Optical modules and optical communication systems

Abstract

Embodiments of this application provide an optical module and an optical communication system to solve the technical problem of low heat dissipation efficiency of optical modules. The optical module includes a first device, a second device, and a housing cover. The housing cover includes a first cavity and a second cavity. A working medium in the first cavity is used to dissipate heat from the first device, and a working medium in the second cavity is used to remove heat from the second device. For example, heat from the first device is transferred by heat transfer to the surface of the housing cover near the first device, the heat enters the first cavity through the surface, the working medium in the first cavity transfers heat to the cavity surface of the first cavity facing away from the first device, and the heat is then transferred to the outside of the optical module through the surface of the housing cover facing away from the first device. The use of separate heat dissipation methods for the first and second devices allows for a reduction in power density (power consumption per unit area) on the surface of the housing cover, thereby reducing the dry contact temperature difference and improving the heat dissipation efficiency of the optical module.

Description

Technical Field

[0001] This application claims the priority of Chinese Patent Application No. 202310294663.8, titled "Optical Module and Optical Communication System", filed with the State Intellectual Property Office of China on March 22, 2023, the entire content of which is incorporated herein by reference.

[0002] This application relates to the field of communication technologies, and particularly to optical modules and optical communication systems.

Background Art

[0003] An optical module is one of the most essential components in the field of optical network technologies, and its function is to convert optical signals into electrical signals and vice versa inside the module. In recent years, as the performance of optical modules has gradually become more powerful, the power consumption of optical modules has gradually increased. As a result, it has gradually become more difficult to dissipate heat from optical modules, presenting a major heat dissipation problem.

[0004] Currently, heat dissipation of optical modules is carried out by providing a heat sink outside the optical module. In this heat dissipation method, due to the imperfect contact between the surface of the optical module and the heat sink, heat can only be transferred through dry contact, resulting in a relatively large thermal contact resistance and leading to low heat dissipation efficiency of the optical module.

Summary of the Invention

[0005] Embodiments of this application provide an optical module and an optical communication system to solve the technical problem of low heat dissipation efficiency of optical modules.

Means for Solving the Problems

[0006] To achieve the above object, in the embodiments of this application, the following technical solutions are used.

[0007] According to a first embodiment, an optical module is provided. The optical module includes a housing body and a housing cover arranged opposite to each other, a first device and a second device. The housing body includes a first surface near the housing cover, the first surface being provided with a accommodating groove extending away from the housing cover. The first device and the second device are arranged in the accommodating groove. The housing cover has a first cavity and a second cavity formed therein, both of which are provided with a working medium, and the first cavity and the second cavity are arranged parallel to the housing cover. The first device and the first cavity are arranged opposite to each other, and the second device and the second cavity are arranged opposite to each other.

[0008] Based on the above description of the structure of the optical module provided in this embodiment of the present application, it can be known that the optical module includes a first device, a second device, and a housing cover configured to dissipate heat from the first and second devices. The housing cover includes a first cavity and a second cavity. A working medium in the first cavity is used to dissipate heat from the first device, and a working medium in the second cavity is used to remove heat from the second device. For example, heat from the first device is transferred by heat transfer to the surface of the housing cover closer to the first device. Since the first device and the first cavity are positioned facing each other, heat enters the first cavity via the surface, and the working medium in the first cavity transfers heat to the cavity surface of the first cavity facing away from the first device, and then the heat is transferred to the outside of the optical module via the surface of the housing cover facing away from the first device. Similarly, heat from the second device is transferred by heat transfer to the surface of the housing cover closest to the second device. Since the second device and the second cavity are positioned facing each other, heat enters the second cavity via the surface, the working fluid within the second cavity transfers heat to the cavity surface of the second cavity facing away from the second device, and then the heat is transferred to the outside of the optical module via the surface of the housing cover facing away from the second device. Compared to a method in which only a heat sink is placed outside the optical module, the optical module provided in this embodiment of the present application uses the structure of the housing cover to carry out separate heat dissipation for the first and second devices, thereby increasing the heat dissipation method and effectively improving the heat dissipation efficiency of the optical module. In addition, the housing cover provided in this embodiment of the present application can further achieve heat dissipation effects as a structural component of the optical module, enabling the effective use of structural components.

[0009] Furthermore, in this embodiment of the present application, providing the first and second cavities allows for a reduction in the power density (power consumption per unit area) on the surface of the housing cover, thereby improving the heat dissipation efficiency of the optical module.

[0010] In a feasible embodiment of the first aspect, the housing cover includes a first cover plate and a second cover plate positioned opposite each other, the first cover plate positioned on the side of the second cover plate away from the first device. The second cover plate includes a second surface closer to the first cover plate, the second surface having a first groove recessed away from the first cover plate. The first cover plate and the second cover plate are sealed and connected such that the first groove of the second cover plate and the first cover plate seal the first cavity together.

