Jet injection device

Abstract

The present invention relates to a microfluidic device (1) for jetting, comprising a receiving chamber (100) defined by a chamber wall (110), the receiving chamber (100) being configured to receive a liquid (10), and having a device extension axis (A D ), the receiving chamber (100) has a chamber length (L ) defined by a first chamber end (101) and a second chamber end (102). C ), the first chamber end (101) has a first chamber opening (1011) for jet ejection from the receiving chamber (100), the chamber wall (110) includes a pattern (300) of a first surface material (111) and a second surface material (112), the first surface material (111) having an equilibrium contact angle θ1 > 90° with the liquid (10), and the second surface material (112) having an equilibrium contact angle θ1 > 90° with the liquid (10). and a pattern (300) having a patch (200), the patch having a patch boundary (205), (a) the patch (200) comprising one of a first surface material (111) and a second surface material (112), (b) at least 50% of the patch boundary (205) contacting the other of the first surface material (111) and the second surface material (112), and the chamber wall (110) having a wall surface area (S W ), and the patch (200) has a patch surface area (S P ) and 10 -4 ≦S P / S W ≦2*10 -1 The present invention provides a microfluidic device (1),

Description

[Technical Field]

[0001] The present invention relates to a microfluidic device for jetting, to a jetting system comprising the microfluidic device, and to a method for jetting a jet by means of a microfluidic device. [Background technology]

[0002] Microfluidic jet injection systems are known in the art. For example, WO2021152476A1 describes a method for jetting a fluid toward a substrate, the method comprising the steps of: providing a nozzle filled with a fluid; and placing a fiber source of pulsed radiation including an optical fiber inside the nozzle in direct contact with the fluid, the fluid being configured to absorb at least a portion of the radiation, wherein absorbing the pulses of pulsed radiation in a first portion of the fluid causes bubbles to form inside the nozzle, vaporizing the fluid as bubbles; and, due to the expansion of the bubbles, forcing a second portion of the fluid out of an opening at a tip of the nozzle, the tip being directed toward the substrate, thereby enabling jetting of the second portion of the fluid, the intensity of the pulses being set to be lower than the radiation induction threshold of a material contained in the fiber source.

[0003] US Patent Application Publication No. 20080186356(A1) describes a nozzle plate having a nozzle hole formed therein, the nozzle hole being defined in the nozzle plate by an inner surface on which a first lyophilic portion, a lyophobic portion, and a second lyophilic portion are arranged in this order from the side closest to the nozzle opening, the first and second lyophilic portions having lyophilic properties, and the lyophobic portion having lyophobic properties.

[0004] US Patent Application Publication No. 20220153028(A1) discloses a microfluidic device comprising: (i) a microfluidic device for jetting; and (ii) a laser-based heating system, wherein the microfluidic device is defined by a chamber wall and has a chamber height h selected from the range of 5 to 400 μm. C And 2 hours C ~10h C The chamber width w is selected from the range C and a chamber length l defined by the first chamber end and the second chamber end. C and a receiving chamber having a second chamber end including a first chamber opening for jet ejection from the receiving chamber, the receiving chamber configured to receive a liquid, and a laser-based heating system configured to provide laser radiation to one or more of the chamber walls and the liquid in the receiving chamber.

[0005] EP 2388032 A1 describes a device for generating at least one microfluidic jet, the device comprising at least one conduit section open at one end to the environment of the device. It further comprises at least one arrangement for forming, in at least one of the conduit sections, a meniscus at a location within the conduit section that constitutes an interface between the liquid in the conduit section and the environment. The meniscus is at least partially concave and is visible looking into the conduit section through the end that is open to the environment. The device also comprises at least one holder for holding a liquid, the at least one holder being in fluid communication with at least one of the conduit sections. It also comprises at least one device for delivering an energy pulse to the liquid in the at least one holder, the at least one device being configured to generate a shock wave front that propagates to the meniscus and generates at least a first stage of a jet from a center of the meniscus. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2021152476(A1) Brochure [Patent Document 2] US Patent Application Publication No. 20080186356(A1) [Patent Document 3] US Patent Application Publication No. 20220153028(A1) [Patent Document 4] European Patent Application Publication No. 2388032(A1) Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention relates to a microjet injection system comprising a microfluidic device for the generation of fluid jets, and more particularly to a system in which the control of the jet is independent solely of the device geometry or input energy.

[0008] Microfluidic devices (also "microfluidic platforms" or "microfluidic systems") encompass a wide range of devices associated with the field of microfluidics, which can deal with the behavior, control, and manipulation of minute volumes of fluids, typically volumes on the order of μl, nl, pl, and fl. Microfluidic devices can enable the precise control and manipulation of fluids on the micrometer- to sub-micrometer-sized scale.

[0009] The use of a microfluidic jet can be an alternative to traditional injection methods (such as by needles). The term "jet" is also sometimes referred to as a "liquid jet" and a "microfluidic jet." A microfluidic jet can provide a way to inject liquid into a viscoelastic material (e.g., skin). In particular, a microfluidic jet can be a promising option for delivering drugs into the skin.

[0010] Needle injection has been used for vaccination and medication administration, although its invasiveness is a limiting factor. Jet injectors are a promising option for delivering drugs into the skin. Microfluidic devices for jet injection rely on accelerating a liquid jet to a velocity sufficient to penetrate the target viscoelastic material. Conventional jet injectors may rely on a spring or gas cartridge to generate the jet. However, such devices may have limited control over injection parameters such as volume and depth. Furthermore, they may require a nozzle to generate a jet thin enough to penetrate the target viscoelastic material.

[0011] Another important requirement for accurate and safe delivery of liquids to target viscoelastic materials is jet stability, especially for applications such as drug delivery via microjet injection. Due to fluid instabilities (e.g., Rayleigh-Plateau instability), microfluidic jets can break up over time into smaller droplets with lower inertia. Furthermore, the rear of the jet can lose velocity or fluctuate in a different direction (i.e., an undesirable jet ejection angle). Both effects can reduce jet penetration, potentially resulting in rebound and / or incomplete delivery. This reduces the reproducibility and effectiveness of the microfluidic jet. Furthermore, rebound can contaminate the jet ejection system and / or the microfluidic device.

[0012] It is therefore an aspect of the present invention to provide a microfluidic device for jetting, which preferably also at least partially overcomes one or more of the above-mentioned drawbacks. The present invention may be directed to overcoming or ameliorating at least one of the disadvantages of the prior art, or to providing a useful alternative. [Means for solving the problem]

[0013] Thus, in a first aspect, the present invention provides a microfluidic device for jetting. In embodiments, the microfluidic device may comprise a receiving chamber defined by a chamber wall. In particular, the receiving chamber may be configured to receive a liquid. The device extension axis (A D ) along the receiving chamber, in embodiments, a chamber length (L ) defined by the first chamber end and the second chamber end. C ). In an embodiment, the first chamber end includes a first chamber opening for jet ejection from the receiving chamber. In an embodiment, the chamber wall may include a (surface) pattern of a first (liquid-repellent) surface material and a second (affinity) surface material. In particular, the first surface material may have an equilibrium contact angle θ1 > 90° with respect to the liquid. Furthermore, the second surface material may have an equilibrium contact angle θ2 with respect to the liquid. In an embodiment, θ1 - θ2 ≧ 20°. In an embodiment, the (surface) pattern may include a (surface) patch. In particular, the patch may be a two-dimensional shape defined on the surface of the chamber wall. In an embodiment, the patch may have a patch boundary. In particular, the patch may include one of the first surface material and the second surface material. In particular, at least 50% of the patch boundary may be in contact with the other of the first surface material and the second surface material. In an embodiment, the chamber wall has a (wall) surface area (S W In particular, the (surface) patch may have a (patch) surface area (S P In an embodiment, 10 -4 ≦S P / S W ≦2*10 -1 is.

[0014] Thus, in certain embodiments, the present invention provides a microfluidic device for jetting, the microfluidic device comprising a receiving chamber defined by a chamber wall, the receiving chamber configured to receive a liquid, the device extending along an axis (A D) along which the receiving chamber extends a chamber length (L ) defined by the first chamber end and the second chamber end. C ), the first chamber end includes a first chamber opening for jet ejection from the receiving chamber, the chamber walls include a (surface) pattern of a first (liquid-repellent) surface material and a second (affinity) surface material, the first surface material having an equilibrium contact angle θ1 > 90° with the liquid, and the second surface material having an equilibrium contact angle θ2 with the liquid, θ1 - θ2 ≧ 20°, the (surface) pattern includes (surface) patches, the patches having a patch boundary, (a) the patches include one of the first surface material and the second surface material, and (b) at least 50% of the patch boundary contacts the other of the first surface material and the second surface material, and the chamber walls have a (wall) surface area (S W ), and the (surface) patch has a (patch) surface area (S P ) and 10 -4 ≦S P / S W ≦2*10 -1 The present invention provides a microfluidic device comprising:

[0015] Such microfluidic devices can generate microfluidic jets with improved stability and reproducibility. In particular, the microfluidic devices may include heterogeneous surface chemistries for enhanced control of the liquid and the microfluidic jet. Furthermore, the chamber walls of the microfluidic devices may have multiple distinct regions with different degrees of lyophilicity (or "affinity") (e.g., hydrophilic and hydrophobic regions, or oleophilic and oleophobic regions) inside the receiving chamber. Therefore, the attractive force between the liquid and the chamber wall may be different at various locations inside the receiving chamber. This can alter the shape of the meniscus (liquid-air interface), resulting in more complex meniscus shapes. When the attractive force of the liquid to the lyophilic surface is greater, capillary flow along the lyophilic surface may generally be faster. Therefore, the meniscus will travel faster along the lyophilic region than along the lyophobic region. This allows for the creation of an interface line from the lyophilic region to the lyophobic region where the meniscus slows down (or its displacement changes), resulting in more reproducible fill levels. Fill level control is important for jetting. The fill level allows for easier control of the jet volume and may also allow for easier control of the jet velocity and therefore the jet depth. Additionally, non-homogeneous surface chemistry may also restrict the jet tail to be in the same direction as the rest of the jet.

[0016] As mentioned above, the heterogeneous surface chemistry of the chamber wall can be caused by the configuration of patches (included in the pattern). In particular, the pattern can include two types of patches (i.e., patches with different shapes, orientations, compositions, and materials).

[0017] In embodiments, the patch may be (generally) elongated. In further embodiments, the patch may have (i) a device extension axis (A D ), and (ii) the device extension axis (A D ) may be configured to be parallel (or approximately parallel) to the

[0018] Device extension axis (A D) can facilitate the blocking of the meniscus and thus the filling or shaping of the (liquid) meniscus. For example, such patches are particularly suitable for preventing the meniscus from advancing perpendicularly (or nearly perpendicularly) to the device extension axis (A D ) along the transition interface for the transition from a (more) liquid-philic surface material to a (more) liquid-repellent surface material. Thus, in embodiments, the liquid meniscus may slow down and / or stop at the transition interface. Furthermore, the shape of such patches may particularly affect the shape of the meniscus, such that the more curved the patch, the more curved the interface and the higher the jet velocity. In embodiments, multiple such patches may facilitate slowing or stopping the progress of the liquid meniscus over an area (instead of a single, fixed transition interface). In embodiments, such patches may be selected from the group consisting of rectangular (straight boundary), curved (crescent, (semi)circular, or elliptical), stadium, disk, and triangular (straight and / or curved boundary). In particular, more curved patches (e.g., moon-shaped, circular, etc.) may facilitate the emission of jets with smaller jet diameters and higher jet velocities. Furthermore, patches with straighter boundaries (e.g., straight and / or rectangular) may facilitate the emission of jets with larger jet diameters and lower jet velocities. Furthermore, the corrugated patches may also facilitate the emission of jets with larger jet diameters and lower jet velocities, such embodiments being discussed in more detail below.

[0019] Device extension axis (A D) can influence the (fluid) dynamics of the liquid jet during jet formation, i.e., it can determine, among other things, the shape and / or trajectory of the liquid jet. Such a patch can, among other things, influence the directionality, stability, and repeatability of the liquid jet. In such embodiments, the patch can facilitate confinement of the jet within a region of higher affinity. In particular, said confinement can define the directionality of the jet. In particular, jet reproducibility can be improved as a result of suppressing tail fluctuations of the (jet) liquid jet. In embodiments, such a patch can be liquidphilic and further surrounded (at least in part) by a liquidphobic material to confine the liquid within the region of higher affinity. In other words, in embodiments, the configuration of such a patch can define a region of high affinity where the motion (or flow) of the liquid can be accelerated (relative to a region of low affinity). Furthermore, in embodiments, such an (elongated) patch can be arranged in a direction parallel to the device extension axis (A D ) can be configured at an angle to facilitate ejection of the liquid jet at an angle relative to the device extension axis. In further embodiments, multiple such patches can be configured on the chamber wall to determine the trajectory of the (ejected) liquid jet.

