Method for manufacturing a liquid dispensing head, and liquid dispensing head

Abstract

The objective is to provide a method for manufacturing a liquid dispensing head that can fix an element substrate unit to a support part with high precision. [Solution] A method for manufacturing a liquid dispensing head includes: a coating step of applying a first adhesive for fixing a cover member, a second adhesive for fixing an element substrate, and a third adhesive to a support portion; an activation step of irradiating the second adhesive with light to activate the second adhesive; a placement step of arranging an element substrate unit on the support portion such that the second adhesive is covered by the cover member; a first curing step of curing the first adhesive; and a second curing step of curing the third adhesive. The activation step is performed before the placement step. The second curing step is performed after the first curing step.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a liquid ejection head and a liquid ejection head.

Background Art

[0002] In a liquid ejection head, an element substrate unit including an element substrate on which ejection openings for ejecting liquid are formed may be fixed to a support portion that supports the element substrate unit by an adhesive. In order to ensure good recording quality in the liquid ejection head, it is important that the element substrate unit is fixed to the support portion with high precision.

[0003] Patent Document 1 discloses a method for manufacturing a liquid ejection head using a first photocurable adhesive that cures at room temperature, a second adhesive that cures at a second temperature higher than room temperature, and a third adhesive that cures at a third temperature higher than the second temperature. According to the manufacturing method of Patent Document 1, it is possible to position and bond the element substrate to the support substrate (support portion) with high precision.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] By the way, in Patent Document 1, when the element substrate unit includes a cover member for protecting the element substrate, nothing is mentioned regarding fixing the element substrate unit to the support portion with high precision.

[0006] An object of the present disclosure is to provide a method for manufacturing a liquid ejection head that can fix an element substrate unit to a support portion with high precision.

Means for Solving the Problems

[0007] A method for manufacturing a liquid discharge head, comprising an element substrate unit including an element substrate containing an energy generating element that generates energy for discharging a liquid, a cover member surrounding the element substrate and having an opening that does not cover a discharge port formed on the element substrate for discharging a liquid, and a support portion for supporting the element substrate unit, is characterized in that it includes a coating step of applying a first adhesive for fixing the cover member, a second adhesive and a third adhesive for fixing the element substrate to the support portion, an activation step of irradiating the second adhesive with light to activate the second adhesive, an arrangement step of arranging the element substrate unit on the support portion such that the second adhesive is covered by the cover member, a first curing step of curing the first adhesive, and a second curing step of curing the third adhesive, wherein the activation step is performed before the arrangement step and the second curing step is performed after the first curing step. [Effects of the Invention]

[0008] According to the method for manufacturing a liquid dispensing head of this disclosure, the element substrate unit can be fixed to the support portion with high precision. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic perspective view of a liquid dispensing device applicable to one embodiment. [Figure 2] A schematic perspective view of a liquid dispensing head that can be applied to one embodiment. [Figure 3] A schematic exploded perspective view of a liquid dispensing head applicable to one embodiment. [Figure 4] A schematic exploded perspective view of an element substrate unit applicable to one embodiment. [Figure 5] A schematic cross-sectional perspective view of an element substrate applicable to one embodiment. [Figure 6]A flowchart illustrating a method for manufacturing a liquid dispensing head, applicable to one embodiment. [Figure 7] Diagram explaining S601. [Figure 8] Diagram explaining S602. [Figure 9] Diagram explaining S603. [Figure 10] Diagram explaining S604. [Figure 11] A diagram showing a modified version of S601. [Figure 12] A schematic perspective view of a liquid dispensing head that can be applied to one embodiment. [Figure 13] A schematic exploded perspective view of an element substrate unit applicable to one embodiment. [Figure 14] A schematic diagram of a liquid dispensing head that can be applied to one embodiment. [Modes for carrying out the invention]

[0010] [First Embodiment] <Liquid discharge device 1000> Figure 1 is a schematic perspective view of a liquid dispensing device 1000 that can be applied to this embodiment.

[0011] The X, Y, and Z axes shown in the drawings referenced in the following description represent the coordinate axes of the liquid dispensing device 1000. The X direction indicates the transport direction of the recording medium P. The Y direction indicates the arrangement direction of the discharge ports 11 (see Figure 2(a), etc.) on the element substrate 10 (see Figure 2(a), etc.). The Z direction indicates the discharge direction of the liquid (e.g., ink) by the liquid dispensing head 3. The X direction intersects the Y direction in a plane (orthogonal in this embodiment). The Z direction intersects the X direction and the Y direction (orthogonal in this embodiment).

[0012] The liquid ejection device 1000 shown in FIG. 1 records an image by continuously conveying a recording medium P (e.g., cut paper) in the conveyance direction by a conveyance device 1 and ejecting a liquid (e.g., ink) from a liquid ejection head 3 disposed at a fixed position. As described above, in the present embodiment, as the liquid ejection device 1000, a so-called full-line type inkjet recording device including a liquid ejection head 3 is used. The liquid ejection head 3 is formed with ejection ports 11 for ejecting a liquid (e.g., ink) across the side corresponding to the entire width (length in the X-axis direction) of the recording medium P.

[0013] In the present embodiment, the liquid ejection head 3 corresponds to four colors of cyan (C), magenta (M), yellow (Y), and black (K). Specifically, the liquid ejection head 3 includes a first liquid ejection head 3Ca and a second liquid ejection head 3Cb corresponding to cyan (C) ink. The liquid ejection head 3 includes a third liquid ejection head 3Ma and a fourth liquid ejection head 3Mb corresponding to magenta (M) ink. The liquid ejection head 3 includes a fifth liquid ejection head 3Ya and a sixth liquid ejection head 3Yb corresponding to yellow (Y) ink. The liquid ejection head 3 includes a seventh liquid ejection head 3Ka and an eighth liquid ejection head 3Kb corresponding to black (K) ink.

[0014] The recording medium P is conveyed in the conveyance direction (X direction) by the conveyance device 1. Recording is performed on the recording medium P by the liquid ejection head 3.

[0015] <Liquid ejection head 3> FIG. 2(a) is a schematic perspective view of the bottom surface of the liquid ejection head 3 applicable to the present embodiment as viewed from above.

[0016] As shown in FIG. 2(a), the liquid ejection head 3 includes a head cover 110 that covers the configuration provided inside.

[0017] The liquid discharge head 3 comprises an element substrate 10 containing an energy generating element 6 (see Figure 5(b), etc.) that generates energy for discharging liquid, a cover member 20 that covers the element substrate 10, and a support part 30 that supports the element substrate 10. The cover member 20 is made of a material that does not transmit light.

