Cable assembly for housing self-calibration data

Abstract

An exemplary cable assembly includes a coaxial cable. A layer encloses at least a portion of the coaxial cable. A memory is located on or in contact with the layer, and the memory is configured to store calibration data for the coaxial cable.

Description

Technical Field

[0001] This specification describes an exemplary implementation of a cable assembly that accommodates self - calibration data.

Background Art

[0002] A device interface board (DIB) can have a plurality of sites for holding a device under test (DUT) that is to be tested by a test instrument respectively. Coaxial cables can carry radio frequency (RF) signals to the DIB for transmission to many DUTs and their many pins. The cable's material, manufacturing, bends, and environmental factors can affect how each cable transmits RF signals. The effects can be different for different cables.

Summary of the Invention

Means for Solving the Problems

[0003] An exemplary cable assembly includes a coaxial cable. A layer wraps at least a portion of the coaxial cable. A memory is on or in contact with the layer, and the memory is configured to store calibration data for the coaxial cable. The cable assembly can include one or more of the following features either alone or in combination.

[0004] The layer may be configured to protect the coaxial cable from modification or damage. The layer may include plastic. The layer may be configured to prevent the coaxial cable from bending. The memory may be positioned around the coaxial cable using 3D printing. One or more contacts may be connected to the memory. The memory may be readable via one or more contacts. One or more wires may supply power and signals for data transmission. The layer may span one or more wires. The memory may be configured to allow reading via a wireless connection. The memory may include a read-only memory device or a read-write memory device. The memory may include electrically erasable programmable read-only memory (EEPROM). The cable may be configured to transmit radio frequency (RF) signals. Calibration data may include S-parameters specific to the cable and based on one or more bends in the cable.

[0005] An exemplary test system includes one or more test instruments for performing a test on a device under test (DUT) by transmitting a signal to the DUT using a cable assembly such as those described above. One or more processing devices may read calibration data from memory. The calibration data may include coaxial cable and associated S-parameters. At least one of the signal's phase or amplitude may be based on the calibration data.

[0006] An exemplary system for testing a DUT includes a cable assembly connected to a device interface board (DIB) configured to carry signals between a test instrument and the DUT. At least one of the cable assemblies includes a coaxial cable, a layer enclosing at least a portion of the coaxial cable, and memory on or in contact with the layer. The memory may be configured to store calibration data for the coaxial cable. The system may include one or more of the following features individually or in combination:

[0007] The layer may be configured to protect the coaxial cable from modification or damage. The layer may be made of or contain plastic. The layer may be configured to prevent the coaxial cable from bending beyond a predetermined shape or range. The memory may be positioned around the coaxial cable using 3D printing. At least one of the cable assemblies may include one or more contacts to the memory. Calibration data may be readable from the memory via one or more contacts. The memory may be configured to allow reading via a wireless connection. The memory may include a read-only memory device or a read-write memory device. The memory may include an electrically erasable programmable read-only memory (EEPROM). The cable may be configured to transmit radio frequency (RF) signals. Calibration data may be based on losses for the corresponding RF frequencies. One or more processing devices may be configured to read the calibration data from the memory and apply the calibration data to one or more radio frequency (RF) signals transmitted over the coaxial cable. The cable may be a radio frequency (RF) cable, and the calibration data may include S-parameters for the cable.

[0008] Any two or more of the features described herein, including this summary section, may be combined to form embodiments not specifically described herein.

[0009] At least some of the devices, systems, and processes described herein may be configured or controlled by executing instructions stored in one or more non-temporary machine-readable storage media in one or more processing devices. Examples of non-temporary machine-readable storage media include read-only memory, optical disk drives, memory disk drives, and random-access memory. At least some of the devices, systems, and processes described herein may be configured or controlled using a computer system comprising one or more processing devices and memory storing instructions that can be executed by one or more processing devices to perform various control operations. The devices, systems, and processes described herein may be configured, for example, through design, configuration, organization, deployment configuration, placement, programming, operation, startup, shutdown, and / or control.

[0010] Details of one or more implementations are shown in the accompanying drawings and the following description. Other features and advantages will become apparent from the description, drawings, and claims. [Brief explanation of the drawing]

[0011] [Figure 1A] This is a perspective view of an exemplary cable assembly for carrying signals between a test instrument and a device under test (DUT). [Figure 1B] This is a perspective view of an exemplary cable assembly for carrying signals between a test instrument and a device under test (DUT). [Figure 1C] This is a perspective view of an exemplary cable assembly for carrying signals between a test instrument and a device under test (DUT). [Figure 2] This is a diagram showing the components of an exemplary test system for testing the DUT. [Figure 3] This flowchart shows an exemplary process for implementing a cable assembly. [Figure 4] This flowchart shows an exemplary process for installing a cable assembly. [Figure 5]This is a diagram illustrating an exemplary interface for retrieving data from a memory device and storing the data in the tester for use by the tester. [Figure 6] This is a diagram illustrating an exemplary interface for inputting data into a memory device during cable manufacturing. [Figure 7] This is a block diagram showing the components of an exemplary automated testing apparatus (ATE). [Modes for carrying out the invention]

[0012] Similar reference numerals in different figures indicate the same elements.

