Inspection equipment, inspection system, program, inspection method, and production method

Abstract

Perform a precise quality inspection of the solder joining the first and second components. [Solution] The controller 90 inspects the quality of the solder S joining component W1 and component W2. The controller 90 includes a heat flux detection unit and a quality determination unit. The heat flux detection unit detects the heat flux HF of the heat flow that flows from component W1 to component W2 and then to component W2 by heating the product U at a temperature that does not melt the solder S to component W1 using a heat flux sensor 50. The quality determination unit determines the quality of the solder S based on the heat flux detected by the heat flux detection unit.

Description

Technical Field

[0001] The present invention relates to an inspection apparatus, an inspection system, a program, an inspection method, and a production method.

Background Art

[0002] As disclosed in Patent Document 1, soldering for joining a first component and a second component with solder is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Solder (including brazing) after soldering may contain voids. If the amount of voids is large, it causes poor joining between the first component and the second component (particularly, poor connection of electrical connection). That is, it can be said that the quality of solder with a large amount of voids is not good (i.e., defective). Here, since it is difficult to completely eliminate voids, it is preferable to inspect the quality of solder for a soldered product after soldering.

[0005] An object of the present invention is to accurately inspect the quality of solder joining a first component and a second component.

Means for Solving the Problems

[0006] To solve the above problems, the inspection apparatus according to the present invention is an inspection apparatus for inspecting the quality of solder joining a first component and a second component, comprising: a detection unit that detects the heat flux of a heat flow that flows from the first component to the solder and then flows through the second component by heating the solder to the first component at a temperature that does not melt the solder, using a heat flux sensor; and a quality determination unit that determines whether the quality is good or bad based on the heat flux detected by the detection unit.

[0007] The inspection system according to the present invention comprises a heater tool that generates heat by contacting the first component, a heat flux sensor that contacts the second component, and the inspection device.

[0008] The program according to the present invention causes a computer to function as the above-mentioned inspection device.

[0009] The inspection method according to the present invention is a method for inspecting the quality of solder joining a first component and a second component, comprising: a heating step of heating the first component at a temperature that does not melt the solder; a detection step of detecting the heat flux of the heat flow that flows from the first component to the solder and then to the second component using a heat flux sensor; and a determination step of determining whether the quality is good or bad based on the heat flux detected in the detection step.

[0010] The production method according to the present invention comprises a first step of producing a soldered product including the first part, the second part, and the solder by performing soldering to join the first part and the second part with the solder, and a second step of inspecting the quality of the solder of the produced soldered product by performing the inspection method. [Effects of the Invention]

[0011] According to the present invention, the quality of the solder joining the first component and the second component can be inspected with high accuracy. [Brief explanation of the drawing]

[0012] [Figure 1]Figure 1 is a schematic diagram showing the configuration of a joint inspection system according to an embodiment of the present invention, and is a schematic diagram showing the state before soldering. [Figure 2] Figure 2 is a schematic diagram showing the configuration of a joint inspection system according to an embodiment of the present invention, and is a schematic diagram showing how the product is transported after soldering. [Figure 3] Figure 3 is a schematic diagram showing the configuration of a joint inspection system according to an embodiment of the present invention, and is a schematic diagram showing the process of inspecting the quality of solder. [Figure 4] Figure 4 is a block diagram showing the main components of the controller. [Figure 5] Figure 5 is a flowchart of the soldering and quality inspection process. [Figure 6] Figure 6 is a flowchart of the soldering process. [Figure 7] Figure 7 is a flowchart of the quality inspection process. [Figure 8] Figure 8(A) is a graph showing the temperature profile, which is the time change of the temperature of the heater tool during heating for solder quality inspection. Figure 8(B) is a graph showing the time change of the current used to heat the heater tool to achieve the temperature change shown in (A). [Figure 9] Figure 9 is a graph showing the time change of the heat flux detected by the heat flux sensor during heating for solder inspection. [Modes for carrying out the invention]

[0013] Embodiments of the present invention will be described below with reference to the drawings. Note that the term "soldering" as described herein includes the concept of brazing. In other words, solder includes wax.

[0014] The bonding inspection system 10 according to this embodiment, shown in Figures 1 to 3, solders component W1 and component W2 together using solder S. This soldering process involves the solder S melting once and then hardening into a solid, thereby bonding component W1 and component W2. Component W1 is, for example, a power semiconductor element. Component W2 is, for example, a copper lead frame. The solder S may be configured as multiple bumps connecting multiple terminals of the power semiconductor element to multiple terminals of the lead frame. The components W1 and W2 and the solder S between them before soldering are also referred to as the workpiece W (Figure 1). The workpiece W after soldering, that is, the combination of components W1 and W2 and the solder S bonding them together, is also referred to as the product U (Figures 2 and 3). Since product U is a product after soldering, it can also be called a soldered product. Product U does not have to be the final product; it may be a component used in the final product. In addition to the above-mentioned joining (soldering), the joint inspection system 10 also inspects the quality of the solder S of product U.

[0015] The joint inspection system 10 comprises a stage 21, a stage 22, a transport device 23, a heater tool 31, a power supply circuit 32, a drive device 33, a temperature sensor 34, an ultrasonic application device 40, a heat flux sensor 50, a cooling device 61, a temperature sensor 62, an input / output device 70, and a controller 90. In Figures 1 and 2, stages 21 and 22 are depicted as cross-sectional views. The X and Y axes set in Figures 1 and 2 extend in directions perpendicular to each other. The Y-axis direction is also called the vertical direction. This vertical direction is for convenience only and may or may not coincide with the actual vertical direction.

[0016] Stage 21 supports the workpiece W to be soldered from the side of the component W2, i.e., from below (-Y axis direction) (see Figure 1). Soldering of the workpiece W is performed on stage 21 by a heater tool 31. Stage 21 may be equipped with protrusions or jigs for positioning the workpiece W (especially the second component W2). After soldering is complete, the product U, which is the workpiece W, is transported from stage 21 to stage 22, which is arranged parallel to stage 21 in the X axis direction. This transport is performed by a transport device 23 that operates under the control of controller 90.

[0017] The transfer device 23 consists of a holding member 23A that holds the product U and a robot including a linear motor or a ball screw mechanism, etc., and includes a drive device 23B that moves the holding member 23A at least in the X-axis direction and the Y-axis direction. By moving the holding member 23A in the state of holding the product U by the drive device 23B (see FIG. 2), the transfer of the product U is realized. In order to prevent interference with the heater tool 31, the drive device 23B is arranged on the back side of the paper surface of FIGS. 1 to 3 than the heater tool 31, and the holding member 23A extends from the drive device 23B to the front side of the paper surface of FIGS. 1 to 3. The product U may be transferred to the stage 22 by the user instead of the transfer device 23.

