Method and apparatus for cleaning package structures

Abstract

The present invention provides a cleaning method and apparatus for package structures. This cleaning method includes a negative pressure cleaning step, which includes adjusting the pressure in a chamber in which the package structure is placed to a predetermined vacuum pressure, rotating the package structure, and spraying a cleaning solution at a predetermined temperature onto the rotating package structure to perform negative pressure cleaning on the package structure. Here, the predetermined vacuum pressure is higher than the vaporization pressure of the cleaning solution at the predetermined temperature. By utilizing the principle that the surface tension of the cleaning solution decreases under negative pressure, the method promotes the inflow of the cleaning solution into the fine gaps of the package structure and prevents the cleaning solution from vaporizing before it reaches the part of the package structure to be cleaned.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and particularly to a cleaning method and apparatus for a package structure.

Background Art

[0002] A system-on-chip (SoC) integrates a complex and large-scale system into a single large chip. Different from an SoC, a heterogeneous (heterogeneous structure) chiplet divides a large-scale system into multiple small-scale systems, manufactures each small-scale system into a small chip (chiplet), or a standard small chip (chiplet), and then recombines these small chiplets by packaging technology to achieve performance equivalent to or better than that of a single large chip with a large-scale system.

[0003] When reassembling chiplets, multiple chiplets are usually integrated onto a large carrier by flip-chip bonding. FIGS. 1a and 1b show a package structure formed by flip-chip bonding. As shown in FIGS. 1a and 1b, a bump array 13 is formed between a plurality of chiplets 12 and a carrier 11. During flip-chip bonding, a flux (e.g., rosin) is used to improve the bonding reliability between the chiplet 12 and the carrier 11. After the bonding is completed, it is necessary to clean the bonded package structure 10 to remove flux residues. By doing so, it is possible to prevent the flux residues from adversely affecting subsequent packaging processes and product yield.

[0004] With the further improvement of packaging density and integration, the bump size in the package structure continues to shrink, and the gaps between the chiplet and the carrier, as well as between the bumps, also become smaller. As a result, it becomes more difficult for the cleaning liquid to enter the tiny gaps between the chiplet and the carrier. Consequently, contaminants such as flux residues in the package structure are not completely removed.

[0005] Therefore, in order to clean contaminants from within the package structure, improvements to the cleaning method and apparatus for the package structure are necessary. [Overview of the Initiative]

[0006] Based on the shortcomings of the prior art described above, the object of the present invention is to provide a cleaning method and apparatus for flip chips that solves the problem of the prior art in which contaminants such as flux residue are not completely removed from the flip chips.

[0007] To achieve the above-mentioned objectives and other related objectives, the present invention provides a method for cleaning a package structure, which includes a negative pressure cleaning step. The negative pressure cleaning process is, A step of adjusting the pressure inside the chamber in which the package structure is placed to a predetermined vacuum pressure, The process of rotating the package structure, The process includes spraying a cleaning solution at a predetermined temperature onto a rotating package structure and performing negative pressure cleaning on the package structure, The predetermined vacuum pressure is higher than the vaporization pressure of the cleaning solution at the predetermined temperature.

[0008] During negative pressure cleaning, the package structure is rotated alternately at a first rotational speed and a second rotational speed, and the first rotational speed may be faster than the second rotational speed.

[0009] A normal pressure cleaning step may be included between the negative pressure cleaning step and the drying step. The atmospheric pressure cleaning process includes the steps of adjusting the pressure in the chamber in which the package structure is placed to atmospheric pressure, rotating the package structure, and spraying deionized water onto the rotating package structure to perform atmospheric pressure cleaning on the package structure.

[0010] If the negative pressure cleaning step and the atmospheric pressure cleaning step are performed on the package structure in different chambers, a pre-drying step may be further included between the negative pressure cleaning step and the atmospheric pressure cleaning step, performed in the same chamber as the negative pressure cleaning step. The pre-drying step includes stopping the spraying of the cleaning solution onto the package structure and rotating the package structure. After the pre-drying of the package structure is complete, the surface of the package structure is covered with a liquid film.

[0011] The present invention also provides a cleaning apparatus for package structures, the cleaning apparatus comprising a control device and at least one first cleaning module, the first cleaning module being The first chamber and A first chuck is placed inside the first chamber and holds the package structure to be cleaned, A first rotating device for rotating the first chuck, A first fluid supply device for spraying at least one of a cleaning liquid or a drying gas onto the surface of the package structure, A first pressure regulating device that adjusts the pressure inside the first chamber, It includes a first temperature control device that adjusts the temperature of the cleaning fluid supplied to the first fluid supply device. The control device is configured to control the first cleaning module to perform the cleaning method on the package structure.

