Circuit board with embedded electronic components

Abstract

The objective is to provide an electronic component-embedded substrate that can reduce the risk of cracking even when blind cavities are fabricated in the glass layer and electronic components are placed therein, thereby improving yield and reducing costs. [Solution] The present invention relates to an electronic component-embedded substrate, comprising: a glass layer; a blind cavity penetrating at least a portion of the glass layer and having at least another portion of the glass layer as its bottom surface; an electronic component, at least a portion of which is disposed within the blind cavity; and an insulating material covering at least a portion of the glass layer and the electronic component, and filling at least a portion of the blind cavity, wherein the blind cavity includes a plurality of corner regions, each of which has a shape that protrudes further outward than the wall surface of the blind cavity on a plane.

Description

Technical Field

[0001] The present invention relates to a substrate with built-in electronic components.

Background Art

[0002] In order to cope with the high-performance and miniaturization strategies of semiconductors, the levels of miniaturization and high density required for printed circuit boards are increasing. For example, in order to manufacture high-end products such as server substrates, high-multi-layer and large substrates are required. However, the more wiring layers and the larger the body size, the more vulnerable the substrate may be to warpage. In order to solve such problems, the use of a glass core has been considered. On the other hand, when using a glass core, the part pointed out as the biggest risk may be the crack risk. In particular, when processing a cavity for embedding an electronic component in a glass core and arranging an electronic component therein, a large crack risk may occur.

Summary of the Invention

Problems to be Solved by the Invention

[0003] One of several objects of the present invention is to provide a substrate with built-in electronic components that can reduce the crack risk even when arranging electronic components by processing blind cavities in a glass layer, and as a result, improve the yield and reduce the cost.

Means for Solving the Problems

[0004] One of several solutions of the present invention is to further process a plurality of corner regions of a blind cavity when forming a blind cavity for arranging an electronic component in a glass layer, thereby preventing a crack issue due to contact between the glass and the component.

[0005] For example, an electronic component-embedded substrate according to one example includes a glass layer, a blind cavity that penetrates at least a portion of the glass layer and has at least another portion of the glass layer as its bottom surface, an electronic component that is at least partially disposed within the blind cavity, and an insulating material that covers at least a portion of the glass layer and the electronic component and fills at least a portion of the blind cavity, wherein the blind cavity includes a plurality of corner regions, and each of the plurality of corner regions may include a shape that protrudes further outward from the wall surface of the blind cavity on a plane.

[0006] For example, an electronic component-embedded substrate according to one example includes a glass layer, a blind cavity that penetrates a portion of the glass layer in the thickness direction from the upper surface of the glass layer, an electronic component that is at least partially disposed within the blind cavity, and an insulating material that covers at least a portion of the glass layer and the electronic component and fills at least a portion of the blind cavity, wherein the blind cavity includes a plurality of corner regions, and each of the plurality of corner regions may be at least partially extended in a direction away from the center of the blind cavity on a plane. [Effects of the Invention]

[0007] One of the various effects of the present invention is that even when blind cavities are processed in a glass layer and electronic components are placed therein, the risk of cracking can be reduced, and as a result, an electronic component-embedded substrate can be provided that improves yield and reduces costs. [Brief explanation of the drawing]

[0008] [Figure 1] This is a block diagram illustrating an example of an electronic equipment system. [Figure 2] This is a schematic cross-sectional view showing an example of a circuit board with embedded electronic components. [Figure 3] Figure 2 is a schematic cross-sectional plan view of the circuit board with embedded electronic components, taken from line A-A'. [Figure 4] This is a schematic process diagram illustrating the process of forming a blind cavity having multiple corner regions that protrude and / or extend from the glass layer. [Figure 5] This is a schematic image taken with an electron microscope showing how blind cavities with multiple protruding and / or extended edge regions are formed in a glass layer. [Modes for carrying out the invention]

[0009] The present invention will be described below with reference to the attached drawings. The shapes and sizes of the elements in the drawings may be exaggerated or reduced for clearer explanation.

[0010] Figure 1 is a block diagram illustrating an example of an electronic equipment system.

