A highly thermally efficient phase-change heat dissipation composite material containing an immiscible heterogeneous organic phase-change material and an anisotropic filler, and a method for manufacturing the same.

Abstract

This invention relates to a highly thermally efficient phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and an anisotropic filler, and to a method for manufacturing the same. This invention relates to a highly thermally efficient phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and anisotropic filler, and to a method for manufacturing the same, which achieves high thermal conductivity, excellent dimensional stability, and efficient heat storage and thermal management by designing the structure of the phase-change composite material using an appropriate amount of thermally conductive anisotropic filler. This invention also relates to a highly thermally efficient phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and anisotropic filler, and to a method for manufacturing the same, which achieves both high thermal conductivity and excellent dimensional stability using hexagonal boron nitride (h-BN) and an incompatible heterogeneous organic phase-change material.

Description

Technical Field

[0001] The present invention relates to a high thermal efficiency phase change heat dissipation composite material containing immiscible heterogeneous organic phase change materials and anisotropic fillers, and a method for manufacturing the same. More specifically, the present invention relates to a high thermal efficiency phase change heat dissipation composite material containing immiscible heterogeneous organic phase change materials and anisotropic fillers that can achieve high thermal conductivity, excellent shape stability, efficient heat storage, and heat management by designing the structure of the phase change composite material using an appropriate amount of thermally conductive anisotropic fillers, and a method for manufacturing the same.

Background Art

[0002] As miniaturization and high functionality of electronic components progress and integration density increases, there is a problem that the heat generated per unit area of the device, that is, the heat density, significantly increases. If the heat generated in the operating device cannot be immediately released and the heat density increases, this may cause shortening of the lifespan and deterioration of performance due to overheating of the device, and furthermore, may cause serious problems such as explosion.

[0003] In order to solve the above problems, the need for the development of heat dissipation composite materials for effectively releasing unnecessary heat generated from operating devices has been increasing, and accordingly, efforts in related research have been actively carried out.

[0004] The thermal conductivity in the heat dissipation composite material is greatly affected by the formation of a physical heat transfer path through the thermally conductive filler. The heat transfer path largely depends on the content ratio of the filler. Although the higher the content of the filler, the easier it is to form the heat conduction path, there are problems that the density of the heat dissipation composite material increases and the processability significantly decreases. As a method for maximizing the heat transfer efficiency with a small amount of filler, forming an efficient filler network in the matrix can be mentioned.

[0005] Phase change materials (PCMs) can absorb and release heat from the outside without temperature changes during phase transition processes such as melting and solidification. Due to this property, they have attracted considerable interest in the fields of thermal energy storage and application, and research into using them as heat-dissipating composite materials is actively underway.

[0006] Organic phase-change materials, among phase-change materials, have the advantages of being less corrosive and toxic, and lower in cost, compared to inorganic phase-change materials. However, they have the limitation of having very low intrinsic thermal conductivity and latent heat capacity. The low thermal conductivity of the organic phase-change materials slows down the phase-change rate, making it difficult to efficiently dissipate heat at the application site.

[0007] Due to the limitations described above, there is a current need to develop highly thermally efficient phase-change composite materials that can overcome the low thermal conductivity of organic phase-change materials and efficiently absorb and release large amounts of heat. [Overview of the project] [Problems that the invention aims to solve]

[0008] The object of the present invention is to overcome the low thermal conductivity of organic phase change materials and to provide a highly thermally efficient phase change heat dissipation composite material containing an incompatible heterogeneous organic phase change material and an anisotropic filler that can efficiently absorb and release large amounts of heat, as well as a method for producing the same.

[0009] Furthermore, an object of the present invention is to provide a highly thermally efficient phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and anisotropic filler that exhibits high thermal conductivity, excellent dimensional stability, and efficient heat storage and thermal management, as well as a method for manufacturing the same.

