Substrate processing apparatus and method for installing the substrate processing apparatus

Abstract

The objective is to facilitate the installation of the substrate processing apparatus by simplifying the process of attaching the processing unit to the inside of the substrate processing apparatus. [Solution] The device is equipped with a main frame 50 on both the inside and outside of the housing section 60B, which allows the heat treatment unit 43 to be easily inserted and removed via a slider 49. The heat treatment unit 43 is equipped with a first assembly connector 45 that collects the first connector group 44. The housing section 60B is equipped with a second assembly connector 62 that collects the second connector group 61. The first assembly connector 45 and the second assembly connector 62 are connected collectively when the heat treatment unit 43 is housed in the housing section 60B via the slider 49, thereby connecting the first connector group 44 and the second connector group 61 together.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus and a method for installing units inside the substrate processing apparatus. The substrate is, for example, any one of a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for an FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, and a substrate for a solar cell.

Background Art

[0002] Patent Document 1 discloses a substrate processing apparatus and a method for installing the substrate processing apparatus. The substrate processing apparatus includes an apparatus main body, an electrical equipment box, a housing side connection portion, a main body side connection portion, a guide portion, and a connection auxiliary mechanism. The apparatus main body performs a predetermined process on the substrate. The electrical equipment box is detachable from the upper part of the apparatus main body.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, the substrate processing apparatus and the method for installing the substrate processing apparatus according to Patent Document 1 only facilitate the work of attaching the electrical equipment box to the upper part of the apparatus main body. Here, the substrate processing apparatus includes a processing unit for performing a predetermined process on the substrate inside. In the substrate processing apparatus and the method for installing the substrate processing apparatus according to Patent Document 1, the work of attaching the processing unit inside the substrate processing apparatus cannot be facilitated.

[0005] This invention has been made in view of these circumstances, and aims to facilitate the installation of a substrate processing apparatus by making it easier to install the processing unit inside the substrate processing apparatus. [Means for solving the problem]

[0006] The present invention has the following configuration. That is, the present invention is a substrate processing apparatus for processing a substrate, the substrate processing apparatus comprising a device body having a plurality of processing units for performing a predetermined process on the substrate, a housing section for housing the processing unit, and a support mechanism inside the housing section and outside the housing section for supporting the processing unit so that it can be moved in and out, the processing unit comprising a first assembly section for collecting a first group of connectors consisting of a plurality of types of connectors connected to the processing unit side, the housing section comprising a second assembly section for collecting a second group of connectors consisting of a plurality of types of connectors connected to the device body side, and the first assembly section and the second assembly section are configured such that the first group of connectors and the second group of connectors are connected together when the processing unit is housed in the housing section via the support mechanism.

[0007] The substrate processing apparatus processes substrates. The substrate processing apparatus comprises an apparatus body and a support mechanism. The apparatus body has multiple pairs of processing units and housing sections. The processing units perform predetermined processing on the substrates. The housing sections house the processing units. The support mechanism supports the processing units so that they can be moved in and out from both inside and outside the housing sections.

[0008] The processing unit includes a first assembly section. The first assembly section collects a first group of connectors consisting of multiple types of connectors connected to the processing unit. The housing section includes a second assembly section. The second assembly section collects a second group of connectors consisting of multiple types of connectors connected to the main body of the device. The first and second assembly sections are configured such that the first group of connectors and the second group of connectors are connected together when the processing unit is housed in the housing section via a support mechanism.

[0009] In other words, since the processing unit is housed in the housing via a support mechanism, the positions of the first assembly and the second assembly align precisely. If the positions of the first and second assembly align precisely, the positions of the first group of connectors gathered in the first assembly and the second group of connectors gathered in the second assembly align precisely. Therefore, even if the first and second group of connectors are composed of multiple types of connectors, it is easy to accurately connect the first and second group of connectors.

[0010] Furthermore, the substrate processing apparatus is provided with a transport passage in which a substrate transport mechanism for transporting the substrate is arranged in the processing unit, the transport passage is located behind the support mechanism, the first assembly is preferably located on the transport passage side of the processing unit, and the second assembly is preferably located on the transport passage side of the housing. Therefore, since the first assembly and the second assembly are located behind the support mechanism, it is easy to connect the first connector group and the second connector group when the processing unit is housed in the housing via the support mechanism.

[0011] Furthermore, it is preferable that the substrate transport mechanism includes a hand for holding the substrate, the device body includes a device body casing that forms the housing, the device body casing has an input / output port for inserting the hand into the processing unit at a position facing the transport passage, and the first and second collection sections are provided at positions that avoid the input / output port. Therefore, the first and second collection sections do not obstruct the hand inserted from the input / output port.

[0012] Furthermore, it is preferable that the first and second collection sections are located below the loading / unloading exits. Therefore, the space located below the opening is effectively utilized by the first and second collection sections.

[0013] Furthermore, it is preferable that the main body of the device includes a main body casing that forms the housing section, and that the main body casing and the processing unit are fitted together by the processing unit being housed in the housing section via the support mechanism, thereby providing a first fitting section. Therefore, it is easy to strengthen the connection between the first connector group and the second connector group in the processing unit and the main body casing.

[0014] Furthermore, it is preferable that the first and second assembly portions are fitted together by the processing unit being housed in the housing portion via the support mechanism. Therefore, it is easy to strengthen the connection between the first connector group and the second connector group in the first and second assembly portions.

[0015] Furthermore, it is preferable that one first and one second assembly be provided for each processing unit. Therefore, the connection between the processing unit and the housing can be consolidated into a single location.

[0016] Furthermore, it is preferable that the first group of connectors is connected to a processing unit that performs the predetermined processing and to a plurality of auxiliary devices that assist the processing unit. Therefore, the connectors connected to the processing unit and the connectors connected to the plurality of auxiliary devices can be grouped together in one place.

[0017] Furthermore, the first assembly unit includes a first frame that groups together the first connector group, and the second assembly unit includes a second frame that groups together the second connector group. Therefore, the positions of the first connector group and the second connector group are precisely aligned.

[0018] Furthermore, the main body of the device includes a main body casing that forms the housing section, and the processing unit is provided with a fixing mechanism on the side opposite to the transport passage for fixing the processing unit to the main body casing, and it is preferable that the fixing mechanism allows for the operation of fixing the processing unit to the main body casing while the first connector group and the second connector group are connected. Therefore, if it is necessary to fix the processing unit more firmly while the first connector group and the second connector group are connected, the processing unit can be fixed to the main body casing.

[0019] A method for installing a substrate processing apparatus, wherein a processing unit for performing a predetermined process on a substrate is installed inside the substrate processing apparatus, the substrate processing apparatus comprises a device body having a plurality of processing units for performing a predetermined process on the substrate, a housing section for housing the processing unit, and a plurality of support mechanisms inside and outside the housing section for supporting the processing unit so that it can be moved in and out, the processing unit comprises a first assembly section for collecting a first group of connectors consisting of a plurality of types of connectors connected to the processing unit, the housing section comprises a second assembly section for collecting a second group of connectors consisting of a plurality of types of connectors connected to the device body, and it is preferable that the processing unit is housed in the housing section via the support mechanisms so that the positions of the first assembly section and the second assembly section are aligned and the first group of connectors and the second group of connectors are connected together.Therefore, by facilitating the installation of the processing unit inside the substrate processing apparatus, the substrate processing apparatus can be easily installed. [Effects of the Invention]

[0020] According to the substrate processing apparatus and installation method of the present invention, the substrate processing apparatus can be easily installed by facilitating the installation of processing units inside the substrate processing apparatus. [Brief explanation of the drawing]

[0021] [Figure 1] This is a cross-sectional view of a substrate processing device. [Figure 2] It is a longitudinal sectional view of a substrate processing apparatus. [Figure 3] It is a longitudinal sectional view of a substrate processing apparatus showing the arrangement of a heat treatment unit. [Figure 4] (a) is a side view of the heat treatment unit pulled out from the housing section. (b) is a side view of the heat treatment unit housed in the housing section. [Figure 5] It is a cross-sectional view of the heat treatment unit housed in the housing section. [Figure 6] It is a longitudinal sectional view of the heat treatment unit housed in the housing section taken along line A-A in FIG. 5. [Figure 7] It is a cross-sectional view of the heat treatment unit pulled out from the housing section. [Figure 8] It is a longitudinal sectional view of the heat treatment unit pulled out from the housing section taken along line B-B in FIG. 7. [Figure 9] It is a block diagram showing the relationship between the heat treatment unit, the control unit, and the power supply unit. [Figure 10] (a) is a diagram showing the connection surface of the first collective connector. (b) is a diagram showing the connection surface of the second collective connector. [Figure 11] (a) is a longitudinal sectional view of the fitting portion in the connected state taken along line C-C in FIG. 5. (b) is a longitudinal sectional view of the fitting portion in the non-connected state taken along line D-D in FIG. 7. [[ID=3o]] [Figure 12] (a) is a longitudinal sectional view of the connection between the alignment recess and the alignment protrusion taken along line E-E in FIG. 5. (b) is a longitudinal sectional view of the non-connection between the alignment recess and the alignment protrusion taken along line F-F in FIG. 7. [Figure 13] It is a cross-sectional view of the heat treatment unit pulled out from the housing section according to Modification 1.

