Power module and method for manufacturing a power module

Abstract

A power module (1) is provided, comprising: - at least one power semiconductor chip (2); - a heat buffer (4) connected to conduct heat to at least one power semiconductor chip (2); - the heat buffer (4) comprises a container (5) of a first material having a cavity; - the heat buffer (4) comprises a filler (6) of a second material different from the first material, disposed within the cavity; - the second material is a phase-change material. Furthermore, a method for manufacturing the power module (1) is provided.

Images