Systems and methods for electrochemical machining

Abstract

An exemplary electrochemical machining system and method for machining a surface of a specimen. In particular, the system includes a nozzle configured to eject a jet of electrolyte solution toward the surface of the specimen. The position or orientation of the nozzle can be controlled to direct the jet of electrolyte solution from the nozzle toward a region of the surface of the specimen (e.g., a region for electrochemical etching or other surface treatment). Electrochemical machining is performed by applying an electric charge to the nozzle and applying an electric charge to the specimen (e.g., to ground or other charge return path) such that the nozzle and specimen define first and second electrodes of an electrolytic cell electrically connected by the jet of electrolyte solution.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application is a non-provisional application of U.S. Provisional Patent Application No. 63 / 437,433, entitled "Systems And Methods For Electrochemical Machining," filed January 6, 2024, which is incorporated herein by reference in its entirety. [Background technology]

[0002] Electrochemical machining is performed on specimens for many purposes and across a vast number of sectors and industries. In some applications, electrochemical machining is performed by the application of a fluid through a nozzle. However, performing a dynamic electrochemical machining process can be difficult and time-consuming, and ensuring consistent results can be challenging. Therefore, systems and methods that offer a variety of features while maintaining consistent results are desirable. Summary of the Invention

[0003] As fully set forth in the claims, systems and methods are disclosed for dynamic electrochemical machining, substantially as shown in and substantially as described in connection with at least one of the drawings. [Brief explanation of the drawings]

[0004] [Figure 1] FIG. 1 illustrates an exemplary electrochemical machining system according to aspects of the present disclosure.

[0005] [Figure 1A] FIG. 2 is another view of the example electrochemical machining system of FIG. 1.

[0006] [Figure 2] FIG. 1 illustrates another exemplary electrochemical machining system according to aspects of the present disclosure.

[0007] [Figure 3] FIG. 3 illustrates another embodiment of the exemplary electrochemical machining system of FIG. 2.

[0008] [Figure 4] FIG. 1 illustrates another exemplary electrochemical machining system according to aspects of the present disclosure.

[0009] [Figure 5] FIG. 1 illustrates a detailed view of an exemplary reservoir according to aspects of the present disclosure.

[0010] [Figure 6] FIG. 1 illustrates an exemplary fixture for supporting multiple specimens for electrochemical machining according to aspects of the present disclosure.

[0011] [Figure 7] FIG. 1 illustrates another exemplary electrochemical machining system including a filtration system according to aspects of the present disclosure.

[0012] The figures are not necessarily to scale. Where appropriate, similar or identical reference numbers are used to refer to similar or identical components. DETAILED DESCRIPTION OF THE INVENTION

[0013] An electrochemical machining system and method for machining a surface of a specimen is disclosed. In particular, the system includes a nozzle configured to eject a jet of electrolyte solution toward the surface of the specimen. The position or orientation of the nozzle can be controlled to direct the jet of electrolyte solution from the nozzle toward a region of the surface of the specimen (e.g., an area for electrochemical etching or other surface treatment). Electrochemical machining is performed by applying an electric charge to the nozzle and applying an electric charge to the specimen (e.g., to ground or other charge return path) such that the nozzle and specimen define first and second electrodes of an electrolytic cell electrically connected by the jet of electrolyte solution.

[0014] The system controls the amount and / or location of electrochemical machining by monitoring system parameters (e.g., fluid conditions, sample, electrical properties such as current / voltage, etc.) and adjusting one or more system outputs accordingly. For example, a controller or control circuitry (e.g., an integrated or linked computer system) can receive monitored system parameters (e.g., output values ​​from sensors) and control the adjustment of one or more system components. This can include, as a non-limiting list of examples, adjusting one or more of the volumetric flow rate of the electrolyte jet, the pressure of the flow, the speed of the nozzle, the distance between the nozzle and the sample, the electrical properties of the electrolyte solution, or the source or type of fluid used.

[0015] Some exemplary systems use multiple reservoirs or tanks for storing multiple fluids, which can be applied through one or more nozzles to process a sample in single or multiple cycles of a selected processing program. In some examples, a particular program and / or cycle can be input by a user (e.g., via a user interface), selected by a user via a list of stored programs and / or cycles, and / or automatically identified and executed by the control circuitry. For example, the sample, fluid type, and / or system can be automatically identified (e.g., by identifying an indicator such as a code and / or a unique property of the sample), and the control circuitry can automatically select an appropriate program (e.g., from a list). The program and / or cycle can include controlling the location and characteristics of the jet of applied electrolyte solution so that a desired region of the sample is processed according to a predetermined set of output parameters (e.g., amount of time, location, and / or processing volume).

[0016] These are improvements over conventional systems, where a single nozzle is limited to processing a single specimen according to strict point-to-point application. This requires the user to reconfigure the specimen and / or the system to process any but the simplest cycles. As a result, additional time and resources are spent isolating and positioning specimens, rather than testing.

[0017] The disclosed specimen holding fixtures and systems allow an operator to move the entire specimen holder tray and attach it directly to an electrochemical machining system without removing individual specimens, which significantly reduces the amount of labor required to process multiple specimens and reduces the possibility of accidental scratching and / or other damage to the specimens.

