Method for removing a superconducting device and connector unit

Abstract

This invention provides a superconducting device that facilitates space-saving, and a method for removing the connector unit. [Solution] The superconducting device comprises a chip having a superconducting circuit, an interposer on which the chip is mounted, a board electrically connected to the interposer, a cooling section to which the board is fixed, a first screw that fixes the board to the cooling section and has a first head with a first screw hole formed therein, and a connector unit that can be fixed to the first screw hole, the connector unit having a second screw hole located in the direction of extension of the first screw hole.

Description

Technical Field

[0001] The present disclosure relates to a superconducting device and a method for removing a connector unit.

Background Art

[0002] A superconducting device having a qubit circuit is known.

[0003] For example, Patent Document 1 discloses "a mounting structure of a substrate unit having a substrate unit in which a printed circuit board is held on a frame provided with screws, and a back panel unit in which a plurality of substrate units are vertically mounted is held on the frame." In the frame of the back panel unit, there are provided a guide hole for guiding the screws of the substrate unit and guiding the connector of the printed circuit board to the plug-in position, and a screw hole into which a push screw for pushing the frame of the substrate unit in the disconnection direction is screwed when the substrate unit is removed. In addition, a flange is provided which abuts against the frame of the substrate unit and regulates the plug-in depth of the printed circuit board. The substrate unit is tightened to the flange of the back panel unit by nuts screwed onto the screws.

[0004] In the mounting structure of the substrate unit disclosed in Patent Document 1, a guide hole is provided in the flange for mounting the substrate unit. In addition, in the mounting structure of the substrate unit, a screw hole is provided in the flange for removing the substrate unit. The guide hole and the screw hole are provided at their respective positions in this flange. An operator detaches the connector of the printed circuit board by properly using the guide hole and the screw hole for each use.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

[0006] Incidentally, in quantum computers that use superconductivity, superconducting devices equipped with chips containing superconducting circuits are mounted within a limited space at extremely low temperatures. Therefore, space saving is required for superconducting devices. If connectors are attached and detached in a superconducting device following the mounting structure of the substrate unit disclosed in Patent Document 1, space is required to provide two types of holes for attaching and detaching the connectors. This space requirement can lead to an increase in the size of the superconducting device.

[0007] The purpose of this disclosure is to provide a superconducting device and a method for removing a connector unit that solve the above-mentioned problems. [Means for solving the problem]

[0008] The superconducting device of this disclosure comprises a chip having a superconducting circuit, an interposer on which the chip is mounted, a board electrically connected to the interposer, a cooling section to which the board is fixed, a first screw having a first head with a first screw hole formed therein for fixing the board to the cooling section, and a connector unit that can be fixed to the first screw hole, wherein the connector unit has a second screw hole located in the direction of extension of the first screw hole.

[0009] A method for removing a connector unit according to the present disclosure includes a chip having a superconducting circuit, an interposer on which the chip is mounted, a first screw having a first head formed with a first screw hole for fixing a board electrically connected to the interposer, a connector unit having a second screw hole and fixable to the first screw hole, and a second screw including a second shaft portion that can engage with the second screw hole, comprising the steps of engaging the second shaft portion with the second screw hole and pressing the first head with the screw tip of the second screw, wherein the second screw hole is located in the direction of extension of the first screw hole with respect to the first screw hole. [Effects of the Invention]

[0010] According to the method for removing superconducting devices and connector units described herein, it is easier to reduce the space required for superconducting devices. [Brief explanation of the drawing]

[0011] [Figure 1] This is a plan view I showing an example of the configuration of a superconducting device related to this disclosure. [Figure 2] This is a cross-sectional view along the line F2-F2 shown in Figure 1. [Figure 3] This is a cross-sectional view along the line F3-F3 shown in Figure 1. [Figure 4] This is Plan View II, showing an example of the configuration of a superconducting device related to this disclosure. [Figure 5] This is a cross-sectional view along the line F3-F3 shown in Figure 4. [Figure 6] This is a cross-sectional view I showing an example of the second screw in this disclosure. [Figure 7] This is a cross-sectional view II showing an example of the second thread in this disclosure. [Figure 8] This figure shows the removal of a connector in a superconducting device relating to this disclosure. [Figure 9] This flowchart I shows an example of the process for removing the connector unit related to this disclosure. [Figure 10] This figure shows the removal of a connector in a modified superconducting device. [Figure 11] This is a cross-sectional view showing an example of the configuration of a superconducting device related to this disclosure. [Figure 12] This is a cross-sectional view along the line F12-F12 shown in Figure 11. [Figure 13] This is flowchart II, which shows an example of the process for removing the connector unit related to this disclosure. [Modes for carrying out the invention]

[0012] Hereinafter, examples of each embodiment according to the present disclosure will be described with reference to the drawings. Note that the drawings and the specific configurations used in each embodiment shall not be used for interpreting the disclosure. The same or corresponding configurations in all the drawings are denoted by the same reference numerals, and common descriptions are omitted. Note that in the present disclosure, the drawings are associated with one or more embodiments.

[0013] <First Embodiment> Hereinafter, one embodiment according to the present disclosure will be described with reference to the drawings. Hereinafter, an example of the configuration of a superconducting device in the present disclosure will be described with reference to the drawings.

[0014] In the following disclosure, the Z direction is a direction in which the surface 21s1 of the base material 21 included in the interposer 2 faces. One side of the Z direction is the +Z direction, and the other side of the Z direction is the -Z direction. The X direction is a direction intersecting the Z direction in the plane along the surface 21s1. One side of the X direction is the +X direction, and the other side of the X direction is the -X direction. The Y direction is a direction intersecting the Z direction and the X direction. One side of the Y direction is the +Y direction, and the other side of the Y direction is the -Y direction.

[0015] Hereinafter, when the X direction and the Y direction are not distinguished, they may be referred to as the "horizontal direction". Hereinafter, the Z direction may be referred to as the "vertical direction".