[0018] The stage 22, which is the transfer destination of the product U, supports the product U from the side of the component W2, that is, from below, when inspecting the quality of the solder S of the product U (see FIG. 3). The inspection of the quality of the solder S of the product U is performed on the stage 22. At the time of this quality inspection, the product U is heated by the heater tool 31. The stage 22 may be provided with irregularities or jigs for positioning the product U (especially the second component W2).

[0019] The heater tool 31 heats the workpiece W on the stage 21 (FIG. 1) for soldering, and also heats the product U on the stage 22 (FIG. 3) for inspecting the quality of the solder S. The heater tool 31 heats the workpiece W or the product U from the side of the component W1, that is, from above, by heating the component W1 from above (+Y-axis direction). The heater tool 31 performs the above heating by generating heat by the current from the power supply circuit 32. The heater tool 31 can employ a general heater tool used for soldering. The heater tool 31 can include a heater chip in which the portion contacting the workpiece W or the product U locally generates heat when the above current flows. The heater tool 31 is movable by the drive device 33.

[0020] The power supply circuit 32 includes an inverter circuit and the like. Under the control of the controller 90, the power supply circuit 32 supplies a current to the heater tool 31 to generate heat and controls the amount of this current.

[0021] The drive unit 33 consists of a robot including, for example, a linear motor or a ball screw mechanism, and moves the heater tool 31 in at least the X-axis and Y-axis directions under the control of the controller 90. The drive unit 33 moves the heater tool 31 between the upper position of the stage 21 and the upper position of the stage 22 by moving it in the X-axis direction. During soldering, the drive unit 33 moves the heater tool 31, which is in the upper position of the stage 21, downward and brings it into contact with the part W1 of the workpiece W on the stage 21 from above (Figure 1). During quality inspection of the solder S of the product U, the drive unit 33 moves the heater tool 31, which is in the upper position of the stage 22, downward and brings it into contact with the part W1 of the product U on the stage 22 from above (Figure 3). The drive unit 33 may press the heater tool 31 against the part W1 when both contacts occur. This pressing presses the workpiece W and product U from the vertical direction (Y-axis direction or thickness direction).

[0022] A temperature sensor 34 is attached to the heater tool 31. The temperature sensor 34 consists of a thermocouple and converts the temperature of the heater tool 31 into an electrical signal. The converted electrical signal is supplied to the controller 90. The controller 90 detects the temperature of the heater tool 31 by performing predetermined processing on the electrical signal to derive the temperature of the heater tool 31. The detected temperature is used by the controller 90 to control the heating temperature of the heater tool 31 (control the current supplied to the heater tool 31).

[0023] The ultrasonic application device 40 applies ultrasonic waves to the workpiece W during soldering. The ultrasonic application device 40 comprises an ultrasonic transducer (also simply called a transducer) 41, an ultrasonic horn (also simply called a horn) 42, and a drive device 43. The transducer 41 is, for example, a Langevin-type transducer and emits ultrasonic waves. The horn 42 is fixed to the transducer 41 and inserted into a through hole 21A formed in the stage 21. The horn 42 amplifies the ultrasonic waves emitted by the transducer 41. The drive device 43 consists of a linear motor or a ball screw mechanism, etc. The drive device 43 moves the transducer 41 and the horn 42 upward and presses the tip of the horn 42 against a component W2 of the workpiece W on the stage 21. During this pressing, the transducer 41 emits ultrasonic waves. The emitted ultrasonic waves are amplified by the horn 42 and applied to the workpiece W from the side of the component W2. The ultrasonic application device 40, specifically the operation of the drive unit 43 and the vibration of the transducer 41, are controlled by the controller 90.

[0024] The heat flux sensor 50 is positioned and housed in a recess 22A that opens on the upper surface of the stage 22. In this way, the stage 22 positions and supports the heat flux sensor 50. For visibility purposes, the schematic diagram of the heat flux sensor 50 in Figures 1 to 3 is marked with a dot pattern. The upper surface of the heat flux sensor 50 is either flush with the upper surface of the stage 22 or positioned above the upper surface of the stage 22 so that it can contact the component W2 of the product U. In the latter case, the stage 22 supports the product U via the heat flux sensor 50.

[0025] During quality inspection of the solder S of product U, the heater tool 31 pressurizes and heats product U on the stage 22. Due to the pressurization by the heater tool 31, product U is sandwiched between the upper surface of the stage 22 and the heat flux sensor 50, at least the heat flux sensor 50 and the heater tool 31. As a result, at least the heat flux sensor 50 is pressed against component W2 of product U. Product U is heated from the side of component W1 by the heating by the heater tool 31. The heating temperature of the heater tool 31, that is, the heating temperature that heats product U (more specifically component W1), is set to a temperature at which the solder S does not melt, as this is for quality inspection of the solder S.

[0026] Heating by the heater tool 31 generates a heat flow HF (Figure 3) in product U, which flows from component W1 through solder S to component W2. The heat flow HF flows from component W2 through the heat flux sensor 50 to the stage 22. The heat flux sensor 50 measures the heat flux q [W / m] of this heat flow HF. 2 The ] is converted into an electrical signal (in this case, a voltage signal). The heat flux sensor 50 supplies the converted electrical signal indicating the heat flux q to the controller 90. The controller 90 detects the heat flux q by performing predetermined processing on the electrical signal to derive the heat flux q. In this way, the controller 90 detects the heat flux q of the heat flow HF that flowed from component W1 to solder S and then to component W2 using the heat flux sensor 50. The controller 90 inspects the quality of solder S based on the heat flux q. The heat flux sensor 50 is, for example, a plate-shaped heat flow sensor called "Energy flow" (registered trademark) manufactured by Toyota Motor Corporation.

[0027] Stage 22 is heated by heating product U with heater tool 31. Stage 22 is cooled by cooling device 61 even after the aforementioned heating, and is maintained at a constant temperature. Cooling device 61 may be air-cooled or water-cooled. An example of an air-cooled cooling device 61 is a fan or other blower. Cooling device 61 may consist of a cooling device using a Peltier element. Cooling device 61 is controlled by controller 90.

