Photoelectric functional film and light-transmitting assembly
The optoelectronic functional film addresses reliability issues by using an external extension to support the circuit board substrate, ensuring stable electrical connections and maintaining reliable adjustment and control functions.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- FUYAO GLASS IND GROUP CO LTD
- Filing Date
- 2024-05-15
- Publication Date
- 2026-05-27
Smart Images
Figure 2026517006000001_ABST
Abstract
Description
Technical Field
[0001] (Cross - reference to Related Applications) This disclosure claims the priority of a Chinese patent application with the application number 2023105482387 and the title "Optoelectronic Functional Film and Translucent Assembly", which was filed with the China National Intellectual Property Administration on May 16, 2023, and all of its contents are incorporated herein by reference.
[0002] This application relates to the technical field of electronic control, and in particular, to optoelectronic functional films and translucent assemblies.
Background Art
[0003] With the development of the glass manufacturing field, the functions of glass have become increasingly diversified. For example, there are translucent assemblies with adjustable transmittance, discoloring glass that can change color, etc. Such glasses with distinctive functions are provided with optoelectronic functional films. The optoelectronic functional film is a kind of electronic control component and can exhibit different states when the electric field changes. The flexible circuit board is an important component of the electronic control components in such glasses. The translucent assembly includes a dimming film, and the dimming film can change the transmittance under the action of an electric field. For example, it is opaque when not energized and transparent when energized. However, in the actual use process, there is a potential risk of failure in the adjustment and control function of the glass.
Summary of the Invention
Problems to be Solved by the Invention
[0004] According to various embodiments of this application, this application provides an optoelectronic functional film and a translucent assembly.
Means for Solving the Problems
[0005] An optoelectronic functional film comprising a functional layer, at least one substrate body, and a flexible circuit board. The aforementioned functional layer can exhibit different states when the external electric field in which it is placed changes. Each of the substrate bodies is arranged in lamination with the functional layer, and a conductive layer is provided on the surface of at least one of the substrate bodies facing the functional layer or on the surface facing away from the functional layer, and at least one of the substrate bodies further includes an external extension that extends beyond the conductive layer, The electrodes of the flexible circuit board are electrically connected to at least one of the conductive layers, and the circuit board substrate of the flexible circuit board is positioned and restricted on the external extension portion.
[0006] In one embodiment, the direction in which the external extension extends outward from the conductive layer is the width direction of the external extension, the width direction of the circuit board substrate coincides with the width direction of the external extension, and the width of the external extension is 1 / 3 or more of the width of the circuit board substrate.
[0007] In one embodiment, the external extension includes an insulating member.
[0008] In one embodiment, the external extension is provided with a plurality of wiring notches arranged at intervals, each of which penetrates two main sides of the base material body, and the circuit board base material is arranged on the external extension in a wavy path, passing sequentially through each of the wiring notches.
[0009] In one embodiment, the conductive layer electrically connected to the electrodes of the flexible circuit board has a plurality of adjustment control regions that are insulated from each other, the flexible circuit board has a plurality of electrodes, one electrode is electrically connected to each of the adjustment control regions, and there is a one-to-one correspondence between the adjustment control regions and the electrodes. The spacing direction in which the multiple wiring notches are sequentially arranged coincides with the direction in which the multiple adjustment control regions are sequentially arranged. Of the multiple wiring notches located between two adjacent electrodes, the one closest to the electrode is a direction-changing notch, and the others are fixing notches. In the fixing notches, the circuit board substrate passes from one side where the conductive layer is provided to the other side, and in the direction-changing notches, the circuit board substrate passes from the other side to the one side where the conductive layer is provided.
[0010] In one embodiment, the width of the fixing notch is greater than the width of the direction-changing notch.
[0011] In one embodiment, the width of the fixing notch is 2 mm to 5 mm, and the width of the direction-changing notch is 2 mm or less.
[0012] In one embodiment, the distance between two adjacent fixing notches located between two adjacent electrodes is 50 mm to 250 mm, and the distance between the direction-changing notch and the nearest electrode is 15 mm to 75 mm.
[0013] In one embodiment, the plurality of adjustment control regions are separated by dividing lines provided in the conductive layer, and at least one fixing notch located between two adjacent electrodes is positioned on the extension of the dividing line. A silver paste layer is provided at the edge of the conductive layer for thermocompression bonding and electrical connection of the electrodes. The fixing notch, located on the extension of the dividing line, extends to the silver paste layer, and the silver paste layers corresponding to different adjustment control regions are divided by the fixing notch.
[0014] In one embodiment, the plurality of electrodes are arranged sequentially at intervals along the long side of the circuit board substrate, the plurality of conductive wires are arranged within the circuit board substrate, the conductive wires are electrically connected to the electrodes on a one-to-one basis, each conductive wire is wired along the length direction of the circuit board substrate, and each conductive wire is arranged at intervals in the width direction of the circuit board substrate. Each of the aforementioned wiring notches is arranged sequentially at intervals along the length of the circuit board substrate.
[0015] In one embodiment, each electrode electrically connected to the adjustment control region is a partition electrode, the flexible circuit board further has a common electrode, conductive layers are provided on both sides of the functional layer, the conductive layer located on one side of the functional layer has a plurality of adjustment control regions, each partition electrode is connected one-to-one with each adjustment control region, and the common electrode is connected to the conductive layer located on the other side of the functional layer.
