Photosensitive element module, camera module and electronic device

Abstract

A photosensitive element module, a camera module and an electronic device are provided. The photosensitive element module 11 has an optical path L, and includes a photosensitive element corresponding to the optical path, a reflecting element 120a facing and adjacent to the photosensitive element and bending the optical path, an optical multi-layer stacked structure layer 131 located farther from the photosensitive element than the reflecting element along the optical path, and a nano-rough surface including a plurality of irregularly shaped nano-protrusion structures arranged adjacent to each other, the nano-rough surface being provided on one side of the photosensitive element facing the reflecting element, thereby avoiding deterioration of optical quality and improving industrial utilization rate.

Description

[Technical field]

[0001] The present disclosure relates to a photosensitive element module and a camera module, and in particular to a photosensitive element module and a camera module used in a portable electronic device. [Background technology]

[0002] In recent years, portable electronic devices such as smart electronic devices and tablet computers have been rapidly developed and are prevalent in modern people's lives, and the camera modules and their photosensitive element modules mounted on the portable electronic devices have been actively developed accordingly. However, with the progress of science and technology, users' quality requirements for the photosensitive element modules have also been increasing. Summary of the Invention [Problem to be solved by the invention]

[0003] Specifically, infrared light is more easily transmitted through light-shielding elements than visible light, so it is likely to pass through the original light-shielding position from the bending point of the light path and reach the photosensitive surface, resulting in an inaccurate exposure of the screen and an inability to display accurate colors. Therefore, developing a photosensitive element module that can improve the problem that infrared light is prone to cause glare in folded telephoto lenses is an important and urgent problem to be solved in the industry. [Means for solving the problem]

[0004] According to the present disclosure, a photosensitive element module, a camera module and an electronic device are provided, and the arrangement of a reflective element, a nano-rough surface and an optical multi-layer stacked structure layer in the light path can help improve industrial utilization and improve glare problems.

[0005] According to one embodiment of the present disclosure, there is provided a photosensitive element module having an optical path, the photosensitive element corresponding to the optical path, a reflecting element facing and adjacent to the photosensitive element and bending the optical path, an optical multilayer stacked structure layer located along the optical path away from the photosensitive element relative to the reflecting element and having a reflectance of 10% or less for light having a wavelength of 450 nm to 600 nm, and a nano-rough surface provided on one side of the photosensitive element facing the reflecting element, the nano-rough surface including a plurality of nano-protrusion structures that are irregular in shape and adjacently arranged, have a width of 300 nm or less and a height of 350 nm or less, the reflectance of the nano-rough surface corresponding to the reflectance of the optical multilayer stacked structure layer, the wavelength at which the reflectance of the optical multilayer stacked structure layer is 50% is R50, the maximum reflectance of the nano-rough surface for wavelengths from 450 nm to R50 is 0.49% or less, and the photosensitive element module satisfies the condition 600 nm≦R50≦720 nm.

[0006] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflective element may comprise a prism including a light incident surface, at least one reflective surface and a light exit surface along the optical path, the light exit surface facing and adjacent to the nano-rough surface.

[0007] According to the embodiment of the photosensitive element module described in the previous paragraph, an optical multi-layer stacked structure layer may be provided on the light incident surface.

[0008] According to the embodiment of the photosensitive element module described in the previous paragraph, the prism may be a red light absorbing element.

[0009] According to the embodiment of the photosensitive element module described in the previous paragraph, at least one of the light input surface, the reflecting surface and the light output surface of the prism may include an aspheric surface, and the aspheric surface is arranged corresponding to the optical path.

[0010] According to the embodiment of the photosensitive element module described in the previous paragraph, the prism may further include a plurality of recessed structures arranged adjacent to each other and gradually narrowing in a direction approaching the optical path, with adjacent pairs of recessed structures forming tips, and the distance between adjacent pairs of tips may be between 0.3 mm and 2.9 mm.

[0011] According to the embodiment of the photosensitive element module described in the previous paragraph, the prism may be a glass element, may further include an injection mark, and is injection molded through the injection mark.

[0012] According to the embodiment of the photosensitive element module described in the previous paragraph, the prism may further include an edge surface, and the emission mark extends from the edge surface in a direction away from the optical path and becomes gradually wider in a direction approaching the edge surface.

[0013] According to the embodiment of the photosensitive element module described in the previous paragraph, the reflecting element may include a reflecting mirror that folds the optical path.

[0014] According to the embodiment of the photosensitive element module described in the previous paragraph, the reflective element may further include a frame integrally molded with the reflective mirror by embedded injection molding.

[0015] According to the embodiment of the photosensitive element module described in the previous paragraph, the reflective element may further include a nano-rough surface provided on at least a portion of the reflective mirror and the frame.

[0016] According to the embodiment of the photosensitive element module described in the previous paragraph, it may further include a holder covered by the photosensitive element and on which a reflective element is provided, and an air partition formed between the reflective element and the photosensitive element, surrounded by the holder, and at least partially overlapping with the nano-rough surface in the optical path.

[0017] According to the embodiment of the photosensitive element module described in the previous paragraph, the nano-rough surface may extend from the photosensitive surface to the holder and is provided on at least a portion of the holder.

[0018] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflective element may include a holder portion fixed relatively to the photosensitive element, and the photosensitive element module may further include an air partition formed between the reflective element and the photosensitive element, surrounded by the holder portion, and at least partially overlapping with the nano-rough surface in the optical path.

[0019] According to the embodiment of the photosensitive element module described in the previous paragraph, it may further include an infrared light absorbing coating provided on the reflective element, and the thickness of the infrared light absorbing coating may be 900nm to 5um.

[0020] According to the embodiment of the photosensitive element module described in the previous paragraph, it may further comprise a filter element, which may include a red light absorbing plate provided with the optical multi-layer stacked structure layer.

[0021] According to the embodiment of the photosensitive element module described in the previous paragraph, the photosensitive element may have a pixel size of 400 nm to 2000 nm and may include a plurality of pixel units, one of which includes a microlens, and the nano-rough surface is provided on the microlens in any one of the pixel units.

[0022] According to an embodiment of the present disclosure, there is provided a camera module including the photosensitive element module of the above embodiment and an imaging lens disposed on an object side of the photosensitive element module along an optical path.

[0023] According to the embodiment of the camera module described in the previous paragraph, it may further include an object-side reflective element disposed on the object side of the photosensitive element module and provided with an optical multi-layer stacked structure layer.

[0024] According to the embodiment of the camera module described in the previous paragraph, the imaging lens may include an object-side lens group provided on the object side of the object-side reflective element.

[0025] According to the camera module of the embodiment described in the previous paragraph, the imaging lens may include an image-side lens group disposed between the object-side reflective element and the photosensitive element module, and the optical multilayer stacked structure layer is disposed between the image-side lens group and the reflective element.

[0026] According to the embodiment of the camera module described in the previous paragraph, the camera module may further include an object-side reflective element disposed on the object side of the reflective element, and the object-side reflective element may include an infrared light absorbing coating having a thickness of 900 nm to 5 um, and the optical path passes through the infrared light absorbing coating.

[0027] According to the camera module embodiment described in the previous paragraph, the imaging lens may include a plurality of lenses arranged in sequence along the optical path, and the optical multi-layer stack structure layer is provided on one of the plurality of lenses.

[0028] According to the camera module of the embodiment described in the previous paragraph, the imaging lens may further include a lens group fixed relatively to the reflective element, and the optical multi-layer stacked structure layer is provided on the lens group.

[0029] According to the camera module of the embodiment described in the previous paragraph, the imaging lens may further include an optical absorption lens, the absorption peak of which may be between 600 nm and 800 nm.

[0030] According to the camera module of the embodiment described in the previous paragraph, the photosensitive element module may further include a sub-optical multi-layer stacked structure layer disposed on the reflective element, and the reflectance of the sub-optical multi-layer stacked structure layer to a light beam having a wavelength of 450 nm to 550 nm may be less than 10%, and the wavelength at which the reflectance of the sub-optical multi-layer stacked structure layer is 50% is R50', and the wavelength at which the reflectance of the sub-optical multi-layer stacked structure layer is 50% is R50'. The condition 0 nm≦R50'≦720 nm can be satisfied.

[0031] According to the camera module embodiment described in the previous paragraph, the imaging lens may have an average wavelength transmittance of 5% or less for light rays with wavelengths of 700 nm to 800 nm, and may have a transmittance of 82% or more for light rays with a maximum transmittance wavelength of 400 nm to 800 nm.

[0032] According to the camera module of the embodiment described in the previous paragraph, the nano-protrusion structure may have a width of 250 nm or less and a height of 250 nm or less, the optical multilayer stacked structure layer may have a number of layers greater than 30, the imaging lens may include an optical absorption lens whose absorption peak may be between 650 nm and 750 nm, the imaging lens may have a wavelength average transmittance of 1% or less for light rays with a wavelength of 700 nm to 800 nm and a transmittance of 85% or more for light rays with a maximum transmittance wavelength of 400 nm to 800 nm, the wavelength at which the reflectance of the optical multilayer stacked structure layer is 50% is R50, and the maximum reflectance of the nano-rough surface for wavelengths R50 from 450 nm may be 0.2% or less, and the condition of 650 nm≦R50≦700 nm may be satisfied.

