Radio frequency aperture with cooling assembly

The RF aperture with a matrix of tapered elements and modular circuits addresses the challenge of capturing a wide range of RF frequencies and maintaining a compact, lightweight form, enhancing RF signal processing efficiency and interference reduction.

JP2026520277APending Publication Date: 2026-06-23BATTELLE MEMORIAL INST
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
BATTELLE MEMORIAL INST
Filing Date
2023-04-26
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

Existing RF apertures face challenges in efficiently capturing a wide range of RF frequencies and maintaining a compact, lightweight design while minimizing RF interference and reflections.

Method used

The RF aperture incorporates a matrix of tapered elements on a circuit board, with adjustable and amplifying circuits, a power supply, and a modular design that allows for selective transmission or reception of RF signals, along with a cooling assembly to manage heat generation.

Benefits of technology

This design achieves broadband RF capture, reduces RF interference, and maintains a small, lightweight form factor, enabling flexible and efficient RF signal processing.

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Abstract

An air interface plane (AIP) for a radio frequency (RF) aperture includes a circuit board having a first side and a second side opposite the first side, and a matrix of tapered elements positioned on the first side of the circuit board and fixed to the circuit board, the matrix of tapered elements cooperating to receive or transmit an over-the-air RF signal. Preferably, each tapered element of the matrix has a central hub extending along the longitudinal axis from a hub base adjacent to the first side of the circuit board to the apex of the tapered element distal to the first side of the circuit board, and a plurality of arms extending from the central hub at the apex of the tapered element, each of the plurality of arms including a first portion projecting radially away from the longitudinal axis and a second portion projecting longitudinally toward the first side of the circuit board.
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