SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE INSPECTION METHOD IN LOAD LOCK CHAMBER - Patent application

Abstract

The present invention provides an apparatus for processing substrates, the apparatus including: a front end module having a first return robot for returning substrates; a transfer chamber having a second return robot for returning substrates; and a load lock chamber disposed on a return path along which substrates are returned between the return frame and the transfer chamber, the load lock chamber including a housing having an upper chamber with an upper space and a lower chamber located below the upper chamber and having a lower space; a first rotary support for supporting and rotating a substrate positioned in the upper space; and a second rotary support for supporting and rotating a substrate positioned in the lower space, the first rotary support and the second rotary support being usable for both substrate alignment inspection and substrate vision inspection.

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a method for inspecting a substrate in a load lock chamber. [Background technology]

[0002] An apparatus for processing a substrate using plasma can be used to remove a film on a substrate (e.g., a hard mask formed on a substrate or a photoresist film formed on a substrate). The apparatus for processing a substrate using plasma is performed in a process chamber. In order to properly process a substrate in the process chamber, the notch direction of the substrate carried into the process chamber must match a preset direction and the position where the substrate is placed must match a preset position. To this end, the substrate is notch aligned in an alignment chamber before being returned to the process chamber. In addition, the substrate that has completed processing in the process chamber undergoes vision inspection in a vision chamber.

[0003] However, if the substrate is returned to the alignment chamber, the notch of the substrate is aligned in the alignment chamber, and the substrate is returned from the alignment chamber to the process chamber as described above, the return sequence becomes complicated and the time required for the return becomes long.

[0004] Furthermore, when the processed substrate is returned to the inspection chamber as described above and the processing state of the substrate is checked in the inspection chamber, the return sequence becomes complicated and the time required for the return becomes long.

[0005] Alternatively, the notch of the substrate may be aligned or the state of the substrate may be inspected on the return path along which the substrate is returned. For example, the notch of the substrate may be aligned or the state of the substrate may be inspected in a load lock chamber where the substrate waits for a while before or after processing. In this case, an alignment unit for aligning the notch of the substrate and an inspection unit for inspecting the surface state of the edge of the substrate must be installed in the load lock chamber, which increases the structural complexity of the load lock chamber.

[0006] In particular, the alignment unit is installed in the loading load lock where the substrates are returned to the process chamber, and the inspection unit is installed in the unloading load lock where the substrates are unloaded from the process chamber. Therefore, since the substrates are returned one by one and the movement path is fixed, there is a drawback in that the production volume per hour per equipment (UPEH) is reduced. DISCLOSURE OF THE INVENTION [Problem to be solved by the invention]

[0007] [Technical issues] An object of the present invention is to provide a substrate processing apparatus having a rotating body that can be used for both alignment and vision inspection, and a substrate inspection method in a load lock chamber.

[0008] SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus and a substrate inspection method in a load lock chamber that can shorten the time required to inspect the notch alignment of a substrate and the processing state of the substrate.

[0009] SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus and a substrate inspection method in a load lock chamber that can maximize production per hour (UPEH) efficiency.

[0010] SUMMARY OF THE INVENTION An object of the present invention is to provide a processing apparatus and a method for inspecting a substrate in a load lock chamber, which can perform alignment and vision inspection in two chambers.

[0011] The problems to be solved by the present invention are not limited to the above-mentioned problems, and problems not mentioned will be clearly understood by a person having ordinary skill in the art to which the present invention pertains from this specification and the accompanying drawings. [Means for solving the problem]

[0012] [Technical solution] According to one embodiment of the present invention, a substrate processing apparatus can be provided that includes: a front end module having a first return robot that returns substrates; a transfer chamber having a second return robot that returns substrates; and a load lock chamber arranged on a return path along which substrates are returned between the return frame and the transfer chamber, the load lock chamber including a housing having an upper chamber with an upper space and a lower chamber positioned below the upper chamber and having a lower space; a first rotary support that supports and rotates a substrate positioned in the upper space; and a second rotary support that supports and rotates a substrate positioned in the lower space; the first rotary support and the second rotary support can be used in both substrate alignment inspection and substrate vision inspection.

[0013] The substrate support may further include a first fixed support for supporting the substrate in the upper space; and a second fixed support for supporting the substrate in the lower space, wherein the first rotary support is rotated by a first rotary drive unit and elevated by a first elevation drive unit, and the second rotary support is rotated by a second rotary drive unit and elevated by a second elevation drive unit.

[0014] The first fixed support may further include first support shafts provided at edges of the upper space; and first edge slots connected to the first support shafts and supporting bottom edges of the substrate, and may further include a third rotation driver that rotates the first support shafts so that the first edge slots can support the substrate and are rotated to a position where they do not interfere with the rotation and lifting operations of the first rotary support.

[0015] The second fixed support may include second support shafts provided at edges of the lower space; and second edge slots connected to the second support shafts, respectively, to support bottom edges of the substrate.

[0016] The first rotation support may include a first rotation shaft connected to the first rotation driver provided at the upper part of the housing; horizontal fingers provided in the upper space, connected to the first rotation shaft, and having a length greater than the radius of the substrate; and support fingers provided at ends of the horizontal fingers to support the bottom edge of the substrate.

[0017] The first lifting driver may include a first actuator; a first lifting bar that is lifted and lowered by the first actuator and is connected to the first rotary support; and a first guide that guides the up and down movement of the first lifting bar.

