Cooling module

Abstract

A cooling module for cooling one or more electronic components within a cooling module includes one or more electronic components and a cooling element configured to cool one or more electronic components by distributing a liquid coolant across the one or more electronic components. The cooling element includes a first region configured to receive liquid coolant from a liquid coolant supply, a second region including a plurality of openings, and a weir between the first region and the second region. The first region, the second region, and the weir are positioned above the one or more electronic components such that the liquid coolant in the first region overflows over the weir and onto the plurality of openings, thereby distributing the liquid coolant across the one or more electronic components.

Description

Technical Field

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[0003]

[0001] The present disclosure relates to a cooling module for cooling electronic components using a liquid coolant.

Background Art

[0002] Most of the power supplied to information technology (IT) equipment is converted into heat within the electronic equipment components. Electronic components generate non-uniform amounts of heat, some having a relatively high power profile (e.g., central processing unit (CPU), graphics processing unit (GPU), etc.), and others having a very low power profile (M.2, SSD, etc.). All electronic components, regardless of whether they have a high power profile or a low power profile, can benefit from proper cooling.

[0003] In conventional air-cooled IT equipment, air is forced through the IT chassis enclosure where it passes over the components and heat sinks to remove heat. In precision immersion cooling, the amount of liquid coolant for a particular component is typically selected based on the power profile of the component. This means that low power profile components typically receive a small amount of liquid coolant flow.

[0004] Low power profile components may may have two or more chips distributed across a surface such as a circuit board. Ideally, to avoid dry zones where the temperature of the chips rises and the component risks reaching its critical threshold and thus failure points, the coolant flow should be distributed across all the chips. In conventional systems, since the liquid coolant flow does not target a single point, sub-optimal distribution of the coolant flow is a particularly prominent problem when low flow rates are used.

[0005] Often, a specific back pressure is generated to provide sufficient flow restriction to properly distribute the flow of liquid coolant. Back pressure can be manipulated by changing the size of the discharge point. The discharge point can be any form of discharge, such as holes or slits of different shapes. At low flow rates, sufficient back pressure cannot be provided due to manufacturing limitations, blockage problems, undesirable surface tension effects, or the formation of jets unsuitable for covering wider areas. Supplying higher flow rates can improve this problem, but this means less flow to other components and therefore less cooling effect.

[0006] Therefore, there is a need to provide a more efficient and effective method for distributing liquid coolant.

[0007] International Publication No. 2022 / 112799 describes a heatsink arrangement for cooling a first set and a second set of electronic components positioned beneath a heatsink arrangement. This includes a first cooling element for cooling the first set of electronic components, which is a first heatsink including a base and retaining walls that together define a volume for holding a liquid coolant, and a second cooling element for cooling the second set of electronic components, which is configured to distribute the liquid coolant over the second set of electronic components. The first and second cooling elements are arranged such that the liquid coolant overflows from the volume of the first cooling element into the second cooling element and is distributed over the second set of electronic components. [Overview of the project]

[0008] Against this backdrop, this disclosure provides the cooling module described in claim 1.

[0009] This disclosure provides a cooling module for cooling one or more electronic components, comprising a cooling element configured to cool one or more electronic components by distributing a liquid coolant across one or more electronic components. The cooling element includes a first region configured to receive a liquid coolant from a liquid coolant supply, a second region comprising a plurality of openings, and a weir between the first region and the second region. The first region, the second region, and the weir are positioned above one or more electronic components such that the liquid coolant in the first region overflows over the weir onto the plurality of openings in the second region, thereby distributing the liquid coolant onto one or more electronic components.

[0010] This arrangement of the first and second regions and the weir allows one or more electronic components to be cooled by a relatively low-pressure flow of liquid coolant. For example, a low-pressure supply of coolant can be supplied to the first region, which is filled with coolant. When a threshold amount of liquid coolant is in the first region, the coolant overflows the weir and begins to fall into the second region under the influence of gravity. The falling coolant then lands on a plurality of openings and can pass through the openings under the influence of gravity. This ensures that the coolant is distributed uniformly across the openings and, therefore, uniformly across the electronic components below.

[0011] By positioning the first and second regions above the electronic components, the first and second regions do not need to be very deep. In contrast, if the first region is mounted on the circuit board adjacent to the electronic components, the first region would need to have a relatively large depth (i.e., greater than the height of the electronic components) so that it can overflow into the second region positioned above those components. Thus, the geometric arrangement of this disclosure provides a compact and efficient method for distributing liquid coolant. Embodiments described herein can provide efficient and effective cooling using low flow rates and low volumes of coolant.

