Pump assembly and liquid cooling chassis housing

Abstract

The pump docking assembly is configured to interconnect at least one pump with a coolant liquid flow loop. The pump docking assembly comprises at least one pump receiving device positioned to releasably engage with at least one pump, and a coolant liquid flow loop port connectable to at least one pump. At least one pump includes a liquid coolant inlet. The liquid cooling chassis housing comprises a liquid coolant distribution device that encloses at least one electronic component and interconnects the liquid coolant flow loop with the pump docking assembly.

Description

Technical Field

[0001] The present disclosure relates to a pump docking assembly for receiving one or more replaceable pumps. A liquid cooling chassis housing (or module) is also provided for holding at least one (electronic) heating component together with a pump docking assembly (having one or more coolant pumps).

Background Art

[0002] Within a computer, server, or other device used for data processing (referred to as IT, or information technology), there are several electronic devices called integrated circuits (ICs). The electronic devices within an integrated circuit can include a central processing unit (CPU), an application specific integrated circuit (ASIC), a graphical processing unit (GPU), a random access memory (RAM), and the like. Each of these devices generates heat during use. This heat should be transferred away from the device in order to maintain the device at an optimal temperature for proper operation. As the processing power of IT increases, and thus the number of electronic devices within a computer, server, or other IT increases, the problem of removing sufficient heat generated by the electronic devices grows.

[0003] Electronic devices are typically mounted on a printed circuit board (PCB) and usually housed or enclosed within a case, housing, or chassis to form an electronic module. For example, in a server, this enclosure may be referred to as a server chassis; however, the term “chassis” is used herein to refer to any type of overall housing used for electronic components. Server chassis typically conform to several industry standards specifying the height of each chassis, referred to as 1RU (1 rack unit) or 1OU (1 open unit), also abbreviated as 1U or 1OU. The smaller of the two main standards is 1RU / 1U, which has a height of 44.45 mm or 1.75 inches. Such servers are typically rack-mounted, although such server chassis may not necessarily need to be plugged into, for example, a backplane.

[0004] Methods for removing heat from each case or chassis are used to maintain electronic devices within the chassis at appropriate temperatures. Cooling electronic modules by circulating air over or inside each case or chassis is common. Airflow may be sufficient to remove some heat from the interior of the enclosure to the surrounding environment. Until recently, this cooling method was almost exclusively used for mass-produced IT and server equipment. However, as the scale of technology shrinks for the same computing performance, it has been found that the heat generated by electronic devices increases even as the footprint decreases. Thus, the limitations of air cooling systems for electronic modules have suppressed or constrained the peak performance of IT systems.

[0005] Therefore, more complex systems and methods have been proposed for cooling electronic modules. In some cases, liquid cooling is used, where a liquid coolant flows over or near a heatsink coupled to the electronic device. Heat can then be transferred from the electronic device to an area or element that can remove the heat from the liquid coolant. Liquid cooling can, in some cases, provide more efficient heat transfer from the electronic device or components and thus can provide greater cooling power than air cooling systems. However, modern liquid cooling systems often use customized systems, which can be complex and expensive to install. Furthermore, improvements in cooling performance are always desired.

[0006] A preferred mode of liquid cooling generally involves immersing the electrical components in a liquid coolant to provide a large surface area for heat exchange between the heat-generating electrical components and the coolant. Such systems may use single-phase coolants, in which case the coolant remains in the liquid phase or a phase-change coolant, and the liquid coolant must evaporate and condense for continuous and effective cooling.

[0007] International Publication No. 2018 / 096362 (by the same applicant as this disclosure, details of which are incorporated herein by reference) describes a cooling system in which a primary dielectric coolant liquid is provided within a chassis and used to cool electronic components housed therein. The primary dielectric coolant liquid is pumped to a heat exchanger, where heat is transferred to a secondary liquid coolant. The heat exchanger is provided within the chassis, and the secondary liquid coolant, typically water or water-based (advantageous due to its high specific heat capacity), is pumped into the chassis and the heat exchanger within it, and then pumped out of the chassis, and may be shared among multiple chassis. Pipes terminated with nozzles are provided to carry the primary dielectric coolant from the heat exchanger to the electronic components to be cooled.

[0008] International Publication No. 2019 / 048864 (by the same applicant as this disclosure, details of which are incorporated herein by reference) describes heat sinks and heat sink configurations for electronic devices. Such heat sinks allow primary dielectric coolant to accumulate adjacent to specific electronic components, thereby effectively cooling the electronic components. The coolant may flow out of the heat sink by overflowing from the heat sink and / or through one or more holes in the heat sink, and merge with the rest of the coolant in the chassis that cools other electronic components inside. In this way, multiple levels of coolant can be provided, and the total amount of coolant required can be minimized. Pipes terminated with nozzles are provided to carry primary dielectric coolant from a heat exchanger to each heat sink.

[0009] International Publication No. 2022 / 106582 (by the same applicant as this disclosure, details of which are incorporated herein by reference) discusses an approach in which immersion cooling based on a dielectric coolant may be combined with a cooling plate supplied with a second liquid coolant, such as a water-based coolant. Heat may be transferred from the dielectric coolant to the second liquid coolant within a heat exchanger, which is advantageously located in the same chassis as the immersion coolant and the electronic equipment being cooled. The second liquid coolant is typically supplied from outside the chassis, for example, from the water supply of the building or facility.

[0010] In these systems, pumping the liquid coolant, particularly the primary coolant, is a significant implementation issue. The use of two or more pumps (each of which may be, for example, an impeller pump) is known, which can offer advantages in terms of capacity and / or redundancy. For this purpose, improved pumping is desirable. [Overview of the Initiative]

[0011] Against this backdrop, a pump docking assembly according to claim 1 and a liquid-cooled chassis housing according to claim 10 are provided. Further preferred and / or advantageous features are detailed in the dependent claims and / or others described herein.

[0012] A removable or replaceable (liquid coolant) pump for a coolant flow loop is, in particular, insertable and removable during operation of the coolant flow loop (so-called "hot-swappable"). The pump may have a body with a coolant inlet and a coolant outlet. The inlet and / or outlet are intended to match corresponding ports on an interface in the coolant flow loop (such as a pipe, cradle, or docking assembly). A handle or gripping surface on the body allows for its insertion and / or removal, in particular during operation of the coolant flow loop (for example, the handle or gripping surface may be thermally separated and / or insulated from the body to facilitate removal). The liquid coolant is typically a dielectric liquid, but the pump may be used with other fluids or liquid coolants.

