Method for manufacturing a light-emitting device

Abstract

The objective is to provide a method for manufacturing a light-emitting device that has good light extraction and high contrast. [Solution] A method for manufacturing a light-emitting device, comprising the steps of: preparing a translucent sheet having first and second main surfaces; forming a non-penetrating first groove at a position surrounding one or more element mounting areas on the first main surface in a top view; arranging a light-emitting element in the element mounting area; placing a first light-shielding member on the first main surface that covers the inside of the first groove and the light-emitting element; removing the first light-shielding member in the first groove so as to cover the side surface of the light-emitting element to form a second groove leading to the translucent sheet; placing a second light-shielding member in the second groove that covers the side surface of the first light-shielding member; removing a portion of the translucent sheet from the second main surface side of the translucent sheet so as to expose the second light-shielding member in the second groove; and dividing the sheet at a position passing through the second light-shielding member in a top view to obtain a light-emitting device.

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing a light-emitting device. [Background technology]

[0002] In recent years, light-emitting devices in which multiple light-emitting elements are arranged in a two-dimensional manner have been used in various fields such as display devices, lighting devices, and flashes. For example, light-emitting devices applicable to variable-beam headlights and flashes for vehicles have been disclosed (Patent Documents 1 and 2, etc.). [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2014-236175 [Patent Document 2] Japanese Patent Publication No. 2024-090235 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] The present disclosure aims to provide a method for manufacturing a light-emitting device that has good light extraction and high contrast. [Means for solving the problem]

[0005] The method for manufacturing the light-emitting device disclosed herein is: A step of preparing a translucent sheet having a first main surface and a second main surface located on the opposite side of the first main surface, In a top view, the process involves forming a non-penetrating first groove at a position surrounding one or more element mounting areas on the first main surface, A step of arranging a light-emitting element on the upper surface of the element mounting area with the light-emitting surface facing it, A step of arranging a first light-shielding member containing a light-reflective material on the first main surface so as to cover the inside of the first groove and the light-emitting element, A step of forming a second groove leading to the light-transmitting sheet, such that the first light-shielding member disposed in the first groove is removed from the first main surface side, and the first light-shielding member that covers the side surface of the light-emitting element in a top view remains; The process involves placing a second light-shielding member containing a light-absorbing material within the second groove so as to cover the side surface of the first light-shielding member, A step of removing a portion of the light-transmitting sheet from the second main surface side of the light-transmitting sheet so that the second light-shielding member disposed in the second groove is exposed, The process includes the step of dividing the material at a position passing through the second light-shielding member in a top view to obtain a light-emitting device.

[0006] Furthermore, the manufacturing method of a light-emitting device according to another embodiment is: A step of preparing a translucent sheet having a first main surface and a second main surface located opposite the first main surface, wherein a diffusion sheet and a phosphor sheet are arranged in order from the second main surface side, In a top view, a non-penetrating first recess is formed at a position surrounding one or more element mounting areas on the first main surface, and the phosphor sheet is defined as an inner phosphor portion located in the one or more element mounting areas and an outer phosphor portion located outside the inner phosphor portion via the first recess, A step of arranging a light-emitting element on the upper surface of the element mounting area with the light-emitting surface facing it, The process involves placing a first light-shielding member containing a light-reflective material on the first main surface so as to cover the inside of the first recess, the light-emitting element, and the outer phosphor portion. The steps include removing the first light-shielding member disposed on the outer phosphor portion from the first main surface side, and forming a second recess such that the first light-shielding member remains covering the side surface of the light-emitting element when viewed from above, The process involves placing a second light-shielding member containing a light-absorbing material within the second recess so as to cover the side surface of the first light-shielding member, A step of removing a portion of the light-transmitting sheet from the second main surface side of the light-transmitting sheet so that the first light-shielding member disposed in the first recess is exposed, In a top view, a step of obtaining a light-emitting device by dividing at a position passing through the second light-shielding member is included.

Advantages of the Invention

[0007] According to an embodiment of the present disclosure, it is possible to provide a method for manufacturing a light-emitting device with good light extraction and high contrast.

Brief Description of the Drawings

[0008] [Figure 1] It is a flowchart showing a method for manufacturing a light-emitting device according to a first embodiment. [Figure 2A] It is a schematic manufacturing process diagram for explaining a method for manufacturing a light-emitting device according to a first embodiment. [Figure 2B] It is a schematic manufacturing process plan view for explaining a method for manufacturing a light-emitting device according to a first embodiment. [Figure 2C] It is a cross-sectional view taken along line IIC-IIC of the translucent sheet in FIG. 2B. [Figure 2D] It is a schematic manufacturing process diagram for explaining a method for manufacturing a light-emitting device according to a first embodiment. [Figure 2E] It is a schematic manufacturing process diagram for explaining a method for manufacturing a light-emitting device according to a first first embodiment. [Figure 2F] It is a schematic manufacturing process plan view for explaining a method for manufacturing a light-emitting device according to a first embodiment. [Figure 2G] It is a cross-sectional view taken along line IIG-IIG of FIG. 2F. [Figure 2H] It is a schematic manufacturing process plan view for explaining a method for manufacturing a light-emitting device of a modified example of FIG. 2F. [Figure 2I] It is a schematic manufacturing process diagram for explaining a method for manufacturing a light-emitting device according to a first embodiment. [Figure 2J] It is a schematic manufacturing process diagram for explaining a method for manufacturing a light-emitting device according to a first embodiment. [Figure 2K] It is a schematic manufacturing process diagram for explaining a method for manufacturing a light-emitting device according to a first embodiment. [Figure 2L]This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the first embodiment. [Figure 2M] This is a schematic plan view of the manufacturing process for illustrating the manufacturing method of the light-emitting device according to the first embodiment. [Figure 2N] This is a schematic manufacturing process diagram showing a modified example of Figure 2K. [Figure 3] This is a flowchart showing a manufacturing method for a light-emitting device according to the second embodiment. [Figure 4A] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 4B] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 4C] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 4D] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 4E] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 4F] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 4G] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 4H] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 4I] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 4J] This is a schematic manufacturing process diagram illustrating the manufacturing method for the light-emitting device of the second embodiment. [Figure 5A] This is a schematic manufacturing process diagram illustrating a manufacturing method for a modified light-emitting device of the second embodiment. [Figure 5B] This is a schematic manufacturing process diagram illustrating a manufacturing method for a modified light-emitting device of the second embodiment. [Figure 5C] This is a schematic manufacturing process diagram illustrating a manufacturing method for a modified light-emitting device of the second embodiment. [Figure 5D] This is a schematic manufacturing process diagram illustrating a manufacturing method for a modified light-emitting device of the second embodiment. [Figure 5E] This is a schematic manufacturing process diagram illustrating a manufacturing method for a modified light-emitting device of the second embodiment. [Figure 6] This is a schematic cross-sectional view showing a light-emitting module according to a first embodiment of the present disclosure. [Modes for carrying out the invention]

[0009] The method for manufacturing a light-emitting device according to embodiments of this disclosure will be described below with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "up," "down," and other terms including these terms) will be used as needed. However, the use of these terms is for the purpose of facilitating the understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of this disclosure. Parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or components.

[0010] The embodiments described below illustrate methods for manufacturing light-emitting devices to embody the technical concept of this disclosure, and do not limit this disclosure to the following. The dimensions, materials, shapes, relative arrangements, etc. of the components described below are intended to be illustrative, and not to limit the scope of this disclosure unless otherwise specified. The contents described in each embodiment and each modification are also applicable to other embodiments or modifications.