[0033] According to one embodiment of the present disclosure, there is provided an electronic device including the camera module of the aforementioned embodiment. [Brief description of the drawings]

[0034] [Figure 1A] FIG. 1 is a perspective view of a camera module according to a first embodiment of the present disclosure. [Figure 1B] 1B is a cross-sectional view of the camera module in the first embodiment of FIG. 1A. [Figure 1C] 1B is a cross-sectional view of the camera module in the first embodiment of FIG. 1A. [Figure 1D] 1B is a scanning electron microscope image of the photosensitive element and nano-rough surface in the first embodiment of FIG. 1A. [Figure 1E] FIG. 1B is a partial schematic diagram of a camera module in a first example of the first embodiment of FIG. 1A. [Figure 1F] 1C is a partial enlarged view of the photosensitive element module in the first example of the first embodiment of FIG. 1E. FIG. [Figure 1G] FIG. 1B is a partial schematic diagram of a camera module in a second example embodiment of the first embodiment of FIG. 1A. [Figure 1H] FIG. 1B is a perspective view of a prism in a third example of the first embodiment of FIG. 1A. [Figure 1I]FIG. 1C is a schematic diagram of a prism in a third example of the first embodiment of FIG. 1H. [Figure 1J] 1J is a cross-sectional view taken along the section line 1J-1J of a prism in a third example of the first embodiment of FIG. 1I. [Figure 1K] FIG. 1B is a perspective view of a prism in a fourth example of the first embodiment of FIG. 1A. [Figure 1L] FIG. 1K is a schematic diagram of a prism in a fourth example of the first embodiment. [Figure 1M] FIG. 1M is a cross-sectional view taken along the cross-sectional line 1M-1M of a prism in a fourth example of the first embodiment of FIG. 1L. [Figure 1N] FIG. 1B is a perspective view of a prism in a fifth example of the first embodiment of FIG. 1A. [Figure 1O] FIG. 1C is a schematic diagram of a prism in a fifth example of the first embodiment of FIG. 1N. [Figure 1P] FIG. 1B is a cross-sectional view taken along the cross-sectional line 1P-1P of a prism in a fifth example of the first embodiment of FIG. 1O. [Figure 1Q] FIG. 1B is a perspective view of a prism in a sixth example of the first embodiment of FIG. 1A. [Figure 1R] FIG. 1Q is a schematic diagram of a prism in a sixth example of the first embodiment of the present invention. [Figure 1S] FIG. 1B is a perspective view of a prism in a seventh example of the first embodiment of FIG. 1A. [Figure 1T] FIG. 1C is a schematic diagram of a prism in a seventh example of the first embodiment of FIG. 1S. [Figure 1U] 1B is a diagram showing the reflectance of the optical multilayer stack structure layer in the first embodiment of FIG. 1A. [Figure 1V] 1B is a diagram showing the transmittance of the filter element in the first embodiment of FIG. 1A. [Figure 1W] 1B is the reflectance of the nano-rough surface in the first embodiment of FIG. 1A. [Figure 1X] 1B is a diagram showing the transmittance of the imaging lens in the first embodiment of FIG. 1A. [Figure 1Y] 1B is a diagram showing the transmittance of the lens in the first embodiment of FIG. 1A. [Figure 2A]FIG. 11 is a perspective view of a camera module according to a second embodiment of the present disclosure. [Figure 2B] FIG. 2B is a partial cross-sectional view of the camera module in the second embodiment of FIG. 2A. [Figure 2C] FIG. 2B is a cross-sectional view of a camera module in a first example of the second embodiment of FIG. 2A. [Figure 2D] FIG. 2D is a partial enlarged view of a camera module in a first example of the second embodiment of FIG. 2C. [Figure 2E] 2D is another partial enlarged view of the camera module in the first example of the second embodiment of FIG. 2C. FIG. [Figure 2F] FIG. 2B is a partial schematic diagram of a camera module in a second example of the second embodiment of FIG. 2A. [Figure 2G] FIG. 2C is a partial enlarged view of a camera module in a second example of the second embodiment of FIG. 2F. [Figure 2H] FIG. 2B is a partial schematic diagram of a camera module in a third example of the second embodiment of FIG. 2A. [Figure 2I] FIG. 2B is a partial schematic diagram of a camera module in a fourth example of the second embodiment of FIG. 2A. [Figure 2J] FIG. 2C is a partial enlarged view of a camera module in a fourth example of the second embodiment of FIG. 2I. [Figure 2K] FIG. 2B is a partial schematic diagram of a camera module in a fifth example of the second embodiment of FIG. 2A. [Figure 2L] FIG. 2K is a partial enlarged view of a camera module in a fifth example of the second embodiment. [Figure 2M] FIG. 2B is a partial schematic diagram of a camera module in a sixth example embodiment of the second embodiment of FIG. 2A. [Figure 3A] FIG. 13 is a perspective view of a camera module according to a third embodiment of the present disclosure. [Figure 3B] FIG. 3B is an exploded view of the camera module in the third embodiment of FIG. 3A. [Figure 3C] FIG. 3B is a cross-sectional view of the camera module in the third embodiment of FIG. 3A. [Figure 3D]FIG. 3D is a partial enlarged view of the camera module in the third embodiment of FIG. 3C. [Figure 3E] FIG. 3B is an exploded view of the photosensitive element module in the third embodiment of FIG. 3A; [Figure 4A] FIG. 13 is a perspective view of a camera module according to a fourth embodiment of the present disclosure. [Figure 4B] FIG. 4B is an exploded view of the camera module in the fourth embodiment of FIG. 4A. [Figure 4C] FIG. 4B is a cross-sectional view of the camera module in the fourth embodiment of FIG. 4A. [Figure 4D] FIG. 4B is an exploded view of the photosensitive element module according to the fourth embodiment of FIG. 4A; [Figure 5A] FIG. 13 is a schematic diagram of an electronic device according to a fifth embodiment of the present disclosure. [Figure 5B] FIG. 5B is another schematic diagram of the electronic device in the fifth embodiment of FIG. 5A. [Figure 6] FIG. 13 is a schematic diagram showing an electronic device according to a sixth embodiment of the present disclosure being installed in an unmanned aerial vehicle. [Figure 7] FIG. 13 is a schematic diagram showing an electronic device according to a seventh embodiment of the present disclosure installed in an automobile. [Figure 8] FIG. 13 is a schematic diagram showing an electronic device according to an eighth embodiment of the present disclosure installed in a computer. [Figure 9] FIG. 13 is a schematic diagram showing an electronic device in a wearable device according to a ninth embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] According to the present disclosure, there is provided a photosensitive element module having an optical path, the photosensitive element corresponding to the optical path, a reflective element facing and adjacent to the photosensitive element and bending the optical path, an optical multilayer stacked structure layer located along the optical path away from the photosensitive element than the reflective element and having a reflectance of 10% or less for light with a wavelength of 450 nm to 600 nm, and a nano-rough surface provided on one side of the photosensitive element facing the reflective element, the nano-rough surface including a plurality of nano-protrusion structures that are irregular in shape and arranged adjacent to each other, have a width of 300 nm or less and a height of 350 nm or less, the reflectance of the nano-rough surface corresponding to the reflectance of the optical multilayer stacked structure layer, the wavelength at which the reflectance of the optical multilayer stacked structure layer is 50% is R50, the maximum reflectance of the nano-rough surface for wavelengths from 450 nm to R50 is 0.49% or less, and the photosensitive element module satisfies the condition 600 nm≦R50≦720 nm.

[0036] Specifically, the arrangement of the reflective element, the nano-rough surface and the optical multi-layer stacked structure layer in the optical path has multiple advantages such as effectively improving color contrast, avoiding glare, shortening the height of the camera module, and improving industrial utilization rate. Furthermore, the present disclosure can improve the problem that infrared light is prone to cause glare in folded telephoto lenses.

[0037] By positioning the optical multilayer stack structure layer farther away from the nano-rough surface than the reflective element along the optical path, glare formed by reflection between the optical multilayer stack structure layer and the photosensitive surface can be avoided, thereby avoiding deterioration of optical quality, and the thickness of the optical multilayer stack structure layer in the direction perpendicular to the photosensitive surface can be reduced, thereby improving industrial utilization rate.

[0038] In addition, the optical multilayer stack structure layer achieves the function of filtering light by passing light in the visible light range and reflecting infrared and ultraviolet light. The nano-rough surface optimizes the transmittance of light that can pass through the optical multilayer stack structure layer, greatly reduces the reflection of light on the photosensitive surface, and improves the receiving ratio of visible light.

[0039] The optical multilayer stack structure layer is multi-layered, and the number of layers can be 10 or more. The optical multilayer stack structure layer with a large number of layers can be a stack of multiple sets of plating films, and adjacent layers of the optical multilayer stack structure layer have different refractive indices, thereby providing different reflectances for light of different frequencies. By stacking layers with high and low refractive indices on each other, the light with wavelengths of 400 nm or less and 700 nm or more has high reflectance, thereby achieving the effect of light filtering. The number of layers can also be 36 or more. The number of layers can also be 72 or more.

[0040] The nano-roughened surface may also be fabricated by processes such as, but not limited to, nano-imprinting, etching, and epitaxial.