[0010] The technical problems that this invention aims to solve are not limited to those described above, and other technical problems not described can be clearly understood by a person with ordinary skill in the art from the description of this invention. [Means for solving the problem]

[0011] To achieve the above objectives, the present invention provides a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and a thermally conductive anisotropic filler, wherein the incompatible heterogeneous organic phase-change material comprises a hydrophobic para-1-fin phase-change material and a hydrophilic phase-change material, and the thermally conductive anisotropic filler exhibits hydrophobicity.

[0012] In the present invention, the incompatible heterogeneous organic phase change material is characterized by being a mixture of the hydrophobic paraffin-based phase change material and the hydrophilic phase change material in a volume ratio of 1:(0.5~1.5).

[0013] In the present invention, the hydrophobic paraffin-based phase change material is paraffin wax, and the hydrophilic phase change material is polyethylene glycol.

[0014] In the present invention, the thermally conductive anisotropic filler is characterized by being hexagonal boron nitride (h-BN).

[0015] In the present invention, the thermally conductive anisotropic filler is contained in an amount of 1% to 9% by volume relative to 100% by volume of the phase-change heat dissipation composite material.

[0016] In the present invention, the phase-change heat dissipation composite material is characterized by exhibiting a latent heat enthalpy of 120 J / g to 240 J / g.

[0017] In the present invention, the thermally conductive anisotropic filler is contained in an amount of 10% to 49% by volume relative to 100% by volume of the phase-change heat dissipation composite material.

[0018] In the present invention, the phase-change heat dissipation composite material is characterized by exhibiting a thermal conductivity of 1 W / mK to 10 W / mK.

[0019] In the present invention, the thermally conductive anisotropic filler is contained in an amount of 50% to 60% by volume relative to 100% by volume of the phase-change heat dissipation composite material.

[0020] In the present invention, the phase-change heat dissipation composite material is characterized by exhibiting a thermal conductivity of 10 W / mK to 20 W / mK.

[0021] In the present invention, the thermally conductive anisotropic filler is characterized by having a particle size of 20 μm to 40 μm.

[0022] In the present invention, the phase-change heat dissipation composite material is characterized in that the thermally conductive anisotropic filler is attached to at least a portion of the surface of a droplet of hydrophilic phase-change material contained in the incompatible heterogeneous organic phase-change material, thereby forming a network.

[0023] Furthermore, the present invention provides a method for producing a highly thermally efficient phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and an anisotropic filler, comprising the steps of: melting and mixing a hydrophobic paraffin-based phase-change material and a hydrophilic phase-change material to produce an incompatible heterogeneous organic phase-change material; and adding a thermally conductive anisotropic filler to the incompatible heterogeneous organic phase-change material.

[0024] In the present invention, the process for producing the incompatible heterogeneous organic phase change material is characterized by simultaneously melting the hydrophobic paraffin-based phase change material and the hydrophilic phase change material under temperature conditions of 50°C to 70°C.

[0025] In the present invention, the process of producing the incompatible heterogeneous organic phase change material is characterized by mixing the hydrophobic paraffin-based phase change material and the hydrophilic phase change material in a volume ratio of 1:(0.5~1.5).

[0026] In the present invention, the hydrophobic paraffin-based phase change material is paraffin wax, and the hydrophilic phase change material is polyethylene glycol.

[0027] In the present invention, the thermally conductive anisotropic filler is characterized by being hexagonal boron nitride (h-BN).

[0028] In the present invention, the thermally conductive anisotropic filler is added in an amount of 1% to 9% by volume based on 100% by volume of the phase change heat dissipation composite material.

[0029] In the present invention, the thermally conductive anisotropic filler is added in an amount of 10% to 49% by volume based on 100% by volume of the phase change heat dissipation composite material.

[0030] In the present invention, the thermally conductive anisotropic filler is added in an amount of 50% to 60% by volume based on 100% by volume of the phase change heat dissipation composite material.