[0013] In another sense (as may be in combination with other aspects or features of the present disclosure), a method for operating a coolant flow loop for a (liquid) coolant may be considered. During operation of the coolant flow loop for heat transfer from electronic equipment (which may include a circuit board) to the liquid coolant, the coolant flow loop is modified by inserting or removing a (liquid) coolant pump. The coolant flow loop continues to operate throughout.

[0014] Each pump is therefore designed to be hot-swappable during service events. If a pump fails, it can be replaced without disabling the coolant loop (or turning off any part of the system). This can replicate the hot-swap functionality used for fans in air-cooling systems.

[0015] Another aspect of the Disclosure (which can be combined with any other aspect or feature of the Disclosure) may be found in a pump docking assembly (cradle) for receiving one or more (liquid) coolant pumps as part of a coolant flow loop. The pump docking assembly has at least one pump receiving device (or means for supporting each pump) and a coolant port (first port) for each pump, to which the coolant can be connected. Each coolant port is typically a coolant liquid outlet that directs the coolant to its respective pump, but in some implementations it can be configured as an inlet. The pump docking assembly may be arranged to allow coolant to flow between each first port and another (second) coolant port that provides flow into (or out of) the pump docking assembly. Typically there is only one second coolant port common to all pumps coupled to the pump docking assembly, which may be made possible by a manifold coupled to each of the first coolant ports, but in some implementations there may be two or more second coolant ports. The pump docking assembly thereby allows for the insertion of a pump into and / or removal of a pump from the coolant flow loop. This can, in particular, allow for the continuous transfer of liquid coolant between the pump docking assembly and the rest of the coolant flow loop when one of several (liquid) coolant pumps is removed. This can enable redundant operation. The pump docking assembly can be combined with one or more pumps to provide a (liquid) coolant pump assembly or system.

[0016] Each pump receiving device is advantageously equipped with a releasable push-fit clip mechanism.

[0017] To allow insertion and / or removal of the pump (facilitating engagement and disengagement of the pump and the pump receiving device), the handle or gripping surface is advantageously located on the upper part of the body. The inlet and outlet are preferably located on the lower part of the body. In embodiments, the inlet may be provided on the base of the body and / or the outlet on the side of the body. In the latter case, the outlet may be configured to cooperate with a port on the pump docking assembly or pipe.

[0018] The pump can be of any type, but typically an impeller pump is used. This may have an impeller housing within the body. A pipe (vertically oriented) may be coupled to each of the first coolant ports. Each coolant liquid flow loop port (which may be an outlet or an inlet) may include a one-way valve device or a check valve device, and / or a pressure relief device or gas relief mechanism between, for example, the one-way valve device or check valve device and the first coolant port, particularly configured at a height above the corresponding pump impeller housing. Thus, the pressure relief device or gas relief mechanism may allow priming of each (liquid) coolant pump when gas is present between the impeller housing and the one-way valve device or check valve device. The pressure relief device or gas relief mechanism may be a hole or air vent orifice (for example, sized to allow gas to escape from the body but to prevent significant flow of liquid coolant from the body), or a priming valve. This may allow the impeller housing to be naturally filled with coolant up to the nominal coolant liquid level in the chassis.

[0019] The electrical (power) connector is coupled to or integrated with the upper part of the body to receive power to the pump and is typically a male connector. This may also be in the form of a cable and / or electrical port (such as a plug or socket). Insertion and / or removal is made easier by providing the power connector at a higher fluid level, typically above the coolant level. Each pump receiving device may include an electrical connector (typically female) configured to mate with a corresponding electrical connector located on each pump. In some implementations, the electrical connection is automatic when the pump is removed or replaced.

[0020] In some embodiments, the vortex-preventing device for the liquid coolant inlet may be provided as part of the pump. Alternatively, the vortex-preventing device may be formed as part of the pump receiving device of the pump docking assembly, for example, as part of its support means (particularly when the pump coolant inlet is located on the base of the body). In that case, individual vortex-preventing devices may be provided for each pump. Each vortex-preventing device may be arranged to cooperate with the liquid coolant inlet of each pump when the pump is engaged with the pump receiving device.

[0021] Each of the first coolant ports of the pump docking assembly is preferably provided with an O-ring seal. Additionally or alternatively, a clip may be used to secure the port on the pump docking assembly together with the pump (typically the outlet) port. The clip may be releaseable with one hand, which may allow the pump to be removed with the other hand. The clip may automatically hold the pump in place upon insertion.

[0022] The pump docking assembly includes (for example, as part of its support means) a rail system, such as a Trammel rail, which advantageously engages with each pump during engagement with the pump receiving device and can guide the pumps and pump receiving devices into proper engagement. The remainder of the pump docking assembly may be mounted on the rail, or each pump may be mounted on the rail. The rail system advantageously allows the movement of the pump docking assembly and / or the pumps (or multiple pumps) together.

[0023] The pump docking assembly may include some form of control, such as a processor, which preferably provides control signals. The processor may be software-based. This may allow for the identification of pumps on each port.

[0024] Advantageously, a fluid (typically liquid) cooling module may be provided. Additionally or alternatively, a liquid-cooled chassis housing (which may be part of a liquid-cooled module) may be provided to enclose heat-generating (electronic) components or devices (e.g., electronic equipment that may be mounted inside). Optionally, a cooling fluid (primary or first, typically liquid) is also provided within the chassis. A pump docking assembly as described herein is further provided (preferably within the chassis). Advantageously, the chassis housing also has a liquid coolant distribution device that interconnects a liquid coolant flow loop with the pump docking assembly. This enables a coolant flow loop within the chassis (preferably entirely within the chassis), for example, by allowing coolant to flow from a pump or a number of pumps into the chassis (to provide direct impact cooling or to partially or completely immerse heat-generating components or devices) and then return to the pump. It is advantageous that the pump (or a number of pumps) is mounted within the pump docking assembly. Such a module or chassis housing may be used to cool IT, e.g., computer servers. The module or chassis housing may be mounted in a rack.

