Photoelectric functional film, light-transmitting assembly and method for manufacturing the same, and vehicle

Abstract

The present invention provides a photoelectric functional film, a light-transmitting assembly, a method for manufacturing the same, and a vehicle. The photoelectric functional film comprises a laminated photoelectric functional layer (33), a first conductive layer (34), and a first substrate layer (35), the first conductive layer consisting of two or more electrically insulated compartments, each of which is connected to a corresponding electrode. Furthermore, the present invention provides a light-transmitting assembly including the photoelectric functional film, a method for manufacturing the same, and a vehicle including the light-transmitting assembly. The photoelectric functional film can be dimmed in a controllable manner for each compartment, has a simplified structure, is small in volume, and is easy to mass-produce.

Description

Technical Field

[0001] This application claims priority based on a Chinese patent application filed with the China National Intellectual Property Administration on April 26, 2023, with an application number of 202310463861.2 and an invention title of "Optoelectronic Functional Film, Light Transmissive Assembly, Method for Producing the Same, and Vehicle", and all its contents are incorporated herein by reference.

[0002] The present invention relates to an optoelectronic functional film, a light transmissive assembly, a method for producing the same, and a vehicle.

Background Art

[0003] Currently, PDLC technology has begun to be widely used as a new technology in automobiles. However, in its applications, PDLC faces several technical problems that need to be solved or improved. One of these technical problems relates to the manufacture of PDLC electrodes. Conventional PDLC film sheets are composed of two layers of PET with a conductive layer such as ITO and a liquid crystal polymer, and the PET having ITO on both sides is configured such that electrodes of the optoelectronic functional film are installed, so the manufacture of the electrodes is relatively complicated.

[0004] Another technical challenge is the packaging of the film sheet. PDLC films are typically packaged with PVB adhesive films, but small molecules in the PVB adhesive film can penetrate through gaps in the film sheet into the central functional layer, resulting in the loss of the light-regulating function of the functional layer in the penetration areas. Currently, there are mainly two solutions. The first solution is to replace PVB with EVA. EVA is less toxic to PDLC film sheets than PVB. However, glass using only EVA has inferior mechanical properties in some aspects compared to glass using PVB, and colored EVA for product coloring cannot be mass-produced. The second solution is to design the film sheet to prevent penetration. The basic idea of ​​the currently adopted method is to seal the gaps around the edges of the film sheet with a specific adhesive, blocking the pathways through which PVB small molecules can diffuse into the film. This method does not require the replacement of the PVB adhesive film used and does not affect its mechanical properties. However, edge sealing with adhesive requires a certain degree of depth processing and is time-consuming. Furthermore, conventional PDLC film sheets typically employ a method of half-cutting by offsetting the upper and lower substrates before connecting the electrodes (as shown in Figure 14), which necessitates double-sided adhesive processing during edge sealing, making the process complex. [Overview of the Initiative]

[0005] The present invention aims to provide a photoelectric functional film, a light-transmitting assembly, a method for manufacturing the same, and a vehicle in order to solve the above problems. The photoelectric functional film can achieve dimming that can be controlled for each section, has a simplified structure, a small volume, and a low difficulty in the manufacturing process.

[0006] To achieve the above objective, the present invention provides a photoelectric functional film comprising a laminated photoelectric functional layer, a first conductive layer, and a first substrate layer, wherein the first conductive layer consists of two or more electrically insulated compartments, and each electrically compartment is connected to a corresponding electrode.

[0007] In the above-described photoelectric functional film, the first conductive layer may be provided between the first substrate layer and the photoelectric functional layer, on the side of the photoelectric functional layer opposite to the first substrate layer, or on the side of the first substrate layer opposite to the photoelectric functional layer.

[0008] Conventional photoelectric functional films typically have two conductive layers, and the operating state of the entire photoelectric functional film is controlled by simultaneously energizing or disconnecting the two conductive layers. The photoelectric functional film of the present invention, however, can achieve controllable dimming in different regions of the photoelectric functional film by providing only one (or common) conductive layer (i.e., a first conductive layer). Specifically, in the present invention, the first conductive layer is divided into a plurality of electrically insulated compartments, and electrodes are individually drawn out for each electrical compartment. This allows the photoelectric functional layer region covered by the orthographic projection of each electrical compartment onto the photoelectric functional layer to be formed into corresponding, mutually independent optical compartments. By energizing two or more selected electrodes and electrical compartments, the optical compartments corresponding to the energized electrical compartments can be activated, while the optical compartments corresponding to other electrically unenergized electrical compartments remain in an actively inactive state, each optical compartment remaining independent of the others. This enables controllable dimming for each section of the photoelectric functional film.

[0009] According to specific embodiments of the present invention, the photoelectric functional layer is for performing photoelectric functions, and there is no need to provide any members electrically connected to the photoelectric functional layer. The voltage necessary for the operation of the photoelectric functional layer can be generated by the electrical connection between each electrical compartment in the conductive layer and the power supply. In some specific embodiments, the orthographic projection area of ​​the photoelectric functional layer onto the conductive layer may be approximately equivalent to the area of ​​the conductive layer.

[0010] According to a specific embodiment of the present invention, the operating state of each optical compartment in the photoelectric functional layer is independently controlled by the corresponding electrical compartments located on the same plane (forming the first conductive layer) and on the same side within the photoelectric functional layer. As shown in Figure 5, when the optical compartments in the photoelectric functional layer are in operation, the positive and negative electrodes of the external power supply are both connected to the first conductive layer.

[0011] In the photoelectric functional film described above, the horizontal distance between adjacent electrical compartments in the first conductive layer may be controlled to be between 10 μm and 1 mm, and further controlled to be between 10 μm and 100 μm. In the present invention, "is in" refers to a range that includes two endpoints. For example, the horizontal distance between adjacent electrical compartments may be specific values ​​such as 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, and any two of the above specific values ​​may be endpoints.

[0012] In the photoelectric functional film described above, the material of the first conductive layer may be a metallic conductor (including metals, metal oxides, etc.) or a non-metallic conductor. Here, the metallic conductor may include TCO (transparent conductive metal oxide) and / or silver, and the non-metallic conductor may be a carbon material, such as a carbon nanomaterial (carbon nanotube), graphite, etc. In some specific embodiments, the material of the first conductive layer specifically includes one or more combinations of TCO, silver, and carbon materials, and the first conductive layer may be a TCO layer, a nanosilver layer, a carbon layer (e.g., a graphite layer, a carbon nanotube layer), etc.

[0013] In the first conductive layer described above, the TCO may include one or more combinations of ITO (indium tin oxide), AZO (aluminum-doped tin oxide), and FTO (fluorine-doped tin oxide), and the silver may be nanosilver, for example, nanosilver wire. Then, the first conductive layer may include one or more combinations of ITO layer, AZO layer, FTO layer, nanosilver layer, and carbon layer.

[0014] In the above-described photoelectric functional film, the material of the photoelectric functional layer may include, but is not limited to, one or more combinations of LC (dye liquid crystal), PDLC (polymer dispersed liquid crystal), GHLC (guest-host liquid crystal), PNLC (polymer network liquid crystal), PSLC (polymer stabilized liquid crystal), PILC (pixel-separated liquid crystal), EC (electrochromic device), and SPD (suspended particles).

