Composite thermal barrier and method

Abstract

A battery module, a battery pack, a thermal barrier, and related methods are disclosed. The device may include several battery cells. The device may include at least one thermal barrier that isolates selected battery cells within the several battery cells, the thermal barrier including an insulating layer and a dielectric reinforcing layer.

Description

Technical Field

[0001] Cross - reference to Related Applications This application claims priority to U.S. Provisional Application No. 63 / 534,056, filed Aug. 22, 2023; U.S. Provisional Application No. 63 / 546,037, filed Oct. 27, 2023; and U.S. Provisional Application No. 63 / 618,143, filed Jan. 5, 2024, the entire contents of which are hereby incorporated by reference.

[0002] Technical Field The present disclosure generally relates to materials, systems, and methods for preventing or mitigating thermal events, such as thermal runaway issues, in energy storage systems. In particular, the present disclosure provides thermal barrier materials. The present disclosure further relates to battery modules or packs having one or more battery cells including the thermal barrier materials, as well as systems including these battery modules or packs. The generally described aspects may include aerogel materials.

Background Art

[0003] Lithium - ion batteries (LIBs) are widely used in powering portable electronic devices such as mobile phones, tablets, laptops, power tools, and other high - current devices such as electric vehicles because they have a high operating voltage, low memory effect, and high energy density compared to conventional batteries. However, there are concerns about safety because LIBs are prone to critical failures under "misuse conditions" such as overcharging (being charged beyond the designed voltage), over - discharging, operation at high temperature and high pressure, or exposure to high temperature and high pressure. Although LIBs are used as an example, the technology of the present disclosure may be used with any type of battery.

Summary of the Invention

[0004] Effective insulation and heat dissipation measures are needed to address these and other technical challenges of LIBs to prevent the occurrence of cascading thermal runaway events.

Brief Description of the Drawings

[0005] [Figure 1A] Several embodiments of battery modules are shown. [Figure 1B] This shows a different battery module in several configurations. [Figure 2] Several embodiments of thermal barriers are shown. [Figure 3] Several different thermal barriers are shown in various forms. [Figure 4] Several other thermal barriers are shown in various forms. [Figure 5] Several other thermal barriers are shown in various forms. [Figure 6A] Several different thermal barriers are shown in various forms. [Figure 6B] Cross-sectional views of battery modules in several configurations are shown. [Figure 6C] The following are cross-sectional views of battery modules in several different configurations. [Figure 6D] The following are cross-sectional views of battery modules in several different configurations. [Figure 7A] Several other thermal barriers are shown in various forms. [Figure 7B] Cross-sectional views of several types of thermal barriers are shown. [Figure 7C] The following are cross-sectional views of thermal barriers in several different configurations. [Figure 8A] Several cross-sectional views of thermal barriers in different configurations are shown. [Figure 8B] The following are cross-sectional views of thermal barriers in several different configurations. [Figure 9A] Several different thermal barriers are shown in various forms. [Figure 9B] Several different thermal barriers are shown in various forms. [Figure 10A] Several different thermal barriers are shown in various forms. [Figure 10B] Several other thermal barriers are shown in various forms. [Figure 11A] The following are isometric exploded views of battery modules in several configurations. [Figure 11B] Selected cross-sections of the thermal barrier and the housing portion according to some embodiments are shown. [Figure 12] An isometric exploded view of a battery module according to some embodiments is shown. [Figure 13A] Another thermal barrier and battery cells according to some embodiments are shown. [Figure 13B] An end view of another thermal barrier and battery cells according to some embodiments is shown. [Figure 13C] An isometric view of another thermal barrier according to some embodiments is shown. [Figure 14A] An exploded view of another thermal barrier according to some embodiments is shown. [Figure 14B] An exploded view of another thermal barrier according to some embodiments is shown. [Figure 14C] An exploded view of another thermal barrier according to some embodiments is shown. [Figure 15A] A cross-sectional view of another thermal barrier according to some embodiments is shown. [Figure 15B] A cross-sectional view of another thermal barrier according to some embodiments is shown. [Figure 15C] An exploded view of another thermal barrier according to some embodiments is shown. [Figure 15D] An exploded view of another thermal barrier according to some embodiments is shown. [Figure 16] A cross-sectional view of a battery module according to some embodiments is shown. [Figure 17] An electronic device according to some embodiments is shown. [Figure 18] An electric vehicle according to some embodiments is shown.

Embodiments for Carrying Out the Invention

[0006] The following description and drawings fully illustrate specific embodiments to enable those skilled in the art to implement them. Other embodiments may incorporate structural, logical, electrical, process, and other modifications. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Embodiments described in the claims encompass all available equivalents of those claims.

[0007] Thermal barriers can be used in battery modules to compartmentalize individual battery cells or groups of battery cells within a battery device. The thermal barrier may include one or more of the following: insulating material layers, dielectric reinforcing layers, wear-resistant layers, thermal conductive layers, elastic material layers, and combinations thereof. One or more of these layers may be configured to have an outer circumference the same size as an adjacent battery cell, or to have one or more sides with edges extending beyond corresponding sides. These one or more “extended edges” may extend beyond corresponding edges of cells to form an interlocking fit with the interior of the battery module housing, as described in the embodiments and hereafter. A group of multiple battery cells coupled together is referred to in this disclosure as a battery module. However, the devices and methods described may be used in any of several types of multiple battery cell devices, which may be called battery packs, battery systems, etc.

[0008] insulating material layer As described below, insulating materials can be used as a single heat-resistant layer or in combination with other layers that provide additional functions such as mechanical strength, compressibility, and heat dissipation / thermal conductivity in a multilayer configuration. The insulating layers described herein are responsible for reliably containing and controlling the flow of heat from heat-generating components in small spaces, providing safety and prevention of heat transfer in such products in the fields of electronics, industrial, and automotive technology.

[0009] In many aspects of this disclosure, the insulating layer functions as a flame / ignition deflection layer, either by itself or in combination with other materials that enhance its ability to contain and control heat flow. For example, the insulating layer may further include an associated particulate material that is resistant to flame and / or hot gases and alters or enhances thermal containment and thermal control.

[0010] Aerogel within the insulating material layer One highly effective material used in insulating layers is aerogel. Aerogels are characterized by their structure, namely low density, open-cell structure, and large surface area (often 900 m²). 2 The grade of materials is described based on pore size (greater than / g) and sub-nanometer scale. The pores may be filled with gas, such as air. Aerogels can be distinguished from other porous materials by their physical and structural properties. Aerogel materials are exemplary insulating materials, but the present invention is not limited thereto. Other thermal insulating material layers may also be used in aspects of this disclosure.

[0011] Selected embodiments of aerogel formation and property are described. In some embodiments, a precursor material is gelled to form a network of pores filled with a solvent. The solvent is then extracted, leaving a porous matrix. Various different aerogel compositions are known, and they may be inorganic, organic, and inorganic / organic hybrids. Inorganic aerogels are generally metal alkoxide-based and include materials such as silica, zirconia, alumina, and other oxides. Organic aerogels include, but are not limited to, urethane aerogels, resorcinol-formaldehyde aerogels, and polyimide aerogels.

[0012] Inorganic aerogels can generally be formed from metal oxide or metal alkoxide materials. These materials may be based on oxides or alkoxides of any metal capable of forming oxides. Such metals include, but are not limited to, silicon, aluminum, titanium, zirconium, hafnium, yttrium, vanadium, and cerium. Inorganic silica aerogels are conventionally prepared via hydrolysis and condensation of silica-based alkoxides (e.g., tetraethoxysilane) or via gelation of silicic acid or water glass. Other relevant inorganic precursor materials for silica-based aerogel synthesis include, but are not limited to, metal silicates such as sodium silicate or potassium silicate, alkoxysilanes, partially hydrolyzed alkoxysilanes, tetraethoxysilane (TEOS), partially hydrolyzed TEOS, condensed polymers of TEOS, tetramethoxysilane (TMOS), partially hydrolyzed TMOS, condensed polymers of TMOS, tetra-n-propoxysilane, partially hydrolyzed and / or condensed polymers of tetra-n-propoxysilane, polyethyl silicates, partially hydrolyzed polyethyl silicates, monomeric alkylalkoxysilanes, bis-trialalkoxyalkyl or arylsilanes, polyhedral silsesquioxanes, or combinations thereof.

[0013] In certain embodiments of this disclosure, a pre-hydrolyzed TEOS, such as Silbond H-5 (SBH5, Silbond Corp), which is hydrolyzed at a water / silica ratio of about 1.9 to 2, may be commercially available or may be further hydrolyzed before being incorporated into the gelling process. A partially hydrolyzed TEOS or TMOS, such as polyethyl silicate (Silbond 40) or polymethyl silicate, may also be commercially available or may be further hydrolyzed before being incorporated into the gelling process.

[0014] Inorganic aerogels may also include gel precursors containing at least one hydrophobic group, such as alkyl metal alkoxides, cycloalkyl metal alkoxides, and aryl metal alkoxides, which can impart or improve specific properties to the gel, such as stability and hydrophobicity. Inorganic silica aerogels may specifically contain hydrophobic precursors such as alkylsilanes or arylsilanes. Hydrophobic gel precursors can be used as primary precursor materials to form the framework of gel materials. However, hydrophobic gel precursors are more commonly used as co-precursors in combination with simple metal alkoxides in the formation of amalgam aerogels. Examples of hydrophobic inorganic precursor materials for silica-based aerogel synthesis include, but are not limited to, trimethylmethoxysilane, dimethyldimethoxysilane (DMDMS), methyltrimethoxysilane (MTMS), trimethylethoxysilane, dimethyldiethoxysilane (DMDS), methyltriethoxysilane (MTES), ethyltriethoxysilane (ETES), diethyldiethoxysilane, dimethyldiethoxysilane (DMDES), ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane (PhTES), hexamethyldisilazane, and hexaethyldisilazane. Any derivative of any of the above precursors may be used, specifically by adding or crosslinking certain polymers of other chemical groups to one or more of the above precursors.

[0015] Organic aerogels are generally formed from carbon-based polymer precursors. Such polymer materials include, but are not limited to, resorcinol formaldehyde (RF), polyimide, polyacrylate, polymethyl methacrylate, acrylate oligomer, polyoxyalkylene, polyurethane, polyphenol, polybutadiene, trialkoxysilyl-terminated polydimethylsiloxane, polystyrene, polyacrylonitrile, polyfurfural, melamine-formaldehyde, cresol formaldehyde, phenol-furfural, polyether, polyol, polyisocyanate, polyhydroxybenzene, polyvinyl alcohol dialdehyde, polycyanurate, polyacrylamide, various epoxies, agar, agarose, chitosan, and combinations thereof. As an example, organic RF aerogels are generally prepared from sol-gel polymerization of resorcinol or melamine with formaldehyde under alkaline conditions.

[0016] Organic / inorganic hybrid aerogels are primarily composed of organically modified silica ("ormosil") aerogels. These ormosil materials contain organic components covalently bonded to the silica network. Ormosil is generally formed by the hydrolysis and condensation of an organically modified silane, R-Si(OX)3, with a conventional alkoxide precursor, Y(OX)4. In these formulas, in some embodiments, X may represent CH3, C2H5, C3H7, or C4H9; in some embodiments, Y may represent Si, Ti, Zr, or Al; and R may be any organic fragment such as methyl, ethyl, propyl, butyl, isopropyl, methacrylate, acrylate, vinyl, or epoxide. The organic components in the ormosil aerogel may be dispersed throughout the silica network or chemically bonded to the silica network.

[0017] Aerogels can be formed from flexible gel precursors. Various flexible layers, including flexible fiber-reinforced aerogels, can be easily combined and molded to obtain a preform that, when mechanically compressed along one or more axes, gives an object with high compressive strength along any of those axes.

[0018] One method of aerogel formation involves batch casting. Batch casting involves catalyzing the entire volume of a single sol to simultaneously induce gelation throughout its entire volume. Gel formation techniques involve adjusting the pH and / or temperature of a diluted metal oxide sol to the point at which gelation occurs. Suitable materials for forming inorganic aerogels include oxides of most metals that can form oxides, such as silicon, aluminum, titanium, zirconium, hafnium, yttrium, and vanadium. Particularly preferred are gels (alcogels) formed mainly from alcoholic solutions of hydrolyzed silicates, as they are readily available and inexpensive. Organic aerogels can also be made from melamine formaldehyde, resorcinol formaldehyde, and the like.

[0019] In one embodiment, the aerogel material may be monolithic or continuous in structure or layer. In another embodiment, the aerogel material may include a composite aerogel material having aerogel particles mixed with a binder and a carrier. Other additives, including but not limited to surfactants that assist in the dispersion of aerogel particles within the binder or carrier, may be included in the composite aerogel material. The composite aerogel slurry may be applied to a support plate such as a mesh, felt, or web, and then dried to form a composite aerogel structure.