[0013] An exemplary cable assembly is configured to store calibration data used by the test system to address or eliminate errors introduced by the assembly in the signals supplied to and / or from the DUT, which are measured by the test system. In some implementations, errors can be eliminated or addressed using a technique commonly described as S-parameter de-embedding.

[0014] An exemplary cable assembly includes a coaxial cable having loss and VSWR (voltage standing wave ratio) non-ideality described by a frequency sweep of two-port S-parameters for the coaxial cable. A protective layer encloses at least a portion of the coaxial cable. The memory is positioned in contact with the protective layer. The memory is configured to store calibration data.

[0015] An exemplary test system includes one or more cable assemblies of the type described above, connected to a device interface board (DIB) and for routing signals between the test instrument and the device under test (DUT). The interface is provided to allow the test system to retrieve calibration data from the memory of one or more cable assemblies and then use that data to perform de-embedding on signals transmitted through one or more cable assemblies to improve signal accuracy. The exemplary interface may also be used to update the calibration data, both initially and whenever it is determined that the calibration data contains errors.

[0016] Figure 1A is a block diagram of an exemplary cable assembly 100. In this example, the cable assembly is configured to carry signals between a test instrument and a DUT, but the cable assembly may be used to carry other signals in a test system or to carry signals in other types of systems unrelated to testing. The cable assembly 100 includes a coaxial cable 102, a protective layer 104, and a memory device 106 located above, inside, or below the protective layer 104. The coaxial cable 102, protective layer 104, and memory device 106 may be connected to a DIB, on which signals are transmitted to and from the DUT. For example, the memory device 106 may be mounted on or formed on or inside the protective layer. For example, the memory device may be three-dimensionally (3D) printed on or inside the protective layer.

[0017] The coaxial cable 102 is configured to transmit radio frequency (RF) signals received from the test instrument to the DIB connected to the DUT, and to transmit the response signals from the DUT back to the test instrument. The coaxial cable 102 includes a defined set of S-parameters associated with its reflection coefficient, isolation, and insertion loss. In some implementations, the coaxial cable 102 may be configured to transmit signals having frequencies up to 60 GHz (gigahertz). In some implementations, the coaxial cable 102 may be configured to transmit signals having frequencies above 60 GHz, such as 80 GHz, 100 GHz, 200 GHz, etc.

[0018] The sticker 122 may be positioned around the peripheral area of ​​the coaxial cable 102. The sticker 122 may allow components such as memory 106, wires 110 and 111 and / or other electronic components 105 to be placed on the coaxial cable 102 without modifying or altering the characteristics of the coaxial cable 102 (e.g., S-parameters) or requiring any additional add-ons to the coaxial cable 102. The sticker 122 may include plastic or a deformable material. In some implementations, the sticker 122 may include an adhesive pad that permanently adheres to the coaxial cable 102 and can withstand wear and tear of the coaxial cable 102. The sticker 122 may include a material that allows electronic components to operate while they are positioned on the sticker 122.

[0019] The protective layer 104 can cover all or part of the coaxial cable and is configured to protect the coaxial cable 102 from modification or damage. By way of example, the protective layer 104 can extend the length of the coaxial cable, or the protective layer 104 can cover less than the entire length of the coaxial cable. The protective layer 104 can include plastic or deformable material. In some implementations, the protective layer 104 can include a rigid plastic material to protect the cable assembly 102 when it is used in an environment where wear and tear of the coaxial cable 102 is anticipated. In some implementations, the protective layer 104 can extend onto the sticker 122 to protect components positioned on the sticker 122. The protective layer 104 and / or the sticker 102 can be implemented on a flexible printed circuit board made of a flexible substrate such as Kapton or other similar materials.

[0020] In this regard, the coaxial cable 102 can include bends or curves intended by the manufacturer. The protective layer 104 can be used to protect these bends or curves and to prevent unintentional bends caused by handling or use from ultimately damaging the cable assembly 100. This can include, for example, deformation as a result of environmental conditions when the protective layer 104 is positioned over the bend or when the coaxial cable 104 expands due to a rise in temperature.

[0021] The memory device 106 is configured to store calibration data for the coaxial cable 102. The calibration data can include, for example, cable calibration identification, manufacturing date, and S-parameter data. Other types of information such as those listed can be part of the calibration data. The memory device 106 can be a read-only memory device or a read-write memory device. In some examples, the memory device 106 can be a flash memory. In other examples, the memory device 106 can be or can include an electrically erasable programmable read-only memory (EEPROM). The memory device 106 can include a combination of different memory devices.