[0031] In the step of adding the thermally conductive anisotropic filler in the present invention, a thermally conductive anisotropic filler having a particle size of 20 μm to 40 μm is added and mixed.

Advantages of the Invention

[0032] By the above means for solving the problems, the present invention can overcome the low thermal conductivity of the organic phase change material and provide a high thermal efficiency phase change heat dissipation composite material containing immiscible heterogeneous organic phase change materials and anisotropic fillers that can efficiently absorb and release a large amount of heat, as well as a method for producing the same.

[0033] In addition, the present invention can provide a high thermal efficiency phase change heat dissipation composite material containing immiscible heterogeneous organic phase change materials and anisotropic fillers that has high thermal conductivity, excellent shape stability, and can perform efficient heat storage and heat management, as well as a method for producing the same.

[0034] Furthermore, the present invention can provide a high thermal efficiency phase change heat dissipation composite material that can be mass-produced by a simple manufacturing process, as well as a method for producing the same.

[0035] Furthermore, the present invention can provide a highly thermally efficient phase-change heat dissipation composite material that can absorb and release heat in response to the external temperature, and can be used as a heat dissipation material for electronic equipment, a building material, and a road material, as well as a method for manufacturing the same.

[0036] Furthermore, the present invention can provide a highly thermally efficient phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and an anisotropic filler, in which the latent heat capacity and thermal conductivity can be controlled by controlling the amount of thermally conductive anisotropic filler added, as well as a method for manufacturing the same.

[0037] The effects of the present invention are not limited in any way to those described above, and other effects not described can be clearly understood by those skilled in the art from the claims. [Brief explanation of the drawing]

[0038] [Figure 1] This figure shows the melting and solidification processes associated with the heating and cooling of the phase change material according to the present invention. [Figure 2] This figure shows the process of adding a thermally conductive anisotropic filler to a heterogeneous organic phase-change material according to the present invention to form a network of the filler. [Figure 3] This figure shows the thermal conductivity of the phase-change composite material according to the present invention, depending on the filler content. [Figure 4] This figure shows the latent heat capacity according to the filler content in the examples and comparative examples of the present invention. [Figure 5] This figure shows the change in shape over time during high-temperature heating in the examples and comparative examples according to the present invention. [Figure 6] This figure shows the change in shape over time during high-temperature heating in the examples and comparative examples according to the present invention. [Modes for carrying out the invention]

[0039] In this specification, while considering the function of the present invention, we have selected as many commonly used terms as possible. However, this may vary depending on the intentions of engineers in the art, precedents, the emergence of new technologies, etc. In certain cases, the applicant has arbitrarily selected some terms, in which case their meaning will be described in detail in the section describing the relevant invention. Therefore, the terms used in this invention are not merely names of terms, but are defined based on the meaning of the term and the overall content of the present invention.

[0040] Furthermore, unless otherwise specifically noted herein or if it is clearly inconsistent with the context, all terms used in this disclosure, including technical and scientific terms, have the same meaning as those commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms that are commonly used or defined in dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and should not be interpreted as ideal or overly formal unless explicitly defined in this application.

[0041] A numerical range includes the numerical values ​​defined in the range. All maximum numerical limits given herein include all even lower numerical limits, as lower numerical limits are clearly written. All minimum numerical limits given herein include all even higher numerical limits, as higher numerical limits are clearly written. All numerical limits given herein include all better numerical ranges within a wider numerical range, as narrower numerical limits are clearly written.

[0042] High thermal efficiency phase-change heat dissipation composite material containing incompatible heterogeneous organic phase-change materials and anisotropic fillers

[0043] The present invention relates to a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler.

[0044] The present invention relates to a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and a thermally conductive anisotropic filler, wherein the heterogeneous organic phase-change material includes a hydrophobic paraffin-based phase-change material and a hydrophilic phase-change material, and the thermally conductive anisotropic filler exhibits hydrophobicity.

