Cooling fan
By positioning the semiconductor cooling sheet at the edge of the fan housing and using a ventilation part to direct airflow, the cooling fan achieves improved cooling efficiency by isolating the heat generating surface from the airflow path.
Patent Information
- Application Number
- JP2025001437U
- Authority / Receiving Office
- JP · JP
- Patent Type
- Utility models
- Current Assignee / Owner
- Priority Date
- 2024-09-24
- Filing Date
- 2025-05-08
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2035-05-08
AI Technical Summary
Existing cooling fans with semiconductor cooling sheets have poor cooling efficiency due to the heat generating surface being located at the air outlet, causing air flow temperature rise.
The semiconductor cooling sheet is positioned at the edge of the housing with a heat conduction net connected to its cooling surface, and a ventilation part directs airflow to dissipate heat, separating the heat generating part from the airflow path.
This arrangement enhances cooling efficiency by ensuring the airflow reduces temperature upon passing through the heat conduction net, effectively isolating the heat generating surface from the airflow.
Smart Images
Figure 0003251895000001_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of fans, and specifically relates to cooling fans.
Background Art
[0002] As a fan used in cooling clothing, a cooling fan often uses a semiconductor cooling sheet to achieve air flow cooling. Since it is used in cooling clothing, the size of the fan is relatively small, and by adopting a semiconductor cooling sheet, the cooling needs can be completely met. However, as shown in Figure 1, the semiconductor cooling sheet of the currently commercially available cooling fan is often arranged at the center of the air outlet. A heat conduction net made of an aluminum alloy material is attached to the air outlet of the fan using bolts. The heat conduction net is connected to the cooling surface of the semiconductor cooling sheet. However, such an arrangement method has the following disadvantages. Since the semiconductor cooling sheet is arranged at the air outlet, although the temperature of the air flow can be reduced when the air passes through the heat conduction net, the heat generating surface of the semiconductor cooling sheet is also located at the air outlet and is arranged towards the motor. Therefore, some air also flows through the heat generating surface of the semiconductor cooling sheet, which may cause the temperature of the air flow to rise. The air flow will go through a process of first rising in temperature and then decreasing, that is, the cooling effect on the air flow is poor.
Summary of the Invention
Problems to be Solved by the Invention
[0003] The purpose of this invention is to provide a cooling fan for solving the problems raised in the above background art.
Means for Solving the Problems
[0004] To solve the above technical problems, in the technical aspect of the present invention, there is provided a housing, a semiconductor cooling sheet, a heat conduction net, and a ventilation part. A motor for rotating a fan blade and a fan blade are arranged inside the housing. The semiconductor cooling sheet is located at the edge of the housing. The heat conduction net located at the air outlet end of the housing is connected to the cooling surface of the semiconductor cooling sheet. The ventilation part located at the air outlet of the housing provides a cooling fan that can direct air towards the semiconductor cooling sheet to dissipate heat from the semiconductor cooling sheet.
[0005] Preferably, a heat dissipation housing is fixedly attached to the housing. The ventilation part communicates with the heat dissipation housing, and the semiconductor cooling sheet is fixedly attached inside the heat dissipation housing.
[0006] Preferably, an air outlet is opened at the bottom of the heat dissipation housing.
[0007] Preferably, a heat dissipation plate is fixedly attached to the side of the heat generating surface of the semiconductor cooling sheet, and an air passage is provided between the heat dissipation plate and the heat dissipation housing.
[0008] Preferably, the ventilation part has a T-shaped plate structure, and an air inlet communicating with the heat dissipation housing is opened at the edge of the ventilation part.
[0009] Preferably, a circular support frame is fixedly attached to the air outlet of the housing. The heat conduction net is fixed to the support frame, and the motor is fixedly attached to the center of the support frame. Preferably, a raceway for arranging the electric wires of the motor is opened in the support frame close to the heat dissipation housing.
[0010] Preferably, an opening covered with a cover is provided on the side of the heat dissipation housing close to the housing air outlet end.
[0011] Preferably, the semiconductor cooling sheet and the heat dissipation plate are arranged parallel to the axis of the housing.
