Induction coil assembly and method for manufacturing the same

Abstract

A method for manufacturing an induction coil assembly is a step of forming N(i) layers, where (i) is an integer from 1 to M, N(i) is the i-th layer, N(M) is the maximum number of layers N(i), and each N(i) layer includes a first conductor (i) instance having a thickness (x)T, bonded to a first side of a ceramic (i) instance, and a second conductor (i) instance having a thickness (y)T, bonded to a second side of a ceramic (i) instance, and for (i=1 to M-1), N(i+1) The method includes the steps of stacking and aligning layers N(1) to N(M) such that an instance of the first conductor in layer N(i) is positioned adjacent to an instance of the second conductor in layer N(i); stacking and aligning a third conductor having thickness (y)T with the first conductor in layer N(1) and a fourth conductor having thickness (x)T with the corresponding second conductor in layer N(M); joining the third conductor to the first conductor in layer N(1) and joining the fourth conductor to the second conductor in layer N(M); and ensuring that x and y are each between 0 and 1.

Description

Technical Field

[0001] Cross - reference to Related Applications This application claims the benefit of U.S. Application No. 63 / 456,414, filed Mar. 31, 2023, which is incorporated herein by reference in its entirety.

[0002] This disclosure generally relates to induction coil assemblies and methods of manufacturing the same.

Background Art

[0003] Low - loss induction coils with integrated capacitance are useful, particularly in the field of inductive wireless power transfer, among technical fields that require high - performance magnetic components capable of operating with high - frequency alternating current.

[0004] Inductive wireless power transfer provides an easy way to power and charge mobile electronic devices such as smartphones. For this technology to spread to a wider user base and enable charging of higher - power products, this technology needs to be highly efficient and manufacturable by low - cost mass - production methods. These higher - power products include electric passenger vehicles, forklifts, material handling equipment, buses, or automated guided vehicles.

[0005] The state - of - the - art includes Litz - wire - based chargers and laminated multilayer conductors. The Litz - wire solution uses a primary winding formed of galvanically insulated foils or Litz wires. Other state - of - the - art devices include magnetic self - resonance structures (MSRS).

[0006] The following publications may be considered useful background technology: U.S. Patent Nos. 8,683,682, 8,377,240, 8,974,914, U.S. Patent Publication No. 2005 / 0150935, U.S. Patent No. 10,109,413, International Publication No. 2022 / 015703, L. Gu, G. Zulauf, ALFStein, PAKyaw, T. Chen and JMRivas Davila, “6.78 MHz Wireless Power Transfer with Self-Resonant Coils at 95% DC-DC Efficiency,” in IEEE Transactions on Power Electronics, doi:10.1109 / TPEL.2020.3014042; Aaron LFStein, Phio Aung Kyaw, Student Member IEEE, and Charles R. Sullivan, Fellow IEEE, “Wireless Power Transfer Utilizing a High-Q Self-Resonant Structure”; and Aaron LFStein Phyo Aung Kyaw Jesse Feldman-Stein Charles R. Sullivan Thayer School of Engineering, Dartmouth College, Hanover, NH 03755 USA, “Thin Self-Resonant Structures with a High-Q for Wireless Power Transfer”.

[0007] While existing multilayer conductors for electronic components may be suitable for their intended purposes, the technology for induction coil assemblies and methods for manufacturing them will advance with the structures and manufacturing methods disclosed herein. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] U.S. Patent No. 8,683,682 [License 2] U.S. Patent No. 8,377,240 [License 3] U.S. Patent No. 8,974,914 [License 4] U.S. Patent and Trademark Publication No. 2005 / 0150935 [Patent Document 5] U.S. Patent No. 10,109,413 [License 6] International Publication No. 2022 / 015703 [Non-licensed literature]

[0009] [Non-licensed Document 1] L.Gu, G.Zulauf, ALFStein, PAKyaw, T.Chen and JMRivas Davila, “6.78 MHz Wireless Power Transfer with Self-Resonant Coils at 95% DC-DC Efficiency,” in IEEE Transactions on Power Electronics, doi:10.1109 / TPEL.2020.3014042 [Non-licensed Document 2] Aaron LFStein,Phyo Aung Kyaw,Student Member IEEE,and Charles R.Sullivan,Fellow,IEEE,“Wireless Power Transfer Utilizing a High-Q Self-Resonant Structure” [Non-licensed Document 3] Aaron LFStein Phyo Aung Kyaw Jesse Feldman-Stein Charles R. Sullivan Thayer School of Engineering, Dartmouth College, Hanover, NH 03755 USA, “Thin Self-Resonant Structures with a High-Q for Wireless Power Transfer” [Overview of the project]

[0010] One embodiment includes a method for manufacturing an induction coil assembly as defined by the attached independent claim. Further advantageous modifications of the method for manufacturing an induction coil assembly are defined by the attached dependent claim.

[0011] In one embodiment, a method for manufacturing an induction coil assembly includes the steps of: forming a first outer layer having a first conductor bonded to a first side surface of a first ceramic, wherein a second side surface of the first ceramic is on the opposite side of the first ceramic, and the first conductor has a thickness T; and forming N(i) intermediate layers, where (i) is an integer from 1 to M, N(i) represents an individual i-th intermediate layer, N(M) is the maximum defined number of N(i) intermediate layers, and each of the N(i) intermediate layers includes an instance of a second conductor bonded to a first side surface of a corresponding instance of a second ceramic, wherein a second side surface of the corresponding instance of a second ceramic is on the opposite side of the first side of the corresponding instance of a second ceramic, and the corresponding instance of a second conductor has a thickness T. The method comprises the steps of forming a second outer layer having a third conductor bonded to a first side surface of a third ceramic, wherein the second side surface of the third ceramic is on the opposite side of the first side surface of the third ceramic and the third conductor has a thickness T; laminating intermediate layers N(1) to N(M) with the first outer layer such that corresponding instances of the second conductor of the intermediate layer N(1) are positioned adjacent to the second side surface of the first ceramic of the first outer layer; and laminating the second outer layer opposite to the second conductor of the second outer layer such that the third conductor of the second outer layer is positioned adjacent to the corresponding instance of the second ceramic of the corresponding intermediate layer N(M). The method further includes the steps of laminating with a corresponding intermediate layer of N(M), aligning a corresponding instance of the second conductor of the intermediate layer of N(1) with the first ceramic of the first outer layer, aligning a third conductor of the second outer layer with a corresponding instance of the second ceramic of the intermediate layer of N(M), laminating and aligning a fourth conductor with the second side surface of the third ceramic of the second outer layer, and at least bonding a corresponding instance of the second conductor of the intermediate layer of N(1) to the first ceramic of the first outer layer, and directly bonding the fourth conductor to the third ceramic of the second outer layer.

[0012] In one embodiment, a method for manufacturing an induction coil assembly comprises the steps of: forming a first outer layer having a first conductor bonded to a first side surface of a first ceramic and a second conductor bonded to a second side surface of the first ceramic, wherein the second side surface of the first ceramic is on the opposite side of the first ceramic, the first conductor has a thickness T, and the second conductor has a thickness (y)T; forming at least one intermediate layer having a third conductor instance bonded to a first side surface of an instance of a second ceramic and a fourth conductor instance bonded to a second side surface of an instance of a second ceramic, wherein the second side surface of an instance of a second ceramic is on the opposite side of the first side surface of an instance of a second ceramic, the third conductor instance has a thickness (x)T, and the fourth conductor instance has a thickness (y)T; and forming a fifth conductor bonded to a first side surface of a third ceramic and a sixth conductor bonded to a second side surface of a third ceramic. Step 2 of forming an outer layer, wherein the second side of the third ceramic is on the opposite side of the first side of the third ceramic, the fifth conductor has a thickness (x)T, the sixth conductor has a thickness T, x is between 0 and 1 and x+y is equal to 1, and at least one intermediate layer is laminated with the first outer layer such that the third conductor of at least one intermediate layer is positioned adjacent to the second conductor of the first outer layer, and the fifth conductor of the second outer layer is positioned adjacent to an instance of the fourth conductor of at least one intermediate layer The method includes the steps of: laminating a second outer layer with at least one intermediate layer so that it can be positioned; aligning an instance of a third conductor of at least one intermediate layer with a second conductor of the first outer layer, and aligning a fifth conductor of the second outer layer with an instance of a fourth conductor of at least one intermediate layer; and directly joining an instance of a third conductor of at least one intermediate layer to a second conductor of the first outer layer, and directly joining a fifth conductor of the second outer layer to an instance of a fourth conductor of at least one intermediate layer.

[0013] In one embodiment, a method for manufacturing an induction coil assembly comprises the steps of: forming a first outer layer comprising a first conductor bonded to a first side surface of a first ceramic and a second conductor bonded to a second side surface of the first ceramic, wherein the second side surface of the first ceramic is opposite to the first side surface of the first ceramic, the first conductor has a thickness T, and the second conductor has a thickness (y)T; and forming N(i) intermediate layers, wherein (i) is an integer from 1 to M, N(i) represents an individual i-th intermediate layer, N(M) is the maximum defined number of intermediate layers N(i), and each of the N(i) intermediate layers comprises a second ceramic A step comprising: a third instance of a conductor (i) joined to a first side of a corresponding instance of a ceramic (i) and a fourth instance of a conductor (i) joined to a second side of a corresponding instance of a ceramic (i), wherein the second side of the corresponding instance of the ceramic (i) is on the opposite side of the first side of the corresponding instance of the ceramic (i), the third instance of the conductor (i) has a thickness (x)T, and the fourth instance of the conductor (i) has a thickness (y)T.The method is a step of forming a second outer layer comprising a fifth conductor joined to a first side surface of a third ceramic and a sixth conductor joined to a second side surface of the third ceramic, wherein the second side surface of the third ceramic is on the opposite side of the first side surface of the third ceramic, the fifth conductor has a thickness (x)T, the sixth conductor has a thickness T, x is between 0 and 1, and x+y is equal to 1; and a step of laminating intermediate layers N(1) to N(M) with the first outer layer such that corresponding instances of the third conductor of the intermediate layer N(1) are arranged adjacent to the second conductor of the first outer layer; and the fifth conductor of the second outer layer is The method further includes the steps of: stacking a second outer layer with an intermediate layer of N(M) such that it is positioned adjacent to a corresponding instance of a fourth conductor of the intermediate layer of N(M); aligning a corresponding instance of a third conductor of the intermediate layer of N(1) with a second conductor of the first outer layer, and aligning a fifth conductor of the second outer layer with a corresponding instance of a fourth conductor of the intermediate layer of N(M); and at least directly joining a corresponding instance of a third conductor of the intermediate layer of N(1) with a second conductor of the first outer layer, and directly joining a fifth conductor of the second outer layer with a corresponding instance of a fourth conductor of the intermediate layer of N(M).

[0014] In one embodiment, a method for manufacturing an induction coil assembly includes the step of forming N(i) layers, where (i) is an integer from 1 to M, N(i) represents an individual i-th layer, N(M) is the maximum defined number of layers N(i), and each of the N(i) layers includes a first conductor(i) instance bonded to a first side of a ceramic(i) instance, wherein the second side of the corresponding ceramic(i) instance is opposite to the first side of the corresponding ceramic(i) instance, and a second conductor(i) instance bonded to the corresponding second side of the ceramic(i) instance, wherein the first conductor(i) instance has a thickness (x)T and the second conductor(i) instance has a thickness (y)T. The method further includes the steps of: stacking and aligning layers N(1) to N(M) on top of each other such that, for (i=1 to M-1), a corresponding instance of a first conductor in layer N(i+1) is positioned adjacent to a corresponding instance of a second conductor in layer N(i); stacking and aligning a third conductor with a corresponding instance of a first conductor in layer N(1), and stacking and aligning a fourth conductor with a corresponding instance of a second conductor in the corresponding layer N(M); directly joining at least the third conductor to the corresponding first conductor in layer N(1), and directly joining the fourth conductor to the corresponding second conductor in the corresponding layer N(M), wherein the third conductor has a thickness (y)T, the fourth conductor has a thickness (x)T, x is between 0 and 1, and x+y is equal to 1.

[0015] As disclosed herein, the use of direct bonding of conductors to ceramics enables the manufacture and utilization of inductive coil assemblies that can operate at high power without dielectric breakdown within a specific frequency operating range in a compact design. Current Society of Automotive Engineers (SAE) specification J2954 indicates that wireless chargers for passenger electric vehicles should operate at 85 kHz and transmit 11 kW of power. Embodiments disclosed herein may be suitable for operating in accordance with SAE J2954, but the appended claims should not be construed as being so limited, and other frequencies and / or power transmissions are contemplated and are understood to be within the scope of the appended claims. Larger vehicles such as buses and large trucks require more power transmission and a set of materials that can withstand those power levels without shorting or melting.

[0016] The above and other features and advantages of the present invention will become readily apparent by understanding the following detailed description of the present invention in connection with the accompanying drawings.

[0017] Referring to the exemplary and non-limiting drawings, like elements are numbered alike in the accompanying drawings.