[0041] The reflective element may include a prism, which includes a light input surface, at least one reflecting surface, and a light output surface along the light path, and the light output surface faces and is adjacent to the nano-rough surface. Specifically, the prism can reduce assembly tolerances and improve the yield rate. In addition, the light output surface can further close the air compartment, thereby achieving good sealing.

[0042] The optical multilayer stacked structure layer may be provided on the light incident surface, thereby avoiding surface reflection between the optical multilayer stacked structure layer and the light incident surface. The optical multilayer stacked structure layer may also be provided directly on the light incident surface, and may be bonded to the prism via a filter element to achieve the above structure, but is not limited thereto.

[0043] The prism may be a red light absorbing element, and the red light absorbing element may be blue glass, which can reduce the interference of red light with other light receiving pixels and further improve the optical quality.

[0044] At least one of the light entrance surface, the reflection surface and the light exit surface of the prism may include an aspheric surface, and the aspheric surface is provided corresponding to the light path, which can further improve the optical quality after passing through the optical multi-layer stacked structure layer.

[0045] The prism may further include a plurality of recessed structures arranged adjacent to each other and narrowing toward the optical path, with adjacent recessed structures forming a tip. The distance between adjacent recessed structures among the tips may be between 0.3 mm and 2.9 mm. This prevents light rays from being reflected through the wall surface of the prism to form glare.

[0046] The prism may be a glass element, may further include an injection mark, and is injection molded through the injection mark. Specifically, the material of the prism may be, but is not limited to, transparent glass, red light absorbing glass, etc.

[0047] The prism may further include an edge surface, and the ejection mark extends from the edge surface in a direction away from the optical path and gradually widens in a direction approaching the edge surface. This can prevent glare from occurring at the notch of the ejection mark. In detail, the ejection mark may include a fillet surface connected to the edge surface, which improves moldability.

[0048] The reflective element may include a reflective mirror that folds the optical path. Reducing the weight of the reflective element can reduce the weight of the photosensitive element module, and indirectly reduce the energy and time consumed to drive the reflective element.

[0049] The reflective element may further include a frame, and the frame and the reflective mirror are integrally molded by embedded injection, which can reduce assembly tolerances and assembly steps.

[0050] The reflective element may further include a nano-rough surface provided on at least a portion of the reflective mirror and the frame, which can reduce reflection on the substrate surface of the reflective mirror to avoid ghosting and reduce glare caused by reflection on the frame.

[0051] The photosensitive element module may further include a holder and an air compartment, the holder covers the photosensitive element, and the reflective element is provided on the holder, the air compartment is formed between the reflective element and the photosensitive element, the holder surrounds the air compartment, and the nano-rough surface and the air compartment at least partially overlap in the optical path, which can avoid contamination of the photosensitive surface during assembly.

[0052] The nano-rough surface may extend from the photosensitive surface to the holder and is provided on at least a portion of the holder, thereby preventing light rays from being reflected by the holder to create glare.

[0053] The reflective element may include a holder part fixed relatively to the photosensitive element. The photosensitive element module may further include an air compartment formed between the reflective element and the photosensitive element, surrounded by the holder part, and at least partially overlapping the nano-rough surface in the optical path. The reflective element and the holder part are integrally molded, thereby reducing the assembly process and assembly tolerance, and further improving the optical quality. The integral molding method can be achieved by a process such as, but not limited to, injection molding, embedded injection, etc.

[0054] The photosensitive element module may further include an infrared light absorbing coating disposed on the reflecting element, the thickness of which may be 900 nm to 5 um. This can prevent the infrared light remaining after passing through the optical multi-layer stacked structure layer from affecting the image quality. In addition, when the infrared light absorbing coating is disposed on the reflecting surface, it can be equivalent to passing through the infrared light absorbing coating twice, thereby reducing the thickness of the coating.

[0055] The photosensitive element module may further include a filter element, which may include a red light absorbing plate provided with an optical multi-layer stacked structure layer. The red light absorbing plate can reduce the interference of red light with other light-receiving pixels, and further improve the optical quality. In particular, the modularized filter element can improve the assembly process, thereby ensuring manufacturability.

[0056] The photosensitive element may include a plurality of pixel units, each of which includes a microlens, and the pixel size may be 400nm to 2000nm, and the nano-rough surface is provided on the microlens in any one of the pixel units. The light receiving effect of the pixel unit is improved, thereby improving the optical quality of the edge. An intermediate layer may be further included between the nano-rough surface and the microlens to improve adhesion.

[0057] The above technical features of the photosensitive element module of the present disclosure can be arranged in combination to achieve corresponding effects.

[0058] According to the present disclosure, there is provided a camera module including the above-mentioned photosensitive element module and an imaging lens arranged on the object side of the photosensitive element module along an optical path, and an optical multilayer stacked structure layer may be arranged on the object side of the reflective element.

[0059] The camera module may further include an object-side reflective element disposed on the object side of the photosensitive element module and provided with an optical multi-layer stacked structure layer, which can further prevent non-imaging light rays from entering the camera module and forming glare.

[0060] The imaging lens may include an object-side lens group disposed on the object side of the object-side reflecting element to control the light rays passing through the optical multi-layer stacked structure layer, thereby improving the effect.

[0061] The imaging lens may include an image-side lens group disposed between the object-side reflective element and the photosensitive element module, and the optical multi-layer stack structure layer is disposed between the image-side lens group and the reflective element, and the optical multi-layer stack structure layer is arranged to optimize the light passing through the optical multi-layer stack structure layer, thereby improving the optical quality.

[0062] The camera module may further include an object-side reflective element disposed on the object side of the reflective element and may include an infrared light absorbing coating, the optical path passes through the infrared light absorbing coating, and the thickness of the infrared light absorbing coating may be 900 nm to 5 um. Furthermore, the object-side reflective element may include an infrared light absorbing coating, and the infrared light absorbing coating may be combined with an optical multilayer stacked structure layer to prevent infrared light from entering the photosensitive surface and further improve the optical quality.

[0063] The imaging lens may include a plurality of lenses arranged in sequence along the optical path, and the optical multi-layer stack layer is provided on one of the plurality of lenses. In particular, the lens material may be an infrared light absorbing material to further filter infrared light.

[0064] The imaging lens may further include a lens group fixed relative to the reflecting element, and the optical multilayer stack layer is disposed on the lens group, thereby reducing the risk of offset of the optical multilayer stack layer.

[0065] The imaging lens may further include an optical absorption lens, the absorption peak of which may be between 600 nm and 800 nm. The optical absorption lens and the optical multilayer stacked structure layer may be combined to correct the color shift caused by the optical multilayer stacked structure layer, thereby further improving the effect of light filtering. In detail, the optical multilayer stacked structure layer may be further provided on the optical absorption lens.

[0066] The photosensitive element module may further include a sub-optical multi-layer stacked structure layer disposed on the reflecting element, and the reflectance of the sub-optical multi-layer stacked structure layer to a light beam having a wavelength of 450 nm to 550 nm may be 10% or less, and the wavelength at which the reflectance of the sub-optical multi-layer stacked structure layer is 50% is R50', and the condition of 600 nm≦R50'≦720 nm is satisfied. A sub-optical multi-layer stack layer may further be provided on the filter element for secondary filtering of the incident light beam and thus ensuring optical quality.

[0067] The imaging lens may have an average wavelength transmittance of 5% or less for light rays with wavelengths of 700 nm to 800 nm, and a transmittance of 82% or more for light rays with a maximum transmittance wavelength of 400 nm to 800 nm. The imaging lens has a light filtering function, which saves the space required for using conventional filter elements and further reduces the volume of the camera module.

[0068] The nano-protrusion structure may have a width of 250 nm or less and a height of 250 nm or less, and the optical multilayer stack structure layer may have a layer number of more than 30. The imaging lens may include an optical absorption lens whose absorption peak may be between 650 nm and 750 nm. The imaging lens may have a wavelength average transmittance of 1% or less for light rays with a wavelength of 700 nm to 800 nm, and a transmittance of 85% or more for light rays with a maximum transmittance wavelength of 400 nm to 800 nm. The wavelength at which the reflectance of the optical multilayer stack structure layer is 50% is R50, and the maximum reflectance of the nano-rough surface for wavelengths from 450 nm to R50 may be 0.2% or less, and the condition of 650 nm≦R50≦700 nm may be satisfied.

[0069] Each of the technical features in the camera module of the present disclosure above can be arranged in combination to achieve a corresponding effect.

[0070] According to the present disclosure, there is provided an electronic device including the camera module described above.

[0071] Based on the above embodiment, specific embodiments and examples are proposed below and will be described in detail with reference to the drawings.

[0072] First Embodiment

[0073] Please refer to Figures 1A to 1C. Figure 1A is a perspective view of a camera module 10 in a first embodiment of the present disclosure, Figure 1B is a cross-sectional view of the camera module 10 in the first embodiment of Figure 1A, and Figure 1C is a cross-sectional view of the camera module 10 in the first embodiment of Figure 1A. As can be seen from Figures 1A to 1C, the camera module 10 includes a photosensitive element module 11, an imaging lens (not shown), and an imaging lens carrier 13 (shown in Figure 1E), where the imaging lens is provided on the object side of the photosensitive element module 11 along the optical path L, and the imaging lens carrier 13 is used to mount the imaging lens.