BEST MODE FOR CARRYING OUT THE INVENTION

EXAMPLE

[0022] Hereinafter, Example 1 of this invention will be described with reference to the drawings.

[0023] <Configuration of the Substrate Processing Apparatus> Next, the substrate processing apparatus 1 will be described using Figures 1 to 3. Figure 1 is a cross-sectional view of the substrate processing apparatus 1. Figure 2 is a longitudinal cross-sectional view of the substrate processing apparatus 1. Figure 3 is a longitudinal cross-sectional view of the substrate processing apparatus 1 showing the arrangement of the heat treatment unit 43. The substrate processing apparatus 1 according to Embodiment 1 performs coating and heat treatment on a wafer W.

[0024] In the substrate processing apparatus 1, the direction in which the indexer block 31 and the processing block 32 (described later) are aligned is called the front-to-back direction. In the front-to-back direction, the direction from the processing block 32 toward the indexer block 31 is called the front. In the front-to-back direction, the direction from the indexer block 31 toward the processing block 32 is called the rear. The front-to-back direction is illustrated by an arrow denoted by the symbol x. The front-to-back direction is also called the x-direction. In the processing block 32, the direction in which the coating unit 41 (described later), the transport space 42, and the heat treatment block 97 (described later) are aligned is called the left-to-right direction. In the left-to-right direction, the direction from the heat treatment block 97 toward the coating unit 41 is called the left. In the left-to-right direction, the direction from the coating unit 41 toward the heat treatment block 97 is called the right. The left-to-right direction is illustrated by an arrow denoted by the symbol y. The left-to-right direction is also called the y-direction. In the substrate processing apparatus 1, the direction perpendicular to the front-to-back direction and the left-to-right direction is called the up-and-down direction. The up-and-down direction is illustrated by an arrow denoted by the symbol z. The up-and-down direction is also called the z-direction.

[0025] The substrate processing apparatus 1 comprises an indexer block 31 and a processing block 32. The indexer block 31 includes two openers 33 and 34, and two substrate transport mechanisms TR1 and TR2. The two openers 33 and 34 (carrier placement sections) provided on the indexer block 31 each place a carrier C capable of accommodating multiple wafers W on it. For example, a hoop (FOUP: Front Open Unified Pod) is used as the carrier C.

[0026] Each of the openers 33 and 34 includes a mounting table 35 on which the carrier C is placed, an opening 36 for passing the wafer W through, a shutter member (not shown) that opens and closes the opening 36 and attaches and detaches the lid to the carrier body, and a shutter member drive mechanism (not shown) that drives the shutter member.

[0027] As shown in Figure 2, each of the substrate transport mechanisms TR1 and TR2 comprises two hands 37, a forward / backward drive unit 38, and a lifting / rotating drive unit 39. Each of the hands 37 holds a wafer W. Each of the hands 37 is movably mounted to the forward / backward drive unit 38. The forward / backward drive unit 38 can move the two hands 37 individually.

[0028] The lifting and rotating drive unit 39 lifts and rotates each of the hands 37 by lifting and rotating the forward and backward drive unit 38. The lifting and rotating drive unit 39 can move the forward and backward drive unit 38 in the vertical direction (z direction) and can also rotate the forward and backward drive unit 38 around the vertical axis AX1. The forward and backward drive unit 38 and the lifting and rotating drive unit 39 are each equipped with, for example, an electric motor. The two substrate transport mechanisms TR1 and TR2 are fixed to the floor of the indexer block 31 so that they cannot move in the horizontal direction. Alternatively, the two substrate transport mechanisms TR1 and TR2 may each be provided to be movable in the horizontal direction. Also, one of the two substrate transport mechanisms TR1 and TR2 may be omitted.

[0029] A substrate mounting section PS1 is provided between the indexer block 31 and the upper processing layer 32A of the processing block 32. A substrate mounting section PS2 is provided between the indexer block 31 and the lower processing layer 32B of the processing block 32. Each of the substrate mounting sections PS1 and PS2 is configured to accommodate one or more wafers W.

[0030] The substrate transport mechanism TR1 transports the wafer W from the carrier C placed on the opener 33 to one of the two substrate mounting sections PS1 and PS2. The substrate transport mechanism TR2 transports the wafer W from the carrier C placed on the opener 34 to one of the two substrate mounting sections PS1 and PS2. Note that there may be two or more openers 33 and 34 in the vertical direction. In this case, for example, the substrate transport mechanism TR1 can retrieve the wafer W from the carrier C placed on two or more openers 33 arranged in the vertical direction.

[0031] As shown in Figure 1, the processing block 32 comprises a coating unit 41, a transport space 42, and a heat treatment block 97. In Example 1, the processing block 32 has a configuration in which two processing layers having the same configuration are stacked. That is, as shown in Figure 2, the processing block 32 has a configuration in which an upper processing layer 32A and a lower processing layer 32B are stacked vertically.

[0032] The coating unit 41 performs a coating process by applying a processing liquid to the wafer W. Examples of processing liquids include photoresist liquid or liquid for forming an anti-reflective film. One coating unit 41 is provided in each of the processing layers 32A and 32B. Of the two coating units 41, the one provided in processing layer 32A is referred to as coating unit 41A, and the one provided in processing layer 32B is referred to as coating unit 41B to distinguish between the two. Each of the coating units 41A and 41B is equipped with a series of mechanisms used in the coating process, such as a nozzle for applying the processing liquid to the wafer W and a spin chuck for holding the wafer W.

[0033] As shown in Figure 1, the transport space 42 is a rectangular space that extends linearly in the front-to-back direction (x-direction) in a plan view. The coating unit 41 and the heat treatment unit 43 are arranged to sandwich the transport space 42 on the left and right sides. That is, the coating unit 41 is located on the left side of the transport space 42, and the heat treatment unit 43 is located on the right side of the transport space 42. The transport space 42 corresponds to the transport passage of the present invention.

[0034] As shown in Figure 2, one transport space 42 is provided in each of the processing layers 32A and 32B. Of the two transport spaces 42, the one provided in processing layer 32A is referred to as transport space 42A, and the one provided in processing layer 32B is referred to as transport space 42B to distinguish between the two.

[0035] The substrate transport mechanism TR3 will now be described. Each of the transport spaces 42A and 42B is equipped with the substrate transport mechanism TR3. The substrate transport mechanism TR3 corresponds to the substrate transport mechanism of the present invention.

[0036] The substrate transport mechanism TR3 transports the wafer W in each of the transport spaces 42A and 42B. Specifically, the substrate transport mechanism TR3 loads and unloads the wafer W into the coating unit 41. The substrate transport mechanism TR3 also loads and unloads the wafer W into the heat treatment unit 43. The substrate transport mechanism TR3 also loads and unloads the wafer W into the standby unit 42A. The substrate transport mechanism TR3 loads and unloads the wafer W into the substrate mounting sections PS1 and PS2.

[0037] The substrate transport mechanism TR3 comprises two hands 47, a forward / backward drive unit 48, and a rotation drive unit 49. The substrate transport mechanism TR3 further comprises a first movement mechanism 51 and a second movement mechanism 52. Of the two hands 47, one is referred to as hand 47A and the other as hand 47B to distinguish them. The hand 47 corresponds to the hand of the present invention.

[0038] A general explanation of the substrate transport mechanism TR3 is as follows: The forward / backward drive unit 48 moves the hands 47A and 47B forward and backward in the horizontal direction. The rotational drive unit 49 rotates the hands 47A and 47B around a rotation axis extending in the z direction. The first moving mechanism 51 moves the hands 47A and 47B together with the forward / backward drive unit 48 and the rotational drive unit 49 in the x direction. The second moving mechanism 52 moves the hands 47A and 47B together with the forward / backward drive unit 48 and the rotational drive unit 49 in the z direction.

[0039] By operating the rotary drive unit 49, the forward and backward directions of the hands 47A and 47B are aligned with either the coating unit 41, the heat treatment unit 43, the standby unit 42A, or the substrate mounting sections PS1 and PS2. By operating the first moving mechanism 51, the horizontal positions of the hands 47A and 47B are aligned with either the coating unit 41, the heat treatment unit 43, the standby unit 42A, or the substrate mounting sections PS1 and PS2. By operating the second moving mechanism 52, the height of the hands 47A and 47B is adjusted to the height required for loading and unloading the wafer W. By operating the forward and backward drive unit 48, the hands 47A and 47B move forward and backward to load and unload the wafer W.

