LED Devices

Abstract

The present application relates to an LED device, the LED device including an LED holder and an LED chip disposed in the LED holder, and further including a packaging layer, the packaging layer including a quantum dot film assembly disposed above and spaced apart from the LED chip.

Description

[Technical field]

[0001] The present application relates to the field of LEDs (Light Emitting Diodes), and in particular to LED devices. [Background technology]

[0002] As the application of LED devices becomes more and more widespread, they are widely used in fields such as display and lighting. As the market demand for a high color gamut increases obviously, the application of quantum dot film in LED devices is increasing. The current method of installing quantum dot film in LED devices is to install an LED chip in an LED holder and bond two quantum dot films to the LED chip. With this installation method, the heat generated by the LED chip is directly transferred to the quantum dot film, which makes the quantum dots easily heat up and affects their performance. Summary of the Invention [Problem to be solved by the invention]

[0003] In view of the above-mentioned shortcomings in the related art, the objective of the present application is to provide an LED device to solve the problem that the quantum dot film provided in the conventional LED device is prone to heating. [Means for solving the problem]

[0004] The present application provides an LED device comprising an LED holder, an LED chip and a package layer, the LED holder comprising a base and an insulating holder, at least a portion of the insulating holder being provided as a dam on the base and forming a package groove together with the base, the LED chip being provided at the bottom of the package groove, the package layer comprising a quantum dot film assembly, the quantum dot film assembly being provided above the LED chip and spaced apart from the LED chip. Effect of the Invention

[0005] Beneficial effects The LED device according to the present application includes an LED holder and an LED chip disposed in the LED holder, and further includes a packaging layer, which includes a quantum dot film assembly disposed above the LED chip and spaced apart from the LED chip, thereby avoiding heat generated by the LED from being directly transferred to the quantum dot film and ensuring the performance of the quantum dots in the quantum dot film. [Brief description of the drawings]

[0006] [Figure 1-1] FIG. 1 is a schematic longitudinal sectional view of a quantum dot film assembly according to Example 1 of the present application. [Figure 1-2] 1 is a schematic vertical cross-sectional view of a quantum dot film according to Example 1 of the present application. [Diagram 2] FIG. 1 is a schematic diagram of the shape of a quantum dot film according to Example 1 of the present application. [Diagram 3] FIG. 2 is a schematic diagram of the shape of a quantum dot film according to Example 1 of the present application. [Figure 4] FIG. 3 is a schematic diagram of the shape of a quantum dot film according to Example 1 of the present application. [Diagram 5] FIG. 2 is a schematic longitudinal sectional view of a quantum dot film assembly according to Example 1 of the present application. [Figure 6] FIG. 3 is a schematic longitudinal sectional view of a quantum dot film assembly according to Example 1 of the present application. [Figure 7] FIG. 4 is a schematic longitudinal sectional view of a quantum dot film assembly according to Example 1 of the present application. [Figure 8] FIG. 5 is a fifth schematic vertical cross-sectional view of a quantum dot film assembly according to Example 1 of the present application. [Figure 9] FIG. 6 is a schematic longitudinal sectional view of a quantum dot film assembly according to Example 1 of the present application. [Figure 10] FIG. 7 is a schematic longitudinal sectional view of a quantum dot film assembly according to Example 1 of the present application. [Figure 11]FIG. 8 is a schematic longitudinal sectional view of a quantum dot film assembly according to Example 1 of the present application. [Figure 12] 1 is a schematic structural diagram in which the quantum dot film and the protective frame have the same thickness according to Example 1 of the present application. [Figure 13] FIG. 1 is a schematic diagram of a structure in which the thickness of the quantum dot film and the thickness of the protective frame are not equal according to Example 1 of the present application. [Figure 14] FIG. 2 is a second schematic diagram of a structure in which the thickness of the quantum dot film and the thickness of the protective frame are not equal according to Example 1 of the present application. [Figure 15] 1 is a flowchart of a method for manufacturing a quantum dot film assembly according to Example 1 of the present application. [Figure 16] 1 is a flowchart of a method for manufacturing a quantum dot film assembly according to Example 1 of the present application. [Figure 17] FIG. 13 is a bottom view of a protective layer when a first fixed post is provided according to a first embodiment of the present application. [Figure 18] FIG. 13 is a bottom view of the protective layer when a second fixing post is provided according to the first embodiment of the present application. [Figure 19] 1 is a schematic vertical cross-sectional view of an LED device according to Example 1 of the present application. [Figure 20] FIG. 2 is a plan view of a single row of LED devices in a backlight module according to Example 1 of the present application. [Figure 21] 21 is a cross-sectional view taken along the line AA in FIG. 20. [Figure 22] FIG. 1 is a schematic longitudinal sectional view of an LED device according to a second embodiment of the present application. [Figure 23] 1 is a schematic vertical cross-sectional view of an LED holder according to a second embodiment of the present application; [Figure 24] 2 is a schematic vertical cross-sectional view of an LED holder according to a second embodiment of the present application. [Diagram 25] 3 is a schematic vertical cross-sectional view of an LED holder according to a second embodiment of the present application; [Figure 26] FIG. 2 is a schematic vertical cross-sectional view of an LED device according to Example 2 of the present application; [Figure 27]FIG. 11 is a plan view of an LED holder according to a third embodiment of the present application. [Figure 28] FIG. 28 is a first cross-sectional view of the LED holder taken along line BB in FIG. 27. [Figure 29] FIG. 28 is a second cross-sectional view of the LED holder taken along line BB in FIG. 27. [Diagram 30] FIG. 28 is a third cross-sectional view of the LED holder taken along line BB in FIG. 27. [Diagram 31] FIG. 28 is a fourth cross-sectional view of the LED holder taken along line BB in FIG. 27. [Diagram 32] FIG. 11 is a plan view of an LED device according to Example 3 of the present application. [Diagram 33] FIG. 33 is a first CC cross-sectional view of the LED device in FIG. 32. [Diagram 34] FIG. 33 is a second cross-sectional view of the LED holder taken along line CC in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] In order to facilitate the understanding of the present application, the present application will be described in more detail below with reference to the associated drawings, in which preferred embodiments of the present application are shown. However, the present application is not limited to the embodiments set forth herein, but may be embodied in many different forms. On the contrary, the purpose of providing these embodiments is to provide a more complete and clear understanding of the disclosure of the present application.

[0008] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art of this application. The terms used in the specification of this application are for the purpose of describing particular embodiments only and are not intended to be limiting of this application.

[0009] In response to the problem that the conventional LED device is easily heated when a quantum dot film is provided, the present application provides an LED device, which includes an LED holder, an LED chip, and a package layer, the LED holder includes a base and an insulating holder, at least a part of the insulating holder is provided on the base as a dam, and forms a package groove together with the base, the surface of the base facing the insulating holder is the bottom of the package groove, and the open end of the dam is separated from and communicates with the bottom of the package groove. The LED chip is provided at the bottom of the package groove, and the package layer includes a quantum dot film assembly, which is provided above the LED chip and spaced apart from the LED chip, thereby avoiding the heat generated by the LED from being directly transferred to the quantum dot film and ensuring the performance of the quantum dots in the quantum dot film. For ease of understanding, the quantum dot film assembly, the LED holder, and the like included in the LED device in the present application will be exemplified below for explanation.

[0010] Example 1 This embodiment provides a quantum dot film assembly, which includes a protective frame having a hollow area in the middle region, a quantum dot film provided in the hollow area, and a light-transmitting adhesive layer at least partially filled in the hollow area to fix the quantum dot film and the protective frame. The quantum dot film assembly has a simple structure, is easy to manufacture, has high reliability, has a high yield rate, and is low cost. For ease of understanding, the quantum dot film assembly and its manufacturing method, as well as an LED device using the quantum dot film assembly, are exemplified and described in the following embodiment with reference to the drawings.

