Display panel

Abstract

To provide a novel display panel that offers superior convenience or reliability. [Solution] A display panel having a first area, a second area, and a display area, The second region includes a part of the display region, the second region comprises the first member, and the second region is the first The member can be curved outward, and the first member is a first elastic body and a second elastic body The body comprises a second elastic body having an end portion that is partially or completely covered by the first elastic body, and the second The elastic body has a higher modulus of elasticity than the first elastic body.

Description

Technical Field

[0001] One aspect of the present invention relates to a display panel, a display device, an input / output device, an information processing device, or a semiconductor device There is no limitation. One aspect of the invention disclosed in this specification or the like relates to an article, a method, or a manufacturing method. Or, one aspect of the present invention relates to a process, a machine, a manufacture, or a composition (composition of matter). Therefore, more specifically, as the technical field of one aspect of the present invention disclosed in this specification, semiconductor devices, display devices, light-emitting devices, power storage devices, storage devices,

[0002] their driving methods, or their manufacturing methods can be cited as an example. One aspect of the present invention relates to a process, a machine, a manufacture, or a composition (composition of matter). Therefore, more specifically, as the technical field of one aspect of the present invention disclosed in this specification, semiconductor devices, display devices, light-emitting devices, power storage devices, storage devices, their driving methods, or their manufacturing methods can be cited as an example. matter). Therefore, more specifically, as the technical field of one aspect of the present invention disclosed in this specification, semiconductor devices, display devices, light-emitting devices, power storage devices, storage devices, their driving methods, or their manufacturing methods can be cited as an example. their driving methods, or their manufacturing methods can be cited as an example.

Background Art

[0003] ​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​This is one such example. Alternatively, the objective is to provide a novel display device that is superior in terms of convenience or reliability. It shall be one of the following. Alternatively, it shall be an objective to provide a novel input / output device that is superior in convenience or reliability. One of the topics is to provide a novel information processing device that is superior in convenience or reliability. This is one of the challenges. Alternatively, a new display panel, a new display device, a new input / output device, new One of the objectives is to provide a standard information processing device or a novel semiconductor device.

[0006] Furthermore, the description of these problems does not preclude the existence of other problems. The approach does not need to solve all of these problems. This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings It is possible to extract other issues from the descriptions in the surfaces, claims, etc. [Means for solving the problem]

[0007] (1) One aspect of the present invention comprises a first region 700A, a second region 700B, and a display region 23 This is a display panel having 1 and .

[0008] The first area 700A includes a portion of the display area 231.

[0009] The second area 700B includes the other part of the display area 231, and the second area 700B is part of the first section The material 791 is provided, and the second region 700B is curved outward toward the first member 791. can.

[0010] The first member 791 comprises a first elastic body 791A and a second elastic body 791C.

[0011] The second elastic body 791C has an end portion that is partially or completely covered by the first elastic body 791A. The second elastic body 791C has a greater modulus of elasticity than the first elastic body 791A.

[0012] This allows the curvature of the second region 700B to be adjusted. Alternatively, It can be curved with a radius of curvature larger than the given size. Or, the radius of curvature is a given size It can be curved in a way that prevents it from becoming smaller. Or, multiple curves with different radii of curvature can be used. The portion can be formed in the second region 700B. Alternatively, it can be curved in a U-shape. It can be repeatedly bent or it can prevent the formation of irreversible creases. This is possible. Alternatively, the display area overlapping with the second area 700B can be protected. Alternatively, the intensity of the second region 700B can be increased. As a result, convenience or reliability This allows us to provide a novel display panel with superior performance.

[0013] (2) In addition, in one aspect of the present invention, the above-mentioned display area 231 is provided with the first member 791. This display panel has a function that allows it to display information in a direction that is not being directed.

[0014] This allows the display to be shown without being obstructed by the first member 791. Alternatively, the Wrinkle formation can be suppressed in region 700B of area 2. As a result, convenience or This allows us to provide a new display panel with superior reliability.

[0015] (3) In addition, in one aspect of the present invention, the second region 700B described above has a curvature greater than 2 mm. This is a display panel that can be curved in diameter.

[0016] This allows the display panel to be repeatedly bent without causing any malfunctions. This allows for a reduction in thickness in a curved state. For example, a radius of curvature of 5 mm or more, preferably 2 m. It can be curved with a radius of curvature of m or more, more preferably greater than 2 mm. Specifically, It can be bent repeatedly more than 50,000 times. As a result, it offers superior convenience or reliability. This allows us to provide a new display panel.

[0017] (4) In addition, in one aspect of the present invention, the second region 700B is the first member 791 It is thinner than the thickness plus 100 μm, preferably thinner than the thickness plus 80 μm, Preferably, the display panel is thinner than the thickness of 50 μm added to it.

[0018] This allows for a thinner display panel. As a result, convenience or reliability This allows us to provide a novel display panel with superior performance.

[0019] (5) In another aspect of the present invention, the first member 791 described above is, in cross-section, toward the end It is a display panel with a shape that allows it to become thinner.

[0020] This allows the rigidity of the first member 791 to be gradually reduced towards the end. Alternatively, the second region 700B can be constructed such that the radius of curvature gradually decreases towards the ends. It can be curved. As a result, it provides a novel display panel with superior convenience or reliability. It is possible.

[0021] (6) In another aspect of the present invention, the first member 791 described above is a band that crosses the display area 231. This is a display panel with a specific shape.

[0022] This allows the display area to be folded in two along the first member 791. Alternatively, the display can be folded in two. A portion of the display area 231 can be aligned with another portion. Alternatively, the outline of the display panel can be adjusted. It can be made smaller. As a result, it offers a new display panel that is more convenient or reliable. It can be provided.

[0023] (7) In another aspect of the present invention, a sealing material 705, a first base material 510, and a second base material 770 The display panel has a third region 700C.

[0024] The sealing material 705 is sandwiched between the first base material 510 and the second base material 770.

[0025] The second substrate 770 has an area that overlaps with the first substrate 510.

[0026] The first region 700A includes a portion of the overlapping region mentioned above, and the second region 700B includes a portion of the overlapping region mentioned above. This includes other parts of the region.

[0027] The third region 700C is the overlapping region mentioned above, the end of the first substrate 510, and the second substrate 770. This includes the second member 792.

[0028] The second member 792 covers the end of the first base material 510, and the second member 792 is connected to the sealing material 705 This display panel has very low breathability.

[0029] This allows the functional layer 520 between the first substrate 510 and the second substrate 770 to be exposed to the outside. This can suppress the diffusion of impurities to the display element 550(i,j). Alternatively, the first The edges of the base material 510 and the second base material 770 can be protected. As a result, convenience is improved. Alternatively, it is possible to provide a new display panel with superior reliability.

[0030] (8) Another aspect of the present invention is a display panel having pixels 702(i,j).

[0031] Pixel 702(i,j) comprises a functional layer 520 and a display element 550(i,j).

[0032] The functional layer 520 includes a pixel circuit 530(i,j), and the pixel circuit 530(i,j) is a display element. It is electrically connected to 550(i,j).

[0033] This allows for the display of electronic data. As a result, it offers superior convenience and reliability. This allows us to provide a novel display panel.

[0034] (9) In addition, in one aspect of the present invention, the above-mentioned display area 231 is a group of pixels 702(i,1) up to pixel 702(i,n), and another group of pixels 702(1,j) to pixel 702(m,j) It is a display panel equipped with scan line G2(i) and signal line S2(j).

[0035] A group of pixels 702(i,1) to 702(i,n) includes pixel 702(i,j), A group of pixels 702(i,1) through 702(i,n) are arranged in the row direction.

[0036] Another group of pixels 702(1,j) to 702(m,j) includes pixel 702(i,j). Furthermore, the other group of pixels 702(1,j) to 702(m,j) are in columns that intersect with the row direction. They are arranged in that direction.

[0037] Scan line G2(i) is electrically connected to a group of pixels 702(i,1) through 702(i,n). Connected.

[0038] The signal line S2(j) is electrically connected to another group of pixels 702(1,j) through 702(m,j). It connects to the target.

[0039] This allows image information to be supplied to multiple pixels. As a result, convenience or reliability This allows us to provide a novel display panel with superior reliability.

[0040] (10) Another aspect of the present invention comprises the above-mentioned display panel 700 and a control unit 238. It is a display device.

[0041] The control unit 238 is supplied with image information V1 and control information CI, and the control unit 238 receives image information V Based on 1, information V11 is generated, and the control unit 238 issues a control signal S based on the control information CI. P is generated, and the control unit 238 supplies information V11 and control signal SP.

[0042] The display panel 700 is supplied with information V11 or control signal SP, and the pixels are displayed based on the information. To show.

[0043] This allows image information to be displayed using a display element. As a result, convenience and This can provide a novel display device with superior reliability.

[0044] (11) Another aspect of the present invention is an input / output device having an input unit 240 and a display unit 230. It is placed there.

[0045] The display unit 230 includes the display panel 700 described above.

[0046] The input unit 240 is equipped with a detection area 241, and the input unit 240 is equipped with an input area adjacent to the detection area 241. Detect. The detection area 241 includes an area that overlaps with pixel 702(i,j).

[0047] This allows image information to be displayed using the display unit, while also allowing access to areas adjacent to the display unit that overlap with it. It can detect this. Alternatively, by using a finger or other object placed close to the display as a pointer, the position can be detected. Location information can be entered. Alternatively, location information can be associated with image information displayed on the display unit. This allows for the provision of novel input / output devices with superior convenience or reliability. It is possible.

[0048] (12) Another aspect of the present invention includes an arithmetic unit 210 and an input / output device 220. It is an information processing device.

[0049] The arithmetic unit 210 is supplied with input information II or detection information DS, and the arithmetic unit 210 receives control information Provides information CI and image information V1.

[0050] Input / output device 220 supplies input information II and detection information DS, and input / output device 220 controls Information CI and image information V1 are supplied, and the input / output device 220 consists of a display unit 230 and an input unit 2 It comprises 40 and a detection unit 250.

[0051] The display unit 230 is equipped with the above-mentioned display panel 700, and the display unit 230 is based on the control information CI Display image information V1.

[0052] The input unit 240 generates input information II, and the detection unit 250 generates detection information DS.

[0053] (13) In addition, one aspect of the present invention relates to a keyboard, hardware buttons, pointing Vice, touch sensor, illuminance sensor, imaging device, voice input device, eye-tracking device, posture detection This is an information processing device that includes one or more of the above-mentioned devices and the display panel described above.

[0054] This allows image information or control based on information supplied using various input devices. Information can be generated by the computing device. As a result, new technologies with superior convenience or reliability can be developed. We can provide an information processing device.

[0055] In the drawings attached to this specification, the components are classified by function and are shown as independent blocks. Although a block diagram is shown, it is difficult to completely separate the actual components by function. Furthermore, a single component may be involved in multiple functions.

[0056] In this specification, the source and drain of a transistor are defined as the polarity of the transistor and each The name changes depending on the potential applied to the terminals. Generally, n-channel In a transistor, the terminal to which a low potential is applied is called the source, and the terminal to which a high potential is applied is called the source. The terminal that is exposed to low potential is called the drain. Also, in p-channel transistors, when a low potential is applied... The terminal to which the current is applied is called the drain, and the terminal to which a high potential is applied is called the source. So, for convenience, let's assume that the source and drain are fixed, and the transistor's connections Although the relationship is sometimes explained, in reality, the source and drain are called according to the potential relationship described above. The way they move is reversed.

[0057] In this specification, the source of a transistor is a part of the semiconductor film that functions as the active layer. This refers to the source region, or the source electrode connected to the semiconductor film. Similarly, The drain of a DISTA is a drain region which is part of the semiconductor film, or a part of the semiconductor film. It refers to the connected drain electrode. The gate, on the other hand, refers to the gate electrode.

[0058] In this specification, the state in which transistors are connected in series means, for example, the first transistor Only one of the sources or drains of the second transistor is connected to the source or drain of the second transistor. This means that only one side of the transistor is connected. Also, when transistors are connected in parallel... The state in which one of the sources or drains of the first transistor is connected to the second transistor Connected to either the source or drain of the first transistor, and the source or drain of the first transistor This means that the other end of one transistor is connected to the other end of the source or drain of the second transistor. do.

[0059] In this specification, "connection" means an electrical connection, where current, voltage, or potential is supplied. This corresponds to a state where power can be supplied or transmitted. Therefore, a connected state means that power is directly connected. This does not necessarily refer to a state in which current, voltage, or potential is available or available for transmission. To enable transmission, the circuit elements such as wires, resistors, diodes, and transistors are connected. This category also includes states where devices are indirectly connected.

[0060] In this specification, when components that are independent in the circuit diagram are connected to each other, However, in reality, for example, when part of the wiring functions as an electrode, one conductive film can be multiple In some cases, the components may also possess the functions of multiple components. In this specification, connection means such as This category also includes cases where a single conductive film possesses the functions of multiple components.

[0061] Furthermore, in this specification, if either the first electrode or the second electrode of the transistor is the source One electrode points to the drain electrode. [Effects of the Invention]

[0062] According to one aspect of the present invention, a novel display panel with superior convenience or reliability is provided. This is possible. Alternatively, it is possible to provide a novel display device that is superior in convenience or reliability. Alternatively, it may be possible to provide novel input / output devices that offer superior convenience or reliability. This can provide a novel information processing device that is superior in convenience or reliability. Or, Novel display panel, novel display device, novel input / output device, novel information processing device or new We can provide semiconductor devices.