[0074] Please refer to FIG. 1D-FIG. 1F. FIG. 1D is a scanning electron microscope image of the photosensitive element 110 and the nano-rough surface 140 in the first embodiment of FIG. 1A, FIG. 1E is a partial schematic view of the camera module 10 in the first example of the first embodiment of FIG. 1A, and FIG. 1F is a partial enlarged view of the photosensitive element module 11 in the first example of the first embodiment of FIG. 1E. As can be seen from FIG. 1B-FIG. 1F, the photosensitive element module 11 has an optical path L and includes a photosensitive element 110, a reflecting element 120a, an optical multilayer stacked structure layer 131, and a nano-rough surface 140. The photosensitive element 110 corresponds to the optical path L. The reflecting element 120a faces and is adjacent to the photosensitive element 110, and folds the optical path L. The optical multilayer stacked structure layer 131 is provided along the optical path L farther from the photosensitive element 110 than the reflecting element 120a, and on the object side of the reflecting element 120a. The nano-rough surface 140 includes a plurality of nano-protrusion structures 141 that are irregular in shape and adjacently arranged, and is provided on one side of the photosensitive element 110 facing the reflective element 120a.

[0075] By having the optical multilayer stacked structure layer 131 located farther from the nano-rough surface 140 than the reflective element 120a along the optical path L, glare caused by reflection between the optical multilayer stacked structure layer 131 and the photosensitive surface IMG of the photosensitive element 110 can be avoided, thereby avoiding deterioration of optical quality, and the thickness of the optical multilayer stacked structure layer 131 in the direction perpendicular to the photosensitive surface IMG can be reduced, thereby improving industrial utilization rate.

[0076] In detail, the optical multilayer stack structure layer 131 transmits light rays in the visible light range and reflects infrared light and ultraviolet light, or reflects infrared light or ultraviolet light, thereby achieving the functionality of filtering light rays, and the nano-rough surface 140 optimizes the transmittance of light rays that can pass through the optical multilayer stack structure layer 131, greatly reduces the reflection of light rays on the photosensitive surface IMG, and improves the receiving ratio of visible light.

[0077] The optical multilayer stacked structure layer 131 may be multilayered and the number of layers may be 10 or more, and the optical multilayer stacked structure layer 131 having a large number of layers may be a stack of multiple sets of plating films. The number of layers may be 30 or more. The number of layers may be 36 or more. The number of layers may be 72 or more. The nano-rough surface 140 may be manufactured by a process such as nano-imprinting, etching, epitaxial, etc., but is not limited thereto.

[0078] Please refer to Table 1, which shows the refractive index classification and thickness value of the optical multilayer stacked structure layer 131 in the first embodiment. The optical multilayer stacked structure layer 131 is a superposition of two sets of plating films, but is not limited thereto. As can be seen from Table 1, adjacent layers of the optical multilayer stacked structure layer 131 have different refractive indices, thereby providing different reflectivities for light of different frequencies. Furthermore, H and L in the refractive index of Table 1 represent high and low refractive indices, respectively. [Table 1]

[0079] 1B and 1C, the camera module 10 may further include an object-side reflective element 120b disposed on the object side of the photosensitive element module 11, and the optical multilayer stacked structure layer 131 is disposed on the object-side reflective element 120b. Furthermore, the object-side reflective element 120b is disposed on the object side of the reflective element 120a. This can further prevent non-imaging light rays from entering the camera module 10 to form glare.

[0080] As can be seen from FIGS. 1A-1C, the camera module 10 may further include a base BS operable relative to the object-side reflective element 120b to achieve optically stable functionality.

[0081] The camera module 10 may further include a circuit E provided on one side of the photosensitive element 110 .

[0082] As can be seen from Figures 1B, 1C and 1E, the imaging lens may include an image-side lens group 181 and an object-side lens group 182, where the image-side lens group 181 includes two groups of lenses 181a, 181b, and is disposed between the object-side reflecting element 120b and the photosensitive element module 11, the optical multilayer stacked structure layer 131 is disposed between the image-side lens group 181 and the reflecting element 120a, and the object-side lens group 182 is disposed on the object side of the object-side reflecting element 120b. The transmitted image-side lens group 181 can optimize the light passing through the optical multilayer stacked structure layer 131, thereby improving the optical quality. And the object-side lens group 182 can control the light passing through the optical multilayer stacked structure layer 131 to improve its effect.

[0083] Furthermore, the lens set 181b of the image-side lens group 181 and the object-side lens group 182 are fixed, but the lens set 181a of the image-side lens group 181 is movable.

[0084] The imaging lens may include a plurality of lenses LE arranged in sequence along the optical path L. In detail, the material of the lenses LE may be an infrared light absorbing material to further filter the infrared light.

[0085] 1E and 1F, the photosensitive element module 11 may further include a holder 161 and an air compartment 162. The holder 161 covers the photosensitive element 110, and the reflecting element 120a is provided on the holder 161. The air compartment 162 is formed between the reflecting element 120a and the photosensitive element 110, the holder 161 surrounds the air compartment 162, and the nano-rough surface 140 and the air compartment 162 at least partially overlap in the optical path L. This can prevent the photosensitive surface IMG from being contaminated during assembly.

[0086] Furthermore, the nano-rough surface 140 extends from the photosensitive surface IMG to the holder 161 and is provided on at least a portion of the holder 161, and is further provided on an inner wall 163 of the holder 161. This makes it possible to prevent light rays from being reflected by the holder 161 and causing glare.

[0087] As can be seen from FIG. 1D and FIG. 1E, the photosensitive element module 11 may further include an infrared light absorbing coating 132 and a filter element 170, where the filter element 170 includes a red light absorbing plate 171, and the optical multilayer stacked structure layer 131 and the infrared light absorbing coating 132 are provided on the red light absorbing plate 171. The red light absorbing plate 171 can reduce the interference of red light with other light receiving pixels, and further improve the optical quality. In addition, the infrared light absorbing coating 132 can prevent the infrared light remaining after passing through the optical multilayer stacked structure layer 131 from affecting the image quality. In particular, the modularized filter element 170 can improve the assembly process, thereby ensuring manufacturability.

[0088] As can be seen from Figures 1E and 1F, the reflective element 120a may include a prism (not shown) including a light incident surface 121, at least one reflective surface 122, and a light exit surface 123 along the light path L, and the light exit surface 123 faces and is adjacent to the nano-rough surface 140 and the photosensitive surface IMG. In particular, the prism can reduce the assembly tolerance and improve the yield. In addition, the air compartment 162 can be further closed by the light exit surface 123, thereby achieving good sealing.

[0089] 1D, the photosensitive element 110 may include a plurality of pixel units 111, each of which includes a microlens 112, and the nano-rough surface 140 is provided on the microlens 112 in any one of the pixel units 111. The nano-rough surface 140 improves the light-receiving effect of the pixel unit 111, thereby improving the optical quality of the edge. In addition, an intermediate layer (not shown) may be further included between the nano-rough surface 140 and the microlens 112 to improve adhesion.

[0090] In detail, the width W1 of the nano-protrusion structure 141 is 193 nm, the height H1 of the nano-protrusion structure 141 is 137 nm, the pixel size W2 of the pixel unit 111 is 800 nm, and the distance H2 between the nano-protrusion structure 141 and the photosensitive element surface 110a is 240 nm.

[0091] Please refer to Fig. 1G, which is a partial schematic diagram of the camera module 10 in the second example of the first embodiment of Fig. 1A. As can be seen from Fig. 1G, an infrared light absorbing coating 132 is provided on the red light absorbing plate 171, and an optical multi-layer stacked structure layer 131 is provided on one of the lenses LE.

[0092] The lens set 181b of the image side lens group 181 is fixed relative to the reflecting element 120a, and the optical multilayer stacked structure layer 131 is provided on the lens set 181b of the image side lens group 181. This can reduce the risk of offset of the optical multilayer stacked structure layer 131.

[0093] The photosensitive element module 11 may further include a sub-optical multi-layer stack structure layer 133 disposed on the reflective element 120a. The sub-optical multi-layer stack structure layer 133 may further be disposed on a filter element 170 to perform secondary filtering of the incident light beam and thereby ensure optical quality.

[0094] Please refer to Figures 1H to 1J. Figure 1H is a perspective view of a prism in the third example of the first embodiment of Figure 1A, Figure 1I is a schematic view of the prism in the third example of the first embodiment of Figure 1H, and Figure 1J is a cross-sectional view along the cross-sectional line 1J-1J of the prism in the third example of the first embodiment of Figure 1I. As can be seen from Figures 1H to 1J, a light incident surface 121 is provided on the light input side IS of the prism, and a light exit surface 123 is provided on the light output side ES of the prism.

[0095] 1J, the prism may further include a plurality of recessed structures arranged adjacent to each other and narrowing toward the optical path L, both adjacent to each other forming a tip 124. This prevents light rays from being reflected by the wall of the prism to form glare.

[0096] In the third example of the first embodiment, the distance between two adjacent tips 124 is SP1 and SP2, respectively, the distance SP1 between two adjacent tips 124 is 0.7 mm, and the distance SP2 between two adjacent tips 124 is 0.99 mm.

