Direct Lithium Metal Web Coating and Transfer Lamination with Fluorinated PET Film Carrier
Direct fluorination of carrier films for lithium deposition addresses contamination and waste issues in prelithiation, enhancing lithium-ion battery manufacturing efficiency and reducing environmental impact.
Patent Information
- Application Number
- JP2025524260
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-10-28
- Filing Date
- 2023-10-26
- Publication Date
- 2026-01-29
AI Technical Summary
Current methods for prelithiation of silicon-blend graphite anodes in lithium-ion batteries face issues such as contamination, low yield, and waste generation due to the use of plastic carriers, which are not economically viable and limit high-speed manufacturing.
A method involving direct fluorination of a carrier film to create a fluorinated layer that allows for the deposition and transfer of metallic lithium onto an anode with minimal contamination, enabling recyclable and reusable carrier films and improved lithium transfer efficiency.
The method enhances lithium deposition purity, reduces waste, and improves manufacturing throughput by using a recyclable carrier film with tunable release properties, ensuring high yield and reduced contamination.
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Abstract
Description
[Technical Field]
[0001] Background technology FIELD OF THE DISCLOSURE
[0001] Embodiments of the present disclosure generally relate to processes and apparatus for coating electrodes.
[0002] 2. Description of Related Art
[0002] Lithium (Li)-ion batteries have played a key role in the development of current generations of mobile devices, microelectronics, and electric vehicles. A typical Li-ion battery consists of a positive electrode (cathode), a negative electrode (anode), an ion-conducting electrolyte, a porous separator membrane (electrical insulator) between the two electrodes to physically separate the electrodes, and a package.
[0003]
[0003] Lithium batteries typically contain graphite materials as anodes. The use of graphite can result in lower capacity compared to the use of silicon-blend graphite. Currently, the industry is transitioning from graphite-based anodes to silicon-blend graphite to increase energy cell density. Silicon-blend graphite anodes can exhibit first-cycle irreversible capacity loss (IRC). The specific energy and energy density of lithium-ion batteries are significantly reduced due to the loss of active lithium during first-cycle charging, where approximately 5 to 20 percent of the lithium from the cathode is consumed by solid electrolyte interphase formation ("SEI") in the anode.
[0004]
[0004] Furthermore, deposition rates on these materials are limited. In silicon blend anodes, the binder in the anode is temperature sensitive. If the lithium deposition rate is too high, the polymer binder in the anode can degrade. In copper current collectors, if the lithium deposition rate is too high, the copper foil will wrinkle or otherwise be damaged. To be more economically viable, alternative methods of depositing lithium on anode materials while maintaining high throughput must be adopted.
[0005]
[0005] The carrier film can be used as a substrate in a prelithiation process to deposit lithium prior to transferring the deposited lithium from the carrier to the anode. Because vapor deposition of lithium onto the carrier film does not require the same complex equipment (e.g., no vacuum system) as depositing lithium onto the anode, prelithiation can be more economical and also allows for higher purity lithium than conventional methods, such as using stabilized lithium metal powder (SLMP) or rolled lithium foil.
[0006]
[0006] However, prelithiation by coating onto a plastic carrier film often leads to low yields or the production of contaminated material. Conventional lithium sources for prelithiation of alloy-type anodes or for preparing solid metal anodes rely on the deposition of a protective layer on the lithium metal (e.g., carbonate coatings on freestanding foils or dispersed particles). High surface energy siloxanes and other release agents contain oxygen, nitrogen, and hydrogen, which, along with the inherent moisture of the carrier film, contaminate the lithium metal.
[0007]
[0007] Additionally, the problem of how lithium is removed from the plastic carrier film has not been adequately addressed. If lithium is deposited on a plastic carrier film without a release layer, it can be removed once sufficient time has passed for the lithium to react with the silicon in the anode. However, this does not allow for mass production or high-speed manufacturing. Lithium that is rolled onto a carrier film often suffers from significant contamination due to the hydrocarbons used to roll the lithium or due to oxidation by the ambient air while waiting for the lithium to infiltrate.
