Adhesion force measurement system, method and electronic device

Abstract

Embodiments of the present application provide an adhesion force measurement system, method and electronic device, the system comprising: a component transmission module, a component bearing module, a digital light processing (DLP) projection device, a charge coupled device (CCD) camera and a data processing and control module; wherein: the component transmission module is configured to transmit a target component to the component bearing module; the data processing and control module is connected to the DLP projection device and the CCD camera respectively; the DLP projection device is configured to project a phase shift fringe pattern onto the surface of the target component; the CCD camera is configured to obtain a deformation fringe pattern corresponding to multiple deformations of the target component during separation of the component transmission module and the target component; and the data processing and control module is configured to: determine a maximum out-of-plane displacement of the target component according to the deformation fringe pattern; and determine the adhesion force between the target component and the component transmission module according to the maximum out-of-plane displacement. The method of embodiments of the present application achieves accurate and effective measurement of the adhesion force.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to an adhesion force measurement system, method and electronic device. BACKGROUND

[0002] In the process of panel production and transmission, there is adhesion force between the friction column pad and the panel in addition to the friction force. When the panel is placed at a designated position after the transmission is completed, the adhesion force hinders the separation of the panel from the friction column pad, thereby causing the deformation and vibration of the panel during the placement process. Therefore, the adhesion force needs to be measured to guide and complete the design of the friction column pad.

[0003] In the related art, a force sensor-equipped measurement device such as a force gauge is used for measurement. However, when measuring the adhesion force between a large-size panel and a friction column pad, the adhesion force is on the order of 10 N, and thus a small-range and high-precision force sensor needs to be used for adhesion force measurement, resulting in high adhesion force measurement cost. SUMMARY

[0004] To solve the problems in the prior art, the embodiments of the present application provide an adhesion force measurement system, method and electronic device.

[0005] Specifically, the embodiments of the present application provide the following technical solutions:

[0006] In a first aspect, the embodiments of the present application provide an adhesion force measurement system, comprising:

[0007] a component transmission module, a component bearing module, a digital light processing (DLP) projection device, a charge-coupled device (CCD) camera and a data processing and control module; wherein:

[0008] The component transmission module is configured to transmit a target component to the component bearing module;

[0009] The data processing and control module is connected to the DLP projection device and the CCD camera respectively;

[0010] The DLP projection device is configured to project a phase shift fringe pattern onto the surface of the target component;

[0011] The CCD camera is configured to acquire a deformation fringe pattern corresponding to the multiple deformations of the target component during the separation of the component transmission module and the target component;

[0012] The data processing and control module is configured to determine the maximum out-of-plane displacement of the target component according to the deformation fringe pattern, and determine the adhesion force between the target component and the component transmission module according to the maximum out-of-plane displacement. Further, the component transmission module comprises:

[0013] A frictional column pad and a mechanical hand; the frictional column pad is fixed on the mechanical hand.

[0014] Further, the data processing and control module comprises:

[0015] A DLP control module, a CCD control module and an image processing module connected in sequence;

[0016] The DLP control module is configured to transmit the generated multiple phase shift fringe patterns to the DLP projection device; and control the DLP projection device to project the phase shift fringe patterns onto the surface of the target component.

[0017] The CCD control module is configured to collect deformation fringe patterns corresponding to multiple deformations of the target component during the process of separating the component transmission module from the target component.

[0018] The image processing module is configured to determine the maximum out-of-plane displacement of the target component according to the multiple sets of deformation fringe patterns collected by the CCD control module; and determine the adhesion between the target component and the component transmission module according to the maximum out-of-plane displacement of the target component.

[0019] In the second aspect, the embodiments of the present application further provide a method for measuring adhesion, comprising:

[0020] In the case that the target component and the component transmission module are in contact, multiple phase shift fringe patterns are projected onto the surface of the target component.

[0021] The maximum out-of-plane displacement of the target component is determined according to the deformation fringe patterns corresponding to multiple deformations of the target component during the process of separating the component transmission module from the target component.

[0022] The adhesion between the target component and the component transmission module is determined according to the maximum out-of-plane displacement of the target component.

[0023] Further, the determination of the maximum out-of-plane displacement of the target component according to the deformation fringe patterns corresponding to multiple deformations of the target component during the process of separating the component transmission module from the target component comprises:

[0024] The phase distribution corresponding to each deformation of the target component is determined according to the deformation fringe pattern corresponding to each deformation of the target component.

[0025] The maximum out-of-plane displacement of the target component is determined according to the phase distribution corresponding to each deformation of the target component.

[0026] Further, the determination of the phase distribution corresponding to each deformation of the target component according to the deformation fringe pattern corresponding to each deformation of the target component comprises:

[0027] The phase distribution of the target component is determined by using the following formula:

[0028]

[0029] wherein, represents the phase distribution of the target component; represents the gray value corresponding to the deformed fringe pattern.

[0030] Further, the maximum out-of-plane displacement of the target component is determined according to the phase distribution corresponding to each deformation of the target component, comprising:

[0031] The out-of-plane displacement corresponding to each deformation of the target component is determined according to the phase distribution corresponding to each deformation of the target component.

[0032] The out-of-plane displacement corresponding to each deformation of the target component is arranged in descending order, and the maximum out-of-plane displacement of the target component is determined.