[0020] Additionally, the combination of patches may facilitate providing a stable and reproducible jet by providing a non-uniform surface chemistry to the chamber walls. Device extension axis (A D converging patches (comprising lyophobic material) (with lyophilic regions between them) capable of providing a jet that can be gradually confined along a converging patch, such a configuration offering the advantage of creating a smooth transition towards micro-confinement, in particular the patches can be curved and further in embodiments triangular or trapezoidal shaped patches can (also) provide a smooth transition towards micro-confinement; - divergent patches (comprising lyophobic material) with lyophilic areas between them, which can provide a more divergent jet and result in (random) tail fluctuations, and can also be used in applications where scattered deposition of liquid is desired; Device extension axis (A D ), where the number of transitions (between lyophobic and lyophilic regions) can be increased to slow down the jet and confine it to a specific region; may have

[0021] These aspects are discussed in more detail below.

[0022] As described above, in embodiments, a microfluidic device for jetting may include a receiving chamber defined by a chamber wall. In embodiments, the first chamber end may include a first chamber opening. In particular, the first chamber end may include the first chamber opening for jetting from the receiving chamber. In some embodiments, a portion of the first chamber end may include the first chamber opening. For example, in embodiments, the first chamber end may be a closed surface, and the first chamber opening may be a hole having dimensions smaller than the first chamber end, with the liquid jet particularly exiting through the first chamber opening. However, in other embodiments, the entire first chamber end may include the first chamber opening. That is, in embodiments, the cross-sectional area (and shape) of the first chamber opening may be the same as the cross-sectional area (and shape) of the first chamber end.

[0023] In embodiments, the receiving chamber may have an elongated shape (or geometric shape), i.e., one of the dimensions of the receiving chamber (in particular the length of the receiving chamber) may be (substantially) greater than the width and height of the receiving chamber. In particular, in embodiments, the receiving chamber may have a length that is greater than the device extension axis (A D ) In particular, the device may have an extension axis (A D) along the chamber length (L C ) may have a chamber length (L C ) may be defined between the first and second chamber ends. The receiving chamber may have a number of different shapes and geometries, and such embodiments are described herein.

[0024] In particular, the receiving chamber may have a prismatic or prismatic geometric shape, in particular a shape selected from a square prism, a pentagonal prism, a hexagonal prism, etc. In an embodiment, the receiving chamber is oriented along the device extension axis (A D ) a cross section of the chamber wall in a plane perpendicular to the ...

[0025] In an embodiment, the receiving chamber (particularly the chamber wall, etc.) has a length (A) of the device extension axis (A D However, in an alternative embodiment, the receiving chamber may have a cross-sectional shape with equal sides (in a plane perpendicular to the device extension axis (A D In a further embodiment, the device may have a cross-sectional shape with unequal sides (e.g., a rectangular cross-section with different widths and heights) in a plane perpendicular to the axis of extension (A ). D In a cross section perpendicular to the axis of the receiving chamber, a portion of the chamber wall may be curved (e.g., a rectangular cross section with two curved sides). Such a geometric shape may also be referred to as a rounded rectangular geometric shape. Furthermore, in embodiments, the receiving chamber may have a cylindrical shape and may have a circular cross section in a plane perpendicular to the axis of the cylinder. Furthermore, in embodiments, the receiving chamber may have a cross-sectional shape that approximates a shape selected from the group including a stadium and an oval.

[0026] In an embodiment, the receiving chamber has a chamber height (H ) selected from the range of 1 to 1000 μm (such as the range of 2 to 500 μm, the range of 5 to 400 μm, and particularly the range of 10 to 200 μm). C In an embodiment, the receiving chamber may have a 1*H C ~20*H C Range (2*H C ~10*H C range, especially 4*H C ~8*H C In particular, the range of 5*H C ~7*H C The chamber width (W C In an embodiment, the receiving chamber may have a chamber length (L ) selected from the range of 10 to 10,000 μm (such as the range of 100 to 5,000 μm, particularly the range of 500 to 1,000 μm). C ) may be included.

[0027] Therefore, in certain embodiments, the receiving chamber has a chamber height (H ) selected from the range of 5 to 400 μm. C ), 2*H C ~10*H C The chamber width (W C ), and a chamber length (L C ), and the chamber length (L C Along at least 80% of the length of the receiving chamber, the receiving chamber has a cross-sectional shape that approximates a shape selected from the group consisting of a rounded rectangle, a stadium, and an oval.

[0028] As previously described, the receiving chamber may be configured to receive a liquid. In embodiments, the liquid may be water. However, in other embodiments, the liquid may be different from water, such as a liquid selected from the group including glycerol, alcohol, organic solvents, and (other) hydrocarbons. For example, in embodiments, the liquid may include an oil. Furthermore, in other embodiments, the liquid may include a solubilizing agent, such as a vaccine or insulin. In particular, the liquid may include additives, such as thickeners, emulsifiers, surfactants, viscoelastic additives, pigments, and biomolecules. Furthermore, in other embodiments, the liquid may include saline. In further embodiments, the liquid may include a polypeptide, such as a protein or a cyclic peptide (e.g., cyclosporin). In other embodiments, the liquid may include a skin penetration enhancer, such as an enhancer selected from the group including alcohols (e.g., ethanol), sulfoxides, surfactants (e.g., sodium dodecyl sulfate), limonene, propanediol, and azone.

[0029] In embodiments, the liquid received by the receiving chamber may fill a portion of the receiving chamber, while the remainder may be a gas (e.g., air). The liquid may, in particular, have a liquid meniscus, i.e., the surface of the liquid in contact with the gas and the chamber wall may be curved. The meniscus curvature may be the result of competing influences of adhesive and cohesive energies between molecules contained in the liquid and the chamber wall. In particular, non-uniform surface chemistry (e.g., differences in lyophilicity of different portions (or regions) of the chamber wall) may facilitate ejection of the liquid from the receiving chamber.

[0030] The lyophilicity of a surface can be defined as the ability of a liquid to spread on a surface and is quantitatively defined by the (equilibrium) contact angle θ (with respect to the liquid). The (equilibrium) contact angle θ can be defined as the angle at which the liquid-gas interface meets the solid-liquid interface, i.e., the angle the liquid meniscus makes with the chamber wall. The contact angles specified herein can particularly represent the contact angles of the liquid and (first / second) surface materials at room temperature (20°C) and a pressure of 1 atm, where the gas includes air. An equilibrium contact angle θ<90° indicates that the surface is lyophilic to the liquid, allowing the liquid to spread over a larger area of ​​the surface. An equilibrium contact angle θ>90° indicates that the surface is lyophobic to the liquid, allowing the contact area between the liquid and the surface to be minimized. In embodiments, the lyophobic surface can have an equilibrium contact angle θ≥91° (such as θ≥93°, particularly θ≥95°). In embodiments, the lyophobic surface may further have an equilibrium contact angle (with respect to the liquid) of θ > 91° (such as θ > 93°, particularly θ > 95°). Additionally or alternatively, in embodiments, the lyophilic surface may have an equilibrium contact angle (with respect to the liquid) of θ ≦ 89° (such as θ ≦ 87°, particularly θ ≦ 85°). Furthermore, in embodiments, the lyophilic surface may have an equilibrium contact angle (with respect to the liquid) of θ < 89° (such as θ < 87°, particularly θ < 85°). It will be clear to those skilled in the art that the equilibrium contact angle θ depends on the combination of the surface material and the liquid. In particular, the equilibrium contact angle of a material depends on the liquid, and in particular (also) the behavior of the contact line (meniscus) of the liquid may differ. Note that (also) the presence of impurities in the liquid may affect the equilibrium contact angle θ.

[0031] In embodiments, the chamber wall may include a (surface) pattern of a first surface material and a second surface material, where the first surface material has an equilibrium contact angle (with respect to the liquid) θ1 and the second surface material has an equilibrium contact angle (with respect to the liquid) θ2. In particular, the first surface material may be lyophobic (with respect to the liquid), with θ1 > 90°. In some embodiments, the second surface material may be lyophilic (with respect to the liquid). However, in other embodiments, the second surface material may be lyophobic (with respect to the liquid). In embodiments, the first surface material may (always) have a larger equilibrium contact angle (with respect to the liquid) than the second surface material. In particular, θ1 - θ2 ≥ 20° (such as θ1 - θ2 ≥ 30°, especially θ1 - θ2 ≥ 40°).

[0032] In embodiments, at least 1% (at least 2%, particularly at least 5%, etc.) of the chamber walls (particularly the pattern) comprise the first surface material. In further embodiments, at least 10% (at least 20%, particularly at least 30%, etc.) of the chamber walls (particularly the pattern) comprise the first surface material. In further embodiments, at least 50% (at least 60%, particularly at least 70%, etc.) of the chamber walls (particularly the pattern) comprise the first surface material. The term "first surface material" may also refer to multiple (different) first surface materials, such as different liquidphobic materials (see also below). For example, in embodiments in which multiple patches comprise the first surface material, different patches may comprise different first surface materials.

[0033] In further embodiments, at least 1% (at least 2%, particularly at least 5%, etc.) of the chamber walls (particularly the pattern) comprise the second surface material. In further embodiments, at least 10% (at least 20%, particularly at least 30%, etc.) of the chamber walls (particularly the pattern) comprise the second surface material. In further embodiments, at least 50% (at least 60%, particularly at least 70%, etc.) of the chamber walls (particularly the pattern) comprise the second surface material. The term "second surface material" may also refer to multiple (different) second surface materials, such as different lyophilic materials (see also below). For example, in embodiments in which multiple patches comprise the second surface material, different patches may comprise different second surface materials.

[0034] In further embodiments, the pattern may cover at least 90% (such as at least 95% (including 100%)) of the (surface area of ​​the) chamber wall. Thus, in embodiments, the first surface material and the second surface material (together) may cover at least 90% (such as at least 95% (including 100%)) of the (surface area of ​​the) chamber wall.

[0035] As previously mentioned, the liquidphilicity (or "affinity") of the first (or second) surface material may be a function of the liquid received by the receiving chamber. In embodiments, the affinity of the liquid for the first (or second) surface material may be a function of the adhesive and cohesive forces between the molecules of the liquid and the first (or second) surface material.

[0036] For example, in embodiments, the liquid may include water. In such embodiments, the first surface material and / or the second surface material may include a hydrophobic material, and particularly, at least the first surface material may include a hydrophobic material. In further embodiments, the hydrophobic material may be selected from the group consisting of polydimethylsiloxane (PDMS), polyvinyl chloride (PVC), and polytetrafluoroethylene (PTFE). In further embodiments, the hydrophobic material may include a hydrophobic coating. For example, the hydrophobic material may include thiol-coated gold. Furthermore, in embodiments, the hydrophobic material may include graphene oxide, particularly a graphene oxide coating. In particular, the hydrophobic material may include a hydrophobic film, which may be obtained by depositing graphene oxide (by chemical vapor deposition) on the surface of the film. Such a film may be specifically referred to as a highly transparent, flexible, and superhydrophobic film (HTFS).

[0037] In a further embodiment, the second surface material may comprise a hydrophilic material, such as a metal oxide selected from the group including Al2O3, TiO2, and SiO2. In a further embodiment, the hydrophilic material may comprise one or more of gold, platinum, chromium, and titanium.

[0038] In further embodiments, the first surface material and / or the second surface material may comprise an oleophobic material, particularly at least the first surface material may comprise an oleophobic material, and particularly at least the second surface material may comprise an oleophobic material. In particular, the oleophobic material may be selected from the group consisting of fluorosurfactants, cycloolefin copolymers (COC), and cyclic olefin polymers (COP). Furthermore, in embodiments, the oleophobic material may comprise a chitosan coating.

[0039] In further embodiments, the second surface material may comprise an oleophilic material. In particular, the oleophilic material may be selected from the group including parylene, alkylsilane (e.g., octadecylsilane), polyethylene (e.g., PTFE), and polypropylene. Furthermore, in embodiments, the oleophilic material may comprise a thiol coating (e.g., dodecanethiol) or a carbon-based coating.

[0040] In embodiments, the (surface) pattern may include a (surface) patch. In embodiments, the surface patch may be a two-dimensional shape defined on the (inner) surface of the chamber wall. In embodiments, the patch may include one of a first surface material and a second surface material.

[0041] In embodiments, the patch may be a two-dimensional region defined by a contour. In particular, the contour may be a single smooth contour (e.g., an oval). Alternatively, in embodiments, the patch may have a contour defined by multiple line segments (e.g., a rectangle). In further embodiments, up to two of the line segments may be curved (e.g., a semi-stadium). Thus, in embodiments, the patch may have a patch shape that approximates a shape (or geometric shape) selected from the group including a triangle, a trapezoid, a rectangle, a crescent, an oval, a circle, a wave, a stadium, and a semi-stadium.