[0020] Reinforcement of the insulating material layer As described above, the aerogel may be organic, inorganic, or a mixture thereof. In some embodiments, the aerogel includes silica-based aerogels. One or more layers within the thermal barrier may include reinforcing material. In some embodiments, the reinforcing material is combined with the aerogel material (e.g., monolithic aerogel, particulate aerogel) to form an insulating layer. The reinforcing material may be any material that provides elasticity, adaptability, or structural stability to the integrated aerogel material. Embodiments of the reinforcing material include, but are not limited to, open-cell macroporous framework reinforcing materials, closed-cell macroporous framework reinforcing materials, open-cell membranes, honeycomb reinforcing materials, polymer reinforcing materials, as well as fibrous reinforcing materials such as discrete fibers, woven materials, nonwoven materials, needled nonwoven battings, webs, mats, and felts.

[0021] The reinforcing material can be selected from organic polymer fibers, inorganic fibers, carbon fibers, or combinations thereof. Inorganic fibers can be selected from glass fibers, rock fibers, metal fibers, boron fibers, ceramic fibers, basalt fibers, other inorganic fibers, or combinations thereof. Organic polymer fibers can be selected from polyester polypropylene fibers, acrylic fibers, polyvinyl chloride fibers, aramid fibers, spandex fibers, nylon fibers, pre-oxidized fibers, pre-oxidized polyacrylonitrile (OPAN) fibers, other organic fibers, or combinations thereof. In some embodiments, the reinforcing material may include layers of multiple materials.

[0022] Dielectric reinforcement layer The thermal barrier further includes a dielectric reinforcement layer in addition to the insulating material layer. The dielectric reinforcement layer provides mechanical strength to the thermal barrier, in addition to other functions. Its low conductivity prevents accidental electrical short circuits within the battery module or battery pack. The dielectric reinforcement layer includes dielectric materials selected from polymers, including ceramics, glass, rubber, oil, paper, resins, epoxy resins, plastics, as well as polyethylene, polypropylene, polytetrafluoroethylene, polyvinyl chloride (PVC), PVC elastomer materials, PVC rigid materials, other dielectric materials, and combinations thereof.

[0023] Alternatively, the dielectric reinforcement layer may include mica. Advantages of using mica as a dielectric reinforcement layer include its low thermal conductivity and the abundant and low-cost availability of such materials. Mica also exists naturally in sheet or sheet-like form, providing good structural properties at low cost. In contrast to powder dielectric materials, mica sheets are mechanically strong and provide desired reinforcement and encapsulation for insulating layers. In one embodiment, the dielectric reinforcement layer comprises mica particles bonded to a binder (e.g., a polymer binder) to form a structural sheet. In one embodiment, the dielectric reinforcement layer is flexible. In one embodiment, the binder may include a silicone-based polymer, but the disclosure is not limited thereto. Silicone polymers have the advantages of high heat resistance and low thermal conductivity. In one embodiment, the thickness of the mica dielectric reinforcement layer is in the range of less than about 1 μm, about 1 μm to about 10 μm, about 10 μm to about 100 μm, about 100 μm to about 1 mm, or any range in between.

[0024] wear resistant layer The thermal barrier further includes an abrasion-resistant layer in addition to the insulating material layer and the dielectric reinforcement layer. The abrasion-resistant layer improves the durability of at least the main surface of the thermal barrier against impacts of particle impacts during extreme conditions such as thermal runaway. During a thermal runaway event, particulate ejecta from the battery cell (e.g., from the negative electrode, positive electrode, and / or structural components of the battery) may be heated to temperatures above 500°C and propelled against the (main or secondary) surface of the thermal barrier with considerable force caused by the combustion of the lithium battery material. Often being micron or millimeter in size, these particles are abrasive and can erode unprotected insulating material (e.g., fiber-reinforced aerogel) during the course of the thermal event. This erosion can then compromise the protection provided by the insulating layer, which is intended to prevent the first cell during thermal runaway from igniting adjacent cells. The abrasion-resistant layer can be configured to resist abrasion from ejecta and thereby maintain the protection it provides to the underlying thermal insulating layer and adjacent cells.

[0025] In some embodiments, the wear-resistant layer may be formed from one or more materials that are not eroded (or are slowly eroded) when subjected to impact by thermal runaway ejecta.

[0026] The wear-resistant layer may include one or more materials selected from silicone glass, silicone glass cloth, glass silicone tape, metal or metal alloy, polycarbonate, aramid, laminated glass, fiberglass, plexiglass, acrylic, other wear-resistant layers, or combinations thereof. In one embodiment, the wear-resistant layer may include an elastomer, or an elastomer reinforced with another material such as glass fiber. In the case of silicone glass cloth, the material may include glass cloth and / or glass cloth fabric with a silicone rubber / resin coating or impregnation. In the case of glass silicone tape, the glass silicone tape may be a glass silicone tape with PSA silicone adhesive. Metal or metal alloy may include steel, aluminum, other suitable metals or alloys, or combinations thereof. The wear-resistant layer may also include any material that can be included in the dielectric reinforcement layer.

[0027] The wear-resistant layer may include thicknesses of approximately 0.01 mm to 5 mm, 0.1 mm to 3 mm, 0.1 mm to 1 mm, 0.1 mm to 0.5 mm, 0.2 mm to 0.3 mm, or any range in between.

[0028] In some embodiments, the abrasion-resistant layer may be a flexible layer. In some embodiments, the abrasion-resistant layer is self-adhesive. Alternatively, the abrasion-resistant layer may include an additional adhesive layer such as double-sided tape or a PSA layer. In some embodiments, a dielectric reinforcing layer may function as the abrasion-resistant layer, or the abrasion-resistant layer may function as the dielectric reinforcing layer.

[0029] Heat conduction In addition to thermal insulator layers, dielectric reinforcement layers, and wear-resistant layers, thermal barriers may further include thermal conductive layers. Thermal conductive layers combined with thermal insulator layers are effective in guiding unwanted heat to desired external locations, such as external heat dissipation fins, heat dissipation housings, or other external structures for dissipating unwanted heat to the ambient air. In one embodiment, one or more thermal conductive layers assist in dissipating heat from localized thermal loads within a battery module or battery pack. Types of high thermal conductivity materials include not only metals, but also, but not limited to, carbon fibers, carbon nanotubes, graphene, graphite, pyrolytic graphite sheets, silicon carbide, copper, stainless steel, aluminum, etc., as well as combinations thereof.

[0030] In at least one embodiment, the thermal conduction layer is coupled to a heat sink to assist in heat dissipation and removal. There are various types and configurations of heat sinks, as well as different techniques for coupling heat sinks to thermal conduction layers, and it will be understood that this disclosure is not limited to the use of any one type of heat sink / coupling technique. In one embodiment, at least one thermal conduction layer of the multilayer material disclosed herein may be in thermal communication with an element of a cooling system of a battery module or battery pack, such as a cooling plate or cooling channel of a cooling system. In another embodiment, at least one thermal conduction layer may be in thermal communication with other elements of a battery pack, battery module, or battery system that can function as a heat sink, such as a pack, module, or system wall, or with other elements of the multilayer material placed between battery cells. Thermal communication between the thermal conduction layer and the heat sink element in a battery system allows for the removal of excess heat from the battery cells or battery cells adjacent to the multilayer material to the heat sink, thereby reducing the impact, severity, or propagation of thermal events that may generate excess heat. In addition to heat removal, the heat conduction layer can diffuse or dissipate heat from a region of high heat concentration to a wider region of low heat concentration.

[0031] In addition to their mechanical function of supporting other layers within a thermal barrier, thermal conductive layers can replace dielectric reinforcement layers in applications where thermal conductivity is required.

[0032] Elastic materials In addition to the thermal insulating layer and the thermal conductive layer, the thermal barrier may also include one or more elastic material layers. In one embodiment, the elastic layer absorbs any volume expansion of one or more battery cells during normal operation. Under certain conditions during charging, the battery cells may expand, and during discharge, the battery cells may contract. In one embodiment, the elastic layer may also absorb permanent volume expansion caused by either battery cell degradation and / or thermal runaway. The elastic material layers may include, but are not limited to, foams, fibers, cloths, sponges, spring structures, rubbers, polymers, and the like.

[0033] Thermal barrier with extended edges Figure 1A shows one configuration of a battery module 100. The module 100 includes a stack of battery cells 102. In one embodiment, the stack of battery cells 102 includes lithium-ion battery cells 102, but other battery cell types are also within the scope of this disclosure. Several configurations of battery cells 102 are possible. In one embodiment, the stack of battery cells 102 includes prism battery cells or pouch battery cells, but this disclosure is not limited in that way. In one embodiment, the stack of battery cells 102 includes lithium-ion battery cells such as lithium nickel manganese cobalt (NMC) oxide battery cells or lithium-ion phosphate (LFP) battery cells, but this disclosure is not limited in that way. Some battery cells 102 are grouped into several battery cell subdivisions 112, 114. As described above, it is desirable to stop or mitigate thermal runaway conditions that may occur in battery cells such as lithium-ion battery cells 102. The thermal barrier 110 is positioned between adjacent battery cell subdivisions 112 and 114 to stop or mitigate thermal runaway between them.

[0034] Each battery cell 102 in Figure 1A includes an electrical terminal 104. While Figure 1A shows a battery cell 102 with terminals 104 on its upper surface (XY plane), other configurations, including but not limited to those shown in the figures below, are also within the scope of the present invention.

[0035] This disclosure refers to the “lateral footprints” of various components, including the battery cell 102 and the thermal barrier 110. The lateral footprint of a component refers to the area of ​​the component’s main surface, defined by the perimeter of the component. As shown in Figure 1A, the main surfaces of the battery cell 102 and the thermal barrier 110 are surfaces in the YZ plane (see the reference axis in Figure 1A). For clarity and convenience of explanation, the term battery cell (equivalent to “battery” or “cell”) lateral footprint (“footprint”) refers to the main surface of the battery cell in the YZ plane. Similarly, the lateral footprint (“footprint”) of a thermal barrier refers to the main surface of the thermal barrier in the YZ plane. In some embodiments described below, the thermal barrier may be manufactured from multiple laminated layers, each layer having a corresponding lateral footprint (i.e., the lateral footprint of the insulator, the lateral footprint of the dielectric reinforcement layer). For clarification, a "secondary plane" is a plane perpendicular to the primary plane and located in the XY or XZ plane using the reference coordinate axes of the figure.

[0036] Figure 1B shows an optional configuration of a battery module 150, including a heatsink 154 or cooling plate positioned on a side (e.g., bottom) of the module 150 and in thermal communication with the battery cells 152. Figure 1B shows a cross-section of the battery module 150. One or more of the battery cells 152 are shown separated by one or more thermal barriers 160. In Figure 1B, only a selected group or subdivision of the battery cells 152 are separated by the thermal barriers 160, but the disclosure is not limited thereto. In other embodiments, all of the battery cells 152 are bounded by the thermal barriers 160. The side (XZ plane), bottom (XY plane), or top (XY plane) of the battery module 150 may also include thermal barriers 160. Embodiments of the thermal barriers 110, 160 are shown in more detail in the following description of the figures.

[0037] In Figures 1A and 1B, the thermal barriers 110 and 160 are shown having lateral footprints that match (i.e., are adjacent to) the lateral footprint of the battery cell 102. In other words, the area of ​​the lateral surfaces of the thermal barriers 110 and 160 is the same as or identical to the area of ​​the lateral surfaces of the battery cell itself. The thermal barriers 110 and 160 do not extend beyond the lateral dimensions of the battery cell 102. The term “footprint” is used to describe how different battery cells not shown in the configurations shown in Figures 1A and 1B may include different lateral shapes other than rectangular or square. In one embodiment, a pouch battery cell may generally be rectangular, but may have a less defined contour. Even if the contour of the pouch battery cell is less defined, it still defines a lateral footprint, although the footprint may not be defined entirely by length × width as in a rectangular battery cell.

[0038] Figure 2 shows one embodiment of a thermal barrier 200 according to the present disclosure. The thermal barrier 200 in Figure 2 includes an insulating layer 202 having main surfaces 203A and 203B, a first dielectric reinforcing layer 204, and a second dielectric reinforcing layer 206. The assembly of the insulating layer 202, the first dielectric reinforcing layer 204 on main surface 203A, and the second dielectric reinforcing layer 206 on main surface 203B forms the thermal barrier 200. The thermal barrier 200 shown in Figure 2 shows the dielectric reinforcing layers on both main surfaces 203A and 203B of the insulating layer 202, but this is not essential. In some embodiments, the thermal barrier 200 includes the dielectric reinforcing layer 204 on one main surface of the insulating layer 202, but does not include the dielectric reinforcing layer 204 on the other main surface of the insulating layer 202 (for example, it includes it on main surface 203A but not on main surface 203B).

