Winding components, transformers, and inductors

A polyimide film layer formed by electrophoresis directly on metal plate conductors addresses the space issue in winding components, achieving miniaturization and improved performance through reduced thickness and enhanced insulation.

JP3252130UActive Publication Date: 2025-07-25HEFEI HANZHIHE MATERIAL SCI & TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2024600081U
Authority / Receiving Office
JP · JP
Patent Type
Utility models
Current Assignee / Owner
Priority Date
2022-08-18
Filing Date
2023-06-21
Publication Date
2025-07-25
Estimated Expiration
2033-06-21

AI Technical Summary

Technical Problem

Existing winding components, particularly those with laminated flat conductors, face increased space occupation due to thick insulating film layers, which hinders miniaturization and broad application.

Method used

A polyimide film layer formed by electrophoresis is directly attached to the surface of metal plate conductors, eliminating the need for adhesive layers and reducing the thickness of the insulating film, while providing excellent insulation and heat resistance.

Benefits of technology

The compact structure and improved performance of the winding components enable miniaturization and wider application, with enhanced electrical and thermal aging resistance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0003252130000001_ABST
    Figure 0003252130000001_ABST
Patent Text Reader

Abstract

A winding component (10) is provided, which includes a plurality of metal plate conductors (11) laminated in order so that the winding component (10) is formed, and a polyimide film layer (12) formed by electrophoresis is disposed on each metal plate conductor (11). A transformer and an inductor are also provided. Since the film layer disposed on the metal plate conductor (11) in the winding component (10) is a polyimide film layer (12) formed by electrophoresis, the thickness of the insulating film layer (12) on the outer surface of each metal plate conductor (11) is significantly reduced, the volume of the entire winding component (10) is reduced, and the structure of the winding component (10) becomes more compact. Moreover, since the polyimide film layer (12) itself is excellent in insulation, heat resistance, corona resistance, etc., the winding component (10) has good working performance, and the space occupied by the winding component (10) can be significantly reduced, thereby being advantageous for miniaturization and high performance of the winding component (10) and serving for wider application of the winding component (10).
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application claims priority based on the application of Chinese Patent Application No. 202222177941.5, titled "Winding Component, Transformer and Inductor", filed with the China National Intellectual Property Administration on August 18, 2022, and the entire content thereof is incorporated herein by reference.

[0002] This application relates to the technical field of power circuit devices, and particularly to winding components, transformers and inductors.

Background Art

[0003] Winding components are essential components of various electronic circuit elements such as transformers and inductors, and are widely used in the field of electronic circuit devices. Winding components are roughly classified into two types according to the structure of their conductors: windings formed by winding a conductor coil one turn at a time and windings laminated layer by layer through flat conductors.

[0004] In the practical application of winding components, taking winding components formed by laminating flat conductors as an example, in order to ensure the good working performance of the winding components, it is necessary to provide film layers with various functions such as insulating film layers on the surfaces of the respective flat conductors. Although the working performance of the winding components can be improved to a certain extent by various film layers with different functions, the thickness of each flat conductor may increase to a certain extent, which may increase the occupied space of the winding components.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The object of this application is to provide a winding component, a transformer, and an inductor that can significantly reduce the occupied space of the winding component while having good working performance, which is beneficial to the miniaturization and high performance of the winding component, and thereby helps the winding component to be more widely applied.

Means for Solving the Problems

[0006] In order to solve the above technical problems, the present application provides a winding component including a plurality of metal plate conductors laminated in order such that a winding component is formed, and a polyimide film layer formed by electrophoresis is disposed on each of the metal plate conductors.

[0007] In any one embodiment according to the present application, the polyimide film layer has a thickness of 1 μm to 250 μm.

[0008] In any one embodiment according to the present application, the winding component further includes a magnetic core passing through the inner ring of each of the metal plate conductors.

[0009] In any one embodiment according to the present application, a second polyimide film layer formed by the electrophoresis is disposed on the surface of the magnetic core.

[0010] In any one embodiment according to the present application, the second polyimide film layer has a thickness of 1 μm to 250 μm.

[0011] In any one embodiment according to the present application, the magnetic core is a ferrite magnetic core and / or a magnetic core made of a metal alloy.

[0012] A transformer including the winding component described in any of the above embodiments.

[0013] An inductor including the winding component described in any of the above embodiments.

[0014] In the winding component, transformer, and inductor provided by the present application, the winding component includes a plurality of metal plate conductors laminated in order such that a winding component is formed, and a polyimide film layer formed by electrophoresis is disposed on each of the metal plate conductors.

