Integrated Circuit Device Packaging Equipment

Abstract

To provide an integrated circuit device packaging apparatus in which the operation of placing a thermal interface material on an integrated circuit device and the operation of applying an adhesive to the integrated circuit device are not performed in the same work station. [Solution] An integrated circuit device packaging apparatus is provided with a number of work stations, including a material supply station B arranged along a transport path A and providing a holding tray on which an integrated circuit device is placed, a thermal interface material processing station C which applies a thermal interface material to the integrated circuit device, an adhesive application station E which applies adhesive to the integrated circuit device, a lid attachment station G which attaches a top lid to the integrated circuit device, a lid crimping station I which crimps the top lid to the integrated circuit device, and a material collection station K which collects the holding tray on which the integrated circuit device is placed.

Description

[Technical field]

[0001] The present invention relates to an integrated circuit device packaging apparatus that performs packaging on an IC (integrated circuit) device. [Background technology]

[0002] The conventional technology for packaging integrated circuit components described in Patent Document 1 uses a series of production lines formed by packaging equipment consisting of a coating device, an embedding device, and a pressing device to perform a coating step, an embedding step, and a pressure curing step. Before placing a heat sink (generally called a cover) on an assembly in which a wafer is mounted on a substrate, a coating step is performed using a coating device having a glue valve and a glue needle. First, a first adhesive is applied in a frame shape toward the center to the four corners of the substrate around the wafer, in order to adhere to the lower edge of the outer periphery of the heat sink. Next, a cross-shaped second adhesive is applied to the upper surface of the chip to adhere the inside of the central protrusion of the heat sink. Next, a pressure curing step is actually performed in which the heat sink is pressed, heated, and cooled by a pressing device to laminate the heat sink on the substrate and wafer to which the adhesive has been applied, thereby completing the package.

[0003] In such a conventional technology, the liquid adhesive used in the packaging process has the roles of (1) bonding the periphery of the heat sink to the substrate and (2) conducting heat between the chip and the heat sink. With the advancement of technology, in IC components in 2.5D IC and 3D IC packaging technology, the chip is no longer directly bonded to the substrate, but has progressed to a chip stack structure called, for example, CoW (Chip on Wafer) via a lead carrier (redistribution layer (RDL Interposer)), and the number of chips packaged on the substrate increases. This causes a problem that sufficient heat dissipation effect cannot be obtained by simply placing an adhesive and a heat sink on the chip at the end of the multiple chips constituting the stack structure. In addition, in the conventional technology, when the coating step is performed using a coating device, in addition to coating the first adhesive on the substrate around the wafer with a glue valve and needle, it is necessary to coat the second adhesive on the top surface of the wafer, which takes a long time when coating is performed in the same processing station, and the valve and needle of the coating device can only coat the adhesive with a liquid material, and cannot be applied to coat the adhesive of a non-liquid material between the wafer and the heat sink. This shows that there is still room for improvement in the prior art. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Taiwan Patent No. I568324 Specification Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide an integrated circuit device packaging apparatus which can improve upon the prior art. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention provides a conveying path having a plurality of rails along which a tray carrying an integrated circuit device can be conveyed; The present invention provides an integrated circuit device packaging apparatus having a plurality of work stations arranged along the transport path, the work stations including a material supply station for providing the holding tray on which the integrated circuit device is placed, a thermal interface material processing station for applying a thermal interface material to the integrated circuit device, an adhesive application station for applying adhesive to the integrated circuit device, a lid attachment station for attaching a top lid to the integrated circuit device, a lid crimping station for crimping the top lid to the integrated circuit device, and a material collection station for collecting the holding tray on which the integrated circuit device is placed.

[0007] The present invention also provides a conveying path having a plurality of rails along which a tray carrying an integrated circuit device can be conveyed; The present invention also provides an integrated circuit device packaging apparatus having a plurality of work stations arranged along the transport path, the work stations including a thermal interface material processing station for applying a thermal interface material to the integrated circuit device, and a thermal interface material inspection station for performing a visual inspection of the thermal interface material applied to the integrated circuit device.