[0042] In embodiments, the patch may particularly have a patch boundary. In embodiments, the patch may be defined on (any location on) the surface of the chamber wall. In particular, the patch may be defined adjacent to the first chamber edge, particularly the first chamber opening. Thus, in embodiments, at least 50% of the patch boundary may be in contact with the other of the first surface material and the second surface material. In particular, in such embodiments, other portions of the patch boundary may be located at the first chamber edge. That is, in embodiments, the patch boundary may define at least a portion of the first chamber edge. In further embodiments, at least 60% of the patch boundary may be in contact with the other of the first surface material and the second surface material. In yet other embodiments, at least 70% of the patch boundary may be in contact with the other of the first surface material and the second surface material. Furthermore, in embodiments, the patch may include a first surface material, and at least 80% of the patch boundary may be in contact with the second surface material. Similarly, in embodiments, the patch may include a second surface material, and at least 80% of the patch boundary may be in contact with the first surface material. In still other embodiments, the patch may contact the other of the first and second surface materials along 99% or more of the patch boundary, including 100% of the patch boundary.

[0043] In certain embodiments, the patch boundary may include multiple boundary portions. For example, a (ring-shaped) patch configured on a chamber wall may have a patch boundary that includes two boundary portions. In particular, at least 50% of a patch boundary that includes one or more boundary portions may contact the other of the first surface material and the second surface material.

[0044] Alternatively, in embodiments, the patch may be defined apart from the first and second chamber ends. In such embodiments, the patch may include one of a first surface material and a second surface material, with the entire patch boundary contacting the other of the first and second surface materials. For example, in embodiments, the patch may include a first surface material, with the entire patch boundary contacting the second surface material. In further embodiments, the patch may include a second surface material, with the entire patch boundary contacting the first surface material.

[0045] In an embodiment, the chamber wall has a (wall) surface area (S W In embodiments, the patch may have a (patch) surface area (S P ) In particular, the surface area (S W ) to the surface area of ​​the patch (S P ) is 10 -5 ≦S P / S W ≦2*10 -1 (10 -4 ≦S P / S W ≦2*10 -1 , especially, 10 -3 ≦S P / S W ≦2*10 -1 In the embodiment, 10 -2 ≦S P / S W ≦2*10 -1 Furthermore, in an embodiment, 10 -5 ≦S P / S W ≦10 -1 (10 -5 ≦S P / S W ≦10 -2 , 10 -5 ≦S P / S W ≦10 -3 , especially 10 -5 ≦S P / S W ≦10 -4In a further embodiment, the surface area of ​​the chamber wall (S W ) to the surface area of ​​the patch (S P ) is the ratio of S P / S W is at least 10 -5 (at least 10 -4 , especially at least 10 -3 In yet another embodiment, the surface area of ​​the chamber wall (S W ) to the surface area of ​​the patch (S P ) is the ratio of S P / S W Up to 2*10 -1 (Max 2*10 -2 , especially, up to 2*10 -3 In an embodiment, the patch surface area (S P ) is at least 1 μm 2 (at least 10 μm 2 , in particular at least 100 μm 2 In a further embodiment, the patch surface area (S P ) is at least 0.01 mm 2 (At least 0.1 mm 2 , especially at least 1 mm 2 etc.)

[0046] The pattern may particularly include a plurality of patches, each patch including a first surface material or a second surface material. In such embodiments, each patch (of the plurality of patches) has an independently selected (patch) surface area (S P )(10 -5 ≦S P / S W ≦2*10 -1 (10 -4 ≦S P / S W ≦2*10 -1 , especially, 10 -3 ≦S P / S W ≦2*10 -1 etc.) applies to an independently selected (patch) surface area (S P) etc.) (see also above).

[0047] Furthermore, in an embodiment, the pattern may be formed in particular over a (pattern) surface area S of the first surface material or the second surface material. PP In particular, the surface area (S W ) to the surface area of ​​the pattern (S PP ) ratio is 0.01≦S PP / S W ≦0.95(0.1≦S PP / S W ≦0.95, especially 0.5≦S PP / S W ≦0.95, etc.) Furthermore, in the embodiment, 0.05≦S PP / S W ≦0.9(0.05≦S PP / S W ≦0.7, especially 0.05≦S PP / S W ≦0.5, especially 0.05≦S PP / S W ≦0.3, etc.

[0048] In an embodiment, the pattern surface area (S PP ) is at least 0.001mm 2 (At least 0.01mm 2 , especially at least 0.1 mm 2 , especially 1mm 2 In a further embodiment, the pattern surface area (S PP ) must be at least 5 mm 2 (At least 10 mm 2 etc.) may be (even).

[0049] In particular, the (pattern) surface area S PP may represent the total surface area of ​​multiple patches of a material (such as the total surface area of ​​multiple patches including a first surface material or the total surface area of ​​multiple patches including a second surface material). Thus, in embodiments, multiple patches may have a total (pattern) surface area S PP may have

[0050] Furthermore, as mentioned above, in embodiments, the chamber wall may not necessarily be flat. In embodiments, one or more surfaces of the chamber wall may, in particular, be curved. In such embodiments, the patch may (still) be configured (or defined) along the curved chamber wall. In particular, in such embodiments, the patch may (also) be curved, e.g., with the same curvature as the chamber wall.

[0051] As mentioned above, the patch may be (essentially) two-dimensional. Thus, in an embodiment, the patch may have a patch length (L P ) and patch width (W P In an embodiment, the patch may be particularly elongated. In particular, along the extension direction, the patch may have a patch extension axis (A P In an embodiment, the patch may have a patch extension axis (A P ) along the patch length (L P ) and the patch extension axis (A P ) and perpendicular to the patch width (W P In an embodiment, the patch may have L P ≧1.25*W P (L P ≧1.5*W P , especially L P ≧2*W P , especially L P ≧5*W P , especially L P ≧10*W P etc.), the patch width (W P ) P In certain embodiments, the patch may have a patch extension axis (A P ) and the patch has a patch extension axis (A P ) along the patch length (L P ) and patch extension axis (A P ) and the perpendicular patch width (W P ) (patch length (L P ) and patch width (W P) is measured along the chamber wall), L P ≧1.5*W P is.

[0052] The elongated shape may be particularly beneficial in controlling the progression of the liquid meniscus. For example, a device comprising a liquid-philic second surface material may be used to control the device extension axis (A D ) can specifically (locally) accelerate the liquid (towards the first chamber opening). Similarly, in embodiments, a first surface material is included and the device elongation axis (A D ) can block the progression of the liquid meniscus. Thus, the patch configuration (i.e., the shape and orientation of the (surface) patch) can control the propagation of the liquid jet.

[0053] In embodiments, the patch may be a continuous surface, i.e., the entire surface area of ​​the patch may be comprised in the first or second surface material. However, in other embodiments, the patch may not be a continuous surface, and in particular the patch may comprise dots (liquidphilic or liquidphobic). In embodiments, the dots (liquidphilic or liquidphobic) comprised in each patch may total more than a surface area (S D In an embodiment, S D / S P ≧0.3(S D / S P ≧0.5, especially S D / S P ≧0.7, etc.), in particular, 0.8≦S D / S P ≦1.0(0.85≦S D / S P <1.0, especially 0.9≦S D / S P <1.0, especially 0.95≦S D / S P<1.0, etc. In embodiments, the dots may be circular dots comprising the first surface material or the second surface material. However, in other embodiments, the dots may not (necessarily) be circular. In particular, the dots may have a shape selected from the group consisting of oval, ellipse, square, semi-stadium, and parallelogram. Furthermore, in embodiments, the dots included in each patch may exhibit polydispersity in size and shape. That is, the dots may have unique (and different) sizes and shapes. In this way, the patch surface may be covered with dots that may comprise, in particular, the first surface material or the second surface material.

[0054] In the embodiment, the patch width W P is 0.01*L C ~0.2*L C (0.05*L C ~0.2*L C , especially, 0.1*L C ~0.2*L C Furthermore, in the embodiment, the patch width W P is 0.01*L C ~0.1*L C (0.01*L C ~0.05*L C In an embodiment, the patch extension axis (A P ) is the device extension axis (A D ) and the patch extension axis (A ) may form an angle α≧80° (α≧85°, etc.). P ) is the device extension axis (A D ), i.e., α=90° (or even). Furthermore, in such an embodiment, the patch may specifically comprise a first surface material. Thus, in a particular embodiment, the patch comprises a first surface material and is aligned with the patch extension axis (A P ) is the device extension axis (A D ) and the angle α≧80°, and the patch width (W P ) is 0.01*L C ~0.2*L CSuch a patch may provide the advantage of primarily blocking the progression of the meniscus. For example, the receiving chamber may be particularly D ), can be filled to a desired volume.

[0055] In an embodiment, the patch is 0.3*L from the second chamber end. C ~0.9*L C Range (0.4*L C ~0.8*L C In particular, the range of 0.5*L C ~0.7*L C Furthermore, the patch may be configured at a (shortest) distance selected from the range of the device extension axis (A D ) and prevents the meniscus from advancing. The volume of liquid received by the receiving chamber can affect the characteristics of the ejected liquid jet. For this reason, the receiving chamber (i) includes a first surface material, and (ii) has a device extension axis (A D ) and (iii) from the end of the second chamber, 0.3*L C ~0.9*L C The (elongated) patch configured at a (shortest) distance selected from the range can facilitate increasing the jet volume (i.e., the volume of the ejected liquid jet) and / or improving the reproducibility of the microfluidic jet.

[0056] The term "nearly parallel" in the context of a patch refers to a patch that is parallel to the axis of extension (A P ) is the device extension axis (A D ) and an angle α (α≦30° (α≦20°, particularly α≦10°, etc.)).

[0057] The term "nearly perpendicular" in the context of a patch refers to a patch that is perpendicular to the axis of extension (A P ) is the device extension axis (A D ) and an angle α (α≧60° (α≧70°, particularly α≧80°, etc.)).

[0058] The angle α is relative to the device extension axis (A D ) to the patch extension axis (A P ) in a counterclockwise (or clockwise) direction. Therefore, the angle α can be measured in particular with respect to the device extension axis (A D ) and patch extension axis (A P ) It may also be the smallest angle between. In other words, -α and +α are not distinguished and both are considered to be α.

[0059] In the embodiment, the patch length (L P ) is 0.2*L C ~0.95*L C Range (0.3*L C ~0.85*L C In the range of 0.4*L C ~0.75*L C In the range of 0.5*L C ~0.65*L C In an embodiment, the patch extension axis (A P ) is the device extension axis (A D ) and the patch extension axis (A) may form an angle α≦30° (α≦20°, particularly α≦10°, etc.). P ) is the device extension axis (A D ), i.e., α=0° (even). Furthermore, in such embodiments, the patch may specifically include a second surface material. Thus, in certain embodiments, the patch may include a second surface material and may be parallel to the patch extension axis (A P ) is the device extension axis (A D ) and the angle α≦30°, and the patch length (L P ) is 0.2*L C ~0.95*L C Such a patch can accelerate the liquid toward the first chamber opening. In particular, such a patch has a patch extension axis (A P) direction. In particular, such a patch may be long enough to extend from the first chamber edge to a point close to the liquid meniscus. In this way, the liquid jet may be guided along the chamber wall to the first chamber opening, such that the stability and reproducibility of the ejected microfluidic jet may be improved.

[0060] In embodiments, the configuration of the patches can affect the trajectory of the liquid jet and / or the volume of the receiving chamber that can be filled with liquid. In particular, the patches can be defined on the surface of the receiving chamber. Thus, in some cases, a portion of the chamber wall can comprise a patch, while a portion of the chamber wall opposite the patch can (not necessarily) comprise a second patch. This can result in blocking of only a portion of the meniscus (i.e., blocking of the liquid meniscus on only one side of the chamber wall) and / or distortion of the trajectory of the liquid jet (i.e., uneven acceleration of the liquid jet on one side of the chamber wall). This can be mitigated by symmetrical placement of one or more patches on the chamber wall. Thus, in embodiments, a pattern can include one or more patches, and in particular, the patches can be configured on the chamber wall such that one or more patches are symmetrically positioned on the chamber wall.

[0061] In some embodiments, during operation of the microfluidic device, a liquid jet may be ejected at an angle from the first chamber opening. In embodiments, this may be controlled (or mitigated) by the configuration of (only) one patch, which may be configured to (at least partially) determine the trajectory of the ejected liquid jet. In this way, even a single patch can promote improved stability and reproducibility of the liquid jet. Furthermore, in embodiments, even a pattern including only one (single) patch may have a plane of symmetry, e.g., the plane of symmetry may pass through the device extension axis and the center of mass of the patch may lie in the plane of symmetry.