[0016] In one embodiment, the photoelectric functional film includes two substrate bodies, each of which is laminated on both sides of the functional layer, and the conductive layer is provided on both of the substrate bodies. The conductive layer provided on the substrate body on which the external extension portion is provided has a plurality of adjustment control regions, and the conductive layer is located on the side of the substrate body facing the functional layer, and the conductive layer is in direct contact with the functional layer.
[0017] In one embodiment, the photoelectric functional film further includes an edge sealing adhesive, and the edge sealing adhesive is disposed on the outer peripheral surface of the functional layer.
[0018] In one embodiment, the external extension includes a PET member, a PC member, or a PVC member. and / or, the circuit board substrate includes a PI substrate or a PE substrate. And / or, the circuit board substrate and the external extension are bonded or snap-fitted together.
[0019] A photoelectric functional film, It includes a functional layer, at least one conductive substrate, and a flexible circuit board. The functional layer can exhibit different states when the external electric field where it is placed changes. The conductive substrate is provided by laminating with the functional layer. Each conductive substrate includes a substrate body and a conductive layer provided on the surface of the substrate body facing the functional layer or the surface facing away from the functional layer. At least one of the conductive layers is divided into conductive regions insulated from each other and an external extension region. The conductive region is located between the substrate body corresponding to the functional layer, and the external extension region extends outside the functional layer. The part covered by the external extension region of the substrate body and the external extension region together constitute an external expansion part. The electrodes of the flexible circuit board are electrically connected to the regions of at least one of the conductive layers facing the functional layer, and the circuit board substrate of the flexible circuit board is position - limited on the external expansion part.
[0020] In one embodiment, the electrodes of the flexible circuit board are electrically connected to the conductive region, and the conductive region and the external extension region belonging to the external expansion part belong to the same conductive layer. A plurality of wiring cut - outs are provided in the external expansion part. Each wiring cut - out penetrates the substrate body and the external extension region of the conductive layer along the thickness direction of the conductive substrate. The circuit board substrate is arranged on the external expansion part in a wavy path by sequentially passing through each wiring cut - out.
[0021] The light - transmissive assembly is It includes a first light - transmissive plate, a second light - transmissive plate, and the above - mentioned optoelectronic functional film. The first light - transmissive plate and the second light - transmissive plate are laminated on both sides of the optoelectronic functional film through an adhesive film, and the functional layer is a dimming layer.
[0022] Details of one or more embodiments of the present application are described in the following drawings and description. Other features, objectives, and advantages of the present application will become apparent from the specification, drawings, and claims.
Brief Description of the Drawings
[0023] [Figure 1] It is a schematic structural view of the optoelectronic functional film according to this embodiment. [Figure 2] It is a cross-sectional view taken along the line A-A of FIG. 1. [Figure 3] It is a cross-sectional view taken along the line B-B of FIG. 1. [Figure 4] It is a cross-sectional view of the optoelectronic functional film according to another embodiment. [Figure 5] It is a partial enlarged view of the C part of FIG. 4.
Embodiments for Carrying out the Invention
[0024] In order to make the above objects, features, and advantages of the present application clearer and easier to understand, the following will describe the specific embodiments of the present application in detail while referring to the accompanying drawings. In the following description, many specific details are described in order to provide a complete understanding of the present application. However, the present application can be implemented in many other forms different from those described here, and those skilled in the art can make similar improvements without departing from the spirit of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0025] As shown in FIGS. 1 and 2, since the optoelectronic functional film 10 has a relatively thin thickness, generally, an electronic control component with a high wiring density, lightweight, thin, and easy to bend, such as a flexible circuit board 13, is used. The optoelectronic functional film 10 includes a functional layer 11, and the functional layer 11 can exhibit different states when the external electric field where it is placed changes. The flexible circuit board 13 can be used to adjust and control the external electric field where the functional layer 11 is placed. For example, a conductive layer 123 is provided on at least one side of the functional layer 11, and a silver paste layer 14 used for electrical connection of the electrodes is provided on the conductive layer 123. The electrodes of the flexible circuit board 13 are electrically connected to the silver paste layer 14, and then, by controlling the alternating voltage applied to the conductive layer by a control unit in the flexible circuit board 13 or another external controller, the external electric field where the functional layer 11 is placed can be adjusted and controlled.
[0026] The electrodes of the flexible circuit board 13 and the silver paste layer 14 can be electrically connected by thermocompression bonding. However, the connection points are fragile, and if sufficient tensile force is applied to the flexible circuit board 13, the electrodes are likely to detach from the silver paste layer 14. In particular, with the development of the glass manufacturing field, region-specific adjustment control is becoming increasingly common, and different regions need to be controlled individually. Each region needs to be equipped with a corresponding electrode, so the number of electrodes included in the flexible circuit board 13 increases, and the number of corresponding wires also increases. As shown in Figure 1, as the number of wires in the flexible circuit board 13 increases, the width of the flexible circuit board 13 (the left-right direction at the angle shown is the width direction) increases, and a larger portion of the flexible circuit board 13 hangs outside the base material body 12. As a result, the tensile force applied to the electrical connection points between the electrodes of the flexible circuit board 13 and the silver paste layer 14 by thermocompression bonding increases, making the electrodes more likely to detach during transport or assembly. Consequently, there is a risk of failure in the adjustment control function of the glass.