[0008] The present invention further provides a conveying path having a plurality of rails along which a tray carrying an integrated circuit device can be conveyed; The present invention also provides an integrated circuit device packaging apparatus having a plurality of work stations arranged along the transport path, including a lid attachment station for attaching a top lid to the integrated circuit device, and a lid inspection station for performing visual inspection on the top lid attached to the integrated circuit device. Effect of the Invention

[0009] In the integrated circuit device packaging apparatus according to the embodiment of the present invention, the operation of placing a thermal interface material on an integrated circuit device and the operation of applying adhesive to the integrated circuit device using, for example, a glue valve and a glue needle are not performed in the same work station. Furthermore, the operation of placing a thermal interface material on an integrated circuit device is performed independently in a work station preceding the work station of applying adhesive, so that different thermal interface materials, such as a thermal interface film (Film Tim), a metal thermal interface material (Metal Tim), or a liquid metal thermal interface material (Liquid Metal Tim), can be independently placed, and different equipment can be used according to different thermal interface materials. For example, the placement of the thermal interface film is performed by lamination, so that the work station for applying adhesive can be performed without being restricted by a glue valve and a glue needle as in the prior art, thereby improving the packaging efficiency and the compatibility of the placement of the thermal interface material. [Brief description of the drawings]

[0010] [Figure 1] 1 is a perspective view showing an integrated circuit device according to an embodiment of the present invention having a chip and a substrate; [Diagram 2] 2 is an exploded perspective view showing a top cover being attached to an integrated circuit device in packaging the integrated circuit device according to an embodiment of the present invention; FIG. [Diagram 3] 1 is an exploded perspective view showing a plurality of integrated circuit devices arranged in a matrix on a carrier plate according to an embodiment of the present invention; FIG. [Figure 4] FIG. 2 is an exploded perspective view showing a plurality of top covers arranged in a matrix on a holding tray in an embodiment of the present invention; [Diagram 5] 1 is a schematic diagram showing an integrated circuit device packaging apparatus and each work station according to an embodiment of the present invention; [Figure 6] 2 is a schematic diagram showing a transport path of the integrated circuit device packaging apparatus according to an embodiment of the present invention; [Figure 7]2 is an explanatory diagram showing the working heads and driving mechanisms of each working station according to the embodiment of the present invention; FIG. [Figure 8] 3 is an explanatory diagram showing the conveying path, the working head, and the driving mechanism in each working station according to the embodiment of the present invention; FIG. [Figure 9] 2 is an explanatory diagram showing predetermined operations performed on an integrated circuit device by each work station in an embodiment of the present invention; FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] As shown in Fig. 1, an integrated circuit device packaging apparatus according to an embodiment of the present invention is suitable for carrying out a packaging process on an illustrated integrated circuit device 1. The integrated circuit device 1 includes a chip 11 on a substrate 12. The integrated circuit device 1 includes a first surface 111 on a side of the chip 11 opposite to the substrate 12, and a second surface 121 on a side of the substrate 12 facing the chip 11. The definition of the chip 11 in this embodiment of the present invention includes a wide range of configurations, such as one or more dies, or a chip stack structure (e.g., CoW, Chip on Wafer) composed of one or more chips and a redistribution layer (RDL Interposer), and the substrate 12 includes, for example, a printed circuit board (PCB Substrate).