[0040] The heat treatment block 97 has heat treatment units 43 stacked in multiple layers and arranged in parallel in the x direction. Each of the heat treatment units 43 performs heat treatment on the wafer W. Figure 3 is a diagram showing the arrangement of the heat treatment units 43 in the processing block 32. Figure 3 corresponds to the cross-sectional view taken along the arrow aa in Figure 1. Each of the processing layers 32A and 32B of the processing block 32 has one heat treatment block 97. Of the two heat treatment blocks 97 in the processing block 32, the one located in the upper processing layer 32A is referred to as heat treatment block 97A, and the one located in the lower processing layer 32B is referred to as heat treatment block 97B.

[0041] In each of the two heat treatment blocks 97A and 97B, the heat treatment units 43 are configured to be arranged, for example, in a 3x5 grid. As shown in Figure 3, the heat treatment units 43 located in the front row are designated as heat treatment unit 43A. The heat treatment units 43 located in the middle row are designated as heat treatment unit 43B. The heat treatment units 43 located in the rear row are designated as heat treatment unit 43C.

[0042] <Regarding the mechanism for supporting career decisions> Referring to Figure 4, a reciprocating support mechanism that supports the heat treatment unit 43 so that it can move back and forth in the left-right direction relative to the main frame 50 of the apparatus will be described. Figure 4(a) is a side view of the heat treatment unit pulled out from the housing section. Figure 4(b) is a side view of the heat treatment unit housed in the housing section.

[0043] The heat treatment unit 43 is supported so as to be able to move in and out from both the inside and outside of the main frame 50 of the apparatus. "Move in and out" means that the heat treatment unit 43 is supported so as to be able to move in and out from both the inside and outside of the main frame 50 of the apparatus.

[0044] Specifically, the heat treatment unit 43 is supported so as to be able to move back and forth in the left-right direction relative to the main body frame 50 of the apparatus. The main body frame 50 constitutes the framework of the substrate processing apparatus 1. The main body frame 50 includes a main body casing 60 that houses the heat treatment unit 43. The main body frame 50 includes a main body casing 60 corresponding to the number of heat treatment units 43. The heat treatment unit 43 is supported so as to be able to move back and forth in the left-right direction relative to the main body casing 60 of the apparatus. The main body frame 50 corresponds to the main body of the apparatus of the present invention.

[0045] As will be described later, the heat treatment unit 43 is fixed to the main frame 50 of the apparatus by a fixing mechanism. Therefore, to be more precise, the heat treatment unit 43 can move back and forth in the left-right direction relative to the main frame 50 of the apparatus unless it is fixed by the fixing mechanism.

[0046] The heat treatment unit 43 is supported on the main body frame 50 of the apparatus so as to be able to move back and forth via a reciprocating support mechanism. The reciprocating support mechanism is, for example, a slider 49 that connects the heat treatment unit 43 to the main body casing 60 of the apparatus so as to be able to move back and forth. Note that the slider 49 corresponds to the support mechanism of the present invention.

[0047] The main casing 60 of the apparatus includes a housing section 60B for housing the heat treatment unit 43. The housing section 60B is the internal space of the main casing 60 of the apparatus. The heat treatment unit 43 is supported so as to be able to be moved in and out from both the inside and outside of the housing section 60B. The housing section 60B corresponds to the housing section of the present invention.

[0048] The heat treatment unit 43 is a drawer-shaped member with a unit base 43s as its bottom plate. The heat treatment unit 43 is, for example, rectangular in both plan view and side view.

[0049] The unit base 43s has base side walls 43z on all four sides. The base side wall 43z on the far side relative to the unit base 43s's direction of movement is called base side wall 43z1. The base side wall 43z located on the right side relative to the unit base 43s's direction of movement is called base side wall 43z2. The base side wall 43z located on the left side relative to the unit base 43s's direction of movement is called base side wall 43z3. The base side wall 43z located on the near side relative to the unit base 43s's direction of movement is called base side wall 43z4. A handle 43y is provided on the outer surface of base side wall 43z4. The worker moves the unit base 43s forward and backward by grasping the handle 43y.

[0050] The slider 49 comprises, for example, a base portion 49A, a tip portion 49B, and an intermediate portion 49C. The tip portion 49B is attached to the outer surface of the base side walls 43z2, 43z3. The base portion 49A is attached to the inner surface of the device body casing 60 facing the base side walls 43z2, 43z3. The intermediate portion 49C is supported so as to be able to move back and forth relative to the base portion 49A. The tip portion 49B is supported so as to be able to move back and forth relative to the intermediate portion 49C. In this way, the slider 49 supports the heat treatment unit 43 so as to be able to move in and out of the inside and outside of the device body casing 60. In other words, the heat treatment unit 43 is supported so as to be able to move back and forth relative to the device body casing 60 via the slider 49.

[0051] This allows the heat treatment unit 43 to be stably inserted into and removed from the main casing 60 of the apparatus.

[0052] The main casing 60 of the apparatus is provided with a lid 60C on the front side in the direction of advancement and retraction. The lid 60C opens and closes the casing opening 60D of the main casing 60 of the apparatus. Before the heat treatment unit 43 is pulled out from the housing 60B, the lid 60C is opened to the main casing 60 of the apparatus. After the heat treatment unit 43 is housed in the housing 60B, the lid 60C is closed to the main casing 60 of the apparatus.

[0053] <Configuration of the heat treatment unit> Here, the configuration of the heat treatment unit 43 housed in the housing section 60B will be explained using Figures 5 and 6. Figure 5 is a cross-sectional view of the heat treatment unit housed in the housing section. Figure 6 is a longitudinal cross-sectional view of the heat treatment unit housed in the housing section, shown by line AA in Figure 5.

[0054] Refer to Figure 5. The heat treatment unit 43 includes a first assembly connector 45 which is an assembly of multiple types of connectors connected to the heat treatment unit 43, as will be described later. The first assembly connector 45 is attached, for example, to the base side wall 43z1. Specifically, the tip of the first assembly connector 45 (the side having the connector contacts) is exposed further back (to the left) than the base side wall 43z1. The first assembly connector 45 corresponds to the first assembly part of the present invention.

[0055] The main casing 60 of the device includes a second assembly connector 62, which is a collection of multiple types of connectors connected to the control unit 85 and the power supply unit 90, as will be described later. The second assembly connector 62 is located on the transport space 42 side of the housing unit 60B. Specifically, the second assembly connector 62 is mounted on the rear side of the main casing 60 of the device. For example, the second assembly connector 62 is mounted on the bottom surface at the rear of the main casing 60 of the device. However, the mounting position of the second assembly connector 62 is not limited to this. For example, the second assembly connector 62 may be mounted on the rear wall surface of the main casing 60 of the device. The second assembly connector 62 corresponds to the second assembly unit of the present invention.

[0056] The back of the second assembly connector 62 has passages formed for the cables connected to each connector to pass through.

[0057] The heat treatment unit 43 is housed in the housing section 60B via the slider 49, thereby connecting the first assembly connector 45 and the second assembly connector 62. The heat treatment unit 43 is pulled out of the housing section 60B via the slider 49, thereby disconnecting the first assembly connector 45 and the second assembly connector 62.

[0058] The connection of the first assembly connector 45 and the second assembly connector 62 connects multiple types of connectors connected to the heat treatment unit 43 with multiple types of connectors connected to the control unit 85 and the power supply unit 90. This makes it easier to connect multiple types of connectors connected to the heat treatment unit 43 with multiple types of connectors connected to the control unit 85 and the power supply unit 90.

[0059] Each element of the heat treatment unit 43 is mounted on the unit base 43s.

[0060] Specifically, the heat treatment unit 43 is equipped with a heating plate 54, a second support pin 57, a second pin lifting mechanism 58, and a local transport mechanism 59 on a unit base 43s. The heating plate 54 corresponds to the processing apparatus of the present invention. The second pin lifting mechanism 58 and the local transport mechanism 59 correspond to auxiliary devices of the present invention.

[0061] The heating plate 54 heats the wafer W on which it is placed to a predetermined temperature. The heating plate 54 is plate-shaped and made of metal or ceramic. The heating plate 54 is equipped with a heater 54A (e.g., an electric heater) and a temperature sensor 54B. The heater 54A heats, for example, the upper surface 54C of the heating plate 54. The temperature sensor 54B detects, for example, the temperature of the upper surface 54C heated by the heating plate 54.

[0062] The heating plate 54 is provided with three holes 66 in the vertical direction. A rod-shaped second support pin 57 is passed through each of the three holes 66. That is, as shown in Figure 6, the three second support pins 57 are provided so as to penetrate the heating plate 54. The lower ends of the three second support pins 57 are fixed to the lifting member 67. The second pin lifting mechanism 58 raises and lowers the three second support pins 57 fixed to the lifting member 67 by raising and lowering the lifting member 67.