[0008]
[0008] Commercially available lithium can be provided on laminated plastic carriers for prelithiation of silicon anodes. However, peeling or delamination of lithium from the plastic carrier after it has been deposited on the anode is currently uncontrolled. These commercially available solutions require a thick plastic layer for the carrier film, which makes it susceptible to interface and surface contamination due to carrier outgassing and air reaction. Commercially available deposited lithium on current carriers often exhibits lithium thickness variations and wrinkling on current carriers.
[0009] The above method also generates hazardous plastic waste since, after lithium is placed in the anode, the plastic carrier contains traces of lithium, increasing waste disposal costs.
[0010]
[0010] Thus, there is a need for improved methods of producing metallic lithium on a carrier film and improved methods of disposing metallic lithium on an anode.
[0011] overview
[0011] Embodiments of the present disclosure generally relate to processes and apparatus for coating electrodes.
[0012] In one embodiment, a method for manufacturing an energy storage device is provided. The method includes inspecting a carrier film, exposing the carrier film to a fluorine-containing gas to form a first fluorinated layer on an upper surface of the carrier film, and depositing an alkali metal layer on the upper surface of the first fluorinated layer to form a coated film. The method further includes laminating the coated film with an anode to form a laminated film. The method also includes peeling the carrier film from the anode, the alkali metal layer, and the first fluorinated layer to form a peeled carrier film comprising the carrier film. The method can further include inspecting, neutralizing, and washing the peeled carrier film, and exposing the peeled carrier film to a fluorine-containing gas to form a second fluorinated layer on the upper surface of the peeled carrier film.
[0013]
[0013] In another embodiment, a directly fluorinated carrier film is provided, comprising a carrier film. The directly fluorinated carrier film comprises a first fluorinated layer on the top surface of the carrier film and an alkali metal layer on the top surface of the first fluorinated layer. The directly fluorinated carrier film further comprises an alkali metal protection layer on the top surface of the alkali metal layer. The alkali metal protection layer comprises lithium carbonate, lithium fluoride, or bismuth. The thickness of the carrier film is between 10 μm and 150 μm. The directly fluorinated carrier film further comprises a second fluorinated layer on the bottom surface of the carrier film. The carrier film is also configured to be laminated with an anode.
[0014] In yet another embodiment, a method for lithiating an anode is provided that includes cleaning the anode, depositing an alkali metal layer on an exterior surface of the anode, and exposing the anode and the alkali metal layer to a fluorine-containing gas to produce a fluorinated layer on the exterior surface of the alkali metal layer, where the alkali metal layer comprises lithium.
[0015]
[0015] So that the features of the present disclosure referred to above can be understood in detail, a more particular description of the disclosure briefly summarized above can be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only exemplary embodiments of the present disclosure and are not to be considered as limiting the scope thereof, since other equally effective embodiments may be recognized. [Brief explanation of the drawings]
[0016] [Figure 1] FIG. 1 is a schematic diagram of a direct fluorination process on a carrier film according to one embodiment. [Figure 2] FIG. 1 is a schematic diagram of a fluorination chamber according to one embodiment. [Figure 3A] FIG. 1 is a schematic cross-sectional view of a directly fluorinated carrier film according to one embodiment. [Figure 3B] FIG. 1 is a schematic cross-sectional view of a directly fluorinated carrier film according to one embodiment. [Figure 3C] FIG. 1 is a schematic cross-sectional view of a directly fluorinated carrier film according to one embodiment. [Figure 4] FIG. 1 is a schematic diagram of a directly fluorinated carrier film manufacturing system according to one embodiment. [Figure 5] FIG. 1 is a schematic cross-sectional view of a directly fluorinated carrier film according to one embodiment. [Figure 6A] FIG. 1 is a schematic diagram illustrating an embodiment of a direct fluorination process on the anode. [Figure 6B] FIG. 1 is a schematic diagram of a fluorination chamber according to one embodiment.