Brief Description of the Drawings

[0018] [Figure 1A] FIG. 1A shows a partial cross-sectional view of an exemplary single-sided conductor-ceramic laminate arrangement for an inductive coil assembly according to one embodiment. [Figure 1B] FIG. 1B shows another partial cross-sectional view of an exemplary single-sided conductor-ceramic laminate arrangement, similar to that of FIG. 1A, but showing gaps at the ends of the conductor layers with and without offset. [Figure 2A] FIG. 2 shows a partial cross-sectional view of an exemplary double-sided conductor-ceramic laminate arrangement for an inductive coil assembly according to one embodiment. [Figure 2B]A partial cross-sectional view of another exemplary double-sided conductor-ceramic laminate arrangement, similar to that of FIG. 2A according to one embodiment, showing a gap at the end of the conductor layer without an offset. [Figure 2C] A partial cross-sectional view of another exemplary double-sided conductor-ceramic laminate arrangement, similar to that of FIG. 2B according to one embodiment, showing a gap at the end of the conductor layer with an offset. [Figure 2D] A partial cross-sectional view of another exemplary double-sided conductor-ceramic laminate arrangement, similar to that of FIG. 2C according to one embodiment, showing a gap at the end of the conductor layer having a larger offset than that of FIG. 2C. [Figure 3] A partial cross-sectional view of another exemplary double-sided conductor-ceramic laminate arrangement, similar to that of FIG. 2A according to one embodiment, having an outer conductor layer formed by an alternative method. [Figure 4A] A partial cross-sectional view of an exemplary bonded conductor-ceramic laminate arrangement having exemplary alignment pins with and without electrical connections between adjacent conductor layers, according to one embodiment. [Figure 4B] A partial cross-sectional view of another exemplary bonded conductor-ceramic laminate arrangement, similar to that of FIG. 4A according to one embodiment, having an alternative exemplary alignment pin arrangement. [Figure 4C] An isometric view of a rotation of a part of an electrical connection that electrically connects the third conductor layer and the fourth conductor layer from below and does not connect the first conductor layer and the second conductor layer from below, according to one embodiment. [Figure 4D] An isometric view of a rotation of a part of an electrical connection similar to that of FIG. 4C, in which the first conductor layer and the third conductor layer from below are electrically connected and the second conductor layer and the fourth conductor layer from below are not connected, according to one embodiment. [Figure 5A] A top view of A-conductor layers and B-conductor layers having electrical interconnects between every other conductor layer arranged in a spiral and showing assembly alignment pins, according to one embodiment. [Figure 5B]The following are top views of another A-conductor layer and another B-conductor layer, which, according to one embodiment, have electrical interconnections between alternating conductor layers similar to those in Figure 5A, but with electrical connections arranged in an alternative manner. [Figure 5C] The image shows top views of another A-conductor layer and another B-conductor layer, which, according to one embodiment, have electrical interconnects between alternating conductor layers similar to those in Figure 5A, but have electrical connections arranged in an alternative manner along the edges. [Figure 5D] The image shows top views of another A-conductor layer and another B-conductor layer, which, according to one embodiment, have electrical interconnections between alternating conductor layers similar to those in Figure 5C, but with electrical connections arranged in an alternative manner along the edges. [Figure 6A] The image shows top views of the A'-conductor layer and B'-conductor layer, which, according to one embodiment, have electrical interconnections between alternating conductor layers similar to those in Figure 5A, but have a rectangularly arranged structured conductor path. [Figure 6B] The following are top views of another A'-conductor layer and another B'-conductor layer, which, according to one embodiment, have electrical interconnections between alternating conductor layers similar to those in Figure 5B, but have a rectangular arrangement of structured conductor paths. [Figure 6C] The following are top views of another A'-conductor layer and another B'-conductor layer, similar to those in Figure 6B, but with electrical connections arranged in an alternative manner along the edges, according to one embodiment. [Figure 6D] The following are top views of another A'-conductor layer and another B'-conductor layer, similar to that shown in Figure 6C, but with stepped conductors visible in the top view, according to one embodiment. [Modes for carrying out the invention]

[0019] Where used herein, a reference to a plan view is synonymous with a reference to the xy-plane of the xyz Cartesian coordinate system.

[0020] Those skilled in the art will understand that the drawings described below are for illustrative purposes only. For simplicity and clarity, it will be understood that the elements shown in the drawings are not necessarily drawn to scale. For example, some dimensions or scales of elements may be exaggerated relative to others for clarity. Furthermore, reference numerals may be repeated between drawings to indicate corresponding or similar elements where appropriate, and similar elements may not be repeatedly enumerated in all drawings where it is recognized and understood that such enumeration is essentially disclosed in the absence of such elements.

[0021] As used herein, the term “embodiments” means “embodiments disclosed and / or illustrated herein” which are provided herein for use in a full understanding of the invention as described in the appended claims, but which do not necessarily encompass any specific embodiment of the invention as described in the appended claims.

[0022] The following detailed description includes many details for illustrative purposes, but those skilled in the art will understand that many variations and modifications of the following details fall within the scope of the appended claims. For example, if a described feature is not mutually exclusive with other described features, such combination of non-exclusive features is considered to be essentially disclosed herein. Furthermore, common features may be generally illustrated in various figures, but are not specifically enumerated in all figures for the sake of brevity, and those not enumerated in a particular figure will be recognized by those skilled in the art as features explicitly disclosed. Accordingly, the following exemplary embodiments are described without loss of generality to the claimed invention disclosed herein and without imposing limitations.

[0023] Embodiments, as shown and described by various figures and accompanying text, provide an improved method for manufacturing MSRS devices. This enables a copper-ceramic multilayer structure with significantly high adhesion between the metal-ceramic layers, which can withstand high power and a wide operating temperature range. This method balances the two obstacles to the widespread adoption of this technology: the required high performance and the manufacturing cost. The range, efficiency, and size of the coils within the MSRS device are determined by the quality factor Q of the resonant coil. As disclosed herein, high-Q structures based on state-of-the-art coils are manufactured using low-cost materials in a low-cost manufacturing process. In addition, this process uses substrates with high dielectric breakdown strength, which helps to increase the power output of the charging device.

[0024] The starting material, which is pure copper (over 99%) bonded to a ceramic structure such as aluminum oxide (Al2O3), is manufactured using the Direct Bonding Copper (DBC) process. This process is a high-temperature melt diffusion process in which pure copper is bonded onto the ceramic. A very strong bond is created by the copper-oxygen eutectic that forms and wets the interface surface during the DBC process.

[0025] In one embodiment, after copper is bonded to a ceramic surface, the copper is patterned with a state-of-the-art coil structure. In one embodiment, the structure is created by printing and etching techniques. This process is repeated for the number of conductor layers required to achieve the coil's resonant frequency and Q. The conductor layers are then bonded to each other by a high-temperature processing process, reducing the need for additional soldering or bonding layers, which can add complexity and cost to the manufacturing process.

[0026] In addition to the manufacturing process described above, it is also possible to start with a thin patterned layer of foil. Patterning can be done by die-cutting or blade cutting. This patterned layer is placed on the ceramic surface. Bonding is performed by the same direct bonding copper process detailed above. The patterned layers can then be stacked on top of each other and bonded into a single multilayer structure by a high-temperature processing process. This process reduces the need for printing and etching each individual conductive layer.

[0027] Due to the high dielectric constant of the ceramic substrate, the number of layers required to achieve electrical resonance at the target operating frequency can be reduced compared to substrates with low dielectric constants. An example of an operating frequency of 85 kHz suitable for the embodiments disclosed herein is set by SAE J2954 as the unified charging frequency for passenger electric vehicles. This reduction in the number of layers can reduce material costs and the number of layers that need to be printed and etched, thereby reducing the overall cost of the manufacturing process.

[0028] In one embodiment, the design disclosed herein is useful for MSRS coils. In one embodiment of the process, strategic regions between ceramic layers where patterned copper is absent may be filled with a non-conductive material or a non-contact copper material. If these regions are not filled with a non-conductive material or a non-contact conductive material, large pressure and / or temperature gradients may occur during the multilayer bonding process. These gradients may result in warping or cracking of the ceramic.

[0029] After the multilayer assembly is joined, one embodiment includes a process in which the assembly is filled with a polymer material in areas between ceramic layers where patterned copper is absent. This material is used to fill gaps between copper features and to seal the edges of the structure. Air results in very low dielectric breakdown strength. Therefore, it is preferable to replace the air with a polymer material having higher dielectric breakdown strength. This prevents discharge and reinforces the structure so that it is not damaged by mechanical shaking or vibration during use (such as when mounted on a vehicle).

[0030] The embodiments provide induction coils and various methods for manufacturing them, as shown and described by various figures and accompanying text. While the embodiments described herein show both helical and rectangular patterns of the structured conductor layer of an induction coil, it will be understood that the inventions disclosed are not limited in this way and are applicable to other shapes of current paths of structured conductor layers that fall within the scope of the accompanying claims.

[0031] Here, we refer to various figures provided herein, some of which should be considered and taken into account in conjunction with other figures among them.

[0032] Figures 1A and 1B show different partial cross-sectional views of an exemplary single-sided conductor-ceramic laminated arrangement for an induction coil assembly, and the laminated configuration serves to illustrate a method for manufacturing the induction coil assembly 2000 (shown in the exploded assembly diagram), and the method, in one embodiment, A step of forming a first outer layer 10 having a first conductor 101 bonded to a first side surface of a first ceramic 201, wherein a second side surface of the first ceramic 201 is on the opposite side of the first side surface of the first ceramic 201, and the first conductor 101 has a thickness T, The step of forming an intermediate layer 20 of N(i), where (i) is an integer from 1 to M, N(i) represents the individual i-th intermediate layers 20.1, 20.2, 20.3..., N(M) is the maximum defined number of intermediate layers of N(i), and each of the intermediate layers 20 of N(i) is (i) instances 102.1, 102.2, 102.3 of a second conductor are bonded to the first side surface of the corresponding (i) instances 202.1, 202.2, 202.3 of a second ceramic, wherein the second side surface of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic is on the opposite side of the first side surface of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, and the corresponding (i) instances 102.1, 102.2, 102.3 of the second conductor have a defined thickness T. Steps including, A step of forming a second outer layer 30 having a third conductor 103 bonded to a first side surface of a third ceramic 203, wherein the second side surface of the third ceramic 203 is on the opposite side of the first side surface of the third ceramic 203, and the third conductor 103 has a thickness T, The steps include laminating the intermediate layers 20.1, 20.2, and 20.3 of N(1) to N(M) with the first outer layer 10 such that the corresponding instance 102.1 of the second conductor of the intermediate layer 20.1 of N(1) is positioned adjacent to the second side surface of the first ceramic 201 of the first outer layer 10, The step of laminating the second outer layer 30 with the corresponding N(M) intermediate layers 20.1, 20.2, 20.3 such that the third conductor 103 of the second outer layer 30 is positioned adjacent to the corresponding instances 202.1, 202.2, 202.3 of the second ceramic of the corresponding N(M) intermediate layers 20.1, 20.2, 20.3, The steps include aligning the corresponding instance 102.1 of the second conductor of the intermediate layer 20.1 of N(1) with the first ceramic 201 of the first outer layer 10, and aligning the third conductor 103 of the second outer layer 30 with the corresponding instances 202.1, 202.2, and 202.3 of the second ceramic of the intermediate layers 20.1, 20.2, and 20.3 of N(M), The steps include: aligning the fourth conductor 104 with the second side surface of the third ceramic 203 of the second outer layer 30; The steps include, at a minimum, directly bonding the corresponding instance 102.1 of the second conductor of the intermediate layer 20.1 of N(1) to the first ceramic 201 of the first outer layer 10, and directly bonding the fourth conductor 104 to the third ceramic 203 of the second outer layer 30. Includes.

[0033] When used herein, the maximum value of M is not a fixed number, as the number of layers in a given stack depends not only on the component design for a particular purpose but also on material properties such as the dielectric constant Dk value of the ceramic material used. Therefore, the maximum value of M can be 64, 128, 256, or any other value suitable for the purposes disclosed herein, and any value of M suitable for the purposes disclosed herein is intended and is deemed to be included within the scope of the appended claims.

[0034] In one embodiment, each conductor-ceramic interface of the induction coil assembly 2000 undergoes a direct bonding process.

[0035] In Figure 1A, the conductor layers are shown without gaps between the ends of corresponding conductor layers, whereas in Figure 1B, the conductor layers are shown with gaps of alternative sizes 40a, 40b between the ends of corresponding conductor layers. As shown in Figure 1B, conductor layers 101 and 102 have a gap 40a, and conductor layers 103 and 104 have a gap 40b, and the respective ends of the corresponding conductor layers are not offset from each other for each layer pair 101 / 102, 103 / 104. Alternatively, conductor layer 102 with a gap 40a and conductor layer 103 with a gap 40b are arranged such that at least one of the respective ends of the corresponding conductor layers is offset 40c from the other conductor layer. Another explanation for this offset arrangement is that the right side (end) of conductor layer 103 partially overlaps with the gap 40a of conductor layer 102.

[0036] In one embodiment, a method for stacking intermediate layers 20.1, 20.2, and 20.3 of N(1) to N(M) further includes the step of stacking the (i+1) instances 20.2, 20.3 (relative upper layers) of the intermediate layers with the corresponding (i) instances 20.1, 20.2 (corresponding relative lower layers) of the intermediate layers such that the corresponding (i+1) instances 102.2, 102.3 of the second conductors of the (i+1) instances 20.2, 20.3 of the intermediate layers are positioned adjacent to the corresponding (i) instances 202.1, 202.2 of the second ceramics of the corresponding (i) instances 20.1, 20.2 of the intermediate layers.

[0037] In one embodiment, each (i) instance of the first conductor 101, the second conductor 102, the third conductor 103, and the fourth conductor 104 each form a corresponding structured conductor having a defined current path (as further described below).

[0038] In one embodiment, each of the first structured conductor (also referred to herein by reference numeral 101), the (i) instance of the second structured conductor (also referred to herein by reference numeral 102), the third structured conductor (also referred to herein by reference numeral 103), and the fourth structured conductor (also referred to herein by reference numeral 104) is formed by directly bonding the corresponding conductor to the corresponding ceramic via a DBC process and patterning the corresponding conductor to form the corresponding structured conductor. In one embodiment, the patterning of the corresponding conductor defines an electrical path of the corresponding structured conductor from the first end to the second end of the corresponding structured conductor. In one embodiment, at least one of the electrical paths is electrically continuous and uninterrupted (see, for example, Figure 5A). In one embodiment, at least one of the electrical paths is electrically non-continuous and uninterrupted (see, for example, the left image of Figure 5B). In one embodiment, patterning of a corresponding conductor includes applying a mask to the corresponding conductor, etching the exposed portion of the corresponding conductor, and removing the mask to define the electrical path of the corresponding structured conductor from a first end to a second end.

[0039] While the above describes the formation of each structured conductor by patterning the corresponding conductor (unstructured conductor layer), it will be understood that the embodiments disclosed herein are not limited in this way. For example, before directly bonding the corresponding conductor to the corresponding ceramic, the method may further include the step of forming defined conductive paths within the unstructured conductor to form the corresponding structured conductor. Here, the method step of forming defined conductive paths includes any one of the following: mechanically removing material from the unstructured conductor to form the corresponding structured conductor; mechanically cutting material from the unstructured conductor to form the corresponding structured conductor; mechanically punching material from the unstructured conductor to form the corresponding structured conductor; optically removing material from the unstructured conductor to form the corresponding structured conductor; and chemically removing material from the unstructured conductor to form the corresponding structured conductor.

