Transfer method and transfer apparatus

Abstract

The present invention provides a transfer method and a transfer apparatus that can improve production efficiency with a simple configuration. [Solution] A transfer method according to one aspect of the present disclosure is a method for transferring an element to the surface of a target substrate using an adhesive stamp, comprising the steps of: aligning the element picked up by the stamp with the target substrate using the adhesive force of the stamp; bringing the target substrate and the stamp relatively close together to bring the target substrate and the element into contact; and, while the target substrate and the element are in contact, moving the target substrate and the stamp relatively in a direction along the surface of the target substrate to separate them.

Description

Technical Field

[0001] The present disclosure relates to a transfer method and a transfer apparatus.

Background Art

[0002] A technology called silicon photonics for forming optical circuits on a silicon substrate is known. The optical circuits formed by silicon photonics are circuits with a fine size. In order to form a circuit with a fine size, a method of transferring a circuit to a target substrate by pick-and-place using an adhesive stamp has been studied.

[0003] For example, Patent Document 1 discloses an apparatus and a method for assembling semiconductor devices on a target substrate using microtransfer printing.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the apparatus and method for microtransfer printing described in Patent Document 1, there is still room for improvement in terms of improving production efficiency.

[0006] The present disclosure provides a transfer method and a transfer apparatus that can improve production efficiency with a simple configuration.

Means for Solving the Problems

[0007] A transfer method according to one aspect of the present disclosure is a method for transferring an element to the surface of a target substrate using an adhesive stamp, comprising the steps of: aligning the element picked up by the stamp with the target substrate using the adhesive force of the stamp; bringing the target substrate and the stamp relatively close together to bring the target substrate and the element into contact; and, while the target substrate and the element are in contact, moving the target substrate and the stamp relatively in a direction along the surface of the target substrate to separate them.

[0008] A transfer apparatus according to one aspect of the present disclosure is a transfer apparatus for transferring an element to the surface of a target substrate using an adhesive stamp, comprising: a target substrate mounting stand for setting the target substrate; a stamp head having a stamp for picking up an element by adhesive force; a frame for holding the stamp head so that the stamp faces the target substrate mounting stand; a position adjustment device for moving the target substrate relative to the stamp; a first imaging unit for imaging the target substrate and the element from above the target substrate; a control unit for controlling the position adjustment device and the first imaging unit; and a contact detection unit for detecting contact between the target substrate and the element, wherein the control unit controls the first imaging Based on the image captured by the unit, the amount of misalignment between the element and the target substrate is detected, and distortion information of the stamp when the target substrate and the element picked up by the stamp come into contact is detected. The position adjustment device is controlled to move the target substrate and the stamp relative to each other to reduce the amount of misalignment and bring them closer together. When the contact detection unit detects contact between the target substrate and the element picked up by the stamp, the position adjustment device is controlled to move the target substrate and the stamp relative to each other while the target substrate and the element are in contact, separating the target substrate and the stamp in a direction along the surface of the target substrate. [Effects of the Invention]

[0009] According to this disclosure, it is possible to provide a transfer method and a transfer apparatus that can improve production efficiency with a simple configuration. [Brief explanation of the drawing]

[0010] [Figure 1] A schematic diagram showing the transfer apparatus according to Embodiment 1 of this disclosure. [Figure 2] A flowchart illustrating the method for transferring elements picked up by a stamp onto a target substrate. [Figure 3A] Schematic diagram to explain the transfer method [Figure 3B] Schematic diagram to explain the transfer method [Figure 3C] Schematic diagram to explain the transfer method [Figure 3D] Schematic diagram to explain the transfer method [Figure 3E] Schematic diagram to explain the transfer method [Figure 3F] Schematic diagram to explain the transfer method [Figure 3G] Schematic diagram to explain the transfer method [Figure 4] A graph to explain adhesive strength. [Figure 5] Flowchart illustrating the transfer method of element 10 according to Embodiment 2 [Figure 6A] Schematic diagram illustrating the transfer method according to Embodiment 2 [Figure 6B] Schematic diagram illustrating the transfer method according to Embodiment 2 [Figure 6C] Schematic diagram illustrating the transfer method according to Embodiment 2 [Figure 6D] Schematic diagram illustrating the transfer method according to Embodiment 2 [Modes for carrying out the invention]

[0011] (Background leading to this disclosure) In fields such as high-speed communication, high-capacity communication, or sensing, the utilization of light is being considered. In particular, a technology called "silicon photonics" that forms optical circuits on a silicon substrate by a CMOS (Complementary Metal Oxide Semiconductor) process, similar to semiconductor electronic circuits, has attracted attention. The optical circuits formed by silicon photonics are circuits with a fine size having an optical control function. The optical circuits formed by silicon photonics include an optical input / output part or an optical modulator, etc. These optical circuits are connected to each other by fine optical waveguides on the sub-micron order. To operate the optical circuits, usually, light from a light source such as a laser diode (LD: Laser Diode) is connected with high precision to the optical input part via an external transmission medium such as an optical fiber. At this time, it is being considered to form an optical circuit with space saving and a reduced number of components by directly arranging an LD chip or an optical element on the optical circuit substrate for optical connection.

[0012] Also, a device for arranging microchips such as a micro LED display is known. When manufacturing a micro LED display, a method is taken in which a plurality of micro LEDs formed by individually changing a wafer are arranged one by one on a circuit board in a pick-and-place process. In such a method, there is a problem that the pick-and-place process is repeated about tens of thousands of times, which takes time to complete the process and leads to an increase in manufacturing cost.

[0013] In Patent Document 1, in order to shorten the time required for the process, it is disclosed that a plurality of elements are transferred to a target substrate in a single pick-and-place process using a viscoelastic stamp material. In the pick-and-place process using a stamp, when the adhesive force of the stamp is too weak, the elements held by the stamp may fall off and cannot be transferred to the desired positions on the target substrate. Also, when the adhesive force of the stamp is too strong, there may be a problem that the elements held by the stamp cannot be successfully transferred to the target substrate. In Patent Document 1, in order to facilitate the transfer of the elements, it is disclosed that plasma treatment or heat treatment is performed.

[0014] However, when plasma treatment is performed, the manufacturing cost increases because expensive equipment is used. Also, element dropout may occur during plasma treatment. Furthermore, the tact time becomes longer due to heat treatment. As a result, it has been difficult to improve the production efficiency of the transfer.

[0015] Therefore, the present inventor(s) studied a method and an apparatus for transferring elements that can improve the production efficiency with a simple configuration, and arrived at the following invention.