[0012] As described above, the cleaning method and apparatus for package structures according to the present invention have the following beneficial effects.

[0013] 1. The package structure is cleaned by spraying a cleaning solution at a predetermined temperature onto the package structure, which is rotating under negative pressure. By utilizing the principle that the surface tension of the cleaning solution decreases under negative pressure, the flow of the cleaning solution into the minute gaps in the package structure can be promoted, thereby cleaning contaminants within the package structure. 2. By setting the vacuum pressure used during negative pressure cleaning of the package structure to a level higher than the vaporization pressure of the cleaning solution at the set temperature, it is possible to prevent the cleaning solution from vaporizing before it reaches the cleaning area of ​​the package structure, thereby contributing to achieving a better cleaning effect. 3. During negative pressure cleaning, the cleaning solution is sprayed onto the package structure while the package structure is rotated alternately at high and low rotation speeds. This promotes the dispersion of the cleaning solution and contaminants, prevents the cleaning solution from remaining, and improves the cleaning effect. 4. After negative pressure cleaning, performing atmospheric pressure cleaning on the package structure can further remove any remaining cleaning agent from the package structure. 5. When negative pressure cleaning and atmospheric pressure cleaning are performed on the package structure in different chambers, a pre-drying process is performed on the package structure after the negative pressure cleaning is completed. This keeps the surface moist while the package structure is being transported to the atmospheric pressure cleaning chamber, preventing oxidation of the package structure surface. [Brief explanation of the drawing]

[0014] The features and performance of the present invention will be further described by the following embodiments and accompanying drawings. [Figure 1] Figure 1a shows a schematic top view of a known package structure. Figure 1b shows a schematic cross-sectional view of a known package structure. [Figure 2] Figure 2 shows a layout diagram of a cleaning device for package structures according to Embodiment 1 of the present invention. [Figure 3] Figure 3 shows a schematic diagram of the first cleaning module according to Embodiment 1 of the present invention. [Figure 4] Figure 4 shows a schematic diagram of the second cleaning module according to Embodiment 1 of the present invention. [Figure 5] Figure 5 shows a flowchart of the cleaning method for a package structure according to Embodiment 1 of the present invention. [Figure 6] Figure 6 is a graph showing the relationship between the vaporization pressure and temperature of deionized water. [Figure 7]FIG. 7 shows a layout diagram of a cleaning device for a package structure according to Embodiment 2 of the present invention. [Figure 8] FIG. 8 shows an arrangement diagram of a cleaning device for a package structure according to Embodiment 3 of the present invention. [Figure 9] FIG. 9 shows a flowchart of a cleaning method for a package structure according to Embodiment 3 of the present invention.

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present invention will be described through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed in various ways based on various viewpoints and applications without departing from the spirit of the present invention.

[0016] Please refer to FIGS. 1 to 9. Note that it should be noted that the drawings provided in these embodiments only schematically show the basic concept of the present invention. The drawings are not drawn based on the number, shape, and size of the components in the actual embodiments, but only show the components related to the present invention. The form, quantity, and ratio of each component in the actual embodiments can be arbitrarily changed, and the arrangement form of the components can also be more complex.

[0017] [Embodiment 1] FIGS. 1a and 1b show a known package structure 10. The package structure 10 includes a carrier 11 and at least one chiplet 12. The chiplet 12 is flip-chip bonded to the carrier 11 via a bump array 13. As described above, when the chiplet 12 is flip-chip bonded to the carrier 11, contaminants such as flux remain between the chiplet 12 and the carrier 11. In order to avoid the influence of these contaminants on subsequent packaging processes, it is necessary to clean the residual contaminants.

[0018] Figure 2 shows an example of a cleaning apparatus 100 according to an embodiment disclosed in this application. The cleaning apparatus 100 can be used to clean residual contaminants within the package structure 10 by performing the cleaning method described herein.