[0018] The second rotation support may include a second rotation shaft connected to the second rotation driver provided at the lower part of the housing; and a support plate provided in the lower space, connected to the second rotation shaft, and having a radius smaller than that of the substrate to support a central portion of the bottom surface of the substrate.

[0019] The substrate pick-up / placement device may further include a third fixed support provided on a bottom surface of the upper space to support the substrate, and the substrate may be picked up / placed on the third fixed support by the up / down movement of the first rotary support.

[0020] In addition, the rotation center of the first rotating support and the rotation center of the second rotating support may be different, and the alignment inspection and vision inspection positions on the first rotating support and the alignment inspection and vision inspection positions on the second rotating support may be provided at positions where the substrate placed on the first rotating support and the substrate placed on the second rotating support do not overlap each other when viewed from above.

[0021] a first alignment unit positioned in the upper space for aligning a substrate; a second alignment unit positioned in the lower space for aligning a substrate; The apparatus may include a first vision unit for inspecting the edge surface condition of a substrate positioned in the upper space; and a second vision unit for inspecting the edge surface condition of a substrate positioned in the lower space.

[0022] Also, the first alignment unit, the second alignment unit, the first vision unit, and the second vision unit may be provided on an upper portion of the housing.

[0023] Also, a viewing window may be provided in a partition wall between the upper chamber and the lower chamber for alignment inspection and vision inspection of the substrate placed in the lower space.

[0024] According to another aspect of the present invention, there is provided a method for inspecting a substrate in a load lock chamber located between a front end module and a transfer chamber, the method comprising: a first loading step in which an unprocessed substrate is loaded from the front end module and a processed substrate is unloaded to the front end module; a second loading step in which a processed substrate is loaded from the transfer chamber and the unprocessed substrate is unloaded to the transfer chamber; An alignment inspection step in which an alignment inspection is performed on the unprocessed substrate before the second loading step; and a vision inspection step in which a vision inspection is performed on the processed substrate before the first loading step; wherein the alignment inspection step and the vision inspection step are performed with the unprocessed substrate and the processed substrate placed on the same rotary support, a substrate inspection method in a load lock chamber can be provided.

[0025] In addition, the processed substrate that has completed the vision inspection on the rotary support may be placed on a fixed support, the unprocessed substrate may be placed on the rotary support in the first loading step, and the unprocessed substrate placed on the fixed support may be placed on the rotary support in the alignment inspection step, and then an alignment inspection may be performed.

[0026] In addition, in the second loading step, the processed substrate may be placed on the fixed support, and in the vision inspection step, the processed substrate placed on the fixed support may be placed on the rotating support, after which vision inspection may be performed.

[0027] Also, the alignment inspection step includes: After completing the alignment of the unprocessed substrate, an origin operation is performed to rotate the rotary support to an origin position; the origin operation of the rotary support can be performed after the unprocessed substrate is placed on a fixed support installed at the bottom of the internal space of the load lock chamber.

[0028] In addition, the internal pressure of the load lock chamber may be converted from atmospheric pressure to a preset vacuum pressure while the alignment inspection step is being performed, and the internal pressure of the load lock chamber may be converted from the preset vacuum pressure to the atmospheric pressure while the vision inspection step is being performed.

[0029] According to another aspect of the present invention, there is provided a substrate processing apparatus including: a housing having an upper chamber with an upper space and a lower chamber positioned below the upper chamber and having a lower space; a first rotary support that supports and rotates a substrate positioned in the upper space; a second rotary support that supports and rotates a substrate positioned in the lower space; a first fixed support that supports a substrate in the upper space; a second fixed support that supports a substrate in the lower space; a first alignment unit for aligning a substrate positioned in the upper space; a second alignment unit for aligning a substrate positioned in the lower space; a first vision unit for vision inspection of a substrate positioned in the upper space; and a second vision unit for vision inspection of a substrate positioned in the lower space; wherein the first alignment unit, the second alignment unit, the first vision unit, and the second vision unit are provided at an upper part of the housing, and the first rotary support and the second rotary support are used commonly for substrate alignment inspection and substrate vision inspection.

[0030] The first rotary support is rotated by a first rotary driver and raised and lowered by a first lift driver, the second rotary support is rotated by a second rotary driver and the second fixed support is raised and lowered by a second lift driver, the first fixed support including first support shafts provided at an edge of the upper space; and first edge slots connected to the first support shafts and supporting a bottom edge of a substrate, and a third rotary driver configured to rotate the first support shafts so that the first edge slots are rotated to a position where they can support a substrate and do not interfere with the rotation and lifting of the first rotary support; and a second fixed support provided at a bottom of the upper space and supporting a substrate, wherein the substrate can be picked up and placed on the second fixed support by the up and down movement of the first rotary support.

[0031] In addition, the rotation center of the first rotating support and the rotation center of the second rotating support may be different, and the alignment inspection and vision inspection positions on the first rotating support and the alignment inspection and vision inspection positions on the second rotating support may be provided at positions where the substrate placed on the first rotating support and the substrate placed on the second rotating support do not overlap each other when viewed from above, and a partition between the upper chamber and the lower chamber may be provided with a viewing window for the second alignment unit and the second vision unit. [Effects of the Invention]

[0032] [Beneficial Effects] According to one embodiment of the present invention, a substrate notch alignment inspection and a vision inspection for checking the surface condition of the substrate edge can be performed with a single rotating support.

