A method for forming a three-dimensional wood grain pattern on the surface of a board, the manufactured board, and its applications.

Abstract

The objective is to provide a method for forming a three-dimensional wood grain layer on the surface of a board material that closely resembles real wood grain in both sight and touch, and to provide a board material manufactured thereby and its applications. Embodiments of this specification relate to the technical field of forming a three-dimensional wood grain layer on the surface of a board material, and more particularly to a method for forming a three-dimensional wood grain on the surface of a board material that closely resembles real wood grain in both sight and touch. This method includes at least the following steps: applying a resin liquid to at least a portion of the surface of an ink layer and solidifying it to form a wood grain base layer; applying at least one layer of resin liquid to at least a portion of the surface of the wood grain base layer; applying a pressing liquid to at least a portion of the surface of the resin liquid along the wood grain pattern of the ink layer to form a pressing layer; solidifying the area of ​​the resin liquid other than the pressing layer, and then removing the pressing layer to form a three-dimensional wood grain layer on the surface of the wood grain base layer. This method makes it possible to form a three-dimensional wood grain layer on the surface of a board material that closely resembles real wood grain in both sight and touch, and can satisfy people's need for a more realistic fusion of sight and touch. The invention also includes a board material manufactured by this method and its applications.

Description

[Technical Field]

[0001] This invention relates to the field of manufacturing surface structures, and more particularly to a method for forming a three-dimensional wood grain pattern on the surface of a sheet material, a sheet material containing a three-dimensional wood grain pattern manufactured by this method, a method for forming the sheet material, and applications of the sheet material. [Background technology]

[0002] Currently, in order to obtain a texture similar to natural wood on the surface of artificial or non-wood panels, printing or printing technology is typically used to create a two-dimensional planar wood grain pattern on the panel surface, thereby satisfying the demand for materials that visually resemble wood.

[0003] For example, the patent with publication number CN 101659073 B discloses a wood grain treatment process for the surface of waterproof flooring substrates. In this process, a simulated wood grain pattern is printed on the surface of a wood-plastic composite floor, and then an abrasion-resistant layer is added on top of the simulated wood grain pattern to protect it and maintain the effect of the wood grain pattern over a long period of time. However, boards with only a two-dimensional planar image printed on the surface are no longer able to meet the demand of people seeking a more realistic combination of sight and touch.

[0004] Therefore, forming a three-dimensional wood grain pattern on the surface of a board that corresponds to a two-dimensional planar image and has a tactile feel similar to wood is currently a widely discussed focus in this field.

[0005] Conventional technologies have proposed several different technical solutions for forming three-dimensional structures on the surface of a substrate, and these conventional methods typically include two types: additive methods and subtractive methods.

[0006] Taking the lamination method as an example, related technologies can be found in the following patents:

[0007] The patent with publication number CN 112455110 A discloses a manufacturing process for wood flooring using inkjet printing. This patent describes how to form a raised, three-dimensional wood grain pattern on the surface of a printed pattern by continuously printing additional ink onto the surface of the pattern. However, actual tests have shown that the molding height is limited because the ink has a certain fluidity before curing, and due to the flow of the resin, the texture angle of the three-dimensional wood grain pattern produced by this lamination method is more rounded compared to natural wood grain. The actual effect is very different from natural wood grain, and it is difficult to achieve the visual effect and tactile feel of natural wood.

[0008] Taking drilling methods as an example, the following patents can be referenced for related technologies:

[0009] The patent with publication number CN 110177691 B discloses a method and apparatus for embossing a substrate using digital printing technology. In this method, an embossing solution is applied to a non-polymerized resin layer, followed by UV curing, subsequent polymerization of the resin, and then the embossing solution is removed to form a three-dimensional surface. The three-dimensional wood grain pattern produced by this method has some improvement in visual effect and tactile feel compared to the lamination method. However, in actual tests, when a three-dimensional wood grain pattern produced by this method is formed on the surface of a wood grain ink layer, the clarity is significantly reduced, specifically resulting in whitening and increased color differences on the surface.

[0010] Patent publication number CN 112996649 A discloses a method for manufacturing a three-dimensional structure on a flat substrate surface, the manufactured substrate, and an apparatus for manufacturing the substrate using this method. In this method, a material for forming wood grain grooves is first dropped onto the substrate surface, then a curable resin is applied to the areas of the substrate surface not covered by the material for forming the wood grain grooves, and after the resin has cured, the material for forming the wood grain grooves is removed, thereby forming wood grain grooves in the cured resin. However, the depth of the wood grain grooves is always the distance between the top surface of the cured resin and the substrate surface, and the depth of each wood grain groove is consistent. In actual wood boards, the depth of the grooves on the surface varies, so the wood grain grooves formed by this technique differ significantly in depth from the actual situation, resulting in an unrealistic problem.

[0011] In short, the dimensions that should typically be considered to measure the similarity between a three-dimensional wood grain pattern and a natural wood grain pattern are: (1) the similarity between the width, narrowness, and depth of the three-dimensional wood grain pattern and the natural wood grain pattern; (2) the degree of correspondence between the three-dimensional wood grain pattern and the underlying two-dimensional planar structure; and (3) the visual effect of the colors presented after the three-dimensional wood grain pattern and the underlying two-dimensional plane are combined. Currently, existing published techniques for forming three-dimensional wood grain patterns often focus on a combination of dimensions (1) and (2).

[0012] Among these, regarding dimension (1), the width and depth of the three-dimensional wood grain pattern can be determined by controlling the amount and position of material used during the formation process of the three-dimensional wood grain pattern. For example, the width of the wood grain pattern is determined by the width of the laminated structure, the extent of the excavation process, or the area of ​​the spread of the embossing liquid. The depth of the three-dimensional wood grain pattern is determined by the upward layering height or the downward excavation intensity. When the difference between the width and depth of the three-dimensional wood grain pattern is more pronounced, the resulting structure is more three-dimensional, and the effect that can be presented to visual and tactile perception is closer to that of natural wood grain.

[0013] Regarding dimension (2), the correspondence between the three-dimensional solid wood grain pattern and the lower two-dimensional planar structure can be achieved by controlling the printing accuracy. For example, it includes control by a computer program and coordinated adjustment between the computer and the forming device. Also, various physical and chemical properties of the material itself, such as its viscosity, surface energy, diffusion coefficient between different materials, etc. are also involved. The higher the correspondence between the three-dimensional solid wood grain pattern and the lower two-dimensional planar structure, the closer the three-dimensional structure approaches the surface wood grain structure of actual natural solid wood.

[0014] Regarding dimension (3), currently, there are not many literatures or technical disclosures regarding the relationship between the three-dimensional structure and the visual effect. In the few technologies available, only the matte or gloss effect of the three-dimensional solid wood grain pattern is included, and no technology that truly achieves the visual effect of the actual wood grain pattern has emerged yet.

[0015] Therefore, in the currently disclosed technologies, there is no precedent for simultaneously considering dimension (3) on the premise of achieving dimensions (1) and (2). Therefore, considering these three dimensions simultaneously is the key to obtaining a texture similar to natural wood on the surface of artificial boards or non-wood boards.

Summary of the Invention

Problems to be Solved by the Invention

[0016] The present invention overcomes the drawback that the method of forming a three-dimensional solid wood grain pattern on the surface of a board in the prior art cannot obtain a texture similar to natural wood, and provides a method of forming a three-dimensional solid wood grain pattern on the surface of a board, the manufactured board, and its uses.

Means for Solving the Problems

[0017] To achieve the above invention objective, the present invention is realized by the following technical solutions:

[0018] From the first perspective, the present invention first provides the following:

[0019] A method of forming a three-dimensional solid wood grain pattern on the surface of a board, including at least the following steps:

[0020] (S.1) A step of covering at least a portion of the surface of a board with ink to form an ink layer having a wood grain pattern;

[0021] (S.2) A step of covering at least a portion of the surface of the ink layer with a resin liquid;

[0022] (S.3) A step of curing at least a portion of the resin liquid on the surface of the ink layer to form a wood grain base layer;

[0023] (S.4) A step of covering at least a portion of the surface of the wood grain base layer with at least one layer of resin liquid;

[0024] (S.5) Applying an embossing liquid to at least a portion of the surface of the resin liquid on the surface of the wood grain base layer along the wood grain pattern of the ink layer, so that the embossing liquid and / or at least a portion of the resin liquid mixed with the embossing liquid and / or at least a portion of the resin liquid covered with the embossing liquid forms an embossed layer;

[0025] (S.6) A step to cure the resin liquid other than the embossed layer formed in the previous step;

[0026] (S.7) A step to remove the embossed layer and form a three-dimensional wood grain layer on the surface of the wood grain base layer.