[0040] In one embodiment, each corresponding structured conductor provides a substantially curved current path, or more specifically, a defined helical current path (see, for example, Figures 5A to 5D).

[0041] Other method steps for forming each structured conductor on the corresponding layers are also contemplated and disclosed herein. For example, the step of forming a first outer layer 10, an intermediate layer 20 of N(i), a second outer layer 30, or any combination thereof, includes the step of depositing an additional conductive metal in the form of a structured conductor that directly bonds the structured conductor to the corresponding first ceramic 201, an (i) instance of the second ceramic 202, and a third ceramic 203, wherein the corresponding structured conductor defines the electrical paths of the corresponding first conductor 101, an (i) instance of the second conductor 102, a third conductor 103, and a fourth conductor 104. In one embodiment, the step of forming the intermediate layer 20 of N(i) includes the step of depositing an additional conductive metal in the form of a structured conductor, which directly bonds the structured conductor to the corresponding (i) instance of the second ceramic 202, wherein the corresponding structured conductor defines the electrical path of the corresponding (i) instance of the second conductor 102.

[0042] In one embodiment, any instance of the aforementioned conductor is made from copper or aluminum, and any instance of the aforementioned ceramic is made from aluminum nitride, HPS zirconia-doped ceramic, aluminum dioxide, or silicon dioxide.

[0043] In one embodiment, the aforementioned thickness T is 35 microns or more and 400 microns or less, or the thickness T is 65 microns or more and 200 microns or less.

[0044] In one embodiment, any instance of the aforementioned layer has a thickness H of 70 microns or more and 1000 microns or less, or any instance of the aforementioned layer has a thickness of 70 microns or more and 500 microns or less.

[0045] In one embodiment, any instance of the aforementioned structured conductor has a C-shaped edge winding shape (represented by the plan views shown in Figures 5A to 5D, in which the cross-section of the corresponding structured conductor is, for example, rectangular).

[0046] Herein, with particular reference to Figures 2A to 2D which show different partial cross-sectional views of exemplary double-sided conductor-ceramic laminated arrangements for induction coil assemblies, the laminated configuration serves to illustrate a method for manufacturing induction coil assembly 1000 (shown in the exploded assembly diagram), and the method, in one embodiment, A step of forming a first outer layer 10 having a first conductor 101 joined to a first side surface of a first ceramic 201 and a second conductor 102 joined to a second side surface of the first ceramic 201, wherein the second side surface of the first ceramic 201 is on the opposite side of the first side surface of the first ceramic 201, the first conductor 101 has a thickness T, and the second conductor 102 has a thickness (y)T (i.e., y times T), A step of forming at least one intermediate layer 20 having an instance of a third conductor 103 joined to a first side surface of an instance of a second ceramic 202, and an instance of a fourth conductor 104 joined to a second side surface of an instance of the second ceramic 202, wherein the second side surface of the instance of the second ceramic 202 is on the opposite side of the first side surface of the instance of the second ceramic 202, the instance of the third conductor 103 has a thickness (x)T (i.e., x times T), and the instance of the fourth conductor 104 has a thickness (y)T. A step of forming a second outer layer 30 having a fifth conductor 105 joined to a first side surface of a third ceramic 203 and a sixth conductor 106 joined to a second side surface of the third ceramic 203, wherein the second side surface of the third ceramic 203 is on the opposite side of the first side surface of the third ceramic 203, the fifth conductor 105 has a thickness (x)T, the sixth conductor 106 has a thickness T, x is between 0 and 1, and x+y is equal to 1 (or y is between 0 and 1), The steps include laminating at least one intermediate layer 20 with the first outer layer 10 such that the third conductor 103 of at least one intermediate layer 20 is positioned adjacent to the second conductor 102 of the first outer layer 10, The steps include stacking the second outer layer 30 with at least one intermediate layer 20 such that the fifth conductor 105 of the second outer layer 30 is positioned adjacent to an instance of the fourth conductor 104 of at least one intermediate layer 20, The steps include aligning an instance of the third conductor 103 of at least one intermediate layer 20 with the second conductor 102 of the first outer layer 10, and aligning the fifth conductor 105 of the second outer layer 30 with an instance of the fourth conductor 104 of at least one intermediate layer 20, The method includes the steps of directly joining an instance of the third conductor 103 of at least one intermediate layer 20 to the second conductor 102 of the first outer layer 10, and directly joining the fifth conductor 105 of the second outer layer 30 to an instance of the fourth conductor 104 of at least one intermediate layer 20.

[0047] From the aforementioned references to the variables "x" and "y", it can be seen that in the embodiment where x=1 and y=0, the layered structure in Figure 2A is similar to the structure in Figure 1A. Therefore, it can be seen that the two layered structures in Figures 1A-1B and Figures 2A-2D are not mutually exclusive.

[0048] In one embodiment, the aforementioned step of forming at least one intermediate layer 20 of the induction coil assembly 1000 includes the step of forming two or more intermediate layers 20, 20.1, 20.2, 20.3, each of the intermediate layers 20 comprising instances of a third conductor 103.1, 103.2, 103.3 bonded to a first side of corresponding instances of a second ceramic 202.1, 202.2, 202.3, and instances of a fourth conductor 104.1, 104.2, 104.3 bonded to a second side of corresponding instances of the second ceramic 202.1, 202.2, 202.3, wherein each instance of the third conductor 103.1, 103.2, 103.3 has a thickness (x)T, and each instance of the fourth conductor 104.1, 104.2, 104.3 has a thickness (y)T.

[0049] In one embodiment, the aforementioned lamination step of at least one intermediate layer 20 of the induction coil assembly 1000 includes the steps of laminating the first of the plurality of intermediate layers 20.1 with the first outer layer 10 such that a corresponding instance 103.1 of the third conductor of the first of the plurality of intermediate layers 20.1 is positioned adjacent to the second conductor 102 of the first outer layer 10, and laminating the second of the plurality of intermediate layers 20.2 with the first of the plurality of intermediate layers 20.1 such that a corresponding instance 103.2 of the third conductor of the second of the plurality of intermediate layers 20.2 is positioned adjacent to the corresponding instance 104.1 of the fourth conductor of the first of the plurality of intermediate layers 20.1.

[0050] In one embodiment, the aforementioned lamination step of the second outer layer 30 of the induction coil assembly 1000 includes the step of laminating the second outer layer 30 with the second of the intermediate layers 20.2 such that the fifth conductor 105 of the second outer layer 30 is positioned adjacent to the corresponding instance 104.2 of the fourth conductor of the second of the intermediate layers 20.2.

[0051] Referring specifically to Figures 2A to 2D, one embodiment of a method for manufacturing an induction coil assembly 1000 is as follows: A step of forming a first outer layer 10 having a first conductor 101 joined to a first side surface of a first ceramic 201 and a second conductor 102 joined to a second side surface of the first ceramic 201, wherein the second side surface of the first ceramic 201 is on the opposite side of the first side surface of the first ceramic 201, the first conductor 101 has a thickness T, and the second conductor 102 has a thickness (y)T, A step of forming an intermediate layer 20 of N(i), where (i) is an integer from 1 to M, N(i) represents the individual i-th intermediate layers 20.1, 20.2, 20.3, N(M) is the maximum defined number of intermediate layers 20 of N(i), and each of the intermediate layers 20 of N(i) is 103.1, 103.2 of a third conductor, bonded to the first side of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, and 104.1, 104.2, 104.3 of a fourth conductor, bonded to the second side of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, wherein the second side of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic The surface is on the opposite side of the first side of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, and the corresponding (i) instances 103.1, 103.2, 103.3 of the third conductor have a thickness (x)T, and the corresponding (i) instances 104.1, 104.2, 104.3 of the fourth conductor have a thickness (y)T, such that the (i) instances 103.1, 103.2 of the third conductor and the (i) instances 104.1, 104.2, 104.3 of the fourth conductor Steps including, A step of forming a second outer layer 30 comprising a fifth conductor 105 joined to a first side surface of a third ceramic 203 and a sixth conductor 106 joined to a second side surface of the third ceramic 203, wherein the second side surface of the third ceramic 203 is on the opposite side of the first side surface of the third ceramic 203, the fifth conductor 105 has a thickness (x)T, the sixth conductor 106 has a thickness T, x is between 0 and 1, and x+y is equal to 1 (or y is between 0 and 1), The steps include stacking the intermediate layers 20.1, 20.2, and 20.3 of N(1) to N(M) with the first outer layer 10 such that the corresponding instance 103.1 of the third conductor of the intermediate layer 20.1 of N(1) is positioned adjacent to the second conductor 102 of the first outer layer 10, The steps include stacking the second outer layer 30 with the intermediate layers 20.1 (when M=1), 20.2 (when M=2), and 20.3 (when M=3) of N(M) such that the fifth conductor 105 of the second outer layer 30 is positioned adjacent to the corresponding instances 104.1, 104.2, and 104.3 of the fourth conductor of the intermediate layers 20.1, 20.2, and 20.3 of N(M), The steps include aligning the corresponding instance 103.1 of the third conductor of the intermediate layer 20.1 of N(1) with the second conductor 102 of the first outer layer 10, and aligning the fifth conductor 105 of the second outer layer 30 with the corresponding instances 104.1, 104.2, and 104.3 of the fourth conductor of the intermediate layers 20.1, 20.2, and 20.3 of N(M), At a minimum, the steps include directly joining the corresponding instance 103.1 of the third conductor of the intermediate layer 20.1 of N(1) to the second conductor 102 of the first outer layer 10, and directly joining the fifth conductor 105 of the second outer layer 30 to the corresponding instances 104.1, 104.2, and 104.3 of the fourth conductor of the intermediate layers 20.1, 20.2, and 20.3 of N(M), and Includes.

[0052] In one embodiment, each conductor-ceramic interface of the induction coil assembly 1000 undergoes a direct bonding (DBC) process.

[0053] In one embodiment, the intermediate layers 20.1, 20.2, and 20.3 of N(i) include the N(i) instances 20.1 and 20.2 of the intermediate layer (the relatively lower of the intermediate layers) and the N(i+1) instances 20.2 and 20.3 of the intermediate layer (the corresponding relatively higher of the intermediate layers), and the step of stacking the intermediate layers N(1) to N(M) is: Step 1: Stack the N(i+1) instances 20.2 and 20.3 of the intermediate layer with the corresponding N(i) instances 20.1 and 20.2 of the intermediate layer, such that the corresponding instances 103.2 and 103.3 of the third conductor of the N(i+1) instances 20.2 and 20.3 of the intermediate layer are positioned adjacent to the corresponding instances 104.1 and 104.2 of the fourth conductor of the N(i) instances 20.1 and 20.2 of the intermediate layer. Includes.

[0054] In one embodiment, the alignment step in a method for manufacturing an induction coil assembly 1000 includes aligning the corresponding instances 103.2, 103.3 of the (upper) third conductor of the N(i+1) instances 20.2, 20.3 of the intermediate layer with the corresponding instances 104.1, 104.2 of the (lower) fourth conductor of the N(i) instances 20.1, 20.2 of the intermediate layer.

[0055] In one embodiment, the direct joining step in a method for manufacturing an induction coil assembly 1000 further includes the step of directly joining the corresponding instances 103.2, 103.3 of the (relatively upper) third conductor of the N(i+1) instances 20.2, 20.3 of the intermediate layer to the corresponding instances 104.1, 104.2 of the (relatively lower) fourth conductor of the N(i) instances 20.1, 20.2 of the intermediate layer.

[0056] Comparing this to the above explanation of Figure 1B, which shows an offset arrangement of conductor layers in which the right side (end) of conductor layer 103 partially overlaps the gap 40a of conductor layer 102, a similar partially overlapping arrangement can be seen in layer 20 of Figure 2C, and a fully overlapping arrangement can be seen in layer 20 of Figure 2D.

[0057] Referring specifically to Figure 3, Figure 3 shows a method for manufacturing the induction coil assembly 3000 (shown in the exploded assembly diagram), and the method is as follows: A step of forming layer 10 of N(i), where (i) is an integer from 1 to M, N(i) represents the individual i-th layers 10.1, 10.2, 10.3, N(M) is the maximum defined number of layers 10 of N(i), and each of layers 10 of N(i) is Instances 101.1, 101.2, 101.3 of first conductors are bonded to the first side surfaces of instances 200.1, 200.2, 200.3 of ceramic, wherein the second side surface of the corresponding instance 200.1, 200.2, 200.3 of ceramic is on the opposite side of the first side surface of the corresponding instance 200.1, 200.2, 200.3 of ceramic, The (i) instances 102.1, 102.2, 102.3 of the second conductor are bonded to the corresponding second sides of the (i) instances 200.1, 200.2, 200.3 of the ceramic and A step comprising, wherein the (i) instances 101.1, 101.2, and 101.3 of the first conductor have a thickness (x)T, and the (i) instances 102.1, 102.2, and 102.3 of the second conductor have a thickness (y)T, For (i=1~M-1), the steps include stacking and aligning layers 10.1, 10.2, and 10.3 of N(1) to N(M) such that corresponding instances 101.2, 101.3 of the first conductors of layers 10.2, 10.3 of N(i+1) are positioned adjacent to corresponding instances 102.1, 102.2 of the second conductors of layers 10.1, 10.2 of N(i), and The third conductor 103 is stacked and aligned with the corresponding instance 101.1 of the first conductor in layer 10.1 of N(1), and the fourth conductor 104 is stacked and aligned with the corresponding instances 102.2 and 102.3 of the second conductors in the corresponding layers 10.2 and 10.3 of N(M). At a minimum, the step of directly joining a third conductor 103 to the corresponding first conductor 101.1 of layer 10.1 of N(1), and directly joining a fourth conductor 104 to the corresponding second conductors 102.2 and 102.3 of layers 10.2 and 10.3 of N(M), wherein the third conductor 103 has a thickness (y)T, and the fourth conductor 104 has a thickness (x)T, where x is between 0 and 1 and x+y is equal to 1 (or y is between 0 and 1), Includes.

[0058] In one embodiment, each conductor-conductor interface of the induction coil assembly 1000 undergoes a direct bonding (DBC) process.

