Wafer inspection system and method

Abstract

To provide a wafer inspection system capable of inspecting the position, moving speed and transport process of a wafer box in real time. [Solution] The wafer inspection system of the present invention combines optical and waveband spectral waves to construct omnidirectional optical and millimeter-wave noise scan images. The wafer inspection system includes an optical inspection unit located at a first position relative to the wafer movement path and performing optical imaging of the wafer, a waveband inspection unit located at a second position relative to the wafer movement path and performing spectral imaging of the wafer, and an inspection and analysis unit signal-connected to the optical inspection unit and the waveband inspection unit and performing inspection and arithmetic analysis based on the optical imaging information and the spectral imaging information.

Description

[Technical Field]

[0001] The present invention relates to the field of wafer inspection, and more particularly to a system and method for inspecting wafers. [Background technology]

[0002] In wet slot cleaning equipment, it is particularly important to achieve high-efficiency wafer transport per unit time. Taking a slot-type cleaning equipment as an example, the mechanical wafer transport device is the wafer transport system, and the equipment consisting of the wafer transport and guide plate module must ensure high-efficiency wafer transport during actual wafer transport. During the wafer or wafer box transport process, the transport is usually carried out through the connecting operation of a specific transport process. During the transport process, the following two practical situations are encountered:

[0003] (1) The supply wafer box is replaced with a cleaning wafer box, and cleaning is performed. (2) Wafers in the supply wafer box are taken out in batches and cleaned.

[0004] In either of the above two situations, it is necessary to maintain the state of the wafers inside the wafer box and to be able to control the operation of the transfer process in a coordinated manner.To prevent the wafer box from being subjected to various external forces due to shaking and causing damage, it is necessary to measure the number of wafers in the wafer box and to detect the position of the wafer box during the transfer process.

[0005] In the conventional design, multiple sensors are mounted on the transfer platform, but it is difficult to inspect the specific position of the wafer box during transfer, the moving speed, and phenomena such as wafer misalignment, damage, or missing wafers. Summary of the Invention [Problem to be solved by the invention]

[0006] In order to solve the above problems, the present invention aims to provide a wafer inspection system and method that can detect the specific movement position and speed of a wafer box during transport, as well as whether or not there is any misalignment or missing wafers. [Means for solving the problem]

[0007] The wafer inspection system provided in the first aspect of the present invention employs the following technical configuration.

[0008] The wafer inspection system combines optical technology with spectral band waves (specifically millimeter waves) to construct an omnidirectional optical and millimeter wave noise scanning image, and includes the following components:

[0009] Optical inspection unit: Provided at a first position relative to the wafer movement path, it performs optical imaging of the wafer.

[0010] Waveband inspection unit: Located at a second position relative to the wafer movement path, it performs spectral imaging of the wafer.

[0011] Inspection and analysis unit: Signal-connected to the optical inspection unit and the waveband inspection unit, it uses optical image information and spectrum image information to perform inspection and calculation analysis, inspects the wafer state, and obtains the real-time wafer state.

[0012] Preferably, the wafer inspection system may further include: Motion control unit: controls the movement of the wafer according to a predetermined program.

[0013] The inspection and analysis unit is electrically connected to the motion control unit, acquires a set program for the wafer's motion, and compares it with the inspected real-time wafer state to monitor the wafer for abnormalities.

[0014] Preferably, the wafer inspection coverage includes inspection of real-time operation of the wafer, wafer transport device, and wafer gripper, where real-time operation includes: The wafer transport device performs flat transport with a single operation, flat transport with multiple operations, vertical movement transport, transport with wafer guide plate operation, and transport with wafer gripping operation.

[0015] Preferably, the inspection range of the wafer may include a first inspection range, a second inspection range, and a third inspection range.

[0016] First inspection scope: Identifying the real-time operational position of the wafer, including wafer misalignment, deviation and missing.

[0017] Second inspection area: Identification of real-time operating position of wafer carrier, including carrier misalignment, deviation and missing, height and relative moving speed.

[0018] The third inspection area: identifying the real-time operating position of the wafer gripper, including the gripper's deviation, shift and missing, height and relative moving speed.

