Composite glass resin substrate, method for manufacturing a composite glass resin substrate, and apparatus for manufacturing a composite glass resin substrate

Abstract

This invention provides a composite glass-resin substrate that eliminates layered cracking inside the glass plate when manufacturing a glass-resin substrate by cutting. [Solution] A composite glass resin substrate 100A is formed comprising: a glass resin substrate 1 comprising: through holes 13 formed in the thickness direction from a first surface 11 to a second surface 12 of a glass substrate 10; a conductive material 14 embedded in the through holes 13; a plurality of single-type resin layer portions 20 formed on both sides of the glass substrate 10; wiring portions 15 provided in the plurality of single-type resin layer portions 20 that are electrically connected to the conductive material 14 embedded in the through holes 13; grooves 31 of a predetermined width formed on both sides of the glass substrate 10, leaving at least a close-contact portion that is in close contact with the glass substrate 10; and a resin layer cut-off portion 30 consisting of the grooves 31 and the close-contact portion; a laminated conductive material 41 provided near the wiring portion 15 of the glass resin substrate 1; and a bonding portion 42 formed on the outermost surface of the plurality of single-type resin layer portions 20 of the glass resin substrate 1.

Description

Technical Field

[0001] The present invention relates to a composite glass resin substrate, a method for manufacturing the composite glass resin substrate, and a manufacturing apparatus for the composite glass resin substrate, and more particularly to a composite glass resin substrate laminated while avoiding cracks occurring in a glass substrate, a manufacturing method thereof, and a manufacturing apparatus corresponding to the manufacturing.

Background Art

[0002] Various semiconductor elements such as various memories, CPUs, and GPUs mounted on a circuit board have terminals for electrical connection. The pitch of the connection terminals and the pitch of the connection portion of the circuit board electrically connected to the semiconductor element usually differ by several times to several tens of times. Therefore, in order to electrically connect the semiconductor element and the circuit board, for example, an intermediate substrate for connection called an interposer and a package substrate used together with the interposer are used. A semiconductor element is mounted on one surface of the interposer, and a package substrate for relay is connected to the other surface.

[0003] As the material of the interposer, an organic resin material has been used. However, in order to cope with the improvement of the processing ability and high integration of semiconductor elements, fine wiring formation of the interposer is required. However, in a conventional interposer using an organic resin material, moisture absorption of the resin and expansion and contraction due to temperature are large, and it has been difficult to cope with fine wiring. [[ID=​​​​​​However, when constructing a circuit board using a glass plate, stress and other effects from the resin film attached to both sides of the glass plate or the laminated resin layers are applied to the glass plate for circuit board formation. Consequently, when cutting (cutting) a glass plate with the resin film attached or the resin layers laminated to a predetermined size and shape, the effects on the resin film (resin layers) can cause the glass plate itself to split in layers internally (layered delamination phenomenon). This layered splitting of a glass plate is called seware, etc.

[0006] To address the phenomenon of back cracking in the glass plate described above, methods have been proposed such as forming holes that penetrate both the front and back surfaces of the glass plate and filling them with resin (see Patent Document 1), coating the glass plate with a mixture of resin and inorganic filler (see Patent Document 2), and modifying the glass plate by irradiating it with a laser (see Patent Document 3). In addition, a method has been proposed in which different types of resin are placed at the cutting point and cut with a rotating blade (dicing blade) (see Patent Document 4).

[0007] The methods described in the listed patent documents and other sources demonstrate a certain degree of effectiveness against back cracking during glass plate processing. However, these methods increase the number of steps required during the manufacturing process, such as drilling holes in the glass plate, resin filling, and coating with various materials, making them not necessarily simple. Furthermore, due to breakage during the manufacturing of glass-resin substrates, further improvements in production efficiency are desired. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2016-157982 [Patent Document 2] Japanese Patent Publication No. 2020-182006 [Patent Document 3] Japanese Patent Publication No. 2019-21720 [Patent Document 4] Japanese Patent Publication No. 2017-168493 [Overview of the project] [Problems that the invention aims to solve]

[0009] Based on the premise of manufacturing glass-resin substrates, the inventors reviewed and diligently improved the manufacturing process, thereby developing an effective countermeasure against the back cracking phenomenon that is unavoidable during the processing of glass plates. This led to the development of glass-resin substrates, a method for manufacturing glass-resin substrates, and manufacturing equipment compatible with this manufacturing process.

[0010] The present invention has been made in view of the above points, and provides a composite glass resin substrate, a method for manufacturing a glass resin substrate, and a manufacturing apparatus corresponding to said manufacturing, which can eliminate manufacturing defects and improve productivity by eliminating the phenomenon of the glass plate itself splitting in layers inside itself (back splitting) due to the action that occurs on the resin film (resin layer) when manufacturing a glass resin substrate by attaching a resin film or laminating a resin layer into a glass plate and cutting it. [Means for solving the problem]

[0011] In other words, the embodiment is a composite glass resin substrate formed by laminating a plurality of glass resin substrates, each having a resin layer on the surface of a glass substrate, wherein the glass resin substrate comprises through holes formed in the thickness direction from the first surface to the second surface of the glass substrate, a conductive material to be embedded in the through holes, a plurality of single-type resin layers formed on the first and second surfaces of the glass substrate, wiring portions provided in the plurality of single-type resin layers that are electrically connected to the conductive material to be embedded in the through holes, grooves of a predetermined width formed on the first and second surfaces of the glass substrate, leaving at least the closest-contact portions that are in close contact with the glass substrate, and resin layer cut-off portions consisting of the grooves and the closest-contact portions, wherein the composite glass resin substrate is characterized by comprising a laminated conductive material provided near the wiring portions of the glass resin substrate, and a joining portion arranged on the outermost surface of the plurality of single-type resin layers of the glass resin substrate that joins the plurality of single-type resin layers to each other.

[0012] Furthermore, in a composite glass resin substrate, the groove portion may be formed on a second surface portion that is symmetrical to the first surface portion in the thickness direction of the glass substrate.

[0013] Furthermore, in a composite glass-resin substrate, the glass-resin substrate may be rectangular, and the resin layer cut-off portions may be provided on the four sides of the first surface and the four sides of the second surface of the glass substrate, respectively.

[0014] Furthermore, in a composite glass resin substrate, the resin layer cut-off portion may be provided with an inclined portion that widens the width of the groove in the direction away from the glass substrate.

[0015] Furthermore, in a composite glass resin substrate, the multiple single-type resin layers may be multiple resin film portions.

[0016] Furthermore, in the composite glass resin substrate, a cut-off portion may be provided at the most closely adhering part.

[0017] Furthermore, the composite glass resin substrates may be laminated on top of each other at the wiring portions of the individual glass resin substrates.

