Warpage inspection device and warpage inspection method

Abstract

The present invention relates to a warpage inspection apparatus and related methods. The apparatus comprises a support frame having an upper support surface; a movable movable table mounted on the support surface; a chuck attached to the movable table, the chuck including a group of movable lift pins, the lift pins being movable between a first position in which they are retracted into the chuck and a second position in which they are extended from the chuck; a holding means attached to the support frame; and an optical sensor means configured to measure the warpage of a disc-shaped workpiece in a first measurement mode in which the lift pins are in the first position and a second measurement mode in which the lift pins are in the second position.

Description

Technical Field

[0001] The present invention relates to a warpage inspection apparatus and a warpage inspection method for a disk-shaped workpiece, particularly for a semiconductor or a mold wafer.

Background Art

[0002] Fan-out wafer-level packaging (FOWLP) has emerged as an advanced packaging technology for semiconductor devices, particularly for mobile and IoT applications.

[0003] Fan-out wafer-level packaging (FOWLP) technology has attracted wide attention due to its numerous advantages, including improved thermal and electrical performance, support for multi-die configurations, and high-density wiring. Many packaging solution providers have adopted this technology to facilitate the development of high-performance devices.

[0004] However, this technology also has two well-known problems, namely die shift and warpage. Die shift refers to the offset of the die compared to its designed position, and warpage is the deformation of the wafer caused by the mismatch in the coefficient of thermal expansion (CTE) between the semiconductor and the mold. Warpage can cause significant problems during mass production as it hinders the smooth handling of the wafer between different platforms, from a flat stage to the pick-up position and the end effector of the transfer robot.

[0005] To address warpage, warpage reduction processes may be employed, or practical deformation levels may be achieved by modifying the wafer structure. However, when selecting the appropriate combination of structures, such as thicker semiconductors, thicker overmolding, or increased die pitch, it is crucial to understand how the wafer behaves at different stages. For example, a thin wafer may warp in the center when placed in a large-diameter end-effector, but its edges may warp when placed in a pin-up position on the stage. Significant differences in warpage profiles are observed between different platforms, and these differences are often related to the wafer structure.

[0006] Understanding warpage is essential to ensuring the quality and reliability of packaged devices. By monitoring and measuring warpage during the FOWLP process, manufacturers can identify and address problems before they become serious. For example, measuring warpage helps determine the optimal die placement on the substrate, ensuring that the dies are not stressed and that the resulting packaged device has the desired characteristics.

[0007] Furthermore, understanding the causes and effects of warping helps optimize the design of the FOWLP process, as well as the selection and handling of machinery, so that they can withstand the stresses and strains of the process. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] U.S. Patent No. 8,599,366 [Patent Document 2] Japanese Patent Publication No. 2018-179680 [Patent Document 3] Japanese Patent Publication No. 2012-193968 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] Warping can manifest in several forms, including bowing, twisting, and warping. Several factors contribute to warping, including mismatches in the coefficient of thermal expansion (CTE) between the substrate and the die, residual stresses, and material properties.

[0010] As FOWLP technology continues to be applied to core and high-end applications, optimizing handling capabilities through warp characterization becomes essential. Patent Document 1 discloses a method and device for determining deformation of a disk-shaped workpiece, particularly a semiconductor or molded wafer.

[0011] Patent Document 2 discloses an information acquisition means for acquiring information on the surface of an object to be inspected, and a control means for determining the surface state of the object to be inspected based on the information acquired by the information acquisition means. A distance measuring unit is used to focus on the surface of the object to be inspected, and the control unit is configured to detect warping of the object to be inspected based on the distance measurement result of the distance measuring unit.

[0012] Patent Document 3 discloses a warpage inspection device and a warpage inspection method for inspecting warpage occurring in a flat object such as a ceramic substrate. The object of the present invention is to provide an improved warpage inspection apparatus and method, particularly for semiconductor or molded wafers, that can accurately evaluate the warpage response of a wafer to different platforms. [Means for solving the problem]

[0013] The present invention provides a warpage inspection apparatus according to independent claim 1 and a warpage inspection method according to independent claim 19 for disk-shaped workpieces, particularly semiconductors or molded wafers. Advantageously, the present invention provides a non-contact measurement tool that employs advanced optical scanning technology to accurately measure wafer deformation on multiple different platforms. This provides a comprehensive and accurate analysis of wafer warpage, which is crucial for ensuring the quality of semiconductor devices.