[0012] As shown in FIG. 1 and FIG. 2, in the process of packaging the integrated circuit device 1, a top cover 2 (lid, heat sink, or heat slug) is attached to the integrated circuit device 1. Before attaching the top cover 2 to the integrated circuit device 1, a thermal interface material 3 is placed on the first surface 111 of the integrated circuit device 1. The thermal interface material 3 can be, for example, a thermal interface film (Film Tim), a metal thermal interface material (Metal Tim), or a liquid metal thermal interface material (Liquid Metal Tim), and is specifically made of materials such as indium, graphite, silicon, gold, silver, copper, tin, and lead, and is used for thermal conduction between the chip 11 and the top cover 2. An adhesive 4, such as a thermal curing adhesive, is applied to the periphery of the second surface 121 of the integrated circuit device 1 for bonding between the substrate 12 and the top cover 2. The embodiment of the present invention can also be applied to a packaging process for aligning a silicon photonics optical communication device in the top cover 2.

[0013] 3 and 4, a plurality of integrated circuit devices 1 can be placed on a boat S1, the boat S1 having a rectangular outer shape, and the integrated circuit devices 1 are arranged in a matrix on the boat S1. A plurality of top covers 2 can be placed on a material tray S2, the material tray S2 having a rectangular outer shape, and the top covers 2 are arranged in a matrix on the material tray S2.

[0014] An integrated circuit device packaging apparatus according to an embodiment of the present invention is shown in Figures 4, 5 and 6. The integrated circuit device packaging apparatus is provided with a transport path A and a number of work stations.

[0015] The transport path A is provided with a plurality of rails A1, and the holding tray S1 on which the integrated circuit device 1 is placed can be transported along the transport path A (rails A1).

[0016] The multiple work stations are arranged in sequence along the transport path A, including a supply station B that supplies a holding tray S1 on which an integrated circuit device 1 is placed, a thermal interface material processing station C that places multiple thermal interface materials 3 on each integrated circuit device 1, a thermal interface material inspection station D that can perform visual inspection of the thermal interface materials 3 placed on the integrated circuit device 1, an adhesive application station E that applies adhesive 4 to the integrated circuit device 1, an adhesive inspection station F that can perform visual inspection of the adhesive 4 applied to the integrated circuit device 1, a lid attachment station G that attaches multiple top lids 2 to each integrated circuit device 1, a lid inspection station H that can perform visual inspection of the top lids 2 attached to the integrated circuit device 1, a lid crimping station I that crimps the top lids 2 to each integrated circuit device 1, a crimping inspection station J that can perform visual inspection of the crimped top lids 2, and a material collection station K that collects the holding tray S1 on which the integrated circuit device 1 is placed.

[0017] A thermal interface material inspection station D is provided between the thermal interface material processing station C and the adhesive application station E, an adhesive inspection station F is provided between the adhesive application station E and the lid mounting station G, a lid inspection station H is provided between the lid mounting station G and the lid crimping station I, and a crimping inspection station J is provided between the lid crimping station I and the material collecting station K. Each work station is a machine with its own configuration, and is adjacent to each other along the conveying path A. Each work station has a control unit B1, C1, D1, E1, F1, G1, H1, I1, J1, K1 with a display and an operation interface, and the control units of two adjacent work stations are signal-connected via a signal line.

[0018] The rails A1 are distributed among the work stations and can be connected in series or parallel to each other as required. Some of the rails A1 are arranged on corresponding rail bases A2 as required, so that the rails A1 arranged on the rail bases A2 can be selectively connected to other rails A1 by horizontally moving or rotating with respect to the rail bases A2. The rails A1 can be configured, for example, by a combination of a rail, a tape, and a connecting means. The method of connecting the rails A1 in series or parallel and horizontally moving or rotating them described here is not the focus of the present invention, so unnecessary explanations will be omitted here.

[0019] It should be noted that although eight integrated circuit devices 1 are placed on the holding tray S1 shown in FIG. 6, the number of integrated circuit devices 1 placed on the holding tray S1 in practice is not limited to this, and it may be, for example, one, two, three or more than three. For ease of understanding, the following description will be given using as an example a holding tray S1 with only one integrated circuit device 1 placed thereon.