[0027] The electrodes of the flexible circuit board 13 can also be bonded to the conductive layer 123, but the bonding area between the two is limited, and similarly, this also presents the problem that the connection point is fragile and easily detaches when sufficient tensile force is applied.
[0028] Based on this, in some embodiments of the present application, a photoelectric functional film 10 is provided, which includes a functional layer 11, at least one substrate body 12, and a flexible circuit board 13, as shown in Figures 1 to 3.
[0029] Here, the functional layer 11 can exhibit different states when the external electric field on which it is placed changes. The functional layer 11 may also be a dimming layer, and can exhibit different transmittances when the external electric field on which it is placed changes. The functional layer 11 may also be an electrochromic layer, and can exhibit different colors when the external electric field on which it is placed changes.
[0030] Each substrate body 12 is arranged in a laminate with the functional layer, and as shown in Figure 2, if the photoelectric functional film 10 includes two substrate bodies, the two substrate bodies 12 are laminated on both sides of the functional layer 11.
[0031] A conductive layer 123 is provided on at least one substrate body 12, either on the surface facing the functional layer 11 or on the surface facing away from the functional layer 11. In other words, as shown in Figure 2, the conductive layer 123 can be located between the substrate body 12 and the functional layer 11. Selectively, the conductive layer 123 can also be located on the side of the substrate body 12 facing away from the functional layer. The conductive layer 123 may be provided on only some of the substrate bodies 12, or it may be provided on all of the substrate bodies 12.
[0032] It is understood that at least a portion of the conductive layer 123 should face the functional layer 11, and that the external electric field on which the functional layer 11 is placed should be changed when the conductive layer 123 is electrically connected to an AC voltage. Furthermore, the conductive layer 123 and the functional layer 11 may be in direct contact, or an intermediate layer may be provided between them, and the intermediate layer may be a structural layer with conductive properties or an insulating structural layer.
[0033] Furthermore, conductive layers 123 may be present on both sides of the functional layer 11, or they may be placed on only one side of the functional layer 11. The conductive layers 123 that are present only need to be able to control the external electric field on which the functional layer 11 is placed.
[0034] At least one substrate body 12 further includes an external extension 121 that extends beyond the conductive layer 123. The electrodes of the flexible circuit board 13 are electrically connected to at least one conductive layer 123, and the circuit board substrate 131 of the flexible circuit board 13 is positioned on the external extension 121.
[0035] The flexible circuit board 13 includes electrodes and a circuit board substrate 131, in which conductive wires 133 for electrical connection to the electrodes may be arranged, and the electrodes are located outside the circuit board substrate 131. The weight of the circuit board substrate 131 and the weight of other electrical interfaces provided on the circuit board substrate 131 account for the main part of the weight of the flexible circuit board 13. When the circuit board substrate 131 is positioned on the external extension 121, the external extension 121 can restrict the position of the circuit board substrate 131, and the external extension 121 is used to support the weight of the circuit board substrate 131, thereby eliminating the need for the electrical connection points between the electrodes and the conductive layer 123 to be subjected to excessive tensile force. As a result, the probability of the electrodes falling off is greatly reduced, the reliability of the photoelectric functional film 10 is ensured, and the probability of the photoelectric functional film 10's regulating control function failing is reduced.
[0036] As shown in Figure 2, in the above embodiment, the external extension portion 121 is formed by extending the base body 12 outward. In this case, the external extension portion 121 does not include the conductive layer 123, and during manufacturing, it is sufficient to simply design the outer circumference of the external extension portion 121 to be larger than that of the conductive layer 123.
[0037] Furthermore, only one side of the base material body 12 needs to extend outside the conductive layer 123, and the other side of the base material body 12 may be aligned flat with the conductive layer 123. For example, both the base material body 12 and the conductive layer 123 are rectangular slices, the length of the base material body 12 is longer than the length of the conductive layer 123, the width of the base material body 12 is the same as the width of the conductive layer 123, the two long sides of the base material body 12 are aligned flat with the two long sides of the conductive layer 123, but the long side of the base material body 12 is longer than the long side of the conductive layer 123, one short side of the base material body 12 is aligned flat with the conductive layer 123, the other short side of the base material body 12 is located outside the conductive layer 123, and the short side located outside the conductive layer 123 belongs to the external extension portion 121.
[0038] Selectively, the substrate body 12 may extend outward relative to the conductive layer 123 in multiple directions. For example, both the substrate body 12 and the conductive layer 123 are rectangular slabs, the length of the substrate body 12 is longer than the length of the conductive layer 123, the width of the substrate body 12 is wider than the width of the conductive layer 123, and the projection of the conductive layer 123 onto the substrate body 12 along the thickness direction of the photoelectric functional film 10 is located entirely inside the substrate body 12. There is a portion that extends outward from the conductive layer 123 all around the perimeter of the substrate body 12.
