Sound collection device

Abstract

The present invention provides a sound-gathering device that ensures sound quality by having a configuration that reduces internal vibrations. [Solution] The sound-collecting device 100 comprises a case 110, a cushioning component 120, a sound-collecting system 140, and a fixing component 150. The cushioning component is provided on the case, the sound-collecting system includes a circuit board 141 and a microphone module 142, the microphone module is connected to the circuit board, and the fixing component penetrates the cushioning component and the circuit board and is fixed to the case.

Description

Technical Field

[0001] The present invention relates to a sound collection device, and particularly to a sound collection device having a configuration for reducing internal vibration.

Background Art

[0002] In current sound collection devices, the fixing method of the microphone module on the circuit board is mostly directly fastening screws on the circuit board. However, this fixing method leads to the transmission of internal vibration of the sound collection device to the microphone module, and when the microphone module operates, it will receive noises such as vibration noise, which is likely to affect the sound collection quality.

[0003] Regarding this, some solutions have been proposed in prior art documents, for example, the microphone vibration damping structure and microphone equipment proposed in Patent Document 1, and the structure and two-wheeled transportation means for reducing the vibration noise of the microphone proposed in Patent Document 2.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

[0005]

Patent Document 2

Summary of the Invention

[0006] In view of the drawbacks of the prior art, the present invention provides a sound collection device having a configuration for reducing internal vibration to ensure sound collection quality.

[0007] This invention proposes a sound-collecting device according to one embodiment. The sound-collecting device comprises a case, a cushioning component, a sound-collecting system, and a fixing component. The cushioning component is provided on the case. The sound-collecting system comprises a circuit board and a microphone module. The microphone module is connected to the circuit board. The fixing component penetrates the cushioning component and the circuit board and is fixed to the case.

[0008] To provide a better understanding of the above and other aspects of this invention, the following will be a detailed description, with particular examples given and with reference to the drawings: [Brief explanation of the drawing]

[0009] Figure 1 shows a three-dimensional diagram of a sound collection device according to one embodiment of the present invention.

[0010] Figure 2 shows a partial cross-sectional view of the sound collection device shown in Figure 1.

[0011] Figure 3 shows a three-dimensional diagram of a sound-collecting device according to another embodiment of the present invention.

[0012] Figure 4A shows an exploded view of one angle of the sound collection device shown in Figure 3.

[0013] Figure 4B shows an exploded view of the sound collection device from another angle in Figure 3.

[0014] Figure 5 shows a partial cross-sectional view of the sound collection device shown in Figure 3. [Modes for carrying out the invention]

[0015] The following describes in detail each embodiment of the present invention, with reference to the drawings as examples. In addition to these detailed descriptions, the present invention can be broadly implemented in other embodiments, and minor substitutions, modifications, and equivalent changes to the embodiments described above are all within the scope of the present invention and subject to the claims for utility model registration. The specification provides many specific details and embodiments in order to give the reader a full understanding of the present invention; however, these specific details and embodiments should not be considered limitations of the present invention. Furthermore, well-known steps or components are not described in detail to avoid leading to unnecessary limitations of the present invention.

[0016] Figure 1 shows a three-dimensional view of a sound-collecting device 100 according to one embodiment of the present invention; Figure 2 shows a partial cross-sectional view of the sound-collecting device of Figure 1, which is a partial cross-sectional view along the cross-sectional line AA in Figure 1.

[0017] Refer to Figures 1 and 2. The sound-collecting device 100 can be applied to any type of electronic device, including but not limited to electronic devices having an imaging module or electronic devices having a recording function. The sound-collecting device 100 may comprise a case 110, a buffer component 120, a sound-collecting system 140, and a fixing component 150. The sound-collecting system 140 may comprise a circuit board 141 and a microphone module 142. The buffer component 120 is provided on the case 110, and the circuit board 141 is provided between the buffer component 120 and the fixing component 150.

[0018] The buffer component 120 may have a peripheral wall 120P and a base 120B, the base 120B being provided in the XY plane, the peripheral wall 120P being provided on the edge of the base 120B and extending in thickness in the Z-axis direction, and the circuit board 141 can be provided on the base 120B and surrounded by the peripheral wall 120P, that is, the circuit board 141 can be provided within the peripheral wall 120P. The microphone module 142 is connected to the circuit board 141. Herein, this embodiment may employ two microphone modules 142, and the sound pickup system 140 may be a microelectromechanical system (MEMS), that is, the microphone module 142 may be a microsensor that can be integrated on the circuit board 141, but this is not used in order to limit the present invention.

