Support device for supporting MEMS sensors

Abstract

A support device (100) for supporting a MEMS (microelectromechanical) sensor (200) comprises a carrier platform (110) suitable for supporting the MEMS sensor (200), and a coupling structure (120) having individual macroscale springs (130) connected to the carrier platform (110) and suitable for connection to a housing structure (300), the housing structure (300) being suitable for housing the support device (100) and the MEMS sensor (200) supported thereon.

Description

Technical Field

[0001] The present invention relates to a support device for supporting a MEMS (Micro-Electro-Mechanical) sensor and a sensor provided with such a support device.

Background Art

[0002] MEMS sensors are currently used in many technical fields. MEMS sensors are particularly suitable as acceleration sensors and / or rotational speed sensors. MEMS sensors are usually covered with a housing to prevent direct impact on the MEMS sensor. However, the housing itself may vibrate or be subjected to shock, and further, for example, its shape may change due to temperature changes.

[0003] In this case, the quality of the measurement data output from the sensor largely depends on how much the MEMS sensor is separated from the vibration of the housing, the influence of the force on the housing, or the deformation of the housing. The MEMS sensor provides more reliable measurement results the less the position changes due to such movement of the housing and the smaller the action of mechanical stress from the surroundings to the sensor, such as thermal deformation.

[0004] For this purpose, a mechanism for separating the movement / deformation of the housing and the movement / deformation of the MEMS sensor is used. For example, a micro-mechanical structure that buffers or attenuates the movement of the housing with respect to the MEMS sensor is known (see, for example, US 2018 / 252739 A1). Similarly, a method of inserting an elastomer between the MEMS sensor and the housing to attenuate the movement of the housing with respect to the MEMS sensor is also known (see, for example, US 2008 / 264169 A1).

[0005] However, such mechanisms have drawbacks. When isolation is implemented using micromechanical structures, direct (and removable) connection to the system housing is usually impossible, and therefore, an additional complex bonding process is typically required to connect the isolation structure to the system housing. The material properties of the elastomer can change with temperature and material degradation. On the one hand, this can change the operating conditions of the MEMS sensor. On the other hand, the ability to isolate the MEMS sensor from external motion may also be lost.

[0006] Micromechanical structures and elastomers can present challenges, such as being difficult to remove or replace from a sensor in the event of a malfunction or failure, or hindering the replacement of other faulty components. In the case of micromechanical structures, this is because they are permanently integrated with the sensor. With elastomers, the problem arises because they are connected to other components via intermaterial bonds. Therefore, existing connections must first be disassembled and then reconnected, which is extremely time-consuming. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] US 2018 / 252739 A1 [Patent Document 2] US 2008 / 264169 A1 [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] Therefore, an object of the present invention is to provide a MEMS sensor support device that reliably and simply isolates a MEMS sensor from the motion and / or deformation of adjacent components. Furthermore, an object of the present invention is to provide a sensor comprising a MEMS sensor support device and a MEMS sensor.

[0009] These objectives are achieved by the subject matter of the independent claims. [Means for solving the problem]

[0010] A support device for supporting a MEMS (microelectromechanical) sensor comprises a carrier platform suitable for supporting the MEMS sensor and a coupling structure having individual macroscale springs connected to the carrier platform and suitable for connection to a housing structure, the housing structure being suitable for housing the support device and the MEMS sensor supported thereon.

[0011] Therefore, this support device is suitable for connecting a MEMS sensor fixed to a carrier platform to a housing structure or the housing of the entire sensor. For this purpose, the support device has macroscale springs (e.g., not micromechanical springs such as those disclosed in US 2018 / 252739 A1) and does not have elastomers such as those described in US 2008 / 264169 A1. These macroscale springs support the carrier platform against the housing structure and absorb the motion and deformation of the housing structure, so that the carrier platform (and the MEMS sensor mounted thereon) remains sufficiently stationary and undeformed for reliable operation.