[0027] Preferably, the amount of resin liquid applied to the surface of the wood grain base layer in step (S.4) is 150 g / m². 2 That's all.

[0028] Preferably, in step (S.4), at least a portion of the surface of the wood grain base layer is covered with at least two layers of resin liquid.

[0029] Preferably, the process of covering at least a portion of the surface of a wood grain base layer with any two adjacent layers of resin liquid includes a transient treatment step in which the application of force to the resin liquid is stopped after the application of the previous layer of resin liquid is completed, and the application of the next layer of resin liquid is performed after the transient treatment step is completed.

[0030] Preferably, in a process of covering at least a portion of the surface of the wood grain base layer with any two adjacent layers of resin liquid, the directions of force applied to the two adjacent layers of resin liquid are opposite.

[0031] Preferably, the plate material completes steps (S.1) through (S.6) in order as it moves and is transported in the fixed direction.

[0032] Preferably, in step (S.5), the embossing liquid is applied to the surface of the resin liquid and / or penetrates downward into the interior of the resin liquid.

[0033] Preferably, the curing method for the resin liquid applied in steps (S.2) and (S.4) is photocuring, thermal curing, or electron beam curing.

[0034] Preferably, the resin liquid contains at least a photocrosslinkable resin and a photoinitiator.

[0035] Preferably, the photocrosslinkable resin includes any or a combination of unsaturated polyester, epoxy resin, acrylic resin, acrylic-modified polyurethane resin, acrylic-modified silicone resin, acrylic-modified epoxy resin, aqueous epoxy acrylate, aqueous polyurethane acrylate, or aqueous polyester acrylate.

[0036] Preferably, the photoinitiator includes one of the following: a free radical polymerization initiator, a cationic polymerization initiator, an energy transfer initiator, or an ionic initiator.

[0037] Preferably, the embossing liquid in step (S.5) includes at least a polymerization inhibitor to prevent polymerization of the resin liquid.

[0038] In this preferred approach, by adding a polymerization inhibitor to the embossing liquid, free radicals generated when the photoinitiator is decomposed by light are eliminated, effectively preventing polymerization in the portion of the resin liquid containing the polymerization inhibitor, and resulting in an easily removable embossed layer.

[0039] Preferably, the resin liquid contains at least a thermosetting resin.

[0040] Preferably, the thermosetting resin includes any or a combination of epoxy resin, phenolic resin, melamineformaldehyde resin, furan resin, unsaturated polyester resin, silicone resin, or polybutadiene resin.

[0041] Preferably, the resin liquid further contains a curing agent.

[0042] Preferably, step (S.4) further includes providing kinetic energy for the embossing liquid to penetrate downward into the resin liquid.

[0043] Preferably, the embossing liquid contains a curable resin.

[0044] Preferably, the curable resin contained in the embossing liquid has a surface energy lower than the surface energy of the three-dimensional wood grain layer after curing.

[0045] Preferably, the curable resin contained in the embossing liquid has a surface energy of less than 100 mN / m after curing.

[0046] Preferably, the curable resin contained in the embossing liquid includes any of the following: a fluororesin, a fluorosilicone resin, or a silicone resin.

[0047] Preferably, the density of the embossing liquid is greater than the density of the resin liquid.

[0048] Preferably, the embossing liquid further comprises a density modifier for adjusting the density of the embossing liquid.

[0049] Preferably, the density modifier is an inorganic solid additive.

[0050] Preferably, the density modifier is nanocalcium carbonate, nanosilicon dioxide, etc.

[0051] Preferably, the embossing liquid comprises at least two different embossing liquids having different surface tensions.

[0052] Preferably, the following are provided in order between the board material and the wood grain sublayer:

[0053] A primer layer to improve the adhesive performance of the surface of a board material;

[0054] A color coating layer provided on the surface of the primer layer to cover the color of the substrate;

[0055] An ink layer located on the surface of the colored paint layer, which forms the wood grain pattern.

[0056] Preferably, the outer surface of the three-dimensional wood grain layer is further covered with a topcoat layer, and at least a portion of the topcoat layer is lower than the upper surface of the three-dimensional wood grain layer.

[0057] In a third aspect, the present invention further provides a method for manufacturing a board material having a three-dimensional wood grain pattern.

[0058] The method includes at least the step of producing a wood grain base layer and a three-dimensional wood grain layer obtained by the above method.

[0059] Preferably, the following steps are further included:

[0060] A step of covering at least a portion of the surface of a board material with a primer and allowing it to harden to obtain a primer layer;

[0061] A step of covering at least a portion of the surface of the primer layer with a color paint and curing it to obtain a color paint layer;

[0062] A step of covering at least a portion of the surface of a color paint layer with wood grain pattern ink and curing it to obtain an ink layer;

[0063] A step of covering at least a portion of the surface of the ink layer with a wood grain base layer and a three-dimensional wood grain layer manufactured by the method described above;

[0064] A step of covering at least a portion of the surface of a three-dimensional wood grain layer with a topcoat and curing it to obtain a topcoat layer.

[0065] Preferably, the amount of primer applied is 10-15 g / m². 2 is;

[0066] The application rate of the color paint is 15-20g / m². 2 is;

[0067] The ink application rate is 6-8 g / m². 2 is;

[0068] The amount of top coat to apply is 20-30g / m². 2 That is the case.

[0069] Preferably, the color coating layer is white.

[0070] Preferably, the color coating comprises at least a photocrosslinkable resin, a photoinitiator, and a white pigment powder.

[0071] In a fourth aspect, the present invention further provides the application of a board material having a three-dimensional wood grain pattern to flooring, decorative wall panels, or ceiling panels.

[0072] Therefore, the present invention has the following beneficial effects:

[0073] (1) The process described in the present invention makes it possible to produce a three-dimensional wood grain pattern on the surface of a board material that is visually and tactilely close to a real wood grain pattern, thereby meeting the demand for a more realistic combination of sight and touch;

[0074] (2) The manufacturing process of the present invention can effectively improve the stability of the color and pattern of the sheet material;

[0075] (3) The sheet material produced by the manufacturing process of the present invention has a higher service life and a lower defect rate. [Brief explanation of the drawing]

[0076] Figure 1 is a schematic diagram of steps (S.1) to (S.7) of the method of the present invention.

[0077] Figure 2 is a schematic diagram of steps (S.6) to (S.8) of Embodiment 1 of the present invention.

[0078] Figure 3 is a schematic diagram of the three-dimensional wood grain pattern structure manufactured in Example 1 of the present invention.

[0079] Figure 4 is a schematic diagram of the top surface structure of the three-dimensional wood grain pattern manufactured in Example 1 of the present invention.

[0080] Figure 5 is a schematic diagram of the three-dimensional wood grain pattern structure manufactured in Comparative Example 1 of the present invention.

[0081] Figure 6 is a schematic diagram of the top surface structure of the three-dimensional wood grain pattern manufactured in Comparative Example 2 of the present invention.

[0082] Figure 7 is a schematic diagram of the three-dimensional wood grain pattern structure manufactured in Comparative Example 3 of the present invention.

[0083] Figure 8 is a schematic diagram of steps (S.6) to (S.8) of Embodiment 2 of the present invention.

[0084] Figure 9 is a schematic diagram of the method of applying a resin liquid to the surface of the wood grain base layer in Comparative Example 4 of the present invention. [Modes for carrying out the invention]

[0085] The present invention will be further described below with reference to the drawings and specific examples in this description. Those skilled in the art can carry out the present invention based on this description. Furthermore, the examples of the present invention mentioned in the following description are usually only a selection of examples of the present invention, not all examples. Accordingly, all other examples that those skilled in the art can obtain without creative effort based on the examples of the present invention are within the scope of protection of the present invention.