[0019] Preferably, the optical inspection unit may include the following components: Integrated light receiving module: A component for receiving light, changing its direction, and guiding it. Light source integration module: A configuration that integrates the guided light and performs optical scanning on the wafer. Optical probe integration module: inspects the optical signal after optical scanning the wafer, and feeds it back to the inspection and analysis unit.

[0020] Preferably, the waveband inspection unit may include: Waveband emission end: Transmits millimeter waves in the X, Y, and Z axis directions to construct an omnidirectional spatial spectrum scan. Waveband Probe Integration Module: After waveband scanning of the wafer, it inspects the reflected and transmitted millimeter waves and feeds back the results to the inspection and analysis unit.

[0021] Preferably, the wafer inspection system further includes a wafer transport platform having a hollow support in the center thereof for supporting the wafer transport device, and the light-receiving integrated module and the light-source integrated module are disposed symmetrically on both sides of the hollow support at the bottom of the wafer transport platform.

[0022] Preferably, the light-receiving integrated module and the light-source integrated module receive and guide light by vertical movement and rotational swing, respectively.

[0023] Preferably, the wafer transport platform is provided with a positioning block corresponding to the support portion, and the block positions the wafer transport device.

[0024] Preferably, the positioning block is provided with an inspection sensor for inspecting whether the wafer carrier is correctly positioned on the positioning legs.

[0025] Preferably, the first position and the second position are both located on the same side of the wafer transfer path.

[0026] Preferably, the second position is arranged along at least one of the X-axis, Y-axis and Z-axis directions, and transmits millimeter waves to the wafer to perform a spectrum scan.

[0027] A second aspect of the present invention provides a wafer inspection method including the following steps.

[0028] Step S1 An optical inspection unit performs optical imaging of the wafer at a first position relative to the wafer, and a waveband inspection unit performs spectral imaging of the wafer at a second position relative to the wafer.

[0029] Step S2 An inspection and analysis unit performs inspection and computational analysis on the optical imaging and the spectral imaging to inspect the wafer and obtain a real-time state of the wafer.

[0030] Preferably, step S1 may be configured as follows. The optical emitting end emits light in the X, Y and Z directions. The integrated light receiving module receives, redirects and guides the light. A light source integration module aggregates the guided light rays. An optical probing integration module inspects the optical signal after optically scanning the wafer.

[0031] Preferably, step S1 may be configured as follows. The waveband emission end emits millimeter waves in the X-axis, Y-axis, and Z-axis directions. The integrated optical receiver module receives the millimeter waves, redirects them, and guides them. The light source integration module aggregates the guided millimeter waves. The integrated waveband probing module inspects millimeter waves after spectral scanning of the wafer.

[0032] Preferably, the wafer inspection method may further include the following steps. An inspection and analysis unit monitors wafer anomalies by obtaining a set program for wafer operation and comparing it with the inspected real-time wafer state. [Effects of the Invention]

[0033] According to the present invention, the wafer box and wafers can be inspected by using optical and spectral technologies in cooperation, which allows the position, movement speed, and movement process of the wafer box to be accurately inspected in real time, and further allows the deviation of the three-dimensional position or movement of the wafer box and wafers, as well as the presence or absence of wafer damage, to be inspected in real time. [Brief explanation of the drawings]