[0019] As shown in Figures 1 and 2, the fixing component 150 may have a connected head section 151, an intermediate section 152, and an end section 153 from the positive Z-axis to the negative Z-axis. The cross-sectional diameter Φ1 of the head section 151 in the XY plane is greater than the cross-sectional diameter Φ2 of the intermediate section 152 in the XY plane, and the cross-sectional diameter Φ2 of the intermediate section 152 in the XY plane is greater than the cross-sectional diameter Φ3 of the end section 153 in the XY plane. The head section 151 of the fixing component 150 abuts against the circuit board 141, the intermediate section 152 passes through the through hole 141H of the circuit board 141 and the through hole 120H of the buffer component 120 and abuts against the case 110, and the end section 153 is provided in the non-through hole 110H of the case 110. Here, the fixing part 150 may be partially threaded, that is, the intermediate section 152 is a smooth column, that is, there is no interfering structure between the intermediate section 152 and the through holes 141H and 120H that locks and / or fastens to each other, and the intermediate section 152 includes but is not limited to a cylindrical body; and the end section 153 has male threads, and the non-through holes 110H may be threaded holes having corresponding female threads, and the fixing part 150 and the case 110 can be screwed together with the help of the end section 153 and the non-through holes 110H, but are not used to limit the present invention, and the intermediate section 152 of the fixing part 150 may have male threads, and the through holes 141H and / or through holes 120H may have corresponding female threads.

[0020] Figure 3 shows a three-dimensional view of another embodiment of the sound-collecting device 100 of the present invention; Figure 4A shows an exploded view of one angle of the sound-collecting device 100 of Figure 3; Figure 4B shows an exploded view of another angle of the sound-collecting device 100 of Figure 3; Figure 5 shows a partial cross-sectional view of the sound-collecting device 100 of Figure 3, which is a partial cross-sectional view along the cross-sectional line AA in Figure 3.

[0021] Referring simultaneously to Figures 3, 4A, 4B, and 5, in other embodiments, the sound-collecting device 100 may further include a buffer washer 130 that can be provided between the fixing component 150 and the circuit board 141. In a specific embodiment, the fixing component 150 can be drilled into the buffer washer 130, and the head section 151 of the fixing component 150 abuts against the buffer washer 130, while the intermediate section 152 penetrates the buffer washer 130, the through hole 141H, and the through hole 120H. In this embodiment, the sound-collecting device 100 can employ two fixing components 150 and two buffer washers 130, but is not limited thereto. By setting an appropriate number of fixing components 150 and buffer washers 130 according to the dimensions of the circuit board 141, the fixing requirements for actual manufacturing can be met. Here, the multiple fixing components 150 can be provided so as to be offset from each other, and there may be a displacement d between them. However, the present invention is not limited thereto, and in other embodiments, multiple fixing parts 150 may be provided so as to be aligned. Also, the buffer washer 130 is not limited to a ring-shaped washer, and a buffer washer 130 having an area in the XY plane several times the cross-sectional area of ​​the fixing part 150 may be used. In other embodiments, the buffer washer 130 may be a single structural component and may be formed to extend above the circuit board 141, thereby covering a wide area of ​​the circuit board 141.

[0022] Furthermore, the case 110 can be made from a rigid material and may include, but is not limited to, plastic or plastic-containing material having non-through holes 110H. The cushioning component 120 and the cushioning washer 130 can each be made from a soft material and may include, but is not limited to, rubber or rubber-containing material, and the cushioning component 120 may have a through hole 120H, and the cushioning washer 130 may have a through hole 130H. The circuit board 141 may be a printed circuit board and may have a through hole 141H. The through holes 130H, 141H, 120H and non-through holes 110H are aligned on the Z axis. The fixing part 150 can be made of a hard material, including but not limited to metal and plastic. The fixing part 150 is drilled through the through hole 120H of the cushioning part 120, the through hole 141H of the circuit board 141, and the through hole 130H of the cushioning washer 130, and is fixed to the non-through hole 110H of the case 110. In one embodiment, the hardness of the cushioning washer 130 may be greater than or equal to the hardness of the cushioning part 120, but this is not used to limit the present invention.