[0011] Referring to the drawing, the electronic device 1000 houses the main board 1010. The main board 1010 is physically and / or electrically connected to chip-related components 1020, network-related components 1030, and other components 1040, etc. These are also coupled with other electronic components, which will be described later, to form various signal lines 1090.

[0012] The chip-related components 1020 include, but are not limited to, memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPUs), graphics processors (e.g., GPUs), digital signal processors, cryptographic processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs). It goes without saying that other different forms of chip-related electronic components may also be included. Furthermore, these chip-related components 1020 may be combined with each other. The chip-related components 1020 may also be in the form of a package that includes the chips and electronic components mentioned above.

[0013] Network-related component 1030 includes, but is not limited to, any other wireless and wired protocols designated as Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and later. It also includes any other diverse wireless or wired standards and protocols. Furthermore, it goes without saying that network-related component 1030 may be combined with chip-related component 1020.

[0014] Other components 1040 include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCCs (low-temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCCs (multi-layer ceramic condensers), etc. However, they are not limited to these, and may also include other passive elements in chip component form used for various other applications. It goes without saying that other components 1040 may be combined with chip-related components 1020 and / or network-related components 1030.

[0015] Depending on the type of electronic device 1000, the electronic device 1000 may include other electronic components that are physically and / or electrically connected to the main board 1010 or not. Examples of other electronic components include, but are not limited to, audio codecs, video codecs, power amplifiers, compasses, accelerometers, gyroscopes, speakers, mass storage devices (e.g., hard disk drives), CDs (compact disks), DVDs (digital versatile disks), etc. Needless to say, other electronic components used for various purposes may also be included depending on the type of electronic device 1000.

[0016] The electronic device 1000 may be a smartphone, personal digital assistant, digital video camera, digital still camera, network system, computer, monitor, tablet, laptop, netbook, television, video game, smartwatch, automobile, server, etc. However, it is not limited to these, and it goes without saying that it may be any other electronic device that processes data.

[0017] Figure 2 is a schematic cross-sectional view showing an example of a circuit board with embedded electronic components, and Figure 3 is a schematic plan view of the circuit board with embedded electronic components shown in Figure 2, cut along line A-A'.

[0018] Referring to the drawings, an example of an electronic component-embedded substrate 100 may include a glass layer 111, a blind cavity C that penetrates at least a portion of the glass layer 111 and has at least another portion as its bottom surface, an electronic component 120 that is at least partially disposed within the blind cavity C, and an insulating material 112 that covers at least a portion of each of the glass layer 111 and the electronic component 120 and fills at least a portion of the blind cavity C. The blind cavity C may penetrate a portion of the glass layer 111 in the thickness direction from one surface of the glass layer 111, for example, the top surface. The blind cavity may include a plurality of corner regions cr. The plurality of corner regions cr may be, for example, four corner regions, but are not limited thereto, and may include a portion of four corner regions. Each of the plurality of corner regions cr may have a shape that protrudes outward from the wall surface of the blind cavity C on a plane. Each of the plurality of corner regions cr may extend at least a portion in the direction away from the center of the blind cavity C on a plane.

[0019] As described above, the electronic component-embedded substrate 100 according to one example can form a blind cavity C in the glass layer 111 for embedding the electronic component 120. In this case, the blind cavity C may include a plurality of corner regions cr that protrude outward and / or extend away from the center on a plane, as described above. Therefore, when placing the electronic component 120 in the blind cavity C, it is possible to improve the situation in which the glass layer 111 and the electronic component 120 come into contact at the corner portions and cracks occur in the glass layer 111. This can improve the yield of product manufacturing, reduce the number of damaged parts, and lower manufacturing costs.

[0020] On the other hand, the protruding shapes of each of the multiple corner regions cr on the plane may be substantially circular or substantially elliptical in at least a portion of them. Furthermore, at least a portion of each of the multiple corner regions cr may be substantially circular or substantially elliptical in the direction away from the center on the plane. For example, by processing as described later, the above-mentioned multiple corner regions cr can be formed by further irradiating each of the multiple corner portions of the blind cavity C with a laser in a substantially circular and / or elliptical shape, and then removing them by etching. Therefore, with such a shape, the above-mentioned multiple corner regions cr can be formed more easily. Furthermore, such a shape can enhance the crack improvement effect described above. On the other hand, substantially circular or substantially elliptical includes not only perfectly circular or perfectly elliptical shapes, but also roughly circular or roughly elliptical shapes, and shapes that include a portion of such a circle or a portion of such an ellipse. That is, it may include having a substantially curved shape on the plane.