[0063] Furthermore, the description of these effects does not preclude the existence of other effects. The embodiment does not necessarily have to have all of these effects. Furthermore, other effects are... This will become clear from the description in the specification, drawings, claims, etc., and the specification, drawings Furthermore, it is possible to extract other effects from the descriptions in the claims and other documents. [Brief explanation of the drawing]

[0064] [Figure 1] A diagram illustrating the configuration of a display panel according to an embodiment. [Figure 2] A diagram illustrating the configuration of a display panel according to an embodiment. [Figure 3] A diagram illustrating the configuration of a display panel according to an embodiment. [Figure 4] A diagram illustrating the configuration of a display panel according to an embodiment. [Figure 5] A top view illustrating the configuration of the display panel according to the embodiment. [Figure 6] A cross-sectional view and a circuit diagram illustrating the configuration of the display panel according to the embodiment. [Figure 7] A cross-sectional view illustrating the configuration of a display panel according to an embodiment. [Figure 8] A cross-sectional view illustrating the configuration of a display panel according to an embodiment. [Figure 9] A block diagram illustrating the configuration of the display panel according to the embodiment. [Figure 10] A diagram illustrating the configuration of a display device according to an embodiment. [Figure 11] A block diagram illustrating the configuration of an input / output device according to an embodiment. [Figure 12] A block diagram and projection diagram illustrating the configuration of an information processing device according to an embodiment. [Figure 13] A flowchart illustrating the driving method of the information processing device according to the embodiment. [Figure 14] A diagram illustrating the driving method of an information processing device according to an embodiment. [Figure 15] A diagram illustrating the artificial intelligence unit of an information processing device according to an embodiment. [Figure 16] A diagram illustrating the characteristics of the transistor according to the embodiment. [Modes for carrying out the invention]

[0065] One aspect of the present invention is a display panel having a first area, a second area, and a display area. The second region includes a part of the display region, the second region comprises the first member, and the second region The first member can be curved outwards, and the first member is a first elastic body and a second The first elastic body comprises an elastic body, and the second elastic body has an end portion that is partially or completely covered by the first elastic body. The second elastic body has a greater modulus of elasticity than the first elastic body.

[0066] This allows for curvature with a radius of curvature larger than a given size. Alternatively, half the radius of curvature It can be curved so that the diameter does not become smaller than a predetermined size. Or, it can be repeatedly curved. It can be bent, or the formation of irreversible creases can be suppressed. This allows us to provide novel display panels that offer superior convenience or reliability.

[0067] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. It will be easily understood by those skilled in the art to obtain this. Therefore, the present invention is as shown in the embodiments below. The description is not to be interpreted as being limited to the stated content. The same reference numeral is used in common across different drawings for parts that are identical or have similar functions. I will omit the explanation of that repetition.

[0068] (Embodiment 1) In this embodiment, the configuration of a display panel according to one aspect of the present invention will be described with reference to Figures 1 to 4. I'll explain while doing so.

[0069] Figure 1 is a diagram illustrating the configuration of a display panel according to one embodiment of the present invention. Figure 1(A) is an embodiment of the present invention. Figure 1(B) is a perspective view of the display panel of the configuration, Figure 1(A) is a side view of Figure 1(C) This is a top view of Figure 1(A).

[0070] Figure 2 is a diagram illustrating the configuration of a display panel according to one embodiment of the present invention. Figure 2(A) is an embodiment of the present invention. Figure 2(B) is a top view of the display panel of the configuration, and Figure 2(B) shows the cutting line A1-A2 in Figure 2(A). This is a cross-sectional view, and Figure 2(C) is a cross-sectional view illustrating the curved state.

[0071] Figure 3(A) is a cross-sectional view illustrating a part of Figure 2(B), and Figure 3(B) is a part of Figure 2(B). This is a cross-sectional view of the curved object.

[0072] Figure 4 is a diagram illustrating the configuration of a display panel according to one embodiment of the present invention. Figure 4(A) is an embodiment of the present invention. Figure 4(B) is a top view of the display panel of the configuration, and Figure 4(B) shows the cutting line A1-A2 in Figure 4(A). This is a cross-sectional view, and Figure 4(C) is a diagram illustrating a part of Figure 4(B).

[0073] In this specification, a variable that takes an integer value of 1 or more may be used as the sign. For example If (p) contains a variable p that takes an integer value of 1 or greater, then any of the maximum p components are special It may be used as part of the sign that is defined. Also, for example, a variable m that takes an integer value of 1 or more. A code that identifies one of up to m × n components of (m,n), which contains the variable n. It may be used in certain departments.

[0074] <Example of display panel configuration 1.> The display panel 700 described in this embodiment includes area 700A, area 700B, and display area It has region 231 and (see Figures 1(A) and 1(C)).

[0075] 《Example 1 of the display area 231 configuration.》 The display area 231 has the function of displaying images.

[0076] 《Area 700A》 Area 700A includes a portion of display area 231.

[0077] 《Example of configuration for area 700B.》 Area 700B includes the remaining portion of display area 231.

[0078] Region 700B comprises member 791, and region 700B is curved with member 791 facing outwards. It is possible.

[0079] 《Example of component 791 configuration 1.》 Member 791 comprises elastic body 791A and elastic body 791C (see Figure 1(B)).

[0080] The elastic body 791C has an end portion that is partially or completely covered by the elastic body 791A, and the elastic body 791 C has a greater modulus of elasticity than elastic body 791A. Alternatively, elastic body 791C is elastic body 791 It has a smaller elongation at break than A. The ratio of the length to the original length is called the elongation at break.

[0081] [Example configuration of elastic body 791A and elastic body 791C] For example, resin, rubber, urethane rubber, silicone rubber, etc. are elastic material 791A and elastic material It can be used with 791C.

[0082] Specifically, materials with an elastic modulus of 0.1 MPa or more and 0.8 MPa or less are used for the elastic body 791A. It is possible to use materials with an elastic modulus of 0.8 MPa or more and 1.2 MPa or less as elastic bodies 79. It can be used in 1C. Alternatively, a material with a breaking elongation of 350% can be used in the elastic body 791A. It is possible to use a material with a fracture elongation of 200% as the elastic body 791C. ru.

[0083] Elastic material 791C is less prone to bending than elastic material 791A. This allows region 700B to be When curved, the radius of curvature R3 of the portion P3 that overlaps with the elastic body 791C is equal to the radius of curvature R3 of the portion that overlaps with the elastic body 791A. The radius of curvature of the portion P1 is greater than R1 (see Figures 3(A) and 3(B)). Also, the bullet The radius of curvature R2 at the point where the boundary P2 of material 791C and elastic material 791A overlaps is the radius of curvature It is greater than R1 and less than the radius of curvature R3.

[0084] This allows you to adjust the curvature of region 700B. Alternatively, a predetermined size It can be curved with a radius of curvature larger than that, or the radius of curvature is smaller than a given size. It can be curved so as not to crack. Alternatively, it can be controlled by multiple curved sections with different radii of curvature. It can be formed in a region of 700B, or it can be curved in a U-shape.

[0085] Alternatively, it can be repeatedly curved in region 700B. Or, irreversible folding. It can suppress the formation of the eye, or protect the display area 231 that overlaps with area 700B. It is possible to do so. Alternatively, the intensity of region 700B can be increased. As a result, convenience This allows us to provide novel display panels with superior performance or reliability.

[0086] 《Example 2 of the display area 231 configuration.》 The display area 231 has a function to display in a direction in which component 791 is not installed. (See Figure 1(A)).

[0087] This allows the display to be shown without being obstructed by member 791. Alternatively, the second area Wrinkle formation can be suppressed in region 700B. As a result, convenience or reliability This allows us to provide a novel display panel with superior performance.

[0088] 《Example configuration of area 700B 2.》 Region 700B can be curved with a radius of curvature greater than 2 mm (see Figure 1(B)). .

[0089] This allows the display panel to be repeatedly bent without causing any malfunctions. This allows for a reduction in thickness in a curved state. For example, a radius of curvature of 5 mm or more, preferably 2 m. It can be curved with a radius of curvature of m or more, more preferably greater than 2 mm. Specifically, It can be bent repeatedly more than 50,000 times. As a result, it offers superior convenience or reliability. This allows us to provide a new display panel.

[0090] 《Example of configuration for area 700B, part 3.》 Region 700B is thinner than the thickness T21 of member 791, which is the thickness T22 plus 100 μm (Figure) See 3(A). Note that region 700B has a thickness of 80 μm added to the thickness T22 of member 791. It is preferable that the thickness be thinner than that, and even more preferable that it be thinner than the thickness T22 plus 50 μm.

[0091] This allows for a thinner display panel. As a result, convenience or reliability This allows us to provide a novel display panel with superior performance.

[0092] 《Example of the configuration of component 791, Part 2.》 Member 791 has a cross-sectional shape that becomes thinner towards the end (Figure 3(A) and See Figure 3(B).

[0093] This allows the rigidity of member 791 to be gradually reduced towards the ends. This involves curving region 700B such that the radius of curvature gradually decreases towards the ends. Yes, it is possible. As a result, it is possible to provide a new display panel that is superior in terms of convenience or reliability. ru.

[0094] 《Example of component 791 configuration 3.》 Component 791 has a strip-like shape that crosses the display area 231 (Figures 2(A) and 2(B) )reference).

[0095] This allows the display area to be folded in half along the first component (see Figure 2(C)). Alternatively, part of the display area can be aligned with another part. Or, the display panel The external dimensions can be reduced. As a result, a new display panel with superior convenience or reliability can be created. We can provide [something].

[0096] <Example of display panel configuration 2.> Furthermore, the display panel 700 described in this embodiment includes a sealing material 705, a base material 510, and a base material It has 770 and region 700C (see Figures 4(A) and 4(B)). 791 comprises elastic bodies 791A, 791B, and 791C. 791C has an end portion that is partially covered by elastic body 791B, and elastic body 791C is elastic body 791 It has a greater modulus of elasticity than B. Or, elastic material 791C has a smaller fracture rate than elastic material 791B. It has elongation properties. For example, a material that can be used for elastic body 791A can be used for elastic body 791B It can be used for this purpose.

[0097] 《Example of the composition of sealing material 705》 The sealing material 705 is sandwiched between the first base material 510 and the second base material 770.

[0098] [Examples of the composition of base material 510 and base material 770] The base material 770 has an area that overlaps with the base material 510.

[0099] Region 700A includes a portion of the overlapping region mentioned above, and region 700B includes the other portion of the overlapping region mentioned above. Includes some parts.

[0100] Base materials 510 and 770 are flexible.

[0101] For example, an organic material such as resin, resin film, or plastic is used as the base material 510 or base material 7 It can be used in 70. Specifically, polyester, polyolefin, polyamide, Using resin films or resin sheets such as polyimide, polycarbonate, or acrylic resin. This can be done. This can reduce the weight. Or, for example, by dropping This can reduce the frequency of damage and other issues.

[0102] For example, a film of metal, thin glass, or inorganic material is laminated onto a resin film, etc. A composite material can be used as the base material 510 or base material 770. For example, a fibrous or This involves using a composite material in which particulate metal, glass, or inorganic materials are dispersed in a resin film. This can be done. For example, by dispersing fibrous or particulate resin or organic material, etc., in an inorganic material. Composite materials can be used.

[0103] Furthermore, a single-layer material or a material consisting of multiple layers can be used as the base material 510 or base material 770. It is possible. For example, a substrate and an insulating film that prevents the diffusion of impurities contained in the substrate are laminated together. Materials can be used. Specifically, glass and the diffusion of impurities contained in glass One or the following are selected from the silicon oxide layer, silicon nitride layer, or silicon oxidoxide-nitride layer to prevent the formation of a silicon oxide layer or A material with multiple layers of films can be used. Alternatively, a resin and impurities that permeate the resin can be used. A silicon oxide film, silicon nitride film, or silicon oxidnitride film, etc., is laminated to prevent diffusion. Materials can be used.

[0104] Specifically, polyester, polyolefin, polyamide (nylon, aramid, etc.), Liimide, polycarbonate, polyurethane, acrylic resin, epoxy resin or silicone A material containing a resin having siloxane bonds, such as corn, is used as the base material 510 or base material 770. This can be done. For example, resin films, resin plates, or laminated materials containing these resins. It can be used.

[0105] Specifically, polyethylene terephthalate (PET), polyethylene naphthalate (PE N), polyethersulfone (PES), cycloolefin polymer (COP) or Using cycloolefin copolymers (COC) or the like in base material 510 or base material 770 can.

[0106] Furthermore, paper or wood can be used as the base material 510 or base material 770.

[0107] For example, a flexible material can be used for the base material 510 or the base material 770.

[0108] Furthermore, a method of directly forming transistors or capacitive elements on a substrate can be used. Alternatively, a process substrate that is resistant to the heat applied during the manufacturing process may be used to place transistors or capacitive elements. Sub-units are formed, and the formed transistor or capacitive element is placed on, for example, a substrate 510 or A method of transferring to the base material 770 can be used. This allows for, for example, a flexible base Transistors or capacitive elements can be formed on the board.

[0109] 《Area 700C》 Region 700C comprises the overlapping region, the end of base material 510, base material 770, and member 792. Includes (see Figure 4(C)).

[0110] 《Component 792》 The component 792 covers the end of the base material 510, and the component 792 has lower moisture permeability than the sealing material 705. ru.

[0111] For example, a part of member 791 can be used for member 792. Specifically, elastic body 79 1A or the elastic body 791B can be used for member 792.

[0112] Alternatively, a film or laminated film can be used for member 792. Specifically, a film with a moisture permeability of 10 -5 g / (m 2 (day) or less, preferably 10 -6 g / (m 2 ·day) The following materials It can be used for member 792. For example, a material containing an inorganic film or an organic film can be used for member 792. It can be used for: metal films, films containing metal and oxygen, and metal and nitrogen. A membrane containing a crosslinked polymer, a membrane containing a crosslinked polymer, etc., can be used in component 792.

[0113] Alternatively, a material having an elastic modulus equal to or greater than that of elastic material 791A can be used for member 792. Alternatively, a material having an elastic modulus of 791B or higher can be used for member 792. A material having a fracture elongation ratio less than or equal to that of the elastic material 791A can be used for member 792. In this case, a material having a fracture elongation ratio less than or equal to that of the elastic body 791B can be used for member 792. Alternatively, a material having rigidity equal to or greater than that of member 791 can be used for member 792.

[0114] This allows the functional layer 520 between the first substrate 510 and the second substrate 770 to be exposed to the outside. This can suppress the diffusion of impurities to the display element 550(i,j). Alternatively, the first The edges of the base material 510 and the second base material 770 can be protected. As a result, convenience is improved. Alternatively, it is possible to provide a new display panel with superior reliability.

[0115] This embodiment can be appropriately combined with other embodiments shown herein. .

[0116] (Embodiment 2) In this embodiment, the configuration of a display panel according to one aspect of the present invention will be described with reference to Figures 5 to 7. I'll explain while doing so.

[0117] Figure 5 is a diagram illustrating the configuration of a display panel according to one embodiment of the present invention. Figure 5(A) is a display panel. This is a top view, and Figures 5(B) and 5(C) show one of the pixels of the display panel shown in Figure 5(A). This is a top view illustrating the section.