[0023] The buffer component 120 may have a recess 120R. The microphone module 142 is housed in the recess 120R and can abut against the buffer component 120. The buffer component 120 may further have a sound-collecting channel 120CN, and the case 110 may have a sound-collecting opening 110OP, the sound-collecting channel 120CN and the sound-collecting opening 110OP being aligned and communicating with each other in the vertical direction (Z axis). The sound-collecting opening 110OP is not limited to the cross-sectional shape of the broken line shown in Figures 2 and 5, but may, for example, have a cross-sectional shape in which only the diagonal lines extend. The sound-collecting channel 120CN extends to the recess 120R. The communication of the sound-collecting opening 110OP with the microphone module 142 via the sound-collecting channel 120CN enables the microphone module 142 to collect sound from the external environment of the case 110. Here, the width of the sound-collecting aperture 110OP may be greater than the width of the sound-collecting channel 120CN in the direction from the positive Z-axis to the negative Z-axis.

[0024] As shown in FIGS. 2 and 5, an adhesive AH may be provided between the case 110 and the buffer component 120, and an adhesive AH may also be provided between the buffer component 120 and the circuit board 141. That is, the buffer component 120 is adhered to the case 110, and the circuit board 141 is adhered to the buffer component 120. The adhesive AH can provide structural stability between the case 110, the buffer component 120 and the circuit board 141. Also, the adhesive AH surrounding the microphone module 142 and the adhesive AH surrounding the sound collection opening 110OP and the sound collection channel 120CN further provide the effect of avoiding the intrusion of noise, thereby ensuring the sound collection quality of the microphone module 142. For example, the adhesive AH may be a double-sided adhesive layer or a photocurable adhesive. Also, there may be a gap G between the circuit board 141 and the peripheral wall 120P. In one embodiment, the circuit board 141 can be adhered to the peripheral wall 120P by filling the gap G with an adhesive (not shown). For example, the adhesive dispensing operation can be performed within the gap G.

[0025] According to the above, the sound collection assembly 140 of the sound collection device 100 of the present invention can be fixed to the case 110 by the buffer component 120 and the fixing component 150. Compared with the conventional fixing method of directly fastening the sound collection assembly using only screws, the sound collection assembly 140 of the sound collection device 100 of the present invention positions using the buffer component 120, thereby blocking the transmission of internal vibrations of the device and avoiding receiving sounds that are not from the sound collection opening 110OP, and thus ensuring the sound collection quality.

[0026] In short, although the present invention is disclosed as above in the embodiments, it is not used for limiting the present invention. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined according to what is defined in the scope of the utility model registration claims.

Claims

1. Case and; A cushioning component provided on the case; Including a circuit board and a microphone module, the microphone module being connected to the circuit board as a sound pickup system; and The buffer component and the fixing component that penetrates the circuit board and is fixed to the case, A sound-collecting device equipped with [specific features / equipment].

2. The sound-collecting device according to claim 1, further comprising a buffer washer between the buffer component and the circuit board.

3. The sound-collecting device according to claim 2, wherein the hardness of the cushioning washer is equal to or greater than the hardness of the cushioning component.

4. The sound-collecting device according to claim 1 or 2, wherein the fixing component has a head section, an intermediate section, and an end section, and the fixing component satisfies at least one of the following conditions: The intermediate section is a smooth column; The intermediate section penetrates the buffer component and the circuit board and contacts the case; The end section and the case are screwed together; The cross-sectional diameter of the head section is greater than the cross-sectional diameter of the intermediate section, and the cross-sectional diameter of the intermediate section is greater than the cross-sectional diameter of the end section.

5. The sound-collecting device according to claim 1, wherein the case has a sound-collecting opening, the buffer component has a sound-collecting channel, and the sound-collecting opening communicates with the microphone module via the sound-collecting channel.

6. The sound-collecting device according to claim 1, wherein the buffer component has a recess, and the microphone module is housed in the recess.

7. The sound-collecting device according to claim 1, wherein the buffer component has a peripheral wall, and the circuit board is provided within the peripheral wall.

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