[0022] The memory device 106 can be configured to enable access to the stored calibration data. In some examples, one or more wired connections 110 can be connected to the memory 106. The memory device 106 can be readable via one or more wired connections 110. The memory device 106 can also enable reading via a wireless connection. For example, the memory device 106 can include a transceiver (not shown) that enables communication via a wireless network or enables direct wireless communication.

[0023] The cable assembly 100 can also include one or more wires 111 for supplying power to the memory device and for sending signals to and from the memory in addition to or in place of data transmission. The wires 110 and 111 can be below, above, or within the protection device 104. Further, the wires 110 and 111 can be of the same type. The wires 110 and 111 can be configured to operate on an I2C bus. In such an arrangement, the wires 110 and 111 can be configured to supply 5V or 3.3V power, be coupled to ground, transmit serial data, and transmit serial clock information, respectively. The wires 110 and 111 can operate on other serial communication buses. The number of wires 110 and 111 can be as shown, depending to some extent on the signals used by the serial communication bus.

[0024] The wires 110 and 111 can be positioned in the peripheral region of the sticker 122. The wires 110 and 111 can include a hollow cylindrical shape or other suitable shape positioned on the sticker 122. The memory 106 is positioned on the sticker 122.

[0025] Figure 1B is a block diagram of another exemplary cable assembly 126. Cable assembly 126 may have the same or similar functionality as cable assembly 100. In this example, the protective layer 130 is located at the bend 132 of the coaxial cable 102. The protective layer 130 protects the bend 132 from damage sustained during use. The protective layer 130 may contain a material similar to that of the protective layer 114 in Figure 1A. The protective layer 130 may be sized such that the bend 130 fits tightly into it. Wires 110 and 111 are located within the protective layer 130. A memory device 106 is located within the protective layer 130. The combination of memory devices may store the data described herein.

[0026] Figure 1C is a block diagram of another exemplary cable assembly 136. Cable assembly 136 may have the same or similar functionality as cable assembly 126. In this example, the protective layer 130 is made transparent to show how wires 110 and 111 may be mounted within the protective layer 130. The memory device 106 is also positioned within the protective layer 130 for additional protection. In another mounting configuration, the protective layer 130 can partially enclose a flexible printed circuit board positioned around the coaxial cable 102 at a bend 132 using 3D printing. The memory device 106 and wires 110 and 111 are added to the flexible printed circuit board. The remainder of the protective layer 130 can then be 3D printed to surround the memory device 106 and wires 110 and 111.

[0027] Figure 2 is a block diagram showing components 200 of an exemplary test system for testing DUT208. Component 200 includes a test instrument 202, a DIB 204, and a cable assembly 206. The test instrument 202, DIB 204, and cable assembly 206 may be part of an automated test apparatus (ATE) 700 (see Figure 7) used to test the test DUT208. The cable assembly 206 may be connected to, located in, or part of the DIB assembly 204.

[0028] The test instrument 202 may output an RF signal to the DUT 208 via a coaxial cable in cable assembly 206 or 204 or both. The RF signal may include a test signal that thereby stimulates the DUT 208 or measures a signal originating from the DUT 208. Optionally, the test signal may be initiated by a control system connected to the test instrument 202. The test signal may include instructions, commands, data, parameters, variables, test patterns and / or any other information designed to elicit a response from the DUT 208. In some implementations, multiple test instruments, e.g., test instrument 202, may be used to output test signals to different DUTs, e.g., DUT 208, distributed at locations such as a DIB or wafer. The test instrument 202 may use multiple channels created by one or more cable assemblies 206 to enable communication between the test instrument and the DUT.

[0029] To establish physical and electrical connections that enable DIB204 to send RF signals to DUT208, DIB204 may be connected to cable assembly 206 to receive RF signals from there. DUT208 may be connected to DIB204 via mechanical and electrical interfaces. Cable assembly 206 may include the features of cable assembly 100, 126, and / or 136 as described above. In some implementations, cable assembly 206 may be or include a bundle of cable assemblies incorporating elements of cable assembly 100, 126, and / or 136, respectively. In some implementations, the test system may obtain memory device calibration data for each cable assembly and use the calibration data to perform corrections on the test system by de-embedding the cables from measured or supplied waveforms. For example, the test system may perform calibration to explain inconsistencies or contradictions in a cable assembly relative to other such cable assemblies connected to the test system.

[0030] Figure 3 shows operations included in an exemplary process 300 for manufacturing a cable assembly such as assembly 100 (126 or 136). The exemplary process 300 includes operations that a cable manufacturer of a cable assembly may perform.