[0011] For the quantum dot film assembly according to this embodiment, refer to FIG. 1. The quantum dot film assembly 10 shown in the figure includes a protective frame 11, a quantum dot film 12, and a light-transmitting adhesive layer 13. The intermediate region of the protective frame 11 is a hollow region. The quantum dot film 12 is provided in the hollow region. In this embodiment, the protective frame 11 and the quantum dot film 12 each have a top surface and a bottom surface that are provided opposite to each other, and the bottom surfaces of the protective frame 11 and the quantum dot film 12 are both surfaces that face the opening end of the dam of the LED holder during use. The light-transmitting adhesive layer 13 is filled into the hollow area to fix the quantum dot film 12 and the protective frame 11. This fixing method has a simple structure and process, high manufacturing efficiency and low cost, and can ensure the reliability and airtightness of the fixation between the quantum dot film 12 and the protective frame 11. In the quantum dot film assembly 10, the protective frame 11 surrounds the quantum dot film 12, provides protection and support for the quantum dot film 12, and further reduces the adverse effects of the environment on the quantum dot film 12, thereby improving the reliability of the quantum dot film 12.

[0012] In this embodiment, the inner surface of the protective frame 11, which is the side surface of the hollow region, may be provided as a light reflecting surface. In this way, when the quantum dot film assembly 10 is provided on an LED holder to manufacture an LED device, the light emitted to the inner surface of the protective frame 11 can be reflected back, thereby concentrating more light rays on the light emitting surface of the LED device, which is advantageous for improving the light emitting efficiency of the LED device.

[0013] In this embodiment, the material of the protective frame 11 is not particularly limited, but as an example, the protective frame 11 may be a white protective frame, in which case the inner surface and other surfaces of the protective frame 11 are both light reflecting surfaces. The protective frame 11 may be a transparent protective frame or a protective frame whose surface is of another color, in which case, if necessary, a reflective layer may be added to the inner surface. Of course, in some application scenarios, the reflective layer may not be added.

[0014] In this embodiment, the quantum dot film 12 may be a conventional quantum dot film, for example, a quantum dot film, which is composed of a hardened adhesive layer and quantum dots mixed in the adhesive layer. In some examples in this embodiment, in order to improve the reliability of the quantum dot film 12, as shown in FIG. 1-2, the quantum dot film 12 is provided to include two transparent protective films 121 and a quantum dot layer 122 located between the two transparent protective films, and the quantum dot layer 122 may include at least one of red quantum dots and green quantum dots. The quantum dot layer 122 is sealed by the two transparent protective films 121, thereby ensuring the airtightness of the quantum dot layer and avoiding the influence of the external environment on the quantum dot layer. Of course, in this embodiment, the structure of the quantum dot film 12 is not limited to the two structures in the above examples, and will not be described in detail here. In some applications, the quantum dot film 12 may be manufactured sheet by sheet or roll by roll, and may be cut or cut according to the desired size when used.

[0015] In this embodiment, the light-transmitting adhesive layer 13 may use various materials that can realize adhesion and hardening. For example, the light-transmitting adhesive layer 13 may select an adhesive material that is incompletely transparent but has light-transmitting properties, or a transparent adhesive material. For example, the light-transmitting adhesive layer 13 may use a light-transmitting adhesive layer. The light-transmitting adhesive layer 13 may be filled only between the side of the quantum dot film 12 and the inner wall of the protective frame 11 so as to fix the quantum dot film 12 and the protective frame 11 (i.e., may be filled in the gap between the quantum dot film 12 and the protective frame 11), or may be filled in other areas of the hollow area. In addition, in this embodiment, the light-transmitting adhesive layer 13 may be located entirely in the hollow area, or may be located partially in the hollow area and partially outside the hollow area. That is, in this embodiment, the position of the light-transmitting adhesive layer 13 relative to the protective frame 11 and the quantum dot film 12 may be various. For example, the bottom surface of the light-transmitting adhesive layer 13 is flush with the bottom surface of the protective frame 11, or for example, the bottom surface of the light-transmitting adhesive layer 13 extends onto the protective frame 11 and covers the bottom surfaces of the protective frame 11 and the quantum dot film 12, or for example, the top surface of the light-transmitting adhesive layer 13 is flush with the top surface of the protective frame 11, or the top surface of the light-transmitting adhesive layer 13 extends onto the protective frame 11 and covers the top surfaces of the protective frame 11 and the quantum dot film 12. It can be understood that when providing the specific position and structure of the light-transmitting adhesive layer 13, any combination of several of the above-mentioned examples can be used. For ease of understanding, the following will be further described in conjunction with the drawings, but it should be understood that the application of the present application is not limited to the following examples.

[0016] As shown in Figure 5, the bottom surface of the translucent adhesive layer 13 is flush with the bottom surface of the protective frame 11, and the top surface of the translucent adhesive layer 13 is flush with the top surface of the protective frame 11, so that the quantum dot film assembly 10 shown in Figure 5 has the advantage of being lightweight and thin.

[0017] 6, the bottom surface of the light-transmitting adhesive layer 13 is flush with the bottom surface of the protective frame 11, and the top surface of the light-transmitting adhesive layer 13 extends onto the protective frame 11 and covers the top surfaces of the protective frame 11 and the quantum dot film 12. The light-transmitting adhesive layer 13 has high coverage for the quantum dot film 12 and good bonding strength with the protective frame 11, so that the top surface of the obtained quantum dot film assembly 10 is an integrated flat surface and has high airtightness.

[0018] 7, the top surface of the light-transmitting adhesive layer 13 extends onto the protective frame 11 and covers the top surfaces of the protective frame 11 and the quantum dot film 12, and the bottom surface of the light-transmitting adhesive layer 13 extends onto the protective frame 11 and covers the bottom surfaces of the protective frame 11 and the quantum dot film 12. The light-transmitting adhesive layer 13 has high coverage over the quantum dot film 12 and the protective frame 11 and also has good bonding strength with the protective frame 11, and the top and bottom surfaces of the quantum dot film assembly 10 are both integrated flat surfaces and are highly airtight.

[0019] As can be seen from the above, in this embodiment, the top and bottom surfaces of the light-transmitting adhesive layer 13 may be further arranged to be flush with the top and bottom surfaces of the protective frame 11, or the light-transmitting adhesive layer 13 may be arranged to cover the top and / or bottom surfaces of the protective frame 11 and the quantum dot film 12, thereby satisfying the purpose of using the light-transmitting adhesive layer 13 to fix the quantum dot film 12 and the protective frame 11, and improving the flexibility of setting the structure of the light-transmitting adhesive layer 13, expanding the application scenarios and improving the adaptability.

[0020] In this embodiment, based on the specific structure of the above-mentioned light-transmitting adhesive layer 13, the quantum dot film assembly 10 may further include a reflective layer to improve the luminance. For example, as shown in FIG. 8, the top surface of the light-transmitting adhesive layer 13 extends onto the protective frame 11 and covers the top surfaces of the protective frame 11 and the quantum dot film 12, the region of the light-transmitting adhesive layer 13 covering the top surface of the protective frame 11 is provided with a first groove communicating with the top surface of the protective frame 11, and the quantum dot film assembly 10 further includes a first reflective layer 141 provided in the first groove. The bottom surface of the light-transmitting adhesive layer 13 extends onto the protective frame 11 and covers the bottom surfaces of the protective frame 11 and the quantum dot film 12, the region of the light-transmitting adhesive layer 13 covering the bottom surface of the protective frame 11 is provided with a second groove communicating with the bottom surface of the protective frame 11, and the quantum dot film assembly 10 further includes a second reflective layer 142 provided in the second groove. In the example shown in the figure, the quantum dot film assembly 10 includes a first reflective layer 141 and a second reflective layer 142, and of course, it should be understood that the quantum dot film assembly 10 may include one of the first reflective layer 141 and the second reflective layer 142. As can be seen from the above, in this embodiment, a reflective layer may be further provided in the area covering the top or bottom surface of the protective frame of the translucent adhesive layer 13, and the light reflecting properties of the reflective layer may further improve the luminance of the LED product.