[0021] Moreover, the bottom surface in each of the plurality of corner regions cr of the blind cavity C may be disposed at substantially the same level as the bottom surface in the central region of the blind cavity C. For example, the blind cavity C can have a substantially rectangular shape in cross-section. More specifically, the blind cavity C can have a substantially rectangular shape not only in a cross-section that does not cut the plurality of corner regions cr but also in a cross-section that cuts the plurality of corner regions cr. On the other hand, even when the blind cavity C has a substantially rectangular shape in cross-section, the portion connecting the bottom surface and the wall surface in each of the central region of the blind cavity C and / or the plurality of corner regions cr can have a substantially rounded shape. For example, as in the process described later, the blind cavity C can be formed by first irradiating the glass layer 111 with a laser targeting the central region, further irradiating the glass layer 111 with a laser targeting the plurality of corner regions cr, and then removing the laser-irradiated regions together by etching. Therefore, the central region of the blind cavity C and the plurality of corner regions cr can be formed at substantially the same depth. In this case, the plurality of corner regions cr can be formed more easily, and furthermore, the crack improvement effect as described above can be enhanced.

[0022] On the other hand, the electronic component 120 can be mounted face-up on the bottom surface of the blind cavity C. For example, the electronic component 120 may include a connecting member P for electrical connection, and the connecting member P may be placed on the front surface of the electronic component 120. Alternatively, the back surface of the electronic component 120 can be mounted on the bottom surface of the blind cavity C, in which case a known adhesive film such as DAF (Die Attach Film) can be used. In this case, the electronic component 120 may include multiple corner portions, for example, four corner portions, and at least a portion of each of the multiple corner portions of the electronic component 120, for example, four corner portions, may be placed in each of multiple corner regions cr, for example, four corner regions cr. Such arrangement can enhance the crack improvement effect described above.

[0023] Referring to the drawings, a substrate 100 with built-in electronic components according to an example may further include a metal via 131 formed in a glass layer 111, a wiring layer 141 disposed on an insulating material 112, and a via layer 142 penetrating the insulating material 112. The metal via 131 can fill at least a part of a through hole formed in the glass layer 111. The through hole can penetrate the glass layer 111. For example, the through hole can penetrate in the thickness direction between the upper surface and the lower surface of the glass layer 111. For example, the through hole may be a TGV (Through Glass Via). The via layer 142 can include first and second connection vias that connect the wiring layer 141 to the metal via 131 and the electronic component 120, respectively. The first connection via may be connected above the metal via 131. The second connection via may be connected to a connection member P of the electronic component 120. If necessary, first and second metal pads 132 and 133 may be further disposed on the glass layer 111. The first and second metal pads 132 and 133 can each contact the metal via 131 and can each cover at least a part thereof with the insulating material 112. In this case, the first connection via may be connected to the metal via 131 via the first metal pad 132. However, the present invention is not limited thereto, and the first and second metal pads 132 and 133 may be omitted. In this case, the first connection via may be directly connected to the metal via 131.

[0024] As described above, in the substrate 100 with built-in electronic components according to an example, the wiring layer 141, the via layer 142, and the metal via 131 can be formed, and if necessary, both the first and second metal pads 132 and 133 may be formed. Therefore, various wiring designs are possible, and various electrical connection paths can be provided.

[0025] Referring to the drawings, an example of an electronic component-embedded substrate 100 may further include a frame 105 and a through-cavity H penetrating the frame 105. The through-cavity H may, for example, penetrate in the thickness direction between the upper and lower surfaces of the frame 105. At least a portion of the glass layer 111 may be placed within the through-cavity H. The insulating material 112 may cover at least a portion of the frame 105 and fill at least a portion of the through-cavity H. If necessary, at least a portion of the through-cavity H may be filled with a separate filler material. The frame 105 can include various materials with excellent rigidity.