[0016] (Configuration of Superconducting Device) As shown in FIGS. 1 to 3, the superconducting device 100 includes a quantum chip 1, an interposer 2, a plurality of bonding wires 3, a board 4, a cooling unit 5, at least one connector unit 6, a first screw 8, and a second screw 9. In the present disclosure, the superconducting device 100 includes four connector units 6.

[0017] The arrangement of the connector units 6 in the superconducting device 100 is not particularly limited. For example, as shown in Figure 1, the superconducting device 100 has a first end 100e1, a second end 100e2, a third end 100e3, and a fourth end 100e4. The first end 100e1 and the second end 100e2 are a pair of ends separated in the X direction. The third end 100e3 and the fourth end 100e4 are a pair of ends separated in the Y direction. In this case, of the four connector units 6 in this disclosure, one is located at the first end 100e1, one at the second end 100e2, one at the third end 100e3, and one at the fourth end 100e4.

[0018] This superconducting device 100 has a basic configuration in which a quantum chip 1 is connected to a board 4 via an interposer 2, and bonding wires 3 are used to connect the interposer 2 and the board 4. In addition, the cooling unit 5 houses the quantum chip 1 and maintains it at an extremely low temperature in which a quantum state can be realized.

[0019] Furthermore, the superconducting device 100 in this disclosure is characterized by a connector unit 6 extraction structure that utilizes a first screw hole and a second screw hole located in the extension direction of the screw hole. Therefore, the connection between the interposer 2 and the board 4 is not particularly limited.

[0020] (Quantum chip configuration) As shown in Figure 2, the quantum chip 1 comprises a substrate 11 and a connection portion 12. The connection portion 12 forms a qubit circuit (superconducting circuit) on the substrate 11. Note that the connection portion 12 does not necessarily have to include a conductor wiring layer that forms a circuit pattern, as long as it is a conductor that can connect to the circuit elements in the quantum chip 1. The wiring layer (connection section 12) of the quantum chip 1 is mounted on the interposer 2 via bumps 24. Therefore, the quantum chip 1 is flip-chip mounted on the interposer 2. In this disclosure, the quantum chip 1 is mounted on the back surface 21s2 described later.

[0021] The connecting portion 12 is preferably made of a superconducting material. More specifically, the base material 11 is made of a material that deforms little in a superconducting environment, such as silicon (Si), gallium arsenide (GaAs), sapphire, or glass. The connecting portion 12 is made of niobium (Nb), niobium nitride or other niobium nitrides, aluminum (Al), indium (In), lead (Pb), tin (Sn), rhenium (Re), palladium (Pd), titanium (Ti), titanium nitride, tantalum (Ta), tantalum nitride, or a superconducting alloy containing at least one of these.

[0022] (Interposer configuration) As shown in Figure 2, the interposer 2 includes a base material 21, a first wiring layer 22, a second wiring layer 23, and at least one bump 24. The base material 21 has a front surface 21s1 and a back surface 21s2. The front surface 21s1 faces the +Z direction. The back surface 21s2 faces the -Z direction. The first wiring layer 22 is provided on the front surface 21s1 of the base material 21. The second wiring layer 23 is provided on the back surface 21s2.

[0023] The interposer 2 is housed within the opening 41op. In the housed interposer 2, the back surface 21s2 of the base material 21 covers the recessed portion 51r. A portion of the back surface 21s2 of the base material 21 is in contact with the cooling portion 5. At this time, the interposer 2 may be positioned with a space between it and the inner circumferential surface 4a of the opening 41op in the board 4. This configuration makes it possible to suppress stress and strain caused by the difference in shrinkage between the interposer 2 and the board 4 due to the temperature change to extremely low temperatures. Alternatively, the interposer 2 may be positioned so as to abut a portion of the inner circumferential surface 4a of the opening 41op in the board 4. When the interposer 2 is in contact, its movement in the horizontal direction is partially restrained.

[0024] The substrate 21, like the quantum chip 1, is composed of materials that deform little in a superconducting environment, such as silicon (Si), gallium arsenide (GaAs), sapphire, and glass.

[0025] Furthermore, the first wiring layer 22 and the second wiring layer 23 are made of niobium (Nb), niobium nitrides such as niobium nitride, aluminum (Al), indium (In), lead (Pb), tin (Sn), rhenium (Re), palladium (Pd), titanium (Ti), titanium nitride, tantalum (Ta), tantalum nitride, or a superconducting alloy containing at least one of these.

[0026] For example, in this disclosure, the interposer 2 and the board 4 are bonded on the front surface 21s1. This bonding is performed using bonding wires 3. In addition, in this disclosure, a quantum chip is mounted on the back surface 21s2. This tends to increase the number of bonding wires 3 on the front surface 21s1.

[0027] The interposer 2 may include through vias. The through vias are used to obtain ground potential from the cooling section 5.

[0028] The bump 24 may contain the same superconducting material as the connection portion 12, or it may contain a different superconducting material than the connection portion 12. Furthermore, if the bump 24 contains multiple metal layers, it is preferable that at least one layer contains a superconducting material.

[0029] In this embodiment, a portion of the back surface 21s2 comes into contact with the cooling unit 5, and the quantum chip 1 is housed in the space formed by the recess 51r of the main body 51 of the cooling unit 5 and the interposer 2.

[0030] (Composition of bonding wires) The bonding wire 3 is used to extract information from the quantum chip 1, which is mounted on the interposer 2. As shown in Figure 2, the bonding wire 3 electrically connects the first wiring layer 22 of the interposer 2 to the third wiring layer 42 of the board 4. Signal information from the quantum chip 1 is transmitted in the following order: interposer 2, bonding wire 3, first connector 43, and second connector 63. In Figures 1 and 4, the bonding wire 3 is simplified.

[0031] Furthermore, the bonding wire 3 is composed of niobium (Nb), niobium nitrides such as niobium nitride, aluminum (Al), palladium (Pd), titanium (Ti), titanium nitride, gold (Au), platinum (Pt), or an alloy containing at least one of these.