[0012] Because the spring is designed on a macroscale, it can be manufactured relatively easily using general macroscale manufacturing processes (such as cutting and electrical discharge machining) if, for example, the material thickness of the bent beam is 0.3 mm or more. Furthermore, by using a mechanical spring instead of an elastomer, it is possible to prevent the coupling characteristics of the support device from fluctuating due to degradation or temperature dependence.

[0013] The use of a support device with macro-scale springs allows for the simple and reliable isolation of MEMS sensors from the motion of surrounding components.

[0014] In this process, at least the spring, and preferably the entire coupling structure, is made of metal. On the one hand, manufacturing is simplified because the production of metal structures is relatively easy. Furthermore, metal springs achieve low self-damping, allowing the spring to absorb ambient motion more effectively. As a result, the isolation of the carrier platform housing the MEMS sensor from such motion is improved, and consequently, the reliability of the measurement data from the MEMS sensor is enhanced. Low self-damping generally results in greater suppression / blocking of vibrations of the support structure in the typical operating frequency band of the MEMS sensor compared to comparable support structures with higher self-damping (e.g., those made of elastomer).

[0015] The coupling structure is suitable for connection to the housing structure via screw connections. Because the coupling structure, and especially the spring, is a macro-scale design, it can be easily secured via screw connections. This further simplifies manufacturing. Furthermore, screw connections can be easily loosened, facilitating the replacement of support devices, coupling structures, and the MEMS sensors attached to them.

[0016] The coupling structure is suitable for insulating the MEMS sensor and the housing structure from each other. In particular, it is preferable that the spring cross-section is small relative to its length, that the spring is made of a material that constitutes the only continuous connection between the housing structure and the carrier platform, and / or that the thermal mass of the coupling structure is smaller than the thermal mass of the carrier platform. As a result, fluctuations in external temperature are transmitted to the MEMS sensor in a highly attenuated manner or not transmitted at all. In either case, the temperature change of the MEMS sensor becomes extremely gradual and uniform. As a result, the reliability of the sensor data is improved.

[0017] The carrier platform is designed as a plate, and the springs are formed as pairs of bent beam springs. Each pair of bent beam springs is connected at its first end to a point on the periphery of the plate and connected to each other at its second end. Each bent beam spring is bent such that there is a gap between each pair of bent beam springs. These pairs of bent beam springs are connected to the housing structure via their second ends, preferably by screw connections. As a result, a specific embodiment of the support device is provided.

[0018] The sensor device comprises a MEMS sensor, a support device configured as described above, on which the MEMS sensor is fixed to a carrier platform of the support device, and a housing structure that accommodates the support device and the MEMS sensor mounted thereon, and is connected to the MEMS sensor via a coupling structure of the support device. As a result, a sensor device is shown having a MEMS sensor isolated in a simple and reliable manner from the operation of the sensor.

[0019] In this case, the thermal expansion coefficients of at least two interconnected elements among the spring, carrier platform, and MEMS sensor can be matched, preferably with a deviation of less than 300%, 200%, 100%, or 50% from each other. This can reduce or eliminate deformation caused by expansion to different lengths due to temperature changes. This is particularly advantageous compared to sensors that use elastomers or silicon for separation, because these materials have thermal expansion coefficients that do not match those of the MEMS sensor material, especially silicon.

[0020] In particular, the spring and carrier platform can be made from the same material, and their coefficient of thermal expansion is adjusted to match the material of the MEMS sensor or its packaging. Alternatively, or in addition, if the MEMS sensor is manufactured using silicon as the substrate, Kovar (material number 1.3981, e.g., 54% iron, 29% nickel, 17% cobalt) or a similar material can be used as the material for the carrier platform.