[0062] Thus, in embodiments, one or more patches have a plane of symmetry, and in particular, this plane of symmetry is aligned with the device extension axis (A D ) and passes through the device extension axis (A D Additionally or alternatively, in some embodiments, the patch may have a plane of symmetry, and in particular, the plane of symmetry may be parallel to the device extension axis (A D ) so that in certain embodiments, the pattern (of the first and second surface materials) has a plane of symmetry (the axis of device extension (A D ) coincides with the symmetry plane or the device extension axis (A D ) is perpendicular to the plane of symmetry).

[0063] In an embodiment, the device extension axis (A D ), the chamber wall (included in the receiving chamber) has a (chamber) perimeter P C In embodiments where the receiving chamber has a cylindrical geometry, the device extension axis (A D The circumference of the chamber wall in a cross section perpendicular to the chamber (boundary) length P C may have

[0064] As previously mentioned, in embodiments, the patch may be defined on the chamber wall in any orientation. P ) is the device extension axis (A D ) at an angle α. D In a cross section perpendicular to the (chamber) perimeter (P C ) along the periphery of the chamber wall having a (patch) perimeter length (P P ) In embodiments, the patch may span the device extension axis (A D ) and the (patch) perimeter (P P ) is the device extension axis (A D) and the patch length (L P ) Furthermore, in embodiments, the patch may be equal to the device extension axis (A D ), and the (patch) perimeter length (P P ) is the device extension axis (A D ) and the patch width (W P ) in other embodiments, the patch extension axis (A P ) is the device extension axis (A D ) may be set at an angle α to the (patch) perimeter (P P ) is the device extension axis (A D ) and in the cross section perpendicular to W P -L P It may be in the range of

[0065] In an embodiment, the device extension axis (A D In a cross section perpendicular to the patch extension axis (A), the patch may cover a part of the chamber wall. P ) is the device extension axis (A D ) may be set parallel or approximately parallel to the (patch) perimeter (P P ) is 0.01*P C ~0.5*P C (0.05*P C ~0.25*P C ,In particular, 0.1*P C ~0.2*P C Therefore, in certain embodiments, the device extension axis (A D In the cross section perpendicular to the plane, the receiving chamber has a perimeter (P C ) and the patch has a perimeter (or "circumference") of (P P ) and P P is 0.05*P C ~0.25*P C is selected from the range.

[0066] 0.01*P C ~0.5*P CIn particular, the range of 0.05*P C ~0.25*P C The (patch) perimeter (P P ) can control the thickness (and / or volume) of the microfluidic jet. Furthermore, the patch can control the (chamber) perimeter (P C ), the (microfluidic) jet may be accelerated differently on the surface of the chamber wall covered by the patch compared to the surface of the chamber wall not covered by the patch, which may facilitate control of the trajectory of the microfluidic jet (e.g., the direction (e.g., angle) of ejection of the microfluidic jet from the first chamber opening, etc.). Furthermore, 0.01*P C ~0.5*P C In particular, the range of 0.05*P C ~0.25*P C The (patch) perimeter (P P ) can control the shape (and position) of the meniscus, i.e., (0.01*P C ~0.5*P C The perimeter (P P A portion of the chamber wall may include a patch (having a device extension axis (A D ) and 0.5*P in the cross section perpendicular to C ~0.99*P C Another part of the chamber wall (having a length of P ) may not (necessarily) include the patch. As a result of this, only a part of the meniscus may be blocked (i.e. the liquid meniscus is blocked on only one side of the chamber wall), so that the meniscus is blocked by the (patch) perimeter of the patch (P P ) can have a (non-)symmetric shape determined by the scalar, which may provide other options for controlling the properties of the microfluidic jet.

[0067] In particular, the patch extension axis (A P ) is the device extension axis (A D ) may be set perpendicular or approximately perpendicular to the (patch) perimeter (P P ) is 0.2*P C ~PC Range (0.4*P C ~P C In particular, the range of 0.6*P C ~P C Therefore, in certain embodiments, the device extension axis (A D In the cross section perpendicular to the plane, the receiving chamber has a perimeter (P C ) and the patch has a perimeter (or "circumference") of (P P ) and P P is 0.4*P C ~P C is selected from the range.

[0068] In applications of the microfluidic device, it may be necessary to control the liquid (e.g., to fill a receiving chamber with the liquid to a predetermined volume). Furthermore, in applications of the microfluidic device, the supply of energy to the liquid may cause the microfluidic device to eject a microfluidic jet through the first chamber opening. Thus, due to the configuration of such patches (on the chamber wall), the chamber wall may, in embodiments, have a heterogeneous surface chemistry (i.e., differences in lyophilicity). In particular, such a heterogeneous surface chemistry may facilitate stable and reproducible ejection of the microfluidic jet.

[0069] As noted above, in embodiments, the pattern may include a plurality of patches. In embodiments, the pattern may include a first set of n patches. In embodiments, each patch in the first set may include a first surface material. In other embodiments, each patch in the first set may include a second surface material.

[0070] In embodiments, n may be at least 2 (such as at least 5, particularly at least 10). In embodiments, the n patches are arranged downstream of the second chamber end along the device extension axis (A D) in a direction parallel to the device extension axis (A). Here, two patches in a row may refer to the second patch being downstream of the first patch. Similarly, in an embodiment, n patches may be in a row. That is, each patch in the first set may be downstream of the preceding patch in the first set (except for the first patch that is configured closest to the end of the second chamber). In an embodiment, the distance between any two consecutive patches in the first set may be the same. That is, the patches in the first set may be equally spaced apart. However, in other embodiments, the distance between any two consecutive patches in the first set may be different. In an embodiment, the patches in the first set are arranged in a direction parallel to the device extension axis (A). D ) of each patch of the first set. P ) is the device extension axis (A D ) may form an angle α≧80° (α≧85°, particularly α=90°, etc.).

[0071] In the context of liquid jet injection, the terms "upstream" and "downstream" refer particularly to the device extension axis (A D ) and may relate to the placement of an item or feature relative to the device extension axis (A D ) relative to a first position along the device extension axis (A D A second location closer to the second chamber end (than the first location) along the device extension axis (A D A third location along the axis 100 that is further from the second chamber end (than the first location) is "downstream."

[0072] Thus, in certain embodiments, the pattern includes a first set of n patches, n≧2, and the n patches are arranged downstream from the second chamber end (the device extension axis (A D )) are arranged consecutively (and equally spaced apart), each patch of the first set comprising a first surface material, and each patch of the first set is aligned along a patch extension axis (A P) is the device extension axis (A D ) and form an angle α≧80°.

[0073] In the application of microfluidic devices, a microfluidic jet can be ejected by supplying energy to the liquid. D ), one or more patches of the first set may include the first surface material, thereby impeding the progression of the liquid meniscus. In particular, the arrangement of such first set patches may successively reduce the ejection velocity of the microfluidic jet. Thus, the velocity of the microfluidic jet may be controlled by, among other things, the number of patches, the orientation angle of the patches, the equilibrium contact angle of each patch, and the distance between successive patches.

[0074] In an embodiment, the pattern may include a second set of k patches, and in an embodiment, each patch in the second set may include a second surface material.

[0075] In an embodiment, k may be at least 2 (at least 5, particularly at least 10, etc.). In an embodiment, each patch of the second set is aligned along the device extension axis (A D 0.3*L from the end of the second chamber (measured in the direction along the C ~0.9*L C Range (0.3*L C ~0.75*L C Range: 0.3*L C ~0.6*L C Furthermore, in an embodiment, each patch of the second set may be configured at a (shortest) distance selected from the range of (the device extension axis (A D 0.4*L from the end of the second chamber (measured in the direction along the C ~0.9*L C Range (0.5*L C ~0.9*L C Range: 0.6*L C ~0.9*L CIn an embodiment, the (shortest) distance from the edge of the second chamber may be the same for each of the k patches in the second set. Alternatively, the (shortest) distance from the edge of the second chamber may be selected individually for each of the k patches in the second set (e.g., 0.3*L C ~0.9*L C range etc. (see also above).

[0076] In an embodiment, the second set of patches is aligned along the device extension axis (A D ) of each patch of the second set may be parallel or substantially parallel to the patch extension axis (A P ) is the device extension axis (A D ) may form an angle α≦30° (such as α≦20°, particularly α≦10°, particularly α=0°). Furthermore, in embodiments, the patches of the second set may converge or diverge towards the first chamber end.

[0077] Thus, in certain embodiments, the pattern includes a second set of k patches, k≧2, each patch of the second set including a second surface material, and each patch of the second set extending along the device extension axis (A D ) from the second chamber end, 0.3*L C ~0.9*L C and the patch extension axis (A P ) is the device extension axis (A D ) and form an angle α≦30°.

[0078] As mentioned above, in embodiments, the patch may be a two-dimensional shape, so the shortest distance may be measured from the point on the outline of the patch closest to the second chamber edge to the second chamber edge.

[0079] In application of the microfluidic device, the supply of energy to the liquid may cause the ejection of a microfluidic jet. In embodiments, the second set of patches may comprise a second surface material. In particular, since the second surface material may be liquidphilic, the second set of patches may be configured to accelerate and guide the liquid jet ejected from the microfluidic device. Thus, as mentioned above, the second set of patches may in embodiments be configured closer (at the shortest distance) to the first chamber end than to the second chamber end. Furthermore, in embodiments, the affinity of the liquid for the second surface material may provide the benefit of (relatively) accelerating the liquid along the patch. Furthermore, the second set of patches may be configured to (i) be aligned with the device extension axis (A D ) and (ii) converging or diverging toward the end of the first chamber, thereby directing the jet along a predetermined trajectory to produce a stable and reproducible jet. Thus, the velocity of the microfluidic jet can be controlled by, among other things, the number of patches, the shape of the patches, the orientation angle of the patches, the contact angle of each patch, and the distance between successive patches.

[0080] In embodiments, the pattern may include a third set of m patches, where m may be at least 2 (such as at least 5, particularly at least 10), and each patch in the third set may include the second surface material.

[0081] In an embodiment, the centers of mass of (all) the patches of the third set are aligned with an axis (A M ) may be along the axis (A M ) is the device extension axis (A D In an embodiment, the patch extension axis (A P ) are the device extension axes (A D ) (and axis (A M In an embodiment, (all) patches of the third set may be at an angle α with the device extension axis (A D) may be at the same angle α as the device extension axis (A D ) may form an angle α different from the patch extension axes (A P ) is the device extension axis (A D ) may form an angle of 5°≦α≦50° (5°≦α≦40°, particularly 5°≦α≦30°, etc.). Furthermore, in an embodiment, the patch extension axes (A P ) is the device extension axis (A D ) and the angle α may be 10°≦α≦30° (15°≦α≦30°, particularly 20°≦α≦30°, particularly 25°≦α≦30°, etc.).

[0082] Furthermore, in an embodiment, the third set of patches is M ) in succession along the third set. In an embodiment, the distance between any two consecutive patches of the third set may be the same. That is, the patches of the third set may be arranged at equal intervals. In other embodiments, the distance between two consecutive patches may be different. In particular, the centers of mass of two consecutive patches of the third set may be set to the first distance d1. In an embodiment, d1 is 0.05*L C ~0.5*L C Range (0.1*L C ~0.4*L C In particular, the range of 0.2*L C ~0.3*L C It should be noted that in this context, the expression "consecutive" is used synonymously with the term "successive."

[0083] In embodiments, the pattern may include a plurality of such third sets. Thus, in certain embodiments, the pattern includes a plurality of third sets, each third set including a set of m patches, m≧2, each patch of the third set including the second surface material, and the centers of mass of (all) the patches being aligned along an axis (A M ) and lie along the axis (A M ) is the device extension axis (A D ) and the patch extension axes (A P ) is the device extension axis (A D ) and an angle 5°≦α≦50°, and the centers of mass of two consecutive patches (respectively) of the third set are set at a first distance d1, where d1 is 0.05*L C ~0.5*L C is selected from the range.

[0084] In embodiments including multiple third sets, the centers of mass of all patches in each third set are aligned along a unique axis (A M ) that is, the third set may be arranged along the axis (A M ) In particular, the axis (A M ) is the axis (A) along the chamber wall M ) perpendicular to two successive axes (A M ) may be defined on the chamber wall such that the distance between them is a distance d2. In particular, d2 is 0.2*P C ~0.5*P C Range (0.25*P C ~0.45*P C In particular, the range of 0.3*P C ~0.4*P C The range may be selected from the range of (e.g.,

[0085] Therefore, in a specific embodiment, two adjacent axes of the third set (A M ) is positioned at a distance d2, and d2 is the axis (A M ) and measured perpendicular to the C ~0.5*PC is selected from the range.

