Printed circuit board

Abstract

The present invention provides a printed circuit board incorporating a bridge including a high-density circuit layer, and a method for manufacturing the same. [Solution] This disclosure relates to a printed circuit board comprising: a first substrate portion 100a on which a pad 300 containing a first metal is disposed on top; a second substrate portion 100b disposed on the first substrate portion 100a; a bridge 500 in which at least a portion is disposed within the second substrate portion 100b and a bridge pad 530 containing a second metal is disposed on the bottom; and a conductive connecting portion disposed between the pad 300 and the bridge pad 530, wherein the conductive connecting portion comprises: a first conductive layer containing a third metal; a second conductive layer disposed below the first conductive layer and containing the first and third metals; and a third conductive layer disposed above the first conductive layer and containing the second and third metals.

Claims

1. A first substrate portion having a pad containing a first metal positioned at the top, A second substrate portion is disposed on the first substrate portion, A bridge is provided, in which at least a portion is disposed within the second substrate portion, and a bridge pad containing a second metal is disposed at the lower part, Includes a conductive connecting portion disposed between the pad and the bridge pad, The conductive connecting portion includes a first conductive layer containing a third metal, a second conductive layer disposed below the first conductive layer and containing the first and third metals, and a third conductive layer disposed above the first conductive layer and containing the second and third metals, in a printed circuit board.

2. The printed circuit board according to claim 1, wherein the first metal and the second metal are the same metal, and the third metal is a different metal from the first metal and the second metal.

3. The printed circuit board according to claim 1, wherein the first metal and the second metal are copper (Cu), and the third metal is tin (Sn).

4. The printed circuit board according to claim 1, wherein the second conductive layer is an intermetallic compound layer disposed between the first conductive layer and the pad.

5. The printed circuit board according to claim 1, wherein the third conductive layer is an intermetallic compound layer disposed between the first conductive layer and the bridge pad.

6. The printed circuit board according to claim 1, wherein the first substrate portion includes one or more first insulating layers, one or more first wiring layers disposed on or within the one or more first insulating layers, and one or more first via layers that penetrate at least one of the one or more insulating layers.

7. The printed circuit board according to claim 6, wherein the lower surface of the bridge is in direct contact with the uppermost first insulating layer among the one or more first insulating layers.

8. The printed circuit board according to claim 6, wherein the second substrate portion includes a second insulating layer covering at least a portion of the side surface of the bridge, a second wiring layer disposed on the second insulating layer, and a second via layer penetrating at least a portion of the second insulating layer.

9. It further includes an external wiring layer positioned on top of the bridge and connected to the bridge, The printed circuit board according to claim 8, wherein the diameter of at least one of the second wiring layers is substantially the same as the diameter of at least one of the outer wiring layers.

10. The printed circuit board according to claim 8, wherein the second insulating layer covers the upper surface of the bridge.

11. The printed circuit board according to claim 8, wherein the second substrate portion further includes a metal pillar disposed on the uppermost first wiring layer of the first wiring layers and connected to the second via layer.

12. The printed circuit board according to claim 11, wherein the upper surface of the metal pillar is at the same level as the upper surface of the bridge.

13. The printed circuit board according to claim 8, wherein the upper surface of the second insulating layer is located at the same level as the upper surface of the bridge.

14. The printed circuit board according to claim 1, wherein the bridge is exposed from the upper surface of the second substrate portion.

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