[0018] Advantageously, the disclosed systems and methods can increase throughput by allowing the system to process multiple specimens without the user having to separately configure the system differently for each cycle or program. Simplified and / or automatic recognition of specimens and / or desired cycles / programs accelerates and dynamics configuration time, allowing different processing steps to be performed during a single program run. This includes processing multiple specimens in a single program. Furthermore, processing specimens with multiple nozzles results in significant cycle time reductions (e.g., approximately 50% reduction for two nozzles, approximately 66% reduction for three nozzles, etc.), thus allowing users to complete processing faster than with existing methods.

[0019] As used herein, the word "exemplary" means "serving as an example, instance, or illustration." The embodiments described herein are intended to be illustrative only and not limiting. It is to be understood that any described embodiment is not necessarily to be construed as preferred or advantageous over other embodiments. Moreover, the term "embodiments" does not require that all disclosed embodiments include the discussed feature, advantage, or mode of operation.

[0020] As used herein, "and / or" means any one or more of the items in the list connected by "and / or." As an example, "x and / or y" means any element of the three-element set {(x), (y), (x, y)}. In other words, "x and / or y" means "one or both of x and y." As another example, "x, y and / or z" means any element of the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y, z)}. In other words, "x, y and / or z" means "one or more of x, y and z." As used herein, the term "for example" begins a list of one or more non-limiting examples, instances, or illustrations.

[0021] For the purposes of promoting an understanding of the principles of the claimed technology and setting out the best currently understood mode of operation, reference will now be made to the embodiments illustrated in the drawings, and specific language will be used to describe the same. It is to be understood, however, that this is not intended to limit the scope of the claimed technology, and that such changes and further modifications in the devices shown, and such further applications of the principles of the claimed technology shown therein, are contemplated as would normally occur to one of ordinary skill in the art to which the claimed technology pertains.

[0022] In a disclosed example, an electrochemical machining system for machining a surface of a specimen includes a nozzle configured to eject a jet of electrolyte solution toward the surface of the specimen, and control circuitry for controlling the electrochemical machining process. The control circuitry is configured to receive inputs providing a program for the specimen, direct the jet of electrolyte solution from the nozzle toward a portion of the surface of the specimen based on the program, and apply an electric charge to the nozzle and to apply an electric charge to the specimen based on the program, such that the nozzle and specimen define a first electrode and a second electrode of an electrolytic cell.

[0023] In some examples, the system includes an interface for receiving input or code from a user. In examples, the control circuitry is further configured to automatically select a program for the sample based on the input or code.

[0024] In some examples, the control circuitry is further configured to monitor one or more system parameters of the surface and adjust one or more of a volumetric flow rate, a pressure, or a rate of application of the electrolyte solution in response to the one or more system parameters based on a program. In examples, the one or more system parameters of the surface include a voltage or a current. In examples, the control circuitry is further configured to measure the level of the voltage or current, compare the measured voltage or current to a list of threshold voltage or current values, and adjust the level of the voltage or current if the measured voltage or current is outside the threshold voltage or current values.

[0025] In some examples, the apparatus is configured to apply jets of electrolyte solution to multiple specimens in a single cycle. In examples, the control circuitry is further configured to receive a first electrochemical machining program and a second electrochemical machining program from the input, apply jets of electrolyte solution to a first region of the specimen at a first volumetric flow rate, a first pressure, or a first velocity during the first electrochemical machining program, and apply jets of electrolyte solution to a second region of the specimen at a second volumetric flow rate, a second pressure, or a second velocity during the second electrochemical machining program.

[0026] In some examples, the system includes a sensor for monitoring one or more system parameters. In examples, the sensor is a fluid sensor for monitoring one or more of the conductivity, refractive index, viscosity, flow rate, or charge of the electrolyte solution. In examples, the sensor is an optical system or a laser system configured to image or scan the sample. In examples, the sensor is an optical system or a laser system configured to image or scan an indicator representing a code or other information about the sample.

[0027] In some examples, the system includes an optical system or a laser system configured to present a reference image onto the sample or stage to align the sample to a desired position on the stage where the sample is located relative to the nozzle.

[0028] In some examples, the system includes a valve configured to receive an external input of airflow to flush the electrolyte solution from the nozzle.

[0029] In some disclosed examples, an electrochemical machining system for machining a surface of one or more specimens includes one or more nozzles configured to eject one or more jets of one or more electrolyte solutions toward the surface of the one or more specimens, and control circuitry for controlling the electrochemical machining process, the control circuitry configured to direct one or more jets of the one or more electrolyte solutions from a first nozzle of the one or more nozzles toward a first portion of the surface of the one or more specimens, direct one or more jets of the one or more electrolyte solutions from a second nozzle of the one or more nozzles toward a second portion of the surface of the one or more specimens, and apply an electric charge to the one or more nozzles and to apply an electric charge to the one or more specimens such that the nozzles and the specimens define a first electrode and a second electrode of an electrolytic cell.

[0030] In some examples, the control circuitry is further configured to control the first nozzle independently of the second nozzle.