[0033] According to one embodiment of the present invention, notch alignment and vision inspection are performed in each of the upper and lower chambers, thereby reducing the layout reduction effect and the additional return time of the return robot.

[0034] According to one embodiment of the present invention, notch alignment and vision inspection for the upper and lower chambers are performed during chamber pumping time and chamber fuzzing time, respectively, thereby maximizing production per hour (UPEH) efficiency per equipment.

[0035] According to one embodiment of the present invention, notch alignment and vision inspection can be selectively performed in each of the upper and lower chambers.

[0036] The effects of the present invention are not limited to the effects described above, and effects not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from this specification and the accompanying drawings. [Brief explanation of the drawings]

[0037] [Figure 1]FIG. 1 is a diagram illustrating a substrate processing apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a diagram showing a schematic view of one embodiment of the load lock chamber of FIG. [Figure 3A] FIG. 3A is a plan view of the load lock chamber shown in FIG. [Figure 3B] FIG. 3B is a cross-sectional view taken along line AA indicated in FIG. 3A. [Figure 4] FIG. 4 is a diagram illustrating the lower chamber. [Figure 5] FIG. 5 is a diagram illustrating the upper chamber. [Figure 6] FIG. 6 is a cross-sectional view taken along line BB shown in FIG. [Figure 7A] 7A to 7F are diagrams showing the substrate inspection process in the lower chamber step by step. [Figure 7B] 7A to 7F are diagrams showing the substrate inspection process in the lower chamber step by step. [Figure 7C] 7A to 7F are diagrams showing the substrate inspection process in the lower chamber step by step. [Figure 7D] 7A to 7F are diagrams showing the substrate inspection process in the lower chamber step by step. [Figure 7E] 7A to 7F are diagrams showing the substrate inspection process in the lower chamber step by step. [Figure 7F] 7A to 7F are diagrams showing the substrate inspection process in the lower chamber step by step. [Figure 8] FIG. 8 is a flow chart showing the substrate inspection process in the lower chamber step by step. [Figure 9A] 9A to 9H are diagrams showing the substrate inspection process in the upper chamber step by step. [Figure 9B] 9A to 9H are diagrams showing the substrate inspection process in the upper chamber step by step. [Figure 9C]9A to 9H are diagrams showing the substrate inspection process in the upper chamber step by step. [Figure 9D] 9A to 9H are diagrams showing the substrate inspection process in the upper chamber step by step. [Figure 9E] 9A to 9H are diagrams showing the substrate inspection process in the upper chamber step by step. [Figure 9F] 9A to 9H are diagrams showing the substrate inspection process in the upper chamber step by step. [Figure 9G] 9A to 9H are diagrams showing the substrate inspection process in the upper chamber step by step. [Figure 9H] 9A to 9H are diagrams showing the substrate inspection process in the upper chamber step by step. [Figure 10] FIG. 10 is a flow chart showing the process of inspecting a substrate in the upper chamber step by step. [Figure 11A] 11A and 11B are diagrams illustrating the origin operation of the first rotary support. [Figure 11B] 11A and 11B are diagrams illustrating the origin operation of the first rotary support. DETAILED DESCRIPTION OF THE INVENTION

[0038] [Best Mode for Carrying Out the Invention] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention may be modified in various ways, and the scope of the present invention should not be construed as being limited to the embodiments described below. These embodiments are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes of components in the drawings are exaggerated to emphasize a clearer description.

[0039] Terms such as "first," "second," etc. may be used to describe various components, but the components should not be limited by these terms. These terms may be used to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of the present invention.

[0040] Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 11B.

[0041] 1 is a diagram illustrating a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 1, the substrate processing apparatus 1 includes an Equipment Front End Module (EFEM) 20 and a processing module 30. The front end module 20 and the processing module 30 are arranged in one direction.

[0042] The front end module 20 has a load port 10 and a return frame 21. The load port 10 has a plurality of support parts 6. The plurality of support parts 6 may be arranged in a row in a first direction 11. When viewed from the front, a direction perpendicular to the first direction 11 is defined as a second direction 12. For example, the second direction 12 may be a direction perpendicular to the ground. A direction perpendicular to a plane including both the first direction 11 and the second direction 12 is defined as a third direction 13.

[0043] A container 4 can be mounted on each of the supports 6. According to an embodiment, the container 4 can include a cassette, a FOUP, etc. The container 4 stores substrates (W) to be processed and substrates (W) that have been processed.

[0044] The return frame 21 is disposed between the load port 10 and the processing module 30. The internal space of the return frame 21 can be generally maintained at atmospheric pressure. A first return robot 25 is disposed inside the return frame 21. The first return robot 25 returns the substrate (W) between the load port 10 and the processing module 30. The first return robot 25 can move along a return rail 27 provided in the first direction 11 to return the substrate (W) between the container 4 and the processing module 30.

[0045] The processing module 30 includes a load lock chamber 40, a transfer chamber 50, and a process chamber 60. The processing module 30 receives a substrate (W) housed in a container 4 placed on a load port 10 and performs a processing process to remove a thin film from the edge region of the substrate (W).

[0046] The load lock chamber 40 is disposed adjacent to the return frame 21. For example, the load lock chamber 40 may be disposed between the front end module 20 and the transfer chamber 50. The load lock chamber 40 provides a waiting space for a substrate (W) to be provided for a process before being returned to the process chamber 60, or for a substrate (W) after processing is completed before being returned to the front end module 20. The internal atmosphere of the load lock chamber 40 may be switched between atmospheric pressure and vacuum pressure. A detailed description of the load lock chamber 40 will be provided later.