[0097] Please refer to Figures 1K to 1M. Figure 1K is a perspective view of a prism in the fourth example of the first embodiment of Figure 1A, Figure 1L is a schematic view of the prism in the fourth example of the first embodiment of Figure 1K, and Figure 1M is a cross-sectional view taken along the cross-sectional line 1M-1M of the prism in the fourth example of the first embodiment of Figure 1L. As can be seen from Figures 1K to 1M, the distance between adjacent tips 124 is SP, and the distance SP between adjacent tips 124 is 0.7 mm.

[0098] Please refer to Figures 1N to 1P. Figure 1N is a perspective view of a prism in the fifth example of the first embodiment of Figure 1A, Figure 1O is a schematic view of the prism in the fifth example of the first embodiment of Figure 1N, and Figure 1P is a cross-sectional view of the prism in the fifth example of the first embodiment of Figure 1O along the cross-sectional line 1P-1P. As can be seen from Figures 1N to 1P, the light entrance surface 121 and the light exit surface 123 each include an aspheric surface, and the aspheric surface is provided corresponding to the light path L. This can further improve the optical quality after passing through the optical multilayer stacked structure layer 131.

[0099] The prism may be a plastic prism and may further include an injection hole 125 through which it is injection molded.

[0100] In the fifth example of the first embodiment, the distance between adjacent ones of the tips 124 is SP, and the distance SP between adjacent ones of the tips 124 is 1.4 mm.

[0101] Please refer to Figure 1Q and Figure 1R. Figure 1Q is a perspective view of a prism in the sixth example of the first embodiment of Figure 1A, and Figure 1R is a schematic diagram of a prism in the sixth example of the first embodiment of Figure 1Q. As can be seen from Figure 1Q and Figure 1R, the light entrance surface 121 and the light exit surface 123 each include an aspheric surface, and the aspheric surface is provided corresponding to the light path L.

[0102] Please refer to Figures 1S and 1T. Figure 1S is a perspective view of a prism in the seventh embodiment of the first embodiment of Figure 1A, and Figure 1T is a schematic diagram of a prism in the seventh embodiment of the first embodiment of Figure 1S. As can be seen from Figures 1S and 1T, the light entrance surface 121 and the light exit surface 123 each include an aspheric surface, and the aspheric surface is provided corresponding to the light path L.

[0103] The prism may be a glass element and may further include an injection mark 125 and an edge surface 126, and is injection molded through the injection mark 125, where the injection mark 125 extends from the edge surface 126 in a direction away from the optical path L and gradually widens in a direction approaching the edge surface 126. This makes it possible to avoid glare from occurring at the cutout of the injection mark 125.

[0104] The injection mark 125 may include a fillet surface 127 connected to the edge surface 126 to improve formability.

[0105] Specifically, the glass prism may be formed by injection molding, and the material of the prism may be, but is not limited to, red light absorbing glass, which can reduce the interference of red light with other light receiving pixels and further improve the optical quality. The prism may be a red light absorbing element, and the red light absorbing element may be blue glass.

[0106] Please refer to FIG. 1U. It is the reflectance of the optical multilayer stacked structure layer 131 in the first embodiment of FIG. 1A. As can be seen from FIG. 1U, the reflectance of the nano-rough surface 140 corresponds to the reflectance of the optical multilayer stacked structure layer 131, and the wavelength at which the reflectance of the optical multilayer stacked structure layer 131 is 50% is R50, and the parameters meet the conditions in Table 2 below. It should be noted that Sample a to Sample h can all be used in the first embodiment of the first embodiment to the seventh embodiment of the first embodiment. In addition, Sample a stacks high and low refractive indexes on each other, allowing light with wavelengths of 400 nm or less and 700 nm or more to have high reflectance, thereby achieving the effect of light filtering. [Table 2]

[0107] Please refer to Fig. 1V, which is the transmittance of the filter element 170 in the first embodiment of Fig. 1A. As can be seen from Fig. 1V, Sample i and Sample ii can all be used in the first example of the first embodiment to the seventh example of the first embodiment.

[0108] Please refer to Fig. 1W. It is the reflectance of the nano-rough surface 140 in the first embodiment of Fig. 1A. As can be seen from Fig. 1W, Samples 1 to 9 can all be used in the first example of the first embodiment to the seventh example of the first embodiment.

[0109] Please refer to Fig. 1X, which is the transmittance of the imaging lens in the first embodiment of Fig. 1A. As can be seen from Fig. 1X, the wavelength average transmittance of the imaging lens for light rays with wavelengths of 700nm to 800nm ​​is 0.31%, and the transmittance of the imaging lens for light rays with wavelengths of 400nm to 800nm ​​with maximum transmittance is 86.42%.

[0110] Please refer to FIG. 1Y. It is the transmittance of the lens LE in the first embodiment of FIG. 1A. As can be seen from FIG. 1Y, the imaging lens may include an optical absorption lens, and at least one of the lenses LE may be an optical absorption lens. The optical absorption lens and the optical multilayer stacked structure layer 131 combined can correct the color shift caused by the optical multilayer stacked structure layer 131, thereby further improving the effect of light filtering. In detail, the optical multilayer stacked structure layer 131 may be further provided on the optical absorption lens. Moreover, the wavelength of the absorption peak AP of the lens LE is 698 nm.

[0111] It should be noted that the range of the light path L is within the dashed line range in FIGS. 1J, 1M, and 1P.

[0112] <Second embodiment>

[0113] Please refer to Figures 2A to 2C. Figure 2A is a perspective view of a camera module 20 in a second embodiment of the present disclosure, Figure 2B is a partial cross-sectional view of the camera module 20 in the second embodiment of Figure 2A, and Figure 2C is a cross-sectional view of the camera module 20 in a first example of the second embodiment of Figure 2A. As can be seen from Figures 2A to 2C, the camera module 20 includes a photosensitive element module (not shown), an imaging lens 22 provided on the object side of the photosensitive element module along the optical path L, and a carrier 265 for mounting the imaging lens 22 and the photosensitive element module.

[0114] Please refer to Figures 2D and 2E. Figure 2D is a partial enlarged view of the camera module 20 in the first example of the second embodiment of Figure 2C, and Figure 2E is another partial enlarged view of the camera module 20 in the first example of the second embodiment of Figure 2C. As can be seen from Figures 2B to 2E, the photosensitive element module has an optical path L and includes a photosensitive element 210, a reflecting element 220a, an optical multilayer stacked structure layer 231, and a nano-rough surface 240. The photosensitive element 210 corresponds to the optical path L. The reflecting element 220a faces and is adjacent to the photosensitive element 210, and folds the optical path L. The optical multilayer stacked structure layer 231 is disposed farther from the photosensitive element 210 than the reflecting element 220a along the optical path L, and on the object side of the reflecting element 220a. The nano-rough surface 240 includes a plurality of nano-protrusion structures (not shown) that are irregular in shape and arranged adjacent to each other, and is provided on one side of the photosensitive element 210 facing the reflective element 220a.

[0115] 2B and 2C, the camera module 20 may further include an object-side reflective element 220b disposed on the object side of the photosensitive element module 20. Furthermore, the object-side reflective element 220b is disposed on the object side of the reflective element 220a.

[0116] As can be seen from Figures 2A to 2C, the camera module 20 may further include a substrate 264, a circuit E, a driver 291, and an image processing element 292, where the circuit E is provided on the surface of the substrate 264, and the driver 291 and the image processing element 292 are provided on the circuit E.

[0117] 2E, the photosensitive element module may further include a holder 261 and an air compartment 262. The holder 261 covers the photosensitive element 210, and the reflective element 220a is provided on the holder 261. The air compartment 262 is formed between the reflective element 220a and the photosensitive element 210, the holder 261 surrounds the air compartment 262, and the nano-rough surface 240 and the air compartment 262 at least partially overlap in the optical path L.

[0118] Furthermore, the nano-rough surface 240 extends from the photosensitive surface IMG to the holder 261 and is provided on at least a portion of the holder 261 , and is further provided on an inner wall 263 of the holder 261 .

[0119] 2C and 2E, the reflective element 220a may include a prism (not shown) including a light incident surface 221, at least one reflecting surface 222, and a light exit surface 223 along the light path L, and the light exit surface 223 faces and is adjacent to the nano-rough surface 240 and faces and is adjacent to the photosensitive surface IMG. In addition, an optical multilayer stacked structure layer 231 is provided on the light incident surface 221. This can avoid surface reflection at the optical multilayer stacked structure layer 231 and the light incident surface 221. In addition, the optical multilayer stacked structure layer 231 may be provided directly on the light incident surface 221, but is not limited thereto.

[0120] 2D, the object-side reflective element 220b may include an infrared light absorbing coating 232, a reflective layer 234, and a red light absorbing glass 272, where the optical path L passes through the infrared light absorbing coating 232, the nano-rough surface 240 is provided on one side of the red light absorbing glass 272, the infrared light absorbing coating 232 is provided on the other side of the red light absorbing glass 272, and the reflective layer 234 is provided on the infrared light absorbing coating 232. Also, the thickness of the infrared light absorbing coating 232 may be 900nm to 5um.