[0039] In one embodiment, the dielectric reinforcing layers 204, 206 are attached to the main surfaces 203A, 203B of the insulating layer 202 (for example, by an adhesive). In one embodiment, the adhesive includes a pressure-sensitive adhesive (PSA). PSA is useful because its use can simplify the manufacturing and assembly of parts. Layers such as the dielectric reinforcing layers 204, 206 and the insulating layer 202 are attached by applying PSA to one or more surfaces of the layers and pressing the layers together to activate the PSA. In one embodiment, the PSA is included in all or part of one or more main surfaces of each dielectric reinforcing layer 204, 206, but the disclosure is not limited thereto. The PSA on the main surface of the dielectric reinforcement layer facing the corresponding surface of the insulator layer (e.g., main surfaces 203A, 203B) can assist in the adhesion of the dielectric reinforcement layer to the insulator layer 202, while the PSA on the opposing main surface of the dielectric reinforcement layer can assist in the attachment of the dielectric reinforcement layer to the battery cell (e.g., battery cell 102 or 152). The adhesive also assists in encapsulating part or all of the insulator layer 202, thus preventing fine powder from falling from the insulator layer 202. The attachment of the dielectric reinforcement layer 204 may be mechanically stronger than the insulator layer 202 itself (e.g., more rigid, higher module, higher tensile strength, higher bending strength), thus providing structural support to the insulator layer 202.

[0040] In one embodiment, the insulating layer 202 includes an aerogel layer, but the disclosure is not limited thereto. The aerogel material described above has very low thermal conductivity, but the addition of one or more dielectric reinforcing layers 204, 206 provides the insulating layer 202 with the desired mechanical strength without adding unwanted higher thermal conductivity. The enhanced mechanical strength improves the durability of the thermal barrier 200, in particular, during particle collisions under extreme conditions (e.g., thermal runaway). The dielectric reinforcing layer 204 further functions as an encapsulation of the insulating layer 202 to reduce or prevent fine particles from coming out of the insulating layer 202.

[0041] In one embodiment, the dielectric reinforcing layers 204, 206 may be selected from polyvinyl chloride (PVC), PVC elastomer materials, PVC rigid materials, rubber, other dielectric materials discussed herein, other dielectric materials, and combinations thereof.

[0042] In one embodiment, the dielectric reinforcing layers 204, 206 include mica. Advantages of using mica as a dielectric reinforcing layer include its low thermal conductivity and the abundant and low-cost availability of such material. Mica also exists naturally in sheet or sheet-like form, providing good structural properties at low cost. In contrast to powder dielectric materials, mica sheets are mechanically strong and provide desired reinforcement and encapsulation for the insulating layer 202. In one embodiment, the dielectric reinforcing layer 204 includes mica particles bound to a binder (e.g., a polymer binder) to form a structural sheet. In one embodiment, the dielectric reinforcing layer 204 is flexible. In one embodiment, the binder may include a silicone polymer, but the disclosure is not limited thereto. Silicone polymers have the advantages of high heat resistance and low thermal conductivity.

[0043] In some embodiments, the insulating layer, e.g., 202, 302, 402, 502, 602, 702, 802, 822, 902, 952, 1002, 1052, 1123, 1133, 1143, 1153, 1214, 1301, 1402, 1412, 1422, 1502, 1512, 1522, 1532, may include a composite of multiple layers. In one embodiment, the insulating layer may include an insulating layer and other material layers such as a structural layer, a conductive layer, a compressible layer, an elastic layer, a dielectric layer, an adhesive layer, an expansion layer, a heat absorption layer, a heat release layer, other suitable layers, or a combination thereof.

[0044] In one embodiment, the insulating layer may include a structural core layer and insulating layers disposed on both surfaces of the structural core layer. The structural core layer includes a layer having a higher modulus of elasticity, higher flexural strength, and / or higher rigidity than that shown by a foam or fiber-reinforced aerogel insulating layer. Thus, the insulating layer composed of the structural core layer (and insulating layers on or adjacent to the main surface of the structural core layer) may have a mechanically stable footprint.

[0045] In one embodiment, the structural core layer may include the aforementioned dielectric reinforcing layer and / or thermal conductive layer. In one embodiment, the structural core layer may include a mica layer, a stainless steel layer, and / or a polymer layer.

[0046] In one embodiment, the insulating layer may be a foam, fiberglass, nonwoven fabric, aerogel, aerogel composite, fiber-reinforced aerogel, other insulating materials discussed herein, other suitable insulating materials, or a combination thereof. In another embodiment, the insulating layer may be a composite such as those disclosed in U.S. Patent Publications 2021 / 0163303, 2021 / 0167438, 2023 / 0032529, and U.S. Patents 18 / 571,175, 18 / 571,178, and 18 / 571,172, each of which is incorporated herein by reference in whole.

[0047] Figure 3 shows another embodiment of the thermal barrier 300. The thermal barrier 300 includes an insulating layer 302 (having main surfaces 303A, 303B) and a dielectric reinforcing layer 304 that forms a lamination with the insulating layer 302. In one embodiment, a second dielectric reinforcing layer 306 is included, so that a pair of dielectric reinforcing layers 304, 306 are attached to both main surfaces 303A, 303B of the insulating layer 302, respectively. In the embodiment shown in Figure 3, at least one of the dielectric reinforcing layers 304 or 306 extends beyond the lateral footprint of the insulator, as shown in the extension 310. In other words, the reinforcing layer 304 does not extend identically to the main surface 303A of the insulating layer 302, but instead extends beyond it. In this case, the reinforcing layer 304 has a Z dimension that is larger than the corresponding Z dimension of the insulating layer 302. In the illustration in Figure 3, the reinforcing layer 306 also extends in the Z direction beyond the corresponding main surface 303B of the insulating layer 302, but the reinforcing layers 304 and 306 do not need to be symmetrical.

[0048] Regions of reinforcing layers 304, 306 that extend beyond the dimensions of the corresponding main surfaces 303A, 303B of the insulating layer 302 are referred to herein as “extensions.” In Figure 3, the extensions are shown as 310A, 310B (collectively referred to as extensions 310), and the dashed line indicates the upper Z dimension of the insulating layer 302, thereby also showing the extension 310 of the reinforcing layer 304. Embodiments including one or more extensions 310 provide an increased barrier between adjacent battery cells within the battery module outside the battery footprint. One or more extensions 310 reduce or prevent heat or thermal runaway ejecta from moving across the battery module. The function of one or more extensions 310 is described in more detail below in Figure 6B with respect to non-limiting extension shapes.

[0049] Figure 4 shows another embodiment of the thermal barrier 400. In the embodiment of Figure 4, the thermal barrier 400 includes an insulating layer 402 (having main surfaces 403A, 403B) and dielectric reinforcing layers 404, 406 on the main surfaces 403A, 403B, thereby forming a lamination with the insulating layer 402. In one embodiment, only a single dielectric reinforcing layer 404 or 406 is included on one of the main surfaces 403A or 403B of the insulating layer 402.

[0050] Similar to thermal barriers 200 and 300, the outer boundaries of the main surfaces 402A and 402B of the insulating layer 402 in the YZ plane define the "footprint" of the insulating layer 402, as described above. Similar to thermal barrier 300, thermal barrier 400 includes first extensions 410A and 410B formed by extending the dimensions of the dielectric reinforcing layers 404 and 406 in the positive Z direction beyond the Z-dimensional footprint of the insulating layer 402. The first extensions 410A and 410B are shown in Figure 4 by dashed lines corresponding to the footprint of the insulating layer 402 in the Z dimension. Although not shown in Figure 4, it should be understood that other embodiments of thermal barrier 400 may also include extensions in the negative Z dimension.

[0051] In addition to the first extensions 410A and 410B, the thermal barrier 400 also has second extensions 412A and 412B that extend beyond the lateral footprint of the insulating layer 402 in a positive Y dimension (corresponding to the dielectric layers 404 and 406, respectively). The second extension 412A is shown by the vertical dashed line in Figure 4. It will be understood that the second extension 412B on the dielectric layer 406 is similar to the second extension 412A. It will also be understood that extensions in the negative Y direction are possible, although they are not shown in Figure 4 for the sake of clarity in the figure.

[0052] As described above and applicable to any extending portion described herein in any embodiment, the extending portion may, by extending beyond the footprint of the insulating layer, contact, engage with, or otherwise interact with the side walls, bottom, or top cover of the module housing to reduce or prevent heat or thermal runaway ejection from moving across the battery module, as described in more detail below.

[0053] Figure 5 shows another embodiment of the thermal barrier 500. In the embodiment of Figure 5, the thermal barrier 500 includes an insulating layer 502 and a dielectric reinforcing layer 504 that forms a lamination with the insulating layer 502. In one embodiment, a second dielectric reinforcing layer 506 is included, forming a pair of dielectric reinforcing layers 504, 506 on both main surfaces of the insulating layer 502. The main surfaces of the insulating layer 502 are not shown in Figure 5 for clarity of the figure. However, since the main surfaces are defined above and shown in Figures 2, 3, and 4, the location and presence of the main surfaces of the insulating layer 502 will be understood by analogy.

[0054] In the embodiment shown in Figure 5, one or more dielectric reinforcing layers 504, 506 include one or more extensions angled outward from the insulating layer. The first extension 510 of the dielectric reinforcing layer 504 is angled upward (in the positive Z direction) and to the right (in the positive X direction) with respect to the insulating layer 502, which is coplanar with the YZ plane. The second extension 512 is angled upward (in the positive Z direction) and to the left (in the negative X direction) from the insulating layer 502. The first extension 510 and the second extension 512 each form an angle θ with the positive Z direction. The angle θ may be acute or right. The angle θ provides flexibility to the dielectric reinforcing layers 504 and 506, for example, providing bending flexibility along the length of the extension or at the intersection between the extension and the body of the reinforcing layer. When installing the battery module cover, the angle increases (the first extension 510 and the second extension 512 move downward in the negative Z direction), thus sealing the space between the battery cell and the cover. This function is further explained with reference to Figure 6B below.

[0055] Figure 6A shows another embodiment of the thermal barrier 600. In the embodiment of Figure 6A, the thermal barrier 600 includes an insulating layer 602 and a dielectric reinforcing layer 604 that forms a laminate with the insulating layer 602. In one embodiment, a second dielectric reinforcing layer 606 is included, forming a pair of dielectric reinforcing layers 604, 606 on both main surfaces of the insulating layer 602.

[0056] In the embodiment shown in Figure 6A, one or more of the dielectric reinforcing layers 604, 606 are angled outward from the insulating layer. The first extension 610 of the dielectric reinforcing layer 604 is angled upward (in the positive Z direction) and to the right (in the positive X direction) from the upper edge of the insulating layer 602. The second extension 612 is angled upward (in the positive Z direction) and to the left (in the negative X direction) from the top of the insulating layer 602.

[0057] Furthermore, in one embodiment of Figure 6A, the reinforcing layers 604 and 606 each extend laterally upward and from the side of the insulating layer 602 beyond the lateral footprint of the battery cell. More specifically, in the embodiment shown in Figure 6A, the third extension 614 is further angled laterally (positive Y direction) away from the side edge of the insulating layer 602 (positive X direction). The fourth extension 616 is further angled laterally (positive Y direction) away from the side edge of the insulating layer 602 (negative X direction). In one embodiment, one edge of the extension 610 is connected to one edge of the extension 614 by a connecting piece 618. In one embodiment, the connecting piece 618 is triangular. The connecting piece helps prevent the movement of heat and particles across the battery module during a thermal runaway event.

[0058] Figure 6B shows one embodiment of how the thermal barrier 600 can be used within a battery module 650. Several battery cells 652 are shown within a module housing 654. One or more of the battery cells 652 are isolated by at least one thermal barrier 600. The thermal barrier 600 from Figure 6A is shown in Figure 6B, but other thermal barrier configurations described herein may also be configured as shown in the module 650 shown in Figure 6B.

[0059] The extensions 610 and 612 are positioned as shown in Figure 6A, and as a result, they extend into the upper space 658 between the top of the battery cell 652 and the cover 656. The extensions 610 and 612 divide the upper space 658 into several separate compartments 659, which better contain the flame and / or ejecta that may result from the failure of one or more battery cells 652. The extensions 610 and 612 block the movement of flame, heat, and / or ejecta along the X direction, confining the flame, heat, and / or ejecta corresponding to the thermally runaway battery cell 652 within the compartments 659. Thus, the thermal runaway is prevented from propagating from the thermally runaway battery cell to adjacent healthy battery cells.

