Lighting module and lighting device

Abstract

The lighting device disclosed in the embodiments of the invention may include a substrate, a light source disposed on the substrate, a resin layer that seals the light source, a reflective layer disposed between the substrate and the resin layer, a reflective portion bent from the reflective layer to face the emission surface of the light source, and a joint portion disposed between the reflective portion and the substrate.

Description

[Technical Field]

[0001] Embodiments of the invention relate to a lighting module and a lighting device comprising the same. [Background technology]

[0002] Lighting applications include not only vehicle lighting but also backlighting for displays and signs. Light-emitting devices, such as light-emitting diodes (LEDs), offer advantages over existing light sources such as fluorescent lamps and incandescent lamps, including low power consumption, a semi-permanent lifespan, fast response, safety, and environmental friendliness. Light-emitting diodes are used in various display devices and various lighting devices, such as interior and exterior lights. Lamps using light-emitting diodes have been proposed as vehicle light sources. Compared to incandescent lamps, light-emitting diodes have the advantage of low power consumption. However, because the light emitted from light-emitting diodes has a narrow angle of incidence, there is a demand for an increased light-emitting area when using light-emitting diodes as vehicle lamps. Light-emitting diodes offer greater design flexibility due to their small size, and their semi-permanent lifespan also makes them economical. Summary of the Invention [Problem to be solved by the invention]

[0003] An embodiment of the present invention provides a lighting module and a lighting device that improves the reflection efficiency of light emitted from a light emitting element sealed in a resin layer by using an inclined reflective layer.An embodiment of the present invention provides a lighting module and a lighting device in which a portion of the reflective layer disposed between the resin layer and the substrate is bent at a predetermined angle by using a joint.

[0004]

[0010] Embodiments of the invention provide a lighting module and a lighting device having an inclined reflective layer disposed between a substrate and a resin layer, facing at least one outer surface of a light-emitting element to change the path of light.

[0011] Embodiments of the invention can provide a lighting module and a lighting device having a reflective layer bent toward the upper surface of the resin layer between multiple light-emitting elements or on the light-emitting side of each light-emitting element.

[0012] Embodiments of the invention improve the reliability of the lighting module and the lighting device, and such a module or device can be applied to electronic devices. [Means for solving the problem]

[0005] An illumination device according to an embodiment of the invention may include a substrate, a light source disposed on the substrate, a resin layer that seals the light source, a reflective layer disposed between the substrate and the resin layer, a reflective portion bent from the reflective layer to face the exit surface of the light source, and a joint disposed between the reflective portion and the substrate.

[0006] An illumination device according to an embodiment of the invention may include a substrate, a light source disposed on the substrate, a resin layer that seals the light source, a first reflective layer disposed between the substrate and the resin layer, a second reflective layer disposed on the resin layer and facing the first reflective layer, a reflective portion bent to face the side of the first reflective layer excluding the exit surface of the light source, and a bonding portion disposed between the reflective portion and the substrate.

[0007] According to an embodiment of the present invention, the substrate may include a bonding pad to which the bonding portion is bonded. The bonding portion may be made of a solder material. An upper end of the reflector may be positioned higher than an upper surface of the light source.

[0008] According to an embodiment of the invention, the joints may have a continuous or discontinuous loop shape. At least one of the joints and the joint pads is disposed on at least one side of the light source. The joints may be disposed in a circular or polygonal shape around the light source.

[0009] According to an embodiment of the present invention, an end of the reflective portion may be exposed to a side surface of the resin layer. The reflective portion may include a reflective pattern on an upper surface thereof.

[0010] According to an embodiment of the invention, the reflective portion may be bent from a region adjacent to a first surface of the resin layer facing the light source exit surface toward the upper surface of the resin layer, and a lower end line of the reflective portion may have a straight or curved shape along a side surface of the resin layer.

[0011] According to an embodiment of the invention, the light source may be a side-view type light emitting device package that emits light toward a side surface of the resin layer. The light source may be a flip-chip type light emitting device package that emits light from at least five surfaces. The reflective portion may extend from the reflective layer to a thickness equal to the thickness of the reflective layer. [Effects of the Invention]

[0012] According to embodiments of the present invention, it is possible to reduce light loss within a lighting device and improve light extraction efficiency. According to embodiments of the present invention, by tilting or bending a portion of a reflective layer between a substrate and a resin layer, it is possible to reduce light loss and improve bright spots and bright lines in the surface light source distribution without installing an additional structure. In addition, it is possible to reduce dark areas in the periphery of a lighting module.

[0013] According to the embodiments of the present invention, the reflective layer can be tilted or bent using the bonding portion bonded to the dummy pad of the substrate, thereby reducing light loss without adding processes or structures. According to the embodiments of the present invention, a lighting module and a lighting device having a uniform lighting image can be provided, and the reliability of an electronic device having the same can be improved. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is an example of a cross-sectional side view of a lighting device according to a first embodiment of the invention.

[0015] [Figure 2] FIG. 2 shows an example in which the lighting device of FIG. 1 is coupled to a housing.

[0016] [Figure 3] FIG. 3 is another example of a joint for the lighting device of FIG.

[0017] [Figure 4] FIG. 4 is another example of the lighting device of FIG.

[0018] [Figure 5] FIG. 5 is a plan view showing the shape of the reflective portion of the reflective layer according to an embodiment of the invention. [Figure 6] FIG. 6 is a plan view showing the shape of the reflective portion of the reflective layer according to an embodiment of the invention.

[0019] [Figure 7] FIG. 7 is an example of a cross-sectional side view of an illumination device according to a second embodiment of the invention.

[0020] [Figure 8] 8A to 8D are diagrams showing examples of bonding parts arranged around the light emitting element of FIG.

[0021] [Figure 9] FIG. 9 is a perspective view of a lighting device according to a third embodiment of the invention.

[0022] [Figure 10] 10 is a BB side cross-sectional view of the lighting device of FIG.

[0023] [Figure 11] 11 is a cross-sectional view of the illumination device of FIG. 9 taken along the line CC.