[0018] Furthermore, in a composite glass resin substrate, the bonding portion may be an adhesive, and the adhesive may be filled into the cut-off portion of the resin layer. Also, in a composite glass resin substrate, the bonding portion may be a resin film portion of the same quality as the bonding resin film portion.

[0019] Furthermore, in a composite glass resin substrate, the bonding portion may be located on part or all of the outermost surface of multiple single-type resin layers of the glass resin substrate, and the multiple single-type resin layers may be bonded together.

[0020] Further, an embodiment is a method for manufacturing a composite glass resin substrate formed by laminating a plurality of glass resin substrates each having a plurality of resin layer portions on the surface of a glass substrate, the method including: a through-hole forming step of forming a through-hole portion in the thickness direction from the first surface portion to the second surface portion of the glass substrate; a conductive material embedding step of embedding an embedded conductive material in the through-hole portion; a forming step of forming a plurality of resin layer portions of a single type each having a wiring portion that conducts with the embedded conductive material of the through-hole portion on each of the first surface portion and the second surface portion of the glass substrate; a groove forming step of forming a groove portion having a predetermined width and a predetermined depth in the plurality of resin layer portions of a single type, leaving at least the closest contact portion that adheres closely to the glass substrate among the plurality of resin layer portions formed on the first surface portion and the second surface portion of the glass substrate, to produce a glass resin substrate; arranging a laminated conductive material in the vicinity of the wiring portion of the glass resin substrate to be laminated and a joining portion that joins the plurality of resin layer portions to each other on the outermost surface of the plurality of resin layer portions of the glass resin substrate, and laminating the glass resin substrates to obtain a laminate; and a cutting step of cutting from the groove portion of the outermost glass resin substrate of the laminate in the thickness direction of the laminate.

[0021] Furthermore, in the method for manufacturing a composite glass resin substrate, the formation of the groove portion in the groove forming step may be by cutting or melting.

[0022] Furthermore, in the method for manufacturing a composite glass resin substrate, the groove portion may be formed on the second surface portion that is symmetric to the first surface portion in the thickness direction of the glass substrate.

[0023] Furthermore, in the method for manufacturing a composite glass resin substrate, in the groove forming step, an inclined portion that expands the width of the groove portion in a direction away from the glass substrate may be formed in the groove portion.

[0024] Furthermore, in the method for manufacturing a composite glass resin substrate, the plurality of resin layer portions of a single type may be a plurality of resin film portions.

[0025] Furthermore, in the method for manufacturing a composite glass resin substrate, after the groove forming step, an excision step of excising the closest contact portion to form an excision portion may be provided.

[0026] Furthermore, in the method for manufacturing a composite glass resin substrate, the joint may be an adhesive, and the adhesive may be filled into the resin layer cut-off portion in the lamination step. Also, in the method for manufacturing a composite glass resin substrate, the joint may be a joint resin film portion of the same quality as the resin film portion.

[0027] Furthermore, in the method for manufacturing a composite glass resin substrate, the joint may be disposed on a part or all of the outermost surface of a plurality of single-type resin layer portions of the glass resin substrate to join the plurality of single-type resin layer portions to each other.

[0028] In addition, the composite glass resin substrate manufacturing apparatus used in the method for manufacturing a composite glass resin substrate according to the embodiment includes a first rotary blade that forms a groove portion having a predetermined width and a predetermined depth in a plurality of resin layer portions of a glass substrate, a second rotary blade that cuts from the groove portion of the outermost glass resin substrate of the laminate in the thickness direction of the laminate, and a control portion that controls the positions of the first rotary blade and the second rotary blade.

Effect of the Invention

[0029] The present invention relates to a composite glass resin substrate formed by laminating multiple glass resin substrates, each having a resin layer on the surface of a glass substrate, wherein the glass resin substrate comprises: through holes formed in the thickness direction from the first surface to the second surface of the glass substrate; a conductive material embedded in the through holes; a plurality of single-type resin layers formed on the first and second surfaces of the glass substrate; wiring portions provided in the plurality of single-type resin layers that are electrically connected to the conductive material embedded in the through holes; and formed on the first and second surfaces of the glass substrate, leaving at least a closest-contact portion that is in close contact with the glass substrate among the plurality of single-type resin layers. The composite glass resin substrate includes a groove of a predetermined width and a resin layer cutting portion consisting of the groove and the closest contact portion. The composite glass resin substrate includes a laminated conductive material provided near the wiring portion of the glass resin substrate and a joining portion arranged on the outermost surface of multiple single-type resin layers of the glass resin substrate to join the multiple single-type resin layers together. This eliminates the phenomenon of the glass plate itself splitting in layers internally (back splitting) caused by the action that occurs on the resin film (resin layer) when manufacturing a glass resin substrate by attaching a resin film or cutting a glass plate on which resin layers have been laminated, thereby eliminating manufacturing defects and increasing productivity.

[0030] Furthermore, the present invention relates to a method for manufacturing a composite glass resin substrate, which is obtained by stacking multiple glass resin substrates, each having multiple resin layers on the surface of a glass substrate, comprising: a through-hole forming step of forming through-holes in the thickness direction from the first surface to the second surface of the glass substrate; a conductive material embedding step of embedding a conductive material into the through-holes; a forming step of forming multiple single-type resin layers on the first and second surfaces of the glass substrate, each having wiring portions that are electrically connected to the conductive material embedded in the through-holes; and a groove forming step of forming grooves of a predetermined width and depth in multiple single-type resin layers, leaving at least the closest-contact portions that are in close contact with the glass substrate, among the multiple resin layers formed on the first and second surfaces of the glass substrate. The method for manufacturing a composite glass resin substrate includes a lamination step in which a laminated conductive material is placed near the wiring portion of a glass resin substrate to be manufactured and laminated, and a bonding portion that joins multiple resin layers to each other on the outermost surface of multiple single-type resin layers of the glass resin substrate, and then the glass resin substrate is laminated to obtain a laminate; and a cutting step in which the laminate is cut from the groove portion of the outermost glass resin substrate toward the thickness direction of the laminate. This eliminates the phenomenon of the glass plate itself splitting in layers inside (back splitting) caused by the action that occurs on the resin film (resin layer) when manufacturing a glass resin substrate by attaching a resin film or laminating resin layers to a glass plate and cutting it, thereby eliminating manufacturing defects and improving productivity.