[0025] The liquid level of the primary coolant is advantageously lower than one or more of the following: the releasable push-fit clip mechanism, the pump handle (or gripping surface), one, some, or all of the (female) electrical connector or multiple electrical connectors of the pump docking assembly, the pump (male) electrical connector, and the release clip handle for pump interconnection with the pump docking assembly. Additionally or alternatively, the liquid level of the primary coolant is at least the same height as the liquid coolant inlet. The pump can be removed and / or inserted (i.e., replaced) without the user needing to come into contact with the coolant or without interference from power connections. Advantageously, the liquid level of the primary coolant is at least the same height (and preferably higher) as the impeller housing of the pump (or multiple pumps). The liquid level of the primary coolant is lower than one or more of the following: at least one releasable push-fit clip mechanism, handle or gripping surface, female electrical connector, and / or

[0026] The module or liquid-cooled chassis housing preferably includes a second (secondary) coolant liquid inlet and a second (secondary) coolant liquid outlet. Advantageously, the secondary coolant liquid inlet is connected to a liquid coolant distribution device, and the secondary coolant liquid outlet is connected to the coolant liquid flow loop outlet of a pump docking assembly.

[0027] Preferably, the coolant flow loop also comprises a heat exchange device, which transfers heat from the liquid coolant to a heat sink (e.g., a secondary coolant, typically liquid and isolated from the primary coolant), typically downstream from the pump (or one, some, or all of the pumps), for example, between the secondary coolant liquid inlet and the liquid coolant distribution device, and between the secondary coolant liquid outlet and the pump docking assembly. The heat exchanger is beneficially located within or forming part of the chassis. Pipes may be provided to transfer the liquid coolant between the pump(s) and the heat exchanger.

[0028] The piping configuration may direct liquid coolant from the pump (or each of multiple pumps) to one or more components within the chassis. The electronic component(s) are beneficially located within a sump that receives primary coolant liquid from the liquid coolant flow loop. Thus, the electronic component(s) are typically in thermal contact, either directly or indirectly, with the primary coolant liquid. A liquid coolant heat sink may be used (as discussed, for example, in International Publication No. WO 2019 / 048864) to accumulate the received liquid coolant adjacent to the component.

Brief Description of the Drawings

[0029] The present disclosure may be practiced in many ways, and the preferred embodiments will be described below by way of example only, with reference to the accompanying drawings. [Figure 1] FIG. 1 shows a plan view of an exemplary liquid-cooled module having a pump assembly according to the present disclosure as part of a dielectric coolant loop for cooling two circuit boards within a chassis. [Figure 2A] FIG. 2 depicts a front isometric view of the exemplary liquid-cooled module of FIG. 1. [Figure 2B] FIG. 3 shows a rear isometric view of the exemplary liquid-cooled module of FIG. 1. [Figure 3] FIG. 4 illustrates an isometric view of the components inside the chassis of the exemplary liquid-cooled module of FIG. 1. [Figure 4] FIG. 5 depicts an isometric view of FIG. 3 with one circuit board and one pump removed. [Figure 5A] FIG. 6 shows an isometric view of the pump assembly of the exemplary liquid-cooled module of FIG. 1. [Figure 5B] FIG. 7 shows an isometric view of FIG. 5A with one pump in the process of being removed. [Figure 5C] FIG. 8 depicts an isometric view of FIG. 5A with one pump removed. [Figure 6A] FIG. 9 shows an isometric view of the pump and cradle support and interconnect portions of the pump assembly of FIG. 5A. [Figure 6B]Figure 5A illustrates a first side view of the pump assembly, including the pump, cradle support, and interconnection parts. [Figure 6C] Figure 5A illustrates a modified version of the pump assembly, illustrating a second partial cross-sectional side view of the pump and cradle support and interconnection parts. [Figure 7] An isometric view of a single pump according to the modified embodiment described herein is shown. [Figure 8A] A pump assembly according to an alternative embodiment in the first configuration is depicted. [Figure 8B] Figure 8A depicts the pump assembly in the second configuration. [Figure 8C] Figure 8A depicts the pump assembly in the third configuration.

[0030] All drawings are essentially schematic. The same reference numerals are used throughout the drawings to indicate the same features. [Modes for carrying out the invention]

[0031] As described above, a key advantage of this disclosure is the ability of individual pumps (or multiple pumps) to be hot-swappable, for example, in a service event. Each pump is designed to facilitate insertion and / or removal, and a handle is provided for this purpose, for example. Thus, if a pump fails, it can be easily replaced without turning off the liquid coolant loop (or any part of the system). This can replicate the hot-swap functionality used on fans in air-cooled servers.

[0032] To illustrate this implementation, an embodiment will be discussed using a dielectric coolant loop (which is particularly advantageous in this disclosure). Referring first to Figure 1, a plan view is shown of an exemplary liquid-cooled module having a pump assembly according to this disclosure as part of a dielectric coolant loop cooling two circuit boards within a chassis.

[0033] A chassis 1, an IT motherboard 3, a liquid coolant heatsink 4, RAM sticks 5, a liquid coolant pump 6, a pump manifold 7, a heat exchanger 8, an outlet pipe 9, a coolant distribution manifold 10, a supply pipe 11, a coolant nozzle 12, a secondary coolant outlet 13, and a secondary coolant inlet 14 are provided. Each IT motherboard also includes multiple integrated circuits (e.g., including CPUs or GPUs), each of which is not visible in Figure 1 due to the liquid coolant heatsink 4. In this embodiment, each IT motherboard (circuit board) 3 has two CPUs, each fitted with its own liquid coolant heatsink 4, and banks of RAM 5 are attached to each side of the CPUs, although other configurations are possible.