[0045] The hydrophobic paraffin-based phase change material and the hydrophilic phase change material may have a melting point of 50°C to 60°C. When the hydrophobic paraffin-based phase change material and the hydrophilic phase change material are melted and mixed simultaneously, the interaction between the two materials is limited, and phase separation may occur.

[0046] When the hydrophobic thermally conductive anisotropic filler is added to the incompatible heterogeneous organic phase-change material that has undergone phase separation, droplets of the hydrophilic phase-change material may form in order to minimize the surface area with the hydrophilic phase-change material. A portion of the thermally conductive anisotropic filler adheres to the surface of these formed droplets, thereby reducing the instability of the interface of the highly thermally efficient phase-change heat dissipation composite material. Due to the structural stability described above, the phase-change heat dissipation composite material can have a high latent heat capacity. At the same time, a filler network structure is formed in which the thermally conductive anisotropic fillers easily connect to each other, improving thermal conductivity.

[0047] When the phase-change heat-dissipating composite material is heated, the thermally conductive anisotropic filler may be located in the hydrophilic phase-change material to stabilize its structure, and may also be isolated within the hydrophobic paraffin material.

[0048] With the above structure, the phase change material inside the phase change heat dissipation composite material does not leak out, and it exhibits superior shape stability compared to conventional composite materials using a single matrix in which thermally conductive fillers are irregularly dispersed.

[0049] The aforementioned phase-change heat-dissipating composite material may be capable of heat storage and heat dissipation during the melting and solidification processes caused by heating and cooling.

[0050] In the present invention, the immiscible heterogeneous organic phase change material may be a mixture of the hydrophobic paraffin-based phase change material and the hydrophilic phase change material in a volume ratio of 1:(0.5~1.5), and preferably a mixture in a volume ratio of 1:1.

[0051] In the present invention, the hydrophobic paraffin-based phase change material may be paraffin wax, and the hydrophilic phase change material may be polyethylene glycol, but the present invention is not limited to these in any way.

[0052] In the present invention, the thermally conductive anisotropic filler may be hexagonal coron nitride (h-BN), but the present invention is not limited thereto.

[0053] The hexagonal boron nitride may have high thermal conductivity and a structurally high aspect ratio, and may be capable of easily forming a network between fillers. Furthermore, the hexagonal boron nitride may exhibit hydrophobic properties.

[0054] In the present invention, the thermally conductive anisotropic filler may be present in an amount of 1% to 9% by volume relative to 100% by volume of the phase-change heat dissipation composite material.

[0055] If the aforementioned thermally conductive anisotropic filler is present in an amount of less than 1 volume%, there is a risk that a network for heat transfer within the heterogeneous organic phase transition material will not be formed.

[0056] In the present invention, the phase-change heat dissipation composite material may exhibit a latent heat enthalpy of 120 J / g to 240 J / g, and the phase-change heat dissipation composite material may exhibit excellent heat dissipation due to such a high latent heat enthalpy.

[0057] In the present invention, the thermally conductive anisotropic filler may be present in an amount of 10% to 49% by volume relative to 100% by volume of the phase-change heat dissipation composite material.

[0058] In the present invention, the phase-change heat dissipation composite material may exhibit a thermal conductivity of 1 W / mK to 10 W / mK.

[0059] In the present invention, the thermally conductive anisotropic filler may be present in an amount of 50% to 60% by volume relative to 100% by volume of the phase-change heat dissipation composite material. If the content of the thermally conductive anisotropic filler exceeds 60% by volume, the amount of the incompatible heterogeneous organic phase-change material contained in the phase-change heat dissipation composite material decreases, and there is a risk that a network for heat transfer within the heterogeneous organic phase-change material will not be formed.

[0060] In the present invention, the phase-change heat dissipation composite material may exhibit a thermal conductivity of 10 W / mK to 20 W / mK. The phase-change heat dissipation composite material may exhibit excellent heat dissipation characteristics due to the high thermal conductivity described above.