[0024] [Figure 12] FIG. 12 is a plan view showing the reflective portion of the reflective layer on the lighting device of FIG.

[0025] [Figure 13] FIG. 13 is a diagram showing an example of a plan view of a vehicle having a lighting device of the invention.

[0026] [Figure 14] FIG. 14 shows an example of a taillight of a vehicle to which the lighting device of FIG. 13 is applied. DETAILED DESCRIPTION OF THE INVENTION

[0027] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0028] The technical spirit of the present invention is not limited to some of the described embodiments and may be embodied in various different forms. One or more of the components of the embodiments may be selectively combined or substituted within the scope of the technical spirit of the present invention. Furthermore, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as generally understandable by those skilled in the art to which the present invention pertains, unless expressly defined otherwise. Commonly used terms, such as dictionary-defined terms, may be interpreted in light of the context of the relevant technology. Furthermore, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention. In this specification, the singular form "a," "an," or "an" may also include the plural form unless otherwise specified. For example, "A and at least one (or more) of B and C" refers to one or more of all possible combinations of A, B, and C. Furthermore, terms such as "first," "second," "A," "B," "(a)," and "(b)" may be used to describe components of the embodiments of the present invention. Such terms are used to distinguish a component from other components and do not determine the nature or order of the components. When a component is described as being "coupled," "coupled," or "connected" to another component, it can refer not only to the case where the component is directly coupled, coupled, or connected to the other component, but also to the case where the component is "coupled," "coupled," or "connected" by another component between the other component. When a component is described as being formed or located "above or below" another component, "above" or "below" refers not only to the case where the two components are in direct contact with each other, but also to the case where one or more other components are formed or located between the two components. When "above" or "below" is used, it can refer not only to the upward direction relative to one component, but also to the downward direction.

[0029] The lighting device according to the present invention can be applied to various lamp devices requiring illumination, such as vehicle lamps, home lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, the lighting device can be used for headlamps, sidelights, turn signal lights, side mirror lights, fog lamps, tail lamps, back-up lamps, brake lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, backup lamps, etc. The lighting device according to the present invention can also be used in indoor and outdoor advertising devices, display devices, and various electric vehicles. It can also be used in all lighting and advertising fields that are currently developed and commercialized, or that can be realized through future technological developments.

[0030] FIG. 1 is an example of a side cross-sectional view of a lighting device according to a first embodiment of the invention, FIG. 2 is an example of the lighting device of FIG. 1 being coupled to a housing, FIG. 3 is another example of the joint of the lighting device of FIG. 1, FIG. 4 is another example of the lighting device of FIG. 2, and FIGS. 5 and 6 are plan views showing the shape of the inclined portion of the reflective layer according to an embodiment of the invention.

[0031] 1 to 6, a lighting device 400 according to an embodiment of the invention may include a substrate 401, a reflective layer 410, a light source 100, and a resin layer 420. The substrate 401 may include a printed circuit board (PCB). The substrate 401 may include at least one of a resin-based printed circuit board (PCB), a PCB with a metal core, a flexible PCB, a ceramic PCB, or an FR-4 board. If the substrate 401 is a metal-core PCB with a metal layer disposed on the bottom, the heat dissipation efficiency of the light source 100 can be improved.

[0032] The substrate 401 is electrically connected to the light source 100. The substrate 401 includes a wiring layer (not shown) thereon, which is electrically connected to the light source 100. The light source 100 includes one or more light emitting elements, which may be elements or packages having light emitting diodes (LEDs).

[0033] When multiple light emitting elements are arranged on the substrate 401, the multiple light emitting elements may be connected in series, parallel, or series-parallel by the wiring layer. The substrate 401 may function as a base member or a support member disposed under the light source 100 and the resin layer 420. Here, the light emitting elements of the light source 100 may be driven in groups or simultaneously. The upper surface of the substrate 401 may have an XY plane. The upper surface of the substrate 401 may be flat or curved. The thickness of the substrate 401 may be a height in a vertical direction or a Z direction. Here, in the XY plane, the X direction may be a first direction, and the Y direction may be a second direction. The Z direction may be a direction perpendicular to the first and second directions X and Y. The multiple first light sources 100 may be arranged on the substrate 401 at a regular pitch in the light emission direction, but this is not limited thereto. The substrate 401 may be provided in a linear or curved bar shape in the long direction. The substrate 401 may include a light-transmitting material that transmits light through its upper and lower surfaces. The light-transmitting material may include at least one of PET (Polyethylene terephthalate), PS (Polystyrene), and PI (Polyimide).

[0034] The substrate 401 may include, for example, an insulating layer or a reflective layer on top to protect the circuit pattern.

[0035] The light source 100 is disposed on the substrate 401 and emits light in a first direction X. The light source 100 emits light with the highest intensity through an exit surface 81. The light source 100 may have an exit surface 81 from which light is emitted, and the exit surface 81 may be disposed, for example, in a third direction Z or perpendicular to a horizontal upper surface of the substrate 401. The exit surface 81 may be a vertical plane, or may have a concave or convex surface. The light source 100 is bonded to a circuit pattern having pads disposed on the substrate 401 by a bonding member 250, and the bonding member 250 is made of a conductive material, such as a solder material or a metal material. The light source may include a plurality of light sources 100, and the plurality of light sources 100 may be arranged in one or more columns and / or one or more rows.

[0036] The light source 100 may emit at least one of blue, red, green, ultraviolet (UV), and infrared light, and may include an LED chip that emits at least one of white, blue, red, green, and infrared light. The light source 100 may be a side-view type light emitting device package whose bottom portion is electrically connected to the substrate 401. As another example, the light source 100 may be an LED chip or a top-view package.

[0037] When the light source 100 is a side-view type light emitting device, the light emitting surface 81 of the light emitting device is disposed on one side of the light emitting device, and the other side may be a non-light emitting surface with a body made of a reflective material.