[0012] Some embodiments of the present disclosure provide a chamber (first region) filled with liquid coolant and stabilizing the liquid coolant before the coolant flows into another chamber (second region). In the second region, the liquid coolant is discharged through a discharge opening which may be a single slit or several slits of any size or any shape. This can be applied to closed systems such as manifolds and open systems such as channeled trays.

[0013] In some embodiments of closed cooling elements, a weir may be provided within the manifold. The weir stabilizes the flow of the liquid coolant and evenly distributes the fluid momentum across the section where the coolant flows beyond the weir, thereby uniformly distributing the coolant across the discharge point. In some embodiments of open cooling elements, a stabilized section is provided, in which the coolant is initially accumulated before overflowing beyond the weir or beyond to the discharge section.

[0014] Throughout this disclosure, cooling elements for cooling electronic components are described. It will be recognized that the electronic components may be any electronic components (e.g., chips) mounted on various substrates such as circuit boards. The surface on which the components are mounted is used as a reference point in this disclosure, and the surface on which the components are mounted defines the xy plane, and the direction perpendicular to that plane is the z direction. Therefore, when one component is described as being "above" another component, this means that it is spaced away from the base (xy plane) of the cooling module, or equivalently, has a larger z coordinate. Thus, in embodiments of this disclosure, the first and second regions may extend in a first direction (e.g., the x direction) and be offset in a second direction (e.g., the y direction), and the first and second regions, as well as the weir, are above the electronic components in a third direction (e.g., the z direction).

[0015] The cooling elements described herein are preferably any elements capable of cooling electronic components using a liquid coolant. Typically, in the context of this disclosure, such a cooling element disperses a liquid coolant (e.g., a dielectric liquid coolant) on an electrical component to transfer heat from the electrical component. Such distribution of the liquid coolant is preferably provided by allowing the coolant to pass through the cooling element (e.g., by dripping or injecting through an opening).

[0016] In this disclosure, the cooling element is described as having a first region. The first region in this specification is typically the volume of the cooling element that receives the coolant from a supply of liquid coolant (e.g., from a conduit carrying the liquid coolant). The supply of coolant may be by supplying the coolant directly to the first region (i.e., through a conduit, for example, without any intervening cooling element). The first region in this disclosure preferably holds the coolant so that it accumulates within one or more upright walls before passing through a weir. The second region also typically has one or more upright walls but has an opening (e.g., at its base) to allow the coolant to exit.

[0017] The weirs described herein typically extend upward (in use) in the z-direction (i.e., away from the components requiring cooling). The effect of the weir may be that the level of liquid coolant in the first region reaches a threshold height above the opening in the second region before it flows over the opening in the second region. This may offer the advantage of increasing the pressure of the coolant over the opening and improving distribution. In contrast, a slow, spurt of coolant may result in a non-uniform distribution across the opening.

[0018] Therefore, it will be understood that the first region described herein is typically located upstream of the weir and downstream of the coolant supply. The weir is typically located upstream of the second region described herein, and the second region is typically located upstream of the electronic components.

[0019] The first region preferably includes an inlet for receiving liquid coolant. Such an inlet may include a conduit (e.g., any type of tube, hose, pipe, etc.) for directly supplying the coolant to the first region. Thus, fresh coolant can be supplied from a heat exchanger or a liquid coolant supply. Used coolant can be pooled at the base of the cooling module after being distributed across the electronic components, so the coolant can be recycled by returning the used coolant to the first region after passing through the heat exchanger.

[0020] It will be understood that the cooling modules described herein may be described using alternative terminology. For example, in another aspect of the present disclosure, a cooling module for cooling one or more electronic components, comprising one or more electronic components and a cooling element configured to cool one or more electronic components by distributing a liquid coolant over the one or more electronic components, comprising: a first region configured to receive liquid coolant from a liquid coolant supply; a second region comprising a plurality of openings; and a weir between the first region and the second region, wherein the liquid coolant in the first region overflows over the weir onto the plurality of openings to distribute the liquid coolant over the one or more electronic components, and the first region is elongated (e.g., longer in the x-direction than in the y-direction), and / or the second region is elongated (e.g., longer in the x-direction than in the y-direction). Such an arrangement provides an efficient method for cooling an electronic device.