[0034] A dielectric coolant (not visible in Figure 1) is used to remove heat from the integrated circuit and RAM stick 5. This dielectric coolant is collected at the base of the chassis 1 for a coolant sump 2. From there, it is drawn in by a pump 6 and transported via a pump manifold 7 to a heat exchanger 8 for cooling (more details of which are discussed below). The cooled coolant is sent from the heat exchanger 8 through an outlet pipe 9 to a coolant distribution manifold 10. From there, the coolant is distributed among supply pipes 11 (four are shown in Figure 1), each supply pipe 11 delivering the coolant to its respective liquid coolant heat sink 4. The liquid coolant heat sinks 4 are as fully described in International Publication No. 2019 / 048864, and therefore their details are omitted here for brevity. The delivered liquid coolant accumulates in each of the liquid coolant heat sinks 4, thereby providing a sink for the heat from each integrated circuit positioned beneath each liquid coolant heat sink 4. The accumulated liquid coolant flows out from each liquid coolant heatsink 4 (for example, by flowing over the outer wall of the liquid coolant heatsink 4 or through a designed channel) and can then cool other components in the chassis 1, such as the RAM stick 5. This hot liquid coolant then accumulates in the coolant sump 2 at the base of the chassis 1, thereby completing the coolant flow loop. Note that the liquid coolant level accumulated in the chassis 1 (i.e., the coolant sump 2) is lower than the coolant level accumulated in each of the liquid coolant heatsinks 4, so that multiple coolant levels exist to provide adaptive cooling for different components in the chassis 1.

[0035] Although this design shows four pumps 6, fewer or more pumps may be used in practice. Using multiple pumps may increase pump capacity and / or efficiency and / or improve redundancy. As mentioned above, pumps 6 can be inserted or removed during operation of the dielectric liquid coolant flow loop. This may be particularly possible by using a cradle (pump docking assembly) supplying the pump manifold 7 (the pump manifold 7 may be seen as part of the cradle in some embodiments and may be omitted), and / or by using multiple pumps 6, as described below. However, hot swapping of pumps may also be possible with a single pump without a cradle, depending on the configuration of the coolant flow loop.

[0036] The heat exchanger 8 is typically a plate heat exchanger, but other options are possible. The dielectric coolant entering the heat exchanger 8 is the primary coolant in this embodiment, and the heat exchanger 8 also receives a secondary coolant (typically water or water-based) via the coolant inlet 14. The received secondary coolant is generally cold and receives heat from the primary coolant in the heat exchanger 8 before being discharged via the secondary coolant outlet 13. A secondary coolant flow loop may also be formed, including a pump arrangement, and one or more pumps or pump systems according to this disclosure may also be suitable for that flow loop, but this is not discussed herein. The secondary coolant inlet 14 is typically located at the end of the heat exchanger 8 opposite the primary (dielectric) coolant inlet, so as to ensure backflow between the coolants. Both the secondary coolant inlet 14 and the secondary coolant outlet 13 advantageously have drip-free connectors.

[0037] Referring now to Figure 2A, a front isometric view of the exemplary liquid-cooled module of Figure 1 is depicted. The same reference numerals are used as the same features are shown. In this embodiment, it can be seen that the pump manifold 7 is positioned above the pump 6. The dielectric coolant outlet pipe 9 runs between the pump manifold 7 and the pump 6. Both the pump manifold 7 and the dielectric coolant outlet pipe 9 are positioned to leave sufficient space to allow for the insertion or removal (and replacement) of the pump.

[0038] Referring to Figure 2B, a rear isometric view of the exemplary liquid-cooled module in Figure 1 is shown. The secondary coolant (water) side of the chassis 1 is more visible, and the drip-free connectors providing the secondary coolant outlet 13 and secondary coolant inlet 14 on the heat exchanger 8 pass through the wall of the chassis 1.

[0039] Referring now to Figure 3, an isometric view illustrating the internal components of the chassis of the exemplary liquid-cooled module shown in Figure 1 is illustrated. This is similar to the diagram in Figure 2A, excluding the chassis. In this embodiment, a fully assembled system with four pumps 6 and two IT motherboards 3 can be seen. In this embodiment, three of the four pumps 6 are required to cool the IT, and one pump 6 is used for redundancy.

[0040] Next, referring to Figure 4, an isometric view of Figure 3 is depicted with one circuit board (IT motherboard 3) and one pump removed. This shows port 16 on the dielectric manifold 10, which is not needed. Unused port 16 is blocked to prevent coolant from flowing out from it.

[0041] In this embodiment, three pumps 6 are used. As a result, the vortex de-sinking device 15 is visible in a portion of the cradle 30, specifically in the empty portion of the cradle 30. This will be discussed further below. When only one IT motherboard 3 needs to be cooled, fewer pumps 6 may be required. If additional IT motherboards 3 are added, additional pumps 6 can also be provided.

[0042] Referring now to Figure 5A, an isometric view of a pump assembly from the exemplary liquid-cooled module of Figure 1 is shown. This exemplary pump assembly 40 comprises two cradles 30, with two pumps 6 coupled to each cradle 30. Each pump 6 comprises a body 26, a handle 21 mounted on the top of the body 26, and a power connector 20 located on the top of the body 26. A rail system 27 is visible from the cradles 30, which will be described in more detail below.

[0043] Next, referring to Figure 5B, an isometric view of Figure 5A is shown with one pump in the removal process. This view allows for a greater visibility of the cradle 30, which can be seen to include an vortex prevention device 15, a pump port 19, a priming valve 18, a non-return valve (NRV) 17, and a rail system 27. The vortex prevention device 15 is attached to the rail system 27 and together forms the support portion of the cradle 30 to which the pump is mounted. A pump inlet 28 is also shown at the base of the pump 6.

[0044] The pump inlet 28 is fitted onto the vortex-preventing device 15, which is positioned distal to the pump port 19 on the rest of the cradle 30. This position is the removal position of the vortex-preventing device 15 when the pump is removed from the pump assembly 40. When the pump 6 is inserted into the pump assembly or system 40, the pump 6 (and specifically the pump inlet 28) is positioned on the vortex-preventing device 15 and moved along the cradle 30 (the cradle 30 may slide along the rails with the pump 6 when it is removed or replaced), thereby coupling the outlet of the pump 6 with the pump port 19. This will be described in more detail below.

[0045] The pump can be positioned and removed by the handle 21, which allows for easy access and precise positioning within the pump assembly 40. The handle is advantageously positioned above the liquid level of the dielectric coolant (in the coolant sump 2) to avoid the user needing to come into contact with the dielectric coolant. The handle 21 may be insulated or separated from the body 26 of the pump 6 so that it can be easily used even if the pump 6 has been recently operated.