[0038] A portion of the light emitted through the light emitting surface 81 of the light source 100 may travel in a direction parallel to the upper surface of the substrate 401, be reflected by the reflective layer 410, or travel toward the upper surface of the resin layer 420. The thickness of the light source 100 may be, for example, 3 mm or less, for example, in the range of 0.8 mm to 2 mm. The light source 100 may be embedded below the resin layer 420. The light emitting surface 81 and side surfaces of the light source 100 may be in contact with the resin layer 420.

[0039] The reflective layer 410 may be a layer separately attached to the upper surface of the substrate 401. The reflective layer 410 is disposed between the substrate 401 and the resin layer 420. The reflective layer 410 may be bonded to the upper surface of the substrate 401. The reflective layer 410 may have an area smaller than the area of ​​the upper surface of the substrate 401. The reflective layer 410 may be spaced apart from the edge of the substrate 401, and the resin layer 420 is attached to the upper edge of the substrate 401 in the spaced apart area. This prevents the edge portion of the reflective layer 410 from peeling off. The reflective layer 410 may include a hole 417 in which the lower part of the light source 100 is disposed. The upper surface of the substrate 401 is exposed through the hole 417 of the reflective layer 410, and a portion where the lower part of the light source 100 is bonded is disposed in the hole 417. The size of the hole 417 may be the same as or larger than the size of the light source 100, but is not limited thereto.

[0040] The reflective layer 410 may be bonded between the resin layer 420 and the substrate 401. The reflective layer 410 may be formed to a thickness thinner than that of the light source 100. The thickness of the reflective layer 410 may be in the range of 0.23 mm±0.02 mm. The lower part of the light source 100 may penetrate through the hole 417 in the reflective layer 410, and the upper part of the light source 100 may protrude from the upper surface of the reflective layer 410. The light emission surface 81 of the light source 100 is provided in a direction perpendicular to the upper surface of the reflective layer 410.

[0041] The reflective layer 410 may be provided as a film having a single layer or multi-layer structure. The reflective layer 410 may include a metallic material or a non-metallic material. The metallic material may include metals such as aluminum, silver, and gold. The non-metallic material may include a plastic material or a resin material. The resin material may include silicone or epoxy with a reflective material, for example, a metal oxide such as TiO2, Al2O3, or SiO2 added thereto. The reflective layer 410 may be implemented as a single layer or a multi-layer structure, and this layer structure may improve light reflection efficiency. The reflective layer 410 according to the embodiment of the invention may reflect incident light, thereby increasing the amount of light so that the light is emitted with a uniform distribution. The reflective layer 410 may include a reflective pattern 45 (FIG. 3) protruding from its upper surface. The reflective pattern 45 may reflect traveling light and improve the distribution of surface light extracted through the surface of the resin layer 420. The reflective patterns 45 may be arranged in a uniformly spaced distribution, or may be arranged in a more densely or more narrowly spaced distribution as they move away from the light output surface 81 of the light source 100 .

[0042] The resin layer 420 is disposed on the substrate 401. The resin layer 420 is disposed on the reflective layer 410. The resin layer 420 is disposed on the entire upper surface or a partial area of ​​the upper surface of the reflective layer 410. The lower surface area of ​​the resin layer 420 may be equal to or larger than the upper surface area of ​​the reflective layer 410. The resin layer 420 may be made of a transparent material and may guide or diffuse light. The resin layer 420 may be made of a resin-based material, such as silicone or epoxy, or may include a UV-curable resin material. Such a resin material may be used instead of a light guide plate and has the advantage of being easy to adjust the refractive index and thickness.

[0043] In addition, the resin layer 420 uses the oligomer disclosed above as a main material and can adjust hardness, heat resistance, and transmittance by mixing IBOA, a diluent monomer, and GMA, and can also improve adhesion and oxidation resistance. The resin layer 420 can contain a photoinitiator and a light stabilizer to adjust curing and prevent discoloration. Since the resin layer 420 is provided as a resin layer that guides light, it can be provided with a thinner thickness than glass and can be provided as a flexible plate. The resin layer 420 can emit point light emitted from the light source 100 in the form of a line light source or a surface light.

[0044] The resin layer 420 may contain a diffusion agent such as beads (not shown), which diffuse and reflect incident light to increase the amount of light. The beads may be disposed in a range of 0.01 to 0.3% by weight of the resin layer 420. The beads may be made of any one selected from the group consisting of silicone, silica, glass bubbles, PMMA (Polymethyl methacrylate), urethane, Zn, Zr, Al2O3, and acrylic, and the particle diameter of the beads may be, but is not limited to, about 1 μm to about 20 μm.

[0045] The resin layer 420 may include a phosphor (not shown) therein. The phosphor may convert the wavelength of the light from the light source 100, for example, to at least one of red, green, and blue. As another example, if the phosphor is disposed in an area adjacent to the light source 100, i.e., within the resin layer 420, it may be damaged by heat. Therefore, a separate wavelength conversion layer (not shown) may be further disposed on the upper surface of the resin layer 420. The wavelength conversion layer may include a phosphor therein or may include a phosphor and ink particles. The ink particles may include red or yellow ink particles.

[0046] The resin layer 420 is disposed on the light source 100, thereby sealing the light source 100, protecting the surface of the light source 100, and reducing loss of light emitted from the light source 100. The light source 100 may be embedded below the resin layer 420. The resin layer 420 may be in contact with the surface of the light source 100 and the light emission surface 81 of the light source 100. A portion of the resin layer 420 is disposed in the hole 417 of the reflective layer 410. A portion of the resin layer 420 may be in contact with the upper surface of the substrate 401 through the hole 417 of the reflective layer 410. As a result, a portion of the resin layer 420 comes into contact with the substrate 401, thereby fixing the reflective layer 410 between the resin layer 420 and the substrate 401.