[0011] In a feasible embodiment of the first aspect, the housing cover further includes a first capillary layer, the first capillary layer being provided on the surface of the first groove.

[0012] Providing a first capillary layer allows for the circulation of the working fluid within the cavity, thereby achieving a better heat dissipation effect.

[0013] In a feasible embodiment of the first aspect, the housing cover further includes a second capillary layer and a third capillary layer. The first cover plate includes a third surface near the second cover plate and facing the second surface, and the second capillary layer is formed on the third surface. The third capillary layer is formed on the second surface of the second cover plate.

[0014] Providing a second and a third capillary layer allows for the circulation of the working fluid within the housing cover, thereby achieving a better heat dissipation effect.

[0015] In a feasible embodiment of the first aspect, a support column is provided in the first groove, and the support column extends from the bottom surface of the first groove to the first cover plate.

[0016] In a feasible embodiment of the first aspect, the housing cover further includes a fourth capillary layer, the fourth capillary layer being formed on the side of the support column.

[0017] The addition of a fourth capillary layer allows for the circulation of the working fluid within the cavity, thereby achieving a better heat dissipation effect.

[0018] In a feasible embodiment of the first aspect, the housing cover further includes an insulating structure provided between the first cavity and the second cavity. The insulating structure is configured to block heat exchange between the first cavity and the second cavity.

[0019] By providing an insulating structure, heat exchange between the first and second cavities is blocked. Heat from the electrical chip does not cause heating of the optical device, which protects the device and helps improve the performance of the optical module.

[0020] In a feasible embodiment of the first aspect, the thermal insulation structure includes thermal insulation members made of thermal insulation holes or thermal insulation devices.

[0021] In a feasible embodiment of the first aspect, the insulation holes penetrate the housing cover.

[0022] Providing insulating holes that penetrate the housing cover prevents the first cavity and the second cavity from communicating with each other, which helps to block heat exchange between the first cavity and the second cavity, thereby protecting the device and improving the performance of the optical module.

[0023] In a realizable embodiment of the first aspect, the optical module further includes a circuit board. The circuit board is disposed at the bottom of the accommodation groove. Both the first device and the second device are disposed on the circuit board, and the first device and the second device are arranged on the same side of the circuit board.

[0024] In a realizable embodiment of the first aspect, the optical module further includes a heat conduction layer. The heat conduction layer is disposed between the first device and the housing cover, and / or the heat conduction layer is disposed between the second device and the housing cover.

[0025] Providing the heat conduction layer enables better heat transfer to the housing cover.

[0026] In a realizable embodiment of the first aspect, the cross-section of the support pillar gradually decreases from the bottom surface of the first groove to the first cover plate.

[0027] This helps increase the contact area with the working medium, and as a result, improves the heat dissipation efficiency.

[0028] According to the second aspect, an optical communication system is provided. The optical communication system includes the optical module provided in the first aspect.

[0029] In the optical communication system, the optical module provided in the first aspect is disposed. The optical module has good heat dissipation performance and can meet the requirements of various high-power consumption scenarios of the optical communication system.

Brief Description of the Drawings

[0030] [Figure 1] It is a diagram of the structure of an optical communication system according to an embodiment of the present application. [Figure 2] It is a diagram of the structure of an optical module and a heat sink according to an embodiment of the present application. [Figure 3] It is a diagram of the structure of an optical module and a heat sink according to an embodiment of the present application. [Figure 4]This is a diagram of a dry contact. [Figure 5] This is a diagram showing the structure of an optical module according to one embodiment of this application. [Figure 6] This is a diagram showing the structure of the housing body of an optical module according to one embodiment of this application. [Figure 7] This is a diagram showing the structure of a housing cover for an optical module according to one embodiment of this application. [Figure 8] Figure 7 is an exploded view of the housing cover of the optical module shown. [Figure 9] Figure 7 is a schematic cross-sectional view of the optical module housing cover along AA. [Figure 10] This is a diagram showing the structure of a housing cover for an optical module according to one embodiment of this application. [Figure 11] This is a diagram showing the structure of a housing cover for an optical module according to one embodiment of this application. [Figure 12] Figure 11 is an exploded view of the housing cover of the optical module shown. [Figure 13] Figure 11 is a schematic cross-sectional view of the housing cover of the optical module along the barb. [Figure 14] This is a diagram showing the structure of an optical module according to one embodiment of this application. [Figure 15] This is a diagram showing the structure of an optical module according to one embodiment of this application. [Modes for carrying out the invention]