[0018] In this embodiment, four element substrates 10 are arranged in a staggered pattern. However, the number of element substrates 10 is not limited to four. For example, there may be just one element substrate 10. Each of these element substrates 10 has a discharge port 11 for discharging liquid.

[0019] The cover member 20 surrounds the element substrate 10. The cover member 20 has an opening 21 that does not cover the discharge port 11 for discharging the liquid formed on the element substrate 10. When the cover member 20 is attached to the element substrate 10, the discharge port 11 is exposed through the opening 21.

[0020] The element substrate 10 and the cover member 20 are composed of different materials. Therefore, the element substrate 10 and the cover member 20 have different coefficients of thermal expansion. However, it is desirable that the coefficient of thermal expansion of the cover member 20 be about the same as that of the element substrate 10. Specifically, it is desirable that the coefficient of thermal expansion of the cover member 20 be about 1 to 5 times that of the element substrate 10.

[0021] For example, if the element substrate 10 is made of silicon, it is desirable that the cover member 20 be made of titanium, nickel alloy, stainless steel, tungsten, molybdenum, or ceramics. With this configuration, the coefficient of thermal expansion of the cover member 20 can be kept within a range of approximately 1 to approximately 5 times the coefficient of thermal expansion of the element substrate 10.

[0022] Furthermore, it is desirable that the thickness (length in the Z direction) of the cover member 20 be small. For example, it is desirable that the thickness of the cover member 20 be approximately 0.1 mm or more and approximately 0.2 mm or less. With this configuration, the distance (distance in the Z direction) between the ejection port 11 and the recording medium P during recording can be reduced without the cover member 20 coming into contact with the recording medium P. In this way, by forming the cover member 20 thinly, the accuracy of the position where the liquid lands during recording can be improved compared to when the cover member 20 is formed thickly.

[0023] Figure 2(b) is a schematic perspective view of the top surface of a liquid dispensing head 3 that can be applied to this embodiment.

[0024] As shown in Figure 2(b), a liquid connection part 111 for introducing liquid into the liquid discharge head 3 is provided on the upper part of the head cover 110. The number of liquid connection parts 111 is not limited. When circulating liquid inside the liquid discharge head 3, the liquid connection parts 111 are configured to allow for the introduction and discharge of liquid.

[0025] Figure 3 is a schematic exploded perspective view of a liquid dispensing head 3 that can be applied to this embodiment.

[0026] As shown in Figure 3, the liquid discharge head 3 comprises an element substrate unit 4 including an element substrate 10, a cover member 20, and a flexible wiring board 14.

[0027] With the element substrate unit 4 fixed to the support portion 30, a first adhesive layer containing the first adhesive 50 is provided at a position between the support portion 30 and the cover member 20 where light can be irradiated.

[0028] With the element substrate unit 4 fixed to the support portion 30, a second adhesive layer containing a second adhesive 60 and a third adhesive layer containing a third adhesive 40 are provided in positions between the support portion 30 and the element substrate 10 where light cannot be irradiated.

[0029] The first adhesive 50 is a photocatalytic adhesive that can be cured in a shorter time than the second adhesive 60. Therefore, once the first adhesive 50 has cured, a first adhesive layer containing the photocatalytic adhesive component is formed between the support portion 30 and the cover member 20.

[0030] In this embodiment, an ultraviolet-curing adhesive is used as the first adhesive 50. Therefore, when the first adhesive 50 hardens, a first adhesive layer containing the components of the ultraviolet-curing adhesive is formed between the support portion 30 and the cover member 20.

[0031] On the other hand, the second adhesive 60 is a light-delayed curing adhesive. Therefore, the time it takes for the second adhesive 60 to cure after being irradiated with light is longer than the time it takes for the first adhesive 50 to cure after being irradiated with light. The curing of the second adhesive 60 can be delayed by adding a compound that temporarily traps the protons generated by the decomposition of the initiator. For example, by irradiating the second adhesive 60 with ultraviolet light, protons of the photocationic polymerization initiator are generated. These protons are temporarily trapped by the curing retarder and gradually supplied to the polymerization reaction system. In this way, the curing rate of the second adhesive 60 can be controlled.

[0032] Then, after a certain period of time has elapsed since irradiation with ultraviolet light, acid is generated from the initiator, the acrylic resin reacts, and cationic polymerization occurs, causing the second adhesive 60 to harden. Therefore, once the second adhesive 60 hardens, a second adhesive layer containing components of a light-delayed curing adhesive is formed between the support part 30 and the element substrate 10.

[0033] In this embodiment, an ultraviolet-delayed curing adhesive is used as the second adhesive 60. Therefore, when the second adhesive 60 hardens, a second adhesive layer containing the components of the ultraviolet-delayed curing adhesive is formed between the support portion 30 and the element substrate 10.

[0034] Furthermore, in this embodiment, a thermosetting adhesive is used as the third adhesive 40. Therefore, when the third adhesive 40 hardens, a third adhesive layer containing components of the thermosetting adhesive is provided between the support portion 30 and the element substrate 10.

[0035] Furthermore, the support portion 30 has a channel connected to a channel (described later) formed in the element substrate 10, and a channel opening 31 of the channel. The third adhesive 40 is applied so as to surround the channel opening 31, and therefore has at least liquid resistance. Accordingly, when the third adhesive 40 hardens, a third adhesive layer is provided that is liquid resistant and surrounds the channel opening 31.

[0036] Furthermore, the second adhesive 60 is applied at a position further away from the flow channel opening 31 than the third adhesive 40. Therefore, as the second adhesive 60 hardens, a second adhesive layer is formed at a position further away from the flow channel opening 31 than the third adhesive 40.

[0037] In this embodiment, a recess 32 is formed on the bottom surface 30a (the surface facing the Z direction) of the support portion 30. When the element substrate unit 4 is placed on the support portion 30, the bottom surface 32a of the recess 32 is covered by the cover member 20. Therefore, when the element substrate unit 4 is placed on the support portion 30, the bottom surface 32a of the recess 32 is in a position where it is impossible to irradiate it with light. The second adhesive 60 and the third adhesive 40 are applied to the bottom surface 32a of the recess 32. On the other hand, the first adhesive 50 is applied to the bottom surface 30a of the support portion 30.

[0038] In this embodiment, four element substrate units 4 are arranged in a staggered pattern around one main body 300. However, the number of element substrate units 4 is not limited to four.

[0039] Figure 4 is a schematic exploded perspective view of an element substrate unit 4 that can be applied to this embodiment.

[0040] As shown in Figure 4, the cover member 20 is fixed to the discharge surface of the element substrate 10 where the discharge port 11 is formed. In this embodiment, the cover member 20 is bonded to the discharge surface 10a with an adhesive. Thin plate portions 401 are provided at both ends of the element substrate 10 in the X direction. Each of these thin plate portions 401 is provided with a first electrode portion 51 (see Figure 5(a)) which includes a plurality of electrodes.