[0015] In the photoelectric functional film described above, at least one electrode is connected to each electrical compartment. The electrodes connected to each electrical compartment may be located on the same side, opposite side, and / or adjacent side in the conductive layer. In some specific embodiments, in order to simplify the manufacturing process of the photoelectric functional film, all electrodes connected to the first conductive layer may be located on the same side in the photoelectric functional layer (as shown in Figure 5).

[0016] In the above-described photoelectric functional film, the orthographic projections of the photoelectric functional layer and the first conductive layer onto the first substrate layer may each be located within the surface area of ​​the first substrate layer. In this case, the area of ​​the first substrate layer is greater than or equal to the area of ​​the photoelectric functional layer and the area of ​​the first conductive layer, respectively.

[0017] Furthermore, the area of ​​the photoelectric functional layer, the area of ​​the first conductive layer, and the area of ​​the first substrate layer may be equal or approximately equivalent.

[0018] Alternatively, the orthographic projections of the photoelectric functional layer and the first conductive layer onto the first substrate layer may each be located within the edge of the first substrate layer, in which case the area of ​​the first substrate layer will be larger than the area of ​​the photoelectric functional layer and the area of ​​the first conductive layer, respectively. In this case, the side surface of the photoelectric functional film will have a stepped structure, which contributes to simplifying the packaging and lamination process of the photoelectric functional film.

[0019] According to a specific embodiment of the present invention, the photoelectric functional film may further include a second substrate layer, and the first substrate layer and the second substrate layer are located on opposite sides of the photoelectric functional layer.

[0020] In the above-described photoelectric functional film, the orthographic projection of the second substrate layer onto the first substrate layer may be located within the edge of the first substrate layer. In this case, the area of ​​the second substrate layer will be smaller than the area of ​​the first substrate layer.

[0021] In the photoelectric functional film described above, the minimum distance from each point on the edge of the orthographic projection of the second substrate layer onto the first substrate layer to the edge of the first substrate layer in the horizontal direction may be between 5 mm and 30 mm. For example, this minimum distance may be a specific value such as 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, 15 mm, 20 mm, 25 mm, or 30 mm, or a range ending at any two of the above specific values.

[0022] In the above-described photoelectric functional film, the orthographic projection of the photoelectric functional layer onto the second substrate layer may be located within the surface area of ​​the second substrate layer. In this case, the area of ​​the photoelectric functional layer may be less than or equal to the area of ​​the second substrate layer.

[0023] In the above-described photoelectric functional film, the orthographic projection of the photoelectric functional layer onto the first conductive layer may be located within the surface area of ​​the first conductive layer, in which case the area of ​​the photoelectric functional layer may be less than or equal to the area of ​​the first conductive layer. Furthermore, the orthographic projection of the photoelectric functional layer onto the first conductive layer may be located within the edge of the conductive layer, in which case the area of ​​the photoelectric functional layer becomes smaller than the area of ​​the first conductive layer.

[0024] According to a specific embodiment of the present invention, when the optoelectronic functional film further includes a conductive layer other than the first conductive layer, the conductive layer other than the first conductive layer may or may not be connected to an external electrode according to actual needs.

[0025] In the optoelectronic functional film, the optoelectronic functional film may further include a second conductive layer, and the second conductive layer and the first conductive layer may be respectively located on opposite sides of the optoelectronic functional layer.

[0026] In the optoelectronic functional film, the second conductive layer can form an induced electric field that covers the optoelectronic functional layer together with the first conductive layer in an energized state.

[0027] In the optoelectronic functional film, the second conductive layer may or may not be connected to an electrode (directly or indirectly). When the second conductive layer is not connected to an electrode, the second conductive layer is also used to realize functions that do not require energization, such as anti-fogging and heat insulation. When the second conductive layer is connected to an electrode, a direct current is passed through the second conductive layer via the electrode simultaneously with or before the operation of the optoelectronic functional layer, and the energized second conductive layer is heated to heat the optoelectronic functional layer, thereby improving the operation response speed of the optoelectronic functional layer, particularly the operation response speed of the SPD-based optoelectronic functional layer in a low-temperature environment. Similarly, by energizing the electrode of the first conductive layer and heating the optoelectronic functional layer to raise its temperature, the operation response speed of the optoelectronic functional layer in a low-temperature environment can also be improved. The optoelectronic functional film provided by the present invention can simultaneously perform functions such as dimming, heating, and other functions that do not require energization for each partition.

[0028] In some specific embodiments, the material of the second conductive layer may be a metal conductor, for example, it may include one or a combination of two or more of an ITO layer, an FTO layer, a Low-E film, an infrared reflection film, a radiation protection film, a carbon layer, etc., or it may be a non-metal conductor, for example, a carbon material such as a carbon nanomaterial or graphite.

[0029] In the above optoelectronic functional film, the orthographic projection of the second conductive layer onto the first base layer may be located within the edge of the first base layer. In this case, the area of the second conductive layer becomes smaller than that of the first base layer.

[0030] According to a specific embodiment of the present invention, a layer structure made of an insulating material, that is, an insulating layer, may be further provided in the optoelectronic functional film. The insulating layer may be located between the first conductive layer and the optoelectronic functional layer, or between the second conductive layer and the optoelectronic functional layer. When a large voltage is applied to the first conductive layer or the second conductive layer, electrical breakdown can be prevented by the insulating layer. Similarly, between the first conductive layer and the optoelectronic functional layer, and / or between the second conductive layer and the optoelectronic functional layer, a layer structure made of a conductive material may be provided as another conductive layer other than the first conductive layer and the second conductive layer.

[0031] Compared with conventional optoelectronic functional films such as dimming films that require at least two conductive layers to achieve dimming, the optoelectronic functional film provided by the present invention can achieve controllable dimming by providing only one (or common) conductive layer. The optoelectronic functional film of the present invention has a simpler structure, lower processing difficulty, and a more simplified process.

[0032] The present invention also includes a first light-transmitting plate, an adhesive layer, a second light-transmitting plate, and an optoelectronic functional film including the above optoelectronic functional film provided by the present invention. The optoelectronic functional film is located between the first light-transmitting plate and the second light-transmitting plate, and the adhesive layer is interposed between the first light-transmitting plate and the optoelectronic functional film, and between the optoelectronic functional film and the second light-transmitting plate, to provide a light-transmissive assembly.

[0033] In the above light-transmissive assembly, the material of the adhesive layer may include PVB and / or EVA.

[0034] In a specific embodiment of the present invention, when the areas of the photoelectric functional layer, the first conductive layer, and the first substrate layer in the photoelectric functional film are equal or equivalent, an adhesive layer having the same thickness as the photoelectric functional film may be further interposed on the side surface of the photoelectric functional film in the light-transmitting assembly so as to fix the position of the photoelectric functional film in the light-transmitting assembly.

[0035] In a specific embodiment of the present invention, if the orthographic projections of the photoelectric functional layer and the first conductive layer in the photoelectric functional film onto the first substrate layer are located within the edge of the first substrate layer (i.e., the area of ​​the first substrate layer is larger than the area of ​​the photoelectric functional layer and the first conductive layer), the adhesive layer in the light-transmitting assembly may further include a first adhesive layer interposed between the first light-transmitting plate and the first substrate layer of the photoelectric functional film, and a second adhesive layer interposed between the first substrate layer of the photoelectric functional film and the second light-transmitting plate.