[0031] The following describes the technical solutions of embodiments of this application with reference to the accompanying drawings of embodiments of this application. In the description of this application, unless otherwise specified, " / " indicates that the related subjects are in an "or" relationship. For example, A / B may represent A or B. In this application, "and / or" describes only the related relationship between related subjects and indicates that three relationships may exist. For example, A and / or B may indicate that only A exists, both A and B exist, and only B exists, and A and B may be singular or plural. In addition, in the description of this application, "plural" means two or more than two unless otherwise specified. "At least one of the following (elements)" or similar expressions refer to any combination of these, including any single (element) or any combination of multiple (elements). For example, at least one of A, B, or C (elements) may represent A, B, C, A and B, A and C, B and C, or A, B, and C, where A, B, and C may be singular or plural. In addition, in order to clearly illustrate the technical solutions of the embodiments of this application, terms such as "first" and "second" are used in the embodiments of this application to distinguish the same or similar things that essentially provide the same function or purpose. Those skilled in the art will understand that terms such as "first" and "second" do not limit the number or order of execution, and that terms such as "first" and "second" do not indicate a clear distinction. In addition, in the embodiments of this application, terms such as "example" or "for example" are used to indicate that an example, illustration, or explanation is being given. No embodiment or design described as "example" or "for example" in the embodiments of this application is described as being preferable or having more advantages than another embodiment or design. More precisely, the use of terms such as "example" or "for example" is intended to present the relevant concepts in a particular way for ease of understanding.

[0032] Embodiments of this application provide an optical communication device capable of converting between optical signals and electrical signals and conducting optical signals. For example, the optical communication device may be an optical module. The optical module may be a long-range communication module or a short-range communication module, etc. Long-range communication modules include coherent communication modules, and short-range communication modules include constant-amplitude communication modules. The specific form of the optical communication device is not particularly limited in the embodiments of this application.

[0033] Optical communication devices may be used in optical communication systems. For example, short-range communication modules may be used in a data center to collaboratively perform data exchange between servers located in different layers within the data center. Figure 1 is a diagram of the structure of an optical communication system according to one embodiment of the present application.

[0034] As shown in Figure 1, in some embodiments, the optical communication system 1 includes an optical switch 100. The optical switch 100 may be used for data exchange between servers located on different layers within a large data center to increase bandwidth and significantly reduce the extra energy consumption caused by switching network cables. The optical switch 100 includes an optical module 200, a converter 130, and a fiber array unit (FIBER ARRAY UNIT, FAU) 120 for fixing the fiber array.

[0035] The optical module 200 is a functional module for the interconversion between optical signals and electrical signals in a network device. In one embodiment, the optical module 200 and the fiber array may be connected to each other via interface 200A. In some embodiments, the fiber array unit 120 includes an output fiber 121 for receiving optical signals output by the optical module 200 and an input fiber 122 for inputting optical signals to the optical module 200. The output fiber 121 and the input fiber 122 may each be plugged into the optical module 200 via different interfaces. As shown in Figures 1 and 3, for example, the output fiber 121 is plugged into the optical module 200 via a first port 200A1, and the input fiber 122 is plugged into the optical module 200 via a second port 200A2. In another embodiment, the optical module 200 is further connected to a converter 130, which is configured for processing and generating electrical signals.

[0036] In this way, the cooperation of the optical module 200, the converter 130, and the fiber array enables the optical switch 100 to perform signal processing and transmission in order to adapt to various communication scenarios.

[0037] In scenarios such as high-baud rate communications integrating transmission and reception, in some embodiments, the optical module 200 may include a modulator 112 and a photoelectric detector 113. The converter 130 may include an optical digital signal processing (ODSP) module 131, a driver module 132, and a trans-impedance amplifier (TIA) 133.

[0038] In one embodiment, the photoelectric detector 113 may be connected to an input fiber 122. After receiving an optical signal from the input fiber 122, the photoelectric detector 113 may generate a corresponding current signal based on the optical signal in order to process the current signal. A transimpedance amplifier 133 is connected to the photoelectric detector 113 and configured to perform transimpedance amplification on the current signal generated by the photoelectric detector 113 in order to acquire a voltage signal. An ODSP module 131 may be connected to the transimpedance amplifier 133 and configured to amplify an electrical signal and control the transimpedance amplifier 133 in order to process the amplified electrical signal.

[0039] In another embodiment, the ODSP module 131 is connected to a driver module 132 and configured to control the driver module 132 to generate a modulated signal. The driver module 132 is connected to a modulator 112 and configured to provide a modulated signal, so that the modulator 112 uses the modulated signal to modulate the optical signal to be modulated and applies the modulated signal as an electrical signal to the optical signal to be modulated. The modulator 112 may be connected to an output fiber 121. After modulating the optical signal to be modulated, the modulator 112 may send the modulated optical signal through the output fiber 121. The optical signal to be modulated may be provided by a light-emitting component 111.