[0021] In this embodiment, the thickness relationship between the quantum dot film 12 and the protective frame 11 is not limited. The thickness of the quantum dot film 12 may be equal to or less than the thickness of the protective frame 11, or may be equal to or greater than the thickness of the protective frame 11. Based on the thickness relationship between the two described above, the height relationship between the top and bottom surfaces of the quantum dot film 12 and the top and bottom surfaces of the protective frame 11 may be further set. For ease of understanding, the following description will be given with reference to the drawings, and it should be understood that the application of this application is not limited to the following examples.

[0022] 12, the thickness of the quantum dot film 12 is equal to the thickness of the protective frame 11, and the top and bottom surfaces of the quantum dot film 12 are flush with the top and bottom surfaces of the protective frame 11. By making the thickness of the quantum dot film 12, the thickness of the protective frame 11, and the thickness of the light-transmitting adhesive layer 13 equal, the quantum dot film assembly 10 formed is lightweight and thin.

[0023] 13, the thickness of the quantum dot film 12 is smaller than the thickness of the protective frame 11, and the bottom surface of the quantum dot film 12 is flush with the bottom surface of the protective frame 11. Making the thickness of the protective frame 11 larger than the thickness of the quantum dot film 12 is advantageous in that the protective frame 11 can better protect the quantum dot film 12.

[0024] 14, the top surface of the protective frame 11 is higher than the top surface of the quantum dot film 12, and the bottom surface of the quantum dot film 12 is higher than the bottom surface of the protective frame 11. By making the thickness of the protective frame 11 larger than the thickness of the quantum dot film 12 and locating the quantum dot film 12 in the center, it is advantageous for the protective frame 11 to better protect the quantum dot film 12.

[0025] In this embodiment, when the quantum dot film assembly 10 shown in each of the above examples is used in combination with an LED holder, it may be provided in the LED holder so that a certain gap is provided between the LED chip in the LED holder, thereby avoiding the direct transfer of heat generated by the LED to the quantum dot film and ensuring the performance of the quantum dots in the quantum dot film.

[0026] According to research, in the prior art, when the quantum dot film is installed in the LED holder, a specific support structure must be installed in the dam of the LED holder, and the quantum dot film must be installed in the dam, and the quantum dot film must be fixed and supported by the specific support structure. This method requires customizing the specific structure of the LED holder first, which is expensive and has low versatility and is difficult to popularize. The quantum dot film assembly 10 of this embodiment has a protective frame and a transparent adhesive layer to support the quantum dot film, so there is no need to add a specific support structure in the dam of the LED holder, and it is highly versatile and low cost.

[0027] In addition, research has shown that when the inner diameter of the dam of the LED holder is small and the quantum dot film is installed inside the dam, the installation is difficult, so the packaging efficiency and the yield rate are low, and the cost is further increased. The quantum dot film is installed inside the dam and is attached to or adjacent to the LED chip inside the dam, so that the heat generated by the LED chip is transferred to the quantum dot film, and the quantum dot film is located in the closed space of the dam, so the heat dissipation performance is low, and the poor heat dissipation further affects the performance of the quantum dots. In contrast, the quantum dot film assembly 10 according to this embodiment may be directly installed on the open end of the dam of the LED holder, eliminating the need to provide a specific support structure within the dam, and is therefore more versatile, less costly, and easier to install than when installed within a dam. This can improve the manufacturing efficiency and yield rate of the entire LED device, and is advantageous for the widespread use of the quantum dot film assembly 10 in LED devices. In addition, the gap between the quantum dot film assembly 10 and the LED chip in the dam can be further increased, reducing the transfer of heat generated by the LED chip to the quantum dot film assembly 10, and the quantum dot film assembly 10 itself can dissipate heat more quickly, thereby reducing the impact of heat on the quantum dots.

[0028] In this embodiment, when the quantum dot film assembly 10 is directly installed on the open end of the dam of the LED holder, the fixing method between the quantum dot film assembly 10 and the LED holder can be flexibly set. For example, the quantum dot film assembly 10 can be directly fixed to the LED holder by adhesion without adding a specific structure to the LED holder, and can be applied to various LED holders and is highly versatile. The quantum dot film assembly 10 can be nailed to the open end of the dam of the LED holder using various nailing methods. In this embodiment, preferably, the quantum dot film assembly 10 can be further provided to include a fixing pole, and is fixed and attached to the open end of the dam of the LED holder through the fixing pole, and the gap between the quantum dot film assembly 10 and the LED chip in the dam can be adjusted by adjusting the height of the fixing pole, so as to better adjust and achieve the target luminous chromaticity of the LED device.

[0029] In this embodiment, the specific number of the fixing posts is not limited, and may be two, three, four, or other values ​​as long as the quantum dot film assembly 10 can be stably fixed to the open end of the dam of the LED holder. In addition, in this embodiment, the fixing posts may be all provided on the protective frame 11, all provided on the light-transmitting adhesive layer 13, or some provided on the protective frame 11 and some provided on the light-transmitting adhesive layer 13. For example, as shown in FIG. 9, the bottom surface of the light-transmitting adhesive layer 13 is flush with the bottom surface of the protective frame 11, and the quantum dot film assembly 10 further includes a first fixing post 151 configured to be fixed to a first fixing hole at the open end of the dam provided on the bottom surface of the protective frame 11. Also, referring to FIG. 10 and FIG. 11, for example, the quantum dot film assembly 10 further includes a second fixing post 152 configured to be fixed to a second fixing hole at the open end of the dam 31 provided on the bottom surface of the light-transmitting adhesive layer 13. As can be seen from the above, in this embodiment, the bottom surface of the protective frame 11 and / or the light-transmitting adhesive layer 13 may further be provided with fixing posts, and when the quantum dot film assembly 10 is installed in the LED holder, alignment and fixing can be achieved through the fixing posts and the fixing holes in the dam, and the target emission chromaticity of the LED device can be achieved by adjusting the distance between the quantum dot film assembly 10 and the LED chip in the dam by the fixing posts. In addition, the quantum dot film assembly 10 is fixed and attached through the fixing posts and the corresponding fixing holes, which is simple to install, and the quantum dot film assembly 10 can be easily removed without damage when necessary later (e.g., when repairing), and the LED holder and / or the quantum dot film assembly 10 can be recovered and reused, which can improve resource utilization and reduce costs.

[0030] In this embodiment, when the quantum dot film assembly 10 is directly installed on the opening end of the dam of the LED holder, in order to ensure the light emission quality of the LED device, the shape and size of the quantum dot film 12 included in the quantum dot film assembly 10 may be arranged to match the shape and size of the opening of the dam opening end. Here, the shape of the quantum dot film 12 matching the shape of the opening of the dam opening end means that the shapes of the two are the same or substantially the same. Here, the size of the quantum dot film 12 matching the size of the opening of the dam opening end means that the sizes of the two are the same, or the size of the quantum dot film 12 is slightly larger or smaller than the size of the opening. The advantage of such arrangement is that the quantum dot film 12 can be improved in utilization rate and reduced cost while satisfying that the quantum dot film 12 substantially or completely covers the opening of the dam opening end. Of course, in another application scenario, the shape of the quantum dot film 12 may be different from the shape of the opening of the dam opening end, and the size of the quantum dot film 12 may be arranged to be larger than the size of the opening of the dam opening end. For example, the shape of the quantum dot film 12 may be the same as the shape of the opening at the dam opening end, and the shapes of the quantum dot film 12 and the opening at the dam opening end may be various, and for example, the shape of the quantum dot film 12 will be described below as an example, but it may be a circle, an ellipse, a rectangle, a diamond, or other irregular shape, but is not limited thereto. For example, the shape of the quantum dot film 12 shown in Figure 2 is a circle, the shape of the quantum dot film 12 shown in Figure 3 is a rectangle, and the shape of the quantum dot film 12 shown in Figure 4 is a diamond, and the specific shape can be flexibly set depending on the application.