[0032] (Board configuration) As shown in Figures 2 and 3, the board 4 includes a base material 41, a third wiring layer 42, and at least one first connector 43. In this disclosure, the board 4 includes twelve first connectors 43. The first connectors 43 are connection parts that can be electrically connected to second connectors 63 provided by the connector unit 6. The first connectors 43 include coaxial connectors, flat cable connectors, and other unidirectional connectors. The first connectors 43 may have a male connector shape or a female connector shape.

[0033] Furthermore, the base material 41 has an opening 41op. The opening 41op exposes the recessed portion 51r when the interposer 2 is absent. The portion of the cooling area 5 exposed by the opening 41op is the peripheral portion of the upper edge of the recessed portion 51r.

[0034] For example, in this embodiment, the base material 41 is plate-shaped. The base material 41 has a surface 41s1 and a back surface 41s2. The surface 41s1 faces the +Z direction. The back surface 41s2 faces the -Z direction. A third wiring layer 42 is provided on the surface 41s1 of the base material 41. The cooling unit 5 is in contact with the back surface 41s2. A first connector 43 is also provided on the third wiring layer 42.

[0035] Furthermore, the base material 41 has a seating surface 41s1 on its surface that supports the first screw 8. A through hole is provided in this seating surface through which the first screw 8 can be inserted. In this way, the board 4 is fixed to the cooling section 5 by the first screw 8.

[0036] The base material 41 may contain epoxy, acrylic, urethane, polyimide, phenol, liquid crystal polymer, etc., and may further contain silica, organic resin, ceramic fillers, or glass fibers. The base material 41 may also contain solidified ceramic powder.

[0037] The third wiring layer 42 provided on the surface 41s1 is made of a material such as copper (Cu) or aluminum (Al), and is formed into a predetermined circuit pattern by means of sputtering, vapor deposition, electroless plating, electrolytic plating, etc. Furthermore, specific methods for forming the conductive material layer into a predetermined circuit pattern include the subtractive method using a resist applied to the surface as a mask, the additive method using plating, the semi-additive method, and the lift-off method, which creates the pattern by removing the applied resist.

[0038] (Cooling unit configuration) As shown in Figures 2 and 3, the board 4 is fixed to the cooling unit 5. The cooling unit 5 has a cooling function. An example of the cooling unit 5 is a sample stage. The sample stage is a so-called cold stage equipped with a cryogenic refrigerator (not shown) with a temperature of about millikelvin [mK] that can realize a superconducting state in the materials constituting the quantum chip 1 and the interposer 2.

[0039] The cooling unit 5 comprises a main body 51. The main body 51 has a surface 51s1. The surface 51s1 faces the +Z direction. The interposer 2 and the board 4 are in contact with the surface 51s1. When the interposer 2 is in contact with the surface 51s1, the back surface 21s2 of the interposer 2 covers the recessed portion 51r. The main body 51 also has a hole in the contact surface with the board 4 through which the first screw 8 can be inserted.

[0040] The main body 51 has a recessed portion 51r that is recessed in the direction opposite to the direction facing the interposer 2 (for example, the -Z direction). The recessed portion 51r has a shape corresponding to the planar shape of the quantum chip 1 in the XY plane. The recessed portion 51r accommodates the quantum chip 1. In this disclosure, a gap is formed between the quantum chip 1 and the recessed portion 51r.

[0041] The main body 51 is preferably made of a metal such as copper (Cu) or a copper alloy. For example, if the quantum chip 1 contains niobium (Nb) as the superconducting material, it utilizes the superconducting phenomenon at extremely low temperatures of 9.2 Kelvin [K] or lower, and if it contains aluminum (Al), it utilizes the superconducting phenomenon at extremely low temperatures of 1.2 Kelvin [K] or lower. Therefore, the cooling unit 5 is required to have a cooling capacity that can achieve the extremely low temperatures exemplified above.

[0042] By having at least a portion of the interposer 2 in contact with the cooling unit 5, the interposer 2 functions as a heat transfer path, and the qubit circuit contained in the quantum chip 1 is cooled to an extremely low temperature. In this way, the superconductivity phenomenon can be utilized.

[0043] Alternatively, the ground potential of the interposer 2 may be obtained from the cooling unit 5. For example, the ground potential of the interposer 2 can be obtained through the through-vias of the interposer 2 that are in contact with the cooling unit 5. In this case, the board 4 obtains the ground potential through its connection with the interposer 2 via the bonding wire 3.

[0044] (Connection unit configuration) As shown in Figures 2 and 3, the connector unit 6 is used to exchange input and output between an external device and the quantum chip 1. For example, the external device performs input and output of power, signals, etc., with the quantum chip 1 via the electrical connection between the second connector 63 and the first connector 43, which will be described later. The connector unit 6 comprises a main body 61, a pair of mounting parts 62, and at least one second connector 63. In this disclosure, the connector unit 6 includes three second connectors 63. The connector unit 6 is also capable of fixing the mounting parts 62 to a fourth screw groove 82g. The second connector 63 has a connector shape that can be mated with the first connector 43 described above.

[0045] The main body 61 holds a plurality of second connectors 63. The main body 61 is an example of a "first holding part". The main body 61 has a front surface 61s1 and a back surface 61s2. The front surface 61s1 is the surface located opposite to the back surface 61s2. In this embodiment, the front surface 61s1 faces the +Z direction. The back surface 61s2 faces the first wiring layer 22. In this embodiment, the back surface 61s2 faces the -Z direction. Each second connector 63 is inserted from the front surface 61s1. The first wiring layer 22 can contact the back surface 61s2. The shape of the main body portion 61 is not particularly limited. For example, in this embodiment, the main body portion 61 extends along the horizontal direction. The main body portion 61 has a rectangular cross-sectional shape in the vertical direction.

[0046] The main body 61 is provided with a plurality of openings 61op. Each opening 61op opens in a first direction (for example, the Z direction). The openings 61op are through holes. A portion of the inner circumferential surface of an opening 61op conforms to the outer shape of the second connector 63. This inner circumferential surface holds the second connector 63 in a predetermined position. At least a portion of the second connector 63 is housed in the openings 61op.