[0059] Referring to the induction coil assembly 3000 shown in Figure 3, where i=3 (shown on the right side of Figure 3), the resulting assembled and joined lower conductor 101.1+103 and the resulting assembled and joined upper conductor 102.3+104 each have a thickness T and are not patterned as structured conductors as described herein, while the assembled and joined intermediate conductors 102.1+101.2 and 102.1+101.3 each have a thickness T and are patterned as structured conductors as described herein. In one embodiment, the outermost conductor layers of a given induction coil 1000, 2000, 3000 are not patterned as structured conductors because these layers are used for other electrical purposes.

[0060] In addition to all of the foregoing, and with particular reference to Figure 4A, a method for manufacturing any one of the aforementioned induction coils 1000, 2000, 3000 having one or more of the gaps 40a, 40b (see, for example, Figures 1B and 2C) may have air-filled gaps 40a, 40b. Alternatively, a method for manufacturing any one of the aforementioned induction coils 1000, 2000, 3000 having one or more of the gaps 40a, 40b may further include the steps of providing the first polymer or resin 60a in the corresponding gaps 40a, 40b on the same side of the (i) instance 202.1 of the second ceramic as the corresponding (i) instance 102.1 of the second structured conductor (see, for example, Figure 1B, 40a.1), and providing the second polymer or resin 60b in the corresponding gaps 40a, 40b on the same side of the (i+1) instance 202.2 of the second ceramic as the corresponding (i+1) instance 102.2 of the second structured conductor (see, for example, Figure 1B, 40a.2).

[0061] In one embodiment, the first polymer 60a is located on the region of the second ceramic (i) instance 202.1 without the material 40a.1 of the corresponding (i) instance 102.1 of the second structured conductor, and the second polymer is located on the region of the second ceramic (i+1) instance 202.2 without the material 40a.2 of the corresponding (i+1) instance 102.2 of the second structured conductor, and the voids are located in the gaps 40a, 40b and / or spacings 42a, 42b between the windings of the coils of the structured conductors 101-104 of the induction coils 1000, 2000, 3000 (see, for example, Figures 5B and 6B) (see, for example, Figure 1B).

[0062] In one embodiment, the first polymer 60a (which may be in, for example, gap 40a.1) has the same thickness as the (i) instance 102.1 of the second structured conductor, and the second polymer 60b (which may be in, for example, gap 40a.2) has the same thickness as the (i+1) instance 102.2 of the second structured conductor.

[0063] Considering the above, and referring to Figure 1B, one embodiment of a method for manufacturing arbitrary induction coil assemblies 1000, 2000, 3000 is the step of providing a first polymer 60a on the same side of a first structured conductor 101 of a first ceramic 201; providing an (i) instance of a second polymer 60b on the same side of an (i) instance 202.1 of a second ceramic, on the same side of the corresponding (i) instance 102.1 of a second structured conductor; and providing a second polymer 60b on the same side of an (i+1) instance 202.2 of a second ceramic, on the same side of the corresponding (i+1) instance 102.2 of a second structured conductor. The method includes the step of providing an (i+1) instance of 60b, wherein the first polymer is placed in a region 40a of the first ceramic 201 that is free of the material of the first structured conductor 101, the (i) instance of the second polymer 60b is placed in a region 40a.1 of the second ceramic (i) instance 202.1 that is free of the material of the second structured conductor (i) instance, and the (i+1) instance of the second polymer 60b is placed in a region 40a.1 of the second ceramic (i+1) instance 202.2 that is free of the material of the second structured conductor (i+1) instance 102.2.

[0064] In one embodiment of a single-sided conductor-ceramic laminate arrangement (see, for example, Figure 1B), the first polymer 60a has the same thickness as the second polymer 60a.

[0065] In one embodiment of a double-sided conductor-ceramic laminate arrangement (see, for example, Figure 2B), the first polymer 60a has the same thickness as the second polymer 60a, and this same thickness is equal to T / 2.

[0066] In one embodiment (referring particularly to Figure 1A), a first outer layer 10, an intermediate layer 20 of N(i), and a second outer layer 30 form an arbitrary induction coil assembly 2000 (see also 1000, 3000) having a plurality of conductive layers 101-104 formed by corresponding first conductors 101, (i) instances 102.1, 102.2, 102.3 of the second conductor, a third conductor 103, and a fourth conductor 104 arranged sequentially and alternately with respect to each other, and ceramic layers 201-203 formed by corresponding first ceramics 201, (i) instances 202.1, 202.2, 202.3 of the second ceramic, and a third ceramic 203.

[0067] In one embodiment (see Figures 1A and 4A-4C in particular), at least two adjacent conductive layers 103, 104 having a thickness T (see Figures 1A and 4C) are electrically connected to each other by an electrical connection portion 300 (see Figures 4A-4C) that crosses one of an intervening ceramic layer 203 (best seen in Figure 1A).

[0068] In one embodiment (see Figures 1A, 4A, 4B, and 4D in particular), at least two of every other of a plurality of conductive layers 101, 103 having a thickness T (see Figures 1A and 4D) are electrically connected to each other by an electrical connection 300 (see Figures 4A, 4B, and 4D) that traverses one or more interposed ceramic layers 201, 202 (best seen in Figure 1A).

[0069] In one embodiment, the electrical connection portion 300 includes spacers 301, 302, and 304 integrally formed in the regions between adjacent layers of a plurality of ceramic layers 201, 202, and 203, and the spacers 301, 302, and 304 are not electrically connected to the corresponding conductive layers in the corresponding layers (for example, 101 and 102 in Figures 1A and 4C, and 102 and 104 in Figures 1A and 4D).

[0070] In one embodiment, the electrical connection portion 300 includes one or more electrically filled or electrically plated vias 310.

[0071] In Figures 4C and 4D, the vertical ellipse 350 indicates that the electrical connection 300 may extend upward and / or downward to include additional intermediate layers 20.1, 20.3, 20.3, and the horizontal ellipse 360 ​​indicates that the corresponding conductors 101, 103, 104 may extend left and / or right to form a structured conductor (see Figures 5A-5D and 6A-6D for the most accurate illustration).

[0072] Figures 4A and 4B show edge electrical connections 500 (electrically connected to the outer or inner edge of the corresponding structured conductor), which may or may not be used in conjunction with conductive vias 310. The edge electrical connections are also shown and described in relation to Figures 5C, 5D, 6C, and 6D, and will be described further below.

[0073] Referring here to Figures 4A, 4B, and 5A, Figures 4A, 4B, and 5A show one or more alignment pins 400 used to align a plurality of layers 10, 20, 30, conductive layers 101-104, and ceramic layers 201-203 in a laminated configuration of a single-sided or double-sided conductor-ceramic laminate arrangement for induction coil assemblies 1000, 2000, 3000, as disclosed herein. Although Figures 4A and 4B show the alignment pins 400 appearing to penetrate the conductive layers, this is not ideal, and preferably the plurality of alignment pins 400 penetrate the region of the ceramic layer outside the periphery of the structured conductive layer in the bonded and laminated arrangement, as shown in the top view of Figure 5A. Here, once the laminations are aligned and joined to one another, the outer portion 450 of the laminations, including the alignment pins and the non-functional portion of the ceramic layer, can be removed by any means suitable for the purposes disclosed herein to facilitate the economical implementation of the induction coil assembly (for example, Figures 5B to 5D show the portion 450 removed compared to Figure 5A).

[0074] In one embodiment, each instance of the conductor is formed from the same material as another different instance of the conductor.

[0075] With respect to all of the above, it will be understood that the method for manufacturing the induction coil assemblies 1000, 2000, and 3000 includes a process in which a first conductor 101 bonded to a first side surface of a first ceramic 201 is bonded at a first surface-to-surface interface; each (i) instance 102.1, 102.2, and 102.3 of a second ceramic, bonded to a first side surface of corresponding (i) instances 202.1, 202.2, and 202.3 of a second ceramic, is bonded at the corresponding (i) instance of a second surface-to-surface interface; a third conductor 103 bonded to a first side surface of a third ceramic 203 is bonded at a third surface-to-surface interface; and a fourth conductor 104 bonded to the third ceramic 203 of a second outer layer 30 is bonded at a fourth surface-to-surface interface. The manufacturing method further includes a process step of direct bonding by heating and a direct bonding copper process by forming a copper-oxygen eutectic that wets the corresponding first, second, third, and fourth surface-surface interfaces.

[0076] Alternatively, and relating to all of the above, it will be understood that a method for manufacturing induction coil assemblies 1000, 2000, 3000 includes a process in which a first conductor 101 bonded to a first side surface of a first ceramic 201 is bonded at a first surface-to-surface interface; each (i) instance 102.1, 102.2, 102.3 of a second ceramic, bonded to a first side surface of corresponding (i) instances 202.1, 202.2, 202.3 of a second ceramic, is bonded at the corresponding (i) instance of a second surface-to-surface interface; a third conductor 103 bonded to a first side surface of a third ceramic 203 is bonded at a third surface-to-surface interface; and a fourth conductor 104 bonded to the third ceramic 203 of a second outer layer 30 is bonded at a fourth surface-to-surface interface. The manufacturing method further includes a process step of chemically bonding by applying a bonding agent that wets the corresponding surface-to-surface interfaces among the first, second, third, and fourth surface-to-surface interfaces. In one embodiment, the bonding agent includes one or more of a prepreg material, a polymer paste, and a ceramic paste.

[0077] In relation to all of the above, a method for manufacturing induction coil assemblies 1000, 2000, 3000 further includes a process step of providing gaps 40a, 40b in any instance of the aforementioned conductors within the corresponding conductors (see, for example, Figures 4B, 5B, and 6B) that cause an electrical break. In one embodiment, each gap in the corresponding conductors of an adjacent pair of conductors is positioned directly facing each other (see Figures 1B and 2B). In one embodiment, each gap in the corresponding conductors of an adjacent pair of conductors is positioned offset from each other and not directly facing each other (see Figures 1B, 2C, and 2D). In one embodiment, each gap in the corresponding conductors of an adjacent pair of conductors has equal gap dimensions (see Figures 1B, 2B, 2C, and 2D). In one embodiment, each gap in the corresponding conductors of an adjacent pair of conductors has unequal gap dimensions (see Figures 1B, 2C, and 2D). In one embodiment, a method for manufacturing induction coil assemblies 1000, 2000, 3000 further includes a process step of filling one or more of the aforementioned voids with a dielectric material.

[0078] Referring here to Figures 5A-5D and 6A-6D, Figures 5A-5D and 6A-6D generally show alternative arrangements of the A-conductor-ceramic layers in the left image and the B-conductor-ceramic layers in the right image, which are stacked, aligned, and joined in an alternating arrangement as disclosed herein, in which adjacent pairs of A-conductors are electrically connected and adjacent pairs of B-conductors are electrically connected. In Figures 5A-5D, the structured conductors of the A and B layers are in a helical form, and in Figures 6A-6D, the structured conductors of the A and B layers are in a rectangular form.

[0079] In one embodiment, with respect to all of the above, a method for manufacturing induction coil assemblies 1000, 2000, 3000 further includes the step of forming a first outer layer 10, an intermediate layer 20 of N(i), and a second outer layer 30 to define an A-layer structure and a B-layer structure that alternate with each other in the arrangement of stacked ABAB or BABA layers.

[0080] In one embodiment, with respect to all of the above, a method for manufacturing induction coil assemblies 1000, 2000, 3000 further includes the step of forming a first conductor 101, each (i) instance of the second ceramic 202, and a fourth conductor 104, to define an A-conductor structure and a B-conductor structure that alternate with each other in a stacked ABAB conductor or BABA conductor arrangement, where the (i) instances of the first ceramic 201, the (i) instances of the second ceramic 202, and the corresponding third ceramic 203 are arranged between adjacent A-conductors and B-conductors.

[0081] In one embodiment, referring to Figure 5A, each A-conductor and each B-conductor is a structured conductor in the form of multiple windings having first outer ends A1, B1 and second inner ends A2, B2, the first outer end A1 of the first A-conductor is electrically connected to the next adjacent A-conductor in the stack by a conductive via 310A through the B-ceramic, and the second inner end B2 of the first B-conductor is electrically connected to the next adjacent B-conductor in the stack by an electrically connected via 310B through the A-ceramic (see also Figure 4D).

[0082] In one embodiment, referring to Figure 5B, conductor A and conductor B are each formed on each winding with a smooth electrical path without stepped electrical paths. Conductor A has an electrically disconnected section between its corresponding first outer end A1 and second inner end A2, forming a third intermediate end A3 and a fourth intermediate end A4 with an electrical gap 40a between them. The third intermediate end A3 is electrically connected to the first outer end A1, and the fourth intermediate end A4 is electrically connected to the second inner end A2. The presence of the electrical gap 40a between the third intermediate end A3 and the fourth intermediate end A4 serves to isolate the capacitance between the A layer and the B layer (see also Figures 6B and 6C, described below). Here, the first outer end and second inner end of conductor A are electrically connected to the first outer end and second inner end of the next adjacent A conductor in the stack by electrically connected vias 310A through the B-ceramic.

[0083] In one embodiment, corresponding electrically connected conductors are electrically connected by electrically filled or electrically plated vias 300, 310.

[0084] In one embodiment, referring to Figure 5C, corresponding electrically connected conductors are electrically connected to the next adjacent corresponding conductor by electrical connection parts 500 along the ends (A - 500A connecting conductors together, and B - 500B connecting conductors together).

[0085] Figure 5D shows features such as 40a and 500A, similar to those described above in this specification.

[0086] As shown in Figures 5A to 5D, each of the multiple windings, A-conductor, and B-conductor has a curved or circular shape, as observed in the plan view of the corresponding layer.

[0087] Referring to Figures 6A to 6B, one embodiment includes an arrangement in which each of the multiple windings, A'-conductors and B'-conductors has a rectangular or square shape, as observed in the plan view of the corresponding layer. While further detail is unnecessary, Figures 6A to 6C show features such as 40a, 42a, 42b, 310A, 310B, and 500A, similar to those described herein.

[0088] In comparison, Figure 6D not only shows a current path and electrical connection along the end similar to that in Figure 6C, but also shows the stepped current path within the B'-conductor and the capacitive decoupling gap 40a within the A'-conductor in the stepped section 110. Although the xy-plan view of the stepped section 110 is shown only in Figure 6D, it will be understood that other structured current paths in other configurations are possible and intended in the various figures disclosed herein. It will also be understood that the plated via 310 described herein also serves as a z-direction step in the associated current path of the corresponding electrically connected structured conductor.