[0014] The warpage inspection apparatus according to the present invention preferably uses an optical scanner that has high resolution and captures wafer surface data at multiple points or locations, thereby enabling the generation of an accurate 2D and / or 3D map of the wafer surface. The system's software algorithm then analyzes the collected data to accurately calculate the wafer warpage profile, including variations in wafer curvature and thickness.

[0015] Preferably, the view can be rotated, zoomed, and manipulated, allowing the user to view the warpage profile from different angles and evaluate its impact on wafer performance. Preferably, the software can generate reports and graphs to help the user interpret the measurement results and make informed decisions. The device is easy to use, as it features a user-friendly interface that enables quick and efficient measurement setup and execution. The non-contact operation of the tool also reduces the risk of contamination and damage to the wafer and ensures that the measurement results are accurate and reliable.

[0016] By taking measurements on different platforms, users can predict and simulate wafer warping behavior at different handling stages. Preferably, the change of platforms and the measurements on them are performed automatically without user interference. This information may be used to adjust the robot, handling method, and hardware design, thus eliminating wafer excursions.

[0017] Preferred embodiments are described in each dependent claim. According to a preferred embodiment, the warp inspection device further includes a fork-shaped end effector connected to or connectable to a moving table for mounting a disk-shaped workpiece, and the optical sensor means is configured to measure the warp of the disk-shaped workpiece at a plurality of positions on the disk-shaped workpiece in a third measurement mode in which the disk-shaped workpiece is mounted on the end effector. This information is useful when a robot using the end effector is utilized in the following manufacturing process.

[0018] According to another preferred embodiment, the support frame includes a lower body portion disposed on the ground and an upper plate portion, and the lower body portion and the upper plate portion are coupled to each other by adjustable leveling means for leveling the xy plane horizontally. Therefore, the measurement can be performed within the leveled xy plane.

[0019] According to another preferred embodiment, the warp inspection device further includes a measurement controller for controlling the optical sensor means, the moving table, and the lift pins in their respective measurement modes.

[0020] According to another preferred embodiment, the warp inspection device further includes a vacuum system connected to the chuck and a vacuum controller for controlling the vacuum system in the first measurement mode. This enables the first measurement mode to be performed regardless of the presence or absence of vacuum suction.

[0021] According to another preferred embodiment, the vacuum system is connected to or connectable to the end effector. According to another preferred embodiment, the end effector includes a first tab and a second tab, and a plurality of pairs of vacuum suction holes are arranged to face different length positions of the first and second tabs.

[0022] According to another preferred embodiment, the vacuum controller is configured to selectively suck each pair of vacuum suction holes in the third measurement mode. Thus, in the third measurement mode, various measurements can be performed by chuck mounting with different pairs of vacuum adsorption holes.

[0023] According to another preferred embodiment, the warp inspection device further includes a temperature control system connected to the chuck and a temperature controller for controlling the temperature control system in the first measurement mode. Therefore, the first measurement mode can be performed at different temperatures.

[0024] According to another preferred embodiment, the measurement controller and / or the vacuum controller and / or the temperature controller are provided on a support frame, particularly on the lower main body of the support frame.

[0025] According to another preferred embodiment, the warp inspection device is controllable by a measurement controller and further includes display means for displaying the measurement results of the measurement mode as a two-dimensional diagram and / or a three-dimensional diagram. This makes it easier to intuitively understand the measurement data.

[0026] According to another preferred embodiment, the warp inspection device further includes input means for selecting the measurement mode and the measurement mode sequence. According to another preferred embodiment, the input means is configured to operate the view so that the view can be rotated and zoomed, enabling the user to view the measured warp profile of the disk-shaped workpiece from views at different angles. This is further useful for understanding the measurement data.

[0027] According to another preferred embodiment, the chuck includes multiple groups of movable lift pins arranged symmetrically or asymmetrically along different concentric circles on the chuck, which can be individually controlled by a measuring controller to lift a disc-shaped workpiece in a second measuring mode. Thus, in the second measuring mode, different measurements can be performed using different groups of lifted lift pins.