[0047] Furthermore, the main body portion 61 may be provided with a counterbore 63c. The counterbore 63c is formed on the back surface 61s2 around the opening portion of the opening 61op. A part of the inner circumferential surface of the counterbore 63c conforms to the outer shape of the second connector 63. In this embodiment, the main body portion 61 comprises a plurality of openings 61op and a counterbore 63c. In the modified example 3 described later, the main body portion 61 does not need to be provided with a counterbore 63c. This is because the opening 71op in modified example 3 has a similar configuration to the counterbore 63c.

[0048] The main body 61 preferably contains an insulating material. The main body 61 contains an insulating material in the portion that is in contact with the second connector 63 and the first wiring layer 22. Furthermore, the main body 61 preferably contains a non-magnetic material. More preferably, the main body 61 may be made of a non-magnetic material.

[0049] The main body 61 may contain quartz or plastics such as engineering plastics. The main body 61 may also contain composite materials including aluminum oxide (Al2O3, also called alumina), mica-based machinable ceramics, aluminum nitride (AlN), zirconia (ZrO2), Macor-based machinable ceramics, glass, resin, and silica filler. Furthermore, the main body 61 may contain superconducting materials, provided that insulation is ensured between the main body 61 and the second connector 63, and between the main body 61 and the first wiring layer 22. Superconducting materials function as magnetic shields during cooling. Therefore, electromagnetic noise is less likely to be applied to the qubit circuit.

[0050] The mounting portion 62 is provided at the end of the main body portion 61. Of the pair of mounting portions 62, one mounting portion 62 extends horizontally from one end of the main body portion 61. The other mounting portion 62 extends horizontally from the other end of the main body portion 61. The mounting portion 62 has a seating surface that supports the second screw 9. The second head 92 of the second screw 9 can contact this seating surface. The mounting portion 62 has a hole through which the second screw 9 can be inserted (hereinafter also referred to as the "second screw hole"). The second screw hole is an engagement hole 62h that opens in the Z direction. The engagement hole 62h is a through hole. The inner circumferential surface of the engagement hole 62h has a second screw groove 62g.

[0051] The second screw hole is located in the direction of extension of the first screw hole, which will be described later. In this disclosure, this extension direction is the Z direction.

[0052] The axis of the second screw groove 62g and the axis of the fourth screw groove 82g may or may not coincide. When the axis of the second screw groove 62g and the axis of the fourth screw groove 82g do not coincide, it is preferable to use the "third type second screw 9C" described later.

[0053] The mounting portion 62 may contain the same material as the main body portion 61, or it may contain a different material from the main body portion 61.

[0054] (Construction of the first screw) As shown in Figures 1 to 5, the first screw 8 secures the board 4 to the cooling unit 5. The first screw 8 has a hole (hereinafter also referred to as the "first screw hole") through which the second screw 9 can be inserted. The first screw hole is an engagement hole 82h that opens in the Z direction. The engagement hole 82h has a bottom surface 82h1 and a side surface 82h2. The bottom surface 82h1 is a surface facing the +Z direction. The bottom surface 82h1 extends horizontally. The side surface 82h2 is a surface that extends from the bottom surface 82h1 along the +Z direction. The side surface 82h2 in the engagement hole 82h surrounds the bottom surface 82h1. The side surface 82h2 has a fourth screw groove 82g. As shown in Figures 3 and 5, the first screw 8 includes a first shaft portion 81 having a third screw groove 81g that can engage with the first screw groove 51g, and a first head portion 82. The first screw 8 has a first head 82 in which the first screw hole is formed.

[0055] Furthermore, the first screw 8 preferably contains a non-magnetic material, such as copper (Cu) or aluminum (Al). More preferably, the first screw 8 may be made of a non-magnetic material. For example, the first screw 8 in this disclosure is made of copper, which has a good heat transfer coefficient among non-magnetic materials. The first screw 8 made of copper promotes the cooling of the fixed board 4.

[0056] (Construction of the second screw) As shown in Figures 3 and 5, the second thread 9 includes a second shaft portion 91 having a fifth thread groove 91gs or a fifth thread groove 91g, and a second head portion 92. The root diameter of the thread in the fifth thread groove 91gs is smaller than the root diameter of the thread in the fifth thread groove 91g. The second thread 9 is a male thread.

[0057] The shape of the second head 92 is not limited. For example, the second screw 9 may be a screw with a slotted head, a screw with a Phillips head hole, a flange screw, a cap bolt, a hex bolt, a wing bolt, etc.

[0058] Here, the second screw 9 will be described in detail using Figures 1 to 8. There are several types of second screw 9. In this disclosure, the second screw 9 can be described as a first type second screw 9A, a second type second screw 9B, and a third type second screw 9C. "First type second screw 9A" is an example of second screw 9AA. "Second type second screw 9B" and "third type second screw 9C" are examples of second screw 9BB.

[0059] The second screw 9AA, to which the "first type second screw 9A" belongs, secures the connector unit 6 by engaging with the first screw hole (engagement hole 82h). In the state shown in Figures 1 to 3, the second screw 9AA is being used. The second screw 9BB, to which the "second type second screw 9B" and the "third type second screw 9C" belong, is used interchangeably with the second screw 9AA. In the state shown in Figures 4 and 5, the second screw 9BB is in use. The second screw 9BB removes the second connector 63 that is mated to the first connector 43. For example, in this disclosure, the second screw 9BB removes the second connector 63 that is mated to each of the multiple first connectors 43 simultaneously (see Figure 5).