[0011] The sizes and positional relationships of the components shown in the drawings below may be exaggerated for clarity. To avoid making the drawings excessively complex, schematic diagrams or end view diagrams showing only the cross-section may be used, omitting the illustration of some elements. Unless otherwise specified, "covering" or "covering" a component includes cases where the component directly covers the component in contact with it, and cases where the component indirectly covers the component without contact.

[0012] [Manufacturing method for a light-emitting device according to the first embodiment] A method for manufacturing a light-emitting device according to the first embodiment will be described with reference to Figures 1 and 2A to 2M. Figure 1 is a flowchart showing a method for manufacturing a light-emitting device according to the first embodiment. The method for manufacturing a light-emitting device according to this embodiment includes the steps of: preparing a light-transmitting sheet S1; forming a first groove S2; arranging a light-emitting element S3; arranging a first light-shielding member S4; forming a second groove in the first light-shielding member within the first groove S5; arranging a second light-shielding member within the second groove S6; removing a portion of the light-transmitting sheet S7; and dividing the second light-shielding member to obtain a light-emitting device S8. By this manufacturing method, the light-emitting device 10 shown in Figures 2L and 2M can be obtained.

[0013] This manufacturing method allows for the easy placement of a first light-shielding member containing a light-reflective material and a second light-shielding member containing a light-absorbing material on the side surface of the light-emitting element. In particular, by placing the first light-shielding member on the side surface of the light-emitting element, the light emitted from the light-emitting element can be efficiently reflected by the first light-shielding member and extracted upwards. Furthermore, by placing the second light-shielding member on the outer circumference of the first light-shielding member, for example, light emitted from the light-emitting element that passes through the first light-shielding member and unintentionally exits to the side of the light-emitting device can be absorbed by the second light-shielding member, thereby improving the contrast of the light-emitting device. As a result, it is possible to manufacture a light-emitting device with good light extraction and high contrast. Furthermore, regardless of the number of light-emitting elements, the overall light emission state of the light-emitting device 10 can be made uniform or nearly uniform, reducing unevenness in light emission. In addition, by reducing the light emitted from the sides of the light-emitting device, it is possible to manufacture a light-emitting device 10 with less color unevenness.

[0014] (S1: Prepare translucent sheet 1) First, prepare the translucent sheet 1 as shown in Figure 2A. The translucent sheet 1 can be processed by dicing or other methods to form grooves. The translucent member 1A obtained from the translucent sheet 1 is to be placed on the light-emitting element in the light-emitting device according to the first embodiment, so it can be a member that transmits at least a portion of the light emitted from the light-emitting element. For example, the member of the translucent sheet 1 can transmit 60% or more of the light emitted from the light-emitting element, and it is preferable that it transmits 70% or more, 75% or more, or 80% or more of the light.

[0015] The translucent sheet 1 is preferably in the form of a plate or a film. The translucent sheet 1 has a first main surface 1a and a second main surface 1b opposite to the first main surface 1a. The first main surface 1a and the second main surface 1b do not have to be parallel to each other, but it is preferable that they be parallel. The shortest distance between the first main surface 1a and the second main surface 1b, that is, the thickness of the translucent sheet 1, can be set as appropriate. For example, the thickness of the translucent sheet 1 can be 30 μm or more and 250 μm or less.

[0016] The translucent sheet 1 can be a single-layer or laminated sheet formed from a translucent resin, glass, ceramics, etc. As the translucent resin, a resin containing one or more of the following can be used: silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, fluororesin, polycarbonate resin, polystyrene resin, polyethylene resin, etc.

[0017] The light-transmitting sheet 1 can contain at least a part of the incident light, a phosphor capable of wavelength conversion, and / or a light diffusing substance, etc. Examples of the light-transmitting sheet containing a phosphor or a light diffusing substance include those obtained by incorporating a powder of a phosphor or a light diffusing substance into a sintered body of a phosphor, a light-transmitting resin, glass, ceramics, etc. Further, it may be one in which a resin layer containing a phosphor or a light diffusing substance is disposed on the surface of a light-transmitting plate which is a molded body of a light-transmitting resin, glass, ceramics, etc.

[0018] Examples of the phosphor include yttrium aluminum garnet-based phosphors (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate-based phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride-based phosphors, LSN-based phosphors (e.g., (La,Y)3Si6N 11 :Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si 1-x Al x )F 6-x:Mn where x satisfies 0 < x < 1), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2) can be used. The above phosphors are particles. Also, one of these phosphors can be used alone, or two or more of these phosphors can be used in combination.

[0019] Examples of the light diffusing material include particles such as titanium oxide, barium titanate, aluminum oxide, silicon oxide, and zinc oxide. By including the light diffusing material in the translucent sheet 1, the light emitted from the light emitting element 2 can be diffused and emitted to the outside. Thereby, in the light emitting device 10, the unevenness of light emission on the upper surface of the translucent member 1A can be reduced.

[0020] In the present embodiment, as shown in FIG. 2A, the translucent sheet 1 includes a laminated sheet in which a translucent layer 11 containing a phosphor and a light diffusing layer 12 are laminated. The surface on the side of the translucent layer 11 is referred to as the first main surface 1a, and the surface on the side of the light diffusing layer 12 is referred to as the second main surface 1b. Each layer can be integrally laminated directly or via an adhesive layer or the like. Also, a laminated sheet may be formed by sequentially applying, etc., the material constituting the light diffusing layer 12 and the material constituting the translucent layer 11 on a support.

[0021] The light-transmitting sheet 1 may be prepared as a laminated sheet in which a second light-transmitting layer is laminated between a light-transmitting layer 11 and a light-diffusing layer 12. In this case, each layer can be laminated integrally directly or via an adhesive layer or the like. The second light-transmitting layer should be a layer that can transmit at least a portion of the light emitted from the light-emitting element 2. For example, a layer that transmits 60% or more of the light emitted from the light-emitting element is recommended, and a layer that transmits 70% or more, 75% or more, or 80% or more is preferable. The second light-transmitting layer can be formed from a light-transmitting resin or the like, similar to the light-transmitting layer.

[0022] (S2: Formation of the first groove 1c on the translucent sheet 1) Figure 2B is a schematic plan view of the translucent sheet 1, and Figure 2C is a cross-sectional view of Figure 2B along the line IIC-IIC. As shown in Figures 2B and 2C, a non-penetrating first groove 1c is formed on the first main surface 1a of the translucent sheet 1 in a top view. The first groove 1c is formed on the first main surface 1a of the translucent sheet 1 at a position surrounding a predetermined element mounting area A for mounting the light-emitting element 2. In other words, the element mounting area A can be defined by forming the first groove 1c on the first main surface 1a of the translucent sheet 1.

[0023] The first groove 1c is formed such that, for example, if the translucent sheet 1 is made only of a translucent layer 11, its bottom is located within the translucent layer 11. For example, as shown in Figure 2A, if the translucent sheet 1 has a laminated structure of a translucent layer 11 and a light-diffusing layer 12, the first groove 1c can be formed as a non-penetrating groove that does not penetrate the light-diffusing layer 12, with its bottom located within the light-diffusing layer 12. Alternatively, if the translucent sheet 1 has a laminated structure including a translucent layer 11, a light-diffusing layer 12, and a second translucent layer placed between them, the first groove 1c can be formed as a non-penetrating groove that does not penetrate the light-diffusing layer 12, with its bottom located within the light-diffusing layer 12 or the second translucent layer.