[0121] Please refer to Figures 2F and 2G. Figure 2F is a partial schematic view of the camera module 20 in the second embodiment of the second embodiment of Figure 2A, and Figure 2G is a partial enlarged view of the camera module 20 in the second embodiment of the second embodiment of Figure 2F. As can be seen from Figures 2F and 2G, the optical multi-layer stacked structure layer 231 is provided on the light incident surface 221 of the reflective element 220a, the infrared light absorbing coating 232 is provided on the reflective surface 222 of the reflective element 220a, and the reflective element 220a is fixed to the holder 261 via the adhesive G. In addition, the nano-rough surface 240 is provided on the light exit surface 223 of the reflective element 220a and the photosensitive element 210.

[0122] It should be noted that if an infrared light absorbing coating 232 is applied to the reflective surface 222, this can be equivalent to two passes through the infrared light absorbing coating, thereby reducing the thickness of the coating.

[0123] Please refer to Fig. 2H, which is a partial schematic diagram of the camera module 20 in the third embodiment of the second embodiment of Fig. 2A. As can be seen from Fig. 2H, the photosensitive element module may further include a filter element 270, which is disposed on the light incident surface 221 of the reflecting element 220a, and includes a red light absorbing plate 271, and the optical multi-layer stacked structure layer 231 is disposed on one side of the red light absorbing plate 271, and the infrared light absorbing coating 232 is disposed on the other side of the red light absorbing plate 271.

[0124] Also, the filter element 270 can be glued to a prism to achieve the above structure, but is not limited to this.

[0125] Please refer to Figures 2I and 2J. Figure 2I is a partial schematic view of the camera module 20 in the fourth embodiment of the second embodiment of Figure 2A, and Figure 2J is a partial enlarged view of the camera module 20 in the fourth embodiment of the second embodiment of Figure 2I. As can be seen from Figures 2I and 2J, the reflective element 220a may include a reflective mirror 251 that bends the optical path L, a frame 252, a flat plate element 254, and a nano-rough surface 240, and the frame 252 and the reflective mirror 25 may be integrally molded by embedded injection to reduce assembly tolerance and assembly process, and the flat plate element 254 is provided on the frame 252, and the nano-rough surface 240 is provided on at least a part of the reflective mirror 251 and the frame 252.

[0126] In detail, the weight of the reflective element 220a can be reduced, and the weight of the photosensitive element module can be reduced, thereby indirectly reducing the energy and time consumed to drive the reflective element 220a. The nano-rough surface 240 can reduce the reflection of the reflective mirror 251 on the surface of the substrate 255 to avoid ghosting, and can reduce the glare caused by the reflection of the frame 252, and the reflective layer 234 is provided on the substrate 255. The filter element 270, the reflective mirror 251, the frame 252 and the flat plate element 254 are combined to form the reflective mirror group 250.

[0127] Please refer to Figures 2K and 2L. Figure 2K is a partial schematic view of the camera module 20 in the fifth embodiment of the second embodiment of Figure 2A, and Figure 2L is a partial enlarged view of the camera module 20 in the fifth embodiment of the second embodiment of Figure 2K. As can be seen from Figures 2K and 2L, the reflective element 220a may include a holder part 253, and the photosensitive element module may further include an air partition 262, where the holder part 253 is fixed relatively to the photosensitive element 210, the air partition 262 is formed between the reflective element 220a and the photosensitive element 210, the holder part 253 surrounds the air partition 262, and the nano-rough surface 240 and the air partition 262 at least partially overlap in the optical path L.

[0128] The reflective element 220a and the holder portion 253 are integrally molded, thereby reducing the assembly process and assembly tolerances and further improving the optical quality, and the method of integral molding can be achieved by processes such as, but not limited to, injection molding, embedded injection molding, etc.

[0129] Please refer to Fig. 2M, which is a partial schematic diagram of the camera module 20 in the sixth example of the second embodiment of Fig. 2A. As can be seen from Fig. 2M, an infrared light absorbing coating 232 and an optical multi-layer stacked structure layer 231 are provided on the light incident surface 221 of the reflective element 220a. In detail, the combination of the infrared light absorbing coating 232 and the optical multi-layer stacked structure layer 231 can prevent the infrared light band light from entering the photosensitive surface IMG, and further improve the optical quality.

[0130] <Third embodiment>

[0131] Please refer to Figures 3A to 3C. Figure 3A is a perspective view of a camera module 30 in a third embodiment of the present disclosure, Figure 3B is an exploded view of the camera module 30 in the third embodiment of Figure 3A, and Figure 3C is a cross-sectional view of the camera module 30 in the third embodiment of Figure 3A. As can be seen from Figures 3A to 3C, the camera module 30 includes a photosensitive element module 31, an imaging lens 32 provided on the object side of the photosensitive element module 31 along the optical path L, and an imaging lens carrier 33 for mounting the imaging lens 32.

[0132] Please refer to Figures 3D and 3E. Figure 3D is a partial enlarged view of the camera module 30 in the third embodiment of Figure 3C, and Figure 3E is an exploded view of the photosensitive element module 31 in the third embodiment of Figure 3A. As can be seen from Figures 3C to 3E, the photosensitive element module 31 has an optical path L and includes a photosensitive element 310, a reflecting element 320, an optical multilayer stacked structure layer 331, and a nano-rough surface (not shown). The photosensitive element 310 corresponds to the optical path L. The reflecting element 320 faces and is adjacent to the photosensitive element 310, and folds the optical path L. The optical multilayer stacked structure layer 331 is disposed farther from the photosensitive element 310 than the reflecting element 320 along the optical path L, and on the object side of the reflecting element 320. The nano-rough surface includes a plurality of nano-protrusion structures (not shown) that are irregular in shape and arranged adjacent to each other, and is disposed on one side of the photosensitive element 310 facing the reflecting element 320.

[0133] As can be seen from Figures 3C and 3E, the camera module 30 may further include a circuit E, a sustaining element 366, and an image processing element 392, where the image processing element 392 is provided in the circuit E and the reflective element 320 is provided in the sustaining element 366.

[0134] The photosensitive element module 31 may further include a holder 361, an infrared light absorbing coating 332, and a filter element 370, where the holder 361 covers the photosensitive element 310, the reflective element 320 is provided on the holder 361, the filter element 370 includes a red light absorbing plate 371, and the optical multilayer stacked structure layer 331 and the infrared light absorbing coating 332 are provided on the red light absorbing plate 371.

[0135] As can be seen in FIG. 3C, the imaging lens 32 may include an infrared light absorbing lens 384, with the optical multi-layer stacked structure layer 331 disposed on the image side of the infrared light absorbing lens 384.

[0136] The reflecting element 320 may comprise a prism (not shown) including a light incident surface 321, five reflecting surfaces 322a, 322b, 322c, 322d, 322e and a light exit surface 323 along the light path L, and the light exit surface 323 faces and is adjacent to the light sensitive surface. In detail, the light incident surface 321, the reflecting surfaces 322b, 322d and the light exit surface 323 are coplanar.

[0137] <Fourth embodiment>

[0138] Please refer to Figures 4A to 4C. Figure 4A is a perspective view of a camera module 40 in a fourth embodiment of the present disclosure, Figure 4B is an exploded view of the camera module 40 in the fourth embodiment of Figure 4A, and Figure 4C is a cross-sectional view of the camera module 40 in the fourth embodiment of Figure 4A. As can be seen from Figures 4A to 4C, the camera module 40 includes a photosensitive element module 41 and two imaging lenses 42a and 42b, and the imaging lenses 42a and 42b are provided on the object side of the photosensitive element module 41 along the optical path L, and the imaging lens 42b is provided between the imaging lens 42a and the photosensitive element module 41.

[0139] Please refer to Fig. 4D, which is an exploded view of the photosensitive element module 41 in the fourth embodiment of Fig. 4A. As can be seen from Fig. 4C and Fig. 4D, the photosensitive element module 41 has an optical path L, and includes a photosensitive element 410, a reflecting element 420a, an optical multilayer stacked structure layer 431, and a nano-rough surface (not shown). The photosensitive element 410 corresponds to the optical path L. The reflecting element 420a faces and is adjacent to the photosensitive element 410, and folds the optical path L. The optical multilayer stacked structure layer 431 is provided on the object side of the reflecting element 420a, away from the photosensitive element 410 along the optical path L, compared to the reflecting element 420a. The nano-rough surface includes a plurality of nano-protrusion structures (not shown) that are irregular in shape and arranged adjacently, and is provided on one side of the photosensitive element 410 facing the reflecting element 420a.

[0140] 4C, the camera module 40 may further include an object-side reflecting element 420b disposed on the object side of the photosensitive element module 41, and the optical multilayer stacked structure layer 431 is disposed on the object-side reflecting element 420b. In addition, the imaging lens 42a includes an object-side reflecting element 420b, and the object-side reflecting element 420b is disposed on the object side of the reflecting element 420a.

[0141] As can be seen from Figures 4C and 4D, the reflective element 420a may comprise a prism (not shown) including a light incident surface 421, at least one reflective surface 422 and a light exit surface 423 along the optical path L, the light exit surface 423 facing and adjacent to the nano-rough surface and facing and adjacent to the photosensitive surface IMG.

[0142] The photosensitive element module 41 may further include a sub-optical multi-layer stacked structure layer 433 disposed on the reflective element 420a.