[0021] In a further embodiment, a cooling module for cooling one or more electronic components includes a first set of one or more electronic components and a second set of one or more electronic components, a first cooling element configured to cool the first set of one or more electronic components by distributing a liquid coolant over the first set of one or more electronic components, and a second cooling element configured to cool the second set of one or more electronic components, wherein the first cooling element includes a first region configured to receive liquid coolant from a liquid coolant supply, a second region including a plurality of openings, and a weir between the first region and the second region, wherein the first and second regions are configured such that the liquid coolant in the first region overflows over the weir onto the plurality of openings to distribute the liquid coolant over the first set of one or more electronic components, and the second cooling element is configured to receive a relatively high flow rate of liquid coolant from a liquid coolant supply.

[0022] Embodiments of this disclosure enable the provision of a relatively small volume of liquid coolant at low pressure for efficient cooling of electronic components. The coolant supply does not require high pressure and / or flow rate. This can be achieved by using a specific geometric arrangement of chambers and weirs to allow gravity to provide the appropriate pressure. These and further advantages will become apparent from this disclosure. [Brief explanation of the drawing]

[0023] This disclosure can be implemented in many ways, and preferred embodiments are described below with reference to the accompanying drawings, merely as examples. [Figure 1] This shows the cooling module. [Figure 2] The cooling element in the first embodiment for use in the cooling module shown in Figure 1 is shown. [Figure 3] The cooling element in the second embodiment for use in the cooling module of Figure 1 is shown. [Modes for carrying out the invention]

[0024] In FIG. 1, a cooling module 11 in which embodiments of the present disclosure can be implemented is shown. Specifically, FIG. 1 shows an example of low-power components 17 (SSD and M.2) within the overall system. In this example, the cooling and IT components are contained within a chassis, the cooling module 11, in which a liquid coolant is pumped through a heat exchanger 13 and supplied to IT components (which are part of server 12 in this example) through pipes 14 (or plural pipes) and manifolds 15 (or plural manifolds). The coolant is then distributed to each of the electronic components 17 that require cooling through a hose 16 (or a pipe, or any other type of conduit). Two examples of the low-power components 17 are shown in FIG. 1. Embodiments of the present disclosure use a cooling element 18 to cool such components 17. Preferred embodiments of the cooling element 18 are shown in FIGS. 2 and 3.

[0025] The cooling element 18 described herein provides a first region into which the liquid coolant flows after accumulating and stabilizing, and then flows into a second region where the coolant is distributed onto the electronic components through a discharge opening. This may be applied to a sealed cooling element as in FIG. 2, and to an open cooling element as in FIG. 3. In a sealed cooling element, a weir may be provided within the manifold. The weir can stabilize the flow and equally distribute the fluid momentum of the liquid coolant across a section where the coolant flows over the weir, and thus evenly distribute the coolant across the discharge points. The open cooling element can include a stabilization section where the coolant first accumulates before overflowing over a weir or more into the discharge section.

[0026] In FIG. 2, an example of a sealed manifold is shown. FIG. 2(A) is a cross-sectional view of the sealed manifold through the inlet port showing an example of an L-shaped weir. The shaded portion represents the fluid volume. FIG. 2(B) is a cross-sectional view of the sealed manifold through the inlet port showing a straight weir. FIG. 2(C) is a cross-sectional view of the sealed manifold through the inlet port showing a T-shaped weir. FIG. 2(D) is a 3D view of an example of the sealed manifold.

[0027] In the example of the closed manifold of FIG. 2(A), the cross-sectional view is taken through an inlet 21 through which coolant (highlighted in the shaded area) is supplied to the manifold section 22. The coolant accumulates in the manifold section 22 within the chamber formed by the weir 23. By doing so, the coolant accumulates, stabilizes, overflows over the top of the weir 23 into other chambers, where the coolant is uniformly discharged through holes 24.

[0028] The weir 23 effectively divides the manifold into a first region (right side of the weir in FIG. 2(A)) and a second region (left side of the weir in FIG. 2(A)). The weir separates the first region from the second region in the sense that fluid cannot flow from the first region to the second region without crossing the weir. Generally, the first region is preferably a channel such as an elongated channel. The first region is preferably longer in the x direction than in the y direction (e.g., the ratio of the length:width of the first region may be at least 1:1, 2:1, or much larger). The use of a relatively narrow first region advantageously ensures that the volume of coolant required before it can flow over the weir is relatively small, allowing for a compact arrangement. Similarly, the second region is preferably elongated (i.e., longer in the x direction than in the y direction). Providing a relatively narrow second region can ensure that the coolant does not need to disperse over a long distance in the y direction to pass through the opening, allowing for a compact arrangement.