[0089] In one embodiment, with respect to all of the above, any instance of the alignment process step includes the use of one or more alignment pins 400 (see Figures 4A, 4B, and 5A).

[0090] In one embodiment, the alignment process step further includes positioning one or more alignment pins 400 such that the one or more alignment pins 400 penetrate all instances of the ceramic layer.

[0091] In one embodiment, the alignment process step further includes positioning one or more alignment pins 400 such that none of the alignment pins 400 penetrate any instance of the conductive layer.

[0092] While certain embodiments disclosed herein illustrate specific patterns for structured conductive layers, it will be understood, by referring to, for example, Figures 5A–5D and 6A–6D, that other patterns for structured conductive layers are not only possible but also intended herein. It will also be understood that induction coil assemblies disclosed herein having multiple structured conductive layers in the form of windings may have different numbers of windings for one or more of the structured conductive layers in a stacked arrangement between multiple ceramic layers.

[0093] While the invention is described herein with reference to exemplary embodiments, it will be understood by those skilled in the art that various modifications may be made without departing from the claims, and equivalents may be substituted for the elements. Many modifications may be made to adapt the teachings of the invention to specific situations or materials without departing from the essential scope of the invention. Thus, the invention is not limited to one or more specific embodiments disclosed herein as the best or only mode intended to carry out the invention, and the invention is intended to include all embodiments that fall within the scope of the appended claims. Exemplary embodiments are disclosed in the drawings and description, and specific terms and / or dimensions may be used, but they are used only in a general, illustrative and / or descriptive sense and not for limiting purposes unless otherwise specified, and therefore the claims are not limited in that sense. Where an element such as a layer, film, region, substrate, or other described feature is referred to as being "on top of" another element or "engaged with" another element, it may be directly on top of the other element or directly engaged with the other element, or an intervening element may be present. In contrast, when one element is referred to as being "directly on top of" another element, or "directly engaged with" another element, there is no intervening element. The use of terms such as first, second, etc., does not indicate order or importance, but rather is used to distinguish one element from another. The use of terms such as a, an, etc., does not indicate a limitation of quantity, but rather indicates the presence of at least one of the items being referred to. The use of terms such as "top," "bottom," "up," "down," "left," "right," "front," "back," etc., or any reference to orientation, does not indicate a limitation of structure, since a structure may be viewed from two or more orientations, but rather indicates a relative structural relationship between one or more of the associated features disclosed herein. The term "comprising" as used herein does not exclude the possibility of including one or more additional features.Any background information provided herein is provided to clarify information that the applicant considers to be potentially relevant to the invention disclosed herein. It is not necessarily intended, nor should it be construed, to accept that any such background information constitutes prior art to the embodiments of the invention disclosed herein.

[0094] In consideration of all of the above, it will be understood that various embodiments of the model are disclosed herein, including but not limited to the following embodiments and / or combinations thereof.

[0095] Embodiment 1: A method for manufacturing an induction coil assembly 2000, the method comprising the steps of: forming a first outer layer 10 comprising a first conductor 101 bonded to a first side surface of a first ceramic 201, wherein a second side surface of the first ceramic 201 is on the opposite side of the first side surface of the first ceramic 201, and the first conductor 101 has a thickness T; and forming an intermediate layer 20 of N(i), where (i) is an integer from 1 to M, N(i) represents individual i-th intermediate layers 20.1, 20.2, 20.3, and N(M) represents the intermediate layer of N(i). The maximum number defined, where each of the N(i) intermediate layers 20 is an (i) instance 102.1, 102.2, 102.3 of a second conductor bonded to the first side of the corresponding (i) instance 202.1, 202.2, 202.3 of the second ceramic, where the second side of the corresponding (i) instance 202.1, 202.2, 202.3 of the second ceramic is on the opposite side of the first side of the corresponding (i) instance 202.1, 202.2, 202.3 of the second ceramic, and the corresponding (i) instance 102.1 of the second conductor Steps include: forming a second outer layer 30 comprising (i) instances 102.1, 102.2, 102.3 of a second conductor having a thickness T, and a third conductor 103 bonded to a first side surface of a third ceramic 203, wherein the second side surface of the third ceramic 203 is opposite to the first side surface of the third ceramic 203, and the third conductor 103 has a thickness T, and the corresponding instance 102.1 of the second conductor of the intermediate layer 20.1 of N(1) is bonded to the first ceramic 2 of the first outer layer 10 The steps include: laminating intermediate layers 20.1, 20.2, and 20.3 of N(1) to N(M) with the first outer layer 10 so that they are positioned adjacent to the second side surface of 01; laminating the second outer layer 30 with the corresponding intermediate layers 20.1, 20.2, and 20.3 of N(M) so that the third conductor 103 of the second outer layer 30 is positioned adjacent to the corresponding instances 202.1, 202.2, and 202.3 of the second ceramic of the corresponding intermediate layers 20.1, 20.2, and 20.3 of N(M); and laminating the corresponding instance 102 of the second conductor of the intermediate layer 20.1 of N(1).A method comprising the steps of: aligning 1 with the first ceramic 201 of the first outer layer 10; aligning the third conductor 103 of the second outer layer 30 with the corresponding instances 202.1, 202.2, and 202.3 of the second ceramic of the corresponding intermediate layers 20.1, 20.2, and 20.3 of N(M); laminating and aligning the fourth conductor 104 with the second side surface of the third ceramic 203 of the second outer layer 30; and directly bonding at least the corresponding instance 102.1 of the second conductor of the intermediate layer 20.1 of N(1) to the first ceramic 201 of the first outer layer 10; and directly bonding the fourth conductor 104 to the third ceramic 203 of the second outer layer 30.

[0096] Embodiment 2: The method according to Embodiment 1, further comprising the step of stacking intermediate layers 20.1, 20.2, 20.3 of N(1) to N(M) such that the (i+1) instances 20.2, 20.3 of the intermediate layers are stacked with the corresponding (i) instances 20.1, 20.2 of the intermediate layers such that the corresponding (i+1) instances 102.2, 102.3 of the second conductors of the (i+1) instances 20.2, 20.3 of the intermediate layers are positioned adjacent to the corresponding (i) instances 202.1, 202.2 of the second ceramics of the corresponding (i) instances 20.1, 20.2 of the intermediate layers.

[0097] Embodiment 3: The method according to Embodiment 1 or 2, wherein each (i) instance of the first conductor 101, the second conductor 102, the third conductor 103, and the fourth conductor 104 each form a corresponding structured conductor.

[0098] Embodiment 4: The method according to Embodiment 3, wherein each of the first structured conductor, the (i) instance of the second structured conductor, the third structured conductor, and the fourth structured conductor is formed by directly bonding the corresponding conductor to the corresponding ceramic and patterning the corresponding conductor to form the corresponding structured conductor.

[0099] Embodiment 5: The method according to Embodiment 4, wherein the patterning of the corresponding conductor defines the electrical path of the corresponding structured conductor from the first end to the second end of the corresponding structured conductor.

[0100] Embodiment 6: The method according to Embodiment 5, wherein at least one of the electrical paths is electrically continuous and uninterrupted.

[0101] Embodiment 7: The method according to Embodiment 4, wherein the patterning of the corresponding conductor comprises applying a mask to the corresponding conductor, etching the exposed portion of the corresponding conductor, and removing the mask to define the electrical path of the corresponding structured conductor from a first end to a second end of the corresponding structured conductor.

[0102] Embodiment 8: The method according to Embodiment 4, further comprising the step of forming a defined conductive path within an unstructured conductor to form a corresponding structured conductor, before directly bonding a corresponding conductor to a corresponding ceramic.

[0103] Embodiment 9: The method according to Embodiment 8, wherein the step of forming a defined conductive path includes one of the following steps: mechanically removing material from an unstructured conductor to form a corresponding structured conductor; mechanically cutting material from an unstructured conductor to form a corresponding structured conductor; mechanically punching material from an unstructured conductor to form a corresponding structured conductor; optically removing material from an unstructured conductor to form a corresponding structured conductor; and chemically removing material from an unstructured conductor to form a corresponding structured conductor.

[0104] Embodiment 10: The method according to any one of Embodiments 3 to 9, wherein each corresponding structured conductor comprises a curved current path.

[0105] Embodiment 11: The method according to any one of Embodiments 3 to 10, wherein each corresponding structured conductor comprises a helical current path.

[0106] Embodiment 12: The method according to any one embodiment 1 to 11, comprising the step of forming a first outer layer 10, an intermediate layer 20 of N(i), a second outer layer 30, or any combination thereof, depositing an additional conductive metal in the form of a structured conductor that directly bonds the structured conductor to the corresponding of the first ceramic, the (i) instance of the second ceramic, and the third ceramic, wherein the corresponding structured conductor defines the electrical paths of the corresponding of the first conductor, the (i) instance of the second conductor, the third conductor, and the fourth conductor.

[0107] Embodiment 13: The method according to any one embodiment 1 to 11, comprising the step of forming an intermediate layer of N(i) by depositing an additional conductive metal in the form of a structured conductor, which directly bonds the structured conductor to a corresponding instance of a second ceramic (i), wherein the corresponding structured conductor defines an electrical path to the corresponding instance of the second conductor (i).

[0108] Embodiment 14: The method according to any one of Embodiments 1 to 13, wherein an optional instance of the conductor comprises copper or aluminum.

[0109] Embodiment 15: The method according to any one of Embodiments 1 to 14, wherein any instance of the ceramic comprises aluminum nitride, HPS zirconia-doped ceramic, aluminum dioxide, or silicon dioxide.

[0110] Embodiment 16: The method according to any one of Embodiments 1 to 15, wherein the thickness T is 35 microns or more and 400 microns or less.

[0111] Embodiment 17: The method according to any one of Embodiments 1 to 16, wherein the thickness T is 65 microns or more and 200 microns or less.

[0112] Embodiment 18: The method according to any one of Embodiments 1 to 17, wherein any instance of the layer has a thickness of 70 microns or more and 1000 microns or less.

[0113] Embodiment 19: The method according to any one of Embodiments 1 to 18, wherein any instance of the layer has a thickness of 70 microns or more and 500 microns or less.

[0114] Embodiment 20: The method according to any one of Embodiments 3 to 11, wherein any instance of the structured conductor has a C-shaped edge winding shape.

[0115] Embodiment 21: The method according to any one of Embodiments 1 to 20, wherein each instance of the conductor is formed of the same material as another different instance of the conductor.

[0116] Embodiment 22: The method according to any one of Embodiments 3 to 11, further comprising the steps of providing a first polymer on the same side of a second ceramic (i) instance as the corresponding second structured conductor (i) instance, and providing a second polymer on the same side of a second ceramic (i+1) instance as the corresponding second structured conductor (i+1) instance.

[0117] Embodiment 23: The method according to Embodiment 22, wherein the first polymer is placed in a region on the materialless (i) instance of the second ceramic corresponding to the (i) instance of the second structured conductor, and the second polymer is placed in a region on the materialless (i+1) instance of the second ceramic corresponding to the (i+1) instance of the second structured conductor.

[0118] Embodiment 24: The method according to Embodiment 23, wherein the first polymer has the same thickness as the (i) instance of the second structured conductor, and the second polymer has the same thickness as the (i+1) instance of the second structured conductor.

[0119] Embodiment 25: The method according to any one embodiment 3 to 11, further comprising the steps of providing a first polymer on the same side of a first ceramic as a first structured conductor; providing a second polymer (i) instance on the same side of a second ceramic (i) instance as a corresponding second structured conductor; and providing a second polymer (i+1) instance on the same side of a second ceramic (i+1) instance as a corresponding second structured conductor, wherein the first polymer is located in a region of the first ceramic that is not present with the material of the first structured conductor; the second polymer (i) instance is located in a region of the second ceramic (i) instance that is not present with the material of the second structured conductor; and the second polymer (i+1) instance is located in a region of the second ceramic (i+1) instance that is not present with the material of the second structured conductor.

[0120] Embodiment 26: The method according to Embodiment 25, wherein the first polymer has the same thickness as the second polymer.

[0121] Embodiment 27: The method according to Embodiment 26, wherein the same thickness is equal to T / 2.

[0122] Embodiment 28: The method according to any one embodiment of 1 to 27, wherein the first outer layer, the intermediate layer of N(i), and the second outer layer form an induction coil assembly having a plurality of conductive layers formed of corresponding first conductors, (i) instances of second conductors, third conductors, and fourth conductors arranged sequentially and alternately with respect to each other, and a ceramic layer formed of corresponding first ceramics, (i) instances of second ceramics, and third ceramics.

[0123] Embodiment 29: The method according to Embodiment 28, wherein at least two of every other of a plurality of conductive layers having a thickness T are electrically connected to each other by an electrical connection that crosses one of a plurality of ceramic layers.

[0124] Embodiment 30: The method according to Embodiment 28, wherein at least two adjacent conductive layers having a thickness T are electrically connected to each other by an electrical connection that crosses one of the ceramic layers interposing them.

[0125] Embodiment 31: The method according to any one of Embodiments 29 to 30, wherein the electrical connection portion includes a spacer integrally formed in the region between adjacent layers of a plurality of ceramic layers, the spacer not electrically connected to a corresponding conductive layer in the corresponding layer.

[0126] Embodiment 32: The method according to any one of Embodiments 29 to 31, wherein the electrical connection comprises one or more electrically filled or electrically plated vias.

[0127] Embodiment 33: The method according to any one embodiment 1 to 32, wherein a first conductor 101 bonded to a first side surface of a first ceramic 201 is bonded at a first surface-to-surface interface, each (i) instance 102.1, 102.2, 102.3 of a second ceramic bonded to a first side surface of corresponding (i) instances 202.1, 202.2, 202.3 of a second ceramic is bonded at corresponding (i) instances of the second surface-to-surface interface, a third conductor 103 bonded to a first side surface of a third ceramic 203 is bonded at a third surface-to-surface interface, and a fourth conductor 104 bonded to a third ceramic 203 of a second outer layer 30 is bonded at a fourth surface-to-surface interface, the method further comprising the steps of heating and direct bonding by a direct bonding copper process by forming a copper-oxygen eutectic that wets the corresponding first, second, third, and fourth surface-to-surface interfaces.