[0034] [Figure 1] 1 is a schematic diagram illustrating a positional relationship between a light-receiving integrated module and a light-source integrated module in a wafer inspection system according to an embodiment of the present invention. [Figure 2] 1 is a schematic diagram illustrating the up and down movement of a light-receiving integrated module and a light-source integrated module in a wafer inspection system according to an embodiment of the present invention. [Figure 3] 1 is a schematic diagram illustrating the rotational operation of a light-receiving integrated module and a light-source integrated module in a wafer inspection system according to an embodiment of the present invention. [Figure 4] 1 is a schematic diagram showing the structure of an integrated light-receiving module in a wafer inspection system according to an embodiment of the present invention. [Figure 5] 1 is a schematic diagram illustrating the structure of a light source integration module in a wafer inspection system according to an embodiment of the present invention. [Figure 6] FIG. 1 is a schematic diagram of optical inspection in a wafer inspection system according to an embodiment of the present invention. [Figure 7] 1 is a schematic diagram of a waveband inspection in a wafer inspection system according to an embodiment of the present invention. [Figure 8] FIG. 1 is a schematic diagram illustrating the integration of optical inspection and waveband inspection in a wafer inspection system according to an embodiment of the present invention. [Figure 9] 1 is a schematic diagram of an inspection path in a wafer inspection system according to an embodiment of the present invention. [Figure 10]1 is a schematic diagram of a waveband inspection in a wafer transport scene in a wafer inspection system according to an embodiment of the present invention; [Figure 11] FIG. 10 is a schematic diagram of waveband inspection in another wafer transfer scene in the wafer inspection system according to an embodiment of the present invention. [Figure 12] FIG. 10 is a schematic diagram of waveband inspection in yet another wafer transfer scene in the wafer inspection system according to an embodiment of the present invention. [Figure 13] 1 is a diagram illustrating the principle of waveband inspection in a wafer inspection system according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0035] Hereinafter, the technical configuration of an embodiment of the present invention will be clearly and completely described with reference to Figures 1 to 13. However, the embodiment described below is merely an example of the present invention and does not limit all embodiments of the present invention. In one embodiment of the wafer inspection system according to the present invention, optical and frequency bands (particularly mm-wave) are combined to construct an omnidirectional optical and mm-wave noise scan image. The system includes the following components:

[0036] Optical inspection unit: Provided at a first position with respect to the moving path of the wafer 5, and performs optical imaging of the wafer 5.

[0037] Waveband inspection unit: Provided at a second position with respect to the moving path of the wafer 5, and performs spectral imaging on the wafer 5.

[0038] Inspection and analysis unit: Signal-connected with the optical inspection unit and the waveband inspection unit, it acquires optical and waveband image information, performs inspection and calculation processing, and inspects the wafer 5 and acquires its real-time status.

[0039] Motion control unit: controls the movement of the wafer 5 based on a set program.

[0040] In addition, the inspection and analysis unit is electrically connected to the motion control unit, and monitors abnormalities in the wafer 5 by obtaining a program regarding the operation of the wafer 5 and comparing it with the state of the inspected wafer 5 in real time.

[0041] The optical inspection unit performs optical inspection and imaging of the wafer 5, and the waveband inspection unit performs spectral inspection and imaging of the wafer 5. The inspection analysis unit inspects the state of the wafer 5 based on the optical imaging information and spectral imaging information, and performs computational analysis to obtain the real-time state of the wafer 5.

[0042] Furthermore, the inspection and analysis unit acquires a set program for the movement of the wafer 5 and compares it with the state of the inspected wafer 5 in real time, thereby monitoring the wafer 5 for abnormalities.

[0043] The scope of wafer inspection in this wafer inspection system includes inspection of real-time operations of the wafer 5, wafer transport device, and wafer gripping device, where real-time operations include single-motion planar transport of the wafer transport device, multi-motion planar transport, vertical transport, transport with guide plate movement of the wafer 5, and transport with gripping movement of the wafer 5.

[0044] Furthermore, the scope of inspection is divided into the following three categories: First inspection range: real-time motion positioning of the wafer 5, including deviation, shift and missing of the wafer 5 (see FIG. 5).

[0045] The second inspection range is the real-time operational positioning of the wafer transport device, including deviation, shift and missing, the height of the transport device and the relative moving speed (see Figures 7, 9 and 10).

[0046] The third inspection range: real-time operational positioning of the wafer gripping device, including the deviation, shift and missing of the gripping position, the height and relative moving speed of the gripping device (see Figures 11 and 12).

[0047] 1 to 6, an optical inspection unit according to the present invention includes: Optical emission end: Emits light sources in the X, Y, and Z axis directions to form an omnidirectional spatial optical scan. Integrated light receiving module 1: It can be raised and lowered and rotated, and receives light, changes its direction, and guides it. Light source integration module 2: This module is capable of moving up and down and rotating, and it aggregates guided light beams to perform optical scanning on the wafer 5.

[0048] The light-receiving-integrated module 1 includes a first negative meniscus lens 11, a biconvex positive lens 12, and a second negative meniscus lens 13, which are arranged in this order along the direction of light incidence. The light-receiving-integrated module 1 receives light from the light-source-integrated module 2, and these three lens groups receive and condense the light before outputting it to the light-source-integrated module 2, thereby improving the scanning and imaging effect of the wafer 5.