[0033] Further, the out-of-plane displacement corresponding to each deformation of the target component is determined according to the phase distribution corresponding to each deformation of the target component, comprising:

[0034] The out-of-plane displacement corresponding to each deformation of the target component is determined by using the following formula:

[0035]

[0036] wherein, h represents the out-of-plane displacement of the target component, D represents the distance between the projection device and the optical center of the camera, L represents the distance from the camera to the reference surface of the target component, and p represents the pitch of the projection fringe, represents the phase difference between the target component before deformation and after deformation.

[0037] Further, the adhesion between the target component and the component transmission module is determined according to the maximum out-of-plane displacement of the target component, comprising:

[0038] The strain of the target component is determined according to the maximum out-of-plane displacement of the target component.

[0039] The stress of the target component is determined according to the strain of the target component and the elastic matrix corresponding to the target component.

[0040] The volume force of the target component is determined according to the stress of the target component and a preset differential operator.

[0041] The adhesion between the target component and the transmission module is determined according to the volume force of the target component.

[0042] In a third aspect, an electronic device is provided, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the adhesion force measurement method according to the second aspect when executing the program.

[0043] In a fourth aspect, a non-transitory computer-readable storage medium is provided, which stores a computer program, and the computer program is executable on a processor to implement the adhesion force measurement method according to the second aspect.

[0044] In a fifth aspect, a computer program product is provided, which includes a computer program, and the computer program is executable on a processor to implement the adhesion force measurement method according to the second aspect.

[0045] The adhesion force measurement system, method and electronic device provided by the embodiments of the present application can accurately determine the out-of-plane displacement of the target component after deformation based on the change of the gray value of each position point in the deformation fringe pattern corresponding to the deformation of the target component through the DLP projection device projecting the phase shift fringe pattern to the surface of the target component and the CCD device acquiring the deformation fringe pattern corresponding to the deformation of the target component, and can further determine the maximum out-of-plane displacement of the target component before the separation of the component transmission module and the target component based on the plurality of out-of-plane displacements corresponding to the plurality of deformations of the target component during the separation of the component transmission module and the target component, and effectively determine the adhesion force between the target component and the component transmission module according to the analysis of the maximum out-of-plane displacement of the target component and the physical model of the target component, thereby improving the measurement accuracy and effectiveness of the adhesion force between the target component and the component transmission module and overcoming the problem of high cost in the prior art by using a force meter or other measurement device with a force sensor. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0047] Figure 1 is a flowchart of the adhesion force measurement system provided by the embodiments of the present application;

[0048] Figure 2 is a structural schematic diagram of the component transmission module provided by the embodiments of the present application;

[0049] Figure 3 is a structural schematic diagram of the component bearing module provided by the embodiments of the present application;

[0050] Figure 4 is a flowchart of the adhesion force measurement method provided by the embodiment of the present application;

[0051] Figure 5 is another flowchart of the adhesion force measurement method provided by the embodiment of the present application;

[0052] Figure 6 is a schematic diagram of the adhesion force measurement device provided by the embodiment of the present application;

[0053] Figure 7 is a structural schematic diagram of the electronic device provided by the embodiment of the present application. DETAILED DESCRIPTION

[0054] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below with reference to the drawings in the present application. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0055] The method of the embodiment of the present application can be applied to the semiconductor manufacturing scene to realize accurate and effective determination of the adhesion force.

[0056] In the related art, measurement is performed by a measurement device with a force sensor such as a force gauge, but when measuring the adhesion force between a large-size panel and a friction column pad, the adhesion force is on the order of 10 N, and thus a small-range and high-precision force sensor is required to measure the adhesion force, resulting in high adhesion force measurement cost.

[0057] The adhesion force measurement system and method of the embodiment of the present application, the DLP projection device projects a phase shift fringe pattern to the surface of the target component, the CCD device acquires the deformation fringe pattern corresponding to the deformation of the target component, and the data processing and control module can accurately determine the out-of-plane displacement of the target component after deformation based on the change of the gray value of each position point in the deformation fringe pattern corresponding to the deformation of the target component; and then the maximum out-of-plane displacement of the target component before the separation of the component transmission module and the target component can be determined based on the plurality of out-of-plane displacements corresponding to the multiple deformations of the target component during the separation of the component transmission module and the target component, and the adhesion force of the target component and the component transmission module can be effectively determined according to the analysis of the maximum out-of-plane displacement of the target component and the physical model of the target component, thereby improving the measurement accuracy and effectiveness of the adhesion force of the target component and the component transmission module and overcoming the problem of high cost of measurement by a measurement device with a force sensor such as a force gauge in the prior art.

[0058] The present application will be described below in conjunction with Figures 1-7The technical solutions of the present application are described in detail with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0059] Figure 1 is a schematic diagram of the adhesion force measurement system provided by the embodiment of the present application. As shown in Figure 1 , the adhesion force measurement system provided by the embodiment of the present application comprises:

[0060] a component transmission module 101, a component bearing module 102, a digital light processing (DLP) projection device 103, a charge coupled device (CCD) camera 104, and a data processing and control module 105.

[0061] The component transmission module 101 is used to transmit the target component to the component bearing module 102.

[0062] The data processing and control module 105 is connected to the DLP projection device 103 and the CCD camera 104, respectively.

[0063] The DLP projection device 103 is used to project a phase shift fringe pattern onto the surface of the target component.

[0064] The CCD camera 104 is used to acquire a deformation fringe pattern corresponding to the multiple deformations of the target component during the separation of the component transmission module and the target component.

[0065] The data processing and control module 105 is used to determine the maximum out-of-plane displacement of the target component according to the deformation fringe pattern, and determine the adhesion force between the target component and the component transmission module according to the maximum out-of-plane displacement.