[0031] In addition, the composite glass resin substrate manufacturing apparatus used in the manufacturing method of the present invention includes a first rotating blade that forms grooves of a predetermined width and depth in multiple single-type resin layers of a glass substrate, a second rotating blade that cuts from the grooves of the outermost glass resin substrate of the laminate toward the thickness direction of the laminate, and a control unit that controls the positions of the first and second rotating blades. Therefore, it is possible to eliminate the phenomenon of the glass plate itself splitting in layers inside (back splitting) due to the action that occurs on the resin film (resin layer) when manufacturing a glass resin substrate by cutting a glass plate to which a resin film has been attached or resin layers have been laminated, thereby eliminating manufacturing defects and providing a manufacturing apparatus that increases productivity. [Brief explanation of the drawing]

[0032] [Figure 1] These are schematic diagrams illustrating the layered cracking phenomenon (back splitting) of a glass substrate: (A) First cross-sectional diagram, (B) Second cross-sectional diagram, and (C) Third cross-sectional diagram. [Figure 2] This is a schematic cross-sectional view of the glass resin substrate of the embodiment. [Figure 3] (A) First enlarged schematic diagram of the film trimming area, (B) Second enlarged schematic diagram of the film trimming area. [Figure 4] This is a magnified photograph (200x magnification) of Figure 3(B). [Figure 5] (A) A schematic diagram of the first cross-section of the excised portion at the closest point of contact, and (B) a schematic diagram of the second cross-section. [Figure 6] This is a schematic cross-sectional view of the composite glass resin substrate of the embodiment. [Figure 7] This is a schematic cross-sectional view of a composite glass resin substrate according to another embodiment. [Figure 8] This is a schematic cross-sectional view of a composite glass resin substrate of yet another embodiment. [Figure 9] These are schematic cross-sectional diagrams (A), (B), and (C) illustrating the manufacturing process for a composite glass resin substrate: (A) first cross-sectional diagram, (B) second cross-sectional diagram, and (C) third cross-sectional diagram. [Figure 10] This is a schematic diagram of the fourth cross-section showing the manufacturing process for a composite glass resin substrate. [Figure 11] (A) A schematic cross-sectional view of the fifth section when the first rotary blade is used, and (B) a schematic cross-sectional view of the sixth section when the second rotary blade is used, in the manufacturing process of a composite glass resin substrate. [Figure 12] This is a schematic cross-sectional diagram showing the excision process. [Figure 13] This is a schematic diagram of the seventh cross-section showing the manufacturing process of a composite glass resin substrate. [Figure 14] This is a schematic diagram of the eighth cross-section showing the manufacturing process of a composite glass resin substrate. [Figure 15] This is a schematic cross-sectional diagram showing the manufacturing process of other composite glass resin substrates. [Figure 16] This is an overall perspective view from above of the composite glass resin substrate manufacturing apparatus according to the embodiment. [Modes for carrying out the invention]

[0033] The composite glass-resin substrate of this embodiment is a laminate of glass plates and resin formed by stacking multiple glass-resin substrates. The glass-resin substrate has through-holes that penetrate both the front and back surfaces of the glass substrate, a conductive metal material is placed in these through-holes, and layers of resin are provided on both surfaces of the glass substrate. The composite glass-resin substrate is mainly used as an interposer or a package substrate. The glass interposer referred to here is a component that serves as a relay substrate for electrically wiring and connecting various semiconductor elements such as memory, CPU, and GPU mounted on a circuit board to the circuit board. In particular, since the glass interposer itself is formed only of glass and embedded conductive material for wiring, it does not contain materials with different coefficients of thermal expansion such as resin, and deformation due to thermal exposure during use is reduced. Of course, the composite glass-resin substrate of this embodiment can be applied to various uses other than interposers.

[0034] First, using the schematic cross-sectional diagram in Figure 1, we will explain the number of glass substrates 10 and resin film portions 20 laminated onto the glass substrates 10, as well as the phenomenon of layered cleavage (back cracking). The same principle is considered to apply when a resin coating is applied multiple times to create layers instead of the resin film portions 20.

[0035] Figure 1(A) is a schematic cross-sectional view of the glass substrate 10 being cut in the thickness direction when there is no resin film portion 20 (0 pieces). When there is no resin film portion 20, the glass substrate 10 is cut as is and no particular problems occur.

[0036] Figure 1(B) is a schematic cross-sectional view of the glass substrate 10 being cut in the thickness direction when only one resin film portion 20 is attached to the glass substrate 10. When there is only one resin film portion 20, even if stress is applied to the resin film portion 20 during cutting, the glass substrate 10 is relatively thicker, so the deformation force of the resin film portion 20 does not affect the glass substrate 10. As a result, the glass substrate 10 is cut as is, and no particular problems occur.

[0037] Figure 1(C) is a schematic cross-sectional view of a glass substrate 10 cut in the thickness direction when four resin film portions 20 are attached to the glass substrate 10. When there are four resin film portions 20, the deformation of the multiple resin film portions 20 that occurs during cutting becomes stress, and the attached glass substrate 10 is pulled by the stress of the multiple resin film portions 20. As a result, a phenomenon of layered cracking (so-called back cracking) occurs inside the glass substrate 10. The back cracking area C is shown in the figure.

[0038] Thus, whether or not back cracking occurs in the glass substrate 10 depends on the number of layers of resin film 20 stacked. Based on this finding, when cutting the glass substrate 10 to divide it into individual substrates, it is considered possible to reduce the stress applied to the glass substrate 10 from multiple resin film 20 (multiple resin layers) by reducing the number of layers of resin film 20 stacked as much as possible, and similarly by reducing the number of layers of resin layers stacked by painting or the like. Therefore, in order to suppress back cracking, the composite glass resin substrate and its manufacturing method of the embodiment are characterized by reducing the number of layers of resin film 20 stacked at the cutting location of the glass substrate 10 (the number of layers of resin layers stacked) in advance.

[0039] Prior to describing the composite glass resin substrate 100 of the embodiment (see Figures 6 and 7), the structure of the glass resin substrate 1, which is a component of the composite glass resin substrate 100, will be explained based on the findings in Figure 1 and using the schematic cross-sectional diagrams in Figures 2 and 3.

[0040] The glass resin substrate 1 is provided with a glass substrate 10 that constitutes the main structure of the substrate. The material of the glass substrate 10 is alkali glass, alkali-free glass, borosilicate glass, etc. Through holes 13 are formed in the thickness direction from the first surface 11 to the second surface 12 of the glass substrate 10. Resin film portions 20, 20 are attached to the first surface 11 and the second surface 12 of the glass substrate 10, respectively. In the figure, multiple resin film portions 20, 20 (four resin film portions 21, 22, 23, and 24 for each of the first surface 11 and the second surface 12) are attached to each of the glass resin substrate 10. The resin film portion 20 is made of a material with good stretchability and insulation properties, and for example, an epoxy resin film is used.