[0041] In this embodiment, two flexible wiring boards 14 are attached to one element substrate 10. The flexible wiring board 14 includes a second electrode portion 141 which contains a plurality of electrodes for electrically connecting the flexible wiring board 14 to the element substrate 10.

[0042] By bringing the electrodes of the second electrode section 141 into contact with the electrodes of the first electrode section 51, the element substrate 10 and the flexible wiring board 14 are electrically connected. With the element substrate 10 and the flexible wiring board 14 electrically connected, a drive signal and drive power for driving the energy generating element 6 (see Figure 5(b)) are supplied to the element substrate 10 via the electrical wiring board (not shown) and the flexible wiring board 14. To prevent liquid from entering the electrical connection portion of the flexible wiring board 14 and the element substrate 10, and to protect the element substrate 10, a cover member 20 is fixed to the discharge surface 10a.

[0043] <Internal structure of the element substrate 10> Figure 5(a) is a schematic cross-sectional perspective view of an element substrate 10 that can be applied to this embodiment.

[0044] As shown in Figure 5(a), the element substrate 10 includes a first substrate 220 and a second substrate 230. The first substrate 220 includes a nozzle substrate 201, a liquid chamber substrate 202, and a liquid supply substrate 203. The first substrate 220 is constructed by stacking the liquid supply substrate 203, the liquid chamber substrate 202, and the nozzle substrate 201 in this order.

[0045] The second substrate 230 includes a channel-forming substrate 204 containing an elastic damper film 204D. Inside the pressure chamber 5 formed in the first substrate 220, which includes a liquid supply substrate 203 fixed to the channel-forming substrate 204, the pressure fluctuates when the liquid is discharged. However, the damper film 204D deforms due to the pressure fluctuations generated inside the pressure chamber 5, thereby suppressing the pressure fluctuations generated inside the pressure chamber 5. The element substrate 10 is constructed by stacking the second substrate 230 and the first substrate 220 in this order.

[0046] Figure 5(b) is an enlarged perspective view showing a portion of Figure 5(a).

[0047] As shown in Figure 5(b), in the first substrate 220, the liquid chamber substrate 202 includes an elastic diaphragm 9. With the liquid supply substrate 203, liquid chamber substrate 202, and nozzle substrate 201 stacked in this order, a pressure chamber 5 connected to the discharge port 11 is formed between the nozzle substrate 201 and the liquid supply substrate 203. In each of the multiple pressure chambers 5, the diaphragm 9, which constitutes a part of the liquid chamber substrate 202, functions as a deformable wall. The pressure chamber 5 functions as a flow path connected to the discharge port 11.

[0048] The diaphragm 9 is provided with energy generating elements 6 corresponding to each of the multiple pressure chambers 5. In this embodiment, piezoelectric elements are used as energy generating elements 6. The energy generating elements 6 are positioned to correspond to each of the multiple discharge ports 11. The diaphragm 9 deforms as the energy generating elements 6 are driven by power to discharge the liquid. As the diaphragm 9 deforms, the liquid filled inside the pressure chambers 5 is pressurized. As the liquid filled inside the pressure chambers 5 is pressurized, the liquid is discharged from the discharge ports 11.

[0049] On the liquid chamber substrate 202, a liquid supply substrate 203 is fixed to the surface opposite to the surface fixed to the nozzle substrate 201. The liquid supply substrate 203 has individual supply channels 7 for supplying liquid to the pressure chamber 5 and individual recovery channels 8 for recovering liquid from the pressure chamber 5. With the liquid supply substrate 203, liquid chamber substrate 202, and nozzle substrate 201 stacked in this order, the individual supply channels 7 and individual recovery channels 8 are connected to the pressure chamber 5. The materials constituting the nozzle substrate 201, liquid chamber substrate 202, liquid supply substrate 203, and channel forming substrate 204 each include silicon, etc.

[0050] In the second substrate 230, a connecting channel 15, a common supply channel 27, a common supply connecting passage 17, a common recovery connecting passage 18, and a common recovery channel 28 are formed on the channel-forming substrate 204. The common supply channel 27 is connected to the common supply connecting passage 17. With the second substrate 230 and the first substrate 220 stacked in this order, one common supply connecting passage 17 is connected to a plurality of individual supply channels 7.

[0051] With the second substrate 230 and the first substrate 220 stacked in this order, the multiple individual recovery channels 8 are connected to a single common recovery communication channel 18. The common recovery communication channel 18 is connected to a common recovery channel 28. Liquid that flows from a liquid tank (not shown) that stores liquid into the common supply channel 27 via the connecting channel 15 flows into the individual supply channels 7 via the common supply communication channel 17 and is supplied to the pressure chamber 5.

[0052] When the energy generating element 6 is activated, the liquid supplied to the pressure chamber 5 is discharged from the discharge port 11. The liquid that is not discharged flows into the individual recovery channel 8.

[0053] Furthermore, when the energy generating element 6 is not operating (for example, when circulating to adjust the liquid temperature), all the liquid supplied to the pressure chamber 5 flows into the individual recovery channel 8. The liquid that flows into the individual recovery channel 8 flows into the common recovery channel 28 via the common recovery communication channel 18, and then is recovered into a liquid tank (not shown) via the connecting channel 15.

[0054] <Manufacturing method for liquid dispensing head 3> Figure 6 is a flowchart illustrating a method for manufacturing a liquid dispensing head 3 that can be applied to this embodiment. The symbol "S" in Figure 6 represents a step.

[0055] In step S601, the first adhesive 50, the second adhesive 60, and the third adhesive 40 (see Figure 7, etc.) are applied to the support portion 30.

[0056] Figure 7 is an explanatory diagram of S601. For the sake of explanation, the upward-facing surface in Figure 7 will be referred to as the "bottom surface."

[0057] As shown in Figure 7, a recess 32 is formed on the bottom surface 30a of the support portion 30. A channel opening 31 is formed on the bottom surface 32a of the recess 32, which connects to the connection channel 15 (see Figure 5(b)) when the element substrate unit 4 (see Figure 3, etc.) is placed on the support portion 30. A wiring opening 33 is formed on the bottom surface 32a of the recess 32, which is a through hole through which the flexible wiring board 14 (see Figure 3, etc.) passes when the element substrate unit 4 is placed on the support portion 30.

[0058] On the bottom surface 30a of the support portion 30, with the element substrate unit 4 in place, a first adhesive 50 is applied to the position corresponding to the corner of the cover member 20 (see Figure 3, etc.) to temporarily fix the cover member 20 to the bottom surface 30a.