[0060] The second screw 9A has one of the following relationships. In either case, the second screw 9BB can be inserted into the second screw hole (engagement hole 62h) located in the extension direction (e.g., Z direction) of the first screw hole (engagement hole 82h). In this embodiment, the second screw 9A has the relationship corresponding to (Case A). (Case A): If the root diameter of the "second screw hole" is larger than the root diameter of the "first screw hole", the second screw 9A has a fifth screw groove 91gs that can engage with the fourth screw groove 82g. (Case B): In other cases, the second screw 9A has a fifth screw groove 91g that can engage with the second screw groove 62g. For example, if the root diameter of the "second screw hole" and the root diameter of the "first screw hole" are equal, the second screw 9A may have a fifth screw groove 91g that can engage with the second screw groove 62g and the fourth screw groove 82g.

[0061] (Type 1, second screw 9A) The second screw 9A in this disclosure has a fifth thread groove 91gs or a fifth thread groove 91g. For example, in this embodiment, the second screw 9A has a fifth thread groove 91gs. The second head 92 of the second screw 9A can press against the connector unit 6. When the second screw 9A is tightened, the fifth thread groove 91gs and the fourth thread groove 82g engage. Then, with the second head 92 pressing against the connector unit 6, the second screw 9A fixes the connector unit 6 to the first screw hole (see Figure 3).

[0062] (Second type, second screw 9B) The second screw 9B in this disclosure has a fifth screw groove 91g. In the second screw 9B, the tip of the second shaft portion 91 (the screw tip of the second screw 9B) presses against the first head portion 82. Figure 6 shows an example of the screw tips of the second screws 9B (second screws 9B1, 9B2, 9B3, 9B4). In the second screw 9B, the second shaft portion 91 does not engage with the first screw hole (engagement hole 82h). As the screw tip of the second screw 9B presses against the first head portion 82, the fifth screw groove 91g and the second screw groove 62g in the engagement hole 62h engage, and the connector unit 6 moves in the +Z direction as the second screw 9B is tightened. Subsequently, the second connector 63 held by the main body portion 61 is simultaneously removed from the first connector 43 (see (8-1) in Figure 8).

[0063] (Third type, second screw 9C) The second screw 9C in this disclosure has a fifth screw groove 91g. The second screw 9C has a configuration that includes a third shaft portion 93, compared to the second screw 9A which has a fifth screw groove 91g in (Case B). In the second screw 9C, the tip of the third shaft portion 93 (the thread tip of the second screw 9C) presses against the bottom surface 82h1. The third shaft portion 93 is aligned continuously with respect to the second shaft portion 91 in the direction of travel of the second screw 9C. The diameter of the third shaft portion 93 is smaller than the outer diameter of the second shaft portion 91. Figure 7 shows an example of the thread tip of the second screw 9C (second screws 9C1, 9C2, 9C3, 9C4). In the second screw 9C, the third shaft portion 93 does not engage with the first screw hole (engagement hole 82h). As the screw tip of the third shaft portion 93 presses against the bottom surface 82h1, the fifth screw groove 91g engages with the second screw groove 62g of the engagement hole 62h, causing the connector unit 6 to move in the +Z direction as the second screw 9C is tightened. Subsequently, the second connector 63, held by the main body portion 61, is simultaneously removed from the first connector 43 (see (8-2) in Figure 8).

[0064] In the "third type second screw 9C," the diameter of the third shaft portion 93 is smaller than that of the second shaft portion 91, which tends to reduce the area that presses against the bottom surface 82h1. As a result, even if the axis of the second screw groove 62g and the axis of the fourth screw groove 82g are slightly tilted, the third shaft portion 93 can easily press against the bottom surface 82h1.

[0065] (How to remove the connector unit) The method for removing the connector unit in this embodiment will be explained with reference to the diagram.

[0066] In this method, a chip having a superconducting circuit (e.g., quantum chip 1), an interposer on which the chip is mounted (e.g., interposer 2), a first screw (e.g., first screw 8) having a first head with a first screw hole formed therein, fixing a board (e.g., board 4) electrically connected to the interposer, a connector unit (e.g., connector unit 6) having a second screw hole and fixable to the first screw hole, and a second screw (e.g., second screw 9) including a second shaft portion that can engage with the second screw hole are used. Furthermore, the second screw hole is located in the direction of extension of the first screw hole with respect to the first screw hole.

[0067] As shown in Figure 9, first, the worker engages the second shaft portion of the second screw with the second screw hole (Step ST11: Step of engaging with the second screw hole).

[0068] Next, the worker presses the first head with the tip of the second screw (Step ST12: Step of pressing the first head).

[0069] Here, the connector unit is removed by using the first screw hole and the second screw hole, which are located in the direction of extension of the screw hole. (Completed)

[0070] (Mechanism of Action and Effects) According to the superconducting device of this disclosure, the connector unit 6 has a second screw hole located in the direction of extension of the first screw hole relative to the first screw hole. This makes it easier to remove the connector unit 6 by using both the first screw hole and the second screw hole, which are located in the direction of extension of the screw hole. Therefore, the superconducting device relating to this disclosure is easily designed to save space.

[0071] Furthermore, in the above disclosure, the superconducting device 100 has a structure in which the second screw 9 is fitted in the direction of extension of the screw hole. This makes it easier to suppress the enlargement of the superconducting device's body.

[0072] Furthermore, the superconducting device 100 of this disclosure also provides the effect that "the connector unit 6 includes a plurality of connectors (for example, a second connector 63) and a first holding portion (for example, a main body portion 61) that holds each connector," thereby "making it easier to remove the plurality of connectors simultaneously."

[0073] In addition, the superconducting device 100 of this disclosure also has the effect that "each connector can be inserted into and removed from the first holding portion," thereby "making it easy to insert and remove each connector."

[0074] Furthermore, in the superconducting device 100 of this disclosure, the effect is obtained that "the first holding portion and the first screw 8 are made of a non-magnetic material," thereby "electromagnetic noise is less likely to be added to the superconducting circuit of the chip (for example, quantum chip 1)."

[0075] Furthermore, the superconducting device 100 of this disclosure "further comprises a second screw 9 including a second shaft portion 91 that can engage with the second screw hole," thereby providing the effect that "the connector unit 6 can be easily fitted or removed by using the first screw hole and the second screw hole, which are located in the extending direction of the screw hole."