[0021] The natural frequency of the support device with the MEMS sensor attached can be greater than the bandwidth of the MEMS sensor and less than the driving frequency of the MEMS sensor. This ensures that the support device and the MEMS sensor vibrate at frequencies different from both the operating frequency at which the MEMS sensor is excited and the bandwidth of the MEMS sensor (indicating the frequency range the MEMS sensor can measure). In this case, the operating frequency is in the range of 10 kHz, and the bandwidth is, for example, in the range of 10 Hz to 100 Hz. As a result, it is ensured that the natural vibration of the support device does not interfere with the operation of the MEMS sensor. The natural frequency of a support device with a MEMS sensor attached can be determined by known methods based on the design of the support device.

[0022] The support device has the same resonant frequency in all three spatial directions. As a result, the MEMS sensor is uniformly isolated from external motion in all spatial directions. The same resonant frequency can be achieved, for example, by a support device with a symmetrical design in two dimensions and configured so that its main moments of inertia match.

[0023] The support device is particularly suitable for preventing deformation of the housing structure due to temperature changes from being transmitted to the MEMS sensor. Such deformation is absorbed mainly by springs and, as a result, is not transmitted to the carrier platform and the MEMS sensor. This improves the reliability of the sensor device because the operation of the MEMS sensor is not hindered by housing deformation. [Brief explanation of the drawing]

[0024] The present invention will be described in more detail with reference to the following drawings. The following description is merely exemplary and should not be construed as limiting. The present invention is defined only by the subject matter of the claims.

[0025] [Figure 1] Shows a schematic diagram of a support device for a MEMS sensor. [Figure 2] Shows a schematic view of another support device for a MEMS sensor. [Figure 3A] Shows a schematic diagram of an additional support device for a MEMS sensor. [Figure 3B] Shows a schematic diagram of an additional support device for a MEMS sensor. [Figure 4] Shows a schematic diagram of a sensor device. [Figure 5A] Shows a schematic diagram of the vibration of the support device. [Figure 5B] Shows a schematic diagram of the vibration of the support device. [Figure 6A] Shows a schematic frequency diagram. [Figure 6B] Shows a schematic frequency diagram.

Embodiments for Carrying Out the Invention

[0026] FIG. 1 shows a schematic diagram of a support device 100 suitable for supporting a MEMS (Micro-Electro-Mechanical) sensor 200 (e.g., an acceleration sensor or a rotational speed sensor). The support device 100 includes a carrier platform 110 on which the MEMS sensor 200 can be disposed or fixed. Further, the support device includes a coupling structure 120 having individual macro-scale springs 130 connected to the carrier platform 110. The coupling structure 120 is connectable to a housing structure 300 suitable for accommodating the support device 100 and the MEMS sensor 200 supported by the support device.

[0027] In this case, the carrier platform 110 has any shape on the one hand,

[0028] The carrier platform 110 is integrated with or connected to a coupling structure 120. As shown in Figure 1, the coupling structure 120 consists substantially of a spring 130 and connects the carrier platform 110 to the housing structure 300. However, the coupling structure 120 may also include additional elements such as struts, anchors, and fixing points to stabilize the motion of the carrier platform 110 and / or to facilitate connection to other parts of the housing structure 300 and the sensor device 400.

[0029] The spring 130 inserted into the coupling structure 120 is characterized by having substantially macro-scale dimensions, such as being visible to the naked eye or having a minimum dimension exceeding 0.3 mm, 0.5 mm, 1 mm, or 5 mm. This makes the manufacturing of the spring 130 significantly easier compared to micromechanical springs. Furthermore, using a spring instead of an elastomer reduces the risk of deterioration due to temperature changes and changes in spring properties. In addition, the macro-scale spring 130 can be relatively easily separated from the housing structure 300 if a malfunction occurs in the support device 100 or the MEMS sensor 200.