[0066] Specifically, in order to accurately measure the adhesion force between the panel and the friction column pad contact surface, thereby accurately guiding and completing the design of the friction column pad, and eliminating the deformation and vibration of the panel during the placement process, the present application provides a large-size panel adhesion force measurement system, which is suitable for measuring the adhesion force between large-size thin plates such as wafers, panels, and display screens and friction column pads, and relates to the field of semiconductors and integrated circuits. As shown in Figure 1 , the adhesion force measurement system in the embodiment of the present application comprises a component transmission module 101, a component bearing module 102, a digital light processing (DLP) projection device 103, a charge coupled device (CCD) camera 104, and a data processing and control module 105.

[0067] The target component in the embodiment of the present application can be a panel, a wafer, or a display screen in the semiconductor manufacturing process. The component transmission module 101 is used to transmit the target component to the component bearing module 102. Figure 2As shown, the frictional column pad and the movable robot are included, and a plurality of frictional column pads are installed on the movable robot. Figure 3 As shown, the component carrying module 102 includes two carriages for carrying the panel. Alternatively, after the robot picks up the panel, the panel is moved by the robot through the frictional force generated between the panel and the frictional column pad by the self weight, so as to realize the panel transmission; when the panel is transmitted to the designated position, the robot places the panel on the component carrying module, the robot moves downward to separate the frictional column pad from the panel, and the panel placement is completed. At this time, the adhesion force is generated between the contact surface of the panel and the frictional column pad, which hinders the separation of the two. Alternatively, the frictional transmission is a common wafer transmission mode, which is transmitted through the frictional force generated by the self weight of the wafer, and has the advantages of simple structure and small wafer deformation; the structure in the frictional transmission robot which directly contacts the wafer and provides the frictional force is called the frictional column pad; in addition to the frictional force, there is also an adhesion force between the frictional column pad and the wafer. When the wafer is placed at the designated position after the transmission is completed, the adhesion force hinders the separation of the wafer and the frictional column pad, thereby causing the deformation and vibration of the wafer during the placement process. Therefore, it is necessary to measure and study the adhesion force, so as to guide the design of the frictional column pad.

[0068] Alternatively, when the panel is placed on the component carrying module 102, the digital light processing (DLP) projection device 103 in the embodiment of the present application is used to project the phase shift fringe pattern to the surface of the panel; wherein the phase shift fringe pattern can be a plurality of sinusoidal fringes projected by the DLP projection device 103, and the adjacent two fringe patterns differ by a certain fixed phase shift; alternatively, the fixed phase shift can be π / 4. Alternatively, the DLP projection device refers to the projection device which is equipped with a DMD (digital micromirror device) chip, and can realize digital optical processing to convert continuous light into gray scale, and then project the image through the lens; alternatively, the DLP projection device 103 can project four fringe patterns with a phase shift of π / 4 to the surface of the target component at a time interval T; alternatively, the DLP projection device 103 is installed in a direction perpendicular to the surface of the panel, and the phase shift fringe image projected by the DLP projection device 103 completely covers the surface of the panel to be measured.

[0069] Optionally, the CCD camera 104 is used to obtain a plurality of deformation fringe patterns corresponding to the deformation of the target component during the process of separating the component transfer module from the target component; optionally, when the target component deforms, the projection fringe on the target component will also deform, so that the CCD camera 104 can also obtain a deformation fringe pattern corresponding to the deformation of the target component; optionally, the CCD camera 104 refers to a camera equipped with a charge coupled device (CCD) image sensor, which can convert optical images into digital signals and store or transmit them; optionally, the CCD camera 104 is installed in a direction perpendicular to the surface of the panel, and the image captured by the CCD camera 104 contains the entire panel to be tested. Optionally, the panel can be deformed by controlling the mechanical hand to move slowly vertically downward, so that the fringe on the surface of the panel deforms, and thus the CCD camera 104 can capture the deformation fringe pattern of the panel surface; optionally, the downward force can be continuously applied to the mechanical hand for a period of time, and the deformation fringe pattern of the panel surface is captured at intervals of the same preset time period until the component transfer module and the component carrier module are separated. For example, the DLP projection device 103 projects N fringe patterns with a phase shift of π / 4 onto the surface of the target component at a time interval T, and during the process of slowly moving the mechanical hand vertically downward to start the separation process of the friction column pad and the panel, the mechanical hand moves downward to meet T time, stops for T*N time, continues to move for T time, and so on, until complete separation. Optionally, during each T*N period of time, the CCD camera 104 can capture N deformation fringe patterns caused by the deformation of the target component at a time interval T.