[0040] Figure 1 schematically shows only some of the possible components included in an optical communication system, and it should be understood that the actual shape, size, location, and structure of these components are not limited by Figure 1.

[0041] Optical modules are one of the most essential components in the field of optical network technology. The devices within optical modules consume relatively high power during operation, leading to increased component temperatures. When component temperatures become too high, their performance may be affected, or they may even be damaged.

[0042] To solve the heat dissipation problem of the optical module, in some embodiments, a heat sink 400 is provided outside the optical module 200, as shown in Figure 2. The heat sink 400 may be made of various materials, such as metals such as die-cast aluminum, die-cast zinc, machined aluminum, or machined copper, with a thermal conductivity of 95 W / MK to 385 W / MK.

[0043] In this way, heat from the optical module 200 can be transferred to the heat sink 400, and the heat sink 400 can quickly transfer the heat to the air for heat dissipation from the optical module 200, thereby ensuring the normal operation of the optical module 200.

[0044] For higher heat dissipation efficiency of the heatsink 400, in some embodiments, the heatsink 400 may include multiple heatsink fins, as shown in Figure 2. These heatsink fins increase the heat dissipation area, resulting in improved heat dissipation efficiency of the heatsink.

[0045] The optical module 200 and the heatsink 400 have multiple connection methods.

[0046] For example, in some embodiments, as shown in Figure 2, the optical module 200 features a pluggable design that allows the optical module 200 to be pluggably connected to a slide rail 300 for ease of use and maintenance. The heatsink 400 can be fixed to the slide rail 300. When the optical module 200 is inserted into the slide rail 300, the optical module 200 makes contact with the heatsink 400. When the optical module 200 is removed from the slide rail 300, the optical module 200 is separated from the heatsink 400.

[0047] In another example, as shown in Figure 3, in some other embodiments, the optical module 200 may also be non-pluggable, i.e., the optical module 200 may be fixed to the bracket 500. The heatsink 400 is positioned opposite the optical module 200, and the heatsink 400 is also fixed to the bracket 500. During the fixing of the heatsink 400 and the optical module 200, it may be understood that a larger contact surface between the heatsink 400 and the optical module 200 is better in order to ensure that heat from the optical module 200 can be transferred to the heatsink 400 as quickly as possible. For better heat conduction between the heatsink 400 and the optical module 200, it may be understood that in some embodiments, a thermally conductive material may be used between the optical module 200 and the heatsink 400. One side of a film layer formed of the thermally conductive material can be fully attached to the optical module 200, and the other side can be fully attached to the heatsink 400. In this way, heat from the optical module 200 can be completely transferred to the heatsink 400 via the thermally conductive material without creating hot spots, thereby ensuring heat dissipation performance.

[0048] In the optical module 200 and heat sink 400 shown in Figure 2, due to the insertion and removal operation of the optical module 200, it is not suitable to place a thermally conductive material between the heat sink 400 and the optical module 200. In this case, the optical module 200 is in direct contact with the heat sink 400. As shown in Figure 4, heat can only be transferred by dry contact between the optical module 200 and the heat sink 400, which results in thermal contact resistance. The cause of "dry contact heat transfer" is as follows: when the optical module 200 is in direct contact with the heat sink 400, there is a gap between the optical module 200 and the heat sink 400, and in addition, the contact surface between the optical module 200 and the heat sink 400 is not perfectly flat, so the contact surface has surface roughness, i.e., the contact surface is uneven. Therefore, there is no perfect contact at a microscopic level, resulting in relatively large thermal contact resistance, which hinders heat dissipation.

[0049] As the performance of optical modules becomes increasingly powerful, their power consumption is also increasing. Consequently, heat dissipation from optical modules is becoming increasingly difficult. This heat dissipation problem cannot be solved simply by using heat sinks.

[0050] To ensure the heat dissipation efficiency of an optical module, one embodiment of this application provides an optical module. Providing a heat dissipation cavity in the housing cover of the optical module enables further improvement of the heat dissipation efficiency of the optical module.

[0051] The following explanation will be provided with reference to the attached drawings.

[0052] Figure 5 is a diagram showing the structure of an optical module according to one embodiment of the present application. As shown in Figure 5, in some embodiments, the optical module 200 includes a housing body 210 and a housing cover 220 arranged opposite each other, a first device 240, and a second device 250.

[0053] The housing body 210 is configured to provide space for arranging electronic devices and to protect electronic devices such as the first device 240 and the second device 250, which are arranged within the housing body 210. The housing body 210 includes a first surface 211 close to the housing cover, and the first surface 211 is provided with a housing groove 210A extending away from the housing cover 220. The housing body 210 may have multiple shapes. For example, in one embodiment, the housing body 210 may be an uncovered cubic box structure as shown in Figure 6. The shape of the housing body 210 is not limited in this application.