[0028] Stage 22 is equipped with a temperature sensor 62 that converts the temperature of the area near the heat flux sensor 50 in Stage 22 into an electrical signal. The temperature sensor 62 is, for example, made up of a thermocouple. The electrical signal converted by the temperature sensor 62 is supplied to the controller 90. The controller 90 detects the temperature of Stage 22 by performing predetermined processing on the electrical signal to derive the temperature of Stage 22. The detected temperature is used by the controller 90 for temperature control of Stage 22, that is, for control of the cooling device 61.

[0029] The input / output device 70 includes a display device, an input device, etc., and displays various images and accepts various operations from the user.

[0030] The controller 90 consists of various computers and includes a non-volatile storage 91 for storing programs and other data, and a processor 92 for executing the programs stored in the storage 91. The storage 91 also stores data used in the following processes, such as soldering conditions, inspection heating conditions, pass / fail conditions, and learning data sets. The processor 92 is composed of one or more CPUs (Central Processing Units). The controller 90 further includes a main memory 93 that provides a workspace for the processor 92, and an I / O (Input / Output) 94 that relays electrical signals transmitted and received between the processor 92 and the outside of the controller 90. The I / O 94 may include a circuit that amplifies and converts analog to digital the electrical signals from the temperature sensor 34, the heat flux sensor 50, the temperature sensor 62, and the operation signals from the input / output device 70. Furthermore, I / O94 may include a circuit that converts control signals from processor92 from digital to analog and supplies them to the controlled objects (for example, transport device 23, power supply circuit 32, drive device 33, ultrasonic application device 40, cooling device 61, input / output device 70).

[0031] The soldering conditions specify the control mode of the power supply circuit 32 during soldering. The inspection heating conditions specify the control mode of the power supply circuit 32 during quality inspection of the solder S of product U. The specific contents of both conditions are arbitrary, but each condition here shall include a temperature profile showing the change in heating temperature over time for the heating temperature of the heater tool 31, i.e., for the workpiece W or product U (more specifically, component W1). The pass / fail conditions include one or more thresholds when inspecting the quality of the solder S. Each condition can be set or changed by the user by operating the input / output device 70. The learning data set includes multiple learning data, each learning data including the quality inspection result and the soldering conditions at that quality level, which are associated with each other.

[0032] The processor 92 operates as the soldering execution unit 92A, transport execution unit 92B, quality inspection execution unit 92C, cooling control unit 92D, and machine learning unit 92E shown in Figure 4 by executing programs stored in the storage 91. The quality inspection execution unit 92C includes a heating execution unit 92CA, a heat flux detection unit 92CB, and a quality determination unit 92CC. Each unit 92A to 92C works together to perform the soldering and quality inspection process shown in Figure 5. The soldering and quality inspection process is performed sequentially for each of the multiple workpieces W. As a result, multiple products U are produced.

[0033] In the soldering and quality inspection process, first, the soldering execution unit 92A performs a soldering process to solder the workpiece W placed on the stage 21 (step S11). The workpiece W is to be placed on the stage 21 by a transport mechanism (not shown) or by the user.

[0034] A detailed example of the soldering process will be explained with reference to Figure 6. First, the soldering execution unit 92A controls the drive device 33 to move the heater tool 31 above the stage 21, and then moves it downward to pressurize the workpiece W (step S21; see the state in Figure 1). The workpiece W is sandwiched between the stage 21 and the moved heater tool 31 and pressed from the thickness direction.

[0035] After step S21, the soldering execution unit 92A controls the current flowing to the heater tool 31 by controlling the power supply circuit 32 according to the soldering conditions stored in the storage 91, and performs soldering (step S22). The soldering execution unit 92A may start step S22 when it detects that the pressure applied to the workpiece W, detected by a pressure sensor (not shown) located at a predetermined position, exceeds a predetermined pressure. In step S22, first, the heater tool 31 generates heat, and the component W1 in contact with the heater tool 31 is heated. The entire workpiece W is heated by heat conduction due to this heating. The solder S melts due to the heating of the workpiece W. After a certain period of time, the current is controlled to end the heating, and the solder S hardens after the heating is finished. Through this series of operations in step S22, soldering of component W1 and component W2 is performed, and component W1 and component W2 are joined by solder S. This joining produces product U, which is the workpiece W after soldering.

[0036] In step S22, the soldering execution unit 92A periodically detects the temperature (more specifically, the heat generation temperature) of the heater tool 31 using the temperature sensor 34. Based on the detected temperature, the soldering execution unit 92A feedback-controls the power supply circuit 32 (for example, the switching frequency of the switching element of the inverter circuit) so that the time change in the heat generation temperature of the heater tool 31 matches the temperature profile included in the soldering condition 61B. Here, the temperature profile is a pulse heat profile that raises the temperature of the heater tool 31 in a pulsed manner (i.e., instantaneously). This results in pulse heat heating or soldering, which allows the heating time of the workpiece W to be shortened.

[0037] During soldering in step S22, the soldering execution unit 92A controls the ultrasonic application device 40 to apply ultrasonic waves to the workpiece W. Specifically, the soldering execution unit 92A vibrates the transducer 41 ultrasonically and controls the drive device 43 to move the transducer 41 and the horn 42 upward, pressing the tip of the horn 42 against the workpiece W from below. This applies ultrasonic waves to the workpiece W. This application of ultrasonic waves reduces the amount of voids generated in the solder S during soldering.

[0038] After step S22, the soldering execution unit 92A controls the drive unit 33 to move the heater tool 31 upward, separating the heater tool 31 from the product U, which is the workpiece W after soldering (step S23; see the state in Figure 2). At this time, the soldering execution unit 92A also controls the ultrasonic application device 40 to separate the horn 42 from the workpiece W and stop the ultrasonic oscillation.

[0039] Referring again to Figure 5, after step S11, the transport execution unit 92B controls the transport device 23 to transport the product U from stage 21 to stage 22 (step S12). After that, the quality inspection execution unit 92C performs the quality inspection process (step S13).

[0040] The quality inspection execution unit 92C performs, for example, the quality inspection process shown in Figure 7. In this process, first, the heating execution unit 92CA of the quality inspection execution unit 92C controls the drive device 33 to move the heater tool 31 above the stage 22, and then below, thereby pressurizing the product U on the stage 22 (step S31; see state in Figure 3). The product U is sandwiched between the stage 22 and at least the heat flux sensor 50 and the heater tool 31, and is pressed from the thickness direction. Due to this pressurization, the heat flux sensor 50 in contact with the part W2 of the product U is pressed against the part W2 and becomes tightly attached.