[0070] Optionally, after the CCD camera 104 collects the deformation fringe corresponding to the multiple deformations of the target component during the process of separating the component transfer module from the target component, the data processing and control module can determine the maximum out-of-plane displacement of the target component according to the deformation fringe corresponding to the multiple deformations of the target component during the process of separating the component transfer module from the target component; and determine the adhesion between the target component and the component transfer module according to the maximum out-of-plane displacement of the target component. Optionally, the data processing and control module 105 can be connected to the DLP projection device 103 and the CCD camera 104 respectively; and optionally, after the data processing and control module 105 obtains the deformation fringe corresponding to the deformation of the target component during the process of separating the component transfer module 101 from the target component, the data processing and control module 105 can determine the out-of-plane displacement of the deformed target component according to the change of the gray value of each position point in the deformation fringe. Optionally, during the process of separating the component transfer module 101 from the target component, the data processing and control module 105 can determine the out-of-plane displacement corresponding to each deformation of the target component according to the change of the gray value of each position point in the deformation fringe corresponding to each deformation of the target component; and then determine the maximum out-of-plane displacement of the target component before the component transfer module separates from the target component during the process of separating the component transfer module from the target component from the multiple out-of-plane displacements corresponding to the multiple deformations of the target component, and further effectively determine the adhesion between the target component and the component transfer module according to the analysis of the maximum out-of-plane displacement of the target component and the physical model of the target component. Optionally, the data processing and control module in the embodiment of the present application comprises (1) a DLP control module: used for setting the image parameters of DLP projection and controlling the DLP projection process; (2) a CCD control module: used for setting the frequency, parameters and the like of the CCD image acquisition and controlling the CCD image acquisition process, and storing the images acquired by the CCD; (3) an image processing module: used for processing the images acquired by the CCD to obtain the out-of-plane displacement of the panel; and (4) an adhesion determination module: used for inversely calculating the adhesion between the wafer and the friction column pad according to the out-of-plane displacement of the panel. The adhesion measurement system in the embodiment of the present application can effectively overcome the problem of high cost of measurement by using the force meter with a force sensor in the prior art, and can also solve the problem that the size of the large-area thin plate is large, the thickness is small, the friction column pad is generally 1-2 cm in size, and the installation of the force sensor is limited by the size of both, and if the force sensor is used for measurement, a special test platform needs to be built, and the test is difficult; finally, the problem that the panel process technology has a great influence on the adhesion during the test process of the special test platform, a plurality of panel styles need to be prepared, the cost is high, the test period is long, the panel and the friction column pad cannot be tested at any time, and the research and development period is lengthened is also solved.

[0071] The adhesion force measurement system of the above embodiment, the DLP projection device projects phase shift fringe patterns to the surface of the target component, the CCD device acquires the deformation fringe pattern corresponding to the deformation of the target component, and the data processing and control module can accurately determine the out-of-plane displacement of the target component after deformation based on the change of the gray value of each position point in the deformation fringe pattern corresponding to the deformation of the target component; Furthermore, based on the multiple out-of-plane displacements corresponding to the multiple deformations of the target component during the separation process of the component transmission module and the target component, the maximum out-of-plane displacement of the target component before the separation of the component transmission module and the target component can be determined, and the adhesion force between the target component and the component transmission module can be effectively determined according to the analysis of the maximum out-of-plane displacement of the target component and the physical model of the target component, thereby improving the measurement accuracy and effectiveness of the adhesion force between the target component and the component transmission module, and overcoming the problem of high cost of measurement by using force meters and other measurement devices with force sensors in the prior art.

[0072] Figure 4 is a flowchart of the adhesion force measurement method provided by the embodiment of the present application. As shown in Figure 4 , the adhesion force measurement system provided by the embodiment includes:

[0073] Step 401, in the case that the target component and the component transmission module are in contact, project multiple phase shift fringe patterns to the surface of the target component;

[0074] Specifically, in the case that the component transmission module transmits the target component to the component carrier module, that is, the panel (or wafer, display screen) is placed on the bracket by the mechanical hand, and the frictional sticking column on the panel and the mechanical hand is in contact, the DLP projection device projects multiple phase shift fringe patterns to the surface of the target component; Alternatively, the DLP projection device can project four fringe patterns with a phase shift of π / 4 to the surface of the target component at a time interval T.

[0075] Step 402, determine the maximum out-of-plane displacement of the target component according to the deformation fringe pattern corresponding to the multiple deformations of the target component during the separation process of the component transmission module and the target component;

[0076] Specifically, after the DLP projection device projects a plurality of phase-shifted fringe patterns to the surface of the target component, the mechanical hand can be controlled to move slowly vertically downward, so that the panel deforms, resulting in deformation of the fringe on the surface of the panel, and then the CCD camera can capture the deformed fringe pattern on the surface of the panel. Optionally, a downward force can be continuously applied to the mechanical hand for a period of time, and the deformed fringe pattern on the surface of the panel can be captured at intervals of the same preset time period until the component conveying module and the component bearing module are separated. For example, the DLP projection device projects N fringe patterns with a phase shift of π / 4 to the surface of the target component at a time interval T. During the slow vertical downward movement of the mechanical hand, the separation process of the friction column pad and the panel is started, wherein the downward movement of the mechanical hand satisfies T time of movement, T*N time of stop, T time of continuous movement, and so on, until complete separation. Optionally, during each T*N time period of stop, the CCD camera can capture N deformed fringe patterns caused by the deformation of the target component at a time interval T.

[0077] Optionally, during the separation of the component conveying module and the target component, after the deformed fringe pattern corresponding to the deformation of the target component is obtained, the off-surface displacement of the deformed target component can be determined according to the change of the gray value of each position point in the deformed fringe pattern. Optionally, during the separation of the component conveying module and the target component, after the data processing and control module determines the off-surface displacement corresponding to each deformation of the target component according to the change of the gray value of each position point in the deformed fringe pattern corresponding to each deformation of the target component, the maximum off-surface displacement of the target component before the separation of the component conveying module and the target component can be determined from a plurality of off-surface displacements corresponding to a plurality of deformations of the target component.

[0078] Step 403, determining the adhesion between the target component and the component conveying module according to the maximum off-surface displacement of the target component.

[0079] Specifically, after the maximum off-surface displacement of the target component before the separation of the component conveying module and the target component is determined during the separation of the component conveying module and the target component, the adhesion between the target component and the component conveying module can be effectively determined according to the analysis of the maximum off-surface displacement of the target component and the physical model of the target component.