[0086] As shown in Figure 1, in a first embodiment of the present invention, the present invention first provides a method for forming a three-dimensional wood grain pattern on the surface of a board material, and includes at least the following steps:

[0087] (S.1) A step of covering at least a portion of the surface of a board with ink to form an ink layer having a wood grain pattern;

[0088] (S.2) A step of covering at least a portion of the surface of the ink layer with a resin liquid;

[0089] (S.3) A step of curing at least a portion of the resin liquid on the surface of the ink layer to form a wood grain base layer;

[0090] (S.4) A step of covering at least a portion of the surface of the wood grain base layer with at least one layer of resin liquid;

[0091] (S.5) Applying an embossing liquid to at least a portion of the surface of the resin liquid on the surface of the wood grain base layer along the wood grain pattern of the ink layer, so that the embossing liquid and / or at least a portion of the resin liquid mixed with the embossing liquid and / or at least a portion of the resin liquid covered with the embossing liquid forms an embossed layer;

[0092] (S.6) A step to cure the resin liquid other than the sacrificial layer formed in the previous step;

[0093] (S.7) A step to remove the embossed layer and form a three-dimensional wood grain layer on the surface of the wood grain base layer.

[0094] In this invention, the principle applied in the process of forming a three-dimensional wood grain pattern on the surface of a board material is the excavation method described in the background art. Compared to the lamination method, the width of the formed texture is controllable, the depth is greater, and the three-dimensional effect is stronger. At the same time, deformation of the wood grain pattern does not occur during the printing process, resulting in high printing accuracy. However, in the conventional process of forming a three-dimensional wood grain pattern using the excavation method, a portion of the ink layer is exposed during the process of removing the embossed layer to obtain the three-dimensional wood grain layer. This exposed ink layer is easily abraded by external forces and may peel off. Therefore, in the process of mechanically removing the embossed layer, it is necessary to consider the downward removal depth, and it is difficult to increase the depth of the three-dimensional wood grain layer in order to prevent abrasion of the ink layer.

[0095] In the process of manufacturing a three-dimensional structure, the present invention first covers the surface of the ink layer with a wood grain base layer obtained by curing a resin liquid, and then forms another three-dimensional wood grain layer on the surface of the wood grain base layer. Due to the presence of the wood grain base layer, the ink layer is not exposed during the process of removing the embossed layer and forming the three-dimensional wood grain layer, and is covered by the wood grain base layer, so the ink layer is not subjected to wear or peeling due to external forces. Therefore, the embossed layer can be excavated downwards to the maximum extent possible during mechanical removal, and the depth of the three-dimensional wood grain layer can be effectively increased.

[0096] Furthermore, in order for the board material containing the three-dimensional wood grain pattern manufactured by this invention to obtain a texture close to that of natural wood, it is necessary to consider not only the wear of the ink layer and the depth of the three-dimensional wood grain layer, but also the correspondence between the bottom ink layer and the upper three-dimensional wood grain layer, that is, the alignment of the two. Regarding the alignment problem, the applicant has found that the following influencing factors cause inaccurate alignment defects between the ink layer and the upper three-dimensional wood grain layer: (1) deformation of the three-dimensional wood grain layer or the ink layer due to shrinkage during the curing of the resin material itself during the manufacturing process of the upper three-dimensional wood grain layer; (2) insufficient compatibility between the embossing liquid and the resin liquid during the manufacturing process of the three-dimensional wood grain layer, resulting in the depth, width, and edge shape of the three-dimensional wood grain layer not meeting expectations. The applicant has found that a texture close to that of natural wood can only be truly obtained after considering the above two factors simultaneously.

[0097] Regarding influencing factor (1), the applicant discovered that during the curing process of the resin layer, the energy (UV or heat) used to cure the resin liquid is usually input from above the resin liquid, causing the upper resin liquid to cure first and the lower resin liquid to cure later. The resin liquid often undergoes a certain volume shrinkage during the curing process, generating internal stress. These internal stresses accumulate downwards and reach their maximum at the very bottom of the resin liquid. At this time, if the resin liquid is in direct contact with the ink layer, and the maximum internal stress exceeds the adhesive force between the ink layer and the surface of the board material, slippage occurs between the ink layer and the surface of the board material, making it difficult for the bottom ink layer and the upper three-dimensional wood grain to align, causing inaccurate alignment problems and significantly affecting the visual effect of the board material. Furthermore, if a large amount of resin liquid is applied above the ink layer, peeling or detachment occurs between the ink layer and the surface of the board material, significantly reducing the product yield.

[0098] Therefore, in order to overcome the above problems, the present invention first covers at least a portion of the surface of the ink layer with a resin liquid, and hardens the resin liquid in this portion first to form a wood grain base layer. At this time, because the amount of resin liquid used in this portion is small, the internal stress generated after hardening is weak and does not affect the relationship between the ink layer and the surface of the board material.

[0099] Since a resin liquid is applied to form a three-dimensional wood grain layer on top of the wood grain base layer and then cured to obtain the three-dimensional wood grain layer, the affinity and adhesive strength between the wood grain base layer and the three-dimensional wood grain layer are strong, so problems of slippage or peeling between them do not occur. Furthermore, since the wood grain base layer has high mechanical strength after curing, the internal stress generated when the three-dimensional wood grain layer hardens is insufficient to deform the wood grain base layer, and the internal stress generated when the three-dimensional wood grain layer hardens is not transmitted to the ink layer located beneath the wood grain base layer. Therefore, by adding step (S.3), it is possible to some extent to prevent the occurrence of inaccurate alignment problems between the three-dimensional wood grain layer and the ink layer in subsequent steps (S.4) to (S.7).

[0100] Regarding influencing factor (2), it is necessary to further improve the compatibility between the embossing liquid and the resin liquid, and to improve the morphological stability of the embossed layer formed after the embossing liquid enters the resin liquid. In this regard, conventional technology employed a step of adding the embossing liquid to an incompletely cured resin layer. However, actual test results showed that the viscosity of the incompletely cured resin layer itself is high, making it difficult for the embossing liquid to enter the resin layer. This results in the following problems: (1) The embossing liquid penetrates to a low depth into the resin layer, resulting in a shallow wood grain pattern and poor three-dimensional effect of the overall three-dimensional wood grain layer; (2) The viscosity of the incompletely cured resin layer is high, causing the embossing liquid to accumulate on the surface of the incompletely cured resin layer after application, and the embossing liquid to diffuse easily on the surface of the resin layer, resulting in the shape and width of the final wood grain pattern not matching the underlying ink layer, causing inaccurate alignment problems; (3) The fluidity of the incompletely cured resin layer is low, making it difficult to mix with the embossing liquid in a short time, resulting in the edges of the formed three-dimensional wood grain layer being more blurred and not sharp, with a clear difference from the structure of a natural wood grain pattern; (4) The viscosity of the incompletely cured resin layer itself is high, so the viscosity of the embossed layer obtained after mixing with the embossing liquid is also relatively high. In the subsequent hardening process, the embossed layer cannot be completely cured, but its viscosity increases. This makes it difficult to completely remove the high-viscosity embossed layer in the mechanical removal process, resulting in residue and causing the wood grain texture to become indistinct and blurry, further widening the difference between its texture and that of actual natural wood material.

[0101] Therefore, the present invention not only adds step (S.3) to the manufacturing process, but also adopts a technical solution of directly applying the embossing liquid to the surface of the uncured resin liquid in the manufacturing process (i.e., step (S.5)). Compared to applying the embossing liquid to the semi-cured resin layer, this change in step brings the following beneficial effects: (1) Because the viscosity of the uncured resin liquid itself is low, it has good fluidity and, after applying the embossing liquid to the resin liquid, it can smoothly enter the resin liquid downwards, greatly improving the depth of the manufactured wood grain pattern and effectively enhancing the three-dimensional effect of the three-dimensional wood grain layer. (2) Because the embossing liquid can penetrate downwards into the interior of the resin liquid, diffusion of the embossing liquid on the surface of the uncured resin liquid is avoided, and the shape and width of the wood grain pattern that is finally formed match the ink layer below, effectively improving the accuracy of alignment. (3) Because the mixing effect of the resin liquid and the embossing liquid is good, the edges of the embossing liquid or the embossed layer obtained by mixing the embossing liquid and the resin liquid are more orderly and sharp, and the manufactured three-dimensional wood grain layer is closer to a natural wood grain pattern. (4) The embossed layer obtained by mixing the embossing liquid or the embossing liquid with the resin liquid has low viscosity even after hardening, is easy to remove after hardening, and leaves no residue after the embossed layer is removed, so the resulting wood grain pattern is cleaner and has sharper edges.