[0076] In addition, the superconducting device 100 of this disclosure has the effect that "the second screw 9 (for example, the second screw 9A) further includes a second head 92, and the second head 92 is capable of pressing the connector unit 6," thereby "facilitating the mating of the connector unit 6 by using the first screw hole and the second screw hole, which are located in the direction of extension of the screw hole."

[0077] In addition, the superconducting device 100 of this disclosure also has the effect that "the tip of the second screw 9 (for example, the second screw 9B) presses against the first head 82," thereby "making it easier to remove the connector unit 6 by using the first screw hole and the second screw hole, which are located in the direction of extension of the screw hole."

[0078] In addition, the superconducting device 100 of this disclosure has the effect that "the second screw (for example, the second screw 9C) further includes a third shaft portion 93, the third shaft portion 93 is continuously aligned with respect to the second shaft portion 91 in the direction of travel, and the diameter of the third shaft portion 93 is smaller than the outer diameter of the second shaft portion 91," thereby "making it easier to remove the connector unit 6 by using the first screw hole and the second screw hole, which are located in the direction of extension of the screw hole."

[0079] In addition, in the superconducting device 100 of this disclosure, the lead of the screw that engages with the second screw hole can be increased because "the root diameter of the second screw hole is larger than the root diameter of the first screw." Therefore, the superconducting device 100 of this disclosure also has the effect that "it is easier to remove the connector unit 6 by using the first screw hole and the second screw hole, which are located in the direction of extension of the screw hole."

[0080] In addition, the superconducting device 100 of this disclosure has the effect that "the board 4 has an opening 41op, and the interposer 2 is housed within the opening 41op," thereby "the enlargement of the superconducting device's body is easily suppressed."

[0081] (First variation) In the above disclosure, bonding wires 3 are used to connect the interposer 2 and the board 4. An opening 41op is provided in the board 4, and the interposer 2 is housed within the opening 41op. In contrast, in this modification, the connection between the interposer 2 and the board 4 may be made using probe pins. In this case, the third wiring layer 42 is provided on the back surface 41s2. For example, the boards 4 are aligned in the first direction (e.g., the Z direction) relative to the interposer 2, and the probe pins are positioned between the interposer 2 and the board 4. The connection between the interposer 2 and the board 4 may be made via the probe pins. In this case, the opening 41op on the board 4 may be closed. Note that when the above connection is made using probe pins, the superconducting device 100 does not need to have bonding wires 3.

[0082] In this modified example, the probe pin is extendable and retractable in the longitudinal direction. For example, one end of the probe pin extends in the -Z direction, and the other end extends in the +Z direction. The probe pin contains a compression spring, and the elastic deformation of the compression spring in the Z direction biases one or the other end of the probe pin in the Z direction. For example, since the biased probe pin is located between the interposer 2 and the board 4, stress is generated in the first wiring layer 22 and / or the third wiring layer 42. As a result, the probe pin comes into close contact with the first wiring layer 22 and / or the third wiring layer 42.

[0083] (Second variation) A metal surface may be provided in the recessed portion 51r. This metal surface covers the recessed portion 51r. This metal surface may include a metal surface made of gold (Au), platinum (Pt), palladium (Pd), etc. This metal surface may be exposed toward the outside of the cooling section 5, or it may be covered and then exposed toward the outside of the cooling section 5. That is, this metal surface may be a thin film or a layered structure. This metal surface may be formed by means of sputtering, vapor deposition, electroless plating, electrolytic plating, etc.

[0084] Thus, the quantum chip 1 is surrounded by the metal surface and the first wiring layer 22 made of a superconducting material, and a cavity resonator is obtained by the metal surface and the second wiring layer 23. At this time, a gap is formed between the quantum chip 1 and the recess 51r. The smaller the gap in the cavity resonator, the higher the resonant frequency of the cavity resonator shifts. Since the resonant frequency generated in the quantum chip is about 5 GHz to 10 GHz, if the gap is reduced and the resonant frequency is shifted to a higher frequency band than this (for example, 20 GHz to 30 GHz), electromagnetic noise will be less likely to be added to the qubit circuit.

[0085] Furthermore, the superconducting material functions as a magnetic shield during cooling. Therefore, the quantum chip 1, surrounded by the metal surface and the second wiring layer 23 made of a superconducting alloy, is provided with magnetic shielding in addition to electromagnetic shielding. As a result, as described above, electromagnetic noise is less likely to be added to the qubit circuit.

[0086] Furthermore, a metal layer such as gold (Au), platinum (Pt), or palladium (Pd) may be formed on the surface of the second wiring layer 23. For example, in the region outside the cavity resonator, a metal layer such as gold (Au), platinum (Pt), or palladium (Pd) may be formed on the surface of the second wiring layer 23.

[0087] Furthermore, if the metal surface is not required, at least a portion of the base material 11 may contact the recessed portion 51r. With this configuration, the quantum chip 1 is directly cooled by the cooling unit 5, making it easier to stabilize the operation of the quantum circuit contained in the quantum chip 1.

[0088] (Third variation) The superconducting device 100 may further include a protective member 7. The protective member 7 prevents external force from being applied to the first connector 43 disposed on the third wiring layer 42. The protective member 7 comprises a main body portion 71 and a pair of mounting portions 72. The main body 71 is capable of holding the first connector 43 to the board 4. The main body 61 is an example of a "second holding part". The main body portion 71 has a front surface 71s1 and a back surface 71s2. The front surface 71s1 is the surface located opposite to the back surface 71s2. In this embodiment, the front surface 71s1 faces the +Z direction. The back surface 71s2 faces the first wiring layer 22. In this embodiment, the back surface 71s2 faces the -Z direction. The back surface 61s2 of the main body portion 61 can contact the front surface 71s1. The back surface 71s2 can contact the third wiring layer 42. In this modified example, the protective member 7 is located between the third wiring layer 42 and the connector unit 6 in the Z direction. The shape of the main body portion 71 is not particularly limited. For example, in this embodiment, the main body portion 71 extends along the horizontal direction. The main body portion 71 has a rectangular cross-sectional shape in the vertical direction.

