Component-embedded circuit board and method for manufacturing the same

Abstract

The thickness of the resin insulating layer on the core substrate having an opening for embedding electronic components is made thin and flat. [Solution] A method for manufacturing a component-embedded substrate, comprising embedding an electronic component in an opening of a core substrate having a first surface and a second surface via a resin insulating layer, comprising: forming an opening for an electronic component penetrating from the first surface to the second surface in the core substrate; forming a peelable adhesive tape on the second surface of the core substrate so as to cover the opening; arranging an electronic component intermediate, which integrates an electronic component and a height adjustment member and has a thickness approximately the same as the thickness of the opening, on the adhesive tape exposed to the opening, with the height adjustment member and the adhesive tape in contact; forming a resin insulating layer on the first surface of the core substrate so as to cover the opening; heat-pressing the resin insulating layer to fill the space between the electronic component intermediate and the opening and the space on the electronic component with the resin insulating layer; and removing the adhesive tape.

Description

Technical Field

[0001] The present invention relates to a component-embedded substrate in which an electronic component is embedded in an opening of a substrate via a resin, and a method for manufacturing the same.

Background Art

[0002] Conventionally, a method for manufacturing a component-embedded substrate in which an electronic component is embedded in an opening of a core substrate of a printed wiring board via a filling resin is known, for example, from Patent Document 1. FIGS. 3A to 3G are diagrams for explaining an embodiment of a conventional method for manufacturing a component-embedded substrate.

[0003] In this conventional method for manufacturing a component-embedded substrate, first, as shown in FIG. 3A, an opening 53 for mounting an electronic component that penetrates from the first surface 51-1 to the second surface 51-2 of the core substrate 51 is formed. Next, as shown in FIG. 3B, a peelable adhesive tape 54 is formed on the second surface 51-2 of the core substrate 51 so as to cover the opening 53. Next, as shown in FIG. 3C, a resin film 55 is formed on the adhesive tape 54 exposed from the opening 53 by a dispenser or the like. Next, as shown in FIG. 3D, an electronic component 56 is disposed on the resin film 55. Next, as shown in FIG. 3E, a resin insulating layer 57 is formed on the first surface 51-1 so as to cover the opening 53. Next, as shown in FIG. 3F, the resin insulating layer 57 is thermocompression-bonded to fill the space between the electronic component 56 and the opening 53 and the space on the electronic component 56 with the resin insulating layer 57. Then, as shown in FIG. 3G, the component-embedded substrate is obtained by removing the adhesive tape 54.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in component-embedded substrates manufactured according to this conventional manufacturing method for component-embedded substrates, the size of the electronic component 56 is usually small relative to the opening 53. As a result, as shown in Figure 3D, the space between the electronic component 56 and the opening 53, and the space on the electronic component 56, become large. Therefore, as shown in Figure 3E, the thickness of the resin insulating layer 57 formed on the first surface 51-1 to cover the opening 53 was not increased to fill the space. In addition, the resin insulating layer 57 on top of the electronic component 56 sometimes became recessed on the opening 53. [Means for solving the problem]

[0006] The component-embedded substrate of the present invention includes a core substrate having a first surface and a second surface; an opening for an electronic component that penetrates from the first surface to the second surface of the core substrate; an electronic component intermediate disposed within the opening, which integrates an electronic component and a height adjustment member, and whose thickness is approximately the same as the thickness of the opening; and a resin insulating layer that fills the space between the electronic component intermediate and the opening and the space on the electronic component.

[0007] The present invention relates to a method for manufacturing a component-embedded substrate, comprising embedding an electronic component in an opening of a core substrate having a first surface and a second surface via a resin insulating layer, and comprising: forming an opening for an electronic component in the core substrate that penetrates from the first surface to the second surface; forming a peelable adhesive tape on the second surface of the core substrate so as to cover the opening; arranging an electronic component intermediate, which integrates an electronic component and a height adjustment member and has a thickness approximately the same as the thickness of the opening, on the adhesive tape exposed to the opening, with the height adjustment member and the adhesive tape in contact; forming a resin insulating layer on the first surface of the core substrate so as to cover the opening; heat-pressing the resin insulating layer to fill the space between the electronic component intermediate and the opening and the space on the electronic component with the resin insulating layer; and removing the adhesive tape. [Brief explanation of the drawing]

[0008] [Figure 1]This figure illustrates one embodiment of a component-embedded substrate that is the target of the manufacturing method of the component-embedded substrate of the present invention. [Figure 2A] This figure illustrates one embodiment of the method for manufacturing a component-embedded substrate according to the present invention. [Figure 2B] This figure illustrates one embodiment of the method for manufacturing a component-embedded substrate according to the present invention. [Figure 2C] This figure illustrates one embodiment of the method for manufacturing a component-embedded substrate according to the present invention. [Figure 2D] This figure illustrates one embodiment of the method for manufacturing a component-embedded substrate according to the present invention. [Figure 2E] This figure illustrates one embodiment of the method for manufacturing a component-embedded substrate according to the present invention. [Figure 2F] This figure illustrates one embodiment of the method for manufacturing a component-embedded substrate according to the present invention. [Figure 3A] This is a diagram illustrating one embodiment of a conventional method for manufacturing a circuit board with embedded components. [Figure 3B] This is a diagram illustrating one embodiment of a conventional method for manufacturing a circuit board with embedded components. [Figure 3C] This is a diagram illustrating one embodiment of a conventional method for manufacturing a circuit board with embedded components. [Figure 3D] This is a diagram illustrating one embodiment of a conventional method for manufacturing a circuit board with embedded components. [Figure 3E] This is a diagram illustrating one embodiment of a conventional method for manufacturing a circuit board with embedded components. [Figure 3F] This is a diagram illustrating one embodiment of a conventional method for manufacturing a circuit board with embedded components. [Figure 3G] This is a diagram illustrating one embodiment of a conventional method for manufacturing a circuit board with embedded components. [Modes for carrying out the invention]

[0009] Hereinafter, an embodiment of the component-embedded substrate and a method for manufacturing the component-embedded substrate according to the present invention will be described with reference to the drawings. In the example shown in Figures 1 and 2A to 2G, the dimensions of each component, particularly the height dimension, are described using dimensions different from the actual dimensions in order to better understand the features of the present invention.

