Multiple input / output antenna device

Abstract

A multiple input / output antenna device is provided that can prevent an increase in the unit cost of manufacturing a product due to automation and simplification of the manufacturing process of the product. [Solution] The multiple input / output antenna device includes a main board stacked with its back surface tightly attached to the inner surface of a heat dissipation housing, a sub-board stacked with its front or back surface tightly attached to the main board, a first heat-generating element mounted only on the main board of the main board and the sub-board, and mounted only on the back surface of the main board, which is the side where a number of heat dissipation fins are provided on the outer surface of the heat dissipation housing, and a second heat-generating element mounted only on the sub-board of the main board and the sub-board, and mounted only on the back surface of the sub-board, which is the side where a number of heat dissipation fins are provided on the outer surface of the heat dissipation housing.

Description

[Technical Field]

[0001] The present invention relates to a massive multi-input and multi-output antenna apparatus, and more particularly to a massive multi-input and multi-output antenna apparatus that can directly mount a heat-generating element, which is an RF element, on the back surface of a sub-board, thereby reducing the need for a separate processing step for heat dissipation and reducing the overall manufacturing cost of the product. [Background technology]

[0002] Wireless communication technology, for example, MIMO (Multiple-Input Multiple-Output) technology, is a technology that dramatically increases data transmission capacity by using multiple antennas. It is a spatial multiplexing technique in which a transmitter transmits different data through each transmitting antenna, and a receiver separates the transmitted data through appropriate signal processing.

[0003] Therefore, by simultaneously increasing the number of transmitting and receiving antennas, channel capacity increases, allowing for the transmission of more data. For example, increasing the number of antennas to 10 will secure approximately 10 times the channel capacity using the same frequency band compared to the current single antenna system. In the case of a transmitting / receiving device that applies this MIMO technology, as the number of antennas increases, the number of transmitters and filters also increases.

[0004] In particular, the main housing has a number of boards (e.g., a PBA (Printed Board Assembly) closely arranged on the rear side of the installation space of the main housing, an antenna board stacked a predetermined distance in front of the PBA, and a PSU board arranged on one side of the PBA or antenna board) stacked thereon, and is also provided with a number of RF power supply network elements and RF filters that generate a large amount of operating heat during operation.

[0005] In the case of conventional multiple input / output antenna devices, a large amount of drive heat generated inside the main housing during operation must be effectively dissipated to the outside of the main housing (especially the rear).To achieve this, a heat-generating element is mounted on the front of the PBA, and then a number of via holes are drilled through to the rear of the PBA, where the heat-generating element is mounted, or a heat-transfer coin is installed at a position corresponding to the number of via holes, thereby dissipating heat.

[0006] However, since PBAs are generally made of substrate materials with low thermal conductivity, the structure that dissipates heat through via holes has low heat dissipation efficiency due to the small contact area between the heat-generating element and the via holes, and the heat dissipation structure using heat transfer coins also has the problem of reduced heat dissipation effectiveness due to contact tolerances on the contact surface with the heat-generating element. Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention has been devised to solve the above technical problems, and its object is to provide a multiple input / output antenna device that allows direct mounting of a heat-generating element, which is an RF element, on the back surface of a sub-board, thereby reducing the need for a separate processing step for heat dissipation and reducing the overall manufacturing cost of the product.

[0008] The technical problems of the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0009] A multiple-input / output antenna device according to one embodiment of the present invention includes a main board stacked so that its back surface is in close contact with the inner surface of a heat dissipation housing; a sub-board stacked so that it is in close contact with the front or back surface of the main board; a first heating element mounted only on the back surface of both sides of the main board that is in contact with the inner surface of the heat dissipation housing; and a second heating element mounted only on the back surface of both sides of the sub-board that is in contact with the inner surface of the heat dissipation housing.

[0010] Here, the first and second heating elements may be connected to corresponding points formed on the rear surfaces of the main board and the sub-board, respectively, by a brazing bonding method using solder paste pre-applied on the surfaces to be bonded to each other.

[0011] The main board may be an integrated one-board formed by joining together multi-layers stacked on the front and rear sides, and the sub-board may be a double-sided PCB.

[0012] Also, the first heating element may be connected to a number of signal contact points implemented through multiple layers of the main board, and may be employed as a digital element capable of controlling a number of digital signals.

[0013] In addition, the second heating element can be employed as an analog element whose RF characteristics are maintained by the dielectric constant of the double-sided PCB, which has a dielectric material having a different dielectric constant from the multi-layer layer of the main board applied to both sides.

[0014] In addition, the first heating element may be a digital element, and may be divided into an electrical signal connection surface (hereinafter referred to as the "signal connection surface") having a plurality of signal connection points and a heat dissipation surface where operating heat is concentrated and dissipated, and the signal connection surface may be formed on a front surface mounted to be closely attached to the rear surface of the main board, and the heat dissipation surface may be formed on a rear surface opposite to the front surface.

[0015] In addition, the second heating element may be an analog element, and may be divided into an electrical signal connection surface (hereinafter referred to as the "signal connection surface") having a plurality of signal connection points and a heat dissipation surface where operating heat is concentrated and dissipated, and the signal connection surface may be formed on a front surface mounted to be closely attached to the rear surface of the sub-board, and the heat dissipation surface may be formed on a rear surface opposite to the front surface.

[0016] Also, the corresponding points formed on the main board and the sub-board may be formed at positions corresponding to a plurality of signal connection points of the first heating element or the second heating element.

[0017] Furthermore, when the sub-board is placed on the front side of the main board, a heat dissipation through-hole that penetrates in the front-to-rear direction may be formed in the portion of the main board corresponding to the portion where the second heat generating element is mounted.