[0047] The transfer chamber 50 returns the substrate (W). For example, the transfer chamber 50 can return the substrate (W) between the load lock chamber 40 and the process chamber 60. The transfer chamber 50 is disposed adjacent to the load lock chamber 40. When viewed from above, the transfer chamber 50 may have a polygonal body. The load lock chamber 40 and a plurality of process chambers 60 may be disposed around the outside of the body.

[0048] The internal atmosphere of the transfer chamber 50 may generally be maintained at a vacuum pressure. A second return robot 53 is disposed in the internal space of the transfer chamber 50, which returns a substrate (W) between the load lock chamber 40 and the process chamber 60. The second return robot 53 returns an unprocessed substrate (W) waiting in the load lock chamber 40 to the process chamber 60, or returns a processed substrate (W) from the process chamber 60 to the load lock chamber 40. The second return robot 53 may also return a substrate (W) between multiple process chambers 60.

[0049] The process chamber 60 is disposed adjacent to the transfer chamber 50. The process chambers 60 may be disposed along the periphery of the transfer chamber 50. A plurality of process chambers 60 may be provided. In each process chamber 60, a process is performed on the substrate (W). The process chamber 60 receives the substrate (W) from the second return robot 53, performs the process on the substrate (W), and hands over the substrate (W) after the process is completed to the second return robot 53. The process performed in each process chamber 60 may be different from each other.

[0050] The controller 70 can control the substrate processing apparatus 1. The controller 70 can control each component of the substrate processing apparatus 1 so as to perform the substrate processing method described below. The controller 70 can control the operation of the substrate processing apparatus 1. The controller 70 can include a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), etc.

[0051] Hereinafter, the process chamber 60 may refer to a process chamber 60 that processes a substrate with plasma. The process chamber 60 that performs the plasma processing process can etch or ash the film on the edge of the substrate (W). The film can include various types of films such as polysilicon film, oxide film, and silicon nitride film.

[0052] As an example, the process chamber 60 may perform a bevel etch process to remove a film on the edge region of the substrate (W) among the process chambers 60 of the substrate processing apparatus 1. However, the process chamber 60 of the substrate processing apparatus 1 is not limited thereto, and may be various process chambers 60 in which processing is performed on the substrate (W).

[0053] The load lock chamber 40 according to an embodiment of the present invention will now be described in detail.

[0054] Figure 2 is a diagram showing a schematic view of one embodiment of the load lock chamber of Figure 1, Figure 3A is a plan view of the load lock chamber shown in Figure 2, and Figure 3B is a cross-sectional view taken along line AA in Figure 3A. Figure 4 is a diagram illustrating the lower chamber, and Figure 5 is a diagram illustrating the upper chamber. Figure 6 is a cross-sectional view taken along line BB in Figure 5.

[0055] 2 to 6, the load lock chamber 40 may include a housing 100, a first rotary support 210, a first fixed support 230, a second rotary support 220, a second fixed support 240, a first rotary drive unit 310, a first lift drive unit 320, a second rotary drive unit 330, a second lift drive unit 340, a third rotary drive unit 350, and a third fixed support 250.

[0056] The present invention is characterized in that the first rotating support 210 and the second rotating support 220 are used in common for substrate notch alignment (alignment inspection) and substrate edge surface condition inspection (vision inspection).

[0057] The housing 100 includes an upper chamber 110 and a lower chamber 120, which are stacked one on top of the other. The upper chamber 110 has an upper space 112, and the lower chamber 120 has a lower space 124. A partition wall 104 is provided between the upper space 112 and the lower space 124. The upper space 112 and the lower space 124 can be converted between a vacuum pressure atmosphere and an atmospheric pressure atmosphere by an atmosphere conversion unit (not shown).

[0058] First gate doors 118 and 128 are provided on a first side wall of the housing 100. When the first gate doors 118 and 128 are opened, the inner space of the return frame 21 can communicate with the upper space 112 and the lower space 124.

[0059] Second gate doors 119 and 129 are provided on a second side wall of the housing 100. When the second gate doors 119 and 129 are opened, the internal space of the transfer chamber 50 can communicate with the upper space 112 and the lower space 124.

[0060] The internal atmospheres of the upper space 112 and the lower space 124 can be independently switched between atmospheric pressure and vacuum pressure by an atmosphere switching unit (not shown). The upper space 112 and the lower space 124 can function as spaces into which substrates to be processed (hereinafter referred to as unprocessed substrates, W) are loaded. For example, the upper space 112 and the lower space 124 can function as spaces into which substrates W unloaded from the container 4 placed on the load port 10 shown in FIG. 1 are loaded. The substrates W unloaded from the container 4 may be substrates W to be processed in the process chamber 60 shown in FIG. 1.

[0061] Additionally, the upper space 112 and the lower space 124 may function as spaces into which a processed substrate (processed substrate, W) is transferred. For example, the upper space 112 and the lower space 124 may function as spaces into which a substrate (W) that has undergone a bevel etch process is transferred in the process chamber 60 shown in FIG. The substrate (W) transferred from the process chamber 60 may be the substrate (W) that is stored in the container 4 shown in FIG.