[0041] After step S31, the heating execution unit 92CA controls the current flowing to the heater tool 31 by controlling the power supply circuit 32 according to the inspection heating conditions stored in the storage 91, thereby heating the product U (step S32). The heating execution unit 92CA may also start step S32 when it detects that the pressure applied to the product U, detected using a pressure sensor (not shown) located at a predetermined position, exceeds a predetermined pressure.

[0042] In step S32, the heating execution unit 92CA provides feedback control to the power supply circuit 32 based on the temperature (heating temperature) of the heater tool 31 detected by the temperature sensor 34, so that the time change in the heating temperature of the heater tool 31 matches the temperature profile included in the test heating conditions. The temperature profile here is a pulse heat profile that increases the temperature of the heater tool 31 in a pulsed manner. This temperature profile, for example as shown in Figure 8(A), raises the temperature Te of the heater tool 31 to a predetermined temperature Te1 (a temperature lower than the melting temperature of the solder S) in a short time (e.g., a few seconds) (T1~T4), then holds it at the predetermined temperature Te1 for a predetermined period (e.g., a few seconds to tens of seconds) (T4~T5), and then decreases it. As shown in Figure 8(B), the heating execution unit 92CA rapidly increases the current that heats the heater tool 31 to a current I2 that is larger than the current I1 that heats the heater tool 31 at the predetermined temperature Te1 and holds it there (T1~T3). When the temperature Te detected by the temperature sensor 34 reaches temperature Te1, the heating execution unit 92CA reduces the current supplied to the heater tool 31 to the above current I1 (T3~T4), holds the current I1 for a predetermined period (T4~T5), and then terminates the supply of current to the heater tool 31.

[0043] In step S32, the heating of product U by the heater tool 31 generates the heat flow HF (Figure 3) that flows from the heater tool 31 to the stage 22 via product U and the heat flux sensor 50. The heat flux detection unit 92CB uses the heat flux sensor 50 to detect the heat flux q of the heat flow HF that passes through the heat flux sensor 50, that is, the heat flux q of the heat flow HF that flows from component W1 of product U through solder S and then through component W2 (step S33). This detection is performed periodically. The periodically detected heat flux q is stored in the main memory 93 as time-series data in chronological order. Step S33 is performed in parallel with step S32. This time-series data is data on the time change of heat flux q.

[0044] When step S32 is completed, step S33 is also completed. After steps S32 and S33 are completed, the quality determination unit 92CC determines the quality of the solder S of product U based on the time-series data of the heat flux q detected by the heat flux detection unit 92CB and stored in the main memory 93 (step S34).

[0045] During the aforementioned heating process, the heat flux q rises rapidly for a predetermined period immediately after the start of heating of the heater tool 31, as shown in the graphs (solid and dashed lines) in Figure 9. For example, from the heating start timing T1 to the timing T4 when the temperature of the heater tool 31 reaches a predetermined temperature Te1 for heating the product U. Subsequently, the heat flux q reaches a peak value (after timing T4.5). As the stage 22 is kept at a constant temperature by the cooling device 61, this peak value continues until the heating of the heater tool 31 is completed. If cooling is not performed by the cooling device 61, the heat flux q gradually decreases after the peak due to heat conduction.

[0046] Of the two graphs in Figure 9, the solid line graph represents the case where the amount of voids in the solder S is small and the quality of solder S is good, while the dashed line graph represents the case where the amount of voids is large and the quality of solder S is poor. As is clear from both graphs in Figure 9, the increase in heat flux q is small when the amount of voids is large. This is because voids exert an insulating effect. The solid line graph and the dashed line graph differ in the rate of increase of heat flux q immediately after the start of heating, or more specifically, during the period from the start of heating until the temperature Te of the heater tool 31 reaches temperature Te1. The rate of increase is expressed by the slope of the time change of heat flux q, etc. Also, the solid line graph and the dashed line graph differ in the value of heat flux q at a predetermined timing, in particular when the heat flux q reaches its peak.

[0047] In step S34, the quality determination unit 92CC determines that the quality of the solder S is good if the rate of increase of the heat flux q immediately after the start of heating is equal to or greater than the threshold Th1, and determines that the quality of the solder S is poor if the rate of increase is less than the threshold Th1. Alternatively or in addition to the above, the quality determination unit 92CC may determine in step S34 that the quality of the solder S is good if the value of the heat flux q at the predetermined timing is equal to or greater than the threshold Th2, and determines that the quality of the solder S is poor if the value is less than the threshold Th2. The quality determination unit 92CC may also determine in step S34 that the quality of the solder S is good if the rate of increase of the heat flux q immediately after the start of heating is equal to or greater than the threshold Th1 AND the value of the heat flux q at the predetermined timing is equal to or greater than the threshold Th2, and otherwise determine that the quality of the solder S is poor. The quality determination unit 92CC may, in step S34, determine that the quality of the solder S is good if the rate of increase of the heat flux q immediately after the start of heating is equal to or greater than the threshold Th1, or if the value of the heat flux q at the predetermined timing is equal to or greater than the threshold Th2, and otherwise determine that the quality of the solder S is poor.

[0048] Furthermore, the quality determination unit 92CC may compare the pattern of time change of the heat flux q shown by the time-series data of the heat flux q (for example, a graph like the one in Figure 9 based on the time-series data) with a reference pattern (for example, a reference graph) which is the pattern of time change of the heat flux when the quality of the solder S is good, and which has been prepared in advance by experimentation or the like. The quality determination unit 92CC determines that the quality of the solder S is poor if the magnitude of the deviation between the two patterns (more specifically, the deviation in the direction of decreasing heat flux q) is greater than or equal to a predetermined standard. As an example of when the magnitude of the deviation is greater than or equal to the predetermined standard, the case may be adopted when the similarity between the two patterns (for example, the graph images) is greater than or equal to a certain standard. Alternatively, as an example of the case, the reference pattern may be a pattern with a width set as the range of the allowable value of the heat flux (for example, a bar curve graph), and the case may be adopted when the pattern of time change of the heat flux shown by the time-series data of the heat flux q deviates from the reference pattern with the width by a predetermined amount or more. The quality determination unit 92CC determines that the quality of the solder S is good if the magnitude of the deviation between the two aspects is less than a predetermined standard.