[0026] Thus, the electronic component-embedded substrate 100 according to this example may further include a frame 105. Since such a frame 105 can be used as a jig in the manufacturing process, the process can be carried out at the panel level via the frame 105, and warping during the process can be easily controlled. Furthermore, the frame 105 can remain on the final unit after singulation, in which case it may be more advantageous for controlling the warping of the final unit.

[0027] Referring to the drawings, an example of an electronic component-embedded substrate 100 may further include a build-up insulating layer 113 disposed on an insulating material 112 and covering at least a portion of the wiring layer 141, a build-up wiring layer 151 disposed on the build-up insulating layer 113, and a build-up via layer 152 disposed within the build-up insulating layer 113 and connecting the wiring layer 141 and the build-up wiring layer 151 to each other. The build-up insulating layer 113, the build-up wiring layer 151, and the build-up via layer 152 can constitute a build-up layer, and if necessary, the build-up layer can be formed in multiple layers. Also, if necessary, such a build-up layer can be formed not only on the upper side of the glass layer 111 but also on the lower side. If necessary, first and second passivation layers 161 and 162 may further be disposed on the uppermost and lowermost sides of the electronic component-embedded substrate 100, respectively.

[0028] Thus, the electronic component-embedded substrate 100 according to this example can include a glass layer 111 as a core layer, and a build-up layer or the like can be formed on at least one side of the core layer, so it can be easily used as a package substrate or an interposer substrate. For example, the electronic component-embedded substrate 100 according to this example can be easily applied to various types of printed circuit boards and / or printed circuit boards of various forms.

[0029] In the following section, the components of an example electronic component-embedded substrate 100 will be described in more detail with reference to the drawings.

[0030] The frame 105 may include an organic insulating material. The organic insulating material may include a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or an inorganic filler, organic filler, and / or glass fiber (glass cloth, glass fabric) together with the resin. For example, the organic insulating material may include, but is not limited to, a copper-clad laminate (CCL) or unclad CCL, and may also include other organic or inorganic materials with superior rigidity. The through-cavity H may penetrate between the top and bottom surfaces of the frame 105 in the thickness direction. The through-cavity H may continuously surround the perimeter of the side surface of the glass layer 111.

[0031] The glass layer 111 may include glass that is an amorphous solid. The glass may include, for example, pure silicon dioxide (about 100% SiO2), soda-lime glass, borosilicate glass, aluminosilicate glass, etc. However, it is not limited to these, and alternative glass materials such as fluorine glass, phosphoric acid glass, chalcogen glass, etc. may also be used as materials. Furthermore, other additives may be included to form glass having specific physical properties. Such additives may include not only calcium carbonate (e.g., lime) and sodium carbonate (e.g., soda), but also magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur, and antimony, as well as carbonates and / or oxides of such elements and other elements. On the other hand, the glass layer 111 can be distinguished from organic insulating materials containing glass fibers (glass fiber, glass cloth, glass fabric), such as copper-clad laminates (CCL) and prepregs (PPG). The glass layer 111 may also be in the form of a glass plate, for example. The blind cavity C and the multiple corner regions cr contained therein can penetrate a portion of the glass layer 111 from the upper surface in the thickness direction. The blind cavity C and the multiple corner regions cr contained therein can continuously surround the perimeter of the side surface of the electronic component 120.

[0032] The insulating material 112 and the build-up insulating layer 113 may each include an organic insulating material. The organic insulating material may include a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or an inorganic filler, an organic filler, and / or glass fiber (glass cloth, glass fabric) together with the resin. For example, the organic insulating material may include, but is not limited to, prepreg (PPG), Ajinomoto Build-up Film (ABF), and photo-imageable dielectric (PID). The insulating material 112 and the build-up insulating layer 113 may each consist of multiple layers. Each of these multiple layers may be integrated without boundaries, or boundaries may be defined between the layers. The multiple layers may each contain substantially the same insulating material, but may also contain different insulating materials.