[0063] As shown in Figure 6, the heating plate 54 is provided with a cover 68 to cover the wafer W on its upper surface 54C. The cover lifting mechanism 69 is connected to the cover 68 and raises and lowers the cover 68. The cover lifting mechanism 69 is composed of an actuator driven by an electric motor or air. The upper surface 54C of the heating plate 54 is provided with a ring-shaped exhaust port 71 that surrounds the placed wafer W. Note that the exhaust port 71 is omitted in Figure 5. When the cover 68 is in the lower position covering the wafer W, the exhaust port 71 can exhaust gas from the processing space SP. The heat treatment unit 43 and the main casing 60 of the apparatus are equipped with an exhaust mechanism which is not shown. Note that the cover lifting mechanism 69 corresponds to an auxiliary device of the present invention.

[0064] As shown in Figure 6, the heat treatment unit 43 is provided with a unit partition wall 43p that separates the standby position 59P from the heating plate 54. The unit partition wall 43p is provided with a partition wall opening 43q for the local transport mechanism 59 to pass through. The partition wall opening 43q is opened and closed by a shutter member 43r. The unit partition wall 43p is equipped with a shutter lifting mechanism 70 that raises and lowers the shutter member 43r. The shutter member 43r is shown by a dashed line in Figure 5. The shutter lifting mechanism 70 corresponds to an auxiliary device of the present invention.

[0065] As shown in Figure 5, the local transport mechanism 59 transports the wafer W between a standby position 59P and a heating position 54D inside the heat treatment unit 43. The local transport mechanism 59 includes a transport arm 65 and an arm drive mechanism 73. The local transport device 59 corresponds to an auxiliary device of the present invention.

[0066] As shown in Figure 5, the transport arm 65 is a flat plate-shaped member made of a material with good heat transfer properties (e.g., aluminum). Three proximity balls 74 are provided on the upper surface of the transport arm 65. As shown in Figure 6, the three proximity balls 74 protrude upward from the upper surface. Therefore, when a wafer W is placed on the upper surface of the transport arm 65, the three proximity balls 74 create a small gap between the lower surface of the wafer W and the upper surface of the transport arm 65. As shown in Figure 5, two slits 75 are formed in the transport arm 65. The two slits 75 are formed on the heating plate 54 side of the transport arm 65 and extend parallel to each other in the front-rear direction (y-direction).

[0067] The two slits 75 are designed so that, for example, three first support pins 55 in a raised position can fit into them. That is, the three first support pins 55 are provided to pass through the transport arm 65. As shown in Figure 6, the lower ends of the three first support pins 55 are fixed to the lifting member 64. The first pin lifting mechanism 56 raises and lowers the three first support pins 55 fixed to the lifting member 64 by raising and lowering the lifting member 64. Each of the first pin lifting mechanisms 56 is composed of an actuator driven by an electric motor or air.

[0068] As shown in Figure 5, the arm drive mechanism 73 can move the conveying arm 65 linearly between the standby position 59P and the heating position 54D. The arm drive mechanism 73 includes a horizontal movement section 73H and a vertical movement section 73V. The horizontal movement section 73H moves the conveying arm 65 in the horizontal direction (y direction). The horizontal movement section 73H includes, for example, an electric motor, a guide rail, and a timing belt. The vertical movement section 73V moves the conveying arm 65 in the vertical direction (z direction). The vertical movement section 73V includes, for example, an electric motor or an air cylinder.

[0069] As shown in Figure 5, the main casing 60 of the apparatus is provided with an input / output port 60A. When the substrate transport mechanism TR3 is positioned in front of the input / output port 60A, the substrate transport mechanism TR3 inserts at least one of the two hands 47A and 47B from the input / output port 60A to load and unload wafers W. The input / output port 60A corresponds to the input / output port of the present invention.

[0070] As shown in Figure 6, the first manifold connector 45 is located on the loading / unloading port 60A side of the heat treatment unit 43. The second manifold connector 62 is located on the loading / unloading port 60A side of the main casing 60 of the apparatus. The first manifold connector 45 and the second manifold connector 62 are located below the loading / unloading port 60A. Therefore, the first manifold connector 45 and the second manifold connector 62 do not obstruct the two hands 47A and 47B that enter from the loading / unloading port 60A.

[0071] Furthermore, as shown in Figure 5, the first and second assembly connectors 45 and 62 are positioned away from the operating components in the heat treatment unit 43. For example, the first and second assembly connectors 45 and 62 are positioned away from the arm drive mechanism 73 in the x-direction. As shown in Figure 6, the first and second assembly connectors 45 and 62 are positioned away from the local transport arm 65 in the z-direction. The first and second assembly connectors 45 and 62 are positioned lower than the lower limit position of the local transport arm 65. Therefore, the first and second assembly connectors 45 and 62 do not interfere with the arm drive mechanism 73 and the local transport arm 65.

[0072] Furthermore, the first and second manifold connectors 45 and 62 are positioned away from the heating plate 54 that undergoes heat treatment in the heat treatment unit 43. A unit partition wall 43p and a shutter mechanism 43r are interposed between the first and second manifold connectors 45 and 62 and the heating plate 54. The shutter mechanism 43r can close the partition wall opening 43q during heat treatment. Therefore, the first and second manifold connectors 45 and 62 are less affected by the heat treatment.

[0073] As shown in Figure 5, the heat treatment unit 43 and the main casing 60 of the apparatus are equipped with a mechanism to prevent displacement in a direction perpendicular to the forward and backward direction. This mechanism is, for example, a displacement prevention recess 46 and a displacement prevention protrusion 83. The displacement prevention recess 46 and the displacement prevention protrusion 83 are provided in the heat treatment unit 43 and the main casing 60 of the apparatus, respectively. For example, the displacement prevention recess 46 is provided in the heat treatment unit 43, and the displacement prevention protrusion 63 is provided in the main casing 60 of the apparatus.

[0074] The misalignment prevention recesses 46 and misalignment prevention protrusions 63 are provided in pairs, one pair each, flanking the first connector group 44 and the second connector group 61. Specifically, the misalignment prevention recesses 46 are provided on the unit base 43s along the base side wall 43z1 of the heat treatment unit 43, flanking the first assembly connector 45. The misalignment prevention recesses 46 are provided on the bottom surface of the device body casing 60, flanking the second assembly connector 62.

[0075] The detailed configuration of the misalignment prevention recess 46 and the misalignment prevention protrusion 63 will be described later.

[0076] As shown in Figure 5, the heat treatment unit 43 and the apparatus body casing 60 are provided with a fixing mechanism for fixing the heat treatment unit 43 and the apparatus body casing 60. For example, the fixing mechanism consists of a tapping screw 60V, a first screw hole 60W, and a second screw hole 60X. The tapping screw 60V is, for example, a screw that can be fastened by hand by an operator. The tapping screw 60V, the first screw hole 60W, and the second screw hole 60X correspond to the fixing mechanism of the present invention.

[0077] The heat treatment unit 43 is provided with two first screw holes 60W in the unit base 43s. Specifically, the two first screw holes 60W are located near the base side wall 43z4. The first first screw hole 60W is located near the base side wall 43z2. The second first screw hole 60W is located near the base side wall 43z3.

[0078] The main casing 60 of the apparatus has two second screw holes 60X in its bottom plate. The second screw holes 60X are positioned to communicate with the first screw holes 60W when the heat treatment unit 43 is housed in the housing section 60B.

[0079] The installation and removal of 60V self-tapping screws will be described later.

[0080] Next, the heat treatment unit 43 pulled out from the housing section 60B will be described using Figures 7 and 8. Figure 7 is a cross-sectional view of the heat treatment unit pulled out from the housing section. Figure 8 is a longitudinal cross-sectional view of the heat treatment unit pulled out from the housing section, shown by the line BB in Figure 7.

[0081] To remove the heat treatment unit 43 from the housing 60B, the operator first opens the lid 60C (see Figure 4(a)) to the main casing 60 of the device. A gap 60E (see Figure 6) is provided between the upper edge of the casing opening 60D and the upper edge of the base side wall 43z4, which is necessary for installing and removing the tapping screw 60W. By opening the lid 60C to the main casing 60, the operator can reach through the gap 60E and remove the tapping screw 60W. Once the tapping screw 60W is removed, the operator can pull the heat treatment unit 43 out of the housing 60B. When the heat treatment unit 43 is pulled out of the housing 60B, the connection between the first manifold connector 45 and the second manifold connector 62 is released.

[0082] After housing the heat treatment unit 43 in the housing section 60B, the worker installs the tapping screw 60W through the gap 60E. Then, the worker closes the lid section 60C over the casing opening 60D. This prepares the heat treatment unit 43 for heat treatment.

[0083] When the heat treatment unit 43 is pulled out from the main casing 60 of the apparatus, the heat treatment unit 43 is exposed. In the illustration, the heating plate 54 and part of the cover 68 are exposed. If the heat treatment unit 43 is pulled out further, the entire heating plate 54 and cover 68 may be exposed. If the heat treatment unit 43 is pulled out further, the local transport mechanism 59 may also be exposed.

[0084] The control unit 85 will be described with reference to Figure 9. Figure 9 is a block diagram showing the relationship between the heat treatment unit 43, the control unit 85, and the power supply unit 90.