[0118] Figure 6(A) shows the cutting lines X1-X2, X3-X4, and X9-X10 of Figure 5(A). This is a cross-sectional view. Figure 6(B) illustrates the configuration of the pixel circuitry in the display panel. This is a circuit diagram.

[0119] Figure 7(A) is a diagram illustrating the pixel configuration of a display panel according to one embodiment of the present invention. Figure 7(B ) is a cross-sectional view illustrating a portion of the pixels shown in Figure 7(A).

[0120] <Example of display panel configuration 3.> The display panel 700 described in this embodiment has pixels 702(i,j) (Figure 5(A )reference).

[0121] 《Example configuration of pixel 702(i,j) 1.》 Pixel 702(i,j) includes a functional layer 520 and a display element 550(i,j) (Figure 6). (See (A)).

[0122] 《Example Configuration of Functional Layer 520 1.》 The functional layer 520 includes a pixel circuit 530(i,j).

[0123] 《Example Configuration of Pixel Circuit 530(i,j) 1.》 The pixel circuit 530(i,j) is electrically connected to the display element 550(i,j) (Figure 6(A) (See Figure 6(B)).

[0124] For example, the pixel circuit 530(i,j) has a display element 550(i, It is electrically connected to j) (see Figure 7(A)).

[0125] For example, switches, transistors, diodes, resistors, inductors, or capacitive elements. This can be used in the pixel circuit 530(i,j).

[0126] The pixel circuit 530(i,j) consists of switch SW2, transistor M and capacitive element C21. include.

[0127] For example, a transistor can be used as switch SW2 (Figure 6(B), Figure 7(A)). See also Figure 7(B).

[0128] 《Example configuration of display element 550(i,j) 1.》 The display element 550(i,j) has the function of emitting light.

[0129] The display element 550(i,j) includes a layer 553(j) containing a light-emitting material (Figure 7(A)). reference).

[0130] For example, a display element equipped with the function of emitting light can be used as the display element 550(i,j). Yes, it is possible. Specifically, organic electroluminescent elements, inorganic electroluminescent elements. Display elements, light-emitting diodes, or QDLEDs (Quatum Dot LEDs), etc. It can be used for element 550(i,j).

[0131] 《Example 1 of the composition of layer 553(j) containing luminescent material.》 For example, a long, strip-shaped laminated material along the signal line S2(j) includes a luminescent material. It can be used in layer 553(j).

[0132] Specifically, a layer 553(j) containing a luminescent material, and a layer 553(j+1) containing a luminescent material. ) and layer 553(j+2) containing luminescent material, material that emits light of different hues from each other This allows for the use of, for example, the light emitted by the display element 550(i,j). The hue can be made different for each row.

[0133] For example, a material that emits blue light, a material that emits green light, and a material that emits red light, It can be used with materials that emit light of different hues.

[0134] 《Example 2 of the composition of layer 553(j) containing luminescent material.》 For example, a laminated material stacked to emit white light, with a layer 553 containing a light-emitting material. (j) can be used.

[0135] Specifically, materials that emit light of different hues are placed in a layer 553(j) containing a luminescent material. It can be used for this purpose.

[0136] For example, a layer containing a luminescent material including a fluorescent material that emits blue light, and green and red A laminated material consisting of layers containing materials other than light-emitting fluorescent materials, and a layer containing a light-emitting material. It can be used in 553(j). Alternatively, a luminescent material containing a fluorescent material that emits blue light. A laminate is formed by stacking a layer containing the material and a layer containing a material other than a fluorescent material that emits yellow light. The material can be used in layer 553(j) which contains a luminescent material.

[0137] For example, the light-emitting unit can be used in layer 553(j) containing a light-emitting material. The unit consists of one region where electrons injected from one side recombine with holes injected from the other side. It is equipped with a light-emitting unit, and the light-emitting material contains a light-emitting material that recombines electrons and holes. The energy generated by the combination is released as light.

[0138] For example, multiple light-emitting units and an intermediate layer are used in layer 553(j) which contains a light-emitting material. This is possible. The intermediate layer comprises a region sandwiched between the two light-emitting units. The intermediate layer is electric It has a charge generation region, and the intermediate layer supplies holes to the light-emitting unit located on the cathode side, and on the anode side It has the function of supplying electrons to the positioned light-emitting units. Also, multiple light-emitting units and A configuration that includes an intermediate layer is sometimes called a tandem-type light-emitting element.

[0139] For example, a light-emitting unit containing a material that emits light of one hue and a material that emits light of another hue The light-emitting unit can be used in layer 553(j) which contains a light-emitting material.

[0140] For example, high molecular weight compounds (oligomers, dendrimers, polymers, etc.), medium molecular weight compounds (low molecular weight compounds) Compounds in the intermediate region between polymers and high molecular weights (molecular weight between 400 and 4000), etc., are used to create luminescent materials. It can be used in the containing layer 553(j).

[0141] 《Electrode 551(i,j), electrode 552》 Electrode 551(i,j) is located at aperture 591A(i,j), and pixel circuit 530(i,j ) is electrically connected to (see Figure 7(A)).

[0142] For example, a material that can be used for wiring, etc., can be used for electrode 551(i,j) or electrode 552. It is possible to do so. Specifically, a material that is transparent to visible light is used as electrode 551(i, j) or electrode 552 can be used.

[0143] For example, conductive oxides or conductive oxides containing indium, indium oxide, indium Using tin oxide, indium zinc oxide, zinc oxide, gallium-added zinc oxide, etc. This is possible. Alternatively, a thin metal film that allows light to pass through can be used. A material that is transparent to visible light can be used.

[0144] For example, a metal film that transmits some of the light and reflects other parts of the light is used as the electrode 551(i,j) This can be used for electrode 552. This allows for, for example, electrodes 551(i,j) and The distance between electrodes 552 can be adjusted. Alternatively, the micro-resonator structure can be displayed using element 55 It can be set at 0(i,j). Alternatively, light of a predetermined wavelength can be extracted more efficiently than other light. It is possible to emit light. Or, it is possible to extract light with a narrow spectral width at half maximum. It can extract light of vivid colors.

[0145] For example, a film that efficiently reflects light can be used for electrode 551(i,j) or electrode 552. This can be done. Specifically, materials containing silver and palladium, etc. or materials containing silver and copper, etc. The material can be used in metal films.

[0146] 《Example configuration of pixel circuit 530(i,j) 2.》 The pixel circuit 530(i,j) consists of switch SW2, transistor M and capacitive element C21. Includes. For example, a transistor can be used as switch SW2.

[0147] 《Example Configuration of Switch SW2 1.》 The transistor used in switch SW2 includes a semiconductor (see Figure 7(B)).

[0148] The transistor consists of semiconductor film 508, conductive film 504, conductive film 512A and conductive film 512B It is equipped with (see Figure 7(B)).

[0149] The semiconductor film 508 has a region 508A that is electrically connected to the conductive film 512A, and the conductive film 512B and includes a region 508B that is electrically connected. The semiconductor film 508 includes a region 508C between the regions 508A and region 508B.

[0150] The conductive film 504 includes a region that overlaps with the region 508C, and the conductive film 504 has the function of a gate electrode.

[0151] The insulating film 506 includes a region sandwiched between the semiconductor film 508 and the conductive film 504. The insulating film 506 has the function of a gate insulating film.

[0152] The conductive film 512A has one of the functions of a source electrode or a drain electrode, and the conductive film 51 2B has the other of the functions of a source electrode or a drain electrode.

[0153] 《Configuration Example 1 of Transistor M.》 For example, a semiconductor film that can be formed in the same process can be used for the transistor of the switch SW2 and the transistor M. Also, the same configuration can be used for the transistor of the switch SW2 and the transistor M.

[0154] Also, the conductive film 524 can be used for the transistor. The conductive film 524 includes a region that sandwiches the semiconductor film 508 between it and the conductive film 50 4. The conductive film 524 has the function of a second gate electrode. The conductive film 524 can be electrically connected to, for example, the conductive film 504.

[0155] Note that, for example, a semiconductor film that can be formed in the same process can be used for the transistors of the drive circuit and the pixel circuit.

[0156] For example, a bottom gate type transistor or a top gate type transistor, etc., can be used for the pixel. ​​​It can be used in circuit 530(i,j). Alternatively, it can be used in the transistor of the drive circuit. It is possible.

[0157] 《Example 1 of the configuration of semiconductor film 508.》 For example, a semiconductor containing elements of Group 14 can be used in the semiconductor film 508. Specifically, A semiconductor containing silicon can be used for the semiconductor film 508.

[0158] [Hydrogenated amorphous silicon] For example, hydrogenated amorphous silicon can be used as the semiconductor film 508. Or, Microcrystalline silicon and the like can be used in the semiconductor film 508. This allows for, for example, poly This provides a display panel with less display unevenness than display panels that use silicon as the semiconductor film 508. This is possible. Alternatively, the display panel can be easily enlarged.

[0159] [Polysilicon] For example, polysilicon can be used in the semiconductor film 508. This allows, for example, water Compared to transistors that use amorphous silicon as the semiconductor film 508, the transistor The field-effect mobility can be increased. Alternatively, for example, hydrogenated amorphous silicon. This allows for improved driving capability compared to transistors using semiconductor film 508. Alternatively, For example, a transistor using hydrogenated amorphous silicon as the semiconductor film 508 has a pixel This can improve the aperture ratio.

[0160] Alternatively, for example, a transistor that uses hydrogenated amorphous silicon as the semiconductor film 508. This can improve the reliability of transistors.

[0161] Alternatively, the temperature required for the fabrication of the transistor can be, for example, the temperature of a transistor using single-crystal silicon. It can be made lower than the standard.

[0162] Alternatively, the semiconductor film used in the transistors of the drive circuit can be used in the transistors of the pixel circuit. It can be formed using the same process as the semiconductor film, or the same process as the substrate on which the pixel circuit is formed. A drive circuit can be formed on the substrate. Alternatively, the number of components constituting the electronic device can be reduced. It is possible.

[0163] [Single-crystal silicon] For example, single-crystal silicon can be used as the semiconductor film 508. This allows, for example, This display panel uses hydrogenated amorphous silicon as the semiconductor film 508, resulting in higher resolution. It is possible to do this. Or, for example, a display panel using polysilicon as the semiconductor film 508. This allows for the provision of a display panel with less display unevenness. Alternatively, for example, smart graphics A head-mounted display or similar device can be provided.

[0164] 《Example 2 of the configuration of semiconductor film 508.》 For example, metal oxides can be used in the semiconductor film 508. This allows for amorphous Compared to a pixel circuit using a transistor with silicon as the semiconductor film 508, the pixel rotation This allows the path to hold the image signal for a longer period of time. Specifically, While suppressing the generation of noise, the selected signal is less than 30Hz, preferably less than 1Hz, more preferably Alternatively, it can be supplied at a frequency of less than once per minute. As a result, the user of the information processing device... It can reduce the fatigue that accumulates in the body. It can also reduce the power consumption associated with operation. Cut.

[0165] For example, a transistor using an oxide semiconductor can be utilized. Specifically, an oxide semiconductor containing indium or an oxide semiconductor containing indium, gallium, and zinc can be used for the semiconductor film 508.

[0166] For example, a transistor with a leakage current in the off state smaller than that of a transistor using amorphous silicon for the semiconductor film can be used. Specifically, a transistor using an oxide semiconductor for the semiconductor film 508 can be used.

[0167] For example, a 25-nm-thick film containing indium, gallium, and zinc can be used for the semiconductor film 508.

[0168] A conductive film formed by laminating a 10-nm-thick film containing tantalum and nitrogen and a 300-nm-thick film containing copper can be used for the conductive film 504. Note that the copper-containing film has a region where the tantalum- and nitrogen-containing film is sandwiched between the copper-containing film and the insulating film 506.

[0169] For example, a laminated film formed by laminating a 400-nm-thick film containing silicon and nitrogen and a 200-nm-thick film containing silicon, oxygen, and nitrogen can be used for the insulating film 506. Note that the silicon- and nitrogen-containing film has a region where the silicon-, oxygen-, and nitrogen-containing film is sandwiched between the silicon- and nitrogen-containing film and the semiconductor film 508.

[0170] For example, a conductive film formed by laminating a 50-nm-thick film containing tungsten, a 400-nm-thick film containing aluminum, and a 100-nm-thick film containing titanium in this order can be used for the conductive film 512 A or the conductive film 512B. Note that the tungsten-containing film is in contact with the semiconductor ​​​​​​​It has a region that is in contact with the film 508.

[0171] By the way, for example, a bottom-gate type transistor that uses amorphous silicon as a semiconductor The manufacturing line produces bottom-gate transistors that use oxide semiconductors as semiconductors. It can be easily modified for use in production lines. Also, for example, a top-gate type semiconductor using polysilicon. The transistor manufacturing line uses oxide semiconductors for top-gate type transistors. It can be easily converted into a Zista production line. All modifications effectively utilize the existing production line. It can be used.

[0172] This can suppress flickering, or reduce power consumption. It can also smoothly display fast-moving videos. Or, it can capture images with rich gradations. It can display truth values, etc. As a result, a new display panel with superior convenience or reliability. We can provide this.

[0173] 《Example 3 of the configuration of semiconductor film 508.》 For example, compound semiconductors can be used as semiconductors in transistors. Specifically, A semiconductor containing um arsenide can be used.

[0174] For example, organic semiconductors can be used as semiconductors in transistors. Specifically, polya Organic semiconductors containing cereals or graphene can be used in semiconductor films.

[0175] 《Example configuration of pixel 702(i,j) 2.》 The display area 231 comprises multiple pixels. For example, it can display colors with different hues. Pixels having these properties can be used in the display area 231. Alternatively, using the plurality of pixels , displaying colors of hues that cannot be displayed by individual pixels using additive or subtractive color mixing. It is possible.

[0176] Furthermore, when using multiple pixels capable of displaying colors with different hues for color mixing, Each pixel can be referred to as a subpixel. Furthermore, multiple subpixels can be grouped together. This can be rephrased as pixels.

[0177] For example, pixel 702(i,j) can be rephrased as a subpixel, and pixel 702(i,j) , pixels 702(i,j+1) and 702(i,j+2) are grouped together to form pixel 703 This can be rephrased as (i,k) (see Figure 5(C)).

[0178] Furthermore, pixel 702(i,j) can be rephrased as a sub-pixel, and pixel 702(i,j), Pixel 702(i,j+1), Pixel 702(i+1,j) and Pixel 702(i+1,j+ 1) can be considered as a pair and referred to as pixel 703(i,k) (see Figure 5(E)). .