[0062] The first rotary support 210 supports and rotates the substrate W positioned in the upper space 112. The first rotary support 210 is rotated by the first rotary driver 310 and can be elevated by the first elevation driver 320. The first rotary support 210 may include a first rotary shaft 211, horizontal fingers 212, and support fingers 214. The first rotary shaft 211 is connected to the first rotary driver 310 provided at the top of the housing 100. The horizontal fingers 212 are provided in the upper space 112 and connected to the first rotary shaft 211. The horizontal fingers 212 have a length greater than the radius of the substrate. The support fingers 214 are provided at the ends of the horizontal fingers 212. The support fingers 214 support the bottom edge of the substrate W. In this embodiment, the first rotary support 210 is illustrated as supporting the substrate W at four fulcrums, but the present invention is not limited thereto.

[0063] The first rotary driver 310 is coupled to the first rotary shaft 211. The first rotary driver 310 provides a driving force to the first rotary shaft 211. According to an embodiment, the first rotary driver 310 may be a motor that provides the driving force.

[0064] The first lifting drive unit 320 may include a first actuator 322, a first lifting bar 324, and a first guide 326. The first actuator 322 may be a hydraulic cylinder. The first actuator 322 may be installed on the upper wall 102 of the housing 100. The first lifting bar 324 may be raised and lowered by the first actuator 322. The first lifting bar 324 may be connected to the first rotary support 210. The first guide 326 is provided to guide the up and down movement of the first lifting bar 324.

[0065] The first fixed support 230 is provided to support a substrate (W) in the upper space 112. The first fixed support 230 may include four first support shafts 233 provided on the edge of the upper space 112 and first edge slots 234 connected to the first support shafts 232 and supporting the bottom edge of the substrate. The first support shafts 232 may be rotated by the third rotation driver 350. The first edge slots 234 may be rotated to a normal position or a retracted position by the rotation of the first support shafts 232. The normal position may be a position where the first edge slots 234 can support the substrate. The retracted position may be a position where there is no interference during the rotation and elevation of the first rotary support 210. For reference, the normal position of the first edge slots 234 is indicated by dotted lines in FIG. 6, and the retracted position of the first edge slots 234 is indicated by solid lines in FIG. 6. In this embodiment, the first fixed support 230 is described as supporting the substrate at four fulcrums, but this is not limited thereto.

[0066] The third fixed support 250 may be provided in the form of a pin protruding from the bottom surface of the upper space 112. At least three third fixed supports 250 may be provided to support the substrate W. The substrate can be picked up / placed on the third fixed support 250 by the up / down movement of the first rotary support 210.

[0067] The second rotary support 220 supports and rotates a substrate positioned in the lower space 124. The second rotary support 220 can be rotated by a second rotary driver 330. In one example, the second rotary support 220 can include a second rotary shaft 222 and a support plate 224. The second rotary shaft 222 is provided at the bottom of the housing 100. The support plate 224 is connected to the second rotary shaft 222. When viewed from above, the support plate 224 can have a diameter relatively smaller than that of the substrate (W). The support plate 224 is provided to support the central portion of the bottom surface of the substrate.

[0068] The second rotary driver 330 is coupled to the second rotary shaft 222. The second rotary driver 330 provides a driving force to the second rotary shaft 222. According to an embodiment, the second rotary driver 330 may be a motor that provides the driving force.

[0069] The second fixed support 240 may be provided to support the substrate W in the lower space. The second fixed support 240 may be elevated by a second elevation driver 340. The second fixed support 240 may include four second support shafts 242 provided at the edges of the lower space and second edge slots 244 connected to the second support shafts 242, respectively, to support the bottom edge of the substrate.

[0070] The second lifting drive unit 340 may include a second actuator 342, a second lifting bar 344, and a second guide 346. The second actuator 342 may be a hydraulic cylinder. The second actuator 342 may be installed on the lower wall 106 of the housing 100. The second lifting bar 344 may be raised and lowered by the second actuator 342. The second lifting bar 344 may be connected to the second rotary support 220. The second guide 346 is provided to guide the up and down movement of the second lifting bar 344.

[0071] A first alignment unit 410, a second alignment unit 430, a first vision unit 420, and a second vision unit 440 are installed on the upper part of the housing 100. The first alignment unit 410 and the first vision unit 420 detect a substrate positioned in the upper space 112. The second alignment unit 430 and the second vision unit 440 detect a substrate positioned in the lower space 124. Here, the detection can include inspecting the notch alignment of the substrate and the surface condition of the substrate edge. The first alignment unit 410 and the second alignment unit 430 can inspect the notch of the substrate. The first vision unit 420 and the second vision unit 440 can inspect the surface condition of the upper edge of the substrate (W).

[0072] The rotation center (C1) of the first rotating support 210 and the rotation center (C2) of the second rotating support 220 are provided to be different so that the second alignment unit 430 and the second vision unit 440 can detect the substrate in the lower space 124. In other words, the alignment inspection and vision inspection positions of the first rotating support 210 and the alignment inspection and vision inspection positions of the second rotating support 220 are provided at positions where the substrate placed on the first rotating support 210 and the substrate placed on the second rotating support 220 do not overlap each other when viewed from above.

[0073] The first alignment unit 410 and the first vision unit 420 are positioned near the first side wall of the housing 100 where the second gate door 119 is installed, and the second alignment unit 430 and the second vision unit 440 are positioned near the second side wall of the housing 100 where the first gate door 118 is installed.

[0074] The housing 100 may be provided with viewports 103, 105. For example, a first viewport 103 may be provided on an upper wall 102 of the housing 100, and a second viewport 105 may be provided on a partition wall 104 between the upper and lower chambers. The first viewport 103 and the second viewport 105 may be made of a transparent material.