[0060] As described above, in the configuration shown in Figure 6B, the extensions 610 and 612 are angled outward from the insulating layer 602 at an angle θ (in the positive and negative X directions, respectively). In one embodiment, the angle θ is acute or right. In one embodiment, the outward angle facilitates curving relative to the lid 656, thereby creating a better seal with the lid 656 and any defects in the space between the lid 656 and the battery cell 652. The ability of the extensions 610 and 612 to curve and accommodate the difference in space results in a better seal with the lid 656 compared to a non-flexible extension.

[0061] Figure 6C shows a cross-sectional view of the battery module 650 of Figure 6B along line AA' which cuts across the insulating layer 602. The insulating layer 602 has a sub-surface 651 (generally referred to herein as an edge, and in particular in this configuration equivalent to a bottom edge) that contacts the bottom surface of the module housing 654 or a cooling plate (not shown) on the bottom surface. The sub-surface 653 of the insulating layer 602 (equivalent to an upper edge) is separated from the lid 656 by an intervening upper space 658. The side edges 661, 663 of the insulating layer 602 (described elsewhere herein as third and fourth sub-surfaces) and the side wall of the module housing 654 are separated by a side space 657.

[0062] Figure 6D shows a cross-sectional view of the battery module 650 of Figure 6B along line BB' that cuts across the extensions 610, 614 of the dielectric reinforcement layer 604. The extensions 610 and 614 extend into the side space 657 and the upper space 658, pressing against the lid 656 and the side wall of the module housing 654 at an angle θ. Thus, the extensions 610 and 614 separate the upper space 658 and the side space 657 into separate compartments, and thus prevent heat and / or particles from moving through the side space 657 and the upper space 658 during thermal runaway. The connecting piece 618 in Figure 6A helps to seal the corner space 660 of the module housing 654. In one embodiment, the connecting piece 618 may be triangular. Alternatively, the connecting piece may be rhomboid for better sealing.

[0063] In one embodiment, one or both of the dielectric reinforcing layers 604, 606 on the insulating layer 602 may be replaced by a wear-resistant layer. In this configuration, the wear-resistant layer is an outer layer of the thermal barrier 600 and is positioned in contact with the main surface of the insulating layer 602 instead of the dielectric reinforcing layers 604, 606.

[0064] In one embodiment, the thermal barrier 600 further includes at least one wear-resistant layer in addition to the dielectric reinforcing layers 604, 606. The wear-resistant layer(s) may be positioned between the insulating layer 602 and the dielectric reinforcing layers 604, 606 (i.e., positioned on one or more main surfaces of the insulating layer 602). In this configuration, the dielectric reinforcing layers 604, 606 are, in this case, outer layers of the thermal barrier 600, thereby bringing them close to adjacent battery cells. Alternatively, the dielectric reinforcing layers 604, 606 may be positioned between the insulating layer 602 and the wear-resistant layer(s). In this configuration, the dielectric reinforcing layers 604, 606 are on the main surfaces of the insulating layer 602, and the wear-resistant layer(s) are outer layers of the thermal barrier 600, thereby bringing them close to adjacent battery cells.

[0065] Although the presence of a wear-resistant layer is introduced and explained in the context of the thermal barrier 600, it will be understood that a wear-resistant layer may be added to any of the thermal barrier configurations described herein with respect to any of the figures. Specifically, one or both of the dielectric reinforcing layers 304, 306 shown in Figure 3 on one or more main surfaces of the insulating layer 302, one or both of the dielectric reinforcing layers 404, 406 shown in Figure 4 on one or more main surfaces of the insulating layer 402, one or both of the dielectric reinforcing layers 504, 506 shown in Figure 5 on one or more main surfaces of the insulating layer 502, and one or both of the dielectric reinforcing layers 604, 606 shown in Figure 6 on one or more main surfaces of the insulating layer 602 may be replaced by a wear-resistant layer, so that one or more layers adjacent to the battery cell are wear-resistant layers. For convenience, the wear-resistant layer may be described as the “outer” layer of the thermal barriers 300, 400, 500, and 600.

[0066] In one embodiment, the thermal barriers 300, 400, 500, and 600 may further include at least one abrasion-resistant layer (or more) disposed between the insulating layers 302, 402, 502, and 602 and one or both of their corresponding dielectric reinforcing layers 304, 306, 404, 406, 504, 506, 604, and 606. In these configurations, the dielectric reinforcing layers 304, 306, 404, 406, 504, 506, 604, and 606 are, in this case, the outer layers of the thermal barriers 300, 400, 500, and 600.

[0067] Thermal barrier with sealed edges Figure 7A shows another embodiment of the thermal barrier 700 having a sealed edge. Figures 7B and 7C are cross-sectional views of the thermal barrier 700 along plane CC'. In the embodiments of Figures 7A and 7B, the thermal barrier 700 includes an insulating layer 702 and a dielectric reinforcing layer 704 located on the first main surface 703A of the insulating layer 702, thereby forming a lamination with the insulating layer 702. In one embodiment, a second dielectric reinforcing layer 706 is located on the second main surface 703B of the insulating layer 702 (e.g., Figure 7C).

[0068] In Figures 7A and 7B, the thermal barrier 700 further includes an edge seal 708 on at least a portion of the periphery of the insulating layer 702 and the dielectric reinforcing layers 704 and 706. That is, the edge seal 708 is located on at least a portion of one or more subsurfaces of the thermal barrier 700 (i.e., the surfaces of the XY and XZ planes in Figure 7A).

[0069] The secondary surfaces are approximately perpendicular to the main surfaces of the insulating layer 702 (within the range of + / - 10 of normal design and manufacturing tolerances) and connect both the first and second main surfaces. Referring to Figure 7B, the first secondary surface 710A and the second secondary surface 710B correspond to secondary surfaces in the XY plane that connect the main surfaces 703A and 703B, which are oriented in the YZ plane.

[0070] The third and fourth sub-faces are sub-faces in the ZX plane, connecting the first principal face, the second principal face, the first sub-face, and the second sub-face. The third and fourth sub-faces are not shown in Figures 7A-7C due to the orientation of the drawings, but will be understood based on these figures and the references to the Cartesian coordinate system in this description.

[0071] The edge seal 708 is shown in Figure 7A as being located on all four sub-surfaces. In some embodiments and / or for the sake of clarity of explanation, the edge seal can be described as having a portion or region named in relation to each of the corresponding surfaces on which the edge seal is located. Referring to Figures 7A, 7B, and 7C for the sake of this explanation, a first edge seal may be located on the first sub-surface 710A, a second edge seal may be located on the second sub-surface 710B, a third edge seal may be located on the third sub-surface, and a fourth edge seal may be located on the fourth sub-surface.

[0072] In one embodiment, the edge seal 708 comprises an elastic material that deforms as shown in Figure 6B above to provide an improved seal with the lid. In one embodiment, the edge seal 708 is not elastic and provides a seal with the lid using only tight dimensions (e.g., an interlocking fit). In one embodiment, the edge seal 708 seals all four edges of the insulating layer 702. In one embodiment, the edge seal 708 comprises a tape or other adhesive film. In some embodiments, the tape or other adhesive film may be attached to at least a portion of one or more secondary surfaces of the thermal barrier (i.e., surfaces in the XY plane in Figure 7A). In some embodiments, the edge seal may extend over a portion of the main surface of the thermal barrier, e.g., the surface of a reinforcing layer. In one embodiment, the edge seal 708 comprises a molded polymer channel. In one embodiment, the polymer edge seal 708 comprises rubber, silicone, resin, other elastic polymer materials, or a combination thereof.

[0073] Figure 7C shows an edge seal 720 that has been dipped or painted in place. Advantages of the edge seal 720 include ease of manufacture and being an alternative option for polymer materials. The dipped or painted edge seal 720 has rounded edges compared to the edge seal 708 in Figure 7B. In one embodiment, the edge seal 720 includes an aerogel component (e.g., aerogel paint), mica, other insulating or flame-retardant materials, or a combination thereof. In one embodiment, the edge seal 720 includes an expandable material. The expandable material has the advantage of expanding when exposed to heat or flame above its activation temperature to form a better seal with the lid. As described above, the improved seal with the battery module lid better contains thermal runaway events, resulting in improved safety and protection of adjacent components.

[0074] In one embodiment, one or both of the dielectric reinforcing layers 704, 706 on the insulating layer 702 may be replaced by a wear-resistant layer. In this case, the wear-resistant layer is the outer layer of the thermal barrier 700. In one embodiment, the thermal barrier 700 further includes at least one wear-resistant layer in addition to the reinforcing layers 704, 706. The wear-resistant layer(s) may be positioned between the insulating layer 702 and the reinforcing layers 704, 706. In this case, the reinforcing layers 704, 706 are the outer layers of the thermal barrier 700. Alternatively, the reinforcing layers 704, 706 may be positioned between the insulating layer 702 and the wear-resistant layer(s). In this case, the wear-resistant layer(s) are the outer layers of the thermal barrier 700. The edge seal 708 is shown to cover at least a portion of the periphery of the insulating layer 702, the reinforcing layers 704, 706, and the wear-resistant layer(s). The edge seal 706 can enclose the edge (also called the periphery) and cover a portion of the main surface of the outer layer of the heat barrier 700.

[0075] Figures 8A and 8B show further embodiments of thermal barriers 800, 820 that can be incorporated into other thermal barriers in this disclosure. Thermal barrier 800 includes multilayers 804 and 806 on two opposing main surfaces of an insulating layer 802. An edge seal 808 is also shown in Figure 8A. The multilayers may include several different layers, each performing a different function in the multilayer thermal barrier. Configurations having multilayers may include, but are not limited to, dielectric reinforcing layers, elastic layers, thermal conductive layers, adhesive layers, and the like. A thermal conductive layer may be used to transfer heat from a given side of the thermal barrier to a heat sink or cooling plate, such as the heat sink 154 in Figure 1B. In one embodiment of Figure 8A, the multilayers 804 and 806 may include an equal number of layers and may include a symmetrical type and order of layers. In one embodiment, the multilayers 804 and 806 each include a dielectric reinforcing layer 810 attached to the insulating layer 802 by an adhesive layer 812. In one embodiment, each of the multilayers 804 and 806 includes a conductive layer 810 attached to the insulating layer 802 by an adhesive layer 812.

[0076] In Figure 8B, the thermal barrier 820 includes multiple layers on two opposing main surfaces of the insulating layer 822. The edge seal 828 is also shown in Figure 8B. As shown in Figure 8B, the multiple layers on the first side 824 are not symmetrical to the multiple layers on the second side 826. Different order of layers, different material layers, and different numbers of layers between the first side 824 and the second side 826 of the insulating layer 822 can be used to better suit the conditions at different locations between battery cells in a battery module. In one embodiment, a thermal barrier 820 having multiple layers only on the first side 824 can be used at the end of a battery module. Compared to a battery cell in the center of a module that has adjacent battery cells on both sides, a battery cell at the end of a module has only one side adjacent to a battery cell. Furthermore, reducing the number of layers can reduce the size and cost of the battery module.

[0077] In one embodiment of Figure 8B, the multilayer on the first side 824 includes a dielectric reinforcing layer 827 attached to the insulating layer 822 by an adhesive layer 825. The multilayer on the second side 826 includes an adhesive layer 825. The thermal barrier 820 may be used at the end of a battery module where only one side of the thermal barrier 820 has battery cells. A multilayer on the second side 826 having only an adhesive layer 825 and no dielectric reinforcing layer may be used to attach the thermal barrier 820 to an adjacent battery cell. In one embodiment, one or more dielectric reinforcing layers 810, 827, adhesive layers 812, 827 on the insulating layer 802 or 822 may be replaced by a wear-resistant layer, in this case the outer layer of the thermal barriers 800, 820. In one embodiment, the thermal barrier 800 or 820 further includes at least one wear-resistant layer in addition to the reinforcing layers 810, 827 and adhesive layers 812, 827. Abrasion-resistant layers may be placed between the insulating layers 802, 822 and the dielectric reinforcing layers 810, 827. In this case, the dielectric reinforcing layers 810, 827 are the outer layers of the thermal barriers 800, 820. Alternatively, the dielectric reinforcing layers 810, 827 may be placed between the insulating layers 802, 822 and the abrasion-resistant layers. In this case, the abrasion-resistant layers are the outer layers of the thermal barriers 800, 820. The insulating layers 802, 822, the abrasion-resistant layers, and the dielectric reinforcing layers 810, 827 may be bonded together by adhesive layers such as adhesive layers 812, 825.