[0031] In some examples, the first nozzle is configured to apply one or more jets of a first electrolyte solution to one or more specimens as a first jet, and the second nozzle is configured to apply one or more jets of a second electrolyte solution to one or more specimens as a second jet. In examples, the first nozzle is configured to apply the first jet of the first electrolyte solution to a first portion of a surface of the specimen at a first volumetric flow rate, a first pressure, or a first velocity, and the second nozzle is configured to apply the jet of the second electrolyte solution to a second portion of a surface of the specimen at a second volumetric flow rate, a second pressure, or a second velocity. In examples, the first volumetric flow rate, the first pressure, or the first velocity corresponds to a first electrochemical machining program, and the second volumetric flow rate, the second pressure, or the second velocity corresponds to a second electrochemical machining program.

[0032] In some examples, the control circuitry is configured to monitor one or more system parameters and adjust one or more of the first or second volumetric flow rate, the first or second pressure, or the first or second rate of application of the first electrolyte solution or the second electrolyte solution in response to the one or more system parameters.

[0033] In some examples, the system includes a first reservoir containing a first electrolyte solution and a second reservoir containing a second electrolyte solution.

[0034] In some instances, the first portion and the second portion overlap.

[0035] In some examples, the first portion and the second portion do not overlap.

[0036] In some examples, the first nozzle and the second nozzle operate simultaneously.

[0037] In some examples, the system includes an interface for receiving input or code from a user.

[0038] In some examples, the control circuitry is further configured to automatically select a program or electrochemical machining program for one or more specimens based on the input or code.

[0039] In some examples, the system includes one or more valves configured to receive an external input of airflow to flush the one or more electrolyte solutions from the first nozzle or the second nozzle.

[0040] In some disclosed examples, an electrochemical machining system for machining a surface of one or more specimens includes one or more reservoirs containing one or more electrolyte solutions, one or more nozzles configured to eject one or more jets of the one or more electrolyte solutions toward a surface of the one or more specimens, and control circuitry for controlling the one or more electrochemical machining processes, the control circuitry configured to: direct one or more jets of the one or more electrolyte solutions from a first reservoir of the one or more reservoirs toward a first portion of a surface of a first one of the one or more specimens; direct one or more jets of the one or more electrolyte solutions from a second reservoir of the one or more reservoirs toward a first portion of a surface of a second one of the one or more specimens; and apply an electric charge to the one or more nozzles and to the one or more specimens such that the nozzles and the specimens define a first electrode and a second electrode of an electrolytic cell.

[0041] In some examples, the one or more electrolyte solutions include a first electrolyte solution contained in a first reservoir and a second electrolyte solution contained in a second reservoir.

[0042] In some examples, one of the first reservoir or the second reservoir includes multiple chambers for holding one or more of a first electrolyte solution, a second electrolyte solution, or other fluids.

[0043] In some examples, the system further comprises a water reservoir for recirculating rinse water during the electrochemical machining process.

[0044] In some examples, the system further comprises a valve configured to receive an external input of airflow to flush the electrolyte solution from the nozzle.

[0045] In some examples, the system further comprises an interface for receiving input or code from a user. In examples, the control circuitry is further configured to receive input providing a size or processing cycle for the one or more specimens. In examples, the control circuitry is further configured to automatically select a program or electrochemical machining program for the one or more specimens based on the input or code. In examples, the control circuitry is further configured to receive a selection of a specimen type or electrochemical machining program for the one or more specimens and automatically select a first electrolyte or a second electrolyte based on the selected specimen type or electrochemical machining program.

[0046] FIG. 1 illustrates an electrochemical machining system 100 for machining the surface of a specimen or workpiece 135. In particular, the system 100 enables a user to process one or more specimens 135 in a single specimen processing cycle (e.g., according to one or more processing programs), including multiple processes on multiple specimens. In some examples, one or more nozzles 108 are connected to one or more tanks or reservoirs 120 via one or more conduits 122, and control of fluid flow from the reservoirs is controlled via one or more pumps (see, e.g., examples in FIGS. 2 and 3). In examples, a controller or processor 114 connected to the system 100 controls movement of the nozzles (e.g., by controlling one or more motors, actuators, etc.) according to a selected program and / or cycle.

[0047] As shown in FIG. 1 , there are multiple ways to implement such features, for example, by using an imaging device 104 (e.g., a camera, a vision acquisition system). One or more specimens 135 (e.g., in a fixture 102) are positioned on a stage 106, the surface of which has multiple coordinates (e.g., on the X-axis, Y-axis, or Z-axis). In some examples, the coordinates correspond to a start point, an end point, and / or one or more intermediate points for each specimen and / or each specimen processing cycle. Programs are selectable (e.g., by a user via the user interface 110 and / or automatically identified via one or more inputs and / or triggers) to be executed for each specimen and initiated through similar means. Once selected or identified, the system 100 executes a given program over the area of ​​the specimen corresponding to the selected program. In some examples, the system is capable of notifying the user (e.g., via an alert, a display on the user interface, etc.) in response to one or more milestones throughout the program, such as upon specific processing of a particular specimen, upon completion of a cycle or portion of a cycle of a selected program, and / or upon completion of the program itself.