[0028] According to another preferred embodiment, the fork-shaped end effector can be manually connected to a mobile table by a connector. According to another preferred embodiment, the fork-shaped end effector is connected to a moving table by a movable connector configured to lift the disc-shaped workpiece from the lift pin in order to move the disc-shaped workpiece into a second measurement mode.

[0029] According to another preferred embodiment, the optical sensor means includes a multicolor confocal camera, which helps to obtain accurate high-resolution data. According to another preferred embodiment, the optical sensor means is mounted on a holder adjustable in the z direction to adjust the distance to the disk-shaped workpiece in each measurement mode.

[0030] Preferred embodiments of the present invention will be described below in reference to the accompanying drawings. [Brief explanation of the drawing]

[0031] [Figure 1a] A schematic front view of a warpage inspection device according to the first embodiment of the present invention is shown. [Figure 1b] A schematic perspective view of a warpage inspection device according to the first embodiment of the present invention is shown. [Figure 2]A partial perspective view of three different platforms used in a warpage inspection device according to an embodiment of the present invention, where a) shows a chuck as a platform into which the lift pin is retracted in a first measurement mode, b) shows a lift pin as a platform from which the lift pin is extended from the chuck in a second measurement mode, and c) shows an end effector as a platform in a third measurement mode. [Figure 3] A more detailed top view of the end effector and connector for connecting the end effector to the moving table used in the warpage inspection apparatus according to the first embodiment of the present invention is shown. [Figure 4] Figure 3 shows a perspective view of the end effector, with the connector connected to the moving table. [Figure 5] A schematic perspective view of a warpage inspection device according to a second embodiment of the present invention is shown. [Figure 6] A top view of two different chucks used in a warpage inspection device according to an embodiment of the present invention, where a) shows a first chuck having an asymmetrical lift pin arrangement, and b) shows a second chuck having a symmetrical lift pin arrangement. [Figure 7] A perspective view of an end effector and a movable connector for connecting the end effector to a moving table used in a warpage inspection device according to a third embodiment of the present invention, wherein a) shows the end effector in the retracted position and b) shows the end effector in the extended position. [Figure 8] A flowchart of a warpage inspection method according to a fourth embodiment of the present invention is shown. [Modes for carrying out the invention]

[0032] In the figures, the same reference numeral indicates the same or functionally equivalent components. Figures 1a and 1b are schematic diagrams of a warpage inspection device according to a first embodiment of the present invention, where Figure 1a is a schematic front view and Figure 1b is a schematic perspective view.

[0033] The warpage inspection apparatus according to the first embodiment is applied to a disc-shaped workpiece in the form of a molded wafer. The warpage inspection device comprises a support frame 1 having an upper support surface 1a defining the xy plane. The support frame 1 includes a lower main body 5 having a plurality of legs 100 placed on the ground, and an upper plate 10, which are connected to each other by adjustable leveling means 12 for leveling the xy plane. The leveling means 12 may consist of rotatable bolts.

[0034] The movable table 20 is mounted on a support surface 1a that is movable in the xy plane by a cross-slide mechanism that slides on orthogonal rails 20a, 20b (see Figure 1b). A vacuum chuck 30 is mounted above the movable table 20, which includes a group of movable lift pins 30a, 30b, 30c (see Figure 2b). The movable lift pins 30a, 30b, 30c are movable between a first position in which the movable lift pins 30a, 30b, 30c are retracted into the vacuum chuck 30 to mount the molded wafer 40 onto the vacuum chuck 30, and a second position in which the movable lift pins 30a, 30b, 30c are extended from the vacuum chuck 30 to lift the molded wafer 40 from the vacuum chuck 30 in the z direction perpendicular to the xy plane.

[0035] In the first embodiment, the retaining means 45 attached to the support frame 1 forms a bridge. The optical sensor means 49 is attached to the bridge-shaped retaining means 45 by a holder 50 adjustable in the z direction to adjust the distance to the disk-shaped workpiece in each measurement mode. The optical sensor means 49 includes a multicolor confocal camera that measures the surface profile of the molded wafer 40 by irradiating the surface of the molded wafer 40 with light 52 and receiving the reflected light 52 in order to determine the warping of the molded wafer 40.