[0019] As shown in Figure 2, the cleaning device 100 comprises a control device 110, a front-end module 120, a transport module 130, at least one first cleaning module 140, and at least one second cleaning module 150. The number of first cleaning modules 140 is greater than the number of second cleaning modules 150. Specifically, the ratio of the number of first cleaning modules 140 to the number of second cleaning modules 150 is in the range of 3:1 to 8:1 (e.g., 5:1). In this embodiment, the first cleaning modules 140 and the second cleaning modules 150 are located on the back of the front-end module 120 and on both sides of the transport module 130, while the second cleaning module 150 is located away from the front-end module 120. The front-end module 120 includes at least one load port 121 for loading package structures 10. The load port 121 is used to load the package structures 10 to be cleaned and to discharge the cleaned package structures 10. The transport module 130 is equipped with a manipulator 131, which is used to transport the package structure 10. In Embodiment 1, the first washing module 140 is used to perform a negative pressure washing process S1 and a pre-drying process S2 on the package structure 10. The second washing module 150 is used to perform an atmospheric pressure washing process S3 and a drying process S4 on the package structure 10. Hereinafter, the specific details of the negative pressure washing process, pre-drying process, atmospheric pressure washing process, and drying process will be described later.

[0020] The control device 110 may be a computing device (e.g., a computer) equipped with a processor for executing commands and a memory for storing commands, etc., for controlling the operation of various components within the first cleaning module 140 and the second cleaning module 150. This allows the first cleaning module 140 and the second cleaning module 150 to perform the corresponding steps in the cleaning method of this application. The control device 110 also controls the transport module 130 to transport the package structure 10 between the front-end module 120, the first cleaning module 140, and the second cleaning module 150. For example, the control device 110 controls the manipulator 131 to transport the package structure 10 along the following path: load port 121 → first cleaning module 140 → second cleaning module 150 → load port 121.

[0021] As shown in Figure 3, the first washing module 140 comprises components such as a first chamber 141, a first chuck 142, a first rotating device 143, a first fluid supply device 144, a first pressure regulator 145, a first temperature regulator 146, and a first spray pressure regulator 147. The first chamber 141 can provide a sealed space for housing the package structure 10. The first chuck 142 is positioned within the first chamber 141 to hold the package structure 10. The first rotating device 143 is used to rotate the first chuck 142, thereby allowing the package structure 10 to rotate accordingly. The control device 110 can control the rotational speed of the first chuck 142 via the first rotating device 143. For example, the rotational speed of the first chuck 142 can be controlled to vary within the range of 0 to 3000 r / min.

[0022] A first fluid supply device 144 is used to spray the cleaning solution onto the surface of the package structure 10. In one embodiment, the first fluid supply device 144 includes a supply source 1441, a supply pipe 1442, and a nozzle 1443. The supply source 1441 is used to store the cleaning solution. The nozzle 1443 is located in the first chamber 141 and is connected to the supply source 1441 via the supply pipe 1442 to spray the cleaning solution onto the package structure 10. In one embodiment, the cleaning solution includes at least one of deionized water and a saponifying agent-containing solution. Here, the saponifying agent-containing solution is, for example, an aqueous solution of a saponifying agent at a mass fraction of 5% to 10%, and the main component of the saponifying agent is, for example, 2-amino-2-methyl-1-propanol.

[0023] The first pressure regulating device 145 is used to regulate the pressure in the first chamber 141. In this embodiment, the control device 110 controls the first pressure regulating device 145 to adjust and maintain the pressure in the first chamber 141 to a predetermined vacuum pressure, thereby performing a negative pressure cleaning process on the package structure 10. During negative pressure cleaning, the predetermined vacuum pressure in the first chamber 141 is set to a value between 25 Torr and 150 Torr.

[0024] In one embodiment, the first pressure regulating device 145 includes a pressure reducing pipe L1. The pressure reducing pipe L1 is connected to the first chamber 141, and a vacuum pump 1451 is placed on the pressure reducing pipe L1. The control device 110 can control the vacuum pump 1451 to create a vacuum in the first chamber 141, thereby adjusting the pressure in the first chamber 141 to a predetermined vacuum pressure. Furthermore, the first pressure regulating device 145 also includes a vacuum release pipe L2. The vacuum release pipe L2 is connected to the first chamber 141, and a vacuum release valve 1452 is provided in the vacuum release pipe L2. After the negative pressure cleaning process in the first chamber 141 is completed, the control device 110 opens the vacuum release valve 1452 to allow air to flow into the first chamber 141, releasing the vacuum in the first chamber 141 and returning the first chamber 141 to atmospheric pressure. This facilitates operations such as removing the package structure 10 from the first chamber 141 via the transport module 130.