[0029] It is advantageous for the first region to extend along a plurality of openings (i.e., directly adjacent in the y direction) as this can ensure that the coolant falling over the weir falls directly onto (or at least near) the openings at a sufficient speed, and thus pressure, to effectively cool the electronic components. The first region may be at the same height as the second region (i.e., the base of the first region is at the same height as the base of the second region), or may be offset in the z direction (i.e., the base of the first region is higher than the base of the second region). That is, the first region may be positioned above the second region in use.

[0030] Figures 2(A) to 2(C) show examples of different weirs 23 having different shapes (L-shaped, straight, and T-shaped), which can be used to control the flow of liquid coolant. Generally, the weirs described herein preferably include a first portion that extends away from the electronic components (e.g., vertically, or at least at a non-zero angle with respect to the horizontal), and may also include a second portion that extends laterally (e.g., vertically) to the first portion (e.g., a horizontal portion of an L-shaped or T-shaped weir). The second portion of the weir may be configured to restrict the flow of liquid coolant from above, thereby improving the way the coolant flows.

[0031] Figure 2(D) shows a three-dimensional view of the manifold, showing the inlet section 21, the manifold body 22, and the discharge section 24 (represented by holes). The discharge section is also referred to herein as holes and openings. It will be understood that any opening through which the coolant can pass may function as a suitable opening. Generally, each of the multiple openings is preferably located at the base of the second region (e.g., the bottom surface in use), thereby allowing the coolant to pass under the influence of gravity, even when the pressure from the coolant source is low. However, one or more openings may be located on the sides of the second region. The multiple openings may be an array of openings extending along the second region (e.g., an ordered, regular arrangement). The spacing of the openings may be chosen to correspond to the arrangement of the components to be cooled. For example, the openings may be located directly above where the components are expected to be positioned. The base of the first region 21 is advantageously devoid of an opening (for example, in its base), which provides a structure that allows the coolant to stabilize before being subsequently distributed over the component to be cooled.

[0032] Figure 3 shows an example of an open cooling element in a further embodiment. Figure 3(A) shows a perspective view of the cooling element, Figure 3(B) shows a top view of the cooling element, Figure 3(C) shows a side cross-sectional view through one of the discharge chambers showing the groin, and Figure 3(D) shows a cross-sectional view taken along the length of the cooling element.

[0033] During use, the coolant flow enters through the inlet 31 and is then distributed into two channels 35, where the liquid coolant flow accumulates. In this example, there are two channels, but any number of such channels (i.e., more or fewer) can be provided. The coolant first loses some of its momentum as it spreads through the channels 35, and then overflows over the weir 33 onto the discharge point 34, where the coolant passes through the discharge point 34 to cool the components positioned below.

[0034] The cross-sectional view in Figure 3(D) shows the fluid region, which is highlighted by the shaded area. The fluid in channel 35 overflows over the weir 33. The coolant enters the secondary chamber 32, where the coolant flow accumulates after overflowing over the weir, and where the discharge point 34 is located. The coolant then passes through the discharge point 34 to cool the components below.

[0035] Figure 3(D) shows that each weir 33 is located between its respective first region (channel 35) and its respective second region (secondary chamber 32). The weir separates the first region from the second region in the sense that the fluid cannot flow from the first region to the second region without crossing the weir. Thus, in a general sense, the weirs described herein can define the walls of the first region. The weirs may provide upright walls that extend in the z direction and restrict the flow of liquid coolant in the x and y directions. The weirs described herein may extend along the axis (e.g., the x direction) of the first and / or second regions, and / or be substantially parallel thereto.

[0036] Preferably, the weir of the present disclosure extends along a plurality of openings in a second region. If the openings are arranged in a straight line, then the weir may be substantially parallel to the line along which the openings extend. Of course, a curved (non-straight) arrangement of openings can be provided, in which case it will be understood that the weir may also be curved. The distance between the openings and the weir may be constant along the length of the weir. Preferably, the weir extends along substantially all of the plurality of openings to ensure that all openings are provided with a similar level of coolant. However, if the cooling of certain components is less important, the distance between the weir and these less important openings may be greater than the distance between the weir and certain other openings.