[0048] In one example, the specimen 135 is placed in the fixture 102 (e.g., a specimen holder), and the fixture is then placed in the system 100, for example, on the stage 106. The fixture 102, specimen(s) 135, and / or stage 106 may include one or more positioning features (e.g., text, graphics, shapes, geometric shapes, etc.) to ensure that the fixture is placed in the system 100 at a predetermined location, orientation, and / or Z-axis position relative to the stage 106, the imaging device 104, the nozzle 108, and / or some other system reference point.

[0049] The system 100 has the ability to scan the surface area of ​​the sample being processed (e.g., in the X and Y axes) to optimize the treatment process and avoid overlapping application of electrolyte to the sample. This includes the ability of the system 100 to process larger areas on a given sample and to process larger samples in a shorter period of time. In one example, the system 100 can scan the surface area of ​​the sample (e.g., by using the imaging device 104 and / or other sensors, e.g., laser raster scanning), and / or the user can input one or both of the X coordinate (e.g., the end point of the sample from left to right) and the Y coordinate (e.g., the end point of the sample from front to back). The control system 114 is configured to optimize the processing cycle to process the entire area in a single run. This includes determining the location of the nozzle 108 relative to the sample (e.g., in the X, Y, or Z axis), the volume of electrolyte, the rate of electrolyte application, and / or the type of electrolyte being delivered at various points along the surface area of ​​the sample.

[0050] In some instances, the surface of the specimen may be uneven. For example, the height or Z distance from the nozzle 108 and / or stage 106 may vary across the area to be processed. However, ensuring the distance between the nozzle and the specimen's surface is important for consistent, high-quality processing of the specimen. Accordingly, the system 100 is configured to map the surface to recognize when the specimen is not level. This can be achieved, for example, by probing the surface with the nozzle 108 by contacting the surface at various points along the specimen and creating a map of the surface plane by correlating the height measurements with their corresponding XY coordinates (e.g., either known, determined by one or more sensors, and / or input by a user). Based on the height measurements, the system 100 controls the nozzle 108 to adjust its position in the Z axis relative to the specimen as it traverses the specimen surface during the processing process.

[0051] In some examples, a user command (e.g., via UI 110) to indicate the type of fixture being used is provided, and system 100 can identify the sample locations (e.g., by accessing a list stored on a connected memory device). The specific program to be executed for each sample(s) is initiated in response to an input and / or trigger (e.g., user selection, response to a timer, completion of a predetermined condition, etc.). System 100 then executes the program over each sample and / or identified area and provides a notification to the user when the cycle(s) are complete.

[0052] In some examples, indicators 112 (e.g., codes, tags, radio frequency devices, etc.) on the fixture and / or specimen are acquired by the system 100 (e.g., via one or more sensors, image capture device 104, etc.), allowing the system 100 to automatically identify the fixture and / or specimen without additional user input. In some examples, the system 100 scans the indicators to identify the type of fixture and / or specimen mounted on the stage 106, and the system 100 identifies the specimen 135 by accessing a list (e.g., in a memory device) of specimen types associated with various indicators. Based on the identification information and the specific program to be executed for each specimen, the system initiates a machining cycle(s).

[0053] In some examples, the image capture device 104 can provide a visual display to a user corresponding to a characteristic 105 of the specimen 135, the progress of a machining program, or other feature associated with the system. For example, the image capture device 104 can be a laser scanner and / or light beam transmitter that illuminates the start of an etching cycle and / or follows the movement of the nozzle and / or electrolyte solution during the cycle. This can assist a user in positioning the nozzle at the start and end of an etching cycle and / or in adjusting the machining path taken during the program.

[0054] In one example, fiducial indicators are projected onto the sample and / or stage to indicate proper placement of the sample 135 on the stage 106. For example, optical and / or laser light (e.g., from a projection device 109 collocated with the nozzle 108) can be projected as a single point or dot, a boundary corresponding to an area and / or a processing area of ​​the sample 135, so that a user and / or a robotic system can place the sample 135 in a desired location on the stage 106. Once the sample 135 is positioned, another sensor (e.g., the imaging device 104) can verify placement on the stage 106.

[0055] While some examples describe the use of a sensor, e.g., a single image capture device / camera, to gather information, in some examples, various numbers of different sensors are used. For example, one or more sensors can monitor environmental conditions (e.g., temperature, humidity, chemical composition, etc.) and / or system parameters (e.g., voltage, current, power, etc.). Sensors can be located within the system device and / or external to the system. Additionally, sensors can be integrated with the system and / or linked via another remote system.

[0056] In some examples, the user interface 110 is interactive and operable to receive input and present information, e.g., configurable softkeys, information about the sample and / or program, and images acquired by the system 100. For example, the imaging device 104 is operable to acquire an image 116 of the sample 135 and display the image 116 on the user interface 110. Based on the acquired image data, the user and / or the system 100 can calibrate the system and / or imaging device 104 by, for example, setting a reference position (e.g., X-axis, Y-axis, or Z-axis) on the sample 135 and / or stage 106 directly via a digital representation (e.g., 2D, 3D) of the sample in the image 116. In some examples, the user can select points along the sample 135 and / or stage 106 via the user interface 110 by navigating the scanned image corresponding to the starting and subsequent positions of the nozzle, regardless of how the sample is placed / positioned on the stage, or if there is no stage. Additionally or alternatively, the user can select a program (and / or the system can automatically select a program) via the user interface 110 for each sample and start the program and / or cycle.