[0102] Therefore, in the present invention, by employing a means of combining step (S.3) and step (S.5), the roles and characteristics of the wood grain base layer, resin liquid, and embossing liquid are interconnected, effectively overcoming the problems in the conventional technology where the morphological structure of the three-dimensional wood grain layer differs significantly from that of natural wood grain patterns, and the problem of inaccurate alignment between the three-dimensional wood grain layer and the underlying ink layer.

[0103] Furthermore, generally speaking, covering the surface of the ink layer with another resin layer that has a transparent effect reduces the clarity of the surface of the board material to a certain extent from a visual standpoint, and the degree of reduction in clarity increases with increasing thickness or number of resin layers on the surface of the ink layer. However, the applicant has surprisingly discovered that, by the method of the present invention, after adding a wood grain base layer to the bottom of the three-dimensional wood grain layer, the problem of clarity is actually improved to a certain extent.

[0104] As a result of research on this, the applicant discovered that after forming a three-dimensional wood grain layer on the surface of the ink layer, a visual micro "lens" effect can be formed, bringing about a certain magnifying effect on the underlying pattern. However, when the three-dimensional wood grain layer is directly attached to the ink layer, the visual effect causes a certain degree of blur due to the focal length, resulting in a decrease in sharpness. In this application, by first providing a wood grain base layer under the three-dimensional wood grain layer, it plays a role in adjusting the focal length of the three-dimensional wood grain layer, effectively improving the sharpness of the wood grain pattern.

[0105] Therefore, in short, by the method of this application, it is possible to obtain a three-dimensional wood grain pattern board with a strong three-dimensional sense, more accurate alignment with the ink layer, and a texture close to that of actual natural wood materials.

[0106] In another preferred embodiment of the present invention, the amount of the resin liquid applied to the surface of the wood grain base layer in step (S.2) is 40 - 50 g / m 2 is.

[0107] In another preferred embodiment of the present invention, the amount of the resin liquid applied to the surface of the wood grain base layer in step (S.4) is 150 g / m 2 or more.

[0108] The applicant discovered through actual exploration that in order to approximate the three-dimensional wood grain pattern on the surface of the board to the feel of natural wood, it is necessary to control the application amount of the resin liquid used to form the three-dimensional wood grain pattern. As a result of testing, it was found that only when the total application amount of the resin liquid used for the wood grain base layer and the three-dimensional wood grain layer exceeds 200 g / m 2 can the formed texture achieve a feel close to that of natural wood and provide better abrasion resistance. However, when applying more than 200 g / m 2 of the resin liquid at once, the bottom of the wear-resistant layer becomes difficult to cure instantaneously, the bonding force between the three-dimensional wood grain pattern and the ink layer on the board surface decreases, and peeling easily occurs between the three-dimensional wood grain pattern and the substrate.

[0109] To achieve smooth curing of large quantities of resin liquid and improve the bonding strength between the three-dimensional wood grain pattern and the board material, it is necessary to increase the curing power used during curing. However, providing high power generates more waste heat during the curing process, and this waste heat causes deformation of the board material and yellowing and aging of the resin liquid, making this method of increasing curing power impractical.

[0110] The applicant, through research on hardened three-dimensional wood grain patterns, discovered that the three-dimensional wood grain pattern contains two functional zones in the vertical direction: (1) a bonding zone for bonding with the board material, i.e., the wood grain base layer of the present invention; and (2) a functional zone for forming the three-dimensional structure, i.e., the three-dimensional wood grain layer of the present invention. The wood grain base layer has low requirements for the amount of resin used, but the three-dimensional wood grain layer requires at least 150 g / m², according to the applicant's calculations. 2 Anything less than this would not achieve a feel close to natural wood and excellent wear resistance.

[0111] Therefore, in this application, a first layer of resin liquid is applied to the surface of the board material and cured to obtain a wood grain base layer. Because a small amount of resin liquid is used to form the wood grain base layer, it can be completely cured with conventional curing power, the bonding strength between the wood grain base layer and the board material is effectively improved, and peeling problems do not occur during use. Subsequently, the total amount of resin applied to the surface of the wood grain base layer to create the overall three-dimensional wood grain pattern is 150 g / m². 2 By increasing the number of elements to this extent, the three-dimensional effect of the wood grain pattern is guaranteed.

[0112] In another preferred embodiment of the present invention, in step (S.4), at least a portion of the surface of the wood grain base layer is covered with at least two layers of resin liquid.

[0113] In another preferred embodiment of the present invention, the process of covering at least a portion of the surface of a wood grain base layer with any two adjacent layers of resin liquid includes a transient treatment step of stopping the application of force to the resin liquid after the application of the previous layer of resin liquid is completed, and then applying the next layer of resin liquid after the transient treatment step is completed.

[0114] As described above, in order to guarantee the three-dimensional appearance of the wood grain pattern, this application applies at least 150 g / m² to the surface of the wood grain base layer. 2 The above resin liquid must be applied. Therefore, the focus of this application is on applying a resin coating of 150 g / m² to the surface of the wood grain base layer. 2 Now we move on to the method for forming the three-dimensional wood grain layer described above.

[0115] Currently, the most common method for applying resin liquid is application using a roll coating machine. The applicant previously applied 150g / m² at a time to the wood grain base layer. 2 We attempted to apply the resin liquid as described above, but found that this single application method requires loading an excessive amount of resin liquid onto a single roller. When using conventional rollers, loading too much resin liquid causes it to flow down, making normal production impossible.

[0116] Therefore, in order to solve the above problem, the present invention employs a dispersion coating method using two rollers, with each roller applying one layer of resin liquid, so that the total amount of resin in the two layers is 150 g / m². 2 The goal is to achieve the above. This method reduces the resin load pressure on each roller while enabling the application of a large amount of resin.

[0117] Conventional technology typically uses a roll coating machine with two parallel rollers to achieve multi-roller coating. The two rollers of a roll coating machine usually employ a combination of a forward roller and a reverse roller. The first roller applies the resin liquid to the surface of the sheet material and pushes the substrate forward, generating a constant force in the direction of sheet material transport on the sheet material and the uncured resin liquid layer attached to the sheet material surface. This force, combined with the brush structure on the roller surface, causes a certain deformation on the resin liquid surface. Then, before the first layer of resin liquid becomes smooth, the second roller takes over the sheet material coated with the uncured resin liquid and generates a force in the opposite direction to the sheet material transport direction on the uncured resin liquid, which also causes deformation in the reverse direction on the applied second layer of resin liquid. At the same time, because a certain speed difference exists between the second and first rollers, the deformation between the first and second layers of resin liquid is not canceled out. On the contrary, the deformation of the two layers of resin liquid accumulates with each other, further worsening the appearance of traces on the resin liquid. After curing, these traces become fixed and have a significant impact on the visual effect of the final product. The occurrence of such traces causes obvious defects in the appearance of finished products, especially those with relatively shallow textures, and when viewed from a distance, a break can be seen in the center of the area where the resin liquid has been applied.

[0118] Therefore, building upon the foundation of existing roll coating machines, the present invention adds a transient treatment step to the process of covering at least a portion of the surface of a wood grain base layer with any two adjacent layers of resin, in which the application of force to the resin is stopped. In this method, as the board passes through the first roller, after the first roller has finished applying force to the entire board, the board is no longer subjected to force before being conveyed to the second roller, which is beneficial for smoothing the first layer of resin over a longer distance. At this time, the board is coated from start to finish by the second roller. At this time, the deformation of the second layer of resin is small, allowing for rapid smoothing before hardening and eliminating the influence of the force and speed difference between the two rollers on the surface morphology.

[0119] In another preferred embodiment of the present invention, in a process of covering at least a portion of the surface of a wood grain sublayer with any two adjacent layers of resin, the directions of force applied to the two adjacent layers of resin are opposite.