[0128] Embodiment 34: The method according to any one of Embodiments 1 to 32, wherein a first conductor 101 bonded to a first side surface of a first ceramic 201 is bonded at a first surface-to-surface interface, each (i) instance 102.1, 102.2, 102.3 of a second ceramic bonded to a first side surface of corresponding (i) instances 202.1, 202.2, 202.3 of a second ceramic is bonded at corresponding (i) instances of a second surface-to-surface interface, a third conductor 103 bonded to a first side surface of a third ceramic 203 is bonded at a third surface-to-surface interface, and a fourth conductor 104 bonded to a third ceramic 203 of a second outer layer 30 is bonded at a fourth surface-to-surface interface, the method further comprising the step of chemically bonding by applying a bonding agent that wets the corresponding first, second, third, and fourth surface-to-surface interfaces.

[0129] Embodiment 35: The method according to Embodiment 34, wherein the bonding agent comprises one or more of a prepreg material, a polymer paste, and a ceramic paste.

[0130] Embodiment 36: The method according to any one of Embodiments 1 to 35, further comprising the step of providing a gap in any instance of a conductor that causes an electrical break within the corresponding conductor.

[0131] Embodiment 37: The method according to Embodiment 36, wherein each void in a pair of adjacent conductors facing each other is arranged in direct opposition.

[0132] Embodiment 38: The method of Embodiment 37, wherein each gap in a pair of adjacent conductors is offset from each other and not directly facing each other.

[0133] Embodiment 39: The method according to any one of Embodiments 36 to 38, wherein each gap in a pair of adjacent conductors has equal gap dimensions.

[0134] Embodiment 40: The method according to any one of Embodiments 36 to 38, wherein each gap in a pair of adjacent conductors has unequal gap dimensions.

[0135] Embodiment 41: The method according to any one of embodiments 33 to 37, further comprising the step of filling one or more of any instances of the void with a dielectric material.

[0136] Embodiment 42: The method according to any one embodiment of 1 to 41, further comprising the step of forming a first outer layer, an intermediate layer of N(i), and a second outer layer in order to define alternating A-layer and B-layer structures in the arrangement of stacked ABAB or BABA layers.

[0137] Embodiment 43: The method according to any one embodiment of 1 to 42, further comprising the step of forming a first conductor, each (i) instance of a second conductor, a third conductor, and a fourth conductor in order to define alternating A-conductor and B-conductor structures in a laminated ABAB conductor or BABA conductor arrangement in which a first ceramic, an (i) instance of a second ceramic, and a corresponding third ceramic are arranged between adjacent A conductors and B conductors.

[0138] Embodiment 44: The method according to Embodiment 43, wherein each A-conductor and each B-conductor comprises a plurality of winding-type structured conductors having a first outer end and a second inner end, the first outer end of an A-conductor being electrically connected to the first outer end of the next adjacent A-conductor, and the second inner end of a B-conductor being electrically connected to the second inner end of the next adjacent B-conductor.

[0139] Embodiment 45: The method according to Embodiment 44, wherein at least one of the A-conductor and the B-conductor is formed in one or more of the windings at stepped portions in the electrical path.

[0140] Embodiment 46: The method according to Embodiment 45, wherein the stepped portion is oriented in either the z direction or the xy plane of an orthogonal xyz coordinate system.

[0141] Embodiment 47: A - The method according to Embodiment 45 or 46, wherein the conductor has an electrically disconnected portion between a corresponding first outer end and a second inner end, forming a third intermediate end and a fourth intermediate end with an electrical gap between them, the third intermediate end being electrically connected to the first outer end and the fourth intermediate end being electrically connected to the second inner end.

[0142] Embodiment 48: The method according to Embodiment 47, wherein the first outer end and second inner end of an A-conductor are electrically connected to the first outer end and second inner end of the next adjacent A-conductor, respectively.

[0143] Embodiment 49: The method according to any one of Embodiments 45 to 48, wherein the corresponding electrically connected conductors are electrically connected by electrically filled or electrically plated vias.

[0144] Embodiment 50: The method according to any one of Embodiments 45 to 48, wherein the corresponding electrically connected conductors are electrically connected by electrical connections along their ends.

[0145] Embodiment 51: The method according to any one of Embodiments 45 to 50, wherein each of the multiple windings has a curved or circular shape as observed in the plan view of the corresponding layer.

[0146] Embodiment 52: The method according to any one of Embodiments 45 to 50, wherein each of the multiple windings has a rectangular or square shape as observed in the plan view of the corresponding layer.

[0147] Embodiment 53: The method according to any one of Embodiments 1 to 52, wherein any instance of alignment includes the use of one or more alignment pins.

[0148] Embodiment 54: The method according to Embodiment 53, further comprising the step of positioning one or more alignment pins such that the one or more alignment pins penetrate all instances of the ceramic.

[0149] Embodiment 55: The method of Embodiment 54, further comprising the step of positioning one or more alignment pins such that the one or more alignment pins do not penetrate any instance of a conductor.

[0150] Embodiment 56: A method for manufacturing an induction coil assembly 1000, the method comprising: forming a first outer layer 10 comprising a first conductor 101 joined to a first side surface of a first ceramic 201 and a second conductor 102 joined to a second side surface of the first ceramic 201, wherein the second side surface of the first ceramic 201 is on the opposite side of the first side surface of the first ceramic 201, the first conductor 101 has a thickness T, and the second conductor 102 has a thickness (y)T; and forming a third conductor 10 joined to the first side surface of an instance of the second ceramic 202 A step of forming at least one intermediate layer 20 comprising an instance of the third ceramic 203 and an instance of the fourth conductor 104 joined to the second side surface of the instance of the second ceramic 202, wherein the second side surface of the instance of the second ceramic 202 is on the opposite side of the first side surface of the instance of the second ceramic 202, the instance of the third conductor 103 has a thickness (x)T, and the instance of the fourth conductor 104 has a thickness (y)T; and a step of forming a fifth conductor 105 joined to the first side surface of the third ceramic 203 and the third ceramic 203 A step of forming a second outer layer 30 comprising a sixth conductor 106 joined to a second side surface, wherein the second side surface of the third ceramic 203 is on the opposite side of the first side surface of the third ceramic 203, the fifth conductor 105 has a thickness (x)T, the sixth conductor 106 has a thickness T, x is between 0 and 1 and x+y is equal to 1, and at least one intermediate layer 20 is laminated with the first outer layer 10 such that the third conductor 103 of at least one intermediate layer 20 is positioned adjacent to the second conductor 102 of the first outer layer 10, and the fifth of the second outer layer 30 The steps are: stacking the second outer layer 30 with at least one intermediate layer 20 such that conductor 105 is positioned adjacent to an instance of the fourth conductor 104 of at least one intermediate layer 20; aligning an instance of the third conductor 103 of at least one intermediate layer 20 with the second conductor 102 of the first outer layer 10, and aligning the fifth conductor 105 of the second outer layer 30 with an instance of the fourth conductor 104 of at least one intermediate layer 20; and directly joining an instance of the third conductor 103 of at least one intermediate layer 20 to the second conductor 102 of the first outer layer 10.A method comprising the step of directly joining a fifth conductor 105 of a second outer layer 30 to an instance of a fourth conductor 104 of at least one intermediate layer 20.

[0151] Embodiment 57: The step of forming at least one intermediate layer 20 is the step of forming two or more intermediate layers 20.1, 20.2, 20.3, wherein each of the intermediate layers 20 is bonded to the first side surface of the corresponding second ceramic instance 202.1, 202.2, 202.3 and to the second side surface of the corresponding second ceramic instance 202.1, 202.2, 202.3 The method according to embodiment 56, comprising instances 104.1, 104.2, 104.3 of a fourth conductor, wherein each instance 103.1, 103.2, 103.3 of a third conductor has a thickness (x)T, and each instance 104.1, 104.2, 104.3 of a fourth conductor has a thickness (y)T, the third conductor instances 103.1, 103.2, 103.3 and the fourth conductor instances 104.1, 104.2, 104.3, the fourth conductor instances

[0152] Embodiment 58: The method according to Embodiment 57, wherein the step of laminating at least one intermediate layer 20 includes the steps of laminating the first of a plurality of intermediate layers 20.1 with the first outer layer 10 such that a corresponding instance 103.1 of the third conductor of the first of a plurality of intermediate layers 20.1 is positioned adjacent to the second conductor 102 of the first outer layer 10, and laminating the second of a plurality of intermediate layers 20.2 with the first of a plurality of intermediate layers 20.1 such that a corresponding instance 103.2 of the third conductor of the second of a plurality of intermediate layers 20.2 is positioned adjacent to the corresponding instance 104.1 of the fourth conductor of the first of a plurality of intermediate layers 20.1.

[0153] Embodiment 59: The method according to Embodiment 58, wherein the step of laminating a second outer layer is to laminate the second outer layer 30 with a second of a plurality of intermediate layers 20.2 such that the fifth conductor 105 of the second outer layer 30 is positioned adjacent to the corresponding instance 104.2 of the fourth conductor of the second of a plurality of intermediate layers 20.2.

[0154] Embodiment 60: A method for manufacturing an induction coil assembly 1000, the method comprising the steps of: forming a first outer layer 10 comprising a first conductor 101 joined to a first side surface of a first ceramic 201 and a second conductor 102 joined to a second side surface of the first ceramic 201, wherein the second side surface of the first ceramic 201 is on the opposite side of the first side surface of the first ceramic 201, the first conductor 101 has a thickness T, and the second conductor 102 has a thickness (y)T; and forming an intermediate layer 20 of N(i), where (i) is an integer from 1 to M. , where N(i) represents the individual i-th intermediate layers 20.1, 20.2, 20.3, N(M) is the defined maximum number of intermediate layers 20 of N(i), each of the intermediate layers 20 of N(i) being (i) instances 103.1, 103.2 of a third conductor bonded to the first side of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, and (i) instances 104.1, 104.2, 104.3 of a fourth conductor bonded to the second side of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, and the second The second side of the corresponding (i) instances 202.1, 202.2, 202.3 of the ceramic is on the opposite side of the first side of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, and the corresponding (i) instances 103.1, 103.2, 103.3 of the third conductor have a thickness (x)T, and the corresponding (i) instances 104.1, 104.2, 104.3 of the fourth conductor have a thickness (y)T, the (i) instances 103.1, 103.2 of the third conductor and the (i) instances 104.1, 104.2 of the fourth conductor. Step 103 of the third conductor of the intermediate layer 20.1 of N(1).The steps are: stacking intermediate layers 20.1, 20.2, and 20.3 of N(1) to N(M) with the first outer layer 10 such that 1 is positioned adjacent to the second conductor 102 of the first outer layer 10; stacking the second outer layer 30 with the intermediate layers 20.1, 20.2, and 20.3 of N(M) such that the fifth conductor 105 of the second outer layer 30 is positioned adjacent to the corresponding instances 104.1, 104.2, and 104.3 of the fourth conductor of the intermediate layers 20.1, 20.2, and 20.3 of N(M); and placing the corresponding instance 103.1 of the third conductor of the intermediate layer 20.1 of N(1) adjacent to the second conductor 1 of the first outer layer 10 A method comprising the steps of: aligning the fifth conductor 105 of the second outer layer 30 with 02 and aligning it with corresponding instances 104.1, 104.2, and 104.3 of the fourth conductor of the intermediate layers 20.1, 20.2, and 20.3 of N(M); and directly joining at least the corresponding instance 103.1 of the third conductor of the intermediate layer 20.1 of N(1) to the second conductor 102 of the first outer layer 10, and directly joining the fifth conductor 105 of the second outer layer 30 to corresponding instances 104.1, 104.2, and 104.3 of the fourth conductor of the intermediate layers 20.1, 20.2, and 20.3 of N(M).

[0155] Embodiment 61: The method according to Embodiment 60, wherein the intermediate layers 20.1, 20.2, 20.3 of N(i) include intermediate layer N(i) instances 20.1, 20.2 and intermediate layer N(i+1) instances 20.2, 20.3, and the step of stacking the intermediate layers 20.1, 20.2, 20.3 of N(1) to N(M) includes stacking the intermediate layers N(i+1) instances 20.2, 20.3 with the corresponding intermediate layers N(i) instances 20.1, 20.2 of the intermediate layers, such that the corresponding instances 103.2, 103.3 of the third conductor of the intermediate layer N(i+1) instances 20.2, 20.3 are positioned adjacent to the corresponding instances 104.1, 104.2 of the fourth conductor of the intermediate layer N(i) instances 20.1, 20.2.

[0156] Embodiment 62: The method according to Embodiment 61, further comprising the step of aligning the corresponding instances 103.2, 103.3 of the third conductor of the N(i+1) instances 20.2, 20.3 of the intermediate layer with the corresponding instances 104.1, 104.2 of the fourth conductor of the N(i) instances 20.1, 20.2 of the intermediate layer.

[0157] Embodiment 63: The method according to Embodiment 62, further comprising the step of directly joining the corresponding instances 103.2, 103.3 of the third conductor of the N(i+1) instances 20.2, 20.3 of the intermediate layer to the corresponding instances 104.1, 104.2 of the fourth conductor of the N(i) instances 20.1, 20.2 of the intermediate layer.