[0059] In the first adhesive 50, it is preferable that the material hardens immediately upon activation treatment such as light emission. If the first adhesive 50 cannot be hardened immediately, the position of the element substrate unit 4 may shift due to external forces, the weight of the element substrate unit 4, and changes in ambient temperature while the first adhesive 50 is hardening. Therefore, in this embodiment, an ultraviolet-curing adhesive is used as the first adhesive 50. However, the adhesive that can be used as the first adhesive 50 is not limited as long as it is an adhesive that hardens immediately. Examples of adhesives that can be used as the first adhesive 50 include light-curing adhesives such as visible light-curing adhesives.

[0060] By temporarily fixing the cover member 20 to the bottom surface 30a using the first adhesive 50 which can harden quickly, it is possible to suppress misalignment of the element substrate unit 4 while it is being fixed to the support part 30.

[0061] At the bottom surface 32a of the recess 32, a second adhesive 60 for temporarily fixing the element substrate 10 (see Figure 3, etc.) to the bottom surface 32a is applied along the short direction (X direction) to both ends in the longitudinal direction (Y direction).

[0062] Ideally, in order to suppress misalignment of the element substrate unit 4, it is preferable that the second adhesive 60 is also a fast-curing adhesive. However, in this embodiment, the length of the outer circumference of the cover member 20 is longer than the length of the outer circumference of the recess 32. Therefore, when the element substrate unit 4 is in place, the opening of the recess 32 is blocked by the cover member 20. As a result, when the element substrate unit 4 is in place, even if light is irradiated to cure the second adhesive 60, the light is blocked by the cover member 20. Thus, in this embodiment, it is difficult to cure the second adhesive 60 after the element substrate unit 4 has been placed.

[0063] Therefore, in this embodiment, a UV-delayed curing adhesive is used as the second adhesive 60. The UV-delayed curing adhesive is activated when irradiated with ultraviolet light and thickens and hardens after a certain period of time. In this way, by irradiating the UV-delayed curing adhesive used as the second adhesive 60 with ultraviolet light and then placing the element substrate unit 4, it becomes possible to temporarily fix the element substrate 10 to the bottom surface 32a. By temporarily fixing the element substrate 10 in advance at the edge of the bottom surface 32a, displacement of the element substrate unit 4 while it is being fixed in the central part of the bottom surface 32a can be further suppressed.

[0064] Furthermore, the adhesive that can be used as the second adhesive 60 is not limited to an ultraviolet delayed-curing adhesive, as long as it can temporarily fix the element substrate 10. Examples of adhesives that can be used as the second adhesive 60 include light-delayed-curing adhesives such as visible light delayed-curing adhesives.

[0065] A third adhesive 40 for permanently fixing the element substrate 10 to the bottom surface 32a is applied to the central part of the bottom surface 32a, surrounding the vicinity of the flow channel opening 31. However, in order to prevent the third adhesive 40 from entering the flow channel opening 31, it is preferable not to apply the third adhesive 40 to the edge of the flow channel opening 31.

[0066] In this embodiment, a thermosetting adhesive that hardens at a temperature of approximately 100 degrees Celsius or more and approximately 150 degrees Celsius or less is used as the third adhesive 40.

[0067] As described above, the third adhesive 40 is applied near the flow channel opening 31. Therefore, during use of the liquid discharge head 3 (see Figure 1, etc.), there is a risk that the liquid passing through the flow channel opening 31 may come into contact with the hardened third adhesive 40 (third adhesive layer).

[0068] Even if a liquid comes into contact with the third adhesive layer, in order to maintain the state in which the element substrate 10 is permanently fixed to the bottom surface 32a, it is preferable that the third adhesive 40 has not only the fixing force necessary to permanently fix the element substrate 10, but also liquid resistance, sealing properties, and swelling properties. For example, when ink is used as the liquid, it is preferable that the third adhesive 40 has ink resistance, sealing properties, and swelling properties in relation to the ink. Note that the third adhesive 40 does not need to be a photocuring type adhesive or a delayed curing type adhesive.

[0069] By using a third adhesive 40 that cures within the temperature range described above, liquid resistance, sealing properties, and swelling properties can be ensured. This extends the product's lifespan compared to a case where the third adhesive 40 does not possess liquid resistance, sealing properties, and swelling properties. The second adhesive 60 is applied at a position further away from the flow channel opening 31 than the third adhesive 40. Therefore, the second adhesive 60 does not need to possess the same excellent liquid resistance, sealing properties, and swelling properties as the third adhesive 40.

[0070] Furthermore, the first adhesive 50 is applied at a position further away from the flow channel opening 31 than the second adhesive 60. Moreover, the position where the first adhesive 50 is applied is at a different height (position in the Z direction) from the positions where the second adhesive 60 and the third adhesive 40 are applied. Therefore, the first adhesive 50 does not need to have the same excellent liquid resistance, sealing properties, and swelling properties as the third adhesive 40, as does the second adhesive 60.

[0071] Generally, UV-curing adhesives tend to have inferior liquid resistance and swelling properties compared to thermosetting adhesives. However, as described above, in this embodiment, the first adhesive 50 and the second adhesive 60 are applied at a position sufficiently far from the flow channel opening 31. Therefore, no problems arise even if UV-curing adhesives are used as the first adhesive 50 and the second adhesive 60.

[0072] Referring again to Figure 6, we will continue the explanation of the manufacturing method for the liquid dispensing head 3.

[0073] In step S602, the second adhesive 60 is activated.

[0074] Figure 8(a) is a bottom view of the support part 30 after adhesive has been applied. Figure 8(b) is a cross-sectional view taken along line VIII-VIII in Figure 8(a).

[0075] As shown in Figures 8(a) and 8(b), the light source 900 is used to irradiate the second adhesive 60 with light. As described above, in this embodiment, an ultraviolet delayed-curing adhesive is used as the second adhesive 60. Therefore, in this embodiment, the light source 900 irradiates the second adhesive 60 with ultraviolet light. This activates the second adhesive 60. It is preferable to provide a mask (not shown) on the first adhesive 50 in order to suppress the curing of the first adhesive 50. When visible light curing adhesives are used as the first adhesive 50 and the second adhesive 60, the light source 900 irradiates with visible light.

[0076] In this embodiment, as described above, an ultraviolet-delayed curing adhesive is used as the second adhesive 60. Therefore, the viscosity of the second adhesive 60 does not change immediately after irradiation with ultraviolet light. For example, approximately 5 minutes to approximately 20 minutes after the second adhesive 60 is irradiated with ultraviolet light, the second adhesive 60 thickens and hardens.

[0077] Referring again to Figure 6, we will continue the explanation of the manufacturing method for the liquid dispensing head 3.

[0078] In S603, the element substrate unit 4 is placed on the support portion 30.

