Spin-coated chamber structure for stabilizing the chamber flow field and improving chamber cleanliness.

Abstract

This invention provides a spin-coated chamber structure for stabilizing the chamber's flow field and improving its cleanliness. [Solution] The spin coating chamber structure comprises a synchronous cover module 6, a pressure adjustment module 7, and a spin stage module 8 arranged from top to bottom and having a concentric structure. The spin stage module and the synchronous cover module rotate synchronously during spin coating. Before spin coating, an air pump is connected to the gas flow path of the pressure adjustment module to remove foreign matter from the substrate surface in the spin coating chamber by airflow, thereby improving the cleanliness of the spin coating chamber. During the spin coating process, supersaturated gas is introduced from the intake port of the synchronous cover module, and the introduced supersaturated gas passes through a cylindrical chamber and is supplied to the spin coating chamber from the exhaust port, thereby improving the atmospheric environment in the spin coating chamber and improving the uniformity of evaporation and film thickness.

Description

Technical Field

[0001] The present invention belongs to the technical field of spin coaters and relates to a spin coat chamber structure for improving the cleanliness of a chamber and stabilizing the flow field of the chamber.

Background Art

[0002] The film formation technology by spin coating method is an important technology widely used in the manufacture of thin films. This technology has the advantages that it can efficiently and quickly coat a thin film on the surface of a substrate, the operation is simple, and the cost is low. Its principle is to drop a liquid material on the surface of a rotating substrate and rotate the substrate at a high speed, so that the liquid is diffused along the surface of the substrate by centrifugal force, and finally a thin film is formed. Since the film thickness and uniformity of the thin film are closely related to factors such as rotation speed, rotation time, chamber environment, and viscosity of the liquid, the film thickness and uniformity of the thin film can be controlled according to requirements. The spin coating method is widely applied in the fields of microelectronics and optoelectronics. In particular, it is widely applied in the coating of photoresist in integrated circuits, the manufacture of light absorption layers in solar cells, and the manufacture of antireflection films in optical lenses. In addition, the spin coating method is also applied in many fields such as nanothin films, sensors, and liquid crystal displays. The spin coating method can efficiently manufacture thin film materials with specific functions and has become an essential basic technology for improving the quality, accuracy, and performance of modern electronic devices. Therefore, the film formation technology by spin coating method occupies an important position in modern science and technology and industrial production.

[0003] However, conventional spin coating methods suffer from non-uniform film thickness in practical applications, which is a significant factor affecting subsequent processes such as photoetching and the quality of the final product. In the spin coating process, film thickness reduction occurs in two ways: fluidity, where the liquid gradually diffuses from the center to the periphery of the substrate due to centrifugal force, ultimately resulting in a thinner film; and evaporation, where the solvent rapidly evaporates during the deposition process, concentrating the solution and gradually thinning the film. Film thickness uniformity and evaporation uniformity are closely related, and the evaporation process is determined by the atmosphere, temperature, humidity, and solvent evaporation rate within the chamber. Evaporation and fluidity work together to affect film thickness uniformity and the final film quality. In addition, for special applications, stringent requirements for chamber cleanliness may be imposed. For example, in the process of manufacturing an anti-reflective film by spin-coating a silica sol gel onto a KDP crystal surface, the presence of contaminants or fine particles on the crystal surface can impair the uniformity and adhesion of the silica sol gel, leading to instability in the quality of the thin film, and potentially causing defects such as delamination, bubbles, or cracks.