[0078] Figure 9A shows another embodiment of the thermal barrier 900. The thermal barrier 900 includes a core 902. Some configurations of the core 902 include single layers of insulating material such as insulating layers 202, 302, 402, 502, 602, 702, and 802, as described above in relation to Figures 2 to 8B. In one embodiment, the core 902 includes multiple layers. In one embodiment, at least one of the multiple layers includes insulating material. In one embodiment, the insulating material includes aerogel material, but the present invention is not limited thereto. In one embodiment, the insulating material includes reinforced aerogel material such as fiber-reinforced aerogel material or foam-reinforced aerogel material. In some embodiments, additional layers within the core 902 may include, but are not limited to, a thermal conductive layer such as a metal layer, an encapsulation layer such as a polymer film layer, a dielectric reinforcing layer such as a mica layer, and an elastic layer such as a foam layer. In one embodiment, the core 902 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 shown in Figures 1A to 8B. In one embodiment, the core 902 includes one or more layers selected from the layers of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 shown in Figures 1A to 8B. In one embodiment, the core 902 includes an abrasion-resistant layer on top of the insulating layer or between the insulating layer and the dielectric reinforcement layer.

[0079] In the configuration shown in Figure 9A, the thermal barrier 900 further includes a dielectric reinforcing layer 906 that encloses the core 902. The dielectric reinforcing layer 906 includes edge seals 904 on third and fourth subsurfaces (i.e., surfaces in the XY plane in Figure 9A). The edge seals 904 cover the edges of the core 902. In one embodiment, the dielectric reinforcing layer 906 is formed from a material that is more resistant to abrasion than one or more layers of the core 902, as described above.

[0080] Furthermore, the dielectric reinforcing layer 906 may contain fine particles generated by some of the materials used as insulation in the core 902. In embodiments of the aerogel insulation material contained in the core 902, the aerogel insulation material may tend to generate fine particles and / or may be easily damaged during handling. The dielectric reinforcing layer 906 is included to suppress fine particles and reduce damage to the core 902 during handling. One embodiment of the dielectric reinforcing layer 906 includes a mica-containing layer, which may include a silicone polymer matrix filled with mica particles. The silicone acts as a binder for the mica particles, resulting in a flexible composite with low thermal conductivity. In one embodiment, the silicone / mica composite used to form the dielectric reinforcing layer 906 may be bendable without cracking and have low thermal conductivity (e.g., 0.4 watts / meter Kelvin to 1.0 watts / meter Kelvin).

[0081] Figure 9A further shows a plan view showing an enlarged view of the edge of the secondary surface of the edge seal 904 of the dielectric reinforcement layer 906. As shown in this figure, the sheet of dielectric reinforcement layer 906 continuously wraps around the core 902, and as a result, the sheet of dielectric reinforcement layer 906 covers the main surface of the core 902. The sheet of dielectric reinforcement layer 906 is continuous (seamless) around the edge 904A shown in the inserted enlarged view. A single seam 912 within the sheet of dielectric reinforcement layer 906 is located at the edge 904B.

[0082] Present at both ends of 904A and 904B is a gap 914 between the inner surface of the dielectric reinforcement layer 906 and the core 902. The gap 914, in which air is trapped, acts as an insulator to prevent heat and particles from moving to adjacent battery cells in the event of thermal runaway. In some embodiments, the gap 914 can be filled with one or more other insulating materials, such as foaming materials, expanding materials, electron glass, ceramics, polymers, rubber, aerogels, air, oil, other insulating materials, or a combination thereof. In one embodiment, a portion of the core 902 extends into the gap 914.

[0083] Figure 9B shows another embodiment of the thermal barrier 950. The thermal barrier 950 includes a core 952. Similar to Figure 9A, in one embodiment, the core 952 includes a single layer of thermal insulation material, such as the insulating layers 202, 302, 402, 502, 602, 702, and 802 shown in Figures 2 to 8B. In one embodiment, the core 952 includes multiple layers. In one embodiment, at least one of the multiple layers includes thermal insulation material. In one embodiment, the thermal insulation material includes aerogel material, but the present invention is not limited thereto. In one embodiment, the thermal insulation material includes a reinforced aerogel material, such as fiber-reinforced aerogel material or foam-reinforced aerogel material. In one embodiment, the core 952 includes an abrasion-resistant layer on top of the insulating layer or between the insulating layer and the dielectric reinforcement layer. In selected embodiments, additional layers within the core 952 may include, but are not limited to, a thermal conductive layer such as a metal layer, an encapsulation layer such as a polymer film layer, a dielectric reinforcement layer such as a mica layer, an elastic layer such as a foam layer, and the like. In one embodiment, the core 902 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 shown in Figures 1A to 8B. In one embodiment, the core 902 includes one or more layers selected from the layers of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 shown in Figures 1A to 8B.

[0084] In the configuration shown in Figure 9B, the thermal barrier 950 includes a dielectric edge seal 956 surrounding the edge of the core 952 (which is equivalent to what is described above as a secondary surface in the context of Figures 7A-7C). The dielectric edge seal 956 and the core 952 form a gap 954 between them. In some embodiments, the gap 954 can be filled with another material, such as foam material, expandable material, electron glass, ceramic, polymer, rubber, aerogel, air, oil, other insulating material, or a combination thereof. In one embodiment, a portion of the core 902 extends into the gap 954. One advantage of reinforcing only the edge of the core 952 is a reduction in the amount of material required. Another advantage of reinforcing only the edge of the core 952 is protecting only the edge that is likely to break during handling. Another advantage of reinforcing only the edge of the core 952 is maintaining a thin thermal barrier 950 between battery cells while reinforcing the portion of the thermal barrier 950 that is exposed to contact with adjacent components, such as battery housing components. Another advantage of reinforcing only the edges of the core 952 is flexibility in manufacturing. By reinforcing only the edges of the core 952, the dielectric edge seal 956 can be applied to the thermal barrier 950 in multiple area configurations. The only concern between different area configurations is selecting a dielectric edge seal 956 of the appropriate length to cover the edges of the core 952. In Figure 9B, two opposing edges of the core 952 are shown covered by the dielectric edge seal 956, but the invention is not limited thereto. Three or four sub-faces may be reinforced using the corresponding dielectric edge seal 956.

[0085] Figure 9B further shows an enlarged view 960 of the dielectric edge seal 956, which is shown wrapping around the edge of the core 952. In the configuration shown in Figure 9B, a fold 909 is formed at one end of the dielectric edge seal 956. An end view 970 of the thermal barrier 950 is further shown in Figure 9B. As mentioned above, it may be advantageous to maintain a thinner central portion of the thermal barrier 950 between the battery cells. The central portion 953 of the thermal barrier 950 is shown in Figure 970, and the central portion 953 is thinner than the reinforced edge seal 956.

[0086] Figure 10A shows another embodiment of the thermal barrier 1000. The thermal barrier 1000 includes a core 1002. Similar to the other embodiments, in one embodiment, the core 1002 includes a single layer of thermal insulation material, such as the insulating layers 202, 302, 402, 502, 602, 702, and 802 shown in Figures 2 to 8B. In one embodiment, the core 1002 includes multiple layers. In one embodiment, at least one of the multiple layers includes thermal insulation material, such as an insulating layer. In one embodiment, the thermal insulation material includes an aerogel material, but the present invention is not limited thereto. In one embodiment, the thermal insulation material includes a reinforced aerogel material, such as a fiber-reinforced aerogel material or a foam-reinforced aerogel material. In one embodiment, the core 1002 includes an abrasion-resistant layer on top of the insulating layer or between the insulating layer and the dielectric reinforcement layer. In selected embodiments, the additional layers within the core 1002 may include, but are not limited to, a thermal conductive layer such as a metal layer, an encapsulation layer such as a polymer film layer, a dielectric reinforcing layer such as a mica layer, or an elastic layer such as a foam layer. In one embodiment, the core 1002 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 shown in Figures 1A to 8B. In one embodiment, the core 1002 includes one or more layers selected from the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 shown in Figures 1A to 8B.

[0087] In the configuration shown in Figure 10A, the thermal barrier 1000 includes dielectric edge seals 1006 on two sub-planes of the XZ plane in Figure 10A (described above as the "third" and "fourth" sub-planes). The dielectric edge seals 1006 and the core 1002 form a gap 1004. In some embodiments, the gap 1004 can be filled with another material, such as foam material, expandable material, electron glass, ceramic, polymer, rubber, aerogel, air, oil, other insulating material, or a combination thereof. In one embodiment, a portion of the core 1002 extends into the gap 1004. There are many advantages to simply reinforcing the edges of the core 1002, as described above with respect to the configuration of other embodiments. In Figure 10A, two opposing edges of the core 1002 are shown covered by the dielectric edge seals 1006, but the present invention is not limited thereto. Three edges may also be reinforced, or all four edges may be reinforced.

[0088] The configuration of Figure 10A further illustrates the encapsulation layer 1008. In the embodiment of Figure 10A, the encapsulation layer 1008 covers all of the main surface and secondary surface (equivalently, the edge) of the core 1002. In one embodiment, the encapsulation layer 1008 covers the entire surface of the core 1002. The encapsulation layer 1008 is shown to encapsulate a dielectric edge seal 1006 together with other components of the thermal barrier 1000, which is located in a continuous sheet. The dielectric edge seal 1006 is positioned between the core 1002 and the encapsulation layer 1008. In one embodiment, the encapsulation layer 1008 comprises a flexible polymer sheet. Other flexible sheet materials are also within the scope of the present invention. In one embodiment, the encapsulation layer 1008 is fixed using a pressure-sensitive adhesive strip, tape, etc. In one embodiment, the encapsulation layer 1008 contains adhesive on all or part of one surface, providing an attachment mechanism to the core 1002 and the dielectric edge seal 1006. In one embodiment, the encapsulation layer 1008 is an adhesive layer such as a pressure-sensitive adhesive layer.

[0089] Figure 10A further shows an enlarged view 1010 of the dielectric edge seal 1006, which is shown enclosing the edge of the core 1002 along with the gap 1004 in between. In the configuration shown in Figure 10A, it is shown that the encapsulation layer 1008 covers both the core 1002 and the dielectric edge seal 1006. The dielectric edge seal 1006 is positioned between the core 1002 and the encapsulation layer 1008. An end view 1020 of the thermal barrier 1000 is further shown in Figure 10A. As mentioned above, it may be advantageous to maintain a thinner central portion of the thermal barrier 1000 between the battery cells. The central portion 1003 of the thermal barrier 1000 shown in Figure 1020 is thinner than the reinforced edge of the core 1002.

[0090] Figure 10B shows another embodiment of the thermal barrier 1050. The thermal barrier 1050 includes a core 1052. Similar to the other embodiments, in one embodiment, the core 1052 includes a single layer of thermal insulation material, such as the insulating layers 202, 302, 402, 502, 602, 702, and 802 shown in Figures 2 to 8B. In one embodiment, the core 1052 includes multiple layers. In one embodiment, at least one of the multiple layers includes thermal insulation material. In one embodiment, the thermal insulation material includes aerogel material, but the present invention is not limited thereto. In one embodiment, the thermal insulation material includes a reinforced aerogel material, such as fiber-reinforced aerogel material or foam-reinforced aerogel material. In one embodiment, the core 1052 includes an abrasion-resistant layer on top of the insulating layer or between the insulating layer and the dielectric reinforcement layer. In selected embodiments, the additional layers within the core 1052 may include, but are not limited to, a thermal conductive layer such as a metal layer, an encapsulation layer such as a polymer film layer, a dielectric reinforcing layer such as a mica layer, an elastic layer such as a foam layer, and the like. In one embodiment, the core 902 is one of the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 shown in Figures 1A to 8B. In one embodiment, the core 902 includes one or more layers selected from the thermal barriers 110, 160, 200, 300, 400, 500, 600, 700, or 800 shown in Figures 1A to 8B.

[0091] In the configuration shown in Figure 10B, the thermal barrier 1050 includes a dielectric edge seal 1056 surrounding the edge of the core 1052. The dielectric edge seal 1056 and the core 1052 form a gap 1054 between them. Reinforcing the secondary surfaces (whether as shown in Figure 10B or all four secondary surfaces) has many advantages, as discussed above with respect to other exemplary configurations. In Figure 10B, two opposing edges of the core 1052 are shown covered by the dielectric edge seal 1056, but the present invention is not limited thereto. Three edges (likewise, secondary surfaces) may also be reinforced, or all four edges may be reinforced.

[0092] The configuration in Figure 10B further illustrates the encapsulation layer 1058. In the configuration of Figure 10B, the encapsulation layer 1058 covers only the surface of the dielectric edge seal 1056 and the core 1052 adjacent to the dielectric edge seal 1056. In one embodiment, the encapsulation layer 1058 comprises a flexible polymer sheet. Other flexible sheet materials are also within the scope of the present invention. In one embodiment, the encapsulation layer 1058 is fixed using a pressure-sensitive adhesive strip, tape, etc. In one embodiment, the encapsulation layer 1058 contains adhesive on all or part of one surface, providing an attachment mechanism to the core 1052 and the dielectric edge seal 1056. In one embodiment, the encapsulation layer 1058 comprises tape. In one embodiment, the encapsulation layer 1058 can be replaced with an abrasion-resistant layer (e.g., an abrasion-resistant layer having adhesive properties).