[0024] In Figure 2C, the width W of the first groove 1c may be, for example, 300 μm or more, preferably 350 μm or more, and more preferably 370 μm or more. The width W of the first groove 1c may be, for example, 600 μm or less, preferably 500 μm or less. By setting the width to this, the placement of the first light-shielding member 3 in the first groove 1c becomes easier in the process of arranging the first light-shielding member 3, which will be described later. Also, the formation of the second groove 3a becomes easier in the process of forming the second groove, which will be described later. However, the width and / or depth of the first groove 1c does not have to be the same throughout.

[0025] As shown in Figure 2B, the first groove 1c is preferably formed in a grid or line shape when viewed from above. For example, the first groove 1c is preferably formed at a position surrounding one or more element mounting areas A. In this case, the first groove 1c may be formed at a position surrounding the entire circumference or a part thereof of the element mounting area A. In particular, it is preferable that the first groove 1c be formed at a position surrounding the entire circumference of one or more element mounting areas A. It is even more preferable that the first groove 1c be formed in a grid shape when viewed from above, so as to define the entire circumference of a plurality of rectangular element mounting areas A. This allows the first light-shielding member 3 to be placed on all sides of the light-transmitting member 1A when it is used as a light-emitting device 10 as described later, thereby improving the contrast of the light-emitting device 10. The first groove 1c can be formed using a dicing blade or by irradiation with laser light, etc.

[0026] The element mounting area A can be set to various shapes and sizes in a top view, depending on the shape of the light-emitting element described later. The element mounting area A can be various shapes in a top view, such as polygons such as squares, circles, or ellipses. In particular, the element mounting area A is preferably a square in a top view, and more preferably a rectangle having a pair of first sides and a pair of second sides that are longer than the first sides. This makes processing such as dicing easier. In this case, the width of the first groove 1c located on the first side, that is, located parallel to the first side, may be different from the width of the first groove 1c located on the second side. By making the width of the first groove 1c different on the first side and the second side in this way, the flow speed of the first light-shielding member 3 can be changed when arranging the first light-shielding member 3 described later. For example, if the width of the first groove 1c is small, the flow speed of the resin can be slowed down, and if the width of the first groove 1c is large, the flow speed of the resin can be increased. This makes it possible to reduce the occurrence of voids in the first light-shielding member 3.

[0027] In element mounting area A, the size may be such that only one light-emitting element can be mounted, or it can be set to a size that can accommodate two or more light-emitting elements, for example, 2x2, 2x3, 3x3, 4x5, etc. Figures 2B and 2C show, for example, a state in which four element mounting areas A, each capable of mounting 3x3 light-emitting elements, are arranged.

[0028] Optionally, a non-penetrating third groove 1d may be formed in the translucent sheet 1 when forming the first groove 1c or before or after forming it, in order to define an area for mounting one or more light-emitting elements within one or more element mounting areas A. The third groove 1d may be the same depth as the first groove 1c, or it may be deeper or shallower than the first groove 1c. In particular, it is preferable that the third groove 1d is the same depth as the first groove 1c or deeper than the first groove 1c. This allows the second light-shielding member 4 to be exposed with minimal removal of the translucent sheet 1 when removing a portion of the translucent sheet 1 as described later. For example, if the depth of the third groove 1d is the same as the first groove 1c, the first light-shielding member 3 and the second light-shielding member 4 are exposed from the translucent sheet 1 almost simultaneously. If the depth of the third groove 1d is deeper than the first groove 1c, the first light-shielding member 3 is exposed from the translucent sheet 1 first, and the second light-shielding member 4 is exposed later.

[0029] The third groove 1d is preferably formed such that its bottom is located within the light-transmitting layer 11 or the light-diffusing layer 12, similar to the first groove 1c. By forming the third groove 1d, for example, the light emitted from adjacent light-emitting elements can be separated for each light-emitting element, thereby forming a light-emitting device with high contrast. When multiple third grooves 1d are formed in the same direction within one element mounting area A, the width w1 of the third groove 1d is typically between 10 μm and 60 μm. Furthermore, the distance between the third grooves 1d is preferably equal to or longer than the sum of the length of the light-emitting element in a top view and the length w1, taking into consideration the size of the light-emitting element mounted therein.

[0030] (S3: Placement of light-emitting element 2) As shown in Figure 2D, the light-emitting element 2 is placed on the upper surface of the element mounting area A divided by the first groove 1c, with its light-emitting surface facing the upper surface. Only one light-emitting element 2 may be placed in one element mounting area A, or multiple light-emitting elements 2 may be placed. In particular, when a third groove 1d is formed, it is preferable to place a light-emitting element 2 in each of the areas for mounting light-emitting elements defined by the third groove 1d. This makes it possible to manufacture a light-emitting device with higher contrast.

[0031] The light-emitting element 2 can be bonded to the translucent sheet 1 by directly bonding the light-emitting side, for example, the side opposite to the side on which electrodes 2n and 2p are formed, to the first main surface 1a of the translucent sheet 1, or by using a translucent bonding member or the like. Any material known in the art may be used for the translucent bonding member. The steps of forming a first groove 1c in the translucent sheet 1 (S2), optionally forming a third groove 1d, and placing the light-emitting element 2 (S3) can be performed in any order.

[0032] The light-emitting element 2 is a semiconductor light-emitting element, and known light-emitting elements such as semiconductor lasers and light-emitting diodes can be used. For example, the light-emitting element 2 is a light-emitting diode. The wavelength of light emitted from the light-emitting element 2 can be selected to any wavelength. For example, as a light-emitting element that emits light with wavelengths from blue to green, ZnSe, nitride semiconductor (In x Al y Ga 1-x-y A light-emitting element using GaP (where N is 0 ≤ x, 0 ≤ y, x + y < 1) can be used. Furthermore, a semiconductor light-emitting element containing semiconductors such as GaAlAs and AlInGaP can be used as a light-emitting element emitting red wavelength light. In addition, a semiconductor light-emitting element formed from materials other than those listed above can also be used for light-emitting element 2. The composition of the semiconductor used, the emission color, size, and number of light-emitting elements can be appropriately selected according to the purpose and design specifications. Multiple light-emitting elements may all emit light of the same wavelength, or some or all may emit light of different wavelengths.

[0033] The light-emitting element 2 includes, for example, a translucent support substrate and a semiconductor laminate on the support substrate. The semiconductor laminate includes an active layer and an n-type semiconductor layer and a p-type semiconductor layer sandwiching the active layer. The light-emitting element 2 is made of a nitride semiconductor (In) capable of emitting short-wavelength light. x Al y Ga 1-x-y It is preferable that N (0 ≤ x, 0 ≤ y, x + y < 1) is included. Various emission wavelengths can be selected depending on the semiconductor material and / or its mixed crystallinity.

[0034] The light-emitting element 2 has electrodes 2n and 2p electrically connected to an n-type semiconductor layer and a p-type semiconductor layer, respectively. The light-emitting element 2 has a top surface (hereinafter also referred to as the light-emitting surface), which is the main light-emitting surface, and a bottom surface located on the opposite side of the top surface. The light-emitting element 2 may have positive and negative electrodes on the same side, or it may have positive and negative electrodes on different sides. In particular, it is preferable that the light-emitting element 2 has electrodes 1p and 1n on its bottom surface. With this arrangement of electrodes, the light-emitting element can be flip-chip mounted on a mounting substrate.