[0085] The substrate processing apparatus 1 comprises a control unit 85, an operation unit 87, a storage unit 89, and a power supply unit 90. The control unit 85 and the storage unit 89 are provided, for example, in the indexer block 31. The operation unit 87 is provided, for example, in the side wall of the substrate processing apparatus 1. The power supply unit 90 is not shown in the figure, but is provided, for example, in the ceiling of the substrate processing apparatus 1. Note that the power supply unit 90 corresponds to the power supply unit of the present invention.

[0086] The control unit 85 includes, for example, an information processing means such as a central processing unit (CPU). The control unit 85 comprehensively controls the operation of each part that constitutes the substrate processing apparatus 1. The control unit 85 includes, for example, a temperature control unit 86A, a first pin lifting / lowering control unit 86B, a second pin lifting / lowering control unit 86C, a local transport control unit 86D, a cover lifting / lowering control unit 86E, and a shutter lifting / lowering control unit 86F. The control unit 85 corresponds to the control unit of the present invention.

[0087] The temperature control unit 86A controls the operation of the heater 54A installed on the heating plate 54. By controlling the operation of the heater, the temperature of the heating plate 54 is adjusted. The temperature control unit 86A adjusts the temperature of the heating plate 54 based on the temperature data of the heating plate 54 detected by the temperature sensor 54B.

[0088] The first pin lifting control unit 86B controls the first pin lifting mechanism 56 (e.g., an electric motor). By controlling the first pin lifting mechanism 56, the height of the first support pin 55 is adjusted in accordance with the operation of the substrate transport mechanism TR3 and the local transport mechanism 59. The upper and lower ends of the first pin lifting mechanism 56 may be equipped with first pin lifting sensors 56A, such as limit switches. Detection signals from the first pin lifting sensors 56A are transmitted to the first pin lifting control unit 86B.

[0089] The second pin lifting control unit 86C controls the second pin lifting mechanism 58 (e.g., an electric motor). By controlling the second pin lifting mechanism 58, the height of the second support pin 57 is adjusted in accordance with the operation of the local transport mechanism 59. The upper and lower ends of the second pin lifting mechanism 58 may be equipped with second pin lifting sensors 58A, such as limit switches. Detection signals from the second pin lifting sensors 58A are transmitted to the second pin lifting control unit 86C.

[0090] The local transport control unit 86D controls the local transport mechanism 59 (e.g., an electric motor). By controlling the local transport mechanism 59, the front-to-back position and height of the transport arm 65 are adjusted in accordance with the operation of the first pin lifting mechanism 56 and the second pin lifting mechanism 58. The left and right ends of the local transport mechanism 59 may be equipped with local transport sensors 59A, such as limit switches. Detection signals from the local transport sensors 59A are transmitted to the local transport control unit 86D.

[0091] The cover lifting control unit 86E controls the cover lifting mechanism 69 (e.g., an electric motor). By controlling the cover lifting mechanism 69, the height of the cover 68 is adjusted in accordance with the operation of the cover lifting mechanism 69. The upper and lower ends of the cover lifting mechanism 69 may be equipped with cover lifting sensors 69A, such as limit switches. Detection signals from the cover lifting sensors 69A are transmitted to the cover lifting control unit 86E.

[0092] The shutter lifting control unit 86F controls the cover lifting mechanism (e.g., an electric motor). By controlling the shutter lifting mechanism 70, the height of the shutter 43r is adjusted in accordance with the operation of the local transport mechanism 59. The upper and lower ends of the shutter lifting mechanism 70 may be equipped with shutter lifting sensors 70A, such as limit switches. Detection signals from the shutter lifting sensors 70A are transmitted to the shutter lifting control unit 86F.

[0093] The operation unit 87 includes a display unit for displaying various information and an input unit for receiving input operations. An example of the display unit is a liquid crystal monitor. An example of the input unit is a keyboard, mouse, touch panel, various buttons, or a combination thereof. Information of input operations received by the operation unit 87 is transmitted to the control unit 85. The control unit 85 is configured to be able to comprehensively control the operation of each part constituting the substrate processing apparatus 1 in response to the input operations received by the operation unit 87.

[0094] The storage unit 89 includes, for example, at least one of ROM (Read-Only Memory), RAM (Random-Access Memory), and a hard disk. The storage unit 89 stores various conditions for the heating and cooling processes, and operation programs necessary for controlling the substrate processing apparatus 1. Each of the control units described above performs control based on the various conditions and operation programs.

[0095] The power supply unit 90 supplies electricity to the heater 54A for heating. The power supply unit 90 also supplies electricity to the first pin lifting mechanism 56, the second pin lifting mechanism 58, the local transport mechanism 59, the cover lifting mechanism 69, and the shutter lifting mechanism 70, for example, to drive electric motors. The power supply unit 90 also supplies electricity to turn on the functions of the temperature sensor 54B, the first pin lifting sensor 56A, the second pin lifting sensor 58A, the local transport sensor 59A, the cover lifting sensor 69A, and the shutter lifting sensor 70A.

[0096] <Configuration of the first connector group> The first junction connector 45 and the second junction connector 62 will be described with reference to Figure 10. Figure 10(a) shows the connection surface of the first junction connector. Figure 10(b) shows the connection surface of the second junction connector. Figures 5, 7, and 9 are also referred to as appropriate. Note that the first junction connector 45 and the second junction connector 62 in Figures 10(a) and 10(b) are diagrams for the sake of explanation.

[0097] The heat treatment unit 43 and the control unit 85 are connected by a first assembly connector 45 and a second assembly connector 62.

[0098] As shown in Figure 10(a), the first connector 45 collects a first connector group 44 consisting of multiple types of connectors 44A, 44B, 44C, and 44D connected to the heat treatment unit 43. Connectors 44A, 44B, 44C, and 44D are connected to each element that makes up the heat treatment unit 43.

[0099] The shapes of connectors 44A, 44B, 44C, and 44D are different from each other. This is because the objects to which connectors 44A, 44B, 44C, and 44D are connected are different from each other. However, the length of the first connector group 44 protruding to the left is the same for each, as shown in Figure 7. Similarly, the length of the second connector group 61 protruding to the right is the same for each. Therefore, the first connector group 44 and the second connector group 61 are connected at once.

[0100] As shown in Figure 10(a), the first assembly connector 45 includes a first frame 45a that brings together the first connector group 44. The first frame 45a is a rectangular plastic frame. The first frame 45a includes fixing parts 45b that secure each connector 44A, 44B, 44C, and 44D within the plastic frame. The connectors 44A, 44B, 44C, and 44D are inserted into and fixed to each fixing part 45b from right to left. Each fixing part 45b allows the connectors 44A, 44B, 44C, and 44D to be fixed and released with a single touch.

[0101] As shown in Figure 10(a), the first frame 45a has a pair of screw mounting portions 45c on each side at both ends in the front-rear direction, to which screws for fixing the first frame 45a to the heat treatment unit 43 are attached. In addition, the first frame 45a has a mating portion 45d on each side at both ends in the front-rear direction, which is used to mat the first connector group 44 and the second connector group 61 when they are connected. The mating portion 45d will be described later.

[0102] Specifically, for example, the end of the control cable connected to the heater 54A and temperature sensor 54B shown in Figure 9 is connected to the connector 44A shown in Figure 10(a). The end of the control cable connected to the first pin lifting mechanism 56 and the first pin lifting sensor 56A shown in Figure 9, the end of the control cable connected to the second pin lifting mechanism 58 and the second pin lifting sensor 58A, the end of the control cable connected to the local transport mechanism 59 and the local transport sensor 59A, the end of the control cable connected to the cover lifting mechanism 69 and the cover lifting sensor 69A, and the end of the control cable connected to the shutter lifting mechanism 70 and the shutter lifting sensor 70A are each connected to the connector 44B shown in Figure 10(a).

[0103] The end of the power cable connected to the heater 54A shown in Figure 9 is connected to connector 45C. The ends of the power cable connected to the first pin lifting mechanism 56, the end of the power cable connected to the second pin lifting mechanism 58, the end of the power cable connected to the local transport mechanism 59, the end of the power cable connected to the cover lifting mechanism 69, and the end of the power cable connected to the shutter lifting mechanism 70 are each connected to connector 44D shown in Figure 10(a). In addition, the ends of the power cable connected to the temperature sensor 54B shown in Figure 9, the end of the power cable connected to the first pin lifting sensor 56A, the end of the power cable connected to the second pin lifting sensor 58A, the end of the power cable connected to the local transport sensor 59A, the end of the power cable connected to the cover lifting sensor 69A, and the end of the power cable connected to the shutter lifting sensor 70A are each connected to connector 44D shown in Figure 10(a).

[0104] <Configuration of the second connector group> The second connector 62 collects the second connector group 61, which consists of multiple types of connectors 61A, 61B, 61C, and 61D connected to the device body casing 60.