[0049] The light source integrated module 2 includes a light guide plate 21 that can be rotated at a small angle, an optical grating and filter 22, and a shutter and diaphragm structure 23. The light guide plate 21 is arranged in a position where the incident light travels in a straight line, and is movable and rotatable, and guides the light to make it enter the optical grating and filter 22, which receives the light. The optical grating and filter 22 is positioned perpendicular to the light guide plate 21 and filters and modulates the light to improve imaging performance and also guide the light.

[0050] The optical grating and filter 22 can be rotated and translated, thereby adjusting the angle and position of the light incident thereon to achieve an arc-shaped scan of the wafer 5. This allows scanning and inspection of different positions on the wafer 5.

[0051] The shutter and aperture structure 23 is disposed above the optical grating and filter 22 and corresponds to the hollow position. The arc-shaped scanning area of ​​the light is parallel to the wafer 5, and the light finally passes through the shutter and aperture structure 23 to scan and inspect the wafer 5.

[0052] The light is guided by the light guide plate 21, then filtered and transmitted by the optical grating and filter 22, and finally passes through the shutter and aperture structure 23 to perform an arc-shaped scan on the wafer 5, scanning the image information on the wafer 5 in the wafer box 6 from all directions.

[0053] The wafer inspection system may further include a wafer transport platform 3. The wafer transport platform 3 has a hollow support position in the center, which is used to support a wafer transport device.

[0054] A positioning block 4 is provided corresponding to the support position of the wafer transport platform 3, and the positioning block 4 is used to position a wafer transport device (for example, a wafer box 6).

[0055] The positioning block 4 is provided with an inspection sensor that inspects whether the wafer carrier is correctly positioned on the positioning legs of the positioning block 4 .

[0056] The integrated light-receiving module 1 and the integrated light-source module 2 are arranged symmetrically on either side of the hollow space at the bottom of the wafer transport platform 3. The optical fiber from the integrated light-source module 2 passes through the hollow space of the wafer transport platform 3 and enters the wafer transport device to inspect the wafer 5.

[0057] Furthermore, the optical inspection unit may include an optical probing integration module, which is responsible for inspecting the optical signal after optical scanning of the wafer 5 and feeding it back to the inspection and analysis unit.

[0058] The light receiving integrated module 1 receives light and guides it to the light source integrated module 2, which then collects the guided light beams to perform optical scanning of the wafer 5. The optical detection integrated module inspects the optical signal after the optical scanning of the wafer 5 and feeds it back to the inspection and analysis unit, which then analyzes the optical image information.

[0059] Referring to FIGS. 7 to 13, the waveband inspection unit has the following configuration. Waveband emission end: Arranged in at least one direction of the X-axis, Y-axis, and Z-axis, it emits millimeter waves in each direction to form a waveband scan of the omnidirectional space.

[0060] Waveband detection integrated module (receiving end): inspects the millimeter wave after waveband scanning on the wafer 5 and feeds back to the inspection analysis unit.

[0061] The waveband inspection unit can be installed at any position on the transport path of the wafer 5 as needed. For example, as shown in Fig. 7, the waveband inspection unit is installed on the side of a wafer transport platform having multiple wafer support positions, and inspects the dynamic states of the wafer box 6 and the wafer 5 from the side as the wafer 5 is transported between the multiple support positions.

[0062] As shown in FIGS. 11 and 12, the waveband inspection unit is disposed above the transfer position of the wafer 5, and inspects the movement operations of the wafer 5, such as guiding and gripping, by utilizing the spatial positional relationship.

[0063] Preferably, the optical inspection unit is disposed at a first position relative to the movement path of the wafer 5, and the waveband inspection unit is disposed at a second position relative to the movement path of the wafer 5. The first position and the second position may both be on the same side of the transport path of the wafer 5, or may each be provided on a different side of the transport path.

[0064] Accordingly, the present invention also provides a wafer inspection method including the following steps.

[0065] Step S1: The optical inspection unit performs optical imaging on the wafer 5 at a first position. The optical emission end emits light in the X, Y and Z directions. The integrated light receiving module 1 receives light, changes its direction, and guides it. The light source integration module 2 aggregates the guided light rays. The optical detection integrated module inspects the optical signal after optical scanning of the wafer 5.