[0080] The method of the above embodiment can accurately determine the out-of-plane displacement of the target component after deformation based on the change of the gray value of each position point in the deformation fringe pattern corresponding to the deformation of the target component by projecting the phase shift fringe pattern onto the surface of the target component and obtaining the deformation fringe pattern corresponding to the deformation of the target component, and then can determine the maximum out-of-plane displacement of the target component before the target component is separated from the component transmission module based on the plurality of out-of-plane displacements corresponding to the plurality of deformations of the target component during the separation of the target component from the component transmission module, and effectively determine the adhesion between the target component and the component transmission module according to the analysis of the maximum out-of-plane displacement of the target component and the physical model of the target component, thereby overcoming the problem of high cost of measurement by using a force meter or other measurement equipment with a force sensor in the prior art, and improving the measurement accuracy and effectiveness of the adhesion between the target component and the component transmission module.

[0081] In an embodiment, the maximum out-of-plane displacement of the target component is determined according to the deformation fringe pattern corresponding to the plurality of deformations of the target component during the separation of the target component from the component transmission module, comprising:

[0082] determining the phase distribution corresponding to each deformation of the target component according to the deformation fringe pattern corresponding to each deformation of the target component;

[0083] determining the maximum out-of-plane displacement of the target component according to the phase distribution corresponding to each deformation of the target component.

[0084] Specifically, in the process of separating the transmission module from the target component, in the case that the DLP device projects four fringe patterns with a phase shift of π / 4 onto the surface of the target component, the phase distribution corresponding to the deformation of the target component can be determined based on the following formula:

[0085]

[0086] wherein, represents the phase distribution of each position point of the target component after deformation; represents the gray value of the four phase shift fringe patterns projected at a time interval T on the target component surface corresponding to the deformation fringe pattern after the deformation of the target component, and the above method realizes accurate determination of the phase distribution of the target component after deformation based on the change of the gray value of each position point in the deformation fringe pattern corresponding to the deformation of the target component.

[0087] Optionally, after determining the phase distribution corresponding to each deformation of the target component according to the deformation fringe pattern corresponding to each deformation of the target component, the out-of-plane displacement corresponding to each deformation of the target component can be determined by using the following formula:

[0088]

[0089] Wherein, h represents the out-of-plane displacement of the target component after deformation, D represents the distance between the projection device and the optical center of the camera, L represents the distance from the camera to the reference surface of the target component, and p represents the pitch of the projected fringe, The phase difference between the target component before deformation and the target component after deformation is represented, and the accurate determination of the out-of-plane displacement of the target component after deformation is realized based on the phase difference between the target component before deformation and the target component after deformation.

[0090] Optionally, after the plurality of out-of-plane displacements of the target component corresponding to a plurality of deformations of the target component during the process of separating the component transmission module from the target component are accurately determined based on the change of the gray value of each position point in the deformation fringe image corresponding to the deformation of the target component, the plurality of out-of-plane displacements of the target component corresponding to each deformation of the target component are arranged in descending order, so as to accurately determine the maximum out-of-plane displacement of the target component, and the moment of the maximum out-of-plane displacement of the target component is determined as the moment of the maximum adhesion between the target component and the component transmission module. Based on the above method, the maximum out-of-plane displacement of the target component is accurately and effectively determined by arranging the plurality of out-of-plane displacements of the target component corresponding to each deformation of the target component in descending order during the process of separating the component transmission module from the target component, and then the adhesion between the target component and the component transmission module is accurately determined based on the maximum out-of-plane displacement of the target component and the physical model of the target component.

[0091] In an embodiment, the adhesion between the target component and the component transmission module is determined according to the maximum out-of-plane displacement of the target component, and the adhesion between the target component and the component transmission module is determined according to the maximum out-of-plane displacement of the target component.

[0092] The strain of the target component is determined according to the maximum out-of-plane displacement of the target component.

[0093] The stress of the target component is determined according to the strain of the target component and the elastic matrix corresponding to the target component.

[0094] The volume force of the target component is determined according to the stress of the target component and a preset differential operator.

[0095] The adhesion between the target component and the transmission module is determined according to the volume force of the target component.

[0096] Specifically, when the maximum out-of-plane displacement of the target component during the process of separating the component transmission module from the target component is determined, the adhesion between the target component and the component transmission module can be accurately determined based on the maximum out-of-plane displacement of the target component and the physical model of the target component.

[0097] Optionally, the strain of the target component can be first determined through the maximum out-of-plane displacement of the target component, for example, the strain of the target component is determined through the following formula: ε=A Tu; wherein, ε represents the strain of the target component; A represents the preset differential operator; and u represents the maximum out-of-plane displacement of the target component;

[0098] Then, the stress of the target component is determined according to the strain of the target component and the elastic matrix corresponding to the target component; for example, the stress of the target component is determined by the following formula: σ = Dε; wherein, σ represents the stress of the target component; D represents the elastic matrix corresponding to the target component; and ε represents the strain of the target component.

[0099] Next, the volume force of the target component is determined according to the stress of the target component and the preset differential operator; for example, the volume force of the target component is determined by the following formula: Aσ + F = 0, wherein, A represents the preset differential operator; σ represents the stress of the target component; and F represents the volume force of the target component.

[0100] Finally, the adhesion between the target component and the transmission module is determined according to the volume force of the target component; optionally, the adhesion between the target component and the transmission module can be obtained by subtracting the gravity of the target component from the volume force of the target component.