[0041] In addition to the aforementioned lamination of multiple resin film portions 20, the glass resin substrate 1 of the embodiment can also adopt a configuration in which a resin coating agent is applied multiple times to form layers and create a resin layer of a predetermined thickness. Therefore, the "resin layer portion" is a configuration that encompasses both the configuration of the "resin film portion" and the configuration of the "resin layer" derived from the resin coating agent. Of course, as mentioned above, materials such as epoxy resin are used as the resin coating agent. The following explanation and drawings illustrate and describe the resin layer portion as being in the configuration of the resin film portion. Regarding the closely adhering portion and the resin layer cut-off portion described later, the closely adhering portion and the resin layer cut-off portion are configurations that encompass both the configuration of the "resin film portion" and the configuration of the "resin layer" derived from the resin coating agent. When the resin layer portion is in the configuration of a resin film portion, the closely adhering portion becomes the closely adhering film portion, and the resin layer cut-off portion becomes the film cut-off portion.

[0042] The formation of through-holes 13 in the glass substrate 10 is carried out using known methods such as laser irradiation or etching with an acid or alkali solution. A conductive material 14 is embedded inside the through-holes 13. The conductive material 14 is a conductive resin paste containing fine particles of metals such as copper, silver, gold, platinum, nickel, and lead. This ensures conductivity of the through-holes 13 from the first surface 11 to the second surface 12. Alternatively, copper or silver plating is formed inside the through-holes 13 to achieve conductivity.

[0043] Wiring sections 15 are formed on the resin film sections (resin layer sections) 20, 20 (resin film sections 21, 22, 23, 24, respectively), thereby providing conductivity on both the first surface 11 and the second surface 12 of the glass substrate 10. The structure and position of the wiring sections 15 are appropriate according to the design of the glass resin substrate 1, and the illustration is merely a schematic example. The resin film sections (resin layer sections) 20, 20 (resin film sections 21, 22, 23, 24, respectively) in this embodiment are all of a single type (single material), and there is no variation or differentiation in use depending on the part.

[0044] A structural feature of the glass resin substrate 1 of this embodiment is that grooves 31 of a predetermined width are formed in multiple resin film portions 20, 20 (multiple resin layers) that are laminated by adhesion to the first surface portion 11 and the second surface portion 12 of the glass substrate 10. In Figure 2, the grooves 31 are formed leaving at least one of the multiple resin film portions 20 (multiple resin layers) that is in close contact with the glass substrate 10. The close-contact film portion shown corresponds to the resin film portion 21.

[0045] Then, a film trimming portion 30 is formed from the vertical groove portion 31 and the horizontal close-adhesion film portion (resin film portion 21). The film trimming portion 30 has a structure in which multiple resin film portions 20 (multiple resin layers) are cut off in the width direction of the glass substrate 10 while leaving the close-adhesion film portion.

[0046] The groove 31 is formed on the second surface 12 of the glass substrate 10, symmetrical (line symmetrical) to the first surface 11 in the thickness direction. As described later in the manufacturing method of the composite glass resin substrate 100, the glass substrate 10 is cut together with the closest-adhesion film portion (closest-adhesion portion) of the single-type (single-material) resin film portion 20, 20 (resin layer portion). Therefore, in order to separate the substrate in the center of the groove 31 during a single cut, the position of the groove 31 must be aligned, and the formation position of the groove 31 is aligned on both the front and back surfaces of the glass substrate 10.

[0047] The composite glass resin substrate 100 and its component glass resin substrate 1, as described later in the embodiment, are square or rectangular to match the shape of the semiconductor elements mounted on the circuit board. Therefore, the glass substrate 10 is rectangular (square or rectangular). The film trimming portions 30 are provided around the perimeter of the rectangular glass substrate 10, on the four sides of the first surface portion 11 and the four sides of the second surface portion 12, respectively. Figure 2 is a schematic cross-sectional view of the glass resin substrate 1. As can be understood from the figure, the film trimming portions 30 are provided at the four corners on the first surface portion 11 side and the four corners on the second surface portion 12 side of the glass substrate 10 (the figure is a partial disclosure of the cross-section). In other words, at each of the four corners on the first surface portion 11 side and the four corners on the second surface portion 12 side of the glass substrate 10, the film trimming portions 30 (resin layer trimming portions) are formed in a long, L-shaped cross-sectional view on the laminated single-type (single-material) resin film portions 20, 20 (resin layer portions).

[0048] There are two types of film trimming sections 30, as shown in the enlarged schematic diagram in Figure 3. The film trimming section 30 in Figure 3(A) is formed perpendicular to multiple single-type (single-material) resin film sections 20, 20 (resin film sections 21, 22, 23, 24) (multiple resin layer sections). In contrast, the film trimming section 30a in Figure 3(B) is provided with an inclined section 32 that widens the width of the groove section 31a in the direction away from the glass substrate 10 (in the order of resin film sections 21, 22, 23, 24). The method for forming the film trimming sections 30, 30a (resin layer trimming sections) in Figures 3(A) and 3(B) will be described in the manufacturing method section below.

[0049] In the film trimmed portion 30a of Figure 3(B) compared to the film trimmed portion 30 of Figure 3(A), the opening of the film trimmed portion 30a gradually increases. In other words, the amount of resin film layer 20 gradually decreases. From this, it can be considered that the stress generated in the resin film layer 20 (resin layer) decreases as it moves away from the glass substrate 10, and the force acting on the glass substrate 10 decreases.

[0050] Figure 4 is a magnified photograph (200x magnification) of a prototype of the film trimming section 30a shown in Figure 3(B). Figure 4 is a photograph of the glass resin substrate 1 when it is cut at the groove section 31a by itself. In the photograph, the thickness of the glass substrate is 495.52 μm, the thickness of the closest-adhesion film section is 25.07 μm on the upper side and 27.60 μm on the lower side, and the layer thickness of the resin film section excluding the closest-adhesion film section is 210.79 μm on the upper side and 177.08 μm on the lower side. As can be seen from the photograph, the opening of the film trimming section 30a gradually increases, and in a side view (cross-sectional view), the film trimming section 30a takes on an approximately "J" shape.

[0051] Figure 5 is a schematic diagram of a partially enlarged cross-section of a glass resin substrate 1 in which a cut-off portion 33 is provided at the most closely adhering portion. The resin film portion or resin layer portion at the most closely adhering portion may be removed from the finished glass resin substrate 1. In other words, at the film cut-off portions 30, 30a (resin layer cut-off portions) of the glass resin substrate 1, all or part of the most closely adhering film portion (most closely adhering portion) is removed to create the cut-off portion 33. The cut-off portion 33 exposes the first surface portion 11 and the second surface portion 12 of the glass substrate 10.