[0057] 1, the specimen 135 is processed in a first etch region 105 A and a second etch region 105 B. In other words, the system 100 can control the nozzle 108 and / or the stage 106 to move relative to each other to process different specimens and / or regions of the specimen according to a program and / or cycle.

[0058] In some examples, system components (e.g., imaging device 104, nozzle 108 and / or nozzle movement system 109, user interface 110, stage 106 and / or stage movement device 111, etc.) communicate with controller or control circuitry 114 via wired and / or wireless connections. In some examples, controller 114 is operable to control one or more parameters of a program and / or cycle in response to input from a user (e.g., via user interface 110). For example, controller 114 can adjust the speed of program execution, the position of one or more components, the flow rate of fluids, the imaging of the sample, etc.

[0059] The controller 114 is further operable to cause the user interface 110 to display information, warnings, and / or images 116 relating to the execution of a program or cycle. In some examples, the controller 114 is connected to a remote device (e.g., a tablet, a smartphone, a network, a remote computer, etc.) and can transmit information (via wire or wirelessly) to such a device.

[0060] Although several exemplary systems using a single nozzle are shown, one or more of the disclosed systems and / or methods can comprise two or more nozzles. In the case of multiple nozzles, during a cycle or program, a user can select the number of nozzles to use and for which samples, or the system can determine the appropriate and / or optimal processing step(s) for each nozzle. The system then independently controls each nozzle to perform the cycle(s). For example, one or more actuators, motors, drives, or gear mechanisms can control the movement of the nozzle(s) to execute the selected cycle or program.

[0061] 1A shows a stage 106 with multiple samples 135A, 135B, 135C loosely positioned thereon. For example, a grid and / or other recognizable pattern 107 can be overlaid on the surface of the stage 106. The grid / pattern 107 can have one or more reference features for identifying the location of the samples on the stage 106 and the relative locations of the various samples. The imaging device 104 can acquire information related to the location data and identification of each sample. The location and identification information is used by the controller 114 to control the processing of the samples.

[0062] 2 shows another exemplary electrochemical machining system 200 that uses two or more nozzles 108A and 108B operating within an etching chamber 202. Each nozzle is connected to a tank or reservoir 120A or 120B, respectively, via one or more conduits 122A, 122B. In some examples, pumps 124A, 124B control the flow of one or more fluids (e.g., electrolyte solution) from the tanks 120A, 120B, which are controlled via the system 200 (e.g., via a controller and / or processor) according to a selected program and / or cycle.

[0063] In some examples, pump 124A and pump 124B control the flow of one or more fluids from a single tank (e.g., tank 120A or tank 120B) to one or both of nozzles 108A and 108B. In examples where a single tank includes multiple chambers, multiple fluids can be drawn from different chambers. In some examples, as shown in FIG. 2, pump 124A controls the flow of fluid from tank 120A, and pump 124A controls the flow of fluid from tank 120B separately and independently from pump 124A.

[0064] In some examples, both nozzles 108A and 108B are operating simultaneously, with nozzle 108A dispensing a first fluid 126A under pressure onto sample 135A and nozzle 108B dispensing a second fluid 126B under pressure onto samples 135B and / or 135C. In some examples, each nozzle dispenses its respective fluid onto one or more samples during a program, and each fluid can be applied at different times during the program, to different regions of one or more samples, and / or according to one or more application parameters (e.g., volumetric flow rate, pressure, velocity, duration, etc.).

[0065] The use of multiple reservoirs has the advantage of increasing the throughput of the system, allowing samples to be processed with different fluids (e.g., electrolytes) without modifying the reservoirs and / or the system. Thus, programs using multiple / different fluids can be loaded into the system and run as disclosed herein. Additionally, the ability to fill one of the reservoirs with water for use during a rinse cycle in the program allows the user to place the machine in a location without a rinse water connection.

[0066] 3 shows another embodiment of an exemplary system 200 using multiple nozzles. As shown, a single sample 135 is subjected to treatment from a first fluid 126A and a second fluid 126B. In such treatment, the fluids can be applied simultaneously, sequentially, and / or in alternating cycles.

[0067] FIG. 4 illustrates another system 300 that uses multiple reservoirs 120A and 120B, similar to system 200. However, in the example of FIG. 4, there is a single nozzle 108 within enclosure 302 that can apply first fluid 126A and / or second fluid 126B for treating sample 135. System 300 uses multiple reservoirs configured to operate independently of one another. The reservoirs can be comprised of one or more of electrolyte, water, and / or other suitable fluids. In some examples, a third reservoir, pump, and / or nozzle can be included to provide rinse water, for example, in a closed system (not integrated into a piping system).

[0068] In some examples, one or more connectors or valves 310 are positioned along one or more conduits leading to the nozzle 108. The valves are configured to introduce fluids and / or gases (e.g., compressed air, ambient air, inert gas, etc.) into the conduits to flush fluids from and / or through the conduits, thereby removing fluid(s) from the nozzle 108 and cleaning the sample 135 and / or stage 106. For example, compressed air can be introduced at the valve 310 (e.g., via a hose, additional conduits, etc.) during equipment calibration, process setup, application of different fluids, and / or after a completed program or cycle. In some examples, operation of the air compressor is controlled by the control circuitry 114 to coordinate the operation of other system components.