[0143] As can be seen from Figures 4C and 4D, the camera module 40 may further include a circuit E, an image stabilization driver 493, and a focus driver 494, where the photosensitive element 410 is provided in the circuit E, the object-side reflective element 420b is provided in the image stabilization driver 493, and the imaging lens 42b is provided in the focus driver 494.

[0144] The reflective element 420 a may include a holder portion 453 that is fixed relatively to the photosensitive element 410 .

[0145] <Fifth embodiment>

[0146] Please refer to Figures 5A and 5B. Figure 5A is a schematic diagram of an electronic device 50 in the fifth embodiment of the present disclosure, and Figure 5B is another schematic diagram of the electronic device 50 in the fifth embodiment of Figure 5A. As can be seen from Figures 5A and 5B, the electronic device 50 is a smartphone, and may be, but is not limited to, a notebook computer, a tablet computer, a drive recorder, etc. The electronic device 50 includes a camera module, and the camera module may be the camera module of the first to fourth embodiments described above, but the present disclosure is not limited to this.

[0147] In the fifth embodiment, the camera modules are a front camera module 521, a wide-angle camera module 522, a telephoto camera module 523, an ultra-wide-angle camera module 524, a macro camera module 525, and a TOF module (Time-Of-Flight module) 526, and the TOF module 526 may be another type of camera module and is not limited to this arrangement.

[0148] In detail, in the fifth embodiment, the front camera module 521 and the TOF module 526 are disposed on the front side of the electronic device 50, while the wide-angle camera module 522, the telephoto camera module 523, the ultra-wide-angle camera module 524 and the macro camera module 525 are disposed on the back side of the electronic device 50.

[0149] The imaging control interface 510 may be a touch screen that is used to display a screen, has a touch function, and can be used to manually adjust the shooting angle of view. In detail, the imaging control interface 510 includes an image playback button 511, a camera module switching button 512, a focus shooting button 513, an integrated option button 514, and a zoom control button 515. Further, the user can enter a shooting mode through the imaging control interface 510 of the electronic device 50, the camera module switching button 512 can freely switch and use one of the front camera module 521, the wide-angle camera module 522, the telephoto camera module 523, the ultra-wide-angle camera module 524 and the macro camera module 525 to take pictures, the zoom control button 515 is used to adjust the zoom, the focus shooting button 513 is used to take pictures after framing and determining one of the front camera module 521, the wide-angle camera module 522, the telephoto camera module 523, the ultra-wide-angle camera module 524 and the macro camera module 525, the image playback button 511 allows the user to view the picture after taking it, and the integrated option button 514 is used to adjust the details during shooting (e.g. timing shooting, shooting scale, etc.).

[0150] The electronic device 50 may further include indicator lights 53 located on the front of the electronic device 50 that can be used to indicate unread messages, unanswered phone numbers, and mobile phone status to the user.

[0151] Furthermore, after a user enters a shooting mode through the imaging control interface 510 of the electronic device 50, the camera module focuses the imaging light onto the photosensitive element, and outputs an electronic signal related to the image to an image signal processor (not shown) of the single-chip system 55, which may further include a random access memory (RAM) (not shown), a central processing unit (not shown), and a storage unit (not shown), and may further include, but are not limited to, a display unit, a control unit, a read-only memory unit (ROM) or a combination thereof.

[0152] In addition, the electronic device 50 may further include an image software processor and an image signal processor, and may further integrate the image software processor, the image signal processor, the position locator, the signal transmission processor, the gyroscope, the storage unit and the random access memory into a single chip system 55.

[0153] According to the camera specifications of the electronic device 50, the electronic device 50 may further include an optical image stabilization assembly (not shown), and may further include at least one auxiliary focus element 56 and at least one sensing element (not shown). The auxiliary focus element 56 may include a light emitting element 561 for compensating color temperature, an infrared distance measuring element (not shown), a laser focus module (not shown), etc., and the sensing element may have a function of sensing physical momentum and operating energy, such as an accelerometer, a gyroscope, a Hall effect element, a position locator, and a signal transmission processor, and may sense the shaking or vibration applied by the user's hand or the external environment, which is further beneficial to the performance of the autofocus function and the optical image stabilization assembly disposed in the camera module of the electronic device 50, obtain good imaging quality, and help the electronic device 50 according to the present disclosure to have multiple modes of shooting functions, such as selfie optimization, low light source HDR (High Dynamic Range, high dynamic range imaging), high resolution 4K (4K Resolution) recording, etc. In addition, the user can directly view the camera's shooting screen from the imaging control interface 510 and manually operate the framing range on the imaging control interface 510 to achieve an autofocus function that works as seen by the naked eye.

[0154] Furthermore, the camera module, the optical image stabilization assembly, the sensing element, the auxiliary focus element 56 and the electronic element 542 may be provided on the electronic element board 54 and electrically connected to related elements such as an image signal processor through a connector 541 to perform the photographing process, and the electronic element board 54 may be a flexible printed circuit board (FPC). Current electronic devices, such as smartphones, tend to be thin, and the camera module and related elements are arranged on a circuit board and the circuit is integrated into the motherboard of the electronic device using a connector, which can meet the demands of the mechanism design and circuit layout in the limited space inside the electronic device, obtain a larger margin, and can more flexibly control the autofocus function of the camera module by the touch screen of the electronic device. In the fifth embodiment, the sensing element and the auxiliary focus element 56 are provided on the electronic element board 54 and at least one other flexible circuit board (not shown), and electrically connected to related elements such as an image signal processing element through a corresponding connector to perform the photographing process. In another embodiment (not shown), the sensing elements and auxiliary optical elements may be mounted on a motherboard or other type of carrier board of an electronic device, as required by mechanical design and circuit layout.

[0155] In addition, the wide-angle camera module 522 can capture images with high pixels in a certain range, and has the function of high resolution and low distortion. The imaging result of the telephoto camera module 523 can have a smaller angle of view and depth of field than the wide-angle camera module 522, and can be used to capture moving targets, that is, the actuator (not shown) of the electronic device 50 drives the telephoto camera module 523 to perform high-speed and continuous auto focus on the target, and can prevent the target from being blurred because it moves away from the focus position. The imaging result of the super wide-angle camera module 524 can have a larger angle of view and depth of field than the wide-angle camera module 522, but often involves large distortion.

[0156] Specifically, the function of zooming can be realized in the electronic device 50 by framing with camera modules having different focal lengths and combining image processing techniques.

[0157] Sixth embodiment

[0158] Please refer to Fig. 6. This is a schematic diagram of an electronic device in a sixth embodiment of the present disclosure being provided on a drone 60. As can be seen from Fig. 6, the electronic device (not shown) includes a camera module, which may be the camera module of the first to fourth embodiments described above, but the present disclosure is not limited thereto.

[0159] In the sixth embodiment, the camera modules are a front camera module 61a, a side camera module 61b, and a bottom camera module 61c.

[0160] Specifically, the front camera module 61a is disposed at the front end of the drone 60, the side camera module 61b is disposed at the side of the drone 60, and the bottom camera module 61c is disposed at the bottom end of the drone 60. This allows the electronic device to deal with complex ambient lighting.

[0161] Seventh embodiment

[0162] Please refer to Fig. 7, which is a schematic diagram of an electronic device in a seventh embodiment of the present disclosure installed in an automobile 70. As can be seen from Fig. 7, the electronic device (not shown) includes a camera module, which may be the camera module of the first to fourth embodiments described above, but the present disclosure is not limited thereto.

[0163] In the seventh embodiment, the camera modules are a front camera module 71a, a side camera module 71b, and a rear camera module 71c.

[0164] A front camera module 71a, a side camera module 71b and a rear camera module 71c are respectively provided at the front end, the side and the rear end of the automobile 70, which helps the driver to obtain external space information other than the automobile 70, such as, but not limited to, external space information I1, I2, I3 and I4, thereby providing more viewing angles to reduce blind spots, which in turn helps to improve driving safety.

[0165] Eighth embodiment

[0166] Please refer to Fig. 8, which is a schematic diagram in which an electronic device in an eighth embodiment of the present disclosure is provided in a computer 80. As can be seen from Fig. 8, the electronic device (not shown) includes a camera module. Furthermore, the camera module may be the camera module in the first to fourth embodiments described above, but the present disclosure is not limited thereto.

[0167] In the eighth embodiment, the camera modules are an infrared camera module 81a and a video camera module 81b, and the infrared camera module 81a and the video camera module 81b are all provided on the front side of the computer 80.

[0168] <Ninth embodiment>

[0169] Please refer to Fig. 9, which is a schematic diagram of an electronic device in a ninth embodiment of the present disclosure being provided in a wearable device 90. As can be seen from Fig. 9, the electronic device (not shown) includes a camera module. Furthermore, the camera module may be the camera module of the first to fourth embodiments described above, but the present disclosure is not limited thereto.

[0170] In the ninth embodiment, the camera module is a video camera module 91 provided on the front side of the wearable device 90.