[0033] The electronic component 120 may include various types of electronic elements. For example, the electronic component 120 may include various types of active and / or passive elements. For example, the electronic component may include, but is not limited to, one or more ICDs (Integrated Circuit Devices) and EPICs (Embedded Passive Integrated Components). The electronic component 120 may include connecting members P for electrical connection. The connecting members P may include conductive materials, such as metals. Metals may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. The connecting members P may include electrodes or pads, and may further include bumps or posts disposed on the electrodes or pads.

[0034] The metal vias 131 and the first and second metal pads 132 and 133 can each contain metals. These metals can include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. For example, the metal vias 131 and the first and second metal pads 132 and 133 can each contain a titanium layer and a copper layer formed by sputtering, i.e., sputtered titanium and sputtered copper, as seed layers, and based on this, electroplated copper formed by electroplating can be included as a pattern plating layer. The metal vias 131 and the first and second metal pads 132 and 133 can each perform various functions depending on the design. For example, the metal via 131 can include through-throughs for signal transmission, through-throughs for power transmission, through-throughs for ground transmission, etc. Also, the first and second metal pads 132 and 133 can each include signal transmission pads, power transmission pads, ground transmission pads, etc. The metal via 131 may be a filled via with a metal through-hole, or it may be a conformal via with an additional filler material inside, if necessary. The metal via 131 may have a substantially hourglass shape, but is not limited to this; for example, it may have a substantially cylindrical shape. There may be multiple metal vias 131 and multiple first and second metal pads 132 and 133.

[0035] The wiring layer 141 and build-up wiring layer 151, and the via layer 142 and build-up via layer 152 can each contain metals. These metals may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or alloys thereof. For example, the wiring layer 141 and build-up wiring layer 151, and the via layer 142 and build-up via layer 152 can each contain chemical copper formed by electroless plating as a seed layer, and based on this, electroplated copper formed by electroplating can be included as a pattern plating layer. The wiring layer 141 and build-up wiring layer 151, and the via layer 142 and build-up via layer 152 can each perform various functions depending on the design. For example, the wiring layer 141 and build-up wiring layer 151 can each contain signal patterns, power patterns, ground patterns, etc. These patterns can each have various forms such as line, trace, plane, land, and pad. Furthermore, the via layer 142 and the build-up via layer 152 can each include signal transmission vias, power transmission vias, and ground transmission vias, respectively. These connection vias may be filled vias with metal filling the via holes, or conformal vias with metal positioned along the walls of the via holes. The via layer 142 and the build-up via layer 152 can each contain multiple connection vias. The connection vias included in the via layer 142 and the build-up via layer 152 may have a tapered shape in the same direction.

[0036] The first and second passivation layers 161 and 162 may each contain an organic insulating material. The organic insulating material may be a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or may contain an inorganic filler and / or organic filler together with the resin. For example, the organic insulating material may be, but is not limited to, Ajinomoto Build-up Film (ABF), Photo Imageable Dielectric (PID), or Solder Resist (SR). The first and second passivation layers 161 and 162 may each consist of multiple layers. The first and second passivation layers 161 and 162 may each have multiple openings, and the patterns exposed through each opening may be, but are not limited to, solder mask defined (SMD) and / or non-solder mask defined (NSMD) types.

[0037] Figure 4 is a schematic process diagram illustrating the process of forming a blind cavity having multiple corner regions that protrude and / or extend from the glass layer.

[0038] Referring to the drawing, first, a glass layer 111 can be prepared. The glass layer 111 may be a glass plate as described above, but is not limited to this. Next, a laser can be irradiated to form a blind cavity in the glass layer 111. For example, the laser can be irradiated in a roughly rectangular shape. Next, the laser can be further irradiated to the corners of the area irradiated to form the blind cavity, for example, to each of the four corners of the rectangular shape. For example, the laser can be irradiated in a roughly circular and / or elliptical shape. Next, a portion of the glass layer 111 in the laser-irradiated area can be removed by etching. As a result, a blind cavity C including multiple corner areas cr as described above can be formed. Such technical details can be applied to the electronic component embedded substrate 100 according to the example described above.