[0105] As shown in Figure 10(b), the second assembly connector 62 includes a second frame 62a that brings together the second connector group 61. The second frame 62a is a rectangular plastic frame. The second frame 62a includes fixing parts 62b that secure each connector 61A, 61B, 61C, and 61D within the plastic frame. The connectors 61A, 61B, 61C, and 61D are inserted into and fixed to each fixing part 62b from left to right. Each fixing part 62b allows the connectors 61A, 61B, 61C, and 61D to be fixed and released with a single touch.

[0106] At both ends of the second frame 62a in the front-rear direction, there are screw mounting portions 62c to which screws for fixing the second frame 62a to the main body casing 60 of the device are attached. In addition, at both ends of the second frame 62a in the front-rear direction, there is one mating portion 62d on each side for mating the first connector group 44 and the second connector group 61 when they are connected. The mating portion 62d will be described later.

[0107] As shown in Figures 5 and 10(b), connectors 61A, 61B, 61C, and 61D are connected to connectors 44A, 44B, 44C, and 44D. The other ends of the cables connected to connectors 61A, 61B, 61C, and 61D are connected to the control unit 85 and the power supply unit 90. Specifically, the other ends of the cables connected to connectors 61A, 61B, 61C, and 61D are connected to the temperature control unit 86A, the first pin lifting / lowering control unit 86B, the second pin lifting / lowering control unit 86C, the local transport control unit 86D, the cover lifting / lowering control unit 86E, the shutter lifting / lowering control unit 86F, and the power supply unit 90, as shown in Figure 9.

[0108] Specifically, for example, the end of the control cable connected to the temperature control unit 86A shown in Figure 9 is connected to the connector 61A shown in Figure 10(b). The end of the control cable connected to the first pin lifting control unit 86B shown in Figure 9, the end of the control cable connected to the second pin lifting control unit 86C, the end of the control cable connected to the local transport control unit 86D, the end of the control cable connected to the cover lifting control unit 86E, and the end of the control cable connected to the shutter lifting control unit 86F are all connected to the connector 61B shown in Figure 10(b).

[0109] The end of the power cable for heating the heater 54A shown in Figure 9 is connected to the connector 61C shown in Figure 10(b). The ends of the power cables for driving the first pin lifting control unit 86B, the second pin lifting control unit 86C, the local transport control unit 86D, the cover lifting control unit 86E, and the shutter lifting control unit 86F shown in Figure 9 are connected to the connector 61D. In addition, the ends of the power cables for operating the temperature sensor 54B, the first pin lifting sensor 56A, the second pin lifting sensor 58A, the local transport sensor 59A, and the cover lifting sensor 69A are each connected to the connector 61D shown in Figure 10(b).

[0110] <Configuration of the connector mating section> The mating portion will be explained with reference to Figure 11. Figure 11(a) is a longitudinal cross-sectional view of the mating portion in the connected state, shown by line CC in Figure 5. Figure 11(b) is a longitudinal cross-sectional view of the mating portion in the disconnected state, shown by line DD in Figure 7. Figures 5 and 7 should also be referred to as appropriate.

[0111] As shown in Figure 11(a), the mating portion 45d and the mating portion 62d are mechanisms for mating the first connector group 44 and the second connector group 61. The mating portion 45d and the mating portion 62d are called the connector mating portion. As shown in Figure 7, the mating portion 45d is, for example, a mating recess 45d1 and a mating projection 45d2. The mating portion 45d has a mating recess 45d1 on its front end and a mating recess 45d2 on its rear end. The mating portion 62d has a mating recess 62d1 and a mating projection 62d2. The mating portion 62d has a mating projection 62d2 on its front end and a mating recess 62d1 on its rear end. Note that the connector mating portion corresponds to the second mating portion of the present invention.

[0112] As shown in Figure 11(b), when the heat treatment unit 43 is pushed into the main casing 60 of the device via the slider 49, the positions of the mating portion 45d and the mating portion 62d are aligned. In other words, when the heat treatment unit 43 is pushed into the main casing 60 of the device via the slider 49, the positions of the first assembly connector 45 and the second assembly connector 62 are aligned. Therefore, as shown in Figure 11(a), when the heat treatment unit 43 is housed in the housing portion 60B via the slider 49, the mating portion 45d and the mating portion 62d are mated. When the heat treatment unit 43 is housed in the housing portion 60B via the slider 49, the first connector group 44 and the second connector group 61 are mated.

[0113] The relationship between the fitting recess 45d1 and the fitting projection 62d2 is similar to that between a pencil cap and a pencil. That is, the fitting recess 45d1 has a cylindrical hole. The fitting projection 62d2 has a rod-shaped member. When the cylindrical hole is pushed in to the base of the rod-shaped member, the cylindrical hole and the rod-shaped member fit together tightly. The fitting recess 45d1 is also open at the tip end. This allows the gas inside the fitting recess 45d1, compressed by the fitting, to escape to the outside.

[0114] The relationship between the fitting projection 45d2 and the fitting recess 62d1 is the inverse of the relationship between the fitting recess 45d1 and the fitting projection 62d2. That is, the fitting projection 45d2 has a rod-shaped member. The fitting recess 62d1 has a cylindrical hole. When the rod-shaped member is pushed all the way into the cylindrical hole, the rod-shaped member and the cylindrical hole fit together tightly. The fitting recess 62d1 is also open at the tip end. This allows the gas inside the fitting recess 62d1 that has been compressed by fitting to escape.

[0115] <Configuration of the displacement prevention mechanism> The misalignment prevention recess 46 and the misalignment prevention protrusion 63 will be explained with reference to Figure 12. Figures 5 and 7 will also be referred to as appropriate. Figure 12(a) is a longitudinal cross-sectional view showing the connection between the alignment recess and the alignment protrusion, indicated by line EE in Figure 5. Figure 12(b) is a longitudinal cross-sectional view showing the disconnection between the alignment recess and the alignment protrusion, indicated by line FF in Figure 7. The misalignment prevention recess 46 and the misalignment prevention protrusion 63 together are referred to as the misalignment prevention mechanism.

[0116] The displacement prevention protrusion 63 is positioned on the bottom surface of the device body casing 60 so as to engage with the displacement prevention recess 46 when the heat treatment unit 43 is housed in the housing section 60B. The engagement of the displacement prevention recess 46 and the displacement prevention protrusion 63 prevents the heat treatment unit 43 and the device body casing 60 from shifting in the front-rear direction. The engagement between the displacement prevention recess 46 and the displacement prevention protrusion 63 may be looser than that of the fitting sections 45d and 62d.

[0117] The base side wall 43z1 is provided with a through hole 46a through which the projection 63a of the displacement prevention projection 63 passes. The tip of the projection 63a that has passed through the through hole 46a is located in the recess 46b of the displacement prevention recess 46. The recess 46b is U-shaped in recess in a right side view (not shown). Even if the displacement prevention projection 63 tries to shift in the front-rear direction relative to the displacement prevention recess 46, The forward and backward movement of the projection 63a is blocked by the through hole 46a and the recess 46b. This prevents the heat treatment unit 43 and the main casing 60 of the device from shifting in the forward and backward direction.

[0118] The misalignment prevention recess 46 and the misalignment prevention protrusion 63 are provided at two locations, sandwiching the first assembly connector 45 and the second assembly connector 62. This makes the system more resistant to misalignment in the front-to-back direction than a configuration where the misalignment prevention recess 46 and the misalignment prevention protrusion 63 are provided at only one location.

[0119] Furthermore, the misalignment prevention recess 46 and the misalignment prevention protrusion 63 also have the function of aligning the front-to-back position when the heat treatment unit 43 is housed in the housing 60B.

[0120] <Effects of the configuration in Example 1> As described above, the substrate processing apparatus 1 according to Embodiment 1 comprises a heat treatment unit 43 for performing a predetermined treatment on a substrate W, a housing section 60B for housing the heat treatment unit 43, and a device body frame 50 having multiple pairs of sliders 49 that support the heat treatment unit 43 so that it can be moved in and out, both inside and outside the housing section 60B. The heat treatment unit 43 is equipped with a first assembly connector 45 that collects a first connector group 44 consisting of multiple types of connectors 44A, 44B, 44C, and 44D connected to the heat treatment unit 43 side. The housing section 60B is equipped with a second assembly connector 62 that collects a second connector group 61 consisting of multiple types of connectors 61A, 61B, 61C, and 61D connected to the device body frame 50 side. The first assembly connector 45 and the second assembly connector 62 are configured such that the first connector group 44 and the second connector group 61 are connected together when the heat treatment unit 43 is housed in the housing section 60B via the sliders 49.

[0121] The substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 comprises a main apparatus frame 50. The main apparatus frame 50 has multiple pairs of heat treatment units 43, housing sections 60B, and sliders 49. The heat treatment units 43 apply heat treatment to the substrate W. The housing sections 60B house the heat treatment units. The sliders 49 support the heat treatment units 43 so that they can be easily moved in and out from both the inside and outside of the main apparatus frame 50. Furthermore, the heat treatment units 43 can be easily maintained by pulling them out from the housing sections 60B.