[0069] In one example, system 300 controls pump 124A to pump fluid 126A to nozzle 108 for processing sample 105. During this cycle, fluid 126A flows to drain 304 and is pumped via pump 124C to valve 306. Valve 306 is controlled to selectively direct fluids to the appropriate reservoir (e.g., reservoir 120A) to avoid cross-contamination between fluids. The use of multiple reservoirs in a single system that can direct different fluids to corresponding reservoirs provides flexibility not available in processing systems that include only one pump and / or reservoir. In particular, processing a sample with a different electrolyte in a system with one pump and / or reservoir requires the removal and replacement of reservoirs and / or a change of fluid before the start of the next portion of the cycle.

[0070] As shown, one or both of reservoirs 120A and 120B can include one or more sensors 308A and 308B, respectively. The sensors are configured to monitor one or more properties of the fluid (e.g., before, during, and / or after a cycle or program) and provide data corresponding to the properties to the controller. The properties can include one or more of the fluid's conductivity, refractive index, viscosity, flow rate, or charge, as a non-limiting list of examples. This data allows the system to determine useful information regarding the quality, or "health," of the fluid (e.g., electrolyte). One or more fluid properties can then be compared to a list that associates fluid properties with sample types and / or process results. This allows the machine to quantitatively determine the fluid's quality, the fluid's remaining useful life, and / or whether the fluid is still suitable for use as a given process.

[0071] Advantageously, by using sensors to determine fluid quality, the system can provide more consistent processing results. In particular, if the electrolyte fluid is outside a threshold range of quality values, damage to the specimen due to poor etching and / or polishing can be avoided, as well as time spent reworking (of the damaged specimen) and / or additional time spent in the process (to compensate for the use of poor quality fluid). The system can be operable to provide a warning to the user that the fluid needs to be changed before running a program with poor quality fluid. In some examples, the sensor is further configured to measure other system parameters, such as, by way of a non-limiting list of examples, the volume of fluid in the reservoir and the temperature of the fluid or the system.

[0072] 5 shows a detailed view of the example reservoir 120A of FIG. 4. As shown, reservoir 120A holds a volume of fluid 126, which can be pumped through conduit 122A and directed back to the reservoir via conduit 122C. Sensor 308A is incorporated into reservoir 120A and configured to measure one or more properties of the fluid. Sensor 308A is connected to controller 114 via wired and / or wireless wiring 123. As shown, information regarding the quality of fluid 126 can be presented on user interface 116.

[0073] In some examples, reservoir 120A can be labeled with an indicator, radio frequency identification (RFID) tag, and / or code 112 readable by one or more sensors of the system (e.g., image capture device 104, radio frequency reader, near field communication (NFC) reader, etc.) to automatically provide data regarding the type of reservoir, the type of fluid in the reservoir, and / or other information associated with the reservoir or fluid to system controller 114. The data enables the controller to track the operation of one or more pumps indicating which fluid is being used and automatically select the appropriate or desired fluid for a given machining cycle.

[0074] In some examples, a user can input information about the reservoir and / or fluid via user interface 110. This allows for modifications to the system, such as manual overrides, and / or for inputting information in a system without a corresponding sensor and / or without an indicator present in the reservoir. The system can include sensors 128 (e.g., contact sensors, weight sensors, optical sensors, laser sensors, etc.) to detect the presence and / or absence of a reservoir. Upon determining the presence of a reservoir (e.g., based on data from sensor 128), user interface 110 can prompt the user to input information about the type of electrolyte contained in the reservoir, which is then recorded in the memory of system controller 114.

[0075] Although the example of Figure 5 shows a single reservoir 120A, the concepts of reservoir and / or fluid identification and / or fluid property monitoring are equally applicable to systems using one or more reservoirs and / or one or more nozzles.

[0076] 6 illustrates an exemplary fixture 130 configured to support multiple samples 135. For example, the fixture 130 can include multiple holes 134 for accommodating each sample 135. As shown, one or more indicators 112A can be disposed on the fixture 130 and / or one or more indicators 112B can be disposed on the sample 135. These indicators are acquired by the image sensing device 104, and the acquired data can be transmitted to the controller 114, where the data can be used to determine an appropriate program and / or cycle for the one or more samples 135, as disclosed herein. As shown, the fixture 130 can rest on a platform 132, which can facilitate movement (e.g., rotational movement) of the fixture 130 relative to the nozzle 108 and / or imaging device 104.

[0077] 7 shows another system 400 using a reservoir 420 similar to system 100, shown with a single nozzle 408 that can apply fluid 426 within enclosure 402 for processing sample 135. A conduit 422, assisted by a pump or valve 424, receives fluid 426 from reservoir 420. While the exemplary system 400 uses a single reservoir, multiple reservoirs can be used in some instances, as disclosed herein.

[0078] 7, a filtration system 430 for filtering electrolyte fluid can be connected to reservoir 420 via one or more conduits 436A and 436B. One or more pumps or valves 434A and 434B can draw fluid from reservoir 420 through filter 442 to filter tank 440 and / or push fluid back into the reservoir in preparation for another sample processing operation.