[0079] Figure 9 is an explanatory diagram of S603.

[0080] As shown in Figure 9, the element substrate unit 4 is positioned on the support portion 30 so that the corners of the cover member 20 are in contact with the first adhesive 50. A predetermined placement device (not shown) is used to position the element substrate unit 4 on the support portion 30.

[0081] According to this method, with the element substrate unit 4 positioned on the support portion 30, the first adhesive 50 adheres to the cover member 20. Then, the second adhesive 60 and the third adhesive 40 adhere to the element substrate 10.

[0082] Furthermore, the process of placing the element substrate unit 4 must be carried out before the activated second adhesive 60 thickens and hardens. This is because once the second adhesive 60 thickens and hardens, it becomes difficult to place the element substrate unit 4 on the support portion 30.

[0083] Referring again to Figure 6, we will continue the explanation of the manufacturing method for the liquid dispensing head 3.

[0084] In S604, the first adhesive 50 is cured.

[0085] Figure 10(a) is a schematic bottom view of the liquid discharge head 3 after the element substrate unit 4 has been placed. Figure 10(b) is a cross-sectional view of Figure 10(a) along the line Xb-Xb.

[0086] As shown in Figures 10(a) and 10(b), the first adhesive 50 is cured by irradiating it with ultraviolet light from the light source 900.

[0087] In the example shown in Figure 10(b), the light source 900 is positioned above the cover member 20 and tilted relative to the bottom surface 30a of the support part 30 to irradiate ultraviolet light. However, the position and angle at which the light source 900 is placed are not limited to this example.

[0088] For example, ultraviolet light may be irradiated from the side of the support portion 30 along the Y direction, or ultraviolet light may be irradiated from the front or back of the support portion 30 along the X direction. With these methods, even if the first adhesive 50 does not protrude outward from the corners of the cover member 20 when the element substrate unit 4 is placed, the first adhesive 50 present between the bottom surface 30a and the cover member 20 can be cured.

[0089] By curing the first adhesive 50, the cover member 20 is temporarily fixed to the bottom surface 30a. By temporarily fixing the cover member 20, it is possible to prevent the element substrate 10 from shifting position while it is being permanently fixed to the bottom surface 32a.

[0090] In this embodiment, immediately after the element substrate unit 4 is positioned by the above-described placement device, the element substrate unit 4 is positioned at the most precise target position relative to the support portion 30. Therefore, it is preferable that the element substrate unit 4 does not move as much as possible from the position immediately after placement.

[0091] As described above, the third adhesive 40 is a thermosetting adhesive. Therefore, there is a risk that the element substrate 10 and the cover member 20 will undergo linear expansion while the third adhesive 40 is being heated. As the support portion 30 and the element substrate unit 4 undergo linear expansion, their volumes will change, and if no countermeasures are taken against this linear expansion, there is a risk that the element substrate unit 4 will deviate from its most accurate position immediately after placement.

[0092] Therefore, in this embodiment, a first adhesive 50 is used that can be cured immediately by irradiation with ultraviolet light in a room temperature environment. With this method, since the ambient temperature does not change immediately after the element substrate unit 4 is placed, the problem of linear expansion in the element substrate 10 and cover member 20 does not occur.

[0093] Furthermore, since the first adhesive 50 hardens immediately upon exposure to ultraviolet light, it becomes easier to maintain the most accurate position immediately after the element substrate unit 4 is placed.

[0094] Furthermore, when multiple element substrate units 4 are arranged on a single support section 30, each of steps S602 to S604 is performed for each element substrate unit 4.

[0095] Referring again to Figure 6, we will continue the explanation of the manufacturing method for the liquid dispensing head 3.

[0096] In step S605, the curing of the second adhesive 60 (see Figure 10(b), etc.) is completed. Even if the second adhesive 60 is left at room temperature after being irradiated with ultraviolet light, it is possible to cure the second adhesive 60. However, by heating the second adhesive 60 at a low temperature of approximately 40 degrees Celsius to approximately 50 degrees Celsius after being irradiated with ultraviolet light, the activation of the second adhesive 60 is promoted. This allows the second adhesive 60 to cure faster than if it were left at room temperature. Therefore, in step S605 of this embodiment, the second adhesive 60 is cured by low-temperature heating. By curing the second adhesive 60, the element substrate 10 (see Figure 10(b), etc.) can be temporarily fixed to the bottom surface 32a (see Figure 10(b), etc.).

[0097] As described above, the cover member 20 (see Figure 10(b), etc.) is temporarily fixed in place at the time the work in this process is performed. However, the object that should be positioned with high precision is not the cover member 20, but the element substrate 10.

[0098] As described above, the element substrate 10 is permanently fixed by a thermosetting third adhesive 40 (see Figure 10(b), etc.). When the third adhesive 40 is heated to permanently fix it, there is a risk that the position of the element substrate 10 may shift due to the difference in the amount of change in linear expansion caused by the difference in the coefficients of linear expansion between the element substrate 10 and the cover member 20. The height (position in the Z direction) where the element substrate 10 is located and the height (position in the Z direction) where the cover member 20 is located are different from each other. The stress generated by linear expansion also acts in the height direction (Z direction). Therefore, there is a risk that the position of the element substrate 10 may shift due to these factors as well.

[0099] Furthermore, in the support portion 30 (see Figure 10(b), etc.), the position in the height direction (Z direction) where the third adhesive 40 is applied differs from the position in the height direction (Z direction) where the first adhesive 50 (see Figure 10(b), etc.) is applied. When the third adhesive 40 is heated while the positions in the height direction where the third adhesive 40 and the first adhesive 50 are applied are different from each other, torque may be generated in the YZ plane and XZ plane of the support portion 30. This torque may cause the position of the element substrate 10 to shift.

[0100] Therefore, in this embodiment, the element substrate 10 is temporarily fixed to the same plane as the plane for permanent fixing (i.e., the bottom surface 32a, which is the XY plane). This allows the element substrate 10 to be temporarily fixed more securely compared to the case where only the cover member 20 is temporarily fixed. Accordingly, this configuration makes it possible to suppress misalignment of the element substrate 10.

[0101] In this embodiment, the second adhesive 60 is cured by heating it to a temperature of approximately 40 degrees Celsius or higher and approximately 50 degrees Celsius or lower. When the temperature at which the second adhesive 60 is heated is within the above-mentioned temperature range, the possibility of linear expansion problems occurring in the element substrate 10 and the cover member 20 is reduced. In this way, by heating the second adhesive 60 at a relatively low temperature, the second adhesive 60 can be cured faster compared to when the second adhesive 60 is not heated.

