Unsupervised thickness measurement for non-destructive testing

Cepstrum analysis in ultrasonic NDT systems enables unsupervised thickness measurement and corrosion estimation, addressing user-dependent errors and ensuring reliable and consistent results.

JP2026518024APending Publication Date: 2026-06-03EVIDENT CANADA INC
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Patent Information

Authority / Receiving Office
JP Β· JP
Patent Type
Applications
Current Assignee / Owner
EVIDENT CANADA INC
Filing Date
2024-03-22
Publication Date
2026-06-03

AI Technical Summary

Technical Problem

Existing non-destructive testing (NDT) methods for thickness measurement and corrosion estimation are often user-dependent and prone to errors due to misleading impulse response artifacts, making them unreliable and inconsistent.

Method used

The use of cepstrum analysis to distinguish between different frequency contents in acoustic data signals from ultrasonic probes, allowing for unsupervised thickness measurement and corrosion estimation by identifying echoes from material walls and defects, without the need for manual input of inspection parameters.

Benefits of technology

This approach provides precise, reproducible, and reliable thickness measurements and corrosion estimation, reducing user dependency and ensuring consistent results over time, while minimizing signal interference and operator variability.

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Abstract

This document describes various techniques for unsupervised thickness measurement and corrosion estimation in materials using ultrasonic inspection systems that utilize non-destructive testing (NDT) methods. The system uses cepstrum analysis to analyze the spectral power of the acoustic data signal acquired after the ultrasonic probe assembly emits ultrasound, identifying different frequency contents associated with multiple echoes. Cepstrum analysis allows the system to distinguish between different types of echoes, such as echoes from the front and back walls of the material, as well as echoes from any defects present within the material.
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