[0035] The light-emitting element 2 may have a planar shape that is a polygon such as a triangle, square, or hexagon, or it may be circular or elliptical. In particular, it is preferable that it be rectangular when viewed from above. The size of the light-emitting element can be set as appropriate depending on the desired performance, etc. For example, the shape of the top surface may be a rectangle of 100 μm to 1000 μm × 100 μm to 1000 μm. For example, when multiple light-emitting elements 2 are arranged, all of the multiple light-emitting elements 2 may be the same size and shape, or some or all may be of different sizes and / or shapes.

[0036] (S4: Arrangement of the first light-shielding member 3) As shown in Figure 2E, a first light-shielding member 3 containing a light-reflective material is arranged to cover the first groove 1c on the first main surface 1a of the light-transmitting sheet 1 and the light-emitting element 2. In this case, it is preferable that the first light-shielding member 3 is positioned so as to cover the electrodes 2n and 2p of the light-emitting element 2 with a covering member, as will be described later. The first light-shielding member 3 may be positioned so as to cover the electrodes 2n and 2p of the light-emitting element 2, and then a portion of the thickness direction of the first light-shielding member 3 may be removed so that the electrodes 2n and 2p of the light-emitting element 2 are exposed. Alternatively, together with the second light-shielding member 4, which will be described later, a portion of the thickness direction of the first light-shielding member 3 may be removed so that the electrodes 2n and 2p of the light-emitting element 2 are exposed.

[0037] The arrangement of the first light-shielding member 3 can be formed using known methods such as transfer molding, injection molding, or compression molding using a mold. Alternatively, the material constituting the first light-shielding member 3 may be applied or formed from the first main surface 1a side of the light-transmitting sheet by a method selected from the group consisting of potting, stamping, coating, drawing, and transfer. A method for removing a portion of the thickness direction of the first light-shielding member 3 can be carried out by methods known in the art, such as etching or grinding. Reducing excessive etching or grinding of the surfaces of electrodes 2n and 2p can improve the reliability of the light-emitting element.

[0038] If the first light-shielding member 3 does not cover the electrodes 2n and 2p of the light-emitting element 2, or if the amount of covering is reduced, for example, a mold having an upper mold and a lower mold is prepared, and a translucent sheet 1 with the light-emitting element 2 placed between the upper mold and the lower mold is placed with the electrodes 2n and 2p of the light-emitting element 2 covered by the covering member. Then, the material for the first light-shielding member is supplied into the mold, and after the material for the first light-shielding member is cured, the covering member is removed and the first light-shielding member that covers the inside of the first groove 1c and the light-emitting element 2 is placed. By using such a method, the surfaces of the electrodes 2n and 2p of the light-emitting element 2 can be exposed or partially exposed from the first light-shielding member 3 when the first light-shielding member 3 is placed. As a result, the step of removing the first light-shielding member 3 can be omitted, and even if a small amount of the first light-shielding member has accumulated, it can be removed by grinding the first light-shielding member together with the second light-shielding member in the step of placing the second light-shielding member described later. This simplifies the manufacturing method.

[0039] As described above, if a third groove 1d is formed within the element mounting region A, it is preferable to also place the first light-shielding member 3 in the third groove 1d. This makes it possible to manufacture a light-emitting device with higher contrast. The first light-shielding member 3 may be, for example, a resin exemplified by the translucent resin described above, containing a light-reflective substance, such as titanium dioxide, aluminum oxide, silicon dioxide, or zinc oxide. The average particle size of the light-reflective substance may be, for example, 0.05 μm or more and 30 μm or less. The content of the light-reflective substance in the resin can be arbitrarily set depending on the material used.

[0040] (S5: Formation of the second groove 3a) Figure 2F is a schematic plan view of the translucent sheet 1 after the second groove 3a has been formed, and Figure 2G is a cross-sectional view taken along the line IIG-IIG in Figure 2F. As shown in Figures 2F and 2G, in a top view, a portion of the first light-shielding member 3, which is positioned in the first groove 1c, is removed from the first main surface 1a side of the translucent sheet 1 to form the second groove 3a leading to the translucent sheet 1. At this time, with the first light-shielding member 3 positioned on the side surface of the light-emitting element 2, a portion of the first light-shielding member 3 in the thickness direction is removed. The second groove 3a may be formed only in a portion of the area surrounding the element mounting area A within the first groove 1c, but it is preferable to form it in the area that surrounds the entire area, as shown in Figure 2F.

[0041] The width W2 of the second groove 3a can be, for example, 150 μm or more and 400 μm or less, and preferably 200 μm or more and 300 μm or less. From another viewpoint, it is preferable to set the width of the second groove 3a so that the first light-shielding member 3 covers the side surface of the light-emitting element 2 with a thickness of 30 μm or more and 100 μm or less, and it is more preferable to set the width of the second groove 3a so that it covers with a thickness of 50 μm or more and 80 μm or less. The depth of the second groove 3a is not particularly limited, but it is preferable that the bottom of the second groove 3a is approximately the same depth as the bottom of the first groove 1c. The width and / or depth of the second groove 3a do not have to be the same throughout.

[0042] The second groove 3a can be formed in the same manner as the first groove 1c. For example, if the second groove 3a is formed only in a part of the area surrounding the element mounting area A within the first groove 1c, it may be arranged so as to be separated from each other at the corners of the element mounting area A, as shown in Figure 2H. In this case, the width or size of the second groove 3a can be set arbitrarily.

[0043] (S6: Arrangement of the second light-shielding member 4) As shown in Figure 2I, a second light-shielding member 4 containing a light-absorbing material is placed in the second groove 3a so as to cover the side surface of the first light-shielding member 3. In this case, the second light-shielding member 4 is positioned to cover the electrodes 2n and 2p of the light-emitting element 2, and then, as shown in Figure 2J, a portion of the second light-shielding member 4 in the thickness direction may be removed so that the electrodes 2n and 2p of the light-emitting element 2 are exposed. Alternatively, the second light-shielding member 4 may be molded so as not to cover the electrodes 2n and 2p of the light-emitting element 2, as shown in Figure 2J.

[0044] In the step of arranging the first light-shielding member 3, the second light-shielding member 4 may be arranged while the first light-shielding member 3 is still covering the electrodes 2n and 2p of the light-emitting element 2. In that case, when removing the second light-shielding member 4, the first light-shielding member 3, which is positioned on the electrodes 2n and 2p, is removed. The arrangement of the second light-shielding member 4 can be formed using known methods such as transfer molding, injection molding, or compression molding using a mold. Alternatively, the material constituting the second light-shielding member 4 may be applied or formed from the first main surface 1a side of the light-transmitting sheet by a method selected from the group consisting of potting, stamping, coating, drawing, and transfer. The removal of the second light-shielding member 4, and optionally the removal of the first light-shielding member 3, can be carried out by methods known in the art, such as etching or grinding.

[0045] The second light-shielding member 4 is preferably made of a resin exemplified above as the material for the first light-shielding member 3, with a light-absorbing substance having a dark color, such as black or gray. Examples of light-absorbing substances include pigments, carbon black, and titanium black. The average particle size of the light-absorbing substance is, for example, 0.05 μm to 30 μm. The content of carbon black or the like in the resin can be arbitrarily set depending on the material used.