[0052] In Figure 5(A), a schematic diagram of a partially enlarged cross-section, a portion of the resin film or resin layer at the most closely adhering part is removed at the film cut-off portion 30 of the glass resin substrate 1, creating a cut-out portion 33. In Figure 5(B), a schematic diagram of a partially enlarged cross-section, a portion of the resin film or resin layer at the most closely adhering part is removed at the film cut-off portion 30a of the glass resin substrate 1, creating a cut-out portion 33. The presence of the cut-out portion 33 further reduces the generation of resistance and stress caused by the resin film or resin layer at the most closely adhering part when cutting the glass resin substrate 1.

[0053] Figure 6 is a schematic cross-sectional view of the composite glass resin substrate 100 of the embodiment. The composite glass resin substrate 100 is formed as a laminate 45 by stacking multiple glass resin substrates 1. For convenience, in the illustration, the glass resin substrate 1 is shown as a 3-layer laminate. The number of layers is appropriate and can range from 2 to 10 layers.

[0054] During the lamination of the glass resin substrate 1, a laminated conductive material 41 is provided near the wiring portion 15 of the glass resin substrate 1. The upper and lower glass resin substrates 1 become electrically conductive with respect to each other due to the interposition of the laminated conductive material 41. The laminated conductive material 41 is made of the same material as the embedded conductive material 14 described above, and the laminated conductive material 41 is a conductive resin paste containing fine particles of metals such as copper, silver, gold, platinum, nickel, and lead.

[0055] Furthermore, joints 42 are formed on the outermost surfaces 26 of the multiple resin layers of the glass resin substrate 1. In Figure 6, adhesive is used as the joint 42, and the adhesive is placed around the laminated conductive material 41. The adhesive of the joint 42 adheres and integrates the resin film portions 20 (resin layers) on the outermost surfaces 26. The appropriate interposition of the joint 42 prevents the outermost surfaces 26 of the multiple single-type (single-material) resin film portions 20 (resin layers) of the glass resin substrate 1 from directly contacting each other. In the illustration, the joint 42 is positioned on a part of the outermost surface 26. When a pressing stress occurs in the vertical direction (up and down of the illustration paper, in the direction of lamination) of the composite glass resin substrate 100, the gap between the outermost surfaces 26 of the multiple resin film portions 20 (resin layers) of the glass resin substrate 1 created by the joint 42 can absorb the deformation stress, thus preventing damage to the glass resin substrate 1. For example, epoxy resin can be used as the adhesive for the joint 42.

[0056] Figure 7 is a schematic cross-sectional view of a composite glass resin substrate 100A of another embodiment. In the composite glass resin substrate 100A of the embodiment in Figure 7, the materials of the laminated conductive material 41 and the adhesive as the bonding portion 42 are the same as those of the composite glass resin substrate 100 in Figure 6. In the composite glass resin substrate 100A, the adhesive as the bonding portion 42 is filled not only around the laminated conductive material 41, but also over the entire outermost surface 26 of the multiple resin layers of the glass resin substrate 1. In the illustration, the bonding portion 42 is distributed over the entire outermost surface 26. Furthermore, the adhesive as the bonding portion 42 is also filled into the resin layer cut-off portion 30. The adhesive has relative viscoelasticity even after curing after coating. Therefore, the influence of longitudinal stress that occurs after the composite glass resin substrate 100A is formed by laminating glass resin substrates 1 can be mitigated.

[0057] Figure 8 is a schematic cross-sectional view of another embodiment of the composite glass resin substrate 100B. In the composite glass resin substrate 100B of the embodiment in Figure 8, the material of the laminated conductive material 41 is the same as that of the composite glass resin substrate 100 in Figure 6. In the composite glass resin substrate 100B, when joining the outermost surfaces 26 of multiple single-type (single-material) resin film portions 20 of the glass resin substrate 1, a joining resin film portion 43 of the same quality as the resin film portion 20 is used as a joining portion 42. In the illustration, the joining portion 42 (joining resin film portion 43) is arranged over the entire outermost surface 26. That is, one or more resin films of the same type or identical to the resin film portion 20 are laminated as is. The joining resin film portion 43 is plasticized by heating and placed at a predetermined position on the outermost surface 26 of the resin film portion 20. Note that holes are pre-formed in the joining resin film portion 43 to avoid the areas of the laminated conductive material 41.

[0058] Since the resin film portion 20 and the bonded resin film portion 43 are of the same type or identical, their mutual bonding and adhesion are excellent. Because the resin film portion 20 and the bonded resin film portion 43 are of the same type or identical, the existing resin film portion 20 can be used as is without using a separate component to bond the outermost surfaces 26 of the resin film portion 20 together, thereby reducing the types of raw materials used in manufacturing and lowering product costs.

[0059] The composite glass resin substrate 100 in Figure 6, the composite glass resin substrate 100A in Figure 7, and the composite glass resin substrate 100B in Figure 8 are completed by going through the "cutting process" described later. After a laminate 45 is formed by stacking multiple glass resin substrates 1, the glass substrates 10 are cut one by one from the top and bottom at the grooves 31, 31a (film trimming sections 30, 30a). In this way, the composite glass resin substrates 100, 100A, and 100B are completed by being divided into predetermined sizes.

[0060] Next, the manufacturing method of the glass resin substrate 1 of the embodiment will be explained using schematic diagrams from Figures 9 to 12, followed by the manufacturing methods of the composite glass resin substrates 100, 100A, and 100B of the embodiment using Figures 13 to 15. In Figure 9(A), a glass substrate 10 constituting the glass resin substrate 1 of the embodiment is prepared. In Figure 9(B), through holes 13 are formed in the glass substrate 10 in the thickness direction from the first surface portion 11 to the second surface portion 12 ("through hole formation process"). The through holes 13 in the glass substrate 10 are formed by perforation by immersion (etching) in an acidic chemical solution such as hydrofluoric acid or an alkaline chemical solution such as caustic soda, or by perforation by laser irradiation, or a combination of both.

[0061] In Figure 9(C), after the formation of the through-hole 13, a conductive material is embedded in the through-hole 13 ("conductive material embedding process"). The conductive material 14 is a conductive resin paste containing fine particles of metals such as copper, silver, gold, platinum, nickel, and lead. Thus, the conductivity of the through-hole 13 from the first surface 11 to the second surface 12 is ensured by the conductive material 14. Alternatively, copper or silver plating is formed inside the through-hole 13 to make the through-hole 13 conductive.

[0062] In Figure 10, multiple resin layers are formed on the first surface 11 and the second surface 12 of the glass substrate 10. In this embodiment, a resin film portion 20 is attached to the first surface 11 and the second surface 12 ("forming process / attachment process"). Similar to the example in Figure 1, wiring portions 15 are formed on the resin film portions 20, 20 (resin film portions 21, 22, 23, 24, respectively), thereby making the glass substrate 10 conductive on both the first surface 11 side and the second surface 12 side. The illustrated resin film portion 21 corresponds to the closest-adhesion film portion (closest-adhesion portion) that is in close contact with the glass substrate 10.

