Surface roughness measurement method and surface roughness measurement system

JP2026096158APending Publication Date: 2026-06-12TSUKUBA MEDICAL ELECTRIC CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
TSUKUBA MEDICAL ELECTRIC CO LTD
Filing Date
2025-09-24
Publication Date
2026-06-12

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Abstract

A method for measuring surface roughness is provided. [Solution] The method includes the steps of: generating terahertz radiated electromagnetic waves to be incident on the object to be tested; detecting a plurality of terahertz received electromagnetic waves that have been reflected, transmitted, or scattered after the terahertz radiated electromagnetic waves have been incident on the object to be tested; measuring a plurality of characteristic signals based on the terahertz radiated electromagnetic waves and the plurality of terahertz received electromagnetic waves; and analyzing the plurality of characteristic signals to determine the surface roughness characteristics of the object to be tested.
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Claims

[Claim 1] A step of generating terahertz radiated electromagnetic waves that are incident on the object to be tested, The steps include detecting a plurality of terahertz received electromagnetic waves that have been reflected, transmitted, or scattered after the terahertz radiated electromagnetic waves have been incident on the object to be tested, The steps include measuring a plurality of characteristic signals based on the terahertz radiated electromagnetic wave and a plurality of the terahertz received electromagnetic waves, A surface roughness measurement method comprising the step of analyzing a plurality of characteristic signals to determine the surface roughness characteristics of the object to be tested. [Claim 2] The step of analyzing multiple characteristic signals to determine the roughness characteristics of the surface of the object under test is: A step of determining at least one profile curve at at least one location on the surface based on a plurality of characteristic signals, A surface roughness measurement method according to claim 1, comprising the step of determining the roughness characteristics of the surface by calculating the roughness of at least one of the positions on the surface based on at least one of the profile curves. [Claim 3] The surface roughness measurement method according to claim 2, wherein at least one of the roughness is selected from one or more of the arithmetic mean roughness, the ten-point mean roughness, and the maximum height roughness. [Claim 4] The frequency of the aforementioned terahertz radiated electromagnetic wave is 10 11 Hz to 10 13 The surface roughness measurement method according to claim 1, wherein the frequency is Hz. [Claim 5] The surface roughness measurement method according to claim 1, wherein the plurality of characteristic signals include the electric field polarization, electric field strength, and electric field phase of each of the plurality of terahertz received electromagnetic waves. [Claim 6] The surface roughness measurement method according to claim 5, wherein the plurality of characteristic signals further include at least one spectral electric field between the plurality of terahertz received electromagnetic waves, and each spectral electric field includes an electric field amplitude and an electric field phase. [Claim 7] The surface roughness measurement method according to claim 1, wherein the object to be tested is selected from one or more of semiconductor wafers, ceramic materials, polymer materials, metallic materials, and composite materials. [Claim 8] A terahertz electromagnetic wave generator configured to generate terahertz radiated electromagnetic waves that are incident on the object under test, A terahertz electromagnetic wave receiver configured to detect multiple terahertz received electromagnetic waves that are reflected, transmitted, or scattered after the terahertz radiated electromagnetic waves are incident on the object to be tested, A surface roughness measurement system comprising: a detection device coupled to the terahertz electromagnetic wave generator and the terahertz electromagnetic wave receiver, configured to measure a plurality of characteristic signals based on the terahertz radiated electromagnetic wave and a plurality of the terahertz received electromagnetic waves, and to analyze the plurality of characteristic signals to determine the surface roughness characteristics of the object under test. [Claim 9] The surface roughness measuring system according to claim 8, wherein the detection device is configured to determine at least one profile curve of at least one location on the surface based on a plurality of characteristic signals, and to calculate at least one roughness of at least one location on the surface based on at least one profile curve to determine the roughness characteristics of the surface. [Claim 10] The surface roughness measuring system according to claim 9, wherein at least one of the roughnesses is selected from one or more of the arithmetic mean roughness, the ten-point mean roughness, and the maximum height roughness. [Claim 11] The frequency of the aforementioned terahertz radiated electromagnetic wave is 10 11 Hz to 10 13 The surface roughness measurement system according to claim 8, wherein the frequency is Hz. [Claim 12] The surface roughness measurement system according to claim 8, wherein the plurality of characteristic signals include the electric field polarization, electric field strength, and electric field phase of each of the plurality of terahertz received electromagnetic waves. [Claim 13] The surface roughness measurement system according to claim 12, wherein the plurality of characteristic signals further include at least one spectral electric field between the plurality of terahertz received electromagnetic waves, each spectral electric field including electric field amplitude and electric field phase. [Claim 14] The surface roughness measurement system according to claim 8, wherein the object to be tested is selected from one or more of semiconductor wafers, ceramic materials, polymer materials, metallic materials, and composite materials.