[0122] The heat treatment unit 43 is equipped with a first connector 45. The first connector 45 collects a first connector group 44 consisting of multiple types of connectors 44A, 44B, 44C, and 44D connected to the heat treatment unit 43. The housing section 60B is equipped with a second connector 62. The second connector 61 collects a second connector group 61 consisting of multiple types of connectors 61A, 61B, 61C, and 61D connected to the device body frame 50. The first connector 45 and the second connector 62 are configured such that the first connector group 44 and the second connector group 61 are connected together when the heat treatment unit 43 is housed in the housing section 60B via a slider 49.

[0123] In other words, since the heat treatment unit 43 is housed in the housing section 60B via the slider 49, the positions of the first assembly connector 45 and the second assembly connector 62 align precisely. If the positions of the first assembly connector 45 and the second assembly connector 62 align precisely, the positions of the first group of connectors 44 gathered at the first assembly connector 45 and the second group of connectors 61 gathered at the second assembly connector 62 align precisely. Therefore, even if the first group of connectors 44 and the second group of connectors 61 are composed of multiple types of connectors, it is easy to accurately connect the first group of connectors 44 and the second group of connectors 61.

[0124] Furthermore, the substrate processing apparatus 1 is equipped with a transport space 42 in which a substrate transport mechanism TR3 for transporting substrates W to the heat treatment unit 43 is located. The transport space 42 is located behind the slider 49, the first assembly connector 45 is located on the transport space 42 side of the heat treatment unit 43, and the second assembly connector 62 is located on the transport space 42 side of the housing section 60B. Therefore, since the first assembly connector 45 and the second assembly connector 62 are located behind the slider 49, it is easy to connect the first connector group 44 and the second connector group 61 when the heat treatment unit 43 is housed in the housing section 60B via the slider 49.

[0125] Furthermore, the substrate transport mechanism TR3 is equipped with a hand 47 for holding substrates, the main body frame 50 is equipped with a main body casing 60 that forms a housing section 60B, the main body casing 60 is equipped with an input / output port 60A for inserting the hand 47 into the heat treatment unit 43 at a position facing the transport space 42, and the first manifold connector 45 and the second manifold connector 62 are provided at positions that avoid the input / output port 60A. Therefore, the first manifold connector 45 and the second manifold connector 62 do not interfere with the hand 47 being inserted from the input / output port 60A.

[0126] Furthermore, it is preferable that the first manifold connector 45 and the second manifold connector 62 are located below the loading / unloading port 60A. Therefore, the space located below the loading / unloading port 60A is effectively utilized by the first manifold connector 45 and the second manifold connector 62.

[0127] Furthermore, the first assembly connector 45 and the second assembly connector 62 are equipped with connector mating portions (matting portions 45d, 62d) that are mated together when the heat treatment unit 43 is housed in the housing portion 60B via the slider 49. Therefore, it is easy to strengthen the connection between the first connector group 44 and the second connector group 61 in the first assembly connector 45 and the second assembly connector 62.

[0128] Furthermore, one first junction connector 45 and one second junction connector 62 are provided for each heat treatment unit 43. Therefore, the connection between the heat treatment unit 45 and the housing unit 60B can be consolidated into a single location.

[0129] Furthermore, the first connector group 44 is connected to the heating plate 54 that undergoes heat treatment in the heat treatment unit 43, and to the second pin lifting mechanism 58, local transport mechanism 59, local transport device 59, cover lifting mechanism 69, and shutter lifting mechanism 70 that assist the heating plate 54. Therefore, the connector connected to the heating plate 54 and the connectors connected to the second pin lifting mechanism 58, local transport mechanism 59, local transport device 59, cover lifting mechanism 69, and shutter lifting mechanism 70 can be consolidated into one location.

[0130] Furthermore, the second connector group 61 is connected to a control unit 85 that controls the heating plate 54, the second pin lifting mechanism 58, the local transport mechanism 59, the local transport device 59, the cover lifting mechanism 69, and the shutter lifting mechanism 70. Therefore, the connector for controlling the heating plate 54 and the connectors for controlling the second pin lifting mechanism 58, the local transport mechanism 59, the local transport device 59, the cover lifting mechanism 69, and the shutter lifting mechanism 70 can be combined into one location.

[0131] Furthermore, the second connector group 61 is connected to the power supply that drives the heater 54A, the second pin lifting mechanism 58, the local transport mechanism 59, the local transport device 59, the cover lifting mechanism 69, the shutter lifting mechanism 70, etc. Therefore, the connector connected to the power supply unit 90 that drives the heater 54A and the connector connected to the power supply unit 90 that drives the second pin lifting mechanism 58, the local transport mechanism 59, the local transport device 59, the cover lifting mechanism 69, and the shutter lifting mechanism 70 can be combined into one location.

[0132] Furthermore, the first connector group 44 and the second connector group 61 consist of connectors 44A, 44B, 44C, 44D and connectors 61A, 61B, 61C, 61D, each having multiple shapes. Therefore, even when the first connector group 44 and the second connector group 61 are composed of connectors 44A, 44B, 44C, 44D and connectors 61A, 61B, 61C, 61D with multiple shapes, it is easy to accurately connect the first connector group 44 and the second connector group 61.

[0133] Furthermore, the first connector 45 includes a first frame 45a that brings together the first connector group 44. The second connector 62 includes a second frame 62a that brings together the second connector group 61. Therefore, the positions of the first connector group 44 and the second connector group 61 are precisely aligned.

[0134] Furthermore, the main frame 50 of the apparatus includes a main casing 60 that forms a housing section 60B, and the heat treatment unit 43 is provided with a first screw hole 60W and a second screw hole 60X on the opposite side from the transport space 42 for tapping screws 60V that fix the heat treatment unit to the main casing 60. The first screw hole 60W and the second screw hole 60X allow for the operation of screwing the tapping screws 60V into the first screw hole 60W and the second screw hole 60X while the first connector group 44 and the second connector group 61 are connected. Therefore, if it is necessary to fix the heat treatment unit 43 more firmly to the main casing 60 while the first connector group 42 and the second connector group 61 are connected, the heat treatment unit 43 can be fixed to the main casing 60.

[0135] A method for installing a substrate processing apparatus 1, wherein a heat treatment unit 43 for applying heat treatment to a substrate W is installed inside the substrate processing apparatus 1, the substrate processing apparatus 1 comprises a heat treatment unit 43 for applying heat treatment to a substrate W, a housing section 60B for housing the heat treatment unit 43, and a device body frame 50 having a plurality of sliders 49 inside and outside the housing section 60B that support the heat treatment unit 43 so that it can be moved in and out. The heat treatment unit 43 is equipped with a first connector 45 that collects a first connector group 44 consisting of a plurality of types of connectors 44A, 44B, 44C, and 44D connected to the heat treatment unit 43. The housing section 60B is equipped with a second connector 62 that collects a second connector group 61 consisting of a plurality of types of connectors 61A, 61B, 61C, and 61D connected to the device body frame 50. When the heat treatment unit 43 is housed in the housing section 60B via the slider 49, the positions of the first assembly connector 45 and the second assembly connector 62 are aligned, and the first connector group 44 and the second connector group 61 are connected together. Therefore, by facilitating the installation of the processing unit 43 inside the substrate processing apparatus 1, the substrate processing apparatus 1 can be easily installed.

[0136] This invention is not limited to the above embodiments and can be modified and implemented as follows.

[0137] (1) In the above-described embodiment 1, a heat treatment unit 43 is used as an example of the processing unit of the present invention. However, the processing unit of the present invention is not limited to the heat treatment unit 43. The processing unit of the present invention may be a coating unit 41. In this case, the coating unit 41 is supported so as to be able to move back and forth relative to the main frame 50 of the apparatus, similar to the heat treatment unit 43. The coating unit 41 is equipped with a first assembly connector and a second assembly connector, similar to the heat treatment unit 43.

[0138] (2) In the above-described embodiment 1, the first manifold connector 44 and the second manifold connector 61 are located below the loading / unloading port 60A. However, the first manifold connector 44 and the second manifold connector 61 are not limited to being located below the loading / unloading port 60A, as long as they are in a position that avoids the loading / unloading port 60A. If there is space above the loading / unloading port 60A, for example, the first manifold connector 44 and the second manifold connector 61 may be located above the opening 60A.

[0139] (3) In the above-described embodiment 1, the mating portions 45d and 62d are provided on the first assembly connector 44 and the second assembly connector 61. However, the locations where the mating portions 45d and 62d are provided are not limited to the first assembly connector 44 and the second assembly connector 61. The mating portions 45d and 62d may also be provided directly on the heat treatment unit 43 and the main body casing 60 of the apparatus. The following explanation will be given with reference to Figure 13. Figure 13 is a cross-sectional view of the heat treatment unit pulled out from the housing according to the modified example 1. The mating portions 45x and 62x shown in Figure 13 are compared to the mating portions 45d and 62d.