[0018] In addition, when the surface to which the back surface of the main board is in contact is assumed to be a reference surface, the heat dissipation housing may be grooved so as to recess rearward relative to the reference surface to accommodate the first heat generating element and the second heat generating element mounted on the back surface of the sub-board stacked on the back surface of the main board, and may be formed with a heat dissipation groove portion to which the back surfaces of the first heat generating element and the second heat generating element are thermally bonded, and a heat dissipation protrusion portion that protrudes forward through the heat dissipation through hole relative to the reference surface to which the back surface of the second heat generating element mounted on the back surface of the sub-board stacked on the front surface of the main board is thermally bonded.

[0019] A heat dissipation interface material may be interposed between the rear surface of the first or second heat dissipation element and the front surface of the heat dissipation groove or the heat dissipation protrusion.

[0020] The heat dissipation interface material may include at least one of thermal grease, a graphite sheet, a heat pipe, a heat spreader, and a vapor chamber.

[0021] The board may further include an elastic pressing portion that elastically presses the sub-board toward the main board. [Effects of the Invention]

[0022] The multiple input / output antenna device according to an embodiment of the present invention can achieve the following various effects.

[0023] First, since the second heating element, which is an RF element, can be mounted directly on the back of the sub-board, there is no need to process a separate heat transfer bridge hole for heat dissipation, which simplifies the manufacturing process of the product.

[0024] Second, the stacking method of the sub-board on the main board and the mounting method of the second heating element via the signal connection surface of the sub-board can be replaced by an automated process, which has the effect of preventing an increase in the overall manufacturing cost of the product. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a perspective view illustrating an embodiment of a multiple input / output antenna device according to the present invention; [Figure 2] FIG. 2 is an exploded perspective view of FIG. 1. [Figure 3] 2A and 2B are front and rear views of a main board and a sub board according to a first embodiment of the present invention; [Figure 4] 4A and 4B are front and rear perspective views showing a first heat generating element and a second heat generating element mounted on the main board or the sub-board of FIG. 3. [Figure 5] 4 is a partial exploded view of the front part and an exploded view of the rear part of FIG. 3. [Figure 6] FIG. 6 is a cross-sectional view taken along the line AA in FIG. 5. [Figure 7] 10A and 10B are front and rear views of a main board and a sub board according to a second embodiment of the present invention; [Figure 8] 8 is a partial exploded view of the front part and an exploded view of the rear part of FIG. 7. FIG. [Figure 9]FIG. 9 is a cross-sectional view taken along line BB in FIG. 8. [Figure 10] 1 is a cross-sectional view showing a heat dissipation housing to which the heat dissipation structure for a second heat generating element according to the first and second embodiments is applied. [Figure 11a] FIG. 4 is a cross-sectional view showing signal connections on a main board. [Figure 11b] FIG. 11b is a plan perspective view of FIG. [Figure 11c] FIG. 11b is a combined cross-sectional and plan view illustrating the interconnection interface of FIG. 11a. [Figure 12a] FIG. 10 is a conceptual diagram showing an electrical connection structure of a sub-board to a main board using a clamshell. [Figure 12b] FIG. 10 is a conceptual diagram showing an electrical connection structure of a sub-board to a main board using a clamshell. [Figure 12c] FIG. 10 is a conceptual diagram showing an electrical connection structure of a sub-board to a main board using a clamshell. [Figure 13] 12a to 12c show three views of the clamshell. [Figure 14] 10A and 10B are conceptual diagrams showing an embodiment of an electrical connection structure of a sub-board to a main board using an elastic pressing portion. [Figure 15] 10A and 10B are conceptual diagrams showing an embodiment of an electrical connection structure of a sub-board to a main board using an elastic pressing portion. [Figure 16a] 16A to 16C are cross-sectional views showing actual substrate stack structures of electrical connection structures according to various modifications of FIGS. 12A to 15 in a multiple input / output antenna device according to an embodiment of the present invention; [Figure 16b] 16A to 16C are cross-sectional views showing actual substrate stack structures of electrical connection structures according to various modifications of FIGS. 12A to 15 in a multiple input / output antenna device according to an embodiment of the present invention; [Figure 16c] 16A to 16C are cross-sectional views showing actual substrate stack structures of electrical connection structures according to various modifications of FIGS. 12A to 15 in a multiple input / output antenna device according to an embodiment of the present invention; [Figure 16d]16A to 16C are cross-sectional views showing actual substrate stack structures of electrical connection structures according to various modifications of FIGS. 12A to 15 in a multiple input / output antenna device according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, a multi-input / multi-output antenna device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0027] In assigning reference numerals to components in each drawing, it should be noted that the same components are assigned the same numerals as much as possible even if they are displayed in different drawings. Furthermore, in describing the embodiments of the present invention, if a detailed description of related publicly known configurations or functions is deemed to hinder understanding of the embodiments of the present invention, the detailed description thereof will be omitted.

[0028] In describing components of embodiments of the present invention, terms such as "first," "second," "A," "B," "(a)," and "(b)" may be used. These terms are merely used to distinguish the component from other components and do not limit the nature, order, or procedure of the components. Furthermore, unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined in this application.

[0029] FIG. 1 is a perspective view for explaining an embodiment of a multiple input / output antenna device according to the present invention, and FIG. 2 is an exploded perspective view of FIG.

[0030] A first embodiment of the multiple-input / output antenna device according to the present invention includes a first stacked assembly 100 that is primarily stacked inside the mounting space of a heat dissipation housing (not shown) that is approximately rectangular parallelepiped-shaped and long and thin in the vertical direction and has a front-to-back storage width, forming a mounting space that is open to the front (upper side in FIG. 1 ), a second stacked assembly 200 that is mounted and fixed to the front of the first stacked assembly 100, and a third stacked assembly 300 that is stacked on the front end of the second stacked assembly 200.