[0037] As shown in Figures 2 and 3, the disclosure generally provides a weir and a first and second region extending in the x-direction (first direction). The first and / or second region is preferably relatively narrow in the y-direction (second direction). The cooling elements described herein may be positioned above the electronic components requiring cooling (i.e., in the z-direction, also described herein as a third direction). In normal use, the z-direction is substantially parallel to gravity, and all directions in the disclosure refer to the system in use.

[0038] The cooling element (and its components, i.e., the first and second regions and the weir) can be positioned above the electronic component in a variety of different ways. For example, the cooling element can be attached (e.g., by screws) to the base of a cooling module on legs that hold the cooling element above the electronic component. Alternatively, the cooling element can be attached (e.g., by clips) to the electronic component itself. Alternatively, the cooling element can be attached (e.g., by screws) to the side of a cooling module.

[0039] As is evident from Figure 3, the cooling element of the present disclosure may be advantageous to include a plurality of first regions (e.g., channels 35) and / or a plurality of second regions (e.g., chambers 32), and / or a plurality of weirs (e.g., weirs 33). The various regions and weirs may all be parallel to each other and adjacent to each other. In some cases, the coolant may leave a single first region by overflowing in two directions, a first direction and a second different direction. For example, the two first regions 35 in Figure 3 may be combined into a single combined first region having two weirs (one weir at each long edge of the first region). In any case, at least one weir is preferably provided between all the first regions and each of the second regions.

[0040] From Figure 3, it will be clear that the cooling elements may not be mounted perfectly horizontally. In such cases, the coolant may tend to accumulate at one end of the channel 35. This can result in the coolant not passing through the entire discharge point 34, potentially leading to ineffective cooling of certain components. To address this problem, a groin 36 is provided. The groin 36 is a wall (or weir) of any shape that forms a separate chamber for the discharge section. Effectively, the groin 36 divides the second region into a sub-region. The sub-region provides an opening at the first height, and the wall divides the opening. This can be advantageously applied in both sealed sections (e.g., manifolds) and open sections (e.g., bathtub-type systems). In Figure 3(C), it can be seen that the groin 36 can help accommodate non-horizontal systems by restricting the flow of coolant in the second region in the x-direction (i.e., along the weir). Of course, if it is known that the cooling elements may be mounted horizontally, the groin can be omitted.

[0041] Generally, and as described above, the second region preferably includes one or more groins. These groins may also be weirs within the second region, which restrict the coolant to remain in specific sub-regions of the second region. This advantageously prevents the coolant from accumulating unevenly at one end of the second region. Therefore, the one or more groins are preferably multiple groins spaced apart along the length of the second region (e.g., in the x-direction). Thus, the one or more groins may extend away from the weirs (i.e., the groins may extend in the y-direction). The groins may be substantially perpendicular to the weirs. Each set of adjacent groins preferably has at least one opening between them, which ensures that an appropriate volume of coolant is supplied to each opening. The multiple openings may be located at the base of the second region and at a lower height than the one or more groins.

[0042] It should be noted that the embodiments in Figures 2 and 3 share several common features. For example, both Figures 2 and 3 provide a weir to stabilize and improve the flow of coolant. Furthermore, both embodiments include a direct connection to the coolant supply section, and both embodiments include an opening at the base of the second region to allow for the distribution of liquid coolant. However, there are also many differences between the embodiment in Figure 2 and the embodiment in Figure 3. It will be recognized that these similarities and differences between the embodiments in Figures 2 and 3 reflect different cooling requirements for different arrangements of components and can provide many different combinations of these features.

[0043] In Figure 2, the first and second regions have a common base at the same height, and the weir extends vertically from the base. In contrast, in Figure 3, the first region is higher than the second region. This height difference can provide different velocities and pressures for the coolant. In Figure 2, a single weir divides the region into one first region and one second region. In contrast, Figure 3 includes two weirs providing two first regions and two second regions, and some embodiments provide more than two weirs. In Figure 2, the cooling element is enclosed, while in Figure 3, the cooling element is open.