[0054] The housing groove 210A contains the first device 240 and the second device 250. The housing groove 210A contains the first device 240 and the second device 250 in multiple ways. For example, in some embodiments, the first device 240 and the second device 250 may be fixed directly to the bottom of the housing groove 210A. In another example, in some other embodiments, the optical module 200 further includes a circuit board 230, as shown in Figures 5 and 6. A fixing column 210B is provided at the bottom of the housing groove 210A. The circuit board 230 may be fixed to the fixing column 210B in the housing groove 210A using fasteners. The first device 240 and the second device 250 are arranged on the circuit board 230. In one embodiment, the first device 240 and the second device 250 may each be fixed to the circuit board 230 by welding. For example, the second device 250 is fixed to the circuit board 230 by a welding method so as to form a solder ball 280. In one embodiment, the first device 240 and the second device 250 are located on the same side of the circuit board 230. In a direction parallel to the first surface 211, the first device 240 and the second device 250 may be fixed side by side within the housing groove 210A. In a direction perpendicular to the first surface 211, the heights H1 of the first device 240 and H2 of the second device 250 may be the same or different. This is not limited to the present application.

[0055] The first device 240 may be an optical device capable of converting an electrical signal to an optical signal or an optical signal to an electrical signal, for example, the modulator 112 or the photoelectric detector 113 shown in Figure 1. The second device 250 may be a silicon photonic chip, for example, the silicon photonic chip DR4 or the silicon photonic chip DR8. Specific embodiments of the first device 240 and the second device 250 are not limited in this application.

[0056] In one embodiment, the housing cover 220 is configured to cover the housing groove 210A of the housing body 210 in order to form a closed cavity. In this way, it is ensured that dust and other debris do not enter the optical module 200 and that the electronic devices located inside the housing body 210 are not damaged by the external environment. In another embodiment, the housing cover is configured to dissipate heat from the electronic devices located inside the housing body 210, for example, from the first device 240 and the second device 250.

[0057] The housing cover 220 and the housing body 210 are secured in several ways. For example, as shown in Figure 5, they may be connected using fasteners 270. The fasteners 270 may be bolts. The housing cover 220 is provided with through mounting holes 220C, and the bolts pass through the mounting holes 220C to connect the housing cover 220 and the housing body 210. In another example, adhesive may be used for the connection.

[0058] The housing cover 220 includes a first cavity 221 and a second cavity 222. A working medium is provided in both the first cavity 221 and the second cavity 222. In the first cavity 221, the working medium can transfer energy by gas-liquid phase change to achieve the purposes of temperature equalization and heat dissipation. The working medium may be a coolant. The coolant may be made of multiple materials, which may include, for example, a fluorinated liquid, or water, methanol, alcohol, or acetone. In one embodiment, after the sample recovery process of the optical module, the liquid may be injected into the first cavity 221 and the second cavity 222, followed by vacuum extraction and sealing.

[0059] The first cavity 221 and the second cavity 222 are arranged parallel to the housing cover 220. The first device 240 and the first cavity 221 are positioned opposite each other, and the working medium in the first cavity 221 is used to dissipate heat from the first device 240. The second device 250 and the second cavity 222 are positioned opposite each other, and the working medium in the second cavity 222 is used to remove heat from the second device 250.

[0060] In this way, when the first device 240 is operating, the heat of the first device 240 is transferred by heat transfer to the surface of the housing cover 220 that is close to the first device 240. Since the first device 240 and the first cavity 221 are positioned facing each other, the heat enters the first cavity 221 via the surface, and the working medium within the first cavity 221 transfers the heat to the cavity surface of the first cavity 221 that faces away from the first device 240. The heat is then transferred to the outside of the optical module 200 via the surface of the housing cover 220 that faces away from the first device 240, thus performing heat dissipation of the first device 240.

[0061] Similarly, when the second device 250 is operating, the heat from the second device 250 is transferred by heat transfer to the surface of the housing cover 220 closest to the second device 250. Since the second device 250 and the second cavity 222 are positioned facing each other, the heat enters the second cavity 222 via the surface, and the working medium within the second cavity 222 transfers the heat to the cavity surface of the second cavity 222 facing away from the second device 250. The heat is then transferred to the outside of the optical module 200 via the surface of the housing cover 220 facing away from the second device 250, thus performing heat dissipation of the second device 250.