[0016] (Embodiment 1) Preferred embodiments of this disclosure will be described in detail below with reference to the attached drawings. The XYZ coordinate system shown in the figures is for the purpose of facilitating understanding of the embodiments and does not limit the embodiments. In the XYZ coordinate system, the X-axis direction is the width direction of the transfer device D1, the Y-axis direction is the depth direction, and the Z-axis direction is the height direction. The X-axis direction, Y-axis direction, and Z-axis direction represent directions parallel to the X-axis, Y-axis, and Z-axis, respectively. The X-axis direction and Y-axis direction are orthogonal to each other. The X-axis direction and Z-axis direction are orthogonal to each other. The Y-axis direction and Z-axis direction are orthogonal to each other. The XY plane represents a virtual plane parallel to the X-axis direction and the Y-axis direction. The XZ plane represents a virtual plane parallel to the X-axis direction and the Z-axis direction. The YZ plane represents a virtual plane parallel to the Y-axis direction and the Z-axis direction. In each figure, among the X-axis directions, the direction indicated by the arrow is the +X-axis direction, and the direction opposite to that is the -X-axis direction. Furthermore, in each diagram, the direction indicated by the arrow in the Y-axis direction is the +Y-axis direction, and the opposite direction is the -Y-axis direction. Also, in each diagram, the direction indicated by the arrow in the Z-axis direction is the +Z-axis direction, and the opposite direction is the -Z-axis direction. The Z-axis direction is equivalent to, for example, the vertical direction or up and down direction, and the X-axis and Y-axis directions are equivalent to, for example, the horizontal direction or left and right direction.

[0017] In this specification and the drawings, components having substantially the same function are denoted by the same reference numerals to avoid redundant explanations. The shape, thickness, length, etc., of the components shown in each figure may differ from the actual shape, thickness, length, etc., of the components due to the drawing process. Furthermore, the material of each component is not limited to the material described in this embodiment.

[0018] [Overall structure] <Transfer device> Figure 1 is a schematic diagram showing a transfer apparatus D1 according to Embodiment 1 of the present disclosure.

[0019] As shown in Figure 1, the transfer apparatus D1 comprises a target substrate mounting table 21, a stamp head 30, a frame 40, a position adjustment device, a first imaging unit 60, a control unit C1, and a contact detection unit 80. In this embodiment, the transfer apparatus D1 further comprises a source substrate mounting table 11 and a second imaging unit 70, but these are not essential components of the transfer apparatus D1. In this embodiment, the position adjustment device includes a stamp head adjustment device 31 and a substrate adjustment device 51.

[0020] The transfer device D1 is a device for transferring an element 10 to a target substrate 2 using an adhesive stamp 3. In this embodiment, the transfer device D1 picks up the element 10 formed on the source substrate 1 using the adhesive force of the stamp 3 and transfers the element to the target substrate 2.

[0021] <Source board> The source substrate 1 is composed of, for example, a rectangular plate-shaped member. The element 10 is formed on the surface of the source substrate 1.

[0022] Element 10 is, for example, an optical element formed on the source substrate 1 by a COMS process. Element 10 can be formed using an appropriate method to obtain the desired performance, and the formation method is not limited.

[0023] Alignment marks (not shown) may be formed on the source substrate 1 and the element 10. The alignment marks are for aligning the stamp 3 with the element 10 when picking up the element 10 from the source substrate 1. In addition, a coating layer 10a may be formed on the element 10 to protect the surface of the element 10 or to improve the adhesion between the stamp 3 and the element 10. For example, a polymer such as a photoresist can be used as the coating layer 10a.

[0024] <Source board mounting stand> The source board mounting base 11 is a component for mounting the source board 1. The source board mounting base 11 is, for example, a rectangular plate-shaped base. The source board mounting base 11 can be any type that can support the source board 1, and is not limited to that type. The source board mounting base 11 may be provided with, for example, suction holes (not shown) for adsorbing the source board 1. By applying negative pressure to the suction holes, the source board 1 can be brought into close contact with the source board mounting base 11.

[0025] <Target substrate> The target substrate 2 is formed, for example, from a rectangular plate-shaped member. The element 10 picked up by the stamp 3 is transferred to the surface of the target substrate 2. To obtain the desired performance when the element 10 is transferred, the target substrate 2 may have an electrical circuit or optical circuit (not shown) formed on it. The target substrate 2 may have alignment marks (not shown) formed on it to align the element 10 with the target substrate 2 when transferring the element 10.

[0026] <Target substrate mounting stand> The target substrate mounting base 21 is a component for mounting the target substrate 2. The target substrate mounting base 21 is, for example, a rectangular plate-shaped base. The target substrate mounting base 21 can be any type that can support the target substrate 2. The target substrate mounting base 21 may be provided with, for example, suction holes (not shown) for adsorbing the target substrate 2. By applying negative pressure to the suction holes, the target substrate 2 can be brought into close contact with the target substrate mounting base 21.

[0027] The source board mounting base 11 and the target board mounting base 21 are placed on the board stage 50. The board stage 50 is supported by a board adjustment device 51, which will be described later. The source board mounting base 11 and the target board mounting base 21 may be fixed to the board stage 50 by means of screws, for example. Alternatively, the board stage 50 may be integrally formed with the source board mounting base 11 and the target board mounting base 21.

[0028] <Stamp> Stamp 3 is formed from a viscoelastic material. Stamp 3 is a component that picks up the element 10 formed on the source substrate 1 using viscoelasticity, i.e., adhesive force, and transfers the element 10 to a desired position on the target substrate 2. Stamp 3 is formed from a viscoelastic material such as silicone rubber. The material of stamp 3 is not limited to silicone rubber, but can be any material that is viscoelastic. The adhesive force of stamp 3 is appropriately set depending on the physical properties of the element 10 and the target substrate 2.

[0029] The stamp 3 may be made of, for example, a transparent material. By forming the stamp 3 from a transparent material, the element 10 picked up by the stamp 3 and the element 10 picked up by the stamp 3 can be observed from above the stamp 3 in the Z-axis direction. This makes it easy to align the element 10 when picking it up with the stamp 3 and when transferring the picked-up element 10 to the target substrate 2.

[0030] In this embodiment, as shown in Figure 3A later, the stamp 3 has a central portion 3a with a part of its surface protruding. The central portion 3a is a convex portion provided on the surface facing the element 10. By having a central portion 3a which is a convex portion, when the stamp 3 picks up the element 10 formed on the source substrate 1, it is possible to suppress the accidental pickup of other elements formed on the source substrate 1 by contact with the stamp 3. The central portion 3a can be formed to have the same shape as the element 10 to be picked up in a plan view, that is, the same shape as the element 10 in the X-axis and Y-axis directions. The dimensions of the central portion 3a in the X-axis and Y-axis directions may be larger or smaller than those of the element 10. The protruding size of the central portion 3a, that is, the dimension of the central portion 3a in the Z-axis direction, can be, for example, twice or more the dimension (thickness) of the element 10 in the Z-direction. By having the dimension of the central portion 3a in the Z-axis direction be twice or more the thickness of the element 10, it is possible to suppress the accidental pickup of other elements when the element 10 comes into contact with the stamp 3.