[0020] 3, 4, 5, and 6, the integrated circuit packaging machine can be used in correspondence with an overhead transfer system (e.g., overhead hoist transfer) L, which straddles above the integrated circuit packaging machine and is vertically parallel to the transport path A. The overhead transfer system L is used to vertically move a supply case W1 up and down to vertically load or unload the supply case W1 into or out of a supply station B, or to vertically move a collection case W2 into or out of a material collection station K, or to vertically move a top cover case W3 into or out of a top cover attachment station G.

[0021] A supply case W1 corresponding to supply station B contains a holding tray S1 on which an integrated circuit device 1 is placed, and is transported to supply station B by an overhead transport system L. After the holding tray S1 on which the integrated circuit device 1 is placed is removed from supply case W1 and supplied to transport path A, the emptied supply case W1 is transported out of supply station B by the overhead transport system L.

[0022] The overhead transport system L transports the emptied collection case W2 corresponding to the material collection station K to the material collection station K, and after the holding tray S1 carrying the integrated circuit device 1 is carried into the collection case W2 from the transport path A and collected, the overhead transport system L transports the collection case W2 carrying the holding tray S1 out of the material collection station K.

[0023] The top cover case W3 corresponding to the lid mounting station G contains a top cover tray S2 on which a top cover 2 is placed, and after the top cover case W3 is transported into the lid mounting station G by the overhead transfer system L, the empty top cover case W3 is transported out of the lid mounting station G by the overhead transfer system L.

[0024] The use of the overhead transport system L facilitates the transportation of the supply case W1, the collection case W2, and the top cover case W3, but the present invention is not limited to this. For example, the integrated circuit device packaging machine can also transport the supply case W1, the collection case W2, and the top cover case W3 using a carrier equipped with a robot arm or by hand.

[0025] The manner in which the holding tray S1 is transported out of the supply case W1 at the material supply station B, the manner in which the holding tray S1 is transported into the collection case W2 at the material collection station K, and the manner in which the top cover tray S2 is transported out of the top cover case W3 at the lid attachment station G are not the focus of this invention, so unnecessary explanations will not be given here.

[0026] As shown in Figures 5, 7, 8 and 9, each work station is provided with a work head that performs a predetermined operation on the integrated circuit device 1 placed on the holding tray S1.

[0027] The material supply station B is provided with a material supply work head B3 which is driven by a drive mechanism B2 to move above the transport path A. The material supply work head B3 can photograph the integrated circuit devices 1 placed on the holding tray S1, and the control unit B1 can calculate the number of integrated circuit devices 1 placed on the holding tray S1. The drive mechanism B2 can be, for example, a single-axis or multi-axis gantry slide. The material supply work head B3 can be, for example, a charge-coupled device (CCD) camera.

[0028] The thermal interface material processing station C is provided with two sets of working heads C3, which are respectively driven by two driving mechanisms C2 to move above the transport path A. Each working head C3 can place the thermal interface material 3 on the first surface 111 (i.e., the chip 11 shown in FIG. 1) of the integrated circuit device 1. In the embodiment of the present invention, a thermal interface film is shown as an example of the thermal interface material 3. Each working head C3 is provided with a tape supply wheel C31, a tape return wheel C32, and an abutment member C33 provided between the tape supply wheel C31 and the tape return wheel C32. The thermal interface material 3 is bonded to the release tape T, and the release tape T to which the thermal interface material 3 is bonded is conveyed from the tape supply wheel C31 and wound around the abutment member C33 before being taken up by the tape return wheel C32. The thermal interface material 3 is provided on the opposite side of the release tape T to the abutting member C33, and when the release tape T on which the thermal interface material 3 is provided is wound around the abutting member C33, the abutting member C33 can attach the thermal interface material 3 to the first surface 111 of the integrated circuit device 1. Each driving mechanism C2 can be, for example, a single-axis or multi-axis gantry slide.