[0061] The phase-change heat dissipation composite material may be capable of controlling latent heat enthalpy and thermal conductivity by controlling the content of the thermally conductive anisotropic filler.

[0062] In the present invention, the thermally conductive anisotropic filler may have a particle size of 20 μm to 40 μm, and preferably has a particle size of 25 μm to 35 μm.

[0063] In the present invention, the phase-change heat dissipation composite material may have a structure in which the thermally conductive anisotropic filler is attached to any portion of the surface of a droplet of hydrophilic phase-change material contained in the incompatible heterogeneous organic phase-change material, thereby forming a network.

[0064] The network is formed as shown in Figure 2 and may be a path through which heat transfer occurs within the composite material.

[0065] The aforementioned phase-change heat dissipation composite material can be used as a heat dissipation material for electronic equipment, a building material, and a road material, but the present invention is not limited to these uses.

[0066] Method for manufacturing a highly thermally efficient phase-change heat dissipation composite material containing incompatible heterogeneous organic phase-change materials and anisotropic fillers.

[0067] The present invention relates to a method for producing a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler.

[0068] The present invention relates to a method for producing a highly thermally efficient phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and an anisotropic filler, comprising the steps of: melting and mixing a hydrophobic paraffin-based phase-change material and a hydrophilic phase-change material to produce an incompatible heterogeneous organic phase-change material; and adding a thermally conductive anisotropic filler to the heterogeneous organic phase-change material.

[0069] When the phase-change heat-dissipating composite material produced by the above manufacturing method is heated, the thermally conductive anisotropic filler may be located in the hydrophilic phase-change material to stabilize its structure, and may also be isolated within the hydrophobic paraffin material.

[0070] With the above structure, the phase change material inside the phase change heat dissipation composite material does not leak out, and it exhibits superior shape stability compared to conventional composite materials using a single matrix in which thermally conductive fillers are irregularly dispersed.

[0071] In the present invention, the step of producing the incompatible heterogeneous organic phase change material may be a step of simultaneously melting the hydrophobic paraffin-based phase change material and the hydrophilic phase change material under a temperature of 50°C to 70°C.

[0072] The hydrophobic paraffin-based phase change material and the hydrophilic phase change material may have a melting point of 50°C to 60°C. When the hydrophobic paraffin-based phase change material and the hydrophilic phase change material are melted and mixed simultaneously, the interaction between the two materials is limited, and phase separation may occur.

[0073] When the hydrophobic thermally conductive anisotropic filler is added to the incompatible heterogeneous organic phase-change material that has undergone phase separation, droplets of the hydrophilic phase-change material may form in order to minimize the surface area with the hydrophilic phase-change material. A portion of the thermally conductive anisotropic filler adheres to the surface of these formed droplets, thereby reducing the instability of the interface of the highly thermally efficient phase-change heat dissipation composite material. Due to the structural stability described above, the phase-change heat dissipation composite material can have a high latent heat capacity. At the same time, a filler network structure is formed in which the thermally conductive anisotropic fillers easily connect to each other, improving thermal conductivity.

[0074] In the present invention, the step of producing the incompatible heterogeneous organic phase change material may be a step of mixing the hydrophobic paraffin-based phase change material and the hydrophilic phase change material in a volume ratio of 1:(0.5~1.5).

[0075] In the present invention, the hydrophobic paraffin-based phase change material may be paraffin wax, and the hydrophilic phase change material may be polyethylene glycol, but the present invention is not limited to these in any way.

[0076] In the present invention, the thermally conductive anisotropic filler may be hexagonal coron nitride (h-BN), but the present invention is not limited thereto.

[0077] In the present invention, the hexagonal boron nitride may have high thermal conductivity and a structurally high aspect ratio, and may be capable of easily forming a network between fillers. Furthermore, the hexagonal boron nitride may exhibit hydrophobicity.