[0049] The threshold Th1, threshold Th2, reference pattern, and each criterion described above are included in the pass / fail conditions stored in the storage 12 and are referenced by the pass / fail determination unit 92CC.

[0050] After step S34, the quality determination unit 92CC performs processing according to the determination result (step S35). For example, if the determination result is good, the quality determination unit 92CC performs processing to supply product U to a subsequent process (more specifically, to equipment that performs subsequent processing). For example, the quality determination unit 92CC controls a transport device (not shown) to transport product U on stage 22 to a subsequent process. The subsequent process includes a packaging process (e.g., a packaging device) if product U is the final product. If product U is not the final product, the subsequent process includes the next processing device or assembly device. The subsequent process may be manual. In this case, the quality determination unit 92CC displays on the input / output device 70 that product U is good as a process for supplying product U to the subsequent process. If the determination result is bad, the quality determination unit 92CC treats product U as a defective product and does not supply it to the aforementioned subsequent process. Treating product U as a defective product includes redoing the soldering of parts W1 and W2 on the defective product U. In this case, the quality determination unit 92CC may control the transport device 23 to return the product U to the stage 21, and soldering using the heater tool 31 may be performed again. Treating product U as defective includes the quality determination unit 92CC controlling a transport device (not shown) to transport the defective product U for disposal. Treating product U as defective also includes the quality determination unit 92CC notifying the user of the defect by displaying it as an inspection result on the input / output device 70, etc.

[0051] The quality determination unit 92CC associates the soldering conditions used in step S11 with the determination result, i.e., the inspection result, obtained in step S34, and adds them to the learning data group in storage 12 as learning data (step S36).

[0052] After the above series of processes are completed, the soldering and quality inspection process is finished.

[0053] During the quality inspection of the solder S of the above-mentioned product U, the stage 22 is heated. In this embodiment, since the heating temperature (in other words, the target temperature) of the heater tool 31 during inspection is fixed, the magnitude of the heat flux q changes depending on the temperature of the stage 22. Therefore, even when inspecting solder S with the same amount of voids, different heat fluxes q may be obtained depending on the temperature of the stage 22 at that time. For this reason, it is desirable to keep the temperature of the stage 22 constant. Accordingly, the cooling control unit 92D in Figure 4 controls the cooling device 61 by feedback control using the temperature of the stage 22 detected by the temperature sensor 62 shown in Figures 1 to 3 as a feedback value, thereby maintaining the temperature of the stage 22 at a desired temperature. In addition, the temperature of the heat flux sensor 50 is also maintained at a desired temperature. Furthermore, in order to facilitate the generation of heat flux HF and to facilitate the above temperature control, the stage 22 should be made of a material with good thermal conductivity, such as copper.

[0054] Furthermore, since the temperature of stage 21 only needs to be at the desired temperature immediately before quality inspection, the cooling control unit 92D may operate the cooling device 61 at least before quality inspection if the temperature of stage 21 detected by the temperature sensor 62 is not at the desired temperature. Alternatively, stage 21 may be cooled naturally. In this case, the cooling device 61, temperature sensor 62, and cooling control unit 92D become unnecessary.

[0055] The machine learning unit 92E in Figure 4 operates at any time and performs machine learning based on the training data set consisting of training data accumulated in the storage 91, updating the soldering conditions stored in the storage 91. Grounded machine learning is performed using the inspection results from the training data as ground truth data. Whether or not to perform such machine learning is optional, but if machine learning is performed, the soldering conditions used during soldering should be changed automatically or manually each time soldering is performed, once or multiple times. This allows for obtaining a large amount of training data useful for machine learning. In machine learning, the soldering conditions are updated so that the inspection results are more likely to be good at a high frequency.

[0056] During soldering, the component W2 may be placed on the stage 21, and the heater tool 31 may hold component W1 and move it onto component W2. This holding is, for example, by suction. In this case, the heater tool 31 is provided with a suction port for suctioning component W2. The heater tool 31 also includes a pump that performs suction using this suction port. This pump may be directly fixed to the heater tool body, which is the heat-generating part of the heater tool 31 equipped with the suction port, or it may be disposed separately from the heater tool body and connected to the heater tool body by a tube. When the heater tool 31 holds component W1, the solder S may be placed on component W2 or on component W1. If the heater tool 31 has such a function, the product U may be held by the heater tool 31 and transported from stage 21 to stage 22 by the movement of the heater tool 31 by the drive device 33. In this case, the transport device 23 is not necessary. Furthermore, even with this configuration, it can be said that stage 21 or 22 supports the entire workpiece W or the entire product U from below during soldering or quality inspection.

[0057] As explained above, the controller 90 operates as an inspection device that inspects the quality of the solder S joining component W1 and component W2. The controller 90 includes a heat flux detection unit 92CB and a quality determination unit 92CC. The heat flux detection unit 92CB detects the heat flux of the heat flow that flows from component W1 to component W2 and then to component W2 by heating the product U at a temperature that does not melt the solder S to component W1, using a heat flux sensor 50. The quality determination unit 92CC determines the quality of the solder S based on the heat flux detected by the heat flux detection unit 92CB. The quality determination unit 92CC also executes processing according to the determination result. The determination result can be said to be the inspection result of the quality of the solder S.

[0058] According to the above configuration, the quality of the solder S is determined based on the heat flux detected by the heat flux sensor 50. Since the heat flux sensor 50 can generally detect heat flux with high sensitivity, according to the above configuration, even minute changes in the amount of voids can be captured by the heat flux sensor 50, and the quality of the solder S can be determined with high accuracy. Therefore, the quality inspection of the solder S is performed with high accuracy. As a similar technology, for example, quality determination can be made based on temperature detected by a thermocouple, but since the heat flux sensor 50 is more sensitive than a thermocouple, the quality inspection of the solder S is performed with high accuracy. In addition, since the heat flux sensor 50 has a fast heat flux detection speed, the inspection time can also be shortened.