[0031] Process 300 includes a cable manufacturer (302) manufacturing a coaxial cable 102. The cable manufacturer may use commonly known techniques to form the coaxial cable 102. This may include forming an internal conductor surrounded by a coaxial conductive shield, the two separated by a dielectric (insulating material). The internal conductor may be constructed of pure copper, copper-coated steel, or aluminum. The cable manufacturer may use materials other than those described herein to construct the internal conductor. The internal conductor is responsible for transmitting signals in the coaxial cable. The dielectric may include foamed polyethylene (FPE), Teflon, polyethylene (PE), polypropylene (PP), or polyvinyl chloride (PVC). The dielectric may include materials other than those described herein.

[0032] After the coaxial cable 102 is formed, the cable manufacturer conforms the coaxial cable 102 to its final configuration (304). In some cases, the coaxial cable 102 may be bent at one or more locations along its length. Bending the coaxial cable 102 can alter its original S-parameters, resulting in a coaxial cable 102 with different S-parameters compared to a straight version of the coaxial cable. Depending on the use of the coaxial cable, bends are used to provide easier connections between endpoints. In some implementations, the coaxial cable is not bent below a minimum recommended bending radius. Otherwise, the bend can cause ripple and stretching of the cable sheath and changes in dielectric constant. The bending radius is based on the material used to make the coaxial cable 102. Depending on the use of the coaxial cable 102, the cable manufacturer may select materials based on the bending radius requirements of DIB 204 and / or test instrument 202 to minimize or reduce the chance of damage to the coaxial cable 102 and the test system.

[0033] The cable manufacturer adds a protective layer, for example, protective layer 104 or 130, to all or part of the coaxial cable 102 (306). The protective layer 104 or 130 may be formed on the coaxial cable 102 using lamination technology or 3D printing. In some implementations, the protective layer 104 or 130 may be positioned over one or more bends of the coaxial cable 102 to protect one or more bends from moving after assembly. In some implementations, the protective layer 104 or 130 may extend over the entire length of the coaxial cable - from one end of the cable (coaxial connection) to the other end (coaxial connection). The protective layer may also surround or in contact with a memory device.

[0034] The cable manufacturer mounts the memory device 106 on, within, or below the protective layer 104 or 130 in order to form the cable assembly 100 such that the memory device 106 is in contact with the protective layer (308). This may be done before, after, or during the application of the protective layer to the coaxial cable. The memory device 106 may be positioned on, within, or across the protective layer 104 or 130 as described above. The memory device 106 may include a material that allows a portion of the memory device 106 to be set on or in contact with the protective layer 104 or 130. An exemplary material that may be used is an adhesive that conforms to the protective layer 104 or 130 and is placed on the memory device 106 so as to keep it attached to the protective layer 104 or 130. In some cases, the adhesive may be placed on the protective layer 104 or 130. The cable manufacturer may use materials other than those mentioned to position the memory device 106 on or in contact with the protective layer 104 or 130. The cable manufacturer may use 3D printing to mount the memory 106 on, within, or below the protective layer 104 or 130.

[0035] In implementations with wired connections to the memory device, the wired connections may be located on, within, or below the protective layer. For example, protective layer 104 or 130 may be positioned to protect wires used by a coaxial cable 102 to power the memory device 106 and to read data from the memory device. The wires may be incorporated into the cable assembly together with the memory.

[0036] The S-parameters of the cable assembly 100 may change due to the addition of bends. To reflect the correct S-parameters for the cable assembly 100, whether molded or straightened, the cable manufacturer measures the S-parameters of the cable assembly 100 (310). Operation 312 may be performed by writing directly to the memory device 106 or by communicating with an exemplary interface 600 that performs 310 and 312, which is further described below in Figure 6. In some implementations, operation 310 and the exemplary interface 600 may be implemented as machine-executable code and executed on the cable manufacturer's computer system.

[0037] In some implementations, cable manufacturers may use vector network analysis (VNA). A VNA can measure S-parameters over frequency by sweeping the input frequency. A VNA may use a directional coupler for power measurement to separate transmitted and reflected power. A VNA can be calibrated before measurement using known techniques appropriate for the frequency band.

[0038] In some implementations, time-domain reflection (TDR) may be used to measure S-parameters. The measured S-parameters may be temporarily stored in storage. This temporary storage may be in the local storage of either the VNA or the TDR. In some cases, the measured S-parameters may be uploaded to the computer system for temporary storage before being loaded into memory device 106.