[0062] In this way, the housing cover of the optical module provided in this embodiment of the present application not only exists as a structural component but also performs heat dissipation by providing a first cavity and a second cavity. Compared to a method in which only a heat sink is placed on the outside of the optical module, this increases the method of heat dissipation and effectively improves the heat dissipation efficiency of the optical module. Furthermore, providing the first cavity and the second cavity allows for a reduction in the power density (power consumption per unit area) on the surface of the housing cover, and as a result reduces the dry contact temperature difference, which aids in heat dissipation.

[0063] When a heatsink is positioned outside the optical module, it should be positioned closer to the housing cover, as a larger contact area between the heatsink and the housing cover will better aid in heat dissipation. In addition, to improve heat dissipation efficiency, it is ensured that the contact surfaces between the housing cover and the heatsink meet the requirements for surface flatness and roughness, thereby allowing the heatsink and housing cover to be mounted more securely to each other.

[0064] The following describes the structure of the housing cover in detail, referring to the attached drawings.

[0065] Figure 7 is a diagram showing the structure of a housing cover for an optical module according to one embodiment of the present application. As shown in Figures 5 and 7, in some embodiments, the housing cover 220 includes a first cover plate 220A and a second cover plate 220B arranged opposite each other. The first cover plate 220A is positioned on the side of the second cover plate 220B away from the first device 240.

[0066] To obtain a better heat dissipation effect, the material of the first cover plate 220A may be copper. The material of the second cover plate 220B may also be copper.

[0067] As shown in Figure 8, the second cover plate 220B includes a second surface 220B3 that is close to the first cover plate 220A. The second surface 220B3 is provided with a first groove 220B1 that is recessed away from the first cover plate 220A. The first cover plate 220A and the second cover plate 220B are sealed and connected such that the first groove 220B1 of the second cover plate 220B and the first cover plate 220A seal the first cavity 221 together. Similarly, as shown in Figure 8, in some embodiments, a second groove 220B2 recessed away from the first cover plate 220A is provided on the second surface 220B3 of the second cover plate 220B. The first cover plate 220A and the second cover plate 220B are sealed and connected such that the second groove 220B2 of the second cover plate 220B and the first cover plate 220A seal the second cavity 222 together. In a direction perpendicular to the second surface 220B3, the depth W1 of the first groove 220B1 and the depth W2 of the second groove 220B2 may be the same or different. This is not limited to the present application.

[0068] The first groove 220B1 may have any of the following shapes, for example, it may be square or circular. This is not limited to the present application. In addition, the first groove 220B1 may also be a stepped groove as shown in Figure 9.

[0069] The first cover plate 220A and the second cover plate 220B may be connected in multiple ways. For example, the connection may be made by welding.

[0070] The following describes feasible embodiments of the first cover plate.

[0071] In one embodiment, the first cover plate 220A may have a straight plate structure as shown in the drawing, that is, the first cover plate 220A does not have a concave structure. Such a first cover plate 220A has a simple structure, is easy to manufacture, and helps reduce costs.

[0072] In another embodiment, the first cover plate 220A may be provided with a concave structure facing the first groove 220B1, and the concave structure may be recessed in a direction away from the second cover plate 220B. In this way, the first cavity 221 has a larger space.

[0073] The first cover plate 220A and the second cover plate 220B may have multiple shapes, for example, they may be rectangular or circular.

[0074] It should be understood that the first and second cover plates provided in this embodiment of the present application are merely examples illustrating feasible embodiments for forming the first and second cavities within the housing cover, and do not constitute a limitation to embodiments for forming the first and second cavities. For example, in another embodiment, the second cover plate may be a straight plate, and a concave structure may be formed in the first cover plate to form the first cavity.

[0075] In addition, compared to the first cover plate, the second cover plate is positioned closer to the first device and relatively close to another device located within the first groove. Therefore, the surface of the second cover plate closer to the first device should avoid interference with the device within the first groove.

[0076] To ensure that the first and second cover plates do not collapse, in some embodiments, as shown in Figure 9, a support column 223 is provided within the first groove 220B1, and the support column 223 extends from the bottom surface 220B0 of the first groove 220B1 to the first cover plate 220A. In one embodiment, the cross-section of the support column 223 gradually decreases from the bottom surface of the first groove 220B1 to the first cover plate 220A. That is, the support column 223 is a tapered column.

[0077] To obtain a better heat dissipation effect, the material of the support column 223 may be copper.

[0078] To circulate the working fluid within the cavity and obtain a better heat dissipation effect, a capillary structure is formed in the housing cover provided in this embodiment of the present application to facilitate the backflow of the working fluid. The capillary structure may also be called a wick structure or microstructure. The wick structure may be a metal wire mesh, a microgroove, or a fiber filament, or it may be a sintered metal powder wick or a combination of several structures. Compared to metal wire mesh, microgrooves, and fiber filaments, sintered metal powder wicks have several advantages, such as low thermal resistance. In addition, since sintered powder wicks typically have a porosity of more than 60%, they have a relatively large evaporation surface area.