[0036] The lower main body 5 of the support frame 1 houses a measurement controller 5a that controls the optical sensor means 49, the movable table 20, and the lift pins 30a, 30b, and 30c in each measurement mode. For simplicity, the corresponding electrical connections are not shown here.

[0037] The lower main body 5 of the support frame 1 also houses a vacuum system (not shown) and a vacuum controller 5b for controlling the vacuum system. The vacuum system is connected to the chuck 30 and the vacuum controller 5b for controlling the vacuum system. For simplicity, the corresponding fluid and electrical connections are also not shown here.

[0038] The lower body portion 5 of the support frame 1 also houses a temperature control system (not shown) and a temperature controller 5c for controlling the temperature control system. The temperature control system is connected to the chuck 30 and the temperature controller 5c for controlling the temperature control system to bring the chuck to a selectable temperature during measurement mode. For simplicity, corresponding fluid and electrical connections are also not shown here.

[0039] The lower main body portion 5 of the support frame 1 also includes input means 70, such as a keypad, for starting and selecting a measurement mode, and an interface 71 for outputting measurement data to an external device, such as a personal computer.

[0040] The optical sensor means 49 is configured to measure the warpage of the disc-shaped workpiece 40 at multiple positions on the molded wafer in a first measurement mode in which the lift pins 30a, 30b, and 30c of the chuck 30 are in a first position, and in a second measurement mode in which the lift pins 30a, 30b, and 30c are in a second position, under the control of the measurement controller 5a.

[0041] As will be further described below with reference to Figures 2c), 3 and 4, the warpage inspection apparatus further comprises a fork-shaped end effector 35 connectable to a moving table 20 for mounting the molded wafer 40. Controlled by the measurement controller 5a, the optical sensor means 49 is configured to measure the warpage of the molded wafer 40 at multiple locations on the molded wafer 40 in a third measurement mode in which the molded wafer 40 is mounted on the end effector 35. A vacuum system can be connected to the end effector 35 via a fluid line (not shown here).

[0042] Once the molded wafer 40 is placed on the chuck 30 manually or automatically, the user can input a desired measurement mode sequence via the input means 70, and the desired measurement mode sequence is then automatically controlled by the software of the measurement controller 5a. The measurement results are output via the interface 70. Subsequently, the same measurement mode sequence may be repeated by placing the next molded wafer 40 on the chuck 30, or a new measurement mode sequence may be input. In this first embodiment, if the measurement mode sequence includes a third measurement mode, the user is prompted to manually connect the end effector 35 to the moving table 20 and place the molded wafer 40 on it.

[0043] The measurement mode sequence can be selected to pre-determine specific parameters for each measurement mode. In the first measurement mode, temperature and vacuum state can be selected. In the second measurement mode, the lift pin arrangement (see Figures 6a and 6b) can be selected. In the third measurement mode, the pair of vacuum suction ports can be selected (see Figure 3). This provides the user with a very high degree of flexibility in defining the measurement modes and mode sequences.

[0044] Figures 2a) to 2c) show partial perspective views of three different wafer platforms used in a warpage inspection apparatus according to an embodiment of the present invention. According to Figure 2a), the chuck 30 functions as a platform for the molded wafer 40 in the first measurement mode (the lift pins are retracted into the chuck 30); according to Figure 2b), the extended lift pins 30a, 30b, and 30c function as a platform for the molded wafer 40 in the second measurement mode; and according to Figure 2c), the end effector 35 functions as a platform for the molded wafer 40 in the third measurement mode.

[0045] Figure 3 shows a more detailed top view of the end effector and connector for connecting the end effector to a moving table used in a warpage inspection device according to the first embodiment of the present invention. Figure 4 shows a perspective view of the end effector of Figure 3 with the connector connected to the moving table.