[0025] The first temperature control device 146 adjusts the temperature of the cleaning solution sprayed onto the package structure 10. In this embodiment, the control device 110 controls the first temperature control device 146 to heat the cleaning solution before it is supplied to the nozzle 1443. This causes the nozzle 1443 to spray the cleaning solution at a predetermined temperature onto the package structure 10. During negative pressure cleaning, the predetermined temperature of the cleaning solution is set to a value between 40°C and 60°C. In one embodiment, the first temperature control device 146 includes temperature control components such as a heater 1461 and a temperature sensor 1462 located on the supply pipe 1442. For example, the control device 110 controls the heating power of the heater 1461 according to the temperature of the cleaning solution in the supply pipe 1442 detected by the temperature sensor 1462. This causes the temperature of the cleaning solution to reach a predetermined temperature. In some embodiments, the first temperature control device 146 may be located on the supply source 1441.

[0026] The first spray pressure regulating device 147 adjusts the spray pressure of the cleaning fluid sprayed onto the package structure 10. In this embodiment, the control device 110 controls the first spray pressure regulating device 147 to pressurize the cleaning fluid before it is supplied to the nozzle 1443, so that the nozzle 1443 sprays the cleaning fluid onto the package structure 10 at a predetermined spray pressure. During negative pressure cleaning, the predetermined spray pressure of the cleaning fluid is set to a value between 10 psi and 70 psi. In one embodiment, the first spray pressure regulating device 147 includes hydraulic adjustment components such as a booster pump 1471, a pressure regulating valve 1472, and a pressure sensor 1473 located on the supply pipe 1442. For example, the control device 110 controls the booster pump 1471 to pressurize the cleaning fluid in the supply pipe 1442 and controls the opening of the pressure regulating valve 1472 according to the pressure of the cleaning fluid in the supply pipe 1442 detected by the pressure sensor 1473, so that the spray pressure of the cleaning fluid reaches a predetermined spray pressure.

[0027] As shown in Figure 4, the second cleaning module 150 comprises components such as a second chamber 151, a second chuck 152, a second rotating device 153, a second fluid supply device 154, and a second pressure regulating device 155. The second chuck 152 is positioned within the second chamber 151 to hold the package structure 10. The second rotating device 153 is used to rotate the second chuck 152, thereby allowing the package structure 10 to rotate accordingly. The control device 110 can control the rotational speed of the second chuck 152 via the second rotating device 153, for example, by controlling the rotational speed of the second chuck 152 to vary within the range of 0 to 3000 r / min.

[0028] A second fluid supply device 154 is used to spray a cleaning solution or drying gas onto the surface of the package structure 10. In one embodiment, the second fluid supply device 154 includes a supply source 1541, a supply pipe 1542, and a nozzle 1543. The supply source 1541 is used to store the cleaning solution or drying gas. The nozzle 1543 is located in the second chamber 151 and is connected to the supply source 1541 via the supply pipe 1542 to spray the cleaning solution or drying gas onto the package structure 10. In one embodiment, the cleaning solution is deionized water and the drying gas is nitrogen or an inert gas.

[0029] The second pressure regulating device 155 is used to regulate the pressure in the second chamber 151. In this embodiment, the control device 110 controls the second pressure regulating device 155 to regulate and maintain the pressure in the second chamber 151 to atmospheric pressure, thereby performing an atmospheric pressure cleaning process on the package structure 10.

[0030] In one embodiment, the second pressure regulating device 155 includes atmospheric pressure piping P1. The atmospheric pressure piping P1 is connected to the second chamber 151, and an exhaust valve 1551 is provided in the atmospheric pressure piping P1. The control device 110 can be controlled to open the exhaust valve 1551, thereby connecting the second chamber 151 to the atmospheric environment, exhausting the gas in the second chamber 151, and maintaining the pressure in the first chamber 141 at atmospheric pressure.

[0031] Please understand that the above scope represents only exemplary embodiments and does not limit the scope of this disclosure. Other suitable embodiments are also possible.

[0032] It should be noted that during the cleaning process of the package structure 10, the nozzles (1443, 1543) may be fixed or movable. The following description will use a nozzle 1543 configured in the second cleaning module 150 to spray cleaning liquid onto the package structure 10 as an example. In one embodiment, the nozzle 1543 sprays cleaning liquid onto the package structure 10 in a stationary state. For example, the nozzle 1543 sprays cleaning liquid onto the package structure 10 from above the center of the package structure 10. In another embodiment, the nozzle 1543 sprays cleaning liquid onto the package structure 10 in an oscillating state. For example, the nozzle 1543 swings along an arc passing through the center of the package structure 10 and sprays cleaning liquid onto the package structure 10. In yet another embodiment, the nozzle 1543 sprays cleaning liquid onto the package structure 10 in a parallel movement state. For example, the nozzle 1543 reciprocates along a straight line passing through the center of the package structure 10 and sprays cleaning liquid onto the package structure 10. Similarly, when the nozzle 1543 sprays a drying gas onto the package structure 10, the nozzle 1543 can be fixed or movable.