[0093] Figure 10B further shows a magnified view 1060 of the edge of the thermal barrier 1050. The dielectric edge seal 1056 is shown enclosing the edge of the core 1052. In the configuration shown in Figure 10B, it is shown that the encapsulation layer 1058 covers only the edge portion of the core 1052 and the dielectric edge seal 1056. An end view 1070 of the thermal barrier 1050 is further shown in Figure 10B. As mentioned above, it may be advantageous to maintain a thinner central portion of the thermal barrier 1050 between the battery cells. The central portion 1053 of the thermal barrier 1050 is shown in Figure 1070, and the central portion 1053 is thinner than the reinforced edge.

[0094] Figure 11A shows a battery module 1100 including one or more thermal barriers as described herein. The battery system 1100 includes several battery cells 1112. The battery cells 1112 are configured to be placed within a battery housing 1102. The battery module 1100 includes one or more thermal barriers 1114 similar to the thermal barriers described with respect to Figures 9A to 10B. In the configuration shown in Figure 11A, the cooling plate 1110 is included on one side of the stack of battery cells 1112. In a selected configuration, the thermal barrier 1114 extends only beyond the lateral footprint of the battery cells 1112 on three sides, so that the cooling plate 1110 can contact the thermal barrier 1114 on a fourth side. In one embodiment, the thermal barriers 1114 include a heat conduction plate within their core. In these embodiments, contact between the heat conduction plate and the cooling plate 1110 facilitates heat conduction from between the battery cells 1112 to the cooling plate 1110, thereby diffusing or dissipating heat.

[0095] In the configuration shown in Figure 11A, one or more slots are included to engage with the thermal barrier 1114 and hold them in place within the housing 1102. In a thermal runaway event, gases and / or ejections may be released from the vents 1113 or other locations on the battery cells 1112. The addition of slots facilitates the containment of any hot gases and / or ejections. Figure 11A shows a first slot 1104 included in the side wall of the housing 1102. Although the slot 1104 is shown on the side of the housing 1102, the slot may also be included in the bottom or lid of the housing 1102. In the configuration shown in Figure 11A, the grooved plate 1106 is included in the grooved plate 1106 and includes several second slots 1107. The first slots 1104 and / or the second slots 1107 are positioned in alignment with the thermal barrier 1114 and hold them in place. The grooved plate 1106 is shown adjacent to the lid 1108, but the present invention is not limited thereto. The grooved plate 1106 may also be used adjacent to the bottom of the housing 1102 or on the side of the housing 1102.

[0096] Figure 11A also shows one or more secondary battery cell separators 1116. The secondary battery cell separators 1116 do not extend beyond the lateral self-print of the battery cell 1112. In one embodiment, the secondary battery cell separator 1116 includes a thermal conductive plate. While combinations of a thermal barrier 1114 and a secondary battery cell separator 1116 are shown, the present invention is not limited thereto. Other embodiments include only one or the other of the thermal barrier 1114 and the secondary battery cell separator 1116.

[0097] Figure 11B shows several possible cross-sectional configurations of the slots, such as the first slot 1104 and the second slot 1107 shown in Figure 11A. Figure 1120 shows the groove 1121. The groove 1121 includes a taper, where the top of the groove 1121 (e.g., the opening facing the inside of the housing) is wider than the bottom of the groove 1121 (e.g., the inner surface of the groove opposite the top). Dimension 1122 indicates the width of the top of the groove 1121. Dimension 1124 indicates the width of the dielectric edge seal of the thermal barrier 1123. As shown in the figure, the dimension 1122 of the taper helps to capture and align the thermal barrier 1123 during assembly.

[0098] Figure 1130 shows the groove 1131. The groove 1131 includes a geometric shape in which the top of the groove 1131 (e.g., the opening facing the inside of the housing) is narrower than the bottom of the groove 1131 (e.g., the inner surface of the groove opposite the top). Dimension 1132 indicates the width of the groove 1131 at the top. In one embodiment, the groove 1131 includes a contoured cross section that substantially reflects the cross section of the dielectric edge seal of the thermal barrier 1133. Dimension 1134 indicates the width of the dielectric edge seal (with the encapsulation layer) of the thermal barrier 1133. As shown in the figure, dimension 1132 is slightly narrower than dimension 1134. The narrow top and contoured shape improve the retention of the thermal barrier 1133 within the groove 1131.

[0099] Figure 1140 shows the groove 1141. The groove 1141 includes a geometric shape in which the top of the groove 1141 (e.g., the opening facing the inside of the housing) is narrower than the bottom of the groove 1141 (e.g., the inner surface of the groove opposite the top). Dimension 1142 indicates the width of the groove 1141 at the top. In one embodiment, the groove 1141 includes a trapezoidal cross-section. The trapezoidal cross-section allows for further variation in the size of the edges of the thermal barrier 1143 compared to the contoured cross-section of the groove 1131. Dimension 1144 indicates the width of the dielectric edge seal of the thermal barrier 1143. As shown in the figure, dimension 1142 is slightly narrower than dimension 1144. The narrow top and trapezoidal cross-section improve the retention of the thermal barrier 1143 within the groove 1141.

[0100] Figure 1150 shows the groove 1151. The groove 1151 has a geometric shape in which the top of the groove 1141 (e.g., the opening facing the inside of the housing) is substantially the same as the bottom of the groove 1151 (e.g., the inner surface of the groove opposite the top). Dimension 1152 shows the width of the groove 1151 at the top and bottom. Dimension 1154 shows the width of the dielectric edge seal of the thermal barrier 1153. As shown in the figure, dimension 1152 is slightly wider than dimension 1154. This configuration facilitates positioning the thermal barrier 1153 within the groove 1151, especially if the dielectric edge seal of the thermal barrier 1153 is not very elastic and does not easily deform within the groove 1151.

[0101] Figure 12 shows a battery module 1200 including one or more thermal barriers as described herein. The battery module 1200 includes several battery cells 1212. The battery cells 1212 are configured to be placed within a battery housing 1202. The battery module 1200 includes one or more thermal barriers 1214 similar to the thermal barriers described with respect to Figures 9A to 10B.

[0102] In the configuration shown in Figure 12, one or more slots are included to engage with the thermal barrier 1214 and hold them in place within the housing 1202. In a thermal runaway event, gases and / or ejections may be released from vents 1213 or other locations on the battery cells 1212. The addition of slots facilitates the containment of any hot gases and / or ejections. Figure 12 shows a first slot 1204 included in the side wall of the housing 1202. Although the slot 1204 is shown on the side of the housing 1202, slots may also be included in the bottom or lid of the housing 1202. In the configuration of Figure 12, the upper grooved plate 1206 adjacent to the lid 1208 includes several second slots 1207. The bottom grooved plate 1218 is also shown with several third slots 1219. In one embodiment, the bottom grooved plate 1218 is a cooling plate. In one embodiment, the bottom grooved plate 1218 may contain a flow of coolant. The first slot 1204, the second slot 1207, and the third slot 1219 are positioned in alignment with the thermal barrier 1214 and hold them in place.

[0103] Figure 12 also shows one or more secondary battery cell separators 1216. The secondary battery cell separators 1216 do not extend beyond the lateral self-tprint of the battery cell 1212 (e.g., the largest surface area of ​​the battery cell). In one embodiment, the secondary battery cell separator 1116 includes a thermal conductive plate, one or more of the upper plate 1206 and the bottom plate 1218 being formed from metal or other conductors and functioning as a cooling plate. In one embodiment, the thermal barrier 1214 extends beyond the lateral self-tprint of the battery cell 1212. While combinations of the thermal barrier 1214 and the secondary battery cell separator 1216 are shown, the present invention is not limited thereto. Other embodiments include only one or the other of the thermal barrier 1214 and the secondary battery cell separator 1216.

[0104] Figure 13A shows another embodiment of the thermal barrier 1300. The thermal barrier 1300 is shown aligned with the battery cell 1302. The lateral footprint 1303 of the battery is indicated by projection lines 1304 so that it lies within the central portion of the thermal barrier 1300. Although only one thermal barrier 1300 and one battery cell 1302 are shown, it should be understood that this configuration can be extended to a battery module with multiple thermal barriers 1300 and multiple battery cells 1302, as described in this disclosure.

[0105] In the configuration shown in Figure 13A, the dielectric edge seal 1306 is shown around the edge of the core 1301 of the thermal barrier 1300. In the configuration shown in Figure 13A, the corner 1308 of the core 1301 is not covered by the dielectric edge seal 1306. This configuration facilitates manufacturing, given that the double thickness of the dielectric edge seal 1306 at the corner is avoided.

[0106] Figure 13B shows an end view of the thermal barrier 1300 having a battery cell 1302 positioned adjacent to the thermal barrier 1300. The core 1301 is shown together with a dielectric edge seal 1306 positioned at the edge of the thermal barrier 1300. The battery cell 1302 is shown in place within the lateral battery footprint 1303 (e.g., the maximum surface area of ​​the battery). The dielectric edge seal 1306 is shown to be thicker than the core 1301. The battery footprint is smaller than the maximum surface area of ​​the core 1301. A portion of the encapsulation layer 1310 above the dielectric edge seal 1306 is positioned between the battery cell 1302 and the core 1301, while the dielectric edge seal 1306 is outside the footprint of the battery cell 1302. As described above, this configuration keeps the overall dimensions of the battery module smaller by allowing a thin thermal barrier 1300 within the lateral battery footprint 1303, while the edges of the thermal barrier 1300 are reinforced.

[0107] In one embodiment, the encapsulation layer 1310 extends to cover the entire lateral battery footprint 1303. In a selected embodiment, portions such as the tape securing the dielectric edge seal 1306, the encapsulation layer, etc., are located within the lateral battery footprint 1303. The encapsulation layer 1310 has a substantially smaller thickness than the dielectric edge seal 1306. Thus, the thermal barrier engages with the battery housing thinner within the battery footprint 1303 and thicker beyond the battery footprint 1303. Figure 13C shows another diagram of the thermal barrier 1350. The central portion 1352 of the thermal barrier 1350 is shown, which corresponds to the lateral battery footprint, similar to the diagram in Figure 13A. In the configuration shown in Figure 13C, the dielectric edge seal 1356 is shown around the edge of the core of the thermal barrier 1350. In the configuration shown in Figure 13C, the corners 1354 of the core are covered by the dielectric edge seal 1356. This configuration eliminates possible pathways at the core corners through which gas and / or ejecta may leak through the thermal barrier 1350 in the event of a thermal runaway event. In the configuration of Figure 13C, the fourth edge 1353 does not include any dielectric edge seals 1356. This configuration may allow thermal contact with a cooling plate, as shown in Figure 11A.

[0108] Thermal barriers with dielectric reinforcement layers of various configurations Figure 14A shows another embodiment of the thermal barrier 1400. The thermal barrier 1400 includes an insulating layer 1402 and a dielectric reinforcing layer 1403 that forms a lamination with the insulating layer 1402. In Figure 14A, the dielectric reinforcing layer 1403 includes a fold 1407 that, together with the first side 1404 and the second side 1406, forms an envelope. An edge seal 1408 similar to the edge seal described above is also shown as an option in the embodiment of Figure 14A. In one embodiment, the edge seal 1408 seals all three edges of the insulating layer 1402. Thermal barriers including an envelope configuration offer advantages such as easier edge containment along the fold 1407 and reduced manufacturing costs.

[0109] Figure 14B shows another embodiment of the thermal barrier 1410. The thermal barrier 1410 includes an insulating layer 1412 and a dielectric reinforcing layer 1413. The dielectric reinforcing layer 1413 has a U-shape with a first side 1414 and a second side 1416. The first side 1414 and the second side 1416 are connected by a bottom side 1417. The bottom side 1417 is perpendicular to the first side 1414 and the second side 1416. An edge seal 1418 seals the gap between the first side 1414 and the second side 1416 and surrounds the insulating layer 1412 between them.

[0110] Figure 14C shows another embodiment of the thermal barrier 1420. The thermal barrier 1420 includes an insulating layer 1422 and a dielectric reinforcing layer 1423. The dielectric reinforcing layer 1423 has a slot with an opening on one of its surfaces, for example, a secondary surface, thereby forming a pocket. The insulating layer 1422 fits into the slot through the opening to the pocket. The thermal barrier 1420 further includes an edge seal 1428 that seals the insulating layer 1422 within the slot of the dielectric reinforcing layer 1423, for example, sealing the opening of the pocket.