[0031] At the same time, as shown in FIGS. 1 and 2, one embodiment of the multiple input / output antenna device according to the present invention may further include a power supply unit (hereinafter abbreviated as "PSU") 50 disposed at one end (lower end) in the longitudinal direction of the first stack assembly 100, and supplying power to a plurality of RF power supply network components provided in the first to third stack assemblies 100 to 300.

[0032] The PSU 50 serves to control the power supply to a number of RF power supply network components provided in the first to third stack assemblies 100 to 300 in order to perform calibration power supply control and frequency filtering.

[0033] Figure 3 is a front view and a rear view of a main board and a sub-board implemented in the first embodiment of the present invention, Figure 4 is a front and rear perspective view showing a first heating element and a second heating element mounted on the main board or sub-board of Figure 3, Figure 5 is a partial front exploded view and a rear exploded view of Figure 3, and Figure 6 is a cross-sectional view cut along line AA of Figure 5.

[0034] The first stacked assembly 100 may include a main board 110 and a sub-board 150, as shown in FIGS.

[0035] More specifically, as shown in Figures 3 to 6, the heat dissipation housing may include a main board 110 stacked so that its back surface is in close contact with the inner surface corresponding to the mounting space of the heat dissipation housing, a sub-board 150 stacked so that it is in close contact with the front or back surface of the main board 110, a first heat-generating element 115 mounted only on the main board 110 of the main board 110 and the sub-board 150, and mounted only on the back surface of the main board 110, which is the side where a plurality of heat dissipation fins are provided on the outer surface of the heat dissipation housing, and a second heat-generating element 155 mounted only on the sub-board 150 of the main board 110 and the sub-board 150, and mounted only on the back surface of the sub-board 150, which is the side where a plurality of heat dissipation fins 11 are provided on the outer surface of the heat dissipation housing 10.

[0036] That is, the front and rear surfaces of the main board 110 and the front and rear surfaces of the sub-board 150 can be provided with a number of heat generating elements 115, 155, which are the aforementioned RF power supply network components and emit a predetermined amount of heat when in operation due to the application of power.

[0037] The main board 110 and the sub-board 150 may each be made of an FR4 resin-based board made of an epoxy resin material, but the main board 110 and the sub-board 150 do not necessarily have to be made of an epoxy resin material, and different materials may be used depending on the function of the board.

[0038] For example, the sub-board 150 may be made of a metal PCB material if heat dissipation is a priority, or may be a double-sided PCB with a dielectric layer having a different dielectric constant than that of the main board 110 applied or plated on both sides if RF performance maintenance is a priority.

[0039] Here, the main board 110 may include a plurality of sections each having a plurality of transmission and reception channels. Here, the plurality of transmission and reception channels may include a transmission channel and a reception channel, and the transmission channels and reception channels may be arranged in a pattern spaced apart by a predetermined distance in the left-right width direction of the main board 110. A plurality of such sections each having a plurality of transmission and reception channels may be provided in the main board 110, spaced apart by a predetermined distance in the up-down length direction.

[0040] Each section is formed as a column number corresponding to the number of unit multiband filters 210 in the configuration of the second stacked assembly 200 described below, and 16 Tx elements and 16 Rx elements are implemented and arranged within one section. By having four such sections, massive MIMO technology with a transmission capacity of 64T / 64R can be applied.

[0041] 1 and 2, the second stack assembly 200 may include a filter 210 that is disposed between the main board 110 of the first stack assembly 100 and the antenna board 310 of the third stack assembly 300 and performs frequency filtering. Here, the filter 210 may be any one of a cavity filter, a waveguide filter, and a dielectric filter. At the same time, the filter here does not exclude a multiband filter (MBF) that covers multiple frequency bands.

[0042] As described above, a plurality of filters 210 are fixed to cover areas corresponding to a plurality of sections provided on the main board 110, and each corresponding area may include a pair of a transmission channel and a reception channel.

[0043] As shown in FIGS. 3 to 6, the multiple input / output antenna device according to the present invention can be implemented in the following first embodiment 100A, in which the layout relationship between the main board 110, the sub-board 150, and the heat generating elements 115 and 155 is as follows.

[0044] That is, the layout relationship 1A embodied in the first embodiment 100A can be defined as a stacked arrangement in which the front surface of the sub-board 150 is in contact with the back surface of the main board 110, and the first heating element 115 and the second heating element 155 are mounted on the back surfaces of the main board 110 and the sub-board 150, respectively.

[0045] The main board 110 has a predetermined thickness and may be formed as a thin rectangular plate made of epoxy resin material, as described above.

[0046] More specifically, the main board 110 may be an integrated single board formed by joining together multiple layers stacked front and back. Conductive pattern circuits 110P1 or 110P2 are printed between each layer constituting the multiple layers of the main board 110, and multiple via holes 110V are provided to electrically connect each layer. The multiple via holes may be plated with the same conductive material as the conductive pattern circuits to enable electrical connection. A specific electrical connection configuration will be described in more detail below with reference to FIG. 11a.

[0047] As previously described, the sub-board 150 may be a double-sided PCB with a dielectric layer having a predetermined dielectric constant applied or bonded to both sides. The bonding interface configuration of the sub-board 150 to the main board 110 will be described in more detail below with reference to FIG.

[0048] The sub-board 150 may be a functional PCB provided to maintain the RF characteristics of the RF element among the heat-generating elements 115 and 155. Generally, the sub-board 150 requires a higher manufacturing cost than the main board 110, and therefore it is not preferable from a cost perspective to produce and stack the sub-board 150 over the entire front or rear surface of the main board 110. Therefore, it is preferable that the sub-board 150 be formed with a smaller area than the main board 110 and be formed in a size that allows the RF element embodied in the second heat-generating element 155 to be mounted.