[0063] In Figures 11(A) and (B), grooves 31, 31a of a predetermined width and depth are formed in multiple resin film portions (multiple resin layers) of a single type (single material) resin film portion 20, 20 attached to the first surface portion 11 and the second surface portion 12 of the glass substrate 10, leaving at least the closest-adhering film portion (resin film portion 21 in the figure) (closest-adhering portion) that is in close contact with the glass substrate 10 ("groove formation process"). In the embodiment, when forming the grooves 31, 31a, a cutting wheel 50, 50a (rotating blade, dicing blade) containing diamond powder is brought into contact with the multiple resin film portions 20, 20 of a single type (single material) and cut (grinds) in such a way as to leave the closest-adhering film portion (closest-adhering portion) intact.

[0064] In the case of a cutting wheel 50 (rotating blade, dicing blade), position control is accurate and easy, making it preferable for forming the groove 31 in the groove formation process. Note that cutting while leaving the closest-adhering film portion does not mean being so precise as to leave only the closest-adhering film portion, but also includes cases where cutting reaches a part of the closest-adhering film portion, and even cases where cutting ends in the middle of other resin film portions laminated to the closest-adhering film portion. Of course, when forming the groove 31 in the groove formation process, known methods such as dissolving the resin portion using chemical solutions such as organic solvents for resins, or cutting the resin portion by irradiation with laser light (cutting by melting) may be employed.

[0065] In forming the groove 31 in Figure 11(A), a cutting wheel 50 (rotating blade) with a square-shaped end is used. This corresponds to the creation of the film trimming section 30 (resin layer trimming section) in Figure 3(A). In forming the groove 31a in Figure 11(B), a cutting wheel 50a (rotating blade) with a rounded chamfered end is used. This corresponds to the creation of the film trimming section 30a (resin layer trimming section) in Figure 3(B). Due to the shape of the cutting wheel 50a (rotating blade), an inclined section 32 that widens the groove 31a is simultaneously formed. In this case, in cross-sectional view, the groove 31a is approximately "U" shaped.

[0066] When forming the grooves 31 and 31a, the positions of the grooves 31 relative to each other are formed on the second surface 12, which is symmetrical (line symmetrical) with respect to the first surface 11 in the thickness direction of the glass substrate 10. This is to ensure that the positions are aligned during cutting, as described below. The size of the grooves of a predetermined width and depth in the multiple resin film sections (multiple resin layers) that leave a single-type (single-material) closest-adhesion film section (resin film section 21 in the figure) (closest-adhesion section) is influenced by various factors such as the type of resin, the amount of thermal expansion, elasticity, and the groove formation method, so it is not easy to define a range for the size of the grooves in general.

[0067] The glass resin substrate 1 is completed by going through the groove formation process disclosed up to Figure 11. Then, edge treatment is added to the closest-adhesion film portion (closest-adhesion portion) as needed. As can be seen from the schematic cross-sectional view in Figure 12, after the groove formation process described above, the closest-adhesion film portion (closest-adhesion portion) of a single type (single material) is cut off to form the cut portion 33 ("cutting process"). In this way, the form shown in Figures 5(A) and (B) is achieved. Since the closest-adhesion film portion (closest-adhesion portion) is cut off and the glass substrate 10 is exposed, the resistance and stress generated during cutting in the cutting process described later are further reduced. In the cutting process, in addition to using the cutting wheels 50, 50a (rotary blades) shown in Figure 12, chemicals, laser irradiation, etc. may also be used.

[0068] The schematic cross-sectional view in Figure 13 shows the manufacturing process of the composite glass resin substrate 100, in which multiple glass resin substrates 1 are stacked. Three layers are shown as an example. The laminated conductive material 41 is placed near the wiring portion 15 of the glass resin substrate 1 to be stacked. At the same time, adhesive is used as a bonding portion 42 on the outermost surface of the multiple resin layer portions 20 of the glass resin substrate 1, and the adhesive is placed there. Then, the glass resin substrates 1 are stacked together to form a laminate 45 ("lamination process"). In the figure, the bonding portion 42 is located on a part of the outermost surface 26.

[0069] Multiple glass resin substrates 1 are stacked to form a laminate 45. After the adhesive or the like that forms the joint 42 hardens, the laminate 45 is cut from the outermost glass resin substrate 1 in the thickness direction, starting from the grooves 31, 31a ("cutting process"). A cutting wheel 50 (rotating blade, dicing blade) containing diamond powder for glass processing is used for cutting. Cutting with the cutting wheel 50 may be done sequentially in one direction from either side of the laminate 45 (top or bottom of the paper), or it may be done simultaneously from both sides of the laminate 45 (top and bottom of the paper). After the cutting process is completed, the composite glass resin substrate 100 shown in Figure 6 is completed. As shown in Figure 13, and later in Figures 14 and 15, the resin film sections 20, 20 (resin film sections 21, 22, 23, and 24, respectively) are of a single type (single material), and therefore the closest-contacting film section (closest-contacting part) is also of a single type (single material). In other words, the closest-contacting film section (closest-contacting part) that the cutting wheel 50 (rotating blade) contacts is not a structure in which different types of film or resin materials are arranged or substituted.

[0070] Figure 14 shows a schematic cross-sectional view of the composite glass resin substrate 100A during manufacturing, where multiple glass resin substrates 1 are stacked. The laminated conductive material 41 is placed near the wiring portion 15 of the glass resin substrate 1 to be stacked. The adhesive, which serves as the bonding portion 42, is filled not only around the laminated conductive material 41 but also over the entire outermost surface 26 of the multiple resin layers of the glass resin substrate 1, including the area around the laminated conductive material 41. In the illustration, the bonding portion 42 is distributed over the entire outermost surface 26. Furthermore, the adhesive, which serves as the bonding portion 42, is also filled into the grooves 31, 31a (resin layer cut-off portions 30). The glass resin substrates 1 are then stacked to form a laminate 45 ("lamination process").

[0071] Multiple glass resin substrates 1 are stacked to form a laminate 45. After the adhesive, etc., which serves as the bonding portion 42 hardens, the laminate 45 is cut from the outermost part in the thickness direction of the laminate 45, starting from the grooves 31, 31a of the outermost glass resin substrate 1 ("cutting process"). The cutting process is the same for both the composite glass resin substrates 100 and 100A shown in Figures 13 and 14. In the composite glass resin substrate 100A, the adhesive 42 is filled into the grooves 31, 31a (resin layer cut-off portion 30), so it is thought that stress is also generated in the resin of the adhesive 42. However, the adhesive as the bonding portion 42 has lower rigidity than the resin film portion 20 and does not cause a strong tensile effect on the glass substrate 10. Therefore, when the glass substrate 10 is cut with the cutting wheel 50 (rotating blade, dicing blade), there is almost no stress affecting the glass substrate 10, and there is no possibility of the glass substrate 10 cracking in layers internally (back cracking).

