Materials for atomic layer deposition and methods for forming silicon oxide films using the same
A novel atomic layer deposition material with halogen and isocyanate compounds forms high-quality silicon oxide films at high temperatures, addressing thermal decomposition issues and ensuring excellent adhesion and coverage.
Patent Information
- Application Number
- JP2024219653
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2026-06-26
AI Technical Summary
Conventional atomic layer deposition materials degrade at high temperatures, leading to thermal decomposition and unsuitable film formation for fine patterns due to poor adhesion and coverage.
A material for atomic layer deposition comprising compounds represented by specific formulas, including halogen atoms and isocyanate groups, is used to form silicon oxide films at temperatures between 25°C to 800°C, with a pressure of 7.6 Pa to 100 kPa, involving multiple introduction and purging steps to achieve high-quality film formation.
The material exhibits excellent heat resistance, enabling the formation of silicon oxide films with high adhesion and good coverage, even at elevated temperatures, suitable for fine patterns.
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Abstract
Citation Information
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