Base material or light-emitting device

Abstract

This can contribute to miniaturizing light-emitting devices. [Solution] A lower part having an upper surface, a first side surface, a second side surface not adjacent to the first side surface, and It has multiple inner surfaces, including a first side and an adjacent third side, and a side portion that surrounds the upper surface of the lower part. The side portion is formed on the inside of a plurality of inner surfaces along part or all of the first side surface when viewed from above. A first stepped portion and, when viewed from above, formed on the inside of multiple inner surfaces along part or all of the second side surface The second stepped portion and, when viewed from above, formed on the inside of multiple inner surfaces along only a part of the third side surface It includes a third stepped portion, and the first stepped portion has a first upper surface on which a wiring pattern is provided. The second stepped section has a second upper surface on which a wiring pattern is provided, and the third stepped section has a wiring pattern A base member having a third upper surface on which a function is provided.

Description

Technical Field

[0001] The present invention relates to a base member or a light-emitting device.

Background Art

[0002] Patent Document 1 discloses a package including a base on which a semiconductor laser element is disposed. In this base, a frame surrounding the semiconductor laser element is provided, and an electrode layer provided at a step portion between the semiconductor laser element and the frame is electrically connected.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Patent Document 1 discloses a suitable form of the base. On the other hand, this is not the only form of the light-emitting device, and there is still room for improvement when expanding functions and improving convenience while suppressing an increase in the size of the light-emitting device.

Means for Solving the Problems

[0005] The base member disclosed in the embodiment has a lower portion having an upper surface, and a plurality of inner surfaces including a first side surface, a second side surface not adjacent to the first side surface, and a third side surface adjacent to the first side surface, and has a side portion surrounding the upper surface of the lower portion, and the side portion has a first step portion formed inside the plurality of inner surfaces along a part or all of the first side surface in a top view, a second step portion formed inside the plurality of inner surfaces along a part or all of the second side surface in a top view, and a front... ... in a top view.​​​​​​ Includes a third stepped portion formed on the inside of the plurality of inner surfaces along only a portion of the third side surface. The first stepped portion has a first upper surface on which a wiring pattern is provided, and the second stepped portion has The third stepped portion has a second upper surface on which a wiring pattern is provided, and the third stepped portion has a wiring pattern provided It has a third upper surface.

[0006] The light-emitting device disclosed in the embodiment includes a first light-emitting element and a first length in the first direction. A plurality of light-emitting elements, including a second light-emitting element smaller than the optical element, and the plurality of light-emitting elements arranged A lower part having an upper surface, a first side surface, a second side surface not adjacent to the first side surface, and the It has multiple inner surfaces, including one side and a third adjacent side, and a side portion that surrounds the upper surface of the lower part, A base member having a plurality of light-emitting elements, and a plurality of wires electrically connecting the plurality of light-emitting elements to the base member, The side portion is provided with the plurality of inner surfaces along part or all of the first side surface when viewed from above. A first stepped portion formed on the inside, and the multiple along part or all of the second side surface when viewed from above. A second stepped portion is formed on the inner side of the inner surface of the number, and in a top view, along only a part of the third side surface The first step portion includes a third stepped portion formed on the inner side of the plurality of inner surfaces, and the first stepped portion is a first step portion The first upper surface has a line pattern, and the second stepped portion has a second wiring pattern. The third stepped portion has a second upper surface on which a third wiring pattern is provided. The plurality of wires include a first wire connected to the first wiring pattern and a second wire connected to the second wiring pattern. It includes a second wiring that is joined and a third wiring that is joined to a third wiring pattern. The direction is perpendicular to the third side surface.

[0007] In at least one of the one or more inventions disclosed by the embodiment, an effect of contributing to miniaturization of the device is expected.

Brief Description of the Drawings

[0008] [Figure 1] FIG. 1 is a perspective view of a light-emitting device according to the first and second embodiments. [Figure 2] FIG. 2 is a top view of a light-emitting device according to the first and second embodiments. [Figure 3] FIG. 3 is a perspective view showing a state before an optical member of a light-emitting device according to the first and second embodiments is mounted. [Figure 4] FIG. 4 is a top view in the state of FIG. 3. [Figure 5] FIG. 5 is a perspective view for explaining each component arranged inside a light-emitting device according to the first embodiment. [Figure 6] FIG. 6 is a top view in the state of FIG. 5. [Figure 7] FIG. 7 is a top view of the state of FIG. 6 with wiring removed. [Figure 8] FIG. 8 is a cross-sectional view taken along the VIII-VIII cross-section line of FIG. 7. [Figure 9] FIG. 9 is a cross-sectional view taken along the IX-IX cross-section line of FIG. 7. [Figure 10] FIG. 10 is a top view for explaining each component arranged inside a light-emitting device according to the second embodiment. [[ID=�9]] [Figure 11] FIG. 11 is a perspective view of a light-emitting device according to the third embodiment. [Figure 12] FIG. 12 is a top view of a light-emitting device according to the third embodiment. [Figure 13] FIG. 13 is a top view of a wiring board according to the third embodiment. [Figure 14] FIG. 14 is a diagram for explaining wiring of a wiring board according to the third embodiment. [Figure 15]Figure 15 is a top view of the light-emitting device according to the fourth embodiment. [Figure 16] Figure 16 is a top view of a wiring board according to the fourth embodiment. [Figure 17] Figure 17 is a diagram illustrating the wiring of a wiring board according to the fourth embodiment. [Modes for carrying out the invention]

[0009] In this specification or in the claims, with respect to polygons such as triangles and quadrilaterals, This includes polygons and shapes where the corners of a square have been processed with rounded corners, chamfers, or other similar processes. This shall be referred to as such. Furthermore, the same applies not only to corners (ends of edges) but also to shapes where processing has been done on the middle part of the edges. This will be referred to as a polygon. In other words, while retaining the polygon as a base, partial processing is performed. The resulting shape is included in the interpretation of “polygon” as described herein and in the claims. Let's assume that.

[0010] Furthermore, the same applies not only to polygons, but also to words describing specific shapes such as trapezoids, circles, and concave shapes. The same applies when dealing with each edge that forms that shape. In other words, on a certain edge... Even if processing has been done to the corners or middle parts, the interpretation of "edge" includes the processed parts. It is possible to distinguish between polygons and edges that have not undergone partial processing and processed shapes. The term "quadrilateral" should be preceded by the word "strictly" or "strictly," for example, "strictly quadrilateral."

[0011] Furthermore, in this specification or the claims, the up and down, left and right, front and back, front and back, and front and back Each description merely states the relative positions, orientations, and directions, and does not relate to the relationship during use. It doesn't have to match the assigned person.

[0012] Furthermore, directions such as the X, Y, and Z directions are indicated in the drawings using arrows. There is a corresponding arrow. The direction of this arrow is consistent across multiple drawings representing the same embodiment.

[0013] Furthermore, in this specification, when describing components, for example, the terms "component" or "part" may be used. It may be included. "Component" refers to an object that is treated as a single, physical unit. The objects handled by the body can also be defined as objects that are treated as individual parts in the manufacturing process. On the other hand, "part" refers to an object that does not need to be treated as a separate physical entity. For example, 1 The term "part" is used when referring to a portion of a component.

[0014] Furthermore, the distinction between "component" and "part" mentioned above is made with an awareness of the scope of rights in the interpretation of the doctrine of equivalents. This does not indicate an intention to limit the scope to "members" and Even if the listed components exist, that alone does not mean that these components are physically... The applicant does not believe that handling the invention in isolation is essential for its application. .

[0015] Furthermore, within this specification or the claims, there are multiple components, and each of them When distinguishing between them, the components are distinguished by adding "1st" or "2nd" to their names. Furthermore, the subject matter to be distinguished between this specification and the claims may differ. Therefore, the claims describe components that have the same annotations as those specified herein. However, if the subject matter identified by this component is not the same as the scope of this specification and the claims. It is possible that it will not happen.

[0016] For example, configurations that are distinguished in this specification by being designated as “First,” “Second,” and “Third.” The elements include the components designated as “First” and “Third” in this specification, and the claims When describing the scope, for the sake of readability, the claims should be labeled as "First" and "Second". The components may be distinguished by adding the following note. In this case, the claims will be “first” The components designated as “Second” are, in this specification, designated as “First,” “Third,” etc. This refers to the constituent elements. Note that this rule does not apply only to constituent elements, but also to other elements. It can be applied rationally and flexibly to other subjects as well.

[0017] The embodiments for carrying out the present invention will be described below. Furthermore, with reference to the drawings, Specific embodiments for carrying out the present invention will be described. The invention is not limited to this specific form. In other words, the illustrated embodiments are examples of how the present invention is realized. This is not the only form. Furthermore, the size and positional relationships of the components shown in each drawing are for ease of understanding. Sometimes things are exaggerated for the sake of accuracy.

[0018] <First Embodiment> A light-emitting device 1 according to the first embodiment will be described. Figures 1 to 9 show an exemplary light-emitting device 1. These are diagrams to explain the form. Figure 1 is a perspective view of the light-emitting device 1. Figure 2 is a perspective view of the light-emitting device Figure 3 is a top view of the unit 1. Figure 3 is an oblique view showing the state of the light-emitting device 1 before the optical element 80 is mounted. This is a visual view. Figure 4 is a top view of the state in Figure 3. Figure 5 shows the inside of the light-emitting device 1. This is a perspective view illustrating each component being placed. Figure 6 is a top view in the state shown in Figure 5. The dashed lines in Figure 6 show specific examples of the first and second virtual lines, which will be discussed later. Figure 7 This is a top view of the state shown in Figure 6, with the wiring 60 removed. Figure 8 shows the VIII-VIII section of Figure 7. This is a cross-sectional view along the plane line. Figure 9 is a cross-sectional view along the IX-IX section in Figure 7.