[0031] <Stamp Head> The stamp head 30 is a component for holding the stamp 3. The stamp head 30 is, for example, a rectangular plate-shaped base. The type of stamp head 30 is not limited as long as it can hold the stamp 3. The stamp head 30 may be provided with, for example, suction holes (not shown) for adsorbing the stamp 3. By applying negative pressure to the suction holes, the stamp 3 can be made to adhere tightly to the stamp head 30.

[0032] <frame> The frame 40 is a component for holding the stamp head 30. The frame 40 is configured to hold the stamp head 30 so that the stamp 3 faces the target substrate mounting base 21. As shown in Figure 1, in this embodiment, the frame 40 is composed of a top plate 40b horizontal to the XY plane and legs 40c extending from the top plate 40b in the Z-axis direction. A through hole 40a is provided near the center of the top plate 40b of the frame 40. By providing a through hole 40a in the top plate 40b, the source substrate 1, target substrate 2, and element 10 can be observed from above the top plate 40b. This makes it easy to align the element 10 when picking it up from the source substrate 1 and when placing the element 10 on the target substrate 2. The frame 40 can be made of, for example, stainless steel. Alternatively, by forming the frame 40 from a transparent material, the source substrate 1, target substrate 2, and element 10 can be observed from above the frame 40 without providing a through hole 40a.

[0033] <Position adjustment device> The position adjustment device, which includes a stamp head adjustment device 31 and a substrate adjustment device 51, is a device for moving the target substrate 2 relative to the stamp 3. In this embodiment, the target substrate 2 can be moved relative to the stamp 3 by moving the stamp head 30 with the stamp head adjustment device 31, moving the substrate stage 50 on which the target substrate 2 is placed with the substrate adjustment device 51, or by moving both the stamp head 30 and the substrate stage 50 with the stamp head adjustment device 31 and the substrate adjustment device 51.

[0034] The stamp head adjustment device 31 is a movable stage for adjusting the position of the stamp head 30. The stamp head adjustment device 31 can move the position of the stamp head 30 in the X-axis, Y-axis, and Z-axis directions. Furthermore, the stamp head adjustment device 31 can rotate the stamp head 30 around the X-axis, Y-axis, and Z-axis. The stamp head adjustment device 31 can be realized, for example, by combining a linear motion stage using a linear ball guide or a goniometer stage. The stamp head adjustment device 31 is also equipped with a motor and encoder (not shown). The position information of the stamp head adjustment device 31 detected by the encoder is input to the control unit C1, which will be described later.

[0035] The substrate adjustment device 51 is a movable stage for adjusting the position of the substrate stage 50. The substrate adjustment device 51 can move the position of the substrate stage 50 in the X-axis, Y-axis, and Z-axis directions. Furthermore, the substrate adjustment device 51 can rotate the substrate stage 50 around the X-axis, Y-axis, and Z-axis. The substrate adjustment device 51 can be realized, for example, by combining a linear stage using a linear ball guide or a goniometer stage. The substrate adjustment device 51 is also equipped with a motor and encoder (not shown). The position information of the substrate adjustment device 51 detected by the encoder is input to the control unit C1, which will be described later.

[0036] In this embodiment, the substrate adjustment device 51 is used to move the target substrate 2 and the stamp 3 closer together and further apart. The relative movement between the target substrate 2 and the stamp 3 may be performed using the stamp head adjustment device 31, or using both the stamp head adjustment device 31 and the substrate adjustment device 51.

[0037] <First Imaging Unit> The first imaging unit 60 images the target substrate 2 and the element 10 from above the target substrate 2. Furthermore, the first imaging unit 60 can also image the source substrate 1 from above the source substrate 1. The first imaging unit 60 is positioned above the through hole 40a of the frame 40. The first imaging unit 60 is composed of, for example, a camera. The information captured by the first imaging unit 60 is input to the control unit C1, which will be described later.

[0038] <First Imaging Unit Adjustment Device> The first imaging unit adjustment device 61 is a movable stage for adjusting the position of the first imaging unit 60. The first imaging unit adjustment device 61 adjusts the position of the first imaging unit 60 so that the source substrate 1, target substrate 2, stamp 3, and element 10 can be imaged from above. The first imaging unit adjustment device 61 can move the first imaging unit 60 in the X-axis direction, Y-axis direction, and Z-axis direction.

[0039] The first imaging unit adjustment device 61 can be realized by combining, for example, a linear motion stage using a linear ball guide. The first imaging unit adjustment device 61 is also equipped with a motor and an encoder (not shown). The position information of the first imaging unit adjustment device 61 detected by the encoder is input to the control unit C1, which will be described later.

[0040] <2nd Imaging Department> The second imaging unit 70 images the target substrate 2 and the element 10 from the side of the target substrate 2. Furthermore, the second imaging unit 70 can also image the source substrate 1 from the side of the source substrate 1. The second imaging unit 70 is positioned to the side of the stamp head 30 and the substrate stage 50. That is, the second imaging unit 70 is positioned along the X-axis or Y-axis of the stamp head 30 and the substrate stage 50. The information captured by the second imaging unit 70 is input to the control unit C1, which will be described later.

[0041] <Second Imaging Unit Adjustment Device> The second imaging unit adjustment device 71 is a movable stage for adjusting the position of the second imaging unit 70. The second imaging unit adjustment device 71 adjusts the position of the second imaging unit 70 so that the source substrate 1, target substrate 2, stamp 3, and element 10 can be observed from the side by the second imaging unit 70. The second imaging unit adjustment device 71 can move the second imaging unit 70 in the X-axis direction, Y-axis direction, and Z-axis direction.

[0042] The second imaging unit adjustment device 71 can be realized by combining, for example, a linear motion stage using a linear ball guide. The second imaging unit adjustment device 71 is also equipped with a motor and an encoder (not shown). The position information of the second imaging unit adjustment device 71 detected by the encoder is input to the control unit C1, which will be described later.

[0043] <Contact detection unit> The contact detection unit 80 is positioned between the stamp head 30 and the frame 40 to detect contact between the element 10 picked up by the stamp 3 and the target substrate 2. Furthermore, the contact detection unit 80 can also detect contact between the element 10 formed on the source substrate 1 and the stamp 3. The contact detection unit 80 includes, for example, a piezoelectric force sensor, and can detect contact between the element 10 and the target substrate 2 by detecting the pressure applied to the stamp 3. The contact detection unit 80 may have, for example, three piezoelectric force sensors, which can detect the pressure applied to the stamp 3 at at least three points on the stamp 3.