[0012] Preferably, the semiconductor cooling sheet and the heat sink are arranged perpendicular to the axis of the housing.
Advantages of the Invention
[0013] Compared with the prior art, the beneficial effects of the present invention are as follows. In the present invention, by arranging the semiconductor cooling sheet on the side surface of the housing and providing the air guiding portion, due to the action of the air guiding portion, the semiconductor cooling sheet can dissipate heat by the airflow blown out from the fan. And since the heat conduction net is in direct contact with the cooling surface of the semiconductor cooling sheet, when the air flows out of the housing, the temperature drops just by passing through the heat conduction net, and the cooling part and the heat generating part of the semiconductor are separated from the airflow path of the fan, avoiding the heating of the airflow by the semiconductor cooling sheet, so that the effect of reducing the temperature of the airflow is better.
Brief Description of the Drawings
[0014]
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Modes for Carrying Out the Invention
[0015] Hereinafter, with reference to the accompanying drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative labor shall fall within the protection scope of the present invention.
[0016] As shown in the drawings, this embodiment provides a cooling fan. This cooling fan includes a housing 1. Both ends of the housing 1 are of an open structure. One side is the air inlet end, and the other side is the air outlet end. A protective net is screwed to the air inlet of the housing 1. Inside the housing 1, a motor 6 and a fan blade are installed. A support frame 5 is fixedly attached to the air outlet end of the housing 1 with bolts. The support frame 5 has a circular structure. The motor 6 is fixedly attached to the center of the support frame 5, and a fan blade is fixedly attached to the output shaft of the motor 6. The motor 6 is used to rotate the fan blade.
[0017] As shown in Figure 4, a raceway 7 is opened in a part of the support frame 5 close to the heat dissipation housing 4. Wires are arranged in the raceway 7, and the wires supply power to the motor 6.
[0018] As shown in Figure 3, a heat conduction net 2 is also fixedly attached to the air outlet end of the housing 1 with bolts. The heat conduction net 2 is made of an aluminum alloy. A heat dissipation housing 4 is fixedly attached to the edge of the housing 1. A semiconductor cooling sheet 9 is installed inside the heat dissipation housing 4. The heat conduction net 2 is in contact with the cooling surface of the semiconductor cooling sheet 9. The low temperature of the cooling surface of the semiconductor cooling sheet 9 is transmitted along the heat conduction net 2. When the flowing air passes through the heat conduction net 2, the temperature of the air passing through the heat conduction net 2 can be reduced.
[0019] The air guide part 3 is also fixedly attached to the heat conduction net 2. As shown in FIG. 2, the air guide part 3 is located at the air outlet end of the housing 1. As shown in FIG. 2, the structure of the air guide part 3 is as follows. The air guide part 3 has a plate-like structure similar to a T shape. An air inlet 10 communicating with the heat dissipation housing 4 is opened at the edge of the air guide part 3, and an air outlet 11 is opened at the bottom of the heat dissipation housing 4. The air outlet 11 is arranged towards the screw of the protection net, and an air deflector larger than the diameter of the housing 1 is integrally provided at the edge of the protection net. When the air flow flows out from the inside of the heat dissipation housing 4, the hot air flowing out from the air outlet 11 diffuses to the outside due to the shielding of the side wall of the protection net and the air deflector, and does not enter the inside of the housing 1.
[0020] When the fan blade operates, the flowing air passes through the air guide part 3. Due to the guiding action of the air guide part 3, the air enters the inside of the heat dissipation housing 4 from the air inlet 10, flows through the semiconductor cooling sheet 9, and then is discharged from the air outlet 11, dissipating heat from the semiconductor cooling sheet 9.
[0021] In a further embodiment, in order to better dissipate heat from the semiconductor cooling sheet 9, a heat dissipation plate 8 is fixedly attached to the heat generating surface of the semiconductor cooling sheet 9. The heat dissipation plate 8 is made of an aluminum alloy. The surface where the heat dissipation plate 8 is bonded to the semiconductor cooling sheet 9 has a smooth structure, and a plurality of evenly distributed protrusions are provided on the other surface. An air passage is formed between the protrusions and the side wall of the heat dissipation housing 4. When the air flow enters the heat dissipation housing 4, the air flow passes through the heat dissipation plate 8 and can take away more heat, making the heat dissipation effect of the semiconductor cooling sheet 9 better.