[0019] The light-emitting device 1 comprises multiple components. These multiple components include a base member 10A, One or more light-emitting elements 20, one or more submounts 30, one or more reflectors Material 40, one or more protective elements 50, multiple wirings 60, cover member 70, and optical member 8 Including 0. The light-emitting device 1 includes a plurality of light-emitting elements, including a first light-emitting element 20A and a second light-emitting element 20B. It can be equipped with element 20.

[0020] The light-emitting device 1 may also have other components. For example, the light-emitting device 1 may include: In addition to the multiple light-emitting elements 20, the device may also have further light-emitting elements. It does not need to possess some of the components listed here.

[0021] First, let's explain each component.

[0022] (Base member 10A) The base member 10A has an upper surface 11A, a lower surface 11B, and one or more outer surfaces 11C. In a top view, the outer edge shape of the base member 10A is rectangular. This rectangle has a long side and a short side. It can be rectangular. In the base member 10A shown in the figure, the direction of the longer side of this rectangle is the X direction. The direction is the same as the direction of the front, and the direction of the short side is the same as the Y direction. Note that, in a top view, the base member 10 The outer shape of A does not have to be rectangular.

[0023] A concave shape is formed in the base member 10A. From the upper surface 11A, A recessed shape is formed downwards. The recess is defined by the recessed shape of the base member 10A. The recess is surrounded by the upper surface 11A when viewed from above.

[0024] The inner edge of the upper surface 11A defines the outer edge of the depression. In a top view, the outer edge shape of the depression is rectangular. This rectangle can be a rectangle having a long side and a short side. The base member 10A shown in the figure In this rectangle, the direction of the longer side is the same as the X direction, and the direction of the shorter side is the same as the Y direction. Yes, it exists. Note that the outer edge shape of this depression does not necessarily have to be rectangular.

[0025] The base member 10A has a mounting surface 11D and one or more inner surfaces 11E. 11D is located below the upper surface 11A and above the lower surface 11B. Multiple inner surfaces 11E are located above the mounting surface 11D. E intersects with the upper surface 11A. Multiple surfaces defining the recess of the base member 10A, the mounting surface 11D and One or more inner surfaces 11E are included.

[0026] One or more inner surfaces 11E are provided perpendicular to the mounting surface 11D. A difference of ±3 degrees is tolerable for the straightness. Note that the inner surface 11E is not perpendicular to the mounting surface 11D. That's fine.

[0027] The base member 10A has a lower part 12A and a side part 12B. The lower surface 11B is attached to the lower part 12A. The upper surface 11A and one or more outer surfaces 11C are included in the side portion 12B. The mounting surface 11D is included in the lower part 12A. One or more inner surfaces 11E are included in the side part 12B. In the illustrated example of the base member 10A, the side portion 12B further has a lower surface, and the base member 10A It has a lower surface 11B of the lower part 12A and a lower surface of the side part 12B.

[0028] The side portion 12B surrounds the mounting surface 11D. In a top view, the mounting surface 11D is surrounded by the side portion 12B. It is enclosed. The mounting surface 11D can also be considered the top surface of the lower part 12A.

[0029] The base member 10A has one or more stepped portions 12C. The stepped portions 12C have an upper surface and It has an inner surface that intersects with the upper surface and extends downward from the upper surface. The upper surface of the stepped portion 12C is the inner surface It intersects with 11E. The inner surface of the stepped portion 12C intersects with the mounting surface 11D.

[0030] One or more stepped portions 12C are included in the side portion 12B. When viewed from above, the stepped portion 12C is It is formed along part or all of the inner surface 11E. One or more stepped portions 12C are formed on top In a top view, it is formed on the inside of the upper surface 11A. One or more stepped portions 12C are formed in a top view. Alternatively, it is formed on the inside of multiple inner surfaces 11E.

[0031] The base member 10A may have a plurality of stepped portions 12C. The plurality of stepped portions 12C have, when viewed from above The step portion 12C is formed along part or all of the inner surface 11E. The difference portion 12C has a stepped portion 12C that, when viewed from above, is formed along only a part of the inner surface 11E. Included. Multiple stepped portions 12C are formed along the entire inner surface 11E when viewed from above. The stepped portion 12C is included.

[0032] Multiple stepped portions 12C are formed along a part or all of a certain inner surface 11E when viewed from above. A stepped portion 12C which is formed along only a part of another inner surface 11E , is included. When an additional step portion 12C is provided, a step along the inner surface 11E is partially included. By providing the differential portion 12C, the remaining portion can be used as the mounting surface 11D. By using 10A, the device can be made smaller.

[0033] Multiple stepped portions 12C have two formed along each of the adjacent inner surfaces 11E The stepped portion 12C includes two integrally formed stepped portions 12C. In this case, In a top view, the stepped portion 12C is formed along one of the adjacent inner surfaces 11E. This connects to the stepped portion 12C formed along the other inner surface 11E. The upper surface of the stepped portion 12C can be provided on the same plane. The two stepped portions 12C can be integrated. By forming it in this way, it can be made into a shape that is easy to manufacture.

[0034] Multiple stepped portions 12C are stepped portions formed along the entire surface of a certain inner surface 11E when viewed from above. Formed along 12C and only along a portion of another inner surface 11E that is longer than this inner surface 11E. It may include a stepped portion 12C.

[0035] Multiple stepped portions 12C are connected along the inner surface 11E in a direction parallel to the upper surface of the lower portion 12A. This includes a stepped portion 12C formed with a length of 10% to 75% of the length of the inner surface 11E. In addition to this stepped portion 12C, there is a flat surface along the inner surface 11E on the upper surface of the lower part 12A. A step formed with a length of 30% to 100% of the length of this inner surface 11E in the direction of the row. The differential part 12C is included.

[0036] One or more wiring patterns 13 are provided on the upper surface of the stepped portion 12C. N13 is connected to other wiring provided in the side 12B via wiring that passes through the inside of the side 12B The turn is electrically connected. The wiring pattern 13 is a wiring pattern provided on the lower surface of the side portion 12B. It is electrically connected to the turn. It can also be electrically connected to the wiring pattern.

[0037] Multiple wiring patterns 13 are provided on the upper surface of one or more stepped portions 12C. One or more wiring patterns 13 may be provided on each of the stepped portions 12C. 10A can have a stepped portion 12C on its upper surface with multiple wiring patterns 13. ru.

[0038] By providing the wiring pattern 13 on the upper surface of the stepped portion 12C, a position higher than the mounting surface 11D is achieved. This allows you to connect the wiring. This makes the wiring connection process easier. ru.

[0039] The lower part 12A and the side part 12B of the base member 10A are formed using different materials as the main material. This is possible. The base member 10A consists of a member that constitutes the lower part 12A and a member that constitutes the side part 12B. , can be formed by joining them. In the illustrated base member 10A, a flat plate-shaped member is formed The lower part 12A and the side part 12B, which is a frame-shaped member, are joined together.

[0040] Here, the main material is the material that makes up the largest proportion by weight or volume in the target formation. This refers to the material that makes up the object. Note that when the target object is formed from a single material... In this case, that material is the main material. In other words, for a material to be the main material, it means that the proportion of that material This includes the possibility that the percentage can reach 100%.

[0041] The base member 10A has ceramic as the main material of the side portion 12B, and metal as the main material of the lower portion 12A, Alternatively, a composite material containing metal can be used. The base member 10A has a lower part 12A and a side part 12 It can be formed by joining B. Furthermore, the lower part 12A and the side part 12B are formed integrally. A base member 10A may be used. In this case, for example, ceramic may be used as the main material, Member 10A can be formed.

[0042] Examples of ceramics include aluminum nitride, silicon nitride, aluminum oxide, and carbon Examples include silicon dioxide. Examples of metals include copper, aluminum, and iron. Alternatively, as a composite material containing metal, copper-molybdenum, copper-diamond composite material, Copper tungsten and other materials can be used.

[0043] By forming the lower part 12A separately from the side part 12B, the lower part has different characteristics from the side part 12B. It can be provided in 12A. For example, the metal used in the lower part 12A can be used in the side part 12B By using a ceramic with superior heat dissipation (high thermal conductivity) compared to the ceramic used in the product, This makes it easier to dissipate heat generated from components mounted on the mounting surface 11D. Furthermore, by providing a wiring pattern 13 on the stepped portion 12C of the side portion 12B, metal plates and the like can be used. The lower part 12A can be formed with a conductive material while securing an area for wiring connections. .

[0044] The base member 10A shown in the diagram has an inner surface 11E (hereinafter referred to as the first surface), this first The inner surface 11E that is not adjacent to the side surface (hereinafter referred to as the second side surface), and the side adjacent to the first side surface It has multiple inner surfaces 11E, including the inner surface 11E (hereinafter referred to as the third surface). First surface The second side faces the third side. The third side is adjacent to the second side. The base member 10A is further, The inner surface 11E (hereinafter referred to as the fourth surface) is adjacent to the first and second surfaces and faces the third surface. .) has. For example, 11E1, 11E2, 11E3, and 11E4 in Figure 7 are each These can be the first side, the second side, the third side, and the fourth side.