[0039] Figure 5 is a schematic image taken with an electron microscope showing how a blind cavity with multiple protruding and / or extended edge regions is formed in the glass layer.

[0040] Referring to the drawings, a blind cavity including multiple corner regions can be formed in the glass layer through the process described above, where each of the multiple corner regions can have a substantially circular and / or elliptical hole shape. Furthermore, at least a portion of the area where the wall surface of the blind cavity and the bottom surface of the blind cavity are connected can have a substantially rounded shape, but is not limited thereto. Such technical details can be applied to the electronic component embedded substrate 100 according to the example described above.

[0041] In this invention, the expression "cover" can include not only covering the entire object but also covering at least a part of it, and can include not only directly covering the object but also indirectly covering it. Furthermore, the expression "fill" can include not only completely filling the object but also filling at least a part of it, and can also include nearly filling the object. For example, it can include cases where there are some gaps or voids. Also, the expression "enclose" can include not only completely enclosing the object but also partially enclosing it and generally enclosing it. Furthermore, "expose" can include not only completely exposing the object but also partially exposing it, and "exposure" can mean that the component is exposed from what it is embedded in.

[0042] In the present invention, "placed within a blind cavity or through cavity" can include not only cases where the object is completely placed within the blind cavity or through cavity, but also cases where a portion of it extends upward or downward in cross-section. For example, if the object is placed within a blind cavity or through cavity in a planar area, it can be interpreted in a broader sense.

[0043] In this invention, the determination can be made including process errors, positional deviations, and measurement errors that substantially occur during the manufacturing process. For example, "placed at substantially the same level" can include not only cases where they are placed at exactly the same level, but also cases where they are placed at approximately the same level. Similarly, "having substantially a specific shape" can include not only cases where they have exactly that shape, but also cases where they have approximately that shape. Furthermore, "substantially the same insulating material" can mean not only cases where the insulating material is completely identical, but also cases where it includes insulating materials of the same type. Therefore, even if the composition of the insulating material is substantially the same, their specific composition ratios may differ slightly.

[0044] In this invention, "on a cross-section" can mean the cross-sectional shape when the object is cut vertically, or the cross-sectional shape when the object is viewed from the side. "On a plane" can mean the planar shape when the object is cut horizontally, or the planar shape when the object is viewed from the top or bottom.

[0045] In this invention, terms such as "lower side," "lower part," and "bottom surface" are used for convenience to mean the downward direction relative to the cross-section in the drawing, while terms such as "upper side," "upper part," and "top surface" are used to mean the opposite direction. However, this is merely a definition of direction for explanatory purposes, and it goes without saying that the scope of rights in the patent claims is not particularly limited by such descriptions of direction, and the concepts of up / down can be changed at any time.

[0046] In this invention, "connected" is a concept that includes not only direct connection but also indirect connection via an adhesive layer or the like. Furthermore, "electrically connected" is a concept that includes both cases where they are physically connected and cases where they are not connected. In addition, expressions such as "first," "second," etc., are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, within the scope of the rights, the first component may be named the second component, and similarly, the second component may be named the first component.

[0047] In this invention, "thickness, width, length, depth, line width, spacing, pitch, separation distance, surface roughness," etc., can be measured using a scanning microscope or optical microscope, etc., based on a cross-section obtained by polishing or cutting the substrate containing the electronic components. The cut cross-section can be a vertical or horizontal cross-section, and each value can be measured based on the required cut cross-section. For example, the width of the upper and / or lower ends of a via can be measured on a cross-section cut along the central axis of the via. In this case, if the values ​​are not constant, the values ​​can be determined by the average value of the values ​​measured at any five points.

[0048] The expression "example" as used in this invention does not mean that each embodiment is the same as another, but is provided to highlight and illustrate the unique and distinct features of each. However, the examples presented above do not preclude their realization in combination with features of other examples. For example, even if a matter described in a particular example is not described in another example, it can be understood as a description related to that other example, unless there is a description in the other example that contradicts or is contrary to that description.