[0049] Here, a number of heat generating elements (including the first heat generating element 115) may be mounted on the front and rear surfaces of the main board 110. For example, at least one LNA 116 (Low Noise Amplifier), which is an Rx element, may be mounted on the front surface of the main board 110, and a digital element such as an FPGA (Field Programmable Gate Array) may be mounted on the rear surface of the main board 110 as the first heat generating element 115.

[0050] That is, the first heating element 115 is preferably connected to a number of signal contact points realized through multiple layers of the main board 110 and is employed as a digital element capable of controlling a number of digital signals.

[0051] Here, as described above, the FPGA is mounted on the rear surface of the main board 110, and does not overlap with the sub-board 150, but is mounted on the rear surface of the main board 110 exposed to the rear, and the heat generated by the surface thermal bonding to the inner surface of the mounting space of the heat dissipation housing 10 can be directly dissipated through the multiple heat dissipation fins 11 integrally formed on the rear surface of the heat dissipation housing 10.

[0052] In particular, the first heating element 115 and the second heating element 155 described later may have different sizes, as shown in FIG. 4, but are divided into electrical signal connection surfaces 115a, 155a (hereinafter referred to as "signal connection surfaces 115a, 155a") having a number of signal connection points 115a', 155a' and heat dissipation surfaces 115b, 155b where operating heat is concentrated and dissipated, and the signal connection surfaces 115a, 155a may be formed on the back surface, which is the surface opposite to the front surface that is mounted in close contact with the back surface of the main board 110 and the sub-board 150.

[0053] In particular, in the case of the second heating element 155 provided as a conventional analog element, since it is difficult to manufacture the signal connection surface 155a and the heat dissipation surface 155b so that they are separated, the signal connection surface 155a and the heat dissipation surface 155b are generally not separated but are provided on the same surface (the surface mounted on the sub-board 150).

[0054] In this case, it is difficult from a design perspective to place the sub-board 150 on the front side of the main board 110. Even if the sub-board 150 is placed on the back side of the main board 110, it is difficult to mount the second heat-generating element 155 on the back side of the sub-board 150, which is the part that comes into direct contact with the inner surface of the heat-dissipating housing 10. In this case, there is a design problem in that at least one heat-transfer bridge hole (not shown) must be formed to discharge the heat generated from the second heat-generating element 155 to the rear side.

[0055] However, the second heating element 155, which is an analog element, may also be manufactured so that the signal connection surface 155a and the heat dissipation surface 155b are opposite to each other (i.e., separated), just like the first heating element 115, which is a digital element. In this case, embodiments 100A and 100B of the present invention can solve design problems regarding the stacked structure of the conventional main board 110 and sub-board 150 and the mounting position of the second heating element 155 on the sub-board 150.

[0056] The multiple input / output antenna device 1 according to the present invention may embody the above-described arrangement relationship in various embodiments (first embodiment 100A and second embodiment 100B).

[0057] Here, as shown in Figures 3 to 6, the layout relationship of the first embodiment 100A is such that the front surface of the sub-board 150 is stacked on the back surface of the main board 110 so as to face the back surface of the main board 110, and the back surfaces of the main board 110 and the sub-board 150 may be provided with signal connection surfaces 115a, 155a on the front surface, respectively, and the first heating element 115 and the second heating element 155 may be mounted and arranged with heat dissipation surfaces 115b, 155b on the back surface.

[0058] In this case, the signal connection points 115a', 155a' formed on the signal connection surfaces 115a, 155a can be connected to corresponding points formed on the rear surface of the main board 110 and the rear surface of the sub-board 150 by a brazing bonding method using solder paste pre-applied on the surfaces to be joined, and heat can be dissipated by surface thermal bonding directly through the heat dissipation housing 10 via the heat dissipation surfaces 115b, 155b.

[0059] Therefore, the corresponding points formed on the main board 110 and the sub-board 150 may be formed at positions corresponding to the multiple signal connection points 115 a ′ and 155 a ′ of the first heating element 115 or the second heating element 155 .

[0060] Here, the inner surface of the heat dissipation housing 10 may be formed with a sub-board receiving groove 133 for accommodating the sub-board 150, and a heat dissipation groove portion 13 for accommodating the first heat generating element 115 mounted on the back surface of the main board 110 and the second heat generating element 155 mounted on the back surface of the sub-board 150.

[0061] In particular, the heat dissipation groove 13 in which the second heat generating element 155 is accommodated may be integrally formed in the sub-board receiving groove 133 in which the sub-board 150 is accommodated.

[0062] At the same time, a heat dissipating interface material 20 may be interposed between the first heating element 115, the second heating element 155, and the inner surfaces of the heat dissipating groove 13. The specific function of the heat dissipating interface material 20 will be described in more detail later.

[0063] FIG. 7 is a front view and a rear view of a main board and a sub board implemented in a second embodiment of the present invention, FIG. 8 is a partial front exploded view and a rear exploded view of FIG. 7, and FIG. 9 is a cross-sectional view cut along line BB in FIG. 8.

[0064] The arrangement relationship in the second embodiment 100B is based on the premise that, similar to the first embodiment 100A, the first heating element 115 and the second heating element 155 have the aforementioned signal connection surfaces 115a, 155a and heat dissipation surfaces 115b, 155b arranged on the same surface.

[0065] More specifically, as shown in Figures 7 to 9, the layout relationship of the second embodiment 100B is such that the back surface of the sub-board 150 is stacked on the front surface of the main board 110 so as to face the front surface of the main board 110, and the back surface of the main board 110 and the back surface of the sub-board 150 may be provided with signal connection surfaces 115a, 155a on their front surfaces, respectively, and may be provided with a first heating element 115 and a second heating element 155 with heat dissipation surfaces 115b, 155b on their rear surfaces.

[0066] Here, the second embodiment 100B differs from the first embodiment 100A described above in that the sub-board 150 is not arranged on the back of the main board 110, but is arranged on the front of the main board 110, and as shown in FIG. 9, the main board 110 may be formed with a heat dissipation through-hole 113 that penetrates forward and backward in a portion of the sub-board 150 corresponding to the portion where the second heat generating element 155 is mounted.