[0045] The illustrated base member 10A has multiple inner surfaces along part or all of the first side surface when viewed from above. A stepped portion 12C (hereinafter referred to as the first stepped portion) is formed on the inside of 11E, and the second stepped portion is visible from above. Stepped portions 12C (and more) are formed on the inside of multiple inner surfaces 11E along part or all of the side surface. (Below, this is called the second stepped section.) And, in a top view, along only a portion of the third side, there are multiple inner surfaces 11E It has a stepped portion 12C (hereinafter referred to as the third stepped portion) formed on the inside of it. For example, Figure 7 shows 12C1, 12C2, and 12C3 as the first stepped section, the second stepped section, and This can be used as a third stepped section.

[0046] In the base member 10A shown in the diagram, the first side and the second side face each other. The third side and the fourth side face each other. The sides are opposite each other. In a top view, the first and second sides extend in the Y direction, and the third and fourth sides... The surface extends in the X direction. In a top view, the direction perpendicular to the first side surface is the X direction. In a top view, The direction perpendicular to the two sides is the X direction. In a top view, the direction perpendicular to the third side is the Y direction. In a top view, the direction perpendicular to the fourth side is the Y direction.

[0047] In the base member 10A shown in the figure, the line of intersection between the first side surface and the first stepped portion is parallel to the Y direction. Yes. The line of intersection between the first step and the mounting surface 11D is parallel to the Y direction. The second side surface and the second step The line of intersection with the part is parallel to the Y direction. The line of intersection between the second stepped part and the mounting surface 11D is parallel to the Y direction. It is a row.

[0048] In the base member 10A shown in the diagram, the line of intersection between the third side surface and the third stepped portion is parallel to the X direction. Yes. The intersection line between the third stepped section and the mounting surface 11D is parallel to the X direction. The third side and the mounting surface 1 The line of intersection with 1D is parallel to the X direction. The line of intersection between the fourth side and the mounting surface 11D is parallel to the X direction. That is the case.

[0049] In the base member 10A shown in the diagram, the second stepped portion and the third stepped portion are integrally formed. In a top view, a second stepped portion is formed along the second side surface, and a third stepped portion is formed along the third side surface. The three stepped sections are connected. Also, the upper surfaces of these two stepped sections 12C are provided on the same plane. Yes, they are.

[0050] In the base member 10A shown in the diagram, the upper surface of the first stepped portion (hereinafter referred to as the first upper surface) One or more wiring patterns 13 (hereinafter referred to as the first wiring pattern) are provided. The upper surface of the second stepped section (hereinafter referred to as the second upper surface) has one or more wiring patterns 13 ( Hereafter referred to as the second wiring pattern, a third stepped section is provided. The upper surface of the third stepped section (hereinafter referred to as the third upper surface and ) contains one or more wiring patterns 13 (hereinafter referred to as the third wiring pattern). It will be established.

[0051] In the base member 10A shown in the diagram, the third stepped portion is along the third side surface and above the lower part 12A. It is formed with a length of 10% to 75% of the length of the third side surface in the direction parallel to the surface. In a surface view, the length along the third side of the third step is 10% of the length along the second side of the second step. The above is 75% or less. When the partially provided third step section is kept within the necessary range. Therefore, the base member 10A may be such that the length of the third stepped section is smaller than that of the second stepped section.

[0052] In the base member 10A shown in the diagram, the second side is in a direction parallel to the upper surface of the lower part 12A. The length of the third side is greater than the length of the second side. The length of the second side is 20 times the length of the third side. It is between % and 90%. The first step is formed along the entire first side surface. Second step The section is formed along the entire second side surface. The step is formed along the longer inner surface surface. By making the part a partially formed stepped section, it becomes easier to secure an area that contributes to miniaturization. ru.

[0053] (Light-emitting element 20) The light-emitting element 20 has a light-emitting surface from which it emits light. The light-emitting element 20 has an upper surface, a lower surface, and multiple It has sides. The top, bottom, or side of the light-emitting element 20 becomes the light-emitting surface. 20 has one or more light-emitting surfaces.

[0054] The shape of the top surface of the light-emitting element 20 is a rectangle with a long side and a short side. The shape of the top surface does not have to be rectangular. A semiconductor laser element is used for the light-emitting element 20. This can be done. Note that the light-emitting element 20 is not limited to semiconductor laser elements, but can also be light-emitting diodes, etc. You may adopt this approach.

[0055] The light-emitting element 20 may include, for example, a light-emitting element that emits blue light and a light-emitting element that emits green light. A light-emitting element that emits red light can be used. Furthermore, light-emitting elements that emit light of other colors may be employed.

[0056] Here, blue light is defined as light whose emission peak wavelength is in the range of 420 nm to 494 nm. This refers to green light, whose emission peak wavelength is in the range of 495 nm to 570 nm. This refers to light in the following range. Red light has an emission peak wavelength of 605 nm to 750 nm. This refers to light within a certain range.

[0057] Here, we will describe a semiconductor laser element, which is an example of a light-emitting element 20. Semiconductor laser The element has a rectangular shape when viewed from above, with one opposite side being the longer side and the other opposite side being the shorter side. Light emitted from a conductive laser element (laser beam) has a broad beam. Divergent light is emitted from the emission end face of the child. The emission end face of the semiconductor laser element is the light-emitting element 20 It can be called a light-emitting surface.

[0058] Light emitted from a semiconductor laser element exhibits an elliptical shape in a plane parallel to the light emission end face. An FFP (Far Field Pattern) is formed. FFP refers to the exit end face. This refers to the shape and light intensity distribution of the emitted light at a distance from the source.

[0059] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light intensity distribution of the FFP The light with peak intensity will be called light traveling along the optical axis, or light passing through the optical axis. In the light intensity distribution of FFP, 1 / e of the peak intensity value 2 Light having the above intensity, This will be referred to as the main part of the light.

[0060] The shape of the FFP of light emitted from a semiconductor laser element is such that the plane parallel to the light emission end face is Therefore, the ellipse shape is longer in the stacking direction than in the direction perpendicular to the stacking direction. The stacking direction is, This refers to the direction in which multiple semiconductor layers, including the active layer, are stacked in a semiconductor laser device. The direction perpendicular to the stacking direction can also be called the plane direction of the semiconductor layer. Also, the elliptical shape of FFP The long axis of the shape is the speed axis direction of the semiconductor laser element, and the short axis direction is the slow axis direction of the semiconductor laser element. You could also say that.

[0061] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The angle at which light of a certain light intensity spreads is half This is defined as the divergence angle of light from a conductive laser element. The divergence angle is 1 / e of the peak light intensity. 2 Light intensity In addition to degrees, it can also be determined, for example, from the light intensity at half the peak light intensity. In the explanation, when simply referring to the "angle of light divergence," it means 1 / e of the peak light intensity. 2 Light intensity This refers to the angle of light divergence. Note that the angle of divergence in the fast axis direction is greater than the angle of divergence in the slow axis direction. It can be said to be larger than the curvature.

[0062] A semiconductor laser element that emits blue light, or a semiconductor laser element that emits green light. Examples include semiconductor laser elements containing nitride semiconductors. Examples of nitride semiconductors include, for example... GaN, InGaN, and AlGaN can be used. A semiconductor that emits red light. As laser elements, InAlGaP, GaInP, GaAs, and AlGaAs are used. Examples include those containing conductors.

[0063] (Submount 30) The submount 30 has two joining surfaces and is composed of a rectangular parallelepiped shape. The top surface of 30 is rectangular in shape. The top surface of the submount 30 is rectangular with a short side and a long side. It can take on a shape.

[0064] The submount 30 has one joint surface on the opposite side of the other joint surface. The distance between the mating surfaces is smaller than the distance between any other pair of opposing surfaces. The shape is not limited to a rectangular prism. The submount 30 can be, for example, silicon nitride, aluminum nitride. It can be formed using aluminum or silicon carbide. Furthermore, the joining surface has a bonding agent. A metal film is provided.

[0065] (Reflective member 40) The reflective member 40 has a light-reflecting surface that reflects light. The light-reflecting surface is also tilted relative to the lower surface. It is angled. In other words, the arrangement of the light-reflecting surfaces, when viewed from below, is neither perpendicular nor parallel. The straight line connecting the lower and upper ends of the ray plane is inclined with respect to the lower surface of the reflecting member 40. The angle of the light-reflecting surface, or the angle of the line connecting the lower and upper ends of the light-reflecting surface relative to the lower surface, This will be called the inclination angle of the light-reflecting surface.

[0066] In the illustrated reflective member 40, the light-reflecting surface is flat and below the reflective member 40 It forms a 45-degree inclination angle with respect to the surface. Note that the light-reflecting surface does not have to be flat; for example, it can be a curved surface. It is acceptable to have one. Also, the angle of inclination of the light-reflecting surface does not have to be 45 degrees.