[0078] In the present invention, the thermally conductive anisotropic filler may be added in an amount of 1% to 9% by volume relative to 100% by volume of the phase-change heat dissipation composite material.

[0079] If the thermally conductive anisotropic filler is added in an amount of less than 1 volume%, there is a risk that a network for heat transfer within the heterogeneous organic phase-change material will not be formed. A high-thermal-efficiency phase-change heat dissipation composite material manufactured by adding the thermally conductive anisotropic filler in the volume ratio described above may exhibit a high latent heat enthalpy of 120 J / g to 240 J / g. As a result, the high-thermal-efficiency phase-change heat dissipation composite material can exhibit excellent heat dissipation properties.

[0080] In the present invention, the thermally conductive anisotropic filler may be added in an amount of 10% to 49% by volume relative to 100% by volume of the phase-change heat dissipation composite material.

[0081] A highly thermally efficient phase-change heat dissipation composite material manufactured by adding a thermally conductive anisotropic filler in the volume ratio described above may exhibit a thermal conductivity of 1 W / mK to 10 W / mK.

[0082] In the present invention, the thermally conductive anisotropic filler may be added in an amount of 50% to 60% by volume relative to 100% by volume of the phase-change heat dissipation composite material.

[0083] If the thermally conductive anisotropic filler is added in an amount exceeding 60 volume%, the amount of the incompatible heterogeneous organic phase-change material contained in the phase-change heat dissipation composite material will decrease, and there is a risk that a network for heat transfer within the heterogeneous organic phase-change material will not be formed.

[0084] A highly thermally efficient phase-change heat dissipation composite material manufactured by adding the thermally conductive anisotropic filler in the volume ratio described above may exhibit a thermal conductivity of 10 W / mK to 20 W / mK. The phase-change heat dissipation composite material may also exhibit excellent heat dissipation due to the high thermal conductivity described above.

[0085] The control method for the phase-change heat dissipation composite material may be a method that controls the latent heat enthalpy and thermal conductivity by controlling the amount of thermally conductive anisotropic filler added.

[0086] In the present invention, the step of adding the thermally conductive anisotropic filler may be a step of adding and mixing a thermally conductive anisotropic filler having a particle size of 20 μm to 40 μm, and preferably a step of adding and mixing a thermally conductive anisotropic filler having a particle size of 25 μm to 35 μm.

[0087] (Modes for carrying out the invention)

[0088] Examples

[0089] The following describes in detail some embodiments of the present invention, but it is clear that the present invention is not limited to these embodiments.

[0090] The advantages and features of the present invention, as well as the methods for achieving them, will become even clearer with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited in any way to the embodiments disclosed below and can be embodied in a variety of different forms. The following embodiments are merely provided to complete the disclosure of the present invention and to allow those who are ordinary skill in the art to fully understand the scope of the invention. The scope of the present invention is defined solely by the scope of the claims.

[0091] <Example 1> Non-mismatched heterogeneous organic phase-change heat dissipation composite material (PPB)

[0092] A paraffin wax matrix was mixed with polyethylene glycol in a 1:1 volume ratio to produce an immiscible heterogeneous organic phase-change material matrix. Next, hexagonal coron nitride (h-BN) filler was added to the immiscible heterogeneous organic phase-change material matrix to produce a phase-change heat-dissipating composite material containing a thermally conductive anisotropic filler. The h-BN filler was applied in the concentrations shown in Tables 1 and 2 below.

[0093] <Comparative Example 1> Paraffin-based single-matrix phase-change material (PWB)

[0094] A hexagonal boron nitride (h-BN) filler was added to a paraffin wax single matrix. The h-BN filler was applied in the concentrations shown in Tables 1 and 2 below.

[0095] <Comparative Example 2> Non-paraffinic single-matrix phase-change material (PEGB)

[0096] A hexagonal boron nitride (h-BN) filler was added to a polyethylene glycol single matrix. The h-BN filler was applied in the concentrations shown in Tables 1 and 2 below.