[0179] Specifically, subpixels that display blue, subpixels that display green, and subpixels that display red These can be used as a pair for pixel 703(i,k). Additionally, a sub-display for cyan can be used. A pixel, a sub-pixel that displays magenta, and a sub-pixel that displays yellow are grouped together as a pixel 7 It can be used with 03(i,k).

[0180] Furthermore, for example, sub-pixels that display white or other colors can be used in addition to the above set of pixels. ru.

[0181] 《Example Configuration of Functional Layer 520, Part 2.》 The functional layer 520 comprises a pixel circuit 530(i,j) and an insulating film 516. For example, the bottom surface An insulating film having an upper surface facing a lower surface can be used as the insulating film 516.

[0182] Specifically, it comprises a lower surface in contact with the semiconductor film 508 and an upper surface in contact with the semiconductor film 508(2). The insulating film can be used as insulating film 516 (see Figures 8(B) and 8(C)). .

[0183] For example, a multilayer film can be used as an insulating film 516. Specifically, on a semiconductor film 508 A portion of the insulating film 516 is formed, and the other portion of the insulating film 516 is formed on the said portion, and the other A semiconductor film 508(2) can be formed on this portion.

[0184] 《Example 3 of the pixel circuit 530(i,j) configuration.》 The pixel circuit 530(i,j) consists of switch SW2, transistor M and capacitive element C21. include.

[0185] For example, a semiconductor formed in a process separate from the process of forming the semiconductor film used in transistor M A transistor with a membrane can be used as switch SW2 (Figure 8(A), Figure 8( See B) and Figure 8(C). Alternatively, a different composition from that of the semiconductor film used in transistor M. A transistor with a semiconductor film of a certain composition can be used as the switch SW2.

[0186] Specifically, a transistor equipped with a semiconductor film 508 is used as the switch SW2, and the semiconductor film 5 A transistor equipped with 08(2) can be used as transistor M.

[0187] This allows, for example, the current of transistor M to be greater than that of the transistor used in switch SW2. The driving capability can be increased. Alternatively, the transistor used in switch SW2 The gate electrode or drain electrode can be used as the gate electrode of transistor M. This refers to the semiconductor film 508 of the transistor used in switch SW2 and the semiconductor film of transistor M. The distance of 508(2) can be reduced. Alternatively, the transient used in switch SW2 The area occupied by the star and transistor M can be reduced. Alternatively, the pixel opening The resolution can be increased. Or, the pixels can be made finer. Or, high resolution It can provide a display panel, or increase the flexibility of the pixel circuit layout. This allows for the placement of more transistors in tiny pixels.

[0188] Although not shown in the diagram, other configurations include, for example, a transistor equipped with a semiconductor film 508(2). A transistor is used as switch SW2, and a transistor equipped with semiconductor film 508 is called transistor M. It may be used for this purpose.

[0189] <Example of display panel configuration 4.> The display panel 700 also has a display area 231 (see Figure 5(A)).

[0190] The display area 231 includes scan lines G2(i) and signal lines S2(j).

[0191] 《Example 3 of the display area 231 configuration.》 Display area 231 includes pixels 702(i,j), 702(i,j+1), and 702 It has (i, j+2) (see Figure 5(C)).

[0192] Pixel 702(i,j) has a chromaticity x greater than 0.680 in CIE1931 chromaticity coordinates. It emits light with a chromaticity y of 0.260 or more and a chromaticity y of 0.320 or less.

[0193] Pixel 702(i,j+1) has a chromaticity x of 0.130 or greater in CIE1931 chromaticity coordinates. It emits light of colors with a chromaticity y of 0.250 or less and a chromaticity y greater than 0.710 and less than or equal to 0.810.

[0194] Pixel 702(i,j+2) has a chromaticity x of 0.120 or greater in CIE1931 chromaticity coordinates. It emits light of a color with a chromaticity y of 0.020 or greater and a chromaticity y of less than 0.060, with a value of 0.170 or less.

[0195] Also, pixels 702(i,j), 702(i,j+1), and 702(i,j+2 ) is defined as having an area ratio of 80% or less to the BT.2020 color gamut in the CIE chromaticity diagram (x,y). The above, or the coverage rate of the color gamut is 75% or more. Preferably, the surface Prepare so that the product ratio is 90% or higher, or the coverage rate is 85% or higher.

[0196] <Example of display panel configuration 5.> Furthermore, the display panel 700 comprises a substrate 510, a substrate 770, and an insulating film 501C (Figure 7(A)).

[0197] The insulating film 501C includes a region sandwiched between the substrate 510 and the substrate 770, and the functional layer 52 0 comprises a region sandwiched between the insulating film 501C and the substrate 770.

[0198] 《Example 3 of the configuration of functional layer 520.》 The functional layer 520 consists of insulating film 521, insulating film 518, insulating film 516, insulating film 506 and insulating It is equipped with a membrane 501C, etc.

[0199] [Insulating film 521] The insulating film 521 is sandwiched between the pixel circuit 530(i,j) and the display element 550(i,j). It has a region that can be used (see Figure 7(A)).

[0200] For example, insulating inorganic materials, insulating organic materials, or insulating materials including inorganic and organic materials The composite material can be used as the insulating film 521.

[0201] Specifically, inorganic oxide films, inorganic nitride films, or inorganic oxidnitride films, etc., or selected from these. A laminated material formed by stacking multiple layers can be used as the insulating film 521.

[0202] For example, silicon oxide film, silicon nitride film, silicon oxide nitride film, aluminum oxide film, etc. Alternatively, a film containing a laminated material formed by stacking multiple selected from these can be used as the insulating film 521. This can be done. Furthermore, silicon nitride films are dense films and have excellent function in suppressing the diffusion of impurities. It can be done.

[0203] For example, polyester, polyolefin, polyamide, polyimide, polycarbonate, Laminate of polysiloxane, acrylic resin, or multiple resins selected from these. Materials or composite materials can be used in the insulating film 521. In addition, photosensitive materials It may be formed using a material. As a result, the insulating film 521 overlaps with the insulating film 521. It can flatten steps and unevenness caused by various structures.

[0204] Furthermore, polyimide possesses properties such as thermal stability, insulation, toughness, low dielectric constant, low coefficient of thermal expansion, and chemical resistance. It possesses superior properties compared to other organic materials. This makes polyimide particularly superior. It can be suitably used as an insulating film 521, etc.

[0205] For example, a film formed using a photosensitive material can be used as the insulating film 521. Specifically, a film formed using photosensitive polyimide or photosensitive acrylic resin, etc. This can be used as the insulating film 521.

[0206] For example, a light-transmitting material can be used for the insulating film 521. Specifically, nitrided cyanoacrylate Recon can be used as the insulating film 521.

[0207] [Insulation film 518] The insulating film 518 comprises a region sandwiched between the pixel circuit 530(i,j) and the insulating film 521. (See Figure 7(B)). Furthermore, the laminated film can be used as the insulating film 518.

[0208] For example, a material that can be used for insulating film 521 can be used for insulating film 518.

[0209] For example, it has a function to suppress the diffusion of oxygen, hydrogen, water, alkali metals, alkaline earth metals, etc. The material can be used for the insulating film 518. Specifically, the nitride insulating film can be used for the insulating film 518. It can be used in 8. For example, silicon nitride, silicon oxide nitride, aluminum nitride. Aluminum nitride oxide and the like can be used in the insulating film 518. This allows transient This can suppress the diffusion of impurities into the semiconductor film.

[0210] [Insulating film 516] The insulating film 516 comprises a region sandwiched between the pixel circuit 530(i,j) and the insulating film 518. (See Figure 7(B)). Furthermore, the laminated film can be used as the insulating film 516. Specifically This involves using an insulating film in which insulating film 516A and insulating film 516B are laminated as insulating film 516. It is possible.

[0211] For example, a material that can be used for insulating film 521 can be used for insulating film 516. Specifically, a film manufactured using a different method than that used for the insulating film 518 can be used for the insulating film 516. .

[0212] [Insulating film 506, insulating film 501D] The insulating film 506 includes a region sandwiched between the semiconductor film 508 and the conductive film 504E (Figure See 7(B). Also, the insulating film 501D is sandwiched between the semiconductor film 508 and the conductive film 524. It has a range that can be reached.

[0213] For example, the material that can be used for insulating film 521 can be used for insulating film 506 or insulating film 501D. It can be used. Specifically, silicon oxide film, silicon oxide nitride film, silicon nitride oxide film Cone film, silicon nitride film, aluminum oxide film, hafnium oxide film, yttrium oxide film Zirconium oxide film, gallium oxide film, tantalum oxide film, magnesium oxide film, galvanic oxide A film containing a tan film, a cerium oxide film, or a neodymium oxide film may be used as the insulating film 506. can.

[0214] [Insulating film 501C] The insulating film 501C comprises a region sandwiched between the pixel circuit 530(i,j) and the substrate 510. (See Figure 7(A)).

[0215] For example, a material that can be used for insulating film 521 can be used for insulating film 501C. Specifically, materials containing silicon and oxygen can be used for the insulating film 501C. This makes it possible to suppress the diffusion of impurities into the pixel circuit or display elements.

[0216] [Insulating film 528] The insulating film 528 has a region sandwiched between the insulating film 521 and the substrate 770, and the display element 5 An opening is provided in the region overlapping with 50(i,j) (see Figure 7(A)). Electrode 551(i,j The insulating film 528 formed along the periphery of electrode 551(i,j) and electrode 552 Prevent short circuits.

[0217] For example, a material that can be used for insulating film 521 can be used for insulating film 528. Specifically, a silicon oxide film, a film containing acrylic resin, or a film containing polyimide is used as an insulating film. It can be used in 528.

[0218] 《Sealing material 705》 The sealing material 705 has a region sandwiched between the functional layer 520 and the substrate 770, and the functional layer 52 It has the function of bonding 0 and the base material 770 together.

[0219] Inorganic materials, organic materials, or composite materials of inorganic and organic materials are used in the sealing material 705. It is possible.

[0220] For example, using an organic material such as a heat-meltable resin or a curable resin in the sealing material 705. It is possible.

[0221] For example, reaction-curing adhesives, photocuring adhesives, thermosetting adhesives, and / or anaerobic adhesives. Organic materials such as fertilizers can be used in the sealing material 705.

[0222] Specifically, epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimi Resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyrate) Adhesives containing resins such as EVA (ethylene vinyl acetate) resin are used in sealing material 705. It is possible to be there.

[0223] Functional Layer 720 The functional layer 720 comprises a colored film CF1, an insulating film 771, and a light-shielding film BM.

[0224] The colored film CF1 comprises a region sandwiched between the substrate 770 and the display element 550(i,j). ru.

[0225] The light-shielding film BM has an aperture in the region that overlaps with pixel 702(i,j).

[0226] 《Functional membrane 770P, etc.》 The functional film 770P has an area that overlaps with the display element 550(i,j).

[0227] For example, anti-reflective films, polarizing films, phase difference films, light-diffusing films, or light-gathering films. Films and the like can be used as the functional film 770P.

[0228] Specifically, a circularly polarizing film can be used in the functional film 770P.

[0229] Additionally, it features an antistatic coating to suppress dust adhesion, a water-repellent coating to make it harder for dirt to adhere, and an anti-reflective coating. Film (anti-reflection film), matte finish film (anti-glare film), scratches from use A hard coat film or similar material that suppresses the occurrence of defects can be used on the functional film 770P.

[0230] This embodiment can be appropriately combined with other embodiments shown herein. .

[0231] (Embodiment 3) In this embodiment, it is used in the semiconductor film of the transistor disclosed in one aspect of the present invention. This section explains the types of metal oxides that can be produced. Note that metal oxides are used in the semiconductor films of transistors. In such cases, the term "metal oxide" may be replaced with "oxide semiconductor."

[0232] Oxide semiconductors can be divided into single-crystal oxide semiconductors and non-single-crystal oxide semiconductors. As for crystalline oxide semiconductors, CAAC-OS (c-axis-aligned crystals Polycrystalline oxide semiconductor, n c-OS(nanocrystalline oxide semiconductor ), pseudo-amorphous oxide semiconductor (a-like OS: amorphous-like o Examples include xide semiconductors and amorphous oxide semiconductors.

[0233] Furthermore, as one type of non-single-crystal oxide semiconductor, there is semi-crystalline oxide semiconductor (Semi-crystal Oxide semiconductors (also known as talline oxide semiconductors) Examples include: Semicrystalline oxide semiconductors are single-crystal oxide semiconductors and amorphous oxide semiconductors. It has an intermediate structure. Semicrystalline oxide semiconductors have a more stable structure compared to amorphous oxide semiconductors. It is fixed. For example, as a semicrystalline oxide semiconductor, it has a CAAC structure and CAC( There are oxide semiconductors with a Cloud-Aligned Composite (C) configuration. Details about AC will be explained below.

[0234] Furthermore, the semiconductor film of the transistor disclosed in one aspect of the present invention includes CAC-OS(Clo ud-Aligned Composite oxide semiconductor ) may also be used.

[0235] Furthermore, the semiconductor film of the transistor disclosed in one aspect of the present invention is the non-single-crystal oxide described above. Semiconductors or CAC-OS can be suitably used. Also, non-single-crystal oxide semiconductors and In this regard, nc-OS or CAAC-OS can be suitably used.

[0236] In one aspect of the present invention, it is preferable to use CAC-OS as the semiconductor film of the transistor. It seems that using CAC-OS gives transistors high electrical characteristics or high reliability. It can be granted.

[0237] The following provides details about CAC-OS.

[0238] CAC-OS or CAC-metal oxide has conductive properties in some parts of the material. In addition, a portion of the material has insulating properties, while the material as a whole has semiconductor properties. Furthermore, CAC-OS or CAC-metal oxide is used in the transistor channel. When used in a formation region, its conductive function is to allow electrons (or holes) that act as carriers to flow. The insulating function is the function of preventing the flow of electrons, which act as carriers. By having the insulating function and the switching function work complementaryly, the switching function (O This function (to enable or disable the on / off state) is imparted to CAC-OS or CAC-metal oxide. This is possible. In CAC-OS or CAC-metal oxide, each By separating these functions, it is possible to maximize the performance of both.