[0120] From the above discussion, it can be seen that a roll coating machine generates a certain force in the resin liquid during roll coating. Since the resin liquid usually contains high-molecular-weight polymers or prepolymers with long molecular chain segments, it generates a certain elastic deformation and orientation force under external force. Because the overall process time from application to curing of the resin liquid is short, the molecular chain segments of the high-molecular-weight polymer in the resin liquid solidify before returning to their initial state, generating a large internal stress in the center of the cured three-dimensional wood grain layer, making the center of the cured three-dimensional wood grain layer prone to cracking. Therefore, in order to reduce the generation of internal stress in the center of the three-dimensional wood grain layer, the present invention specially adjusts the direction of the forces acting on two adjacent layers of resin liquid by two rollers in a process of covering at least a portion of the surface of the wood grain base layer with any two adjacent layers of resin liquid, and provides a force opposite to its internal stress to the uncured second wear-resistant layer during the operation of the second roller, thereby weakening or canceling out the internal stress originally present in the three-dimensional wood grain layer and reducing the probability of cracking occurring in the center of the cured three-dimensional wood grain layer.

[0121] In another preferred embodiment of the present invention, the plate material completes steps (S.1) through (S.6) in order as it moves and is transported in a fixed direction.

[0122] In another preferred embodiment of the present invention, the embossing liquid in step (S.5) is applied to the surface of the resin liquid and / or penetrates downward into the interior of the resin liquid.

[0123] In this application, there are multiple principles for forming an embossed layer by adding an embossing liquid to the surface of a resin liquid, and are not limited to the UV shielding method, the free radical absorption method, or the volume occupancy method.

[0124] Among these methods, the UV shielding method is applied to UV-curing resin liquid. The principle is to cover the surface of the uncured resin liquid with a layer of embossing liquid that prevents UV transmission. The resin liquid located beneath the embossing liquid remains in a liquid, uncured state, and this uncured resin liquid forms the embossing layer, which is removed in subsequent processing steps by mechanical cleaning or solution cleaning to obtain a three-dimensional wood grain layer with an imitation wood grain structure.

[0125] The free radical absorption method is applied to resin liquids based on the free radical polymerization principle. This principle involves absorbing free radicals used in the polymerization of the resin liquid by penetrating downwards into or onto the surface of the uncured resin liquid, thereby carrying out free radical polymerization and curing. The portion of the resin liquid containing the embossing liquid remains in a liquid, uncured state, and this portion of the uncured resin liquid forms an embossed layer, which is removed in subsequent processing steps by mechanical or solution washing to obtain a three-dimensional wood grain layer with an imitation wood grain structure.

[0126] The volume occupancy method refers to the process where, as the embossing liquid penetrates downward into the uncured resin liquid, it pushes out the uncured resin liquid, and the volume of this pushed-out portion contains only the embossing liquid, which may or may not be polymerizable. Finally, the embossing liquid is washed away by mechanical or solvent cleaning to obtain a three-dimensional wood grain layer with an imitation wood grain structure.

[0127] In another preferred embodiment of the present invention, the method for curing the resin liquid applied in steps (S.2) and (S.4) is photocuring, thermocuring, or electron beam curing.

[0128] In another preferred embodiment of the present invention, the resin liquid comprises at least a photocrosslinkable resin and a photoinitiator.

[0129] In another preferred embodiment of the present invention, the photocrosslinkable resin includes any or a combination of unsaturated polyester, epoxy resin, acrylic resin, acrylic-modified polyurethane resin, acrylic-modified silicone resin, acrylic-modified epoxy resin, aqueous epoxy acrylate, aqueous polyurethane acrylate, or aqueous polyester acrylate.

[0130] In another preferred embodiment of the present invention, the photoinitiator includes any of a free radical polymerization initiator, a cationic polymerization initiator, an energy transfer initiator, or an ionic initiator.

[0131] In another preferred embodiment of the present invention, the embossing liquid in step (S.5) includes at least a polymerization inhibitor to prevent polymerization of the resin liquid.

[0132] In this preferred approach, adding a polymerization inhibitor to the embossing liquid eliminates free radicals generated by the photodegradation of the photoinitiator, effectively preventing polymerization in the portion of the resin liquid containing the polymerization inhibitor, or reducing the curing rate of the portion of the resin liquid containing the polymerization inhibitor, so that the portion of the resin liquid containing the polymerization inhibitor remains in a liquid or semi-solid state even after the completion of step (S.6), making the embossed layer easier to remove.

[0133] In another preferred embodiment of the present invention, the resin liquid comprises at least a thermosetting resin.

[0134] In another preferred embodiment of the present invention, the thermosetting resin includes any or a combination of epoxy resins, phenolic resins, melamineformaldehyde resins, furan resins, unsaturated polyester resins, silicone resins, and polybutadiene resins.

[0135] In another preferred embodiment of the present invention, the resin liquid further comprises a curing agent.

[0136] In another preferred embodiment of the present invention, step (S.4) further includes providing kinetic energy for the embossing liquid to penetrate downward into the resin liquid.

[0137] After the embossing liquid is applied to the surface of the uncured resin liquid, it may not be able to penetrate quickly into the interior of the uncured resin liquid, which in some embodiments causes a problem of insufficient depth in the three-dimensional wood grain pattern. Therefore, in order to make the three-dimensional wood grain pattern have a stronger sense of depth, the applicant proposes to solve this technical problem by increasing the downward penetration speed of the embossing liquid. The applicant has found that by providing kinetic energy to the embossing liquid, it can enter the interior of the uncured resin liquid at a faster speed or with greater kinetic energy, thereby increasing the depth of the three-dimensional wood grain pattern.

[0138] In another preferred embodiment of the present invention, the embossing liquid includes a curable resin.

[0139] The curable resin contained in the embossing liquid includes acrylic resin, epoxy resin, or other curable resins.

[0140] In another preferred embodiment of the present invention, the curable resin contained in the embossing liquid has a surface energy after curing that is lower than the surface energy of the three-dimensional wood grain layer.

[0141] In some preferred solutions of the present invention, the compression solution contains a resin with a lower surface energy than the three-dimensional wood grain layer, which weakens the adhesion to the three-dimensional wood grain layer after curing, allowing the compression solution to be easily removed by mechanical or solvent cleaning after curing.

[0142] In another preferred embodiment of the present invention, the curable resin contained in the flower pressing solution has a surface energy of less than 100 mN / m after curing.

[0143] In another preferred embodiment of the present invention, the curable resin contained in the flower pressing solution includes any of a fluororesin, a fluorosilicone resin, or a silicone resin.

[0144] In another preferred embodiment of the present invention, the density of the compressed flower solution is greater than the density of the resin solution.

[0145] In addition to actively providing kinetic energy to the compressed flower solution as described above, the applicant proposes further improving the downward penetration rate of the compressed flower solution into the uncured resin liquid by passively increasing the kinetic energy of the compressed flower solution in some preferred solutions of the present invention. For example, by adjusting the density of the compressed flower solution, the density of the compressed flower solution is made greater than that of the resin liquid. After applying an equivalent volume of the compressed flower solution to at least a portion of the surface of the uncured resin liquid, the mass of the compressed flower solution increases, the kinetic energy when it enters the uncured resin liquid increases, and the depth of the three-dimensional wood grain layer formed as a result becomes greater. At the same time, after the high-density compressed flower solution enters the resin liquid, it becomes easier for it to rapidly enter the uncured resin liquid downward due to the action of gravity.

[0146] In another preferred embodiment of the present invention, the pressed flower solution further comprises a density modifier for adjusting the density of the pressed flower solution.

[0147] In another preferred embodiment of the present invention, the density modifier is an inorganic solid powder additive.

[0148] In another preferred embodiment of the present invention, the density modifier is an inorganic solid additive such as calcium carbonate or silicon dioxide.

[0149] In another preferred embodiment of the present invention, the flower press solution comprises flower press solutions having at least two different surface tensions.

[0150] As mentioned in the background technology section, in order for a three-dimensional structure to achieve a texture similar to actual wood, in addition to the depth mentioned above, another important point is how to control the width of the three-dimensional structure. Currently, the control of the width of the three-dimensional structure is mainly based on the amount of compressed liquid sprayed. Generally, the larger the amount of compressed liquid sprayed or the larger the individual droplet of compressed liquid, the wider the grooves in the wood grain pattern become, and the smaller the amount of compressed liquid sprayed or the smaller the droplet of compressed liquid, the narrower the grooves in the wood grain pattern formed.