[0033] Figure 5 is a flowchart showing an example of a cleaning method for a package structure 10 according to an embodiment of this application. The cleaning method for the package structure 10 will be described below using a cleaning apparatus 100 for cleaning the package structure 10 as an example. As shown in Figure 5, the cleaning method for the package structure 10 includes a negative pressure cleaning step S1, a pre-drying step S2, an atmospheric pressure cleaning step S3, and a drying step S4.

[0034] The negative pressure cleaning process S1 will be described in detail below with reference to Figures 2, 3, and 5.

[0035] S11: The pressure in the chamber in which the package structure 10 is placed is adjusted to a predetermined vacuum pressure. Specifically, the control device 110 controls the manipulator 131 to place the package structure 10 to be cleaned in the first chamber 141, holds the package structure 10 in the first chuck 142, and controls the vacuum pump 1451 to start vacuuming the first chamber 141 so that the pressure in the first chamber 141 reaches a predetermined vacuum pressure. Preferably, the pressure in the first chamber 141 is adjusted to a value between 25 Torr and 150 Torr.

[0036] S12: The package structure 10 is rotated. Specifically, the control device 110 controls the first rotating device 143 to rotate the first chuck 142 alternately at a first rotational speed and a second rotational speed. The first rotational speed is faster than the second rotational speed, so that the package structure 10 rotates alternately at the first and second rotational speeds. In some embodiments, the first and second rotational speeds do not exceed 1000 r / min. For example, the first rotational speed is in the range of 400 r / min to 800 r / min, and the second rotational speed is in the range of 100 r / min to 300 r / min.

[0037] Please note that the number of cycles in which the package structure 10 rotates alternately at the first and second rotational speeds is set according to the actual process conditions. For example, the number of cycles is in the range of 8 to 30. In one cycle, the time the package structure 10 rotates at the first rotational speed is T1, and the time the package structure 10 rotates at the second rotational speed is T2. T1 and T2 can be set to the same or different values ​​depending on the actual process conditions. For example, T1 and T2 are in the range of 30 to 60 seconds, and in a specific example, both T1 and T2 are set to 45 seconds.

[0038] During negative pressure cleaning of the package structure 10, rotating the package structure 10 at alternating speeds makes it easier to remove the cleaning solution from the cleaning area of ​​the package structure 10 (i.e., the back surface of the tiplet 12) and prevents the cleaning solution from remaining.

[0039] S13: Negative pressure cleaning is performed by spraying a cleaning solution at a predetermined temperature onto the rotating package structure 10. Specifically, the first temperature control device 146 adjusts the cleaning solution to a predetermined temperature, and then the cleaning solution at the predetermined temperature is sprayed onto the surface of the rotating package structure 10 via the nozzle 1443. Due to the action of centrifugal force, the cleaning solution spreads over the entire package structure 10. The nozzle 1443 can spray the cleaning solution onto the package structure 10 in an oscillating, parallel, or stationary state. In one embodiment, deionized water or a saponifying agent-containing solution is used as the cleaning solution to clean the package structure 10. In another embodiment, the package structure 10 is sequentially cleaned using a saponifying agent-containing solution and deionized water. In yet another embodiment, the package structure 10 is cleaned using a saponifying agent-containing solution and deionized water alternately. Here, the predetermined temperature for both the saponifying agent-containing solution and the deionized water can be set to a value between 40°C and 60°C, preferably 60°C. Furthermore, the cleaning time for different types of cleaning solutions can be optimized based on actual process conditions.

[0040] In the negative pressure cleaning process S1 of the package structure 10, the cleaning environment of the package structure 10 is set to negative pressure. This reduces the surface tension of the cleaning liquid supplied to the package structure 10, improving the diffusivity of the cleaning liquid. As a result, the cleaning liquid can smoothly flow into the fine gaps on the back surface of the chiplet 12 and diffuse uniformly into the gaps of the bump array 13, resulting in a superior cleaning effect.