[0017]
[0025] To facilitate understanding, the same reference numerals have been used, wherever possible, to designate identical elements common to the figures, and it is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
[0018] Detailed Description
[0026] Energy storage devices, such as lithium-ion batteries, typically include a positive electrode (e.g., cathode) and a negative electrode (e.g., anode) separated by multiple layers. Substrate independent direct transfer (SIDT) is a method for prelithiating anodes in energy storage devices to improve the battery's life cycle. These anodes can include, but are not limited to, graphite, silicon, silicon graphite, silicon oxide graphite, silicon, metallized plastic, and copper. In the SIDT process, lithium is first deposited onto a support layer composed of one or more hydrogen-carbon based polymers (e.g., polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), or combinations thereof). The material on the support layer is transferred directly to the anode for prelithiation. A release layer allows the lithium and other materials to be peeled from the support layer and transferred to the anode.
[0019]
[0027] Conventional exfoliation layers remain on the support layer after transferring the lithium and other layers. This reduces the ability to reuse the support layer in a subsequent SIDT process. This also exposes the transferred lithium on the anode, which can affect device stability, especially at high temperatures. The apparatus and methods described herein enable the exfoliation layer to be transferred to the anode along with the lithium layer, where it acts as a protective layer on the lithium during transfer.
[0020]
[0028] Direct fluorination of the support layer or carrier film provides tunable release properties with an electrochemically compatible and recoverable or recyclable interface compared to siloxane release interfaces contaminated with lithium nitride or oxide. The disclosed subject matter avoids the need to protect the as-deposited metallic lithium by addressing surface contamination with an engineered release layer on the carrier film. Furthermore, direct fluorination minimizes carrier film waste by enabling reuse of the carrier film after release.
[0021]
[0029] The disclosed subject matter provides process controls, including optimizing the thickness of the fluorinated layer and recycling to maximize anode-specific performance, yield, and economics. Thus, metallic lithium deposited by physical vapor deposition (PVD) can be laminated ex situ onto a substrate without surface contamination from the carrier film itself. Furthermore, the carrier film can be recovered and recycled to minimize consumable costs. The disclosed subject matter is also useful for directly fluorinating other anode active materials (AAMs) and cathode active materials (CAMs).
[0022]
[0030] Direct contact prelithiation is then enabled by thermal evaporation of metallic lithium onto the direct fluorinated carrier film. Double-sided direct fluorination provides a barrier to outgassing of the carrier film, which could contaminate the evaporated metallic lithium. Furthermore, the metallic lithium at the fluorinated interface possesses reproducible release properties without interfacial contamination. The lack of interfacial contamination at the release interface facilitates reuse of the carrier film, minimizing consumable waste and maximizing the economics of transfer lamination.
[0023]
[0031] 1 shows a schematic cross-sectional view of one implementation of a direct fluorination film carrier manufacturing process 100. The manufacturing process 100 includes a first web inspection 101, a direct fluorination process 102, an alkali metal deposition and protection process 103, a second web inspection 104, a transfer lamination process 105, an aging and peeling process 106, and a recovery and recycling process 107.
[0024]
[0032] The first web inspection 101 includes inspecting the cleaned carrier film 110. The carrier film 110 may include any hydrogen-carbon based polymer, such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), or a combination thereof. The thickness of the carrier film is between 12 μm and 150 μm. This inspection determines whether the carrier film 110 is suitable for further processing, such as identifying any wrinkles that may be present on the carrier film 110, any thinning that may be present on the carrier film 110, or any undesirable particles that may remain on the carrier film 110.
[0025]
[0033] Once the first web inspection 101 is complete, the carrier film 110 is then subjected to a direct fluorination process 102. The direct fluorination process 102, as further described below, results in a fluorinated carrier film 130 including a first fluorinated layer 120 on the top surface of the carrier film 110. Preferably, the fluorinated carrier film 130 may also include a second fluorinated layer 122 on the bottom surface of the carrier film 110. The second fluorinated layer 122 prevents front surface contamination during unwinding, eliminating the need for intermediate and protective layers.