[0046] As shown in Figure 3, the end effector 35 includes a first projection 38a and a second projection 38b, and multiple pairs of vacuum suction holes 35a, 35b and 35c, 35d and 35e, 35f are arranged to face each other at different positions along the length of the first and second projections 38a, 38b. The vacuum controller 5b is configured to selectively vacuum each pair of vacuum suction holes 35a, 35b and 35c, 35d and 35e, 35f in the third measurement mode.

[0047] As shown in Figure 4, the connector 38 can be attached to the mobile table 20, for example, by a plug-in mechanism. The vacuum system is connected to the connector 38 and the mobile table 20 by corresponding fluid lines, which are not shown here.

[0048] Figure 5 shows a schematic perspective view of a warpage inspection device according to a second embodiment of the present invention. The warpage inspection apparatus according to the second embodiment differs from the warpage inspection apparatus according to the first embodiment in that, in place of or in addition to the interface 71, it includes a display means 60 controllable by the measurement controller 5a for displaying the measurement results of the measurement mode as a two-dimensional and / or three-dimensional diagram.

[0049] The input means 70 is configured to manipulate the view so that it can be rotated and zoomed, allowing the user to view the measured warp profile of the disc-shaped workpiece from different viewing angles.

[0050] Furthermore, the retaining means 45' is formed by an inclined profile rather than a bridge as in the first embodiment. In all other respects, the second embodiment is designed in exactly the same way as the first embodiment.

[0051] Figures 6a) and 6b) are top views of two different chucks used in a warpage inspection device according to an embodiment of the present invention, where Figure 6a) shows a first chuck having an asymmetrical lift pin arrangement, and Figure 6b) shows a second chuck having a symmetrical lift pin arrangement.

[0052] The first chuck 30 in Figure 6a) includes three groups of movable lift pins 29a, 29b, 29c and 30a, 30b, 30c and 31a, 31b, 31c, which are asymmetrically arranged along three different concentric circles D1, D2, D3 on the chuck 30 and can be individually controlled by the measurement controller 5a to lift the molded wafer 40 in the second measurement mode.

[0053] The second chuck 30 in Figure 6b) includes three groups of movable lift pins 29a, 29b, 29c and 30a, 30b, 30c and 31a, 31b, 31c, which are symmetrically arranged along three different concentric circles D1, D2, D3 on the chuck 30 and can be individually controlled by the measurement controller 5a to lift the molded wafer 40 in the second measurement mode.

[0054] Figures 7a) and 7b) are perspective views of an end effector and a movable connector for connecting the end effector to a moving table used in a warpage inspection device according to a third embodiment of the present invention, where Figure 7a) shows the end effector in the retracted position and Figure 7b) shows the end effector in the extended position.

[0055] The warpage inspection device according to the third embodiment differs from the warpage inspection device according to the first embodiment in that the fork-shaped end effector 35 is connected to the movable table 20 by a movable connector 38', and the movable connector 38' is configured to lift the disc-shaped workpiece from the lift pins 30a, 30b, and 30c in order to automatically put the disc-shaped workpiece into the third measurement mode.

[0056] The end effector 35 can be moved back and forth along direction b by the connector 38'. According to Figure 7a), the end effector 35 is retracted and the molded wafer 40 is placed on the lift pins 30a, 30b, 30c in a second position for the second measurement mode. According to Figure 7b), the end effector 35 is extended below the molded wafer 40, which is still placed on the lift pins 30a, 30b, 30c. The lift pins 30a, 30b, 30c are then retracted into the chuck 30, and the molded wafer 40 is placed on the end effector 35, ready for the third measurement mode.

[0057] As indicated by the dashed line 29, the connector 38' is directly or indirectly coupled to the moving table 20 so that the molded wafer 40, placed on the end effector 35, can be positioned at multiple measurement locations below the optical sensor means 49.

[0058] In all other respects, the third embodiment is designed in exactly the same way as the first embodiment. Figure 8 shows a flowchart of a warpage inspection method according to a fourth embodiment of the present invention. In step S1, the molded wafer is manually or automatically placed on the chuck 30 of the warpage inspection apparatus of any of the embodiments described above.

[0059] In step S2, the user can input a desired measurement mode sequence and its parameters via the input means 70, and the desired measurement mode sequence is then automatically controlled by the software of the measurement controller 5a, as already described above.