[0046] The power connector 20 is coupled to a suitable internal electrical connection (particularly on the cradle 30). The power connector 20 can not only supply power to the pump, but also, advantageously, control signals are supplied through it additionally (or alternatively). To insert or remove the pump 6, the power connector needs to be connected or disconnected, respectively. The power connector 20 (and inline cable) is also above the liquid level of the dielectric coolant (in the coolant sump 2).

[0047] NRV17 is positioned along a pipe (or piping) oriented perpendicularly from the pump port 19 toward the connection to the pump manifold 7, which is more clearly seen in subsequent drawings. When empty, NRV17 can prevent backflow through the pump port 19. When the pump 6 is first installed, air may be trapped between the impeller housing and NRV17 within the pump 6. This can make it difficult for the pump 6 to prime, as the pump is designed to pump liquid, not air.

[0048] When pump 6 is first turned on, it attempts to force the air trapped in the impeller housing or pump port 19 through the coolant loop. To achieve this, pump 6 is required to generate sufficient pressure to open NRV 17. However, this is not always possible, as pump 6 cannot effectively pump out the trapped air in order to overcome the back pressure in front of NRV 17. Therefore, the priming valve 18 (gas relief mechanism) allows air to be purged from pump 6 and the impeller housing in pump port 19 before NRV 17, and the impeller housing is naturally filled with coolant up to the nominal coolant liquid level in chassis 1. This ensures that pump 6 can prime itself.

[0049] Each NRV17 is provided for each pump port 19 of the cradle 30, and therefore one, two, three, or four pumps can be used. The number of pumps used may depend on the cooling and / or coolant requirements.

[0050] Next, referring to Figure 5C, an isometric view of Figure 5A is depicted with one pump removed. The portion of the cradle 30 around the pump port 19 is more visible, and the retaining clip 29 of the cradle 30 can be seen. When the pump 6 is coupled to the cradle 30, the outlet of the pump 6 is pushed into the opening of the pump port 19, which has an O-ring (or equivalent) seal. The retaining clip 29 holds the pump 6 in place. The retaining clip 29 can be easily released (for example with one hand), making it possible to remove the pump 6 (for example with the other hand). When the replacement pump 6 is inserted so as to couple to the pump port 19, the retaining clip 29 automatically holds the new pump 6 in place. The retaining clip 29 has a handle that is above the liquid level of the dielectric coolant (in the coolant sump 2). Therefore, the pump can be removed and replaced without the user needing to touch the dielectric coolant.

[0051] The cradle may, advantageously, include a processor (not shown) capable of controlling the pumps 6. Such control (which may be implemented in hardware or firmware, but preferably as software) may enable hot-swapping functionality by appropriately disabling and / or enabling the pumps 6. Since all pumps operate according to the same pump coolant loop design, costs and / or complexity may be reduced. Beneficially, the processor may be able to identify, through software recognition, which pump is connected to each pump port 19.

[0052] Control can be used to ensure optimal redundant pump operation. In practice, different pumping redundancy requirements may apply. For example, if only one pump is needed to meet the cooling requirements, two pumps may be provided to offer N+N redundancy. An alternative approach is to use N+1 redundancy, in which case, for example, three pumps may be needed, and therefore four pumps are provided.

[0053] Pump redundancy control can be implemented in two different ways. One approach is for all pumps (N+1) in the chassis to operate together at a lower power (or RPM). Then, if a pump fails, the remaining pump (N) can operate at a higher power (or RPM) until the failed pump is replaced. This may be the preferred option since the redundant pump is already operational. The second approach is to turn off the redundant pump (+1) when the system is operating normally and turn it on only when a pump fails.

[0054] In a general sense, a (liquid) coolant pump can be considered, comprising a body having a (liquid) coolant inlet and a (liquid) coolant outlet, wherein at least one of the (liquid) coolant inlet and (liquid) coolant outlet is configured to cooperate with a corresponding coolant port as part of a coolant flow loop. Advantageously, a handle or gripping surface may also be provided, for example, on the body of the pump, which may be positioned to allow the (liquid) coolant pump to be positioned within and removed from the coolant flow loop, and / or to facilitate engaging and disengaging the pump with a pump receiving device. For example, the handle or gripping surface may be located on the upper part of the body. The liquid coolant inlet and liquid coolant outlet are then, advantageously, located on the lower part of the body, which may contain a pump mechanism, such as an impeller housing. The handle may be insulated from or separated from the body, in particular from the pump mechanism (which may be heated).

[0055] In relevant embodiments (which may differ from or be combined with any other embodiments disclosed herein), a cradle may be conceivable for receiving one or more (liquid) coolant pumps as part of a coolant flow loop. The cradle comprises, for each of the one or more (liquid) coolant pumps, a support portion configured to support the body of each (liquid) coolant pump, and a first coolant port configured to transmit (liquid) coolant fluid between each (liquid) coolant pump and the cradle when each (liquid) coolant pump is positioned within the support portion. Advantageously, the cradle further comprises at least one second coolant port configured to transmit coolant fluid between the cradle and the rest of the coolant flow loop. The cradle thereby allows each of the one or more (liquid) coolant pumps to be inserted into and removed from the coolant flow loop (during operation of the coolant flow loop). Combinations of the cradle with one or more (liquid) coolant pumps are also conceivable, as disclosed herein.

[0056] Another embodiment (which may be different from or in combination with any other embodiment disclosed herein) may provide a pump docking assembly configured to interconnect at least one pump with a coolant liquid flow loop, the aforementioned pump docking assembly comprising at least one pump receiving device arranged to releasably engage with at least one pump, and a coolant liquid flow loop port connectable to at least one pump. The at least one pump advantageously includes a liquid coolant inlet.

[0057] Another aspect of the present disclosure (which may also be optionally combined with any other aspect disclosed herein) is found in a liquid-cooled module, the liquid-cooled module comprising: a chassis; at least one heat-generating component mounted within the chassis; a liquid coolant (e.g., a dielectric liquid) within the chassis for cooling the at least one heat-generating component; and one or more (liquid) coolant pumps (in particular, as disclosed herein) configured to provide a coolant flow loop within the chassis.