[0041] To prevent the cleaning solution from vaporizing before reaching the cleaning area of ​​the package structure 10, during negative pressure cleaning, the set vacuum pressure in the chamber where the package structure 10 is located should be higher than the vaporization pressure of the cleaning solution sprayed onto the package structure 10 at the set temperature. This ensures that the cleaning solution remains in a liquid state even under the set vacuum pressure, contributing to the achievement of a better cleaning effect. Figure 6 shows a curve illustrating how the vaporization pressure of deionized water changes with temperature. In one embodiment, when deionized water at 60°C is used as the cleaning solution and negative pressure cleaning is performed on the package structure 10, the vaporization pressure of deionized water at 60°C is approximately 150 Torr, so the predetermined vacuum pressure in the first chamber 141 is set to 150 Torr or higher. For example, by setting the predetermined vacuum pressure of the first chamber 141 to 200 Torr, the deionized water can be used to clean the package structure 10 in a liquid state.

[0042] After the package structure 10 has completed the negative pressure cleaning process S1, and before the package structure 10 is transported to the second cleaning module 150, it is necessary to perform a preliminary drying process S2 on the package structure 10 that has completed the negative pressure cleaning process S1 in the first cleaning module 140. This is to prevent liquid splashing during transport of the package structure 10 by thinning the liquid film on the surface of the package structure 10.

[0043] The pre-drying step S2 includes stopping the spraying of cleaning solution onto the package structure 10 and rotating the package structure. Specifically, the spraying of cleaning solution onto the package structure 10 by the nozzle 1443 is stopped, and the control device 110 controls the first rotating device 143 to rotate the first chuck 142, thereby rotating the package structure 10. Compared to the negative pressure cleaning step S1, the rotation speed of the package structure 10 is increased in the pre-drying step S2 to remove a portion of the liquid film on the surface of the package structure 10. A thin liquid film remains on the surface of the package structure 10 even after the completion of the pre-drying step S2. As a result, the surface of the package structure 10 remains wet while it is being transported to the second cleaning module 150, thereby preventing oxidation of the surface of the package structure 10. In the pre-drying step S2, the rotation speed of the package structure 10 is lower than the rotation speed of the package structure 10 in the subsequent drying step S4. Specifically, in the pre-drying process S2, the rotational speed of the package structure 10 is less than 1000 r / min, for example, in the range of 600 r / min to 800 r / min.

[0044] Furthermore, after the package structure 10 completes the negative pressure cleaning process S1, the control device 110 controls the vacuum release valve 1452 to open, thereby releasing the vacuum in the first chamber 141 and restoring the pressure in the first chamber 141 to atmospheric pressure. Note that this facilitates subsequent operations such as removing the package structure 10.

[0045] The atmospheric pressure cleaning process S3 will be described in detail below with reference to Figures 2, 4, and 5.

[0046] S31: The pressure in the chamber where the package structure 10 is placed is adjusted to atmospheric pressure. Specifically, the control device 110 controls the manipulator 131 to transport the package structure 10, which has been washed in the first washing module 140, to the second chamber 151 of the second washing module 150, to hold the package structure 10 on the second chuck 152, and to open the exhaust valve 1551, thereby maintaining the pressure in the second chamber 151 at atmospheric pressure. Note that if the exhaust valve 1551 of the second chamber 151 is set to be in an open state at all times, the operation to open the exhaust valve 1551 after the package structure 10 has been transported to the second chamber 151 is unnecessary.

[0047] S32: The package structure 10 is rotated. Specifically, the control device 110 controls the second rotating device 153 to rotate the second chuck 152, thereby rotating the package structure 10. In S32, the rotational speed of the package structure 10 is less than 1000 r / min, for example, in the range of 200 r / min to 800 r / min. Preferably, in S32, the package structure 10 rotates at a sequentially increasing rotational speed. For example, the package structure 10 first rotates at 300 r / min for a certain period of time, and then rotates at 500 r / min for a certain period of time.

[0048] S33: While the package structure 10 is rotating, deionized water is sprayed onto the package structure 10 to perform atmospheric pressure washing. Specifically, the control device 110 controls the nozzle 1543 to spray deionized water onto the rotating package structure 10. In one embodiment, the temperature of the deionized water is approximately 25°C.

[0049] After the package structure 10 completes the atmospheric pressure washing process S3, it is necessary to perform a drying process S4 on the package structure 10. The drying process S41 is described below.