[0029] The thermal interface material inspection station D is provided with a thermal interface material inspection head D3 which is driven by a driving mechanism D2 to move above the transport path A. The thermal interface material inspection head D3 can perform visual inspection on the thermal interface material 3 placed on the chip 11. The driving mechanism D2 can be, for example, a single-axis or multi-axis gantry slide. The thermal interface material inspection head D3 can be a CCD camera, and the visual inspection items can include whether the thermal interface material 3 is placed at the correct position, whether there are any defects in the appearance of the thermal interface material 3, etc.

[0030] The adhesive application station E is provided with two sets of application heads E3, which are driven by two driving mechanisms E2 to move above the transport path A. Each application head E3 can apply adhesive 4 to the periphery of the second surface 121 of the integrated circuit device 1 (i.e., the substrate 12 shown in FIG. 1). Each driving mechanism E2 can be, for example, a single-axis or multi-axis gantry slide. Each application head E3 can be, for example, a screw-type glue valve, a piezoelectric glue valve, or an air-driven glue valve.

[0031] The adhesive inspection station F is provided with an adhesive inspection head F3 that is driven by a drive mechanism F2 to move above the transport path A. The adhesive inspection head F3 can perform a visual inspection of the adhesive 4 applied to the substrate 12. An example of the drive mechanism F2 is a single-axis or multi-axis gantry slide. The adhesive inspection head F3 can be a CCD camera, and items of the visual inspection include whether the application position of the adhesive 4 is accurate, whether there are any defects in the appearance of the adhesive 4, etc.

[0032] The lid mounting station G is provided with two sets of mounting heads G3, which are driven by two driving mechanisms G2 to move above the transport path A. Each mounting head G3 picks up a top lid 2 and mounts the top lid 2 on the second surface 121 of the integrated circuit device 1 (i.e., the substrate 12 shown in FIG. 1), thereby shielding the chip 11 with the top lid 2. Each driving mechanism G2 may be, for example, a single-axis or multi-axis gantry slide. Each mounting head G3 may be, for example, a negative pressure suction cup.

[0033] The lid inspection station H is provided with a lid inspection head H3 which is driven by a drive mechanism H2 to move above the transport path A. The lid inspection head H3 can perform a visual inspection of the top lid 2 attached to the substrate 12. An example of the drive mechanism H2 is a single-axis or multi-axis gantry slide. The lid inspection head H3 may be a CCD camera, and items of the visual inspection may include whether the attachment position of the top lid 2 is accurate, whether there are any defects in the appearance of the top lid 2, etc.

[0034] The lid crimping station I is provided with a total of four crimping mechanisms I2, two of which are provided on each side of the transport path A, and two sets of moving mechanisms I3. Each crimping mechanism I2 is provided with a lower die jig I21 and an upper die jig I22 that can move up and down relative to the lower die jig I21. Each moving mechanism I3 can transport the holding tray S1 between the transport path A and two crimping mechanisms I2 located on both sides of the transport path A, and more specifically, each moving mechanism I3 can pick up the holding tray S1 from the transport path A and transport it to one of the corresponding two crimping mechanisms I2 to place the holding tray S1 on the lower die jig I21, so that the upper die jig I22 moves downward to apply pressure to the upper lid 2 to crimp the integrated circuit device 1, and at the same time, the integrated circuit device 1 can be heated to solidify the adhesive 4, or the thermal interface material 3 can be melted by heating the upper lid 2.

[0035] The crimping inspection station J is provided with a crimping inspection head J3 that is driven by a drive mechanism J2 to move above the transport path A, and the crimping inspection head J3 can perform a visual inspection of the crimped top cover 2. The drive mechanism J2 can be, for example, a single-axis or multi-axis gantry slide. The crimping inspection head J3 can be a CCD camera, and items of the visual inspection can include whether the top cover 2 is misaligned, whether there are any defects in the appearance of the top cover 2, etc.