[0039] Subsequently, the cable manufacturer may store the measured S-parameters in the memory device 106 as part of the calibration data for the cable assembly 100 (312). The test system 200 may use the calibration data to calibrate the signal in the cable assembly 100. The calibration data may include other metadata or information, such as cable calibration identification and manufacturing information. Examples of calibration data that may be stored in the memory device 106 include, but are not limited to, the presence of encryption, manufacturer, manufacturing date, wire type, connector type, nominal length (in meters), consumer, cable serial number, checksum, S-parameters, such as the number of points (linear sweep), start frequency, stop frequency, RI or MA format, and S-parameter chunks with parameters for s11, s12, s21, s22 and the S-parameter data conformance equation. Different types of information not described may also be part of the calibration data. The data may be stored in the memory 106 via one or more wired or wireless connections as described herein.

[0040] Figure 4 shows the operations included in an exemplary process 400 for installing the cable assembly 100 on the tester. The exemplary process 400 includes operations that may be performed in the test system 200. In some implementations, at least a portion of the exemplary process 400 may be implemented using machine-executable code that runs on the control system of the test system 200.

[0041] Process 400 includes installing the cable assembly in the test system 200 (402). The cable assembly may be installed by connecting it to the DIB 204 and the test instrument. For example, the installation of cable assembly 100 in the test system may include connecting the test instrument 202 to cable assembly 100 at one end and to the DIB at the other end. In some implementations, several cable assemblies, such as cable assemblies 100, 100, 126, 136 and / or 206, may be installed in the DIB 214 of the test system 200.

[0042] Once the cable assembly is installed, process 404 reads data from the memory device (404). S-parameters and / or other calibration data may be read from the memory device 106. For example, S-parameters and / or other calibration data may be read wirelessly or via a wired connection as described herein.

[0043] Process 400 includes determining where to store the read data (406). For example, in some implementations, S-parameters or other read data may be stored in a local file of the test system 200 or in the non-volatile memory of DIB 204. The user may input a location for storing the read data via a user interface. The user interface may send the location to process 400 for processing. An example of a user interface may be the exemplary user interface 500, which is further described below.

[0044] If the location for storing the read data is the test system 200, process 400 stores the data in a local file on the test system 200 (408) or links to a file on the test system 200. If the location for storing the read data is the non-volatile memory of DIB204, process 400 stores the read data in the non-volatile memory of DIB204 (410). The non-volatile memory may be an EEPROM.

[0045] Figure 5 shows an exemplary user interface 500 for retrieving de-embedding S-parameter data from the cable assembly's memory, e.g., memory device 106. The exemplary interface 500 includes an interface element 502 which receives user input (e.g., 502A) or displays information (e.g., 502D) regarding the status of reading data from the cable assembly's memory. In some implementations, the exemplary interface 500 may be a graphical user interface (GUI) running on the control system of the test system 200. In some implementations, the exemplary interface 500 may be a GUI running on a computer system separate from the test system 200 or its control system. In some implementations, the exemplary interface 500 may be implemented by running a test program used by the test system 200 to perform the test.

[0046] Input field 502A may be used to input the channel map of DIB202 and its associated name and / or location. The channel map may identify the RF pins and sites operated by DIB202 to manage one or more DUTs, such as DUT208. The channel map may also be stored in the memory of DIB202 or the test system 200. If the channel map is stored and accessible, the browse button 502B may be used to access the channel map from memory. In this case, the exemplary interface 500 may provide a list of directories to browse (502B) to find the channel map. After the channel map is found, the location of the channel map is added to data field 502A and used to provide instructions to the user during installation. After the data bus is connected to memory device 106, the read button 502C may be used to check the status of memory device 106 and determine if it is ready for upload. When the read button 502C is activated, the display field 502D may display the status of memory device 106, the data bus, and the calibration data.

[0047] Input field 502E may be used to specify the names of signals at each site that are included in the DIB defined in the channel map and used by the test program. The naming conventions for signals at each site may differ for each different test system. The exemplary interface 500 may use buttons 502F and 502G to specify where calibration data read from cable assembly 100 in the test system 200 is stored. When button 502F or 502G is activated, the data retrieved from the smart cable is stored in the test system's file system, and its name is linked to its particular signal path. In some implementations, when 502G is selected, the calibration data from cable assembly 100 may be stored in non-volatile memory located at 204 in the test system 200. In some implementations, other non-volatile memory used by DIB 204 may store calibration data.

[0048] Before storing the calibration data, the exemplary interface 500 may initiate validation of the calibration data to determine whether the calibration data contains errors. In this case, button 502H may be activated to initiate the validation process. In some embodiments, the S-parameters are validated by the test system as described above, but the exemplary interface 500 may initiate validation of other calibration data. As previously described, the validation process may measure each S-parameter port as described in operation 406 and verify whether the measured / estimated length matches that of the cable assembly 100. This may involve comparing the calibration data read from the memory device 106 with the measured S-parameters of the validation process. If errors are detected in the calibration data, the validation process may reject the cable or assist the user in measuring it as in steps 310, 312. Otherwise, the calibration data may be stored. Once the calibration data for a path is stored, button 502J may be used to move to the next signal path listed in the selected channel map. Once all signal paths are complete, button 502K may be activated to indicate the completion of the calibration data retrieval and validation process. Button 5021 may be used to return to the preceding signal path in order to correct the entry.

