Cooling device for system-on-a-chip

JP2026517683APending Publication Date: 2026-06-02HEWLETT PACKARD DEVELOPMENT COMPANY LP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
HEWLETT PACKARD DEVELOPMENT COMPANY LP
Filing Date
2023-05-17
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing thermal interface materials (TIMs) for system-on-chips (SOCs) face challenges with thermal expansion, leading to stress, cracking, and delamination when rigid materials like metallic TIMs are used, especially in larger SOCs, due to differences in thermal expansion coefficients between the SOC, TIM, and heatsink or cooling manifold.

Method used

A cooling device for SOCs comprising a plurality of cooling units spaced apart and connected by a bridge, allowing independent movement, with rigid TIMs like metallic thermal interface materials, and a flexible seal to manage thermal expansion, combined with a coolant distribution manifold for efficient heat transfer.

Benefits of technology

The solution effectively manages thermal expansion stresses, enabling the use of high thermal conductivity TIMs, reducing the risk of cracking and delamination, and enhancing heat dissipation efficiency through independent movement of cooling units and efficient coolant distribution.

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Abstract

A cooling device for a system-on-chip includes a plurality of cooling units coupled to the system-on-chip via a first side of the plurality of cooling units, and the cooling device includes a plurality of cooling units spaced apart from each other. The cooling device further includes a bridge coupled to a second side of the plurality of cooling units, and the bridge and the plurality of cooling units are arranged to allow independent movement of the individual cooling units of the plurality of cooling units.
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