[0072] Figure 15 shows a schematic cross-sectional view of the composite glass resin substrate 100B during manufacturing, where multiple glass resin substrates 1 are laminated. Laminated conductive material 41 is placed near the wiring portion 15 of the glass resin substrate 1 to be laminated. A bonding resin film portion 43 of the same quality as the resin film portion 20 is used as the bonding portion 42. In the figure, the bonding portion 42 (bonding resin film portion 43) is placed over the entire outermost surface 26. That is, one or more resin films of the same type or identical to the resin film portion 20 are laminated as is. The bonding resin film portion 43 is plasticized by heating and placed at a predetermined position on the outermost surface 26 of the resin film portion 20. Note that holes are formed in advance in the bonding resin film portion 43 to avoid the area of ​​the laminated conductive material 41. Then, the glass resin substrates 1 are laminated together to form a laminate 45 ("lamination process").

[0073] Multiple glass resin substrates 1 are stacked to form a laminate 45. After the bonding resin film portion 43 hardens and fuses with the upper and lower resin film portions 20, the laminate 45 is cut from the outermost part in the thickness direction of the laminate 45, starting from the grooves 31, 31a of the outermost glass resin substrate 1 ("cutting process"). The cutting process is the same for all composite glass resin substrates 100, 100A, and 100B shown in Figures 13, 14, and 15. As shown in Figure 15, in the composite glass resin substrate 100B, the bonding resin film portion 43 reaches the resin layer cut-off portion 30. However, at the resin layer cut-off portion 30, which is the cutting point, the bonding resin film portion 43 is floating without contacting the other resin film portions 20. Therefore, the stress of the bonding resin film portion 43 has an extremely small effect on the glass substrate 10 through the resin film portion 20. Therefore, when cutting the glass substrate 10 with the cutting wheel 50 (rotating blade, dicing blade), there is almost no stress affecting the glass substrate 10, and there is no possibility of the glass substrate 10 cracking in layers internally (back cracking).

[0074] As can be seen from the illustrations in Figures 13 to 15, film cut-off portions 30, 30a (resin layer cut-off portions) originating from grooves 31, 31a are formed on the first surface 11 side and the second surface 12 side of the glass substrate 10, respectively. In other words, in the film cut-off portions 30, 30a, the resin film portion (resin layer portion) that adheres to the glass substrate 10 is limited to the minimum closest-adhesion film portion (closest-adhesion portion). Therefore, when the cutting wheel 50 (rotating blade) contacts the closest-adhesion film portion, the stress generated in the closest-adhesion film portion is small compared to the entirety of the multiple laminated resin film portions 20, 20 (multiple resin layers), and the propagation of stress from the closest-adhesion film portion (closest-adhesion portion) to the glass substrate 10 is suppressed. By reducing the volume of the resin film portion 20, 20 (resin layer portion) at the cutting location in advance, the influence of excess stress generated from the resin film portion 20, 20 (resin layer portion) on the glass substrate 10 is mitigated, and deformation of the glass substrate 10 is avoided. As a result, this method is effective in preventing the phenomenon of layered cracking (back cracking) that occurs within the glass substrate itself.

[0075] In the composite glass-resin substrate 100 in Figure 13, the composite glass-resin substrate 100A in Figure 14, and the composite glass-resin substrate 100B in Figure 15, the closest-adhesion film portion (closest-adhesion portion) remains. Alternatively, composite glass-resin substrates 100, 100A, and 100B can be created by replacing each of the multiple glass-resin substrates 1 with a glass-resin substrate 1 having the cut portion disclosed in Figure 5. As shown in Figures 13 to 15, the closest-adhesion film portion (closest-adhesion portion) is part of the resin film portions 20, 20 (resin film portions 21, 22, 23, 24 respectively), and the resin film portions 20, 20 (resin film portions 21, 22, 23, 24 respectively) are all of the same single type (single material). Therefore, the structure is not such that a different type of film or resin material is arranged or replaced as the closest-adhesion film portion (closest-adhesion portion) that the cutting wheel 50 (rotating blade) contacts.

[0076] The perspective view in Figure 16 shows an example of a composite glass resin substrate manufacturing apparatus 500 for manufacturing composite glass resin substrates 100, 100A, and 100B formed by laminating the glass resin substrates 1 described above. The composite glass resin substrate manufacturing apparatus 500 includes a first rotating blade 501 that forms grooves 31, 31a of a predetermined width and depth in a plurality of resin layer portions 20 (resin film portions 21, 22, 23, 24 in Figure 10) of the glass substrate 1, and a second rotating blade 502 that cuts from the grooves 31, 31a of the outermost glass resin substrate 1 of the laminate 45 toward the thickness direction of the laminate 45.

[0077] Furthermore, the composite glass resin substrate manufacturing apparatus 500 includes a control unit 505 inside the base unit 507 that controls the positions of the first rotating blade 501 and the second rotating blade 502. The control unit 505 is a control device or control board on which known computing elements such as a microcomputer or programmable logic controller are mounted.

[0078] In the composite glass resin substrate manufacturing apparatus 500 as shown in the figure, the workpiece W is placed at a predetermined position on the turntable 508 of the base 507. The workpiece W is rotated through the turntable 508 in accordance with the cutting operation of the first rotating blade 501 and the second rotating blade 502. The workpiece W is either a glass resin substrate 1 or a laminate 45.

[0079] The first rotating blade 501 is held by the first arm 503, and the second rotating blade 502 is held by the second arm 504. The first rotating blade 501 and the second rotating blade 502 are known rotating blades (cutting wheels, dicing blades) used for processing glass, silicon wafers, etc., such as grinding wheels containing diamond or the like. The first rotating blade 501 is a thick (thick and wide) rotating blade used to form grooves 31, 31a of a predetermined width in the resin film portion 20 (resin film portions 21, 22, 23, 24). In contrast, the second rotating blade 502 is a thinner (thinner) rotating blade than the first rotating blade 501 used to sequentially cut each glass substrate 10 of the laminate 45.

[0080] The base 507 is equipped with a motor (servo motor, stepping motor, etc.) for rotating the turntable 508 (not shown). The base 507 is also equipped with a case 509, which is equipped with rails and motors (servo motor, stepping motor, etc.) (not shown) for the vertical, horizontal, and vertical movement (see arrows) of the first arm 503 and the second arm 504. The amount of movement of the first arm 503 and the second arm 504 is controlled under the control of the control unit 505.