[0036] In the above light-transmitting assembly, the first adhesive layer may include an EVA layer, and the second adhesive layer may include a PVB layer and / or an EVA layer. By including an EVA layer in the first adhesive layer, the toxicity to the photoelectric functional layer in the photoelectric functional film can be reduced, contributing to the stable performance of the photoelectric functional layer.

[0037] The present invention also provides a method for manufacturing the above-mentioned light-transmitting assembly, which includes sequentially stacking a first light-transmitting plate, a raw adhesive film for the adhesive layer, a photoelectric functional film, and a second light-transmitting plate, raising the temperature to form them, and laminating them to obtain a dimmable glass.

[0038] According to a specific embodiment of the present invention, when the areas of the photoelectric functional layer, the first conductive layer, and the first substrate layer in the photoelectric functional film are equal, the above manufacturing method may further include providing an adhesive film on the side surface of the photoelectric functional film after stacking the raw materials of each layer in order and before raising the temperature to form it. Specifically, the adhesive film provided on the side surface of the photoelectric functional film may be a raw adhesive film having a thickness equal to or corresponding to that of the photoelectric functional film.

[0039] According to a specific embodiment of the present invention, if the orthographic projections of the photoelectric functional layer and the first conductive layer in the photoelectric functional film onto the first substrate layer are located within the edge of the first substrate layer, the manufacturing method may include stacking a first light-transmitting plate, a raw adhesive film for the first adhesive layer, a photoelectric functional film, a raw adhesive film for the second adhesive layer, and a second light-transmitting plate in order, raising the temperature to form and laminate them to obtain the light-transmitting assembly. Here, since a stepped structure is formed on the side surface of the photoelectric functional film, the raw adhesive films for the first adhesive layer and the second adhesive layer melt simultaneously from both sides of the photoelectric functional film and can be interposed between the first light-transmitting plate and the photoelectric functional film, and between the photoelectric functional film and the second light-transmitting plate, respectively. Therefore, the manufacturing method does not necessarily include providing an adhesive film on the side surface of the photoelectric functional film.

[0040] The present invention also provides a vehicle comprising glass including the above-mentioned light-transmitting assembly.

[0041] The beneficial effects of the present invention include at least the following: 1. The photoelectric functional film provided by the present invention can achieve dimming controllable for each section by providing only one conductive layer, and the structure of the photoelectric functional film is simplified, resulting in a smaller volume and lower cost. 2. In the photoelectric functional film provided by the present invention, all electrodes are connected to the same conductive layer (first conductive layer) and may also be located on the same side within the photoelectric functional film. This significantly reduces the requirements for electrode manufacturing equipment, lowers the difficulty and cost of the electrode processing process, and dramatically improves the yield of the photoelectric functional film. 3. The light-transmitting assembly provided by the present invention can effectively prevent the photoelectric functional film from penetrating into the toxic adhesive film during use, especially under high-temperature conditions, which is advantageous for maintaining the photomodulation function of the photoelectric functional film. Furthermore, the light-transmitting assembly has high adhesive strength between the layers, high mechanical properties and impact resistance, and good aging resistance. 4. The light-transmitting assembly provided by the present invention does not require the application of an adhesive film to the side surface of the photoelectric functional film during the manufacturing process, thus reducing the difficulty of processing, simplifying the process, and saving on material costs. [Brief explanation of the drawing]

[0042] [Figure 1] This is a schematic diagram of the structure of the photoelectric functional film according to Example 1. [Figure 2] This is a schematic diagram of the structure of the photoelectric functional film according to Example 1. [Figure 3] This is a schematic diagram of the structure of the photoelectric functional film according to Example 1. [Figure 4] This is a schematic diagram of the structure of the photoelectric functional film according to Example 1. [Figure 5] This is a schematic diagram of the structure of the first conductive layer and electrode in the photoelectric functional film according to Example 1. [Figure 6] This is a schematic diagram of the structure of the first conductive layer and the photoelectric functional layer in the photoelectric functional film according to Example 1. [Figure 7] This is a schematic diagram of the electrode extraction method from the first conductive layer in the photoelectric functional film according to Example 1. [Figure 8] This is a photograph of the photoelectric functional film according to Example 1. [Figure 9] This is an actual photograph of the photoelectric functional film in operation according to Example 1. [Figure 10] This is a schematic diagram of the structure of the photoelectric functional film according to Example 2. [Figure 11] This is a schematic diagram of the structure of the photoelectric functional film according to Example 3. [Figure 12] This is a schematic diagram of the structure of the photoelectric functional film according to Example 3. [Figure 13] This is a schematic diagram of the structure of the light-transmitting assembly according to Example 4. [Figure 14] This is a schematic diagram of the structure of a conventional photoelectric functional film. [Modes for carrying out the invention]

[0043] In order to more clearly understand the constituent elements, objectives, and beneficial effects of the present invention, the technical design of the present invention will be described in detail below, but this should not be understood as limiting the scope of the invention's applicability.

[0044] In this invention, directions or positional relationships indicated by terms such as "up," "down," and "horizontal" are based on the directions or positional relationships shown in the drawings and are merely for explanatory convenience and simplification of the invention. They do not indicate or imply that the shown devices or elements have a specific direction or must be configured and operated in a specific direction, and should not be understood as limiting the invention. Terms such as "first" and "second" are used solely for explanatory purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of constituent elements shown. Thus, constituent elements limited by "first," "second," etc., may explicitly or implicitly include one or more such constituent elements.

[0045] In this invention, orthographic projection refers to projection along the thickness direction of the photoelectric functional film.

[0046] In the present invention, the orthographic projection of A onto B being located within the range of the surface of B means that the orthographic projection of A does not extend beyond the range of the surface of B, and that the orthographic projection of A can be completely located inside the surface of B, in which case none of the edges of the orthographic projection of A overlap with the edges of B, or at least some of the edges of the orthographic projection of A overlap with some of the edges of B.

[0047] In this invention, the orthographic projection of A onto B being located within the edge of B means that the orthographic projection of A is completely located inside the surface of B, and none of the edges of the orthographic projection of A overlap with the edges of B.

[0048] The drawings of the present invention introduce a three-dimensional coordinate system xyz in which the direction from the first substrate layer to the second substrate layer is defined as the direction in which the z-axis coordinate increases, the plane on which the photoelectric functional layer exists is defined as the xy-plane formed by the x-axis and y-axis, and the direction in which the electrodes are extracted is defined as the direction in which the y-axis coordinate increases.

[0049] (Example 1) This embodiment provides a photoelectric functional film comprising a second substrate layer 31, a second conductive layer 32, a photoelectric functional layer 33, a first conductive layer 34, and a first substrate layer 35, which are stacked and installed as shown in Figures 1 to 4.

[0050] The photoelectric functional layer 33 is located between the second substrate layer 31 and the first substrate layer 35, while the second conductive layer 32 and the first conductive layer 34 are located on opposite sides of the photoelectric functional layer 33.

[0051] The photoelectric functional layer 33 is for realizing photoelectric functions, and specifically, it may be a photoelectric functional film that operates with an AC voltage, such as a PDLC film or an SPD film.