[0067] The reflective member 40 can use glass or metal as its main material. Suitable materials include, for example, quartz or glass such as BK7 (borosilicate glass), and aluminum. Other metals can be used. The reflective member 40 can also be formed using Si as the main material. Yes, it is possible. If the main material is a reflective material, a light-reflecting surface can be formed from the main material. When forming a light-reflecting surface separately from the material, the light-reflecting surface may be made of metals such as Ag, Al, or Ta. Using dielectric multilayer films such as 2O5 / SiO2, TiO2 / SiO2, and Nb2O5 / SiO2 It can be formed by [doing something].

[0068] On a light-reflecting surface, the reflectance for the peak wavelength of the light irradiated onto the surface is 90% or higher. Furthermore, this reflectivity may be 95% or higher. It is also possible to do so. The light reflectance is 100% or less.

[0069] (Protection element 50) The protective element 50 is activated when an excessive current flows through a specific element (e.g., the light-emitting element 20) and it is destroyed. This is to prevent accidental storage. The protective element 50 is, for example, a Zener diode. One example is the do. Also, a Zener diode made of Si can be used. ru.

[0070] (Wiring 60) The wiring 60 is a linear conductive material with joints at both ends. The joints at both ends are other components This is the connection point with the element. Wiring 60 is, for example, a metal wire. Metals include, for example, Gold, aluminum, silver, copper, etc., can be used.

[0071] (Lid member 70) The lid member 70 has a bottom surface and an top surface, and is composed of a rectangular parallelepiped flat plate shape. It does not have to be a body. The lid member 70 has light-transmitting properties. Here, light-transmitting properties mean, The light transmittance must be 80% or higher. This applies to light of all wavelengths. It is not necessary for the lid member 70 to have a non-transmitting region (transmitting) in part. It may have areas that it does not have.

[0072] The lid member 70 is formed using glass as the main material. The main material forming the lid member 70 is It is a material with high light transmittance. The lid member 70 is not limited to glass, but for example, sapphire. It may also be formed using it as the main material.

[0073] (Optical component 80) The optical member 80 has an upper surface, a lower surface, and side surfaces. The optical member 80 receives incident light. In contrast, optical processes such as reflection, transmission, and refraction, as well as optical functions such as focusing, diffusion, and collimation, are different. To give something a use for.

[0074] The optical component 80 may have one or more lens surfaces. The one or more lens surfaces allow light to pass through. It is provided on the upper side of the academic member 80. Alternatively, it may be provided on the lower side of the optical member 80. The top and bottom surfaces are flat. One or more lens surfaces intersect with the top surface. The lens surface is enclosed by the top surface when viewed from above. When viewed from above, the optical element 80 has a rectangular outer shape. The lower surface of the optical element 80 is rectangular.

[0075] The portion of the optical element 80 that overlaps with one or more lens surfaces when viewed from above is defined as the lens portion. In the lens component 80, the portion that overlaps with the top surface when viewed from above is defined as the non-lens portion. The lens portion is defined as the top surface When divided into two by a virtual plane including the lens surface, the lens surface side is the lens-shaped part, and the lower surface side is the flat plate-shaped part. The lower surface of the lens portion is a part of the lower surface. In the optical component 80, the lower surface is the lens. It consists of the lower surface of the lens portion and the lower surface of the non-lens portion.

[0076] The illustrated optical element 80 has multiple lens surfaces. Furthermore, the multiple lens surfaces are They are formed in a continuous line in one direction. The optical member 80 has four lens surfaces, and these four lenses The surfaces are formed so that their vertices lie on a straight line.

[0077] Here, the direction in which multiple lens surfaces are aligned when viewed from above is called the connection direction. In a top view, the length of the lens surface in the connection direction is greater than the length in the direction perpendicular to this direction. (Figure) In the optical member 80 shown, the connection direction is the same as the X direction.

[0078] The optical component 80 has high light transmittance. The optical component 80 has a lens portion and a non-lens portion. It also exhibits high light transmittance even in misaligned positions. Furthermore, the optical component 80 as a whole exhibits high light transmittance. The optical component 80 can be formed using, for example, glass such as BK7.

[0079] (Light-emitting device 1) Next, we will describe the light-emitting device 1 equipped with the above-mentioned components. In the light-emitting device 1, one or more light-emitting elements 20 are arranged on the mounting surface 11D. Alternatively, each of the multiple light-emitting elements 20 is arranged so that its light-emitting surface faces sideways. Alternatively, each of the multiple light-emitting elements 20 has its light-emitting surface on one of the inner surfaces 11 of the package 10. It is positioned so that it faces E.

[0080] Viewed from above, the light-emitting element 20 has a length in the first direction that is greater than the length in the second direction perpendicular to the first direction. They are also arranged in a direction that increases. Each of the one or more light-emitting elements 20 has a length in the first direction The angle may be positioned in a direction that is more than twice the length of the second direction. In the illustrated light-emitting device 1 Furthermore, the first direction is the same as the Y direction, and the second direction is the same as the X direction.

[0081] One or more light-emitting elements 20, when viewed from above, have a length in the first direction that is equal to the length of the mounting surface 11D. It is preferable that the ratio is between 30% and 70% of the length in the direction. By using a base member 10A that satisfies the conditions, it contributes to miniaturizing the size of the light-emitting device 1. It is possible.

[0082] In relation to the stepped portion 12C which is formed along only a part of the inner surface 11E when viewed from above, 1 or The multiple light-emitting elements 20 are perpendicular to the inner surface 11E when viewed from above, and the stepped portion 12 The device is positioned at a location that passes through a hypothetical straight line passing through C (hereinafter referred to as the first hypothetical line). The optical element 20 is included. In this stepped portion 12C, in a direction perpendicular to the inner surface 11E, A line passing through the point furthest from the inner surface 11E and parallel to this inner surface 11E, The shortest distance from the hypothetical straight line (hereinafter referred to as the second hypothetical line) to this light-emitting element 20 is 50 It is greater than or equal to μm. Furthermore, this shortest distance is preferably less than 400 μm. Shortest distance If the distance is 50 μm or more, this light-emitting element 20 can be easily mounted. This shortest distance is 40 By making it less than 0 μm, it is possible to contribute to miniaturizing the size of the light-emitting device 1. The shortest distance for this hypothetical line to pass through the light-emitting element 20 is assumed to be 0. For example, Based on Figure 6, the first virtual line and the second virtual line can be designated as L1 and L2, respectively.

[0083] In relation to the stepped portion 12C which is formed along only a part of the inner surface 11E when viewed from above, 1 or The multiple light-emitting elements 20 are not positioned in a location that passes through the first virtual line. This includes the shortest distance from the inner surface 11E to the light-emitting element 20, which is 50 μm or more. If the shortest distance is 50 μm or more, this light-emitting element 20 can be easily mounted.

[0084] The stepped portion 12C is formed along only a portion of the inner surface 11E and adjacent inner surface 11E. In relation to the resulting stepped portion 12C, when viewed from above, it is perpendicular to the adjacent inner surface 11E, One or more light-emitting elements 2 are positioned at a location that passes through a virtual straight line that passes through this stepped portion 12C. 0 is placed.

[0085] The light-emitting device 1 may be equipped with a plurality of light-emitting elements 20. The plurality of light-emitting elements 20 are 1. Light-emitting element 20A, and 2. Light-emitting element 2, whose length in the first direction is smaller than that of the first light-emitting element 20A. Includes 0B. Multiple light-emitting elements 20 include one or more first light-emitting elements 20A and one or more It includes a number of second light-emitting elements 20B. Multiple light-emitting elements 20 include multiple first light-emitting elements 20A. It can be seen. Multiple light-emitting elements 20 may include multiple second light-emitting elements 20B. Device 1 comprises two first light-emitting elements 20A and two second light-emitting elements 20B.

[0086] The first light-emitting element 20A emits first light having a peak wavelength at a first wavelength. 20 is adopted. The second light-emitting element 20B has a peak wavelength at a second wavelength different from the first wavelength. A light-emitting element 20 that emits a second light can be employed.

[0087] For example, the first light-emitting element 20A is a light-emitting element 20 that emits red light, and the second light-emitting element 2 0B can be a light-emitting element 20 that emits blue light. Also, the first light-emitting element 20A The first light-emitting element 20 emits red light, and the second light-emitting element 20B emits green light. This can be referred to as element 20.

[0088] Multiple light-emitting elements 20 are multiple first light-emitting elements 2 that emit light with different peak wavelengths from each other. It may include 0A. Multiple light-emitting elements 20 emit light with different peak wavelengths from each other. It may include a plurality of second light-emitting elements 20B.

[0089] For example, the light-emitting device 1 includes a first light-emitting element 20A that emits red light and a light-emitting element that emits infrared light It may be equipped with a first light-emitting element 20A. The light-emitting device 1 also emits blue light. The system may include a second light-emitting element 20B and a second light-emitting element 20B that emits green light.

[0090] The multiple light-emitting elements 20 include multiple first light-emitting elements 20A that have different lengths in the first direction from each other. It may be so. Multiple light-emitting elements 20 have multiple first light-emitting elements with different lengths in the second direction from each other. It may also include element 20A. Multiple light-emitting elements 20 have different lengths in the first direction from each other. It may include multiple second light-emitting elements 20B. The multiple light-emitting elements 20 are arranged in a second direction relative to each other. It may include multiple second light-emitting elements 20B of different lengths.

[0091] For example, among the multiple light-emitting elements 20, there are light-emitting elements 20 that emit red light and light-emitting elements that emit blue light. It includes a light-emitting element 20 that emits light and a light-emitting element 20 that emits green light, and each of the colors of light The length of the light-emitting element 20 in the first direction or the length in the second direction may be different.