[0031] For ease of understanding, this embodiment further provides a manufacturing method for the quantum dot film assembly shown in each of the above examples, as shown in FIG. 15, which includes the following steps:

[0032] S101: Providing a protective frame having a hollow region and a quantum dot film.

[0033] S102: The quantum dot film is provided in the hollow region, and a light-transmitting adhesive medium (eg, glue) is injected into the hollow region to fix the quantum dot film and the protective frame.

[0034] As can be seen from the above, the manufacturing method uses a simple process, the manufacturing procedure is simple, the efficiency is high and the cost is low, and the manufactured quantum dot film assembly has high reliability and versatility.

[0035] In this embodiment, the quantum dot film assembly may be manufactured singly or in batches to improve manufacturing efficiency and save costs. For ease of understanding, an exemplary batch manufacturing method is described below. As shown in FIG. 16, it includes the following steps:

[0036] S201: Provide a protective layer 110. The protective layer 110 includes a plurality of protective frames 11 connected in sequence, and the middle region 111 of each protective frame 11 is a hollow region.

[0037] The material of the protective layer 110 is not limited, and the protective layer 110 may be a white protective layer, a transparent protective layer, etc. The shape of the hollow area 111 of each protective frame 11 may be the same as or different from the shape of the quantum dot film 12, and the size of the hollow area 111 of each protective frame 11 may be larger than the size of the quantum dot film 12 to leave a position for the glue in advance, which is advantageous for subsequently bonding the quantum dot film 12 and the protective layer 110 together. Of course, the size of the hollow area 111 may be equal to or smaller than the size of the quantum dot film 12, and in this case, the top and / or bottom surfaces of the protective frame 11 and the adhesive quantum dot film 12 can be simultaneously covered with glue to fix them together. The thickness of the protective layer 110 may be the same as or different from the thickness of the quantum dot film 12.

[0038] S202: Providing a plurality of quantum dot films 12, and fixing each quantum dot film 12 in a hollow region 111 of a corresponding protective frame 11.

[0039] For example, a glue is injected into the hollow region 111 of the protective frame 11 to form a light-transmitting adhesive layer, and the quantum dot film and the protective frame are fixed via the light-transmitting adhesive layer. As described above, the light-transmitting adhesive layer may be a light-transmitting adhesive layer. Referring to FIG. 17, the bottom and top surfaces of the light-transmitting adhesive layer may be flush with the bottom and top surfaces of the protective frame 11, and a first fixing post 151 is provided on the bottom surface of the protective frame 11. Referring to FIG. 18, the bottom and top surfaces of the light-transmitting adhesive layer may extend onto the protective frame 11 and cover the bottom and top surfaces of the protective frame 11 and the quantum dot film 12, respectively. A second fixing post 152 is provided on the bottom surface of the light-transmitting adhesive layer. This light-transmitting adhesive layer may be integrally molded with the second fixing post 152. In some applications, the light-transmitting adhesive layer and the fixing post are not limited to being formed by a dispensing or stamping process. When the light-transmitting adhesive layer formed by the embossing process can cover the bottom surface of the protective frame 11, a portion of the light-transmitting adhesive layer can be further cut subsequently to provide a groove communicating with the bottom surface of the protective frame 11 on the bottom surface of the light-transmitting adhesive layer covering the protective frame 11, and a reflective layer (e.g., the above-mentioned first reflective layer and second reflective layer) can be formed by injecting white glue into the groove by the embossing process.

[0040] S203: The protective layer 110 on which the multiple quantum dot films 12 are provided is cut to obtain the quantum dot film assembly 10. For example, the cut is made along the dashed lines shown in FIG. 17 or FIG. 18, thereby obtaining a single quantum dot film assembly.

[0041] This embodiment further provides an LED device, and as shown in FIG. 19, the LED device 100 includes any of the quantum dot film assemblies 10 as described above, and further includes an LED chip 20 and an LED holder 30, and the LED holder 30 includes an insulating holder 31 forming a dam. The LED chip 20 is disposed in a package groove (also called a receiving chamber), the quantum dot film assembly 10 is disposed at an open end of the dam (i.e., the insulating holder 31), and the quantum dot film 12 of the quantum dot film assembly 10 covers the opening of the dam open end. As can be seen from the above, when the quantum dot film assembly 10 and the LED holder 30 are used in combination, the LED device 100 according to this embodiment has no specific requirements for the specific structure of the LED holder 30, and is highly versatile and has a wide range of applications.

[0042] In one example of this embodiment, the LED holder 30 may specifically include an insulating holder 31 and a base, the base includes a first frame (also called a positive substrate) 32 and a second frame (also called a negative substrate) 33, and the insulating holder 31 is provided on both the first frame 32 and the second frame 33 to form a dam. In this case, the insulating holder 31, the first frame 32 and the second frame 33 form a bowl-shaped structure (the internal hollow portion constitutes the package groove). The LED chip 20 is provided in the package groove and contacts the first frame 32 and / or the second frame 333. The package layer of the LED device 100 may further include other package layers, such as a package adhesive layer, a nitrogen gas layer, an inert gas layer, etc., provided in the package groove and covering the LED chip 20. In this embodiment, the types of the LED chip and the package adhesive are not limited, but are only examples for understanding here. The package adhesive may be, but is not limited to, a transparent package adhesive, a package adhesive containing a red phosphor, or a package adhesive containing a green phosphor. Based on the above description, the quantum dots in the quantum dot film 12 may include at least one of red quantum dots and green quantum dots. In practical applications, in order to enable the LED device 100 to generate mixed white light, a blue light LED chip, a transparent packaging adhesive, and the quantum dot film 12 including red quantum dots and green quantum dots may be combined, a blue light LED chip, a packaging adhesive including red phosphor, and the quantum dot film 12 including green quantum dots may be combined, or a blue light LED chip, a packaging adhesive including green phosphor, and the quantum dot film 12 including red quantum dots may be combined.

[0043] As can be further understood, when a fixing column is provided on the quantum dot film assembly 10, the opening end of the dam of the LED holder 30 may further be provided with a corresponding fixing hole for fixing to the fixing column on one side of the quantum dot film assembly 10, so that the quantum dot film 12 in the LED device 100 and the opening end of the dam have a certain distance, the distance between the quantum dot film 12 and the LED chip 20 is increased, and the adverse effect on the quantum dots caused by the heat generated by the LED chip 20 is further reduced, and the luminous chromaticity can be adjusted.

[0044] This embodiment further provides a backlight module, and referring to Fig. 20 and Fig. 21, the backlight module 200 includes a substrate 40 and a plurality of LED devices 100 disposed on the substrate 40. It can be understood that the LED device 100 in the backlight module 200 can be any of the above, and the specific structure of the LED device 100 is not described in detail here. The substrate 40 can be any of various substrates with integrated driving circuits or any of various substrates without integrated driving circuits.