[0086] The arrangement of such patches (such as a plurality of third sets of patches) can facilitate guiding and controlling the microfluidic jet toward the first chamber opening, which can facilitate providing a stable and reproducible jet.

[0087] In a further aspect, the present invention may provide a jetting system comprising the microfluidic device of the present invention, a liquid supply source, and a heating system. In particular, the receiving chamber may include a receiving chamber opening. In embodiments, the liquid supply source may be configured to supply liquid to the receiving chamber through the receiving chamber opening. In embodiments, the heating system may be configured to supply radiation to one or more of the chamber walls and / or the liquid in the receiving chamber. In certain embodiments, the present invention provides a jetting system comprising: (i) a microfluidic device, (ii) a liquid supply source, and (iii) a (laser-based) heating system, wherein the receiving chamber includes a receiving chamber opening, the liquid supply source is configured to supply liquid to the receiving chamber through the receiving chamber opening, and the (laser-based) heating system is configured to supply (laser) radiation to one or more of the chamber walls and the liquid in the receiving chamber, and in particular, the laser radiation comprises infrared laser pulses.

[0088] The jet ejection system may, in particular, facilitate ejection of a microfluidic jet through the first chamber opening. In an embodiment, some of the functions performed by the jet ejection system are, first, to fill a predetermined volume of the receiving chamber with liquid, and, second, to provide energy to eject the microfluidic jet through the first chamber opening.

[0089] In embodiments, the microfluidic device may include one or more patches, particularly a pattern including a plurality of patches each including a first surface material. Such a configuration may facilitate filling of the receiving chamber with a predetermined volume of liquid. In particular, such a configuration may facilitate filling of the receiving chamber with a predetermined volume of liquid along the device extension axis (A D ) along the nozzle opening 22.

[0090] Further, in embodiments, the receiving chamber may include a receiving chamber opening. In particular, the receiving chamber opening is located a distance L from the second chamber end. O In an embodiment, L O may be selected from the range of 10 to 2000 μm (such as the range of 100 to 1500 μm, particularly the range of 500 to 1000 μm). O In particular, D O may be selected from the range of 1 to 1000 μm (the range of 10 to 500 μm, particularly the range of 25 to 300 μm, the range of 25 to 200 μm, etc.). O , 0≦L O / L C ≦0.6(0.1≦L O / L C ≦0.5, especially 0.2≦L O / L C ≦0.4, etc. In some embodiments, the receiving chamber opening may also be configured at the second chamber end. O =0.

[0091] In embodiments, the receiving chamber may be fluidly connected to a liquid source, i.e., liquid may flow from the liquid source to the receiving chamber. To this end, in embodiments, tubing or (micro)pipes may be used to connect the liquid source to the receiving chamber opening. In this way, liquid may flow into the receiving chamber via the receiving chamber opening.

[0092] In embodiments, the jetting system may provide energy to the microfluidic device, particularly to the liquid received in the receiving chamber. In embodiments, energy may be provided to the liquid in a number of different ways. In embodiments, the receiving chamber (particularly the region near the second chamber end) may be heated by a heating system, which may include a laser, a gas burner, an electrical resistance heater, etc. Furthermore, in embodiments, the chamber walls may (also) be heated by a thermal heater or (high temperature) heating element.

[0093] Furthermore, in embodiments, heat may be supplied by a light beam (or laser radiation), i.e., by guiding a laser beam onto the chamber wall, particularly in the region close to the second chamber end. In particular, the laser radiation may comprise infrared laser pulses. Alternatively, in embodiments, the laser radiation may be supplied to one end of an optical fiber and transmitted (by total internal reflection) to the other end of the optical fiber, the other end of the optical fiber being attached to or located close to the chamber wall (particularly the second chamber end). In embodiments, the chamber wall may be transparent to the light beam. In this way, energy may be supplied to the liquid by a light beam (or laser radiation). In particular, the wavelength of the supplied (laser) radiation may be selected from the range of 200 to 11,000 nm (e.g., the range of 300 to 8,000 nm, particularly the range of 400 to 3,000 nm). Additionally or alternatively, the chamber wall may in embodiments comprise a thermal coating (applied to the outside of the chamber wall). In particular, the thermal coating may be adapted to be heated by a light beam (or laser radiation) and the heat may be transferred to the liquid through the chamber walls. Typically, in embodiments, the energy supplied may be in the range of 0.01 to 50 mJ.

[0094] Alternatively, in embodiments, mechanical energy may be provided to the liquid. For example, in some embodiments, the second chamber end may include a second chamber opening. In particular, the device extension axis (A D A piston may be configured within the receiving chamber (and may extend into the receiving chamber via the second chamber opening) such that the piston can act along a height (H T ), and H T The width (W T ), and W T is 1*H T ~20*H T Range (2*H T ~10*H T range, especially 4*H T ~8*H T In particular, the range of 5*H T ~7*H T In embodiments, the piston may be actuated by a compression spring arranged outside the receiving chamber (or, in some embodiments, within the second chamber end). The spring may in particular be compressed and, when released, may drive the piston in a downstream direction. Furthermore, in embodiments, the piston may be actuated by a (pressurized) gas. In particular, pressurized gas may be supplied upstream of the piston, and expansion of the gas may actuate the piston in a downstream direction.

[0095] In embodiments, the jetting may be performed using a piezoelectric actuator. In particular, the microfluidic device may comprise a piezoelectric actuator configured to provide (mechanical) energy to the liquid. In particular, in embodiments, the piston (see above) may comprise a piezoelectric actuator.

[0096] Alternatively, in embodiments, pressurized gas may be supplied to the receiving chamber (in the absence of a piston). In particular, the chamber wall may include a second receiving chamber opening. In particular, the second receiving chamber opening may be located a distance L from the second chamber end. O2 In an embodiment, L O2 may be selected from the range of 10 to 2000 μm (such as the range of 100 to 1500 μm, particularly the range of 500 to 1000 μm). Furthermore, in an embodiment, the second receiving chamber opening has a diameter D O2 In particular, D O2 may be selected from the range of 1 to 500 μm (such as the range of 5 to 250 μm, particularly the range of 10 to 100 μm). In embodiments, the receiving chamber may be fluidly connected to a gas source. That is, in embodiments, the gas source may be configured to supply (pressurized) gas to the receiving chamber via the second receiving chamber opening. To this end, in embodiments, a tube or a (micro)pipe may be used to connect the gas source to the second receiving chamber opening. The pressurized gas may enter the receiving chamber, particularly at a position close to the end of the second chamber. In particular, the expansion of the pressurized gas may cause the device extension axis (A D ) can be used to eject a microfluidic jet by forcing a liquid downstream along the

[0097] In this manner, energy can be supplied to the liquid by a number of different methods (eg, thermal, mechanical, optical, etc.).

[0098] In further embodiments, the jet ejection system may comprise a control system. In particular, the control system may be configured to control (or operate) the jet ejection system. In particular, the control system may control the filling of the liquid in the receiving chamber. That is, in embodiments, the control system may regulate the flow of liquid from the liquid source to the receiving chamber. Furthermore, the control system may regulate the energy supplied to the liquid in the receiving chamber. For example, the control system may regulate the pressure of a gas supplied to an embodiment of the microfluidic device. Alternatively, in embodiments, the control system may regulate the power of a laser-based radiation system. Thus, the control system may, among other things, control the operation of the jet ejection system.

[0099] As used herein, the term "controlling" and similar terms may particularly refer to at least monitoring the operation of a jet injection system. Thus, as used herein, the term "controlling" and similar terms may refer to monitoring the operation of a jet injection system or one or more elements included in a jet injection system. Control of the elements may be performed by a control system. Thus, the control system and the elements may be at least temporarily or permanently functionally connected. An element may comprise the control system. In embodiments, the control system and the elements may not (necessarily) be physically connected.

[0100] The control can be performed by wired and / or wireless control. The term "control system" can also particularly refer to several different control systems that are functionally connected, for example one control system may be a master control system and one or more other control systems may be slave control systems. In an embodiment, the control system may be adapted to operate via a user interface, although other options are possible, such as depending on (external) sensor signals or (time) schemes to perform operations.

[0101] In a further aspect, the present invention may provide a method for ejecting a jet using a microfluidic device. In an embodiment, the method may include a liquid supplying step including supplying a liquid to a receiving chamber. In particular, the liquid supplying step may include filling 20 to 70% by volume of the receiving chamber with the liquid. Also, in an embodiment, the method may include an ejecting step including applying radiation to the chamber wall and / or the liquid to boil at least a portion of the liquid and ejecting a liquid jet.

[0102] Thus, in certain embodiments, the present invention may provide a method for ejecting a jet from a microfluidic device, comprising: a liquid supplying step including supplying a liquid to a receiving chamber, the liquid supplying step including filling the receiving chamber with the liquid by 20 to 70% by volume; and an ejecting step including applying radiation to the chamber wall and / or the liquid to boil at least a portion of the liquid and ejecting a liquid jet.

[0103] As mentioned above, the liquid fill level in the receiving chamber can affect the stability and reproducibility of the microfluidic jet emitted from the system. In particular, the volume of the receiving chamber filled with liquid can depend on the configuration of the pattern included in the chamber wall. That is, the volume percentage of the receiving chamber filled with liquid can vary depending on the configuration of one or more patches (or groups of patches) included in the pattern. In embodiments, the liquid supply step can include filling 10 to 80% by volume (e.g., 20 to 70%, particularly 30 to 60%, and especially 40 to 50% by volume) of the (volume of) the receiving chamber with liquid.

[0104] Further, in embodiments, the method may include an injection step. In embodiments, the injection step may include providing radiation to the chamber walls and / or the liquid. In embodiments, the radiation may be provided by a laser-based radiation source.

[0105] As mentioned above, in some embodiments, the chamber wall may be transparent to the light beam. Energy may thus be provided to the liquid by a light beam (or laser radiation). In particular, the liquid may absorb the (light) energy and be heated. In particular, a portion of the liquid may boil (or vaporize) to form gas bubbles, and the expanding gas bubbles may facilitate the liquid's ejection. Additionally or alternatively, a laser may be focused on a portion of the chamber wall, and heat may be transferred to the liquid through the chamber wall. In particular, the chamber wall may include a thermal coating, which may facilitate the transfer of heat to the liquid. Therefore, the method may particularly include focusing the laser on a portion of the chamber wall that is closer to the second chamber end than the first chamber end. Furthermore, in some embodiments, an optical fiber may be used, where the laser is guided onto one end of the optical fiber, which may be in contact with or adjacent to the chamber wall, and transferred to the other end of the optical fiber by total internal reflection. In this way, laser-based radiation may be provided to the liquid. In embodiments, radiation may be applied to the chamber walls and / or the liquid to cause at least a portion of the liquid to boil (and / or vaporize) and eject a liquid jet.

[0106] Alternatively, in embodiments, the method may include an injection step, whereby mechanical energy is supplied to the liquid. In particular, the method may include actuating a piston arranged within the receiving chamber. In embodiments, the method may include actuating the piston by a compression spring arranged outside the receiving chamber (or, in some embodiments, within the receiving chamber). In particular, the method may include driving the piston in a downstream direction by releasing the (compression) spring. Furthermore, in embodiments, the method may include actuating the piston by supplying a (pressurized) gas upstream of the piston. In particular, the expansion of the gas may actuate the piston in a downstream direction.

[0107] Alternatively, in embodiments, the method, and in particular the injection step, may comprise supplying pressurized gas to the receiving chamber (even in the absence of a piston). In particular, the (pressurized) gas flows from the gas source into the receiving chamber, forcing the liquid towards the device extension axis (A D ) can be aligned to eject a microfluidic jet.

[0108] As mentioned above, the ejecting step may comprise heating the liquid to boil and / or vaporize a portion of the liquid (in the receiving chamber), in particular the heat may be provided with a power selected from the range of 0.10 to 10 W (such as the range of 0.15 to 8 W, in particular the range of 0.20 to 5 W, in particular the range of 0.25 to 1.5 W).

[0109] Jetting systems and methods are known in the art. For example, the method of the present invention may be performed by injecting a liquid jet onto a target material using the system described in WO2020182665, which is incorporated herein by reference.

[0110] The subject material may be, in particular, a viscoelastic material, i.e., a material that exhibits both elastic and viscous behavior upon deformation. For example, in embodiments, the subject material may include a polymer. In further embodiments, the subject material may include (ex vivo) soft tissue, such as (ex vivo) skin or (ex vivo) eye. In further embodiments, the subject material may include a hydrogel, such as one or more of gelatin, agarose, and polyacrylamide. Gelatin and agarose are commonly used to provide texture to foods and as skin substitutes. Polyacrylamide may be used, for example, in studies of cell stiffness (the ability of cells to migrate across a substrate with a stiffness gradient). In further embodiments, the subject material may include an artificially engineered tissue or biomaterial, such as a dermal equivalent or a cell-cultured tissue for transplantation (e.g., 3D-printed tissues and organs).