[0079] The following describes the capillary structure formed in the housing cover, with reference to the attached drawings.

[0080] Figure 10 is a diagram showing the structure of a housing cover for an optical module according to one embodiment of the present application. As shown in Figure 10, in some embodiments, the housing cover 220 further includes a first capillary layer 224, the first capillary layer 224 being provided on the surface 220B4 of a first groove 220B1.

[0081] The material of the first capillary layer 224 may be copper powder, which is obtained by high-temperature sintering. The material of the second cover plate 220B may also be copper. In this way, the first capillary layer and the second cover plate are well combined.

[0082] The capillary structure can be provided not only in the first groove 220B1, but also in another location on the housing cover 220.

[0083] For example, as shown in Figure 10, in some embodiments, the housing cover 220 further includes a second capillary layer 226 and a third capillary layer 225. The first cover plate 220A includes a third surface 220A1 that is close to the second cover plate 220B and faces the second surface 220B3. The second capillary layer 226 is formed on the third surface 220A1. The material of the second capillary layer 226 may be copper powder, which is obtained by high-temperature sintering. The material of the first cover plate 220A may also be copper. In this way, the second capillary layer 226 and the first cover plate 220A are well combined.

[0084] The third capillary layer 225 is formed on the second surface 220B3 of the second cover plate 220B. The material of the third capillary layer 225 may be copper powder, which is obtained by high-temperature sintering. The material of the second cover plate 220B may also be copper. In this way, the third capillary layer 225 and the second cover plate 220B are well combined.

[0085] In another example, as shown in Figure 10, in some embodiments the housing cover 220 further includes a fourth capillary layer 227, which is formed on the side of the support column 223.

[0086] In one embodiment, when the fourth capillary layer 227 is formed, the copper powder can be sintered into a powder ring structure and sleeved to the support column 223 using a clamp.

[0087] In this way, to carry out heat dissipation, heat can be transferred to a heat sink or dissipated into the air by a series of heat exchanges. The optical module provided in this embodiment of the present application is characterized by its small size and rapid heat dissipation, and can meet relatively high heat dissipation requirements.

[0088] When the first device 240 is an optical device and the second device 250 is an electrical chip, the power consumption of the electrical chip may account for at least 70% of the total power consumption of the entire optical module. Compared to optical devices, electrical chips have relatively high temperature specifications. For example, the housing temperature specification of an electrical chip may be 95°C or higher. On the other hand, optical devices have low power consumption and are not heat resistant. The housing temperature specification of an optical device may be 65°C or lower. In other words, when optical devices and electrical chips are operating, their power consumption is different, and the heat emitted by optical devices and electrical chips is different. As a result, after the heat from the optical device and electrical chip is transferred to the housing cover, the heat may dissipate. Since the heat from the electrical chip is greater than the heat from the optical device, the heat from the electrical chip may be transferred to the optical device, and the optical device is heated by this portion of the heat. As a result, the temperature of the optical device rises, which is undesirable for heat dissipation of the optical module.

[0089] To solve this problem, an insulating structure is provided between the first cavity and the second cavity in the optical module provided in this embodiment of the present application to block heat exchange between the first cavity and the second cavity. Heat from the electrical chip does not cause heating of the optical device. The insulating structure will be described below with reference to the accompanying drawings.

[0090] Figure 11 is a diagram of the structure of a housing cover for an optical module according to one embodiment of the present application. Figure 12 is an exploded view of the housing cover for the optical module shown in Figure 11. As shown in Figures 11 and 12, in some embodiments, the housing cover 220 further includes an insulating structure 228 provided between a first cavity 221 and a second cavity 222 and configured to block heat exchange between the first cavity 221 and the second cavity 222.

[0091] The thermal insulation structure may be implemented in multiple forms.

[0092] For example, the insulation structure may be an insulation hole. As shown in Figure 13, the insulation hole penetrates the housing cover 220, preventing the first cavity 221 and the second cavity 222 from communicating with each other. The insulation hole can be formed by machining.

[0093] In another example, the thermal insulation structure may also be a thermal insulation component made of a thermal insulation device.

[0094] In this way, the devices within the optical module are protected, and it is ensured that the performance of the devices is not interfered with by other devices.

[0095] To facilitate heat transfer by the housing cover, in some embodiments, the optical module 200 further includes a thermal conductive layer 260, as shown in Figure 14. In one embodiment, the thermal conductive layer 260 is located between the second device 250 and the housing cover 220. In another embodiment, the thermal conductive layer 260 may be located only between the first device 240 and the housing cover 220.

[0096] As shown in Figure 15, in another embodiment, the thermal conductive layer 260 is located between the first device 240 and the housing cover 220, and the thermal conductive layer 260 is located between the second device 250 and the housing cover 220.