[0049] When a bundle of cable assemblies is used, each cable assembly, for example, cable assemblies 100, 126, 136, or 206, may have its own calibration data. In this case, the exemplary interface 500 may assign a search page to each cable assembly installed in the test system 200. The search pages may contain the same information as shown in the exemplary interface 500, but each cable assembly will have different search information for its respective interface element 502. Users can move back and forth through the list of cable assemblies by activating buttons 5021 or 502J to view or add information for a particular cable assembly.

[0050] Figure 6 is a schematic diagram of an exemplary user interface 600 for inputting data, including calibration data, into a memory device of the cable assembly, such as memory device 106, during operations 310 and 312. The exemplary interface 600 includes an interface element 602 that receives input or displays information regarding the status of the input data to memory device 106. In some implementations, the exemplary interface 600 may be or include a general user interface (GUI) running on the cable manufacturer's computer system.

[0051] Input fields 602A and 602B may be used to input metadata such as manufacturer, name assigned to the cable, and date. The input metadata may, as needed, include optional encryption, manufacturer, manufacturing date, wire type, connector type, nominal length (m), consumer, cable serial number, checksum, number of points (linear sweep), start frequency, stop frequency, RI or MA format, and S-parameter chunks of S-parameters such as s11, s12, s21 and / or 22. In some implementations, input fields 602A and 602B may contain more information than described.

[0052] Input field 602C may be used to enter the name and / or location of the calibration data and associated files for the cable assembly. Buttons 602E and 602D allow the user to generate (measure) a new file or use (browse) an existing file. The cable data for the cable assembly may include additional information such as wire type, connection type, or nominal length (m). Exemplary interface 600 may store the cable data in the memory of a computer system located at the cable manufacturer. If the cable data for the cable assembly is stored and available, the browse button 602B may be used to access the cable data for the cable assembly. In this case, exemplary interface 600 may provide a list of directories for browsing to find the cable data. Once the cable data is found, the location of the cable data is automatically added to data field 602C.

[0053] When button 602E is activated, the exemplary interface 600 can measure or otherwise calculate S-parameters for the cable assembly 100. The exemplary interface 600 may initiate a VNA or TDR to measure or calculate the S-parameters. After the completion of that operation, the VNA or TDR may transmit the S-parameters to the exemplary interface 600 for uploading to the memory device 106 via wire or wirelessly. The specific results of the operations performed by the VNA and TDR may be displayed in the display field 602F.

[0054] Checkbox 602G may enable encryption of S-parameters, including other calibration data, when checked. The encryption used may be asymmetric or symmetric. Asymmetric encryption can use a key pair, i.e., different keys may be used for the encryption and decryption processes. One key is typically known as the private key, and the other as the public key. The cable manufacturer may keep the private key secret, while the public key is shared among certified test systems. The same key may be used for encryption and decryption in symmetric encryption. When checkbox 602G is not checked, encryption is not used.

[0055] Button 602H may be used to generate a Globally Aware Identifier (GUID) for the cable assembly 100. The GUID may also function as the serial number of the cable assembly 100. The exemplary interface 600 may use any of many approaches to generate the GUID. When button 602H is activated, the GUID may be displayed in the display field 602I. Furthermore, the cable assembly 100 may be assigned the GUID as the serial number displayed in the display 602I.

[0056] Button 602J may be used to verify the connection between the memory device 106 of the cable assembly 100 and the data bus before attempting to program the device. To determine whether the memory device 106 is ready to receive calibration data or is capable of receiving calibration data, the cable manufacturer may send a signal to the memory device 106 via the data bus requesting acknowledgment of its connection to the data bus, or may attempt to read / write one or more memory locations. When button 602J is activated, the connection between the memory device 106 and the data bus is verified, and the result is displayed in field 602K.

[0057] If there is a positive indication of connection between the memory device 106 and the data bus, the memory device 106 may be ready to receive S-parameters and other calibration data for storage. Button 602L may be used, for example, to upload S-parameters and other calibration data to the memory device 106. When button 602L is activated, the exemplary interface 600 may display the status of the operation to upload S-parameters and other calibration data to the memory device 106 in the display field 602M. This includes indicating the status of the checksum and additional information. For example, an error may be indicated if the data does not match the device memory or the readback does not match.

[0058] After a positive indication of the storage of S-parameters and other calibration data in memory device 106, button 602P may be activated to indicate the completion of calibration data storage.

[0059] When many cable assemblies are manufactured, each cable assembly, for example, cable assembly 100, may have its own calibration data. The manufacturer may use 602N, 602O to perform the respective testing and data storage steps.