[0097] <Experimental Example 1> Measurement of thermal conductivity according to filler content

[0098] The thermal conductivity of the phase change materials produced in Example 1 and Comparative Examples 1-2 was measured according to the h-BN filler content, and the results are shown in Figure 3. The h-BN filler content per 100 volume of the phase change material is shown in Table 1 below.

[0099] [Table 1]

[0100] As shown in Figure 3, the incompatible heterogeneous organic phase-change heat dissipation composite material of Example 1 showed higher thermal conductivity than the single-matrix phase-change materials of Comparative Examples 1 and 2 at all h-BN filler contents.

[0101] From the above results, it was confirmed that the phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and anisotropic filler according to the present invention exhibits superior thermal conductivity compared to a phase-change material containing anisotropic filler in a single phase-change material matrix.

[0102] <Experimental Example 2> Measurement of latent heat enthalpy according to filler content

[0103] In the phase change materials produced in Example 1 and Comparative Examples 1-2, the latent heat enthalpy corresponding to the h-BN filler content was measured, and the results are shown in Figure 4. The h-BN filler content per 100 volume of the phase change material is shown in Table 2 below.

[0104] [Table 2]

[0105] As shown in Figure 4, the heterogeneous organic phase-change composite material of Example 1, which contains 1% to 5% by volume of the h-BN filler, exhibited a higher latent heat enthalpy than the single-matrix phase-change materials of Comparative Examples 1 and 2.

[0106] However, when the h-BN filler content exceeded 5 volume%, the latent heat capacity of the incompatible heterogeneous organic phase-change heat dissipation composite material of Example 1 decreased, and when the h-BN filler content exceeded 9 volume%, it exhibited a very low latent heat enthalpy compared to the single-matrix phase-change materials of Comparative Examples 1 and 2.

[0107] From the above results, it was confirmed that a phase-change heat dissipation composite material according to the present invention, containing 1% to 9% by volume of anisotropic filler relative to 100% by volume of the phase-change heat dissipation composite material, exhibits superior latent heat enthalpy compared to a phase-change material matrix containing anisotropic filler.

[0108] <Experimental Example 3> Observation of shape changes over time

[0109] The phase change materials produced in Example 1 and Comparative Examples 1-2 were exposed to a temperature of 100°C, and the change in shape over time was observed. The results are shown in Figure 5. The phase change material contains 3 volume% of h-BN filler per 100 volume% of the phase change material.

[0110] As shown in Figure 5, the single-matrix phase-change materials of Comparative Example 1 and Comparative Example 2 were found to melt 20 seconds after exposure to a temperature of 100°C, and after 30 seconds, a large amount of melting occurred along with leakage of the internal h-BN filler.

[0111] In contrast, the incompatible heterogeneous organic phase-change heat dissipation composite material of Example 1 was confirmed to maintain its shape stably even after 30 seconds had elapsed since exposure to a temperature of 100°C.

[0112] From the above results, it was confirmed that the phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and anisotropic filler according to the present invention exhibits superior dimensional stability compared to a phase-change material containing anisotropic filler in a single phase-change material matrix.

[0113] <Experimental Example 4> Observation of shape changes over time

[0114] The phase change materials produced in Example 1 and Comparative Examples 1-2 were exposed to a temperature of 100°C, and the change in shape over time was observed. The results are shown in Figure 6. The phase change material contains 20% by volume of h-BN filler per 100% by volume of the phase change material.

[0115] As shown in Figure 6, the paraffin-based single-matrix phase-change material of Comparative Example 1 began to melt 10 seconds after exposure to a temperature of 100°C, and after 20 seconds, a large amount of melting was observed, along with leakage of the internal h-BN filler, confirming that the material could not maintain its shape.