[0058] Further embodiments (which may also be optionally combined with any other embodiments disclosed herein) provide a liquid-cooled chassis housing for enclosing at least one electronic component. The liquid-cooled chassis housing comprises a liquid coolant distribution device that interconnects a liquid coolant flow loop with a pump docking assembly, as disclosed herein. The liquid-cooled chassis housing may, for example, form part of a fluid (liquid)-cooled module.

[0059] At least one of the (liquid) coolant pumps may be removed during the operation of the coolant flow loop, in particular without interrupting the functional operation of the coolant flow loop. One or more (liquid) coolant pumps are conveniently provided within a cradle or pump docking assembly, as disclosed herein. Additionally or alternatively, one or more (liquid) coolant pumps may be mounted within the chassis (together with the cradle or pump docking assembly). Typically, at least one electronic device and / or heat-generating component comprises a circuit board (e.g., a motherboard) on which multiple electronic components are mounted.

[0060] Further embodiments may be considered for methods of operating a coolant flow loop for a liquid coolant. This method includes operating the coolant flow loop to transfer heat from at least one heat-generating component to the liquid coolant, and modifying the coolant flow loop during its operation by inserting or removing a (liquid) coolant pump into or from the coolant flow loop so that the coolant flow loop continues to operate. The coolant flow loop is typically located within the chassis of a fully liquid-cooled module. As described herein, the chassis may house at least one heat-generating component, a liquid coolant, and a (liquid) coolant pump. If the coolant flow loop includes multiple (liquid) coolant pumps, operating the coolant flow loop may further include directing the coolant liquid between at least one of the multiple (liquid) coolant pumps and at least one heat-generating component.

[0061] Various optional and / or advantageous features may apply to any aspect of this disclosure, as discussed below, but they may be particularly applicable to one or more specific aspects than to other aspects. Some of these are detailed below.

[0062] For example, the liquid coolant inlet is typically located on the base of the pump body. The liquid coolant outlet of the pump may be located on the side of the body and configured to work in conjunction with the corresponding coolant port of the pump receiving device.

[0063] The (liquid) coolant pump may further comprise an impeller housing within the main body. The cradle or pump docking assembly may further comprise pipes coupled to each of the first coolant ports or pump receiving devices for coupling toward at least one second coolant port or coolant liquid flow loop port. Each pipe or coolant liquid flow loop port may include a one-way valve or check valve device. This is preferably located higher than the impeller housing of each (liquid) coolant pump (or at least higher than each first coolant port). Additionally or alternatively, each pipe or coolant liquid flow loop port may include a pressure relief device or gas relief mechanism. For example, this may be located between the one-way valve or check valve device and the first coolant port (in the sense of coolant flow) and may be configured to allow priming of each (liquid) coolant pump when gas is present between the first coolant port (or more precisely, the impeller housing) and the check valve. For example, a pressure relief device or gas relief mechanism may comprise one of a hole or air vent orifice (for example, sized to allow gas to escape from the body but to prevent significant flow of liquid coolant from the body) and a (priming) valve.

[0064] The (liquid) coolant pump may further include an electrical (power) connector for receiving power in the pump. This is typically a male electrical connector. The pump docking assembly may include an electrical connector (typically female) configured to mate with a corresponding electrical connector located on at least one of the pumps. Advantageously, the power connector may be coupled to or integrated with the upper portion of the body (particularly above the liquid level of the dielectric coolant).

[0065] The pump docking assembly or cradle may be configured for multiple (liquid) coolant pumps. The pump docking assembly or cradle may then be further configured to allow for the continuous transfer of (liquid) coolant between the pump docking assembly or cradle and the rest of the coolant flow loop when one of the multiple (liquid) coolant pumps is removed. This can, for example, allow for pump redundancy. In some embodiments, a single common second coolant port is provided. In this case, the pump docking assembly or cradle may be configured as appropriate to transfer (liquid) coolant between each of the multiple (liquid) coolant pumps' respective first coolant ports and the common second coolant port. For example, a liquid coolant distribution device or manifold may be provided, which forms part of the cradle and is then coupled to each of the first coolant ports and may be configured to transfer liquid coolant between each of the multiple (liquid) coolant pumps' respective first coolant ports and the common second coolant port. Alternatively, it may be a separate component within a module or liquid-cooled chassis housing that interconnects the liquid coolant flow loop with the pump docking assembly.

[0066] Preferably, each of the first coolant ports is provided with an O-ring seal and / or clip for securing each first coolant port to a corresponding port of one or more (liquid) coolant pumps. Each pump may have the same or corresponding features to allow a seal between the pump outlet (or inlet) and one of the first coolant ports.

[0067] For each of the one or more (liquid) coolant pumps, the pump docking assembly or cradle may include a vortex-preventing device (e.g., as part of each of the support portion or at least one pump receiving device). The vortex-preventing device may be positioned adjacent to the (liquid) coolant inlet of each (liquid) coolant pump and / or arranged to cooperate with the liquid coolant inlet of at least one pump when the pump engages with the pump receiving device. For example, the (liquid) coolant inlet may be on the base of the (liquid) coolant pump, and as a result, the vortex-preventing device may be positioned to receive the base of the pump.

[0068] The pump docking assembly (or one or more support parts of the cradle) may include a rail system, such as a Trammel rail, which may be positioned near the pump receiving device. The rail system or rail may be configured to engage with at least one pump during engagement with the pump receiving device, guiding the pump into proper engagement with the pump receiving device. Additionally or alternatively, the rest of the pump docking assembly or cradle may be mounted on the rail system or rail, and each of one or more (liquid) coolant pumps may be mounted thereon. Thus, the rail system or rail may be configured to allow movement of the rest of the pump docking assembly or cradle and / or each of one or more (liquid) coolant pumps (in particular, the cradle and pump or multiple pumps may move together).

[0069] The pump docking assembly or cradle may further include, advantageously, a processor configured to provide control signals to each of one or more (liquid) coolant pumps in order to control the pump operation.

[0070] The liquid coolant level is, for the most part, lower than one or more of the following: each handle or gripping surface of each of the one or more (liquid) coolant pumps, at least one releasable push-fit clip mechanism, a (female) electrical connector on the pump docking assembly or cradle, each electrical (power) connector of each of the one or more (liquid) coolant pumps, each release clip handle associated with each of the first coolant ports of each of the one or more (liquid) coolant pumps, and / or the liquid coolant level is at least the same height as the liquid coolant inlet of the pump docking assembly or each of the impeller housings of each of the one or more (liquid) coolant pumps.