[0026]
[0034] Once the fluorinated carrier film 130 is created, it may then be subjected to a vapor deposition process 103 to produce a coated film 150. A layer of an alkali metal (e.g., lithium) is evaporated onto the first fluorinated layer 120 to form a metal layer 140 on the first fluorinated layer 120. An air-stable metal protective layer 142 is deposited on the exposed surface of the metal layer 140 to protect the metal layer 140. The metal protective layer 142 may comprise an air-stable material including lithium carbonate (Li2CO3), lithium fluoride (LiF), or bismuth (Bi), or a combination thereof, and has a thickness of at least 1 μm or greater, preferably 2 μm or greater.
[0027]
[0035] The coated film 150 may then be subjected to a second web inspection process 104, in which the coated film 150 is inspected for uniform alkali metal thickness in the metal layer 140 and any level of contamination in the coated film 150 is determined. This second web inspection process 104 may be completed visually or may be completed using equipment (e.g., equipment that uses eddy currents to determine alkali metal thickness and uniformity).
[0028]
[0036] The coated film 150 is configured to undergo a transfer lamination process 105 to produce a laminated layer 170. The transfer lamination process 105 allows the top surface 142a of the metal protective layer 142 of the coated film 150 to be laminated with a graphite or alloy-type anode layer 160. The laminated layer 170 includes the coated film 150 and the anode layer 160. The metal protective layer 142 acts as a buffer layer between the metal layer 140 and the anode layer 160, preventing contamination of the metal layer 140.
[0029]
[0037] The laminated film 170 may then be subjected to an aging and peeling process 106. The laminated film 170 may then be aged for an appropriate length of time. Once the laminated film 170 has aged, a peeling process may be used to separate the cell layer 180, including the anode layer 160, the metal protective layer 142, the metal layer 140, and the first fluorinated layer 120, from the carrier film 110 and the release film 132, including the second fluorinated layer 122. Once peeled, the first fluorinated layer 120 transforms into a low-impedance peel interface 124. The peel interface 124 has a low thermal impedance. The cell layer 180 may be further processed into a cell assembly (not shown).
[0030]
[0038] The aging and peeling process 106 also produces a peeled film 132. The peeled film includes the carrier film 110, the second fluorinated layer 122, and an exposed surface 114 on top of the carrier film 110. The peeled film 132 can then be recovered, cleaned, and reused in the manufacturing process 100. The peeled film 132 can then be subsequently subjected to a repeat of the direct fluorination process 102. Subsequent repetitions of the direct fluorination process 102 can produce a third fluorinated layer on the top surface of the carrier film 110 opposite the second fluorinated layer 122. The thickness of the second fluorinated layer 122 remains substantially the same during subsequent repetitions of the direct fluorination process 102. Alternatively, prior to the subsequent direct fluorination process 102, the peeled layer 132 can be inverted so that the second fluorinated layer 122 becomes the top surface of the carrier film 110 and the exposed surface 114 becomes the bottom surface of the carrier film 110.
[0031]
[0039] FIG. 2 shows an exemplary fluorination chamber used in embodiments of the disclosed subject matter. The fluorination system 200 includes a fluorination chamber 210 comprising a chamber body 220 and at least one fluorination drum 240. In the exemplary embodiment, the at least one fluorination drum 240 comprises a first fluorination drum 240a, a second fluorination drum 240b, and a third fluorination drum 240c, although the at least one fluorination drum 240 may comprise one fluorination drum or any desired amount of fluorination drums. A supply drum 230 external to the fluorination chamber 210 provides a roll of carrier film 110 to the fluorination chamber 210 via the first fluorination drum 240a, the second fluorination drum 240b, and the third fluorination drum 240c, and then to a receiving drum 235 external to the fluorination chamber. As the carrier film 110 moves through the fluorination chamber 210, the carrier film is exposed to a fluorine-containing gas 250 in a continuous treatment process. Exposing the carrier film 110 to the fluorine-containing gas 250 produces a first fluorinated layer 120 and a second fluorinated layer 122 on the carrier film. Fluorination in the fluorination chamber 210 is a diffusion-controlled process, where the rate of fluorinated layer formation is limited by the rate of fluorine penetration into the surface of the carrier film 110. Thus, the processing results are determined by the throughput rate of the carrier film 110 and the fluorine concentration of the fluorine-containing gas 250. The fluorination system 200 can also be designed to process a wide range of web materials of various thicknesses and widths from the supply drum 230 to the receiving drum 235.