[0092] The light-emitting device 1 includes a first light-emitting element 20A positioned in a location that does not pass through the first virtual line. The light-emitting device 1 includes a second light-emitting element 20B positioned at a location that passes through the first virtual line. The first light-emitting element 20A provided in the light-emitting device 1 is not positioned to pass through the first dashed line. The light-emitting device 1 may include a second light-emitting element 20B positioned in a location that does not pass through the first virtual line. .

[0093] The stepped portion 12C, which is partially provided on the inner surface 11E, is located below the second light-emitting element 20A. It is formed in a position close to the optical element 20B. The shortest distance from the second virtual line to the first light-emitting element 20A The distance is smaller than the shortest distance from the second virtual line to the second light-emitting element 20B. By arranging element 20, it is possible to contribute to miniaturizing the light-emitting device 1.

[0094] In the illustrated light-emitting device 1, when viewed from above, it is perpendicular to the third side and passes through the third step portion. Furthermore, there is no hypothetical straight line that passes through the first light-emitting element 20A. The first light-emitting element 20A is positioned at a location that satisfies the following conditions. This allows the longer direction in the first direction to be The light-emitting element 20 can be placed in an mounting area that is longer in the first direction, and light emission This can contribute to miniaturizing device 1.

[0095] In the illustrated light-emitting device 1, when viewed from above, it is perpendicular to the third side and passes through the third step portion. Furthermore, there exists a hypothetical straight line that passes through the second light-emitting element 20B. This condition The second light-emitting element 20B is positioned in a location that satisfies the conditions. This allows the shorter direction in the first direction to be The light-emitting element 20 is positioned in the mounting area that is made shorter in the first direction by the third step portion. This can contribute to miniaturizing the light-emitting device 1.

[0096] Multiple light-emitting elements 20 are arranged side by side so that their respective light-emitting surfaces face the same direction. This is done. Note that "same direction" here refers to the mounting surface of the light-emitting surfaces of adjacent light-emitting elements 20. This includes cases where the rotational displacement on a plane parallel to 11D is within ±5 degrees. In the optical device 1, multiple light-emitting elements 20 are arranged in a line in the X direction.

[0097] The light-emitting surfaces of the multiple light-emitting elements 20 are planes parallel to the light-emitting surface of one of the light-emitting elements 20. The distances between them are arranged to be between 0 μm and 200 μm. Multiple light-emitting elements 20 The optical axes of the multiple light sources emitted are parallel to each other. The light-emitting surfaces of the multiple light-emitting elements 20 are 1 They can be arranged on a plane. That is, multiple light-emitting elements 20 are arranged with their light-emitting surfaces aligned. obtain.

[0098] In the illustrated light-emitting device 1, from the light-emitting surface of the light-emitting element 20, which is a semiconductor laser element, Light from the FFP is emitted with the direction perpendicular to the mounting surface 11D as the speed axis. Child 20 also has a spread angle in the retarded axis direction of 20 degrees or less. Note that a spread angle greater than 0 degrees is an angle greater than 0 degrees. It is a degree.

[0099] In the light-emitting device 1, one or more light-emitting elements 20 are mounted on one or more submounts 3 It is placed on 0. The submount 30 bonds the light-emitting element 20 on one bonding surface, and the other The light-emitting element 20 is bonded to the mounting surface 11D at the bonding surface. The light-emitting element 20 is bonded via the submount 30. It is then placed on the mounting surface 11D. Furthermore, the light-emitting element 20 is positioned without using the submount 30. It may also be placed on the mounting surface 11D.

[0100] The length of the submount 30 in the first direction is the length of the light-emitting element 20 mounted on the submount 30. It is greater than the length in the first direction. The length of the submount 30 in the second direction is This is greater than the length of the light-emitting element 20 mounted on the submount 3 in the second direction. This can improve the heat dissipation effect for the heat generated from the light-emitting element 20. Other components such as wiring 60 are joined to the upper surface of the submount 30 exposed from the optical element 20. This allows us to secure the necessary area.

[0101] In the first direction, the difference in length between the submount 30 and the light-emitting element 20 is in the second direction. It is smaller than the difference in length between the submount 30 and the light-emitting element 20. By exposing the upper surface of the mount 30, multiple light-emitting elements are arranged in a line in the second direction. This can improve the heat dissipation effect by 20.

[0102] The submount 30 is provided on the light-emitting element 20 in a one-to-one ratio. The light-emitting device 1 is provided on the light-emitting element 20 It is equipped with the same number of submounts 30 as the number of light-emitting elements. Note that one submount 30 contains multiple light-emitting elements. Child 20 may be assigned.

[0103] The light-emitting device 1 includes multiple submounts 30 corresponding to multiple light-emitting elements 20. Yes, it is possible. The multiple submounts 30 include a first submount 30A and a first submount whose length in the first direction is Includes a second submount 30B which is smaller than the first submount 30A. The first light-emitting element 20A is mounted on the to 30A. The second light-emitting element 20A is mounted on the second submount 30B. The optical element 20B is mounted. In a top view, the first submount 30A passes through the second virtual line. It is positioned in such a way. Multiple light-emitting elements 20 of different lengths in the first direction are arranged according to the magnitude of their lengths. By providing multiple compatible submounts 30, it contributes to miniaturizing the light-emitting device 1. It is possible.

[0104] The light-emitting device 1 includes a first submount 30A positioned in a location that does not pass through the first virtual line. The light-emitting device 1 has a second submount 30B positioned to pass through the first virtual line. The first submount 30A provided in the light-emitting device 1 is positioned to pass through the first virtual line. It is not placed. The light-emitting device 1 is a second submount located in a position that does not pass through the first virtual line. It can be equipped with 30B.

[0105] With respect to the length in the first direction, the first submount 30A is longer than the second submount 30B. Large in the range of 100 μm to 600 μm. Second submount 30 passing through the first virtual line. B is greater than the difference in length in the first direction between it and the first submount 30A, and the step passing through the first virtual line It is preferable that the distance in the first direction between the differential portion 12C and the light-emitting device is smaller. This can contribute to miniaturization of the device.

[0106] In the illustrated light-emitting device 1, the length of the first submount 30A in the first direction and the length of the second sub The difference in length of mount 30B in the first direction is smaller than the length of the third stepped section in the first direction. The difference between the length of submount 1 30A in the first direction and the length of submount 2 30B in the first direction. Preferably, this is 30% to 90% of the length of the third stepped portion in the first direction. Therefore, the effect of partially providing a stepped section 12C may become more pronounced.

[0107] In the light-emitting device 1, one or more reflective members 40 are arranged in the internal space of the package 10. One or more reflective members 40 are placed on the mounting surface 11D. The reflective member 40 has one or more light-reflecting surfaces. Light emitted from the surface is reflected by one or more light-reflecting surfaces. The light-reflecting surfaces pass through the optical axis. It is tilted at a 45-degree angle to the direction of light propagation. The light reflected by the light-reflecting surface is upward. Proceed to the next step. Multiple primary portions of light illuminate one or more light-reflecting surfaces.

[0108] The reflective members 40 can be provided in a one-to-one ratio with the light-emitting element 20. In other words, the light-emitting element 20 The same number of reflective members 40 are arranged. All of the reflective members 40 are the same size and shape. Therefore, the light from the main portion of one light-emitting element 20 shines on the light-reflecting surface of one reflective member 40. It is illuminated. Furthermore, the main portion from multiple light-emitting elements 20 is reflected on the light-reflecting surface of one reflective member 40. Light may be shone on it.

[0109] The light-reflecting surface of the reflective member 40 reflects more than 90% of the light from the main illuminated portion. The light-emitting device 1 does not necessarily have a reflective member 40. In this case, for example, the light-emitting element 20 The light-emitting surface faces upwards.

[0110] The light-emitting device 1 may include a plurality of reflective members 40. The plurality of reflective members 40 are arranged on top In a surface view, the multiple light-emitting elements 20 are arranged in the same direction as the direction in which they are aligned. The optical axes of the multiple beams of light reflected by the light-reflecting surface are parallel to each other.

[0111] In the light-emitting device 1, one or more protective elements 50 are arranged on the base member 10A. Alternatively, multiple protective elements 50 are arranged on the wiring pattern 13. It may be placed in a position other than 13. For example, it may be placed on top of submount 30. One or more protective elements 50 are electrically connected to the wiring pattern 13. 50 is provided in a one-to-one ratio with respect to an electrical circuit that electrically connects one or more light-emitting elements 20. .

[0112] In the light-emitting device 1, the wiring 60 is connected to the wiring pattern 13. The light-emitting device 1 is multiple It has several wires 60. The multiple wires 60 connect one or more light-emitting elements 20 to the base member 10A Connect it electrically.

[0113] One or more wires 60 are connected to each stepped portion 12C. The first light-emitting element 20A is attached to the base. Wiring 60 electrically connected to material 10A, and the second light-emitting element 20B electrically connected to base member 10A The wiring 60 to be connected is joined to a different stepped section 12C.