[0151] However, the above plan has the following two problems:

[0152] (1) In order to form a wider three-dimensional wood grain pattern, more pressing solution needs to be added. Since the pressing solution needs to be removed in the final step, adding more pressing solution will result in more wasted pressing solution.

[0153] (2) In order to form a narrower three-dimensional wood grain pattern, it is necessary to add a smaller amount of the pressing solution, but this may result in the depth of the three-dimensional wood grain pattern becoming too small, leading to a lack of precision and defects that make the three-dimensional wood grain pattern look unnatural.

[0154] To address the above problem, this invention proposes a solution in which materials with different tensions are selected for the compression solution used to form a wider three-dimensional wood grain pattern and for the compression solution used to form a narrower three-dimensional wood grain pattern.

[0155] When using a compression solution with lower tension, it spreads more easily on the surface of the abrasion-resistant layer. In this case, the contact angle between the compression solution with lower tension and the abrasion-resistant layer becomes smaller, and the area over which it spreads increases even with the same volume. Therefore, a wider three-dimensional wood grain pattern can be achieved with less compression solution.

[0156] On the other hand, when using a highly tensile pressure solution, it becomes difficult for the solution to spread on the surface of the abrasion-resistant layer. In this case, the contact angle between the highly tensile pressure solution and the abrasion-resistant layer increases, resulting in a higher droplet height for the same volume. Therefore, by using a small amount of highly tensile pressure solution, a finer and deeper three-dimensional wood grain pattern can be obtained.

[0157] In another preferred embodiment of the present invention, the amount of ink applied to the surface of the plate material in step (S.1) is 6-8 g / m². 2 That is the case.

[0158] In another preferred embodiment of the present invention, the amount of resin liquid applied to the surface of the wood grain sublayer in step (S.2) is 30-50 g / m². 2 That is the case.

[0159] From a second perspective, another preferred embodiment of the present invention provides a board material having a three-dimensional solid wood grain pattern, comprising the board material,

[0160] The surface of the board material includes a wood grain underlayer and a three-dimensional wood grain layer manufactured by the method described above.

[0161] In another preferred embodiment of the present invention, the following are provided in order between the board material and the wood grain underlayer:

[0162] A primer layer to improve the adhesive performance of the surface of a board material;

[0163] A color coating layer provided on the surface of the primer layer to cover the color of the substrate;

[0164] An ink layer located on the surface of the colored paint layer, which forms the wood grain pattern.

[0165] In another preferred embodiment of the present invention, the outer surface of the three-dimensional wood grain layer is further covered with a topcoat layer, at least a portion of which is lower than the upper surface of the three-dimensional wood grain layer.

[0166] As a third aspect, another preferred embodiment of the present invention provides a method for manufacturing a board material having the three-dimensional wood grain pattern described above,

[0167] The process includes the step of producing a wood grain base layer and a three-dimensional wood grain layer manufactured by at least the method described above.

[0168] Another preferred embodiment of the present invention further includes the following steps:

[0169] A step of covering at least a portion of the surface of a board material with a primer and allowing it to harden to obtain a primer layer;

[0170] A step of covering at least a portion of the surface of the primer layer with a color paint and curing it to obtain a color paint layer;

[0171] A step of covering at least a portion of the surface of a color paint layer with wood grain pattern ink and curing it to obtain an ink layer;

[0172] A step of covering at least a portion of the surface of the ink layer with a wood grain base layer and a three-dimensional wood grain layer manufactured by the method described above;

[0173] A step of covering at least a portion of the surface of a three-dimensional wood grain layer with a topcoat and curing it to obtain a topcoat layer.

[0174] In another preferred embodiment of the present invention,

[0175] The amount of primer to apply is 10-15 g / m². 2 is;

[0176] The amount of color paint to apply is 15-20g / m². 2 is;

[0177] The amount of top coat to apply is 20-30g / m². 2 That is the case.

[0178] In another preferred embodiment of the present invention, the color coating layer is white.

[0179] In another preferred embodiment of the present invention, the color coating comprises at least a photocrosslinkable resin, a photoinitiator, and a white pigment powder.

[0180] In a fourth aspect, the present invention further provides the application of the board material having the three-dimensional wood grain pattern described above to flooring, decorative wall panels, or ceiling panels.

[0181] The following examples are for illustrative purposes only and are not intended to limit the scope of protection as defined by the appended claims.

[0182] Example 1

[0183] The method for forming a three-dimensional wood grain pattern on the surface of a board includes the following steps:

[0184] (S.1) Place an SPC sheet material with a length, width, and thickness of 1260mm x 970mm x 4.85mm, respectively, on the surface of a conveying device that moves in the fixed direction;

[0185] (S.2) The SPC sheet material first passes through the first roll coating machine during transport. The surface of the coating roller of this roll coating machine is coated with a photocurable primer (primer components: 90% photocurable clear varnish HYS01-1, 5% photoinitiator 184, 0.5% photoinitiator TPO, 4.5% diluent hydroxyethyl acrylate), and during the contact process between the SPC sheet material and the coating roller, 12 g / m 2 The primer was applied to the surface of the SPC board material, and the wavelengths were 395 nm and 8 W / cm². 2 Curing with a UV lamp forms a primer layer;

[0186] (S.3) The SPC sheet material obtained in the previous step is passed through the second roll coating machine again. The surface of the coating roller of this roll coating machine is coated with a photocurable white paint (white paint components: 50% photocurable epoxy HYS01-1, 30% titanium dioxide, 5% photoinitiator 184, 0.5% photoinitiator TPO, 14.5% diluent hydroxyethyl acrylate), and during the contact process between the SPC sheet material and the coating roller, 18 g / m 2 Apply the white paint to the primer surface, at 395 nm and 8 W / cm². 2 Curing with a UV lamp yields a white color paint layer;

[0187] (S.4) The SPC board material obtained in the previous step is transported to the first inkjet printer and coated with 6-8 g / m² of color paint on the surface. 2 The ink is sprayed and cured to form a wood grain patterned ink layer on the surface of the primer layer;

[0188] (S.5) The SPC sheet material obtained in the previous step is transported to the third roll coating machine and coated with 45 g / m² of ink on the surface. 2A photocurable resin liquid (resin liquid components: 90% Dow Corning 65 Additive, 5% photoinitiator 184, 0.5% photoinitiator TPO, 4.5% diluent hydroxyethyl acrylate) was roll-coated and exposed to light at 395 nm and 8 W / cm². 2 UV lamp and 160w / cm 2 The wood grain base layer is formed by sequentially irradiating and curing with an Hg lamp;

[0189] (S.6) The SPC board material obtained in the previous step is transported to the fourth roll coating machine, and the coating rollers of the fourth roll coating machine coat the wood grain sublayer surface at 80 g / m² along the transport direction of the SPC board material (the rollers themselves rotate clockwise). 2 The resin liquid (resin liquid components: 90% Dow Corning 65 Additive, 5% photoinitiator 184, 0.5% photoinitiator TPO, 4.5% diluent hydroxyethyl acrylate) is roll-coated;

[0190] (S.7) After applying the first layer of resin liquid, the SPC sheet material is conveyed forward along the surface of the conveying device, and before being conveyed to the next roll coating machine, the fourth roll coating machine is prevented from applying any force to the resin liquid;

[0191] (S.8) The SPC sheet material obtained in the previous step is transported to the fifth roll coating machine, and the coating rollers of the fifth roll coating machine are applied at 75 g / m² in the opposite direction to the transport direction of the SPC sheet material (the rollers themselves rotate clockwise). 2 The resin liquid is roll-coated;

[0192] Figure 2 shows a schematic diagram of steps (S.6) to (S.8) of this embodiment, which will help to better understand these three steps;

[0193] (S.9) The SPC sheet material obtained in the previous step is transported to the second inkjet printer and 6-8 g / m² of resin liquid is applied to the surface. 2The flower condensate (flower condensate components: 45.5% diacrylate monomer PEG600DA, 20.5% p-hydroxyanisole HQMME, 10% 2-tert-butylhydroquinone MTBHQ, 24% diethylene glycol butyl ether) is sprayed, and the flower condensate penetrates downward into the resin solution and mixes with the resin solution to form a flower condensate layer;

[0194] (S.10) The portion of the resin liquid on the surface of the SPC plate obtained in the previous step, excluding the compressed layer, is treated with 395 nm and 8 W / cm². 2 UV lamp and 160w / cm 2 The material is cured deeply by sequentially irradiating it with an Hg lamp;

[0195] (S.11) The SPC board material obtained in the previous step is transported to a washing device including a steel brush, and the compressed layer is removed with the steel brush to form a three-dimensional wood grain layer;

[0196] (S.12) The SPC sheet material obtained in the previous step is coated in the 6th roll coating machine at 395 nm and 8 W / cm². 2 Passed through a UV ultraviolet lamp, 12g / m² is applied to the surface of the three-dimensional wood grain layer. 2 Apply the first topcoat and cure it to obtain the first topcoat layer;

[0197] (S.13) The SPC sheet material obtained in the previous step is coated in the 7th roll coating machine at 395 nm and 8 W / cm². 2 Passed through a UV ultraviolet lamp, 12g / m² was applied to the surface of the first topcoat layer. 2 The second topcoat is applied and cured to obtain the second topcoat layer.