[0066] The waveband inspection unit performs spectral imaging at a second position relative to the wafer 5 . The waveband emitter emits millimeter waves in the X, Y and Z directions. The integrated optical receiver module 1 receives the millimeter waves, changes their direction, and guides them. The light source integration module 2 aggregates the guided millimeter waves. The integrated waveband detection module inspects millimeter waves after waveband scanning of the wafer 5.

[0067] The emission of the light source from the optical emission end and the emission of the millimeter wave from the waveband emission end can be performed simultaneously regardless of the time order, thereby enabling imaging of the wafer 5.

[0068] Step S2: The inspection and analysis unit performs inspection and calculation analysis based on the optical image and the spectral image to inspect the state of the wafer 5 and obtain the real-time state.

[0069] The inspection and analysis unit acquires the setting program for the operation of the wafer 5 and compares it with the real-time state to monitor for abnormalities in the wafer 5.

[0070] <Operating principle> The transfer mechanism transfers a wafer box 6 loaded with wafers 5 onto the wafer transfer platform 3. The wafer box 6 can be placed at a wafer support position. The light receiving integrated module 1 of the optical inspection unit receives, redirects and guides the light, the light source integrated module 2 concentrates the guided light beam, and the optical detection integrated module inspects the optical signal after optical scanning of the wafer 5.

[0071] The waveband emission terminal of the waveband inspection unit emits millimeter waves to the target inspection position, and the millimeter wave noise generated by reflection or scattering from the target is fed back to the waveband detection integrated module (receiving terminal), so that the waveband inspection of the target is performed.

[0072] The integrated optical detection module inspects the optical signal after the optical scanning of the wafer 5, and the integrated waveband detection module inspects the millimeter wave after the scanning of the wafer 5. The inspection and analysis unit analyzes the optical image and the spectral image to obtain the status of the wafer 5 in real time, thereby inspecting the deviation of the three-dimensional position and movement of the wafer box 6 and the wafer 5, and whether the wafer 5 is damaged.

[0073] In the wafer inspection method according to the present invention, the wafer 5 can be inspected using either optical inspection or waveband inspection alone, but it is also possible to combine the two for a multifaceted and comprehensive inspection. When using this combined method, the optical inspection and waveband inspection can be performed simultaneously within the same transport process, or they can be performed one after the other. Furthermore, a separate operation is also possible, where optical inspection is performed in one transport process and waveband inspection is performed in another transport process.

[0074] As will be apparent to those skilled in the art, the present invention is not limited to the details of the above-described embodiments, and may be embodied in other specific forms without departing from the spirit or essential characteristics of the present invention. Accordingly, the embodiments described herein are merely illustrative and not limiting. The scope of the present invention is defined by the appended claims, and all changes that fall within the scope of the equivalents of the claims should be construed as being within the scope of the present invention. Furthermore, the reference numerals in the accompanying drawings used in the claims should not be construed as limiting the technical scope of the present invention. [Explanation of symbols]

[0075] 1: Integrated light receiving module 11: First negative meniscus lens 12: Biconvex positive lens 13: Second negative meniscus lens 2: Light source integration module 21: Light guide plate 22: Optical lattices and filters 23: Shutter and aperture structure 3: Wafer transport platform 4: Positioning block 5: Wafer 6: Wafer box

Claims

1. 1. A wafer inspection system that combines optics and waveband spectrum waves to construct an omnidirectional optical and millimeter-wave noise scan image, comprising: The apparatus includes an optical inspection unit, a waveband inspection unit, and an inspection and analysis unit, the optical inspection unit is located at a first position relative to a movement path of the wafer (5) and performs optical imaging of the wafer (5); the waveband inspection unit is provided at a second position relative to the movement path of the wafer (5) and performs spectral imaging of the wafer (5); The inspection and analysis unit is signal-connected to the optical inspection unit and the waveband inspection unit, and performs inspection and arithmetic analysis using optical image information and spectral image information, thereby inspecting the wafer (5) and acquiring its real-time status.