[0015] The film layer disposed on the metal plate conductor in the winding component according to the present application is a polyimide film layer formed by electrophoresis. That is, the polyimide film layer of the present application has a structure of a film layer directly attached to the surface of the metal plate conductor. Different from the conventional insulating film layer attached to an adhesive tape and wound and pasted on the metal plate conductor, in the present application, it is not necessary to adhere the polyimide film layer to the surface of the metal plate conductor through an adhesive layer or other adhesive layers. As a result, the thickness of the film layer attached to the surface of each metal plate conductor is significantly reduced, the volume of the entire winding component becomes smaller, the structure of the winding component becomes more compact, and the polyimide film layer has performance such as good insulation, heat resistance, and corona resistance. Therefore, the winding component according to the present application has good working performance, can significantly reduce the space occupied by the winding component, is advantageous for miniaturization and high performance of the winding component, and helps the winding component to be more widely applied.

[0016] To more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced. The drawings described below are only some embodiments of the present application. It will be obvious to those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

Brief Description of the Drawings

[0017]

Figure 1

Figure 2

Figure 3

Modes for Carrying Out the Invention

[0018] In a general winding component, the insulating film layer on the conductor surface is realized by means such as winding an adhesive tape having an insulating layer on the surface around the conductor surface, or applying an insulating paint layer on the conductor surface. For the insulating layer wound around the conductor surface with an adhesive tape, the overall thickness of the insulating layer increases significantly due to the adhesive tape having adhesiveness. And the insulating layer formed in this way is prone to crack problems as the usage time of the winding component passes, and further affects the service life of the entire winding component. On the other hand, in the insulating layer arranged by applying an insulating paint layer, it is often difficult to ensure the uniformity of the thickness of the insulating paint layer. When flat conductors are stacked on each other, since the thickness of the insulating paint layer is non-uniform, it becomes difficult to stack each flat conductor compactly, and the thickness of the winding component also increases to a certain extent.

[0019] Therefore, the present application provides a technical solution of arranging a polyimide film layer formed by electrophoresis on a metal conductor in a winding component, which can greatly reduce the space volume occupied by the winding component and make the structure of the winding component more compact.

[0020] In order for those skilled in the art to better understand the technical solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts shall be included in the protection scope of the present application.

[0021] Referring to FIGS. 1 and 2, FIG. 1 is a schematic structural diagram of a winding component provided in an embodiment according to the present application, and FIG. 2 is a schematic sectional structure diagram of a local part of the metal plate conductor shown in FIG. 1. FIG. 3 is a schematic structural diagram of a magnetic core in a winding component provided in an embodiment according to the present application.

[0022] The winding component 10 is formed by laminating a plurality of metal plate conductors 11 on which a first polyimide film layer 12 formed by electrophoresis is disposed in sequence.

[0023] In the process of forming the first polyimide film layer 12 on the metal plate conductor 11, first, a metal plate conductor 11 having a substantially flat ring structure is formed, and then the first polyimide film layer 12 can be formed on this metal plate conductor 11 by electrophoresis.

[0024] Specifically, the surface of the metal plate conductor 11 is cleaned by a cleaning method such as alkali cleaning, acid cleaning, solvent cleaning, laser cleaning, plasma cleaning, etc. The cleaned metal plate conductor 11 is completely immersed in a polyimide electrophoresis solution. This polyimide electrophoresis solution is a mixture of polyimide, an alkali compound, an organic filler or an inorganic filler, alcohol or ketone, a water-soluble polar solvent, and deionized water. Using the metal plate conductor 11 as the positive electrode, electrophoresis is performed under an applied voltage of 20 to 80 V, and the charge amount is set to 0.01 to 350 C by controlling the current and the energization time. Also, by controlling the charge amount, the polyimide film was slowly grown on the surface of the metal plate conductor 11 to obtain the first polyimide film layer 12. After electrophoresis, the metal plate conductor 11 coated with the first polyimide film layer 12 is taken out, the remaining electrophoresis solution is blown off by an air flow, dried at a high temperature, and a metal plate conductor 11 with the first polyimide film layer 12 attached to its surface is obtained.

[0025] Note that electrophoresis is a common film growth method. In this application, the key is not to form the first polyimide film layer 12 by electrophoresis, but it is important that the film layer structure of the first polyimide film layer 12 on the surface of the metal plate conductor 11 according to this application is a film layer structure that can be formed by electrophoresis. Therefore, the process and principle of electrophoresis will not be introduced in detail in this embodiment, and a general electrophoresis method may be referred to.