[0239] Furthermore, CAC-OS or CAC-metal oxide has conductive and insulating properties. It has regions. The conductive region has the conductive function described above, and the insulating region has the insulating function described above. It has the function of [this]. Furthermore, within the material, the conductive region and the insulating region are at the nanoparticle level. In some cases, they are separated by a rib. Also, conductive regions and insulating regions are located within the material. They may be unevenly distributed. Furthermore, the conductive regions appear blurred around the edges and connected in a cloud-like pattern. There are cases where this occurs.

[0240] Furthermore, in CAC-OS or CAC-metal oxide, the conductive region and the insulating region The marginal region is defined as being between 0.5 nm and 10 nm, preferably between 0.5 nm and 3 nm. These particles may be dispersed in the material at the following sizes.

[0241] Furthermore, CAC-OS or CAC-metal oxide has different band gaps. It is composed of the following components. For example, CAC-OS or CAC-metal oxi de consists of a component with a wide gap due to the insulating region and a component with a wide gap due to the conductive region. It consists of a component having a low gap. In this configuration, when the carrier is flowing... In components with a narrow gap, the carrier mainly flows. A component having a wide gap acts complementaryly with a component having a narrow gap. In conjunction with the components, carriers also flow to components with a wide gap. Therefore, the above C AC-OS or CAC-metal oxide is applied to the channel formation region of the transistor. When used, a high current driving force is required in the transistor's ON state, i.e., a large ON current. Furthermore, a high field-effect mobility can be obtained.

[0242] In other words, CAC-OS or CAC-metal oxide is a matrix composite material. (matrix composite) or metal matrix composite (metal m It can also be called an atrix composite.

[0243] In the case of CAC-OS, for example, the elements constituting the metal oxide are unevenly distributed in a size of 0.5 nm or more and 10 nm or less, preferably, in a configuration of a material unevenly distributed in a size of 1 nm or more and 2 nm or less or in the vicinity thereof. In the following, in the metal oxide, one or more metal elements are unevenly distributed, and a region having the metal element is mixed in a size of 0.5 nm or more and 10 nm or less, preferably, 1 nm or more and 2n m or less or in the vicinity thereof, and this state is also referred to as a mosaic state or a patch state.

[0244] Note that the metal oxide preferably contains at least indium. Particularly, it preferably contains indium and zinc. In addition to these, one or more selected from aluminum, gallium, yttrium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium may be included.

[0245] For example, CAC-OS in In-Ga-Zn oxide (among CAC-OS, In-G a-Zn oxide may be particularly referred to as CAC-IGZO.) is indium oxide (hereinafter, InO X1 (where X1 is a real number greater than 0).), or indium zinc oxide (hereinafter, In X2 Zn Y2 O Z2 (where X2, Y2, and Z2 are real numbers greater than 0) and gallium oxide (hereinafter, GaO X3 (where X3 is a real number greater than 0). ), or gallium zinc oxide (hereinafter, Ga X4 ZnY4 O Z4 (X4, Y4, and Z4) Let be a real number greater than 0. The material separates into parts such as ), resulting in a mosaic pattern. Mosaic-like InO X1 , or In X2 Zn Y2 O Z2 However, the structure is uniformly distributed within the membrane. (Hereafter referred to as "cloud-based").

[0246] In other words, CAC-OS is GaO X3 The region in which is the main component, and In X2 Zn Y2 O Z2 , or InO X1 A composite metal oxide having a composition in which a region is the main component and a region is mixed. Yes. In this specification, for example, the atomic ratio of In to element M in the first region is The first region is greater than the atomic ratio of In to element M in the second region. Assume that the concentration of In is higher compared to the other region.

[0247] Note that IGZO is a common name and refers to a single compound composed of In, Ga, Zn, and O. There are such examples. A typical example is InGaO3(ZnO). m1 (m1 is a natural number), or In (1 +x0) Ga (1-x0) O3(ZnO) m0 It can be expressed as (-1 ≤ x0 ≤ 1, where m0 is any number). Examples include crystalline compounds.

[0248] The above crystalline compounds have a single crystal structure, a polycrystalline structure, or CAAC(c-axis al It has an igned crystal structure. Note that the CAAC structure is a structure with multiple IGZO The nanocrystals have c-axis orientation and are linked without orientation in the ab-plane, forming a crystalline structure. ru.

[0249] On the other hand, CAC-OS relates to the material composition of metal oxides. CAC-OS is In, Ga In a material composition containing Zn and O, a portion is observed to be in the form of nanoparticles with Ga as the main component. The region that is obscured and the region that is observed to be in the form of nanoparticles mainly composed of In are each mosaic-like. This refers to a configuration in which particles are randomly dispersed in a ripple-like manner. Therefore, in CAC-OS, the crystal structure This is a secondary element.

[0250] Furthermore, CAC-OS does not include a layered structure of two or more films with different compositions. For example, a structure consisting of two layers, one with In as the main component and the other with Ga as the main component, is included. do not have.

[0251] Note that GaO X3 The region in which is the main component, and In X2 Zn Y2 O Z2 , or InO X1 but In some cases, a clear boundary may not be observable between the principal component region and the surrounding area.

[0252] Note that aluminum, yttrium, copper, vanadium, and beryllium can be used instead of gallium. Boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum Lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium If one or more species selected from Cium, etc., are included, CAC-OS will be partially The region is observed to be in the form of nanoparticles mainly composed of the metal element, and a part of it is mainly composed of In. The regions observed in the nanoparticle form are randomly dispersed in a mosaic-like manner. say.

[0253] CAC-OS is formed, for example, by sputtering under conditions where the substrate is not intentionally heated. It is possible. Also, when forming CAC-OS by sputtering, the deposition gas and Then, select from inert gases (typically argon), oxygen gas, and nitrogen gas. You can use one or more of these. Also, the oxygen gas in relation to the total flow rate of the deposition gas during film formation. A lower flow rate ratio is preferable, for example, a flow rate ratio of oxygen gas of 0% or more and less than 30% is preferable. It is preferable that the value be between 0% and 10%.

[0254] CAC-OS is a type of X-ray diffraction (XRD) measurement method. When measured using the θ / 2θ scan method, which is the only Out-of-plane method, It is characterized by the absence of a clear peak. In other words, from X-ray diffraction measurements, It can be seen that no orientation is observed in the ab-plane direction or the c-axis direction of the region.

[0255] Furthermore, CAC-OS uses an electron beam with a probe diameter of 1 nm (also called a nanobeam electron beam) to illuminate the surface. In the electron diffraction pattern obtained by irradiation, there is a ring-shaped region of high brightness, and Multiple bright spots are observed in the ting region. Therefore, from the electron diffraction pattern, CAC-OS The crystal structure is non-oriented in both the planar and cross-sectional directions (nc(nano-cr)). It can be seen that it has a ystal structure.

[0256] For example, in CAC-OS in In-Ga-Zn oxide, energy-dispersive X-rays Spectroscopy (EDX: Energy Dispersive X-ray spectroscopy) GaO X3 The region in which is the main component and InX2 Zn Y2 O Z2 , or InO X1 Regions where it is the main component are unevenly distributed and mixed. It can be confirmed that it has the following structure.

[0257] CAC-OS has a different structure from IGZO compounds in which metal elements are uniformly distributed, It has different properties from ZO compounds. In other words, CAC-OS is GaO X3 These are the main components. In a certain area, X2 Zn Y2 O Z2 , or InO X1 The region in which is the main component, and It exhibits phase separation, and has a mosaic-like structure in which regions composed of each element are the main components.

[0258] Here, In X2 Zn Y2 O Z2 , or InO X1 The region in which is the main component is GaO X3 Compared to regions where these are the main components, this region has high conductivity. In other words, In X2 Zn Y 20 Z2 , or InO X1 In the region where this is the main component, the carrier flows, causing oxidation. Conductivity as a material semiconductor is exhibited. Therefore, In X2 Zn Y2 O Z2 , or InO X Regions where 1 is the main component are distributed in a cloud-like manner within the oxide semiconductor, resulting in a high field effect. Mobility (μ) can be achieved.

[0259] On the other hand, GaO X3 Regions in which these are the main components are In X2 Zn Y2 O Z2 , or InO X This region has higher insulating properties compared to the region where 1 is the main component. In other words, GaO X3 etc. The distribution of the main component region within the oxide semiconductor suppresses leakage current and improves performance. It can perform itching operations.

[0260] Therefore, when CAC-OS is used in semiconductor devices, GaO X3 Insulation caused by, In X2 Zn Y2 O Z2 , or InO X1 The conductivity resulting from this works in a complementary manner. As a result, high on-current (I on ), and high field effect mobility (μ) can be achieved. Cut.

[0261] Furthermore, semiconductor devices using CAC-OS have high reliability. Therefore, CAC-OS is... It is ideal for various semiconductor devices, including display panels.

[0262] This embodiment can be combined with other embodiments as appropriate.

[0263] (Embodiment 4) In this embodiment, the configuration of a display panel according to one aspect of the present invention is shown in Figures 5 and 9. I'll explain while doing so.

[0264] Figure 9 is a diagram illustrating the configuration of a display panel according to one embodiment of the present invention.

[0265] <Example of display panel configuration 6.> The display panel 700 described in this embodiment has a display area 231 (see Figure 9).

[0266] 《Example 5 of the display area 231 configuration.》 The display area 231 consists of a group of pixels 702(i,1) to 702(i,n) and another group Pixels 702(1,j) to 702(m,j), scan line G2(i), and signal line S2 (j) has (see Figure 9). Note that i is an integer between 1 and m, and j is between 1 and n. The following integers are given, where m and n are integers greater than or equal to 1.

[0267] Although not shown in the diagram, the display area 231 has a conductive film VCOM2 and a conductive film ANO. .

[0268] A group of pixels 702(i,1) to 702(i,n) includes pixel 702(i,j), A group of pixels 702(i,1) through 702(i,n) are in the row direction (indicated by arrow R1 in the figure). It is arranged in the direction.

[0269] Another group of pixels 702(1,j) to 702(m,j) includes pixel 702(i,j). Furthermore, the other group of pixels 702(1,j) to 702(m,j) are arranged in the column direction intersecting the row direction. It is arranged in the direction indicated by arrow C1 in the diagram.

[0270] The scan line G2(i) is a group of pixels 702(i,1) to pixels 702( It is electrically connected to i and n).

[0271] The signal line S2(j) is connected to another group of pixels 702(1,j) to 70 arranged in the column direction. It is electrically connected to 2(m,j).

[0272] This allows image information to be supplied to multiple pixels. As a result, convenience or reliability This allows us to provide a novel display panel with superior reliability.

[0273] The display area 231 has more than 600 pixels per inch.

[0274] This allows for a larger aperture ratio while maintaining pixel resolution. Alternatively, the aperture It is possible to increase the resolution of pixels while maintaining the same resolution. As a result, it is superior in terms of convenience or reliability. This allows us to provide a novel display panel.

[0275] 《Example 6 of the display area 231 configuration.》 The display area 231 has more than 7600 pixels in the row direction, and the display area 231 has more than 4300 pixels The pixels above are arranged in the column direction. For example, 7680 pixels are arranged in the row direction, and 4320 pixels are arranged. The elements are arranged in the column direction.

[0276] <Example of display panel configuration 7.> Display area 231 includes pixels 702(i,j), 702(i,j+1), and 702 It has (i, j+2) (see Figure 5(C)).

[0277] Pixel 702(i,j) has a chromaticity x greater than 0.680 in CIE1931 chromaticity coordinates. Displays colors with a chromaticity y of 0.260 or greater and a chromaticity y of 0.320 or less.

[0278] Pixel 702(i,j+1) has a chromaticity x of 0.130 or greater in CIE1931 chromaticity coordinates. Display colors with a chromaticity y value of 0.250 or less, and a chromaticity y value greater than 0.710 and less than or equal to 0.810.

[0279] Pixel 702(i,j+2) has a chromaticity x of 0.120 or greater in CIE1931 chromaticity coordinates. Display colors with a chromaticity y value of 0.020 or higher and less than 0.060, where the chromaticity is 0.170 or lower.

[0280] Also, pixels 702(i,j), 702(i,j+1), and 702(i,j+2 ) is defined as having an area ratio of 80% or less to the BT.2020 color gamut in the CIE chromaticity diagram (x,y). The above, or the coverage rate of the color gamut is 75% or more. Preferably, the surface Prepare so that the product ratio is 90% or higher, or the coverage rate is 85% or higher.

[0281] <Example of display panel configuration 8.> Furthermore, the display panel 700 described in this embodiment can be equipped with multiple drive circuits. For example, it can be equipped with a drive circuit GDA, a drive circuit GDB, or a drive circuit SD. (See Figure 9).

[0282] 《Drive circuit GDA, drive circuit GDB》 The drive circuits GDA and GDB have the function of supplying selection signals based on control information. To possess.

[0283] For example, based on control information, at a frequency of 30 Hz or higher, preferably 60 Hz or higher It has a function to supply a selection signal to one scan line. This allows for smooth display of moving images. It is possible.

[0284] For example, based on control information, less than 30Hz, preferably less than 1Hz, more preferably one It has a function to supply a selection signal to one scan line at a frequency of less than once per minute. Still images can be displayed with the filter suppressed.

[0285] When multiple drive circuits are provided, for example, the frequency at which the drive circuit GDA supplies the selection signal and the drive The frequency at which the dynamic circuit GDB supplies the selection signal can be varied. Specifically, the static Display a moving image at a higher frequency than the frequency at which a selection signal is supplied to a region where a still image is displayed. A selection signal can be supplied to other regions. This suppresses flicker in one region. It is possible to display a still image in a fixed state and smoothly display a moving image in another area.

[0286] Alternatively, a progressive scan method can be used to display the image at a frame rate of 120Hz. Yes, it is possible. Alternatively, it can be done according to the international standard Recommendation ITU-R BT.2. It can display extremely high resolution, satisfying the 020-2 requirement. It can display a wide range of values.

[0287] 《Drive Circuit SD(1)》 The drive circuit SD(1) has the function of supplying an image signal based on information V11 (see Figure 9). (see).

[0288] The drive circuit SD(1) has the function of generating an image signal and transmitting the image signal to a single display element electrically. It has the function of supplying power to the pixel circuits that are connected to it.

[0289] For example, various sequential circuits such as shift registers can be used in the drive circuit SD(1). can.

[0290] For example, an integrated circuit formed on a silicon substrate can be used as the drive circuit SD(1). ru.

[0291] For example, the COG (Chip on glass) method or COF (Chip on Fi) The lm method allows for the mounting of integrated circuits onto terminals. Specifically, an anisotropic conductive film Using this method, integrated circuits can be mounted on terminals.