[0052] The material of the first conductive layer 34 is one or more combinations of ITO, FTO, AZO, nanosilver, carbon nanomaterials, graphite, etc., where the sheet resistance of ITO and FTO is 100Ω / □ to 300Ω / □.

[0053] The first conductive layer 34 has (N-1) etching lines 340 formed on it by an etching process, and the non-conductive etching lines 340 divide the first conductive layer into N (N≧2) electrically insulated compartments. The number of electrically insulated compartments in the first conductive layer can be adjusted according to actual requirements. For example, when the first conductive layer 34 has four electrically insulated compartments, as shown in Figure 5, the first conductive layer 34 in this embodiment has three parallel etching lines 340, and the etching lines 340 divide the first conductive layer 34 into four electrically insulated compartments. The first conductive layer 34 is divided into a first electrically insulated compartment 341, a second electrically insulated compartment 342, a third electrically insulated compartment 343, and a fourth electrically insulated compartment 344, which are arranged in the horizontal direction (perpendicular to the thickness direction of the photoelectric functional film). The horizontal distance between two adjacent electrically insulated compartments corresponds to the width of the etching line 340, which is 10 to 100 μm in this embodiment.

[0054] Each electrical compartment in the first conductive layer 34 is provided with an external connection region 3400 that can serve as an electrode or for drawing out an electrode. The position of the external connection region 3400 in each electrical compartment can be adjusted as needed and may be located on the same side, opposite side, and / or adjacent side in the first conductive layer 34. When the external connection regions 3400 in each electrical compartment are located on the same side in the first conductive layer 34, drawing out the electrodes becomes convenient and the manufacture of common electrodes also becomes convenient. In some embodiments, the external connection region 3400 may be a region in the first conductive layer 34 where each electrical compartment protrudes beyond the edge of the photoelectric functional layer 33 to facilitate electrode drawing out.

[0055] In this embodiment, at least one electrode is connected to each external connection region 3400 of each electrical compartment in the first conductive layer 34. Specifically, the first electrode 361 is connected to the first electrical compartment 341, the second electrode 362 to the second electrical compartment 342, the third electrode 363 to the third electrical compartment 343, and the fourth electrode 364 to the fourth electrical compartment 344. The first electrode 361, the second electrode 362, the third electrode 363, and the fourth electrode 364 may be located on the same side, opposite sides, and / or adjacent sides within the first conductive layer 34. Figure 5 shows the case where the electrodes are located on the same side within the first conductive layer 34.

[0056] The material of the second conductive layer 32 includes metallic conductors and / or non-metallic conductors, and specifically may be ITO, FTO, Low-E, silver-containing plating films (double silver film, triple silver film, etc.), carbon materials (carbon nanomaterials, graphite), etc. When the first conductive layer 34 is energized (generally with alternating current), the second conductive layer 32, together with the first conductive layer 34, can form an induced electric field that covers at least a portion of the photoelectric functional layer 33, thereby activating the optical section of the photoelectric functional layer 33 located within the induced electric field.

[0057] Furthermore, electrodes may be connected to the second conductive layer 32. When the photoelectric functional film operates, a direct current flows through the electrodes to the second conductive layer 32, and the second conductive layer 32 heats the photoelectric functional layer 33, thereby improving the operating response speed of the photoelectric functional layer 33 in low-temperature environments.

[0058] Alternatively, the second conductive layer 32 may be used to realize other functions that do not require current flow, such as anti-fogging or heat insulation, in which case electrodes do not need to be connected to the second conductive layer 32.

[0059] In this embodiment, the second conductive layer 32 and the first conductive layer 34 may each be in direct contact with the photoelectric functional layer 33, and the second conductive layer 32 may have a structure made of another conductive or insulating material, such as a transparent substrate or another conductive layer, interposed between it and the photoelectric functional layer 33. The first conductive layer 34 may be in direct contact with the photoelectric functional layer 33, or a structure made of another conductive or insulating material, such as a transparent substrate or another conductive layer, interposed between it and the photoelectric functional layer 33, and the first conductive layer 34 may have a corresponding conductive layer on the opposite side of the photoelectric functional layer 33.

[0060] As shown in Figure 1, the first conductive layer 34 and the second conductive layer 32 are in direct contact with the photoelectric functional layer 33. As shown in Figure 2, the first conductive layer 34 is in direct contact with the photoelectric functional layer 33, but the second substrate layer 31 is interposed between the second conductive layer 32 and the photoelectric functional layer 33. As shown in Figure 3, the second conductive layer 32 is in direct contact with the photoelectric functional layer 33, but the first substrate layer 35 is interposed between the first conductive layer 34 and the photoelectric functional layer 33. As shown in Figure 4, the second substrate layer 31 is interposed between the second conductive layer 32 and the photoelectric functional layer 33, and the first substrate layer 35 is interposed between the first conductive layer 34 and the photoelectric functional layer 33. It should be understood that the positions of the second conductive layer 32 and the first conductive layer 34 in Figures 1 to 4 are interchangeable.

[0061] In this case, compared to the cases shown in Figures 1 to 3, in the case shown in Figure 4 and in the case where the positions of the second conductive layer 32 and the first conductive layer 34 in Figure 4 are swapped, the second conductive layer 32 and the photoelectric functional layer 33 are each located on the surface exposed to the outside of the photoelectric functional film. This allows the electrodes to be placed on the surface of the photochromic layer, which not only reduces the difficulty of manufacturing the electrodes but also allows for better control of the etching status of the first conductive layer 34, reduces the difficulty of the etching process, maintains the cleanliness of the first conductive layer 34 after etching, and contributes to guaranteeing etching quality.

[0062] In the photoelectric functional layer 33, the positions corresponding to each electrical compartment in the first conductive layer 34 are divided into optical compartments. Taking the structure of the photoelectric functional film shown in Figures 1 and 2 as an example, the photoelectric functional layer 33 is divided into the first optical compartment 331, the second optical compartment 332, the third optical compartment 333 and the fourth optical compartment 334 shown in Figure 6, where the first optical compartment 331 corresponds to the region where the first electrical compartment 341 in the first conductive layer 34 is orthographically projected onto the photoelectric functional layer 33 and covers the photoelectric functional layer 33, and the second optical compartment 332 corresponds to the first conductive layer 3 In Figures 4, the second electrical compartment 342 corresponds to the region that is orthographically projected onto the photoelectric functional layer 33 and covers the photoelectric functional layer 33; the third optical compartment 333 corresponds to the region that is orthographically projected onto the photoelectric functional layer 33 and covers the photoelectric functional layer 33; and the fourth optical compartment 334 corresponds to the region that is orthographically projected onto the photoelectric functional layer 33 and covers the photoelectric functional layer 33. In the structure of the photoelectric functional film shown in Figures 3 and 4, the first substrate layer 35 is interposed between the photoelectric functional layer 33 and the first conductive layer 34, and the compartmentalization of the photoelectric functional layer 33 is the same as that shown in Figure 6.

[0063] In the present invention, the areas of the second substrate layer 31, the second conductive layer 32, the photoelectric functional layer 33, the first conductive layer 34, and the first substrate layer 35 may be equal, and the dimensions of each layer in the x and y planes are the same. In this case, the edges of the sides of each layer are approximately flush, and this case is referred to as the Type A structure.