[0075] The first viewport 103 may be provided adjacent to the first alignment unit 410 and the first vision unit 420, and the second alignment unit 430 and the second vision unit 440, respectively.

[0076] The second viewport 105 may be provided at a position where the second alignment unit 430 and the second vision unit 440 can detect the substrate in the lower space 124 .

[0077] A substrate inspection method in a load lock chamber according to an embodiment of the present invention will now be described. The controller 70 controls the components of the load lock chamber 40 to perform the substrate processing method described below.

[0078] 7A to 7F are diagrams showing the steps of the substrate inspection process in the lower chamber, and FIG. 8 is a flowchart showing the steps of the substrate inspection process in the lower chamber.

[0079] 7A to 8, the method for inspecting a substrate in a lower chamber may include a first loading step (S100), an alignment inspection step (S200), a second loading step (S300), and a vision inspection step (S400). After the vision inspection step (S400), the first loading step (S100) is performed again.

[0080] In the first loading step (S100), the unprocessed substrate (W2) is loaded by the first return robot 25 of the front end module 20, and the processed substrate (W1) is unloaded to the front end module 20 (first gate door open state). The unprocessed substrate (W2) is placed on the second rotating support 220 (see FIG. 7C). In the first loading step (S100), the processed substrate (W1) may be in a state where vision inspection has been completed.

[0081] In the alignment inspection step (S200), the first gate door 128 is closed and notch alignment for the unprocessed substrate W2 is performed. That is, the unprocessed substrate W2 is rotated by the second rotary support 220, and the second alignment unit 430 inspects the notch of the substrate W2 (FIG. 7D). Once alignment of the unprocessed substrate W2 is complete, the second gate door 129 is opened.

[0082] In the second loading step (S300), the processed substrate (W1) is loaded into the transfer chamber 50 by the second return robot 53, and the unprocessed substrate (W2) is unloaded into the transfer chamber 50 (FIG. 7E). The processed substrate (W1) loaded into the lower space 124 by the second return robot 53 is placed on the second fixed support 240. In the second loading step, the second return robot can be switched, so that the loading and unloading order of the unprocessed substrate and the processed substrate can be changed.

[0083] In the vision inspection step (S400), the processed substrate W1 is placed on the second rotary support 220 by the lowering movement of the second fixed support 240 (FIG. 7F). Then, the second gate door 129 is closed. The processed substrate W1 is rotated by the second rotary support 220, and the second vision unit 440 inspects the surface condition of the upper edge of the processed substrate W1 (FIG. 7A). After the vision inspection, the processed substrate W1 is placed on the second fixed support 240, and the first gate door 128 is opened (FIG. 7B).

[0084] As described above, according to this embodiment, the alignment inspection step and the vision inspection step are performed in a state where the unprocessed substrate W2 and the processed substrate W1 are placed on the same second rotary support 220.

[0085] Meanwhile, while the alignment inspection step is being performed, the internal pressure of the lower space 124 may be converted from normal pressure to a preset vacuum pressure, and while the vision inspection step is being performed, the internal pressure of the lower space 124 may be converted from a preset vacuum pressure to normal pressure.

[0086] 9A to 9H are diagrams showing the steps of the substrate inspection process in the upper chamber, and FIG. 10 is a flowchart showing the steps of the substrate inspection process in the upper chamber.

[0087] 9A to 10, the method for inspecting a substrate in the upper chamber may include a first loading step (S500), an alignment inspection step (S600), a second loading step (S700), and a vision inspection step (S800). After the vision inspection step (S800), the first loading step (S500) is performed again.

[0088] In the first loading step (S500), the unprocessed substrate (W2) is loaded by the first return robot 25 of the front end module 20, and the processed substrate (W1) is unloaded to the front end module 20 (first gate door 118 is open). The unprocessed substrate (W2) is placed on the first fixed support 230, and the processed substrate (W1) placed on the first rotary support 210 is unloaded to the front end module 20 (see FIGS. 9C and 9D). In the first loading step (S500), the processed substrate (W1) may have undergone vision inspection.

[0089] In the alignment inspection step (S600), the first gate door 118 is closed and notch alignment for the unprocessed substrate W2 is performed. The unprocessed substrate W2 is placed on the first rotating support 210 by raising the first rotating support 210. The unprocessed substrate W2 is rotated by the first rotating support 210, and the first alignment unit 410 inspects the notch of the substrate W2 (FIG. 9E). The first rotating support 210 is rotated with the first edge slots 234 of the first fixed support 230 rotated to the avoidance position. If the notch is located on the support fingers 214 during the alignment inspection, the first alignment unit 410 cannot detect the notch. In this case, after a timeout alarm, the substrate W2 is lowered onto the third fixed support 250. At this time, the first rotating support 210 is rotated a certain angle so that the support fingers 214 are lowered further below the substrate and the notch avoids the support fingers 214. After this, an alignment inspection is performed again. When alignment of the unprocessed substrate (W2) is completed, the position of the support fingers 214 may not be the origin position. In this case, the return robot cannot enter. Therefore, an origin operation is performed to rotate the first rotating support 210 to the origin position (FIGS. 9F and 9G). During the origin operation of the first rotating support 210, the first edge slots 234 of the first fixed support 230 wait in the avoidance position. For reference, the origin position of the first rotating support 210 is a position where there is no collision when loading / unloading a substrate, and is shown in FIG. 6.