[0039] In other cases, as shown in Figure 4, the external extension 121 may include a portion of the conductive layer 123. For example, in some other embodiments, as shown in Figures 4 and 5, the photoelectric functional film 10 includes a functional layer 11, at least one conductive substrate, and a flexible circuit board 13. Here, the functional layer 11 can exhibit different states when the external electric field on which it is placed changes. The conductive substrate is arranged in lamination with the functional layer 11. Each conductive substrate includes a substrate body 12 and a conductive layer 123 provided on the surface of the substrate body 12 facing the functional layer 11 or on the surface facing away from the functional layer 11. At least one conductive layer 123 is divided into a conductive region 1234 and an external extension region 1235 that are insulated from each other, the conductive region is located between the functional layer 11 and the corresponding substrate body 12, and the external extension region extends outside the functional layer 11. The portion of the substrate body 12 covered by the external extension region 1235 and the external extension region 1235 together constitute the external extension 121. The electrodes of the flexible circuit board 13 are electrically connected to a region of at least one conductive layer 123 facing the functional layer 11, and the circuit board substrate 131 of the flexible circuit board 13 is positioned on the external extension portion 121.
[0040] As shown in Figures 4 and 5, in this embodiment, the external extension portion 121 includes a part of the base material body 12 and a part of the conductive layer 123 (i.e., the external extension region 1235). However, this portion of the conductive layer 123 belonging to the external extension portion 121 (i.e., the external extension region 1235) is insulated from the conductive region 1234. Therefore, the external extension portion 121 is essentially an insulated component from the conductive region 1234, and the external extension portion 121 is mainly used to support the weight of the circuit board base material 131.
[0041] During manufacturing, a conductive layer 123 is first placed over the entire surface of the substrate body 12 facing the functional layer 11. Then, separation lines are created in the conductive layer 123 using processes such as etching to separate the conductive region 1234 from the external extension region 1235, thereby forming a conductive region 1234 and an external extension region 1235 that are insulated from each other. As shown in Figure 5, a narrow gap exists between the conductive region 1234 and the external extension region 1235. Specifically, there are various methods for forming this narrow gap, ultimately separating the conductive region 1234 from the external extension region 1235.
[0042] In the embodiment where the external extension portion 121 includes only a part of the base material body 12, the conductive layer 123 is similar to the conductive region in the embodiment where the external extension portion 121 includes both a part of the base material body 12 and the external extension region 1235.
[0043] When the photoelectric functional film 10 includes two substrate bodies 12, the substrate body 12 on which the conductive layer 123 electrically connected to the electrodes of the flexible circuit board 13 is arranged, and the substrate body 12 on which a portion belongs to the external extension portion 121, may be the same substrate body 12, or they may be two different substrate bodies 12.
[0044] In one embodiment, as shown in Figures 4 and 5, the portion of the base material body 12 covered by the external extension region 1235 and the external extension region 1235 together constitute the external extension portion 121, the electrodes of the flexible circuit board 13 are electrically connected to the conductive region 1234, and this conductive region 1234 and the external extension region 1235 belonging to the external extension portion 121 belong to the same conductive layer 123.
[0045] Furthermore, in some embodiments, as shown in Figures 1 and 2, the conductive layer 123 electrically connected to the electrodes of the flexible circuit board 13 has a plurality of insulated adjustment control regions 1231. The flexible circuit board 13 has a plurality of electrodes, and one electrode is electrically connected to each adjustment control region 1231, so that there is a one-to-one correspondence between the adjustment control region 1231 and the electrodes. As shown in Figure 1, each electrode electrically connected to the adjustment control region 1231 is a partition electrode 132. Since each adjustment control region 1231 can be individually and independently adjusted, it is necessary to arrange a unique electrode for each adjustment control region 1231. As the number of electrodes increases, the number of conductive wires 133 corresponding to the electrodes in the circuit board substrate 131 increases, and as a result, the volume and weight of the circuit board substrate 131 increase. In this case, the need to provide an external extension 121 to support the circuit board substrate 131 becomes even greater.
[0046] Specifically, in some embodiments, when the external extension portion 121 is formed extending from the base material body 12 to the outside of the conductive layer 123, the conductive layer 123 provided on the base material body 12 on which the external extension portion 121 is provided has a plurality of adjustment control regions 1231. Each adjustment control region 1231 is insulated from each other, the flexible circuit board 13 has a plurality of electrodes, one electrode is electrically connected to each adjustment control region 1231, and there is a one-to-one correspondence between the adjustment control region 1231 and the electrodes.
[0047] Since the base body 12 on which the conductive layer 123 electrically connected to the flexible circuit board 13 is placed and the base body 12 including the external extension 121 for positioning the circuit board base material 131 are the same base body 12, the electrodes of the flexible circuit board 13 and the circuit board base material 131 are basically on the same base body 12, and the electrodes and the circuit board base material 131 are kept essentially on the same plane, the reliability of the electrical connection between the electrodes and the conductive layer 123 is further enhanced. In particular, when multiple partition electrodes 132 are electrically connected one-to-one with multiple adjustment control regions 1231, the conductive layer 123 provided on the substrate body 12 on which the external extension portion 121 is provided has multiple adjustment control regions 1231, each partition electrode 132 and the circuit board substrate 131 are basically arranged on the same substrate body 12, and the circuit board substrate 131 is arranged in a wavy path through each wiring notch 122, the height difference between the partition electrodes 132 and the adjustment control regions 1231 is small, and as a result, the reliability of the electrical connection between the partition electrodes 132 and the adjustment control regions 1231 is high.