[0044] <Department Head> The control unit C1 controls the operation of the components of the transfer device D1. The control unit C1 is composed of, for example, a microcomputer. The control unit C2 has an arithmetic unit C2 that performs various calculations.

[0045] The control unit C1 can control the position adjustment device, the first imaging unit adjustment device 61, and the second imaging unit adjustment device 71 based on the received position information, etc., to perform the process of transferring the element 10 from the source substrate 1 to the target substrate 2.

[0046] Furthermore, the control unit C1 can receive information such as images captured by the first imaging unit 60 and the second imaging unit 70. For example, based on the image captured by the first imaging unit 60, the control unit C1 can calculate the amount of misalignment between the stamp 3 and the element 10 when picking up the element 10, and the amount of misalignment between the element 10 picked up by the stamp 3 and the target substrate 2. Similarly, based on the image captured by the second imaging unit 70, the control unit C1 can also calculate the amount of misalignment between the stamp 3 and the element 10 when picking up the element 10, and the amount of misalignment between the element 10 picked up by the stamp 3 and the target substrate 2. The calculation of the misalignment amount is performed, for example, by the calculation unit C2 of the control unit C1.

[0047] The control unit C1 controls at least one of the position adjustment devices, namely the stamp head adjustment device 31 and the substrate adjustment device 51, to reduce the calculated positional misalignment. For example, the control unit C1 controls the position adjustment device to bring the stamp 3 and the source substrate 1 closer together. When the contact detection unit 80 detects that the stamp 3 and the element 10 formed on the source substrate 1 have come into contact, the control unit C1 controls the position adjustment device to move the stamp 3 and the source substrate 1 further apart. Furthermore, the control unit C1 controls the position adjustment device to bring the stamp 3 and the target substrate 2 closer together. When the contact detection unit 80 detects that the element 10 picked up by the stamp 3 has come into contact with the target substrate 2, the control unit C1 controls the position adjustment device to move the stamp 3 and the target substrate 2 further apart.

[0048] [Operation] Next, the method of transferring the element 10 by the control unit C1 will be explained in detail. Figure 2 is a flowchart illustrating the method of transferring the element 10 picked up by the stamp 3 to the target substrate 2. Figures 3A to 3G are schematic diagrams illustrating the transfer method.

[0049] First, in S10, the element 10 formed on the source substrate 1 is picked up by the stamp 3. At this time, first, the element 10 formed on the source substrate 1 and the stamp 3 are aligned as shown in Figure 3A. The alignment of the element 10 and the stamp 3 can be performed, for example, by controlling the substrate adjustment device 51 with the control unit C1 to move the substrate stage 50 to a predetermined position in the XY plane. The predetermined position of the substrate stage 50 is, for example, a position where the alignment mark of the element 10 formed on the source substrate 1 coincides with the alignment mark of the stamp 3.

[0050] The first imaging unit 60 images the element 10 and stamp 3 formed on the source substrate 1, and based on the imaged information, the calculation unit C2 of the control unit C1 calculates the amount of misalignment between the element 10 and the stamp 3. Based on the calculated amount of misalignment, the control unit C1 controls the substrate adjustment device 51 to adjust the position of the substrate stage 50. By adjusting the position of the substrate stage 50, the position of the source substrate 1 is adjusted, and the alignment of the element 10 and stamp 3 formed on the source substrate 1 is performed. Information captured by the second imaging unit 70 may also be used for alignment.

[0051] The alignment between element 10 and stamp 3 is performed on the order of nanometers or micrometers.

[0052] When aligning the element 10 with the stamp 3, the stamp head adjustment device 31 may be controlled instead of the substrate adjustment device 51 to move the stamp head 30 in the XY direction, or both the stamp head adjustment device 31 and the substrate adjustment device 51 may be controlled.

[0053] After aligning the element 10 formed on the source substrate 1 with the stamp 3, the source substrate 1 and the stamp 3 are brought relatively closer together, as shown in Figure 3B. In the example in Figure 3B, the control unit C1 controls the substrate adjustment device 51 to raise the substrate stage 50 in the +Z axis direction, thereby bringing the source substrate 1 and the stamp 3 closer together. Alternatively, the stamp head adjustment device 31 may be controlled to lower the stamp head 30 in the -Z direction, or both the stamp head adjustment device 31 and the substrate adjustment device 51 may be controlled to bring the source substrate 1 and the stamp 3 closer together.

[0054] The substrate stage 50 is raised to bring the source substrate 1 and the stamp 3 closer together, causing the element 10 formed on the source substrate 1 to come into contact with the stamp 3. Contact between the element 10 and the stamp 3 can be detected, for example, by the pressure applied to at least three points on the stamp 3, which is detected by the contact detection unit 80. When the contact detection unit 80 detects that the element 10 and the stamp 3 have come into contact, the control unit C1 stops the substrate adjustment device 51 and stops the raising of the substrate stage 50.

[0055] The pressure threshold applied to the stamp 3 for detecting contact between the element 10 and the stamp 3 is set to an appropriate value based on, for example, the physical properties and shape of the element 10 and the stamp 3. For example, when at least three piezoelectric force sensors are used, contact between the element 10 and the stamp 3 can be detected when the value detected by each piezoelectric force sensor exceeds a threshold set to 1 [mN] or more and 10 [N] or less.

[0056] Furthermore, the control unit C1 controls the substrate adjustment device 51 so that, for example, the substrate stage 50 rises at a speed of 1 nm / sec to 1000 μm / sec.

[0057] To prevent the substrate stage 50 from rising excessively, the pressure threshold detected by the contact detection unit 80 may be set low, or the rising speed of the substrate stage 50 may be set to a low speed.

[0058] After the source substrate 1 and stamp 3 come into contact, the source substrate 1 and stamp 3 are separated relative to each other, as shown in Figure 3C. By bringing the element 10 into contact with stamp 3 and then separating the source substrate 1 and stamp 3 relative to each other, the element 10 is picked up by stamp 3 due to the adhesive force of stamp 3.

[0059] In the example shown in Figure 3C, the control unit C1 controls the substrate adjustment device 51 to lower the substrate stage 50 in the -Z axis direction, thereby separating the source substrate 1 and the stamp 3. Alternatively, the stamp head adjustment device 31 may be controlled to raise the stamp head 30 in the +Z direction, or both the stamp head adjustment device 31 and the substrate adjustment device 51 may be controlled to separate the source substrate 1 and the stamp 3. At this time, the adhesive force of the stamp 3 causes the element 10 to peel off the source substrate 1 and be picked up by the stamp 3.