[0049] The terms used in this invention are used merely to illustrate an example and are not intended to limit the invention. In this context, singular expressions include plural expressions unless the context clearly indicates a different meaning. [Explanation of symbols]

[0050] 1000:Electronic equipment 1010: Mainboard 1020: Chip-related components 1030: Network-related components 1040: Other parts 1050: Camera 1060: Antenna 1070: Display 1080: Battery 1090: Signal line 100: Circuit board with embedded electronic components 105: Frame 111: Glass layer 112: Insulating material 113: Build-up insulating layer 120: Electronic components 131: Metal Via 132, 133: Metal pads 141: Wiring layer 142: Beer layer 151: Build-up wiring layer 152: Build-up via layer 161, 162: Passivation layer H: Through-cavity C: Blind Cavity cr: Corner area P: Connecting member

Claims

1. A glass layer, A blind cavity that penetrates at least a portion of the glass layer and has at least another portion of the glass layer as its bottom surface, An electronic component, at least a portion of which is located within the blind cavity, The insulating material covers at least a portion of the glass layer and the electronic component and fills at least a portion of the blind cavity, The blind cavity includes a plurality of corner regions, The aforementioned plurality of corner regions each include a shape that protrudes further outward than the wall surface of the blind cavity on a plane, wherein the substrate contains an electronic component.

2. The electronic component embedded substrate according to claim 1, wherein at least a portion of the protruding shapes on the plane of each of the plurality of corner regions is circular or elliptical.

3. The electronic component substrate according to claim 1, wherein the bottom surface in each of the plurality of corner regions of the blind cavity is positioned at the same level as the bottom surface in the central region of the blind cavity.

4. The electronic component embedded substrate according to claim 3, wherein the blind cavity has a rectangular cross-section.

5. The electronic component embedded substrate according to claim 1, wherein the plurality of corner regions are four corner regions spaced apart from each other.

6. The electronic component is mounted on the bottom surface in a face-up configuration, as described in claim 1.

7. The electronic component embedded substrate according to claim 1, wherein the electronic component has a plurality of corner portions, and at least a portion of each of the plurality of corner portions is arranged in each of the plurality of corner regions.

8. The electronic component embedded substrate according to claim 1, wherein the electronic component includes one or more of ICD (Integrated Circuit Device) and EPIC (Embedded Passive Integrated Component).

9. A metal via filling at least a portion of the through hole penetrating the glass layer, A wiring layer arranged on the insulating material, The electronic component embedded substrate according to claim 1, further comprising a via layer including first and second connecting vias that penetrate the insulating material and connect the wiring layer to the metal via and the electronic component, respectively.

10. The present invention further includes a metal pad disposed on the glass layer, in contact with the metal via, and at least a portion of which is covered by the insulating material, The electronic component substrate according to claim 9, wherein the first connecting via is connected to the metal via the metal pad.

11. Frame and, The frame further includes a through cavity that penetrates the frame, At least a portion of the glass layer is disposed within the through cavity, The electronic component substrate according to claim 9, wherein the insulating material covers at least a portion of the frame and fills at least a portion of the through cavity.

12. A build-up insulating layer is placed on the insulating material and covers at least a portion of the wiring layer, A build-up wiring layer is placed on the aforementioned build-up insulating layer, The electronic component substrate according to claim 11, further comprising: a build-up via layer disposed within the build-up insulating layer and connecting the wiring layer and the build-up wiring layer to each other.

13. A glass layer, A blind cavity that penetrates a portion of the glass layer in the thickness direction from the upper surface of the glass layer, An electronic component, at least a portion of which is located within the blind cavity, The insulating material covers at least a portion of the glass layer and the electronic component and fills at least a portion of the blind cavity, The aforementioned blind cavity includes multiple corner regions, An electronic component substrate in which each of the aforementioned multiple corner regions extends at least partially in a direction away from the center of the blind cavity on a plane.

14. The electronic component substrate according to claim 13, wherein at least a portion of each of the plurality of corner regions is extended in a circular or elliptical shape in the direction on a plane.

15. The electronic component embedded substrate according to claim 13, wherein the plurality of corner regions are four corner regions spaced apart from each other.

16. The electronic component substrate according to claim 13, wherein at least a portion of the area where the wall surface of the blind cavity and the bottom surface of the blind cavity are connected has a rounded shape.

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