[0046] The second light-shielding member 4 is preferably made of a material with higher hardness and / or lower tackiness than the first light-shielding member 3. Materials with high hardness and / or low tackiness can be selected, for example, from the resin constituting the second light-shielding member, which has such properties, or by adjusting the hardness and / or tackiness using additives such as glass fillers. By making the second light-shielding member 4 hard and / or low tackiness, the hard and / or low-tack material of the second light-shielding member 4 can be placed on the outermost surface of the resulting light-emitting device. As a result, as will be described later, when transporting and sorting a large number of light-emitting devices during the assembly process of the light-emitting device, adhesion between the light-emitting devices can be prevented, thereby improving the assembly work.

[0047] Thereafter, a conductive film may be optionally formed on the exposed electrodes 2n and 2p. The conductive film can be made of any conductive material, such as copper, aluminum, gold, silver, platinum, titanium, tungsten, palladium, iron, nickel, or alloys containing these metals. The conductive film can be formed, for example, by sputtering or vapor deposition. The thickness of the conductive film can be appropriately set depending on the performance to be obtained and the materials used. By forming such a conductive film, it is possible to substantially increase the surface area of ​​the electrodes 2n and 2p of the light-emitting element 2 exposed from the first light-shielding member 3 and the second light-shielding member 4, thereby ensuring or improving connectivity to a substrate or the like.

[0048] (S7: Removal of a portion of the translucent sheet 1) As shown in Figure 2K, a portion of the translucent sheet 1 in the thickness direction is removed from the second main surface 1b side of the translucent sheet 1 so that the second light-shielding member 4, which is located in the second groove 3a, is exposed. If a third groove 1d is formed in the translucent sheet 1, it is preferable to expose the first light-shielding member 3, which is located in the third groove 1d. By removing a portion of the translucent sheet 1 in the thickness direction in this way, the translucent sheet 1 can be separated into element mounting regions A. Furthermore, if a third groove 1d is formed, a translucent member 1A can be placed for each light-emitting element 2 within the element mounting region A.

[0049] The translucent sheet 1 can be removed by methods known in the art, such as etching or grinding, and it is preferable to flatten the surface from which a portion of the translucent sheet 1 in the thickness direction has been removed. It is even more preferable to flatten the surface from which a portion of the translucent sheet 1 in the thickness direction has been removed so that it is flush with the first light-shielding member 3 and the second light-shielding member 4. However, it may have fine irregularities. Here, irregularities refer to irregularities of about ±5% of the thickness of the translucent sheet 1.

[0050] Alternatively, as shown in Figure 2N, the upper surface of the second light-shielding member 4 may be positioned higher in the height direction than the upper surface of the first light-shielding member 3 and the upper surface of the translucent sheet 1 from which a portion in the thickness direction has been removed. Such arrangement of the second light-shielding member 4 can be achieved, for example, by the difference in the amount that can be removed in a certain period of time by the known method of removing the translucent sheet 1 described above, when the second light-shielding member 4 has a higher hardness than the first light-shielding member 3. Furthermore, because the light-emitting surface of the light-emitting element is positioned lower than the second light-shielding member 4 due to the shape of the second light-shielding member 4, when the lens 31 is positioned above the light-emitting device in the light-emitting module 30 as shown in Figure 6, the intake of light into the lens 31 can be improved, which can contribute to the improvement of yellow rolling, etc.

[0051] Furthermore, if the third groove 1d is shallower than the first groove 1c and / or the second groove 3a, and the hardness of the second light-shielding member 4 is high, then when the translucent sheet 1 is removed, for example by polishing, the second light-shielding member 4 will be exposed first, making it easy to recognize when the end point of polishing has been reached, and thus improving thickness accuracy.

[0052] (S8: Division of the second light-shielding member 4) Figure 2L is a diagram showing the light-emitting device 10 divided into sections, and Figure 2M is a schematic plan view of Figure 2L. In a top view, the device is divided at a position passing through the second light-shielding member 4 to obtain the light-emitting device 10 as shown in Figures 2L and 2M. This division can be performed using a dicing blade or by known methods such as laser beam irradiation. For example, the light-emitting device 10 can be rectangular in shape when viewed from above. Furthermore, the second light-shielding member 4 may be divided such that the width of the second light-shielding member 4 located on one side of the light-emitting device differs from the width of the second light-shielding member 4 located on the other side. In this way, by dividing the second light-shielding member at a position passing through the second light-shielding member 4, a light-emitting device 10 can be formed having a structure in which the first light-shielding member 3 and the second light-shielding member 4 are stacked in this order on the side surface of the light-emitting device 10, as shown in Figures 2L and 2M.

[0053] In the light-emitting device 10, the arrangement of the second light-shielding member 4 can improve light contrast and reduce lateral light leakage. The thickness of the first light-shielding member 3 and the second light-shielding member 4 in the light-emitting device 10 can be adjusted according to the desired characteristics of the light-emitting device. For example, to improve light extraction efficiency, the thickness of the first light-shielding member 3 and the second light-shielding member 4 can be set to 95:5 to 60:40. To further improve contrast and / or reduce lateral light leakage, the thickness can be set to 40:60 to 5:95. To improve light extraction and contrast, the thickness can be set to 60:40 to 40:60.

[0054] In the manufacturing method of the light-emitting device shown in Figures 1 and 2A to 2M, the first light-shielding member 3 and the second light-shielding member 4 can be easily arranged on the side of the light-emitting device 10, taking into consideration the desired characteristics. As a result, in particular, lateral light leakage can be reduced, improving light extraction from the light extraction surface, and a light-emitting device with high contrast can be manufactured. Furthermore, regardless of the number of light-emitting elements, the light emission state of the entire light-emitting device 10 can be made uniform or nearly uniform, reducing unevenness in light emission. Moreover, a light-emitting device can be manufactured that can improve color unevenness caused by light emitted from the side of the light-emitting device.

[0055] Furthermore, when the obtained light-emitting device 10 is assembled into a light-emitting module or the like shown in Figure 6, sorting of the light-emitting devices may be performed using a sorting device, for example. In this case, work efficiency can be improved and the yield of the process can be increased. Specifically, the sorting device may include a transport unit that transports each light-emitting device in one direction, a posture alignment unit that aligns the orientation of the transported light-emitting devices, an inclined sliding surface located between the transport unit and the posture alignment unit, and a sorting unit that sorts the light-emitting devices after the posture alignment unit. Furthermore, the transport unit may have a function to align the light-emitting devices 10 by vibration, such as that of a ball feeder.

[0056] Furthermore, when using such a device, the second light-shielding member 4 in the light-emitting device 10 is formed such that the width of the second light-shielding member 4 located on one side of the light-emitting device 10 is different from the width of the second light-shielding member 4 located on the other side. This allows the orientation of the light-emitting device 10 to be determined based on the second light-shielding member 4 of the different widths. As a result, for example, the accuracy of aligning the light-emitting devices 10 to a predetermined orientation in a transport unit, orientation arrangement unit, etc., can be improved. In addition, if the second light-shielding member 4 has higher hardness and / or lower tackiness than the first light-shielding member 3, the second light-shielding member 4 will be located on the outer surface of the light-emitting device 10. Therefore, when moving the light-emitting devices on an inclined sliding surface, adhesion between the light-emitting devices can be reduced, and the sliding of the light-emitting devices on the inclined sliding surface can be improved. This makes it possible to improve the process yield in the assembly process of the light-emitting devices.

[0057] (Light-emitting module 30) As shown in Figure 6, the light-emitting module 30 of the first embodiment comprises a light-emitting device 10, a lens 31 disposed on the light-emitting device 10, and a mounting substrate 32 on which the light-emitting device 10 is mounted. The lens 31 can be a convex lens, a concave lens, a Fresnel lens, or any other lens that performs various functions. Furthermore, the housing or substrate 33 may be provided to support the lens 31.