[0022] There are two ways to arrange the semiconductor cooling sheet 9 and the heat dissipation plate 8.
[0023] As shown in FIG. 6, the semiconductor cooling sheet 9 and the heat dissipation plate 8 are arranged parallel to the axis of the housing 1, and the air entering from the air inlet 10 can blow onto the heat dissipation plate 8, dissipating heat from the heat dissipation plate 8 and the semiconductor cooling sheet 9.
[0024] As shown in Fig. 7, the semiconductor cooling sheet 9 and the heat sink 8 are arranged perpendicular to the axis of the housing 1, and the air entering from the air inlet 10 can be blown onto the heat sink 8 to dissipate heat from the heat sink 8 and the semiconductor cooling sheet 9.
[0025] Both of the above two methods can dissipate heat from the semiconductor cooling sheet 9 and the heat sink 8.
[0026] In this embodiment, as shown in Fig. 5, an opening is provided on the side of the heat dissipation housing 4 close to the air outlet end of the housing 1, and a cover 12 is covered on the opening. The cover 12 can be directly fitted into the opening, and the cover 12 can be removed from the opening, which facilitates the installation of the heat sink 8 and the semiconductor cooling sheet 9.
[0027] Although the embodiments of the present invention have been shown and described, it can be understood by those skilled in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Description of Reference Numerals
[0028] 1. Housing 2. Heat conduction net 3. Air guiding part 4. Heat dissipation housing 5. Support frame 6. Motor 7. Raceway 8. Heat sink 9. Semiconductor cooling sheet 10. Air inlet 11. Air outlet 12. Cover
Claims
1. A cooling fan comprising a housing (1), a semiconductor cooling sheet (9), a heat conduction net (2), and an air guiding part (3), a motor (6) for rotating a fan blade and the fan blade are arranged inside the housing (1), the semiconductor cooling sheet (9) is located at the edge of the housing (1), the heat conduction net (2) located at the air outlet of the housing (1) is connected to the cooling surface of the semiconductor cooling sheet (9), the air guiding part (3) located at the air outlet of the housing (1) is characterized in that it can direct air towards the semiconductor cooling sheet (9) for heat dissipation.
2. A heat dissipation housing (4) is fixedly attached to the housing (1), the air guiding part (3) communicates with the heat dissipation housing (4), The cooling fan according to claim 1, wherein the semiconductor cooling sheet (9) is fixedly attached inside the heat dissipation housing (4).
3. The cooling fan according to claim 2, wherein an air outlet (11) is provided at the bottom of the heat dissipation housing (4).
4. A heat dissipation plate (8) is fixedly attached to the heat generating surface side of the semiconductor cooling sheet (9), The cooling fan according to claim 1, wherein an air passage is formed between the heat dissipation plate (8) and the heat dissipation housing (4).
5. The air guiding part (3) has a T-shaped plate structure, The cooling fan according to claim 4, wherein an air inlet communicating with the heat dissipation housing (4) is provided at the edge of the air guiding part (3).
6. A circular support frame (5) is fixedly attached to the air outlet of the housing (1), the heat conduction net (2) is fixed to the support frame (5), The cooling fan according to claim 5, wherein the motor (6) is fixedly attached to the center of the support frame (5).
7. The cooling fan according to claim 6, wherein a raceway (7) for arranging the electric wires of the motor (6) is provided at a position of the support frame (5) close to the heat dissipation housing (4).
8. The cooling fan according to claim 7, wherein an opening covered by a cover plate (12) is provided on the side of the heat dissipation housing (4) close to the air outlet end of the housing (1).
9. The cooling blower according to claim 4, characterized in that the semiconductor cooling sheet (9) and the heat sink (8) are arranged parallel to the axial center line of the housing (1).
10. The cooling blower according to claim 4, characterized in that the semiconductor cooling sheet (9) and the heat sink (8) are arranged perpendicular to the axial center line of the housing (1).