[0059] In this embodiment, the heat flux detected by the heat flux detection unit 92CB is a plurality of heat fluxes detected at multiple timings (time-series data of the heat flux above; the same applies hereinafter), that is, the time change of the heat flux. As described above, the quality determination unit 92CC may determine the quality of the solder S to be poor when the rate of increase of the heat flux is less than the threshold Th1, and determine the quality to be good when the rate of increase is equal to or greater than the threshold Th, based on the time change. This makes it possible to inspect the quality of the solder S with high accuracy. The rate of increase of the heat flux used in the determination is preferably the rate of increase during a period in which the heat flux increases rapidly. Examples of this period include (1) the period from the start of heating of the component W1 (product U) by the heater tool 31 until the temperature of the heater tool 31 reaches the target heat generation temperature for the heating (the period from T1 to T4 in Figure 8), or (2) the period from the start of heating until the heat flux reaches its peak value (the period from T1 to T4.5 in Figure 9). The rate of increase may be the value obtained by dividing the rate of increase in heat flux over a predetermined period, which is either the entire period or a portion of these periods, by the predetermined period, or it may be the derivative of the time change of heat flux at a certain point in time within these periods. The same applies to the rate of increase described below.

[0060] As described above, the quality determination unit 92CC may determine that the quality of the solder S is poor when the value of the heat flux at a predetermined timing among the time changes of the heat flux detected by the heat flux detection unit 92CB is less than the threshold Th2, and determine that the quality is good when the value is equal to or greater than the threshold Th2. This allows for accurate inspection of the quality of the solder S. Note that the heat flux detected by the heat flux detection unit 92CB may be not a time change, but only the value of the heat flux detected at a timing after a certain period of time has elapsed since the start of heating (i.e., the predetermined timing). The predetermined timing may be a timing predetermined as the timing when the heat flux reaches its peak value, or the timing when the heat flux reaches its peak value among the time changes of the heat flux.

[0061] As described above, the quality determination unit 92CC may determine the quality to be poor when the rate of increase of the heat flux detected by the heat flux detection unit 92CB is less than the threshold Th1, and / or when the value of the heat flux at a predetermined timing is less than the threshold Th2, and determine the quality to be good otherwise. This allows for accurate inspection of the quality of the solder S.

[0062] As described above, the quality determination unit 92CC may determine the quality to be poor if the magnitude of the deviation between the pattern of the time change of the heat flux detected by the heat flux detection unit 92CB (for example, a graph of the time change of the heat flux based on time-series data of the heat flux) and a pre-prepared pattern of the time change of the heat flux when the solder S is of good quality is greater than or equal to a predetermined standard, and determine the quality to be good if the magnitude of the deviation is less than the predetermined standard. This allows for accurate inspection of the quality of the solder S.

[0063] As a variation of this embodiment, the quality determination unit 92CC may be an artificial intelligence model that takes the time change of the heat flux detected by the heat flux detection unit 92CB as input and outputs the quality as determined by the determination result. This model can be generated by machine learning using the quality and time change of the heat flux (time series data) obtained from experiments, etc., as training data. The time change here may be time series data, or it may be graph data based on the time series data (for example, graph image data).

[0064] Furthermore, in the above embodiment, the joint inspection system 10 includes a heater tool 31 that heats component W1 (product U) by contacting component W1 and generating heat, a heat flux sensor 50 that contacts component W2, and a controller 90 as an inspection device. Such a joint inspection system 10 can operate as an inspection system that inspects at least the quality of solder S.

[0065] As described above, the controller 90 may further include a heating execution unit 92CA that controls the current that generates heat in the heater tool 31, causing the heater tool 31 to perform pulse heating. Pulse heating enables precise temperature control of the heater tool 31, and as a result, the quality of the solder S can be inspected with high accuracy. Note that the heating does not have to be pulse heating. In any case of heating, if there are many voids, the rate of increase and peak of the heat flux at the beginning of heating will be lower than when there are few voids, as described above, so the quality can be judged using the same method as above.

[0066] As described above, the heater tool 31 is preferably configured to heat the workpiece W, which includes component W1, component W2, and solder S before soldering, from the side of component W1, and to perform soldering to join component W1 and component W2 with solder S. This allows the heater tool 31 to be used for both soldering and inspection, and facilitates quality inspection of the solder S of each of the multiple products U obtained by multiple soldering processes. It also makes it easier to integrate the joint inspection system 10 inline into a predetermined manufacturing line. Separate heater tools may be provided for soldering and inspection. Stages 21 and 22 may be a common stage, but the stage is often preheated during soldering, and in this case, the preheated stage must be cooled further during inspection. For this reason, it is preferable to have separate stages for soldering and inspection, such as stages 21 and 22.

[0067] As described above, the controller 90 is preferably equipped with a machine learning unit 92E that performs machine learning using the soldering conditions when soldering is performed by the heater tool 31 and the result of determining the quality of the solder S soldered under those conditions (inspection result) as training data. The machine learning unit 92E updates the soldering conditions stored in the storage 91 through this machine learning. As a result, the soldering conditions become suitable for soldering.

[0068] As described above, the joint inspection system 10 may include a stage 22 supporting a heat flux sensor 50, a temperature sensor 62 for detecting the temperature of the stage 22, and a cooling device 61 for cooling the stage 22. The controller 90 may include a cooling control unit 92D that controls the cooling device 61 at all times (especially before and during inspection) to keep the stage 22 at a predetermined temperature based on the temperature detected using the temperature sensor 62. This makes it possible to make the temperature difference between the heater tool 31 and the stage 22 a desired temperature difference or approach it during solder S inspection, and suppresses the instability of the relationship between void amount and heat flux with each inspection. This makes it possible to inspect the quality of the solder S of product U with high accuracy. Note that the stage 22 only needs to be at a predetermined temperature at least before heating during quality inspection, so the cooling device 61 may be controlled at least before inspection.

[0069] As described above, the joint inspection system 10 may include a stage 22 supporting a heat flux sensor 50 and a temperature sensor 62 for detecting the temperature of the stage 22. The controller 90 may further include a heating execution unit 92CA that controls the current to heat the heater tool 31, causing the heater tool 31 to heat the component W1 (product U). As a modification, the heating execution unit 92CA may be configured to control the current so that the difference between the temperature of the heater tool 31 and the temperature detected using the temperature sensor 62 becomes a predetermined temperature difference, instead of or in addition to the above. For example, the heating execution unit 92CA feedback-controls the current to heat the heater tool 31, using the temperature of the heater tool 31 detected using the temperature sensor 34 plus the predetermined temperature difference as the target temperature. For example, the heating execution unit 92CA may prepare a plurality of different inspection heating conditions according to the temperature detected by the temperature sensor 62, and perform heating using the inspection heating conditions according to the temperature detected by the temperature sensor 62. With the above configuration, the temperature difference between the heater tool 31 and the stage 22 can be set to the desired temperature difference during solder S inspection, and the instability of the relationship between void amount and heat flux with each inspection is suppressed. As a result, the quality inspection of the solder S of product U can be performed with high accuracy. Furthermore, by combining this with the cooling of the stage 22, the temperature difference between the heater tool 31 and the stage 22 can be stably set to the desired temperature difference during solder S inspection.