[0004] Therefore, designing a high-performance spin coating chamber that can stably maintain the flow field within the chamber while meeting cleanliness requirements has become an urgent and critical issue in the field of film deposition using the spin coating method. In order to improve film thickness uniformity, ensure the cleanliness of the chamber environment, optimize the process, and enhance product quality, the chamber structure must not only stably maintain the pressure and airflow velocity within the chamber during spin coating, but also effectively remove contaminants such as dust from the chamber. [Overview of the project] [Problems that the invention aims to solve]

[0005] The present invention has been made in view of the above-mentioned technical problems, and provides a high-performance spin coating chamber that can effectively improve the stability of the flow field inside the chamber and effectively remove contaminants such as dust inside the chamber. [Means for solving the problem]

[0006] To achieve the above objectives, the present invention employs the following technical means. One aspect of the present invention provides a spin-coat chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber. The spin-coat chamber structure comprises a synchronous cover module, a pressure adjustment module, and a spin stage module, the synchronous cover module, the pressure adjustment module, and the spin stage module are arranged in order from top to bottom and have a concentric structure, a flow path for the coating liquid to flow out is left between the spin stage module and the pressure adjustment module, and the spin stage module and the synchronous cover module rotate synchronously during spin coating. A circular substrate mounting platform is provided on the upper surface of the spin stage module. The area of ​​the circular substrate mounting platform is larger than the area of ​​the target substrate. The area of ​​the spin stage module other than the circular substrate mounting platform is the stage periphery. The circular substrate mounting platform and the stage periphery are continuously formed via a slope. The circular substrate mounting platform is higher than the stage periphery, and a vacuum hole is provided in the center of the circular substrate mounting platform. The target substrate is attracted to the circular substrate mounting platform 2 by vacuum. The pressure adjustment module has an annular structure, and its inner wall surface is continuously formed from a flat surface to a slope from top to bottom. The flat surface corresponds to the synchronous cover module, and the slope is used to prevent the coating liquid from splashing during spin coating. After the coating liquid is splashed onto the slope, it flows out of the channel along the slope. A rectangular parallelepiped projection is provided on the outer surface of the pressure adjustment module, and a pressure adjustment inlet is provided on the outer surface of the rectangular parallelepiped projection. The center height of the pressure adjustment inlet is the same as the top surface height of the target substrate. A gas channel is formed in the pressure adjustment module, and the gas channel consists of a first part with a constant rectangular cross-section and a second part with a linearly increasing rectangular cross-section. These two parts form a single gas channel from the outside to the inside. The synchronous cover module is configured to move vertically up and down. An intake port is provided on the top of the synchronous cover module, and gas is introduced through the intake port and supplied to the synchronous cover module. The inside of the synchronous cover module is hollow, and annularly spaced exhaust ports are provided on the bottom surface of the synchronous cover module. The exhaust ports communicate with the hollow, and gas is introduced through the intake port, passes through the hollow, and is blown out above the spin stage module through the exhaust ports.

[0007] Furthermore, the vacuum hole connects the axial hole of the spin coater's hollow shaft to the vacuum pump.

[0008] Furthermore, the upper surface of the circular substrate mounting platform is provided with four symmetrically arranged positioning holes.

[0009] Furthermore, four connecting holes are provided on the outer circumference of the upper surface of the pressure adjustment module, and the pressure adjustment module is fixed to the frame of the spin coater with bolts and nuts.

[0010] Furthermore, the pressure adjustment inlet of the pressure adjustment module is not located directly below the connecting hole of the pressure adjustment module.

[0011] Furthermore, the cavity in the synchronous cover module is a cylindrical cavity.

[0012] Furthermore, a trapezoidal spoiler is provided on the lower surface of the synchronization cover module, and the angle between the spoilers can be adjusted within the range of 60° to 90°. On the lower surface of the synchronization cover module, no exhaust holes are provided at the location of the spoilers, nor are exhaust holes provided on the trapezoidal spoiler. [Effects of the Invention]