[0045] As can be understood, in order to realize the adjustment of the light output angle of the backlight module 200, the backlight module 200 may further include a plurality of lenses 50 provided on the substrate 40, each corresponding to one LED device 100. Furthermore, the lens 50 may be provided to include a lens portion 51 and a support portion 52, the lens portion 51 having a spherical convex shape, the support portion 52 being fixed to the lens portion 51, and the two being combined to form a receiving chamber. The support portion 52 of the lens 50 is fixed to the substrate 40, and the LED device 100 is placed in the receiving chamber of the lens 50, thereby realizing that the lens 50 covers the corresponding LED device 100. Furthermore, the height of the support portion 52 may be flexibly set, for example, the height of the support portion 52 may be equal to the height of the LED device 100, or the height of the support portion 52 may be appropriately larger than the height of the LED device 100, and in the latter case, the distance between the lens portion 51 and the LED device 100 may be increased, which is advantageous to improve the light emission uniformity of the backlight module 200.

[0046] The present embodiment further provides a display device including any of the backlight modules as described above. The display device of the present embodiment can be used in terminals such as televisions, displays, or mobile phones.

[0047] Example 2 In this embodiment, an LED holder used by an LED device is illustrated and described. As the application of LED devices becomes more widespread, the demand for crack resistance and high airtightness of LED devices increases. The conventional method is to provide a packaging adhesive in the package groove of the LED holder to improve airtightness, but the groove walls of the conventional package grooves are all straight wall structures, so that external water vapor, etc. easily enters the inside of the package groove through the interface between the groove wall of the package groove and the packaging adhesive directly, resulting in low airtightness.

[0048] This embodiment provides an LED holder with excellent airtightness and reliability, which can be combined with a package layer to form an LED device. The LED holder in this embodiment includes a base and an insulating holder, at least a part of which is provided on the base as a dam and forms a package groove together with the base. A step surface is provided on the groove wall of the package groove, and the package groove is configured to accommodate an LED chip. The package layer in this embodiment includes a first package layer and a second package layer, the second package layer is fixed on the step surface, and the first package layer is located below the second package layer. By providing a step surface in the package groove of the LED holder, the bonding strength between the second package layer and the LED holder can be improved, and the path for external water vapor and the like to enter along the groove wall of the package groove can be extended, thereby comprehensively improving the airtightness of the obtained LED device.

[0049] The second package layer in this embodiment may use the quantum dot film assembly 10 shown in the above-mentioned embodiment 1, but is not limited thereto. In this case, the quantum dot film assembly 10 may be provided on the step surface and the entire assembly may be located in the package groove. The second package layer may use various conventional quantum dot films or packaging adhesive layers, such as a transparent adhesive layer or a fluorescent adhesive layer. In other words, the second package layer in this embodiment may use the quantum dot film assembly 10 in the above-mentioned embodiment 1, or may not use the quantum dot film assembly 10 in the above-mentioned embodiment 1. The first package layer in this embodiment may use at least one of a packaging adhesive layer, a nitrogen gas layer, and an inert gas layer.

[0050] For ease of understanding, the present embodiment will be described below with reference to an LED device shown in Fig. 22. The LED device 100 includes an LED holder 30, an LED chip 20 and a package layer 7 provided in the LED holder 30, the LED holder 30 includes a base 3 and an insulating holder 31, at least a part of the insulating holder 31 is provided on the base 3 so as to form a package groove together with the base 3, and a step surface 301 is provided on the groove wall of the package groove. The LED chip 20 is placed in the package groove 35 and electrically connected to the base 3; The package layer 7 includes a first package layer 71 and a second package layer 72 , where the first package layer 71 contacts and covers the LED chip 20 , and the second package layer 72 is fixed on the step surface 301 .

[0051] The structure of an example of the LED holder 30 shown in Fig. 22 includes a base 3 and an insulating holder 31, as shown in Fig. 23. The base 3 includes a first frame 32 and a second frame 33, and the first frame 32 and the second frame 33 are provided so as to be insulated and separated from each other via a separation groove, and an insulating part 60 is filled in the separation groove. The insulating holder 31 forms a package groove 35 together with the first frame 32 and the second frame 33. The side walls of the insulating holder 31 form the groove walls of the package groove 35, and a step surface 301 is provided on the side walls of the insulating holder 31. In the region of the package groove 35 on the top surfaces of the first frame 32 and the second frame 33, a functional region is provided in each in order to be electrically connected to the LED chip 20. In this embodiment, the first frame 32 and the second frame 33 may use a metal substrate or a printed circuit board, and the metal substrate may be at least one of an aluminum substrate, a copper substrate, a silver substrate, a conductive alloy substrate, etc., but is not limited thereto, and the printed circuit board may be obtained by providing a corresponding conductive layer on a non-metal substrate. As can be understood, in this embodiment, the insulating holder 31 may extend from the top surface of the first frame 32 and the second frame 33 toward the bottom surface of the base 3, or may further extend from the top surface of the first frame 32 and the second frame 33 to the side surface and / or bottom surface thereof. For example, the insulating holder 31 may be provided to be located simultaneously on the top surface and the side surface of the first frame 32 and the second frame 33, or may be provided to be located simultaneously on the top surface, the side surface, and the bottom surface of the first frame 32 and the second frame 33. When the insulating holder 31 extends from the top surface of the first frame 32 and the second frame 33 to the side surface and / or bottom surface, the strength of the connection between the insulating holder 31 and the base 31 can be further improved and the airtightness can be further improved.

[0052] In the prior art, when manufacturing an LED holder, the insulating holder is usually a plastic holder, and when the plastic holder is manufactured on the base by injection molding, the plastic material is likely to overflow into the area where the LED chip is provided on the first frame 32 and the second frame 33, which affects the bonding between the LED chip and the LED holder. In contrast, another exemplary structure of the LED holder 30 shown in FIG. 22 is shown in FIG. 24, in which the first frame 32 includes a first functional area 322 for electrically connecting to the LED chip 20, the second frame 33 includes a second functional area 332 for electrically connecting to the LED chip 20, a third groove 321 is provided on the outer periphery of the first functional area 322 in the first frame 32, and a fourth groove 331 is provided on the outer periphery of the second functional area 332 in the second frame 33, and the first functional area 322, the third groove 321, the second functional area 332 and the fourth groove 331 are all exposed from the package groove 35. As can be seen, when forming the insulating holder 31 on the base 3, the first frame 32 and the second frame 33 can be placed at the predetermined fixed position of the lower mold, respectively, and then the upper mold and the lower mold can be attached. The upper mold has a shape complementary to the shape of the insulating holder and the package groove, and further includes a protruding portion complementary to the shape of the first groove 321 and the second groove 331. During the injection molding step, the plastic material does not enter the functional area of ​​the first frame 32 and the second frame 33 due to the barrier of the protruding portion. As can be seen from the above, by providing the first groove 321 and the second groove 331, when manufacturing the insulating holder, the plastic material can be effectively prevented from overflowing into the functional area of ​​the first frame 32 or the second frame 33, which may affect the reliability of the bonding between the LED chip 20 and the base 3. In addition, the provision of the first groove 321 and the second groove 331 can further improve the reliability and airtightness between the first frame 32 and the second frame 33 and the first package layer 71. In addition, the provision of the first groove 321 and the second groove 331 can further extend the intrusion path of external water vapor, thereby improving reliability.

[0053] Another exemplary structure of the LED holder 30 shown in FIG. 22 can be seen in FIG. 25. The end surface of the insulating holder 31 on which the step surface 301 is formed may further include a fifth groove 302. The fifth groove 302 can be provided on the step surface 301 to provide a filling position for the second package layer or a locking position for the second package layer, and further improve the bonding strength and airtight performance of the second package layer. In addition, the fifth groove 302 can further extend the intrusion path of external water vapor, thereby further improving reliability. In particular, when the LED chip is a UV chip and the second package layer is adhesively fixed through the adhesive filled in the fifth groove 302, the adhesive filled in the fifth groove 302 can be prevented from being deactivated by UV irradiation, thereby ensuring the stable fixation of the adhesive layer for the second package and improving reliability.