[0064] Alternatively, the area of ​​the first substrate layer 35 may be larger than the areas of the second substrate layer 31, the second conductive layer 32, the photoelectric functional layer 33, and the first conductive layer 34, causing the first substrate layer 35 to protrude outward relative to the other layer structures and forming a stepped structure on the side surface of the photoelectric functional film. That is, the orthographic projection of the second substrate layer 31, the second conductive layer 32, the photoelectric functional layer 33, and the first conductive layer 34 onto the first substrate layer 35 is located within the edge of the first substrate layer 35, and this case is referred to as type B structure.

[0065] For photoelectric functional films employing a Type A structure, when packaging, an adhesive film such as PVB or EVA can be used to fill the thickness of the photoelectric functional film with an adhesive film that is the same as or equivalent to the thickness of the photoelectric functional film in the thickness direction of the photoelectric functional film, thereby making the sides of the photoelectric functional film flush.

[0066] Compared to photoelectric functional film A having structure A, photoelectric functional film B having structure B allows for a further simplification of the lamination packaging process. During the packaging process, instead of filling the film thickness direction with adhesive, the top and bottom surfaces of photoelectric functional film B can be packaged with adhesive films. Furthermore, by designing a stepped structure, the adhesive films packaged on the top and bottom of photoelectric functional film B can be separated, preventing harmful adhesive molecules from entering the photoelectric functional layer of photoelectric functional film B.

[0067] In this embodiment, the photoelectric functional film employs a Type B structure, and the relative dimensions of each layer structure in the Type B structure are described below. The relative dimensional relationship between the second substrate layer 31, the second conductive layer 32, the photoelectric functional layer 33, the first conductive layer 34, and the first substrate layer 35 may be as follows.

[0068] The orthographic projection of the second substrate layer 31 onto the first substrate layer 35 lies within the edge of the first substrate layer 35. In this case, the area of ​​the second substrate layer 31 is smaller than the area of ​​the first substrate layer 35, and each edge of the orthographic projection of the second substrate layer 31 is contained within the surface of the first substrate layer 35 and does not overlap with the edge of the first substrate layer 35. Furthermore, in the horizontal plane (i.e., the xy plane), the minimum distance from each point on the edge of the orthographic projection of the second substrate layer 31 onto the first substrate layer 35 to the edge of the first substrate layer 35 is 5 to 30 mm.

[0069] The orthographic projections of the second conductive layer 32, the photoelectric functional layer 33, and the first conductive layer 34 onto the first substrate layer 35 are also located within the edge of the first substrate layer 35.

[0070] The orthographic projection of the photoelectric functional layer 33 onto the second substrate layer 31 is located within the surface area of ​​the second substrate layer 31, and the area of ​​the photoelectric functional layer 33 is less than or equal to the area of ​​the second substrate layer 31. Specifically, the area of ​​the photoelectric functional layer 33 is equal to the area of ​​the second substrate layer 31, and the edges of the orthographic projection of the photoelectric functional layer 33 onto the second substrate layer 31 overlap with the edges of the second substrate layer 31, or the area of ​​the photoelectric functional layer 33 is smaller than the area of ​​the second substrate layer 31, and none of the edges of the orthographic projection of the photoelectric functional layer 33 onto the second substrate layer 31 extend beyond the edges of the second substrate layer 31 (none of the edges of the orthographic projection may be located within the edges of the second substrate layer 31, or some of the edges of the orthographic projection may overlap with the edges of the second substrate layer 31, and the rest may be located within the edges of the second substrate layer 31). In this embodiment, the area of ​​the photoelectric functional layer 33 is equal to the area of ​​the second substrate layer 31.

[0071] The orthographic projection of the second conductive layer 32 onto the second substrate layer 31 is located within the surface area of ​​the second substrate layer 31, and the area of ​​the second conductive layer 32 is less than or equal to the area of ​​the second substrate layer 31.

[0072] The orthographic projection of the photoelectric functional layer 33 onto the second conductive layer 32 is located within the surface area of ​​the second conductive layer 32, and the area of ​​the photoelectric functional layer 33 is less than or equal to the area of ​​the second conductive layer 32.

[0073] The orthographic projection of the photoelectric functional layer 33 onto the first conductive layer 34 is located within the surface area of ​​the first conductive layer 34, and the area of ​​the photoelectric functional layer 33 is less than or equal to the area of ​​the first conductive layer 34; that is, none of the edges of the photoelectric functional layer 33 extend beyond the edges of the first conductive layer 34. In this embodiment, in order to facilitate electrode extraction, the area of ​​the photoelectric functional layer 33 may be smaller or slightly smaller than that of the first conductive layer 34.

[0074] As can be seen from the above, the area relationships between each layer are: photoelectric functional layer 33 ≤ second conductive layer 32 ≤ second substrate layer 31 < first substrate layer 35, and photoelectric functional layer 33 ≤ first conductive layer 34 < first substrate layer 35.

[0075] In the present invention, each electrode connected to the first conductive layer 34 may be a conductor or an FPC. The electrode lead-out method can be selected from the following methods.

[0076] 1. A conductive copper foil 42 is attached to the edge of the external connection area 3400 of each electrical compartment, and the external electrode 41 is fixed to the surface of the conductive copper foil 42, and the external electrode is pulled out.

[0077] Furthermore, optionally, the conductive copper foil 42 may be fixed to the external connection region 3400 using hardened silver paste 43. Specifically, as shown in Figure 7, a region of a predetermined width (1 / 5 to 4 / 5 of the electrode length, typically 5 to 10 mm) (i.e., the external connection region 3400) is selected on the edge of each electrical compartment and a silver paste with a thickness of 5 to 20 μm is applied. After drying, hardened silver paste 43 is formed, the conductive copper foil 42 is attached to the surface of the hardened silver paste 43, and the external electrode 41 is pulled out.

[0078] 2. After attaching the conductive adhesive copper tape to the edge (external connection area 3400) of the first conductive layer 34, the external electrodes are pulled out.

[0079] In the above method, the electrodes can be protected by fixing them with the high-temperature tape 44.

[0080] To clearly illustrate each structure, there are gaps between the external electrode 41, conductive copper foil 42, hardened silver paste 43, and high-temperature tape 44 in Figure 7. However, in actual conditions, it should be understood that there are no gaps between the above structures as shown in Figure 7, and they are in close contact.

[0081] Furthermore, a common electrode 360 ​​may be provided at the edge of the first conductive layer 34, connected to the electrode corresponding to each electrical compartment. Figure 8 is a photograph of the front and back surfaces of a photoelectric functional film in which the first conductive layer 34 has six electrical compartments and a common electrode is provided at the edge. In this way, each of the six electrical compartments in the first conductive layer 34 of the photoelectric functional film is connected to an electrode, and the electrode corresponding to each electrical compartment is drawn out by connection to the common electrode 360 ​​at the edge of the first conductive layer 34. If there are two or more common electrodes 360, the common electrodes 360 can be located on the same side in the first conductive layer 34 to simplify the manufacturing process.