[0048] Similarly, in some other embodiments, when the external extension 121 includes a portion of the substrate body 12 and a portion of the conductive layer 123 (i.e., an external extension region 1235), the conductive region 1234 has a plurality of adjustment control regions 1231. Each adjustment control region 1231 is insulated from one another, the flexible circuit board 13 has a plurality of electrodes, and one electrode is electrically connected to each adjustment control region 1231, with a one-to-one correspondence between the adjustment control region 1231 and the electrode. The conductive region including the plurality of adjustment control regions 1231 and the external extension region belonging to the external extension 121 belong to the same conductive layer 123.
[0049] The circuit board substrate 131 and the external extension 121 can be positioned relative to each other by adhesive, snap-fit, or other means.
[0050] For example, in some embodiments, as shown in Figures 1 to 3, the external extension 121 is provided with a plurality of spaced wiring notches 122. When the external extension 121 extends from the base material body 12 to the outside of the conductive layer 123, each wiring notch 122 penetrates two main sides of the base material body 12. When the external extension 121 includes a part of the base material body 12 and an external extension region 1235 of the conductive layer 123, each wiring notch 122 penetrates the base material body 12 and the external extension region of the conductive layer 123 along the thickness direction of the conductive substrate. Subsequently, as shown in Figures 1 and 3, the circuit board base material 131 passes through each wiring notch 122 sequentially and is arranged on the external extension 121 in a wavy path.
[0051] When the circuit board substrate 131 is attached to the external extension 121 along the wavy path, the relative position between the circuit board substrate 131 and the external extension 121 is essentially fixed, reducing the tensile force that must be exerted on the electrical connection points between the electrodes and the conductive layer 123, and increasing the reliability of the electrical connection between them. Furthermore, the overall thickness of the circuit board substrate 131 as it passes over the external extension 121 is small, resulting in a compact structure.
[0052] Furthermore, in some embodiments, as shown in Figures 1 and 2, when the external extension portion 121 is formed extending from the base material body 12 to the outside of the conductive layer 123, the direction in which the external extension portion 121 extends to the outside of the conductive layer 123 is the width direction of the external extension portion 121. When the external extension portion 121 includes a part of the base material body 12 and an external extension region 1235 of the conductive layer 123, the direction in which the external extension portion 121 extends to the outside of the conductive layer 123 is the width direction of the external extension portion 121.
[0053] As shown in Figure 2, if the width direction of the circuit board substrate 131 coincides with the width direction of the external extension 121, and the width L2 of the external extension 121 is 1 / 3 or more of the width L1 of the circuit board substrate 131, the external extension 121 can provide strong support to the circuit board substrate 131.
[0054] In some embodiments, as shown in Figures 1 and 2, the external extension 121 is an insulating material. When the external extension 121 extends from the base material body 12 to the outside of the conductive layer 123, the material of the external extension 121 is the same as the material of the base material body 12, and both are insulating materials. The term "insulating material" as used herein refers to a material in which at least the surface layer in contact with the circuit board base material 131 is an insulating material, and does not limit whether a conductive material is arranged inside it.
[0055] When the external extension portion 121 includes a part of the base material body 12 and the external extension region 1235 of the conductive layer 123, although it includes the external extension region 1235 of the conductive layer 123, this region is insulated from the conductive region 1234. Therefore, in this case, the external extension portion 121 remains non-conductive even when the conductive region 1234 is energized.
[0056] In some embodiments, as shown in Figure 1, multiple electrodes are arranged sequentially at intervals along the long side of the circuit board substrate 131, and multiple conductive wires 133 are arranged within the circuit board substrate 131, with each conductive wire 133 electrically connected one-to-one with an electrode, each conductive wire 133 being routed along the length of the circuit board substrate 131, and each conductive wire 133 being spaced apart in the width direction of the circuit board substrate 131. As the number of conductive wires 133 increases, the width of the circuit board substrate 131 increases. Each wiring notch 122 is arranged sequentially at intervals along the length of the circuit board substrate 131. As the circuit board substrate 131 passes through each wiring notch 122, each electrode located on the long side is electrically connected to the conductive layer 123, corresponding precisely to the conductive layer 123.
[0057] Furthermore, as shown in Figures 1 and 3, in some embodiments, the spacing direction in which the multiple wiring notches 122 are sequentially arranged coincides with the direction in which the multiple adjustment control regions 1231 are sequentially arranged. Of the multiple wiring notches 122 located between two adjacent electrodes, the one closest to the electrode is a direction-changing notch 1222, and the others are fixing notches 1221. In the fixing notch 1221, the circuit board substrate 131 passes from one side where the conductive layer 123 is provided to the other side, and in the direction-changing notch 1222, the circuit board substrate 131 passes from the other side to the one side where the conductive layer 123 is provided. Regardless of the number of wiring notches 122 located between two adjacent electrodes, the circuit board substrate 131 can ultimately pass from the direction-changing notch 1222 to the side where the conductive layer 123 is present, thereby electrically connecting the electrodes of the flexible circuit board 13 to the conductive layer 123.
[0058] Furthermore, in some embodiments, the width of the fixing notch 1221 is greater than the width of the direction-changing notch 1222. As shown in Figures 1 and 3, each wiring notch 122 is a long notch. The fixing notch 1221 is mainly used to guide the circuit board substrate 131 to be positioned along a corrugated path, so its width is set large to facilitate the insertion of the circuit board substrate 131. On the other hand, the direction-changing notch 1222 is mainly used to change the direction of the circuit board substrate 131 and allow the circuit board substrate 131 to pass through to the side where the conductive layer 123 is located, so its width is set small, as long as the circuit board substrate 131 can pass through.