[0026] From the above, the first polyimide film layer 12 formed on the surface of the metal plate conductor 11 by electrophoresis directly adheres to and grows on the surface of the metal plate conductor 11. Since the metal plate conductor 11 is an equipotential body during electrophoresis, it is ensured that the thicknesses of the first polyimide film layers 12 formed on the surfaces of the metal plate conductors 11 at different positions are uniform. The thickness of this first polyimide film layer 12 can be 1 μm to 250 μm. To adhere and bond the first polyimide film layer 12 to the surface of the metal plate conductor 11, there is no need to use other things such as adhesive tapes, because the thickness of the insulating film layer on the surface of the metal plate conductor 11 is significantly reduced. After forming the first polyimide film layer 12 on the surface of the metal plate conductor 11, the metal plate conductors 11 can be laminated in sequence to form a winding component as shown in FIG. 1. This is because the thickness of the first polyimide film layer 12 on the surface of the metal plate conductor 11 is significantly smaller than the thickness of the insulating film layer on the surface of the conductor of the conventional winding component, so the space volume occupied by the winding component formed by laminating the metal plate conductors 11 is also significantly reduced.

[0027] For the layer structure in which a multilayer film is arranged on the surface of the conductor of the conventional winding component, in this application, only a single layer of the first polyimide film layer 12 needs to be arranged. Therefore, while effectively solving the film layer peeling phenomenon that often appears during electrical aging and thermal aging of the multilayer adhesive insulating film layer, good working performance of the winding component can be ensured.

[0028] Regarding the first polyimide film layer 12, since it is itself a good insulating material and heat conductive material, it can have good insulating performance and is helpful for the rapid heat dissipation of the metal plate conductor 11. Furthermore, the corona resistance of the first polyimide film layer 12 can be improved by introducing only the inorganic particles generally used to improve the corona resistance into the polyimide electrophoresis solution during the process of electrophoresis growth. Examples of the inorganic particles often used to improve the corona resistance of the film layer include, for example, fine alumina containing polymers, but no further explanation is given in this application.

[0029] In a specific embodiment of the present application, the thicknesses of the first polyimide film layer 12 on the surface of the metal plate conductor 11 are 40 μm and 60 μm. For the metal plate conductors corresponding to the first polyimide film layers 12 with two different thicknesses, for example, performance tests such as voltage resistance test, insulation impedance test, corona resistance test, temperature index test, oil immersion test, thermal conductivity test, thermal shock test, softening temperature and breakdown temperature test, etc. were carried out. The results are shown in Table 1 below.

[0030]

Table 1

[0031] According to the above experimental data, for the winding component according to the present application, when the thickness of the first polyimide film layer 12 is 60 μm, the withstand voltage reaches 10 KV, the insulation impedance reaches 17 GΩ at DC 1 kV for 5 seconds, and the leakage current is less than 0.2 μA at DC 2.7 kV for 60 s, indicating that it has excellent insulation performance. Also, since the breakdown field strength is 5 kV or more, it indicates that it has excellent electrical aging resistance. Since the temperature index is 220 °C or more, it indicates that it has excellent heat aging resistance. Since the thermal conductivity is 0.2 W / m·K or more, it indicates that it has excellent heat dissipation performance. The oil immersion resistance and thermal shock resistance are qualified, indicating that it has excellent oil immersion resistance and thermal shock resistance.

[0032] Due to the presence of the first polyimide film layer 12, compared with the insulating film made of other materials, the electrical aging resistance time is more than 20 times longer, and the decomposition temperature also rises by 20 °C or more. Therefore, the electrical aging resistance and heat aging resistance are more excellent.

[0033] Referring to FIG. 1, it can be seen that each metal plate conductor 11 generally has a ring structure with a through-hole in the central region. As each metal plate conductor 11 is successively stacked, the through-holes in the central regions of the metal plate conductors 11 together form a cylindrical hole. Referring to FIG. 3, in any one embodiment according to the present application, a magnetic core 20 penetrating the inner ring-shaped through-hole of each metal plate conductor 11 may be further provided in the cylindrical hole formed by each metal plate conductor 11.

[0034] Optionally, the magnetic core 20 may be a ferrite magnetic core (for example, a manganese zinc ferrite magnetic core, a nickel zinc ferrite magnetic core, a magnesium zinc ferrite magnetic core, etc.) and / or a magnetic core made of a metal alloy (for example, an iron core, an iron nickel alloy magnetic core, a silicon steel sheet magnetic core, an amorphous alloy magnetic core, a nanocrystalline alloy magnetic core, etc.).