[0060] If necessary, a single cable assembly comprising multiple cables may have de-embedding data stored in a single tag having a protective layer and memory, for example, protective layer 104 and memory 106. In this case, the exemplary interface 600 may assign a memory page for each cable assembly installed in the test system 200. The memory pages may contain the same information as shown in the exemplary interface 600, but each cable assembly will have different memory information for its respective interface element 602. Similarly, in a process for manufacturing many cables, it may be possible to move back and forth through the cable assemblies by activating buttons 602N or 602O to view or add information about a particular cable assembly.

[0061] Figure 7 is a block diagram showing the components of an exemplary ATE700, including a test device (referred to herein as “tester”) 701 and a control system 702. The components 100, 126, or 136 described above may be part of the ATE700.

[0062] The tester 701 includes a test head 703 and a device interface board (DIB) 704 physically and electrically connected to the test head 703. DIB 704 may be an implementation of DIB 204 in Figure 2. In this example, DIB 704 includes a circuit board with mechanical and electrical interfaces to site 705. One or more DUTs, for example DUT 708, are connected to each of these sites for testing by ATE. DUT 708 may be an implementation of DUT 208 in Figure 2.

[0063] DIB704 may include, among other things, connectors, conductive wiring, conductive layers, and circuit configurations for routing signals between test instruments in the test head 703, as well as other circuit configurations in the DUT and ATE connected to the DIB site. Power, including voltage and current, may be acted upon the DUT connected to the DIB via one or more layers in DIB704.

[0064] The test head 703 includes a plurality of test instruments 711a to 711n, each of which may be configured to implement testing and / or other functions as appropriate. Although only four test instruments are shown, the ATE 10 may include any suitable number of test instruments, including one or more test instruments located outside the test head 715. A test instrument may be a hardware device that includes one or more processing devices and / or other circuit configurations. A test instrument may be configured—for example, programmed—to output commands for testing the DUT held in the DIB 704. Commands for testing the DUT may be or include instructions, signals, data, parameters, variables, test patterns and / or any other information designed to elicit a response from the DUT. One or more of the test instruments—for example, all of them—may be configured to receive responses from the DUT to commands sent from the ATE to the DUT. A response is in the form of response data. A test instrument may be configured to analyze the response data to determine whether the DUT passed or failed the test. Each of the test instruments 711a to 711n may be an example of test instrument 202.

[0065] Furthermore, the test system may include cable assemblies 715, examples of which include cable assemblies 100, 126, 136, or 206 for transmitting signals between the DUT of DIB 704 and the test instruments 711a-711n. Each test instrument 711a-711n may use one or more cable assemblies such as cable assemblies 100, 126, 136, or 206 to send and receive signals with DIB 704. In this regard, a test channel is configured between the test head and the DIB of cable assembly 715, enabling communication between the DUT and the test instrument using one or more cable assemblies 206. Although only four test channels are shown in Figure 7, any number of test channels may be included, for example, one or more test channels per DUT.

[0066] The control system 702 is configured—for example, programmed—to communicate with test instruments 711a-711n to guide and / or control the testing of the DUT. In some implementations, this communication link 720 may be via a direct connection, such as a conceptual serial bus of the type described herein. In some implementations, this communication link may be via a network. In some implementations, this communication link may be considered part of one or more test channels. In some implementations, this communication link may not be considered part of one or more test channels. In some implementations, this link may include a cable assembly, such as cable assemblies 100, 126, 136, or 206.

[0067] The control system 702 may be configured to provide test programs and / or commands to test instruments 711a-711n in the test head, which the test instruments use to test the DUT. The control system 702 may be configured to receive response data from the test instruments and analyze the response data to determine whether the DUT passed or failed the test. Memory 723 also stores machine-executable instructions 734, such as computer code in binary executable form, to perform all or some of the functions performed by the control system 702. The machine-executable instructions 734 may include instructions for performing the operation of an exemplary interface 600. In some implementations, the machine-executable instructions 734 may include instructions for performing the operation of process 400.

[0068] All or part of the test systems and processes described herein, as well as various modifications thereof, may be configured or controlled at least partially by one or more computers, for example, a control system 702, using one or more computer programs tangibly implemented on one or more information carriers, for example, one or more non-temporary machine-readable storage media. The computer programs may be written in any form of programming language, including compiled or interpretable languages, and may be deployed in any form, for example, as standalone programs or modules, components, subroutines, or other units suitable for use in a computing environment. The computer programs may be deployed to run on one computer or on multiple computers located in one site or distributed across multiple sites and interconnected by a network.

[0069] Any actions relating to configuring or controlling the test systems and processes described herein may be performed by one or more programmable processors executing one or more computer programs to control or perform all or part of the operations described herein. All or part of the test systems and processes may be configured or controlled by special-purpose logic circuit configurations, such as FPGAs (Field Programmable Gate Arrays) and / or ASICs (Application-Specific Integrated Circuits) or embedded microprocessors localized for instrument hardware.