[0032]
[0040] 3A is a schematic cross-sectional view of a fluorinated carrier film 130. After fluorination in the fluorination chamber 210, the fluorinated carrier film 130 includes a first fluorinated layer 120 and a carrier film 110. The fluorinated carrier film 130 also includes a reaction layer 112 between the unmodified carrier film 110 and the first fluorinated layer 120. The reaction layer 112 includes a reaction zone of fluorine and polymer, where the fluorine is still reacting with the polymer material of the carrier film 110. The first fluorinated layer 120 functions as an outgassing barrier for the unmodified layer and as a surface for alkali metal condensation and layer separation. The first fluorinated layer 120 is an alkali-metal compatible surface that prevents alkali metal contamination of the carrier film 110 by acting as a barrier between the polymer material of the carrier film 110 and the deposited alkali metal layer.
[0033]
[0041] 3B shows a schematic cross-sectional view of a coated film 150 according to an exemplary embodiment. The coated film includes an unmodified polymer layer 134 of a carrier film 110, where the unmodified polymer layer 134 includes a hydrogen-carbon-based polymer. A first fluorinated layer 120 is stacked on the unmodified polymer layer 134, and a metal layer 140 is stacked on the first fluorinated layer 120. The metal layer 140 may be deposited to a thickness of at least 1 μm, preferably at least 2 μm. Then, a metal protective layer 142 is deposited on the metal layer 140 to a thickness of at least 5 nm, preferably at least 10 nm.
[0034]
[0042] 3C shows a schematic cross-sectional view of a coated film 150 according to an exemplary embodiment. The coated film includes an unmodified polymer layer 134 of a carrier film 110, where the unmodified polymer layer 134 includes a hydrogen-carbon-based polymer, and further includes a top surface 134a and a bottom surface 134b that coincide with the top surface and bottom surface of the carrier film 110. A first fluorinated layer 120 is stacked on the top surface 134a of the unmodified polymer layer 134, and a second fluorinated layer 122 is stacked on the bottom surface 134b of the unmodified polymer layer 134. A metal layer 140 may be deposited on the top surface of the first fluorinated layer 120 to a thickness of at least 1 μm, preferably at least 2 μm. By providing a second fluorinated layer 122 on the bottom surface 134b of the carrier film 110, the metal layer 140 (e.g., metallic lithium) is protected from surface contamination due to backside outgassing, eliminating the need for a metal protection layer 142 on the metal layer 140.
[0035]
[0043] FIG. 4 shows a schematic diagram of an exemplary embodiment of a direct fluorination system. The direct fluorination system 400 may include a cleaner 410 for controlled in-situ dissolution of an alkali metal (e.g., lithium) to neutralize the surface of a film carrier (e.g., carrier film 110). The direct fluorination system 400 may also include a strip washer 420 for cleaning the film carrier (e.g., carrier film 110). The direct fluorination system 400 may also include a fluorination system 430 configured to deliver a fluorine-containing gas (e.g., fluorine-containing gas 250), which further includes a gas cabinet 431. The gas cabinet 431 may include a fluorine gas tank 432, a purge gas tank 433, a scrubber 434, and a vacuum 435, all of which are fluidly connected to an exhaust system 436. The gas cabinet 431 of the fluorination system 430 may be fluidly connected to a fume hood 440. The fluorination system 430 may be configured to expose a carrier film (e.g., the carrier film 110) to a fluorine-containing gas (e.g., the fluorine-containing gas 250) to produce one or more fluorinated layers (e.g., the first fluorinated layer 120 and the second fluorinated layer 122) on the carrier film. The direct fluorination system 400 may also include a vacuum oven 450.