[0058] The mounting substrate 32 can be a mounting substrate known in the art, having a wiring layer on its surface. The wiring layer may be formed, for example, to enable local dimming of the light-emitting elements in segment units.

[0059] Thus, when the light-emitting device 10 of this disclosure is used in a light-emitting module, especially when used in combination with a lens, such as a convex lens, it is possible to reduce color unevenness, brightness unevenness, light emission unevenness, yellow ring, etc., when viewed from above the light-emitting module. Furthermore, it is possible to enhance the design and improve the appearance when the light is not illuminated.

[0060] [Manufacturing method for a light-emitting device according to the second embodiment] A method for manufacturing the light-emitting device 10A according to the second embodiment will be described with reference to Figures 3 and 4A to 4J. Figure 3 is a flowchart showing a method for manufacturing the light-emitting device 10A according to the second embodiment. As shown in Figure 3, the method for manufacturing the light-emitting device 10A according to this embodiment includes a step S1 for preparing a light-transmitting sheet, a step S12 for forming a first recess, a step S3 for arranging a light-emitting element, a step S14 for arranging a first light-shielding member, a step S15 for forming a second recess in the first light-shielding member within the first recess, a step S16 for arranging a second light-shielding member within the second recess, a step S17 for removing a part of the light-transmitting sheet, and a step S18 for dividing the second light-shielding member to obtain the light-emitting device.

[0061] This manufacturing method allows for the easy placement of a first light-shielding member containing a light-reflective material and a second light-shielding member containing a light-absorbing material on the side surface of the light-emitting element. In particular, by placing the first light-shielding member on the side surface of the light-emitting element, the light emitted from the light-emitting element can be efficiently reflected by the first light-shielding member and extracted upwards. Furthermore, by placing the second light-shielding member on the outer circumference of the first light-shielding member, for example, light emitted from the light-emitting element that passes through the first light-shielding member and unintentionally exits to the side of the light-emitting device can be absorbed by the second light-shielding member, thereby improving the contrast of the light-emitting device.

[0062] Furthermore, regardless of the number of light-emitting elements, the appearance of the light-emitting device when viewed from above can be improved, and the overall light emission state of the light-emitting device 10A can be made uniform or nearly uniform, thereby reducing unevenness in light emission. Moreover, the light emitted from the sides of the light-emitting device can be reduced, making it possible to manufacture a light-emitting device 10A with less color unevenness.

[0063] (S1: Preparation of the translucent sheet 21) First, prepare the translucent sheet 21 as shown in Figure 4A. The translucent sheet 21 has a first main surface 21a and a second main surface 21b located on the opposite side of the first main surface 21a, and a diffusion sheet 26 and a phosphor sheet 25 are arranged in order from the second main surface 21b side. The diffusion sheet 26 and the phosphor sheet 25 are, for example, similar to the light diffusion layer 12 and the light-transmitting layer 11 containing the phosphor described above. The material of the light-transmitting sheet 21 is one that transmits 60% or more of the light emitted from the light-emitting element.

[0064] (S12: Formation of the first recess 21c in the translucent sheet 21) As shown in Figure 4B, a first recess 21c is formed on the first main surface 21a of the translucent sheet 21. The first recess 21c is formed on the first main surface 21a of the translucent sheet 21 at a position that surrounds one or more element mounting areas A for mounting pre-set light-emitting elements when viewed from above. Preferably, the first recess 21c is formed as a non-penetrating recess that does not penetrate the diffusion sheet 26, with its bottom positioned within the diffusion sheet 26.

[0065] The first recess 21c defines the phosphor sheet 25 into an inner phosphor portion 25I located within one or more element mounting regions A, and an outer phosphor portion 25O located outside the inner phosphor portion 25I via the first recess 21c, i.e., outside the element mounting region A. The width of the first recess 21c can be set arbitrarily. If there are multiple element mounting regions A, the distance between the element mounting regions A only needs to be equal to or greater than the width of one first recess 21c, for example, 600 μm or less. The first recess 21c can be formed using the same method as the first groove in S2.

[0066] When forming the first recess 21c, or before or after such formation, a third recess 21d may be further formed to define the inner phosphor portion 25I located within the element mounting region A for each region on which one or more light-emitting elements are mounted. The third recess 21d is preferably formed as a non-penetrating recess that does not penetrate the diffusion sheet 26, similar to the first recess 21c, with its bottom positioned within the diffusion sheet 26.

[0067] (S3: Placement of light-emitting element 2) As shown in Figure 4C, the light-emitting element 2 is placed on the upper surface of the element mounting area A with its light-emitting surface facing the other, similar to S3 in the first embodiment. In the above case, if a third recess 21d is formed within the element mounting region A, it is preferable to mount the light-emitting element 2 in each of the regions where the light-emitting elements are mounted, that is, in the inner phosphor portion 25I.

[0068] (S14: Arrangement of the first light-shielding member 23) As shown in Figure 4D, a first light-shielding member 23 containing a light-reflective material is arranged on the first main surface 21a of the translucent sheet 21 so as to cover the light-emitting element 2 and the outer phosphor portion 25O within the first recess 21c. The material and arrangement of the first light-shielding member 23 can be the same as those used in S4 of the first embodiment.

[0069] (S15: Formation of the second recess 23a) As shown in Figure 4E, a portion of the first light-shielding member 23, which is positioned on the outer phosphor portion 25O, is removed from the first main surface side, and a second recess 23a is formed such that, in a top view, the first light-shielding member 23 that covers the side surface of the light-emitting element 2 remains. The width of the second recess 23a can be appropriately set depending on the size of the light-emitting element, the size of the light-emitting device to be formed, etc. Here, it is preferable that the second recess 23a be formed as a non-penetrating recess that does not penetrate the phosphor sheet 25, with its bottom positioned inside the phosphor sheet 25, that is, inside the outer phosphor portion 25O. The second recess 23a can be formed in the same manner as the second groove 3a in S5.

[0070] (S16: Arrangement of the second light-shielding member 24) As shown in Figure 4F, a second light-shielding member 24 containing a light-absorbing material is placed in the second recess 23a so as to cover the side surface of the first light-shielding member 23. The arrangement of the second light-shielding member 24 can be the same as the arrangement of the second light-shielding member in S6.

[0071] The second light-shielding member 24 may be positioned to cover the electrodes 2n and 2p of the light-emitting element 2, but it is preferable to position it so that the electrodes 2n and 2p of the light-emitting element 2 are exposed, as shown in Figure 4G. By positioning it in this way, the surfaces of the electrodes 2n and 2p of the light-emitting element 2 and the upper surface of the second light-shielding member 24 can be flush or nearly flush.

[0072] (S17: Removal of a portion of the translucent sheet 21) As shown in Figure 4H, a portion of the light-transmitting sheet 21 is removed from the second main surface 21b side of the light-transmitting sheet 21 so that the first light-shielding member 23, which is located in the first recess 21c, is exposed. The partial removal of the translucent sheet 21 here can be carried out in the same way as the partial removal of the translucent sheet 1 in S7.