[0081] The composite glass resin substrate manufacturing apparatus 500 of this embodiment can ultimately manufacture composite glass resin substrates 100, 100A, and 100B by using the first rotary blade 501 and the second rotary blade 502 depending on the desired groove width and the workpiece. Since processing is performed only by rotary blades, it is possible to process faster than laser irradiation processing. In particular, it is convenient for mass production of composite glass resin substrates 100, 100A, and 100B. [Explanation of symbols]

[0082] 1. Glass resin substrate 10 Glass substrate 11 First side 12 Second side part 13 Through hole 14 Embedded conductive material 15 Wiring section 20 (21, 22, 23, 24) Resin film portion (resin layer portion) 26 Outermost surface 30,30a Film trimming section (resin layer trimming section) 31,31a Groove 32 Slope 33 Excision part 41. Multilayer conductive materials 42 Joint 43 Bonding resin film section 45 Laminate 50,50a Cutting wheel (rotary blade) 100, 100A, 100B Composite Glass Resin Substrate 500 Composite glass resin substrate manufacturing equipment 501 First Rotating Blade 502 Second Rotating Blade 503 First Arm 504 Second Arm 505 Control Unit 506 Rotary blade moving part 507 Taibe 508 Turntable C. Spine split area W - Object to be processed

Claims

1. A composite glass resin substrate is formed by laminating multiple glass resin substrates, each having a resin layer on the surface of a glass substrate, The glass resin substrate is The glass substrate has through holes formed in the thickness direction from the first surface to the second surface, The conductive material to be embedded in the through-hole, A plurality of single-type resin layers formed on the first and second surfaces of the glass substrate, A wiring portion provided in the plurality of single-type resin layers that is electrically connected to the embedded conductive material in the through-hole portion, A groove of a predetermined width is formed on the first and second surfaces of the glass substrate, leaving at least the closest contact portion that is in close contact with the glass substrate among the plurality of single-type resin layer portions, The resin layer cutting portion comprises the groove portion and the closest-fitting portion, The aforementioned composite glass resin substrate is A laminated conductive material provided near the wiring portion of the glass resin substrate, The glass resin substrate comprises a bonding portion disposed on the outermost surface of the plurality of single-type resin layers, which joins the plurality of single-type resin layers together. A composite glass resin substrate characterized by the following features.

2. The composite glass resin substrate according to claim 1, wherein the groove portion is formed on the second surface portion which is symmetrical to the first surface portion in the thickness direction of the glass substrate.

3. The glass resin substrate is rectangular, The composite glass resin substrate according to claim 2, wherein the resin layer cut-off portions are provided on the four sides of the first surface and the four sides of the second surface of the glass substrate, respectively.

4. The composite glass resin substrate according to claim 1, wherein the resin layer cut-off portion is provided with an inclined portion that increases the width of the groove in a direction away from the glass substrate.

5. The composite glass resin substrate according to claim 1, wherein the plurality of single-type resin layers are a plurality of resin film portions.

6. The composite glass resin substrate according to claim 1, wherein the closest adhering portion is provided with a cut portion.

7. The composite glass resin substrate according to claim 1, wherein the composite glass resin substrate is laminated between the wiring portions of each of the glass resin substrates.

8. The aforementioned joint is made of adhesive, The composite glass resin substrate according to claim 1, wherein the adhesive is filled into the portion of the resin layer that has been cut off.

9. The composite glass resin substrate according to claim 1, wherein the bonding portion is a bonding resin film portion of the same quality as the resin film portion.

10. The composite glass resin substrate according to claim 1, wherein the bonding portion is arranged on part or all of the outermost surface of the plurality of single-type resin layers of the glass resin substrate, and the plurality of single-type resin layers are bonded together.

11. A method for manufacturing a composite glass resin substrate, comprising stacking multiple glass resin substrates, each having multiple resin layers on the surface of a glass substrate, The process of forming through holes in the thickness direction from the first surface to the second surface of the glass substrate includes a through-hole formation step, A conductive material embedding step involves embedding a conductive material into the aforementioned through-hole, A forming step of forming a plurality of single-type resin layers on each of the first and second surfaces of the glass substrate, each having a wiring portion that is electrically connected to the embedded conductive material in the through-hole; A groove forming step in which grooves of a predetermined width and depth are formed in the plurality of single-type resin layers formed on the first and second surfaces of the glass substrate, leaving at least the closest-contact portion that is in close contact with the glass substrate; The glass resin substrate is then fabricated from the above. A lamination process to obtain a laminate by laminating the glass resin substrate, wherein a laminated conductive material is placed near the wiring portion of the glass resin substrate to be laminated, and a bonding portion is placed on the outermost surface of the plurality of resin layers of the glass resin substrate to bond the plurality of single-type resin layers to each other, and the glass resin substrate is laminated. The process includes a cutting step of cutting the outermost glass resin substrate of the laminate in the thickness direction of the laminate from the groove. A method for manufacturing a composite glass resin substrate, characterized by the following:

12. The method for manufacturing a composite glass resin substrate according to claim 11, wherein the formation of the groove in the groove formation step is by cutting or dissolution.

13. The method for manufacturing a composite glass resin substrate according to claim 11, wherein the groove portion is formed on the second surface portion which is symmetrical to the first surface portion in the thickness direction of the glass substrate.

14. The method for manufacturing a composite glass resin substrate according to claim 11, wherein, in the groove forming step, an inclined portion is formed in the groove that increases the width of the groove in a direction away from the glass substrate.

15. The method for manufacturing a composite glass resin substrate according to claim 11, wherein the plurality of single-type resin layers are a plurality of resin film portions.

16. The method for manufacturing a composite glass resin substrate according to claim 11, further comprising a cutting step after the groove formation step, in which the closely adhering portion is cut off to form a cut portion.

17. The aforementioned joint is made of adhesive, The method for manufacturing a composite glass resin substrate according to claim 11, wherein in the lamination step, the adhesive is filled into the resin layer cut-off portion.

18. The method for manufacturing a composite glass resin substrate according to claim 11, wherein the bonding portion is a bonding resin film portion of the same quality as the resin film portion.

19. The method for manufacturing a composite glass resin substrate according to claim 11, wherein the bonding portion is arranged on part or all of the outermost surface of the plurality of single-type resin layers of the glass resin substrate, and the plurality of single-type resin layers are bonded together.

20. A composite glass resin substrate manufacturing apparatus used in the method for manufacturing a composite glass resin substrate according to claim 11, A first rotating blade for forming grooves of a predetermined width and depth in the plurality of single-type resin layers of the glass substrate, A second rotating blade cuts from the groove of the outermost glass resin substrate of the laminate toward the thickness direction of the laminate, The system includes a control unit that controls the positions of the first rotating blade and the second rotating blade. A composite glass resin substrate manufacturing apparatus characterized by the following features.

Images