[0030] In principle, the spring 130 can be manufactured from any material having sufficient elasticity and dimensional stability for this purpose. That is, the spring 130 must freely support the carrier platform 110 and the MEMS sensor 200 above the housing structure 300, function to buffer the movement of the housing structure 300, so that the MEMS sensor 200 moves as little as possible, or as slowly and uniformly as possible, while simultaneously avoiding contact with other parts within the housing structure 300 or the housing structure 300 itself. The shape of the spring 130 shown in Figure 1 should be interpreted purely symbolically here. For example, the spring 130 can be in the form of a bent beam spring extending in one direction in a thin strip-like shape. This example will be discussed later. However, the spring 130 can also be in any other form that satisfies the above function.

[0031] In particular, the spring 130 may be made of metal. Preferably, the rest of the coupling structure 120 is also made of (the same or different) metal. On the one hand, metal has the above-mentioned properties of sufficient elasticity and dimensional stability. Furthermore, metal can be readily used to manufacture macro-scale springs, such as bent beam springs. In this process, the metal can be formed into the desired shape by any known method, such as cutting, erosion, punching, or bending. By using metal, the spring 130 can be manufactured with reduced damping. This improves the isolation between the housing structure 300 and the MEMS sensor 200. This is because the motion of the housing structure 300 is easily absorbed by the low-damping spring 130, and the vibration of the spring 130 is suppressed at the operating frequency of the MEMS sensor 200.

[0032] With the appropriate configuration, the coupling structure 120 insulates the MEMS sensor 200 and the housing structure 300 from each other. In other words, temperature changes in the housing structure 300 are not transmitted to the carrier platform 110 or the MEMS sensor 200 fixed on it, or are transmitted only to a very small extent. As a result, the MEMS sensor 200 is kept at a nearly constant temperature, or temperature changes occur at least slowly and uniformly. This improves the reliability of data output from the MEMS sensor 200.

[0033] In particular, the spring 130 has a small cross-section relative to its length and consists of a single material that constitutes the only continuous connection between the housing structure 300 and the carrier platform 110. As a result, the cross-section of the material available for heat transfer is small compared to the distance bridging. Consequently, a flat temperature gradient is created along the spring 130, and this flat temperature gradient does not cause significant temperature changes in the MEMS sensor 120.

[0034] Alternatively, or in addition, the carrier platform 110 can be designed as a heat reservoir with a large thermal mass or thermal capacity compared to the thermal capacity (and / or mass greater than that of the coupling structure 120) of the coupling structure 120. In this case, the amount of heat transferred by the coupling structure 120 is absorbed by the carrier platform 110 without causing significant temperature changes. This method significantly isolates the temperature of the MEMS sensor 200 from the temperature of the housing structure 300.

[0035] The coupling structure 120 is detachably connected to the housing structure 300, for example, by a screw connection 122. Therefore, the coupling structure 120 has connection points adjacent to the spring 130, such as drilled holes for inserting screws or bolts, or press-fit plug connectors. Such a detachable connection allows the macroscale coupling structure 120 to be removed from the housing structure 300 along with the carrier platform 110 and the MEMS sensor 200 mounted on it, in the event of a failure of, for example, the MEMS sensor 200 or a component of the support device 100.

[0036] Examples of such support devices 100 are shown in Figures 2, 3A and 3B. In these examples, the carrier platform 110 is designed as a plate to which the MEMS sensor 200 is mounted. For example, the MEMS sensor 200, along with its packaging (i.e., primary protective cover), is bonded, inserted, or soldered to the carrier platform 200. The carrier platform 110 is preferably made of metal.

[0037] The spring 130 is formed as a pair 132 of bent beam springs, also made of metal. The carrier platform 110 and the spring 130 are made of the same or different materials. They are designed to be molded as a single unit or to be manufactured separately and then joined together. In this case, the metal bent beam springs serve two purposes: on the one hand, to provide mechanical isolation (i.e., motion damping), and on the other hand, to insulate the MEMS sensor 200 from external components as described above.