[0047] The thickness of the resin layer 420 may be 1.8 mm or more, for example, in the range of 1.8 mm to 2.5 mm. If the thickness of the resin layer 420 is greater than this range, the luminous intensity may decrease, and the increased module thickness makes it difficult to provide a flexible module. If the thickness of the resin layer 420 is less than this range, it makes it difficult to provide surface light with uniform luminous intensity. The resin layer 420 may be provided in a size sufficient to cover a plurality of light sources 100. The resin layer 420 may be separated into portions each having a size sufficient to cover each of the plurality of light sources 100. The side surfaces of the resin layer 420 may include a first surface S1 facing the light output surface 81 of the light source 100, and a second surface S2 facing the rear surface of the light source 100, i.e., the surface opposite the light output surface 81. The first surface S1 and the second surface S2 may be opposite surfaces.

[0048] The light source 100 can emit light toward the first surface S1. The light emitted by the light source 100 is guided through the resin layer 420, reflected by the reflective layer 410, and then emitted through the surface, i.e., the top, of the resin layer 420. The resin layer 420 can provide a uniformly distributed surface light.

[0049] The resin layer 420 may include an optical member 430 (see FIG. 4) on the upper surface thereof for uniform light distribution. The optical member 430 may include a single layer or multiple layers and may include a diffusing material. The diffusing material may include at least one of polyester (PET), PMMA (Poly Methyl Methacrylate), or PC (Poly Carbonate).

[0050] Some of the light emitted from the light source 100 may travel toward the side of the resin layer 420. In this case, there is a risk of light loss occurring through the side of the resin layer 420. Therefore, in order to achieve uniform light distribution, it is necessary to increase the number of light sources 100, narrow the intervals between the light sources 100, increase the pattern shape or density of the reflective pattern 45, or use a light emitting device with high output.

[0051] In an embodiment of the invention, the reflective layer 410 may include a reflective portion 41. The reflective portion 41 is disposed in an area adjacent to a first surface S1 of the resin layer 420 facing the light exit surface 81 of the light source 100. The reflective portion 41 may protrude higher than the upper surface of the reflective layer 410. The reflective portion 41 may be bent from a portion of the reflective layer 410 toward the upper surface of the resin layer 420. Since the reflective portion 41 is formed by bending and extending a portion of the reflective layer 410, the thickness of the reflective portion 41 and the thickness of the reflective layer 410 may be the same.

[0052] At least a portion of the reflector 41 may face the exit surface 81 of the light source 100. The reflector 41 is disposed between the exit surface 81 and the first surface S1. This allows the reflector 41 to reflect light emitted through the exit surface 81 of the light source 100 toward the upper surface of the resin layer 420. The upper end of the reflector 41 is disposed above the optical axis Lx of the light source 100. The upper end of the reflector 41 is disposed above a line horizontal to the upper surface of the light source 100. This allows light in the optical axis direction, which has the highest luminous intensity in the light source 100, to be reflected by the reflector 41, thereby reducing light loss leaking through the first surface S1 of the resin layer 420. The upper end of the reflector 41 may be disposed higher than the optical axis Lx and lower than the upper surface of the resin layer 420. The height of the upper end of the reflector 41 from the surface of the reflective layer 410 may be 0.15 mm or more, for example, in the range of 0.15 mm to 2.2 mm.

[0053] The reflective portion 41 has a line connecting the reflective layer 410 and the bent point of the reflective portion 41 to the end of the upper surface of the reflective portion 41, which is inclined at an angle R1 with respect to a horizontal line (K1) at the upper end of the reflective portion 41. The angle R1 may be less than 90 degrees, for example, in the range of 10 degrees to 80 degrees or in the range of 15 degrees to 60 degrees. If the angle R1 of the reflective portion 41 is smaller than the above range, the light loss suppression effect may be reduced or a dark area may occur on the first surface S1. If the angle R1 is larger than the above range, a hot spot may occur around the first surface S1 of the resin layer 420.

[0054] The end of the reflective portion 41 may or may not be exposed on the first surface S1 of the resin layer 420. When the end of the reflective portion 41 is exposed on the first surface S1 of the resin layer 420, the reflective portion 41 is arranged at an incline, and then the resin layer 420 is molded, and the end of the reflective portion 41 can be exposed and supported outside the side surface of the resin layer 420, and a cutting process can be performed thereafter. In this case, it is possible to prevent a problem of deviation in the inclination angle of the reflective portion 41 during the molding process of the resin layer 420. When the end of the reflective portion 41 is not exposed on the first surface S1 of the resin layer 420, the resin layer 420 covers the outside of the reflective portion 41, thereby protecting the end of the reflective portion 41.

[0055] The bonding portion 11 is disposed between the substrate 401 and the reflector 41. The bonding portion 11 is made of a material bonded to a pad of the substrate 401, for example, a conductive material, such as a solder material or a metal material. That is, a bonding pad 43, i.e., a dummy pad, may be exposed in the area of ​​the substrate 401 where the bonding portion 11 is formed, and the bonding portion 11 may be formed on the dummy pad. The bonding pad 43 may be a pad that is not electrically connected to the light source 100.

[0056] The area of ​​the bonding pad 43 may be the same as or different from the area of ​​the bonding portion 11, and may correspond to the area of ​​the bonding portion 11. The shape of the upper surface of the bonding pad 43 may correspond to the shape of the lower surface of the bonding portion 11. In addition, when there are a plurality of bonding pads 43 and a plurality of bonding portions 11, the number of the bonding pads 43 and the number of the bonding portions 11 may be the same. The side cross section of the bonding portion 11 may be polygonal or hemispherical. The bonding portion 11 may have a solder ball shape as shown in FIG. 3. In addition, the bonding portion 11 may include a plurality of bonding portions 11A and 11B depending on the inclination or height of the reflecting portion 41. The plurality of bonding portions 11A and 11B may have different heights or thicknesses to support the lower surface of the reflecting portion 41. The plurality of bonding portions 11A and 11B may be arranged in the optical axis direction and may have a greater height or thickness as they are closer to the first surface S1. This allows the height from the bottom end to the top end of the reflecting portion 41 to be provided at a constant angle R1.