[0067] This is to allow the heat dissipation surface 155b of the second heat generating element 155 mounted on the rear surface of the sub-board 150 to penetrate and be thermally bonded to the inner surface of the mounting space of the heat dissipation housing 10.

[0068] In this case, in the case of the second heating element 155, a number of signal connection points 155a' formed on the signal connection surface 155a can be connected to corresponding points on the rear surface of the main board 110 and the rear surface of the sub-board 150 by soldering, and the heat dissipation surface 155b can dissipate heat through the heat dissipation housing 10 that is in contact with the heat dissipation through-hole 113.

[0069] On the other hand, as in the first embodiment 100A described above, a heat dissipation groove portion 13 is formed on the inner surface of the heat dissipation housing 10 to accommodate the first heat generating element 115 mounted on the back surface of the main board 110, and a heat dissipation protrusion portion 15 may be formed to protrude forward to the heat dissipation surface 155b of the second heat generating element 155 mounted on the back surface of the sub-board 150 exposed to the rear side through the heat dissipation through hole 113 described above.

[0070] FIG. 10 is a cross-sectional view showing a heat dissipation housing to which the heat dissipation structure for the second heat generating element according to the first and second embodiments is applied, FIG. 11a is a cross-sectional view showing the signal wiring on the main board, FIG. 11b is a planar perspective view of FIG. 11a, and FIG. 11c is a cross-sectional view and a plan view showing the mutual interface of FIG. 11a.

[0071] In the arrangement structures according to the first embodiment 100A and the second embodiment 100B, the surface of the heat dissipation housing 10 to which the rear surface of the main board 110 is in close contact can be assumed to be the reference surface 110A, as shown in FIG.

[0072] In addition, the heat dissipation housing 10 is grooved to recess rearward based on the reference surface 110A to accommodate the first heat generating element 115 and the second heat generating element 155 mounted on the rear surface of the sub-board 150 stacked on the rear surface of the main board 110, and includes a heat dissipation groove portion 13 to which the rear surfaces (particularly the heat dissipation surfaces 115b, 155b) of the first heat generating element 115 and the second heat generating element 155 are thermally bonded, and a heat dissipation protrusion portion 15 that protrudes forward through the heat dissipation through hole 113 based on the reference surface 110A to which the rear surface of the second heat generating element 155 mounted on the rear surface of the sub-board 150 stacked on the front surface of the main board 110 is thermally bonded.

[0073] At the same time, a heat dissipating interface material 20 may be interposed between the rear surface of the first heating element 115 or the second heating element 155 and the front surface of the heat dissipating groove 13 or the heat dissipating protrusion 15. Here, the heat dissipating interface material 20 eliminates the tolerance between the heat dissipating surfaces 115b, 155b of the first heating element 115 or the second heating element 155, which essentially perform the heat dissipation function, and the inner surface of the mounting space of the heat dissipating housing 10, and also provides a higher heat transfer rate, thereby maximizing heat dissipation performance.

[0074] The thermal interface material 20 may include at least one of thermal grease, a graphite sheet, a heat pipe, a heat spreader, and a vapor chamber.

[0075] The electrical connection structure between the main board 110, the sub-board 150, and the second heating element 155 of the multiple input / output antenna device 1 according to one embodiment of the present invention configured as described above will be briefly described with reference to Figures 11a to 11c as follows.

[0076] First, as shown in FIG. 11a, the main board 110 is provided in a form in which multiple layers are bonded together, and conductive patterns 110P1 may be printed between some of the layers of the multiple layers for signal connection, and the connection pattern 110P2 printed on the back of the main board 110 may be signal-connected to the conductive pattern 110P1 using via holes 110V plated with a conductive material.

[0077] Also, as shown in FIG. 11a, the sub-board 150 is provided in the form of a double-sided PCB, and each outer layer (front and back) is coated or covered with a dielectric layer having a predetermined dielectric constant so as to maintain RF characteristics or perform optimized mounting, and a signal connection pattern 150P for signal connection may be formed on each dielectric layer.

[0078] In this case, the second heating element 155 has a signal connection surface 155a on its front surface, on which a number of signal connection points 155a' are formed, which allows signal connection to the signal connection pattern 150P formed on the rear surface of the sub-board 150 using solder paste during the soldering process, making it possible to directly mount the second heating element 155 on the rear surface of the sub-board 150, unlike conventional methods.

[0079] At the same time, the electrical signal connection between the main board 110 and the sub-board 150 is achieved by contacting a connection pattern 110P2 of a predetermined length printed on the back of the main board 110 with a signal connection pattern 150P formed on the back of the sub-board 150 so as to be electrically connected to a via hole 110V that has been drilled and plated in the thickness direction of the main board 110, as shown in FIG. 11a.

[0080] However, when the sub-board 150 is stacked so that its front surface is in contact with the back surface of the main board 110 and the second heating element 155 is mounted on the back surface of the sub-board 150, at least a portion of the aforementioned signal connection pattern 150P must penetrate the sub-board 150 and be exposed to the front surface in order to connect to the connection pattern 110P2 of the main board 110, which requires processing of a solder hole 150h as shown in Figure 11a.The signal connection pattern 150P, which is plated on a portion of the inner surface of the solder hole 150h so as to be exposed to the front surface of the sub-board 150 and the connection pattern 110P2 of the main board 110, can be electrically connected by soldering 110P.

[0081] In particular, referring to Figures 11b and 11c, a signal connection structure and interface are provided to enable an automated soldering process using solder paste, which significantly simplifies the process of stacking the sub-board 150 onto the main board 110 and the process of mounting the second heating element 155 onto the sub-board 150, thereby providing the advantage of saving labor costs.