[0044] In Figure 2, the fluid enters through the inlet, and the flow of the incoming coolant is perpendicular to the weir. In contrast, in Figure 3, the flow of the incoming coolant is parallel to the weir. Thus, in some embodiments, the first region of the present disclosure may include an inlet positioned such that the liquid coolant enters the first region substantially parallel to the weir or substantially perpendicular to the weir. The first region may include an inlet. The liquid coolant can be supplied to the inlet by various means such as a hose 16 or any conduit. Fresh liquid coolant can be supplied directly to the first region (i.e., without passing through other cooling elements) from a heat exchanger or a liquid coolant supply. The inlet may be positioned such that the liquid coolant enters the first region substantially parallel to the weir (e.g., as in Figure 3) or substantially perpendicular to the weir (e.g., as in Figure 2), but other entry angles may be provided.

[0045] The weirs described herein may be a single continuous wall forming a chamber, or they may be discontinuous, forming a weir section locally over a single discharge point or multiple discharge points. The weirs described herein may be simple straight walls, or they may have other shapes such as the shapes shown in Figure 3 (T-shaped, inverted L-shaped, or Y-shaped at any angle). Different weir shapes can provide different flow paths and may help stabilize the follow-through flow of the coolant and distribute fluid momentum perpendicular to the inflow flow, as in Figure 2, or parallel to the inflow flow, as in Figure 3.

[0046] In embodiments of this disclosure, depending on the available space and the required flow distribution level, one or more stabilization chambers (first regions formed by weirs as described herein) may be present. One or more separate second regions having openings may be present. Additionally or alternatively, multiple weirs may be present in a single cooling element. The openings in the second regions may be individual overflow holes of different shapes or continuous slits (single or multiple slits). Generally, the multiple openings in the second regions as described herein may include one or more slits and / or holes, and the dimensions (e.g., width and length) of these openings may be varied to control the flow rate. Combinations of slits and / or holes may be used, and such combinations can be adjusted to suit a particular arrangement of electronic components. The liquid coolant may be supplied through a dedicated single or multiple inlet nozzle or from an open bath heat sink overflow.

[0047] As described above, embodiments of the present disclosure are particularly advantageous when used with a relatively low-pressure supply of liquid coolant. Accordingly, embodiments described herein may include a further (i.e., a second) set of electronic components cooled by a second cooling element (which may be different from the cooling element described above). The second cooling element may provide more coolant than the first cooling element.

[0048] In general terms, one or more electronic components described herein may be a first set of one or more electronic components, a cooling element may be a first cooling element, and a cooling module may further include a second set of one or more electronic components (different from the first set) and a second cooling element configured to cool the second set of one or more electronic components. A liquid coolant supply is configured to provide liquid coolant to the first and second cooling elements. The liquid coolant supply may be configured to provide the second cooling element with any one or more of the following: a larger volume of liquid coolant than that of the first cooling element, a higher flow rate of liquid coolant than that of the first cooling element, and a higher pressure of liquid coolant than that of the first cooling element. Therefore, the first cooling element described herein is particularly advantageous in such a cooling module because it is suitable for low-pressure or low-flow scenarios.

[0049] In the embodiments described above, the depth (measured in the z-direction) of the first region and / or the second region may be less than the height of the electronic component being cooled.

[0050] Those skilled in the art will understand from reading the embodiments described above that the liquid coolant should be maintained in liquid form. In other words, there should be no phase change of the liquid coolant, as evaporation of the liquid coolant may reduce the effectiveness of the embodiments described above.

[0051] All of the features described herein can be applied to either a sealed manifold or an open system. That is, the first and second regions may both be open, or the first and second regions may both be sealed.

[0052] It will be understood that many modifications can be made to the above-described apparatus, systems, and methods while retaining the advantages mentioned above. For example, where a particular configuration is described, alternative arrangements that provide the same or similar functionality may be provided.

[0053] For example, the components described herein may have a variety of dimensions. It will be understood that the present invention is not limited to cooling elements having any particular depth, length, or height.

[0054] The depth of the first region described above is approximately 10 mm. However, depending on the flow rate, geometric constraints, and other factors, various other values ​​such as at least 3 mm, 50 mm, or 100 mm can be used. The length of the first region can also be varied depending on the location of the components being cooled. In the example above, the length shown is approximately 100 mm, but depending on the flow rate, geometric constraints, and other factors, various other values ​​such as at least 3 mm, 50 mm, or 200 mm can be used. The height of the weir described above is approximately 5 mm. However, depending on the flow rate, geometric constraints, and other factors, other heights such as 3 mm, 10 mm, 50 mm, or 100 mm can be used. The groin described herein is shown as having a height slightly lower than the height of the weir. Such a height may be, for example, 1 mm, 2 mm, or 3 mm lower than the height of the weir. The groin may be 70%, 80%, or 90% of the height of the weir. Again, various different heights can be used depending on the flow rate and geometric constraints.