[0057] The thickness of the bonding portion 11 may be thicker than the thickness of the reflective layer 410. The center thickness or minimum thickness of the bonding portion 11 may be more than 1 time and not more than 5 times the thickness of the reflective layer 410, for example, in the range of 1.5 to 5 times or 2 to 4 times. If the thickness of the bonding portion 11 is less than this range, the upper end of the reflective portion 41 may be bent, and if it is greater than this range, a concave groove or an irregularly curved surface may be generated at the lower end of the reflective portion 41, which reduces the uniformity of light distribution.

[0058] The maximum thickness of the bonding part 11 may be equal to or greater than half the vertical distance between the upper end of the reflective part 41 of the reflective layer and the upper surface of the substrate 401. That is, by positioning the bonding part 11 to support the lower part of the reflective part 41 at a point halfway between the upper and lower ends, problems such as a concave groove at the lower part of the reflective part 41 or bending of the upper part can be reduced.

[0059] In this embodiment of the invention, a bonding portion 11 is disposed under the reflective layer 410, and the reflective portion 41 is bent toward the upper surface of the resin layer 420 by the bonding portion 11, and is disposed to face the emission surface 81 of the light source 100. This reduces the amount of light emitted through the emission surface 81 of the light source 100 that leaks through the first surface S1 of the resin layer 420, and improves the light uniformity around the first surface S1 of the resin layer 420.

[0060] In addition, the first region 421 between the reflective part 41 and the substrate 401 may be filled with the resin layer 420, or may be an adhesive or air region. When the resin layer 420 is filled with the first region 421, an opening is formed in the reflective part 41, and a part of the molded resin layer 420 is filled therein.

[0061] FIG. 2 shows a structure in which a housing is disposed outside the lighting device of FIG.

[0062] 2, a housing 501 supports the bottom of the substrate 401, and outer side portions 503 may be disposed higher than the top surface of the resin layer 420 on both sides of the resin layer 420. The side portions 503 of the housing 501 may reflect light leaking through the reflecting portion 41 or an upper portion of the first surface S1 of the resin layer 420.

[0063] 3, a reflective pattern 45 is formed on the upper surface of the reflective layer 410, and the reflective pattern 45 is formed on the reflective portion 41. The reflective patterns formed on the reflective portion 41 may be arranged smaller or more densely than the reflective patterns adjacent to the light source 100.

[0064] As shown in FIG. 4 , the lighting device 400 includes an optical member 430 disposed on the resin layer 420. The optical member 430 may be a single-layer or multi-layer diffusion plate. A light-shielding portion 425 is disposed between the optical member 430 and the resin layer 420. The light-shielding portion 425 is disposed above the light source 100 from which light is emitted, and can suppress hot spots by blocking or reflecting incident light. The light-shielding portion 425 may overlap the light source 100 in a vertical direction. The light-shielding portion 425 may be formed as a single layer or multiple layers and may include a reflector. The area of ​​the light-shielding portion 425 may be larger than the top surface area of ​​the light source 100, or may be 1.5 times or more the top surface area of ​​the light source 100.

[0065] The optical member 430 may include at least one of a diffusing agent such as beads, a phosphor, and ink particles. The phosphor may include at least one of a red phosphor, an amber phosphor, a yellow phosphor, a green phosphor, and a white phosphor. The ink particles may include at least one of a metallic ink, a UV ink, and a curable ink. The size of the ink particles may be smaller than that of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, and blue. The ink type may be selected from PVC (Polyvinyl Chloride) ink, PC (Polycarbonate) ink, ABS (Acrylonitrile Butadiene Styrene Copolymer) ink, UV resin ink, epoxy ink, silicone ink, PP (Polypropylene) ink, water-based ink, plastic ink, PMMA (Polymethyl Methacrylate) ink, and PS (Polystyrene) ink. The ink particles may include at least one of a metallic ink, a UV ink, and a curable ink.

[0066] An adhesive layer 415 is disposed between the optical member 430 and the resin layer 420, and the adhesive layer 415 bonds the optical member 430 and the resin layer 420. The light-blocking portion 425 may be separated from the resin layer 420 by an air gap 427 within the adhesive layer 415. The lower surface of the light-blocking portion 425 may not contact the upper surface of the resin layer 420. The thickness of the light-blocking portion 425 may be thinner than the thickness of the adhesive layer 415, and the region between the lower surface of the light-blocking portion 425 and the upper surface of the resin layer 420 may be a partial space of the air gap 427, i.e., a sealed space. Such a sealed space may improve light diffusion efficiency.

[0067] 5, the reflective portion 41 of the reflective layer 410 may be disposed to be inclined in a region facing the light emitting surface 81 of the light source 100, and the bottom line of the reflective portion 41 may be disposed in a parallel linear form along the first surface S1 of the resin layer 420. The distance between the bottom line of the reflective portion 41 and the first surface S1 may be the same.

[0068] 6, the reflective portion 41 of the reflective layer 410 is disposed to be inclined in a region facing the light emitting surface 81 of the light source 100, and the bottom line of the reflective portion 41 may be disposed non-parallel along the first surface S1 of the resin layer 420. The distance between the bottom line of the reflective portion 41 and the first surface S1 may be small in the region where the light source 100 is disposed and large outside the outermost light source 100. That is, the bottom line of the reflective portion 41 is formed as a curved line that is narrow in the center of the reflective portion 41 and wide at the outer edge, so that the distance from the light emitting surface 81 of the light source 100 can be maintained within a predetermined range. As a result, the distribution of light reflected by the reflective portion 41 is uniform at the center and the outside of the reflective portion 41.

[0069] 7 and 8 show a lighting device according to Example 2. In the description of Example 2, the portions that overlap with Example 1 can include the description of Example 1.

