Wiring board
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- NITERRA CO LTD
- Filing Date
- 2024-12-04
- Publication Date
- 2026-06-16
Smart Images
Figure 2026097543000001_ABST
Abstract
Claims
1. A wiring board on which light-emitting elements are arranged, A base material in the shape of a flat plate formed of metal and having a pair of main surfaces, wherein one of the pair of main surfaces has a recess formed on it that is recessed by 5 μm or more in the thickness direction of the base material, An insulating film covering the inner surface of the recess, A conductive portion is disposed on the insulating film and electrically connected to the light-emitting element, Equipped with, A wiring board characterized by the following features.
2. A wiring board according to claim 1, The main surface of the substrate has a flat portion formed on the outer circumference of the recess, The substrate has a surface that defines the recess, and among the surfaces that define the recess, it has a sloped surface that connects to the flat portion. The angle between the slope and the flat surface is 30 degrees or more and 60 degrees or less. A wiring board characterized by the following features.
3. A wiring board according to claim 1 or claim 2, further, It comprises a metal projection positioned on the conductive portion, filled in the recess, with its upper end protruding from the opening of the recess, A wiring board characterized by the following features.
4. A wiring board according to claim 3, In the thickness direction of the substrate, the depth of the recess is at least half the height of the protrusion. A wiring board characterized by the following features.