[0060] The control unit C1 controls the substrate adjustment device 51 so that the substrate stage 50 descends at a descent speed of 10 [μm / sec] to 1000 [mm / sec]. The adhesive force of the stamp 3, which is made of viscoelastic material, tends to increase in a certain speed range depending on the peeling speed. Therefore, when the element 10 and the stamp 3 are in contact, the faster the descent speed of the substrate stage 50, the greater the adhesive force of the stamp 3 becomes, and the force that peels the element 10 from the source substrate 1 becomes greater than the force with which the source substrate 1 holds the element 10. Figure 4 is a graph illustrating the adhesive force. As shown in Figure 4, the critical energy release rate between the element 10 and the substrate (source substrate 1) is almost constant regardless of speed, but the critical energy release rate between the element 10 and the stamp 3 increases in proportion to the speed. Therefore, by making the descent speed of the substrate stage 50 faster than the speed Vc shown in Figure 4, the adhesive force acting at the interface between the element 10 and the stamp 3 can be made greater than the force with which the source substrate 1 holds the element 10. Therefore, by controlling the descent speed of the substrate stage 50, the element 10 can be easily picked up onto the stamp 3.

[0061] After picking up the element 10 on the stamp 3, in step S20, the element 10 is aligned with the target substrate 2 as shown in Figure 3D. In step S20, alignment is performed to place the element 10 at a desired position on the target substrate 2. Alignment between the element 10 and the target substrate 2 can be performed by the control unit C1 controlling the position adjustment device based on the image captured by the first imaging unit 60, thereby changing the relative position between the stamp 3 and the target substrate 2. Here, an example of performing alignment by controlling the substrate adjustment device 51 of the position adjustment device will be described.

[0062] Alignment of the element 10 with the target substrate 2 is performed by controlling the substrate adjustment device 51 with the control unit C1 to move the substrate stage 50 to a predetermined position in the XY plane. The predetermined position is the position of the substrate stage 50 such that the desired position on the target substrate 2 and the position of the element 10 picked up by the stamp 3 coincide in the XY plane. The predetermined position can be identified by alignment marks or the like provided on the target substrate 2 and the element 10.

[0063] The first imaging unit 60 images the target substrate 2 and the element 10 picked up by the stamp 3, and based on the imaged information, the calculation unit C2 of the control unit C1 calculates the amount of misalignment between the target substrate 2 and the element 10. Based on the calculated amount of misalignment, the control unit C1 controls the substrate adjustment device 51 to adjust the position of the substrate stage 50. By adjusting the position of the substrate stage 50, the position of the target substrate 2 is adjusted, and alignment between the target substrate 2 and the element 10 is performed. Information captured by the second imaging unit 70 may also be used for alignment.

[0064] In step S20, the target substrate 2 and the element 10 can be aligned to the order of nanometers or micrometers.

[0065] Next, in step S30, as shown in Figure 3E, the control unit C1 controls the position adjustment device to bring the stamp 3 and the target substrate 2 closer together, so that the element 10 picked up by the stamp 3 and the target substrate 2 come into contact. For example, the element 10 picked up by the stamp 3 and the target substrate 2 can be brought into contact by lowering the stamp head 30 in the -Z axis direction using the stamp head adjustment device 31, or by raising the substrate stage 50 in the +Z axis direction using the substrate adjustment device 51. In the example in Figure 3E, the stamp 3 and the target substrate 2 are brought closer together by raising the substrate stage 50 in the +Z axis direction using the substrate adjustment device 51. That is, in the example in Figure 3E, the target substrate 2 is raised in the +Z axis direction so that the element 10 picked up by the stamp 3 and the target substrate 2 come into contact. When the contact detection unit 80 detects that the element 10 picked up by the stamp 3 and the target substrate 2 have come into contact, the control unit C1 stops the substrate adjustment device 51 and stops the raising of the substrate stage 50.

[0066] The pressure threshold applied to the stamp 3 for detecting contact between the element 10 picked up by the stamp 3 and the target substrate 2 is set to an appropriate value based on, for example, the mechanical properties and shape of the target substrate 2, the stamp 3, and the element 10. For example, when at least three piezoelectric force sensors are used, contact between the element 10 picked up by the stamp 3 and the target substrate 2 can be detected when the value detected by each piezoelectric force sensor exceeds a threshold set to 1 [mN] or more and 10 [N] or less.

[0067] In this embodiment, the control unit C1 controls the substrate adjustment device 51 so that, for example, the substrate stage 50 rises at a speed of 1 nm / sec to 1000 μm / sec.

[0068] To prevent the substrate stage 50 from rising excessively, the pressure threshold detected by the contact detection unit 80 may be set low, or the rising speed of the substrate stage 50 may be set to a low speed.

[0069] Even if alignment between the element 10 and the target substrate 2 is performed in step S20, it is difficult to perfectly align the position of the stamp 3 that picked up the element 10 with the target substrate 2 due to the limitations of processing and machine precision. Therefore, as shown in Figure 3E, when the element 10 and the target substrate 2 come into contact, the stamp 3 is tilted relative to the target substrate 2. Due to the relative tilt of the stamp 3 with respect to the target substrate 2, as shown in Figure 3E, distortion occurs in the shape of the viscoelastic stamp 3 when the element 10 and the target substrate 2 come into contact.

[0070] Next, in step S40, with the target substrate 2 and the element 10 in contact, the target substrate 2 and the stamp 3 are moved relative to each other in a direction along the surface of the target substrate 2 to separate them. The direction along the surface of the target substrate 2 is the direction along the arrow in Figure 3F, which is approximately horizontal to the XY plane.

[0071] After the element 10 picked up by the stamp 3 is brought into contact with the target substrate 2, the element 10 is transferred to the target substrate 2 by separating the stamp 3 and the target substrate 2. The element 10 is picked up by the stamp 3 due to adhesive force. The main cause of the adhesive force acting at the interface between the element 10 and the stamp 3 is the van der Waals force. By bringing the element 10 into contact with the target substrate 2 and moving the target substrate 2 and the stamp 3 relative to each other in a direction along the surface of the target substrate 2, the van der Waals bond between the element 10 and the stamp 3 is broken, and the element 10 is transferred from the stamp 3 to the target substrate 2.

[0072] The van der Waals bond between the stamp 3 and the element 10 is more easily broken by applying a shear force along the surface of the target substrate 2 than by applying a tensile force in the direction in which the stamp 3 and the target substrate 2 face each other. Therefore, in step S40, the target substrate 2 and the stamp 3 are moved relative to each other in the direction along the surface of the target substrate 2, thereby separating the target substrate 2 and the stamp 3.

[0073] In step S40, the control unit C1 determines the relative direction of movement between the target substrate 2 and the stamp 3 in a direction along the surface of the target substrate 2, based on the strain information of the stamp 3 when the element 10 and the target substrate 2 are in contact.