[0070] 7 and 8, the light source 100A may include a light emitting device that emits light from at least five sides. The light emitting device may be a flip-chip type light emitting diode (LED) package. Here, at least four sides of the light source 100A may be defined as the emission surface as disclosed above. The reflective portions 41 of the reflective layer 410 are disposed around the light source 100A, for example, around each side of the light source 100A. The reflective portions 41 of the reflective layer 410 are spaced apart at the same distance as each side of the light source 100A to reflect light with a uniform distribution. The reflective portions 41 are provided with an inclined structure on both or all sides of the light source 100A, thereby reflecting light emitted through the side of the light source 100A to be extracted to the upper surface of the resin layer. The outer end of the reflective layer 410, i.e., the end of the reflective portion 41, may or may not be exposed to the side of the resin layer 420.

[0071] The joint 11 may be spaced apart from each side of the light source 100A by a predetermined distance. As shown in (A), (B), (C), and (D) of FIG. 8, the joint 11 may be arranged in a continuous loop shape or a discontinuous loop shape. The joint 11 may have a circular or polygonal shape. The joint 11 is arranged in an area spaced apart from the hole in which the light source is arranged. The joint 11 may be bonded to a bonding pad at its bottom to support the reflector 41. That is, at least one joint 11 and one bonding pad are arranged on at least one side of the light source 100A.

[0072] 9 to 12 show an illumination device according to a third embodiment.

[0073] 9 to 12, the lighting device 400A includes one or more light sources 100, and irradiates light emitted from the light sources 100 as a line-shaped surface light source. The lighting module 400A may include a first surface S1 facing the light source 100, a second surface S2 opposite the first surface S1, and a plurality of third and fourth surfaces S3 and S4 extending in a second direction from both ends of the first surface S1 and the second surface S2. The first to fourth surfaces S1, S2, S3, and S4 are each side surface of the resin layer 420.

[0074] The lighting device 400A may include a plurality of light sources 100 arranged in one direction. The light sources 100 may be arranged in one row, or alternatively, in two rows. The light sources 100 arranged in one direction may face the first surface S1, i.e., the front surface. The light exit surface 81 of each of the light sources 100 may face the first surface S1. Light emitted from the light source 100 is emitted through the first surface S1, and some of the light may be directed toward another side. Based on the light source 100, a distance D2 between the light source 100 and the first surface S1 and a distance D3 between the light source 100 and the second surface S2 may be different from each other. The distance D3 between the light source 100 and the second surface S2 may be 2 mm or more, for example, in the range of 2 mm to 20 mm. If the distance D3 between the light source 100 and the second surface S2 is smaller than the above range, moisture may penetrate or the area for forming a circuit pattern may become smaller. If the distance D3 is larger than the above range, the size of the lighting device 400A may become larger.

[0075] The lighting device 400A may include a plurality of protrusions P1, P2, and P3 corresponding to the light sources 100, and recesses C1 and C2 between the protrusions P1, P2, and P3. Each of the protrusions P1, P2, and P3 corresponds to the center of the light source 100, and the closer an area corresponds to the center of the light source 100, the farther the distance from the light source 100. The protrusions P1, P2, and P3 may protrude toward the first surface S1 relative to the light emitting elements 101, 102, and 103, and the recesses C1 and C2 may be recessed toward the second surface S2 relative to the first surface S1. The protrusions P1, P2, and P3 may include convex curved surfaces. The recesses C1 and C2 may include concave curved surfaces. The protrusions P1, P2, and P3 may have a first curvature, and the second recesses C1 and C2 may have a second curvature having a radius smaller than the radius of the first curvature. The first surface S1 to the fourth surface S4 of the resin layer 420 may have the same thickness or height.

[0076] The lighting device 400A includes a substrate 401 below a resin layer 420, a first reflective layer 410 between the substrate 401 and the resin layer 420, and a second reflective layer 440 above the resin layer 420. The resin layer 420 is disposed to surround a plurality of light sources 100. The substrate 401 is thin, allowing for a flexible lighting device. The first reflective layer 410 may be the same layer as the reflective layer in the first and second embodiments. The protrusions P1, P2, and P3 may include a first protrusion P1 corresponding to the first light emitting element 101, a second protrusion P2 corresponding to the second light emitting element 102, and a third protrusion P3 corresponding to the third light emitting element 103. The recesses C1 and C2 may include a first recess C1 disposed between the first and second protrusions P1 and P2 and a second recess C2 disposed between the second and third protrusions P2 and P3.

[0077] The convex portions P1, P2, and P3 can diffuse light emitted from the light-emitting surfaces 81 of the light-emitting elements 101, 102, and 103. To this end, the first to third convex portions P1, P2, and P3 can overlap with the light-emitting surfaces 81 of the first to third light-emitting elements 101, 102, and 103 in the horizontal direction.

[0078] The maximum width W1 of the convex portions P1, P2, and P3 may be the distance between the adjacent concave portions C1 and C2, which may be equal to or smaller than the pitch G1 of the light sources 100. If the maximum width W1 of the convex portions P1, P2, and P3 is larger than the pitch G1 between the light sources 100, two or more light emitting elements may be disposed in the area of ​​the convex portions P1, P2, and P3, thereby increasing luminous intensity. If the maximum width W1 of the convex portions P1, P2, and P3 is smaller than the pitch G1 between the light sources 100, the size of the convex portions P1, P2, and P3 is small, providing a uniform light distribution, but reducing luminous intensity. Here, the distance between the outermost light emitting element 103 and the outer surface S4 of the resin layer 420 may be smaller than the pitch G1.

[0079] The first recess C1 may horizontally overlap the region between the first and second light emitting elements 101 and 102, and the second recess C2 may horizontally overlap the region between the second and third light emitting elements 102 and 103. The first and second recesses C1 and C2 may transmit or reflect a portion of incident light. The first and second recesses C1 and C2 may suppress the occurrence of dark areas in the region between the light emitting elements 101, 102, and 103.

[0080] The first reflective layer 410 is disposed between the resin layer 420 and the substrate 401. The resin layer 420 may cover the light source 100. The resin layer 420 may be in contact with the top and side surfaces of the light source 100. The resin layer 420 may be in contact with the top surface of the first reflective layer 410. A portion of the resin layer 420 may be in contact with the substrate 401 via the first reflective layer 410. The resin layer 420 may be in contact with the emission surface 81 of the light source 100.

