Cover body for surface mount components, surface mount component body, and method for mounting surface mount components

Abstract

This invention provides a surface mount component mounting method that allows for easy removal of a cover attached to a surface mount component for suction purposes during the mounting process of the surface mount component onto a substrate. [Solution] The mounting method for the surface mount component (1) uses a cover (2) which is adsorbable by a suction nozzle (81) and has an engaging projection (221a) that engages with and holds the surface mount component (1), and to which a heat shrinkable member (3) is attached. The engaging projection (221a) is structured so that it is released from engagement with the surface mount component (1) when the heat shrinkable member (3) shrinks. With the surface mount component (1) held by the engaging projection (221a), the cover (2) is adsorbed by the suction nozzle (81) and the cover (2) and surface mount component (1) are placed on a predetermined solder paste (821) on a substrate (82). Then, they are passed through a reflow oven to shrink the heat shrinkable member (3) and release the engagement of the engaging projection (221a) with the surface mount component (1).

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