[0036]
[0044] The direct fluorination system 400 may also include an alkali metal evaporator system 460 for depositing an alkali metal (e.g., lithium). The evaporator system 460 may include a system for physical vapor deposition (PVD) coating an alkali metal onto a film carrier (e.g., the fluorinated film 130). The evaporator system 460 may be configured to deposit an alkali metal layer (e.g., the metal layer 140) onto the carrier film (e.g., the fluorinated film 130). The evaporator system 460 may be configured to deposit a metal protective layer (e.g., the metal protective layer 142) comprising an air-stable material (e.g., Li2CO3, LiF, Bi, or a combination thereof) onto the alkali metal layer.
[0037]
[0045] Direct fluorination system 400 produces a fluorinated carrier film (e.g., fluorinated film 130) coated with an alkali metal (e.g., lithium), where the coated fluorinated carrier film (e.g., coated film 150) is configured to be laminated using a conventional laminator 470. Once laminated (e.g., laminated film 170), the coated fluorinated carrier film is configured to peel the alkali metal anode layer (e.g., metal layer 140, metal protective layer 142, and anode layer 170) from the peeled carrier film (e.g., peeled film 132) via a release layer (e.g., peel interface 124). Direct fluorination system 400 is also configured to reuse the peeled carrier film (e.g., peeled film 132) in a direct fluorination process, a lamination process, an alkali metal coating process, or a combination thereof.
[0038]
[0046] FIG. 5 shows a schematic diagram of an exemplary lamination process, e.g., a transfer lamination process 105. After a carrier film 510 is fluorinated and a metal layer 530 is deposited on the outer surface of at least one fluorinated layer 520, a graphite or alloy-type anode layer 540 can be laminated to the outer surface of each metal layer 530 to produce a laminated film 550. Laminating the carrier film 510, metal layer 530, and at least one fluorinated layer 520 involves calendering the anode layer 540. Once calendering of the laminated film 550 is complete, in situ metrology is used to verify that no over-calendaring has occurred and that the laminated film 550 is free of lamination defects. The metal layer, anode layer, and peel interface 524 are peeled from the carrier film 510 to produce a peeled film 532 that can be recovered and reused.
[0039]
[0047] FIG. 6A shows a schematic cross-sectional view of an exemplary embodiment of a fluorinated anode. The anode 610 may include a graphite or alloy-type anode. The anode 610 may be subjected to an evaporation process 601, in which an alkali metal layer 612 is deposited on the exterior surface of the anode 610 to produce an alkali metal-coated anode 620. The alkali metal layer 612 may include any alkali metal, such as lithium. The evaporation process 601 may be a vapor deposition process, such as physical vapor deposition (PVD). The coated anode 620 may then be subjected to a direct fluorination process 602, in which the alkali metal layer 612 is exposed to a fluorine-containing gas 250 to form a fluorinated layer 614 on the exterior surface of the alkali metal layer 612. The fluorinated layer 614 may include any alkali metal and fluorine compound, such as lithium fluoride (LiF). The fluorination process 602 produces a fluorinated alkali metal anode stack 630 similar to cell layer 180 of FIG. 1, which can then be processed into a cell assembly (not shown).
[0040]
[0048] 6B shows a schematic diagram of an exemplary system for fluorinating alkali metal anodes. The fluorination system 600 comprises a fluorination chamber 640 including a chamber body 642 and at least one fluorination drum 650. In the exemplary embodiment, the at least one fluorination drum 650 includes a first fluorination drum 650a, a second fluorination drum 650b, and a third fluorination drum 650c, although the at least one fluorination drum 650 may include one fluorination drum or any desired amount of fluorination drums. A supply drum 660 external to the fluorination chamber 640 provides a roll of coated anode 620 to the fluorination chamber 640 via the first fluorination drum 650a, the second fluorination drum 650b, and the third fluorination drum 650c, and then to a receiving drum 665 external to the fluorination chamber.