[0101] The method of the above embodiment determines the volume force of the target component through the maximum out-of-plane displacement of the target component and the physical model of the target component; and then the adhesion between the target component and the transmission module can be obtained by subtracting the gravity of the target component from the volume force of the target component, so that the adhesion between the target component and the transmission module can be accurately determined, and the accurate and effective determination of the adhesion between the target component and the transmission module is realized. The adhesion measurement method in the embodiment of the present application can measure the adhesion between a large-size panel and a friction column pad, has the characteristics of high precision, low cost and strong universality, and can realize timely detection of different panel and friction column pad combinations.

[0102] For example, as shown in FIG. 1, the adhesion measurement method in the embodiment of the present application builds a large-size panel adhesion measurement system through a CCD, a DLP and the like, without the need for a high-precision force sensor, thereby reducing the cost of the test equipment. Figure 5 In addition, the method of the embodiment of the present application can obtain the adhesion between the panel and the friction column pad, and can identify the adhesion difference between multiple and different position friction column pads and the panel, thereby having higher precision; without the need for modification of the panel transmission equipment to be tested, without the need for the manufacture of fixtures and workpieces, thereby reducing the test cost and shortening the test period, and achieving the testing of large-size panels and friction column pads as they come; the method has strong universality, and is suitable for panels, wafers, display screens and the like of various sizes, and friction column pads arranged in any form.

[0103] (1) DLP, CCD initialization

[0104] Install DLP projection device and CCD camera in designated position, adjust the position and focal length of the two, and adjust the background light intensity to make the projection image clear and the collected image clear and complete. At this time, the state of the panel transmission module is that the panel is placed on the bracket, but the mechanical hand does not leave, and at this time the panel is still in contact with the friction column pad.

[0105] (2) DLP projection stripe

[0106] A set of digital stripes are generated by the DLP control module in the data processing and control module, including a digital stripe pattern with sinusoidal light intensity and a certain pitch and N images of the phase-shifted stripe pattern. Through the DLP control module, the projection interval of the phase-shifted stripe pattern is set as T, and the projector is controlled to project the digital stripe to the surface of the panel to be tested according to the interval.

[0107] (3) Start mechanical hand movement

[0108] Start the mechanical hand to move vertically downward at a slow speed to start the separation process of the friction column pad and the panel. The mechanical hand movement satisfies the movement T time, the stop T*N time, and the continuous movement T time, and the cycle is repeated until complete separation.

[0109] (4) CCD starts to collect

[0110] At the same time when the mechanical hand starts to move, the CCD control module in the data processing and control module controls the CCD to collect the projected stripe image on the surface of the panel with a sampling interval T.

[0111] (5) Mechanical hand movement stops

[0112] After the panel and the friction column pad are completely separated, the mechanical hand stops moving.

[0113] (6) CCD stops collecting

[0114] At the same time when the mechanical hand stops moving, the CCD control module controls the CCD to stop collecting.

[0115] (7) Image processing

[0116] The image processing module in the data processing and control module processes the M groups (each group contains N stripe images) of images collected by the CCD, and the panel surface displacement field at this moment can be obtained, and a total of M panel surface displacement fields (out-of-plane displacement) are obtained.

[0117] Optionally, the sinusoidal stripe is projected onto the panel surface to be measured, and the stripe light field (gray value) is modulated by the panel surface height to form a deformed stripe. The phase difference of the deformed stripe has a relationship with the panel surface height:

[0118]

[0119] where D is the distance between the projection device and the optical center of the camera, L is the distance between the camera and the reference plane, which is the surface of the panel at the initialization stage when the robot is not moving, and p is the pitch of the sinusoidal fringe. is the phase difference of the deformed fringe.

[0120] Reference plane phase of the panel without deformation It can also be obtained by the above-mentioned phase shift method. Then the phase difference

[0121]

[0122] In summary, the surface height distribution (out-of-plane displacement) h of the M panels can be obtained. M (x, y).

[0123] (8) Simulation system construction

[0124] The simulation model is a discretized grid model of the physical model based on the finite element method principle, and contains physical information such as mass and stiffness corresponding to the physical model. By applying boundary conditions such as displacement, force, gravity field, etc. to the simulation model, and solving the basic equations (balance equation, geometric equation, constitutive equation), the physical quantities such as displacement, force, stress, and strain in the simulation model can be obtained.

[0125] A panel adhesion force simulation model is built, which includes: panel, panel holder, friction column pad, robot. The panel and the holder, the friction column pad are in contact, and the friction column pad and the robot are actually connected (gluing, interference fit, etc.).

[0126] (9) Displacement field identification

[0127] By comparing the surface height distribution h of the above-mentioned M panels M (x, y), the height distribution with the maximum displacement is obtained, which is recorded as the panel deformation distribution when the adhesion force is maximum, and is output to the simulation system.

[0128] (10) Adhesion force calculation

[0129] The simulation system receives the maximum deformation distribution of the panel mentioned above, inputs it into the simulation model as a displacement boundary condition, and inversely calculates the force that the panel generates when the displacement is generated, which is the adhesion force between the panel and the friction column pad.

[0130] Given the displacement boundary condition u, the strain ε is obtained, and then the stress σ and the body force F are obtained. For the panel discrete model, the body force of any element node is known, so the adhesion force at the contact position between the panel and the friction column pad can be obtained.

[0131] The adhesion between the panel and the friction column pad obtained by the method is not a resultant force, but can identify the adhesion between the friction column pad and the panel at multiple different positions, with higher precision.