[0013] This invention offers the following advantages compared to the prior art. 1. According to the present invention, before performing spin coating, an air pump is connected to the gas flow path of the pressure adjustment module, and the airflow is made to flow at high speed, thereby removing dust and other foreign matter that may contaminate the thin film in the spin coating chamber from the substrate surface and ensuring cleanliness in the chamber. 2. During the spin coating process, supersaturated gas is introduced from the intake port of the synchronous cover module. The supersaturated gas passes through a cylindrical chamber and is uniformly supplied to the spin coating chamber from the exhaust port. This improves the atmospheric environment within the spin coating chamber, enhances the uniformity of evaporation, and consequently improves the uniformity of the film thickness. 3. During the spin coating process, the synchronous cover module and the spin stage module rotate synchronously. This allows the trapezoidal spoiler of the synchronous cover module to improve the airflow velocity within the spin coating chamber, resulting in a more uniform gas flow velocity within the spin coating chamber and ensuring uniformity of the film thickness. [Brief explanation of the drawing]

[0014] [Figure 1] This is a schematic diagram (assembly diagram) showing the overall configuration of the present invention. [Figure 2(a)] This is a schematic diagram showing a cross-section of the overall structure of the present invention. [Figure 2(b)] Figure 2(a) is a magnified view of a portion of the flow path, where dl is the size of the flow path inlet. [Figure 3] This is a cross-sectional view of the gas flow path in a pressure regulation module. [Figure 4(a)]This is a front view showing the arrangement of the exhaust ports and the configuration of the spoiler on the synchronous cover module. [Figure 4(b)] This is a side view showing the arrangement of the exhaust ports on the synchronous cover module and the configuration of the spoiler. [Modes for carrying out the invention]

[0015] Embodiments of the present invention will be further described below with reference to the drawings and technical means.

[0016] The spin-coat chamber structure, which enhances the stability of the flow field within the chamber and removes contaminants such as dust from the chamber, comprises a synchronous cover module 6, a pressure adjustment module 7, and a spin stage module 8. The synchronous cover module 6, the pressure adjustment module 7, and the spin stage module 8 must be concentric, and they must be arranged in order from top to bottom. Furthermore, the outer wall of the synchronous cover module 6 and the inner wall of the pressure adjustment module 7 must not come into contact with each other. The diameter of the inner wall of the pressure adjustment module 7 must be larger than the diameter of the outer wall of the spin stage module 8. As a result, a gap, i.e., a flow path for the coating liquid to flow out, is formed between the pressure adjustment module 7 and the spin stage module 8. The minimum size of the flow path is d1, and the size of d1 is determined by the properties of the coating liquid. The synchronous cover module 6 and the spin stage module 8 rotate synchronously during the spin coating process, while the pressure adjustment module 7 does not rotate during the spin coating process.

[0017] On the upper surface of the spin stage module 8, a high-precision circular substrate mounting table 2 is provided. The circular substrate mounting table 2 is located at the center of the spin stage module 8, and its area is smaller than the area of the upper surface of the spin stage module 8. In the area other than the circular substrate mounting table 2, high precision is not required, that is, it does not have to be highly precise. Further, the height of the area of the high-precision circular substrate mounting table 2 is slightly higher than that of the spin stage module, and the height difference transitions through a slope structure.

[0018] In the area of the high-precision circular substrate mounting table 2, four positioning holes 1 for the spin coat target substrates are provided symmetrically with respect to the center position. When spin coating is performed, the spin coat target substrates are fixed to the high-precision circular substrate mounting table 2 by positioning pins.

[0019] Furthermore, a vacuum hole 9 is provided at the center of the high-precision circular substrate mounting table 2. The vacuum hole 9 is used to adsorb the spin coat target substrate by vacuum suction. The spin coat target substrate is fixed by vacuum adsorption or by positioning pins, and when the rotation speed is high, both fixing methods may be used in combination. On the outer periphery of the upper surface of the air pressure adjustment module 7, four mounting holes 12 for the air pressure adjustment modules are provided. The air pressure adjustment module 7 is connected and fixed to the frame of the entire spin coater by bolts.

[0020] Furthermore, the inner wall of the air pressure adjustment module 7 is continuously formed from a plane to a slope from top to bottom. The plane area corresponds to the synchronization cover module 6, and a flow path for the coating liquid to flow out is formed between the slope area and the spin stage module 8. The slope structure has the function of preventing the scattering of the coating liquid during the spin coating process. When the coating liquid is splashed onto the wall surface of the slope area, the coating liquid may drip along the wall surface.