[0111] Thermal barrier having dielectric reinforcement layer and encapsulation layer Figure 15A shows a cross-sectional view of the thermal barrier 1500. The thermal barrier 1500 includes an insulating layer 1502 and dielectric reinforcing layers 1504 and 1506 on at least one opposing main surface of the insulating layer 1502. The thermal barrier 1500 further includes an encapsulation layer 1508 that encloses the insulating layer 1502 to prevent or contain fine particles from the insulating layer 1502. The encapsulation layer 1508 may completely or partially enclose the insulating layer 1502. In one embodiment, the encapsulation layer 1508 encloses the insulating layer 1502 as a whole. The encapsulation layer 1508 is positioned between the dielectric reinforcing layers 1504 and 1506. The thermal barrier 1500 may further include an adhesive layer (not shown) between the encapsulation layer 1508 and each of the dielectric reinforcing layers 1504 and 1506.

[0112] In one embodiment, the encapsulation layer 1508 may include polyethylene (PE), polypropylene (PP), polyvinyl chloride (PVC), polyethylene terephthalate (PET), polycarbonate (PC), other polymers, rubber, or resin films, or combinations thereof.

[0113] In one embodiment, the encapsulation layer 1508 may include an adhesive layer such as a pressure-sensitive adhesive (PSA). The encapsulation layer 1508 is pressed against the insulating layer 1502 and completely surrounds it. Dielectric reinforcing layers 1504 and 1506 may be pressed against and attached to the two main surfaces of the insulating layer 1502 by the encapsulation layer 1508.

[0114] Figure 15B shows a cross-sectional view of the thermal barrier 1510. The thermal barrier 1510 includes at least one of the dielectric reinforcing layers 1514 and 1516, and an insulating layer 1512 placed thereon. Unlike the thermal barrier 1500 shown with respect to Figure 15A, the insulating layer 1512 and the dielectric reinforcing layers 1514 and 1516 are all surrounded by an encapsulation layer 1518. The encapsulation layer 1518 prevents any possible fine particles from the insulating layer 1512 or the dielectric reinforcing layers 1514 and 1516. The encapsulation layer 1518 may also help to hold the insulating layer 1512 and the dielectric reinforcing layers 1514 and / or 1516 together without the use of adhesive between them. In other embodiments, the reinforcing layers 1514 and 1516 may be attached to or bonded to the insulating layer 1512, for example, using an adhesive (not shown), and the encapsulation layer 1518 may be attached to or bonded to the outer surface of the thermal barrier 1510, for example, using an adhesive (not shown). In some embodiments, the encapsulation layer may be attached to or bonded to itself, for example, by heat sealing or by the selective use of adhesive on overlapping surfaces.

[0115] Figure 15C shows a cross-sectional view of the thermal barrier 1520. The thermal barrier 1520 includes an insulating layer 1522 and two dielectric reinforcing layers 1524 and 1526 attached to the insulating layer 1522 by an adhesive 1523. In one embodiment, the adhesive 1523 is a spray adhesive, double-sided tape, or PSA.

[0116] Optionally, the thermal barrier 1520 in Figure 15C may further include adhesive 1527 for attachment to adjacent battery cells (not shown). In one embodiment, the adhesive 1527 is double-sided tape, PSA, or spray adhesive. In one embodiment, the adhesive 1527 has a shape of multiple stripes. In one embodiment, the adhesive 1527 is positioned at different locations on opposing surfaces of the thermal barrier 1520 to reduce the stacking thickness when multiple thermal barriers 1520 are used in a battery module. In one embodiment, the adhesive 1527 on the left side (negative X direction) of the thermal barrier 1520 is offset in the Z direction from the adhesive 1527 on the right side (positive X direction) of the thermal barrier 1520.

[0117] In some embodiments of Figure 15C, the adhesive 1527 and the encapsulation layer 1528 are protected by a release layer 1525, which can be removed when the thermal barrier 1520 is attached to the battery cell (not shown) to expose the adhesive 1527. If the encapsulation layer 1528 is PSA, the release layer 1525 is attached directly to the encapsulation layer 1528 without using the adhesive 1527.

[0118] Figure 15D shows an exploded view of the thermal barrier 1530. The thermal barrier 1530 includes an insulating layer 1532 and dielectric reinforcing layers 1534 and 1536. In one embodiment, the dielectric reinforcing layers 1534 and 1536 are attached to the main surface of the insulating layer 1532 by an adhesive 1533. The adhesive 1533 can cover the main surface of the insulating layer 1532 entirely or partially. In one embodiment, the adhesive 1533 may be an adhesive strip. In one embodiment, the adhesive can be sprayed onto the insulating layer 1532 or the dielectric reinforcing layers 1534.

[0119] The thermal barrier 1530 in Figure 15D may further include an encapsulation layer 1538 enclosing the insulating layer 1532 and the dielectric reinforcing layers 1534 and 1536. At least one of the encapsulation layers 1538 includes a main surface and at least one flap 1539 adjacent to the main surface. In some embodiments, one encapsulation layer has a main surface having the same or smaller footprint as the insulating layer 1532 and the dielectric reinforcing layers 1534 and 1536, while the other encapsulation layer includes at least one flap 1539. In various embodiments, at least one flap 1539 can be folded back to enclose and contact the other encapsulation layer, surrounding the insulating layer 1532 and the dielectric reinforcing layers 1534 and 1536.

[0120] The thermal barrier 1530 in Figure 15D may further include an adhesive layer 1537 for attaching the thermal barrier 1530 to a battery cell (not shown). The adhesive 1537 may be double-sided tape or a spray adhesive. The adhesive layer 1537 may optionally be protected from external damage such as scratches or fine dust by a release layer 1535. The release layer 1535 is removable when attaching the thermal barrier 1530 to a battery cell (not shown).

[0121] Figure 16 shows a battery module 1600 including one or more thermal barriers as described herein. Several battery cells 1602 are shown within a module housing 1604. One or more of the battery cells 1602 are isolated by at least one thermal barrier 1610. In Figure 16, a heat sink 1605 or cooling plate is included adjacent to one edge of the battery cells 1602 and the thermal barrier 1610. As described above, in one embodiment, one or more of the thermal barriers 1610 include a thermal conductive layer that helps to dissipate heat laterally from the heat sink 1605. A lid 1606 is shown housing the battery cells 1602 and the thermal barrier 1610 within the housing 1604. In one embodiment, an upper insulating layer 1608 is included to protect against heat leaking upward from the battery module 1600. In one embodiment, the upper insulating layer 1608 can withstand particle impact under extreme conditions (e.g., thermal runaway) to protect components (not shown) on the lid 1606. Embodiments of the upper insulating layer 1608 include, but are not limited to, aerogel materials. In one embodiment, the upper insulating layer 1608 includes a structure similar to the thermal barrier described herein, such as a dielectric reinforcing layer.

[0122] Battery modules and / or battery packs with the thermal barrier described above are used in several electronic devices. Figure 17 shows an electronic device 1700 including a battery module 1710. The battery module 1710 is coupled to a functional electronic device 1720 by a circuit 1712. In the illustrated configuration, the battery module 1710 and the circuit 1712 are housed in a housing 1702. A charging port 1714 coupled to the battery module 1710 is shown to facilitate recharging of the battery module 1710 when needed.

[0123] In one embodiment, the functional electronic device 1720 includes devices such as semiconductor devices equipped with transistors and memory circuits. The semiconductor devices include, but are not limited to, telephones, computers, display screens, and navigation systems.

[0124] Figure 18 shows another electronic system utilizing a battery module, including the thermal management system described above. An electric vehicle 1800 is shown in Figure 18. The electric vehicle 1800 includes a chassis 1802 and wheels 1822. In the illustrated embodiment, each wheel 1822 is coupled to a drive motor 1820. A battery module 1810 coupled to the drive motor 1820 by circuit 1806 is shown. A charging port 1804 coupled to the battery module 1810 is shown to facilitate recharging of the battery module 1810 when needed.

[0125] Electric vehicles 1800 may include, but are not limited to, consumer vehicles such as automobiles and trucks. Commercial vehicles such as tractors and semi-trucks are also within the scope of the present invention. Although four-wheeled vehicles are shown, the present invention is not so limited. For example, two-wheeled vehicles such as motorcycles and scooters are also within the scope of the present invention.

[0126] To better illustrate the methods and apparatus disclosed herein, a non-limiting list of embodiments is provided herein.

[0127] Embodiment 1. A battery module comprising several battery cells, at least one thermal barrier separating selected battery cells within the several battery cells, the thermal barrier comprising an insulating layer, and a dielectric reinforcing layer forming a laminate with the insulating layer.

[0128] Embodiment 2. The battery module according to Embodiment 1, wherein the dielectric reinforcing layer includes mica.

[0129] Embodiment 3. The battery module according to Embodiment 2, wherein the mica is contained in the silicone binder.

[0130] Embodiment 4. The battery module according to Embodiment 1, wherein the insulating layer includes aerogel.

[0131] Embodiment 5. The battery module according to Embodiment 1, wherein the dielectric reinforcing layer includes pairs of dielectric reinforcing layers on both main surfaces of the insulator layer.

[0132] Embodiment 6. The battery module according to Embodiment 1, wherein the dielectric reinforcing layer is attached to the insulating layer with an adhesive.

[0133] Embodiment 7. The battery module according to Embodiment 6, wherein the adhesive comprises a first pressure-sensitive adhesive.

[0134] Embodiment 8. The battery module according to Embodiment 6, further comprising a second pressure-sensitive adhesive for attaching the thermal barrier to at least one battery cell.

[0135] Embodiment 9. A battery module comprising: several battery cells in a module housing, the battery cells having a lateral footprint; a lid enclosing the module housing and covering the several battery cells, defining an upper space between the several battery cells and the lid; at least one thermal barrier separating selected battery cells within the several battery cells, the thermal barrier having an insulating layer having a lateral footprint equal to or greater than the lateral footprint of the battery cells; and a reinforcing layer comprising a dielectric that forms a lamination with the insulating layer, the reinforcing layer comprising the dielectric extending beyond the lateral footprint of the insulating layer.

[0136] Embodiment 10. The battery module according to Embodiment 9, wherein the reinforcing layer includes a pair of reinforcing layers on both main surfaces of the insulating layer.

[0137] Embodiment 11. The battery module according to Embodiment 10, wherein the reinforcing layer extends into the upper space.

[0138] Embodiment 12. The battery module according to Embodiment 9, further comprising a seal between the battery cell and the lid.

[0139] Embodiment 13. The battery module according to Embodiment 9, wherein the reinforcing layer extends laterally upward from the side surface of the insulating layer.

[0140] Embodiment 14. The battery module according to Embodiment 9, further comprising cooling plates adjacent to the bottom edges of some of the battery cells.

[0141] Embodiment 15. The battery module according to Embodiment 9, wherein the reinforcing layer is angled outward from the insulating layer.

[0142] Embodiment 16. The battery module according to Embodiment 9, wherein the insulating layer includes aerogel.

[0143] Embodiment 17. The battery module according to Embodiment 9, wherein the reinforcing layer includes mica.

[0144] Embodiment 18. The battery module according to Embodiment 9, further comprising an upper thermal barrier between the several battery cells and the lid.

[0145] Embodiment 19. The battery module according to Embodiment 18, wherein the upper thermal barrier comprises a lamination of aerogel and mica.

[0146] Embodiment 20. A battery module comprising several battery cells in a module housing, the battery cells having a lateral footprint; a lid enclosing the module housing and covering the several battery cells, the lid defining an upper space between the several battery cells and the lid; at least one layered thermal barrier separating selected battery cells within the several battery cells, the thermal barrier comprising an insulating layer; a reinforcing layer comprising a dielectric that forms a lamination with the insulating layer; and an edge seal, the layered thermal barrier being dimensionalized such that the edge seal contacts the lid.

[0147] Embodiment 21. The battery module according to Embodiment 20, wherein the reinforcing layer includes a pair of reinforcing layers on both main surfaces of the insulating layer.

[0148] Embodiment 22. The battery module according to Embodiment 20, wherein the reinforcing layer includes a foldable envelope.

[0149] Embodiment 23. The battery module according to Embodiment 20, wherein the lid includes an upper insulating layer adjacent to the lower lid surface.

[0150] Embodiment 24. The battery module according to Embodiment 23, wherein the upper insulating layer includes a lamination of aerogel and mica.

[0151] Embodiment 25. The battery module according to Embodiment 20, wherein the insulating layer includes aerogel.

[0152] Embodiment 26. The battery module according to Embodiment 20, wherein the reinforcing layer includes mica.

[0153] Embodiment 27. The battery module according to Embodiment 20, wherein the edge seal includes tape.

[0154] Embodiment 28. The battery module according to Embodiment 20, wherein the edge seal includes an expanding material.