[0059] In some embodiments, as shown in Figure 1, each adjustment control region 1231 is separated by a dividing line provided in the conductive layer 123. At least one fixing notch 1221 located between two adjacent electrodes is positioned on the extension of the dividing line.
[0060] A silver paste layer 14 is provided at the edge of the conductive layer 123 for thermocompression bonding and electrical connection of electrodes. The fixing notch 1221, located on the extension of the dividing line, extends to the silver paste layer 14, and the silver paste layers 14 corresponding to different adjustment control regions 1231 are separated by this fixing notch 1221. The wide fixing notch 1221 ensures reliable insulation between the silver paste layers 14 corresponding to the two adjustment control regions 1231, preventing accidental contact between the silver paste layers 14 corresponding to different adjustment control regions 1231.
[0061] In some specific embodiments, the dividing lines are parallel to each other. As shown in Figure 1, each adjustment control region 1231 is rectangular.
[0062] In some embodiments, the width of the fixing notch 1221 is 2 mm to 5 mm, and the width of the direction-changing notch 1222 is 2 mm or less. For example, the width of the direction-changing notch 1222 may be 1 mm.
[0063] Furthermore, in some embodiments, the spacing between two adjacent fixing notches 1221, which are located between two adjacent electrodes and are adjacent to each other, is 50 mm to 250 mm, thereby ensuring that the circuit board substrate 131 passing through each fixing notch 1221 is clamped or positioned. The spacing between the reversing notch 1222 and the nearest electrode is 15 mm to 75 mm, ensuring that the electrode on the circuit board substrate 131 passing through the reversing notch 1222 can be electrically connected to the conductive layer 123 at close range.
[0064] Specifically, in one embodiment, the distance between two adjacent fixing notches located between two adjacent electrodes is 100 mm to 200 mm, and the distance between the direction-changing notch and the nearest electrode is 20 mm to 50 mm.
[0065] In some embodiments, as shown in Figure 1, each electrode electrically connected to the adjustment control region 1231 is a partition electrode 132, and the flexible circuit board 13 further has a common electrode 134. Conductive layers 123 are provided on both sides of the functional layer 11, and the conductive layer 123 located on one side of the functional layer 11 has a plurality of adjustment control regions 1231, each partition electrode 132 is connected one-to-one with each adjustment control region 1231, and the common electrode is connected to the conductive layer 123 located on the other side of the functional layer 11. The region in the conductive layer 123 electrically connected to each partition electrode 132 is a polarization region 1233, and the region in the conductive layer 123 electrically connected to the common electrode is a common electrode region 1232. Each partition electrode 132 is controlled independently, thereby allowing each adjustment control region 1231 to be controlled independently for each region.
[0066] As shown in Figures 1 and 2, in some embodiments, the silver paste layer 14 is provided on the polarization region 1233, and each compartment electrode 132 is electrically connected to the silver paste layer 14 corresponding to each adjustment control region 1231. The polarization region 1233 is the edge region of the conductive layer, and in some cases, the polarization region 1233 is a long, strip-shaped region.
[0067] If the polarization region 1233 and the common electrode region 1232 belong to different conductive layers 123, and the common electrode region 1232 is located on the side where the external extension 121 exists, in order to further ensure that the silver paste layers 14 in the two regions do not come into contact, a blocking notch 124 may be provided in the external extension, and the blocking notch 124 may be located at the boundary between the polarization region 1233 and the common electrode region 1232, thereby separating the silver paste layers 14 in the two regions.
[0068] In other embodiments, if the conductive layer 123 is present on only one side of the functional layer 11, the multiple adjustment control regions 1231 belong to this conductive layer 123.
[0069] Furthermore, as shown in Figure 2, in some embodiments, the photoelectric functional film 10 further includes an edge sealing adhesive (not shown), which is placed on the outer surface of the functional layer 11 to protect the functional layer 11 from the inside, and when bonded, the photoelectric functional film 10 is sandwiched between the two glass plates, an adhesive film is provided between the glass and the substrate body 12, and the adhesive film can also be filled into the unfilled areas of the photoelectric functional film 10 in the space between the two glass plates. In this case, the edge sealing adhesive can prevent contact between the adhesive film and the functional layer 11.
[0070] As shown in Figures 2 and 3, in some embodiments, the silver paste layer 14 and the functional layer 11 form a groove 16 with a gap between them, and the edge sealing adhesive is filled into this groove 16. A portion of the adhesive film located between the two glass sheets is pressed between them, and this portion of the adhesive film is the edge filling adhesive film 15. The difference in thickness between the edge filling adhesive film 15 and the photoelectric functional film 10 is 100 microns or less, preventing the glass from cracking due to the height difference between the two during high-pressure bonding. The adhesive film may be a PVB material, an EVA material, a TPU material, or any combination thereof.
[0071] The edge-filling adhesive film 15 is positioned on the outer periphery of the laminated structure formed by the base material body 12 and the functional layer 11. The upper and lower surfaces of the edge-filling adhesive film 15 are aligned flat with the main sides of the two base material bodies 12 that face away from each other, and its position is in close contact with the edge of the external extension portion 121. The base material body 12 extends outward relative to the functional layer 11, and the edge-filling adhesive film 15 is provided in order to make the thickness of the outer edge portion and the thickness of the middle portion of the photoelectric functional film 10 approximately the same. At the same time, it is also possible to avoid a situation in which electronic control components on the photoelectric functional film 10 are crushed and damaged during bonding.