[0082] When the photoelectric functional film is in operation, controllable dimming can be achieved simply by connecting an external power supply to the electrodes in the first conductive layer 34. Figure 5 shows the case where both poles of the external power supply 45 (AC) are connected to the first electrode 361 and the fourth electrode 364, respectively. Specifically, when an AC current is passed through electrodes connected to at least two electrical compartments in the first conductive layer 34, the photoelectric functional film can be operated so that the optical compartments corresponding to the electrical compartments connected to the energized electrodes become operational, while the optical compartments corresponding to the electrical compartments connected to the unenergetic electrodes remain inactive.

[0083] When two compartments operate in a photoelectric functional film, this includes the following:

[0084] 1. When current is applied to the first electrode 361 and the second electrode 362, the first optical compartment 331 and the second optical compartment 332 operate, while the third optical compartment 333 and the fourth optical compartment 334 do not operate actively.

[0085] 2. When current is applied to the first electrode 361 and the third electrode 363, the first optical compartment 331 and the third optical compartment 333 operate, while the second optical compartment 332 and the fourth optical compartment 334 do not operate actively.

[0086] 3. As shown in Figure 5, when current is applied to the first electrode 361 and the fourth electrode 364, the first optical compartment 331 and the fourth optical compartment 334 operate, while the second optical compartment 332 and the third optical compartment 333 do not operate actively.

[0087] 4. When current is applied to the second electrode 362 and the third electrode 363, the second optical compartment 332 and the third optical compartment 333 operate, while the first optical compartment 331 and the fourth optical compartment 334 do not operate actively.

[0088] 5. When current is applied to the second electrode 362 and the fourth electrode 364, the first optical compartment 331 and the third optical compartment 333 operate, while the second optical compartment 332 and the fourth optical compartment 334 do not operate actively.

[0089] If it is necessary to operate three or more optical compartments simultaneously, two or more electrodes can be connected in parallel and energized, and specific operating methods include the following:

[0090] 1. When the first electrode 361 and the second electrode 362 are connected in parallel, and current is applied to the first electrode 361 (or the second electrode 362) and the third electrode 363, the first optical compartment 331, the second optical compartment 332, and the third optical compartment 333 operate, while the fourth optical compartment 334 does not operate actively.

[0091] Even when the first electrode 361 and the third electrode 363 are connected in parallel and current is applied to the first electrode 361 (or the third electrode 363) and the second electrode 362, or when the second electrode 362 and the third electrode 363 are connected in parallel and current is applied to the second electrode 362 (or the third electrode 363) and the first electrode 361, it can be seen that the first optical compartment 331, the second optical compartment 332, and the third optical compartment 333 of the photoelectric functional film operate, while the fourth optical compartment 334 does not operate actively. In other words, after selecting the electrodes to be energized, the specific parallel combination method between each electrode does not affect the operating state of the optical compartments corresponding to the electrical compartments connected to the energized electrodes.

[0092] 2. When the first electrode 361 and the second electrode 362 are connected in parallel, and current is applied to the first electrode 361 (or the second electrode 362) and the fourth electrode 364, the first optical compartment 331, the second optical compartment 332, and the fourth optical compartment 334 operate, while the third optical compartment 333 does not operate actively.

[0093] 3. When the first electrode 361 and the third electrode 363 are connected in parallel, and current is applied to the first electrode 361 (or the third electrode 363) and the fourth electrode 364, the first optical compartment 331, the third optical compartment 333, and the fourth optical compartment 334 operate, while the second optical compartment 332 does not operate actively.

[0094] 4. When the second electrode 362 and the third electrode 363 are connected in parallel, and current is applied to the second electrode 362 (or the third electrode 363) and the fourth electrode 364, the second optical compartment 332, the third optical compartment 333, and the fourth optical compartment 334 operate, while the first optical compartment 331 does not operate actively.

[0095] 5. When the first electrode 361 and the second electrode 362 are connected in parallel, and the third electrode 363 and the fourth electrode 364 are connected in parallel, and current is applied to the first electrode 361 (or the second electrode 362) and the third electrode 363 (or the fourth electrode 364), all of the first optical section 331, the second optical section 332, the third optical section 333, and the fourth optical section 334 will operate.

[0096] Furthermore, a direct current can be passed through the second conductive layer 32 simultaneously with or before the operation of the photoelectric functional layer 33, thereby heating the photoelectric functional layer 33. This improves the operational response speed of the energized optical section in the photoelectric functional layer 33. For example, conventional SPD dimming films have a long operational response time in environments below -10°C. However, in this embodiment, if the photoelectric functional layer 33 is an SPD dimming film, the photoelectric functional layer 33 can be heated by passing a direct current through the second conductive layer 32. This shortens the operational response time of the photoelectric functional layer 33 in low-temperature environments and improves the response speed.

[0097] During the operation of the photoelectric functional film, the AC voltage applied to the electrodes in the first conductive layer 34 may be slightly higher than the normal voltage, or materials such as PET with low sheet resistance may be used for the second substrate layer 31 and the first substrate layer 35. For example, in order to obtain a low voltage drop, PET with a sheet resistance of 10 to 40 Ω / □ may be used for the second substrate layer 31 and / or the first substrate layer 35.

[0098] Figure 9 is a photograph of the photoelectric functional film shown in Figure 1 (the material of the photoelectric functional layer 33 is PDLC) after alternating current is applied to the first electrode 361 and the fourth electrode 364, respectively. In this operating state, the first optical compartment 331 and the fourth optical compartment 334 operate, but the second optical compartment 332 and the third optical compartment 333 do not operate actively.

[0099] Voltage measurements were taken in the operating state of the photoelectric functional films shown in Figures 1 to 4. The frequencies measured in the first conductive layer 34 and the second conductive layer 32 were the same, and the voltage measured in the first conductive layer 34 was slightly higher than the voltage measured in the second conductive layer 32, but they were almost identical and did not affect normal operation.

[0100] (Example 2) This embodiment provides a photoelectric functional film having a structure similar to that of the photoelectric functional film according to Embodiment 1, except that it further includes a first insulating layer 37 located between the first conductive layer 34 and the photoelectric functional layer 33, and / or a second insulating layer 38 located between the second conductive layer 32 and the photoelectric functional layer 33. The structure of the photoelectric functional film including both of the above insulating layers is shown in Figure 10.

[0101] Similarly, depending on actual requirements, a layer structure made of a conductive material, i.e., a conductive layer other than the first conductive layer and the second conductive layer, may be provided between the first conductive layer 34 and the photoelectric functional layer 33 and / or between the second conductive layer 32 and the photoelectric functional layer 33.

[0102] That is, an insulating layer and / or a conductive layer may be provided between the first conductive layer 34 and the photoelectric functional layer 33, and similarly, an insulating layer and / or a conductive layer may be provided between the second conductive layer 32 and the photoelectric functional layer 33.

[0103] The photoelectric functional film according to this embodiment can prevent electrical dielectric breakdown of the photoelectric functional layer 33 when the operating voltage is high by providing a first insulating layer 37 and / or a second insulating layer 38. Furthermore, by providing a conductive layer, the photoelectric functional film can also serve other functions that require current (e.g., heating) or functions that do not require current (e.g., heat insulation, anti-fogging).

[0104] (Example 3) This embodiment provides a photoelectric functional film having the same structure as the photoelectric functional film according to Example 1, except that it does not include a second conductive layer. The structure of the photoelectric functional film is shown in Figure 11.