[0111] Thus, in embodiments, the subject matter may be an inanimate object.Furthermore, in embodiments, the method may be a non-medical method.

[0112] In further embodiments, the target material may include tissue, such as skin tissue or eye tissue, of a subject, among others.

[0113] In an embodiment, the method may comprise ejecting a liquid, in particular a liquid jet, at a jet velocity selected from the range of 1 to 250 m / s (such as the range of 2 to 150 m / s, in particular the range of 5 to 70 m / s). The liquid jet may in particular be adapted to be incident on a target comprising the target material. It will be clear to those skilled in the art that the suitable jet velocity may depend on the jet characteristics of the liquid jet (jet diameter, jet volume, and / or jet angle (relative to the target material)). In general, the jet velocity of the liquid jet may be (relatively) stable from the moment of ejection until the moment of impact with the target material. However, the jet velocity described herein may in particular refer to the jet velocity of the liquid jet immediately before the liquid jet impacts the target material.

[0114] In a further embodiment, the method may comprise ejecting a liquid jet having a jet volume selected from the range of 500 μl or less (such as 200 μl or less, particularly 100 μl or less). In a further embodiment, the liquid jet may be ejected at a jet volume selected from the range of 10 μl or less (such as 5 μl or less, particularly 1 μl or less). In a further embodiment, the liquid jet may be ejected at a jet volume selected from the range of 2-50 nl (such as 5-25 nl, particularly 8-13 nl). In particular, a (relatively) small jet volume may be selected to prevent liquid from pooling on the target material. Thus, in a further embodiment, the liquid jet may be delivered at a jet volume selected from the range of 75 nl or less (such as 50 nl or less, particularly 40 nl or less). In a further embodiment, the liquid jet may be delivered at a jet volume selected from the range of 30 nl or less (such as 20 nl or less, particularly 15 nl or less).

[0115] In a further embodiment, the method may comprise ejecting a liquid jet having an equivalent circular (jet) diameter selected from the range of 20 μm to 5 mm (such as the range of 30 μm to 3 mm, particularly 50 μm to 1 mm). In an embodiment, the equivalent circular diameter may particularly be 3 mm or less (such as 1 mm or less, particularly 500 μm or less, 100 μm or less). The equivalent circular diameter (or ECD) (or "equivalent circular diameter") of an (irregular) two-dimensional shape is the diameter of a circle with an equivalent area. For example, the equivalent circular diameter of a square with a side length of a is 2*a*√(1 / π). For a circle, its diameter is the same as the equivalent circular diameter. If a circle in the xy plane with diameter D is transformed into any other shape (in the xy plane) without changing the size of its area, the equivalent circular diameter of that shape will also be D.

[0116] In general, the liquid jet may be applied perpendicular to the target material. That is, the liquid jet may travel along a path (essentially) perpendicular to the target material before impacting the target material. In further embodiments, the jet may be applied at a (jet) angle, the jet angle being the angle the jet makes with the surface of the target material at the point where it impacts the target material. In embodiments, the liquid jet may be directed toward the target material at a (jet) angle (relative to the target material) of 45° to 90° (such as an angle of 60° to 90°, particularly an angle of 75° to 90°, an angle of 85° to 90°, particularly (essentially) 90°, etc.). In embodiments, the method may comprise applying the liquid jet to the target material at an angle (relative to the target material) of 30° to 85° (such as an angle of 45° to 80°, particularly an angle of 50° to 75°, etc.).

[0117] Further, in embodiments, the method may include varying (over time) jet characteristics of the liquid jet. For example, the method may include varying (over time) the diameter (in equivalent circle or sphere) or jet velocity of the liquid jet. In particular, in embodiments, the method may include varying one or more of the jet velocity, diameter (in equivalent circle or sphere), and jet angle (relative to the target material) of the liquid jet.

[0118] As mentioned above, a plurality of successively dispensed droplets is considered a liquid jet. In particular, in an embodiment, the method may comprise dispensing a liquid jet, which may comprise one or more (successively dispensed) droplets. In a further embodiment, the (liquid) droplets may be ejected with an equivalent spherical diameter selected from the range of 30 μm to 3 mm (such as the range of 50 μm to 2 mm, and particularly the range of 100 μm to 1 mm). The equivalent spherical diameter (or ESD) (or "equivalent spherical diameter") of an (irregular) three-dimensional shape is the diameter of a sphere of equivalent volume. In the case of a sphere, this diameter is the same as the equivalent spherical diameter. If a sphere in the xyz plane of diameter D is changed to any other shape (in the xyz plane) without changing its volume, the equivalent spherical diameter of that shape will also be D.

[0119] Furthermore, in an embodiment, the plurality of droplets (or droplets therein) may be (independently) supplied at intervals selected from the range of 0.02 to 10 ms (such as the range of 0.05 to 5 ms, particularly the range of 0.1 to 2 ms). Thus, in an embodiment, the method may include supplying the plurality of droplets at a frequency selected from the range of 0.001 to 50 kHz (such as the range of 0.1 to 50 kHz, particularly the range of 1 to 30 kHz).

[0120] In particular, in embodiments, the method may include varying the properties of two or more of the plurality of droplets, such as by continuously, in particular linearly, varying the properties of the droplets, or by gradually varying the properties of the droplets (e.g., changing droplets having (essentially) the properties of a first set followed by droplets having the properties of a second set).

[0121] Thus, in embodiments, the method may include varying the jet characteristics (over time) of the liquid jet by varying the jet characteristics along the plurality of (sequentially delivered) droplets. In further embodiments, the method may include varying the interval between two or more consecutive droplets of the plurality of droplets. That is, the duration of the two or more consecutive intervals may be different. In particular, the method may include varying the frequency at which the plurality of droplets are delivered (over time). In particular, in embodiments, the method may include varying the frequency in a range of 0.1 to 50 kHz. In further embodiments, the method may include providing a frequency sweep in a range of 0.001 to 50 kHz (such as a range of 0.1 to 50 kHz, particularly a range of 1 to 30 kHz). As used herein, the term "frequency sweep" may particularly refer to starting at a first frequency, adjusting the frequency continuously or stepwise to a terminal frequency, and then returning (continuously or stepwise) to the starting frequency.

[0122] The embodiments described herein are not limited to a single aspect of the present invention. For example, an embodiment describing a method may further relate to, for example, a system, particularly an operating mode of the system, or particularly a control system. Similarly, a system embodiment describing the operation of the system may further relate to a method embodiment. In particular, a method embodiment describing the operation (of a system) may indicate in an embodiment that the system may be configured for that operation and / or that the system may be suitable for that operation. Similarly, a system embodiment describing the operation of (a certain stage in) a certain operating mode may indicate in an embodiment that the method may include those operations. [Brief explanation of the drawings]

[0123] Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, in which: [Figures 1A-1C] 1 is a diagram schematically illustrating an embodiment of a microfluidic device 1. FIG. [Figure 2A] 2A to 2C are diagrams illustrating various shapes of patches 200 according to an embodiment. [Figure 2B-2C] FIG. 1 is a diagram schematically illustrating a plane of symmetry 150 of a pattern 300 in an embodiment. [Figure 3] 1 is a diagram illustrating a pattern 300 including a plurality of sets of patches 200 in an embodiment. [Figure 4] 1A-1C are schematic diagrams illustrating one embodiment of a jetting system 1000. These schematic diagrams are not necessarily to scale. DETAILED DESCRIPTION OF THE INVENTION

[0124] 1A to 1C are schematic diagrams illustrating an embodiment of a microfluidic device 1. FIG. D 1B is an isometric view of another embodiment of the microfluidic device 1, and FIG. 1C is an isometric view of another embodiment of the microfluidic device 1, taken along the axis of device extension A. D 1 shows a cross section of yet another embodiment of a microfluidic device 1 in a cross section perpendicular to FIG.

[0125] In an embodiment, the present invention may provide a microfluidic device 1 for jetting. In an embodiment, the microfluidic device 1 may comprise a receiving chamber 100 defined by a chamber wall 110. In particular, the receiving chamber 100 may be configured to receive a liquid 10. In an embodiment, the device extension axis A D The receiving chamber 100 has a chamber length L defined by a first chamber end 101 and a second chamber end 102. cIn an embodiment, the chamber wall 110 may include a first chamber end 101 and a second chamber end 102. In particular, the first chamber end 101 may include a first chamber opening 1011 for jet ejection from the receiving chamber 100. In the illustrated embodiment, i.e., in FIGS. 1A-1C, the first chamber opening 1011 is the same size as the first chamber end 101. However, in other embodiments, the first chamber opening 1011 may be a portion (or may be only a portion) of the first chamber end 101.

[0126] In particular, in embodiments, the first chamber end may be (completely) open. In particular, the receiving chamber 100 is D In the cross section perpendicular to the H (device extension axis A D The first chamber opening (in a plane perpendicular to H ~S H In particular, the range of 0.9*S H ~S H The range (essentially S H The opening area may be selected from the following:

[0127] In an embodiment, the chamber wall 110 may comprise a (surface) pattern 300 of a first (liquid-repellent) surface material 111 and a second (liquid-affinity) surface material 112. In particular, the first surface material 111 may have an equilibrium contact angle θ1 > 90° with the liquid 10, and the second surface material 112 may have an equilibrium contact angle θ2 with the liquid 10. In particular, θ1 - θ2 ≥ 20°.

[0128] In an embodiment, the (surface) pattern 300 may include a (surface) patch 200. In an embodiment, the patch 200 may be a two-dimensional shape defined on the surface of the chamber wall 110. In an embodiment, the patch may have a patch boundary 205 (see FIG. 2A ). Furthermore, in an embodiment, the patch 200 may include one of the first surface material 111 and the second surface material 112. Furthermore, in an embodiment, at least 50% of the patch boundary 205 may be in contact with the other of the first surface material 111 and the second surface material 112. In an embodiment, the patch 200 may include the first surface material 111, and at least 80% of the patch boundary 205 may be in contact with the second surface material 112. Furthermore, in an embodiment, the patch 200 may include the second surface material 112, and at least 80% of the patch boundary 205 may be in contact with the first surface material 111. In further embodiments, the patch may contact the other of the first surface material 111 and the second surface material 112 along 99% or more of the patch boundary 205. Generally, the patch 200 may, in embodiments, be configured away from the first chamber edge 101 (such as in the embodiment shown in FIGS. 1A and 1B). In such embodiments, the patch 200 may be completely surrounded by the other of the first surface material 111 and the second surface material 112. Thus, in such embodiments, at least 99% of the patch boundary 205 or (even) 100% of the patch boundary 205 may contact the other of the first surface material 111 and the second surface material 112. However, in other embodiments, the patch 200 may be configured such that the patch boundary 205 may coincide with the first chamber opening 1011. In such embodiments, only a portion of the patch 200 may be surrounded by the other of the first surface material 111 and the second surface material 112. Thus, in such an embodiment, at least 50% (at least 60%, particularly at least 70%, particularly at least 80%, etc.) of the patch boundary 205 may be in contact with the other of the first surface material 111 and the second surface material 112.

[0129] It should be noted that in embodiments, pattern 300 may (also) include multiple patches 200. In the embodiment shown in Figure 1A, only one patch 200 is visible. The embodiments shown in Figures 1B and 1C show two and four patches 200, respectively.

[0130] In an embodiment, the chamber wall 110 has a (wall) surface area S W In particular, the (surface) patch 200 may have a (patch) surface area S P In particular, 10 -4 ≦S P / S W ≦2*10 -1 is.

[0131] In an embodiment, the patch 200 has a patch extension axis A P In particular, the patch 200 may have a patch extension axis A P Along the patch length L P (see also FIG. 2A ), and the patch extension axis A P and vertically the patch width W P In an embodiment, the patch width W P can be measured along the chamber wall 110. In particular, L P ≧1.5*W P In the embodiment shown in FIGS. 1A and 1B, the patch extension axis A P is the device extension axis A D and may be perpendicular.

[0132] In embodiments, patch 200 may have a patch shape that approximates a shape selected from the group including a triangle, a trapezoid, particularly a rectangle, a crescent, an oval, a circle, etc. In embodiments, the patch shape may approximate a triangle. In further embodiments, the patch shape may approximate a trapezoid. In yet other embodiments, the patch shape may approximate a rectangle. In other embodiments, the patch shape may approximate a crescent. In particular, the patch shape may approximate an oval. In particular, the patch shape may approximate a circle.