[0071] The liquid coolant flow loop typically contains a first or primary coolant fluid (generally a liquid), which is preferably a dielectric coolant. The module and / or liquid-cooled chassis housing advantageously further includes a second or secondary coolant liquid inlet and a second or secondary coolant liquid outlet. The liquid inlet may then be connected to a liquid coolant distribution device (or manifold), and the liquid outlet may be connected to a coolant liquid flow loop port of a pump docking assembly.

[0072] A (liquid-cooled) module and / or liquid-cooled chassis housing preferably further comprises a heat exchanger or heat exchange device, which is advantageously configured as part of a coolant flow loop and can receive (first or primary) coolant and transfer heat from the liquid coolant to a heat sink. For example, the heat exchange device may be located between a secondary coolant liquid inlet and a liquid coolant distribution device, and between a secondary coolant liquid outlet and a pump docking assembly. The heat exchanger or heat exchanger device is typically located within or forms part of the chassis. The heat sink of the heat exchanger is generally a secondary (liquid) coolant separated from the primary coolant flowing through the pump (or multiple pumps). In some embodiments, the module or liquid-cooled chassis housing further comprises piping for transferring liquid coolant between one or more (liquid) coolant pumps and the heat exchanger. At least one (cooled) electronic component may be located in a sump that receives primary coolant liquid from the liquid coolant flow loop. Next, at least one electronic component is, beneficially, in direct or indirect thermal contact with the primary coolant liquid (in the heat exchange device).

[0073] Optionally, the liquid-cooled module further comprises a piping arrangement for guiding a liquid coolant from a pump to at least one heat-generating component. Additionally or alternatively, the liquid-cooled module further comprises one or more liquid coolant heatsinks, each of which is configured to receive and store a liquid coolant adjacent to each of the at least one heat-generating component.

[0074] More specific implementation details are presented below. However, further discussion following the general meaning discussed here will be provided later.

[0075] Referring now to Figure 6A, isometric views of the pump and cradle support and interconnects of the pump assembly shown in Figure 5A. In these drawings, the vortex de-vortex device 15 (as part of the support portion of the cradle 30), the pump port 19, the cradle vertical piping 31, the NRV 17, the priming valve 18, the pump outlet 32 ​​from the pump 6, the handle 21, and the power connector 20 are visible. Here, the handle 21 can be seen positioned above the coolant level, ensuring that the user removing or replacing the pump 6 does not need to touch the coolant. The power (and control) connector 20 is connected to a wire in this embodiment. The connector is manually unplugged when removing the pump 6 or plugged in when inserting the pump 6. The positioning of the pump outlet 32 ​​for coupling with the pump port 19 can also be seen. The NRV 17 and the priming valve 18 run along the piping 31.

[0076] Referring here to Figure 6B, a first side view of the pump 6 and the cradle support and interconnection portion of the pump assembly in Figure 5A is illustrated. The priming valve 18 and power connector 20 can be seen above the line 22 representing the depth of the dielectric coolant. The coolant depth 22 should preferably be deep enough to completely immerse the pump impeller housing within the body 26 of the pump 6. If the coolant depth is shallower than this, the pump may be more prone to drawing in air.

[0077] Next, referring to Figure 6C, a partial cross-sectional side view of the pump and cradle support and interconnection of a modified pump assembly according to Figure 5A is illustrated. A single pump 6 is inserted into the pump port 19 of the cradle 30'. This partial cross-section is in the area of ​​the pump port 19, and the O-ring seal 24 (as described above) for the outlet of the pump 6 is exposed.

[0078] The only difference between this embodiment and the cradle embodiment described above is that an alternative method for discharging trapped air from the pump port 19 is shown. A small vent hole 23 is used between the impeller housing and the NRV 17 instead of a priming valve. However, this method of discharging trapped air allows the coolant to flow out of the hole 23 after all the air has escaped, which can reduce the flow rate. Therefore, this method of discharging air is undesirable.

[0079] Referring next to Figure 7, an isometric view of a single pump in accordance with a modified embodiment of the present disclosure is shown. Similar to the previously described embodiment, the pump 6' comprises a handle 21, a body 26, and a pump outlet 32. However, the power connector 25 (which may provide additional or alternative control signals) is integrated with the body 26 and does not include a cable.

[0080] This may be more beneficial than the cable connection solution (along the aforementioned lines) because the pump power and control can be connected simultaneously when the pump outlet 32 ​​engages with the pump port 19 of the cradle 30. Ultimately, this can eliminate the extra process of plugging and unplugging connectors, in addition to removing extra cables in the system. In fact, the electrical connection may even be made automatically when the pump is removed or replaced.

[0081] Here, we refer to Figures 8A, 8B, and 8C, which depict pump assemblies according to alternative embodiments. Figure 8A shows the first configuration. The cradle 30'' does not use retaining clips but has a push-fit mechanism 35 that, together with the rail system 27, can enable coupling of the pump port 19 of the cradle 30'' with the pump outlet 32 ​​along the axis 33. In this first configuration, the handle of the push-fit mechanism 35 is not used. The pump 6 is spatially separated from the cradle 30'' with the pump outlet 32 ​​disconnected from the pump port 19.

[0082] Figure 8B shows a second configuration. Here, the handle of the push-fit mechanism 35 is open, but the pump 6 is in contact with the cradle 30'' and the pump outlet 32 ​​is coupled to the pump port 19. A third configuration is shown in Figure 8C, where the pump 6 remains in contact with the cradle 30'', and the handle of the push-fit mechanism 35 is closed, completely coupling the pump outlet 32 ​​to the pump port 19. The pump 6 may be released from the cradle 30'' by opening the handle of the push-fit mechanism 35, spatially separating the pump 6 from the cradle 30'' (along the axis 33), and disconnecting the pump outlet 32 ​​from the pump port 19 of the cradle 30''.

[0083] While specific embodiments have been described, those skilled in the art will understand that various modifications and changes are possible. Different types of chassis (and / or different types of servers or IT within a chassis) may have different cooling requirements. The maximum number of pumps shown here (four) may be changed (for example, to six). Cradles are typically designed for multiple pumps, which have the associated advantages described above, but the principle can also be applied to a single pump. Removing a single pump may not always interrupt the coolant flow loop, at least temporarily. The coolant may continue to flow due to convection even without a pump.