[0082] As described above, according to the multiple input / output antenna device 1 of one embodiment of the present invention, the area of ​​the sub-board 150, which has a relatively expensive manufacturing cost, is minimized, and since it is not necessary to mount the second heat generating element 155 on the front surface of the sub-board 150 and it can be mounted directly on the back surface of the sub-board 150, it is not necessary to process a structure such as a heat transfer bridge hole for heat dissipation, and the overall manufacturing cost of the product can be reduced by simplifying the manufacturing process of the product.

[0083] Figures 12a to 12c are conceptual diagrams showing an electrical connection structure of a sub-board to a main board using a clamshell, Figure 13 is a three-view diagram showing the clamshell of Figures 12a to 12c, and Figures 14 and 15 are conceptual diagrams showing an embodiment of an electrical connection structure of a sub-board to a main board using an elastic pressing portion.

[0084] As mentioned above, the sub-board 150 for the main board 110 must undergo the necessary process of forming solder holes 150h in the sub-board 150 so that the connection pattern 110P2, which is connected to the via hole 110V formed in the main board 110, is exposed to the outside to enable mutual electrical connection, as shown in Figures 11a to 11c, and then connecting the connection pattern 110P2 of the main board 110 to the signal connection pattern 150P of the sub-board 150 with solder 110P.

[0085] However, the electrical connection structure of the sub-board 150 to the main board 110 as described above requires a process for processing the soldering hole 150h because it is difficult to directly connect the exposed end of the via hole 110V, and then a soldering process is also required, which may increase the number of processes.

[0086] In one embodiment of the present invention, in order to prevent the additional steps due to the above-mentioned electrical connection structure, an electrical connection structure is proposed in which, as a first variant (Figures 12a to 13), a clamshell cover 30 is used to press the sub-board 150 in the direction in which the main board 110 is provided, or, as a second variant (Figures 14 and 15), an elastic pressing part 160 is used to press the sub-board 150 in the direction in which the main board 110 is provided.

[0087] The electrical connection structure of the first variant is related to the arrangement structure of the second embodiment 100B of the present invention as shown in Figures 7 to 9, and may be limited to when the sub-board 150 is stacked and arranged so that the back of the sub-board 150 is in contact with the front of the main board 110.

[0088] More specifically, the electrical connection structure of the first modified example includes a clamshell cover 30 that is arranged to completely surround the front of a sub-board 150, whose front and back surfaces are in close contact with the main board 110, and has at least one pressing rubber 31 formed on its inner surface to press the sub-board 150 toward the main board 110, as shown in Figures 12a to 13.

[0089] Here, the clamshell cover 30 serves to form a space that shields and accommodates electrical components mounted on the outer surfaces of the sub-board 150 and the main board 110, such that a number of spaces are partitioned on one side of the main board 110, including the other side of the sub-board 150, thereby blocking interference from external signals.

[0090] The end of the clamshell cover 30 adjacent to the sub-board 150 or the main board 110 may be coupled through an EMI shielding sleeve 35 that is applied to the sub-board 150 or the main board 110 in advance by an EMI dispensing method.

[0091] Meanwhile, referring to FIG. 12a, at least one pressing rubber 31 may be made of a rubber material and may be formed elongated in a linear direction on the inner surface of the clamshell cover 30. When the clamshell cover 30 is completely coupled to the sub-board 150 or the main board 110, each end portion of the pressing rubber 31 can elastically deform while tightly adhering at least the sub-board 150 in the direction in which the main board 110 is positioned.

[0092] Here, the attachment of the clamshell cover 30 to the main board 110 and the sub-board 150 may be performed by screw assembly using fixing screws (not shown) that are fastened through screw fastening holes 110s formed in the main board 110 and screw through holes 150s formed in the sub-board 150, respectively, as shown in Figures 12b and 12c.

[0093] In this way, when the assembly force of the fixing screw is transmitted to the clamshell cover 30, as shown in FIG. 12a, the tip of the pressing rubber 31 provided inside the clamshell cover 30 elastically supports the other side (front side) of the sub-board 150, and the via hole 110V formed in the main board 110 and the via hole 150V formed in the sub-board 150 are directly electrically connected, so no separate soldering process is required.In addition, since no soldering process is required for electrically connecting the main board 110 and the sub-board 150, the processing process of the soldering hole for the sub-board 150 (see drawing reference symbol 150h in FIG. 11a) is also unnecessary, which creates the advantage of not requiring the process.

[0094] Meanwhile, the electrical connection structure of the second modified example is related to the arrangement structure of the first embodiment 100A of the present invention as shown in Figures 3 to 6, and may be limited to when the sub-board 150 is stacked and arranged so that the front surface of the sub-board 150 is in contact with the rear surface of the main board 110.

[0095] However, in the case of the arrangement structure of the first embodiment 100A of the present invention, the second heat generating element 155 is limited to being mounted on the back surface of the sub-board 150, but it should be noted that the electrical connection structure of the second variant here is limited to only the electrical connection between the main board 110 and the sub-board 150, and does not exclude the case where the sub-board 150 is stacked on the back surface of the main board 110 and the second heat generating element 155 is mounted on the front surface of the sub-board 150, as shown in Figures 14 and 15.

[0096] More specifically, the electrical connection structure of the second variant may include an elastic pressing portion 160 that presses the sub-board 150, which is arranged relatively rearward, toward the main board 110, which is arranged in front of it, as shown in Figures 14 and 15.

[0097] As shown in FIG. 14, the elastic pressing portion 160 can be implemented as an elastic sleeve 165 that presses the sub-board 150 by its own elastic force, which is one of the properties of the material, without any additional elastic means.

[0098] Also, as shown in FIG. 15, the elastic pressing part 160 may be implemented in an assembly form including an elastic sleeve 165 disposed on one side of the support pad 161 and an elastic means 163 provided in a spring form to apply an elastic force to the support pad 161 on the other side of the support pad 161.