[0050] S41: The package structure 10 is rotated to increase its rotational speed. Specifically, the control device 110 controls the second rotating device 153 to rotate the second chuck 152, thereby rotating the package structure 10. In S41, the rotational speed of the package structure 10 is 1000 r / min or more, for example, in the range of 1000 r / min to 3000 r / min, preferably in the range of 1500 r / min to 2000 r / min. S42: While the package structure 10 is rotating, the package structure 10 is purged with a drying gas to dry it. The drying gas may be nitrogen or an inert gas. Specifically, the control device 110 controls the nozzle 1543 to purge the rotating package structure 10 with a drying gas.

[0051] [Embodiment 2] Please refer to Figure 7. This embodiment provides a cleaning device 200 for a package structure. Compared with Embodiment 1, this embodiment differs in that the second cleaning module 150 is located closer to the front end module 120.

[0052] [Embodiment 3] Please refer to Figure 8. This embodiment provides a cleaning device 300 for package structures. Compared with Embodiment 1, this embodiment differs in that the cleaning device 300 comprises only a first cleaning module 140 and does not include a second cleaning module 150.

[0053] The structure of the first cleaning module 140 is basically the same as in Embodiment 1. The differences will be explained below with reference to Figure 3. In Embodiment 3, the first fluid supply device 144 is used not only to spray cleaning liquid onto the package structure 10, but also to spray drying gas onto the surface of the package structure 10. Correspondingly, the supply source 1441 is used to store the cleaning liquid and drying gas. Secondly, in addition to the depressurization pipe L1 and the vacuum release pipe L2, the first pressure regulating device 145 is also provided with atmospheric pressure pipe L3. The atmospheric pressure pipe L3 is connected to the first chamber 141, and an exhaust valve 1453 is provided on the atmospheric pressure pipe L3. The control device 110 can control and open the exhaust valve 1453, thereby discharging the gas in the first chamber 141 to the outside environment and maintaining the pressure in the first chamber 141 at atmospheric pressure.

[0054] Figure 9 shows a cleaning method for the package structure 10 performed using the cleaning device 300. This cleaning method includes only a negative pressure cleaning step S01, an atmospheric pressure cleaning step S03, and a drying step S04, and the negative pressure cleaning step S01, atmospheric pressure cleaning step S03, and drying step S04 are substantially the same as the negative pressure cleaning step S1, atmospheric pressure cleaning step S3, and drying step S4 of Embodiment 1, respectively. The difference is that in Embodiment 3, the negative pressure cleaning step S01, atmospheric pressure cleaning step S03, and drying step S04 are all performed in the first cleaning module 140.

[0055] For a description of how to perform the negative pressure cleaning process S01 on the package structure 10 via the first cleaning module 140, please refer to the description of the negative pressure cleaning process S1 in Embodiment 1. Further details are not provided here.

[0056] In Embodiment 3, the control device 110 controls the first cleaning module 140 to perform a negative pressure cleaning process S01 on the package structure 10, and then the control device 110 continues to control the first cleaning module 140 to perform an atmospheric pressure cleaning process S03 on the package structure 10. According to Figure 3, the atmospheric pressure cleaning process S03 is as follows: The control device 110 controls and opens the exhaust valve 1453 to maintain the pressure in the first chamber 141 at atmospheric pressure, and at the same time controls the first chuck 142 to rotate the package structure 10, and controls the nozzle 1443 to spray deionized water onto the rotating package structure 10, thereby performing atmospheric pressure cleaning on the package structure 10.

[0057] The control device 110 controls the first washing module 140 to perform the atmospheric pressure washing process S03 on the package structure 10, and then the control device 110 continues to control the first washing module 140 to perform the drying process S04 on the package structure 10. As shown in Figure 3, the drying process S04 is as follows: The control device 110 controls the first rotating device 143 to rotate the first chuck 142, thereby rotating the package structure 10. Furthermore, the control device 110 controls the nozzle 1443 to spray drying gas onto the package structure 10, drying the surface of the package structure 10. It should be noted that during the drying process S04, the control device 110 controls the exhaust valve 1453 to be open, so the first chamber 141 is maintained at atmospheric pressure.

[0058] In the drying process S04, the rotational speed of the package structure 10 is faster than the rotational speed of the package structure 10 in the negative pressure washing process S01 and the atmospheric pressure washing process S03. The rotational speed is increased and drying gas is sprayed to quickly dry the package structure 10. Specifically, in the drying process S04, the rotational speed of the package structure 10 is 1000 r / min or more, for example, in the range of 1000 r / min to 3000 r / min, preferably in the range of 1500 r / min to 2000 r / min.