[0060] For example, if a first measurement mode that does not use a vacuum and a second measurement mode that uses lift pins 30a, 30b, and 30c are selected, the user can start the measurement mode sequence in step S3.

[0061] In step S4, the warpage of the molded wafer 40 at multiple positions on the molded wafer 40 in a first measurement mode where the lift pin 30 is in a first position is measured without using a vacuum.

[0062] In step S5, the system automatically switches to the second measurement mode by lifting the lift pins 30a, 30b, and 30c. In step S6, the warpage of the molded wafer 40 is measured at multiple positions on the molded wafer 40 in a second measurement mode in which the lift pins 30a, 30b, and 30c are in the second position.

[0063] In step S7, the user may terminate the process or add another measurement mode via the input means 70. If no further measurement mode is selected, the process terminates in step S8.

[0064] If a different measurement mode, such as a third measurement mode, is selected, in step S9, the effector 35 is connected to the moving table 20, and the molded wafer 40 is placed on the effector 35, either manually or by a movable connector 38' configured to lift the molded wafer 40 from the lift pins 30a, 30b, 30c to put the molded wafer 40 into the third measurement mode.

[0065] In step S10, the warpage of the molded wafer 40 is measured at multiple locations on the molded wafer 40 in a third measurement mode in which the molded wafer 40 is mounted on the end effector 35.

[0066] Subsequently, the process is terminated in step S11. While the present invention has been described with reference to specific embodiments, it is not limited thereto. Various modifications are possible within the scope of the invention as defined in the appended claims.

[0067] In particular, the warpage inspection apparatus and method can be applied not only to molded wafers but also to semiconductor wafers, and most commonly to any disk-shaped workpiece for which warpage needs to be measured.

Claims

1. A warpage inspection apparatus for disc-shaped workpieces, particularly semiconductors or molded wafers, A support frame (1; 5, 10) having an upper support surface (1a) that defines the xy plane, A movable table (20) mounted on the support surface (1a) and movable in the xy plane, A chuck (30) attached to the movable table (20), the chuck (30) includes a group of movable lift pins (30a, 30b, 30c), the lift pins (30a, 30b, 30c) being movable between a first position in which the disc-shaped workpiece (40) is retracted into the chuck (30) to mount the disc-shaped workpiece (40) onto the chuck (30), and a second position in which the disc-shaped workpiece (40) is extended from the chuck (30) to lift the disc-shaped workpiece (40) from the chuck (30) in the z direction perpendicular to the xy plane, A retaining means (45; 45') attached to the support frame (1; 5, 10), A warpage inspection device comprising: an optical sensor means (49) attached to the holding means (45) and configured to measure the warpage of the disc-shaped workpiece (40) at multiple positions on the disc-shaped workpiece (40) in a first measurement mode in which the lift pins (30a, 30b, 30c) are in the first position, and a second measurement mode in which the lift pins (30a, 30b, 30c) are in the second position.

2. The warpage inspection device according to claim 1, further comprising a fork-shaped end effector (35) connected to or connectable to the movable table (20) for mounting the disc-shaped workpiece (40), wherein the optical sensor means (49) is configured to measure the warpage of the disc-shaped workpiece (40) at a plurality of positions on the disc-shaped workpiece (40) in a third measurement mode in which the disc-shaped workpiece (40) is mounted on the end effector (35).

3. The warpage inspection device according to claim 1 or 2, wherein the support frame (1; 5, 10) includes a lower body portion (5) placed on the ground and an upper plate portion (10), and the lower body portion (5) and the upper plate portion (10) are connected to each other by an adjustable leveling means (12) for making the xy plane horizontal.

4. The warpage inspection apparatus according to any one of claims 1 to 3, further comprising a measurement controller (5a) for controlling the optical sensor means (49), the movable table (20), and the lift pins (30a, 30b, 30c) in their respective measurement modes.

5. The warpage inspection apparatus according to any one of claims 1 to 4, further comprising a vacuum system connected to a chuck (30) and a vacuum controller (5b) for controlling the vacuum system in the first measurement mode.

6. The warpage inspection apparatus according to claim 5, dependent on claim 2, wherein the vacuum system is connected to or connectable to the end effector (35).