[0055] In some embodiments, the height of the weir may be slightly greater than the diameter of the inlet pipe (e.g., 1 mm, 2 mm, 3 mm, etc.) to prevent the coolant from flowing directly over the weir. Thus, in general terms, the weir described herein may be higher than the inlet that provides the liquid coolant to the first area. A larger inlet pipe may result in a higher weir. The inlet may be a pipe or tube that has any height or shape depending on the component being cooled or the component in which the cooling element is located nearby.

[0056] This disclosure provides cooling elements that are particularly advantageous when used at relatively low flow rates. Non-limiting examples of relatively low flow rates are 0.05 L / min to 0.25 L / min. However, other flow rates other than these values ​​can be considered low flow rates. For example, if a cooling module includes cooling elements that provide higher flow rates, any flow rate within the cooling module can be considered a “low flow rate.” Thus, 0.05 L / min to 0.25 L / min may be described as a low flow rate in some contexts, but if another cooling element provides 0.01 L / min, these may be considered relatively high flow rates. Examples of relatively high flow rates (which may be used to cool hot components) may be 1.5 L / min to 3 L / min. However, it will be understood that the terms “low flow rate” and “high flow rate” are not limited to these specific examples.

[0057] Advantageously, embodiments of the present disclosure can be used at pressures so low that it is difficult to reliably measure the pressure. The weirs described herein can provide a method for providing appropriate pressure when back pressure cannot be used to equalize the flow on a manifold. The cooling elements described herein can be used at various flow rates (including relatively high flow rates) to improve the pressure of coolants used to cool electronic devices.

[0058] Furthermore, various types of pump transport and liquid transfer configurations can be used. The illustrated configurations are for illustrative purposes only, and any alternative configurations can be used, including any of the configurations described and illustrated in International Publication Nos. 2019 / 048864 and 2022 / 112799, which are incorporated by reference. Similarly, while DIMMs and M.2s have been mentioned above, other electronic components may be cooled using the features of this disclosure.

[0059] It will be understood that the cooling elements described herein may be provided as standalone components. For example, the disclosure also provides a cooling element configured to cool one or more electronic components by distributing a liquid coolant over one or more electronic components, comprising: a first region configured to receive liquid coolant from a liquid coolant supply; a second region comprising a plurality of openings; and a weir between the first region and the second region, wherein the first region, the second region and the weir are configured to be positioned above one or more electronic components (e.g., configured to be mounted) such that the liquid coolant from the first region overflows over the weir onto the plurality of openings, thereby distributing the liquid coolant over one or more electronic components.

[0060] Additionally, the Disclosure also relates to a cooling element configured to cool one or more electronic components by distributing a liquid coolant over one or more electronic components, comprising: a first region configured to receive a liquid coolant from a liquid coolant supply; a second region comprising a plurality of openings; and a weir between the first region and the second region, wherein the first and second regions are configured such that the liquid coolant in the first region overflows over the weir onto the plurality of openings, thereby distributing the liquid coolant over one or more electronic components. The first region and / or the second region may be elongated. These regions may extend along the weir.

[0061] Unless otherwise specified, each feature disclosed herein may be replaced by an alternative feature that serves the same, equivalent, or similar purpose. Accordingly, unless otherwise specified, each disclosed feature is merely an example of a general set of equivalent or similar features.

[0062] Where used herein, including in the claims, the singular form of a term should be interpreted as including the plural form unless the context indicates otherwise, and vice versa, where the context allows. For example, unless the context indicates otherwise, the singular reference in this specification, including in the claims, to “a” or “an” (such as an electronic component or a cooling element) means “one or more” (e.g., one or more electronic components or one or more cooling elements). Throughout the description of this disclosure and the claims, the words “comprise,” “including,” “having,” and “contain,” and variations thereof, such as “comprising” and “comprises,” are not intended (and do not) exclude other components.

[0063] Any and all examples or exemplary language provided herein (such as "for instance," "such as," and "for example") are intended solely to better illustrate the disclosure and, unless otherwise requested, do not limit the scope of the disclosure. No language in this specification should be construed as indicating that any unclaimed element is essential to the practice of the disclosure.