[0021] The outer surface of the pressure adjustment module 7 is provided with a rectangular parallelepiped-shaped projection, and a pressure adjustment inlet 3 is opened in the rectangular parallelepiped-shaped projection. During spin coating, the upper surface of the target substrate is positioned within the inlet range of the pressure adjustment inlet 3. In other words, the pressure-adjusted gas must pass over the surface of the target substrate, thereby allowing the gas supplied or discharged from the pressure adjustment inlet 3 to remove dust and contaminating foreign matter from inside the spin coating chamber. The gas supply to the pressure adjustment inlet 3 is performed before the start of spin coating. Furthermore, the pressure adjustment module 7 is provided with a gas flow path, which consists of a first portion with a constant rectangular cross-section and a second portion with a linearly increasing rectangular cross-section.

[0022] Furthermore, the gas flow path of the pressure adjustment module 7 is not located directly below the mounting hole 12 of the pressure adjustment module.

[0023] A flow path for the coating liquid is provided between the spin stage module 8 and the pressure adjustment module 7, and the minimum size of the flow path is d1. A synchronization cover intake hole 11 is provided above the synchronization cover module 6, and gas for controlling the atmospheric environment inside the chamber during spin coating is blown in through the synchronization cover intake hole 11.

[0024] Furthermore, the interior of the synchronization cover module 6 is a cylindrical cavity 10, and the synchronization cover intake hole 11 and the cylindrical cavity 10 are in communication.

[0025] Furthermore, the lower surface of the synchronization cover module 6 is provided with synchronization cover exhaust holes 4, which are uniformly arranged in an annular shape. The synchronization cover intake holes 11, the cylindrical cavity 10, and the synchronization cover exhaust holes 4 are in communication with each other. During the spin coating process, gas is introduced from the synchronization cover intake holes 11, fills the inside of the cylindrical cavity 10, and is finally supplied uniformly to the spin coating chamber from the synchronization cover exhaust holes 4, thereby improving the flow field of the spin coating chamber.

[0026] Furthermore, a trapezoidal spoiler 5 is attached to the lower surface of the synchronization cover module 6, and the angle between the trapezoidal spoilers 5 can be adjusted within the range of 60° to 90°. No exhaust holes are provided on the lower surface of the synchronization cover module 6 where the spoiler is located, and no exhaust holes are provided on the trapezoidal spoiler either.

[0027] The present invention is implemented as follows. Before starting spin coating, select a target substrate and coating solution of appropriate size according to the spin coating process and product requirements. Then, select appropriate spin coating process parameters according to the required thin film thickness. After the preliminary preparation work for spin coating is complete, the production of the thin film by spin coating may begin immediately.

[0028] First, high-speed gas is introduced into the spin coat chamber from the pressure adjustment inlet of the pressure adjustment module, or the gas in the chamber is removed using a vacuum pump to blow out dust and other contaminants or particulate matter from the chamber, thereby ensuring cleanliness within the chamber. Next, the synchronization cover module is moved upward, and the coating liquid is placed on the center or the entire surface of the target substrate. Then, the synchronization cover module is returned to its original position, and the power switches for driving the spin stage module and the synchronization cover module, as well as the control switch for controlling the intake of the synchronization cover module, are turned on. The coating liquid flows or diffuses along the substrate surface due to centrifugal force, and at the same time, the film thickness is reduced by the evaporation of the solvent. Simultaneously, supersaturated water vapor, continuously and uniformly introduced from the intake port of the synchronization cover, reaches the cylindrical chamber of the synchronization cover and is then introduced into the spin coat chamber from exhaust holes uniformly located on the underside of the synchronization cover. The uniform introduction of gas ensures the stability of the atmospheric environment within the chamber, and the synchronously rotating trapezoidal spoiler ensures the stability of the flow field within the chamber by matching the gas flow velocity. The combined action of the spoiler and the introduced gas is advantageous in ensuring uniform thin film flow and reduction in film thickness due to evaporation, thereby ensuring film thickness uniformity and thin film quality.