[0090] 11A and 11B are views illustrating the origin operation of the first rotary support 210. Referring to FIGS. 9F, 9G, 11A, and 11B, the origin operation of the first rotary support 210 involves placing the unprocessed substrate W2 on the third fixed support 250 and moving the rear support fingers 214 to the origin position. Once the origin operation of the first rotary support 210 is complete, the first edge slots 234 of the first fixed support 230 are rotated from the avoidance position to the normal position, and the second gate door 119 is opened.

[0091] In the second loading step (S700), the processed substrate (W1) is loaded into the transfer chamber 50 by the second return robot 53, and the unprocessed substrate (W2) is unloaded into the transfer chamber 50 (FIG. 9H). The processed substrate (W1) loaded into the upper space 112 by the second return robot 53 is placed on the first fixed support 230.

[0092] In the vision inspection step S800, the processed substrate W1 is placed on the first rotating support 210 by raising the first rotating support 210 (FIG. 9A). Then, the second gate door 119 is closed. The processed substrate W1 is rotated by the first rotating support 210, and the first vision unit 420 inspects the surface condition of the upper edge of the processed substrate W1 (FIG. 9A). After the vision inspection, the processed substrate W1 is moved to the down position (see FIG. 9B). During the vision inspection, the first edge slots 234 of the first fixed support 230 wait in the avoidance position. For example, after the vision inspection, the first rotating support 210 may perform an origin operation if necessary. Once the vision inspection is completed, the first gate door 128 is opened.

[0093] As described above, according to this embodiment, the alignment inspection step and the vision inspection step are performed in a state where the unprocessed substrate W2 and the processed substrate W1 are placed on the same first rotary support 210.

[0094] Meanwhile, while the alignment inspection step is being performed, the internal pressure of the upper space 112 may be converted from normal pressure to a preset vacuum pressure, and while the vision inspection step is being performed, the internal pressure of the upper space 112 may be converted from a preset vacuum pressure to normal pressure.

[0095] According to the above-described embodiment of the present invention, notch and surface inspection of the substrate (W) can be performed in the load lock chamber 40, which is located on the path along which the unprocessed substrate (W2) to be processed and the processed substrate (W1) are returned. That is, the notch inspection and alignment of the substrate (W2) and the surface processing state of the substrate (W1) can all be inspected in the load lock chamber 40. This minimizes the substrate movement path in the substrate processing apparatus 1. This simplifies the return sequence of the substrates (W1, W2), allowing for efficient substrate processing.

[0096] The above detailed description exemplifies the present invention. Furthermore, the above description illustrates preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the inventive concept disclosed herein, within the scope of equivalents to the disclosed disclosure, and / or within the scope of the skill or knowledge of the art. The above-described embodiments illustrate the best mode for embodying the technical ideas of the present invention, and various modifications are possible as required for specific application fields and uses of the present invention. Therefore, the above detailed description of the invention is not intended to limit the present invention to the disclosed embodiments. Furthermore, the appended claims should be construed to include other embodiments. [Explanation of symbols]

[0097] 10 Loading Port 20 forward end module 30 Processing Module 40 Load Lock Chamber 60 process chambers 210 First rotating support 230 First fixed support 220 Second rotating support 240 Second fixed support

Claims

1. In an apparatus for processing a substrate, a front end module having a first return robot for returning substrates; a transfer chamber having a second return robot for returning the substrate; a load lock chamber disposed on a return path along which substrates are returned between the return frame and the transfer chamber; The load lock chamber includes: a housing having an upper chamber having an upper space and a lower chamber located below the upper chamber and having a lower space; a first rotary support that supports and rotates the substrate positioned in the upper space; a second rotary support that supports and rotates the substrate positioned in the lower space, The substrate processing apparatus includes a first rotary support and a second rotary support that are commonly used for substrate alignment inspection and substrate vision inspection.

2. a first fixed support member for supporting a substrate in the upper space; a second fixed support member that supports the substrate in the lower space, the first rotary support is rotated by a first rotary drive unit and raised and lowered by a first lift drive unit; the second rotary support is rotated by a second rotary drive unit, The substrate processing apparatus according to claim 1 , wherein the second fixed support is moved up and down by a second lifting drive unit.

3. The first fixed support is First support shafts provided at the edges of the upper space; and a first edge slot connected to each of the first support shafts and configured to support a bottom edge of the substrate; 3. The substrate processing apparatus of claim 2, further comprising a third rotation driving unit that rotates the first support shafts so that the first edge slots are rotated to a position where they can support a substrate and are not interfered with during rotation and lifting of the first rotary support.

4. The second fixed support is Second support shafts provided at the edges of the lower space; and 3. The substrate processing apparatus of claim 2, further comprising second edge slots connected to the second support shafts, respectively, for supporting the bottom edge of the substrate.

5. The first rotary support includes: a first rotation shaft connected to the first rotation driving unit provided on an upper portion of the housing; a horizontal finger provided in the upper space, connected to the first rotation shaft, and having a length greater than a radius of the substrate; 3. The substrate processing apparatus of claim 2, further comprising: support fingers provided at distal ends of the horizontal fingers for supporting a bottom edge of the substrate.

6. The first lifting drive unit is A first actuator; a first lift bar that is lifted and lowered by the first actuator and that is connected to the first rotary support; The substrate processing apparatus according to claim 2 , further comprising: a first guide that guides the vertical movement of the first lifting bar.