[0198] The surface of the three-dimensional solid-structured plate material manufactured in Example 1 was analyzed using a laser contour meter to obtain Figures 3 and 4. Figure 3 is a schematic diagram of the three-dimensional solid-grain structure, and Figure 4 is a schematic diagram of the top surface structure of the three-dimensional solid-grain structure.

[0199] Comparative Example 1

[0200] Comparative Example 1 is basically the same as Example 1, the only difference being that step (S.5) was omitted in Comparative Example 1, so the resulting three-dimensional structure does not include a wood grain underlayer. Figures 5 and 6 are schematic diagrams of the three-dimensional structure and top surface structure of the three-dimensional wood grain pattern produced in Comparative Example 1 of the present invention, respectively. From the figures, it can be seen that the average depth of the formed wood grain pattern is lower after omitting step (S.5).

[0201] Comparative Example 2

[0202] Comparative Example 2 is basically the same as Example 1 in steps, the only difference being that in step (S.5), the resin liquid is not completely cured, but only allowed to gel.

[0203] Comparative Example 3

[0204] Comparative Example 3 is basically the same as Example 1 in steps, the only difference being that after step (S.8), the resin liquid was irradiated with ultraviolet light to obtain a gel-like resin layer that did not fully harden. Figure 7 is a schematic diagram of the three-dimensional structure of the three-dimensional wood grain pattern produced in Comparative Example 3 of the present invention. From the figure, it can be seen that the depth of the three-dimensional wood grain pattern obtained in Comparative Example 3 is lower and the edges are less distinct.

[0205] Product testing:

[0206] Surface abrasion resistance test: Tested according to standard GT / T 18102-2020.

[0207] Surface scratch resistance index test: Tested according to standard GT / T 18102-2020.

[0208] Clarity test: Tested according to standard JIS K7374.

[0209] Product Acceptance Rate Test: Fifty sheets of material were produced in batches according to the methods of Example 1, Comparative Example 1, and Comparative Example 2 described above. The sheets were observed for cracks and delamination, and the initial warp and heated warp of the sheets were measured. The product acceptance rate was then statistically calculated. The results are shown in Table 1. Sheets with visible quality problems and sheets with a heated warp exceeding 1 mm / m were recorded as unacceptable.

[0210] Alignment accuracy test: Visually inspect the alignment accuracy and check for any misalignment, shadowing, or damage.

[0211] Warping test: Cut the sheet material into 240mm x 240mm samples, place them on an aluminum plate with the abrasion-resistant layer facing upwards, and leave them for 24 hours under conditions of 23±2℃ and 50±5%RH. Measure the average initial warp of the sheet material with a caliper. Adjust the temperature of the constant-temperature drying oven to 80℃, place the samples together with the aluminum plate in the oven for 6 hours, then remove the samples together with the aluminum plate and leave them for 24 hours under conditions of 23±2℃ and 50±5%RH. Measure the average heated warp of the sheet material with a caliper.

[0212] The results of the board performance tests for Example 1 and Comparative Examples 1-3 are shown in Table 1 below:

[0213] Table 1 Performance Test Results [Table 1]

[0214] Example 2

[0215] Example 2 is basically the same as Example 1 in terms of steps, the only difference being the change in the resin liquid application method in steps (S.6) to (S.8). As shown in Figure 8, in this example, a spray method is used in steps (S.6) and (S.8), and the resin liquid is sequentially sprayed onto the surface of the wood grain base layer. During the spraying process, a certain angle is formed between the nozzle and the SPC board material.

[0216] In this process, in step (S.6), the nozzle forms a constant angle with respect to the conveying direction of the SPC sheet material (in this embodiment, an acute angle of 30° between the nozzle and the conveying direction of the SPC sheet material), and in step (S.8), the nozzle forms a constant angle along the conveying direction of the SPC sheet material (in this embodiment, an obtuse angle of 150° between the nozzle and the conveying direction of the SPC sheet material).

[0217] Example 3

[0218] Example 3 is basically the same as Example 1 in terms of steps, the only difference being that the components of the resin liquid and the curing method were changed in steps (S.5) to (S.8).

[0219] The resin liquid components can be selected from a thermosetting resin system, specifically as follows:

[0220] Resin (Bisphenol A type epoxy resin E-51) 100 parts;

[0221] Hardener (methyltetrahydrophthalic anhydride) 30 parts;

[0222] Reactive diluent (butyl glycidyl ether BGE) 15 parts;

[0223] Accelerator (DMP30) 10 parts.

[0224] After applying the thermosetting resin system obtained by mixing the above formulation to the surface of the SPC sheet material, the ambient temperature of the SPC sheet material is raised to 140°C by infrared heating to cure the thermosetting resin system.

[0225] The results of the board material performance test for Example 3 are shown in Table 2 below;

[0226] Table 2 Performance test results; [Table 2]

[0227] Example 4;

[0228] Example 4 is essentially the same as Example 1, the only difference being the change in the composition of the pressed flower solution in step (S.9);

[0229] In this embodiment, the compressed resin is a polytetrafluoroethylene emulsion with a solid content of 60%. After applying the polytetrafluoroethylene emulsion to the resin solution, it penetrates downwards into the resin solution. Since the polytetrafluoroethylene emulsion is aqueous, it does not mix with the resin solution after penetration. After the resin solution hardens, some of the water in the polytetrafluoroethylene emulsion evaporates due to heat, forming a polytetrafluoroethylene layer. Because the surface energy of the polytetrafluoroethylene layer is less than 100 mN / m, it does not adhere to the hardened resin solution, making removal easy.

[0230] Example 5;

[0231] Example 5 is basically the same as the steps of Example 4, the only difference being that when applying the compressed flower solution (60% solid polytetrafluoroethylene emulsion) to the resin solution, the injection rate of the compressed flower solution into the resin solution was increased to 5 m / s;

[0232] The specific impacts are shown in Table 3 below;

[0233] Table 3 [Table 3]

[0234] From Table 1 above, it can be seen that after increasing the injection rate of the compression solution, the depth of the three-dimensional structure of the final formed plate surface was significantly improved, with the maximum depth increasing by 17.4%.

[0235] Example 6;

[0236] Example 6 is basically the same as Example 4, the difference being that nano silicon dioxide is added to the compressed flower solution (60% solid polytetrafluoroethylene emulsion), and the density of the compressed flower solution is increased to 1.5 g / cm³. 3 From 2.0 g / cm³ 3 These are the points mentioned above;

[0237] The specific impacts are shown in Table 4 below;

[0238] Table 4; [Table 4]

[0239] Table 3 above shows that after increasing the density of the compressed flower solution, the depth of the three-dimensional structure on the final plate surface improved significantly, with the maximum depth increasing by 27.5%.

[0240] Comparative Example 4;

[0241] Comparative Example 4 is basically the same as Example 1 in terms of steps, the only difference being that steps (6) to (8) were combined and applied using a conventional two-roll coating machine;

[0242] A schematic diagram of the roll coating process is shown in Figure 8. When the SPC board material, covered with a wood grain base layer, is transported along the conveying mechanism to the two-roll coating machine, the board material first applies resin liquid 1 to the surface of the wood grain base layer as it passes through the first roller of the two-roll coating machine. Then, before the surface of the wood grain base layer is completely covered with resin liquid 1, the SPC board material passes through the second roller of the two-roll coating machine, applying resin liquid 2 to the surface of resin liquid 1, and this process continues until resin liquids 1 and 2 completely cover the surface of the wood grain base layer.