[0036] The material collecting station K is provided with a recovery work head K3 which is driven by a drive mechanism K2 to move above the transport path A. The recovery work head K3 can photograph the integrated circuit devices 1 placed on the holding tray S1, and the control unit K1 can calculate the number of integrated circuit devices 1 placed on the holding tray S1. The drive mechanism K2 can be, for example, a single-axis or multi-axis gantry slide. The recovery work head K3 can be, for example, a CCD camera.

[0037] When the embodiment of the present invention is implemented, the tray S1 carrying the integrated circuit devices 1 is stored in a supply case W1, and the supply case W1 is transported to the supply station B by the overhead transport system L, so that the tray S1 carrying the integrated circuit devices 1 can be transported out of the supply case W1 and supplied to the transport path A. Then, the tray S1 carrying the integrated circuit devices 1 passes through the thermal interface material processing station C, the thermal interface material inspection station D, the adhesive application station E, the adhesive inspection station F, the lid mounting station G, the lid inspection station H, the lid crimping station I, and the crimping inspection station J in this order on the transport path A, and finally reaches the material collecting station K. Finally, the tray S1 carrying the integrated circuit devices 1 is collected by the material case W2, and then transported out of the material collecting station K by the overhead transport system L for each material case W2.

[0038] Furthermore, the integrated circuit device packaging apparatus of the present invention sequentially performs the following operations at multiple different work stations on the transport path A for the holding tray S1 on which the integrated circuit device 1 is placed: placing a thermal interface material 3 on the integrated circuit device 1, applying an adhesive 4 to the integrated circuit device 1, attaching a top cover 2 to the integrated circuit device 1, and applying pressure to the top cover 2 to press it against the integrated circuit device 1.

[0039] After placing the thermal interface material 3 on the integrated circuit device 1 and before applying the adhesive 4 to the integrated circuit device 1, a visual inspection of the thermal interface material 3 formed on the chip 11 is performed.

[0040] After the operation of applying the adhesive 4 to the integrated circuit device 1 and before the operation of attaching the top cover 2 to the integrated circuit device 1, an operation of visually inspecting the adhesive 4 applied to the substrate 12 is performed.

[0041] After the operation of attaching the top cover 2 to the integrated circuit device 1 and before the operation of applying pressure to the top cover 2 to pressurize it against the integrated circuit device 1, a visual inspection is performed on the top cover 2 attached to the substrate 12.

[0042] After applying pressure to the top cover 2 to press the integrated circuit device 1 against it, and before the holding tray S1 on which the integrated circuit device 1 is placed is transported to a material collection station K, a visual inspection is performed on the pressed top cover 2.

[0043] The holding tray S1 on which the integrated circuit device 1 is placed has predetermined operations performed in the thermal interface material processing station C, adhesive application station E, lid attachment station G, and lid crimping station I, and then inspection operations are performed in the thermal interface material inspection station D, adhesive inspection station F, lid inspection station H, and crimping inspection station J, respectively.This allows any defects that occur when the integrated circuit device 1 is subjected to predetermined operations in the thermal interface material processing station C, adhesive application station E, lid attachment station G, or lid crimping station I to be detected in real time.

[0044] When a specified operation is performed on the holding tray S1 carrying the integrated circuit device 1, if a fault or defect is found, the work station performing the operation stops and issues a warning message. Therefore, when the holding tray S1 carrying the integrated circuit device 1 is transported out of the supply case W1 of the corresponding supply station B and then transported to the collection case W2 of the corresponding material collection station K for collection, when preparing to transport the holding tray S1 carrying the integrated circuit device 1 from the current work station (e.g., the thermal interface material inspection station D) to the next work station (e.g., the adhesive application station E) to which the integrated circuit device 1 is to be transferred, an electronic signal is transmitted via a signal line connecting the control unit of the current work station (e.g., the control unit D1) and the control unit of the next work station (e.g., the control unit E1) to confirm whether the control unit of the next work station will allow the holding tray S1 carrying the integrated circuit device 1 to be received, thereby preventing a defective integrated circuit device 1 from being transported to the next work station.