[0064] Any steps described herein may be performed in any order or concurrently, unless otherwise specified or required by context. Furthermore, where it is stated that one step is performed after another, this does not preclude the intermediate step from being performed.

[0065] All aspects and / or features disclosed herein can be combined in any combination, except for any combination in which at least some of such features and / or steps are mutually exclusive. In particular, preferred features of the Disclosure are applicable to all aspects and embodiments of the Disclosure and can be used in any combination. Similarly, features described in non-essential combinations may be used separately (without combination).

[0066] Methods for manufacturing and / or operating any of the devices (or arrangements of devices) disclosed herein are also provided. These methods may include steps of providing each of the features disclosed herein and / or configuring each feature for its described function.

Claims

1. A cooling module for cooling one or more electronic components within a cooling module, One or more electronic components, A cooling element configured to cool one or more electronic components by distributing a liquid coolant over one or more electronic components, The cooling element is A first region configured to receive the liquid coolant from a liquid coolant supply unit, A second region including multiple openings, A weir between the first region and the second region, A cooling module wherein the first region, the second region, and the weir are positioned above one or more electronic components such that the liquid coolant in the first region overflows over the weir and onto the plurality of openings, thereby distributing the liquid coolant onto one or more electronic components.

2. The cooling module according to claim 1, wherein the first region includes a channel.

3. The first region is an elongated cooling module according to claim 1 or 2.

4. The cooling module according to any one of claims 1 to 3, wherein the base of the first region has no opening.

5. The cooling module according to any one of claims 1 to 4, wherein the first region extends along the plurality of openings.

6. The cooling module according to any one of claims 1 to 5, wherein the first region is located above the second region.

7. The second region is an elongated cooling module according to any one of claims 1 to 6.

8. The cooling module according to any one of claims 1 to 7, wherein each of the plurality of openings is located at the base of the second region.

9. The cooling module according to any one of claims 1 to 8, wherein the plurality of openings is an array of openings extending along the second region.

10. The cooling module according to any one of claims 1 to 9, wherein the plurality of openings include one or more slits and / or holes.

11. The cooling module according to any one of claims 1 to 10, wherein the second region comprises one or more groins.

12. The cooling module according to claim 11, wherein the one or more groins are a plurality of groins spaced apart along the length of the second region.

13. The cooling module according to claim 11 or 12, wherein one or more groins extend away from the weir.

14. The one or more groins mentioned above are multiple groins, The cooling module according to any one of claims 11 to 13, wherein at least one of the plurality of openings is located between each set of adjacent groins.

15. The cooling module according to any one of claims 11 to 14, wherein the plurality of openings are located at the base of the second region and at a height lower than the one or more groins.

16. The cooling module according to any one of claims 1 to 15, wherein the weir defines the wall of the first region.

17. The cooling module according to any one of claims 1 to 16, wherein the weir is substantially parallel to the axis of the first region and / or the second region.

18. The cooling module according to any one of claims 1 to 17, wherein the weir extends along the plurality of openings.

19. The cooling module according to any one of claims 1 to 18, wherein the weir includes a first portion extending away from the electronic component and a second portion extending laterally with respect to the first portion.

20. The cooling module according to any one of claims 1 to 19, wherein the cross-section of the weir is T-shaped, L-shaped, or Y-shaped.

21. The cooling element is Multiple first regions and / or multiple second regions, and / or A cooling module according to any one of claims 1 to 20, comprising a plurality of weirs.

22. The cooling module according to any one of claims 1 to 21, wherein the cooling element includes a plurality of first regions and a plurality of second regions, and each first region and each of the second regions has a weir between them.

23. The cooling module according to any one of claims 1 to 22, wherein the first region includes an inlet arranged such that the liquid coolant enters the first region substantially parallel to the weir or substantially perpendicular to the weir.

24. The aforementioned one or more electronic components are a first set of one or more electronic components, The cooling element is a first cooling element, The cooling module is A second set of one or more electronic components, A second cooling element configured to cool the second set of one or more electronic components, A cooling module according to any one of claims 1 to 23, further comprising: a liquid coolant supply unit configured to supply the liquid coolant to the first cooling element and the second cooling element.

25. The liquid coolant supply unit supplies the second cooling element, A liquid coolant in a volume larger than that of the first cooling element, A liquid coolant with a flow rate higher than that of the first cooling element, The cooling module according to claim 24, configured to provide any one or more of the following: a liquid coolant at a pressure higher than that of the first cooling element.

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