[0102] Examples of adhesives that can be used as the second adhesive 60 are not limited as long as the above-mentioned problem of linear expansion does not occur. For example, a two-component curing adhesive may be used as the second adhesive 60. With this configuration, although it takes longer than when the second adhesive 60 is heated, the second adhesive 60 can be cured without causing the problem of linear expansion in the element substrate 10 and the cover member 20.

[0103] In S606, the third adhesive 40 (see Figure 10(b), etc.) is cured.

[0104] In this embodiment, the third adhesive 40 can be cured by heating it to a temperature of approximately 100 degrees Celsius or more and approximately 150 degrees Celsius or less, thereby permanently fixing the element substrate 10 to the bottom surface 32a (see Figure 10(b), etc.). However, the temperature at which the third adhesive 40 is heated is not limited to this example, as long as it is possible to permanently fix the element substrate 10 to the bottom surface 32a.

[0105] As described above, if the outer circumference of the element substrate unit 4 is unstable, heating the third adhesive 40 may cause the element substrate 10 (see Figure 10(b), etc.) to shift position. However, in this embodiment, temporary fixing is performed using the first adhesive 50 (see Figure 10(b), etc.) and the second adhesive 60 (see Figure 10(b), etc.), so the displacement of the element substrate 10 is suppressed.

[0106] The above is an explanatory diagram of a method for manufacturing a liquid dispensing head 3 (see Figure 10(b), etc.) applicable to this embodiment. The order in which the steps in the flowchart described above are performed can be changed as long as it is possible to manufacture the liquid dispensing head 3 of this embodiment. In addition, some of the steps described above may be performed simultaneously. Furthermore, if the second adhesive 60 activated in S602 has hardened sufficiently between S604 and S606, the step in S605 may be omitted.

[0107] As described above, in this embodiment, a fast-curing adhesive is used as the first adhesive 50 for temporarily fixing the cover member 20 (see Figure 10(b), etc.), and a delayed-curing adhesive is used as the second adhesive 60 for temporarily fixing the element substrate 10. As a result, even if the second adhesive 60 covers the cover member 20 while the element substrate unit 4 (see Figure 10(b), etc.) is placed on the support part 30, the element substrate 10 can be permanently fixed while the cover member 20 and the element substrate 10 are temporarily fixed. Therefore, the position of the element substrate unit 4 relative to the support part 30 is prevented from shifting while the element substrate 10 is being permanently fixed.

[0108] Therefore, according to the liquid discharge head manufacturing method of this embodiment, the element substrate unit can be fixed to the support part with high precision.

[0109] [First modified example in the first embodiment] Figure 11(a) shows a first modified example of S601.

[0110] As shown in Figure 11(a), the second adhesive 60 may be applied to the bottom surface 32a of the recess 32 formed in the support portion 30, at a position corresponding to the corner of the element substrate 10 (see Figure 3, etc.). This method allows for a reduction in the amount of the second adhesive 60 applied compared to the example in Figure 7.

[0111] [Second variation in the first embodiment] Figure 11(b) shows a second modified example of S1.

[0112] As shown in Figure 11(b), the first adhesive 50 may be applied to the bottom surface 30a of the support portion 30 along the opening of the recess 32. However, in order to prevent the first adhesive 50 from adhering to the inside of the recess 32 and fixing the flexible wiring board 14 with the first adhesive 50 in unintended locations, it is preferable not to apply the first adhesive 50 to the edge of the opening of the recess 32. This method prevents liquid adhering to the discharge port 11 (see Figure 2, etc.) and mist generated when liquid is discharged from entering the recess 32 through the gap between the cover member 20 (see Figure 3, etc.) and the bottom surface 30a. This prevents liquid from adhering to the electrical wiring section (for example, the flexible wiring board 14 (see Figure 3, etc.)) located inside the liquid discharge head 3 (see Figure 1, etc.). In other words, it prevents the occurrence of electrical malfunctions.

[0113] [Second Embodiment] This embodiment aims to provide a liquid discharge head 3 that can more firmly fix the element substrate unit 4 to the support portion 30. In the following description, components that are the same as or corresponding to the first embodiment are denoted by the same reference numerals and their descriptions are omitted, while the differences are mainly described.

[0114] Figure 12 is a schematic cross-sectional view of a liquid discharge head 3 that can be applied to this embodiment. Note that Figure 12 corresponds to the line Xb-Xb in Figure 10(a).

[0115] As shown in Figure 12, in this embodiment, the support portion 30 includes a first support portion 301 and a second support portion 302. The recess 32 is formed by stacking the second support portion 302 on top of the first support portion 301. Thus, the support portion 30 in this embodiment is constructed by individually manufacturing and stacking the first support portion 301 and the second support portion 302.

[0116] This makes it easier, for example, to process the surface of the second support portion 302 than in the first embodiment. Specifically, by polishing the surface of the second support portion 302 to which the first adhesive 50 is applied (i.e., the surface used as the bottom surface 30a of the support portion 30), the flatness of the surface to which the first adhesive 50 is applied can be improved. By improving the flatness of the bottom surface 30a, multiple element substrate units 4 can be arranged in parallel when the element substrate units 4 are placed, thereby improving the quality of the recorded image.

[0117] Therefore, with the liquid discharge head 3 of this embodiment, the element substrate unit 4 can be more firmly fixed to the support portion 30.

[0118] [Third Embodiment] This embodiment aims to provide a liquid discharge head 3 that can fix the element substrate unit 4 to the support portion 30 with high precision. In the following description, components that are the same as or corresponding to the first embodiment are denoted by the same reference numerals and their descriptions are omitted, while the differences are mainly described.

[0119] Figure 13 is an exploded perspective view of an element substrate unit 4 that can be applied to this embodiment.

[0120] As shown in Figure 13, the element substrate unit 4 of this embodiment includes a flow channel member 13 having a flow channel formed along the short direction (X direction), and a flow channel conversion substrate 12 having a flow channel that converts the direction in which the liquid supplied from the flow channel member 13 flows to the long direction (Y direction).

[0121] In this embodiment, the element substrate unit 4 is constructed by stacking the flow path member 13, the flow path conversion substrate 12, the element substrate 10, and the cover member 20 in this order, and connecting the flexible wiring substrate 14 to the element substrate 10.

[0122] Figure 14(a) is a schematic bottom perspective view of a liquid dispensing head 3 that can be applied to this embodiment.

[0123] In this embodiment, the support portion 30 does not have a recess 32 (see Figure 7, etc.). The flow path opening 31 (see Figure 7, etc.) is formed on the bottom surface 30a. With the element substrate unit 4 fixed to the support portion 30, the cover member 20 has an inclined portion 22 that is inclined with respect to the bottom surface 30a. In the element substrate unit 4, the inclined portion 22 is formed so as to move from the center of the cover member 20 toward the outer circumference toward the element substrate 10.