[0089] The main body 71 is provided with a plurality of openings 71op. Each opening 71op opens in a first direction (for example, the Z direction). The openings 71op are through holes. A portion of the inner circumferential surface of an opening 71op conforms to the outer shape of the first connector 43. This inner circumferential surface holds the first connector 43 in a predetermined position on the board 4. At least a portion of the second connector 63 is housed in the opening 61op.

[0090] The mounting portion 72 is provided at the end of the main body portion 71. Of the pair of mounting portions 72, one mounting portion 72 extends horizontally from one end of the main body portion 71. The other mounting portion 72 extends horizontally from the other end of the main body portion 71. The mounting portion 72 has a seating surface that supports the first screw 8. The first head 82 of the first screw 8 can contact this seating surface. The mounting portion 72 has a seating surface that supports the first screw 8. The seating surface is provided with a through hole through which the first screw 8 can be inserted. In this way, the protective member 7 is fixed to the cooling portion 5 together with the board 4 by the first screw 8.

[0091] The main body portion 71 and the mounting portion 72 may contain the same material as the main body portion 61, or they may contain different materials than the main body portion 61.

[0092] (Fourth variation) The main body portion 61 may have a second screw hole in part. In this case, the main body portion 61 may have an L-shape, a U-shape, or a square shape. Furthermore, the main body portion 71 may have a through hole in part. This through hole corresponds to a second screw hole provided in the main body portion 61. In this case, the main body portion 71 may have an L-shape, a U-shape, or a square shape.

[0093] <Second Embodiment> An embodiment of this disclosure will be described below with reference to the figures. Below, an example of the configuration of a superconducting device in this disclosure will be explained with reference to a figure.

[0094] (composition) As shown in Figures 11 and 12, the superconducting device 100m comprises a chip 1m having a superconducting circuit, an interposer 2m on which the chip 1m is mounted, a board 4m electrically connected to the interposer 2m, a cooling section 5m to which the board 4m is fixed, a first screw 8m that fixes the board 4m to the cooling section 5m and has a first head 82m with a first screw hole 82hm formed therein, and a connector unit 6m that can be fixed to the first screw hole 82hm, wherein the connector unit 6m has a second screw hole 62hm located in the extension direction of the first screw hole 82hm.

[0095] (Mechanism of Action and Effects) According to the superconducting device of this disclosure, the connector unit 6 has a second screw hole 62hm located in the extension direction of the first screw hole 82hm relative to the first screw hole 82hm. This makes it easier to remove the connector unit 6m by using the first screw hole 82hm and the second screw hole 62hm, which are located in the extension direction of the screw hole. Therefore, the superconducting device relating to this disclosure is easily designed to save space.

[0096] <Third Embodiment> An embodiment of this disclosure will be described below with reference to the figures. An example of a method for removing the connector unit in this disclosure will be explained below with reference to the figures.

[0097] As shown in Figure 13, the method for removing the connector unit uses a chip having a superconducting circuit, an interposer on which the chip is mounted, a first screw having a first head with a first screw hole formed therein that fixes a board electrically connected to the interposer, a connector unit having a second screw hole and fixable to the first screw hole, and a second screw including a second shaft portion that can engage with the second screw hole. Furthermore, the second screw hole is located in the direction of extension of the first screw hole with respect to the first screw hole. The method for removing the connector unit includes the steps of engaging the second shaft portion with the second screw hole (step ST11m: step of engaging with the second screw hole) and pressing the first head with the screw tip of the second screw (step ST12m: step of pressing the first head).

[0098] (Mechanism of Action and Effects) The connector unit used in the connector unit removal method of this disclosure has a second screw hole located in the direction of extension of the first screw hole relative to the first screw hole. This makes it easier to remove the connector unit using the first screw hole and the second screw hole, which are located in the direction of extension of the screw hole, in the connector unit removal method of this disclosure.

[0099] Although the present disclosure has been described above with reference to embodiments, the present disclosure is not limited to the embodiments described above. Various modifications to the structure and details of the present disclosure can be made as can be understood by those skilled in the art within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0100] Some or all of the above embodiments may also be described as follows, but are not limited to the following:

[0101] (Note 1) A chip having a superconducting circuit, The interposer on which the aforementioned chip is implemented, A board electrically connected to the interposer, The cooling section to which the aforementioned board is fixed, The board is fixed to the cooling section, and a first screw has a first head in which a first screw hole is formed, A connector unit that can be fixed to the first screw hole, Equipped with, The connector unit has a second screw hole located in the direction of extension of the first screw hole with respect to the first screw hole. Superconducting devices.

[0102] (Note 2) The connector unit includes a plurality of connectors and a first retaining part that holds each connector. The superconducting device described in Appendix 1.

[0103] (Note 3) Each connector is insertable into and removable from the first retaining portion. The superconducting device described in Appendix 2.

[0104] (Note 4) The first retaining part and the first screw are made of a non-magnetic material. The superconducting device described in Appendix 2.

[0105] (Note 5) The board further comprises a second retaining portion that holds a connecting portion electrically connectable to the connector unit, The second retaining part is fixed to the cooling part together with the board. A superconducting device as described in any one of the appendices 1 through 4.

[0106] (Note 6) The system further comprises a second screw including a second shaft portion that can engage with the second screw hole, A superconducting device as described in any one of the appendices 1 through 5.

[0107] (Note 7) The aforementioned second screw further includes a second head, The second head portion is capable of pressing the connector unit. The superconducting device described in Appendix 6.

[0108] (Note 8) The tip of the second screw presses against the first head. The superconducting device described in Appendix 6.

[0109] (Note 9) The second screw further includes a third shaft portion, The third shaft portion is arranged in a continuous manner with respect to the second shaft portion in the direction of travel, The diameter of the third shaft portion is smaller than the outer diameter of the second shaft portion. The superconducting device described in Appendix 8.