[0099] More specifically, as shown in FIG. 14, the inner surface of the heat dissipation housing 10 is provided with a rib installation groove 17, into which an elastic rib 165, which is adopted as one component of the elastic pressing portion 160, may be inserted.

[0100] Therefore, the elastic pressing portion 160 can be defined as an elastic sleeve 165 that is arranged between the inner surface of the heat dissipation housing 10 and the main board 110 and elastically supports the sub-board 150 stacked on the back of the main board 110 toward the main board 110.

[0101] As shown in (a) of Figure 14, when the main board 110 and the sub-board 150 stacked and joined thereto are stacked and joined so as to be in surface contact with the inner surface of the heat dissipation housing 10 with the elastic ribs 165 inserted into the rib installation grooves 17, the inner surface of the sub-board 150 is elastically pressed toward the main board 110 by the elastic ribs 165 due to the fixing force, and the via holes 110V formed in the main board 110 and the via holes 150V formed in the sub-board 150 are electrically connected (joined) without the need for a separate soldering process.

[0102] On the other hand, the elastic ribs 165 may be formed in a straight line as shown in FIG. 14(b), or may be provided in a number of pieces arranged in a dot pattern in a straight line as shown in FIG. 14(c).

[0103] Furthermore, although the elastic ribs 165 are shown in (a) of Figure 14 as being arranged only at two locations, at one end and the other end of the sub-board 150, it can be said that they can naturally be arranged evenly at multiple locations so as to provide elastic support across the entire back surface of the sub-board 150.

[0104] At the same time, as shown in (a) of FIG. 15, an assembly installation groove 17a may be formed on the inner surface of the heat dissipation housing 10 for installing the elastic pressing part 160 provided in the form of an assembly, and the sub-board 150 may be elastically pressed toward the main board 110 by the elastic sleeve 165 of the elastic pressing part 160.

[0105] As shown in (b) and (c) of FIG. 15, the elastic pressing part 160 may include a spring-shaped elastic means 163 interposed inside the assembly installation groove 17a, and a support pad 161 elastically supported by the elastic means 163 on one side and having an elastic sleeve 165 attached on the other side.

[0106] The elastic means 163 may be limited to a coil spring among springs, but the elastic means 163 does not necessarily have to be limited to a coil spring, and should be understood as a concept including any type of elastic body as long as it uniformly elastically supports the support pad 161.

[0107] 16a to 16d are cross-sectional views showing actual substrate stack structures of electrical connection structures according to various modifications of FIGS. 12a to 15 in a multi-input / multi-output antenna device according to an embodiment of the present invention.

[0108] In the electrical connection structures according to the first and second modified examples described above, the application of the elastic pressing portion 160 to a specific embodiment of the present invention will be described with reference to Figures 16a to 16d as follows.

[0109] That is, the multiple input / output antenna device 1 according to one embodiment of the present invention has a technical feature that the first heating element 115 is mounted only on the rear surface of the main board 110 and the second heating element 155 is mounted only on the rear surface of the sub-board 150, as described above, and the electrical connection structure described above can be flexibly applied although there are slight structural differences, as shown in Figures 16a to 16d.

[0110] More specifically, as shown in FIGS. 16a and 16c, this is applicable to the case of the multiple-input / output antenna device 100A according to the first embodiment of the present invention, in which the sub-board 150 is stacked on the back surface of the main board 110, and the main board 110 and the sub-board 150 are mounted with the first heating element 115 and the second heating element 155, in which the signal connection surfaces 115a, 155a and the heat dissipation surfaces 115b, 155b are formed on different surfaces.

[0111] Referring to FIG. 16a, the inner surface of the heat dissipation housing 10 is formed with a sub-board receiving groove 133 for accommodating the sub-board 150, and a heat dissipation groove portion 13 for accommodating the second heating element 155 mounted so as to protrude rearward from the rear surface of the sub-board 150, and may also be formed with a rib installation groove 17 for accommodating an elastic pressing portion 160 provided by the elastic rib 165 itself.

[0112] Also, referring to FIG. 16c, the inner surface of the heat dissipation housing 10 is formed with a sub-board receiving groove 133 and a heat dissipation groove portion 13, similar to FIG. 16a, and an assembly installation groove 17a for accommodating and installing the elastic pressing portion 160 provided in the assembly form may be formed with a structure similar to the aforementioned rib installation groove 17.

[0113] As described above, in the electrical connection structures of the first and second modified examples applied to the arrangement structure 100A of the multiple-input / output antenna device 1 according to the first embodiment of the present invention, when the main board 110 and the sub-board 150 are stacked and coupled to the heat dissipation housing 10, they are elastically pressed by their fixing force (see FIG. 16a), or the elastic sleeve 165 of the elastic pressing part 160 provided in the assembly form can elastically press the sub-board 150 (see FIG. 16c).

[0114] 16b, the heat dissipation housing 10 may have a heat dissipation protrusion 15 protruding forward through the heat dissipation through-hole 113 formed in the main board 110 and a heat dissipation groove 13 for accommodating the first heating element 115 mounted on the rear surface of the main board 110. The elastic pressing part 160 formed by the elastic rib 165 itself may be installed and fixed to the front end (rear end) of the pressing rib 37 of the clamshell cover 30. In this case, the front end of the pressing rib 37 of the clamshell cover 30 may further have a structure similar to the rib installation groove 17 for installing the elastic pressing part 160, but it is of course possible to design it differently depending on the installation method of the elastic pressing part 160.

[0115] 16d, the heat dissipation protrusion 15 and the heat dissipation groove 13 are formed on the inner surface of the heat dissipation housing 10, as in FIG. 16b, and the pressure sleeve 37 of the clamshell cover 30 may have an assembly installation groove 17a for accommodating and installing the elastic pressure part 160 provided in the assembly form.

