Lead frame
The lead frame with a retaining portion and uneven surface on the die pad addresses flux and moisture intrusion issues, enhancing semiconductor device reliability through improved adhesion and sealing.
JP2026115570APending Publication Date: 2026-07-09NICHIDEN SEIMITSU INDS
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- NICHIDEN SEIMITSU INDS
- Filing Date
- 2024-12-27
- Publication Date
- 2026-07-09
Smart Images
Figure 2026115570000001_ABST
Abstract
The present invention provides a lead frame and its products that can improve the reliability of semiconductor devices and the like. [Solution] By manufacturing semiconductor devices and other products using a lead frame that includes a die pad, and intrusion prevention means, which is a stepped recess or protrusion of two or more stages that prevents flux and moisture from entering, provided on the die pad, the reliability of semiconductor devices and other products can be dramatically improved.
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