[0072] Specifically, in some embodiments, the external extension portion 121 includes, but is not limited to, a PET member, a PC member, or a PVC member.
[0073] The circuit board substrate 131 includes, but is not limited to, a PI substrate or a PE substrate.
[0074] Furthermore, in several other embodiments of the present application, a light-transmitting assembly is provided, comprising a first light-transmitting plate, a second light-transmitting plate, and the photoelectric functional film 10 described above. Both the first and second light-transmitting plates may be glass components. The first and second light-transmitting plates are laminated on both sides of the photoelectric functional film 10, and the functional layer 11 is a light-adjusting layer. Specifically, the first and second light-transmitting plates may be bonded to the photoelectric functional film 10 via an adhesive film.
[0075] The light-transmitting assembly using the above solution employs a photoelectric functional film 10, thus significantly reducing the probability of its adjustment and control function failing. Specifically, the external extension 121 functions as a support structure for the flexible circuit board 13, thereby reducing the tensile force applied to the electrical connection points between the electrodes of the flexible circuit board 13 and the conductive layer 123, reducing the probability of the electrodes detaching from the conductive layer 123, and thus more reliably maintaining the adjustment and control function of the photoelectric functional film 10.
[0076] In the description of this application, when terms such as "length," "width," "thickness," and "exterior" appear, the orientation or positional relationship indicated by these terms is the orientation or positional relationship shown in the drawings. These terms are used solely to facilitate or simplify the explanation of this application, and should not be interpreted as indicating or implying that the shown device or component necessarily has a specific orientation or a specific orientational structure and operation. Therefore, they should not be interpreted as limiting this application.
[0077] Furthermore, where terms such as "first," "second," etc., appear, these terms are used solely for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features described. Thus, features limited to "first," "second," etc., may explicitly or implicitly include at least one such feature. In the description of this application, unless otherwise clearly and specifically limited, where the term "plural" appears, the meaning of "plural" is at least two, for example, two, three, etc.
[0078] In this application, unless otherwise specified or limited, terms such as "connection" and "fixed" should be understood in a broad sense. For example, a connection may be fixed, detachable, integral, mechanical, electrical, directly, or indirectly via an intermediate medium. A person skilled in the art will be able to understand the specific meaning of these terms in this application depending on the specific circumstances.
[0079] In this application, unless otherwise specified or limited, when a similar description appears, such as "above" or "below" the first feature of the second feature, it may mean that the first and second features are in direct contact, or that the first and second features are indirectly in contact through an intermediate medium.
[0080] Each of the technical features in the above embodiments can be combined in any way, and for the sake of brevity, not all possible combinations of each of the technical features in the above embodiments are described. However, as long as these combinations of technical features are inconsistent, they should all be considered to fall within the scope described herein.
[0081] The above embodiments illustrate several aspects of the present application, and their descriptions are more specific and detailed, but this should not be understood as limiting the scope of the patent. Furthermore, a person skilled in the art can make various modifications and improvements as long as they do not deviate from the spirit of the present application, and all such modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application should be based on the attached claims. [Explanation of symbols]
[0082] 10 Photoelectric functional film 11 Functional Layers 12 Base material body 121 External extension section 122 Wiring cutout 1221 Fixing notch 1222 Notch for changing direction 123 Conductive layer 1231 Controlled Region 1232 Common electrode area 1233 Polarization Region 1234 conductive area 1235 External extension area 124 Cutout for blocking 13 Flexible circuit board 131 Circuit board base material 132 compartment electrodes 133 Conductive wire 134 Common electrode 14 Silver paste layer 15. Adhesive film for edge filling 16 grooves
Claims
1. It includes a functional layer, at least one substrate body, and a flexible circuit board. The aforementioned functional layer can exhibit different states when the external electric field in which it is placed changes. Each of the substrate bodies is arranged in lamination with the functional layer, and a conductive layer is provided on the surface of at least one of the substrate bodies facing the functional layer or on the surface facing away from the functional layer, and at least one of the substrate bodies further includes an external extension that extends beyond the conductive layer, The photoelectric functional film is characterized in that the electrodes of the flexible circuit board are electrically connected to at least one of the conductive layers, and the circuit board substrate of the flexible circuit board is positioned on the external extension portion.
2. The photoelectric functional film according to claim 1, characterized in that the direction in which the external extension portion extends outside the conductive layer is the width direction of the external extension portion, the width direction of the circuit board substrate coincides with the width direction of the external extension portion, and the width of the external extension portion is 1 / 3 or more of the width of the circuit board substrate.
3. The photoelectric functional film according to claim 1 or 2, characterized in that the external extension portion includes an insulating member.
4. The photoelectric functional film according to any one of claims 1 to 3, characterized in that the external extension portion is provided with a plurality of wiring notches arranged at intervals, each wiring notch penetrates two main sides of the substrate body, and the circuit board substrate is arranged on the external extension portion in a wavy path by sequentially passing through each wiring notch.