[0070] The above embodiment also includes a method for inspecting the quality of the solder S of product U. This inspection method comprises a heating step of heating component W1 of product U at a temperature that does not melt the solder S; a detection step of detecting the heat flux of the heat flow that flows from component W1 to component W2 and then to component W2 using a heat flux sensor 50; and a determination step of determining whether the quality is good or bad based on the heat flux detected in the detection step. The entity that performs each step can be arbitrary (the same applies to the steps below). The quality of the solder S of product U can be inspected with high accuracy.

[0071] The heat flux detected in the detection step may be either a time-dependent change in the heat flux or the heat flux at a specific point in time. In the former case, the discrimination step may include a step to determine whether the quality is good or bad based on the time-dependent change detected in the detection step. This allows for accurate inspection of the quality of the solder S of product U.

[0072] In the heating step, component W1 is heated by a heater tool 31 that has been used to solder component W1 and component W2 together using solder S. This allows the heater tool to be used for both soldering and inspection.

[0073] A cooling step may be performed at least before the heating step to cool the stage 22 supporting the heat flux sensor 50 to a predetermined temperature. With this configuration, the temperature difference between the heater tool 31 and the stage 22 can be set to or approached the desired temperature difference during solder inspection, and instability in the relationship between void amount and heat flux with each inspection is suppressed.

[0074] The above embodiment also includes a method for producing product U, that is, a soldered product. This production method comprises: a first step of producing product U, which includes component W1, component W2, and the solder S joining them together by soldering component W1 and component W2 together with solder S; and a second step of inspecting the quality of the solder S of the produced product U (determining whether it is good or bad) by performing the inspection method described above. This makes it possible to obtain product U whose quality has been inspected with high accuracy.

[0075] Furthermore, the production method further includes a third step in which products U that are determined to be of good quality by the inspection method in the second step are supplied to the next process, and products U that are determined to be of poor quality are treated as defective products and not supplied to the next process. As a result, products U that are accurately determined to be good products are supplied to the next process.

[0076] (modified version) Various modifications are possible to the above embodiment. For example, the various configurations described in the above embodiment are arbitrary and can be changed as appropriate. For example, the processor 92 may consist of at least one or more combinations of one or more CPUs, one or more ASICs (Application Specific Integrated Circuits), and one or more FPGAs (Field-Programmable Gate Arrays). The processor 92 can also be called a processing unit. The program may be stored in a non-temporary storage medium that is readable by the computer, such as a non-volatile storage 91.

[0077] (Note) Configurations based on the above embodiments and modifications are provided as examples. The provided configurations are interchangeable. (Note 1) An inspection device for inspecting the quality of the solder joining a first component and a second component, A detection unit that detects the heat flux of the heat flow that flows from the first component to the solder and then to the second component by heating the first component at a temperature that does not melt the solder, using a heat flux sensor, A quality determination unit that determines whether the quality is good or bad based on the heat flux detected by the detection unit, An inspection device equipped with the following features. (Note 2) The heat flux is the time change of the heat flux, The quality determination unit determines the quality to be poor when the rate of increase of the heat flux is less than a first threshold, and determines the quality to be good when the rate of increase is equal to or greater than the first threshold, based on the time change. The inspection device described in Appendix 1. (Note 3) The heat flux is the value of the heat flux at a predetermined timing, The quality determination unit determines the quality to be poor when the value is less than the second threshold, and determines the quality to be good when the value is equal to or greater than the second threshold. The inspection device described in Appendix 1 or 2. (Note 4) The heat flux is the time change of the heat flux, The quality determination unit determines the quality to be poor when, based on the time change, at least one of the following conditions is met: the rate of increase of the heat flux is less than a third threshold, and the value of the heat flux at a predetermined timing is less than a fourth threshold; otherwise, it determines the quality to be good. The inspection device described in Appendix 1. (Note 5) The heat flux is the time change of the heat flux, The quality determination unit determines the quality to be poor if the magnitude of the deviation between the mode of the mode of the mode of the mode of the heat flux The inspection device described in any of the appendices 1 to 3. (Note 6) The heat flux is the time change of the heat flux, The quality determination unit is an artificial intelligence model that takes the time change as input and outputs the quality (good or bad) as the result of the determination by the quality determination unit. An inspection device as described in any of the appendices 1 to 5. (Note 7) A heater tool that generates heat by contacting the first component, The heat flux sensor in contact with the second component, An inspection device as described in any of Appendix 1 to 6, An inspection system equipped with the following features. (Note 8) The inspection apparatus further comprises a heating execution unit that controls the current that generates heat in the heater tool, causing the heater tool to perform heating using a pulsed heat method as the heating method. The inspection system described in Appendix 7. (Note 9) The heater tool heats the workpiece, which includes the first component, the second component, and the solder before soldering, from the side of the first component, and performs soldering to join the first component and the second component with the solder. The inspection system described in Appendix 7 or 8. (Note 10) The inspection device further includes a machine learning unit that updates the soldering conditions by performing machine learning using the soldering conditions when soldering is performed with the heater tool and the result of determining whether the quality of the solder soldered under those conditions is good or bad as training data. The inspection system described in Appendix 9. (Note 11) A stage supporting the heat flux sensor, A temperature sensor for detecting the temperature of the stage, The system further comprises a cooling device for cooling the aforementioned stage, The inspection apparatus includes a cooling control unit that controls the cooling device so that the stage reaches a predetermined temperature at least before heating, based on the temperature detected using the temperature sensor. The inspection system described in any of the appendices 7 to 10. (Note 12) A stage supporting the heat flux sensor, The system further comprises a temperature sensor for detecting the temperature of the stage, The inspection apparatus further comprises a heating execution unit that controls the current that generates heat in the heater tool to cause the heater tool to perform the heating, The heating unit controls the current based on the temperature detected using the temperature sensor so that the difference between the temperature of the heater tool and the temperature of the stage becomes a predetermined temperature difference. The inspection system described in any of the appendices 7 to 11. (Note 13) A program that makes the computer function as the inspection device described in appendices 1 to 12. (Note 14) A method for inspecting the quality of the solder joining a first component and a second component, A heating step of heating the first component at a temperature that does not melt the solder, A detection step in which a heat flux sensor detects the heat flux of the heat flow that flows from the first component to the solder and then to the second component as a result of the heating step, A determination step for determining whether the quality is good or bad based on the heat flux detected in the detection step, An inspection method that includes the following features. (Note 15) The heat flux detected in the above detection step is the time change of the heat flux, The determination step includes determining whether the quality is good or bad based on the time change detected by the detection step. The inspection method described in Appendix 14. (Note 16) In the heating step, the first component is heated by a heater tool that has been used to solder the first component and the second component together using solder. The inspection method described in Appendix 14. (Note 17) The method further comprises a cooling step of cooling the stage supporting the heat flux sensor to a predetermined temperature at least before the heating step. The inspection method described in Appendix 14. (Note 18) A first step of producing a soldered product including the first part, the second part, and the solder by performing soldering to join the first part and the second part with the solder, The second step involves inspecting the quality of the solder in the produced soldered product by performing the inspection method described in any of the appendices 14 to 17, A production method that includes the following features. (Note 19) The process further comprises: a third step in which the soldered product whose quality is determined to be good by the inspection method in the second step is supplied to the next process, and the soldered product whose quality is determined to be poor is treated as a defective product and not supplied to the next process. The production method described in Appendix 18.