[0124] With this configuration, even if a wiper (not shown) comes into contact with the element substrate unit 4 while wiping off liquid adhering to the element substrate 10 during maintenance, the impact of that contact is deflected by the inclined portion 22. Therefore, compared to a configuration in which the inclined portion 22 is not formed, the impact when the wiper makes contact can be mitigated. As a result, the durability of the wiper is improved, reducing the decrease in maintainability due to wiper damage and suppressing dust generation from the wiper. In addition, the element substrate unit 4 is less likely to be damaged.

[0125] Figure 14(b) is a cross-sectional view taken along the line XIVb-XIVb in Figure 14(a).

[0126] As shown in Figure 14(b), in this embodiment, the first adhesive 50, the second adhesive 60, and the third adhesive 40 are applied to the bottom surface 30a. The second adhesive 60 and the third adhesive 40 are applied to the inside of the cover member 20. Therefore, in this embodiment, when the second adhesive 60 and the third adhesive 40 harden, adhesive layers of the second adhesive 60 and the third adhesive 40 are formed on the inside of the cover member 20.

[0127] With this configuration, by using an ultraviolet-delayed curing adhesive as the second adhesive 60, the element substrate unit 4 can be fixed to the support part 30 with high precision.

[0128] [Other embodiments] In the embodiments described above, the liquid ejection head 3 is configured to eject four types of liquids. However, the form of the liquid ejection head 3 is not limited to the above-described form, as long as it can eject one or more types of liquids. For example, the liquid ejection head 3 may be configured to eject only black ink, or it may be configured to eject the four or more colors of ink described above.

[0129] In the embodiments described above, cut paper was used as the recording medium P. However, roll paper may also be used as the recording medium P.

[0130] In the embodiments described above, it was explained that an immediate-curing adhesive, such as an UV-curing adhesive, can be used as the first adhesive 50. However, the first adhesive 50 does not necessarily need to be immediately curing. For example, a room-temperature curing adhesive, a moisture-curing adhesive, or a two-component mixed adhesive may be used as the first adhesive 50. However, these adhesives require a longer curing time compared to an immediate-curing adhesive. Therefore, if an immediate-curing adhesive is not used as the first adhesive 50, there is a risk that the cover member 20 may shift position during the curing of the adhesive due to factors such as the weight of the cover member 20, external forces, and changes in ambient temperature. For this reason, it is preferable that the first adhesive 50 is immediately curing.

[0131] In the embodiments described above, a thermosetting adhesive that hardens at a relatively high temperature was used as the third adhesive 40. However, the example of the third adhesive 40 is not limited as long as it can permanently fix the element substrate 10. For example, a room-temperature curing adhesive, a thermosetting adhesive that hardens at a relatively low temperature (specifically, about 40 degrees Celsius or more and about 50 degrees Celsius or less), or a two-component mixed adhesive may be used as the third adhesive 40. With these adhesives, high-temperature heating is not required, so linear expansion in the cover member 20 and the element substrate 10 can be avoided. Therefore, if a room-temperature curing adhesive or the like is used as the third adhesive 40, it takes time to harden, but it can suppress displacement of the element substrate unit 4 due to linear expansion of the cover member 20 and the element substrate 10.

[0132] This disclosure includes the following methods and configurations:

[0133] [Method 1] An element substrate unit comprising an element substrate including an energy generating element that generates energy for discharging liquid, and a cover member that surrounds the element substrate and has an opening that does not cover the discharge port for discharging liquid formed on the element substrate, A support portion for supporting the aforementioned element substrate unit, A method for manufacturing a liquid dispensing head, comprising: The process includes applying a first adhesive for fixing the cover member, a second adhesive for fixing the element substrate, and a third adhesive to the support portion, An activation step in which the second adhesive is irradiated with light to activate the second adhesive, The arrangement step involves positioning the element substrate unit on the support portion such that the second adhesive is covered by the cover member, A first curing step for curing the aforementioned first adhesive, A second curing step for curing the third adhesive, Includes, The activation step is performed before the arrangement step. The second curing step is performed after the first curing step. A method for manufacturing a liquid dispensing head, characterized by the following:

[0134] [Method 2] In the coating step, a light-delayed curing adhesive that takes longer to cure than the first adhesive is applied as the second adhesive. A method for manufacturing a liquid dispensing head as described in Method 1.

[0135] [Method 3] In the coating step, a photocuring adhesive that can be cured in a shorter time than the second adhesive is applied as the first adhesive. In the first curing step, the first adhesive is irradiated with light. A method for manufacturing a liquid dispensing head as described in Method 1 or 2.

[0136] [Method 4] In the first curing step described above, ultraviolet light is irradiated as light. A method for manufacturing a liquid dispensing head as described in Method 3.

[0137] [Method 5] In the activation step, ultraviolet light is irradiated as light. A method for manufacturing a liquid dispensing head as described in any one of Methods 1 to 4.

[0138] [Method 6] The cover member is made of a material that does not transmit light. A method for manufacturing a liquid dispensing head as described in any one of Methods 1 to 5.

[0139] [Method 7] The third adhesive is a thermosetting adhesive, In the second curing step, the third adhesive is heated. A method for manufacturing a liquid dispensing head as described in Method 1 or 2.

[0140] [Method 8] The support portion has a channel opening that is connected to a channel formed in the element substrate. The third adhesive has liquid resistance, In the coating process, The third adhesive is applied so as to surround the flow channel opening. The second adhesive is applied at a position further away from the flow channel opening than the third adhesive. A method for manufacturing a liquid dispensing head as described in any one of Methods 1 to 7.

[0141] [Method 9] The flow channel opening is formed on the bottom surface of the recess formed in the support portion. A method for manufacturing a liquid dispensing head as described in Method 8.

[0142] [Method 10] The method further includes a third curing step of heating the second adhesive to promote activation. A method for manufacturing a liquid dispensing head as described in any one of Methods 1 to 9.

[0143] [Method 11] The third adhesive cures at a higher temperature than the second adhesive. A method for manufacturing a liquid dispensing head as described in any one of Method 10.

[0144] [Composition 12] An element substrate unit comprising an element substrate including an energy generating element that generates energy for discharging liquid, and a cover member that surrounds the element substrate and has an opening that does not cover the discharge port for discharging liquid formed on the element substrate, A support portion for supporting the aforementioned element substrate unit, Equipped with, A first adhesive layer is provided between the support portion and the cover member, and includes a first adhesive. A second adhesive layer, which is covered by the cover member, provided between the element substrate and the support portion, and includes a second adhesive that is activated by irradiation with light, A third adhesive layer is provided between the support portion and the cover member, and includes a third adhesive layer, including, A liquid dispensing head characterized by the following features.