[0158] Embodiment 64: A method for manufacturing an induction coil assembly 3000, the method comprising the step of forming N(i) layers 10, where (i) is an integer from 1 to M, N(i) represents individual i-th layers 10.1, 10.2, 10.3, and N(M) is the defined maximum number of layers 10 of N(i), each of the N(i) layers 10 being (i) instances 101.1, 101.2, 101.3 of first conductors bonded to the first side surfaces of (i) instances 200.1, 200.2, 200.3 of ceramic, and the ceramic pairs The (i) instances 101.1, 101.2, 101.3 of the first conductor, wherein the second sides of the corresponding (i) instances 200.1, 200.2, 200.3 are opposite to the first sides of the corresponding (i) instances 200.1, 200.2, 200.3 of the ceramic, and the (i) instances 102.1, 102.2, 102.3 of the second conductor, which are joined to the corresponding second sides of the (i) instances 200.1, 200.2, 200.3 of the ceramic, wherein the (i) instance 101.1, Steps 101.2 and 101.3 have a thickness (x)T, and instances (i) of the second conductor 102.1, 102.2, and 102.3 have a thickness (y)T. Steps 101.2 to M-1 are stacked and aligned with each other such that the corresponding instances 101.2 and 101.3 of the first conductor in layers 10.2 and 10.3 of layer N(i+1) are adjacent to the corresponding instances 102.1 and 102.2 of the second conductor in layers 10.1 and 10.2 of layer N(i). Steps include: stacking and aligning the third conductor 103 with the corresponding instance 101.1 of the first conductor of layer 10.1 of N(1); stacking and aligning the fourth conductor 104 with the corresponding instances 102.2 and 102.3 of the second conductors of the corresponding layers 10.2 and 10.3 of N(M); and at least directly joining the third conductor 103 to the corresponding first conductor 101.1 of layer 10.1 of N(1); and joining the fourth conductor 104 to the corresponding second conductors 102.2 and 102.3 of the corresponding layers 10.2 and 10.3 of N(M).A method comprising the steps of directly joining three components, wherein the third conductor 103 has a thickness (y)T, the fourth conductor 104 has a thickness (x)T, x is between 0 and 1, and x+y is equal to 1. [Explanation of Symbols]

[0159] 10 First outer layer, 20 Intermediate layer of N(i), 20.1 Intermediate layer of N(1), 20.2 Intermediate layer, 20.3 Intermediate layer, 30 Second outer layer, 40a Gap, 40a.1 Gap, 40a.2 Gap, 40b Gap, 40c Offset, 42a Spacing, 42b Spacing, 60a First polymer, 60b Second polymer, 101 First conductor layer, 102 Second conductor layer, 102.1 Instance of the second conductor layer, 102.2 Instance of the second conductor layer, 102.3 Instance of the second conductor layer, 103 Third conductor layer, 103.1 Instance of the third conductor layer, 103.2 Instance of the third conductor layer, 103.3 Instance of the third conductor layer, 104 Fourth conductor layer, 104.1 Instance of the fourth conductor layer, 104.2 Instance of the fourth conductor layer, 104.3 Instance of the fourth conductor layer, 105 Fifth conductor layer, 106 Sixth conductor layer, 110 Step section, 200 Ceramic instance, 200.1 Ceramic instance, 200.2 Ceramic instance, 200.3 Ceramic instance, 201 First ceramic layer, 202 Second ceramic layer, 202.1 Instance of the second ceramic layer, 202.2 Instance of the second ceramic layer, 202.3 Instance of the second ceramic layer, 203 Third ceramic layer, 300 Electrical connection section, 301 Spacer, 302 Spacer, 303 Spacer, 310 Electrically filled or electrically plated via, 310A Conductive via, 310B Conductive via, 350 Vertical ellipse, 360 Horizontal ellipse, 400 Alignment pin, 450 Outer section, 500 Electrical connection section, 500A A - Electrical connection along the end connecting two conductors, 500B B - Electrical connection along the end connecting two conductors, 1000 Induction coil assembly, 2000 Induction coil assembly, 3000 Induction coil assembly, A1 First outer end, A2 Second inner end, A3 Third intermediate end, A4 Fourth intermediate end, B1 First outer end, B2 Second inner end

Claims

1. A method for manufacturing an induction coil assembly 2000, wherein the method is A step of forming a first outer layer 10 comprising a first conductor 101 bonded to a first side surface of a first ceramic 201, wherein a second side surface of the first ceramic 201 is on the opposite side of the first side surface of the first ceramic 201, and the first conductor 101 has a thickness T, A step of forming an intermediate layer 20 of N(i), where (i) is an integer from 1 to M, N(i) represents an individual i-th intermediate layer 20.1, 20.2, 20.3, N(M) is the maximum defined number of intermediate layers N(i), and each of the intermediate layers 20 N(i) is Steps comprising: a second conductor (i) instance 102.1, 102.2, 102.3 bonded to the first side surface of the corresponding (i) instance 202.1, 202.2, 202.3 of the second ceramic, wherein the second side surface of the corresponding (i) instance 202.1, 202.2, 202.3 of the second ceramic is on the opposite side of the first side surface of the corresponding (i) instance 202.1, 202.2, 202.3 of the second ceramic, and the corresponding (i) instance 102.1, 102.2, 102.3 of the second conductor has a thickness T; A step of forming a second outer layer 30 comprising a third conductor 103 bonded to a first side surface of a third ceramic 203, wherein the second side surface of the third ceramic 203 is on the opposite side of the first side surface of the third ceramic 203, and the third conductor 103 has a thickness T, The steps of laminating the intermediate layers 20.1, 20.2, and 20.3 of N(1) to N(M) with the first outer layer 10 such that the corresponding instance 102.1 of the second conductor of the intermediate layer 20.1 of N(1) is positioned adjacent to the second side surface of the first ceramic 201 of the first outer layer 10, The step of laminating the second outer layer 30 with the corresponding intermediate layers 20.1, 20.2, 20.3 of N(M) such that the third conductor 103 of the second outer layer 30 is positioned adjacent to the corresponding instances 202.1, 202.2, 202.3 of the second ceramic of the corresponding intermediate layers 20.1, 20.2, 20.3 of N(M), The steps include aligning the corresponding instance 102.1 of the second conductor of the intermediate layer 20.1 of N(1) with the first ceramic 201 of the first outer layer 10, and aligning the third conductor 103 of the second outer layer 30 with the corresponding instances 202.1, 202.2, and 202.3 of the second ceramic of the intermediate layers 20.1, 20.2, and 20.3 of the corresponding N(M), The steps include: aligning the fourth conductor 104 by stacking it with the second side surface of the third ceramic 203 of the second outer layer 30; At a minimum, the steps include: directly bonding the corresponding instance 102.1 of the second conductor of the intermediate layer 20.1 of N(1) to the first ceramic 201 of the first outer layer 10, and directly bonding the fourth conductor 104 to the third ceramic 203 of the second outer layer 30; Methods that include...

2. The step of laminating the intermediate layers 20.1, 20.2, and 20.3 of N(1) to N(M) is, Steps to stack the (i+1) instances 20.2, 20.3 of the intermediate layer with the corresponding (i) instances 20.1, 20.2 of the intermediate layer, such that the corresponding (i+1) instances 102.2, 102.3 of the second conductor of the (i+1) instances 20.2, 20.3 of the intermediate layer are arranged adjacent to the corresponding (i) instances 202.1, 202.2 of the second ceramic of the corresponding (i) instances 20.1, 20.2 of the intermediate layer. The method according to claim 1, further comprising:

3. Each (i) instance of the first conductor 101, the second conductor 102, the third conductor 103, and the fourth conductor 104 each form a corresponding structured conductor. The method according to claim 1 or 2.

4. Each of the first structured conductor, the (i) instance of the second structured conductor, the third structured conductor, and the fourth structured conductor is formed by directly bonding the corresponding conductor to the corresponding ceramic and patterning the corresponding conductor to form the corresponding structured conductor. The method according to claim 3.

5. The patterning of the corresponding conductor defines the electrical path of the corresponding structured conductor from the first end to the second end of the corresponding structured conductor. The method according to claim 4.

6. At least one of the aforementioned electrical paths is electrically continuous and uninterrupted. The method according to claim 5.

7. The patterning of the corresponding conductor includes applying a mask to the corresponding conductor, etching the exposed portion of the corresponding conductor, and removing the mask to define the electrical path of the corresponding structured conductor from the first end to the second end of the corresponding structured conductor. The method according to claim 4.

8. Before directly joining the corresponding conductor to the corresponding ceramic, the method To form the corresponding structured conductor, the step of forming a defined conductive path within the unstructured conductor. The method according to claim 4, further comprising:

9. The step of forming the defined conductive path is: A step of mechanically removing the material of the unstructured conductor to form the corresponding structured conductor, The steps of mechanically cutting the material of the unstructured conductor to form the corresponding structured conductor, The steps of mechanically punching out the material of the unstructured conductor to form the corresponding structured conductor, The steps of optically removing the material of the unstructured conductor to form the corresponding structured conductor, and The step of chemically removing the material of the unstructured conductor to form the corresponding structured conductor. The method according to claim 8, comprising any one of the above.

10. Each corresponding structured conductor has a curved current path. The method according to any one of claims 3 to 9.

11. Each corresponding structured conductor has a spiral current path. The method according to any one of claims 3 to 10.

12. The step of forming the first outer layer 10, the intermediate layer 20 of N(i), the second outer layer 30, or any combination thereof, A step of depositing an additional conductive metal in the form of a structured conductor, which is directly bonded to the corresponding first ceramic, the (i) instance of the second ceramic, and the third ceramic, wherein the corresponding structured conductor defines the electrical paths of the corresponding first conductor, the (i) instance of the second conductor, the third conductor, and the fourth conductor. The method according to any one of claims 1 to 11, including the method described in any one of claims 1 to 11.

13. The step of forming the intermediate layer of N(i) is, A step of depositing an additional conductive metal in the form of a structured conductor, which is directly bonded to a corresponding instance of the second ceramic (i), wherein the corresponding structured conductor defines an electrical path of the corresponding instance of the second conductor (i). The method according to any one of claims 1 to 11, including the method described in any one of claims 1 to 11.

14. Any instance of the conductor includes copper or aluminum. The method according to any one of claims 1 to 13.

15. Any instance of the ceramic comprises aluminum nitride, HPS zirconia-doped ceramic, aluminum dioxide, or silicon dioxide. The method according to any one of claims 1 to 14.

16. The thickness T is between 35 microns and 400 microns. The method according to any one of claims 1 to 15.

17. The thickness T is between 65 microns and 200 microns. The method according to any one of claims 1 to 16.

18. Any instance of the aforementioned layer has a thickness of 70 microns or more and 1000 microns or less. The method according to any one of claims 1 to 17.

19. Any instance of the aforementioned layer has a thickness of 70 microns or more and 500 microns or less. The method according to any one of claims 1 to 18.

20. Any instance of the structured conductor has a C-shaped edge winding shape, The method according to any one of claims 3 to 11.

21. Each instance of the conductor is formed from the same material as another different instance of the conductor. The method according to any one of claims 1 to 20.

22. The steps include providing the first polymer on the same side of the second ceramic (i) instance as the corresponding second structured conductor (i) instance, The steps include providing a second polymer on the same side of the (i+1) instance of the second ceramic as the corresponding (i+1) instance of the second structured conductor, and The method according to any one of claims 3 to 11, further comprising:

23. The first polymer is placed on the region of the second ceramic (i) instance that lacks the material of the corresponding (i) instance of the second structured conductor, The second polymer is placed in the region of the (i+1) instance of the second ceramic that lacks the material of the corresponding (i+1) instance of the second structured conductor. The method according to claim 22.

24. The first polymer has the same thickness as the (i) instance of the second structured conductor, The second polymer has the same thickness as the (i+1) instance of the second structured conductor. The method according to claim 23.

25. The steps include providing the first polymer on the same side of the first ceramic as the first structured conductor, The steps include providing a second polymer (i) instance on the same side of the second ceramic (i) instance as the corresponding second structured conductor (i) instance, The steps include providing an instance of the second polymer (i+1) on the same side of the second ceramic (i+1) instance as the corresponding (i+1) instance of the second structured conductor, and It further includes, The first polymer is placed in the region of the first ceramic that does not contain the material of the first structured conductor. The (i) instance of the second polymer is placed in a region of the (i) instance of the second ceramic that does not contain the material of the (i) instance of the second structured conductor. The (i+1) instance of the second polymer is placed in a region of the (i+1) instance of the second ceramic that does not contain the material of the (i+1) instance of the second structured conductor. The method according to any one of claims 3 to 11.

26. The first polymer has the same thickness as the second polymer. The method according to claim 25.

27. The aforementioned same thickness is equal to T / 2. The method according to claim 26.

28. The first outer layer, the intermediate layer of N(i), and the second outer layer form the induction coil assembly having a plurality of conductive layers formed of corresponding first conductors, (i) instances of the second conductor, third conductors, and fourth conductors arranged sequentially and alternately with respect to each other, and a ceramic layer formed of corresponding first ceramics, (i) instances of the second ceramic, and third ceramics. The method according to any one of claims 1 to 27.

29. At least two of the alternate conductive layers having the aforementioned thickness T are electrically connected to each other by an electrical connection portion that crosses one of the intervening ceramic layers. The method according to claim 28.

30. At least two adjacent conductive layers having the aforementioned thickness T are electrically connected to each other by an electrical connection portion that crosses one of the plurality of ceramic layers interposed therein. The method according to claim 28.

31. The electrical connection portion includes a spacer integrally formed in the region between adjacent layers of the plurality of ceramic layers. The spacer is not electrically connected to the corresponding conductive layer in the corresponding layer. The method according to any one of claims 29 to 30.

32. The electrical connection portion comprises one or more electrically filled or electrically plated vias. The method according to any one of claims 29 to 31.

33. The first conductor 101, which is bonded to the first side surface of the first ceramic 201, is bonded at a first surface-to-surface interface. Each of the (i) instances 102.1, 102.2, 102.3 of the second conductor, which is joined to the first side surface of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, is joined at the corresponding (i) instance of the second surface-to-surface interface. The third conductor 103, which is bonded to the first side surface of the third ceramic 203, is bonded at the third surface-to-surface interface. The fourth conductor 104, which is bonded to the third ceramic 203 of the second outer layer 30, is bonded at the fourth surface-to-surface interface. The aforementioned method, The step of direct bonding by heating and a direct bonding copper process by forming a copper-oxygen eutectic that wets the corresponding first, second, third, and fourth surface-surface interfaces. Further including, The method according to any one of claims 1 to 32.

34. The first conductor 101, which is bonded to the first side surface of the first ceramic 201, is bonded at a first surface-to-surface interface. Each of the (i) instances 102.1, 102.2, 102.3 of the second conductor, which is joined to the first side surface of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, is joined at the corresponding (i) instance of the second surface-to-surface interface. The third conductor 103, which is bonded to the first side surface of the third ceramic 203, is bonded at the third surface-to-surface interface. The fourth conductor 104, which is bonded to the third ceramic 203 of the second outer layer 30, is bonded at the fourth surface-to-surface interface. The aforementioned method, A step of chemically joining by applying an adhesive that wets the corresponding surface-to-surface interface among the first, second, third, and fourth surfaces. Further including, The method according to any one of claims 1 to 32.