[0105] Furthermore, an insulating layer and / or other conductive layer may be provided between the first conductive layer 34 and the photoelectric functional layer 33. Figure 12 shows the case where a first insulating layer 37 is provided between the first conductive layer 34 and the photoelectric functional layer 33.

[0106] Compared to the photoelectric functional film according to Example 1, the photoelectric functional film according to this embodiment can be simplified by providing only the first conductive layer 34 and omitting the second conductive layer 32, and by providing an insulating layer, electrical dielectric breakdown of the photoelectric functional layer 33 can be prevented when the operating voltage is high.

[0107] (Example 4) This embodiment provides a light-transmitting assembly. As shown in Figure 13, the light-transmitting assembly includes a first light-transmitting plate 1, a first adhesive layer 2, a photoelectric functional film 3, a second adhesive layer 4, and a second light-transmitting plate 5.

[0108] The first light-transmitting plate 1 and the second light-transmitting plate 5 can each be made of glass, and accordingly, the light-transmitting assembly according to this embodiment may specifically be a glass assembly.

[0109] The photoelectric functional film 3 can be selected and used from the photoelectric functional film according to Example 1, Example 2, or Example 3. The photoelectric functional film according to this example is the photoelectric functional film shown in Figure 1 in Example 1 (having the structure of type B in Example 1).

[0110] The photoelectric functional film 3 is located between the first light-transmitting plate 1 and the second light-transmitting plate 5. The first adhesive layer 2 is interposed between the first light-transmitting plate 1 and the first substrate layer 35 of the photoelectric functional film 3, and the second adhesive layer 4 is interposed between the first substrate layer 35 and the second light-transmitting plate 5 of the photoelectric functional film 3. The first adhesive layer 2 and the second adhesive layer 4 are in contact with each other such that their contact points are located between the upper and lower surfaces of the first substrate layer 35 (including the upper and lower surfaces). Here, the upper surface of the first substrate layer 35 means the surface of the first substrate layer 35 that is in contact with the first conductive layer 34, and the lower surface of the first substrate layer 35 means the surface opposite to the upper surface. In Figure 13, the adhesive point between the first adhesive layer 2 and the second adhesive layer 4 is located on the lower surface of the first substrate layer 35.

[0111] The first adhesive layer 2 is an EVA layer, and the second adhesive layer 4 is a PVB layer or an EVA layer. Here, the material of the EVA layer may include ordinary EVA or high UV-blocking EVA, and the material of the PVB layer may include ordinary PVB or high UV-blocking PVB. The high UV-blocking EVA and high UV-blocking PVB have a UV-cut wavelength band of 390 nm or more, preferably 400 nm.

[0112] The manufacturing method for the light-transmitting assembly involves stacking a first light-transmitting plate 1, a raw adhesive film for the first adhesive layer 2, a photoelectric functional film 3, a raw adhesive film for the second adhesive layer 4, and a second light-transmitting plate 5 in order, raising the temperature, and melting the raw adhesive films for the first adhesive layer 2 and the second adhesive layer 4 in a high-temperature, high-pressure environment. The molten raw adhesive film for the first adhesive layer 2 adheres the first light-transmitting plate 1 and the second substrate layer 31, and then continues to flow to the first substrate layer 35, sealing the side opening between the second substrate layer 31 and the first substrate layer 35. After the molten raw adhesive film for the second adhesive layer 4 adheres to the first substrate layer 35 and the second light-transmitting plate 5, it continues to flow forward along the first substrate layer 35 until it contacts the raw adhesive film for the first adhesive layer 2. At this time, the raw adhesive film for the first adhesive layer 2 fills the space between the first light-transmitting plate 1 and the first substrate layer 35 in the photoelectric functional film 3, and the raw adhesive film for the second adhesive layer 4 fills the space between the first substrate layer 35 and the second light-transmitting plate 5 in the photoelectric functional film 3. The assembly is then molded and laminated to obtain a light-transmitting assembly. Compared to conventional processes for laminated glass including dimming films, the manufacturing method provided by the present invention does not require the addition of a raw adhesive film for the adhesive layer at equal thickness to the side surface of the photoelectric functional film, thus significantly simplifying the process.

[0113] When the second adhesive layer is a PVB layer, the softening point of EVA (the material of the first adhesive layer) is 70-90°C, but the softening point of PVB (the material of the second adhesive layer) is over 100°C. Therefore, the two adhesive layer materials have different fluidity at the same temperature. Accordingly, the manufacturing method of the above light-transmitting assembly may be as follows.

[0114] The first light-transmitting plate 1, the raw adhesive film for the first adhesive layer 2, the photoelectric functional film 3, the raw adhesive film for the second adhesive layer 4, and the second light-transmitting plate 5 are stacked in order, the temperature is raised, and the raw adhesive film for the first adhesive layer 2 is melted in a high-temperature, high-pressure environment. After the molten raw adhesive film for the first adhesive layer 2 adheres the first light-transmitting plate 1 and the second base material layer 31, it continues to flow into the first base material layer 35 until the side opening between the second base material layer 31 and the first base material layer 35 is completely filled. Then, the raw adhesive film for the second adhesive layer 4 is melted, and after the molten raw adhesive for the second adhesive layer 4 adheres the first base material layer 35 and the second light-transmitting plate 5, it continues to flow forward along the first base material layer 35 until it comes into contact with the raw adhesive film of the first adhesive layer 2. The assembly is then molded and laminated to obtain a light-transmitting assembly.

[0115] Compared to a light-transmitting assembly in which both the first and second adhesive layers are EVA layers, a light-transmitting assembly in which the first adhesive layer is an EVA layer and the second adhesive layer is a PVB layer can have even better mechanical performance.

[0116] When the photoelectric functional film 3 is replaced with one having the structure of type A in Example 1, the method for manufacturing the light-transmitting assembly includes the following: stacking the first light-transmitting plate 1, the raw adhesive film for the first adhesive layer 2, the photoelectric functional film 3, the raw adhesive film for the second adhesive layer 4, and the second light-transmitting plate 5 in order; providing the raw adhesive film for the first adhesive layer 2 and / or the second adhesive layer 4 (which may have a thickness equal to or corresponding to that of the photoelectric functional film 3) on the side surface of the photoelectric functional film 3; raising the temperature and melting the raw adhesive film for the first adhesive layer 2 and the raw adhesive film for the second adhesive layer 4 in a high-temperature, high-pressure environment; continuing to flow the molten raw adhesive film until it fills the space between the photoelectric functional film 3 and the first light-transmitting plate 1 and the second light-transmitting plate 5; forming and stacking to obtain a light-transmitting assembly.

[0117] Figure 14 is a schematic diagram of the structure of a conventional dimmable film. As shown in Figure 14, the conventional dimmable film consists of a second substrate layer 61, a first conductive layer 63, a photoelectric functional layer 65, a second conductive layer 64, and a first substrate layer 62, which are laminated in order. The second substrate layer 61 and the first substrate layer 62 are half-cut with a staggered edge on the same side, and the connection points between the first FPC electrode 66 and the second FPC electrode 67 and the dimmable film are on the cut sides of the second substrate layer 61 and the first substrate layer 62. The first FPC electrode 66 is connected to the first conductive layer 63, and the connection point between the two corresponds to the uncut area of ​​the second substrate layer 61, and the first FPC electrode 66 is not in contact with the second conductive layer 64. The second FPC electrode 67 is connected to the second conductive layer 64, and the connection point between the two corresponds to the uncut area of ​​the first substrate layer 62, and the second FPC electrode 67 is not electrically connected to the first conductive layer 63.