[0074] The distortion information of stamp 3 includes information such as the amount of deformation of the shape of stamp 3 and the amount of tilt of stamp 3 relative to the target substrate 2. Specifically, the distortion information of stamp 3 includes distribution information in the XY plane regarding the amount of distortion of stamp 3, i.e., the amount of deformation of stamp 3 in the Z-axis direction. Note that the distortion information of stamp 3 may also be interpreted as information on the relative tilt between stamp 3 and the target substrate 2. In the example in Figure 3E, distortion occurs in the area R1 enclosed by the dashed line of stamp 3. The distortion of stamp 3 occurs because stamp 3 is tilted relative to the target substrate 2.

[0075] The distortion information of stamp 3 is calculated by the control unit C1 based on an image captured by the first imaging unit 60, for example. For example, the distortion information can be calculated by comparing the images taken by the first imaging unit 60 before and after bringing stamp 3 and target substrate 2 closer together in step S30, and calculating the amount of deformation of stamp 3.

[0076] Alternatively, strain information can be calculated by calculating the amount of strain on the stamp 3 based on the pressure applied to the stamp 3 at at least three points on the stamp 3 detected by the contact detection unit 80. For example, if the pressure applied to the stamp 3 detected by the contact detection unit 80 is F, the cross-sectional area of ​​the stamp 3 parallel to the XY plane is A, and the elastic modulus of the stamp is E, then the amount of strain ε of the stamp 3 can be calculated by ε = F / (A × E).

[0077] The control unit C1 determines the relative direction of movement between the target substrate 2 and the stamp 3 such that the portion of the stamp 3 with greater strain moves away from the target substrate 2 before the portion of the stamp 3 with less strain. Specifically, in Figure 3E, region R1 of the stamp 3 is the portion with greater strain compared to the rest of the stamp 3.

[0078] The distortion or tilt of stamp 3 causes a difference in the balance of forces acting at the interface between stamp 3 and element 10, including van der Waals forces. Region R1 of stamp 3 is more distorted than other parts of stamp 3, and therefore experiences stronger forces at the interface. By moving the target substrate 2 relatively away from region R1 of stamp 3, the target substrate 2 and stamp 3 can be separated to release the forces acting at the interface.

[0079] As shown in Figures 3F to 3G, the control unit C1 controls the substrate adjustment device 51 to move the substrate stage 50 in the direction of the arrow, thereby separating the target substrate 2 and the stamp 3. At this time, the force acting at the interface between the target substrate 2 and the element 10 becomes greater than the force acting at the interface between the stamp 3 and the element 10, and the element 10 is transferred to the target substrate 2.

[0080] Generally, the adhesive force acting at the interface between the stamp 3 and the element 10 tends to increase with the peeling speed in certain speed ranges. As shown in Figure 4, the critical energy release rate between the source substrate 1 or target substrate 2 and the element 10 is almost constant. On the other hand, the critical energy release rate force between the element 10 and the stamp 3 tends to decrease as the speed decreases. Therefore, if the relative separation speed between the target substrate 2 and the stamp 3 is set to, for example, 1 [μm / sec] or more and 100 [mm / sec] or less, the element 10 becomes easier to peel off from the stamp 3, and the transfer of the element 10 to the target substrate 2 can be made easier.

[0081] As described above, by controlling the relative movement direction between the target substrate 2 and the stamp 3, the element 10 picked up by the stamp 3 can be transferred to the target substrate 2 more easily. Furthermore, by controlling the separation speed between the target substrate 2 and the stamp 3, the transfer between the target substrate 2 and the element 10 can be easily performed with high production efficiency.

[0082] [effect] According to the above-described embodiment, the following effects can be achieved.

[0083] By moving the target substrate 2 and the stamp 3 relative to each other in a direction along the surface of the target substrate 2, the adhesive force acting at the interface between the stamp 3 and the element 10 becomes smaller than the force acting at the interface between the target substrate 2 and the element 10. Therefore, the transfer of the element 10 from the stamp 3 to the target substrate 2 can be performed more easily with high production efficiency. In addition, the transfer apparatus D1 can be made with a simple configuration.

[0084] (Embodiment 2) Embodiment 2 will be described with reference to Figures 5 to 6D. In Embodiment 2, components identical or equivalent to those in Embodiment 1 will be denoted by the same reference numerals. Also, in Embodiment 2, descriptions that overlap with those in Embodiment 1 will be omitted.

[0085] Figure 5 is a flowchart illustrating the transfer method of element 10 according to Embodiment 2. Figures 6A to 6D are schematic diagrams illustrating the transfer method according to Embodiment 2. As shown in Figure 5, Embodiment 2 differs from Embodiment 1 in that the transfer method includes a step of tilting the stamp relative to the target substrate. The configuration of the transfer apparatus D1 is the same as in Embodiment 1, so its description is omitted.

[0086] In Embodiment 1, the relative direction of movement between the target substrate 2 and the stamp 3 was determined after the element 10 picked up by the stamp 3 came into contact with the target substrate 2. In this embodiment, the stamp 3 is tilted relative to the target substrate 2 in advance before the element 10 picked up by the stamp 3 comes into contact with the target substrate 2. By tilting the stamp 3 relative to the target substrate 2 in advance, the relative direction of movement between the target substrate 2 and the stamp 3 can be determined in advance. Steps S110 to S120 shown in Figure 5 are the same as steps S10 to S20 described in Embodiment 1, so their explanation is omitted.

[0087] In step S120, the element 10 picked up by the stamp 3 is aligned with the target substrate 2, and then in step S130, the stamp 3 is tilted relative to the target substrate 2. In this embodiment, the control unit C1 controls the stamp head adjustment device 31 of the position adjustment device to tilt the stamp head 30, thereby tilting the stamp 3 relative to the target substrate 2. Alternatively, the stamp 3 may be tilted relative to the target substrate 2 by controlling the substrate adjustment device 51, or by controlling both the stamp head adjustment device 31 and the substrate adjustment device 51.

[0088] The relative tilt of the stamp 3 with respect to the target substrate 2 can be determined based on information captured by the first imaging unit 60. Alternatively, it may be tilted in a predetermined direction regardless of the imaging information. The tilt angle of the stamp 3 with respect to the target substrate 2 can be set to an appropriate value depending on the physical properties or shape of the element 10 and the target substrate 2. By setting the tilt angle of the stamp 3 with respect to the target substrate 2 to, for example, 10 degrees or less with respect to the surface of the target substrate 2, it is possible to suppress the stamp 3 from contacting the target substrate 2 and contaminating the target substrate 2, and to suppress the element 10 from being damaged by excessive force. More preferably, the tilt angle of the stamp 3 with respect to the target substrate 2 should be 5 degrees or less with respect to the surface of the target substrate 2. As shown in Figure 6A, the control unit C1 controls the stamp head adjustment device 31 to tilt the stamp head 30 at a predetermined angle in at least one of the X-axis direction and the Y-axis direction.