[0084] The arrangement of the chassis, components, heat sinks, pumps, support structures, and other components may be modified, combined, or configured in various different ways, and those disclosed herein are merely embodiments. Different types of liquid pumps (e.g., in terms of structure and / or pumping mechanism) may be used in different shapes and / or configurations (e.g., in different types, shapes and / or number of ports). The support portion of the cradle may differ from those shown, for example, having a different rail system (or not having a rail system) and / or not having an eddy prevention device and / or retaining ring. The design of the coolant ports on the cradle may also differ. The cradle may also have multiple output ports. Alternatively, the coolant flow may differ from that described herein. For example, the flow between the pump and the heat exchanger may differ. More than one heat exchanger may be used. In some embodiments, the coolant flow may be the opposite of that described herein, for example, the coolant flows from the heat exchanger (or multiple heat exchangers) to the pump system. In this case, the cradle may also serve as a manifold for supplying multiple pumps.

[0085] The number, structure, and / or configuration of each heat-generating (electronic) component or device cooled by a dielectric coolant and optionally one or more heat sinks can vary considerably. When heat sinks are used, the configuration, exact shape, and / or size of the heat sinks can also be modified. For example, each heat sink may be formed as an assembly of multiple parts or as a single, integrated device.

[0086] Although this disclosure is described with reference to a chassis (server module) of a particular shape and size, this can be modified (for example, a vertically oriented chassis may be used), and in fact, aspects of this disclosure may be applied to cooling other types of devices. For example (at least described in International Publication No. 2020 / 178579, which is a common applicant with this disclosure), the cooling techniques provided by this disclosure can be used to cool a wide variety of heat-generating (generally electrical and / or electronic) components, including but not limited to IT devices.

[0087] The primary and / or secondary coolant is a liquid and, advantageously, is maintained in liquid form (single-phase coolant). However, this is not necessarily required in the case of coolants that do not pass through the (liquid) coolant pump according to this disclosure. For the secondary coolant, for example, a two-phase coolant and / or refrigerant coolant may be used (where conversion to and from the gas phase may be permitted).

[0088] Although the vortex prevention device described herein is provided within a cradle, it may also be molded as part of the pump body, for example, to form part of the pump. This can reduce the number of parts in the assembly, as well as the cost and complexity of the cradle that slides with the pump.

[0089] Returning to the general meaning of the above disclosure, the (liquid) coolant pump may further comprise an anti-vortex device for the (liquid) coolant inlet (for example, integrated with the part of the body adjacent to the liquid coolant inlet).

[0090] At least one pump receiving device, or each at least one pump receiving device, may be equipped with a releasable push-fit clip mechanism.

[0091] All features disclosed herein may be combined in any combination, except for any combination in which at least some of the features and / or steps are mutually exclusive. In particular, preferred features of the present invention are applicable to all aspects of the invention and can be used in any combination. Similarly, features described in non-essential combinations may be used separately (without combination).

Claims

1. A pump docking assembly configured to interconnect at least one pump with a coolant liquid flow loop, At least one pump receiving device arranged to be releasably engaged with the at least one pump, It comprises a coolant liquid flow loop port connectable to at least one of the pumps, The at least one pump is a pump docking assembly including a liquid coolant inlet.

2. The pump docking assembly according to claim 1, wherein the at least one pump receiving device comprises a releasable push-fit clip mechanism.

3. The pump docking assembly according to claim 1 or 2, wherein the coolant liquid flow loop port includes a one-way valve device.

4. The pump docking assembly according to any one of claims 1 to 3, wherein the coolant liquid flow port includes a pressure relief device.

5. The pump docking assembly according to claim 4, wherein the pressure release device is a priming valve or an air vent orifice.

6. The pump docking assembly according to any one of claims 1 to 5, wherein the at least one pump receiving device includes an anti-vortex device disposed to cooperate with the liquid coolant inlet of the at least one pump when the at least one pump is engaged with the pump receiving device.

7. It also features one or more removable pumps, The pump docking assembly according to any one of claims 1 to 6, wherein each of the one or more removable pumps is configured to include a handle or gripping surface for facilitating engagement and disengagement of each of the removable pumps with the pump receiving device.

8. The pump docking assembly includes a rail disposed proximal to the pump receiving device, The pump docking assembly according to any one of claims 1 to 7, wherein the rail is configured to engage with the at least one pump during engagement with the pump receiving device, and to guide the pump into proper engagement with the pump receiving device.

9. The pump docking assembly according to any one of claims 1 to 8, wherein the pump receiving device includes a female electrical connector configured to mate with a corresponding male electrical connector located on the at least one pump.

10. A liquid-cooled chassis housing for enclosing at least one electronic component, A liquid cooling chassis housing comprising a liquid coolant distribution device that interconnects a liquid coolant flow loop with a pump docking assembly according to any one of claims 1 to 9.

11. The liquid coolant flow loop comprises a first coolant liquid, as described in claim 10.

12. The liquid-cooled chassis housing includes a second coolant liquid inlet and a second coolant liquid outlet. The liquid inlet is connected to the liquid coolant distribution device, The liquid outlet is connected to the coolant liquid flow loop outlet of the pump docking assembly, the liquid cooling chassis housing according to claim 10 or 11.

13. The liquid coolant distribution device is a liquid coolant manifold, according to claim 12, for the liquid cooling chassis housing.

14. A liquid cooling chassis housing according to any one of claims 10 to 12, wherein a heat exchange device is located between the second coolant liquid inlet and the liquid coolant distribution device, and between the second coolant liquid outlet and the pump docking assembly.

15. The at least one electronic component is located in a sump that receives the first coolant liquid from the liquid coolant flow loop. The liquid-cooled chassis housing according to any one of claims 10 to 14, wherein the at least one electronic component is in direct or indirect thermal contact with the first coolant liquid.

16. The liquid level of the first coolant liquid is lower than at least one of the following: the releasable push-fit clip mechanism, the handle or gripping surface, and / or the female electrical connector. The liquid cooling chassis housing according to claim 15, wherein the liquid level of the first coolant liquid is at least the same height as the liquid coolant inlet.

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