[0171] Although the present invention has been disclosed as described above in the embodiments and examples, the present invention is not intended to be limited thereto, and any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on that defined by the scope of the utility model registration claims attached later. [Explanation of symbols]

[0172] 10, 20, 30, 40: Camera module 11, 31, 41: Photosensitive element module 13, 33: Imaging lens carrier 110, 210, 310, 410: Photosensitive element 110a: photosensitive element surface 111: Pixel unit 112: Microlens 120a, 220a, 320, 420a: Reflective elements 120b, 220b, 420b: object side reflecting element 121, 221, 321, 421: Light incidence surface 122, 222, 322a, 322b, 322c, 322d, 322e, 422: Reflective surface 123, 223, 323, 423: Light exit surface 124: Tip 125:Ejection mark 126: Edge surface 127: Fillet surface 131, 231, 331, 431: Optical multilayer deposition structure layer 132, 232, 332: Infrared light absorbing coating 133, 433: Sub-optical multilayer stacking layers 140, 240: Nano-rough surface 141: Nanoprotrusion structure 161, 261, 361: Holder 162, 262: Air partition room 163, 263: Inner wall 170, 270, 370: Filter elements 171, 271, 371: Red light absorbing plate 181: Image side lens group 181a, 181b: Lens set 182: Object-side lens group 22, 32, 42a, 42b: Imaging lenses 234: Reflective layer 250: Reflective mirror group 251: Reflective mirror 252: Frame 253, 453: Holder part 254: Planar element 255: Substrate 264: Circuit board 265: Career 272: Red light absorbing glass 291: Driver 292, 392: Image processing element 366: Sustaining element 384: Infrared light absorbing lens 493: Image stabilization driver 494: Focus Driver 50:Electronic equipment 510: Imaging control interface 511: Image playback button 512: Camera module switching button 513: Focus shooting button 514: Integration option button 515: Zoom control button 521: Front camera module 522: Wide-angle camera module 523: Telephoto camera module 524: Ultra-wide-angle camera module 525: Macro camera module 526:TOF module 53: Indication lamp 54: Electronic device board 541: Connector 542: Electronic elements 55: Single chip system 56: Auxiliary focus element 561: Light emitting element 60: Drone 61a, 71a: Front camera module 61b, 71b: Side camera module 61c: Bottom camera module 71c: Rear camera module 70: Automobiles 80: Computer 81a: Infrared camera module 81b, 91: Video camera module 90: Wearable device AP: Absorption peak BS: Bass E:Circuit ES: Idemitsu side G: Adhesive L: Light path LE: Lens IMG: Photosensitive surface IS: Light input side I1, I2, I3, I4: External spatial information W1: Width of the nanoprotrusion structure W2: Pixel size in pixel units H1: Height of nanoprotrusion structure H2: Distance between the nano-protrusion structure and the photosensitive element surface SP, SP1, SP2: Distance between adjacent tips

Claims

1. A photosensitive element module having an optical path, a photosensitive element corresponding to the optical path; a reflective element facing and adjacent to the photosensitive element and folding the optical path; an optical multilayer stacked structure layer that is farther away from the photosensitive element than the reflecting element along the optical path and has a reflectance of 10% or less for light rays with wavelengths of 450 nm to 600 nm; a nano-rough surface including a plurality of nano-protrusion structures arranged adjacent to each other and having an irregular shape, a width of 300 nm or less, and a height of 350 nm or less, the nano-rough surface being provided on one side of the photosensitive element facing the reflective element; Equipped with The reflectance of the nano-rough surface corresponds to the reflectance of the optical multilayer stack structure layer, and the wavelength at which the reflectance of the optical multilayer stack structure layer is 50% is R50, and the maximum reflectance of the nano-rough surface from 450 nm to the wavelength R50 is 0.49% or less; A photosensitive element module that satisfies the condition 600 nm≦R50≦720 nm.

2. The reflective element is a prism including a light input surface, at least one reflecting surface, and a light output surface along the light path; The photosensitive element module of claim 1 , wherein the light output surface faces and is adjacent to the nano-rough surface.

3. The photosensitive element module according to claim 2 , wherein the optical multi-layer stacked structure layer is provided on the light incident surface.

4. The photosensitive element module according to claim 2 , wherein the prism is a red light absorbing element.

5. The photosensitive element module according to claim 2 , wherein at least one of the light entrance surface, the at least one reflecting surface and the light exit surface of the prism includes an aspheric surface, and the aspheric surface is provided corresponding to the optical path.

6. The prism is The optical path further includes a plurality of recessed structures arranged adjacent to each other and narrowing toward the optical path, the adjacent recessed structures forming a tip; 3. The photosensitive element module according to claim 2, wherein the distance between adjacent ones of the plurality of tips is between 0.3 mm and 2.9 mm.

7. the prism is a glass element; The photosensitive element module according to claim 2 , wherein the prism further comprises an injection mark and is injection molded through the injection mark.

8. The prism is an edge surface, the emission mark extending from the edge surface in a direction away from the optical path; The photosensitive element module according to claim 7 , wherein the ejection mark becomes gradually wider in a direction approaching the edge surface.

9. The reflective element is 2. The photosensitive element module according to claim 1, further comprising a reflecting mirror for folding the optical path.

10. The reflective element is The photosensitive element module according to claim 9 , further comprising a frame integrally formed with the reflecting mirror by embedded injection molding.

11. The reflective element is The photosensitive element module according to claim 10 , further comprising a nano-roughened surface provided on at least a portion of the reflective mirror and the frame.

12. a holder that is covered by the photosensitive element and on which the reflecting element is provided; an air compartment formed between the reflecting element and the photosensitive element, surrounded by the holder, and at least partially overlapping the nano-rough surface in the optical path; The photosensitive element module of claim 1 , further comprising:

13. The photosensitive element module according to claim 12 , wherein the nano-rough surface extends from the photosensitive surface to the holder and is provided on at least a portion of the holder.

14. the reflecting element includes a holder portion fixed relatively to the photosensitive element, The photosensitive element module of claim 1 , further comprising an air partition formed between the reflective element and the photosensitive element, surrounded by the holder portion, and at least partially overlapping the nano-rough surface in the optical path.

15. further comprising an infrared light absorbing coating disposed on the reflective element; 2. The photosensitive element module according to claim 1, wherein the infrared light absorbing coating has a thickness of 900 nm to 5 um.

16. 2. The photosensitive element module according to claim 1, further comprising a filter element including a red light absorbing plate on which the optical multi-layer stacked structure layer is provided.

17. The photosensitive element is A pixel unit has a pixel size of 400 nm to 2000 nm, and includes a plurality of pixel units, each of which includes a microlens; The photosensitive element module according to claim 1 , wherein the nano-rough surface is provided on the microlens in the any one of the plurality of pixel units.

18. The photosensitive element module according to claim 1 ; an imaging lens provided along the optical path on an object side of the photosensitive element module; a camera module including:

19. 20. The camera module of claim 18, further comprising an object-side reflecting element disposed on the object side of the photosensitive element module and on which the optical multi-layer stack structure layer is disposed.

20. The imaging lens is 20. The camera module of claim 19, further comprising an object-side lens group provided on the object side of the object-side reflective element.

21. The imaging lens is 20. The camera module of claim 19, further comprising an image-side lens group disposed between the object-side reflecting element and the photosensitive element module, the optical multilayer stack structure layer being disposed between the image-side lens group and the reflecting element.

22. The object-side reflecting element is provided on the object side of the reflecting element, 20. The camera module of claim 18, wherein the object-side reflective element includes an infrared light absorbing coating having a thickness between 900 nm and 5 um, and the optical path passes through the infrared light absorbing coating.

23. The imaging lens is 20. The camera module of claim 18, comprising a plurality of lenses arranged in sequence along the optical path, the optical multi-layer stack layer being disposed on one of the plurality of lenses.

24. The imaging lens is a lens group fixed relative to the reflecting element; 24. The camera module of claim 23, wherein the optical multi-layer stack layer is provided on the lens group.

25. The imaging lens is 24. The camera module of claim 23, further comprising an optical absorbing lens having an absorption peak between 600 nm and 800 nm.

26. The photosensitive element module includes: The reflector further includes a sub-optical multilayer stack structure layer disposed on the reflecting element, the reflectance of the sub-optical multilayer stack structure layer for a light beam having a wavelength of 450 nm to 550 nm is 10% or less, and the wavelength at which the reflectance of the sub-optical multilayer stack structure layer is 50% is R50'; The camera according to claim 23, which satisfies the condition 600 nm≦R50′≦720 nm. Module.

27. The camera module according to claim 23, wherein the imaging lens has an average wavelength transmittance of 5% or less for light rays with wavelengths of 700 nm to 800 nm, and a transmittance of 82% or more for light rays with wavelengths of 400 nm to 800 nm with a maximum transmittance wavelength.

28. the plurality of nanoprotrusion structures have a width of 250 nm or less and a height of 250 nm or less; The optical multilayer stack structure layer has a layer number greater than 30; the imaging lens comprises an optically absorbing lens having an absorption peak between 650 nm and 750 nm; The imaging lens has an average wavelength transmittance of 1% or less for light rays having a wavelength of 700 nm to 800 nm, and a transmittance of 85% or more for light rays having a wavelength of 400 nm to 800 nm with a maximum transmittance wavelength; the wavelength at which the reflectance of the optical multilayer stack structure layer is 50% is R50, and the maximum reflectance of the nano-rough surface from 450 nm to the wavelength R50 is 0.2% or less; 20. The camera module according to claim 18, which satisfies the condition 650 nm≦R50≦700 nm.

29. 20. An electronic device comprising the camera module of claim 18.

Images