[0029] As described above, a person skilled in the art can make various other modifications and changes based on the technical means and technical concept of the present invention, and all such modifications and changes fall within the scope of protection of the claims.

[0030] (Note) (Note 1) It comprises a synchronous cover module (6), a pressure adjustment module (7), and a spin stage module (8), The synchronous cover module (6), the pressure adjustment module (7), and the spin stage module (8) are arranged in order from top to bottom and have a concentric structure, a flow path for the coating liquid to flow out is left between the spin stage module (8) and the pressure adjustment module (7), and the spin stage module (8) and the synchronous cover module (6) rotate synchronously during spin coating. A circular substrate mounting platform (2) with an area larger than the target substrate is provided on the upper surface of the pin stage module (8), the area of ​​the spin stage module (8) other than the circular substrate mounting platform (2) is the stage periphery, the circular substrate mounting platform (2) and the stage periphery are formed continuously via a slope, the circular substrate mounting platform (2) is higher than the stage periphery, a vacuum hole (9) is provided in the center of the circular substrate mounting platform (2), and the target substrate is attracted to the circular substrate mounting platform (2) by vacuum, The pressure adjustment module (7) has an annular structure, and its inner wall surface is continuously formed from a flat surface to a slope from top to bottom, the flat surface corresponds to the synchronous cover module (6), the slope is used to prevent the coating liquid from splashing during the spin coating process, and after the coating liquid is splashed onto the slope it flows out of the flow path along the slope, the outer surface of the pressure adjustment module (7) is provided with a rectangular parallelepiped-shaped projection, and a pressure adjustment inlet is provided on the outer surface of the rectangular parallelepiped-shaped projection, the center height of the pressure adjustment inlet is the same as the top surface height of the target substrate, the pressure adjustment module (7) has a gas flow path formed therein, the gas flow path is composed of a first part with a constant rectangular cross-section and a second part with a linearly increasing rectangular cross-section, the first part and the second part form an integrated gas flow path from the outside to the inside, The synchronization cover module (6) is configured to be vertically movable up and down, and an intake port is provided above the synchronization cover module (6), and gas is introduced through the intake port and supplied to the synchronization cover module (6), the inside of the synchronization cover module (6) is hollow, and annularly and uniformly arranged exhaust ports are provided on the lower surface of the synchronization cover module (6), the exhaust ports communicate with the hollow, and gas flows in from the intake port, passes through the hollow, and is blown out from the exhaust ports above the spin stage module (8), A trapezoidal spoiler (5) is provided on the lower surface of the synchronization cover module (6), and the angle between the spoilers (5) can be adjusted in the range of 60° to 90°. The exhaust holes (4) are not provided on the lower surface of the synchronization cover module (6) where the spoilers (5) are located, and the trapezoidal spoiler also does not have an exhaust hole (4). A spin-coated chamber structure characterized by stabilizing the chamber's flow field and improving the cleanliness of the chamber.

[0031] (Note 2) The aforementioned vacuum hole (9) connects the axial hole of the hollow shaft of the spin coater to the vacuum pump. A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in Appendix 1.

[0032] (Note 3) The upper surface of the circular substrate mounting base (2) is provided with four symmetrically arranged positioning holes (1). A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in Appendix 1.

[0033] (Note 4) The aforementioned pressure adjustment module (7) has four connecting holes on the outer circumference of its upper surface and is fixed to the frame of the spin coater by bolts and nuts. A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in Appendix 1.

[0034] (Note 5) The gas flow path of the pressure adjustment module (7) is not located directly below the connecting hole. A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in Appendix 1.