[0010] <Regarding the component-embedded circuit board of the present invention> Figure 1 is a diagram illustrating one embodiment of the component-embedded substrate of the present invention. In the embodiment shown in Figure 1, the component-embedded substrate comprises a core substrate 1 having a first surface 1-1 and a second surface 1-2, an opening 2 for electronic components penetrating from the first surface 1-1 to the second surface 1-2 of the core substrate 1, an electronic component intermediate 5 disposed within the opening 2 which integrates an electronic component 3 and a height adjustment member 4, and whose thickness is approximately the same as the thickness of the opening 2, and a resin insulating layer 6 which fills the space between the electronic component intermediate 5 and the opening 2 and the space on the electronic component 3.

[0011] <Regarding the manufacturing method of the component-embedded substrate of the present invention> Figures 2A to 2G are diagrams illustrating one embodiment of the manufacturing method for a component-embedded substrate according to the present invention. Hereinafter, one embodiment of the manufacturing method for a component-embedded substrate according to the present invention will be described in order using Figures 2A to 2G.

[0012] First, as shown in Figure 2A, an opening 2 for mounting electronic components is formed, penetrating from the first surface 1-1 to the second surface 1-2 of the core substrate 1. Next, as shown in Figure 2B, a removable adhesive tape 11 is formed on the second surface 1-2 of the core substrate 1 so as to cover the opening 2.

[0013] Next, as shown in FIG. 2C, an electronic component intermediate body 5 in which an electronic component 3 and a height adjustment member 4 are integrated is disposed on the adhesive tape 11 exposed in the opening 2, and the thickness of the electronic component intermediate body 5 is substantially the same as the thickness of the opening 2. The electronic component intermediate body 5 is formed in advance by fixing an electronic component 3 and a height adjustment member 4 whose height is adjusted so that its thickness becomes substantially the same as the thickness of the opening 2 when the electronic component 3 and the height adjustment member 4 are stacked, using an adhesive 12. The thickness of the opening 2 means the thickness of only the core substrate 1, or the thickness of the core substrate 1 + the thickness of the conductor layer when conductor layers are formed on the first surface 1-1 and the second surface 1-2 of the core substrate 1.

[0014] Next, as shown in FIG. 2D, a resin insulating layer 6 is formed on the first surface 1-1 of the core substrate 1 so as to cover the opening 2. Next, as shown in FIG. 2E, the resin insulating layer 6 is thermocompression bonded to fill the space between the electronic component intermediate body 5 and the opening 2 and the space on the electronic component 3 with the resin insulating layer 6. Then, as shown in FIG. 2F, the adhesive tape 11 is removed to obtain a component-embedded substrate.

[0015] According to the component-embedded substrate and its manufacturing method of the present invention described above, an electronic component intermediate body 5 in which an electronic component 3 and a height adjustment member 4 are integrated is used. By adjusting the height of the height adjustment member 4, the thickness of the electronic component intermediate body 5 is made substantially the same as the thickness of the opening 2. Therefore, the thickness of the resin insulating layer 6 on the core substrate 1 having the opening 2 for embedding an electronic component can be made thin and flat.

[0016] As a preferred embodiment, the height adjustment member 4 may be constituted by a metal member coated with an insulating film, a ceramic member, or a cured resin member (for example, a double-sided copper-clad laminate). In this case, since the height adjustment member 4 is not thinned by the weight of the electronic component 3, it is easy to control the height position of the electronic component 3, which is preferable.

Explanation of Reference Numerals

[0017] 1 Core substrate 1-1 First page 1-2 2nd page 3 Electronic Components 4. Height adjustment member 5. Electronic component intermediates 6. Resin insulating layer 11 Adhesive tape 12 Adhesives

Claims

1. A circuit board with embedded components, A core substrate having a first surface and a second surface, An opening for electronic components that penetrates from the first surface to the second surface of the core substrate, An electronic component intermediate, which integrates an electronic component and a height adjustment member and is arranged within the aforementioned opening, wherein the thickness of the electronic component intermediate is approximately the same as the thickness of the aforementioned opening, The system includes a resin insulating layer that fills the space between the electronic component intermediate and the opening, and the space on the electronic component.

2. A method for manufacturing a component-embedded substrate, comprising embedding electronic components in an opening of a core substrate having a first surface and a second surface via a resin insulating layer, The core substrate is formed to have an opening for an electronic component that penetrates from the first surface to the second surface, A removable adhesive tape is formed on the second surface of the core substrate so as to cover the opening, An electronic component intermediate, which integrates an electronic component and a height adjustment member, and whose thickness is approximately the same as the thickness of the opening, is placed on the adhesive tape exposed in the opening, with the height adjustment member and the adhesive tape in contact. A resin insulating layer is formed on the first surface of the core substrate so as to cover the aforementioned opening, The resin insulating layer is heat-pressed to fill the space between the electronic component intermediate and the opening and the space on the electronic component with the resin insulating layer. Removing the aforementioned adhesive tape, Includes.

3. A method for manufacturing a component-embedded substrate according to claim 2, wherein the height adjustment member is a metal member, a ceramic member, or a cured resin member covered with an insulating film.

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