[0079] The filtering operations performed through filtration system 430 and / or reservoirs may include forcing one or more of electrolyte, water, and / or other suitable fluids (e.g., contained in reservoir 420, conduit 422, nozzle 408, valve 424, etc.) through conduits 436A and 436B, valves 434A and 434B, and / or filter 442. Such rinsing may be performed between filtering operations using the first and second reservoirs and / or first and second fluids (e.g., first and second electrolytes). Thus, the filtering operations remove impurities from the fluids (e.g., electrolyte) to provide a more consistent application of electrolyte during processing.

[0080] Filter 442 can include a single filter and / or multiple filters, one or more of which may be removable for cleaning and / or replacement from tank 440. Although filter 442 is shown as being located within tank 440, one or more filters may be located within conduits 436A and 436B and / or valves 434A and 434B.

[0081] In some examples, a drain and / or release valve 444 can be incorporated into the filter tank 440 so that any fluid remaining after the filtering operation can be drained. In some examples, the filtration system 430 can be cleaned between filtering operations, such as with rinse water, which can be drained through the drain 444.

[0082] Filtration system 430 can operate independently of system 400 and / or can be controlled by a common control system (e.g., control circuitry 114) to coordinate the operation of other system components. While illustrated as operating on a single reservoir, in some examples, filtration system 430 can be connected to multiple reservoirs and perform filtration operations on multiple reservoirs simultaneously and / or sequentially. In some examples, filtration system 430 is a self-contained system that can be attached to and / or detached from a given reservoir.

[0083] The above description and accompanying drawings illustrate the principles, preferred embodiments, and modes of operation. However, the present disclosure should not be construed as limited to the particular embodiments described above. Additional variations on the above-described embodiments will be apparent to those skilled in the art.

[0084] Although the present method and / or system has been described with reference to certain specific embodiments, those skilled in the art will recognize that various modifications and equivalents may be substituted without departing from the scope of the present method and / or system. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the scope of the present disclosure. For example, blocks and / or components of the disclosed examples may be combined, divided, rearranged, and / or otherwise modified. Therefore, the present method and / or system is not limited to the particular embodiments disclosed. Instead, the present method and / or system includes all embodiments falling within the scope of the appended claims, both literally and under the doctrine of equivalents. While the controller and method are described as being used in conjunction with a grinding / polishing and / or hardness / density testing system, the present teachings are equally applicable to other systems and operations.

[0085] All documents referred to in this application, including published journal articles or abstracts, published or corresponding U.S. or foreign patent applications, issued or foreign patents, or any other documents, are each incorporated by reference in their entirety, including all data, tables, figures, and text presented within the referenced documents.

Claims

1. 1. An electrochemical machining system for machining a surface of a specimen, comprising: a nozzle configured to eject a jet of electrolyte solution toward the surface of the specimen; 1. A control circuitry for controlling an electrochemical machining process, comprising: receiving inputs that provide a program for the sample; directing the jet of the electrolyte solution from the nozzle toward a portion of the surface of the specimen based on the program; applying an electric charge to the nozzle and to the sample based on the program so that the nozzle and the sample define a first electrode and a second electrode of an electrolytic cell; a control circuit for performing the above; A system comprising:

2. The system of claim 1 , further comprising an interface for receiving the input or code from a user.

3. The system of claim 2 , wherein the control circuitry is further configured to automatically select a program for the sample based on the input or the code.

4. The control circuitry further includes: monitoring one or more system parameters of the surface; adjusting one or more of a volumetric flow rate, a pressure, or a rate of application of the electrolyte solution based on the program and in response to the one or more system parameters; The system of claim 1 configured to:

5. The system of claim 4 , wherein the one or more system parameters of the surface include voltage or current.

6. The control circuitry further includes: measuring the level of said voltage or current; comparing the measured voltage or current to a list of voltage or current thresholds; adjusting the voltage or current level if the measured voltage or current is outside a voltage or current threshold; The system of claim 5 configured to:

7. The system of claim 1 , wherein the device is configured to apply jets of the electrolyte solution to multiple samples in a single cycle.

8. The control circuitry further includes: receiving a first electrochemical machining program and a second electrochemical machining program from the input; applying a jet of the electrolyte solution to a first region of the specimen at a first volumetric flow rate, a first pressure, or a first velocity during a first electrochemical machining program; applying a jet of the electrolyte solution to a second region of the specimen at a second volumetric flow rate, a second pressure, or a second velocity during a second electrochemical machining program; The system of claim 7 configured to:

9. The system of claim 1 , further comprising a sensor for monitoring one or more system parameters.

10. The system of claim 9 , wherein the sensor is a fluid sensor for monitoring one or more of the conductivity, refractive index, viscosity, flow rate, or charge of the electrolyte solution.

11. The system of claim 9 , wherein the sensor is an optical or laser system configured to image or scan the sample.

12. 10. The system of claim 9, wherein the sensor is an optical or laser system configured to image or scan the code or an indicator representing other information about the sample.

13. 10. The system of claim 1, further comprising an optical system or a laser system configured to present a reference image onto the sample or the stage to align the sample with the nozzle at a desired position on the stage where the sample is placed.