[0045] According to the integrated circuit device packaging apparatus of the embodiment of the present invention, the operation of placing the thermal interface material 3 on the integrated circuit device 1 and the operation of applying the adhesive 4 to the integrated circuit device 1 using a glue valve or glue needle can be performed in different work stations. In addition, the operation of placing the thermal interface material 3 on the integrated circuit device 1 is performed independently in the thermal interface material processing station C, which is located before the adhesive application station E where the operation of applying the adhesive 4 is performed, so that different thermal interface materials 3, such as thermal interface film (Film Tim), metal thermal interface material (Metal Tim) or liquid metal thermal interface material (Liquid Metal Tim), can be independently placed, and different equipment can be used according to different thermal interface materials. For example, the placement of the thermal interface film is performed by lamination, so that the work station for applying the adhesive can be performed without being restricted by glue valves and glue needles as in the prior art, and therefore the packaging efficiency and the compatibility of the placement of the thermal interface material 3 can be improved.

[0046] In addition, a thermal interface material inspection station D is provided along the conveying path A after the thermal interface material processing station C, and a lid inspection station H is provided along the conveying path A after the lid mounting station G, so that even if a defect occurs in the integrated circuit device 1 after the thermal interface material 3 is installed at the thermal interface material processing station C or after the top lid 2 is mounted at the lid mounting station G, it can be immediately detected.

[0047] Although the embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications are possible without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0048] 1 Integrated Circuit Devices 11 Chips 111 First Side 12 Substrate 121 Second Side 2 Top lid 3 Thermal interface materials 4. Glue A Transport Route A1 Rail A2 Rail stand B Material supply station B1 Control unit B2 Drive mechanism B3 Material supply work head C. Thermal interface material processing station C1 Control Unit C2 Drive mechanism C3 Work Head C31 Tape Supply Wheel C32 Tape recovery wheel C33 Contact member D Thermal Interface Material Inspection Station D1 Control Unit D2 Drive mechanism D3 Thermal Interface Materials Inspection Head E Glue Application Station E1 Control Unit E2 Drive mechanism E3 application head F. Adhesive Inspection Station F1 Control Unit F2 Drive mechanism F3 Adhesive Inspection Head G Lid mounting station G1 Control Unit G2 Drive Mechanism G3 Placement Head H Lid Inspection Station H1 Control Unit H2 Drive Mechanism H3 Lid Inspection Head I Lid crimping station I1 Control Unit I2 crimping mechanism I21 Lower die jig I22 Upper mold jig I3 Moving mechanism J Crimp Inspection Station J1 Control Unit J2 Drive mechanism J3 Crimp Inspection Head K Material Collection Station K1 Control Unit K2 Drive mechanism K3 Recovery Head L Overhead Transport System T Release Tape S1 Holding dish S2 Top Lid Tray W1 Supply Case W2 Collection Case W3 Top Case

Claims

1. a transport path provided with a plurality of rails along which a tray carrying an integrated circuit device can be transported; an integrated circuit device packaging apparatus provided with a plurality of work stations arranged along the transport path, the work stations including a material supply station for providing the holding tray on which the integrated circuit device is placed, a thermal interface material processing station for applying a thermal interface material to the integrated circuit device, an adhesive application station for applying adhesive to the integrated circuit device, a lid attachment station for attaching a top lid to the integrated circuit device, a lid crimping station for crimping the top lid to the integrated circuit device, and a material collection station for collecting the holding tray on which the integrated circuit device is placed.

2. 2. The integrated circuit device packaging apparatus of claim 1, wherein the tray on which the integrated circuit device is placed is housed in a supply case corresponding to the material supply station and can be vertically transported to the material supply station by an overhead transport system.

3. 2. The integrated circuit device packaging apparatus of claim 1, wherein the tray on which the integrated circuit device is placed is housed in a collection case corresponding to the material collection station and can be vertically transported out of the material collection station by an overhead transport system.