[0081] The resin layer 420 is disposed between the first and second reflective layers 410 and 440. The first and second reflective layers 410 and 440 have the same area and are disposed to face each other at the bottom and top of the resin layer 420. As a result, the resin layer 420 can diffuse and guide light emitted from the light source 100 and light reflected by the first and second reflective layers 410 and 440 toward the sides. The resin layer 420 is formed to a thickness b that is thicker than the thickness of the light source 100. As a result, the resin layer 420 can protect the upper part of the light source 100 and prevent moisture penetration.

[0082] The lighting device 400A has a length Y1 that is long in one direction and is greater than the width X1 between the first and second surfaces S1 and S2. The thickness Zb of the resin layer 420 is the distance between the first and second reflective layers 410 and 440. The distance (e.g., Zb) between the first and second reflective layers 410 and 440 may be smaller than the distance between the first surface S1 and the second surface S2. By setting the distance between the first and second reflective layers 410 and 440 to be smaller than the width X1 or the minimum width of the lighting device 400A, a line-shaped surface light source can be provided, improving luminous intensity and preventing hot spots. The thickness Zb of the resin layer 420 may be less than twice the thickness of the light source 100, for example, more than 1 time and less than 2 times. The thickness Zb of the resin layer 420 may be, for example, in the range of 1.5 mm to 1.9 mm or 1.6 mm to 1.8 mm. The thickness Zb of the resin layer 420 may be 0.8 times or less the thickness Z1 of the lighting device 400A. This prevents a decrease in light efficiency in the lighting device 400A and enhances flexibility. The resin layer 420 may contain a phosphor. The phosphor may include at least one of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor.

[0083] The region of the resin layer 420 where the convex portions P1, P2, and P3 are formed serves as a lens portion. The lens portion of the resin layer 420 has a convex curved surface and may have a hemispherical shape when viewed from the top. The lens portion may refract light incident on a region off the optical axis at an exit angle greater than the incident angle.

[0084] The first reflective layer 410 may reflect light emitted from the light source 100. The first reflective layer 410 is formed on the upper surface of the substrate 401. The first reflective layer 410 may be attached to the upper surface of the substrate 401 with an adhesive. The first reflective layer 410 has a plurality of holes 417 in an area corresponding to the lower surface of the light source 100, and the light source 100 is connected to the substrate 401 through the holes 417. The first reflective layer 410 may include a white resin material or a plastic material. The first reflective layer 410 may include a white resin material or a polyester (PET) material. The first reflective layer 410 may include at least one of a low-reflection film, a high-reflection film, a diffuse reflection film, or a regular reflection film. The first reflective layer 410 may be provided as a regular reflection film for reflecting incident light to the first surface S1, for example.

[0085] The thickness Zc of the first reflective layer 410 may be smaller than the thickness of the substrate 401. The thickness Zc of the first reflective layer 410 is set to be 0.5 times or more the thickness of the substrate 401 to reduce the transmission loss of incident light. The thickness Zc of the first reflective layer 410 may be in the range of 0.2 mm to 0.4 mm. If the thickness Zc is smaller than this range, a light transmission loss occurs, and if the thickness Zc is thicker than this range, the thickness Z1 of the lighting device 400A increases.

[0086] The second reflective layer 440 is disposed on the resin layer 420. The second reflective layer 440 may be bonded to the upper surface of the resin layer 420. The second reflective layer 440 may be disposed over the entire upper surface of the resin layer 420 to reduce light loss. The second reflective layer 440 may be made of the same material as the first reflective layer 410. The second reflective layer 440 may be made of a material with higher light reflectivity or a greater thickness than the material of the first reflective layer 410 to reflect light and reduce light transmission loss. The thickness Zd of the second reflective layer 440 may be the same as or thicker than the thickness Zc of the first reflective layer 410, and may be made of a material with the same or higher reflectivity than the material of the first reflective layer 410. The thickness Zd of the second reflective layer 440 may be smaller than the thickness of the substrate 401.

[0087] The first reflective layer 410 includes a reflective portion 41, which is disposed on both side surfaces and a rear surface of each of the light emitting elements 101, 102, and 103 of the light source 100. The reflective portion 41 faces both side surfaces and a rear surface of each of the light emitting elements 101, 102, and 103 of the light source 100, but does not necessarily face the light emitting surface 81 of each of the light emitting elements 101, 102, and 103. As another example, the reflective portion 41 is disposed below at least one or all of the convex portions P1, P2, and P3 and the concave portions C1 and C2 of the resin layer 420. As another example, the second reflective layer 420 may include a reflective portion disposed below at least one or all of the convex portions P1, P2, and P3 and the concave portions C1 and C2 of the resin layer 420.

[0088] The reflective portion 41 of the first reflective layer 410 may face the area of ​​each of the light emitting elements 101, 102, and 103 excluding the emission surface 81. This allows light leaking through the second to fourth surfaces S2, S3, and S4 of each of the light emitting elements 101, 102, and 103 to be reflected. The inclination angle of the reflective portion 41 may be higher than that of the first embodiment, for example, 20 degrees or more, for example, in the range of 30 degrees to 90 degrees. For example, the first inclination angle of the reflective portion 41 adjacent to the second surface S2 of each of the light emitting elements 101, 102, and 103 may be the highest, and the second inclination angle of the reflective portion 41 adjacent to the third and fourth surfaces S3 and S4 may be smaller than the first inclination angle. That is, since light is extracted from the first surface S1 of the resin layer 420, the reflective portions 41 may be arranged so that the inclination angle increases as they move away from the first surface S1. Furthermore, on the upper surface of the reflecting portion 41, the above-disclosed reflecting pattern 45 (FIG. 3) is disposed.

