One-time use of multifunctional materials

Abstract

A primary bonding method is provided. [Solution] The temporary bonding method includes preparing a stack comprising a first substrate having a back and a front surface, an adhesive layer adjacent to the front surface and containing polyazomethine, and a second substrate having a first surface adjacent to the adhesive layer, and exposing the adhesive layer to laser energy to facilitate the separation of the first and second substrates. The disclosed materials and methods can be used for applications such as temporary bonding and debonding of semiconductor and display substrates. These materials have a sufficiently low melt rheology to be used as an adhesive layer, can be crosslinked / cured, and allow for reduced material flow over long periods.

Claims

[Claim 1] The temporary bonding method is, A stack is prepared that includes a first substrate having a back and a front surface, an adhesive layer adjacent to the front surface containing polyazomethine, and a second substrate having a first surface adjacent to the adhesive layer. A temporary bonding method comprising exposing the adhesive layer to laser energy in order to facilitate the separation of the first and second substrates.

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