[0155] Embodiment 29. The battery module according to Embodiment 20, wherein the edge seal is wider than the width of the insulating layer and the reinforcing layer.

[0156] Embodiment 30. A thermal barrier comprising an insulating layer, an encapsulation layer enclosing the insulating layer, and a dielectric reinforcing layer forming a laminate with the insulating layer and the encapsulation layer.

[0157] Embodiment 31. The thermal barrier according to Embodiment 30, wherein the encapsulation layer encloses the dielectric reinforcing layer.

[0158] Embodiment 32. The thermal barrier according to Embodiment 30, wherein the insulating layer and the dielectric reinforcing layer are separated by the encapsulation layer.

[0159] Embodiment 33. The thermal barrier according to Embodiment 30, wherein the encapsulation layer is an adhesive layer.

[0160] Embodiment 34. The thermal barrier according to Embodiment 30, wherein the encapsulating layer is a pressure-sensitive adhesive layer.

[0161] Embodiment 35. The thermal barrier according to Embodiment 30, wherein the thermal barrier further includes an adhesive layer between the insulating layer and the dielectric reinforcing layer.

[0162] Embodiment 36. The thermal barrier according to Embodiment 30, wherein the thermal barrier further comprises an adhesive layer on the encapsulation layer.

[0163] Embodiment 37. The thermal barrier according to Embodiment 33, wherein the thermal barrier further includes a release layer on the adhesive layer.

[0164] Embodiment 38. The thermal barrier according to Embodiment 30, wherein the dielectric reinforcing layer is a first dielectric reinforcing layer disposed on one side of the insulating layer, and the thermal barrier further comprises a second dielectric reinforcing layer disposed on the opposite side of the insulating layer.

[0165] Embodiment 39. A battery module comprising several battery cells in a module housing, each having a corresponding lateral footprint of a battery cell; at least one thermal barrier separating selected battery cells within the several battery cells, the thermal barrier comprising a core insulating layer; and a dielectric reinforcing layer enclosing the core insulating layer.

[0166] Embodiment 40. Embodiment 1. A battery module comprising several battery cells, at least one thermal barrier separating selected battery cells within the several battery cells, the thermal barrier comprising an insulating layer, and a dielectric reinforcing layer forming a laminate with the insulating layer.

[0167] Embodiment 41. The battery system according to Embodiment 40, wherein the core insulating layer includes an aerogel layer.

[0168] Embodiment 42. The battery module according to Embodiment 40, wherein the dielectric edge seal includes mica.

[0169] Embodiment 43. The battery module according to Embodiment 40, further comprising a sealing layer covering the dielectric edge seal.

[0170] Embodiment 44. The battery module according to Embodiment 40, further comprising a encapsulation layer covering the entire dielectric edge seal and the entire core insulating layer.

[0171] Embodiment 45. The battery module according to Embodiment 40, wherein the dielectric edge seal covers the entire core insulating layer.

[0172] Embodiment 44. The battery module according to Embodiment 43, wherein the sealing layer includes a tape.

[0173] Embodiment 45. The battery module according to Embodiment 40, wherein the dielectric edge seal surrounds three edges and the fourth edge of the thermal barrier is in contact with a cooling plate.

[0174] Embodiment 46. The battery module according to Embodiment 40, wherein one or more sides of the housing include a groove corresponding to the edge of the at least one thermal barrier.

[0175] Embodiment 47. The battery module according to Embodiment 46, wherein the groove is narrower above the bottom of the groove.

[0176] Embodiment 48. The battery module according to Embodiment 46, wherein the groove is narrower at the bottom than at the top.

[0177] Embodiment 49. The battery module according to Embodiment 46, wherein the groove includes one or more grooves in the side wall of the housing.

[0178] Embodiment 50. The battery module according to Embodiment 40, further comprising one or more grooved plates housed within the housing.

[0179] Embodiment 51. The battery module according to Embodiment 50, wherein the one or more grooved plates include upper and bottom grooved plates.

[0180] Embodiment 52. The battery module according to Embodiment 40, wherein the dielectric edge seal surrounds the edge of the core insulator layer, rather than the corner.

[0181] Embodiment 53. The battery module according to Embodiment 40, wherein the dielectric edge seal surrounds the edges and corners of the core insulator layer.

[0182] Embodiment 53. The battery module according to Embodiment 40, wherein the dielectric edge seal is continuous across three edges of the core insulator layer.

[0183] Embodiment 54. The battery module according to Embodiment 40, wherein the dielectric edge seal covers a portion of the insulating layer on the lateral outer side of the lateral footprint of the battery cell.

[0184] Embodiment 54. The battery module according to Embodiment 40, further comprising a secondary battery cell separator having a footprint smaller than that of the thermal barrier.

[0185] The above description is intended to be illustrative, not restrictive. The above examples (or one or more of their embodiments) may be used in combination with each other. Other embodiments may be used, for example, by a person skilled in the art who examines the above description. The abstract is provided in accordance with 37 CFR §1.72(b) to enable the reader to quickly grasp the essence of the technical disclosure. It is submitted with the understanding that it is not to be used to interpret or limit the claims or their meaning. Also, in the embodiments for carrying out the invention described above, various features may be grouped together to streamline the disclosure. This should not be interpreted as meaning that any unclaimed disclosed feature is essential to any claim. Rather, the subject matter of the invention is not in all the features of a particular disclosed embodiment. Accordingly, the following claims are incorporated into the embodiments for carrying out the invention herein, and each claim is a separate embodiment, and it is intended that such embodiments can be combined with each other in various combinations or variations. The scope of the invention should be determined by referring to the appended claims, as well as the full extent of the equivalents to which such claims are granted.

[0186] While the subject matter of the present invention has been described with reference to specific embodiments and / or aspects, various modifications and changes can be made to these embodiments without departing from the broader scope of embodiments of the present disclosure. Such embodiments of the subject matter of the present invention may be referred to herein, individually or collectively, solely for convenience, without any intention to spontaneously limit the scope of this application to a single disclosure or inventive concept when multiple inventions are actually disclosed.

[0187] The embodiments illustrated herein are described in sufficient detail to enable those skilled in the art to carry out the disclosed teachings. Other embodiments may be utilized and derived therefrom, so as to be structural and logical substitutions and modifications without departing from the scope of this disclosure. Accordingly, the forms for carrying out the invention should not be constrained, and the scope of the various embodiments is defined only by the sufficient scope of the equivalents to which such claims are granted, in addition to the appended claims.

[0188] As used herein, the term “or” may be interpreted either inclusively or exclusively. Furthermore, multiple examples may be provided for resources, processes, or structures described herein as a single example. Moreover, the boundaries between various resources, processes, modules, engines, and datastores are arbitrary to some extent, and certain processes are shown in the context of a particular exemplary configuration. Other assignments of functionality are conceivable and may fall within the scope of various embodiments of this disclosure. In general, structures and functionalities represented as separate resources in the embodiments and / or configurations described above may be implemented as combined structures or resources. Similarly, structures and functionalities represented as single resources may be implemented as separate resources. These and other variations, modifications, additions, and improvements are within the scope of the embodiments of this disclosure represented by the appended claims. Accordingly, the specification and drawings should be considered illustrative rather than restrictive.

[0189] The above description for illustrative purposes is based on reference to specific embodiments and / or configurations. However, the above illustrative description is not intended to be exhaustive, nor is it intended to limit possible embodiments and / or configurations to the exact forms disclosed. Many variations and modifications are conceivable in light of the above teachings. The embodiments and / or configurations have been selected and described in order to best illustrate the principles involved and their practical applications, thereby enabling those skilled in the art to best utilize various embodiments and / or configurations with various variations as suitable for their particular intended use.

[0190] Furthermore, while terms such as "first," "second," etc., may be used herein to describe various elements, it should be understood that these elements should not be limited by these terms. These terms are used solely to distinguish one element from another. For example, without departing from the scope of the exemplary embodiments of this application, a first contact portion may be called a second contact portion, and similarly, a second contact portion may be called a first contact portion. The first and second contact portions are both contact portions, but they are not the same contact portion.

[0191] The terms used in describing exemplary embodiments herein are for the sole purpose of describing specific exemplary embodiments and are not intended to be limiting. Where used in describing aspects, configurations, embodiments and / or appended examples of the present invention, the singular forms “a,” “an,” and “the” are intended to also include the plural form unless the context explicitly indicates otherwise. The terms “and / or” as used herein are also understood to refer to and encompass any possible combination of one or more items described in association. The terms “comprise” and / or “comprising,” when used herein, specify the presence of a described feature, integer, step, operation, element, and / or component, but do not exclude the presence of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0192] As used herein, the term “if” may be interpreted, depending on the context, as “when,” “upon,” “in response to determining,” or “in response to detecting.” Similarly, the phrase “if it is determined” or “if a stated condition or event” may be interpreted, depending on the context, as “upon determining,” “in response to determining,” “upon detecting,” or “in response to detecting.”

Claims

1. An insulating layer having a first main surface, a second main surface facing the first main surface, a first secondary surface, and a second secondary surface facing the first secondary surface, wherein both the first secondary surface and the second secondary surface are perpendicular to the first main surface and the second main surface and connect them, At least one outer layer on at least one of the first main surface or the second main surface of the insulating layer, A first edge seal on the first subsurface and a second edge seal on the second subsurface, A thermal barrier, including

2. The thermal barrier according to claim 1, wherein the first edge seal and the second edge seal include an elastic material.

3. The thermal barrier according to claim 2, wherein the elastic material includes an elastic polymer material.

4. The thermal barrier according to claim 3, wherein the elastic polymer material further comprises a heat insulating material, a flame retardant material, or both.

5. The thermal barrier according to claim 1, further comprising a third subsurface and a third edge seal on the third subsurface, wherein the third edge seal is in contact with the first edge seal and the second edge seal.

6. The thermal barrier according to claim 5, wherein the first main surface and the second main surface are connected by a fourth sub-surface facing the third sub-surface, and the thermal barrier further includes a fourth edge seal on the fourth sub-surface, the fourth edge seal being in contact with the first edge seal and the second edge seal.

7. The thermal barrier according to claim 1, wherein the outer layer is an abrasion-resistant layer.

8. The thermal barrier according to claim 7, further comprising a dielectric reinforcing layer disposed between the insulating layer and the wear-resistant layer.

9. The thermal barrier according to claim 1, wherein the outer layer is a dielectric reinforcing layer.

10. The thermal barrier according to claim 9, further comprising a wear-resistant layer disposed between the insulating layer and the dielectric reinforcing layer.

11. The module housing further includes side walls, a bottom, and a top cover, The thermal barrier according to claim 1, wherein the first portion of the edge seal on the first subsurface is configured to form an interlocking fit with the upper cover of the module housing.

12. The thermal barrier according to claim 11, wherein the second portion of the edge seal on the second subsurface is configured to form an interlocking fit with the corresponding surface of the module housing.

13. The thermal barrier according to claim 11, wherein the third portion of the edge seal on the third sub-surface, the fourth portion of the edge seal on the fourth sub-surface, or both thereof, are configured to form an interlocking fit with the corresponding surface of the module housing.

14. A dielectric reinforcing layer, The first main surface and A second main surface opposite to the first main surface, At the first end of the dielectric reinforcing layer, a first sub-surface connected to the first main surface and the second main surface, The dielectric reinforcing layer comprises a first sub-surface connected to the first main surface and the second main surface at the first end of the dielectric reinforcing layer, and a second sub-surface facing the first sub-surface, the second sub-surface connected to the first main surface and the second main surface at the second end of the dielectric reinforcing layer, At least the dielectric reinforcing layer includes the first main surface, the second main surface, the first secondary surface, and a third secondary surface connected to the second secondary surface at the first and second ends of the dielectric reinforcing layer, The first main surface, the second main surface, the first secondary surface, the second secondary surface, and the third secondary surface define the internal slots of the battery pack housing, and the dielectric reinforcing layer, An insulating layer disposed within the internal slot, A thermal barrier, including

15. The thermal barrier according to claim 14, further comprising an edge seal on the insulating layer disposed within the internal slot, wherein the edge seal is on a fourth sub-surface opposite the third sub-surface, and the edge seal is in contact with the first main surface, the second main surface, the first sub-surface, and the second sub-surface.

16. The thermal barrier according to claim 15, wherein the edge seal comprises an elastic material.

17. The thermal barrier according to claim 16, wherein the elastic material includes an elastic polymer material.

18. The thermal barrier according to claim 17, wherein the elastic polymer material further comprises a heat insulating material, a flame retardant material, or both.

19. The thermal barrier according to claim 18, further comprising a module housing including side walls, a bottom surface, and a top cover, wherein the edge seal is configured to form an interlocking fit with the top cover of the module housing.

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