[0035] (Note 6) The cavity is a cylindrical cavity (10). A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in Appendix 1. [Explanation of Symbols]

[0036] 1: Positioning hole for spin-coating target substrate, 2: High-precision circular substrate mounting stage, 3: Pressure adjustment inlet, 4: Synchronization cover exhaust hole, 5: Trapezoidal spoiler, 6: Synchronization cover module, 7: Pressure adjustment module, 8: Spin stage module, 9: Vacuum drain hole, 10: Cylindrical cavity, 11: Synchronization cover intake hole, 12: Mounting hole for pressure adjustment module, 13: Anti-scattering slope.

Claims

1. It comprises a synchronous cover module (6), a pressure adjustment module (7), and a spin stage module (8), The synchronous cover module (6), the pressure adjustment module (7), and the spin stage module (8) are arranged in order from top to bottom and have a concentric structure, a flow path for the coating liquid to flow out is left between the spin stage module (8) and the pressure adjustment module (7), and the spin stage module (8) and the synchronous cover module (6) rotate synchronously during spin coating. A circular substrate mounting platform (2) with an area larger than the target substrate is provided on the upper surface of the pin stage module (8), the area of ​​the spin stage module (8) other than the circular substrate mounting platform (2) is the stage periphery, the circular substrate mounting platform (2) and the stage periphery are formed continuously via a slope, the circular substrate mounting platform (2) is higher than the stage periphery, a vacuum hole (9) is provided in the center of the circular substrate mounting platform (2), and the target substrate is attracted to the circular substrate mounting platform (2) by vacuum. The pressure adjustment module (7) has an annular structure, and its inner wall surface is continuously formed from a flat surface to a slope from top to bottom, the flat surface corresponds to the synchronous cover module (6), the slope is used to prevent the coating liquid from splashing during the spin coating process, and after the coating liquid is splashed onto the slope it flows out of the flow path along the slope, the outer surface of the pressure adjustment module (7) is provided with a rectangular parallelepiped-shaped projection, and a pressure adjustment inlet is provided on the outer surface of the rectangular parallelepiped-shaped projection, the center height of the pressure adjustment inlet is the same as the top surface height of the target substrate, the pressure adjustment module (7) has a gas flow path formed therein, the gas flow path is composed of a first part with a constant rectangular cross-section and a second part with a linearly increasing rectangular cross-section, the first part and the second part form an integrated gas flow path from the outside to the inside, The synchronization cover module (6) is configured to be vertically movable up and down, and an intake port is provided above the synchronization cover module (6), and gas is introduced through the intake port and supplied to the synchronization cover module (6), the inside of the synchronization cover module (6) is hollow, and annularly uniformly arranged exhaust ports are provided on the lower surface of the synchronization cover module (6), the exhaust ports communicate with the hollow, and gas flows in from the intake port, passes through the hollow, and is blown out from the exhaust ports above the spin stage module (8), A trapezoidal spoiler (5) is provided on the lower surface of the synchronization cover module (6), and the angle between the spoilers (5) can be adjusted in the range of 60° to 90°. The exhaust holes (4) are not provided on the lower surface of the synchronization cover module (6) where the spoilers (5) are located, and the trapezoidal spoiler also does not have an exhaust hole (4). A spin-coated chamber structure characterized by stabilizing the chamber's flow field and improving the cleanliness of the chamber.

2. The vacuum hole (9) connects the axial hole of the hollow shaft of the spin coater to the vacuum pump. A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in feature 1.

3. The upper surface of the circular substrate mounting base (2) is provided with four positioning holes (1) arranged symmetrically. A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in feature 1.

4. The aforementioned pressure adjustment module (7) has four connecting holes on the outer circumference of its upper surface and is fixed to the frame of the spin coater by bolts and nuts. A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in feature 1.

5. The gas flow path of the pressure adjustment module (7) is not located directly below the connecting hole. A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in feature 1.

6. The cavity is a cylindrical cavity (10). A spin-coated chamber structure for stabilizing the flow field of the chamber and improving the cleanliness of the chamber, as described in feature 1.

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