[0054] In this embodiment, as shown in Fig. 22 and Fig. 26, the LED device 100 may use a two-stage package mode, that is, a first package layer 71 and a second package layer 72 may be filled in the package groove 35 in order. The first package layer 71 contacts the LED chip 20, and the second package layer 72 is fixed on a step surface 301. The first package layer 71 may or may not directly contact the second package layer 72. When the first package layer 71 directly contacts the second package layer 72, the step surface 301 may be flush with the interface between the first package layer 71 and the second package layer 72, or may be approximately flush with the interface. In this embodiment, the hardness of the first package layer 71 may be smaller than that of the second package layer 72. When the hardness of the first package layer 71 closer to the LED chip 20 is low, the crack resistance is high. Conversely, when the hardness of the second package layer 72 away from the LED chip 20 is high, the airtight performance is high. This allows the LED device 100 to have both high crack resistance and high airtightness, improving the reliability of the LED device.

[0055] For example, the first package layer 71 may be provided as a soft adhesive layer, and the second package layer 72 may be provided as a hard adhesive layer or the quantum dot film assembly 10 shown in the above embodiment 1. The lower the hardness of the package layer, the stronger its crack resistance and the higher its oxygen permeability and moisture permeability. Therefore, by providing the first package layer 71 closer to the LED chip 20, the crack resistance of the soft adhesive layer can be utilized to improve the phenomenon that the LED chip 20 is prone to cracking due to high radiation and high heat emission, especially when the LED chip 20 is a high-power chip. In order to avoid direct contact between the hard adhesive layer and the LED chip and to protect the lower soft adhesive layer and the LED chip, the hard adhesive layer, which is the second package layer 72, is provided above the soft adhesive layer, which is the first package layer 71, and has higher hardness and better airtightness, which can improve the airtightness of the entire LED device, and the phenomenon of cracking due to high radiation and high heat emission caused by the LED chip 20 does not occur. In addition, the specific hardness values ​​of the first package layer 71 and the second package layer 72 can be flexibly set according to need, and the hardness standard to be referred to includes, but is not limited to, Shore A or Shore D. Taking the hardness standard Shore D as an example, in one example, the hardness Shore D of the first package layer 71 may be set to ≦62, and is not limited to values ​​such as 60, 50, or 40, and the hardness of the second package layer 72 is higher than that of the first package layer. In another example, the hardness Shore D of the second package layer 72 may be set to >50, and is not limited to 60, 75, or 90, and the hardness of the first package layer 71 is lower than that of the second package layer 72. In addition, the second package layer 72 may contain quantum dots and / or phosphors, and in this case, the light source generated by the LED chip 20 can excite and mix the quantum dots to form a wide color gamut white light, and the second package layer 72 may not contain quantum dots and / or phosphors.

[0056] In this embodiment, the quantum dot film assembly 10 shown in the embodiment 1 can be further provided on the open end of the LED holder 30 of the above embodiment, thereby obtaining an LED device with a corresponding target color. In this embodiment, the number of LED chips 20 in a single LED device can be flexibly selected, including but not limited to one, two or more. In addition, the LED chip 20 includes but is not limited to a blue light LED chip. After the LED chip 20 is fixed to the base 3, the entire LED chip 20 can be located below the step surface 301. That is, the step surface 301 can be located above each LED chip 20.

[0057] Example 3 In this embodiment, another LED holder used by an LED device will be described. The LED holder according to this embodiment has the advantage of being excellent in both airtightness and reliability. As shown in Fig. 27 and Fig. 28, the LED holder 30 according to this embodiment includes at least a base, a metal baffle 34 provided on the base, an insulating part 60, and an insulating holder 31.

[0058] The base includes a first frame 32 and a second frame 33, the first frame 32 and the second frame 33 being separated by a separation groove, a metal baffle 34, the first frame 32 and the second frame 33 all having bottom and top surfaces opposite to each other, the bottom surface of the metal baffle 34 contacting the top surfaces of the first frame 32 and the second frame 33, a first package groove 351 penetrating the top and bottom surfaces of the metal baffle 34 being provided in the metal baffle 34, the first package groove 351 being connected to the separation groove and may be for providing a first package layer.

[0059] The insulating part 60 is filled in the separation groove between the first frame 32 and the second frame 33, and the insulating holder 31 covers the outer wall of the metal baffle 34 and forms a second package groove 352 together with at least a part of the top surface of the metal baffle 34. The second package groove 351 may be for providing a second package layer, and at least a part of the top surface of the metal baffle 34 is a step surface 301 between the first package groove 351 and the second package groove 352. By providing the step surface 301 in the package groove of the LED holder, the bonding strength between the second package layer and the LED holder can be improved, and the path for external water vapor and the like to enter along the groove wall of the package groove can be extended, thereby comprehensively improving the airtightness of the obtained LED device.

[0060] The second package layer in this embodiment may use the quantum dot film assembly 10 shown in the above-mentioned embodiment 1, but is not limited thereto. In this case, the quantum dot film assembly 10 may be provided on the step surface, and the entire assembly may be located in the package groove. The second package layer may use various conventional quantum dot films or adhesive layers for packaging, such as a transparent adhesive layer, a fluorescent adhesive layer, etc. In other words, the second package layer in this embodiment may use the quantum dot film assembly 10 in the above-mentioned embodiment 1, or may not use the quantum dot film assembly 10 in the above-mentioned embodiment 1.

[0061] In the prior art, when manufacturing an LED holder, a plastic holder is usually used as an insulating holder, and when the plastic holder is manufactured on a base by injection molding, the plastic material is likely to overflow into the area of ​​the first frame 32 and the second frame 33 where the LED chip is provided, affecting the connection between the LED chip and the LED holder. In contrast, this embodiment provides a different LED holder, and as shown in FIG. 29, a fifth groove 302 is provided on the top surface (i.e., the step surface 301) of the metal baffle 34, and the fifth groove 302 is connected to the second package groove 352.

[0062] It can be understood that in some application scenarios, after the base and metal baffle 34 are manufactured by pressing or etching process, when the insulating holder 31 is manufactured by injection molding process, the injection molding material will not overflow into the base and metal baffle 34 and flow into the area of ​​the first frame 32 and the second frame 33 where the LED chip is provided, because the mold extends into the fifth groove 302 of the metal baffle 34 and forms a barrier, so that the reliability of the bonding between the LED chip and the LED holder can be ensured. In addition, the provision of the fifth groove 302 can improve the bonding strength between the second package layer and the LED holder, and can extend the path for external water vapor and the like to enter along the groove wall of the package groove, so as to comprehensively improve the airtightness of the obtained LED device.

[0063] In this embodiment, the material and structure of the first frame 32 and the second frame 33 may be the same as those in the second embodiment, but are not limited thereto. The metal baffle 34, the first frame 32, and the second frame 33 may be made of the same material, or may be integrally molded from the same material. After the LED device is formed, the heat generated when the LED chip emits light can be transferred downward through the base, and can also be transferred to the four sides through the metal baffle 34, improving the transfer effect of the heat generated when the LED device is operated. Optionally, the height of the metal baffle 34 can be made higher than the height of the LED chip, which is favorable for transferring more heat through the metal baffle 34, and further improving the transfer effect of the heat generated when the LED device is operated.