[0089] With the stamp head 30 tilted, in step S140, as shown in Figure 6B, the control unit C1 controls the substrate adjustment device 51 to raise the substrate stage 50 in the +Z axis direction. Because the stamp head 30 is tilted, the stamp 3 is tilted relative to the target substrate 2, and the element 10 picked up by the stamp 3 makes contact with the target substrate 2.

[0090] Next, in step S150, the target substrate 2 and the stamp 3 are moved apart relative to each other, as shown in Figures 6C to 6D. In this embodiment, the target substrate 2 and the stamp 3 are moved apart relative to each other by controlling the substrate adjustment device 51 to move the substrate stage 50. The direction in which the substrate stage 50 is moved can be predetermined by the control unit C1 based on the inclination of the stamp head 30 in step S130, that is, the relative inclination of the stamp 3 with respect to the target substrate 2.

[0091] Furthermore, by appropriately combining any embodiment or modification from the various embodiments or modifications described above, the effects of each can be achieved. In addition, combinations of embodiments with each other, combinations of examples with each other, and combinations of embodiments with examples are possible, as well as combinations of features from different embodiments or examples.

[0092] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations or modifications will be obvious to those skilled in the art. Such variations or modifications should be understood to be included therein, as long as they do not fall outside the scope of this disclosure as defined by the appended claims. Furthermore, changes in the combination or order of elements in the embodiments can be realized without departing from the scope and spirit of this disclosure.

[0093] (Note) Based on the above description of embodiments, the following technologies are disclosed.

[0094] (Technology 1) A method for transferring an element to the surface of a target substrate using an adhesive stamp, comprising the steps of: aligning the element picked up by the stamp with the target substrate using the adhesive force of the stamp; bringing the target substrate and the stamp relatively close together to bring the target substrate and the element into contact; and, while the target substrate and the element are in contact, moving the target substrate and the stamp relatively in a direction along the surface of the target substrate to separate them.

[0095] This configuration provides a method for transferring elements that can improve production efficiency with a simple setup.

[0096] (Technology 2) The transfer method according to Art 1, wherein, while the target substrate and the element picked up by the stamp are in contact, the step of moving the target substrate and the stamp relative to each other in a direction along the surface of the target substrate to separate them includes determining the relative direction of movement between the target substrate and the stamp based on the distortion information of the stamp while the element picked up by the stamp and the target substrate are in contact.

[0097] This configuration allows the adhesive force between the stamp and the element to be smaller than the bonding force between the element and the target substrate, thus enabling easy transfer of the element to the target substrate.

[0098] (Technology 3) The transfer method according to Technology 1 or 2, wherein the distortion information of the stamp is calculated based on the pressure applied to the stamp at at least three points on the stamp.

[0099] This configuration allows for more accurate calculation of stamp distortion information.

[0100] (Technology 4) The transfer method according to Technology 1 or 2, wherein the distortion information of the stamp is calculated based on the amount of deformation of the outer edge of the stamp.

[0101] This configuration allows for more accurate calculation of stamp distortion information.

[0102] (Technology 5) A transfer method according to any one of the techniques 1 to 4, wherein the stamp distortion information includes the amount of stamp distortion, and determining the relative direction of movement between the target substrate and the stamp based on the stamp distortion information includes determining the direction of movement such that the part of the stamp with greater distortion leaves the target substrate before the part of the stamp with less distortion.

[0103] This configuration allows the adhesive force between the stamp and the element to be smaller than the bonding force between the element and the target substrate, thus enabling easy transfer of the element to the target substrate.

[0104] (Technology 6) A transfer method according to any one of the techniques 1 to 4, comprising the step of tilting the stamp relative to the target substrate before bringing the target substrate and the stamp closer together to bring the target substrate and the element into contact.

[0105] This configuration allows for the predetermined method of moving the target substrate and stamp apart, thereby improving production efficiency.

[0106] (Technology 7) A transfer method according to any one of the technologies 1 to 6, comprising the step of moving a source substrate on which elements are formed relatively closer to and further away from the stamp, before aligning the elements picked up by the stamp with the target substrate by the adhesive force of the stamp, thereby picking up the elements formed on the source substrate with the stamp by the adhesive force of the stamp.

[0107] This configuration allows for a continuous process from element pickup to transfer to the target substrate.

[0108] (Technology 8) A transfer apparatus for transferring an element to the surface of a target substrate using an adhesive stamp, comprising: a target substrate mounting stand for placing the target substrate; a stamp head having a stamp that picks up the element by adhesive force; a frame that holds the stamp head so that the stamp faces the target substrate mounting stand; a position adjustment device for bringing the target substrate and the stamp closer together and further apart; a first imaging unit for imaging the target substrate and the element from above the target substrate; a control unit that controls the position adjustment device and the first imaging unit; and a contact detection unit for detecting contact between the target substrate and the element, wherein the control unit controls the image captured by the first imaging unit. A transfer device that, based on an image, detects the amount of misalignment between the element and the target substrate, detects distortion information of the stamp when the target substrate and the element picked up by the stamp come into contact, controls a position adjustment device to move the target substrate and the stamp relatively to reduce the amount of misalignment and bring them closer together, and controls the position adjustment device to move the target substrate and the stamp relatively while the target substrate and the element are in contact, when the contact detection unit detects contact between the target substrate and the element picked up by the stamp, moves the target substrate and the stamp apart in a direction along the surface of the target substrate.

[0109] This configuration makes it possible to provide an element transfer apparatus that can improve production efficiency with a simple configuration.

[0110] (Technology 9) The transfer apparatus according to Technology 8, wherein the contact detection unit comprises at least three pressure sensors for measuring the pressure applied to the stamp, and the control unit calculates stamp distortion information based on the detected values ​​of the at least three pressure sensors.

[0111] This configuration allows for more accurate calculation of stamp distortion information.

[0112] (Technology 10) The transfer apparatus according to Technical Reference 8 or 9, wherein the control unit calculates the amount of deformation of the outer edge of the stamp based on the image captured by the first imaging unit, and calculates distortion information of the stamp based on the amount of deformation of the outer edge of the stamp.

[0113] This configuration allows for more accurate calculation of stamp distortion information.

[0114] (Technology 11) A transfer apparatus according to any one of the technologies 8 to 10, further comprising a second imaging unit that images the target substrate and the element from the side of the target substrate, wherein the control unit calculates the amount of deformation of the outer edge of the stamp based on the image captured by the second imaging unit, and calculates distortion information of the stamp based on the amount of deformation of the outer edge of the stamp.