[0133] In further embodiments, the patch shape may be similar to the aforementioned shapes, while the curvature of one or more sides of the aforementioned shapes may be different. For example, the patch shape may be triangular, or a triangle with one curved side. Thus, the patch shape may approximate a shape selected from the group including a triangle, a trapezoid, in particular a rectangle, a crescent, an oval, and a circle. In embodiments, the patch 200 may have an outline defined by a plurality of line segments, up to two of which are curved. Figure 2A illustrates several different patch shapes in embodiments.

[0134] In this specification, the term "approximate" and its conjugations (such as "to approximate a shape") refer to something that is substantially identical to the following term, in particular the same (e.g., approximately the same as a sector of a circle or a semi-cylinder). For example, the patch boundary 205 may define a circular patch 200 (if it lacks one). Similarly, for example, the rounded shape defined by the patch 200 may not be a perfect circle, but may be slightly elliptical. In particular, in this specification, an object that is approximately a first shape may refer to a first shape entity that encompasses the object. The first shape entity is defined as the smallest encompassing shape of the object (in 2D or 3D, respectively). The first shape entity also has the first shape. The ratio of the area (volume) of the first shape entity to the area (volume) of the object is 1.2 or less, in particular 1.1 or less (e.g., 1.05 or less, in particular 1.02 or less). For example, the patch 200 may approximate a semi-cylindrical shape, and the first geometric entity may be defined as the smallest enclosing semi-cylindrical shape of the patch 200. The ratio of the volume of the first geometric entity to the volume of the patch 200 is 1.2 or less, particularly 1.1 or less (1.05 or less, particularly 1.02 or less, etc., including 1). Furthermore, when the dimensions of the first shape are specified, the term "approximate" may refer to the object and the first shape being superimposed (in 2D or 3D, respectively) and the intersection of the object and the first shape covering at least n% of the object and at least n% of the shape, where n is at least 90% (at least 95%, particularly at least 98%, such as at least 99%, including 100%).

[0135] In an embodiment, the patch 200 may include a first surface material 111. In particular, the patch extension axis A P is the device extension axis A D In the embodiment, the patch width W P is 0.01*L C ~0.2*L C The range may be selected from the following range.

[0136] In embodiments, the patch 200 may include a second surface material 112. In particular, the patch extension axis A P is the device extension axis A D In the embodiment, the patch length L P is 0.2*L C ~0.95*L C The range may be selected from the following range.

[0137] The angle α is particularly relative to the device extension axis (A D ) and patch extension axis (A P ) It may also be the smallest angle between. In other words, -α and +α are not distinguished and both are considered to be α.

[0138] In an embodiment, the pattern 300 (of the first surface material 111 and the second surface material 112) may have a plane of symmetry 150 (see FIG. 2B). D may coincide with the plane of symmetry 150, or alternatively (or in addition), the device extension axis A D may be perpendicular to the plane of symmetry 150. Some embodiments in which the pattern has a plane of symmetry 150 are shown in Figures 2B and 2C.

[0139] In the embodiment, the device extension axis A D In a cross section perpendicular to the plane of the receiving chamber 100, the receiving chamber 100 has a perimeter P C 1C, the device may have an outer periphery 115 (or "circumference") of 100 mm. D The extent of the perimeter 115 of the chamber wall 110 (in a cross section perpendicular to the perimeter) is shown schematically by an additional (closed) line (with arrows at both ends) for visualization purposes, which is (also) shown for other embodiments in Figures 2B(I) and 2C(I). In particular, the patch 200 extends along the perimeter 115 by a (patch) perimeter length P P In an embodiment, P P is 0.05*P C ~0.25*P CThe range may be selected from the following range.

[0140] In the embodiment, the device extension axis A D In a cross section perpendicular to the plane of the receiving chamber 100, the receiving chamber 100 has a perimeter P C In particular, the patch 200 has a (patch) perimeter length P along the perimeter 115. P In particular, P P is 0.4*P C ~P C The range may be selected from the following range.

[0141] In an embodiment, the pattern 300 may include multiple patches 200. In particular, the pattern 300 may include multiple sets of patches 200. Figure 3 illustrates such an embodiment.

[0142] In an embodiment, the receiving chamber 100 has a chamber height H selected from the range of 5 to 400 μm. C and 2*H C ~10*H C The chamber width W is selected from the range C and a chamber length L selected from the range of 100 to 5000 μm. C Furthermore, in the embodiment, the chamber length L C Along at least 80% of its length, receiving chamber 100 may have a cross-sectional shape that approximates a shape selected from the group including a rounded rectangle, a stadium, and an oval.

[0143] FIG. 2A shows a schematic representation of various shapes of patches 200 in an embodiment.

[0144] In embodiments, the patch 200 may be defined by multiple sides. P Length greater than L P In an embodiment, a rectangular patch 200 is shown defined by a patch extension axis A Pmay pass through the midpoint of at least one side of the patch 200.

[0145] Furthermore, in the embodiment, two sides of the patch 200 are aligned along the patch extension axis A. P It should be noted that the orientation of the patch 200 can affect the inhomogeneous surface chemistry of the chamber wall 110. In particular, the patch 200 may be configured parallel to the device extension axis A. D and angle α. Embodiment II is similar to Embodiment I, but the patch 200 in Embodiment II is oriented in a direction perpendicular to that in Embodiment I.

[0146] In embodiment III of FIG. 2A, the patch 200 includes a crescent-shaped patch 200. Here, the patch 200 may be specifically defined by only two curves of different radii that form the crescent shape. Note that in such an embodiment, the patch extension axis A P (as an alternative to the above) specifically the patch orientation axis A passing through the midpoint of the two curves (shown as dashed lines). O may be defined.

[0147] In embodiment IV of FIG. 2A, patch 200 has a semi-stadium shape. The semi-stadium shape may be defined by two parallel and equal sides and two connecting lines connecting the ends of the parallel sides to form a closed two-dimensional area, one of the two connecting sides being straight and the other being curved. In this embodiment, patch length L of patch 200 (as shown in the figure) is P is measured along the parallel edge direction, and the patch width W P can be measured as the distance between two parallel sides.

[0148] As used herein, the (2D) shape of the patch has an extension axis A P In particular, may represent an axis oriented along the extension direction and passing through the imaginary center of gravity of the (2D) shape (when the (2D) shape has an arbitrary thickness). In an embodiment, the extension axis A P may pass through the midpoint of the shortest side of the smallest rectangular entity that contains the shape.

[0149] In embodiment V of Figure 2A, patch 200 includes a patch 200 that includes three sides. In such an embodiment, patch extension axis A P may be defined to pass through the midpoint of one side and the intersection of the other two sides. In embodiments where patch 200 may include an odd number of sides, the patch extension axis A P may be defined to pass through the midpoint of one side and the intersection point of the two other sides opposite said side (as shown in embodiment VI).

[0150] It should be noted that in embodiments, the patch 200 may (also) have other patch shapes that approximate a triangle, a trapezoid, a shape selected from the group including, in particular, a rectangle, a crescent, an oval, a circle, etc. Furthermore, in embodiments, the patch 200 may have a wave shape, and in such embodiments, the patch length L P is measured along the same direction as the wavelength can be measured, and the patch width W P may be measured as the distance between the peaks and valleys of the corrugations. In further embodiments, patch 200 may have a contour defined by multiple line segments. In particular, up to two of the line segments may be curved.

[0151] 2B and 2C show a schematic representation of an embodiment showing the plane of symmetry 150 of the pattern 300. In the embodiment, the device extension axis A D In a cross section perpendicular to the plane of the receiving chamber 100, the receiving chamber 100 has a perimeter P C In particular, the patch 200 may have a (patch) perimeter length P along the perimeter 115. P In an embodiment, P P is 0.05*P C ~0.25*P C In a further embodiment, P P is 0.4*P C ~P C The range may be selected from the following range.

[0152] FIG. 2B illustrates an embodiment of a device extension axis A including a receiving chamber 100 with a circular (or "round") cross section. D 1 shows a cross section perpendicular to the plane of symmetry 150. Embodiment I includes a pattern 300 including (only) one patch 200. In the illustrated embodiment, the pattern 300 may have one plane of symmetry 150. Similarly, in embodiment II, the pattern 300 includes two patches 200. In the illustrated embodiment, the pattern 300 may have two planes of symmetry 150. The planes of symmetry 150 are shown with dashed lines. In the illustrated embodiment, the pattern 300 may have further planes of symmetry 150 (such as cross sections).

[0153] FIG. 2C illustrates an embodiment of the device with an elongated axis A of a receiving chamber 100 having an oval cross section. D 2B , the chamber wall 110 of embodiments I, II, III, and IV includes one, two, three, and four patches 200, respectively. Similar to the embodiment of FIG. 2B , the pattern 300 may include at least one plane of symmetry 150 in embodiments. For example, in embodiments I and III, the pattern 300 includes (at least) one plane of symmetry 150. In embodiments II and IV, the pattern 300 has (at least) two planes of symmetry.

[0154] FIG. 3 illustrates a schematic representation of an embodiment in which a pattern 300 includes multiple sets of patches 200 .

[0155] In embodiment I, the pattern 300 includes a first set 310 of n patches 200. In particular, n may be at least 2. In embodiment I, n is 3. In an embodiment, the n patches 200 are arranged downstream of the second chamber end 102 (along the device extension axis (A D ) in a direction parallel to the patch extension axis A ). In addition, in an embodiment, each patch 200 of the first set 310 may include the first surface material 111. In yet another embodiment, the patch extension axis A of each patch 200 of the first set 310 may be P is the device extension axis AD and the angle α may be 80° or more. In the illustrated embodiment, the first set 310 of n patches 200 is filled with liquid up to the first patch 200.

[0156] In embodiment II, the pattern 300 includes a second set 320 of k patches 200. In particular, k may be at least 2. In embodiment II, k is 3. Note that in some embodiments, the pattern 300 may have multiple sets of patches 200. For example, in the illustrated embodiment, the pattern 300 includes a first set 310 of one patch 200 and a second set 320 of three patches 200.

[0157] Furthermore, in an embodiment, each patch 200 in the second set 320 may include the second surface material 112. In particular, each patch 200 in the second set 320 may include a second surface material 112 (device extension axis A D 0.3*L from the second chamber end 102 (measured along C ~0.9*L C In the embodiment, the patch extension axis A of each patch 200 in the second set 320 may be set to a (shortest) distance selected from the range of P is the device extension axis A D Additionally or alternatively, in embodiments, the patches 200 of the second set 320 may converge or diverge towards the first chamber end 101.

[0158] As previously mentioned, the pattern 300 may include multiple sets, and each set may include multiple patches 200. Embodiment III illustrates a microfluidic device including multiple third sets 330.

[0159] In an embodiment, each third set 330 may include a set of m patches 200. In an embodiment, m may be at least 2. Embodiment III includes two third sets 330 of m patches 200, each third set 330 including three patches 200.

[0160] In an embodiment, each patch 200 of the third set 330 may include the second surface material 112. In particular, the center of mass of (all) the patches 200 is aligned with an axis A defined on the chamber wall 110. M In particular, the axis A M is the device extension axis A D In an embodiment, the patch extension axes A of the m patches 200 of the third set 330 may be parallel to each other. P is the device extension axis A D and the angle α may be 5°≦α≦50°. Furthermore, in an embodiment, the centers of mass of two consecutive patches 200 in the third set 330 may be set at a first distance d1. In particular, d1 is 0.05*L C ~0.5*L C The range may be selected from the following range.

[0161] Furthermore, in the embodiment, the axes A of two adjacent third sets 330 M may be disposed at a distance d2. In particular, d2 is (along the chamber wall 110 with respect to the axis A M (measured perpendicular to the C ~0.5*P CIn the embodiment shown in FIG. 3(III), a first third set 330 forms a positive angle α, and a second third set 330 forms a negative angle α. In this manner, the patches 200 of the multiple third sets 330 may converge (or diverge) toward the first chamber edge 101. In particular, in the embodiment shown in FIG. 3(III), the patches 200 of the multiple third sets 330 may converge toward the first chamber edge 101, and in particular, the patches 200 of different third sets 330 may converge toward the first chamber edge 101.

[0162] FIG. 4 illustrates a schematic diagram of one embodiment of a jetting system 1000 .

[0163] In a further aspect, the present invention may provide a jetting system 1000 comprising: (i) a microfluidic device 1; (ii) a liquid supply source 500; and (iii) a (laser-based) heating system 600. Note that in embodiments, the heating system 600 may facilitate the delivery of energy to the liquid 10 received in the receiving chamber 100. In embodiments, it will be apparent to those skilled in the art that other energy sources may (also) be used to deliver energy to the liquid 10, such as a piston, Joule heating, dielectric breakdown, etc. Some of these embodiments have been described above.