5. The conductive layer electrically connected to the electrodes of the flexible circuit board has a plurality of adjustment control regions that are insulated from each other, the flexible circuit board has a plurality of electrodes, one electrode is electrically connected to each of the adjustment control regions, and there is a one-to-one correspondence between the adjustment control regions and the electrodes. The photoelectric functional film according to claim 4, characterized in that the spacing direction in which the plurality of wiring notches are sequentially arranged coincides with the direction in which the plurality of adjustment control regions are sequentially arranged, and of the plurality of wiring notches located between two adjacent electrodes, the one wiring notch closest to the electrode is a direction-changing notch, and the others are fixing notches, and in the fixing notches, the circuit board substrate passes from one side where the conductive layer is provided to the other side, and in the direction-changing notches, the circuit board substrate passes from the other side to the one side where the conductive layer is provided.
6. The photoelectric functional film according to claim 5, characterized in that the width of the fixing notch is greater than the width of the direction-changing notch.
7. The photoelectric functional film according to claim 6, characterized in that the width of the fixing notch is 2 mm to 5 mm, and the width of the direction-changing notch is 2 mm or less.
8. The photoelectric functional film according to any one of claims 5 to 7, characterized in that the distance between two adjacent fixing notches located between two adjacent electrodes is 50 mm to 250 mm, and the distance between the direction-changing notch and the nearest electrode is 15 mm to 75 mm.
9. The multiple adjustment control regions are separated by dividing lines provided in the conductive layer, and at least one of the fixing notches located between two adjacent electrodes is positioned on the extension of the dividing line. The photoelectric functional film according to any one of claims 5 to 8, characterized in that a silver paste layer is provided at the edge of the conductive layer for use in thermocompression bonding and electrical connection of the electrodes, the fixing notch located on the extension of the dividing line extends to the silver paste layer, and the silver paste layers corresponding to different adjustment control regions are divided by the fixing notch.
10. Multiple electrodes are arranged sequentially at intervals along the long side of the circuit board substrate, multiple conductive wires are arranged within the circuit board substrate, each conductive wire is electrically connected to one electrode on a one-to-one basis, each conductive wire is wired along the length direction of the circuit board substrate, and each conductive wire is arranged at intervals in the width direction of the circuit board substrate. The photoelectric functional film according to any one of claims 5 to 9, characterized in that each of the wiring notches is arranged sequentially at intervals along the length direction of the circuit board substrate.
11. The photoelectric functional film according to any one of claims 5 to 10, wherein each electrode electrically connected to the adjustment control region is a partition electrode, the flexible circuit board further has a common electrode, conductive layers are provided on both sides of the functional layer, the conductive layer located on one side of the functional layer has a plurality of adjustment control regions, each partition electrode is connected one-to-one with each adjustment control region, and the common electrode is connected to the conductive layer located on the other side of the functional layer.
12. The photoelectric functional film includes two substrate bodies, each of which is laminated on both sides of the functional layer, and the conductive layer is provided on both of the substrate bodies. The photoelectric functional film according to claim 11, wherein the conductive layer provided on the substrate body on which the external extension portion is provided has a plurality of adjustment control regions, the conductive layer is located on the side of the corresponding substrate body facing the functional layer, and the conductive layer is in direct contact with the functional layer.
13. The photoelectric functional film further comprises an edge sealing adhesive, and the edge sealing adhesive is disposed on the outer surface of the functional layer, characterized in that the photoelectric functional film is according to any one of claims 1 to 12.
14. The aforementioned external extension includes a PET member, a PC member, or a PVC member. and / or, the circuit board substrate includes a PI substrate or a PE substrate. The photoelectric functional film according to any one of claims 1 to 13, characterized in that the circuit board substrate and the external extension are bonded or snap-fitted together.
15. The device includes a functional layer, at least one conductive substrate, and a flexible circuit board. The aforementioned functional layer can exhibit different states when the external electric field in which it is placed changes. The conductive substrate is provided laminated with the functional layer, and each conductive substrate includes a substrate body and a conductive layer provided on the surface of the substrate body facing the functional layer or on the surface facing away from the functional layer, and at least one of the conductive layers is divided into a conductive region and an external extension region which are insulated from each other, the conductive region is located between the functional layer and the substrate body corresponding to it, the external extension region extends outside the functional layer, and the portion of the substrate body covered by the external extension region and the external extension region together constitute an external extension portion. The photoelectric functional film is characterized in that the electrodes of the flexible circuit board are electrically connected to a region of at least one of the conductive layers facing the functional layer, and the circuit board substrate of the flexible circuit board is positioned on the external extension portion.
16. The photoelectric functional film according to claim 15, characterized in that the electrodes of the flexible circuit board are electrically connected to the conductive region, the conductive region and the external extension region belonging to the external extension portion belong to the same conductive layer, the external extension portion is provided with a plurality of wiring notches, each wiring notch penetrates the main body of the conductive substrate and the external extension region of the conductive layer along the thickness direction of the conductive substrate, and the circuit board substrate is arranged on the external extension portion in a wavy path by sequentially passing through each wiring notch.
17. The invention comprises a first light-transmitting plate, a second light-transmitting plate, and a photoelectric functional film according to any one of claims 1 to 16. A light-transmitting assembly characterized in that the first light-transmitting plate and the second light-transmitting plate are laminated on both sides of the photoelectric functional film via an adhesive film, and the functional layer is a light-adjusting layer.