14. The system of claim 1 , further comprising a valve configured to receive an external input of airflow to flush the electrolyte solution from the nozzle.

15. 1. An electrochemical machining system for machining a surface of one or more specimens, comprising: one or more nozzles configured to eject one or more jets of one or more electrolyte solutions toward the surface of the one or more specimens; 1. A control circuitry for controlling an electrochemical machining process, comprising: directing the one or more jets of the one or more electrolyte solutions from a first nozzle of the one or more nozzles toward a first portion of the surface of the one or more specimens; directing the one or more jets of the one or more electrolyte solutions from a second one of the one or more nozzles toward a second portion of the surface of the one or more specimens; applying an electric charge to the one or more nozzles and to the one or more samples such that the nozzles and the samples define first and second electrodes of an electrolytic cell; a control circuit for performing the above; A system comprising:

16. 16. The system of claim 15, wherein the control circuitry is further configured to control the first nozzle independently of the second nozzle.

17. 16. The system of claim 15, wherein the first nozzle is configured to apply the one or more jets to the one or more samples as first jets of a first electrolyte solution, and the second nozzle is configured to apply the one or more jets to the one or more samples as second jets of a second electrolyte solution.

18. 18. The system of claim 17, wherein the first nozzle is configured to apply the first jet of the first electrolyte solution to the first portion of the surface of the specimen at a first volumetric flow rate, a first pressure, or a first velocity, and the second nozzle is configured to apply the jet of the second electrolyte solution to the second portion of the surface of the specimen at a second volumetric flow rate, a second pressure, or a second velocity.

19. The system of claim 18 , wherein the first volumetric flow rate, the first pressure, or the first speed corresponds to a first electrochemical machining program.

20. The system of claim 18 , wherein the second volumetric flow rate, the second pressure, or the second speed corresponds to a second electrochemical machining program.

21. The control circuitry further includes: monitoring one or more system parameters; adjusting one or more of the first or second volumetric flow rate, the first or second pressure, or the first or second rate of application of the first electrolyte solution or the second electrolyte solution in response to the one or more system parameters; 21. The system of claim 20 configured to:

22. 20. The system of claim 17, further comprising a first reservoir containing the first electrolyte solution and a second reservoir containing the second electrolyte solution.

23. The system of claim 15 , wherein the first portion and the second portion overlap.

24. The system of claim 15 , wherein the first portion and the second portion are non-overlapping.

25. The system of claim 15 , wherein the first nozzle and the second nozzle operate simultaneously.

26. 16. The system of claim 15, further comprising an interface for receiving the input or code from a user.

27. 17. The system of claim 16, wherein the control circuitry is further configured to automatically select a program or an electrochemical machining program for the one or more specimens based on the input or the code.

28. 16. The system of claim 15, further comprising one or more valves configured to receive an external input of airflow to flush the one or more electrolyte solutions from the first nozzle or the second nozzle.

29. 1. An electrochemical machining system for machining a surface of one or more specimens, comprising: one or more reservoirs containing one or more electrolyte solutions; one or more nozzles configured to eject the one or more electrolyte solutions in the form of one or more jets toward the surface of the one or more specimens; a control circuitry for controlling one or more electrochemical machining processes, directing the one or more jets of the one or more electrolyte solutions from a first reservoir of the one or more reservoirs toward a first portion of a surface of a first sample of the one or more samples; directing the one or more jets of the one or more electrolyte solutions from a second one of the one or more reservoirs toward a first portion of a surface of a second one of the one or more samples; applying an electric charge to the one or more nozzles and to the one or more samples such that the nozzles and the samples define first and second electrodes of an electrolytic cell; a control circuit for performing the above; A system comprising:

30. 30. The system of claim 29, wherein the one or more electrolyte solutions include a first electrolyte solution contained in the first reservoir and a second electrolyte solution contained in the second reservoir.

31. 31. The system of claim 30, wherein the one or more nozzles include a first nozzle and a second nozzle, the first nozzle configured to draw the first electrolyte solution from the first reservoir and direct a first jet of the first electrolyte solution at the surface.

32. 32. The system of claim 31 , wherein the second nozzle is configured to draw the second electrolyte solution from the second reservoir and direct a second jet of the second electrolyte solution at the surface.

33. 31. The system of claim 30, wherein one of the first reservoir or the second reservoir includes a plurality of chambers for holding one or more of a first electrolyte solution, a second electrolyte solution, or other fluids.

34. 30. The system of claim 29, further comprising a water reservoir for recirculating rinse water during the electrochemical machining process.

35. 30. The system of claim 29, further comprising a valve configured to receive an external input of airflow to flush the electrolyte solution from the nozzle.

36. 30. The system of claim 29, further comprising an interface for receiving the input or code from a user.

37. 37. The system of claim 36, wherein the control circuitry is further configured to receive an input providing a size or processing cycle for the one or more specimens.

38. 38. The system of claim 37, wherein the control circuitry is further configured to automatically select a program or an electrochemical machining program for the one or more specimens based on the input or the code.

39. 38. The system of claim 37, wherein the control circuitry is further configured to receive a selection of a specimen type or an electrochemical machining program for the one or more specimens, and automatically select the first electrolyte or the second electrolyte based on the selected specimen type or the electrochemical machining program.

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