[0164] In an embodiment, the receiving chamber 100 may include a receiving chamber opening 132. Further, in an embodiment, a liquid source 500 (containing a liquid 550) may be configured to provide the liquid 10 to the receiving chamber 100 via the receiving chamber opening 132. In particular, tubing or (micro)pipes 510 may be used to connect the liquid source 500 to the receiving chamber opening 132. Furthermore, a (laser-based) heating system 600 may be configured to provide (laser) radiation 601 to one or more of the chamber wall 110 and the liquid 10 in the receiving chamber 100. In particular, in an embodiment, the laser radiation 601 may include infrared laser pulses 610.

[0165] In an embodiment, the receiving chamber opening 132 is located a distance L from the second chamber end 102. O In an embodiment, L O may be selected from the range of 10 to 2000 μm. In some embodiments, the receiving chamber opening 132 may also be configured at the second chamber end 102. That is, L O = 0. Furthermore, in an embodiment, the receiving chamber opening 132 has a diameter D O In particular, D O The thickness may be selected from the range of 1 to 1000 μm.

[0166] 4, a (laser-based) heating system 600 may be (or may be configured to) direct a beam of laser radiation 601 through the chamber wall 110 onto the liquid 10. The energy provided by the laser radiation 601 may be specifically adapted to be absorbed by the liquid 10 in the receiving chamber 100.

[0167] Furthermore, in an embodiment, the liquid 10 (via the receiving chamber opening 132 ) may be filled to a predetermined volume, such that the progression of the liquid meniscus is blocked by the patch 200 .

[0168] The heat provided by the laser radiation 601 may vaporize at least a portion of the liquid 10. The expansion of the vaporized liquid 10 may also cause the device extension axis A D The liquid 10 may be accelerated along the axis , which may result in a microfluidic jet 20 being ejected from the microfluidic device 1.

[0169] In a further aspect, the present invention provides a method for ejecting a jet 20 from a microfluidic device 1. In an embodiment, the method may include a liquid supplying step and an ejecting step. In an embodiment, the liquid supplying step may include supplying liquid 10 to a receiving chamber 100. In particular, the liquid supplying step may include filling 20 to 70% by volume of the receiving chamber 100 with liquid 10.

[0170] In embodiments, the ejecting step may include applying radiation 601 to the chamber wall 110 and / or the liquid 10 to boil (or vaporize) at least a portion of the liquid 10 to eject the liquid jet 20. Additionally, in embodiments, the ejecting step may include vaporizing a portion of the liquid 10 (in the receiving chamber 100) by heating the liquid 10. In particular, the heat may be applied with a power selected from the range of 0.1 to 10 W.

[0171] The term "plurality" refers to two or more than two. Furthermore, the terms "a plurality of" and "a number of" may be used interchangeably. As used herein, the terms "substantially" or "essentially" and similar terms will be understood by those skilled in the art. The terms "substantially" or "essentially" may also include embodiments with "entirely," "completely," "all," etc. Thus, in embodiments, the adverb "substantially" or "essentially" may be omitted. Furthermore, where applicable, the terms "substantially" or "essentially" may also relate to 90% or more (95% or more, particularly 99% or more, particularly 99.5% or more, etc. (including 100%)). Furthermore, the terms "about" and "approximately" can also relate to 90% or more (95% or more, particularly 99% or more, especially 99.5% or more, etc., including 100%). With respect to numerical values, it is understood that the terms "substantially", "essentially", "about", and "approximately" can also relate to a range of 90% to 110% (such as 95% to 105%, especially 99% to 101%) of the stated value.

[0172] The term "comprise" also includes embodiments in which the term "comprise" means "consist of." The term "and / or" particularly relates to one or more of the items listed before and after "and / or." For example, the expression "item 1 and / or item 2" and similar expressions may relate to one or more of item 1 and item 2. The term "comprising" can mean "consisting of" in some embodiments, while in other embodiments it can also mean "containing at least the defined species and optionally one or more other species."

[0173] Furthermore, in this specification and claims, the terms "first," "second," "third," etc. are used to distinguish between similar elements and do not necessarily denote a sequential or chronological order. The terms so used are interchangeable under appropriate circumstances, with the understanding that the embodiments of the invention described herein are capable of operating in sequences other than those described or illustrated herein.

[0174] Any description herein of a device, apparatus, or system may be, among other things, in operation. Those skilled in the art will appreciate that the present invention is not limited to methods of operation or to devices, apparatus, or systems in operation.

[0175] The term "further embodiment" and similar terms may refer to an embodiment that includes features of the embodiments discussed above, but may also refer to an alternative embodiment.

[0176] It should be noted that the above-described embodiments are illustrative rather than limiting of the present invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims.

[0177] In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.

[0178] Use of the verb "to comprise" and its conjugations does not exclude the presence of elements or steps other than those stated in a claim. Unless the context clearly requires otherwise, throughout this specification and the claims, the words "comprise", "comprising", "include", "including", "contain", "containing", and the like, are to be interpreted in the inclusive sense, i.e., "including, but not limited to", as opposed to the exclusive or exhaustive sense.

[0179] The article "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.

[0180] The invention can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In a device, apparatus, or system claim enumerating several means, several of these means may be embodied by one and the same item of hardware. The mere fact that certain means are recited in mutually different dependent claims does not indicate that a combination of these means cannot be used to advantage.

[0181] The present invention also provides a control system capable of controlling a device, apparatus or system or performing the methods or processes described herein. Additionally, the present invention also provides a computer program product which, when running on a computer operatively connected to or included in a device, apparatus or system, controls one or more controllable elements of such a device, apparatus or system.

[0182] Furthermore, the present invention also applies to a device, apparatus, or system that includes one or more of the features described herein and / or illustrated in the accompanying drawings. Furthermore, the present invention relates to a method or process that includes one or more of the features described herein and / or illustrated in the accompanying drawings. Furthermore, when a method or an embodiment of a method is described as being performed on a device, apparatus, or system, it is understood that the device, apparatus, or system is suitable for (performing) or configured for (performing) the method or embodiment of the method, respectively.

[0183] Combinations of the various aspects discussed in this patent may provide additional advantages. Furthermore, those skilled in the art will recognize that embodiments may be combined, and that combinations of three or more embodiments may be possible. Furthermore, some of the features may form the basis for one or more divisional applications.

Claims

1. A microfluidic device (1) for jetting, comprising a receiving chamber (100) defined by a chamber wall (110), The receiving chamber (100) is configured to receive a liquid (10), and the device extension axis (A Ｄ ), the receiving chamber (100) has a chamber length (L) defined by a first chamber end (101) and a second chamber end (102). ｃ ), wherein the first chamber end (101) comprises a first chamber opening (1011) for jet ejection from the receiving chamber (100); The chamber wall (110) comprises a pattern (300) of a first surface material (111) and a second surface material (112), the first surface material (111) having an equilibrium contact angle θ with the liquid (10). １ >90°, and said second surface material (112) has an equilibrium contact angle θ with said liquid (10). ２ and θ １ -θ ２ ≧20°, The pattern (300) comprises a patch (200), the patch having a patch boundary (205), (a) the patch (200) comprises one of the first surface material (111) and the second surface material (112), and (b) at least 50% of the patch boundary (205) contacts the other of the first surface material (111) and the second surface material (112); The chamber wall (110) has a wall surface area (S Ｗ ), and said patch (200) has a patch surface area (S Ｐ ) and 10 －４ ≦S Ｐ / S Ｗ ≦2*10 －１ and The device extension axis (A Ｄ In a cross section perpendicular to the plane of the receiving chamber (100), the chamber perimeter length P Ｃ and the patch (200) has a patch perimeter length P Ｐ And P Ｐ But 0.01*P Ｃ ~0.5*P Ｃ The microfluidic device (1) is selected from the range of:

2. The patch (200) has a patch extension axis (A Ｐ ), and the patch (200) has the patch extension axis (A Ｐ ) along the patch length (L Ｐ ) and the patch extension axis (A Ｐ ) and the perpendicular patch width (W Ｐ ) and L Ｐ ≧1.5*W Ｐ The microfluidic device (1) according to claim 1, wherein

3. The patch (200) comprises a first surface material (111) and a patch extension axis (A Ｐ ) is the device extension axis (A Ｄ ) and an angle α≧80°, and the patch width W Ｐ But 0.01*L Ｃ ~0.2*L Ｃ The microfluidic device (1) according to claim 2, wherein the thickness is selected from the range of

4. The patch (200) includes a second surface material (112) and a patch extension axis (A Ｐ ) is the device extension axis (A Ｄ ) and the angle α≦30°, and the patch length (L Ｐ ) is 0.2 * L Ｃ ~0.95*L Ｃ The microfluidic device (1) according to claim 2, wherein the thickness is selected from the range of

5. The microfluidic device (1) according to any of the preceding claims, wherein the pattern (300) has a plane of symmetry (150).

6. P Ｐ But 0.05*P Ｃ ~0.25*P Ｃ The microfluidic device (1) according to any one of claims 1 to 5, wherein the thickness is selected from the range of

7. 7. A microfluidic device (1) according to any one of claims 1 to 6, wherein the patch contacts the other of the first surface material (111) and the second surface material (112) along at least 99% of the patch boundary, and the patch (200) has an outline defined by a plurality of line segments, at most two of which are curved.

8. the pattern (300) comprises a first set (310) of n patches (200), n≧2; The n patches (200) are arranged in succession downstream from the second chamber end (102); each patch (200) of the first set (310) includes a first surface material (111); The patch extension axis (A) of each patch (200) of the first set (310) Ｐ ) is the device extension axis (A Ｄ 8. The microfluidic device (1) according to claim 2, wherein the angle α with the first and second electrodes is α≧80°.

9. the pattern (300) comprises a second set (320) of k patches (200), k≧2; each patch (200) of said second set (320) comprises a second surface material (112); Each patch (200) of the second set (320) is spaced from the second chamber end (102) by 0.3*L. Ｃ ~0.9*L Ｃ and configured to a distance selected from a range of The patch extension axis (A) of each patch (200) of the second set (320) Ｐ ) is the device extension axis (A Ｄ 9. The microfluidic device (1) according to any one of claims 2 to 8, wherein the angle α with the first and second electrodes is α≦30°.

10. 10. The microfluidic device (1) of claim 9, wherein k=2 and the patches (200) of the second set (320) converge or diverge towards the first chamber end (101).

11. the pattern (300) includes a plurality of third sets (330); Each third set (330) comprises a set of m patches (200), m≧2, each patch (200) of said third set (330) comprises a second surface material (112), and the center of mass of said patch (200) is aligned with an axis (A) defined on the chamber wall (110). Ｍ ) and the axis (A Ｍ ) is the device extension axis (A Ｄ ) of the m patches (200) of the third set (330) are parallel to the patch extension axes (A Ｐ ) is the device extension axis (A Ｄ ) and the angle α is 5°≦α≦50°, and the centers of mass of two consecutive patches (200) of the third set (330) are arranged at a first distance d1, and d1 is 0.05*L Ｃ ~0.5*L Ｃ The microfluidic device (1) according to any one of claims 2 to 10, selected from the range

12. The axes (A Ｍ ) are placed at a distance d2, and d2 is 0.2*P Ｃ ~0.5*P Ｃ 12. The microfluidic device (1) according to claim 11, selected from the range:

13. The receiving chamber (100) has a chamber height (H) selected from the range of 5 to 400 μm. Ｃ ), 2*H Ｃ ~10*H Ｃ The chamber width (W Ｃ ), and a chamber length (L Ｃ ), and the chamber length (L Ｃ 13. The microfluidic device (1) of claim 1, wherein along at least 80% of the receiving chamber (100) has a cross-sectional shape that approximates a shape selected from the group consisting of a rounded rectangle, a stadium, and an oval.

14. A jetting system (1000) comprising: (i) a microfluidic device (1) according to any one of claims 1 to 13; (ii) a liquid supply source (500); and (iii) a heating system (600), The receiving chamber (100) includes a receiving chamber opening (132); the liquid supply (500) is configured to supply liquid (10) to the receiving chamber through the receiving chamber opening (132); The jet injection system (1000), wherein the heating system (600) is configured to supply radiation (601) to one or more of the chamber walls (110) and the liquid (10) in the receiving chamber (100).

15. A method for ejecting a jet (20) by a microfluidic device (1) according to any one of claims 1 to 13, comprising: a liquid supply step comprising supplying a liquid (10) to a receiving chamber (100), the liquid supply step comprising filling 20-70% by volume of the receiving chamber (100) with the liquid (10); an injection step including applying radiation (601) to the chamber walls (110) and / or to the liquid (10) to boil at least a portion of the liquid (10) and inject a liquid jet (20); The method comprising:

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