[0064] 29, a first connection region 323, a first extension region 324, and a first functional region 322 are provided on the top surface of the first frame 32, and a second connection region 333, a second extension region 334, and a second functional region 332 are provided on the top surface of the second frame 33, and the first functional region 322 and the second functional region 332 are all exposed to a first package groove 351, and the first connection region 323 may be connected to the first extension region 324, and the second connection region 333 may be connected to the second extension region 334. Optionally, the first frame 32 and the second frame 33 may further be provided with a communication hole so that the insulating holder 31 can extend from the connection region between the top surface of the first frame 32 and the top surface of the second frame 33 to the bottom surfaces of the first frame 32 and the second frame 33. For example, as shown in Fig. 30, the first frame 32 is provided with a first communication hole penetrating the top and bottom surfaces of the first frame 32, the second frame 33 is provided with a second communication hole penetrating the top and bottom surfaces of the second frame 33, and the insulating holder 31 has an extension portion 310 extending into the first communication hole and the second communication hole. Alternatively, as shown in Fig. 31, the side walls of the first communication hole and / or the second communication hole have a step. By providing the first communication hole and the second communication hole and providing a step surface in the first communication hole or the second communication hole, the contact area between the insulating holder 31 and the first frame 32 and the second frame 33 is increased, thereby improving the binding force and the airtightness between them.

[0065] In this embodiment, in order to improve the light output efficiency, the inner wall of the metal baffle 34 exposed to the first package groove may be provided as a reflective surface, and / or the surfaces of the first frame 32 and the second frame 33 exposed to the first package groove may be provided as a reflective surface, that is, the groove wall and / or the groove bottom of the first package groove 351 may be provided as a reflective surface. For example, the inner wall of the metal baffle 34 and / or the top surface of the first frame 32 and the second frame 33 may be electroplated with a thin highly reflective metal layer to form a reflective surface, and the material of the highly reflective metal layer may include, but is not limited to, any one or more of silver, nickel, and gold. In addition, the inner wall of the metal baffle 34 and the top surfaces of the first frame 32 and the second frame 33 may be polished to form a reflective surface, which is also advantageous for reflecting more light to the LED holder.

[0066] In this embodiment, the insulating component 60 and the insulating holder 31 may be made of the same material, for example, thermoplastic resin, and may be integrally molded. The insulating holder 31 provided on the first frame 32 and the second frame 33 further covers the outer wall of the metal baffle 34, and the top surface of the insulating holder 31 is higher than the top surface of the metal baffle 34. The insulating holder 31 further forms a second package groove 352 together with at least a part of the top surface of the metal baffle 34, and the second package groove 352 communicates with the first package groove 351 in the metal baffle 34 and also communicates with the fifth recessed groove 302 in the top surface of the metal baffle 34. The size of the opening of the second package groove 352 is larger than the size of the opening of the first package groove 351, and the shape of the opening of the second package groove 352 may be the same as the shape of the opening of the first package groove 351, including but not limited to a circular or rectangular shape. 31 , the insulating holder 31 can cover a part of the top surface of the metal baffle 34, and the inner wall of the insulating holder 31 exposed to the second package groove 352 is close to the outer side of the fifth groove 302, and the outer side of the fifth groove 302 is away from the first package groove 351. In this case, the fifth groove 302 of the metal baffle 34 can function as a separation groove, and when the insulating holder 31 is manufactured, a separation barrier is formed in the fifth groove 302 of the metal baffle 34, which can effectively prevent the plastic material from overflowing into the functional area or the inner wall of the metal baffle 34, and thereby ensure that the LED chip can be more firmly fixed to the LED holder in the subsequent process.

[0067] 31, in order to increase the light-emitting angle, the inner wall exposed to the second package groove 352 of the insulating holder 31 may be inclined toward the outside of the insulating holder 31, and / or the inner wall exposed to the first package groove 351 of the metal baffle 34 may be inclined toward the outside of the metal baffle 34, i.e., the groove walls of the first package groove 351 and / or the second package groove 352 may be inclined toward the outside of the first package groove 351 and / or the second package groove 352, which is advantageous for forming an LED device with a larger light-emitting angle. The specific inclination angle may be flexibly set according to actual needs and is not limited herein.

[0068] This embodiment further provides an LED device, and as shown in Figures 32 and 33, this LED device 100 includes the LED holder shown in each of the above examples, an LED chip 20 provided in the LED holder, and a package layer 7, where the LED chip 20 is provided in the first package groove and electrically connected to the first frame 32 and the second frame 33, and the package layer 7 is provided in the first package groove and the second package groove to encapsulate the LED chip 20.

[0069] In this embodiment, the LED device may be provided with one or at least two LED chips 20, including but not limited to blue light LED chips, and the height of the metal baffle 34 may be greater than the height of the LED chip 20, i.e., the depth of the first package groove may be greater than the height of the LED chip 20.

[0070] In this embodiment, in order to meet different application needs, the specific type of the package layer can be selected as necessary, and the specific types include, but are not limited to, a low refractive index transparent adhesive layer, a high refractive index transparent adhesive layer, a fluorescent adhesive layer containing quantum dots, a high hardness transparent adhesive layer, or a low hardness transparent adhesive layer. In addition, two or more package layers may be further provided in the LED holder. For example, as shown in FIG. 34, a first package layer 71 is filled in the first package groove of the LED holder, and a second package layer 72 is filled in the second package groove of the LED holder. In this case, at least a part of the top surface 301 of the metal baffle 34 may be flush or approximately flush with the interface between the first package layer 71 and the second package layer 72. The top surface of the metal baffle 34 is further provided with a fifth groove 302, which provides a filling position for the adhesive for fixing the second package layer 72, or provides a locking position for the second package layer 72, thereby indirectly improving the package coupling ability and airtight performance. In particular, when the LED chip is a UV chip and the second package layer 72 is adhesively fixed via the adhesive filled in the fifth groove 302, the adhesive filled in the fifth groove 302 can be prevented from being deactivated by UV exposure, thereby ensuring stable fixation of the adhesive layer for the second package and improving reliability.

[0071] Alternatively, the first package layer 71 and the second package layer 72 in this embodiment may use the first package layer 71 and the second package layer 72 shown in the above embodiment 2, but are not limited thereto. The LED chip in this embodiment may use a high power LED chip as necessary.

[0072] The packaging layer in this embodiment may further use a two- or more-stage packaging form, and by using the multi-stage packaging method, the direct contact between the later-formed packaging layer and the heat source can be effectively avoided, and the safety performance can be improved. It also meets the dual demands of high crack resistance and high airtightness protection of the light-emitting device, and can be used to separate the packaging of non-heat-resistant materials. For example, based on the above-mentioned first packaging layer 71 and second packaging layer 72, the quantum dot film assembly 10 shown in the above-mentioned embodiment 1 may be added to the dam opening end of the LED holder.

[0073] In the LED device of this embodiment, the metal baffle and the fifth groove on the top surface of the metal baffle can effectively prevent the plastic material from overflowing into the functional area of ​​the base, and ensure the reliability of the LED chip and the LED holder when they are bonded together. Furthermore, the LED holder has a first package groove and a second package groove, and at least a part of the top surface of the metal baffle is a step surface between the first package groove and the second package groove, which is advantageous to use a multi-stage package mode and meets the needs of different applications. The fifth groove can further increase the contact area between the package adhesive and the LED holder, making the connection between the two stronger; and when a multi-stage package mode is adopted, it can provide a filling position for the adhesive that fixes the package adhesive of this layer, or provide a locking position for the package adhesive of this layer, thereby indirectly improving the package bonding ability and airtight performance, and can also extend the extension path for the external water vapor to enter the inside of the LED device, thereby further improving the reliability of the LED device.

[0074] For ease of understanding, this embodiment further provides a manufacturing method for the LED holder, which includes but is not limited to the following steps.

[0075] S301: Provide a base, The base includes a first frame and a second frame, and the first frame and the second frame are separated by a separation groove.

[0076] In this embodiment, the first frame and the second frame may be manufactured by pressing or etching, and the material and structure thereof may refer to the structure of the first frame and the second frame in each of the above examples, but are not limited thereto.

[0077] S302: Form a metal baffle on the base, the metal baffle having a first package groove penetrating a top surface and a bottom surface of the metal baffle, the first package groove communicating with the separation groove, and a fifth groove on the top surface of the metal baffle.