2. a motion control unit; The motion control unit controls the movement of the wafer (5) based on a predetermined program; 2. The wafer inspection system of claim 1, wherein the inspection and analysis unit is electrically connected to the motion control unit, acquires a setting program regarding the operation of the wafer (5), and compares it with a real-time state to monitor abnormalities in the wafer (5).

3. Inspecting the wafer (5) includes inspecting real-time operation of the wafer (5), the wafer transport device, and the wafer gripping device; 2. The wafer inspection system of claim 1, wherein the real-time operations include single-motion planar transport, multiple-motion planar transport, vertical transport, guide plate movement and gripping movement of the wafer (5) by a wafer transport device.

4. The inspection range for the wafer (5) includes a first inspection range, a second inspection range, and a third inspection range; The first inspection range includes real-time motion positioning, misalignment, deviation and missing of the wafer (5); The second inspection range includes real-time operational positioning, deviation, shift and missing, height and relative movement speed of the wafer transport device; 2. The wafer inspection system of claim 1, wherein the third inspection range includes real-time motion positioning, gripping deviation, deviation and missing, height and relative movement speed of the wafer gripping device.

5. The optical inspection unit includes: an integrated light receiving module (1) that receives light, changes its direction, and guides it; a light source integration module (2) that aggregates the guided light beams and performs optical scanning on the wafer (5); 4. The wafer inspection system of claim 3, further comprising an optical probing integration module for inspecting the optical signal after optical scanning of the wafer (5) and feeding it back to the inspection and analysis unit.

6. The waveband inspection unit includes: a waveband emission end that emits millimeter waves in X-axis, Y-axis, and Z-axis directions to form an omnidirectional spatial scan; 6. The wafer inspection system of claim 5, further comprising: a waveband probing integration module for inspecting millimeter waves after waveband scanning on the wafer (5) and feeding the millimeter waves back to the inspection analysis unit.

7. a wafer transport platform (3) having an intermediate hollow support position for supporting the wafer transport device; 6. The wafer inspection system of claim 5, wherein the light-receiving integrated module (1) and the light-source integrated module (2) are symmetrically arranged on the bottom of the wafer transport platform (3).

8. 8. The wafer inspection system according to claim 7, wherein the light-receiving integrated module (1) and the light-source integrated module (2) receive and guide light by vertical movement and rotational swing.

9. 8. The wafer inspection system according to claim 7, wherein a positioning block (4) is provided corresponding to a support position of the wafer transport platform (3) and is used to position a wafer transport device.

10. 10. The wafer inspection system of claim 9, wherein the positioning block (4) is provided with an inspection sensor for inspecting whether the wafer transport device is positioned on the positioning legs of the block.

11. 2. The wafer inspection system of claim 1, wherein the first and second locations are located on the same side of a transport path for the wafer (5).

12. 2. The wafer inspection system of claim 1, wherein the second position is arranged along at least one of an X-axis, a Y-axis, and a Z-axis, and emits millimeter waves toward the wafer (5) to perform a spectrum scan.

13. Step S1: an optical inspection unit performs optical imaging on a wafer (5) at a first position, and a waveband inspection unit performs spectral imaging on the wafer (5) at a second position; Step S2: The inspection and analysis unit inspects and calculates and analyzes the optical image information and the spectral image information to obtain the real-time status of the wafer (5); A wafer inspection method comprising:

14. In step S1, the optical emission end emits the light source in the X-axis, Y-axis, and Z-axis directions; The integrated light receiving module (1) receives light, redirects it, and guides it; The light source integration module (2) aggregates the guided light beams; an optical probe integrated module inspecting the optical signal after optical scanning of the wafer (5); 14. The wafer inspection method of claim 13, comprising:

15. In step S1, The waveband emission end emits millimeter waves in the X-axis, Y-axis, and Z-axis directions; The integrated optical receiving module (1) receives millimeter waves, changes their direction, and guides them; The light source integration module (2) aggregates the guided millimeter waves; a waveband probe integrated module for inspecting the millimeter wave after scanning the wafer (5); 14. The wafer inspection method of claim 13, comprising:

16. 14. The method of wafer inspection of claim 13, further comprising: The inspection and analysis unit acquires a setting program for the operation of the wafer (5), compares it with a real-time state, and monitors abnormalities of the wafer (5); 14. The wafer inspection method of claim 13, further comprising:

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