[0114] The stepped portion 12C, which is partially provided on the inner surface 11E, has three or more lights arranged in a row in the light-emitting device 1. Of the light-emitting elements 20 arranged, the light-emitting element 20 arranged between the light-emitting elements 20 at both ends The wiring 60 that is joined to it is joined. As a result, the light-emitting element 20 that is placed between the two ends Wiring connections can be made easier. Also, from this perspective, 3 or more, or 4 or more By using a light-emitting device 1 equipped with a light-emitting element 20, the effect of ease of wiring connection becomes more apparent. It can be said that it is.

[0115] In the illustrated light-emitting device 1, one or more wires 60 (hereinafter, One or more wires 60 (hereinafter referred to as the first wiring) are arranged in the second wiring pattern. One or more wires 60 (hereinafter referred to as the third wiring pattern) are arranged in the third wiring pattern. (These are called wiring.) Multiple wirings 60 are arranged. One or more first wirings, one or more This includes a second wiring and one or more third wirings.

[0116] In the illustrated light-emitting device 1, the first light-emitting element 20A is placed on the upper surface of the first stepped portion of the base member 1 A wiring 60 that is electrically connected to 0A is joined. The second light-emitting element 20 is attached to the upper surface of the second stepped section. Wiring 60 is joined to electrically connect B to the base member 10A. Wiring 60 is joined to electrically connect the light-emitting element 20B to the base member 10A. On the upper surface, wiring 60 is attached to electrically connect the first light-emitting element 20A to the base member 10A. do not have.

[0117] In the light-emitting device 1, the lid member 70 is positioned on the upper surface of the base member 10A. Point 0 is located above the stepped portion 12C. Also, when the lid member 70 is joined, the base A closed space is created by the material 10A and the lid member 70. This space is where the light-emitting element 20 It is the space in which it is arranged.

[0118] By joining the lid member 70 to the base member 10A under a predetermined atmosphere, an airtight, sealed closed space is created. This is produced. When a semiconductor laser element is used for the light-emitting element 20, the semiconductor laser element By airtight sealing the space in which it is placed, quality deterioration due to dust collection can be suppressed. Lid Material 70 is transparent to light emitted from the light-emitting element 20. More than 90% of the light that shines on the main part passes through the cover member 70 and is emitted to the outside.

[0119] The optical component 80 is positioned above the lid member 70. The optical component 80 is joined to the lid member 70. Multiple beams of light emitted from the lid member 70 enter the incident surface of the optical member 80. Light incident on the incident surface of material 80 is emitted from the lens surface.

[0120] When viewed from above, the optical component 80 has one or more lens surfaces, each of which emits different light from one another. It is positioned so as to overlap with element 20. From each of the one or more lens surfaces, different The light from the main portion emitted from the light-emitting element 20 is emitted. The child 20 corresponds to the light-emitting element 20, and light is emitted from the corresponding light-emitting element 20 from each lens surface.

[0121] <Second Embodiment> A second embodiment of the light-emitting device 2 will be described. The light-emitting device 2 emits light with respect to the stepped portion 12C. It differs from device 1. Figure 10 is a diagram illustrating an exemplary form of light-emitting device 2. Figure 10 is a top view illustrating the various components arranged inside the light-emitting device 2. Figures 1 through 4 also serve as diagrams illustrating the light-emitting device 2.

[0122] The light-emitting device 2 comprises multiple components. These multiple components include the base member 10B, One or more light-emitting elements 20, one or more submounts 30, one or more reflectors Material 40, one or more protective elements 50, multiple wirings 60, cover member 70, and optical member 8 Includes 0.

[0123] Of the above-described explanations relating to the light-emitting device 1 and its components in the first embodiment, the explanation relating to the light-emitting device 2 All content, excluding any content that can be said to be contradictory from the drawings in Figures 1 to 4 and Figure 10, is the light-emitting device. This also applies to the explanation of position 2. All non-contradictory content is presented again here to avoid repetition. Therefore, no explanation is provided. Furthermore, the explanation regarding the base member 10A in the first embodiment is also omitted. Except for inconsistencies with the drawing of Figure 10 relating to the base member 10B in the second embodiment, the base This also applies to the description of material 10B.

[0124] (Base member 10B) The base member 10B has a stepped portion 12C that is partially provided along the inner surface 11E, adjacent to The stepped portion 12C formed along the inner surface 11E is not integrally formed with the inner surface 11E. With respect to the direction along the multiple inner surfaces 11E, it is partially provided along the inner surfaces 11E. The stepped portion 12C is separated from the stepped portion 12C formed along the adjacent inner surface 11E. ru.

[0125] In the base member 10B, the step portion 12C that is partially provided along the inner surface 11E is the upper surface view, is perpendicular to this inner surface 11E, and is formed at a position passing through a virtual straight line (hereinafter referred to as the third virtual line) passing through the midpoint of this inner surface 11E.

[0126] (Light-emitting device 2) In the illustrated light-emitting device 2, a wiring 60 that electrically connects the first light-emitting element 20A to the base member 1 0B is joined to the upper surface of the first step portion. A wiring 60 that electrically connects the first light-emitting element 20 A to the base member 10B is joined to the upper surface of the second step portion. A wiring 60 that electrically connects the second light-emitting element 20B to the base member 10B is joined to the upper surface of the third step portion. The wiring 60 that electrically connects the second light-emitting element 20B to the base member 10B is not connected to the upper surfaces of the first step portion and the second step portion. The wiring 60 that electrically connects the first light-emitting element 20A to the base member 10B is not joined to the upper surface of the third step portion.

[0127] As shown by the base member 10A and the base member 10B, the step portion 12C that is partially provided on the inner surface 11E can be provided at an appropriate position according to how the first light-emitting element 20A and the second light-emitting element 20B are arranged. Thus, by adjusting the position where the step portion 12C is formed, it is possible to reduce the size of the light-emitting device corresponding to the positions where the plurality of light-emitting elements 20 are arranged.

[0128] <Third Embodiment> The light-emitting device 3 according to the third embodiment will be described. The light-emitting device 3 further includes a wiring board 90A and a connector 100 in addition to the light-emitting device 1 or the light-emitting device 2. Therefore, the descriptions of the light-emitting device 1 and the light-emitting device 2 also apply to the light-emitting device 3. FIGS. 1 to 10 are the This also serves as a drawing for explaining the optical device 3. FIGS. 11 to 14 are drawings for explaining an exemplary form of the light-emitting device 3. FIG. 11 is a perspective view of the light-emitting device 3. FIG. 12 is a top view of the light-emitting device 3. FIG. 13 is a top view of the wiring board 90A. FIG. 14 is a diagram for explaining the wiring of the wiring board 90 A.

[0129] The light-emitting device 3 includes a plurality of components. This plurality of components includes all the components included in the light-emitting device 1 or all the components included in the light-emitting device 2, the wiring board 90A and the connector 100. Note that the light-emitting device 3 may not include all the components of the light-emitting device 1 or the light-emitting device 2. Also, without having the technical features of the components of the light-emitting device 1 or the light-emitting device 2, instead, components having basic parts of the structure or material in common may be provided.

[0130] (Wiring board 90A) The wiring board 90A has an upper surface and a lower surface. A plurality of wiring patterns 91 are provided on the wiring board 90A. In a top view, the outer edge shape of the wiring board 90A is rectangular. This rectangle can be a rectangle having a long side and a short side. In the illustrated wiring board 90A, the long side direction of this rectangle is the same as the X direction, and the short side direction is the same as the Y direction. Note that in a top view, the outer edge shape of the wiring board 90A may not be rectangular.

[0131] Each wiring pattern 91 has a plurality of bonding regions 92 that are separated from each other on the upper surface of the wiring board 90A. The plurality of bonding regions 92 include a first bonding region 92A and a second bonding region 92B. For example, an insulating layer is provided partially on the wiring pattern 91 Therefore, multiple bonding regions 92 that are spaced apart from each other when viewed from above can be provided.

[0132] Each wiring pattern 91 further has a conductive region 92C on the upper surface of the wiring board 90A. The wiring board 90A, on its upper surface, has a joint area 92 of the wiring pattern 91. In addition, it has one or more bonding patterns 93. The wiring board 90A has on its upper surface It has a bonding surface 95 that connects with other components. The bonding surface 95 is separated from the wiring pattern 91. They are separated.

[0133] The wiring board 90A further includes a heat dissipation member 94. The heat dissipation member 94 has an upper surface and a lower surface. The surface is exposed, and a heat dissipation path is formed from the top surface to the bottom surface. The joint surface 95 is included in the heat dissipation member 94. It is rare.

[0134] Multiple wiring patterns 91 include a first wiring pattern 91A and a second wiring pattern 91B. In a top view, the joint surface 95 is connected to the first wiring pattern 91A and the second wiring pattern 91B. It is located in between. The first wiring pattern 91A and the second wiring pattern 91B are based on the joint surface 95. They are arranged symmetrically. The first wiring pattern 91A and the second wiring pattern 91B are in the third direction. They are arranged at a distance from each other. In the illustrated wiring board 90A, the third direction is the same as the X direction. That is the case.

[0135] Multiple wiring patterns 91 may include multiple first wiring patterns 91A. The line pattern 91 may include multiple second wiring patterns 91B. The first junction regions 92A of the line 91A are arranged side by side. Multiple second wiring patterns 91B The first bonding regions 92A are arranged side by side.