[0078] The material and structure of the metal baffle and the method of connecting it to the first frame and the second frame may refer to the above examples, but are not limited thereto and will not be described in detail here.

[0079] S303: Form an insulating part and an insulating holder on a base.

[0080] In this embodiment, the insulating part and the insulating holder may be made of the same material, such as thermoplastic resin, and may be integrally molded. The insulating holder injection molded on the base further covers the outer wall of the metal baffle, and the top surface of the insulating holder is higher than the top surface of the metal baffle. The fifth groove of the metal baffle prevents the plastic material from overflowing onto the functional areas of the first and second frames or the reflective surface of the metal baffle, thereby ensuring that the LED chip is more firmly connected to the LED holder in the subsequent process.

[0081] As can be seen from the above, the manufacturing method of the LED holder according to this embodiment has the advantages of using simple processes, the manufacturing process is simple, the efficiency is high, the cost is low, and the manufactured LED has high airtightness and reliability.

[0082] Example 4 This embodiment further provides a light emitting device including the LED device according to any one of the above embodiments. The light emitting device includes, but is not limited to, a lighting device, a light signal indicator device, or a backlight device. Specifically, the LED device according to the above embodiment can be used in various light emitting fields, for example, manufactured into a backlight module and used in a display backlight field (which may be a backlight module of a terminal such as a television, a display, or a mobile phone). In this case, it can be used in a backlight module. In addition to being used in the display backlight field, it can also be used in the key backlight field, the photography field, the home lighting field, the medical lighting field, the decoration field, the automobile field, the transportation field, and the like. When used in the field of key backlighting, it can function as a key backlight light source with key devices such as mobile phones, calculators, keyboards, etc. When used in the field of photography, it can be manufactured into a camera flash, when used in the field of home lighting, it can be manufactured into a floor lamp, desk lamp, lighting lamp, ceiling lamp, bobbin lamp, projection lamp, etc. When used in the field of medical lighting, it can be manufactured into a surgical lamp, low electromagnetic lighting lamp, etc. When used in the field of decoration, it can be manufactured into various decorative lamps, such as various illuminations, landscape lighting lamps, and advertising lamps, when used in the field of automobiles, it can be manufactured into automobile lamps, automobile indicator lamps, etc. When used in the field of traffic, it can be manufactured into various traffic lamps and various street lamps. The above applications are merely some of the applications exemplified in this embodiment, and it should be understood that the application of the LED device in this embodiment is not limited to the several fields of the above examples.

[0083] It should be understood that the application of the present application is not limited to the above examples, and those skilled in the art may make improvements or modifications according to the above description, and all of these improvements and modifications should fall within the scope of protection of the utility model claims attached to this application.

Claims

1. 1. An LED device comprising: Including an LED holder, an LED chip, and a packaging layer; the LED device, characterized in that the LED holder includes a base and an insulating holder, at least a portion of the insulating holder is provided on the base as a dam and forms a package groove together with the base, the LED chip is provided at a bottom of the package groove, and the package layer includes a quantum dot film assembly, the quantum dot film assembly is provided above the LED chip and is spaced apart from the LED chip.

2. The quantum dot film assembly includes: a protective frame having a hollow intermediate region; a quantum dot film provided in the hollow region; 2. The LED device according to claim 1, further comprising: a light-transmitting adhesive layer, at least a portion of which is filled in the hollow region to fix the quantum dot film and the protective frame.

3. the quantum dot film assembly is disposed at an open end of the dam; 3. The LED device of claim 2, wherein the shape and size of the quantum dot film are adapted to the shape and size of the opening of the opening end, the protective frame and the quantum dot film both have opposing top and bottom surfaces, and the bottom surfaces of the protective frame and the quantum dot film both face toward the opening end.

4. The light-transmitting adhesive layer is a light-transmitting adhesive layer, The bottom surface of the transparent adhesive layer is flush with the bottom surface of the protective frame or extends onto the protective frame and covers the bottom surfaces of the protective frame and the quantum dot film; 4. The LED device according to claim 3, wherein a top surface of the transparent adhesive layer is flush with a top surface of the protective frame or extends onto the protective frame and covers the top surfaces of the protective frame and the quantum dot film.

5. The top surface of the transparent adhesive layer extends onto the protective frame and covers the top surfaces of the protective frame and the quantum dot film, and a first groove communicating with the top surface of the protective frame is provided in the region of the transparent adhesive layer covering the top surface of the protective frame, and the quantum dot film assembly further includes a first reflective layer provided in the first groove; And / or, the bottom surface of the translucent adhesive layer extends onto the protective frame and covers the bottom surfaces of the protective frame and the quantum dot film, and a second groove communicating with the bottom surface of the protective frame is provided in the area of ​​the translucent adhesive layer covering the bottom surface of the protective frame, and the quantum dot film assembly further includes a second reflective layer provided in the second groove. The LED device of claim 4.

6. The bottom surface of the transparent adhesive layer is flush with the bottom surface of the protective frame, and the quantum dot film assembly further includes a first fixing post configured to be fixed to a first fixing hole at the opening end provided on the bottom surface of the protective frame; Alternatively, the quantum dot film assembly further includes a second fixing post configured to be fixed to a second fixing hole at the opening end provided on the bottom surface of the transparent adhesive layer. The LED device according to claim 4 .

7. 3. The LED device according to claim 2, wherein an inner surface of the protective frame is a light reflecting surface.

8. 3. The LED device of claim 2, wherein the quantum dot film includes two transparent protective films and a quantum dot layer located between the two transparent protective films.

9. 2. The LED device according to claim 1, wherein a groove wall of the package groove is provided with a step surface, the package layer includes a first package layer and a second package layer, the second package layer is fixed on the step surface, the first package layer is located below the second package layer, and the second package layer is the quantum dot film assembly or an adhesive layer.

10. 10. The LED device of claim 9, wherein the base includes a first frame, a second frame, and an insulating component, the first frame and the second frame have a separation groove between them in which the insulating component is filled to insulate them from each other, the insulating holder, the first frame, and the second frame form the package groove, an inner wall of the insulating holder forms a groove wall of the package groove, and the inner wall of the insulating holder is provided with the step surface.

11. the first frame includes a first functional area for electrically connecting to the LED chip, and the first frame includes a second functional area for electrically connecting to the LED chip; a third groove is provided on an outer periphery of the first functional area of ​​the first frame, and a fourth groove is provided on an outer periphery of the second functional area of ​​the second frame; 11. The LED device as claimed in claim 10, wherein the first functional area, the third groove, the second functional area and the fourth groove are all exposed to the package groove.

12. the base includes a first frame, a second frame, a metal baffle, and an insulating component; a separation groove is provided between the first frame and the second frame, the separation groove being filled with the insulating component and insulating and isolating the first frame and the second frame; the metal baffle has a first package groove provided on the first frame and the second frame and penetrating its own top surface and bottom surface, the first package groove communicates with the separation groove, a groove wall of the first package groove is an inner wall of the metal baffle, and a groove bottom is the top surface of the first frame and the second frame; the insulating component is filled in the separation groove; the insulating holder covers an outer wall of the metal baffle and, together with at least a portion of a top surface of the metal baffle, forms a second package groove communicating with the first package groove, and at least a portion of the top surface of the metal baffle is formed as the step surface; 10. The LED device of claim 9, wherein the package groove comprises the first package groove configured to receive the first package layer and the second package groove configured to receive the second package layer.

13. 10. The LED device as claimed in claim 9, wherein the step surface is provided with a fifth groove, which provides a filling or locking position for a second package layer.

14. 10. The LED device of claim 9, wherein the hardness of the first package layer is less than the hardness of the second package layer.

15. 13. The LED device of claim 12, wherein a groove wall and / or a groove bottom of the first package groove are reflective surfaces.

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