[0140] As shown in Figure 13, the mating portion 45x is directly provided on the heat treatment unit 43. The mating portion 62x is directly provided on the main body casing 60 of the apparatus. The mating portions 45x and 62x are called the unit mating portion. The unit mating portion is the first mating portion of the present invention.

[0141] As shown in Figure 13, the fitting portion 45x is, for example, a fitting recess 45x1 and a fitting projection 45x2. The fitting portion 45x has a fitting recess 45x1 on the front end side and a fitting recess 45x2 on the rear end side. The fitting portion 62x is a fitting recess 62x1 and a fitting projection 62x2. The fitting portion 62x has a fitting projection 62x2 at the front end and a fitting recess 62x1 at the rear end. As a result, when the heat treatment unit 43 and the device body casing 60 are placed facing each other, the fitting portions 45x and 62x fit together.

[0142] The first and second connector 45 and 62 do not have mating portions 45x and 62x. As a result, the first and second connector 45 and 62 are less affected by the forces applied to the mating portions 45x and 62x. Therefore, the substrate processing apparatus 1 can be configured so that the mating portions 45x and 62x are more tightly fitted together. As a result, it is easy to strengthen the connection between the first connector group 44 and the second connector group 61 in the heat treatment unit 43 and the apparatus body casing 60.

[0143] Thus, the apparatus body casing 60 and the heat treatment unit 43 according to Modification 1 are fitted together by housing the heat treatment unit 43 in the housing section 60B via a slider 49. Therefore, it is easy to strengthen the connection between the first connector group 44 and the second connector group 61 in the heat treatment unit 43 and the apparatus body casing 60.

[0144] (4) In the above-described embodiment 1, only the transport arm 65 of the local transport mechanism 59 is located at the standby position 59P. However, the standby position 59P may also be equipped with a cooling plate for cooling the placed wafer W. The cooling plate is plate-shaped and is made of, for example, metal or ceramic. The cooling plate is provided with a circulation channel (not shown) inside which cooling water adjusted to a predetermined temperature (for example, 23°C) circulates. Cooling water is circulated in the circulation channel inside the cooling plate by an external pump. The cooling plate may also incorporate a Peltier element as a cooling mechanism.

[0145] The wafer W is cooled indirectly via the transport arm 65. Alternatively, the wafer W may be placed directly on a cooling plate. Furthermore, the transport arm 65 may have a cooling function similar to that of a cooling plate. In this case, a cooling plate may not be necessary. [Explanation of Symbols]

[0146] 1 ... Substrate processing equipment 31… Indexer Block 32 ... Processing block 33... Opener 34... Opener 35 ... Mounting platform 36…Opening 37…Hand 38 ... Reverse drive unit 39 ... Rotary drive unit 41 ... Coating unit 42 ... Transport space 42A ... Standby unit 43, 43A, 43B, 43C ... Heat treatment units 43p ... Unit bulkhead 43q…Bulkhead opening 43r ... Shutter component 43s ... Unit base 43z, 43z1~43z4 ... Base side wall 44 ...First connector group 44A, 44B, 44C, 44D ... connectors 45 ...First Assembly Connector 45a ...First frame 45b…Fixed part 45c ... Screw mounting part 45d…Mating part 45d1 ... Fitting recess 45d2 ... Fitting protrusion 46 ... Recess to prevent misalignment 46a...Through hole 46b ... recess 47, 47A, 47B ... Hand 48 ... Reverse drive unit 49 ... Rotary drive unit 49 ... Slider 49A...Proximal end 49B...Tip 49C…middle part 50 ... Main frame of the device 51...First movement mechanism 52...Second movement mechanism 54 ... Heating plate 54A ... Heater 54B ... Temperature sensor 55 ...First support pin 56 ...First pin lifting mechanism 56A ...1st pin lift sensor 57 ...Second support pin 58 ...Second pin lifting mechanism 58A ...Second pin lift sensor 59 ... Local transport mechanism 59A ... Local transport sensor 60 ...Device main casing 60A ... Loading / unloading 60B ... Storage area 60C…Lid part 60D ... Casing opening 60E ... gap 60V... self-tapping screws 60W ... First screw hole 60X ... Second screw hole 61 ...Second connector group 61A, 61B, 61C, 61D… connectors 62 ...Second Assembly Connector 62a ... 2nd frame 62b…Fixed part 62c ... Screw mounting part 62d ... Fitting part 62d1 ... Fitting recess 62d2 ... Fitting protrusion 63 ...Protrusion to prevent misalignment 63a...protrusion 64 ... Lifting member 65 ... Transport arm 66...hole 67 ... Lifting member 68...cover 69... Cover lifting mechanism 69A ... Cover lifting sensor 70 ... Shutter lifting mechanism 70A ... Shutter lifting sensor 71 ... Exhaust port 73 ... Arm drive mechanism 74… Proximity Ball 75…Slit 85 ... Control Unit 86A ... Temperature control unit 86B ...First pin lifting / lowering control unit 86C ...Second pin lift control unit 86D ... Local transport control unit 86E ... Cover lifting control unit 86F ... Shutter lifting control unit 90...Power supply section C... Career W... circuit board TR1~TR3 ... Circuit board transport mechanism PS1~PS2... Circuit board mounting section

Claims

1. A substrate processing apparatus for processing substrates, The substrate processing apparatus comprises a processing unit for performing a predetermined process on the substrate, a housing section for housing the processing unit, and a device body having a plurality of support mechanisms inside the housing section and outside the housing section that allow the processing unit to be moved in and out. The processing unit includes a first assembly unit that collects a first group of connectors consisting of multiple types of connectors connected to the processing unit side. The housing section includes a second assembly section that collects a second group of connectors consisting of multiple types of connectors connected to the main body of the device, The first and second assembly sections are configured such that the first and second connector groups are connected together when the processing unit is housed in the housing section via the support mechanism. A substrate processing apparatus characterized by the following:

2. In the substrate processing apparatus according to claim 1, The substrate processing apparatus includes a transport passage in which a substrate transport mechanism for transporting the substrate is arranged in the processing unit, The transport passage is located behind the support mechanism. The first collection unit is located on the transport passage side of the processing unit, The second collection unit is located on the transport passage side of the storage unit. A substrate processing apparatus characterized by the following:

3. In the substrate processing apparatus according to claim 2, The substrate transport mechanism includes a hand for holding the substrate, The device body comprises a device body casing that forms the housing section, The device body casing is provided with an inlet / outlet at a position opposite the transport passage for inserting the hand into the processing unit, The first and second collection sections are provided in positions that avoid the loading and unloading exits. A substrate processing apparatus characterized by the following:

4. In the substrate processing apparatus according to claim 3, The first and second collection sections are located below the loading / unloading exit sections. A substrate processing apparatus characterized by the following:

5. In the substrate processing apparatus according to claim 1, The device body comprises a device body casing that forms the housing section, The apparatus body casing and the processing unit are fitted together by a first fitting portion, which is formed when the processing unit is housed in the housing portion via the support mechanism. A substrate processing apparatus characterized by the following:

6. In the substrate processing apparatus according to claim 1, The first assembly and the second assembly are fitted together by the processing unit being housed in the housing via the support mechanism, which includes a second fitting portion. A substrate processing apparatus characterized by the following:

7. In the substrate processing apparatus according to claim 1, The first and second assembly units are provided one each for one processing unit. A substrate processing apparatus characterized by the following:

8. In the substrate processing apparatus according to claim 1, The first group of connectors is connected to a processing unit that performs the predetermined processing and to a plurality of auxiliary devices that assist the processing unit. A substrate processing apparatus characterized by the following:

9. In the substrate processing apparatus according to claim 1, The first assembly unit includes a first frame that brings together the first group of connectors, The second assembly comprises a second frame that brings together the second group of connectors. A substrate processing apparatus characterized by the following:

10. In the substrate processing apparatus according to claim 2, The device body comprises a device body casing that forms the housing section, The processing unit is provided with a fixing mechanism for fixing the processing unit to the main casing of the device on the side opposite to the transport passage, The fixing mechanism allows the processing unit to be fixed to the main casing of the device while the first connector group and the second connector group are connected. A substrate processing apparatus characterized by the following:

11. A method for installing a substrate processing apparatus, wherein a processing unit for performing a predetermined process on a substrate is installed inside the substrate processing apparatus, The substrate processing apparatus comprises a processing unit for performing a predetermined process on the substrate, a housing section for housing the processing unit, and a device body having a plurality of support mechanisms inside the housing section and outside the housing section that allow the processing unit to be moved in and out. The processing unit includes a first assembly unit that collects a first group of connectors consisting of multiple types of connectors connected to the processing unit, The housing section includes a second assembly section that collects a second group of connectors consisting of multiple types of connectors connected to the main body of the device, When the processing unit is housed in the housing section via the support mechanism, the positions of the first assembly section and the second assembly section are aligned, and the first connector group and the second connector group are connected together. A method for installing a substrate processing apparatus, characterized by the following features.

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