[0116] As described above, in the electrical connection structures of the first and second modified examples applied to the layout structure 100B of the multiple-input / output antenna device 1 according to the second embodiment of the present invention, when an assembly force is transmitted when the clamshell cover 30 is installed on the heat dissipation housing 10 or the main board 110, the elastic pressing portion 160 provided only on the elastic sleeve 165 can elastically press the sub-board 150 toward the main board 110 (see FIG. 16b), or the elastic sleeve 165 of the elastic pressing portion 160 provided in the assembled form can elastically press the sub-board 150 (see FIG. 16d).

[0117] As described above, the implementation of such an electrical connection structure of the sub-board 150 to the main board 110 can eliminate the soldering process and the processing process of the sub-board 150, thereby reducing the number of processes and providing the advantage of further improving the reliability of the electrical connection.

[0118]

[0033] An embodiment of a multi-input / multi-output antenna device according to the present invention has been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiment, and various modifications and equivalents may be made by those skilled in the art. Therefore, the true scope of the present invention is determined by the following claims. [Industrial Applicability]

[0119] The present invention provides a multiple input / output antenna device that allows direct mounting of a heat generating element, which is an RF element, on the back surface of a sub-board, thereby reducing the need for a separate processing step for heat dissipation and reducing the overall manufacturing cost of the product. [Explanation of symbols]

[0120] 1: Multiple input / output antenna device 10: Heat dissipation housing 11: Heat dissipation fin 13: Heat dissipation groove 15: Heat dissipation protrusion 20: Heat dissipation interface material 110: Main board 113: Heat dissipation through hole 115: First heating element 150: Sub-board 155: Second heating element 155a: Signal connection surface 155a': Signal connection point 155b: Heat dissipation surface 160: Elastic pressing part 161: Support pad 163: Elastic means 165: Elastic Reeve

Claims

1. A mainboard that is stacked with its backside tightly attached to the inside surface of the heat dissipation housing; a sub-board that is stacked on the front or rear surface of the main board so as to be in close contact with the front or rear surface of the main board; a first heat generating element mounted only on the rear surface of the main board, the rear surface being in contact with the inner surface of the heat dissipation housing; and a second heat generating element mounted only on the rear surface of the sub-board that is in contact with the inner surface of the heat dissipation housing, out of both surfaces of the sub-board;

2. 2. The multiple-input / output antenna device of claim 1, wherein the first and second heating elements are connected to corresponding points formed on the rear surfaces of the main board and the sub-board, respectively, by a brazing bonding method using solder paste pre-applied on surfaces to be joined to each other.

3. The main board is an integrated one-board formed by joining together multi-layers stacked in the front and rear, 2. The multiple input / output antenna device according to claim 1, wherein the sub-board is a double-sided PCB.

4. 4. The multi-input / output antenna device of claim 3, wherein the first heating element is connected to a plurality of signal contact points implemented through multiple layers of the main board and is employed as a digital element capable of controlling a plurality of digital signals.

5. 4. The multiple input / output antenna device according to claim 3, wherein the second heating element is employed as an analog element whose RF characteristics are maintained by the dielectric constant of the double-sided PCB, on both sides of which dielectric layers having a dielectric constant different from that of the multi-layer layer of the main board are applied.

6. the first heating element is a digital element, 3. The multiple-input / output antenna device of claim 2, wherein the device is divided into an electrical signal connection surface (hereinafter referred to as "signal connection surface") having a plurality of signal connection points and a heat dissipation surface where operating heat is concentrated and dissipated, the signal connection surface being formed on a front surface mounted to be closely attached to a rear surface of the main board, and the heat dissipation surface being formed on a rear surface opposite to the front surface.

7. The second heating element is an analog element, 3. The multiple-input / output antenna device of claim 2, wherein the device is divided into an electrical signal connection surface (hereinafter referred to as "signal connection surface") having a plurality of signal connection points and a heat dissipation surface where operating heat is concentrated and dissipated, the signal connection surface being formed on a front surface mounted to be closely attached to a rear surface of the sub-board, and the heat dissipation surface being formed on a rear surface opposite to the front surface.

8. 8. The multiple-input / output antenna device according to claim 6, wherein the corresponding points formed on the main board and the sub-board are formed at positions corresponding to a plurality of signal connection points of the first heating element or the second heating element.

9. 2. The multiple input / output antenna device according to claim 1, wherein when the sub-board is disposed in front of the main board, the main board has a heat dissipation through-hole extending forward and backward at a portion of the sub-board corresponding to a portion on which the second heat generating element is mounted.

10. The heat dissipation housing includes: When the surface to which the rear surface of the main board is attached is assumed to be the reference surface, a heat dissipation groove portion recessed rearward from the reference plane to accommodate the first heat generating element and the second heat generating element mounted on the rear surface of the sub-board stacked on the rear surface of the main board, the rear surfaces of the first heat generating element and the second heat generating element being thermally bonded to each other; and 10. The multiple-input / output antenna device of claim 9, further comprising a heat dissipation protrusion protruding forward through the heat dissipation through-hole relative to the reference plane so that the rear surface of the second heating element mounted on the rear surface of the sub-board stacked on the front surface of the main board is thermally bonded to the heat dissipation protrusion.

11. The multiple-input / output antenna device of claim 10, wherein a heat dissipation interface material is interposed between a rear surface of the first or second heat generating element and a front surface of the heat dissipation groove or the heat dissipation protrusion.

12. The multiple-input / output antenna device of claim 11, wherein the heat dissipation interface material includes at least one of thermal grease, a graphite sheet, a heat pipe, a heat spreader, and a vapor chamber.

13. 2. The multiple-input / output antenna device according to claim 1, further comprising: an elastic pressing portion that elastically presses the sub-board toward the main board.

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