[0118] In contrast to conventional dimmable films where the dimensions of the two upper and lower substrate layers are the same, or designs where the front and rear substrates are offset vertically and half-cut as shown in Figure 14, the present invention makes the side surface of the photoelectric functional film 3 step-like by making the first substrate layer 35 of the photoelectric functional film protrude outward from the periphery of the other layer structures in the photoelectric functional film. The first substrate layer 35 divides the photoelectric functional film 3 into two spaces in the vertical direction, and the orthographic projection of the side edge opening position between the second substrate layer 31 and the first substrate layer 35 onto the first substrate layer 35 is located within the edge of the first substrate layer 35. Subsequently, when packaging the photoelectric functional film into a light-transmitting assembly with an adhesive film, a non-toxic EVA adhesive film is used on the upper surface of the first substrate layer 35 of the photoelectric functional film, and the photoelectric functional layer 33 of the film sheet and the side opening between the second substrate layer 31 and the first substrate layer 35 are covered with an adhesive film that has less toxic effect on the photoelectric functional layer of the film sheet. By installing the above structure, the penetration of harmful contents in the adhesive film from the side edge into the photoelectric functional layer is reduced, thereby lowering the failure rate of the photoelectric functional layer in the photoelectric functional film sheet or preventing failure of the photoelectric functional layer. [Explanation of Symbols]

[0119] 1 1st light transmission plate 2 First adhesive layer 3 Photoelectric functional film 4 Second adhesive layer 5 Second light transmitting plate 31 Second base layer 32 Second conductive layer 33 Photoelectric functional layer 34 First conductive layer 35 First base layer 36 electrodes 37. First insulating layer 38. Second insulating layer 340 Etching lines 3400 External connection area 341 First Electrical Compartment 342 Second Electrical Compartment 343 Third Electrical Compartment 344 Fourth Electrical Compartment 331 First optical compartment 332 Second optical compartment 333 Third optical compartment 334 Fourth optical compartment 361 1st electrode 362 2nd electrode 363 3rd electrode 364 4th electrode 360 common electrode 41 External electrode 42 Conductive copper foil 43. Hardened silver paste 44 High-temperature tape 45 External power supply 61 2nd base layer 62 1st base layer 63 First conductive layer 64 Second conductive layer 65 Photoelectric functional layer 66 1st FPC electrode 67 2nd FPC electrode

Claims

1. A photoelectric functional film comprising a laminated photoelectric functional layer (33), a first conductive layer (34), and a first substrate layer (35), The first conductive layer (34) is a photoelectric functional film comprising two or more electrically insulated compartments, each of which is connected to a corresponding electrode.

2. The photoelectric functional film according to claim 1, wherein in the first conductive layer (34), the horizontal distance between adjacent electrical compartments is 10 μm to 1 mm.

3. The photoelectric functional film according to claim 2, wherein in the first conductive layer (34), the horizontal distance between adjacent electrical compartments is 10 μm to 100 μm.

4. The photoelectric functional film according to claim 1, wherein all electrodes connected to the first conductive layer (34) are located on the same side, opposite side and / or adjacent side in the photoelectric functional layer (33).

5. The photoelectric functional film according to claim 1, wherein the material of the photoelectric functional layer (33) includes one or more combinations of LC, PDLC, GHLC, PNLC, PSLC, PILC, EC, and SPD.

6. The photoelectric functional film according to claim 1, wherein the orthographic projections of the photoelectric functional layer (33) and the first conductive layer (34) onto the first substrate layer (35) are each located within the surface area of ​​the first substrate layer (35).

7. The photoelectric functional film further includes a second substrate layer (31), The photoelectric functional film according to claim 1, wherein the second substrate layer (31) and the first substrate layer (35) are located on opposite sides of the photoelectric functional layer (33), respectively.

8. The photoelectric functional film according to claim 7, wherein the orthographic projection of the second substrate layer (31) onto the first substrate layer (35) is located within the edge of the first substrate layer (35).

9. The photoelectric functional film according to claim 8, wherein, in the horizontal direction, the minimum distance from each point on the edge of the orthographic projection of the second substrate layer (31) onto the first substrate layer (35) to the edge of the first substrate layer (35) is between 5 mm and 30 mm.

10. The orthographic projection of the photoelectric functional layer (33) onto the second substrate layer (31) is located within the surface area of ​​the second substrate layer (31). The photoelectric functional film according to claim 8, wherein the orthographic projection of the photoelectric functional layer (33) onto the first conductive layer (34) is located within the surface area of ​​the first conductive layer (34).

11. The photoelectric functional film further includes a second conductive layer (32), The photoelectric functional film according to any one of claims 1 to 10, wherein the second conductive layer (32) and the first conductive layer (34) are located on opposite sides of the photoelectric functional layer (33), respectively.

12. The photoelectric functional film according to claim 11, wherein the orthographic projection of the second conductive layer (32) onto the first substrate layer (35) is located within the edge of the first substrate layer (35).

13. The present invention comprises a first light-transmitting plate (1), an adhesive layer, a second light-transmitting plate (5), and a photoelectric functional film (3) containing the photoelectric functional film described in any one of claims 1 to 12. The photoelectric functional film (3) is located between the first light-transmitting plate (1) and the second light-transmitting plate (5). The adhesive layer is interposed between the first light-transmitting plate (1) and the photoelectric functional film (3), and between the photoelectric functional film (3) and the second light-transmitting plate (5), forming a light-transmitting assembly.

14. The adhesive layer includes a first adhesive layer (2) and a second adhesive layer (4), The first adhesive layer (2) is interposed between the first light-transmitting plate (1) and the first substrate layer (35) of the photoelectric functional film (3). The light-transmitting assembly according to claim 13, wherein the second adhesive layer (4) is interposed between the first substrate layer (35) of the photoelectric functional film (3) and the second light-transmitting plate (5).

15. The first adhesive layer (2) includes an EVA layer, The light-transmitting assembly according to claim 14, wherein the second adhesive layer (4) includes a PVB layer and / or an EVA layer.

16. A method for manufacturing a light-transmitting assembly according to any one of claims 13 to 15, A manufacturing method comprising stacking a first light-transmitting plate (1), a raw adhesive film for the adhesive layer, a photoelectric functional film (3), and a second light-transmitting plate (5) in order, raising the temperature to form them, and laminating them to obtain the light-transmitting assembly.

17. The process involves stacking a first light-transmitting plate (1), a raw adhesive film for the first adhesive layer (2), a photoelectric functional film (3), a raw adhesive film for the second adhesive layer (4), and a second light-transmitting plate (5) in order, raising the temperature to form them, and laminating them to obtain the light-transmitting assembly. The manufacturing method according to claim 16, except that an adhesive film is provided on the side surface of the photoelectric functional film (3).

18. A vehicle comprising glass including a light-transmitting assembly as described in any one of claims 13 to 15.

Images