[0243] Figure 2 is an image of the surface of a three-dimensional plate material manufactured by the method of Comparative Example 4. From the figure, it can be seen that the plate material manufactured by the method of Comparative Example 4 has clear traces on its surface.

[0244] The results of the performance test for the board material of Comparative Example 4 are shown in Table 5 below;

[0245] Table 5 Performance Test Results [Table 5]

Claims

1. A method for forming a three-dimensional wood grain pattern on the surface of a board, characterized by comprising at least the following steps: (S.1) A step of covering at least a portion of the surface of a board with ink to form an ink layer having a wood grain pattern; (S.2) A step of covering at least a portion of the surface of the ink layer with a resin liquid; (S.3) A step of curing at least a portion of the resin liquid on the surface of the ink layer to form a wood grain base layer; (S.4) A step of covering at least a portion of the surface of the wood grain base layer with at least one layer of resin liquid; (S.5) Applying a pressing solution to at least a portion of the surface of the resin solution on the surface of the wood grain base layer along the wood grain pattern of the ink layer, so that the pressing solution and / or at least a portion of the resin solution mixed with the pressing solution and / or at least a portion of the resin solution covered with the pressing solution forms a pressing layer; (S.6) A step of curing the resin liquid other than the pressed flower layer formed in the previous step; (S.7) A step in which the compressed layer is removed and a three-dimensional wood grain layer is formed on the surface of the wood grain base layer.

2. In step (S.4), the amount of resin liquid applied to the surface of the wood grain sublayer is 150 g / m². ２ The method according to claim 1, characterized in that it is as described above.

3. The method according to claim 2, characterized in that in step (S.4), at least a portion of the surface of the wood grain base layer is covered with at least two layers of resin liquid.

4. The method according to claim 3, characterized in that, in a process of covering the surface of at least a portion of a wood grain base layer with any two adjacent layers of resin liquid, the process includes a transient treatment step of stopping the application of force to the resin liquid after the application of any one layer of resin liquid is completed, and the next layer of resin liquid is applied after the transient treatment step is completed.

5. The method according to claim 3 or 4, characterized in that, in a process of covering the surface of at least a portion of a wood grain base layer with any two adjacent layers of resin liquid, the direction of force applied to the two adjacent layers of resin liquid is opposite.

6. The method according to claim 1, characterized in that steps (S.1) to (S.6) are completed in order during the process in which the plate material is moved and conveyed in a fixed direction.

7. The method according to claim 1, characterized in that in step (S.5), the pressed flower solution is applied to the surface of the resin solution and / or penetrates downward into the interior of the resin solution.

8. The method according to claim 1 or 7, characterized in that the method for curing the resin liquid applied in steps (S.2) and (S.4) is photocuring, thermal curing, or electron beam curing.

9. The method according to claim 8, characterized in that the resin liquid comprises at least a photocrosslinkable resin and a photoinitiator.

10. The method according to claim 9, characterized in that the pressed flower solution in step (S.4) contains at least a polymerization inhibitor for preventing the polymerization of the photocrosslinkable resin.

11. The method according to claim 9, characterized in that the photocrosslinkable resin includes any one or a combination of unsaturated polyester, epoxy resin, acrylic resin, acrylic-modified polyurethane resin, acrylic-modified silicone resin, acrylic-modified epoxy resin, aqueous epoxy acrylate, aqueous polyurethane acrylate, and aqueous polyester acrylate.

12. The method according to claim 9, characterized in that the photoinitiator includes one of a free radical polymerization initiator, a cationic polymerization initiator, an energy transfer initiator, or an ionic reaction initiator.

13. The method according to claim 8, characterized in that the resin liquid contains at least a thermosetting resin.

14. The method according to claim 13, characterized in that the thermosetting resin includes any one or a combination of epoxy resin, phenolic resin, melamineformaldehyde resin, furan resin, unsaturated polyester resin, silicone resin, and polybutadiene resin.

15. The method according to claim 13, characterized in that the resin liquid further contains a curing agent for catalyzing the curing of the thermosetting resin.

16. The method according to claim 7, characterized in that step (S.4) further comprises a step of providing kinetic energy for the pressed flower sap to penetrate downward into the resin sap.

17. The method according to claim 16, characterized in that the pressed flower liquid contains a curable resin.

18. The method according to claim 17, characterized in that the curable resin contained in the compressed flower liquid has a surface energy after curing that is lower than the surface energy of the three-dimensional wood grain layer.

19. The method according to claim 18, characterized in that the curable resin contained in the compressed flower solution has a surface energy of less than 100 mN / m after curing.

20. The method according to any one of claims 17 to 19, characterized in that the curable resin contained in the compressed flower liquid includes any of a fluororesin, a fluorosilicone resin, or a silicone resin.

21. The method according to any one of claims 1, 7, or 16 to 19, characterized in that the density of the compressed flower sap is greater than the density of the resin sap.

22. The method according to claim 21, characterized in that the pressed flower sap further comprises a density adjusting agent for adjusting the density of the pressed flower sap.

23. The method according to claim 22, characterized in that the density modifier is an inorganic solid powder additive.

24. The method according to any one of claims 1, 7, or 16 to 19, characterized in that the pressed flower sap comprises pressed flower sap having at least two different surface tensions.

25. In step (S.1), the amount of ink applied to the surface of the board material is 6-8 g / m². ２ The method according to claim 1, characterized in that...

26. In step (S.2), the amount of resin liquid is 30-50 g / m ２ The method according to claim 1, characterized in that...

27. A board material having a three-dimensional solid wood grain pattern, comprising a board material, characterized in that the surface of the board material includes a wood grain base layer and a three-dimensional solid wood grain layer manufactured by the method of any one of claims 1 to 26.

28. A board material having a three-dimensional solid wood grain pattern according to claim 27, characterized in that the following are provided in order between the board material and the wood grain base layer; A primer layer to improve the adhesive performance of the surface of a board material; A color coating layer provided on the surface of the primer layer to cover the color of the substrate; An ink layer located on the surface of the colored paint layer, which forms the wood grain pattern.

29. A board material having a three-dimensional wood grain pattern according to claim 27 or 28, characterized in that the outer surface of the three-dimensional wood grain layer is further covered with a top coat layer, and at least a portion of the top coat layer is lower than the upper surface of the three-dimensional wood grain layer.

30. A method for producing a board material having a three-dimensional wood grain pattern as described in any of claims 27 to 29, characterized in that it includes the step of producing a wood grain base layer and a three-dimensional wood grain layer produced by the method described in at least any of claims 1 to 26.

31. A method for producing a board material having a three-dimensional solid wood grain pattern according to claim 30, characterized by comprising the following steps; A step of covering at least a portion of the surface of a board material with a primer and allowing it to harden to obtain a primer layer; A step of covering at least a portion of the surface of the primer layer with a color paint and curing it to obtain a color paint layer; A step of covering at least a portion of the surface of a color paint layer with an ink layer, a wood grain base layer, and a three-dimensional wood grain layer manufactured by any one of claims 1 to 26; A step of covering at least a portion of the surface of a three-dimensional wood grain layer with a topcoat and curing it to obtain a topcoat layer.

32. Primer application amount: 10-15 g / m² ２ The application amount of color paint is 15-20 g / m². ２ The amount of top coat applied is 20-30 g / m². ２ A method for producing a board material having a three-dimensional solid wood grain pattern as described in claim 31, characterized in that...

33. A method for producing a board material having a three-dimensional wood grain pattern according to claim 31 or 32, characterized in that the color paint layer is white.

34. A method for producing a board material having a three-dimensional wood grain pattern according to claim 33, characterized in that the color coating comprises at least a photocrosslinkable resin, a photoinitiator, and a white pigment powder.

35. The present invention is characterized by applying a board material having a three-dimensional solid wood grain pattern as described in any of claims 27 to 29 to flooring, decorative wall panels, or ceiling panels.

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