[0035] Generally, the magnetic core 20 has a relatively hard material, various shapes, and often has sharp edges. The magnetic core 20 is insulated by coating a film using an insulating tape. During the film coating, due to process limitations, there are often defects such that the insulator becomes too thin at corners and other irregularly shaped positions, resulting in insufficient coating, and it is also difficult to completely cover the internal space of the magnetic core. In addition, the insulating layer on the surface of the magnetic core often causes friction with the metal plate conductor 11, leading to damage to the insulating film layer.

[0036] Therefore, in any other embodiment according to the present application, a second polyimide film layer formed by electrophoresis can be further provided on the surface of the magnetic core 20. The thickness of this second polyimide film layer may be 1 μm to 250 μm. Preferably, the thickness of this second polyimide film is 40 μm to 90 μm.

[0037] In addition, when the winding component is used in devices such as inductors and transformers, since the loss due to electromagnetic induction in the magnetic field existing in the magnetic core 20 is released as heat, the insulating film layer of the magnetic core may become ineffective due to low heat resistance performance. In this embodiment, by using the second polyimide film layer formed by electrophoresis as the insulating layer of the magnetic core 20, not only can the thickness of the insulating layer on the surface of the magnetic core 20 be reduced to a certain extent, but also the heat resistance of the insulating layer of the magnetic core 20 is ensured by the improvement of insulation, and the working performance of the magnetic core 20 is also ensured.

[0038] In short, the conductor of the winding component according to the present application is a metal plate conductor, and the metal plate conductors are stacked in order to form a winding component, and a polyimide film layer formed by electrophoresis is provided on the surface of each metal plate conductor. Thereby, it becomes possible to directly attach a single-layer film layer to the conductor surface of the winding component, ensuring good working performance of the winding component, reducing the space volume occupied by the structure of the entire winding component, being advantageous for miniaturization and high performance of the winding component, and serving for a wide range of applications of the winding component.

[0039] Based on the above embodiments of the winding component, the present application further discloses a transformer that can include any one of the above winding components.

[0040] Since the polyimide film layer formed by electrophoresis is a single layer and arranged on the metal plate conductor of the winding component, the thickness of the winding component in the direction perpendicular to the metal plate conductor can be significantly reduced. Therefore, in the transformer using the winding component, it is possible to form a flat-shaped transformer, which is advantageous for application to electronic devices such as tablets that have strict requirements for the thickness of the transformer.

[0041] It is understood that the winding component is an important component for a transformer and also an important device for an inductor. Therefore, in any other embodiment according to the present application, the present application further discloses an inductor that can include any one of the above winding components.

[0042] This inductor can also be widely applied to electrical or electronic devices that require a relatively thin thickness of the inductor.

[0043] In this specification, for example, relative terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of such an actual relationship or order between these entities or operations. Also, the terms "comprising", "included", or any other similar terms mean non-exclusive inclusion, intending to include a series of elements inherent to a process, method, article, or device. Unless there are further limitations, the elements defined by the phrase "comprising..." do not exclude the existence of other identical elements in the process, method, article, or device that includes such elements. Also, for the parts corresponding to the realization principles of the technical solutions in the prior art in the above technical solutions provided in the embodiments related to this application, no detailed description will be given to avoid redundant description.

[0044] Regarding the principles and embodiments of this application, specific examples have been used in this specification for explanation. However, the above description of the embodiments is only used to understand the method and gist of this application. It should be noted that for those skilled in the art, there may be several improvements and modifications to this application without departing from the principles of this application, and it is necessary to pay attention that these improvements and modifications are also within the scope of the patent of this application.

Claims

1. A winding component including a plurality of metal plate conductors laminated in order so that a winding part is formed, wherein a first polyimide film layer formed by electrophoresis is disposed on each of the metal plate conductors. The winding component is characterized by this.

2. The winding component according to Claim 1, wherein the first polyimide film layer has a thickness of 1 μm to 250 μm.

3. The winding component according to Claim 1, further including a magnetic core passing through the inner ring of each of the metal plate conductors.

4. The winding component according to Claim 3, wherein a second polyimide film layer formed by electrophoresis is disposed on the surface of the magnetic core.

5. The winding component according to Claim 4, wherein the second polyimide film layer has a thickness of 1 μm to 250 μm.

6. The winding component according to Claim 3, wherein the magnetic core is a ferrite magnetic core and / or a magnetic core made of a metal alloy.

7. A transformer including the winding component according to any one of Claims 1 to 6.

8. An inductor including the winding component according to any one of Claims 1 to 6.