4. 2. The integrated circuit device packaging apparatus of claim 1, wherein the plurality of work stations further includes a thermal interface material inspection station along the transport path between the thermal interface material processing station and the adhesive application station for performing a visual inspection of the thermal interface material applied to the integrated circuit device.

5. 2. The integrated circuit device packaging apparatus of claim 1, wherein the plurality of work stations further includes an adhesive inspection station along the transport path between the adhesive application station and the lid mounting station for performing visual inspection of the adhesive applied to the integrated circuit device.

6. 2. The integrated circuit device packaging apparatus of claim 1, wherein the plurality of work stations further includes a lid inspection station along the transport path between the lid mounting station and the lid crimping station, which performs visual inspection on the top lid attached to the integrated circuit device.

7. 2. The integrated circuit device packaging apparatus of claim 1, wherein the plurality of work stations further includes a crimping inspection station along the transport path between the lid crimping station and the material collection station for performing visual inspection on the top lid crimped to the integrated circuit device.

8. a transport path provided with a plurality of rails along which a tray carrying an integrated circuit device can be transported; and a plurality of work stations arranged along the transport path, the work stations including a thermal interface material processing station that applies a thermal interface material to the integrated circuit device, and a thermal interface material inspection station that performs a visual inspection of the thermal interface material applied to the integrated circuit device.

9. 9. The integrated circuit device packaging apparatus of claim 8, wherein the plurality of work stations further includes a material supply station positioned along the transport path in front of the thermal interface material processing station to provide the holding tray on which the integrated circuit device is placed.

10. 10. The integrated circuit device packaging apparatus of claim 9, wherein the tray on which the integrated circuit device is placed is housed in a supply case corresponding to the material supply station and can be vertically transported to the material supply station by an overhead transport system.

11. 9. The integrated circuit device packaging apparatus of claim 8, wherein the plurality of work stations further comprises an adhesive application station disposed along the transport path after the thermal interface material treatment station for applying adhesive to the integrated circuit devices.

12. 12. The integrated circuit device packaging apparatus of claim 11, wherein the plurality of work stations further includes an adhesive inspection station disposed after the adhesive application station along the transport path for performing visual inspection of the adhesive applied to the integrated circuit device.

13. a transport path provided with a plurality of rails along which a tray carrying an integrated circuit device can be transported; and a plurality of work stations arranged along the transport path, the work stations including a lid attachment station for attaching a top lid to the integrated circuit device, and a lid inspection station for performing a visual inspection of the top lid attached to the integrated circuit device.

14. 14. The integrated circuit device packaging apparatus of claim 13, wherein the plurality of work stations further includes an adhesive application station disposed along the transport path in front of the lid mounting station for applying adhesive to the integrated circuit devices.

15. 15. The integrated circuit device packaging apparatus of claim 14, wherein the plurality of work stations further includes an adhesive inspection station along the transport path between the adhesive application station and the lid mounting station for performing visual inspection of the adhesive applied to the integrated circuit device.

16. 14. The integrated circuit device packaging apparatus of claim 13, wherein the plurality of work stations further includes a lid crimping station disposed after the lid inspection station along the transport path for crimping the top lid to the integrated circuit device.

17. 17. The integrated circuit device packaging apparatus of claim 16, wherein the plurality of work stations further includes a material collection station disposed along the transport path after the lid crimping station for collecting the holding trays on which the integrated circuit devices are placed.

18. 18. The integrated circuit device packaging apparatus of claim 17, wherein the plurality of work stations further includes a crimping inspection station along the transport path between the lid crimping station and the material collection station for performing visual inspection on the top lid crimped to the integrated circuit device.

19. 20. The integrated circuit device packaging apparatus of claim 17, wherein the tray on which the integrated circuit device is placed is housed in a collection case corresponding to the material collection station and can be vertically transported out of the material collection station by an overhead transport system.

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