[0038] In the examples shown in Figures 2 and 3A, the pairs of bent beam springs 132 are connected to the periphery of the plate at their first ends 132a and connected to each other at their second ends 132b. Each bent beam spring is bent such that a certain distance is maintained between each pair of bent beam springs 132. As a result, the springs 130 can absorb external motion symmetrically. Furthermore, such a structure improves the stability of the coupling structure 120 because the springs 130 of the pairs 132 support each other.

[0039] Figure 3B shows a different example in which not all pairs of springs 132 act on the carrier platform 110, but rather a frame 124 is present. One pair of springs 132 connects the carrier platform 110 to the frame 124, while another pair of springs 132 connects the frame 124 to the outside. These examples can be interpreted as being arbitrarily varied. Thus, the carrier platform 110 can be connected to the housing structure 300 using different numbers of springs, individual springs, multiple frames, open frames, intermediately positioned springs, etc.

[0040] In the examples in Figures 2 and 3A, each pair of bent beam springs 132 is connected to the housing structure 300 via its second end 132b, preferably by a screw connection 122 or other removable connecting means. In the example in Figure 3B, the connection to the housing structure is present only on the outer pair of springs 132.

[0041] As shown in Figure 2, the spring 130 or coupling structure 120 acts symmetrically with respect to the corners of the rectangular or square carrier platform 110. Alternatively, it can act on the lateral sides, as shown in Figures 3A and 3B. In this case, as shown in Figure 2, the screw connection 122 is positioned in the gap between the pair of bending beam springs 132, resulting in a compact structure. In this case, a symmetrical and centrally located arrangement is recommended, as also shown in Figure 2. However, the connection point can also be located outside of these, as shown in Figures 3A and 3B. In this case as well, a symmetrical arrangement is recommended.

[0042] In the support device 100 shown in Figures 2, 3A and 3B, the MEMS sensor fixed to the support device 100 is mechanically and thermally isolated as described above.

[0043] The support device 100 and the MEMS sensor 200 typically constitute part of the sensor device 400. In addition to the MEMS sensor 200 and the support device 100 described above, the sensor device 400 further includes a housing structure 300 that accommodates the support device 100 and the MEMS sensor 200 mounted on it, and is connected to the MEMS sensor 200 via a coupling structure 120 of the support device 100.

[0044] An example of the basic structure of such a sensor device 400 is shown in Figure 4. Here, the support device 100 in the example of Figure 2 is fixed to the housing structure 300 by screws. The coupling structure 120, together with the spring 130 and the carrier platform 110, is attached by screws at a certain distance from the wall surface of the housing structure 300. As a result, they are capable of vibrating parallel and perpendicular to the wall surface of the housing structure 300. Exaggerated examples of such vibrations are shown in Figures 5A and 5B. The sensor device 400 may be equipped with damping means to limit / attenuate vibrations as needed. For example, the maximum displacement can be limited by a stopper. The housing structure 300 may also be filled with damping gas.

[0045] In such a sensor device 400, it is recommended that the thermal expansion coefficients of at least two interconnected elements among the spring 130, carrier platform 110, and MEMS sensor 200 match, preferably having a deviation of less than 300%, 200%, 100%, or 50% from each other. Because the thermal expansion coefficient of the carrier platform 110 (and spring 130) is relatively close to that of the MEMS sensor 200, thermomechanical stress directly occurring between the MEMS sensor 200 and the carrier platform 110 can be avoided.

[0046] In particular, the carrier platform 110 and the spring 130 / coupling structure 120 can be manufactured from the same metal. When selecting a metal, the coefficient of thermal expansion of the MEMS sensor 200 or its basic components should be considered. For example, if the MEMS sensor 200 is manufactured using silicon as the base material, Kovar (Fe-Ni-Co alloy) can be used for the spring 130 and / or the carrier platform 110 because these materials have similar coefficients of thermal expansion. For example, Kovar has a coefficient of thermal expansion of 5.6 ppm / K, while silicon has 2.6 ppm / K. The coefficient of thermal expansion of aluminum is 23 ppm / K, which is about 1000% of the value for silicon. For example, elastomer / silicon has a coefficient of 200 ppm / K, which is about 10000% of the value for silicon.