[0115] This configuration allows for more accurate calculation of stamp distortion information.

[0116] (Technology 12) A transfer apparatus according to any one of technologies 8 to 11, wherein the control unit determines the relative direction of movement between the target substrate and the stamp based on the distortion information of the stamp.

[0117] This configuration allows the adhesive force between the stamp and the element to be smaller than the bonding force between the element and the target substrate, thus enabling easy transfer of the element to the target substrate.

[0118] (Technology 13) A transfer apparatus according to any one of technologies 8 to 11, wherein the control unit controls a positioning device to tilt the target substrate relative to the stamp before the target substrate and the elements picked up by the stamp come into contact.

[0119] This configuration allows for a continuous process from element pickup to transfer to the target substrate.

[0120] (Technology 14) A transfer apparatus according to any one of technologies 8 to 13, further comprising a source substrate mounting stand for mounting a source substrate on which an element is formed, wherein the source substrate mounting stand holds the source substrate so that the surface of the source substrate faces the same direction as the surface of the target substrate, a position adjustment device moves the source substrate relative to a stamp, a contact detection unit detects contact between the element formed on the source substrate and the stamp, and a control unit controls the position adjustment device to move the source substrate closer to and further away from the stamp so that the element formed on the source substrate is picked up by the adhesive force of the stamp.

[0121] This configuration allows for a continuous process from element pickup to transfer to the target substrate. [Industrial applicability]

[0122] This disclosure is useful in fields such as microLED displays, high-speed optical communication represented by silicon photonics, and high-precision sensing using laser light. [Explanation of Symbols]

[0123] 1 Source board 2 Target substrate 3 stamps 10 elements 10a Covering layer 11. Source board mounting stand 21 Target substrate mounting stand 30 stamp heads 31 Stamp head adjustment device 40 frames 50 PCB stage 51 Board adjustment device 60 First Imaging Unit 61 First imaging unit adjustment device 70 Second Imaging Unit 71. Second imaging unit adjustment device 80 Contact detection unit

Claims

1. A method for transferring an element to the surface of a target substrate using an adhesive stamp, The steps include aligning the element picked up by the stamp and the target substrate using the adhesive force of the stamp, The steps include bringing the target substrate and the stamp relatively close together to bring the target substrate and the element into contact, The steps include: moving the target substrate and the stamp relative to each other in a direction along the surface of the target substrate while the target substrate and the element are in contact, including, Transfer method.

2. The step of moving the target substrate and the stamp relative to each other in a direction along the surface of the target substrate while the target substrate and the element picked up by the stamp are in contact includes determining the relative direction of movement between the target substrate and the stamp based on the distortion information of the stamp while the element picked up by the stamp and the target substrate are in contact. The transfer method according to claim 1.

3. The distortion information of the stamp is calculated based on the pressure applied to the stamp at at least three points. The transfer method according to claim 2.

4. The distortion information of the stamp is calculated based on the amount of deformation of the outer edge of the stamp. The transfer method according to claim 2.

5. The distortion information of the stamp includes the amount of distortion of the stamp. Determining the relative direction of movement between the target substrate and the stamp based on the distortion information of the stamp includes determining the direction of movement such that the portion of the stamp with greater distortion moves away from the target substrate before the portion of the stamp with less distortion. The transfer method according to claim 2.

6. The step of tilting the stamp relative to the target substrate before bringing the target substrate and the stamp closer together and bringing the target substrate and the element into contact, The transfer method according to claim 1.

7. Prior to the step of aligning the element picked up by the stamp and the target substrate using the adhesive force of the stamp, the step of moving the source substrate on which the element is formed closer to and further away from the stamp, thereby picking up the element formed on the source substrate onto the stamp using the adhesive force of the stamp, Equipped with, The transfer method according to any one of claims 1 to 6.

8. A transfer apparatus for transferring an element to the surface of a target substrate using an adhesive stamp, A target substrate mounting stand on which the target substrate is placed, A stamp head having a stamp that picks up the element by adhesive force, A frame that holds the stamp head such that the stamp faces the target substrate mounting base, A position adjustment device that moves the target substrate and the stamp closer together and further apart, A first imaging unit that images the target substrate and the element from above the target substrate, The position adjustment device and the first imaging unit are controlled by a control unit, A contact detection unit for detecting contact between the target substrate and the element, Equipped with, The control unit, Based on the image captured by the first imaging unit, the amount of misalignment between the element and the target substrate is detected, and the distortion information of the stamp when the target substrate and the element picked up by the stamp come into contact is detected. The position adjustment device is controlled to move the target substrate and the stamp relative to each other in order to reduce the amount of misalignment, bringing the target substrate and the stamp closer together. The position adjustment device is controlled so that when the contact detection unit detects contact between the target substrate and the element picked up by the stamp, the target substrate and the stamp are moved relative to each other while the target substrate and the element are in contact, thereby separating the target substrate and the stamp in a direction along the surface of the target substrate. Transfer device.

9. The contact detection unit includes at least three pressure sensors for measuring the pressure applied to the stamp. The control unit calculates the distortion information of the stamp based on the detected values ​​of the at least three pressure sensors. The transfer apparatus according to claim 8.

10. The control unit calculates the amount of deformation of the outer edge of the stamp based on the image captured by the first imaging unit, and calculates distortion information of the stamp based on the amount of deformation of the outer edge of the stamp. The transfer apparatus according to claim 8.

11. The system further comprises a second imaging unit that images the target substrate and the element from the side of the target substrate, The control unit calculates the amount of deformation of the outer edge of the stamp based on the image captured by the second imaging unit, and calculates distortion information of the stamp based on the amount of deformation of the outer edge of the stamp. The transfer apparatus according to claim 8.

12. The control unit determines the relative direction of movement between the target substrate and the stamp based on the distortion information of the stamp. The transfer apparatus according to claim 8.

13. The control unit controls the position adjustment device to tilt the target substrate relative to the stamp before the target substrate and the element picked up by the stamp come into contact. The transfer apparatus according to claim 8.

14. The system further comprises a source board mounting stand for mounting the source board on which the element is formed, The source substrate mounting stand holds the source substrate so that the surface of the source substrate faces the same direction as the surface of the target substrate. The position adjustment device moves the source substrate relative to the stamp, The contact detection unit detects contact between the element formed on the source substrate and the stamp, The control unit, The position adjustment device is controlled to move the source substrate closer to and further away from the stamp, thereby picking up the element formed on the source substrate onto the stamp using the adhesive force of the stamp. A transfer apparatus according to any one of claims 8 to 13.

Images