[0136] In the illustrated wiring board 90A, the first bonding regions 92A of the plurality of first wiring patterns 91A are arranged in the same direction (the fourth direction) as the Y direction. Also, the first bonding regions 92A of the plurality of second wiring patterns 91B are arranged in the same direction as the Y direction. In the wiring pattern 91, the first bonding region 92A is closer to the bonding surface 95 than the second bonding region 92B. The first bonding region 92A is closer to the bonding surface 95 than the conductive region 92C. In the wiring pattern 91, the first bonding region 92A, the conductive region 92C, and the second bonding region 92B are arranged in this order from the closest to the bonding surface 95. In a top view, the conductive region 92C is provided between the first bonding region 92A and the second bonding region.

[0137] In the wiring pattern 91, the conductive region 92C is provided between a virtual line passing through the point farthest from the bonding surface 95 of the first bonding region 92A and perpendicular to the third direction in a top view and a virtual line passing through the point closest to the bonding surface 95 of the second bonding region 92B and perpendicular to the third direction in a top view. In the wiring pattern 91, the conductive region 92C related to the first wiring pattern 91A is provided in the region between a virtual line parallel to the third direction passing through one end and a virtual line parallel to the third direction passing through the other end among the two ends in the fourth direction of the plurality of first bonding regions 92A arranged in the fourth direction. Also, the conductive region 92C related to the first wiring pattern 91A is not provided outside this region. Also, the conductive region 92C related to the second wiring pattern 91B is not provided outside this region. By providing the conductive region 92C in this way, the length of the wiring board 90A in the fourth direction can be suppressed. The bonding pattern 93 is arranged between the second bonding regions 92B of the two first wiring patterns 91A. In a top view, the conductive region 92C is provided between the first bonding region 92A and the second bonding region. In the wiring pattern 91, the first bonding region 92A, the conductive region 92C, and the second bonding region 92B are arranged in this order from the closest to the bonding surface 95.

[0138] In the wiring pattern 91, a virtual line perpendicular to the third direction in a top view passing through the point farthest from the bonding surface 95 of the first bonding region 92A and a virtual line perpendicular to the third direction in a top view passing through the point closest to the bonding surface 95 of the second bonding region 92B. Between them, the conductive region 92C is provided. In the wiring pattern 91, the conductive region 92C related to the first wiring pattern 91A is provided in the region between a virtual line parallel to the third direction passing through one end and a virtual line parallel to the third direction passing through the other end among the two ends in the fourth direction of the plurality of first bonding regions 92A arranged in the fourth direction.

[0139] <000​​​​​​​​​​​​​​​ In addition, another junction pattern 93 is the second junction region 9 of the two second wiring patterns 91B. It is placed between 2B.

[0141] The wiring pattern 91 is formed using a conductive material such as metal. The heat dissipation member 94 is made of metal It can be formed using the genus as the main material. It has the advantages of good heat dissipation and ease of processing. Therefore, it is preferable to form the heat dissipation member 94 using copper. It may also be formed by including materials other than metal, or by using a material other than metal as the main material.

[0142] (Connector 100) The connector 100 has a connection port 101 and a joint. The connection port 101 is into which the connection terminal is inserted. This is the part that is inserted. The connection terminal is inserted into the connection port 101, thereby making an electrical connection with the outside. Connection is made possible. The connection port 101 is provided on the opposite side of the joint of the connector 100. The location where the connection port 101 is provided is not limited to the opposite side of the joint of the connector 100.

[0143] (Light-emitting device 3) In the light-emitting device 3, the base member 10A is placed on the wiring board 90A. The base member 10A is The lower surface of the base member 10A and the wiring board 90A are joined to the bonding surface 95. The joint surface 95 is joined. The lower part 12A of the base member 10A is joined to the joint surface 95, and the side part 12 B is not joined to the joint surface 95.

[0144] The base member 10A is electrically connected to the first junction area 92A of the first wiring pattern 91A. The base member 10A is electrically connected to the first junction area 92A of the second wiring pattern 91B. Member 10A is joined to the first joining region 92A. The side portion 12B of the base member 10A is the first joining region The lower part 12A is joined to region 92A, but the lower part 12A is not joined to the first joining region 92A. Base member 10A The wiring pattern 13 is electrically connected to the wiring pattern 91 of the wiring board 90A.

[0145] The multiple light-emitting elements 20 arranged on the base member 10A are in the direction of the long side of the wiring board 90A when viewed from above. They are lined up. In the illustrated light-emitting device 3, light is emitted from each of the multiple light-emitting elements 20, and the lid The light emitted upward from material 70 has a slow axis direction parallel to the long side direction of the wiring board 90A, and a fast axis direction. The axial direction is parallel to the short side direction of the wiring board 90A. In a top view, the long side direction of the base member 10A and The long side direction of the wiring board 90A is the same as that of the base member 10A and the wiring board 90A The short side direction is the same. The long side direction and the short side direction of the base member 10A and the wiring board 90A Aligning the orientations contributes to miniaturizing the light-emitting device 3.

[0146] In the light-emitting device 3, one or more connectors 100 are arranged on the wiring board 90A. The connector 100 is joined to the second bonding area 92B of the wiring board 90A. 100 is joined to the joining pattern 93 of the wiring board 90A. The joining part of connector 100 It is then joined to the wiring board 90A.

[0147] One or more connectors 100 include a first connector 100A and a second connector 100B. The first connector 100A is joined to the second joining area 92B of the first wiring pattern 91A. The second connector 100B is joined to the second joining area 92B of the second wiring pattern 91B. In a top view, a hypothetical straight line passing through the first connector 100A and the second connector 100B is the base It passes through component 10A.

[0148] The first connector 100A is joined to the second joining area 92B of multiple first wiring patterns 91A. The second connector 100B connects to the second junction area 92B of multiple second wiring patterns 91B. It will be joined to it.

[0149] For example, the first connector 100A is connected to the first light-emitting element 20A and the second light-emitting element 20B. Electrically connected. The second connector 100B connects the first light-emitting element 20A and the second light-emitting element 20 It electrically connects to B. The first connector 100A connects to one electrode of each light-emitting element 20 (for example). The second connector 100B connects to the other electrode (e.g., the negative electrode) of each light-emitting element 20. Connect to the poles. By aligning the electrodes on each connector 100, the connection to the power supply is It will become easier.

[0150] The first connector 100A, when viewed from above, has its mounting surface 11D illuminated by a virtual line perpendicular to the third direction. When the area 3 is divided in two, the first light-emitting element is positioned in the region that includes the first connector 100A. The second light-emitting element 2 is located in an area that does not include the first connector 100A, as well as 20A. It is also electrically connected to 0B. The second connector 100B is shown in a top view. The region containing the second light-emitting element 20B, as well as the second connector 100B, is located within the region containing the second light-emitting element 20B. The first light-emitting element 20A, which is located in a less frequent area, is also electrically connected.

[0151] As another example, the first connector 100A is electrically connected to the first light-emitting element 20A. The second connector 100B is electrically connected to the second light-emitting element 20B. A is not electrically connected to the second light-emitting element 20B, and the second connector 100B is connected to the first light-emitting element It is not electrically connected to the child 20A. Thus, the first connector 100A and the second connector 1 With 00B, multiple light-emitting elements 20 can be powered separately. Also, this allows the upper The size of the light-emitting device 3 in the direction perpendicular to the third direction when viewed from the surface can be reduced.

[0152] When viewed from above, the light-emitting device 3 is divided in two by a virtual line perpendicular to the third direction on the mounting surface 11D, One or more light-emitting elements 20 located in the area containing connector 100A are first connector It is electrically connected to connector 100A and is located in the area containing the second connector 100B. Alternatively, multiple light-emitting elements 20 are electrically connected to the second connector 100B.

[0153] In the illustrated light-emitting device 3, the midpoint of the mounting surface 11D in the third direction passes through the third direction This relationship applies to a region that is bisected by a vertical imaginary line. (Placed on the implementation surface 11D) Half of the multiple light-emitting elements 20 are connected to the first connector 100A, and the remaining half are connected to the second connector 1 It is electrically connected to 00B. Note that the number of light-emitting elements 20 arranged on the mounting surface 11D is odd. In this case, there will be one more light-emitting element 20 in either region, but here, we will include this as well. This shall be expressed as "half."

[0154] The conductive region 92C is used, for example, to confirm the electrical connection between the light-emitting element 20A and the wiring board 90A. It can be used for testing purposes.

[0155] <Fourth Embodiment> A light-emitting device 4 according to the fourth embodiment will be described. The light-emitting device 4 is a light-emitting device 1 or a light-emitting device Furthermore, the 2 is equipped with a wiring board 90B and a connector 100. Therefore, the light-emitting device 1 and The description of light-emitting device 2 also applies to light-emitting device 4, and Figures 1 to 10 are shown. This also serves as a diagram explaining the light device 3. Furthermore, the light-emitting device 4 has a wiring board 90B that corresponds to the light-emitting device 3. This differs from the wiring board 90A. Figures 15 to 17 illustrate an exemplary form of the light-emitting device 4. These are drawings for the purpose of [the following]. Figure 15 is a top view of the light-emitting device 4. Figure 16 is the wiring board 90B. This is a top view. Figure 17 is a diagram illustrating the wiring of the wiring board 90B.