[0116] Furthermore, in Comparative Example 2, melting was observed after 20 seconds, and after 30 seconds, a large amount of melting was observed, along with leakage of h-BN filler.

[0117] In contrast, the incompatible heterogeneous organic phase-change heat dissipation composite material of Example 1 was confirmed to maintain its shape stably even after 30 seconds had elapsed since exposure to a temperature of 100°C.

[0118] From the above results, it was confirmed that the phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and anisotropic filler according to the present invention exhibits superior dimensional stability compared to a phase-change material containing anisotropic filler in a single phase-change material matrix.

Claims

1. It comprises an incompatible heterogeneous organic phase-change material and a thermally conductive anisotropic filler, The aforementioned incompatible heterogeneous organic phase change materials include hydrophobic paraffin-based phase change materials and hydrophilic phase change materials. The aforementioned thermally conductive anisotropic filler exhibits hydrophobic properties. A highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler, characterized by these features.

2. The aforementioned incompatible heterogeneous organic phase change material is The hydrophobic paraffin-based phase change material and the hydrophilic phase change material are mixed in a volume ratio of 1:(0.5 to 1.5). A highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 1.

3. The aforementioned thermally conductive anisotropic filler is It is hexagonal boron nitride (h-BN). A highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 1.

4. The aforementioned thermally conductive anisotropic filler is It is contained in an amount of 1% to 9% by volume relative to 100% by volume of the aforementioned phase-change heat dissipation composite material. A highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 1.

5. The aforementioned thermally conductive anisotropic filler is It is contained in an amount of 10% to 49% by volume relative to 100% by volume of the aforementioned phase-change heat dissipation composite material. A highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 1.

6. The aforementioned thermally conductive anisotropic filler is It is contained in an amount of 50% to 60% by volume relative to 100% by volume of the aforementioned phase-change heat dissipation composite material. A highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 1.

7. The aforementioned thermally conductive anisotropic filler is The particle size is 20 μm to 40 μm. A highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 1.

8. A process for producing an incompatible heterogeneous organic phase-change material by melting and mixing a hydrophobic paraffin-based phase-change material and a hydrophilic phase-change material, The process includes adding a thermally conductive anisotropic filler to the aforementioned incompatible heterogeneous organic phase change material. A method for producing a highly thermally efficient phase-change heat dissipation composite material containing an incompatible heterogeneous organic phase-change material and an anisotropic filler.

9. In the process of producing the aforementioned incompatible heterogeneous organic phase change material, Under temperature conditions of 50°C to 70°C, the hydrophobic paraffin-based phase change material and the hydrophilic phase change material are melted simultaneously. A method for producing a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 8.

10. In the process of producing the aforementioned incompatible heterogeneous organic phase change material, The hydrophobic paraffin-based phase change material and the hydrophilic phase change material are mixed in a volume ratio of 1:(0.5 to 1.5). A method for producing a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 8.

11. The aforementioned thermally conductive anisotropic filler is It is hexagonal boron nitride (h-BN). A method for producing a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 8.

12. The aforementioned thermally conductive anisotropic filler is It is added in an amount of 1 to 9 volumes relative to 100 volumes of the aforementioned phase-change heat dissipation composite material. A method for producing a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 8.

13. The aforementioned thermally conductive anisotropic filler is The aforementioned phase-change heat dissipation composite material is added in an amount of 10% to 49% by volume. A method for producing a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 8.

14. The aforementioned thermally conductive anisotropic filler is It is added at an amount of 50% to 60% by volume relative to 100% by volume of the aforementioned phase-change heat dissipation composite material. A method for producing a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 8.

15. In the step of adding the thermally conductive anisotropic filler, Add and mix in a thermally conductive anisotropic filler with a particle size of 20 μm to 40 μm. A method for producing a highly thermally efficient phase-change heat dissipation composite material comprising an incompatible heterogeneous organic phase-change material and an anisotropic filler as described in claim 8.

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