[0078] (Scope of the present invention) The present invention has been described above with reference to embodiments and modifications, but the present invention is not limited to the above embodiments and modifications. For example, the present invention includes various modifications to the above embodiments and modifications that can be understood by those skilled in the art within the scope of the technical concept of the present invention. Each of the components listed in the above embodiments and modifications can be combined as appropriate to the extent that they do not contradict each other. Furthermore, each component can be omitted at will. [Explanation of symbols]

[0079] 10…Joining inspection system, 12…Storage, 21…Stage, 21A…Through hole, 22…Stage, 22A…Recess, 23…Transport device, 23A…Holding member, 23B…Drive device, 31…Heater tool, 32…Power supply circuit, 33…Drive device, 34…Temperature sensor, 40…Ultrasonic application device, 41…Transducer, 42…Horn, 43…Drive device, 50…Heat flux sensor, 61…Cooling device, 62…Temperature sensor S, 70... Input / Output device, 90... Controller, 91... Storage, 92... Processor, 92A... Soldering execution unit, 92B... Transport execution unit, 92C... Quality inspection execution unit, 92CA... Heating execution unit, 92CB... Heat flux detection unit, 92CC... Good / bad judgment unit, 92D... Cooling control unit, 92E... Machine learning unit, 93... Main memory, HF... Heat flow, S... Solder, U... Product, W... Workpiece, W1... Part, W2... Part.

Claims

1. An inspection device for inspecting the quality of the solder joining a first component and a second component, A detection unit that detects the heat flux of the heat flow that flows from the first component to the solder and then to the second component by heating the first component at a temperature that does not melt the solder, using a heat flux sensor, A quality determination unit that determines whether the quality is good or bad based on the heat flux detected by the detection unit, An inspection device equipped with the following features.

2. The heat flux is the time change of the heat flux, The quality determination unit determines the quality to be poor when the rate of increase of the heat flux is less than a first threshold, and determines the quality to be good when the rate of increase is equal to or greater than the first threshold, based on the time change. The inspection apparatus according to claim 1.

3. The heat flux is the value of the heat flux at a predetermined timing, The quality determination unit determines the quality to be poor when the value is less than the second threshold, and determines the quality to be good when the value is equal to or greater than the second threshold. The inspection apparatus according to claim 1.

4. The heat flux is the time change of the heat flux, The quality determination unit determines the quality to be poor when, based on the time change, at least one of the following conditions is met: the rate of increase of the heat flux is less than a third threshold, and the value of the heat flux at a predetermined timing is less than a fourth threshold; otherwise, it determines the quality to be good. The inspection apparatus according to claim 1.

5. The heat flux is the time change of the heat flux, The quality determination unit determines the quality to be poor if the magnitude of the deviation between the mode of the mode of the mode of the mode of the heat flux The inspection apparatus according to claim 1.

6. The heat flux is the time change of the heat flux, The quality determination unit is an artificial intelligence model that takes the time change as input and outputs the quality (good or bad) as the result of the determination by the quality determination unit. The inspection apparatus according to claim 1.

7. A heater tool that generates heat by contacting the first component, The heat flux sensor in contact with the second component, The inspection apparatus according to claim 1, An inspection system equipped with the following features.

8. The inspection apparatus further comprises a heating execution unit that controls the current that generates heat in the heater tool, causing the heater tool to perform heating using a pulsed heat method as the heating method. The inspection system according to claim 7.

9. The heater tool heats the workpiece, which includes the first component, the second component, and the solder before soldering, from the side of the first component, and performs soldering to join the first component and the second component with the solder. The inspection system according to claim 7.

10. The inspection device further includes a machine learning unit that updates the soldering conditions by performing machine learning using the soldering conditions when soldering is performed with the heater tool and the result of determining whether the quality of the solder soldered under those conditions is good or bad as training data. The inspection system according to claim 9.

11. A stage supporting the heat flux sensor, A temperature sensor for detecting the temperature of the stage, The system further comprises a cooling device for cooling the aforementioned stage, The inspection apparatus includes a cooling control unit that controls the cooling device so that the stage reaches a predetermined temperature at least before heating, based on the temperature detected using the temperature sensor. The inspection system according to claim 7.

12. A stage supporting the heat flux sensor, The system further comprises a temperature sensor for detecting the temperature of the stage, The inspection apparatus further comprises a heating execution unit that controls the current that generates heat in the heater tool to cause the heater tool to perform the heating, The heating unit controls the current so that the difference between the temperature of the heater tool and the temperature detected by the temperature sensor becomes a predetermined temperature difference. The inspection system according to claim 7.

13. A program that causes a computer to function as the inspection device described in claim 1.

14. A method for inspecting the quality of the solder used to join a first component and a second component, A heating step of heating the first component at a temperature that does not melt the solder, A detection step in which a heat flux sensor detects the heat flux of the heat flow that flows from the first component to the solder and then to the second component as a result of the heating step, A determination step for determining whether the quality is good or bad based on the heat flux detected in the detection step, An inspection method that includes the following features.

15. A first step of producing a soldered product including the first part, the second part, and the solder by performing soldering to join the first part and the second part with the solder, A second step involves performing the inspection method described in claim 14 to inspect the quality of the solder in the produced soldered product, A production method that includes the following features.

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