[0292] This embodiment can be appropriately combined with other embodiments shown herein. .

[0293] (Embodiment 5) In this embodiment, the configuration of a display device according to one aspect of the present invention will be described with reference to Figure 10. I will reveal it.

[0294] Figure 10 is a block diagram illustrating the configuration of a display device according to one embodiment of the present invention.

[0295] <Example of display device configuration> The display device described in this embodiment includes a control unit 238 and a display panel 700 (Figure (See 10).

[0296] 《Example configuration of the control unit 238》 The control unit 238 is supplied with image information V1 and control information CI. For example, a clock signal. Alternatively, timing signals and other similar information can be used as control information (CI).

[0297] The control unit 238 generates information V11 based on image information V1, and based on control information CI The control unit 238 generates the control signal SP. The control unit 238 also supplies the information V11 and the control signal SP. For example, information V11 includes 8 bits or more, preferably 12 bits or more, for gradation.

[0298] Specifically, the control unit 238 includes the control circuit 233, the expansion circuit 234, and the image processing circuit 23 It is equipped with 5.

[0299] Control circuit 233 The control circuit 233 has the function of generating and supplying control signals SP.

[0300] The control circuit 233 has the function of supplying control signals SP. For example, a clock signal or a timer. The timing signal and other signals can be used as control signals SP. Specifically, the drive circuit GDA( 1) Use a start pulse to initiate the operation of the drive circuit SDA(1), etc., as the control signal SP. This allows for the synchronization of the operation of multiple drive circuits.

[0301] For example, a timing controller can be used in the control circuit 233.

[0302] The control circuit 233 can also be included in the display panel. For example, it can be mounted on a rigid circuit board. The control circuit 233 can be used in the display panel. Also, it can be mounted on a rigid board. The control circuit 233 is electrically connected to the drive circuit using a flexible printed circuit board. It is possible.

[0303] Specifically, drive circuit GDA(1), drive circuit GDB(1), drive circuit GDA(2) and It can be electrically connected to the drive circuit GDB(2). Also, the drive circuit SDA(1) , drive circuit SDB(1), drive circuit SDC(1), drive circuit SDA(2), drive circuit SD It can be electrically connected to B(2) and the drive circuit SDC(2).

[0304] 《Extension circuit 234》 The decompression circuit 234 has the function of decompressing the image information V1 that is supplied in a compressed state. The decompression circuit 234 includes a memory unit. The memory unit stores, for example, the decompressed image information. To possess the ability.

[0305] Image processing circuit 235 The image processing circuit 235 includes, for example, a memory area. The memory area contains, for example, image information V1 It has the function of storing the information contained within it.

[0306] The image processing circuit 235 corrects the image information V1 based on a predetermined characteristic curve, for example, to process the information. It has the function of generating V11 and the function of supplying information V11.

[0307] 《Example of display panel configuration》 The display panel 700 is supplied with information V11 or control signal SP. The drive circuit is supplied with control signal S It operates based on P, and pixel 702(i,j) is displayed based on information V11.

[0308] For example, the display panel described in Embodiments 1 to 4 can be used. ru.

[0309] For example, drive circuit GDA(1), drive circuit GDB(1), drive circuit GDA(2) and drive The dynamic circuit GDB(2) has the function of supplying a selection signal based on the control signal SP.

[0310] For example, drive circuit SDA(1), drive circuit SDB(1), drive circuit SDC(1), drive cycle The path SDA(2), drive circuit SDB(2), and drive circuit SDC(2) supply the control signal SP. It is supplied and provides information V11.

[0311] This allows image information to be displayed using a display element. As a result, convenience and This can provide a novel display device with superior reliability.

[0312] This embodiment can be appropriately combined with other embodiments shown herein. .

[0313] (Embodiment 6) In this embodiment, the configuration of an input / output device according to one aspect of the present invention will be described with reference to Figure 11. explain.

[0314] Figure 11 is a block diagram illustrating the configuration of an input / output device according to one embodiment of the present invention.

[0315] <Example of input / output device configuration> The input / output device described in this embodiment has an input unit 240 and a display unit 230 (Figure (See 11).

[0316] 《Display section 230》 For example, if the display panel 700 described in Embodiment 1 or Embodiment 2 is used in the display unit 230 It is possible to have an input / output panel with an input unit 240 and a display unit 230. It can be said that it is 700TP.

[0317] 《Example configuration of input unit 240 1.》 The input unit 240 includes a detection area 241. The input unit 240 is adjacent to the detection area 241. It has a function to detect [something].

[0318] The detection area 241 includes an area that overlaps with pixel 702(i,j).

[0319] This allows image information to be displayed using the display unit, while also allowing access to areas adjacent to the display unit that overlap with it. It can detect this. Alternatively, by using a finger or other object placed close to the display as a pointer, the position can be detected. Location information can be entered. Alternatively, location information can be associated with image information displayed on the display unit. This allows for the provision of novel input / output devices with superior convenience or reliability. It is possible.

[0320] 《Example configuration of input unit 240 2.》 The input section 240 can be equipped with an oscillator circuit OSC and a detection circuit DC (see Figure 11). .

[0321] Detection area 241 The detection region 241 comprises, for example, one or more detection elements.

[0322] The detection region 241 comprises a group of detection elements 775(g,1) to 775(g,q), It also has another group of detection elements 775(1,h) to detection elements 775(p,h). g is an integer between 1 and p, h is an integer between 1 and q, and p and q are both 1 or greater. It is an integer.

[0323] A group of detection elements 775(g,1) to detection elements 775(g,q) are detection elements 775(g It includes ,h) and is arranged in the row direction (the direction indicated by arrow R2 in the figure). The direction may be the same as or different from the direction indicated by arrow R1.

[0324] Furthermore, another group of detection elements 775(1,h) to detection elements 775(p,h) are detection elements It includes 775(g,h) and is arranged in the column direction intersecting the row direction (indicated by arrow C2 in the figure). It will be done.

[0325] 《Detection element》 The detection element has the function of detecting nearby pointers, such as fingers or stylus pens. It can be used as a pointer. For example, a piece of metal or a coil can be used in a stylus pen. It is possible to be there.

[0326] Specifically, capacitive proximity sensors, electromagnetic induction proximity sensors, and optical proximity sensors Sensors such as resistive proximity sensors can be used as detection elements.

[0327] Furthermore, multiple types of detection elements can be used in combination. For example, a detection element that detects fingers and It can be used in conjunction with a detection element that detects a stylus pen.

[0328] This allows us to determine the type of pointer. Or, the type of pointer that has been determined. Based on this, different instructions can be associated with detection information. Specifically, to the pointer If it is determined that a finger was used, the detection information can be associated with the gesture. If it is determined that a stylus pen was used as the pointer, the detection information is associated with the drawing process. It can be attached.

[0329] Specifically, a finger can be detected using a capacitive or optical proximity sensor. It can do so. Alternatively, it can detect the stylus pen using an electromagnetic induction or optical proximity sensor. It is possible to know.

[0330] This embodiment can be appropriately combined with other embodiments shown herein. .

[0331] (Embodiment 7) In this embodiment, the configuration of an information processing device according to one aspect of the present invention is shown in Figures 12 to 15. I will explain while referring to it.

[0332] Figure 12(A) is a block diagram illustrating the configuration of an information processing device according to one embodiment of the present invention. 2(B) is a projection view illustrating an example of the external appearance of an information processing device.

[0333] Figure 13 is a flowchart illustrating a program according to one embodiment of the present invention. Figure 13(A) This is a flowchart illustrating the main processing of a program according to one embodiment of the present invention, and Figure 13( B) is a flowchart explaining interrupt handling.

[0334] Figure 14 is a diagram illustrating a program according to one embodiment of the present invention. Figure 14(A) is the present invention. This is a flowchart illustrating the interrupt handling of one aspect of a program. Also, Figure 14(B) Figure 14(C) is a schematic diagram illustrating the operation of an information processing device, and Figure 14(C) is an embodiment of the present invention. This is a timing chart illustrating the operation of an information processing device.

[0335] Figure 15 is a diagram illustrating an artificial intelligence unit according to one embodiment of the present invention. Figure 15(A) is an embodiment of the present invention. This is a block diagram illustrating the artificial intelligence section of the present invention. Figure 15(B) shows a neural network according to one embodiment of the present invention. This is a block diagram illustrating a neural network. Figure 15(C) shows a neural network according to one embodiment of the present invention. This is a block diagram explaining the circuit.

[0336] <Example of information processing device configuration 1.> The information processing device 200 described in this embodiment includes an arithmetic unit 210 and an input / output device 220. , has (see Figure 12(A)). Note that the input / output device 220 is electrically connected to the arithmetic unit 210. It is connected to the information processing device 200. Furthermore, the information processing device 200 may have a housing (see Figure 12(B)). (see).

[0337] 《Example Configuration of the Calculation Unit 210 1.》 The arithmetic unit 210 is supplied with input information II or detection information DS. The arithmetic unit 210 controls It supplies information CI and image information V1.

[0338] The arithmetic unit 210 comprises an arithmetic unit 211 and a storage unit 212. The arithmetic unit 211 also includes, It includes a transmission line 214 and an input / output interface 215.

[0339] The transmission line 214 is connected to the arithmetic unit 211, the storage unit 212, and the input / output interface 215. It is electrically connected.

[0340] 《Calculation section 211》 The arithmetic unit 211 includes, for example, a function for executing a program.

[0341] 《Storage section 212》 The storage unit 212 stores, for example, programs executed by the arithmetic unit 211, initial information, configuration information, or It has a function to store images and other data.

[0342] Specifically, hard disks, flash memory, or transistors containing oxide semiconductors. Memory and other components using this technology can be used.

[0343] Input / output interface 215, transmission path 214 The input / output interface 215 is equipped with terminals or wiring to supply and receive information. It has the function of being able to electrically connect to the transmission line 214. It can be electrically connected to device 220.

[0344] The transmission line 214 is equipped with wiring and has the function of supplying and receiving information. For example, input It can be electrically connected to the output interface 215. Also, the calculation unit 211, It can be electrically connected to the memory unit 212 or the input / output interface 215.

[0345] 《Example configuration of input / output device 220》 The input / output device 220 supplies input information II and detection information DS. Control information CI and image information V1 are supplied (see Figure 12(A)).

[0346] For example, keyboard scan codes, location information, button operation information, audio information, or images. Image information, etc., can be used as input information II. Alternatively, for example, the information processing device 200 can Illumination information, orientation information, acceleration information, orientation information, pressure information, temperature information, etc. of the environment in which it is used. Alternatively, humidity information and other data can be used in the detection information DS.

[0347] For example, a signal to control the brightness of the image information V1, a signal to control the saturation, and a signal to control the hue. The signal can be used for control information CI. Alternatively, a portion of the display of image information V1 can be used. The signal to be changed can be used in the control information CI.

[0348] The input / output device 220 includes a display unit 230, an input unit 240, and a detection unit 250. For example Alternatively, the input / output device described in Embodiment 6 can be used.

[0349] The display unit 230 displays image information V1 based on the control information CI.

[0350] The input unit 240 generates input information II.

[0351] The detection unit 250 generates detection information DS.

[0352] 《Display section 230》 The display unit 230 has a function to display an image based on the image information V1. It features a function to display images based on your CI information.

[0353] The display unit 230 includes a control unit 238, a drive circuit GDA(1), and a drive circuit SDA(1). It has a display panel 700 (see Figure 10). For example, as described in Embodiment 5. A display device can be used in the display unit 230.

[0354] Input section 240 The input unit 240 has a function to supply location information. Various human interfaces A chair or similar object can be used as the input unit 240 (see Figure 12(A)).

[0355] For example, keyboards, hardware buttons, pointing devices, touch sensors, cameras Image device, audio input device, eye-tracking input device, posture detection device, microphone or camera, etc. are input to input unit 2 It can be used in 40. Furthermore, a touch sensor having an area that overlaps with the display unit 230 is used. It is possible to have a display unit 230 and a touch sensor with an area overlapping the display unit 230. An input / output device can be called a touch panel or touch screen.

[0356] For example, the user can use their finger touching the touch panel as a pointer to perform various gestures ( You can perform actions such as tapping, dragging, swiping, or pinching in.

[0357] For example, the arithmetic unit 210 analyzes information such as the position or trajectory of a finger that is in contact with the touch panel. And, when the analysis results satisfy predetermined conditions, it is determined that a specific gesture was supplied. Yes, it is possible. This allows the user to use a predetermined gesture that is pre-associated with a given gesture. Operation commands can be supplied using the gesture.

[0358] For example, the user can use a "scroll command" to change the display position of image information. It can be supplied using a gesture of moving a finger along the touch panel while in contact with the touch panel. .

[0359] Detection unit 250 The detection unit 250 has a function to supply detection information DS. The detection unit 250, for example, processes the information. The apparatus 200 has a function to detect the illuminance of the environment in which it is used and a function to supply illuminance information. Prepare.

[0360] The detection unit 250 has the function of detecting the surrounding conditions and supplying detection information. Specifically, Illuminance information, attitude information, acceleration information, orientation information, pressure information, temperature information, or humidity information, etc. It can be provided.

[0361] For example, photodetectors, illuminance sensors, attitude detectors, acceleration sensors, compass sensors, GPS (Gl (Obal positioning system) Signal receiving circuit, pressure sensor, temperature sensor A sensor, humidity sensor, or camera can be used in the detection unit 250.

[0362] 《Communications Section 290》 The communications unit 290 has the function of supplying information to the network and acquiring information from the network. Prepare.

[0363] Cabinet The enclosure also has the function of housing the input / output device 220 or the arithmetic unit 210. Alternatively, The enclosure has a function to support the display unit 230 or the arithmetic unit 210.

[0364] As a result, the information processing device will be able to perform the following actions in the environment in which the information processing device is used. It can operate by sensing the intensity of light the enclosure receives. Or, the user of the information processing device. The display method can be selected. As a result, new information with superior convenience or reliability can be provided. We can provide an information processing device.

[0365] Furthermore, these configurations cannot be clearly separated, and one configuration may also serve as another configuration. This may include a part of it. For example, a touch panel in which a touch sensor is superimposed on the display panel is It serves as both a display unit and an input unit.

[0366] 《Example of the configuration of the arithmetic unit 210.》 The computing unit 210 includes an artificial intelligence unit 213 (see Figure 12(A)).