7. The second rotary support includes: a second rotation shaft connected to the second rotation driving unit provided at a lower portion of the housing; 3. The substrate processing apparatus of claim 2, further comprising: a support plate provided in the lower space, connected to the second rotation shaft, the support plate being smaller than the radius of the substrate and supporting a central portion of the bottom surface of the substrate.

8. a third fixed support provided on a bottom surface of the upper space for supporting a substrate; 3. The substrate processing apparatus according to claim 2, wherein the substrate is picked up and placed on the third fixed support by moving the first rotary support up and down.

9. 3. The substrate processing apparatus of claim 2, wherein the rotation center of the first rotary support and the rotation center of the second rotary support are provided to be different, and the alignment inspection and vision inspection positions on the first rotary support and the alignment inspection and vision inspection positions on the second rotary support are provided at positions where the substrates placed on the first rotary support and the substrates placed on the second rotary support do not overlap each other when viewed from above.

10. a first alignment unit for aligning a substrate located in the upper space; a second alignment unit for aligning the substrate located in the lower space; a first vision unit for inspecting the edge surface condition of the substrate located in the upper space; The substrate processing apparatus of claim 9 , further comprising: a second vision unit for inspecting the surface condition of the edge of the substrate positioned in the lower space.

11. The substrate processing apparatus of claim 10 , wherein the first alignment unit, the second alignment unit, the first vision unit, and the second vision unit are provided on an upper portion of the housing.

12. 10. The substrate processing apparatus of claim 9, wherein a viewing window is provided in a partition wall between the upper chamber and the lower chamber for alignment inspection and vision inspection of the substrate positioned in the lower space.

13. 1. A method for inspecting a substrate in a load lock chamber located between a front end module and a transfer chamber, comprising: a first loading stage in which an unprocessed substrate is loaded from the front end module and a processed substrate is unloaded to the front end module; a second loading step in which the processed substrate is loaded from the transfer chamber and the unprocessed substrate is loaded into the transfer chamber; an alignment inspection step in which an alignment inspection is performed on the unprocessed substrate before the second loading step; a vision inspection step in which a vision inspection is performed on the processed substrate before the first loading step, The alignment inspection step and the vision inspection step are performed in a state where the unprocessed substrate and the processed substrate are placed on the same rotary support.

14. 14. The substrate inspection method in a load lock chamber of claim 13, wherein the processed substrate after completing the vision inspection on the rotary support is placed on a fixed support, the unprocessed substrate is placed on the rotary support in the first loading step, and the unprocessed substrate placed on the fixed support is then placed on the rotary support in the alignment inspection step, and then an alignment inspection is performed.

15. 14. The method for inspecting a substrate in a load lock chamber according to claim 13, wherein in the second loading step, the processed substrate is placed on a fixed support, and in the vision inspection step, the processed substrate placed on the fixed support is placed on the rotating support and then vision inspection is performed.

16. The alignment inspection step includes: After completing the alignment of the unprocessed substrate, an origin operation is performed to rotate the rotary support to an origin position; 14. The method of claim 13, wherein the origin movement of the rotary support is performed after the unprocessed substrate is placed on a fixed support installed at the bottom of the inner space of the load lock chamber.

17. During the alignment inspection step, the internal pressure of the load lock chamber is converted from atmospheric pressure to a preset vacuum pressure.

14. The method of claim 13, wherein the internal pressure of the load lock chamber is converted from the preset vacuum pressure to the atmospheric pressure while the vision inspection step is being performed.

18. In an apparatus for processing a substrate, a housing having an upper chamber having an upper space and a lower chamber located below the upper chamber and having a lower space; a first rotary support that supports and rotates the substrate positioned in the upper space; a second rotary support that supports and rotates the substrate positioned in the lower space; a first fixed support member for supporting a substrate in the upper space; a second fixed support member for supporting a substrate in the lower space; a first alignment unit for aligning a substrate located in the upper space; a second alignment unit for aligning the substrate located in the lower space; a first vision unit for vision inspection of the substrate located in the upper space; a second vision unit for vision inspection of the substrate located in the lower space, the first alignment unit, the second alignment unit, the first vision unit, and the second vision unit are provided on an upper portion of the housing; The substrate processing apparatus includes a first rotary support and a second rotary support that are commonly used for substrate alignment inspection and substrate vision inspection.

19. the first rotary support is rotated by a first rotary drive unit and raised and lowered by a first lift drive unit; the second rotary support is rotated by a second rotary drive unit, the second fixed support is raised and lowered by a second lifting drive unit; The first fixed support is a first support shaft provided on an edge of the upper space; a first edge slot connected to each of the first support shafts and configured to support a bottom edge of the substrate; a third rotation driving unit that rotates the first support shafts so that the first edge slots are rotated to a position where they can support a substrate and are not interfered with during the rotation and lifting of the first rotary support; the second fixed support provided on the bottom surface of the upper space for supporting a substrate; 20. The substrate processing apparatus of claim 18, wherein the substrate is picked up and placed on the second fixed support by moving the first rotary support up and down.

20. The first rotary support and the second rotary support have different rotation centers, the alignment inspection and vision inspection positions on the first rotary support and the alignment inspection and vision inspection positions on the second rotary support are provided at positions where the substrates placed on the first rotary support and the substrates placed on the second rotary support do not overlap each other when viewed from above, 19. The substrate processing apparatus of claim 18, wherein a partition wall between the upper chamber and the lower chamber is provided with a viewing window for the second alignment unit and the second vision unit.

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