[0089] A bonding portion 11 is disposed in a region between the reflective portion 41 and the substrate 401, and the bonding portion 11 may be bonded onto a bonding pad 43. The bonding portion 11 is disposed in a region spaced apart from both side and rear surfaces of each of the light emitting devices 101, 102, and 103, and supports the lower portion of the reflective portion 41. The material of the bonding portion 11 is more rigid than the material of the reflective portion 41, so that the bonding portion 11 can prevent the reflective portion 41 from sagging. The bonding pad 43 and the bonding portion 11 are formed continuously or discontinuously along the outer periphery of each of the light emitting devices 101, 102, and 103, excluding the light emitting side region.

[0090] The upper end of the reflective portion 41 is disposed higher than the upper surface of each of the light emitting elements 101, 102, and 103, thereby improving the light reflection efficiency of the reflective portion 41. In an embodiment of the invention, at least one or all of the first and second reflective layers 410 and 420 may include a reflective portion that is inclined or bent by the joint as disclosed above.

[0091] 12, the bottom line of the reflective portion 41 may be disposed in a form that covers both sides and the rear surface of each light emitting element, and thus the reflective layer 410 may include a flat region 410B in the front direction and a sloped region 410A in the rear direction.

[0092] The laminated structure of the substrate 401, the first reflective layer 410, the resin layer 420, and the second reflective layer 440 may include the convex portions P1, P2, and P3 and the concave portions C1 and C2. The convex portions P1, P2, and P3 have flat upper and lower surfaces and may be curved or hemispherical in a first direction. The concave portions C1 and C2 may have concave surfaces in a rear surface S2 direction. The convex and concave surfaces of the resin layer 420 may be treated as haze surfaces to diffuse light. The haze surfaces may be treated as rougher surfaces than the inner surfaces of the resin layer 420 to diffuse emitted light. As another example, the reflective portions may be implemented by the second reflective layer 440.

[0093] The lighting device 400A according to the embodiment of the invention may have a thickness Z1 in a line shape, and may provide a flexible, line-shaped surface light source. The thickness Z1 of the lighting device 400A may be 3 mm or less. That is, the lighting device 400A is provided as a line-shaped surface light source having a thickness of 3 mm or less.

[0094] FIG. 13 is a plan view of a vehicle to which the lighting device according to the embodiment is applied, and FIG. 14 is a diagram showing an example of a taillight of the vehicle in FIG.

[0095] 13 and 14, in a moving body or vehicle 900, a front lamp 850 may include one or more lighting modules, and the activation timing of these lighting modules may be individually controlled to provide not only a normal headlight function but also additional functions such as a welcome light or a celebration effect when a driver opens a vehicle door. The lamp may be applied to a daytime running light, a high beam, a low beam, a fog lamp, or a turn signal light.

[0096] In vehicle 900, taillight 800 includes a plurality of lamp units 810, 812, 814, and 816 supported by housing 801. For example, lamp units 810, 812, 814, and 816 may include a first lamp unit 810 disposed on the outside, a second lamp unit 814 disposed around the inside of first lamp unit 810, and third and fourth lamp units 814 and 816 disposed inside second lamp unit 814, respectively. The first to fourth lamp units 810, 812, 814, and 816 may selectively employ the lighting devices disclosed in the embodiments, and red or white lens covers may be disposed on the outside of the lighting devices depending on the lighting characteristics of the lamp units 810, 812, 814, and 816. The lighting devices disclosed in the embodiments applied to such lamp units 810, 812, 814, and 816 may emit surface light with a uniform distribution.

[0097] The first and second lamp units 810, 812 may be provided in at least one of a curved shape, a linear shape, an angular shape, an inclined shape, and a flat shape, or a combination thereof. One or more of the first and second lamp units 810, 812 may be provided in each tail light. The first lamp unit 810 may be provided as a tail light, the second lamp unit 812 may be provided as a brake light, the third lamp unit 814 may be provided as a backup lamp, and the fourth lamp unit 816 may be provided as a turn signal lamp. The structure and position of such illumination lamps may be changed.

[0098] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment may be combined or modified with other embodiments by a person skilled in the art to which the embodiment belongs. Therefore, such combinations and modifications are to be construed as falling within the scope of the present invention. Furthermore, while the above description focuses on the embodiments, these are merely examples and do not limit the present invention. A person skilled in the art to which the present invention belongs may make various modifications and applications not exemplified above within the scope of the present embodiments, provided that such modifications and applications do not deviate from the essential characteristics of the present embodiments. For example, each component specifically presented in the embodiments may be modified. Such modifications and variations are to be construed as falling within the scope of the present invention, as defined by the appended claims.

Claims

1. A substrate; a light source disposed on the substrate; a resin layer that seals the light source; a reflective layer disposed between the substrate and the resin layer; a reflecting portion bent from the reflecting layer so as to face the light output surface of the light source; a bonding portion disposed between the reflecting portion and the substrate.

2. A substrate; a light source disposed on the substrate; a resin layer that seals the light source; a first reflective layer disposed between the substrate and the resin layer; an upper reflective layer disposed on the resin layer and facing the reflective layer; a reflecting portion bent so as to face a side surface of the reflecting layer excluding the light emitting surface of the light source; a bonding portion disposed between the reflecting portion and the substrate.

3. The lighting device of claim 1 or 2, wherein the substrate includes a bond pad to which the bond portion is bonded.

4. The lighting device according to claim 3 , wherein an upper end of the reflecting portion is disposed higher than an upper surface of the light source.

5. The lighting device according to claim 3 , wherein the joint has a continuous or discontinuous loop shape.

6. The lighting device according to claim 1 , wherein the reflecting portion is bent from a region adjacent to a first surface of the resin layer that faces an emission surface of the light source toward an upper surface of the resin layer.

7. The lighting device of claim 6 , wherein the bottom line of the reflective portion is a straight line or a curved line along a side surface of the resin layer.

8. The lighting device according to claim 1 , wherein the joints are arranged in a circular or polygonal shape around the light source.

9. The lighting device according to claim 3 , wherein an end portion of the reflecting portion is exposed on a side surface of the resin layer.

10. The lighting device according to claim 1 , wherein the reflective portion extends from the reflective layer to a thickness equal to the thickness of the reflective layer.

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