[0073] (S18: Division of the second light-shielding member 24) In a top view, at position X1 passing through the second light-shielding member 24, the second light-shielding member 24, the outer phosphor portion 25O, and the diffusion sheet 26 are separated as shown in Figure 4I. This allows the light-emitting device 10A to be obtained as shown in Figure 4J. In the light-emitting device 10A, a translucent member 21A is placed on each of the multiple light-emitting elements 2, and the first light-shielding member 23 covers the sides of the light-emitting elements 2 and the translucent member 21A. The upper surface of the first light-shielding member 23 is flush or nearly flush with the upper surface of the translucent member 21A on the light-emitting elements 2. Furthermore, the outer surface of the light-emitting device 10A has the second light-shielding member 24, the outer phosphor portion 25O, and the diffusion sheet 26 arranged in this order. In addition, in the light-emitting device 10A, the first light-shielding member 23 and the second light-shielding member 24 are arranged flush or nearly flush with the electrodes 2n and 2p of the light-emitting elements 2.

[0074] The light-emitting device 10A obtained in this manner can ensure work efficiency and / or handling, similar to the light-emitting device 10 described above, and a light-emitting device with good work efficiency and / or handling can be manufactured using a simple manufacturing method.

[0075] <Modified form of the second embodiment> (S15: Formation of the second recess 23aa) The second recess 23a shown in Figure 4E can be formed on the outer phosphor portion 25O as a non-penetrating recess that does not penetrate, as shown in Figure 5A, with its bottom positioned within the first light-shielding member 23.

[0076] (S16: Arrangement of the second light-shielding member 24) Subsequently, as shown in Figure 5B, a second light-shielding member 24 containing a light-absorbing material is placed in the second recess 23aa. The second light-shielding member 24 can be positioned in the same way as the second light-shielding member in S6.

[0077] (S17: Removal of a portion of the translucent sheet 21) As shown in Figure 5C, a portion of the light-transmitting sheet 21 is removed from the second main surface 21b side of the light-transmitting sheet 21 so that the first light-shielding member 23, which is located in the first recess 21c, is exposed. The partial removal of the translucent sheet 21 here can be carried out in the same way as the partial removal of the translucent sheet 1 in S7.

[0078] (S18: Division of the second light-shielding member 24) As shown in Figure 5D, in a top view, the second light-shielding member 24, the first light-shielding member 23, the outer phosphor portion 25O, and the diffusion sheet 26 are separated at position X2 passing through the second light-shielding member 24. This makes it possible to obtain the light-emitting device 10B as shown in Figure 5E.

[0079] The light-emitting device 10B has a translucent member 21A placed on each of the multiple light-emitting elements 2, and a first light-shielding member 23 covers the sides of the light-emitting elements 2 and the translucent member 21A. The upper surface of the first light-shielding member 23 is flush or nearly flush with the upper surface of the translucent member 21A on the light-emitting elements 2. Furthermore, the outer surface of the light-emitting device 10B has a second light-shielding member 24, a first light-shielding member 23, an outer phosphor section 25O, and a diffusion sheet 26 arranged in this order. By providing the first light-shielding member 23 between the second light-shielding member 24 and the outer phosphor section 25O, the propagation of light emitted from the light-emitting elements 2 can be made uniform, and color unevenness can be suppressed. Furthermore, in the light-emitting device 10B, the first light-shielding member 23 and the second light-shielding member 24 are arranged flush or substantially flush with the electrodes 2n and 2p of the light-emitting element 2.

[0080] The light-emitting device 10B obtained in this manner can ensure the same work efficiency and / or handling as the light-emitting devices 10 and 10A described above, and in this way, a light-emitting device with good work efficiency and / or handling can be manufactured using a simple manufacturing method. [Industrial applicability]

[0081] The light-emitting device and light-emitting module disclosed herein can be used as a flash light source for cameras, headlights for vehicles, backlights for liquid crystal displays, and various lighting fixtures.

[0082] In addition to the embodiments described above, the following inventions are further disclosed. (Note 1) A step of preparing a translucent sheet having a first main surface and a second main surface located on the opposite side of the first main surface, In a top view, the process involves forming a non-penetrating first groove at a position surrounding one or more element mounting areas on the first main surface, A step of arranging a light-emitting element on the upper surface of the element mounting area with the light-emitting surface facing it, A step of arranging a first light-shielding member containing a light-reflective material on the first main surface so as to cover the inside of the first groove and the light-emitting element, A step of forming a second groove leading to the light-transmitting sheet, such that the first light-shielding member disposed in the first groove is removed from the first main surface side, and the first light-shielding member that covers the side surface of the light-emitting element in a top view remains; The process involves placing a second light-shielding member containing a light-absorbing material within the second groove so as to cover the side surface of the first light-shielding member, A step of removing a portion of the light-transmitting sheet from the second main surface side of the light-transmitting sheet so that the second light-shielding member disposed in the second groove is exposed, A method for manufacturing a light-emitting device, comprising the step of dividing the device at a position passing through the second light-shielding member in a top view to obtain a light-emitting device. (Note 2) The method for manufacturing a light-emitting device according to Appendix 1, wherein, in the step of arranging the second light-shielding member, a portion of the first light-shielding member, the second light-shielding member, and the electrodes arranged on the electrodes of the light-emitting device are further removed. (Note 3) In the step of arranging the first light-shielding member, Prepare a mold having an upper mold and a lower mold. A method for manufacturing a light-emitting device according to Appendix 1 or 2, wherein a translucent sheet on which the light-emitting element is arranged is placed between the upper mold and the lower mold, and the electrodes of the light-emitting element are covered with a covering member, a resin material is supplied into the mold, the resin material is cured, and then the covering member is removed and the first light-shielding member that covers the first groove and the light-emitting element is placed. (Note 4) In the process of forming two consecutive grooves, A method for manufacturing a light-emitting device according to any one of the appendices 1 to 3, wherein the second groove is formed in part or all of the region surrounding the element mounting area when viewed from above. (Note 5) In the process of forming the following groove, Within the one or more element mounting regions, a non-penetrating third groove is formed that is deeper than the depth of the first groove that defines the one or more element mounting regions into a plurality of element mounting regions. In the step of arranging the first light-shielding member, A method for manufacturing a light-emitting device according to any one of the appendices 1 to 4, wherein the first light-shielding member is also placed in the third groove within the element mounting area. (Note 6) In the step of arranging the second light-shielding member, The second light-shielding member is made of a material with higher hardness than the first light-shielding member. In the step of removing a portion of the light-transmitting sheet, A method for manufacturing a light-emitting device according to any one of the appendices 1 to 5, wherein the upper surface of the second light-shielding member is located higher in the height direction than the upper surface of the first light-shielding member and the upper surface of the light-transmitting sheet. (Note 7) In the process of forming the following groove, In a top view, the first groove is formed at a position surrounding the one or more rectangular element mounting regions, each having a pair of first sides and a pair of second sides. A method for manufacturing a light-emitting device according to any one of the appendices 1 to 6, wherein the width of the first groove located on the first side is different from the width of the first groove located on the second side. (Note 8) In the step of arranging the second light-shielding member, A method for manufacturing a light-emitting device according to any one of the appendices 1 to 7, wherein the second light-shielding member has lower tackiness than the first light-shielding member. (Note 9) In the step of arranging the light-emitting element, The light-emitting device is rectangular in shape when viewed from above. A method for manufacturing a light-emitting device according to any one of the appendices 1 to 8, wherein in the step of obtaining the light-emitting device, the second light-shielding member is cut such that the width of the second light-shielding member arranged on one side of the light-emitting device is different from the width of the second light-shielding member arranged on the other side. (Note 10) A step of preparing a translucent sheet having a first main surface and a second main surface located opposite the first main surface, wherein a diffusion sheet and a phosphor sheet are arranged in order from the second main surface side, In a top view, a non-penetrating first recess is formed at a position surrounding one or more element mounting areas on the first main surface, and the phosphor sheet is defined as an inner phosphor portion located in the one or more element mounting areas and an outer phosphor portion located outside the inner phosphor portion via the first recess, A step of arranging a light-emitting element on the upper surface of the element mounting area with the light-emitting surface facing it, The process involves placing a first light-shielding member containing a light-reflective material on the first main surface so as to cover the inside of the first recess, the light-emitting element, and the outer phosphor portion. The steps include removing the first light-shielding member disposed on the outer phosphor portion from the first main surface side, and forming a second recess such that the first light-shielding member remains covering the side surface of the light-emitting element when viewed from above, The process involves placing a second light-shielding member containing a light-absorbing material within the second recess so as to cover the side surface of the first light-shielding member, A step of removing a portion of the light-transmitting sheet from the second main surface side of the light-transmitting sheet so that the first light-shielding member disposed in the first recess is exposed, A method for manufacturing a light-emitting device, comprising the step of dividing the device at a position passing through the second light-shielding member in a top view to obtain a light-emitting device. (Note 11) In the process of forming the two recesses described above, A method for manufacturing a light-emitting device according to Appendix 10, wherein the second recess is formed such that the bottom of the second recess is located within the phosphor sheet. (Note 12) In the process of forming the two recesses described above, A method for manufacturing a light-emitting device according to appendix 10 or 11, wherein the second recess is formed such that the bottom of the second recess is located within the first light-shielding member. [Explanation of symbols]