[0059] It should be noted that in the above cleaning method, if the cleaning effect of the package structure 10 by the negative pressure cleaning step S01 satisfies the process requirements, the normal pressure cleaning step S03 can be omitted.

[0060] Furthermore, the parameter settings related to the atmospheric pressure washing process S3 and the drying process S4 in Embodiment 1 are also applicable to Embodiment 3, and their details are not described here.

[0061] The embodiments described above are merely illustrative of the principles and effects of the present invention and do not limit it. Those skilled in the art can modify or alter the embodiments without departing from the spirit and scope of the invention. Therefore, all equivalent changes or modifications made by a person with ordinary skill in the art without departing from the spirit and technical idea disclosed herein are still included within the scope of the claims.

Claims

1. A method for cleaning a package structure, which includes a negative pressure cleaning step, wherein the negative pressure cleaning step is A step of adjusting the pressure inside the chamber in which the package structure is placed to a predetermined vacuum pressure, A step of rotating the package structure, The process includes spraying a cleaning solution at a predetermined temperature onto the rotating package structure and performing negative pressure cleaning on the package structure, A method for cleaning a package structure, characterized in that the predetermined vacuum pressure is higher than the vaporization pressure of the cleaning solution at the predetermined temperature.

2. The method for cleaning a package structure according to claim 1, characterized in that the predetermined vacuum pressure is in the range of 25 Torr to 150 Torr.

3. The method for cleaning a package structure according to claim 1, characterized in that the predetermined temperature is in the range of 40°C to 60°C.

4. The cleaning method for a package structure according to claim 1, characterized in that the cleaning solution has a predetermined spray pressure, and the predetermined spray pressure is in the range of 10 psi to 70 psi.

5. The method for cleaning a package structure according to claim 1, characterized in that during the negative pressure cleaning, the package structure is rotated alternately at a first rotational speed and a second rotational speed, wherein the first rotational speed is faster than the second rotational speed.

6. The method for cleaning a package structure according to claim 1, characterized in that the cleaning solution contains at least one of a saponifying agent-containing solution or deionized water.

7. The negative pressure cleaning step is followed by a drying step, the drying step being: A step of rotating the package structure, A method for cleaning a package structure according to claim 1, characterized by comprising the step of purging a drying gas onto the rotating package structure to dry the package structure.

8. Between the negative pressure cleaning step and the drying step, a normal pressure cleaning step is further included, and the normal pressure cleaning step is A step of adjusting the pressure inside the chamber in which the package structure is placed to atmospheric pressure, A step of rotating the package structure, A method for cleaning a package structure according to claim 7, characterized by comprising the steps of spraying deionized water onto the rotating package structure and performing atmospheric pressure cleaning on the package structure.

9. When the negative pressure cleaning step and the atmospheric pressure cleaning step are performed on the package structure in different chambers, the process further includes a pre-drying step performed in the same chamber as the negative pressure cleaning step between the negative pressure cleaning step and the atmospheric pressure cleaning step, wherein the pre-drying step is The process includes stopping the spraying of the cleaning solution onto the package structure and rotating the package structure, The method for cleaning a package structure according to claim 8, characterized in that after the pre-drying of the package structure is completed, the surface of the package structure is covered with a liquid film.

10. A cleaning apparatus for a package structure comprising a control device and at least one first cleaning module, wherein the first cleaning module is The first chamber and A first chuck is placed inside the first chamber and holds the package structure to be cleaned, A first rotating device for rotating the first chuck, A first fluid supply device for spraying at least one of a cleaning liquid or a drying gas onto the surface of the package structure, A first pressure regulating device that adjusts the pressure inside the first chamber, It includes a first temperature control device that adjusts the temperature of the cleaning fluid supplied to the first fluid supply device. A cleaning apparatus for a package structure, characterized in that the control device is configured to control the first cleaning module to perform the cleaning method for the package structure described in any one of claims 1 to 8.

11. The system further comprises at least one second cleaning module, the second cleaning module being: The second chamber and A second chuck is provided within the second chamber for holding the package structure to be cleaned, A second rotating device that drives the second chuck to rotate, A second fluid supply device for spraying at least one of deionized water or dry gas onto the surface of the package structure, The system includes a second pressure regulating device for adjusting the pressure within the second chamber, The packaging structure cleaning apparatus according to claim 10, further characterized in that the control device controls the first cleaning module to execute the negative pressure cleaning step and pre-drying step on the packaging structure based on the cleaning method for the packaging structure described in claim 9, and controls the second cleaning module to execute the normal pressure cleaning step and drying step on the packaging structure.

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