[0367] 《Example Configuration of Artificial Intelligence Unit 213 1.》 The artificial intelligence unit 213 generates control information CI based on input information II or detection information DS. (See Figure 15(A)).

[0368] The artificial intelligence unit 213 includes a semiconductor device 90.

[0369] [Natural language processing on input information II] Specifically, the artificial intelligence unit 213 performs natural language processing on the input information II, and then processes the entire input information II. One feature can be extracted from the input information II. For example, the artificial intelligence unit 213 takes the input information II into account. The emotions and other factors involved can be inferred and used as characteristics. Furthermore, empirically, it is possible to identify characteristics that are suitable for such characteristics. It can infer the colors, patterns, or fonts that are perceived. Also, Artificial Intelligence Unit 213 This generates information that specifies the color, pattern, or font of the text, and information that specifies the color or pattern of the background. This can be used for control information CI.

[0370] Specifically, the artificial intelligence unit 213 performs natural language processing on the input information II and extracts the information contained in the input information II. It is possible to extract some of the words. For example, the artificial intelligence unit 213 can extract grammatical errors, It can extract misrepresentations or expressions containing emotions. In addition, the artificial intelligence unit 213 extracts Generates control information (CI) that displays a portion of the output in a different color, pattern, or font from the other portions. It can be used for control information CI.

[0371] [Image processing for input information II] Specifically, the artificial intelligence unit 213 processes the input information II as an image and extracts one from the input information II. Features can be extracted. For example, the artificial intelligence unit 213 can extract input information II from a photograph. Age, whether the environment in which Input Information II was taken was indoors or outdoors, Input Information II It is possible to infer whether the environment in which the image was taken was daytime or nighttime, etc., and to use that as a characteristic. It is possible. Furthermore, it is possible to infer a color tone that is empirically perceived as suitable for the said characteristic and to represent that color tone. It can generate control information CI for use in display. Specifically, it can be used for representing shades of gray. The control information CI uses information that specifies the color (e.g., full color, black and white, or brownish-red). It is possible.

[0372] Specifically, the artificial intelligence unit 213 processes the input information II as an image, and the input information II contains It is possible to extract a portion of an image. For example, a boundary can be placed between a portion of the extracted image and another portion. It is possible to generate control information CI that displays a portion of the extracted image. Specifically, it is possible to surround a portion of the extracted image. It is possible to generate control information CIs that display a rectangle.

[0373] [Inference using detection information DS] Specifically, the artificial intelligence unit 213 uses the detection information DS as information IN to generate the inference RI. It is possible that, based on the inference RI, the user of the information processing device 200 is comfortable. It is possible to generate control information CI that makes it feel that way.

[0374] Specifically, based on the ambient illuminance, the artificial intelligence unit 213 determines that the display brightness is comfortable. It is possible to generate control information CI to adjust the display brightness so that it feels like the display is brighter. Alternatively, the artificial intelligence unit 213 determines that the size is perceived as comfortable based on environmental noise, etc. This allows for the generation of control information (CI) to adjust the volume.

[0375] The display unit 230 supplies a clock signal or timing signal to the control unit 238. These can be used in the control information CI. Alternatively, they can be supplied to the control unit provided in the input unit 240. Clock signals or timing signals can be used as control information CI.

[0376] Semiconductor device 90 The semiconductor device 90 supplies control information CI based on input information II or detection information DS. .

[0377] The semiconductor device 90 is supplied with information IN and supplies inference RI (Figure 15(A), Figure 15(B) (See reference). For example, input information II or detection information DS can be used as information IN. Alternatively, for example, inference RI can be used as control information CI.

[0378] For example, the semiconductor device 90 extracts features from input information II or detection information DS. The semiconductor device 90 can generate control information CI based on the extracted features. Cut.

[0379] For example, the semiconductor device 90 extracts a portion from the input information II or the detection information DS. This is possible. The semiconductor device 90 provides control information to display the extracted portion differently from other portions. It can generate a report CI.

[0380] This makes it possible to generate control information that is displayed in a way that is perceived as favorable. Alternatively, it can be displayed in a way that makes it seem preferable. Or, it can be displayed in a way that makes it seem comfortable. It is possible to generate control information that can be displayed in a way that feels comfortable. It can be displayed in a way that is easy to understand. As a result, it can be a new information processing method that is convenient or reliable. We can provide the necessary equipment.

[0381] 《Example configuration of semiconductor device 90 2.》 The semiconductor device 90 includes a neural network 80 (see Figure 15(A)).

[0382] 《Neural Network 80》 The neural network 80 comprises an input layer 81, a hidden layer 82, and an output layer 83 (Figure See 15(B). For example, a convolutional neural network is a neural network It can be used for 80. Alternatively, a recurrent neural network can be used as a neural network. It can be used with workpiece 80.

[0383] The input layer 81 comprises a first group of neuronal circuits.

[0384] The intermediate layer 82 contains a second group of neuronal circuits.

[0385] The output layer 83 comprises a third group of neuronal circuits.

[0386] The second group of neuronal circuits consists of the first neuronal circuit 71 and the second neuronal circuit Includes 72.

[0387] The first neuron circuit 71 is electrically connected to the first group of neuron circuits.

[0388] The second neuron circuit 72 is electrically connected to a third group of neuron circuits.

[0389] The first group of neuronal circuits are supplied with information IN. For example, input information II or detection Information DS can be used as information IN.

[0390] A third group of neuronal circuits supplies inference RI. For example, inference RI is used to control information CI. It can be used for this purpose.

[0391] Neuron Circuit 71 The neuron circuit 71 includes a multiply-accumulate unit 10 and a converter 30 (see Figure 15(C)).

[0392] 《Add-and-Accumulate Unit 10》 The multiply-accumulate unit 10 is supplied with a group of input signals X[1] to X[N]. The unit 10 is supplied with a group of weight information W[1] to W[N]. It also has a multiply-accumulate unit. 10 is supplied with bias signal B.

[0393] The sum-accumulate unit 10 receives a group of input signals X[1] to X[N] and weight information W[1]. Alternatively, a sum-of-products signal u is generated based on the sum-of-products value of the weight information W[N] and the bias signal B, To supply. For example, a memory using a transistor containing an oxide semiconductor, etc., provides weight information W[1 It can be used as memory to store ] or weight information W[N]. Specifically, Oxide semiconductors containing indium or oxide semiconductors containing indium, gallium, and zinc A transistor can be used as memory. Also, for example, an analog arithmetic circuit can be used as a multiply-accumulate unit. It can be used in 10. This reduces the circuit size compared to digital arithmetic circuits. It can be made easier. Or, power consumption can be reduced.

[0394] Converter 30 The converter 30 is electrically connected to the multiply-accumulate unit 10. Based on the multiply-accumulate signal u, the converter 30 Generates and supplies the output signal f(u).

[0395] <Example of information processing device configuration 3.> Figures 13(A) and 13(B) show another configuration of an information processing device according to one embodiment of the present invention. I will explain while referring to it.

[0396] "program" A program according to one aspect of the present invention has the following steps (see Figure 13(A)).

[0397] [Step 1] In the first step, the settings are initialized (see Figure 13(A)(S1)).

[0398] For example, predetermined image information to be displayed at startup, and a predetermined mode for displaying said image information, Information specifying a predetermined display method for displaying the image information is obtained from the storage unit 212. Specifically, this involves using one still image or another moving image to create a predetermined image. Yes, it is possible. Furthermore, the first mode or the second mode can be used as a predetermined mode.

[0399] [Step 2] In the second step, interrupt handling is enabled (see Figure 13(A)(S2)). An arithmetic unit that is enabled to handle interrupts can perform interrupt processing in parallel with the main processing. Yes, it can. The arithmetic unit, having returned to the main process from the interrupt handler, will process the result obtained from the interrupt handler. This can be reflected in the main processing.

[0400] Furthermore, when the counter value is at its initial value, the arithmetic unit is prompted to perform an interrupt. When returning from the program, the counter may be set to a value other than its initial value. This allows the program to... It is possible to have interrupt processing always run after startup.

[0401] [Step 3] In the third step, a predetermined selected in the first step or interrupt processing. The image information is displayed using the mode or a predetermined display method (see Figure 13(A)(S3)). ). Note that the specified mode identifies the mode for displaying information, and the specified display method displays image information. Specify the method of display. Also, for example, it can be used as information to display image information V1. Cut.

[0402] For example, one method of displaying image information V1 can be associated with a first mode. Alternatively, other methods for displaying image information V1 can be associated with the second mode. This allows you to select the display method based on the selected mode.

[0403] Mode 1 Specifically, a selection signal is supplied to one scan line at a frequency of 30 Hz or higher, preferably 60 Hz or higher. A method of supplying and displaying based on a selection signal can be associated with the first mode.

[0404] For example, if a selection signal is supplied at a frequency of 30 Hz or higher, preferably 60 Hz or higher, the moving image It can display the movement smoothly.

[0405] For example, if the image is updated at a frequency of 30Hz or higher, preferably 60Hz or higher, the user's operation The image changes to smoothly follow the user's actions and is displayed on the information processing device 200 that the user is operating. It can be shown.

[0406] Mode 2 Specifically, a frequency of less than 30 Hz, preferably less than 1 Hz, and more preferably less than once per minute. A method of supplying a selection signal to one scan line at a time and displaying based on the selection signal is called a second mode. It can be associated with "do".

[0407] A selection signal at a frequency of less than 30 Hz, preferably less than 1 Hz, and more preferably less than once per minute. By supplying this, a display with reduced flicker or blinking can be achieved. Also, Power consumption can be reduced.

[0408] For example, if the information processing device 200 is used as a clock, it will be used at a frequency of once per second or once per minute. The display can be updated based on frequency, etc.

[0409] By the way, for example, when using a light-emitting element as a display element, the light-emitting element is made to emit light in a pulsed manner. This allows for the display of image information. Specifically, by emitting light from an organic EL element in a pulsed manner... The afterglow can be used for display. Organic EL elements have excellent frequency characteristics. In some cases, this can reduce power consumption by shortening the time required to drive the light-emitting element. Because heat generation is suppressed, it may be possible to reduce the degradation of the light-emitting element.

[0410] [Step 4] In the fourth step, if a termination command is supplied, proceed to the fifth step, and the termination command If it is not supplied, choose to proceed to the third step (Figure 13(A)(S4)). reference).

[0411] For example, the termination instruction supplied during interrupt handling may be used for the decision.

[0412] [Step 5] In the fifth step, the process ends (see Figure 13(A)(S5)).

[0413] Interrupt handling Interrupt handling comprises the following steps 6 through 8 (see Figure 13(B)). .

[0414] [Step 6] In the sixth step, for example, the information processing device 200 is used with the detection unit 250. The illuminance of the environment is detected (see Figure 13(B)(S6)). Note that instead of the illuminance of the environment, the environmental illuminance is detected. The color temperature and chromaticity of the ambient light may also be detected.

[0415] [Step 7] In the seventh step, the display method is determined based on the detected illuminance information (Figure 13(B). (See S7). For example, make sure the display brightness is not too dark or too bright. We have decided on this.

[0416] Furthermore, if the color temperature or chromaticity of the ambient light is detected in step 6, the display will You can adjust the color.

[0417] [Step 8] In the eighth step, the interrupt processing is terminated (see Figure 13(B)(S8)).

[0418] <Example of information processing device configuration 3.> Another configuration of an information processing device according to one aspect of the present invention will be described with reference to Figure 14.

[0419] Figure 14(A) is a flowchart illustrating a program according to one embodiment of the present invention. Figure 14 (A) is a flowchart that explains an interrupt process different from the interrupt process shown in Figure 13(B). It's a chart.

[0420] In addition, the configuration example 3 of the information processing device changes the mode based on a predetermined event that is supplied. The interrupt handling has a step that can be explained with reference to Figure 13(B). This process is different. Here, we will explain the differences in detail and how to use a similar configuration. The above explanation will be used to describe the parts where this is possible.

[0421] Interrupt handling Interrupt handling comprises the following steps 6 through 8 (see Figure 14(A)). .

[0422] [Step 6] In step 6, if a predetermined event is supplied, proceed to step 7. If the specified event is not supplied, proceed to step 8 (Figure 14(A)(U6) (See reference). For example, using whether or not a specific event was supplied during a specified period as a condition. This is possible. Specifically, 5 seconds or less, 1 second or less, or 0.5 seconds or less, preferably 0.1 seconds or less. The predetermined period can be a period longer than 0 seconds.

[0423] [Step 7] In the seventh step, change the mode (see Figure 14(A)(U7)). Specifically, If you selected the first mode, select the second mode, and then select the second mode. If so, select the first mode.

[0424] For example, the display mode can be changed for a portion of the display unit 230. In particular, the display unit 230 includes drive circuits GDA, GDB, and GDC. The display mode can be changed in the region where one drive circuit supplies the selection signal. See Figure 14(B).

[0425] For example, in the input section 240 located in the region where the drive circuit GDB supplies the selection signal, When a predetermined event is supplied, the drive circuit GDB supplies a selection signal to the display area. The code can be changed (see Figures 14(B) and 14(C)). Specifically, the instructions In response to a "tap" event supplied to the touch panel using the above, the drive circuit GDB supplies The frequency of the selection signal can be changed.

[0426] The signal GCLK is a clock signal that controls the operation of the drive circuit GDB, and the signal PWC Signals 1 and PWC2 are pulse width control signals that control the operation of the drive circuit GDB. The GDB circuit selects a signal based on signals GCLK, PWC1, PWC2, etc. This is supplied to scan line G2(m+1) or scan line G2(2m).

[0427] This means, for example, that the drive circuit GDA and drive circuit GDC supply selection signals. The drive circuit GDB can supply the selection signal. Alternatively, the drive circuit GDA and Without changing the display in the area where the drive circuit GDC supplies the selection signal, the drive circuit GDB selects The display of the area supplying the selection signal can be updated. Alternatively, the power consumed by the drive circuit can be updated. It can be suppressed.

[0428] [Step 8] In the eighth step, the interrupt processing is terminated (see Figure 14(A)(U8)). Interrupt handlers may be repeatedly executed during the period in which the main process is running.

[0429] 《Scheduled Events》 For example, "clicks" and "drags" that are supplied using a pointing device such as a mouse. Events such as using a finger or other object as a pointer to input data to a touch panel, such as "tap" and "drag". Events such as "grab" or "swipe" can be used.