[0083] 1. Translucent sheet 1A, 21A Translucent member 1a, 21a 1st main surface 1b, 21b 2nd principal surface 1c 1st groove 1d 3rd groove 2 light-emitting elements 2n, 2p electrode 3.23 First light-shielding member 3a 2nd groove 4.24 Second light-shielding member 10, 10A, 10B Light-emitting devices 11 Translucent layer 12 Light Diffusion Layer 21 Translucent Sheet 21c First recess 21d Third recess 23a, 23aa Second recess 25 Phosphor Sheets 25I Inner phosphor section 25O outer phosphor part 26 Diffusion Sheets 30 Light-emitting modules 31 lenses 32 Implemented circuit boards 33 circuit boards A Element mounting area

Claims

1. A step of preparing a translucent sheet having a first main surface and a second main surface located on the opposite side of the first main surface, The process involves forming a non-penetrating first groove at a position surrounding one or more element mounting areas on the first main surface in a top view, A step of arranging a light-emitting element on the upper surface of the element mounting area with the light-emitting surface facing it, The process involves placing a first light-shielding member containing a light-reflective material on the first main surface so as to cover the inside of the first groove and the light-emitting element, A step of forming a second groove leading to the light-transmitting sheet, such that the first light-shielding member disposed in the first groove is removed from the first main surface side, and the first light-shielding member that covers the side surface of the light-emitting element in a top view remains; The process involves placing a second light-shielding member containing a light-absorbing material in the second groove so as to cover the side surface of the first light-shielding member, A step of removing a portion of the light-transmitting sheet from the second main surface side of the light-transmitting sheet so that the second light-shielding member disposed in the second groove is exposed, A method for manufacturing a light-emitting device, comprising the step of dividing the device at a position passing through the second light-shielding member in a top view to obtain a light-emitting device.

2. The method for manufacturing a light-emitting device according to claim 1, wherein in the step of arranging the second light-shielding member, a portion of the first light-shielding member, the second light-shielding member, and the electrodes arranged on the electrodes of the light-emitting device are further removed.

3. In the step of arranging the first light-shielding member, Prepare a mold having an upper mold and a lower mold. A method for manufacturing a light-emitting device according to claim 1, wherein a translucent sheet on which the light-emitting element is arranged is placed between the upper mold and the lower mold, and with the electrodes of the light-emitting element covered with a covering member, a resin material is supplied into the mold, the resin material is cured, and then the covering member is removed and the first light-shielding member that covers the first groove and the light-emitting element is placed.

4. In the process of forming the two adjacent grooves, The method for manufacturing a light-emitting device according to claim 1, wherein the second groove is formed in part or all of the region surrounding the element mounting region when viewed from above.

5. In the process of forming the aforementioned groove, Within the one or more element mounting regions, a non-penetrating third groove is formed that is deeper than the depth of the first groove that defines the one or more element mounting regions into a plurality of element mounting regions. In the step of arranging the first light-shielding member, The method for manufacturing a light-emitting device according to claim 1, wherein the first light-shielding member is also placed in the third groove within the element mounting area.

6. In the step of arranging the second light-shielding member, The second light-shielding member is made of a material with higher hardness than the first light-shielding member. In the step of removing a portion of the light-transmitting sheet, The method for manufacturing a light-emitting device according to claim 1, wherein the upper surface of the second light-shielding member is located higher in the height direction than the upper surface of the first light-shielding member and the upper surface of the light-transmitting sheet.

7. In the process of forming the aforementioned groove, In a top view, the first groove is formed at a position surrounding the one or more rectangular element mounting regions, each having a pair of first sides and a pair of second sides. The method for manufacturing a light-emitting device according to claim 1, wherein the width of the first groove located on the first side is different from the width of the first groove located on the second side.

8. In the step of arranging the second light-shielding member, The method for manufacturing a light-emitting device according to claim 1, wherein the second light-shielding member has lower tackiness than the first light-shielding member.

9. In the step of arranging the light-emitting element, The light-emitting device is rectangular in shape when viewed from above. A method for manufacturing a light-emitting device according to claim 1, wherein, in the step of obtaining the light-emitting device, the second light-shielding member is cut such that the width of the second light-shielding member arranged on one side of the light-emitting device is different from the width of the second light-shielding member arranged on the other side.

10. A step of preparing a translucent sheet having a first main surface and a second main surface located opposite the first main surface, wherein a diffusion sheet and a phosphor sheet are arranged in order from the second main surface side, In a top view, a non-penetrating first recess is formed at a position surrounding one or more element mounting areas on the first main surface, and the phosphor sheet is defined into an inner phosphor portion located in the one or more element mounting areas and an outer phosphor portion located outside the inner phosphor portion via the first recess, A step of arranging a light-emitting element on the upper surface of the element mounting area with the light-emitting surface facing it, The process involves placing a first light-shielding member containing a light-reflective material on the first main surface so as to cover the inside of the first recess, the light-emitting element, and the outer phosphor portion. The steps include removing the first light-shielding member disposed on the outer phosphor portion from the first main surface side, and forming a second recess such that the first light-shielding member remains covering the side surface of the light-emitting element when viewed from above, The process involves placing a second light-shielding member containing a light-absorbing material within the second recess so as to cover the side surface of the first light-shielding member, A step of removing a portion of the light-transmitting sheet from the second main surface side of the light-transmitting sheet so that the first light-shielding member disposed in the first recess is exposed, A method for manufacturing a light-emitting device, comprising the step of dividing the device at a position passing through the second light-shielding member in a top view to obtain a light-emitting device.

11. In the process of forming the two recesses described above, The method for manufacturing a light-emitting device according to claim 10, wherein the second recess is formed such that the bottom of the second recess is located within the phosphor sheet.

12. In the process of forming the two recesses described above, The method for manufacturing a light-emitting device according to claim 10, wherein the second recess is formed such that the bottom of the second recess is located within the first light-shielding member.

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