[0132] In the embodiment of the present application, the full-field out-of-plane displacement of the large-size panel is measured by a non-contact method, and the maximum displacement field of the out-of-plane displacement of the large-size panel is identified as the panel deformation distribution when the adhesion is maximum; and then the maximum deformation distribution of the panel is input into a simulation system, and the adhesion between the panel and the friction column pad is obtained by the simulation system, and the difference in adhesion between the panel and the friction column pad at multiple different positions can be identified.

[0133] The adhesion force measuring device provided by the present application is described below, and the adhesion force measuring device described below can be referred to in correspondence with the adhesion force measuring method described above.

[0134] Figure 6 is a structural schematic diagram of the adhesion force measuring device provided by the present application. The adhesion force measuring device provided in the embodiment comprises:

[0135] The projection module 710 is configured to project a plurality of phase-shifted fringe patterns onto the surface of the target component in the case that the target component and the component conveying module are in a contact state.

[0136] The first determination module 720 is configured to determine the maximum out-of-plane displacement of the target component according to the deformation fringe patterns corresponding to the multiple deformations of the target component during the process that the component conveying module is separated from the target component.

[0137] The second determination module 730 is configured to determine the adhesion between the target component and the component conveying module according to the maximum out-of-plane displacement of the target component.

[0138] Optionally, the first determination module 720 is specifically configured to determine the phase distribution corresponding to each deformation of the target component according to the deformation fringe patterns corresponding to each deformation of the target component.

[0139] The maximum out-of-plane displacement of the target component is determined according to the phase distribution corresponding to each deformation of the target component.

[0140] Optionally, the first determination module 720 is specifically configured to determine the phase distribution of the target component by using the following formula:

[0141]

[0142] wherein, represents the phase distribution of the target component; represents the gray value corresponding to the phase-shifted fringe pattern.

[0143] Optionally, the first determining module 720 is specifically used for determining the out-of-plane displacement of the target component corresponding to each deformation of the target component according to the phase distribution corresponding to each deformation of the target component.

[0144] Optionally, the first determining module 720 is specifically used for determining the out-of-plane displacement of the target component corresponding to each deformation of the target component according to the phase distribution corresponding to each deformation of the target component.

[0145] Optionally, the first determining module 720 is specifically used for determining the out-of-plane displacement of the target component corresponding to each deformation of the target component according to the phase distribution corresponding to each deformation of the target component.

[0146] Optionally, the first determining module 720 is specifically used for determining the out-of-plane displacement of the target component corresponding to each deformation of the target component according to the phase distribution corresponding to each deformation of the target component.

[0147] Optionally, the first determining module 720 is specifically used for determining the out-of-plane displacement of the target component corresponding to each deformation of the target component according to the phase distribution corresponding to each deformation of the target component.

[0148]

[0149] Wherein, h represents the out-of-plane displacement of the target component, D represents the distance between the projection device and the optical center of the camera, L represents the distance from the camera to the reference surface of the target component, p represents the pitch of the projection stripe, represents the phase difference between the target component before deformation and after deformation.

[0150] Optionally, the second determining module 730 is specifically used for determining the strain of the target component according to the maximum out-of-plane displacement of the target component.

[0151] According to the strain of the target component and the elastic matrix corresponding to the target component, the stress of the target component is determined.

[0152] According to the stress of the target component and the preset differential operator, the volume force of the target component is determined.

[0153] According to the volume force of the target component, the adhesion force between the target component and the transmission module is determined.

[0154] The device of the embodiment of the application is used for executing the method in any one of the foregoing method embodiments, and has similar implementation principles and technical effects, which will not be described herein again.

[0155] Figure 7An example of a schematic diagram of a physical structure of an electronic device is provided, which can include a processor 810, a communications interface 820, a memory 830, and a communications bus 840, wherein the processor 810, the communications interface 820, and the memory 830 can communicate with each other through the communications bus 840. The processor 810 can invoke a logical instruction in the memory 830 to execute an adhesion force measurement method, which includes: projecting a plurality of phase-shifted fringe patterns to a target component surface in a case where the target component and a component transfer module are in a contact state; determining a maximum out-of-plane displacement of the target component according to a plurality of deformation fringe patterns corresponding to a plurality of deformations of the target component in a process in which the component transfer module and the target component are separated; and determining an adhesion force between the target component and the component transfer module according to the maximum out-of-plane displacement of the target component.

[0156] In addition, the logical instruction in the memory 830 described above can be implemented in the form of a software functional unit and sold or used as an independent product, and can be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various media that can store program codes.

[0157] On the other hand, the present application also provides a computer program product, which includes a computer program stored on a non-transitory computer-readable storage medium, and the computer program includes program instructions, when the program instructions are executed by a computer, the computer can execute the adhesion force measurement method provided by the above-mentioned methods, which includes: projecting a plurality of phase-shifted fringe patterns to a target component surface in a case where the target component and a component transfer module are in a contact state; determining a maximum out-of-plane displacement of the target component according to a plurality of deformation fringe patterns corresponding to a plurality of deformations of the target component in a process in which the component transfer module and the target component are separated; and determining an adhesion force between the target component and the component transfer module according to the maximum out-of-plane displacement of the target component.

[0158] In yet another aspect, the present application also provides a non-transitory computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements the above-mentioned provided adhesion measurement method, which comprises: projecting a plurality of phase-shifted fringe patterns to the surface of the target component in the case that the target component is in contact with the component transfer module; determining the maximum out-of-plane displacement of the target component according to the deformation fringe patterns corresponding to the multiple deformations of the target component in the process that the component transfer module is separated from the target component; and determining the adhesion between the target component and the component transfer module according to the maximum out-of-plane displacement of the target component.