35. The bonding agent comprises one or more of the following: a prepreg material, a polymer paste, and a ceramic paste. The method according to claim 34.

36. The step of providing an air gap in any instance of the conductor that causes an electrical break within the corresponding conductor. The method according to any one of claims 1 to 35, further comprising:

37. The gaps in the corresponding pairs of adjacent conductors are arranged facing each other directly. The method according to claim 36.

38. The gaps in the corresponding conductors of the adjacent pair of conductors are not directly facing each other, but are offset from each other. The method according to claim 37.

39. Each gap in the corresponding pair of adjacent conductors has an equal gap dimension. The method according to any one of claims 36 to 38.

40. The gaps in the corresponding pairs of adjacent conductors have unequal gap dimensions. The method according to any one of claims 36 to 38.

41. The step of filling one or more of the arbitrary instances of the void with a dielectric material. The method according to any one of claims 33 to 37, further comprising:

42. The steps of forming the first outer layer, the intermediate layer of N(i), and the second outer layer in order to define an alternating A-layer structure and B-layer structure in the arrangement of stacked A-B-A-B layers or B-A-B-A layers. The method according to any one of claims 1 to 41, further comprising:

43. The steps of forming the first conductor, each (i) instance of the second conductor, the third conductor, and the fourth conductor in order to define an alternating A-conductor structure and a B-conductor structure in a laminated A-B-A-B conductor or B-A-B-A conductor arrangement in which the first ceramic, the (i) instance of the second ceramic, and the corresponding third ceramic are arranged between adjacent A-conductors and B-conductors. The method according to any one of claims 1 to 42, further comprising:

44. Each A-conductor and each B-conductor comprises a structured conductor in the form of multiple windings having a first outer end and a second inner end. The first outer end of the A-conductor is electrically connected to the first outer end of each of the next adjacent A-conductors. The second inner end of the B-conductor is electrically connected to the second inner end of each of the next adjacent B-conductors. The method according to claim 43.

45. At least one of the A-conductor and the B-conductor is formed in one or more of the windings at stepped portions within the electrical path. The method according to claim 44.

46. The stepped portion is oriented in either the z direction or the x-y plane of the orthogonal x-y-z coordinate system. The method according to claim 45.

47. The A-conductor is provided with an electrically disconnected portion that forms a third intermediate end and a fourth intermediate end between the corresponding first outer end and the second inner end, with an electrical gap between them. The third intermediate end is electrically connected to the first outer end. The fourth intermediate end is electrically connected to the second inner end. The method according to claim 45 or 46.

48. The first outer end and the second inner end of the A-conductor are electrically connected to the first outer end and the second inner end of the next adjacent A-conductor, respectively. The method according to claim 47.

49. The corresponding electrically connected conductors are electrically connected by electrically filled or electrically plated vias. The method according to any one of claims 45 to 48.

50. The corresponding electrically connected conductors are electrically connected by an electrical connection along the end. The method according to any one of claims 45 to 48.

51. Each of the aforementioned windings has a curved or circular shape, as observed in the plan view of the corresponding layer. The method according to any one of claims 45 to 50.

52. Each of the aforementioned windings has a rectangular or square shape, as observed in the plan view of the corresponding layer. The method according to any one of claims 45 to 50.

53. Any instance of the aforementioned alignment includes the use of one or more alignment pins. The method according to any one of claims 1 to 52.

54. The step of positioning one or more alignment pins such that they penetrate all instances of the ceramic. The method according to claim 53, further comprising:

55. The step of positioning the one or more alignment pins such that they do not penetrate any instance of the conductor. The method according to claim 54, further comprising:

56. A method for manufacturing an induction coil assembly 1000, wherein the method is A step of forming a first outer layer 10 comprising a first conductor 101 bonded to a first side surface of a first ceramic 201 and a second conductor 102 bonded to a second side surface of the first ceramic 201, wherein the second side surface of the first ceramic 201 is on the opposite side of the first side surface of the first ceramic 201, the first conductor 101 has a thickness T, and the second conductor 102 has a thickness (y) T, A step of forming at least one intermediate layer 20 comprising an instance of a third conductor 103 bonded to a first side surface of an instance of a second ceramic 202, and an instance of a fourth conductor 104 bonded to a second side surface of the instance of the second ceramic 202, wherein the second side surface of the instance of the second ceramic 202 is on the opposite side of the first side surface of the instance of the second ceramic 202, the instance of the third conductor 103 has a thickness (x) T, and the instance of the fourth conductor 104 has a thickness (y) T. A step of forming a second outer layer 30 comprising a fifth conductor 105 bonded to a first side surface of a third ceramic 203 and a sixth conductor 106 bonded to a second side surface of the third ceramic 203, wherein the second side surface of the third ceramic 203 is on the opposite side of the first side surface of the third ceramic 203, the fifth conductor 105 has a thickness (x) T, the sixth conductor 106 has a thickness T, x is 0 or more and 1 or less, and x + y is equal to 1. The steps include laminating the at least one intermediate layer 20 with the first outer layer 10 such that the third conductor 103 of the at least one intermediate layer 20 is positioned adjacent to the second conductor 102 of the first outer layer 10, The steps of laminating the second outer layer 30 with the at least one intermediate layer 20 such that the fifth conductor 105 of the second outer layer 30 is positioned adjacent to the instance of the fourth conductor 104 of the at least one intermediate layer 20, The steps include aligning the instance of the third conductor 103 of the at least one intermediate layer 20 with the second conductor 102 of the first outer layer 10, and aligning the fifth conductor 105 of the second outer layer 30 with the instance of the fourth conductor 104 of the at least one intermediate layer 20, The steps include: directly joining the instance of the third conductor 103 of the at least one intermediate layer 20 to the second conductor 102 of the first outer layer 10, and directly joining the fifth conductor 105 of the second outer layer 30 to the instance of the fourth conductor 104 of the at least one intermediate layer 20; Methods that include...

57. The step of forming at least one intermediate layer 20 is, A step of forming two or more intermediate layers 20, 20.1, 20.2, 20.3, wherein each of the intermediate layers 20 is The instances 103.1, 103.2, 103.3 of the third conductor are bonded to the first side surface of the corresponding instances 202.1, 202.2, 202.3 of the second ceramic, and the instances 104.1, 104.2, 104.3 of the fourth conductor are bonded to the second side surface of the corresponding instances 202.1, 202.2, 202.3 of the second ceramic, wherein each instance 103.1, 103.2, 103.3 of the third conductor has a thickness (x) T, and each instance 104.1, 104.2, 104.3 of the fourth conductor has a thickness (y) T. Step The method according to claim 56, including the method described in claim 56.

58. The step of laminating the at least one intermediate layer 20 is, The step of laminating the first of the plurality of intermediate layers 20.1 with the first outer layer 10 such that the corresponding instance 103.1 of the third conductor of the first of the plurality of intermediate layers 20.1 is positioned adjacent to the second conductor 102 of the first outer layer 10, The step of stacking the second of the plurality of intermediate layers 20.2 with the first of the plurality of intermediate layers 20.1 such that the corresponding instance 103.2 of the third conductor of the second of the plurality of intermediate layers 20.2 is positioned adjacent to the corresponding instance 104.1 of the fourth conductor of the first of the plurality of intermediate layers 20.

1. The method according to claim 57, including the method described in claim 57.

59. The step of laminating the second outer layer is, The step of laminating the second outer layer 30 with the second of the multiple intermediate layers 20.2 such that the fifth conductor 105 of the second outer layer 30 is positioned adjacent to the corresponding instance 104.2 of the fourth conductor of the second of the multiple intermediate layers 20.

2. The method according to claim 58, including the method described in claim 58.

60. A method for manufacturing an induction coil assembly 1000, wherein the method is A step of forming a first outer layer 10 comprising a first conductor 101 bonded to a first side surface of a first ceramic 201 and a second conductor 102 bonded to a second side surface of the first ceramic 201, wherein the second side surface of the first ceramic 201 is on the opposite side of the first side surface of the first ceramic 201, the first conductor 101 has a thickness T, and the second conductor 102 has a thickness (y) T, A step of forming an intermediate layer 20 of N(i), where (i) is an integer from 1 to M, N(i) represents an individual i-th intermediate layer 20.1, 20.2, 20.3, N(M) is the defined maximum number of intermediate layers 20 of N(i), and each of the intermediate layers 20 of N(i) is The second ceramic is bonded to the first side surface of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, and the third conductor is bonded to the second side surface of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, wherein the second side surface of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic is , on the opposite side of the first side of the corresponding (i) instances 202.1, 202.2, 202.3 of the second ceramic, the corresponding (i) instances 103.1, 103.2, 103.3 of the third conductor have a thickness (x) T, and the corresponding (i) instances 104.1, 104.2, 104.3 of the fourth conductor have a thickness (y) T, the (i) instances 103.1, 103.2 of the third conductor and the (i) instances 104.1, 104.2, 104.3 of the fourth conductor. It has steps, A step of forming a second outer layer 30 comprising a fifth conductor 105 bonded to a first side surface of a third ceramic 203 and a sixth conductor 106 bonded to a second side surface of the third ceramic 203, wherein the second side surface of the third ceramic 203 is on the opposite side of the first side surface of the third ceramic 203, the fifth conductor 105 has a thickness (x) T, the sixth conductor 106 has a thickness T, x is 0 or more and 1 or less, and x + y is equal to 1. The steps include stacking the intermediate layers 20.1, 20.2, and 20.3 of N(1) to N(M) with the first outer layer 10 such that the corresponding instance 103.1 of the third conductor of the intermediate layer 20.1 of N(1) is positioned adjacent to the second conductor 102 of the first outer layer 10, The step of laminating the second outer layer 30 with the intermediate layers 20.1, 20.2, 20.3 of N(M) such that the fifth conductor 105 of the second outer layer 30 is positioned adjacent to the corresponding instances 104.1, 104.2, 104.3 of the fourth conductor of the intermediate layers 20.1, 20.2, 20.3 of N(M), The steps include aligning the corresponding instance 103.1 of the third conductor of the intermediate layer 20.1 of N(1) with the second conductor 102 of the first outer layer 10, and aligning the fifth conductor 105 of the second outer layer 30 with the corresponding instances 104.1, 104.2, and 104.3 of the fourth conductor of the intermediate layers 20.1, 20.2, and 20.3 of N(M), At a minimum, the steps include directly joining the corresponding instance 103.1 of the third conductor of the intermediate layer 20.1 of N(1) to the second conductor 102 of the first outer layer 10, and directly joining the fifth conductor 105 of the second outer layer 30 to the corresponding instances 104.1, 104.2, and 104.3 of the fourth conductor of the intermediate layers 20.1, 20.2, and 20.3 of N(M), and Methods that include...

61. The intermediate layers 20.1, 20.2, and 20.3 of N(i) include N(i) instances 20.1 and 20.2 of the intermediate layer and N(i+1) instances 20.2 and 20.3 of the intermediate layer, and the step of stacking the intermediate layers 20.1, 20.2, and 20.3 of N(1) to N(M) is, Steps to stack the N(i+1) instances 20.2, 20.3 of the intermediate layer with the corresponding N(i) instances 20.1, 20.2 of the intermediate layer, such that the corresponding instances 103.2, 103.3 of the third conductor of the N(i+1) instances 20.2, 20.3 of the intermediate layer are arranged adjacent to the corresponding instances 104.1, 104.2 of the fourth conductor of the N(i) instances 20.1, 20.2 of the intermediate layer. The method according to claim 60, including the method described in claim 60.

62. The aforementioned step of alignment is, The step of aligning the corresponding instances 103.2, 103.3 of the third conductor of the N(i+1) instances 20.2, 20.3 of the intermediate layer with the corresponding instances 104.1, 104.2 of the fourth conductor of the N(i) instances 20.1, 20.2 of the intermediate layer. The method according to claim 61, further comprising:

63. The step of direct joining is, The step of directly joining the corresponding instances 103.2, 103.3 of the third conductor of the N(i+1) instances 20.2, 20.3 of the intermediate layer to the corresponding instances 104.1, 104.2 of the fourth conductor of the N(i) instances 20.1, 20.2 of the intermediate layer. The method according to claim 62, further comprising:

64. A method for manufacturing an induction coil assembly 3000, wherein the method is A step of forming N(i) layers 10, where (i) is an integer from 1 to M, N(i) represents individual i-th layers 10.1, 10.2, 10.3, N(M) is the defined maximum number of layers 10 of N(i), and each of the layers 10 of N(i) is A first conductor (i) instance 101.1, 101.2, 101.3 bonded to the first side surface of a ceramic (i) instance 200.1, 200.2, 200.3, wherein the second side surface of the corresponding ceramic (i) instance 200.1, 200.2, 200.3 is on the opposite side of the first side surface of the corresponding ceramic (i) instance 200.1, 200.2, 200.3, The (i) instances 102.1, 102.2, 102.3 of the second conductor are bonded to the corresponding second sides of the (i) instances 200.1, 200.2, 200.3 of the ceramic, Equipped with, Steps include: (i) instances 101.1, 101.2, 101.3 of the first conductor having a thickness (x) T, and (i) instances 102.1, 102.2, 102.3 of the second conductor having a thickness (y) T; The steps include stacking and aligning the layers N(1) to N(M) 10.1, 10.2, and 10.3 such that, for i=1 to M-1, the corresponding instances 101.2, 101.3 of the first conductor in layers N(i+1) 10.2, 10.3 are positioned adjacent to the corresponding instances 102.1, 102.2 of the second conductor in layers N(i) 10.1, 10.2, and The steps include: stacking and aligning the third conductor 103 with the corresponding instance 101.1 of the first conductor in layer 10.1 of N(1), and stacking and aligning the fourth conductor 104 with the corresponding instances 102.2 and 102.3 of the second conductor in the corresponding layers 10.2 and 10.3 of N(M); The step of directly joining the third conductor 103 to the corresponding first conductor 101.1 of layer 10.1 of N(1), and directly joining the fourth conductor 104 to the corresponding second conductors 102.2 and 102.3 of layers 10.2 and 10.3 of N(M), wherein the third conductor 103 has a thickness (y) T, the fourth conductor 104 has a thickness (x) T, x is between 0 and 1, and x + y is equal to 1. Methods that include...

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