[0041]
[0049] While the coated anode 620 moves through the fluorination chamber 640, the coated anode 620 is exposed to a fluorine-containing gas 670 in a continuous treatment process. The fluorine-containing gas 670 reacts with the alkali metal layer 612 to form a fluorinated layer 614 on the alkali metal layer 612. The fluorination in the fluorination chamber 640 is a diffusion-controlled process, where the rate of formation of the fluorinated layer is limited by the throughput rate of the coated anode 620 and the fluorine concentration of the fluorine-containing gas 670. For example, the thickness of the fluorinated layer 614 can be about 380 nm after 12 hours of reaction.
[0042]
[0050] The resulting fluorinated layer 614 can include alkali metal and fluorine compounds (e.g., LiF) with extremely low oxygen and carbon contaminant percentages. Furthermore, energy storage cells fabricated with fluorinated layers (e.g., fluorinated layer 614), such as LiF-coated lithium cells, have higher discharge capacities than bare lithium while maintaining durability.
[0043]
[0051] While the forgoing is directed to several embodiments, other and further embodiments may be devised without departing from the basic scope thereof, which scope is defined by the following claims.
Claims
1. 1. A method for manufacturing an energy storage device, comprising: Inspecting the carrier film; exposing the carrier film to a fluorine-containing gas to produce a first fluorinated layer on an upper surface of the carrier film; depositing an alkali metal layer on top of the first fluorinated layer to form a coated film; A method comprising:
2. The method of claim 1 further comprising laminating the coated film with an anode to produce a laminated film.
3. 3. The method of claim 2, further comprising peeling the carrier film from the anode, the alkali metal layer, and the first fluorinated layer to produce a peeled carrier film comprising the carrier film.
4. inspecting, neutralizing, and washing the peeled carrier film; and exposing the peeled carrier film to a fluorine-containing gas to produce a second fluorinated layer on the top surface of the peeled carrier film; The method of claim 3 further comprising:
5. The method of claim 1 , wherein the carrier film comprises a hydrogen-carbon based polymer.
6. The method of claim 1 further comprising depositing an alkali metal protective layer on top of the alkali metal layer.
7. The method of claim 1 , wherein the thickness of the carrier film is between 10 μm and 150 μm.
8. The method of claim 1 , further comprising exposing the carrier film to a fluorine-containing gas to produce a second fluorinated layer on the bottom surface of the carrier film.
9. 10. The method of claim 8, further comprising laminating the coated film with an anode to produce a laminated film.
10. 10. The method of claim 9, further comprising peeling the carrier film and the second fluorinated layer from the anode, the alkali metal layer, and the first fluorinated layer, and producing a peeled carrier film comprising the carrier film and the second fluorinated layer.
11. inspecting, neutralizing, and washing the peeled carrier film; and exposing the peeled carrier film to a fluorine-containing gas to form a third fluorinated layer. The method of claim 10 further comprising:
12. inspecting, neutralizing, and washing the peeled carrier film; and depositing a second alkali metal layer on the outer surface of said second fluorinated layer; The method of claim 10 further comprising:
13. Carrier film, a first fluorinated layer on top of the carrier film; and an alkali metal layer on top of the first fluorinated layer; A directly fluorinated carrier film comprising:
14. 14. The directly fluorinated carrier film of claim 13, further comprising an alkali metal protective layer on top of the alkali metal layer.
15. 15. The directly fluorinated carrier film of claim 14, wherein the alkali metal protective layer comprises lithium carbonate, lithium fluoride, or bismuth.
16. 14. The directly fluorinated carrier film of claim 13, wherein the thickness of the carrier film is between 10 μm and 150 μm.
17. 14. The directly fluorinated carrier film of claim 13, further comprising a second fluorinated layer on the bottom surface of the carrier film.
18. 14. The directly fluorinated carrier film of claim 13, wherein the carrier film is configured to be laminated with an anode.
19. cleaning the anode; depositing an alkali metal layer on the exterior surface of the anode; and exposing the anode and the alkali metal layer to a fluorine-containing gas to form a fluorinated layer on the outer surface of the alkali metal layer; 1. A method for lithiating an anode, comprising:
20. 20. The method of claim 19, wherein the alkali metal layer comprises lithium.