[0159] The device embodiments described above are merely illustrative, wherein the units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, i.e., can be located in one place, or can be distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the embodiment scheme according to actual needs. Those skilled in the art can understand and implement without creative labor.

[0160] From the above description of the embodiments, those skilled in the art can clearly understand that the embodiments can be realized by means of software plus necessary universal hardware platforms, and of course can also be realized by hardware. Based on such understanding, the above technical solutions, essentially or in other words, the part that contributes to the prior art, can be embodied in the form of a software product, which can be stored in a computer readable storage medium, such as a ROM / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute the methods described in each embodiment or some parts of the embodiments.

[0161] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to some technical features; and these modifications or replacements do not make the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An adhesion force measurement system characterized by, include: Component transmission module, component carrier module, digital light processing (DLP) projection equipment, charge-coupled device (CCD) camera, and data processing and control module; among which: The component transfer module is used to transfer the target component to the component carrying module; The data processing and control module is connected to the DLP projection device and the CCD camera, respectively. The DLP projection device is used to project a phase-shifted fringe pattern onto the surface of the target component. The CCD camera is used to acquire deformation stripe patterns corresponding to the multiple deformations of the target component during the separation of the component transmission module from the target component. The data processing and control module includes: The DLP control module, CCD control module, image processing module, and adhesion determination module are connected in sequence. The DLP control module is used to transmit the generated multiple phase-shift fringe patterns to the DLP projection device; and to control the DLP projection device to project the phase-shift fringe patterns onto the surface of the target component. The CCD control module is used to collect deformation stripe patterns corresponding to the multiple deformations of the target component during the process of the component transmission module separating from the target component. The image processing module is used to determine the maximum off-surface displacement of the target component based on multiple sets of deformation stripe patterns acquired by the CCD control module. The adhesion force determination module is used to determine the adhesion force between the target component and the component transfer module based on the maximum off-surface displacement of the target component; the determination of the adhesion force between the target component and the component transfer module based on the maximum off-surface displacement of the target component includes: The strain of the target component is determined by the maximum out-of-plane displacement of the target component, and the strain of the target component is determined by the following formula: ε = A T u; wherein, ε represents the strain of the target component; A represents a preset differential operator; and u represents the maximum out-of-plane displacement of the target component. Based on the strain of the target component and the elastic matrix corresponding to the target component, the stress of the target component is determined by the following formula: σ=Dε; where σ represents the stress of the target component; D represents the elastic matrix corresponding to the target component; and ε represents the strain of the target component. Based on the stress of the target component and the preset differential operator, the volume force of the target component is determined; the volume force of the target component is determined by the following formula: Aσ + F = 0, where A represents the preset differential operator; σ represents the stress of the target component; and F represents the volume force of the target component. Subtracting the weight of the target component from the volume force of the target component yields the adhesive force between the target component and the transmission module.

2. The adhesion measurement system of claim 1, wherein The component transmission module includes: Friction pads and a robotic arm; the friction pads are fixed to the robotic arm.

3. A method of measuring adhesion force, characterized by, The adhesion force measurement system as described in claim 1 or 2 includes: When the target component and the component transfer module are in contact, multiple phase-shifted fringe patterns are projected onto the surface of the target component; Based on the deformation stripe pattern corresponding to the multiple deformations of the target component during the separation process between the component transfer module and the target component, the maximum off-plane displacement of the target component is determined. The adhesion force between the target component and the component transfer module is determined based on the maximum off-surface displacement of the target component.

4. The adhesion force measurement method according to claim 3, wherein The step of determining the maximum out-of-plane displacement of the target component based on the deformation fringe pattern corresponding to the multiple deformations of the target component during the separation process of the component transfer module and the target component includes: According to the deformation fringe corresponding to each deformation of the target component, a phase distribution corresponding to each deformation of the target component is determined; According to the phase distribution corresponding to each deformation of the target component, a maximum out-of-plane displacement of the target component is determined.

5. The adhesion force measurement method according to claim 4, wherein The method according to the phase distribution corresponding to each deformation of the target component, the phase distribution corresponding to each deformation of the target component comprises: The phase distribution of the target component is determined by using the following formula: ； wherein, represents a phase distribution of the target component; represents a gray value corresponding to the deformed fringe pattern.

6. The adhesion force measurement method according to claim 5, wherein The method according to the phase distribution corresponding to each deformation of the target component, the maximum out-of-plane displacement of the target component comprises: According to the phase distribution corresponding to each deformation of the target component, an out-of-plane displacement corresponding to each deformation of the target component is determined; The out-of-plane displacement corresponding to each deformation of the target component is arranged in descending order to determine the maximum out-of-plane displacement of the target component.

7. The adhesion force measurement method according to claim 6, wherein The method according to the phase distribution corresponding to each deformation of the target component, the out-of-plane displacement corresponding to each deformation of the target component comprises: The out-of-plane displacement corresponding to each deformation of the target component is determined by using the following formula: ； wherein h represents the out-of-plane displacement of the target part, D represents the distance between the projection device and the optical center of the camera, and L represents the distance from the camera to the reference surface of the target part, represents the pitch of the projected fringe, represents the phase difference between the target part before deformation and after deformation.

8. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The processor executes the program to realize the adhesion measurement method according to any one of claims 3 to 7.

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