[0156] Of the above-described explanations relating to the light-emitting device 3 and each component of the third embodiment, the explanation relating to the light-emitting device 4 All content from Figures 15 to 17, excluding any content that can be said to be contradictory, is for the light-emitting device 4 This also applies to the explanation. All non-contradictory content will be explained again here to avoid repetition. The details will not be described. Furthermore, the description regarding the wiring board 90A in the third embodiment will also be provided. The contents of Figures 16 and 17 relating to the wiring board 90B in the fourth embodiment are inconsistent. Except for the description of the 90B wiring board, this also applies.

[0157] (Wiring board 90B) On the wiring board 90B, the first bonding region 92A and the second bonding region 9 The bonding surface 95 is located between 2B. From the second bonding region 92B of the second wiring pattern 91B The distance from the first junction area 92A of the second wiring pattern 91B is greater than the distance from the first junction area 92A of the second wiring pattern 91B The distance from the second junction area 92B to the first junction area 92A of the first wiring pattern 91A. It is short. Also, from the second junction area 92B of the first wiring pattern 91A to the second wiring pattern 91 The distance to the first junction area 92A of B is greater than the distance to the second junction area 92 of the first wiring pattern 91A. The distance from B to the first junction area 92A of the first wiring pattern 91A is shorter. By doing so, the first light-emitting element 20A and the second light-emitting element 20B are connected by connector 100. To enable electrical connections and reduce the size of the wiring board 90B in the third direction. It is possible.

[0158] On the wiring board 90B, the ends of the multiple first junction regions 92A arranged in the fourth direction are The space between a virtual line passing through one end and parallel to the third direction, and a virtual line passing through the other end and parallel to the third direction. A conductive region 92C related to the first wiring pattern 91A is provided in the region. A conductive region 92C related to turn 91B is provided outside this region.

[0159] As described above, each embodiment of the present invention is described. The present invention is not strictly limited to a light-emitting device of a certain type. In other words, the present invention is opened up by each embodiment. The present invention is not limited to the external form and structure of the light-emitting device shown. It can be applied without requiring all components to be present in sufficient quantities. If the claims include a portion of the components of the light-emitting device disclosed in the embodiments, If not, some of the components may be substituted, omitted, altered in shape, or altered in material. Furthermore, the degree of design freedom of those skilled in the art is recognized, and the invention described in the claims is This specifies that it applies. [Industrial applicability]

[0160] The light-emitting device described in each embodiment is a projector, an in-vehicle headlight, a head-mounted light It can be used for displays, lighting, and other applications. [Explanation of Symbols]

[0161] 1, 2, 3, 4 Light-emitting devices 10A 10B Base member 11A Top 11B Bottom side 11C External surface 11D Implementation side 11E Inside surface 12A Lower 12B Side 12C Step section 13 Wiring Patterns 20 Light-emitting elements 20A First light-emitting element 20B Second light-emitting element 30 Submount 30A First Submount 30B Second Submount 40 Reflective material 50 protective elements 60 Wiring 70 Lid member 80 Optical components 90A 90B Wiring Board 91 Wiring Patterns 91A First Wiring Pattern 91B Second Wiring Pattern 92 Joint area 92A 1st joint area 92B 2nd joining area 92C conductive area 93 Joining Patterns 94 Heat dissipation components 95 Joint surface 100 connectors 100A 1st connector 100B Second Connector

Claims

1. A lower part having an upper surface, The first side, the second side not adjacent to the first side, and the third side adjacent to the first side It has multiple inner surfaces including a surface, and a side portion that surrounds the upper surface of the lower part, It has, The aforementioned side portion, when viewed from above, is along part or all of the first side surface and inside the plurality of inner surfaces A first stepped portion is formed therein, and the plurality of along part or all of the second side surface when viewed from above The second stepped portion is formed on the inner side of the inner surface, and the third side is formed along only a part of the surface when viewed from above. It includes a third stepped portion formed on the inner side of multiple inner surfaces, The first stepped portion has a first upper surface on which a wiring pattern is provided, The second stepped portion has a second upper surface on which a wiring pattern is provided, The third stepped portion is a base member having a third upper surface on which a wiring pattern is provided.

2. The second stepped portion and the third stepped portion are formed integrally, and the second upper surface and the 3. The base member according to claim 1, which is provided on the same plane as the upper surface.

3. The second stepped portion and the third stepped portion are spaced apart in the direction along the plurality of inner surfaces. The base member according to claim 1.

4. The third stepped portion is along the third side surface and in a direction parallel to the upper surface of the lower part. A length of 10% to 75% of the length of the three sides, formed in any of claims 1 to 3. The base member described in item 1.

5. In a top view, the length along the third side of the third stepped portion is the length along the second side of the second stepped portion. The base according to any one of claims 1 to 4, which is 10% or more and 75% or less of the length along the surface. Components.

6. With respect to the direction parallel to the upper surface of the lower part, the length of the third side surface is greater than the length of the second side surface. The base member according to any one of claims 1 to 5, wherein the difference is greater.

7. Claim 6, the length of the second side is 20% or more and 90% or less of the length of the third side. The base member described above.

8. The first stepped portion is formed along the entire first side surface, The second stepped portion is formed along the entire second side surface, as in any one of claims 1 to 7. The base member described in item 1.

9. A first light-emitting element and a second light-emitting element whose length in the first direction is smaller than that of the first light-emitting element. Includes multiple light-emitting elements, The lower part having an upper surface on which the plurality of light-emitting elements are arranged, a first side surface, and adjacent to the first side surface. It has a second side surface that does not have a first side surface, and a plurality of inner sides including a third side surface adjacent to the first side surface, A base member having a side portion that surrounds the upper surface of the lower part, Multiple wirings electrically connect the multiple light-emitting elements to the base member, Equipped with, The aforementioned side portion, when viewed from above, is along part or all of the first side surface and inside the plurality of inner surfaces A first stepped portion is formed therein, and the plurality of along part or all of the second side surface when viewed from above The second stepped portion is formed on the inner side of the inner surface, and the third side is formed along only a part of the surface when viewed from above. It includes a third stepped portion formed on the inner side of multiple inner surfaces, The first stepped portion has a first upper surface on which a first wiring pattern is provided, The second stepped portion has a second upper surface on which a second wiring pattern is provided, The third stepped portion has a third upper surface on which a third wiring pattern is provided, The plurality of wires include a first wire connected to the first wiring pattern and a second wire connected to the second wiring pattern. It includes a second wiring that is joined and a third wiring that is joined to a third wiring pattern, The first direction is perpendicular to the third side surface, in the light-emitting device.

10. The third stepped portion is formed closer to the second light-emitting element than the first light-emitting element. The light-emitting device according to claim 9.

11. In a top view, it is perpendicular to the third side surface, passes through the third stepped portion, and the first light emission At a position that satisfies the condition that no virtual straight line passes through the element, the aforementioned A light-emitting element is positioned, In a top view, it is perpendicular to the third side surface, passes through the third stepped portion, and the second light emission The second Light-emitting elements are arranged The light-emitting device according to claim 9 or 10.

12. In a top view, the point furthest from the third side surface in a direction perpendicular to the third side surface of the third stepped portion. From a hypothetical straight line passing through the point and parallel to the third side surface, the first light-emitting element The shortest distance to is 50 μm or more and less than 400 μm, any one of claims 9 to 11. The light-emitting device described above.

13. In a top view, in a direction perpendicular to the third side surface, from the third side surface to the first light-emitting element The shortest distance is 50 μm or more, according to any one of claims 9 to 12, the light-emitting device 。

14. In a top view, the point furthest from the third side surface in a direction perpendicular to the third side surface of the third stepped portion. From a hypothetical straight line passing through the point and parallel to the third side surface, the first light-emitting element The shortest distance to is less than the shortest distance from the straight line to the second light-emitting element, claim A light-emitting device according to any one of items 9 to 13.

15. The first light-emitting element is mounted on a first submount positioned on the upper surface of the lower part, The length in the first direction is smaller than the first submount, and the second light-emitting element is mounted Furthermore, a second submount is positioned on the upper surface of the lower part, Furthermore, In a top view, the point furthest from the third side surface in a direction perpendicular to the third side surface of the third stepped portion. A hypothetical straight line passing through the point and parallel to the third side surface is the first submount Any of claims 9 to 14, the first submount is positioned at a location that passes through the tortoise. The light-emitting device described in item 1.

16. Having a first wiring pattern, the upper surface has a bonding surface and the first wiring pattern has A wiring board having a junction region, a second junction region, and a conductive region, A first connector joined to the second joining region of the first wiring pattern, Furthermore, The base member is joined to the joining surface, and the first joining region of the first wiring pattern And connect electrically, In a top view, the conductive region is provided between the first junction region and the second junction region. The light-emitting device according to any one of claims 9 to 15.

17. It has a plurality of wiring patterns including a first wiring pattern and a second wiring pattern, and on the upper surface The joining surface and the first joining region and second joining region of each of the plurality of wiring patterns A wiring board in which a region is provided, A first connector joined to the second joining region of the first wiring pattern, A second connector joined to the second joining region of the second wiring pattern, Furthermore, The base member is joined to the joining surface, and the first joining region of the first wiring pattern and electrically connected to the first junction region of the second wiring pattern, In a top view, the base member is provided between the first connector and the second connector. The first light-emitting element and the second light-emitting element, when viewed from above, are the first connector, the base member, Furthermore, the second connectors are arranged in a direction in which they are aligned, as described in any one of claims 9 to 15. A mounted light-emitting device.

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