7. The warpage inspection apparatus according to claim 6, wherein the end effector (35) includes a first projection (38a) and a second projection (38b), and a plurality of pairs of vacuum suction holes (35a, 35b; 35c, 35d; 35e, 35f) are arranged to face the first and second projections (38a, 38b) at positions of different lengths.

8. The warpage inspection apparatus according to claim 7, wherein the vacuum controller (5b) is configured to selectively suck each pair of vacuum suction holes (35a, 35b; 35c, 35d; 35e, 35f) in the third measurement mode.

9. The warpage inspection apparatus according to any one of claims 1 to 8, further comprising a temperature control system connected to a chuck (30) and a temperature controller (5c) for controlling the temperature control system in the first measurement mode.

10. The warpage inspection apparatus according to any one of claims 1 to 9, wherein at least one of the measuring controller (5a), the vacuum controller (5b), and the temperature controller (5c) is provided on the support frame (1; 5, 10), particularly on the lower main body portion (5) of the support frame (1; 5, 10).

11. The warpage inspection apparatus according to any one of claims 1 to 10, further comprising a display means (60) that can be controlled by the measurement controller (5a) and displays the measurement result of the measurement mode as at least one of a two-dimensional figure and a three-dimensional figure.

12. The warpage inspection apparatus according to any one of claims 1 to 11, further comprising input means (70) for selecting the measurement mode and the measurement mode sequence.

13. The warpage inspection apparatus according to claim 12, dependent on claim 11, wherein the input means (70) is configured to manipulate the view so that the view can be rotated and zoomed, enabling the user to view the measured warpage profile of the disc-shaped workpiece from views at different angles.

14. The warpage inspection apparatus according to claim 4, wherein the chuck (30) includes a plurality of groups of movable lift pins (29a, 29b, 29c; 30a, 30b, 30c; 31a, 31b, 31c) arranged symmetrically or asymmetrically along different concentric circles (D1, D2, D3) on the chuck (30), and the plurality of groups can be individually controlled by the measuring controller to lift the disc-shaped workpiece in the second measurement mode.

15. The warpage inspection apparatus according to claim 2, wherein the fork-shaped end effector (35) can be manually connected to the movable table (20) by a connector (38).

16. The warpage inspection apparatus according to claim 2, wherein the fork-shaped end effector (35) is connected to the moving table (20) by a movable connector (38') configured to lift the disc-shaped workpiece from the lift pins (30a, 30b, 30c) in order to put the disc-shaped workpiece into the third measurement mode.

17. The warpage inspection apparatus according to any one of claims 1 to 16, wherein the optical sensor means (49) includes a multicolor confocal camera.

18. The warpage inspection apparatus according to claim 17, wherein the optical sensor means (49) is mounted on a holder (50) that is adjustable in the z direction to adjust the distance to the disc-shaped workpiece in each measurement mode.

19. A method for inspecting the warpage of a disc-shaped workpiece using the warpage inspection system described in any one of claims 1 to 18, In the first measurement mode in which the lift pins (30a, 30b, 30c) are in the first position, the steps include measuring the curvature of the disc-shaped workpiece (40) at multiple positions on the disc-shaped workpiece (40), The steps include automatically transitioning to the second measurement mode described above, A method for inspecting warpage, comprising the step of measuring the warpage of the disc-shaped workpiece (40) at multiple positions on the disc-shaped workpiece (40) in a second measurement mode in which the lift pins (30a, 30b, 30c) are in the second position.

20. The warpage inspection system further comprises a fork-shaped end effector (35) connected to or connectable to the moving table (20) for mounting the disc-shaped workpiece (40), the optical sensor means (49) configured to measure the warpage of the disc-shaped workpiece (40) at a plurality of positions on the disc-shaped workpiece (40) in a third measurement mode in which the disc-shaped workpiece (40) is mounted on the end effector (35), the warpage inspection method according to claim 19, further comprising the steps of automatically or manually transitioning to the third measurement mode, and measuring the warpage of the disc-shaped workpiece (40) at a plurality of positions on the disc-shaped workpiece (40) in the third measurement mode in which the disc-shaped workpiece (40) is mounted on the end effector (35).

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