[0097] The optical module provided in this embodiment of the present application uses a housing cover structure to dissipate heat from the first and second devices, thereby increasing the heat dissipation method and effectively improving the heat dissipation efficiency of the optical module.

[0098] To improve the heat dissipation efficiency of the optical module, it can be understood that more than two devices may be placed on the optical module, and correspondingly, more than two cavities may be placed on the housing cover.

[0099] Surface treatment may be applied to the optical module housing body and housing cover to meet process requirements such as corrosion prevention and waterproofing.

[0100] Finally, it should be noted that the embodiments described above are for illustrative purposes only and not to limit the present application. Although this application is described in detail with reference to the embodiments described above, those skilled in the art will understand that further modifications can be made to the technical solutions described in the embodiments described above, or equivalent substitutions can be made to some of the technical features thereof, without departing from the spirit and scope of the technical solutions of the embodiments of this application. [Explanation of Symbols]

[0101] 1. Optical communication system 100 Light switches 111 Light-emitting components 112 Modulator 113 Photoelectric detector 120 Fiber Array Units 121 Output Fiber 122 Input Fiber 130 Converters 131 Optical Digital Signal Processing Module 132 driver modules 133 Photoelectric detector 200 optical modules 200A Interface 200A1 First port 200A2 Second port 210 Housing Body 210A Housing groove 210B fixed column 211 First side 220 Housing Cover 221 First Cavity 222 Second Cavity 223 Support column 224 First capillary layer 225 Third capillary layer 226 Second capillary layer 227 The fourth capillary layer 228 Insulated structure 220A First cover plate 220A1 Third surface 220B Second cover plate 220B0 Bottom 220B1 First groove 220B2 Second groove 220B3 Second side 220B4 surface 220C mounting holes 230 Circuit boards 240 First device 250 Second device 260 Thermal conductive layer 270 Fixtures 280 solder balls 300 slide rail 400 Heatsink 500 bracket

Claims

1. A housing body and a housing cover arranged facing each other, The housing body has a first surface close to the housing cover, and the first surface is provided with a housing groove extending away from the housing cover, the housing body and housing cover, A first device and a second device are arranged within the aforementioned housing groove, Equipped with, The housing cover has a first cavity and a second cavity formed therein, and both the first cavity and the second cavity are provided with a working medium, and the first cavity and the second cavity are arranged in a direction parallel to the housing cover. The first device and the first cavity are arranged facing each other, and the second device and the second cavity are arranged facing each other. Optical module.

2. The housing cover comprises a first cover plate and a second cover plate arranged opposite to each other, wherein the first cover plate is positioned on the side of the second cover plate away from the first device. The second cover plate has a second surface that is close to the first cover plate, and the second surface is provided with a first groove that is recessed in a direction away from the first cover plate. The optical module according to claim 1, wherein the first cover plate and the second cover plate are sealed and connected such that the first groove of the second cover plate and the first cover plate together seal the first cavity.

3. The optical module according to claim 2, wherein the housing cover further comprises a first capillary layer, the first capillary layer being provided on the surface of the first groove.

4. The housing cover further comprises a second capillary layer and a third capillary layer, The first cover plate has a third surface that is close to the second cover plate and facing the second surface, and the second capillary layer is formed on the third surface. The optical module according to claim 2 or 3, wherein the third capillary layer is formed on the second surface of the second cover plate.

5. The optical module according to any one of claims 2 to 4, wherein a support column is provided in the first groove, and the support column extends from the bottom surface of the first groove to the first cover plate.

6. The optical module according to claim 5, wherein the housing cover further comprises a fourth capillary layer, the fourth capillary layer being formed on the side surface of the support column.

7. The housing cover further comprises a heat insulating structure provided between the first cavity and the second cavity, The optical module according to any one of claims 1 to 6, wherein the thermal insulation structure is configured to block heat exchange between the first cavity and the second cavity.

8. The optical module according to claim 7, wherein the thermal insulation structure comprises a thermal insulation member made of thermal insulation holes or a thermal insulation device.

9. The optical module according to claim 8, wherein the heat insulating holes penetrate the housing cover.

10. The optical module further comprises a circuit board, The circuit board is placed at the bottom of the housing groove. The optical module according to any one of claims 1 to 9, wherein both the first device and the second device are arranged on the circuit board, and the first device and the second device are arranged on the same side of the circuit board.

11. The optical module further comprises a thermal conductive layer, The heat conductive layer is disposed between the first device and the housing cover. and / or The optical module according to any one of claims 1 to 10, wherein the thermal conductive layer is disposed between the second device and the housing cover.

12. An optical communication system comprising an optical module according to any one of claims 1 to 11.

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