[0110] (Note 10) The root diameter of the second screw hole is larger than the root diameter of the first screw. A superconducting device as described in any one of the appendices 1 through 9.

[0111] (Note 11) The board has an opening, The interposer is housed within the opening. A superconducting device as described in any one of the appendices 1 through 10.

[0112] (Note 12) A chip having a superconducting circuit, An interposer equipped with the aforementioned chip, A first screw having a first head in which a first screw hole is formed, which fixes a board electrically connected to the interposer, A connector unit having a second screw hole and fixable to the first screw hole, A second screw including a second shaft portion that can engage with the second screw hole, Using The steps include engaging the second shaft portion with the second screw hole, The steps include pressing the first head with the tip of the second screw, Includes, The second screw hole is located in the direction of extension of the first screw hole with respect to the first screw hole. How to remove the connector unit.

[0113] (Note 13) The connector unit includes a plurality of connectors and a first retaining part that holds each connector. The method for removing the connector unit as described in Appendix 12.

[0114] (Note 14) Each connector is insertable into and removable from the first retaining portion. The method for removing the connector unit as described in Appendix 13.

[0115] (Note 15) The first retaining part and the first screw are made of a non-magnetic material. The method for removing the connector unit as described in Appendix 13.

[0116] (Note 16) The cooling section to which the aforementioned board is fixed, A second holding portion that holds a connection portion electrically connectable to the connector unit on the board, Furthermore, The second retaining part is fixed to the cooling part together with the board. The method for removing the connector unit described in any one of the appendices 12 to 15.

[0117] (Note 17) The system further comprises a second screw including a second shaft portion that can engage with the second screw hole, The method for removing the connector unit described in any one of the appendices 12 to 16.

[0118] (Note 18) The aforementioned second screw further includes a second head, The second head portion is capable of pressing the connector unit. The method for removing the connector unit as described in Appendix 17.

[0119] (Note 19) The tip of the second screw presses against the first head. The method for removing the connector unit as described in Appendix 17.

[0120] (Note 20) The second screw further includes a third shaft portion, The third shaft portion is arranged in a continuous manner with respect to the second shaft portion in the direction of travel, The diameter of the third shaft portion is smaller than the outer diameter of the second shaft portion. The method for removing the connector unit as described in Appendix 19.

[0121] (Note 21) The root diameter of the second screw hole is larger than the root diameter of the first screw. The method for removing the connector unit described in any one of the appendices 12 to 20.

[0122] (Note 22) The board has an opening, The interposer is housed within the opening. The method for removing the connector unit as described in any one of the appendices 12 to 21. [Explanation of symbols]

[0123] 1. Quantum chip 11 Base material 12 Connection part 2 Interposer 21 Base material 21s1 surface 21s2 back side 22 First wiring layer 23 Second wiring layer 24 Bump 3 Bonding wire 4 boards 41 Base material 41op aperture 4a Inner surface 41s1 surface 41s2 Reverse side 42 Third wiring layer 43 First Connector 5 Cooling section 51 Main body 51s1 surface 51g First thread groove 51r recessed area 6 Connector Units 61 Main body 61s1 surface 61s2 Reverse side 61op aperture 63c Counterbore 62 Mounting part 62g Second thread groove 62h Engagement hole (second screw hole) 63 Second connector 7. Protective components 71 Main body 71s1 surface 71s2 back side 71op aperture 72 Mounting part 8 First screw 81 First shaft part 81g Third thread groove 82 First head 82h Engagement hole (first screw hole) 82h1 Bottom 82h2 Side surface 82g Fourth thread groove 9, 9A, 9B, 9C Second thread 91 Second shaft part 91g Fifth thread groove 91gs Fifth thread groove 92 Second head 93 Third shaft part 1m chip 2m Interposer 4m board 5m cooling section 6m Connector Unit 62hm Second screw hole 8m First Screw 82m First head 82hm First screw hole 100 Superconducting Devices 100e1 1st end 100e2 2nd end 100e3 3rd end 100e4 4th end 100m Superconducting Device

Claims

1. A chip having a superconducting circuit, The interposer on which the aforementioned chip is implemented, A board electrically connected to the interposer, The cooling section to which the aforementioned board is fixed, The board is fixed to the cooling section, and a first screw has a first head in which a first screw hole is formed, A connector unit that can be fixed to the first screw hole, Equipped with, The connector unit has a second screw hole located in the direction of extension of the first screw hole with respect to the first screw hole. Superconducting devices.

2. The connector unit includes a plurality of connectors and a first retaining part that holds each connector. The superconducting device according to claim 1.

3. Each connector is insertable into and removable from the first retaining portion. The superconducting device according to claim 2.

4. The first retaining part and the first screw are made of a non-magnetic material. The superconducting device according to claim 2.

5. The board further comprises a second retaining portion that holds a connecting portion electrically connectable to the connector unit, The second retaining part is fixed to the cooling part together with the board. A superconducting device according to any one of claims 1 to 4.

6. The system further comprises a second screw including a second shaft portion that can engage with the second screw hole, A superconducting device according to any one of claims 1 to 4.

7. The aforementioned second screw further includes a second head, The second head portion is capable of pressing the connector unit. The superconducting device according to claim 6.

8. The tip of the second screw presses against the first head. The superconducting device according to claim 6.

9. The second screw further includes a third shaft portion, The third shaft portion is arranged in a continuous manner with respect to the second shaft portion in the direction of travel, The diameter of the third shaft portion is smaller than the outer diameter of the second shaft portion. The superconducting device according to claim 8.

10. A chip having a superconducting circuit, An interposer equipped with the aforementioned chip, A first screw having a first head in which a first screw hole is formed, which fixes a board electrically connected to the interposer, A connector unit having a second screw hole and fixable to the first screw hole, A second screw including a second shaft portion that can engage with the second screw hole, Using The steps include engaging the second shaft portion with the second screw hole, The steps include pressing the first head with the tip of the second screw, Includes, The second screw hole is located in the direction of extension of the first screw hole with respect to the first screw hole. How to remove the connector unit.

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