[0430] Also, for example, the position of the slider bar pointed to by the pointer, the swipe speed, the drag speed. Arguments to commands associated with a given event can be provided using degrees, etc.

[0431] For example, the information detected by the detection unit 250 is compared with a pre-set threshold, and the comparison result It can be used for events.

[0432] Specifically, a pressure sensor that contacts buttons or other objects positioned to be pressed into the casing. These can be used in the detection unit 250.

[0433] 《Instructions to associate with a specified event》 For example, a termination command can be associated with a specific event.

[0434] For example, "page turning" is used to switch the displayed image information from one image to another. The "page turn command" can be associated with a predetermined event. Arguments that determine the page-turning speed used during execution are set using a predetermined event. It can be given.

[0435] For example, move the display position of a portion of an image to create a continuous section within that portion. You can associate commands such as "scroll commands" that display other parts with specific events. This determines the speed at which the display moves when executing the "scroll command". Arguments can be provided using a predetermined event.

[0436] For example, commands to set the display method or commands to generate image information are sent to a predetermined event It can be associated with a predetermined event. It can be associated with the . Also, the argument that determines the brightness of the generated image is set by the detection unit 2 50 may be determined based on the ambient brightness detected by the sensor.

[0437] For example, information delivered using a push-type service can be acquired using the communication unit 290. Commands and other instructions can be associated with specific events.

[0438] Furthermore, the determination of whether or not the person is qualified to acquire the information is made using the location information detected by the detection unit 250. This is also acceptable. Specifically, being inside or in a designated classroom, school, conference room, company, building, etc. In some cases, it may be determined that one is qualified to obtain the information. This could, for example, be a school or This involves receiving educational materials distributed in classrooms at universities, etc., and using the information processing device 200 as textbooks, etc. This is possible (see Figure 12(B)). Alternatively, you can receive materials distributed in a company's meeting room. It can be used in meeting materials.

[0439] This embodiment can be appropriately combined with other embodiments shown herein. . [Examples]

[0440] In this embodiment, a transistor that can be used in a display panel according to one embodiment of the present invention is fabricated. The results will be explained with reference to Figures 8 and 16.

[0441] Figure 16 is a diagram illustrating the characteristics of the fabricated transistor. The transistor has a configuration similar to that of the transistor shown in Figure 8.

[0442] <Manufacturing method> First, an insulating film 501C was formed, and then a conductive film 504 was formed on the insulating film 501C. Next Then, an insulating film 506 is formed on the conductive film 504, and a semiconductor film 508 is formed on the insulating film 506. Next, an opening was formed in the insulating film 506. Then, the conductive film 512A in contact with the semiconductor film 508 A conductive film 512B was formed, and an insulating film 516 was formed. Furthermore, a conductive film 512A was formed. A conductive film 512C was formed in the process. This resulted in the transistor used in the switch SW2. This was formed. Furthermore, the channel width W of the transistor used in switch SW2 was set to 3 μm. The flannel length was set to 3 μm.

[0443] Next, a semiconductor film 508(2) is formed on the insulating film 516, and an opening is formed in the insulating film 516. Next, conductive films 512D and 512E in contact with the semiconductor film 508(2) are formed. This formed an insulating film 516(2). This created a transistor M. The channel width W of ZISTA M was set to 50 μm and the channel length to 3 μm.

[0444] Furthermore, oxide semiconductor films were used for semiconductor film 508 and semiconductor film 508(2).

[0445] <Rating> The characteristics of the fabricated transistor M are shown. Specifically, the voltage between the source and drain (Vd For the cases where s) is 0.1V and 20V, drain current - gate voltage (I The D-VG characteristics are shown (see Figure 16(a)).

[0446] The characteristics of the transistor used in the fabricated switch SW2 are shown. Specifically, the source and drain When the voltage between the inputs (Vds) is 0.1V and when it is 20V, The current-gate voltage (ID-VG) characteristics are shown (see Figure 16(b)).

[0447] All of them possessed good transistor characteristics.

[0448] For example, in this specification, etc., if it is explicitly stated that X and Y are connected The cases are when X and Y are electrically connected and when X and Y are functionally connected. The cases disclosed in this specification, etc., include the case where X and Y are directly connected. Therefore, the connection relationships are not limited to those shown in the diagram or text. In addition to the connections shown in the diagrams or text, other connections are also disclosed in the diagrams or text. do.

[0449] Here, X and Y are the object (e.g., device, element, circuit, wiring, electrode, terminal, conductive film, layer). (etc.)

[0450] One example of a case where X and Y are directly connected is when an electrical connection between X and Y is possible. Elements such as switches, transistors, capacitive elements, inductors, resistive elements, and dies. If the diode, display element, light-emitting element, load, etc. are not connected between X and Y and elements that enable electrical connection between X and Y (e.g., switches, transistors, capacitors). Without the need for elements such as components, inductors, resistors, diodes, display elements, light-emitting elements, loads, etc. This is the case when X and Y are connected.

[0451] One example of a case where X and Y are electrically connected is the ability to make an electrical connection between X and Y possible. Elements such as switches, transistors, capacitive elements, inductors, resistive elements, and dies. One or more devices (such as diodes, display elements, light-emitting elements, and loads) are connected between X and Y. Yes, it is possible. Furthermore, a switch has the function of being controlled to be on or off. In other words, a switch The switch can be in a conductive (on) or non-conductive (off) state, allowing current to flow. It has a function to control whether or not current flows. Alternatively, the switch selects the path through which current flows. It has a function to switch between them. Furthermore, if X and Y are electrically connected, X and This includes cases where Y is directly connected to it.

[0452] One example of a functional connection between X and Y is enabling a functional connection between X and Y. Circuits that perform this function (for example, logic circuits (inverters, NAND gates, NOR gates, etc.), signal transformers) Conversion circuits (DA conversion circuits, AD conversion circuits, gamma correction circuits, etc.), potential level conversion circuits (electric (Source circuits (boost circuits, buck circuits, etc.), level shifter circuits that change the potential level of a signal, etc.) Voltage source, current source, switching circuit, amplification circuit (which can increase signal amplitude or current amount, etc.) Circuits, operational amplifiers, differential amplifier circuits, source follower circuits, buffer circuits, etc., signal generation One or more circuits (such as memory circuits and control circuits) can be connected between X and Y. For example, even if another circuit is placed between X and Y, the signal output from X If the signal is transmitted to Y, then X and Y are assumed to be functionally connected. When X and Y are functionally connected, the situation is different from when X and Y are directly connected. This includes cases where and are electrically connected.

[0453] Furthermore, if it is explicitly stated that X and Y are electrically connected, then X and Y and When they are electrically connected (i.e., when there is another element or circuit between X and Y) (when connected) and when X and Y are functionally connected (i.e., X and Y are connected) (When functionally connected with another circuit in between) and when X and Y are directly connected In the case of (that is, when X and Y are connected without another element or circuit in between) and However, this shall be as disclosed in this specification, etc. That is, explicitly stated that they are electrically connected. If it is explicitly stated that it is connected, then Similar information is disclosed in this specification, etc.

[0454] For example, if the source (or first terminal, etc.) of the transistor is connected via Z1 (or via (In short), electrically connected to X, the drain (or second terminal, etc.) of the transistor is connected to Z. If Y is electrically connected via (or without) 2, or if the transistor source (or the first terminal, etc.) is directly connected to a part of Z1, and another part of Z1 is directly connected to X. They are directly connected, with the transistor's drain (or second terminal, etc.) directly connected to a portion of Z2. If it is connected to and another part of Z2 is directly connected to Y, it can be expressed as follows: It is possible to do so.

[0455] For example, "X and Y and the source (or first terminal, etc.) and drain (or second terminal) of the transistor." The terminals (such as the X terminal) are electrically connected to each other, and X is the source (or the X terminal) of the transistor. The electrical connections are in the following order: terminal 1, the drain of the transistor (or terminal 2, etc.), and Y. It can be expressed as "It is connected." Or, "The source (or the source) of the transistor." Terminal 1 (or terminal 2) is electrically connected to X, and the drain (or terminal 2) of the transistor is connected to X. (d) is electrically connected to Y, X is the source of the transistor (or the first terminal, etc.), and the transistor The drain (or second terminal, etc.) of the converter, Y, is electrically connected in this order. It can be expressed as "X is the source (or first terminal) of the transistor." Alternatively, "X is the source (or first terminal) of the transistor." Y is electrically connected to X via the drain (or second terminal, etc.) and X, the transistor The source of the transistor (or the first terminal, etc.), the drain of the transistor (or the second terminal, etc.) ), Y is provided in this connection order. By using a specific method of expression to define the order of connections in the circuit configuration, Distinguish between the source (or first terminal, etc.) and drain (or second terminal, etc.) of the zista. This allows us to determine the technical scope.

[0456] Alternatively, another way to express it is, for example, "the source (or first terminal, etc.) of the transistor." It is electrically connected to X via at least a first connection path, and the first connection path is It does not have a second connection path, and the aforementioned second connection path is via a transistor, The source (or first terminal, etc.) of the transistor and the drain (or second terminal, etc.) of the transistor. The path between ( and ), and the first connection path is a path via Z1, and the transit The drain (or second terminal, etc.) of the terminal is electrically connected to Y via at least a third connection path. They are connected in a manner, and the third connection path does not have the second connection path, and the third The connection path is the path via Z2. This can be expressed as "The transition The source of the starter (or the first terminal, etc.) is connected via Z1 through at least the first connection path. And, electrically connected to X, the first connection path does not have a second connection path, The second connection path has a connection path via a transistor, and the drain of the transistor (or a second terminal, etc.) is connected to Y via Z2 by at least a third connection path. It is expressed as: "They are electrically connected, and the third connection path does not have the second connection path." It is possible. Or, "the source (or first terminal, etc.) of the transistor is less Both are electrically connected to X via Z1 through a first electrical path, and the first electrical The target path does not have a second electrical path, and the second electrical path is the transistor From the source (or first terminal, etc.) to the drain (or second terminal, etc.) of the transistor It is an electrical path, and the drain (or second terminal, etc.) of the transistor is at least third The electrical path is electrically connected to Y via Z2, and the third electrical path is , it does not have a fourth electrical path, and the fourth electrical path is the drain of the transistor The electrical pulse from (or the second terminal, etc.) to the source (or the first terminal, etc.) of the transistor It can be expressed as "It is S." Using similar methods of expression as these examples, the circuit configuration By defining the connection path in the transistor, the source (or first terminal) To distinguish between the drain (or second terminal, etc.) and the second terminal, and to determine the technical scope. It is possible.

[0457] Note that these methods of expression are just examples and are not limited to these methods. Here, X Y, Z1, and Z2 are the objects (e.g., devices, elements, circuits, wiring, electrodes, terminals, conductive films, etc.) Let's assume it is a layer, etc.

[0458] Note that, in circuit diagrams, independent components are shown as being electrically connected to each other. Even in such cases, one component may possess the functions of multiple components. For example, if part of the wiring also functions as an electrode, one conductive film will perform the function of the wiring, and It possesses the functions of both components of the electrode's function. Therefore, the electrode in this specification A conductive connection is a situation where a single conductive film combines the functions of multiple components. Combined forms are also included in that category. [Explanation of symbols]

[0459] ANO: Conductive film, B: Bias signal, C21: Capacitive element, CI: Control information, DS: Detection information Report, G2: scan line, GDA: drive circuit, GDB: drive circuit, GDC: drive circuit, GCLK :Signal, II:Input information, IN:Information, P1:Part, P2:Boundary, P3:Part, PWC1 : Signal, PWC2: Signal, R1: Radius of curvature, R2: Radius of curvature, R3: Radius of curvature, S2: Signal Line number, SD: drive circuit, SDA: drive circuit, SDB: drive circuit, SDC: drive circuit, SP : Control signal, SW2: Switch, U: Sum-accumulate signal, V1: Image information, V11: Information, VCO M2: Conductive film, W: Information, 10: Multiply-accumulate unit, 30: Converter, 71: Neuron circuit, 7 2: Neuron circuit, 80: Neural network, 81: Input layer, 82: Hidden layer, 8 3: Output layer, 90: Semiconductor device, 200: Information processing device, 210: Arithmetic unit, 211: Calculation unit, 212: Memory unit, 213: Artificial intelligence unit, 214: Transmission line, 215: Input / output interface Face, 220: Input / Output device, 230: Display unit, 231: Display area, 233: Control circuit 234: Expansion circuit, 235: Image processing circuit, 238: Control unit, 240: Input unit, 241 : detection area, 248: control unit, 250: detection unit, 290: communication unit, 400: molecular weight, 50 1C: insulating film, 504: conductive film, 506: insulating film, 508: semiconductor film, 508A: region 508B: Area, 508C: Area, 510: Base material, 512A: Conductive film, 512B: Conductive film 512C: conductive film, 512D: conductive film, 512E: conductive film, 516: insulating film, 516A : insulating film, 516B: insulating film, 518: insulating film, 520: functional layer, 521: insulating film, 52 4: conductive film, 528: insulating film, 530: pixel circuit, 550: display element, 551: electrode, 5 52: Electrode, 553: Layer, 591A: Aperture, 700: Display panel, 700A: Area, 7 00B: Area, 700C: Area, 700TP: Input / Output Panel, 702: Pixel, 703: Image Element, 720: Functional layer, 770: Substrate, 770P: Functional film, 771: Insulating film, 775: Detection Element, 791: component, 791A: elastic body, 791B: elastic body, 791C: elastic body, 792 : component

Claims

1. A display panel comprising a first substrate, a second substrate, a sealing material, a first member, and a second member, The sealing material is located between the first substrate and the second substrate. The first substrate has a region that extends outward from the end of the sealing material, The first member is provided in contact with the second base material, The first member comprises a first elastic body, a second elastic body, and a third elastic body. The third elastic body has an end portion that is partially covered by the first elastic body and another end portion that is partially covered by the second elastic body. The elastic modulus of the third elastic body is greater than that of the first and second elastic bodies. The second member has a region that contacts the first substrate and a region that covers the end of the sealing material and the end of the second substrate. The first substrate and the second substrate are flexible, The display panel has a first area, a second area adjacent to the first area, and a display area. The first region includes a part of the display region, The second region includes another part of the display region, The second region overlaps with the second substrate and curves outward toward the second substrate. A display panel having a function to fold the display area in two along the first member.

2. In claim 1, A display panel having a region in which the first surface of the second substrate and the second surface of the second substrate are bent so as to face each other.

Images