[0047] From a weight perspective, it is often advantageous to manufacture the housing structure 300 from aluminum and the MEMS sensor 200 from a silicon-based structure. In this case, the support device 100 plays a role in absorbing the deformation of the housing due to temperature changes caused by the coefficient of thermal expansion and preventing it from being transmitted to the MEMS sensor 200. It is necessary to create an environment for the MEMS sensor 200 that is as free from stress and deformation as possible. At the same time, it is important that the coefficient of thermal expansion of the support device 100 matches that of the MEMS sensor 200. Otherwise, stress will be generated between the support device 100 and the MEMS sensor 200.

[0048] The thermal deformation of the housing structure 300 caused by the spring 130 absorbs / compensates for the deformation of the chip, so the thermal expansion coefficient of the housing structure 300 plays only a subordinate role. Therefore, the material selection for the housing structure 300 is arbitrary in this respect. More importantly, the thermal expansion coefficient of the carrier platform 110 (and spring 130) should be relatively close to that of the MEMS sensor 200. Otherwise, direct thermomechanical stress would occur between the chip and the carrier platform 110.

[0049] By adjusting the coefficient of thermal expansion, deformation due to changes in length can be avoided. As a result, the position of the carrier platform 110 does not change during temperature changes, and therefore the position of the MEMS sensor 200 does not change, thus improving the reliability of the sensor device 400.

[0050] The support device 100 is designed such that its natural frequency with the MEMS sensor 200 attached is greater than the bandwidth of the MEMS sensor 200 achievable by the sensor device 400, and less than the drive frequency of the MEMS sensor 200 used by the sensor device 400. In particular, this can be achieved by adjusting the mass of the coupling structure 120 and the carrier platform 110, and by adjusting the spring stiffness of the spring 130.

[0051] The support device 100 exhibits vibration behavior as shown in Figure 6A, for example. Here, the operating frequency or drive frequency BF of the MEMS sensor 200 is relatively high, for example, in the range of 10 kHz. The bandwidth BW of the MEMS sensor 200, i.e., the measurable frequency range, is relatively low, for example, in the range of 10 Hz to 100 Hz. The natural frequency and / or resonant frequency EF of the support device 100 and the MEMS sensor 200 lies in between. In particular, the operating frequency BF is remarkably high. This ensures that the resonance or natural vibration of the support device 100 incorporated into the sensor device 400 does not interfere with the drive of the MEMS sensor 200 or the measurement range of the sensor device 400. This also improves the reliability of the sensor device 400. At the same time, this ensures that the operating frequency of the MEMS sensor 200 is isolated from external vibrations as much as possible, so that external vibrations do not affect the sensor performance.

[0052] Figure 6B shows how the amplification of spring vibration, i.e., the vibration absorption capacity, changes in response to damping in this case. The arrows in Figure 6B indicate a decrease in damping. When damping is low, vibrations close to the natural frequency are more strongly coupled. At the same time, when damping is low, frequencies close to the operating frequency BF are also suppressed. Therefore, it is advantageous to reduce the damping achieved by, for example, a metal spring.

[0053] In this case, it is ideal that the support device 100 has the same natural frequency or resonant frequency in all three spatial directions. In the case of a support device having a substantially two-dimensional structure, as shown in Figures 2, 3A, and 3B, this can be achieved by selecting a symmetrical structure on one side. The mass ratio is adjusted so that the same natural / resonant frequency is obtained in the third spatial direction as well. The corresponding vibrations of the support device 100 shown in Figures 2 and 4 are shown in Figures 5A and 5B.

[0054] The support device 100, which responds similarly to excitations in three spatial directions, avoids the need to consider a preferred orientation, especially when positioning the sensor device 400. As a result, the correct use of the sensor device 400 is simplified, thereby improving the reliability of the data from the sensor device 400.