[0070] Processors suitable for executing computer programs include, for example, both general-purpose and special-purpose microprocessors, as well as any one or more processors of any type of digital computer. Generally, a processor may receive instructions and data from read-only storage, random-access storage, or both. The elements of a computer include one or more processors for executing instructions and one or more storage devices for storing instructions and data. Generally, a computer includes one or more machine-readable storage media, such as mass storage devices for storing data, such as magnetic, magneto-optical disks, or optical disks, or is operably coupled thereto to receive data from or transmit data to, or both. Non-temporary, machine-readable storage media suitable for implementing computer program instructions and data include, for example, semiconductor storage devices such as EPROM (Erasable Programmable Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), flash storage devices, magnetic disks such as internal hard disks or removable disks, magneto-optical disks, and all forms of non-volatile storage, including CD-ROM (Compact Disk Read-Only Memory) and DVD-ROM (Digital Multipurpose Disk Read-Only Memory).

[0071] The elements of the different implementations described above may be combined to form other implementations not specifically shown above. The elements may remain outside the system described above without adversely affecting their operation or the operation of the system in general. Furthermore, various distinct elements may be combined to form one or more individual elements to perform the functions described herein.

[0072] Other implementations not specifically described herein are also within the scope of the following claims.

Claims

1. A cable assembly, Coaxial cable and A layer enclosing at least a portion of the coaxial cable, A memory on or in contact with the aforementioned layer, configured to store calibration data for the coaxial cable. Cable assemblies, including the cable assembly.

2. The cable assembly according to claim 1, wherein the layer is configured to protect the coaxial cable from modification or damage.

3. The cable assembly according to claim 1, wherein the layer includes plastic.

4. The cable assembly according to claim 1, wherein the layer is configured to prevent the coaxial cable from bending.

5. The cable assembly according to claim 1, wherein the memory is positioned around the coaxial cable using 3D printing.

6. The cable assembly according to claim 1, further comprising one or more contacts connected to the memory, wherein the memory is readable via the one or more contacts.

7. The cable assembly according to claim 1, further comprising one or more wires for supplying power and signals for data transmission, wherein the layer spans the one or more wires.

8. The cable assembly according to claim 1, wherein the memory is configured to enable reading via a wireless connection.

9. The cable assembly according to claim 1, wherein the memory includes a read-only memory device or a read-write memory device.

10. The cable assembly according to claim 1, wherein the memory includes an electrically erasable, programmable, read-only memory (EEPROM).

11. The cable assembly according to claim 1, wherein the cable is configured to transmit radio frequency (RF) signals, and the calibration data is specific to the cable and includes S-parameters based on one or more bends in the cable.

12. A system for testing a device under test (DUT), Multiple cable assemblies connected to a device interface board (DIB) are configured to carry signals between the test instrument and the DUT. Including, at least one of the cable assemblies is Coaxial cable and A layer enclosing at least a portion of the coaxial cable, A memory on or in contact with the aforementioned layer, configured to store calibration data for the coaxial cable. A system that includes this.

13. The system according to claim 12, wherein the layer is configured to protect the coaxial cable from modification or damage.

14. The system according to claim 12, wherein the layer includes plastic.

15. The system according to claim 12, wherein the layer is configured to prevent the coaxial cable from bending beyond a predetermined shape or range.

16. The system according to claim 12, wherein the memory is positioned around the coaxial cable using 3D printing.

17. At least one of the cable assemblies includes one or more contacts to the memory, The system according to claim 12, wherein the calibration data is readable from the memory via the one or more contacts.

18. The system according to claim 12, wherein the memory is configured to allow reading via a wireless connection.

19. The system according to claim 12, wherein the memory includes a read-only memory device or a read-write memory device.

20. The system according to claim 12, wherein the memory includes an electrically erasable programmable read-only memory (EEPROM).

21. The system according to claim 12, wherein the cable is configured to transmit radio frequency (RF) signals, and the calibration data is based on the loss for the corresponding RF frequency.

22. The system according to claim 12, further comprising one or more processing devices configured to read the calibration data from the memory and to apply the calibration data to one or more radio frequency (RF) signals transmitted via the coaxial cable.

23. The system according to claim 12, wherein the cable is a radio frequency (RF) cable, and the calibration data includes S-parameters for the cable.

24. It is a testing system, One or more test instruments for performing a test of a device under test (DUT) by transmitting a signal to the DUT using the cable assembly described in claim 1, One or more processing devices and Includes, The one or more processing devices perform an operation that includes reading the calibration data from the memory. The calibration data includes S-parameters associated with the coaxial cable, A test system in which at least one of the phase or amplitude of the signal is determined based on the calibration data.

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