[0145] [Composition 13] The second adhesive layer contains components of a light-delayed curing adhesive that takes longer to cure than the first adhesive. Liquid dispensing head as described in configuration 12.

[0146] [Composition 14] The first adhesive layer contains components of a photocatalytically curing adhesive that can be cured in a shorter time than the second adhesive. A liquid dispensing head as described in configuration 12 or 13.

[0147] [Composition 15] The second adhesive contains a component whose hardening is accelerated by heating. A liquid dispensing head as described in any one of items 12 to 14 of the configuration.

[0148] [Composition 16] The cover member is made of a material that does not transmit light. A liquid dispensing head as described in any one of items 12 to 15 of the configuration.

[0149] [Composition 17] The cover member includes at least one of titanium, nickel alloy, stainless steel, tungsten, molybdenum, and ceramics. Liquid dispensing head as described in configuration 16.

[0150] [Composition 18] The third adhesive is a thermosetting adhesive. A liquid dispensing head as described in any one of items 12 to 17 of the configuration.

[0151] [Composition 19] The support portion has a channel opening that is connected to a channel formed in the element substrate. The third adhesive layer is It has liquid resistance, The third adhesive is provided so as to surround the flow channel opening. The second adhesive layer is provided at a position further away from the flow channel opening than the third adhesive layer. A liquid dispensing head as described in any one of items 12 to 18 of the configuration.

[0152] [Configuration 20] The flow channel opening is formed on the bottom surface of the recess formed in the support portion. Liquid dispensing head as described in configuration 19.

[0153] [Composition 21] The second adhesive layer and the third adhesive layer are located on the same plane. Liquid dispensing head as described in configuration 20.

[0154] [Composition 22] The first adhesive layer, the second adhesive layer, and the third adhesive layer are provided on the same plane. The cover member has an inclined portion that is tilted with respect to the plane and tilted to approach the element substrate. A liquid dispensing head as described in any one of items 12 to 20 of the configuration.

Claims

1. An element substrate unit comprising an element substrate including an energy generating element that generates energy for discharging liquid, and a cover member that surrounds the element substrate and has an opening that does not cover the discharge port for discharging liquid formed on the element substrate, A support portion for supporting the aforementioned element substrate unit, A method for manufacturing a liquid dispensing head, comprising: The process includes applying a first adhesive for fixing the cover member, a second adhesive for fixing the element substrate, and a third adhesive to the support portion, An activation step in which the second adhesive is irradiated with light to activate the second adhesive, The arrangement step involves positioning the element substrate unit on the support portion such that the second adhesive is covered by the cover member, A first curing step for curing the first adhesive, A second curing step for curing the third adhesive, Includes, The activation step is performed before the arrangement step. The second curing step is performed after the first curing step. A method for manufacturing a liquid dispensing head, characterized by the following:

2. In the coating step, a light-delayed curing adhesive that takes longer to cure than the first adhesive is applied as the second adhesive. A method for manufacturing a liquid dispensing head as described in claim 1.

3. In the coating step, a photocuring adhesive that can be cured in a shorter time than the second adhesive is applied as the first adhesive. In the first curing step, the first adhesive is irradiated with light. A method for manufacturing a liquid dispensing head according to claim 1 or 2.

4. In the first curing step described above, ultraviolet light is irradiated as light. A method for manufacturing a liquid dispensing head according to claim 3.

5. In the activation step, ultraviolet light is irradiated as light. A method for manufacturing a liquid dispensing head according to claim 1 or 2.

6. The cover member is made of a material that does not transmit light. A method for manufacturing a liquid dispensing head according to claim 1 or 2.

7. The third adhesive is a thermosetting adhesive, In the second curing step, the third adhesive is heated. A method for manufacturing a liquid dispensing head according to claim 1 or 2.

8. The support portion has a channel opening that is connected to a channel formed in the element substrate. The third adhesive has liquid resistance, In the coating process, The third adhesive is applied so as to surround the flow channel opening. The second adhesive is applied at a position further away from the flow channel opening than the third adhesive. A method for manufacturing a liquid dispensing head according to claim 1 or 2.

9. The flow channel opening is formed on the bottom surface of the recess formed in the support portion. A method for manufacturing a liquid dispensing head according to claim 8.

10. The method further includes a third curing step of heating the second adhesive to promote activation. A method for manufacturing a liquid dispensing head according to claim 1 or 2.

11. The third adhesive cures at a higher temperature than the second adhesive. A method for manufacturing a liquid dispensing head according to claim 10.

12. An element substrate unit comprising an element substrate including an energy generating element that generates energy for discharging liquid, and a cover member that surrounds the element substrate and has an opening that does not cover the discharge port for discharging liquid formed on the element substrate, A support portion for supporting the aforementioned element substrate unit, Equipped with, A first adhesive layer is provided between the support portion and the cover member, and includes a first adhesive. A second adhesive layer, which is covered by the cover member, provided between the element substrate and the support portion, and includes a second adhesive that is activated by irradiation with light, A third adhesive layer is provided between the support portion and the cover member, and includes a third adhesive. including, A liquid dispensing head characterized by the following features.

13. The second adhesive layer contains components of a light-delayed curing adhesive that takes longer to cure than the first adhesive. The liquid dispensing head according to claim 12.

14. The first adhesive layer contains components of a photocurable adhesive that can be cured in a shorter time than the second adhesive. The liquid dispensing head according to claim 12 or 13.

15. The second adhesive contains a component whose hardening is accelerated by heating. The liquid dispensing head according to claim 12 or 13.

16. The cover member is made of a material that does not transmit light. The liquid dispensing head according to claim 12 or 13.

17. The cover member includes at least one of titanium, nickel alloy, stainless steel, tungsten, molybdenum, and ceramics. The liquid dispensing head according to claim 16.

18. The third adhesive is a thermosetting adhesive. The liquid dispensing head according to claim 12 or 13.

19. The support portion has a channel opening that is connected to a channel formed in the element substrate. The third adhesive layer is It has liquid resistance, The third adhesive is provided so as to surround the flow channel opening. The second adhesive layer is provided at a position further away from the flow channel opening than the third adhesive layer. The liquid dispensing head according to claim 12 or 13.

20. The flow channel opening is formed on the bottom surface of the recess formed in the support portion. The liquid dispensing head according to claim 19.

21. The second adhesive layer and the third adhesive layer are located on the same plane. The liquid dispensing head according to claim 20.

22. The first adhesive layer, the second adhesive layer, and the third adhesive layer are provided on the same plane. The cover member has an inclined portion that is tilted with respect to the plane and tilted to approach the element substrate. The liquid dispensing head according to claim 12 or 13.

Images