[0055] In addition, in the sensor device 400, the support device 100 is particularly suitable for preventing the deformation of the housing structure 300 due to temperature changes from being transmitted to the MEMS sensor 200. For this purpose, the support device 100 is suspended such that the deformation of the housing structure 300 causes compression of the spring 130, but is configured so that the position of the MEMS sensor 200 does not change significantly, or so that mechanical stress is not transmitted to the MEMS sensor. Furthermore, in a symmetrical structure, deformation due to temperature changes is usually symmetrical, and the deformation can be offset by shaping the support device 100 symmetrically, for example, by compressing or extending all the springs 130 evenly. As a result, the position of the MEMS sensor 200 in space does not change as much as possible, and the impact on the measurement of the MEMS sensor 200 is reduced. This improves the reliability of the sensor device 400.

[0056] Through the above means, the MEMS sensor 200 can be reliably and easily isolated from the motion of adjacent components. As a result, the reliability of the MEMS sensor 200 or the sensor device 400 equipped with the MEMS sensor 200 is improved.

Claims

1. A support device (100) for supporting a MEMS (microelectromechanical) sensor (200), A carrier platform (110) suitable for supporting the MEMS sensor (200), A support device (100) comprising a carrier platform (110) having individual macroscale springs (130) connected thereto, and a coupling structure (120) suitable for connection to a housing structure (300), wherein the housing structure (300) is suitable for housing the support device (100) and the MEMS sensor (200) supported thereon.

2. The support device (100) according to claim 1, wherein at least the spring (130), preferably the entire coupling structure (120), is made of metal.

3. The support device (100) according to claim 1 or 2, wherein the coupling structure (120) is suitable for being connected to the housing structure (300) by screw connections (122).

4. The support device (100) according to any one of claims 1 to 3, wherein the coupling structure (120) is suitable for insulating the MEMS sensor (200) and the housing structure (300) from each other, preferably having a small cross-section relative to the length of the spring (130), the spring (130) being made of a material that constitutes the only continuous connection between the housing structure (300) and the carrier platform (110), and / or the heat capacity of the coupling structure (120) is smaller than the heat capacity of the carrier platform (130).

5. The carrier platform (110) is formed in a plate shape, The spring (130) is formed as a pair (132) of bent beam springs, the pair (132) of bent beam springs is connected at its first end (132a) to a point on the periphery of the plate, and at its second end (132b) to each other, and each of the bent beam springs is bent such that a gap is formed between each of the pairs (132) of bent beam springs. The support device (100) according to any one of claims 1 to 4, wherein each pair of bending beam springs (132) can be connected to the housing structure (300) via the second end (132b), preferably by screw connections (122).

6. MEMS sensor (200) and A support device (100) according to any one of claims 1 to 5 for supporting the MEMS sensor (200), wherein the MEMS sensor (200) is fixed to the carrier platform (110) of the support device (100), A sensor device (400) comprising the support device (100) and a housing structure (300) that houses the MEMS sensor (200) mounted thereon and is connected to the MEMS sensor (200) via the coupling structure (120) of the support device (100).

7. The sensor device (400) according to claim 6, wherein the thermal expansion coefficients of at least two interconnected elements among the spring (130), the carrier platform (110), and the MEMS sensor (200) are identical, preferably having a deviation of less than 300%, 200%, 100%, or 50% from each other.

8. The sensor device (400) according to claim 6 or 7, wherein the natural frequency of the support device (100) with the MEMS sensor (200) attached is greater than the bandwidth of the MEMS sensor (200) and less than the drive frequency of the MEMS sensor (200).

9. The support device (100) has the same resonant frequency in all three spatial directions, the sensor device (400) according to any one of claims 6 to 8.

10. The sensor device (400) according to any one of claims 6 to 9, wherein the support device (100) is particularly suitable for preventing the deformation of the housing structure (300) due to temperature changes from being transmitted to the MEMS sensor (200).

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